JP2020178101A - Electronic component - Google Patents

Abstract

To provide an electronic component in which noise is suppressed from propagating to the outside.SOLUTION: An electronic component includes a mold IC 10 containing an electronic element, a metal mounting portion 60 on which the mold IC is mounted, a terminal 40 that connects the mold IC and an external device, and a bolt 80 that electrically and mechanically connects the terminal and the mounting portion, and the terminal includes a first connection portion 41 connected to the mold IC, a second connection portion 42 connected to the external device, and a third connection portion 43 to which the bolt is connected, and the first connection portion is located between the second connection portion and the third connection portion in the extension direction of the terminal.SELECTED DRAWING: Figure 8

Description

The disclosures described herein relate to electronic components.

As shown in Patent Document 1, a semiconductor device in which a cooling member and a conductive member are connected by a fixing screw is known.

Japanese Unexamined Patent Publication No. 2010-4033

As described above, in the semiconductor device shown in Patent Document 1, a fixing screw is located between one end connected to a lead in a conductive member and the other end extending to the opposite side. If noise flows from the fixing screw to the other end side, the noise may propagate to an external device.

Therefore, the disclosure described in the present specification is intended to provide an electronic component in which noise is suppressed from propagating to an external device.

One of the disclosures is a mold IC (10) containing an electronic element (12, 13, 15, 16) and a mold IC (10).
The metal mounting part (60) on which the mold IC is mounted and
A terminal (40) that connects the mold IC and an external device,
It has a fastening member (80) that electrically and mechanically connects the terminal and the mounting portion.
The terminal has a first connection portion (41) connected to the mold IC, a second connection portion (42) connected to an external device, and a third connection portion (43) connected to the fastening member. ,
The first connection portion is located between the second connection portion and the third connection portion in the extending direction of the terminal.

As described above, in the present disclosure, the mold IC (10) is mounted on the mounting portion (60). Therefore, a parasitic capacitance is generated between the mold IC (10) and the mounting portion (60). Noise flows from the mold IC (10) to the mounting portion (60) through this parasitic capacitance. The noise that has flowed to the mounting portion (60) tends to flow to the terminal (40) via the fastening member (80).

As described above, in the present disclosure, the first connection portion (41) is located between the second connection portion (42) and the third connection portion (43) in the extending direction of the terminal (40). Therefore, the third connection portion (43), the first connection portion (41), and the second connection portion (42) are arranged in this order. Therefore, the noise that has flowed to the third connection portion (43) of the terminal (40) through the fastening member (80) first tries to flow to the first connection portion (41). The remaining noise tries to flow to the second connection portion (42). Therefore, the noise flowing through the second connection portion (42) tends to be reduced. Noise is suppressed from propagating to external devices.

Note that the reference numbers in parentheses above merely indicate the correspondence with the configurations described in the embodiments described later, and do not limit the technical scope at all.

It is an electric circuit of a radiator drive system. It is an exploded perspective view of a fan controller. It is sectional drawing which shows the mounting state to the mounting part of a mold IC. It is a top view which shows the mounting state to the mounting part of a mold IC. It is a top view of the terminal. It is a top view which shows the connection form of a fan controller. It is a top view for demonstrating the current path of noise through a parasitic path in a round-trip communication path. It is a top view for demonstrating the current path of noise flowing between connection parts in a round-trip communication path. It is a top view for demonstrating the current path of noise flowing to the 2nd connection part in a round-trip connecting path. It is a top view for demonstrating the first modification. It is a top view for demonstrating the 2nd modification.

Hereinafter, embodiments will be described with reference to the drawings.

(First Embodiment)
The fan controller 3 and the radiator drive system 1 including the fan controller 3 will be described with reference to FIGS. 1 to 9.

<Overview of radiator drive system>
The radiator drive system 1 is mounted on the vehicle. As shown in FIG. 1, the radiator drive system 1 includes a battery 2, a fan controller 3, and a motor 4. An ECU (not shown) and a control IC of the fan controller 3 are electrically connected.

An instruction signal is output from the ECU to the control IC of the fan controller 3. The control IC steps down the DC power supplied from the battery 2 in response to the instruction signal. This step-down DC power is supplied to the motor 4.

The motor 4 is powered by the supplied DC power. As a result, the shaft of the motor 4 rotates. A fan (not shown) is arranged at the tip of the shaft. The fan rotates as the shaft rotates. This sends wind from the fan to the radiator.

<Circuit configuration of fan controller>
As shown in FIG. 2, the fan controller 3 has a mold IC 10 and an electric component 30.

As shown in FIG. 1, the mold IC 10 is electrically connected to the battery 2 via the first path 81 and the second path 82. The first path 81 is connected to the positive electrode of the battery 2. The second path 82 is connected to the negative electrode of the battery 2. The negative electrode of the battery 2 is connected to an external ground.

The electrical component 30 has a plurality of passive elements. The electric component 30 has a capacitor 31 and a coil 32 as a plurality of passive elements. The low-pass filter 33 is composed of the capacitor 31 and the coil 32. The low-pass filter 33 is electrically connected to the battery 2 via the first path 81 and the second path 82. In FIG. 1, the low-pass filter 33 is shown surrounded by a broken line.

The mold IC 10 has a first series circuit 11 and a second series circuit 14 connected in series between the first path 81 and the second path 82.

The first series circuit 11 has a first capacitor 12 and a second capacitor 13. One of the two electrodes of the first capacitor 12 is connected to the first path 81. One of the two electrodes of the second capacitor 13 is connected to the second path 82. The remaining one of the two electrodes of the first capacitor 12 and the remaining one of the two electrodes of the second capacitor 13 are electrically connected.

The midpoint between the first capacitor 12 and the second capacitor 13 is electrically connected to one of the two input / output terminals of the motor 4 via the third path 83. Further, the remaining one of the two input / output terminals of the motor 4 is connected to the first path 81 via the fourth path 84.

The second series circuit 14 includes a diode 15 and a power MOSFET 16. The cathode of the diode 15 is electrically connected to the first path 81. The anode of the diode 15 is connected to the drain electrode of the power MOSFET 16. The source electrode of the power MOSFET 16 is electrically connected to the second path 82.

The midpoint between the diode 15 and the power MOSFET 16 is electrically connected to one of the two input / output terminals of the motor 4 via the third path 83. Further, the midpoint between the diode 15 and the power MOSFET 16 is electrically connected to the midpoint between the first capacitor 12 and the second capacitor 13 via the third path 83.

With the electrical connection configuration shown above, the positive electrode and the negative electrode of the battery 2 are electrically connected via the low-pass filter 33, the first capacitor 12, the second capacitor 13, the diode 15, and the power MOSFET 16. ..

The remaining one of the two input / output terminals of the motor 4 is connected to the first path 81 via the fourth path 84. One of the two input / output terminals of the motor 4 is connected to the drain electrode of the power MOSFET 16. The source electrode of the power MOSFET 16 is connected to the second path 82. As a result, the positive electrode and the negative electrode of the battery 2 are connected to each other via the motor 4 and the power MOSFET 16.

When the power MOSFET 16 is closed, the positive electrode and the negative electrode of the battery 2 are electrically connected via the motor 4 and the power MOSFET 16. As described above, the low-pass filter 33 is connected to the first path 81 and the second path 82. Therefore, DC power from which high frequency noise has been removed is supplied to the motor 4. However, as described above, the DC power of the battery 2 is also supplied to the first capacitor 12 and the second capacitor 13. The time change of the power supply from the battery 2 to the motor 4 becomes gradual due to the power supply to the first capacitor 12 and the second capacitor 13.

When the power MOSFET 16 is switched from the closed state to the open state, the supply of DC power from the battery 2 to the motor 4 is cut off. However, as described above, the first capacitor 12 and the second capacitor 13 are charged. Therefore, DC power is supplied to the motor 4 from the first capacitor 12 and the second capacitor 13. As a result, as a result of switching the power MOSFET 16 from the closed state to the open state, it is suppressed that the power supply to the motor 4 is instantaneously interrupted.

The opening / closing control of the power MOSFET 16 shown above is performed by the above-mentioned ECU and control IC. A control IC is electrically connected to the gate electrode of the power MOSFET 16. The ECU is electrically connected to the control IC.

An instruction signal is output from the ECU to the control IC. This instruction signal is a signal that specifies the duty ratio of the pulse included in the pulse signal. The control IC outputs a pulse signal (drive signal) having a duty ratio corresponding to the instruction signal to the gate electrode of the power MOSFET 16. In this way, the control IC PWM-controls the power MOSFET 16 according to the instruction signal.

The power MOSFET 16 is sequentially switched between the closed state and the open state by the input of the drive signal. As a result, the supply of DC power from the battery 2 to the motor 4 becomes intermittent. As a result, the DC power supplied to the motor 4 is stepped down on average over time.

As the duty ratio of the drive signal increases, the time for the drive signal to output a high-level signal becomes longer. This prolongs the time that the power MOSFET 16 is closed. The supply time of DC power from the battery 2 to the motor 4 becomes longer. As a result, the degree of step-down of the DC power supplied to the motor 4 is weakened.

On the contrary, when the duty ratio of the drive signal is lowered, the time for the drive signal to output a low-level signal becomes longer. As a result, the time for the power MOSFET 16 to be in the open state becomes longer. The supply time of DC power from the battery 2 to the motor 4 is shortened. As a result, the degree of step-down of the DC power supplied to the motor 4 is increased.

As shown in FIG. 1, the electric circuit of the fan controller 3 has a fifth path 85 in addition to the first path 81 to the fourth path 84 shown so far. The electric circuit and the mounting portion 60, which will be described later, are electrically connected via the fifth path 85.

<Fan controller configuration>
Next, the configuration of the fan controller 3 will be described. In the following, the three directions orthogonal to each other are defined as the x direction, the y direction, and the z direction. The fan controller 3 corresponds to an electronic component.

As shown in FIG. 2, in addition to the mold IC 10 and the electric component 30 described so far, the fan controller 3 includes a support case 20, a terminal 40, a resin cover 50, a mounting portion 60, an adhesive 70, and a bolt. It has 80 and. The bolt 80 corresponds to a fastening member.

The mold IC 10 includes the power MOSFET 16 shown in FIG. 1, the diode 15, the first capacitor 12, the second capacitor 13, and other electronic elements, as well as the island 17, the lead 18, and the resin case 19 shown in FIG. Has. The above-mentioned electronic element is mounted on the island 17. These are electrically connected via wiring. Further, each of the electronic elements is electrically connected to the lead 18 via wiring. An electric circuit formed by electrically connecting these a plurality of electronic elements is covered and protected by a resin case 19. This electric circuit corresponds to the region surrounded by the alternate long and short dash line in FIG.

The resin case 19 is made of an insulating resin material. The resin case 19 covers all of the electronic elements mounted on the island 17 and a part of the leads 18.

As shown in FIG. 3, the resin case 19 has a flat shape having a thin thickness in the z direction. The resin case 19 has two main surfaces having the largest area. The power MOSFET 16 coated on the resin case 19 has a property of easily generating heat by switching. A part of the island 17 is exposed from one of these two main surfaces in order to dissipate the heat generated by the power MOSFET 16. In the following, the exposed main surface of the resin case 19 is referred to as the first main surface 19a. The back surface of the first main surface 19a is referred to as the second main surface 19b.

Further, a part of the lead 18 is exposed from the resin case 19. The exposed lead 18 is bent and extends in the direction from the first main surface 19a to the second main surface 19b. The portion of the lead 18 extending in this direction has a flat shape having a thin thickness in the x direction.

Next, the support case 20 will be described. As shown in FIG. 2, the support case 20 has a hollow for accommodating the mold IC 10 and the electric component 30, and a support portion 21 for supporting the electric component 30. The hollow of the support case 20 is open in the z direction. This opening is closed by the resin cover 50 and the mounting portion 60.

The support case 20 is made of resin. As shown in FIG. 2, the terminal 40 is inserted in the support case 20.

Next, the terminal 40 will be described. As shown in FIG. 5, the terminal 40 has five connecting paths. These five connecting paths form a flat shape having a thin thickness in the z direction, and have an extension portion 44 extending in the direction facing the z direction. Further, a part of the five connecting paths has a first connecting portion 41 connected to the mold IC 10 and a second connecting portion 42 connected to an external device such as the motor 4 and the battery 2. And one of the five connecting paths has a third connecting portion 43 connected to the mounting portion 60 in addition to the first connecting portion 41 and the second connecting portion 42.

In the following, as shown in FIG. 2, the surface of the extension portion 44 on the mold IC 10 side is referred to as a lower surface 44a. The back surface of the lower surface 44a is referred to as the upper surface 44b.

As shown in FIG. 5, the first connection portion 41 includes a flat shape having a thin thickness in the z direction and a bent portion 45 in which the flat shape is bent from the lower surface 44a to the upper surface 44b. The bent portion 45 has a flat shape having a thin thickness in the x direction.

As shown in FIG. 6, the bent portion 45 of the first connecting portion 41 extends in the same direction as a part of the lead 18 exposed and bent from the resin case 19. The bent portion 45 and the lead 18 face each other in the x direction. These are fixed by resistance welding or the like. As a result, the terminal 40 and the mold IC 10 are electrically connected.

As shown in FIGS. 5 and 6, the second connection portion 42 has a flat shape having a thin thickness in the z direction. As described above, it is connected to an external device such as a motor 4 or a battery 2. As a result, the terminal 40 and the external device are electrically connected. The motor 4 and the battery 2 correspond to external devices.

As shown in FIGS. 5 and 6, the third connection portion 43 has a flat shape having a thin thickness in the z direction. A first volt hole 46 that opens in the z direction is formed in the third connection portion 43. A screw groove is formed in the first bolt hole 46.

Next, the mounting unit 60 will be described with reference to FIGS. 3 and 4. The mounting portion 60 has a mounting base 61 and a protrusion 62. The mounting base 61 and the protrusion 62 are each made of metal. The mounting base 61 is composed of a facing surface 61a facing the first main surface 19a, an external surface 61b on the back surface thereof, and four connecting surfaces connecting these two surfaces. Of these four connecting surfaces, the first connecting surface 63a and the third connecting surface 63c are arranged so as to be separated from each other in the y direction. The second connecting surface 63b and the fourth connecting surface 63d are arranged so as to be separated from each other in the x direction. The first connecting surface 63a, the second connecting surface 63b, the third connecting surface 63c, and the fourth connecting surface 63d are sequentially connected in a clockwise direction.

As shown in FIGS. 2 and 3, the facing surface 61a faces the z direction. As described above, the extension portion 44 of the terminal 40 extends in the z direction. The mounting portion 60 and the extension portion 44 are coaxially opposed to each other in the z direction.

As shown in FIG. 4, a second bolt hole 64 that opens in the z direction is formed on the second connecting surface 63b side of the facing surface 61a on the first connecting surface 63a side. A screw groove is formed in the second bolt hole 64. The second bolt hole 64 and the first bolt hole 46 of the third connection portion 43 described above are aligned in the z direction. These two bolt holes communicate with each other in the z direction to form one bolt hole. The shaft portion of the bolt 80 described above is passed through this bolt hole. The bolt 80 is fastened to the thread groove of the first bolt hole 46 and the second bolt hole 64.

As a result, the terminal 40 is mechanically connected to the mounting portion 60 as shown in FIG. Further, the terminal 40 and the mounting portion 60 are electrically connected via the bolt 80. In other words, the electric circuit of the fan controller 3 and the mounting portion 60 are electrically connected via the bolt 80. The relationship between the electric circuit of the terminal 40 and the fan controller 3 will be described in detail later.

As shown in FIG. 3, the adhesive 70 is applied to the facing surface 61a of the mounting portion 60. The mold IC 10 is fixed to the mounting portion 60 via the adhesive 70.

The protrusion 62 of the mounting portion 60 projects from the outer surface 61b in the direction in which the shaft portion of the bolt 80 extends. The protrusion 62 has a function of dissipating heat generated by the electronic element contained in the mold IC 10.

<Current path and terminal>
Next, the relationship between the first path 81 to the fifth path 85 and the terminal 40 included in the electric circuit of the fan controller 3 will be described. The terminal 40 comprises a portion of the first path 81 to the fifth path 85 shown in FIG. 1 other than the portion surrounded by the alternate long and short dash line indicating the mold IC 10 and the portion surrounded by the broken line indicating the low-pass filter 33.

<Round trip connection>
As mentioned above, the terminal 40 has five connecting paths. In the following, a connecting path having the first connection portion 41 to the third connection portion 43 will be described with reference to FIGS. 7 and 8. This connecting road is referred to as a round-trip connecting road 47.

The first connecting surface 63a and the third connecting surface 63c separated in the y direction correspond to two points separated in a predetermined direction. The y direction corresponds to a predetermined direction. The first connecting surface 63a corresponds to the first predetermined position. The third connecting surface 63c corresponds to the second predetermined position.

The reciprocating passage 47 extends from the first connecting surface 63a side to the third connecting surface 63c side, and then folds back and extends from the third connecting surface 63c side toward the first connecting surface 63a side. The second connecting portion 42 and the third connecting portion 43 are located on the first connecting surface 63a side of the round-trip connecting road 47. The first connection portion 41 is located on the third connecting surface 63c side of the reciprocating passage 47.

The round-trip connecting path 47 has a first connecting path 48 including a third connecting portion 43, and a second connecting path 49 including a first connecting portion 41 and a second connecting portion 42. The first connecting path 48 extends from the third connecting portion 43 toward the first connecting portion 41. The second connecting path 49 extends from the first connecting portion 41 to the second connecting portion 42. The connection form of the first connecting road 48 and the second connecting road 49 will be described in detail later.

The shaft portion of the bolt 80 is inserted into the first bolt hole 46 of the third connection portion 43 and the second bolt hole 64 of the mounting portion 60. As a result, the first connecting path 48 and the second connecting path 49 are electrically and mechanically connected to the mounting portion 60.

As shown in FIGS. 7 and 8, a part of the round-trip connecting road 47 extending in the x direction is omitted from the first connecting road 48 and the second connecting road 49.

Hereinafter, the first connecting road 48 and the second connecting road 49 will be described in detail. Dashed lines are added to the boundaries of the individual parts shown in FIGS. 7 to 9.

The first connecting path 48 includes a third connecting portion 43, a first extension portion 48a extending from the third connecting surface 63c side, a second extending portion 48b extending from the end to the fourth connecting surface 63d side, and an end thereof. It has a third extension portion 48c extending from the side to the first connecting surface 63a side.

The second connecting path 49 includes a first connecting portion 41, a fourth extension portion 49a extending from the second connecting surface 63b side, a fifth extending portion 49b extending from the end to the first connecting surface 63a side, and an end thereof. It has a second connection portion 42 connected to the.

The end of the third extension 48c of the first connecting road 48 on the first connecting surface 63a side and the first connecting portion 41 of the second connecting road 49 are connected to form the above-mentioned reciprocating connecting road 47.

As shown in FIGS. 7 and 8, the first connecting road 48 and the second connecting road 49 are arranged so as to be separated from each other. The first extension 48a of the first connecting path 48 and the fifth extension 49b of the second connecting path 49 are separated from each other in the x direction. The shortest separation distance Lx between the first extension portion 48a and the fifth extension portion 49b is equal to or less than the thickness of the terminal 40 in the z direction. The second extension 48b of the first connecting path 48 and the fourth extension 49a of the second connecting path 49 are separated from each other in the y direction. The shortest separation distance Ly between the second extension portion 48b and the fourth extension portion 49a may be less than or equal to the thickness of the terminal 40 in the z direction.

<Current path via parasitic capacitance>
As shown above, the mold IC 10 is fixed to the mounting portion 60 with the adhesive 70. Therefore, a parasitic capacitance 90 is formed between the mold IC 10 and the mounting portion 60. As shown in FIG. 1, the mold IC 10 and the mounting portion 60 are electrically connected via the parasitic capacitance 90. Hereinafter, this current path is referred to as a parasitic path. In FIG. 7, this parasitic route is indicated by a cross. The current paths are indicated by arrows in FIGS. 7 to 9.

As shown in FIG. 7, the AC component of noise flowing in the electric circuit of the fan controller 3 flows to the mounting unit 60 via this parasitic path. The AC component of the noise that has flowed to the mounting portion 60 flows to the first connecting path 48 described above via the bolt 80 inserted into the third connecting portion 43. The AC component of the noise that has flowed to the first connecting path 48 flows to the first connecting portion 41.

The AC component of the noise that has flowed to the first connection portion 41 flows to the parasitic path again via the leads 18 provided in the mold IC 10 and the wiring. In this way, the AC component of noise flows in the closed loop composed of the mold IC 10, the parasitic path, the mounting portion 60, the bolt 80, and the first connecting path 48. In FIG. 7, an arrow indicates this closed loop.

<Effect>
As described above, a parasitic path is formed between the electric circuit of the fan controller 3 and the mounting portion 60. The AC component of the noise generated in the electric circuit flows to the mounting unit 60 via the parasitic path. The AC component of the noise that has flowed to the mounting unit 60 flows to the reciprocating communication path 47 via the bolt 80.

The reciprocating passage 47 has a first connection portion 41 connected to the mold IC 10, a second connection portion 42 connected to the battery 2, and a third connection portion 43 connected to the mounting portion 60. The bolt 80 described above is inserted into the third connection portion 43. In the reciprocating passage 47, the third connection portion 43, the first connection portion 41, and the second connection portion 42 are arranged in order in the extension direction in which the extension portion 44 extends.

Therefore, the AC component of the noise that has flowed from the mounting portion 60 to the third connection portion 43 via the bolt 80 first tries to flow to the first connection portion 41. A part of the AC component of the noise flowing to the first connection portion 41 flows to the parasitic path via the mold IC 10 and circulates in the closed loop shown in FIG. 7.

The remaining part of the AC component of the noise that has flowed to the first connection portion 41 tends to flow to the second connection portion 42 as shown in FIG. Therefore, for example, as shown in FIG. 9, as compared with the configuration in which the third connection portion 43 and the second connection portion 42 are connected in the extension direction of the extension portion 44 without passing through the first connection portion 41, the third connection portion 43 The AC component of noise flowing to the second connection portion 42 tends to decrease. Therefore, the influence of noise on an external device such as a battery 2 located outside the fan controller 3 can be easily suppressed.

As shown above, the reciprocating communication path 47 extends from the first connecting surface 63a side to the third connecting surface 63c side, and then folds back and extends from the third connecting surface 63c side toward the first connecting surface 63a side. There is.

As shown in FIG. 8, with respect to the direction of the magnetic field generated with respect to the current flowing from the third connection portion 43 toward the first connection portion 41 and the current flowing from the first connection portion 41 toward the second connection portion 42. The direction of the magnetic field generated is opposite. Therefore, the magnetic fields generated in each current path are likely to cancel each other out.

Further, as described above, the shortest separation distance Lx in the x direction of the first extension portion 48a and the fifth extension portion 49b is equal to or less than the thickness of the terminal 40. By bringing the two current paths that generate the magnetic fields in opposite directions close to each other, the magnetic fields can easily cancel each other out effectively.

Although the preferred embodiments of the present disclosure have been described above, the present disclosure is not limited to the above-described embodiments, and can be variously modified and implemented without departing from the gist of the present disclosure. In addition, various symbols such as the cross mark shown in this embodiment have the same meanings as the symbols given to the drawings showing various modifications shown below.

(First modification)
The third connection portion 43 in the first connecting path 48 does not have to be on the first connecting surface 63a side of the first extension portion 48a. For example, as shown in FIG. 10, the third connection portion 43 may be on the fourth connecting surface 63d side of the second extension portion 48b. In this case, the second bolt hole 64 formed in the mounting portion 60 is also located on the fourth connecting surface 63d side of the facing surface 61a on the third connecting surface 63c side.

The length of the extension 44 from the third connection 43 to the first connection 41 in the first connection 48 is the extension 44 between the first connection 41 and the second connection 42 in the second connection 49. It is shorter than the length of. The length of the closed-loop current path via the parasitic path shown in FIG. 10 is shortened.

Therefore, the electrical resistance of the extension portion 44 from the third connection portion 43 to the first connection portion 41 is lower than the electrical resistance of the extension portion 44 between the first connection portion 41 and the second connection portion 42. The resistance of the closed loop through the parasitic path is reduced. This makes it easier for the AC component of noise to flow in the closed loop. Therefore, the AC component of the noise flowing from the first connection portion 41 to the second connection portion 42 is reduced. As a result, it is easy to suppress the propagation of noise to the outside of the fan controller 3.

(Second modification)
Further, as shown in FIG. 11, a part of the first extension portion 48a of the first connecting road 48 may be divided. In this case, it becomes difficult to form the current path as shown in FIGS. 7 and 8. Therefore, it becomes easy to suppress the flow of the AC component of noise from the third connection portion 43 to the second connection portion 42.

10 ... Mold IC, 12 ... 1st capacitor, 13 ... 2nd capacitor, 15 ... Diode, 16 ... Power MOSFET, 40 ... Terminal, 41 ... 1st connection part, 42 ... 2nd connection part, 43 ... 3rd connection part , 60 ... Mounting part, 63a ... First connecting surface, 63c ... Third connecting surface, 80 ... Bolt

Claims (5)

A mold IC (10) containing an electronic element (12, 13, 15, 16) and
The metal mounting portion (60) on which the mold IC is mounted and
A terminal (40) for connecting the mold IC and an external device,
It has a fastening member (80) that electrically and mechanically connects the terminal and the mounting portion.
The terminal has a first connection portion (41) connected to the mold IC, a second connection portion (42) connected to an external device, and a third connection portion (43) connected to the fastening member. Have,
An electronic component in which the first connection portion is located between the second connection portion and the third connection portion in the extending direction of the terminal. The electron according to claim 1, wherein the resistance of the portion between the first connection portion and the third connection portion is lower than the resistance of the portion between the first connection portion and the second connection portion. parts. 2. Claim 2 in which the length of the portion between the first connection portion and the third connection portion in the terminal is shorter than the length of the portion between the first connection portion and the second connection portion. Electronic components described in. Assuming that the two points separated in a predetermined direction are the first predetermined position (63a) and the second predetermined position (63c),
The first connection portion and the second connection portion are located on the first predetermined position side,
The third connection portion is located on the second predetermined position side,
The terminal according to any one of claims 1 to 3, wherein the terminal extends from the third connection portion to the first connection portion, and then folds back from the first connection portion to the second connection portion. Electronic components. The shortest distance between the portion extending from the third connection portion to the first connection portion in the terminal and the portion extending back from the first connection portion to the second connection portion is determined in the terminal. The electronic component according to claim 4, wherein the thickness is less than or equal to the thickness in the direction in which the mold IC and the mounting portion are aligned.

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