JP2020163786A - High-frequency dielectric heating adhesive sheet, fabric joined body, and joining method - Google Patents

Abstract

To provide a high-frequency dielectric heating adhesive sheet which can join fabrics with high strength by high-frequency dielectric heating treatment with low power for short time without suture; a fabric joined body including the high-frequency dielectric heating adhesive sheet; and a joining method using the high-frequency dielectric heating adhesive sheet.SOLUTION: A high-frequency dielectric heating adhesive sheet 10 has a high-frequency dielectric adhesive layer containing a thermoplastic resin (A) a dielectric filler (B), in which the dielectric filler (B) is zinc oxide and is used for joining fabrics 21 and 22.SELECTED DRAWING: Figure 1

Description

The present invention relates to a high frequency dielectric heating adhesive sheet, a fabric bonded body, and a bonding method.

As a technique for joining fabrics, there is a technique for joining fabrics by high frequency or heat treatment instead of sewing.
For example, Patent Document 1 describes, as a tape used for bonding fabrics, for fabrics composed of a thermoplastic polymer tape substrate and a large number of adhesive spot layers formed on at least one surface of the tape substrate so as to be separated from each other. Adhesive tape is listed.

Further, for example, in Patent Document 2, a waterproof cloth obtained by laminating a fiber base cloth and a thermoplastic resin film having a predetermined dielectric constant, dielectric constant and melting point has a predetermined dielectric constant, dielectric constant and melting point. A technique is described in which a stitch is sewn face down via a hot melt sealing material, and the sewn portion is dielectrically heated and joined using a high-frequency welder.

JP-A-57-117578 Japanese Patent Application Laid-Open No. 8-92868

According to the adhesive tape for fabrics described in Patent Document 1, it is described that two canvases can be joined by performing high frequency processing with a high frequency oscillator having an output of 2 kW and a frequency of 40.68 MHz for 3 seconds.
In the joining technique described in Patent Document 2, the waterproof fabric is joined under the conditions of an applied frequency of 40 MHz, an oscillation time of 5 seconds, and an anode current of 0.3 A, after being sewn face down.
However, since power consumption is large under high-frequency processing conditions as described in Patent Document 1, there is a demand for a technique for joining fabrics with high strength even with lower power consumption and short-time high-frequency dielectric heating treatment.
Further, in the joining technique described in Patent Document 2, the joining strength is secured by suturing with a sewing thread or the like, but there is a demand for a joining method capable of obtaining sufficient joining strength without suturing.

An object of the present invention is to provide a high-frequency dielectric heating adhesive sheet capable of bonding fabrics with high strength by low-power and short-time high-frequency dielectric heating treatment without stitching, and fabric bonding including the high-frequency dielectric heating adhesive sheet. It is to provide a body and to provide a joining method using the high frequency dielectric heating adhesive sheet.

According to one aspect of the present invention, the high-frequency dielectric adhesive layer has a high-frequency dielectric adhesive layer, and the high-frequency dielectric adhesive layer contains a thermoplastic resin (A) and a dielectric filler (B), and the dielectric filler (B). ) Is zinc oxide, a high-frequency dielectric heating adhesive sheet used for joining fabrics is provided.

In the high-frequency dielectric heating adhesive sheet according to one aspect of the present invention, the thermoplastic resin (A) preferably contains an olefin resin.

In the high-frequency dielectric heating adhesive sheet according to one aspect of the present invention, the thermoplastic resin (A) preferably contains a polyolefin-based resin having a polar moiety.

In the high-frequency dielectric heating adhesive sheet according to one aspect of the present invention, the flow start temperature of the high-frequency dielectric adhesive layer is preferably 80 ° C. or higher and 300 ° C. or lower.

In the high-frequency dielectric heating adhesive sheet according to one aspect of the present invention, the density of the high-frequency dielectric heating adhesive sheet is preferably ³ g / cm ³ or less.

In the high-frequency dielectric heating adhesive sheet according to one aspect of the present invention, the rate of change R1 of the tensile fracture stress of the high-frequency dielectric heating adhesive sheet before and after the dynamic flexibility test is 80% or more and 120% or less. preferable.
Rate of change R1 = {(tensile fracture stress after dynamic flexibility test) / (tensile fracture stress before dynamic flexibility test)} × 100

In the high-frequency dielectric heating adhesive sheet according to one aspect of the present invention, the Young's modulus of the high-frequency dielectric heating adhesive sheet is preferably 500 MPa or less.

According to one aspect of the present invention, the cloth, the adherend, and the high-frequency dielectric adhesive layer of the high-frequency dielectric heating adhesive sheet according to the above-mentioned aspect of the present invention for joining the cloth and the adherend. A fabric joint having the above is provided.

In the woven fabric joint according to one aspect of the present invention, the result of the joint strength test conducted by fixing the woven fabric and the adherend with a gripping tool is that the tensile shear force is 4 MPa or more, or the woven fabric is broken. It is preferable that the adherend is destroyed, or both the fabric and the adherend are destroyed.

In the cloth bonded body according to one aspect of the present invention, a water resistance test was conducted in which the cloth bonded body was immersed in water at a temperature of 25 ° C. for 1 day, and further allowed to stand in an environment of 25 ° C. and 50% RH for 24 hours. The result of the joint strength test is whether the tensile shear force is 4 MPa or more, the fabric is destroyed, the adherend is destroyed, or both the fabric and the adherend are destroyed. It is preferable that at least one of them is applicable.

In the cloth bonded body according to one aspect of the present invention, a solvent resistance test was conducted in which the cloth bonded body was immersed in an aliphatic hydrocarbon solvent at a temperature of 25 ° C. for 1 hour, and further, 24 at 25 ° C. and 50% RH environment. The result of the joint strength test conducted after allowing to stand for a long time is whether the tensile shear force is 4 MPa or more, the cloth is broken, the adherend is broken, or the cloth and the adherend are broken. It is preferable that both are destroyed or at least one of them.

According to one aspect of the present invention, there is provided a joining method for joining a fabric and an adherend by using the high-frequency dielectric heating adhesive sheet according to the above-mentioned aspect of the present invention.

In the joining method according to one aspect of the present invention, the step of arranging the high-frequency dielectric heating adhesive sheet between the cloth and the adherend, and applying a high frequency to the high-frequency dielectric adhesive layer are applied to the cloth and the adherend. It is preferable to have a step of joining the adherends.

In the joining method according to one aspect of the present invention, it is preferable to apply a high frequency of 1 kHz or more and 300 MHz or less to the high frequency dielectric adhesive layer.

In the joining method according to one aspect of the present invention, the application time of high frequency is preferably 1 second or more and 60 seconds or less.

According to one aspect of the present invention, it is possible to provide a high-frequency dielectric heating adhesive sheet capable of bonding fabrics with high strength by low-power and short-time high-frequency dielectric heating treatment without stitching.
According to one aspect of the present invention, it is possible to provide a fabric bonded body containing the high frequency dielectric heating adhesive sheet.
According to one aspect of the present invention, it is possible to provide a joining method using the high frequency dielectric heating adhesive sheet.

It is sectional drawing of the joint cloth which concerns on 1st Embodiment. It is a figure for demonstrating the dielectric heating treatment carried out by using the dielectric heating adhesive apparatus in 1st Embodiment. It is sectional drawing of the joint cloth which concerns on the modification. It is sectional drawing of the bonded cloth which concerns on another modification.

[Embodiment]
[High frequency dielectric heating adhesive sheet]
The high-frequency dielectric heating adhesive sheet according to the present embodiment includes a high-frequency dielectric adhesive layer. The high frequency dielectric adhesive layer contains a thermoplastic resin (A) and a dielectric filler (B). The high-frequency dielectric heating adhesive sheet according to this embodiment is used for joining fabrics. In the present specification, the thermoplastic resin (A) may be referred to as a component A. In the present specification, the dielectric filler (B) may be referred to as a B component.
Details of the high-frequency dielectric heating adhesive sheet and the high-frequency dielectric adhesive layer will be described later.

(1) Usage of High Frequency Dielectric Heating Adhesive Sheet The high frequency dielectric heating adhesive sheet according to this embodiment is used for joining fabrics. In the present specification, the fabrics are bonded to each other as an example, but the object to which the fabrics are bonded may be a fabric or another member (adhesive body). Other members include, for example, paper base materials such as high-quality paper, art paper, coated paper, and glassin paper; laminated paper obtained by laminating a thermoplastic resin such as polyethylene on these paper base materials; aluminum foil, copper foil, and iron. Metal foils such as foils; Porous materials such as non-woven fabrics; Polyethylene resins such as polyethylene resin and polypropylene resin, polyester resins such as polybutylene terephthalate resin and polyethylene terephthalate resin, acetate resins, ABS resins, polystyrene resins, vinyl chloride resins, etc. A resin film or sheet containing one or more kinds of resins; and the like.
By joining the fabric and the adherend using the high-frequency dielectric heating adhesive sheet according to the present embodiment, for example, a fabric joint can be manufactured. When the cloth joint body according to the present embodiment is a joint body of a cloth and an adherend, and the adherend is also a cloth, one cloth is referred to as a first cloth and the other cloth is referred to as a second cloth. It may be called. The bonded body obtained by joining the fabrics in this way is referred to as a bonded fabric in the present specification.

(Joint fabric)
FIG. 1 shows a schematic cross-sectional view showing the bonded fabric 1 according to the present embodiment.
The joining cloth 1 according to the present embodiment includes a first cloth 21, a high-frequency dielectric heating adhesive sheet 10, and a second cloth 22. The bonded cloth 1 includes a high-frequency dielectric heating adhesive sheet 10 between the first cloth 21 and the second cloth 22.
Details of the high-frequency dielectric heating adhesive sheet 10 will be described later.

(Fabric)
The first cloth 21 and the second cloth 22 are not particularly limited. As the first cloth 21 and the second cloth 22, for example, a woven fabric, a knitted fabric, or a non-woven fabric composed of fibers selected from the group consisting of conventionally known natural fibers and chemical fibers can be used independently.
Examples of chemical fibers include regenerated fibers, semi-synthetic fibers, synthetic fibers and inorganic fibers.
Examples of the recycled fiber include viscous fiber (rayon and polynosic), cuprammonium rayon fiber (cupra), peanut protein fiber, corn protein fiber, soybean protein fiber, mannan fiber, rubber fiber, argin fiber, chitin fiber and gazein fiber. Can be mentioned.
Semi-synthetic fibers include, for example, acetate fibers (acetate and triacetate) and promix fibers (promix).
Examples of synthetic fibers include nylon fibers, polyester fibers, aramid fibers, vinylon fibers, polyvinylidene chloride fibers, polyvinyl chloride fibers, fluorine fibers, acrylic fibers, acrylic fibers, polyethylene fibers, and polypropylene fibers. , Polyurethane fiber, polyclar fiber, polylactic acid fiber and the like.
Examples of the inorganic fiber include glass fiber, carbon fiber and metal fiber.
Examples of natural fibers include plant fibers and animal fibers.
Plant fibers include, for example, cotton, cabock, wood pulp, non-wood pulp, hemp, Manila hemp, sisal, New Zealand hemp, Rafu hemp, coconut, rush, and straw.
Animal fibers include animal hair (wool, angora, mohair, cashmere, alpaca, camel, vicuna), silk (silk) and feathers (down, feather).
The fabric may be composed of one type of fiber or may be composed of two or more types of fibers.

The first cloth 21 and the second cloth 22 are preferably waterproof cloths from the viewpoint that the effects of the present invention can be further obtained.

The thickness of the first cloth 21 and the second cloth 22 is not particularly limited, and a cloth having a thickness suitable for the intended use may be appropriately selected.
The thickness of the first cloth 21 and the second cloth 22 is preferably 50 μm or more, more preferably 100 μm or more, and 300 μm or more independently from the viewpoint of reducing damage to the adherend. It is more preferably 500 μm or more, and even more preferably 500 μm or more.
The thickness of the first cloth 21 and the second cloth 22 is preferably 2000 μm or less, more preferably 1200 μm or less, and 1000 μm or less, independently from the viewpoint of efficient joining. More preferred.

The basis weight of the first cloth 21 and the second cloth 22 is not particularly limited, and a cloth with a basis weight according to the intended use may be appropriately selected.
The basis weights of the first cloth 21 and the second cloth 22 are preferably 100 g / m ² or more, and more preferably 150 g / m ² or more, respectively, from the viewpoint of reducing damage to the adherend. It is preferably 170 g / m ² and more preferably 170 g / m ² .
The texture of the first cloth 21 and the second cloth 22 is preferably 3000 g / m ² or less, more preferably 2000 g / m ² or less, and 1000 g, respectively, from the viewpoint of efficient joining. It is more preferably less than / m ^{2 and} even more preferably 500 g / m ² or less, even more preferably 250 g / m ² or less, and particularly preferably 220 g / m ² or less.

The first cloth 21 and the second cloth 22 are preferably cloths having low dielectric properties (tan δ / ε'). It is preferable that the dielectric property of the high-frequency dielectric heating adhesive sheet 10 is larger than the dielectric property of the first cloth 21 and the second cloth 22. The dielectric properties (tan δ / ε') of the first cloth 21 and the second cloth 22 are independently preferably 0.010 or less, more preferably 0.008 or less, and 0.005 or less. It is more preferable to have. If the first cloth 21 and the second cloth 22 have dielectric properties in such a range, it is easy to prevent the first cloth 21 and the second cloth 22 from being heated and spoiling the appearance during the dielectric heat treatment. .. The method for measuring the dielectric loss tangent (tan δ), the dielectric constant (ε ′) and the dielectric property (tan δ / ε ′) will be described later.

Items including the bonded fabric 1 include down jackets, rainwear, T-shirts, sweatshirts, jerseys, pants, sweat suits, socks, hats, underwear, swimwear, wet suits, dry suits, space suits, body shape measurement suits, and dresses. And clothing such as blouses, tents, sleeping bags, bedding, handkerchiefs, scarves, towels, bedspreads, cushion covers, sheets, tents, curtains, carrying bags, cloth bags, stuffed animals, flags, carpets, sails, wallpapers, etc. ..

For example, when the down jacket has the structure of the joint fabric 1, the strength of the joint portion (crimping portion) is strong, and it is possible to prevent the joint portion from peeling off due to washing, dry cleaning, or deterioration over time. In a so-called seamless down jacket in which there is no stitching for partitioning a portion for accommodating down, the bonding structure by the high-frequency dielectric heating adhesive sheet 10 is suitable.
Further, for example, by using the high-frequency dielectric heating adhesive sheet 10 according to the present embodiment and joining the waterproof zipper as the first cloth to the second cloth, there is no seam and the waterproof property is further improved. Can be obtained.
Further, for example, by using the high-frequency dielectric heating adhesive sheet 10 according to the present embodiment, it is possible to obtain a high-strength tent that has no seams and can withstand wind pressure and the like.

(Characteristics of bonded fabric)
It is preferable that the evaluation result of the bonded fabric 1 is acceptable when the following bonding strength test is performed.
-Joint strength test With respect to the test piece prepared by joining a pair of cloths (in this embodiment, the first cloth 21 and the second cloth 22) with the high-frequency dielectric heating adhesive sheet according to the present embodiment. The result of the joint strength test is that the tensile shear force is 4 MPa or more, the first fabric 21 is destroyed, the second fabric 22 is destroyed, or both the first fabric 21 and the second fabric 22 are destroyed. If at least one of the above is true, it is judged as passing. According to the high-frequency dielectric heating adhesive sheet whose evaluation result is acceptable when the bonding strength test is performed, it is possible to provide the bonding fabric 1 bonded with higher strength.
In the present specification, in the joint strength test of the bonded fabric, each fabric constituting the bonded fabric is fixed with a gripping tool of the tensile tester using a tensile tester according to JIS K 6850: 1999, and the following Perform under the measurement conditions.
-Test conditions for joint strength test Width of test piece: within 25 mm Test speed: 100 m / min
The joint strength test of the fabric joint is carried out under the same tensile tester and test conditions as the joint fabric. In this case, the cloth and the adherend constituting the cloth joint are fixed by the gripping tool of the tensile tester.

Further, it is more preferable that the evaluation result of the bonded fabric 1 is acceptable when the following water resistant bonding strength test is performed. According to the high-frequency dielectric heating adhesive sheet whose evaluation result is acceptable when the water resistance bonding strength test is performed, it is possible to provide the bonding fabric 1 having more excellent water resistance.
-Water-resistant bonding strength test A test piece obtained by bonding a pair of fabrics (in this embodiment, the first fabric 21 and the second fabric 22) with the high-frequency dielectric heating adhesive sheet according to the present embodiment is subjected to a temperature of 25 ° C. The result of the joint strength test, which was carried out after performing a water resistance test in which the cloth was immersed in the water for 1 day and further standing in a 50% RH environment at 25 ° C. for 24 hours, showed that the tensile shear force was 4 MPa or more. If at least one of the following, that is, the cloth 21 is destroyed, the second cloth 22 is destroyed, or both the first cloth 21 and the second cloth are destroyed, the result is determined to be acceptable.

Further, it is more preferable that the evaluation result of the bonded fabric 1 is acceptable when the following solvent-resistant bonding strength test is performed. According to the high-frequency dielectric heating adhesive sheet whose evaluation result is acceptable when the solvent-resistant bonding strength test is performed, it is possible to provide the bonding cloth 1 having more excellent solvent resistance. If the bonded fabric has excellent solvent resistance, it is easy to secure the bonding strength even after undergoing a dry cleaning treatment.
-Solude resistance bonding strength test A test piece obtained by bonding a pair of fabrics (in this embodiment, the first fabric 21 and the second fabric 22) with the high-frequency dielectric heating adhesive sheet according to the present embodiment is heated to a temperature of 25. The results of the bonding strength test conducted after conducting a solvent resistance test in which the fabric was immersed in an aliphatic hydrocarbon solvent at ° C for 1 hour and then allowing it to stand in an environment of 25 ° C and 50% RH for 24 hours showed that the tensile shear force was high. If it corresponds to at least one of 4 MPa or more, the first cloth 21 is destroyed, the second cloth 22 is destroyed, and both the first cloth 21 and the second cloth 22 are destroyed. Judge as passing. In the present specification, T-SOL 3040 FLUID (“T-SOL” is a registered trademark) manufactured by JXTG Energy Co., Ltd. is used as the aliphatic hydrocarbon solvent used in the solvent resistance test.

As a method for producing the bonded fabric 1 satisfying the above-mentioned bonding strength, water-resistant bonding strength or solvent-resistant bonding strength, for example, the high-frequency dielectric heating adhesive sheet and the dielectric heating bonding device described below will be used, and the following will be described. A method of producing the bonded fabric 1 depending on the high-frequency dielectric heating bonding conditions to be applied can be mentioned.

(2) Method of joining the first cloth and the second cloth The first cloth 21 and the second cloth 22 are preferably joined by dielectric heating treatment, and a joining method including the following steps (P1) and (P2). It is more preferable to join with.
Step (P1): A step of arranging the high-frequency dielectric heating adhesive sheet 10 between the first cloth 21 and the second cloth 22. Step (P2): Placed between the first cloth 21 and the second cloth 22. A step of performing a dielectric heating treatment on a high-frequency dielectric heating adhesive sheet 10 using a dielectric heating adhesive device.

The step (P1) is a step of arranging the high-frequency dielectric heating adhesive sheet 10 at a predetermined position. Specifically, the step (P1) is a step of sandwiching the high-frequency dielectric heating adhesive sheet 10 between the first cloth 21 and the second cloth 22.

The high-frequency dielectric heating adhesive sheet 10 may be sandwiched between the first cloth 21 and the second cloth 22 so that the first cloth 21 and the second cloth 22 can be joined. The high-frequency dielectric heating adhesive sheet 10 may be sandwiched between the first cloth 21 and the second cloth 22 at a plurality of places or on the entire surface. From the viewpoint of improving the joint strength between the first cloth 21 and the second cloth 22, it is preferable to sandwich the high-frequency dielectric heating adhesive sheet 10 over the entire joint surface between the first cloth 21 and the second cloth 22.

Further, as one aspect of sandwiching the high-frequency dielectric heating adhesive sheet 10 in a part between the first cloth 21 and the second cloth 22, along the outer periphery of the joint surface between the first cloth 21 and the second cloth 22. An embodiment in which the high-frequency dielectric heating adhesive sheet 10 is arranged in a frame shape and sandwiched between the first cloth 21 and the second cloth 22 can be mentioned. By arranging the high-frequency dielectric heating adhesive sheet 10 in a frame shape in this way, the bonding strength between the first cloth 21 and the second cloth 22 is obtained, and the high-frequency dielectric heating adhesive sheet 10 is arranged over the entire joint surface. The weight of the bonded cloth 1 can be reduced as compared with the case. By reducing the weight of the bonded fabric 1, it is possible to reduce the weight of the article using the bonded fabric 1, and for example, it is possible to provide clothing that is more comfortable to wear. Further, when the high-frequency dielectric heating adhesive sheet 10 is arranged in a frame shape and the first fabric 21 and the second fabric 22 are joined, the first fabric 21, the second fabric 22, and the high-frequency dielectric adhesive layer are surrounded. Space can be formed. The space can prevent the inclusions (for example, down of the down jacket, air, cotton, etc.) contained in the space from leaking out, and can also prevent foreign matter from entering the space from the outside.

Further, according to one aspect in which the high-frequency dielectric heating adhesive sheet 10 is sandwiched between the first cloth 21 and the second cloth 22, the size of the high-frequency dielectric heating adhesive sheet 10 to be used can be reduced, so that the entire joint surface can be reduced. The high-frequency dielectric heating treatment time can be shortened as compared with the case where the high-frequency dielectric heating adhesive sheet 10 is arranged.

The step (P2) is a step of performing a dielectric heating treatment on the high-frequency dielectric heating adhesive sheet 10 arranged between the first cloth 21 and the second cloth 22 by using a dielectric heating adhesive device.
Next, the dielectric heating adhesive device used in the step (P2) and the conditions for the dielectric heating treatment thereof will be described. Here, an example of manufacturing the bonded fabric 1 will be described.

(3) Dielectric Heat Adhesive Device FIG. 2 shows a schematic view of the dielectric heat adhesive device 100.
The dielectric heating adhesive device 100 includes a first high frequency application electrode 160, a second high frequency application electrode 180, and a high frequency power supply 200.
The first high frequency application electrode 160 and the second high frequency application electrode 180 are arranged to face each other. The first high frequency application electrode 160 and the second high frequency application electrode 180 have a press mechanism. By this press mechanism, the first cloth 21, the high frequency dielectric heating adhesive sheet 10 and the second cloth 22 can be pressure-treated between the first high frequency application electrode 160 and the second high frequency application electrode 180.

When the first high frequency application electrode 160 and the second high frequency application electrode 180 form a pair of flat plate electrodes parallel to each other, such an electrode arrangement type may be referred to as a parallel plate type.
It is also preferable to use a parallel plate type high frequency dielectric heating device for applying a high frequency. In the case of a parallel flat plate type high frequency dielectric heating device, since the high frequency penetrates the high frequency dielectric heating adhesive sheet located between the electrodes, the entire high frequency dielectric heating adhesive sheet can be warmed, and the adherend and the high frequency dielectric heating adhesive sheet can be heated. Can be bonded in a short time.

A high frequency power supply 200 for applying a high frequency of, for example, a frequency of about 27.12 MHz or a frequency of about 40.68 MHz is connected to each of the first high frequency application electrode 160 and the second high frequency application electrode 180.
As shown in FIG. 2, the dielectric heating adhesive device 100 performs a dielectric heating treatment via a high-frequency dielectric heating adhesive sheet 10 sandwiched between the first cloth 21 and the second cloth 22. Further, the dielectric heating and bonding device 100 adheres the first cloth 21 and the second cloth 22 by a pressure treatment by the first high frequency application electrode 160 and the second high frequency application electrode 180 in addition to the dielectric heat treatment.

When a high-frequency electric field is applied between the first high-frequency application electrode 160 and the second high-frequency application electrode 180, the overlapping portion of the first cloth 21 and the second cloth 22 is contained in the adhesive component of the high-frequency dielectric heating adhesive sheet 10. The dispersed dielectric filler (not shown) absorbs high frequency energy.
Then, the dielectric filler as the B component functions as a heat generating source, and the heat generated melts the thermoplastic resin component as the A component, and finally, even if the treatment is performed for a short time, the first fabric 21 and the first cloth 21 It can be firmly adhered to the second cloth 22.

Since the first high frequency application electrode 160 and the second high frequency application electrode 180 have a press mechanism, they also function as a press device. Therefore, the first cloth 21 and the second cloth 22 can be more firmly bonded by the pressurization in the compression direction by the first high frequency application electrode 160 and the second high frequency application electrode 180 and the heating and melting of the high frequency dielectric heating adhesive sheet 10. ..

(4) High Frequency Dielectric Heating Adhesion Conditions The high frequency dielectric heating bonding conditions can be changed as appropriate, but the following conditions are preferable.

The high frequency output is preferably 10 W or more, more preferably 50 W or more, and even more preferably 100 W or more.
The high frequency output is preferably 50,000 W or less, preferably 20,000 W or less, more preferably 15,000 W or less, further preferably 10,000 W or less, and 1,000 W or less. Is even more preferable.
When the high frequency output is 10 W or more, it is easy to prevent the problem that the temperature does not easily rise due to the dielectric heating treatment and good adhesive force cannot be obtained.
When the high frequency output is 50,000 W or less, it is easy to prevent a problem that temperature control by dielectric heating treatment becomes difficult. From the viewpoint of power consumption, a small high frequency output is preferable, but it is preferable to appropriately set the high frequency output in consideration of the balance with the adhesive force.

The high frequency application time is preferably 1 second or longer.
The application time of the high frequency is preferably 60 seconds or less, preferably 45 seconds or less, preferably 35 seconds or less, more preferably 25 seconds or less, and further preferably 10 seconds or less.
If the high frequency application time is 1 second or more, it is easy to prevent the problem that the temperature does not easily rise due to the dielectric heating treatment and good adhesive force cannot be obtained.
If the application time of the high frequency is 60 seconds or less, the manufacturing efficiency of the bonded cloth 1 is lowered, the manufacturing cost is high, and the bonded cloth 1, the first cloth 21, and the second cloth 22 are thermally deteriorated. It is easy to prevent such problems.

The high frequency frequency is preferably 1 kHz or higher, more preferably 1 MHz or higher, further preferably 5 MHz or higher, and even more preferably 10 MHz or higher.
The high frequency frequency is preferably 300 MHz or less, more preferably 100 MHz or less, further preferably 80 MHz or less, and even more preferably 50 MHz or less. Specifically, the industrial frequency bands 13.56 MHz, 27.12 MHz or 40.68 MHz assigned by the International Telecommunication Union are also used in the high frequency dielectric heating bonding method of the present embodiment.

(5) High Frequency Dielectric Heating Adhesive Sheet and High Frequency Dielectric Adhesive Layer The high frequency dielectric heating adhesive sheet according to the present embodiment comprises only one layer of the high frequency dielectric adhesive layer in one embodiment. The high-frequency dielectric heating adhesive sheet according to the present invention is not limited to an embodiment consisting of only one layer of the high-frequency dielectric adhesive layer, and as a modification of the high-frequency dielectric heating adhesive sheet, layers other than the high-frequency dielectric adhesive layer are laminated. There are also aspects that have been used.
As described above, the high-frequency dielectric heating adhesive sheet may consist of only one layer of the high-frequency dielectric adhesive layer. Therefore, in the present specification, the terms "high-frequency dielectric heating adhesive sheet" and "high-frequency dielectric adhesive layer" are used. The terms can be interchanged with each other in some cases.

(5.1) Thermoplastic resin (A)
The type of the thermoplastic resin (A) is not particularly limited.
The thermoplastic resin (A) is, for example, a polyolefin resin, a polyolefin resin having a polar moiety, a styrene resin, a polyacetal resin, a polycarbonate resin, etc. from the viewpoint of being easily melted and having a predetermined heat resistance. It is preferably at least one selected from the group consisting of polyacrylic resins, polyamide resins, polyimide resins, polyvinyl acetate resins, phenoxy resins and polyester resins.

The thermoplastic resin (A) is preferably a polyolefin-based resin or a polyolefin-based resin having a polar moiety.

The polyolefin-based resin as the thermoplastic resin (A) may be a polyolefin-based resin having no polar moiety.

(Polyolefin resin)
The polyolefin-based resin as the thermoplastic resin (A) is composed of, for example, a resin made of a homopolymer such as polyethylene, polypropylene, polybutene and polymethylpentene, and ethylene, propylene, butene, hexene, octene and 4-methylpentene. Examples thereof include α-olefin resins made of copolymers of monomers selected from the group. The polyolefin-based resin as the thermoplastic resin (A) may be a single resin or a combination of two or more resins.

(Polyolefin-based resin with polar parts)
The polar portion of the polyolefin-based resin having a polar moiety is not particularly limited as long as it can impart polarity to the polyolefin-based resin. A polyolefin resin having a polar portion is preferable because it exhibits high adhesive strength to the fabric.
The thermoplastic resin (A) may be a copolymer of an olefin-based monomer and a monomer having a polar moiety. Further, the thermoplastic resin (A) may be a resin obtained by introducing a polar moiety into an olefin polymer obtained by polymerizing an olefin monomer by modification such as an addition reaction.

The type of the olefin-based monomer constituting the polyolefin-based resin having the polar moiety as the thermoplastic resin (A) is not particularly limited. Examples of the olefin-based monomer include ethylene, propylene, butene, hexene, octene, 4-methyl-1-pentene and the like. The olefin-based monomer may be used alone or in combination of two or more.
Ethylene and polypropylene are preferable as the olefin-based monomer from the viewpoint of excellent mechanical strength and stable adhesive properties.
The olefin-derived structural unit in the polyolefin-based resin having a polar moiety is preferably ethylene or a propylene-derived structural unit.

Examples of the polar moiety include a hydroxyl group, a carboxy group, a vinyl acetate structure, an acid anhydride structure, and an acid-modified structure introduced into a polyolefin resin by acid modification.

The acid-modified structure as a polar site is a site introduced by acid-modifying a polyolefin resin. Examples of the compound used for graft-modifying a polyolefin resin include an unsaturated carboxylic acid derivative component derived from any one of an unsaturated carboxylic acid, an acid anhydride of the unsaturated carboxylic acid, and an ester of the unsaturated carboxylic acid.

Examples of unsaturated carboxylic acids include acrylic acid, methacrylic acid, maleic acid, fumaric acid, itaconic acid and citraconic acid.

Examples of the acid anhydride of the unsaturated carboxylic acid include acid anhydrides of unsaturated carboxylic acids such as maleic anhydride, itaconic anhydride and citraconic anhydride.

Examples of the ester of unsaturated carboxylic acid include methyl acrylate, ethyl acrylate, methyl methacrylate, ethyl methacrylate, butyl methacrylate, dimethyl maleate, monomethyl maleate, dimethyl fumarate, diethyl fumarate, and dimethyl itaconic acid. , Esters of unsaturated carboxylic acids such as diethyl itaconic acid, dimethyl citraconic acid, diethyl citraconic acid and dimethyl tetrahydrohydride phthalate.

When the thermoplastic resin (A) is a copolymer of an olefin-based monomer and a monomer having a polar moiety, the copolymer preferably contains 2% by mass or more of a structural unit derived from the monomer having a polar moiety. It is more preferably contained in an amount of 4% by mass or more, further preferably contained in an amount of 5% by mass or more, and further preferably contained in an amount of 6% by mass or more. Further, the copolymer preferably contains 30% by mass or less of a constituent unit derived from a monomer having a polar moiety, more preferably 25% by mass or less, further preferably 20% by mass or less, and 15% by mass. It is particularly preferable to include the following.
When the copolymer contains 2% by mass or more of a monomer-derived structural unit having a polar moiety, the adhesive strength of the high-frequency dielectric heating adhesive sheet is improved. Further, when the copolymer contains 30% by mass or less of a constituent unit derived from a monomer having a polar moiety, it is possible to prevent the thermoplastic resin (A) from becoming too tacky. As a result, it becomes easy to prevent the molding process of the high-frequency dielectric heating adhesive sheet from becoming difficult. Further, when the copolymer contains 30% by mass or less of a constituent unit derived from a monomer having a polar moiety, it becomes easy to suppress deterioration of water resistance and solvent resistance of the high-frequency dielectric adhesive layer.

When the polyolefin resin as the thermoplastic resin (A) has an acid-modified structure, the acid modification rate is preferably 0.01% by mass or more, more preferably 0.1% by mass or more. It is more preferably 0.2% by mass or more.
When the polyolefin resin as the thermoplastic resin (A) has an acid-modified structure, the acid modification rate is preferably 30% by mass or less, more preferably 20% by mass or less, and 10% by mass or less. Is more preferable.
When the thermoplastic resin (A) has an acid-modified structure, the adhesive strength of the high-frequency dielectric heating adhesive sheet is improved when the acid modification rate is 0.01% by mass or more. Further, when the modification rate by acid is 30% by mass or less, it is possible to prevent the thermoplastic resin (A) from becoming too tacky. As a result, it becomes easy to prevent the molding process of the high-frequency dielectric heating adhesive sheet from becoming difficult. Further, when the modification rate of the copolymer by acid is 30% by mass or less, it is easy to suppress the deterioration of the water resistance and heat resistance of the high-frequency dielectric adhesive layer.
As used herein, the modification rate is a percentage of the mass of the acid-derived portion with respect to the total mass of the acid-modified polyolefin.

(Maleic anhydride-modified polyolefin)
The polyolefin-based resin as the thermoplastic resin (A) more preferably has an acid anhydride structure as an acid-modified structure. The acid anhydride structure is preferably a structure introduced when the polyolefin resin is modified with maleic anhydride.
In the maleic anhydride-modified polyolefin as the component A, the modification rate with maleic anhydride is preferably in the same range as the modification rate when the polyolefin-based resin as the thermoplastic resin (A) has an acid-modified structure. The effect obtained within this range is also the same as when the polyolefin-based resin as the thermoplastic resin (A) has an acid-modified structure.

The olefin-derived structural unit in the maleic anhydride-modified polyolefin is preferably an ethylene or propylene-derived structural unit. That is, the maleic anhydride-modified polyolefin is preferably a maleic anhydride-modified polyethylene resin or a maleic anhydride-modified polypropylene resin.

(Olefin-vinyl acetate copolymer resin)
The thermoplastic resin (A) according to the present embodiment is also preferably a copolymer (olefin-vinyl acetate copolymer resin) containing a structural unit derived from olefin and a structural unit derived from vinyl acetate.
The olefin-vinyl acetate copolymer resin as the thermoplastic resin (A) has a structural unit derived from vinyl acetate, and the thermoplastic resin (A) has a polar moiety in a copolymer of an olefin-based monomer and a monomer having a polar moiety. It is preferable to have it in the same range as the constituent unit derived from the monomer to have, and the effect obtained within the range is also when the thermoplastic resin (A) is a copolymer of an olefin-based monomer and a monomer having a polar moiety. The same is true.

The olefin-derived structural unit in the olefin-vinyl acetate copolymer resin is preferably a structural unit derived from ethylene or propylene from the viewpoint of excellent mechanical strength and stable adhesiveness.
Therefore, the thermoplastic resin (A) is preferably at least one of an ethylene-vinyl acetate copolymer resin and a propylene-vinyl acetate copolymer resin, and more preferably an ethylene-vinyl acetate copolymer resin. The structural units derived from vinyl acetate in the ethylene-vinyl acetate copolymer resin and the propylene-vinyl acetate copolymer resin are also preferably in the same range as the percentage (mass%) described for the olefin-vinyl acetate copolymer resin.

(Softening temperature)
The softening temperature of the thermoplastic resin (A) measured in accordance with JIS K 7196: 2012 is preferably 40 ° C. or higher, more preferably 50 ° C. or higher, and further preferably 60 ° C. or higher. preferable.
The softening temperature of the thermoplastic resin (A) measured in accordance with JIS K 7196: 2012 is preferably 200 ° C. or lower, preferably 150 ° C. or lower, and more preferably 130 ° C. or lower. , 100 ° C. or lower is more preferable.
When the softening temperature of the thermoplastic resin (A) is 40 ° C. or higher, the heat resistance of the high-frequency dielectric adhesive layer can be easily improved. Even if the bonded fabric 1 obtained by bonding the fabrics using the high-frequency dielectric heating adhesive sheet according to the present embodiment is placed in a high temperature environment (for example, a high temperature environment such as midsummer), the bonded state between the fabrics can be maintained. Can be secured.
When the softening temperature of the thermoplastic resin (A) is 200 ° C. or lower, stable bonding strength can be easily obtained in a short time. If stable bonding strength can be obtained in a short time, the influence of heat on the fabric can be suppressed.

(Average molecular weight)
The average molecular weight (mass average molecular weight) of the thermoplastic resin (A) is usually preferably 5000 or more, more preferably 10,000 or more, and further preferably 20,000 or more.
The average molecular weight (mass average molecular weight) of the thermoplastic resin (A) is preferably 300,000 or less, more preferably 200,000 or less, and even more preferably 100,000 or less.
When the mass average molecular weight of the thermoplastic resin (A) is 5000 or more, it is easy to prevent the heat resistance and the adhesive strength from being significantly lowered.
When the mass average molecular weight of the thermoplastic resin (A) is 300,000 or less, it is easy to prevent the weldability and the like when the dielectric heat treatment is carried out from being significantly lowered.
The mass average molecular weight of the thermoplastic resin (A) can be measured by, for example, the SEC method in accordance with JIS K7252-4: 2016.

(Melt flow rate)
The melt flow rate (MFR) of the thermoplastic resin (A) is usually preferably in the following range.
The MFR of the thermoplastic resin (A) is preferably 0.5 g / 10 minutes or more, more preferably 2 g / 10 minutes or more, and 5 g / 10 minutes or more under the conditions described below. More preferred.
The MFR of the thermoplastic resin (A) is preferably 50 g / 10 minutes or less, more preferably 40 g / 10 minutes or less, and further preferably 30 g / 10 minutes or less under the conditions described below. ..
When the MFR of the thermoplastic resin (A) is 0.5 g / 10 minutes or more, the fluidity can be maintained and the film thickness accuracy can be easily obtained. Further, when the MFR of the thermoplastic resin (A) is 0.5 g / 10 minutes or more, it is easy to improve the followability of the high-frequency dielectric heating adhesive sheet to the fabric having irregularities on the surface. Further, the melted high-frequency dielectric adhesive layer invades the unevenness of the surface of the fabric, and then the high-frequency dielectric adhesive layer solidifies, so that a so-called anchor effect is generated, and the bonding strength of the high-frequency dielectric adhesive layer to the fabric is further improved. To do.
When the MFR of the thermoplastic resin (A) is 50 g / 10 minutes or less, film forming property can be easily obtained.
The MFR of the thermoplastic resin (A) can be measured by the method described in the item of Examples described later.
The test temperature conforms to JIS K 7210-1: 2014. For example, when the structural unit derived from olefin in the thermoplastic resin (A) is polyethylene, the test temperature is 190 ° C. When the structural unit derived from olefin in the thermoplastic resin (A) is polypropylene, the test temperature is 230 ° C.

(5.2) Dielectric filler (B)
(type)
The dielectric filler (B) preferably generates heat when a high frequency of 1 kHz or more and 300 MHz or less is applied. Further, the dielectric filler (B) is preferably a high-frequency absorbent filler having a dielectric property capable of generating heat by applying a high frequency such as a frequency of 27.12 MHz or 40.68 MHz.

Dielectric fillers (B) include zinc oxide, silicon carbide (SiC), anatase-type titanium oxide, barium titanate, barium titanate, lead titanate, potassium niobate, rutyl-type titanium oxide, hydrated aluminum silicate, It is preferable to use one kind or a combination of two or more kinds of an inorganic material having crystalline water such as hydrated aluminosilicate of an alkali metal or an inorganic material having crystalline water such as hydrated aluminosilicate of an alkaline earth metal.

The dielectric filler (B) is preferably a metal oxide, more preferably zinc oxide. Zinc oxide as the dielectric filler (B) has high dielectric properties and has little effect on the thermoplastic resin (A). In addition, zinc oxide is abundant in variety and can be selected from various shapes and sizes. Further, if the dielectric filler (B) is zinc oxide, it is easy to improve the adhesive properties and mechanical properties of the high-frequency dielectric heating adhesive sheet according to the application.
Zinc oxide as the dielectric filler (B) can be easily uniformly mixed in the thermoplastic resin (A) which is an adhesive component. Therefore, even if the amount of zinc oxide in the high-frequency dielectric adhesive layer is relatively small, it is superior to the high-frequency dielectric heating adhesive sheet containing other dielectric fillers in a predetermined dielectric heating treatment. It can exert a heat generating effect.
Therefore, since the high-frequency dielectric adhesive layer contains zinc oxide as the dielectric filler (B), excellent weldability can be obtained in the dielectric heat treatment for joining the fabrics. According to the high-frequency dielectric adhesive layer containing zinc oxide as the dielectric filler (B), the adhesive characteristics and the mechanical characteristics can be exhibited according to the material of the fabric as the adherend and the variation of the application of the bonded fabric.

The high-frequency dielectric adhesive layer according to this embodiment preferably does not contain a conductive substance. Examples of the conductive substance include carbon or a carbon compound containing carbon as a main component (for example, carbon black) and a metal. The content of the conductive substance is preferably 5% by mass or less, more preferably 1% by mass or less, and preferably 0.1% by mass or less, based on the total amount of the high-frequency dielectric adhesive layer. It is even more preferably 0% by mass. When the content of the conductive substance in the high-frequency dielectric adhesive layer is 5% by mass or less, it is easy to prevent the problem of carbonization of the adhesive portion and the fabric due to electrical dielectric breakdown during the dielectric heat treatment.

(Average particle size)
The average particle diameter (median diameter, D50) measured in accordance with JIS Z 8819-2: 2001 of the dielectric filler (B) is preferably 1 μm or more, more preferably 2 μm or more, and 3 μm or more. It is more preferably 5 μm or more.
The average particle diameter (median diameter, D50) measured in accordance with JIS Z 8819-2: 2001 of the dielectric filler (B) is preferably 30 μm or less, more preferably 25 μm or less, and 20 μm or less. It is more preferably 15 μm or less.
If the average particle size of the dielectric filler (B) is too small, the reversal motion when a high frequency is applied is reduced, so that the dielectric heating adhesiveness is excessively lowered, and strong adhesion between the fabrics may be difficult.
On the other hand, as the average particle size of the dielectric filler (B) increases, the distance that can be polarized inside the filler increases. Therefore, the degree of polarization becomes large, the reversal motion becomes intense when a high frequency is applied, and the dielectric heating adhesiveness is improved.
Therefore, if the average particle size of the dielectric filler (B) is 1 μm or more, the distance that can be polarized inside the filler does not become too small, and it is easy to prevent the degree of polarization from becoming small, although it depends on the type of filler.
If the average particle size of the dielectric filler (B) is too large, the distance from the surrounding dielectric filler is short, so that the reversal motion when a high frequency is applied is reduced due to the influence of the electric charge, and the dielectric heating adhesiveness becomes excessive. It may be lowered, or it may be difficult to firmly bond the fabrics together.
Therefore, when the average particle size of the dielectric filler (B) is 30 μm or less, it is easy to prevent the dielectric heating adhesiveness from being excessively lowered and the strong adhesion between the fabrics from becoming difficult.
The average particle size (median diameter, D50) of zinc oxide as the dielectric filler (B) measured in accordance with JIS Z 8819-2: 2001 is preferably 1 μm or more, more preferably 2 μm or more. It is more preferably 3 μm or more, and even more preferably 5 μm or more.
The average particle diameter (median diameter, D50) of zinc oxide as the dielectric filler (B) measured in accordance with JIS Z 8819-2: 2001 is preferably 30 μm or less, more preferably 25 μm or less. , 20 μm or less, and even more preferably 15 μm or less.
The average particle size of the dielectric filler (B) is preferably smaller than the thickness of the high-frequency dielectric adhesive layer.

(Volume content)
The high-frequency dielectric heating adhesive sheet according to the present embodiment preferably contains the dielectric filler (B) in the high-frequency dielectric adhesive layer in an amount of 3% by volume or more, more preferably 5% by volume or more, and 10% by volume. It is more preferably contained in an amount of 13% by volume or more, and particularly preferably contained in an amount of 15% by volume or more.
The high-frequency dielectric heating adhesive sheet according to the present embodiment preferably contains the dielectric filler (B) in the high-frequency dielectric adhesive layer in an amount of 40% by volume or less, more preferably 35% by volume or less, and 25% by volume. It is more preferable to contain the following.
When the volume content of the dielectric filler (B) is 3% by volume or more, it is easy to prevent the heat generation from becoming poor during the dielectric heat treatment. As a result, it is possible to prevent a problem that the meltability of the thermoplastic resin (A) is excessively lowered and a strong adhesive force cannot be obtained.
If the volume content of the dielectric filler (B) is 40% by volume or less, the fluidity of the high-frequency dielectric heating adhesive sheet decreases during the dielectric heat treatment, or electricity is applied between the electrodes when a high frequency is applied. It is easy to prevent it from happening. Further, when the volume content of the dielectric filler (B) is 40% by volume or less, it is easy to prevent deterioration of the film-forming property, flexibility and toughness of the high-frequency dielectric heating adhesive sheet. When the volume content of the dielectric filler (B) is 40% by volume or less, it is possible to prevent the weight of the high-frequency dielectric adhesive layer from increasing, and it is easy to reduce the weight of the bonded fabric 1. As a result, the weight of the article using the bonded cloth 1 can be reduced, and for example, it is possible to provide clothing that is more comfortable to wear.
If the volume content of the dielectric filler (B) exceeds 50% by volume, the high-frequency dielectric adhesive layer becomes brittle and may not be suitable for a bonded fabric.

Since the high-frequency dielectric adhesive layer according to the present embodiment contains the thermoplastic resin (A) and the dielectric filler (B), the total volume of the thermoplastic resin (A) and the dielectric filler (B) is relative to the total volume. , The dielectric filler (B) is preferably contained in an amount of 3% by volume or more, more preferably 5% by volume or more, and further preferably 13% by volume or more.
The high-frequency dielectric adhesive layer according to the present embodiment preferably contains 40% by volume or less of the dielectric filler (B) with respect to the total volume of the thermoplastic resin (A) and the dielectric filler (B). It is more preferably contained in an amount of 25% by volume or less, and further preferably contained in an amount of 25% by volume or less.

(Number of copies)
The high-frequency dielectric adhesive layer according to the present embodiment preferably contains 5 parts by mass or more, and 20 parts by mass or more of the dielectric filler (B) with respect to 100 parts by mass of the thermoplastic resin (A). It is preferably contained in an amount of 30 parts by mass or more, more preferably 50 parts by mass or more, and further preferably 100 parts by mass or more.
The high-frequency dielectric adhesive layer according to the present embodiment preferably contains 800 parts by mass or less of the dielectric filler (B) with respect to 100 parts by mass of the thermoplastic resin (A), and preferably contains 400 parts by mass or less. It is more preferable to contain 300 parts by mass or less, and further preferably 200 parts by mass or less.
When the number of parts by mass of the dielectric filler (B) is 5 parts by mass or more, it is easy to prevent the heat generation from becoming poor during the dielectric heat treatment. As a result, it is easy to prevent a problem that the meltability of the thermoplastic resin (A) is excessively lowered and a strong adhesive force cannot be obtained.
When the number of parts by mass of the dielectric filler (B) is 800 parts by mass or less, the fluidity of the high-frequency dielectric heating adhesive sheet decreases during the dielectric heat treatment, or electricity is applied between the electrodes when a high frequency is applied. It is easy to prevent this. Further, when the number of parts by mass of the dielectric filler (B) is 800 parts by mass or less, it is easy to prevent deterioration of film forming property, flexibility and toughness of the high frequency dielectric heating adhesive sheet.

In the high-frequency dielectric heating adhesive sheet according to the present embodiment, the total mass of the thermoplastic resin (A) and the dielectric filler (B) is 80% by mass or more with respect to the total mass of the high-frequency dielectric adhesive layer. It is more preferably 90% by mass or more, and even more preferably 99% by mass or more.

(5.3) Additive The high-frequency dielectric adhesive layer according to the present embodiment may or may not contain an additive.

When the high-frequency dielectric adhesive layer according to the present embodiment contains an additive, the additive may be, for example, a tackifier, a plasticizer, a wax, a colorant, an antioxidant, an ultraviolet absorber, an antibacterial agent, or a coupling agent. , Viscosity modifiers, organic fillers, inorganic fillers and the like. Organic fillers and inorganic fillers as additives are different from dielectric fillers as component B.

The tackifier and the plasticizer can improve the melting property and the adhesive property of the high frequency dielectric adhesive layer.
Examples of the tackifier include rosin derivatives, polyterpene resins, aromatic-modified terpene resins, hydrides of aromatic-modified terpene resins, terpene phenol resins, kumaron inden resins, aliphatic petroleum resins, aromatic petroleum resins and aromatics. Examples include hydrides of petroleum resins.
Examples of the plasticizer include petroleum-based process oils, natural oils, dialkyl dibasic acids, and low molecular weight liquid polymers. Examples of petroleum-based process oils include paraffin-based process oils, naphthenic process oils, aromatic process oils, and the like. Examples of natural oils include castor oil and tall oil. Examples of the dialkyl dibasic acid include dibutyl phthalate, di-2-ethylhexyl phthalate, and dibutyl adipate. Examples of the low molecular weight liquid polymer include liquid polybutene and liquid polyisoprene.

When the high-frequency dielectric adhesive layer according to the present embodiment contains an additive, the high-frequency dielectric adhesive layer usually contains 0.01% by mass or more of the additive based on the total amount of the high-frequency dielectric adhesive layer. It is more preferable to contain 0.05% by mass or more, and even more preferably 0.1% by mass or more. When the high-frequency dielectric adhesive layer according to the present embodiment contains an additive, the high-frequency dielectric adhesive layer preferably contains 20% by mass or less of the additive based on the total amount of the high-frequency dielectric adhesive layer. It is more preferably contained in an amount of 15% by mass or less, and further preferably contained in an amount of 10% by mass or less.

In the high-frequency dielectric adhesive layer according to the present embodiment, the above-mentioned components (thermoplastic resin (A) and dielectric filler (B); if necessary, additional additives) are premixed, and a known kneading device is used. It can be kneaded and manufactured by a known molding method. Examples of the kneading device include an extruder and a heat roll. Examples of the molding method include extrusion molding, calendar molding, injection molding, casting molding and the like.

(6) Form and Characteristics of High Frequency Dielectric Heating Adhesive Sheet When the high frequency dielectric heating adhesive sheet according to the present embodiment consists of only one layer of the high frequency dielectric heating adhesive layer, the form and characteristics of the high frequency dielectric heating adhesive sheet are high frequency dielectric. Corresponds to the morphology and properties of the adhesive layer.

(Flow start temperature)
The flow start temperature of the high-frequency dielectric adhesive layer according to the present embodiment is preferably 80 ° C. or higher, more preferably 85 ° C. or higher, further preferably 90 ° C. or higher, and 95 ° C. or higher. Is particularly preferred.
The flow start temperature of the high-frequency dielectric adhesive layer according to the present embodiment is preferably 300 ° C. or lower, more preferably 250 ° C. or lower, further preferably 200 ° C. or lower, and 150 ° C. or lower. It is even more preferable, and it is even more preferable that the temperature is 130 ° C. or lower.
When the flow start temperature of the high-frequency dielectric adhesive layer is 80 ° C. or higher, the high-frequency dielectric adhesive layer tends to have good heat resistance. In particular, even if hot water such as hot water is applied to the high-frequency dielectric adhesive layer at the joint, good adhesiveness can be easily maintained if the flow start temperature of the high-frequency dielectric adhesive layer is 80 ° C. or higher.
When the flow start temperature of the high-frequency dielectric adhesive layer is 300 ° C. or lower, good adhesiveness can be easily obtained in a short time. In addition, it becomes easy to adhere to the fabric without damage.
The flow start temperature of the high-frequency dielectric adhesive layer can be measured by the method described in the item of Examples described later.

(Melting point)
The melting point of the high-frequency dielectric adhesive layer according to the present embodiment is preferably 60 ° C. or higher, more preferably 70 ° C. or higher, and even more preferably 80 ° C. or higher.
The melting point of the high-frequency dielectric adhesive layer according to the present embodiment is preferably 200 ° C. or lower, more preferably 150 ° C. or lower, and even more preferably 120 ° C. or lower.
If the melting point of the high-frequency dielectric adhesive layer is 60 ° C. or higher, the bonded state can be maintained even when the bonded cloth 1 is placed in a high temperature environment or a high temperature medium such as hot water comes into contact with the bonded portion of the bonded cloth 1. Easy to secure.
When the melting point of the high-frequency dielectric adhesive layer is 200 ° C. or lower, good adhesiveness can be obtained in a short time, and heat damage is unlikely to remain on the adherend.
The melting point of the high-frequency dielectric adhesive layer can be measured by the method described in the item of Examples described later.

(Loss tangent peak temperature at 1 Hz)
The loss tangent peak temperature at 1 Hz of the high-frequency dielectric adhesive layer according to the present embodiment is preferably 0 ° C. or lower, more preferably −10 ° C. or lower, and even more preferably −20 ° C. or lower. The loss tangent peak temperature of the high-frequency dielectric adhesive layer at 1 Hz is usually −60 ° C. or higher.
When the loss tangent peak temperature at 1 Hz of the high-frequency dielectric adhesive layer is 0 ° C. or less, it is easy to secure the bonding strength even when the bonding fabric 1 is placed in a low temperature environment. For example, even when wearing clothes containing the bonded cloth 1 and spending time in a cold region, it is possible to prevent the first cloth 21 and the second cloth 22 from peeling off.
The loss tangent peak temperature at 1 Hz of the high-frequency dielectric adhesive layer can be measured by the method described in the item of Examples described later.

(Tensile fracture stress after dynamic flexibility test)
The rate of change R1 of the tensile fracture stress of the high-frequency dielectric heating adhesive sheet before and after the dynamic flexibility test is preferably 80% or more, more preferably 85% or more, and more preferably 90% or more. Even more preferably, it is 95% or more.
The rate of change R1 of the tensile fracture stress of the high-frequency dielectric heating adhesive sheet before and after the dynamic flexibility test is preferably 120% or less, more preferably 115% or less, and more preferably 110% or less. Even more preferably, it is 105% or less.
Rate of change R1 = {(tensile fracture stress after dynamic flexibility test) / (tensile fracture stress before dynamic flexibility test)} × 100
If the rate of change R1 of the tensile fracture stress after the dynamic flexibility test of the high-frequency dielectric heating adhesive sheet is 80% or more, the sheet is brittle even if the adhesive site is bent multiple times by human movement or washing. It's hard to be.
If the rate of change R1 of the tensile fracture stress after the dynamic flexibility test of the high-frequency dielectric heating adhesive sheet is 120% or less, it is unlikely that the composition of the adhesive sheet has changed, so that the adhesive site is human. Quality stability is easy to obtain even if it is bent multiple times due to operation or washing.

The tensile fracture stress of the high-frequency dielectric heating adhesive sheet after the dynamic flexibility test is preferably 3 MPa or more, more preferably 4 MPa or more, and further preferably 5 MPa or more.
The tensile fracture stress of the high-frequency dielectric heating adhesive sheet after the dynamic flexibility test is preferably 40 MPa or less, more preferably 25 MPa or less, and even more preferably 15 MPa or less.
If the tensile breaking stress after the dynamic flexibility test of the high-frequency dielectric heating adhesive sheet is 3 MPa or more, it is possible to prevent the sheet from being broken even if the bonded part is bent multiple times by human movement or washing. easy.
If the tensile fracture stress of the high-frequency dielectric heating adhesive sheet after the dynamic flexibility test is 40 MPa or less, workability can be easily obtained even after long-term use.

(Young's modulus)
The Young's modulus of the high-frequency dielectric heating adhesive sheet is preferably 10 MPa or more, more preferably 25 MPa or more, further preferably 50 MPa or more, further preferably 75 MPa or more, and even more preferably 100 MPa or more. Is particularly preferred.
The Young's modulus of the high-frequency dielectric heating adhesive sheet is preferably 500 MPa or less, more preferably 400 MPa or less, further preferably 300 MPa or less, and even more preferably 200 MPa or less.
When the Young's modulus of the high-frequency dielectric heating adhesive sheet is 500 MPa or less, the joint portion of the joint fabric 1 can be easily bent.
When the Young's modulus of the high-frequency dielectric heating adhesive sheet is 10 MPa or more, it is possible to prevent the self-supporting property from being small and becoming difficult to handle during construction.
The Young's modulus of the high-frequency dielectric heating adhesive sheet can be measured by JIS K 7161-1: 2014 and JIS K 7127: 1999.

(thickness)
The thickness of the high-frequency dielectric adhesive layer according to the present embodiment is usually preferably 10 μm or more, more preferably 50 μm or more, and further preferably 100 μm or more.
The thickness of the high-frequency dielectric adhesive layer according to the present embodiment is preferably 2,000 μm or less, more preferably 1,000 μm or less, and further preferably 600 μm or less.
When the thickness of the high-frequency dielectric adhesive layer is 10 μm or more, it is possible to prevent the adhesive force between the first cloth 21 and the second cloth 22 from suddenly decreasing. Further, if the thickness of the high-frequency dielectric adhesive layer is 10 μm or more and the adhesive surface of at least one of the first cloth 21 and the second cloth 22 has irregularities, the high-frequency dielectric adhesive layer can follow the irregularities. Therefore, the adhesive strength is easily developed.
As long as the thickness of the high-frequency dielectric adhesive layer is 2,000 μm or less, it can be rolled into a roll or applied to a roll-to-roll method. In addition, the high-frequency dielectric heating adhesive sheet can be easily handled in the next process such as punching. Further, as the thickness of the high-frequency dielectric adhesive layer increases, the weight of the entire bonded fabric also increases, so the thickness is preferably within a range that does not cause a problem in use.

(Dielectric property (tan δ / ε'))
The dielectric loss tangent (tan δ) and the dielectric constant (ε') as the dielectric properties of the high-frequency dielectric heating adhesive sheet according to the present embodiment can be measured according to JIS C 2138: 2007, but according to the impedance material method. Therefore, it can be measured easily and accurately.
The dielectric property (tan δ / ε') of the high-frequency dielectric heating adhesive sheet according to the present embodiment is preferably 0.005 or more, more preferably 0.008 or more, and preferably 0.01 or more. More preferred.
The dielectric property (tan δ / ε') of the high-frequency dielectric heating adhesive sheet according to the present embodiment is preferably 0.05 or less, and more preferably 0.03 or less. The dielectric property (tan δ / ε') is a value obtained by dividing the dielectric loss tangent (tan δ) measured using an impedance material device or the like by the dielectric constant (ε') measured using an impedance material device or the like.
If the dielectric property of the high-frequency dielectric heating adhesive sheet is 0.005 or more, it is possible to prevent a problem that it becomes difficult to firmly bond the fabrics to each other without generating a predetermined heat when the dielectric heating treatment is performed. Easy to do.
When the dielectric property of the high-frequency dielectric heating adhesive sheet is 0.05 or less, damage to the bonded cloth 1, the first cloth 21, and the second cloth 22 is less likely to occur.
The details of the method for measuring the dielectric properties of the high-frequency dielectric heating adhesive sheet are as follows. A high-frequency dielectric heating adhesive sheet cut to a predetermined size is subjected to dielectric constant (ε') and dielectric loss tangent (tan δ) under the condition of a frequency of 40.68 MHz at 23 ° C. using an impedance material analyzer E4991 (manufactured by Agent). Each is measured and the value of the dielectric property (tan δ / ε') is calculated.

(Melt flow rate)
The melt flow rate (MFR) of the high-frequency dielectric adhesive layer according to the present embodiment is preferably 1.0 g / 10 minutes or more, more preferably 3.0 g / 10 minutes or more, and 5 It is more preferably 0.0 g / 10 minutes or more, further preferably 7.0 g / 10 minutes or more, and particularly preferably 10.0 g / 10 minutes or more.
The melt flow rate of the high-frequency dielectric adhesive layer according to the present embodiment is preferably 65 g / 10 minutes or less, more preferably 55 g / 10 minutes or less, and further preferably 45 g / 10 minutes or less. , 35 g / 10 minutes or less is more preferable.
In the present specification, the test temperature for measuring the MFR of the high-frequency dielectric adhesive layer is 230 ° C., and the load is 5 kg.
When the MFR of the high-frequency dielectric adhesive layer is 1.0 g / 10 minutes or more, the fluidity can be maintained and the film thickness accuracy can be easily obtained. If the MFR of the high-frequency dielectric adhesive layer is 1.0 g / 10 minutes or more, the melted high-frequency dielectric adhesive layer invades the irregularities on the surface of the fabric, and then the high-frequency dielectric adhesive layer solidifies. A so-called anchor effect is generated, and the bonding strength of the high-frequency dielectric adhesive layer to the fabric is further improved.
When the MFR of the high-frequency dielectric adhesive layer is 65 g / 10 minutes or less, film-forming property can be easily obtained.
The MFR of the high frequency dielectric adhesive layer can be measured by the method described in the item of Examples described later.

(Softening temperature)
The softening temperature of the high-frequency dielectric heating adhesive sheet measured in accordance with JIS K 7196: 2012 is preferably 50 ° C. or higher, more preferably 60 ° C. or higher, and even more preferably 70 ° C. or higher. ..
The softening temperature of the high-frequency dielectric heating adhesive sheet measured in accordance with JIS K 7196: 2012 is preferably 210 ° C. or lower, preferably 160 ° C. or lower, and more preferably 140 ° C. or lower. It is more preferably 110 ° C. or lower.
When the softening temperature of the high-frequency dielectric heating adhesive sheet is 50 ° C. or higher, the heat resistance of the high-frequency dielectric adhesive layer can be easily improved. Even if the bonded fabric 1 obtained by bonding the fabrics using the high-frequency dielectric heating adhesive sheet according to the present embodiment is placed in a high temperature environment (for example, a high temperature environment such as midsummer), the bonded state between the fabrics can be maintained. Can be secured.
When the softening temperature of the high-frequency dielectric heating adhesive sheet is 210 ° C. or lower, stable bonding strength can be easily obtained in a short time. If stable bonding strength can be obtained in a short time, the influence of heat on the fabric can be suppressed.

(density)
The density of the high-frequency dielectric heating adhesive sheet is preferably 0.90 g / cm ³ or more, more preferably 1.00 g / cm ³ or more, further preferably 1.10 g / cm ³ or more.
The density of the high-frequency dielectric heating adhesive sheet according to the present embodiment, is preferably 3 g / cm ³ or less, more preferably 2.5 g / cm ³ or less, still more preferably 2 g / cm ³ or less ..
When the density of the high-frequency dielectric heating adhesive sheet is 3 g / cm ³ or less, it is easy to prevent the high-frequency dielectric heating adhesive sheet from bending due to its own weight and to prevent the occurrence of peeling at the joint portion between the fabrics. Further, by reducing the weight of the bonded cloth 1, it is possible to reduce the weight of the article using the bonded cloth 1, and for example, it is possible to provide clothing that is more comfortable to wear.
Further, when the density of the high-frequency dielectric heating adhesive sheet is 0.90 g / cm ³ or more, it becomes easy to suppress fluttering when the sheet is formed by the roll-to-roll method.
The density of the high-frequency dielectric heating adhesive sheet can be measured according to the method A (underwater substitution method) of JIS K 7112: 1999.

(5% weight loss temperature)
The 5% weight loss temperature of the high-frequency dielectric adhesive layer according to the present embodiment is preferably 300 ° C. or higher, more preferably 325 ° C. or higher, further preferably 350 ° C. or higher, and 400 ° C. or higher. Is even more preferable.
The 5% weight loss temperature of the high-frequency dielectric adhesive layer according to the present embodiment is preferably 500 ° C. or lower, more preferably 475 ° C. or lower, and even more preferably 450 ° C. or lower.
When the 5% weight loss temperature of the high-frequency dielectric adhesive layer is 300 ° C. or higher, stable physical properties can be easily obtained even after molding.
When the 5% weight loss temperature of the high-frequency dielectric adhesive layer is 500 ° C. or lower, molding processability can be easily obtained.
The 5% weight loss temperature of the high frequency dielectric adhesive layer can be measured by the method described in the item of Examples described later.

The high frequency dielectric heating adhesive sheet according to the present embodiment is preferably used under the condition of high frequency output of 10 W or more, more preferably used under the condition of high frequency output of 50 W or more, and the condition of high frequency output of 100 W or more. It is more preferably used in.
The high frequency dielectric heating adhesive sheet according to the present embodiment is preferably used under the condition of high frequency output of 50,000 W or less, more preferably used under the condition of high frequency output of 20,000 W or less, and 15,000 W. It is more preferably used under the following high frequency output conditions, further preferably 10,000 W or less, and even more preferably 1,000 W or less.

The high-frequency dielectric heating adhesive sheet according to the present embodiment is preferably used by applying a high frequency of 1 kHz or more, more preferably by applying a high frequency of 1 MHz or more, and is used by applying a high frequency of 5 MHz or more. It is more preferable that it is used by applying a high frequency of 10 MHz or more.
The high-frequency dielectric heating adhesive sheet according to the present embodiment is preferably used by applying a high frequency of 300 MHz or less, more preferably by applying a high frequency of 100 MHz or less, and is used by applying a high frequency of 80 MHz or less. It is even more preferable that it is used by applying a high frequency of 50 MHz or less.
More specifically, the high-frequency dielectric heating adhesive sheet according to the present embodiment is used by applying a high frequency of 13.56 MHz, 27.12 MHz or 40.68 MHz in the industrial frequency band assigned by the International Telecommunication Union. Is preferable.

The high-frequency dielectric heating adhesive sheet according to this embodiment is preferably used for a high-frequency application time of 1 second or longer.
The high frequency dielectric heating adhesive sheet according to the present embodiment is preferably used with a high frequency application time of 60 seconds or less, preferably with a high frequency application time of 45 seconds or less, and has a high frequency of 35 seconds or less. It is preferably used depending on the application time, more preferably 25 seconds or less, and further preferably 10 seconds or less.

(Effect of embodiment)
According to the high-frequency dielectric heating adhesive sheet according to the present embodiment, since the high-frequency dielectric adhesive layer contains a dielectric filler, the first fabric and the second fabric have high strength even in a low-power and short-time high-frequency dielectric heating treatment. Can be bonded to fabric. Furthermore, damage to the fabric due to heat can be prevented. Further, the high-frequency dielectric heating adhesive sheet according to the present embodiment can bond fabrics in a short time and with high strength as compared with a conventionally used hot melt adhesive. Further, since the fabrics can be joined with high strength without stitching, no seams appear on the surface of the joined fabrics, and the appearance is excellent.

Since the high-frequency dielectric heating adhesive sheet according to the present embodiment is heated by high-frequency dielectric heating, the surface side of the fabric in contact with the high-frequency dielectric heating adhesive sheet is only locally heated. Therefore, according to the high-frequency dielectric heating adhesive sheet according to the present embodiment, the problem that the entire fabric is melted at the time of joining with the fabric can be solved.

The high-frequency dielectric heating adhesive sheet according to the present embodiment can be peeled from the first cloth 21 and the second cloth 22 by high-frequency dielectric heating. Thereby, for example, the first cloth 21 and the second cloth 22 constituting the bonded cloth 1 can be replaced with other cloths. Therefore, when scratches or stains occur on the bonded fabric 1, the scratched or soiled fabric can be peeled off and another fabric can be joined by high-frequency dielectric heating.

According to the high-frequency dielectric heating adhesive sheet according to the present embodiment, unlike a discontinuous sewn structure such as sewing, it is possible to obtain a continuously joined structure between the first cloth and the second cloth. it can. For example, an enclosed space can be formed by the first cloth, the second cloth, and the high-frequency dielectric adhesive layer. Therefore, by joining the first cloth and the second cloth so as to accommodate the inclusions (for example, down, air or cotton) in the space, it is possible to prevent the inclusions from going out of the space. On the other hand, it is possible to prevent foreign matter (for example, dust, water, chemicals, etc.) from entering the space from the outside.

The high-frequency dielectric heating adhesive sheet according to the present embodiment can bond the first fabric and the second fabric in a short time by high-frequency dielectric heating. Therefore, the high-frequency dielectric heating adhesive sheet according to the present embodiment is preferable from the viewpoint of work efficiency.

The high-frequency dielectric heating adhesive sheet according to the present embodiment has excellent water resistance and moisture resistance as compared with general adhesives. The bonded fabric is also suitable for applications such as clothing that is exposed to wind and rain or is used in an environment where the temperature becomes high due to exposure to sunlight.

Since the high-frequency dielectric heating adhesive sheet according to the present embodiment does not contain a solvent, the problem of VOC (Volatile Organic Compounds) caused by the adhesive used when joining the fabric is unlikely to occur. Therefore, by using the high-frequency dielectric heating adhesive sheet according to the present embodiment for bonding with a cloth, it is possible to provide a bonded cloth suitable for clothing and the like.

[Modification of Embodiment]
The present invention is not limited to the above embodiment. The present invention can include modifications and improvements to the extent that the object of the present invention can be achieved.

The high-frequency dielectric heating adhesive sheet may have an adhesive portion. By having the adhesive portion, when the high-frequency dielectric heating adhesive sheet is attached to the fabric, it is possible to prevent misalignment and arrange it at an accurate position. The adhesive portion may be provided on one surface of the high-frequency dielectric adhesive layer or may be provided on both sides. Further, the adhesive portion may be provided on the entire surface or partially with respect to the surface of the high-frequency dielectric adhesive layer.

Further, holes and protrusions for temporary fixing may be provided in a part of the high-frequency dielectric heating adhesive sheet. By having holes and protrusions for temporary fixing, it is possible to prevent misalignment and arrange the high-frequency dielectric heating adhesive sheet at an accurate position when it is attached to the fabric.

The bonding fabric produced by the bonding method using a high-frequency dielectric heating adhesive sheet is not limited to the mode shown in FIG.
Further, the bonded cloth 1A shown in FIG. 3 can be mentioned. The bonded cloth 1A is different from the bonded cloth 1 in which the high-frequency dielectric heating adhesive sheet 10 is sandwiched between the first cloth 21 and the second cloth 22, and the first cloth 21 and the second cloth 22 are heated by the first high-frequency dielectric heating. It has a structure sandwiched between the adhesive sheet 11 and the second high-frequency dielectric heating adhesive sheet 12. As the first high-frequency dielectric heating adhesive sheet 11 and the second high-frequency dielectric heating adhesive sheet 12, it is preferable to use the high-frequency dielectric heating adhesive sheet described in the first embodiment.

The number of fabrics used in the joining method using the high-frequency dielectric heating adhesive sheet is not particularly limited.
Examples of the joining structure of the cloth different from the above-described embodiment include a joining cloth in which three or more cloths are adhered to each other. For example, when three cloths (first cloth, second cloth and third cloth) are bonded, the second cloth and the third cloth are arranged side by side so as to face the first cloth, and the first cloth and the second cloth are arranged side by side. A first high-frequency dielectric heating adhesive sheet may be sandwiched between the first cloth and the second high-frequency dielectric heat-bonding sheet may be sandwiched between the first cloth and the third cloth. More specifically, there is an embodiment in which the second cloth and the third cloth are arranged side by side with respect to the first cloth.
Alternatively, one high-frequency dielectric heating adhesive sheet is arranged over the first adherend and the second adherend, and is placed between the third adherend and the first adherend and the second adherend. , The one high-frequency dielectric heating adhesive sheet may be sandwiched. An example of this case is the bonded fabric 1B as shown in FIG. The bonded cloth 1B has a first cloth 21, a second cloth 22, a third cloth 23, and a high-frequency dielectric heating adhesive sheet 10. The high-frequency dielectric heating adhesive sheet 10 is arranged over the first cloth 21 and the second cloth 22. If one high-frequency dielectric heating adhesive sheet 10 is sandwiched between the third cloth 23 and the first cloth 21 and the second cloth 22, as in the case of the bonded cloth 1B, the first cloth 21 and the first cloth 21 and the second cloth 22 are sandwiched. 2 Fabrics 22 can be firmly connected. Further, for example, when one cloth is split into two, the split cloths (first cloth and second cloth) are separated by using a member corresponding to the third cloth for repair. A joining method such as joining may be used. In addition, when a defective part (for example, a hole or a crack, etc.) or a contaminated part (for example, dirt or discoloration, etc.) occurs in the cloth, the defective part is repaired by using a member corresponding to the third cloth. There is also a joining method of joining a third cloth in order to cover or repair it.

Further, one cloth may be folded or bent, and the overlapping portions of the cloth may be joined by the high frequency dielectric heating adhesive sheet 10.

The high-frequency dielectric heating treatment is not limited to the dielectric heating and bonding apparatus in which the electrodes described in the above embodiment are arranged to face each other, and a lattice electrode type high-frequency dielectric heating apparatus may be used. The lattice electrode type high-frequency dielectric heating device has lattice electrodes in which a first electrode and a second electrode having the opposite polarity to the first electrode are alternately arranged on the same plane at regular intervals.
For example, when the bonded cloth 1 as shown in FIG. 1 is manufactured, a lattice electrode type high frequency dielectric heating device is arranged on the first cloth 21 side or the second cloth 22 side to apply a high frequency.

When manufacturing a bonded fabric using a lattice electrode type high-frequency dielectric heating device, lattice electrodes (first lattice electrode and second lattice electrode) are arranged on both sides of the bonded fabric, and high frequencies are simultaneously generated from both sides. May be applied.
For example, in the case of manufacturing the bonded fabric 1, the first lattice electrode may be arranged on the first fabric 21 side, the second lattice electrode may be arranged on the second fabric 22 side, and a high frequency may be applied at the same time.

When manufacturing a bonded fabric using a lattice electrode type high frequency dielectric heating device, a lattice electrode is placed on one surface side of the bonded fabric, a high frequency is applied, and then a lattice electrode is applied to the other surface side of the bonded fabric. May be arranged and a high frequency may be applied.
For example, in the case of manufacturing the bonded cloth 1, a lattice electrode may be arranged on the first cloth 21 side and a high frequency may be applied, and then a lattice electrode may be arranged on the second cloth 22 side and a high frequency may be applied.

It is also preferable to use a lattice electrode type high frequency dielectric heating device for applying a high frequency. By using a lattice electrode type high-frequency dielectric heating device, the fabrics are not affected by the thickness of the bonded fabric, and the fabrics are heated by dielectric heating from the surface layer side of the bonded fabric, for example, the surface layer side where the distance to the high-frequency dielectric heating adhesive sheet is short. Can be glued. Further, by using a lattice electrode type high frequency dielectric heating device, it is possible to realize energy saving in the production of the bonded fabric.

In addition, in the figure, an embodiment using a dielectric heating adhesive device in which electrodes are arranged to face each other is illustrated for simplification.

The adherend in the cloth joint may be a communication tag such as an RF tag. In this case, a cloth bonded body with a communication tag can be obtained by joining the cloth and the communication tag as an adherend using the high-frequency dielectric heating adhesive sheet according to the embodiment. According to the high-frequency dielectric heating adhesive sheet according to the embodiment, since the fabric and the adherend can be adhered with high strength, the adhered portion is hard to be peeled off by human movement or washing.

Hereinafter, the present invention will be described in more detail with reference to examples. The present invention is not limited to these examples.

[Manufacturing of high-frequency dielectric heating adhesive sheet]
(Example 1)
Ethylene vinyl acetate copolymer (manufactured by Tosoh Corporation, product name "Ultrasen 626", softening temperature: 65 ° C., melt flow rate: 12 g / 10 min, density: 0.936 g / cm ³ , vinyl acetate content) as component A : 15% by mass.) 80.0% by mass and zinc oxide as component B (manufactured by Sakai Chemical Industry Co., Ltd., product name "LPZINC11", average particle size: 11 μm, described as ZnO in Table 1) 20. 0% by volume was weighed in the container, respectively. Table 1 shows the mixing ratio of each component. In Table 1, the blending ratio of each component is a value expressed in% by volume. In addition, Table 1 also shows the value obtained by converting the unit into parts by mass as the mixing ratio of the B component.
The weighed components A and B were premixed in a container. After premixing each component, it is supplied to the hopper of a 30 mmΦ twin-screw extruder, the cylinder set temperature is set to 180 ° C or higher and 200 ° C or lower, the die temperature is set to 200 ° C, melt-kneaded, and then pelletized with a pelletizer. processed.
Next, the obtained pellets are put into the hopper of a single-screw extruder equipped with a T-die, and a sheet-like melt-kneaded product is extruded from the T-die under the conditions of a cylinder temperature of 200 ° C. and a die temperature of 200 ° C. and cooled. By cooling with a roll, a high-frequency dielectric heating adhesive sheet having a thickness of 400 μm was produced.

(Examples 2 to 4)
Examples 2 to 4 are the same as in Example 1 except that the composition of the high-frequency dielectric adhesive layer and the type of fabric are changed as shown in Table 1 below and the temperatures during kneading and film formation are appropriately adjusted. The high frequency dielectric heating adhesive sheet was obtained. In Example 2, unlike the other examples, a high-frequency dielectric heating adhesive sheet having a thickness of 200 μm was produced.
As the component A of Example 4, maleic anhydride-modified polyethylene (manufactured by Mitsubishi Chemical Corporation, product name "Modic L504", softening temperature: 84 ° C., melt flow rate: 20 g / 10 min, density: 0.91 g / cm ³⁾ ) Was used.

(Comparative Examples 1 and 2)
The high-frequency dielectric heating adhesive sheet according to Comparative Examples 1 and 2 was different from that of Example 1 except that the composition of the high-frequency dielectric adhesive layer was changed as shown in Table 2 below and the temperature during kneading and film formation was appropriately adjusted. It was produced in the same manner.

[Preparation of bonded fabric]
(Example A1)
Samples were prepared according to JIS K 6850: 1999. Two nylon cloths (25 mm × 100 mm), which are cloths, were prepared. The high-frequency dielectric heating adhesive sheet obtained in Example 1 was placed between the two nylon cloths so that the sticking surface was 25 mm × 12.5 mm. Then, a high frequency was applied for 10 seconds under the conditions of a frequency of 40.68 MHz and an output of 200 W while being fixed between the electrodes of a high frequency dielectric heating device (YRP-400t-RC manufactured by Yamamoto Vinita Co., Ltd.). In this way, two nylon cloths were adhered to obtain a bonded cloth according to Example 1.
As the cloth used in the examples and comparative examples of the present specification, the attached white cloth for dyeing fastness test was used.

(Examples A2 to A7)
The bonded fabrics according to Examples A2 to A7 were produced in the same manner as in Example A1 except that the high-frequency dielectric heating adhesive sheets and fabrics shown in Table 2 below were used.

(Comparative Examples B1 to B2)
The bonded fabrics according to Comparative Examples B1 to B2 were produced in the same manner as in Example A1 except that the high-frequency dielectric heating adhesive sheet and the fabric shown in Table 2 below were used.

[Evaluation of high-frequency dielectric heating adhesive sheet]
Table 1 shows the evaluation results of the high-frequency dielectric heating adhesive sheet.

(Dielectric property)
The produced high-frequency dielectric heating adhesive sheet was cut into a size of 30 mm × 30 mm. The cut high-frequency dielectric heating adhesive sheet was measured for dielectric constant (ε') and dielectric loss tangent (tan δ), respectively, using an impedance material analyzer E4991 (manufactured by Agilent) under the condition of a frequency of 40.68 MHz at 23 ° C. Based on the measurement results, the value of the dielectric property (tan δ / ε') was calculated.
The dielectric property (tan δ / ε) of the high-frequency dielectric heating adhesive sheet according to Comparative Example 1 was 0.008.
The dielectric property (tan δ / ε) of the high-frequency dielectric heating adhesive sheet according to Comparative Example 2 was 0.000.

(Softening temperature)
The softening temperature of the high-frequency dielectric heating adhesive sheet was measured according to JIS K 7196: 2012.

(Flow start temperature)
The flow start temperature of the produced high-frequency dielectric heating adhesive sheet was measured using a descent type flow tester (manufactured by Shimadzu Corporation, model number "CFT-100D"). Using a die with a hole shape of φ2.0 mm, a length of 5.0 mm, and a cylinder with an inner diameter of 11.329 mm with a load of 5.0 kg, while raising the temperature of the measurement sample at a heating rate of 10 ° C./min, The stroke displacement rate (mm / min), which fluctuates with increasing temperature, was measured to obtain a temperature-dependent chart of the stroke displacement rate of the sample. In this chart, the temperature at which the stroke displacement velocity starts to increase again after the peak obtained on the low temperature side has passed is defined as the flow start temperature.

(5% weight loss temperature)
The 5% weight loss temperature (the temperature at which the weight loss is measured while raising the temperature of the measurement sample and the weight loss reaches 5% by weight) is measured by a differential thermal analyzer (manufactured by Shimadzu Corporation, TG / DTA). This was performed using an analyzer DTG-60). The temperature of the measurement sample was raised from 40 ° C. to 500 ° C. at a temperature rise rate of 10 ° C./min under a dry nitrogen atmosphere, and the 5% weight loss temperature of the measurement sample was measured.

(density)
The density (g / cm ³ ) of the high-frequency dielectric heating adhesive sheet was measured according to the method A (underwater substitution method) of JIS K 7112: 1999.

(Melt flow rate)
The MFR of the measurement sample was measured by changing the test conditions described in JIS K 7210-1: 2014 as follows.
・ Test temperature: 230 ℃
・ Load: 5 kg
・ Die: Hole shape φ2.0 mm, length 5.0 mm
・ Cylinder diameter: 11.329 mm
In the thermoplastic resin (A) of the example, since the constituent unit derived from olefin is polyethylene, the test temperature at the time of measuring the MFR of the component A was set to 190 ° C.

(Melting point)
The measurement was performed using a differential scanning calorimeter (manufactured by DSC TA Instruments, product name "Q2000") according to JIS K 7121: 2012.
Specifically, first, the temperature is raised from room temperature to 250 ° C. at a heating rate of 20 ° C./min, held at 250 ° C. for 10 minutes, lowered to -60 ° C. at a temperature lowering rate of 20 ° C./min, and 10 at -60 ° C. Hold for minutes. Then, it was heated again to 250 ° C. at a heating rate of 20 ° C./min to obtain a DSC curve, and the melting point was measured.

(Loss tangent peak temperature at 1 Hz)
The loss positive peak temperature at 1 Hz is tensioned in the range of -100 ° C to 120 ° C at a frequency of 1 Hz and a temperature rise of 4 ° C / min using a dynamic viscoelastic automatic measuring instrument (Vibron DDV-01FP manufactured by Orientec). The viscoelasticity of the high-frequency dielectric heating adhesive sheet according to the mode was measured and used as the temperature at the maximum point of the obtained tan δ (loss elastic modulus / storage elastic modulus).

(Tensile fracture stress before and after the flexibility test)
A high-frequency dielectric heating adhesive sheet was cut into a size of 150 mm (MD direction) × 15 mm (TD direction) to obtain a measurement sample.
A tensile test was performed on the measurement sample before the flexibility test in the same manner as in the Young's modulus measurement method, and the tensile fracture stress before the flexibility test was determined.
Next, using a planar unloaded U-shaped expansion / contraction tester (manufactured by Yuasa System Co., Ltd.), this measurement sample was subjected to the conditions of a test temperature of 23 ° C., a minimum bending diameter of 10 mmφ, a number of bendings of 30,000 times, and a bending speed of 30 rpm. The flexibility test was performed by repeatedly bending in.
After completing the flexibility test, the measurement sample is allowed to stand in an environment of 25 ° C. and 50% RH for 24 hours, and then a tensile test is performed in the same manner as the Young's modulus measurement method, and the tensile fracture stress after the flexibility test is performed. Asked.

(Young's modulus)
The high-frequency dielectric heating adhesive sheet produced in the above Examples and Comparative Examples was cut into a test piece of 15 mm (TD direction) × 150 mm (MD direction).
Tensile elongation (%) and Young's modulus (MPa) at 23 ° C. were measured according to JIS K7161-1: 2014 and JIS K 7127: 1999. Specifically, the above test piece is set to a distance between chucks of 100 mm with a tensile tester (manufactured by Shimadzu Corporation, Autograph AG-IS 500N), and then a tensile test is performed at a speed of 200 mm / min to obtain Young's modulus. (MPa) was measured.

[Evaluation of bonded fabric]
Table 2 shows the evaluation results of the bonded fabric.

(Joint strength test)
A pair of fabrics (first fabric and second fabric) were joined with a high-frequency dielectric heating adhesive sheet to prepare test pieces (bonded fabrics) according to Examples A1 to A7 and Comparative Examples B1 to B2 described above.
The tensile shear force of the prepared test piece was measured according to JIS K 6850: 1999. If the measured tensile shear force is 4 MPa or more, or at least one of the pair of fabrics is broken, it is judged to be acceptable. In Table 2, if it passes, it is indicated as "A", and if it fails, it is indicated as "F".

(Water resistant joint strength test)
A water resistance test was carried out in which the test piece prepared in the above-mentioned (bond strength test) was immersed in water at a temperature of 25 ° C. for 1 day. The test piece after the water resistance test was further allowed to stand in an environment of 25 ° C. and 50% RH for 24 hours, and then the tensile shear force was measured according to JIS K 6850: 1999. If the measured tensile shear force is 4 MPa or more, or at least one of the pair of fabrics is broken, it is judged to be acceptable. In Table 2, if it passes, it is indicated as "A", and if it fails, it is indicated as "F".

(Solvent resistance bond strength test)
A solvent resistance test was carried out in which the test piece prepared in the above (bond strength test) was immersed in an aliphatic hydrocarbon solvent (T-SOL 3040 FLUID manufactured by JXTG Energy Co., Ltd.) at a temperature of 25 ° C. for 1 hour. The test piece after the solvent resistance test was further allowed to stand in an environment of 25 ° C. and 50% RH for 24 hours, and then the tensile shear force was measured according to JIS K 6850: 1999. If the measured tensile shear force is 4 MPa or more, or at least one of the pair of fabrics is broken, it is judged to be acceptable. In Table 2, if it passes, it is indicated as "A", and if it fails, it is indicated as "F".

According to the high-frequency dielectric heating adhesive sheet according to Examples 1 to 4, the fabrics could be firmly bonded to each other even by the high-frequency dielectric heating treatment with low power and short time. In the high-frequency dielectric heating adhesive sheets according to Comparative Examples 1 and 2, the fabrics could not be firmly bonded to each other under the same high-frequency dielectric heating treatment conditions as in Examples 1 to 4.

1,1A, 1B ... Joined fabric, 10 ... High frequency dielectric heating adhesive sheet, 21 ... 1st fabric, 22 ... 2nd fabric.

Claims (15)

Has a high frequency dielectric adhesive layer,
The high-frequency dielectric adhesive layer contains a thermoplastic resin (A) and a dielectric filler (B).
The dielectric filler (B) is zinc oxide.
A high-frequency dielectric heating adhesive sheet used for joining fabrics. In the high-frequency dielectric heating adhesive sheet according to claim 1,
The thermoplastic resin (A) contains an olefin resin.
High frequency dielectric heating adhesive sheet. In the high-frequency dielectric heating adhesive sheet according to claim 1 or 2.
The thermoplastic resin (A) contains a polyolefin resin having a polar moiety.
High frequency dielectric heating adhesive sheet. The high-frequency dielectric heating adhesive sheet according to any one of claims 1 to 3.
The flow start temperature of the high-frequency dielectric adhesive layer is 80 ° C. or higher and 300 ° C. or lower.
High frequency dielectric heating adhesive sheet. In the high-frequency dielectric heating adhesive sheet according to any one of claims 1 to 4.
The density of the high-frequency dielectric heating adhesive sheet is 3 g / cm ³ or less.
High frequency dielectric heating adhesive sheet. The high-frequency dielectric heating adhesive sheet according to any one of claims 1 to 5.
The rate of change R1 of the tensile fracture stress of the high-frequency dielectric heating adhesive sheet before and after the dynamic flexibility test is 80% or more and 120% or less.
High frequency dielectric heating adhesive sheet.
Rate of change R1 = {(tensile fracture stress after dynamic flexibility test) / (tensile fracture stress before dynamic flexibility test)} × 100 The high-frequency dielectric heating adhesive sheet according to any one of claims 1 to 6.
The Young's modulus of the high-frequency dielectric heating adhesive sheet is 500 MPa or less.
High frequency dielectric heating adhesive sheet. A cloth having a cloth, an adherend, and the high-frequency dielectric adhesive layer of the high-frequency dielectric heating adhesive sheet according to any one of claims 1 to 7, which joins the cloth and the adherend. Joined body. In the fabric joint of claim 8,
The result of the joint strength test conducted by fixing the fabric and the adherend with a gripping tool is whether the tensile shear force is 4 MPa or more, the fabric is destroyed, or the adherend is destroyed. , At least one of the destruction of both the fabric and the adherend.
Fabric joint. In the cloth joint according to claim 9,
The result of the joint strength test conducted after the cloth joint body was immersed in water at a temperature of 25 ° C. for 1 day and then allowed to stand in an environment of 25 ° C. and 50% RH for 24 hours, the tensile shear force was 4 MPa. It corresponds to at least one of the above, the destruction of the fabric, the destruction of the adherend, and the destruction of both the fabric and the adherend.
Fabric joint. In the fabric joint according to claim 9 or 10.
Results of a bonding strength test conducted after the fabric bonded body was immersed in an aliphatic hydrocarbon solvent at a temperature of 25 ° C. for 1 hour and then allowed to stand in an environment of 25 ° C. and 50% RH for 24 hours. However, the tensile shear force is 4 MPa or more, the fabric is destroyed, the adherend is destroyed, or both the fabric and the adherend are destroyed. To do,
Fabric joint. The fabric and the adherend are bonded to each other by using the high-frequency dielectric heating adhesive sheet according to any one of claims 1 to 7.
Joining method. In the joining method according to claim 12,
A step of arranging the high-frequency dielectric heating adhesive sheet between the cloth and the adherend,
It has a step of applying a high frequency to the high frequency dielectric adhesive layer to join the cloth and the adherend.
Joining method. In the joining method according to claim 13,
A high frequency of 1 kHz or more and 300 MHz or less is applied to the high frequency dielectric adhesive layer.
Joining method. In the joining method according to claim 13 or 14.
The application time of high frequency is 1 second or more and 60 seconds or less.
Joining method.

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