JP2020151872A - Method of molding three-dimensional modeled product, apparatus of molding three-dimensional modeled product, and program - Google Patents

Abstract

To improve molding quality for material injection molding.SOLUTION: A model material 201 is discharged in a first forward path F1 and cured by a curing unit 24A. The model material 201 is discharged in a first return path R1, a surface of the model material 201 is flattened with a flattening roller 23 just after the discharging, and the model material is cured by the curing unit 24A to mold a model material layer 211. A support material 202 is discharged in a second forward path F2 and cured by the curing unit 24A. The support material 202 is discharged in a second return path R2, a surface of the support material 202 is flattened with the flattening roller 23 just after the discharging, and the support material is cured by the curing unit 24A to mold a support material layer 212.SELECTED DRAWING: Figure 3

Description

The present invention relates to a method for modeling a three-dimensional object, a device for forming a three-dimensional object, and a program.

As a device for modeling a three-dimensional model (three-dimensional model), a modeling material (model material) for forming the three-dimensional model and a support material for supporting the shape of the model material are used, and the model material and the support material are discharged. , A material injection molding method (material jet method) is known in which flattening (smoothing) and hardening are repeated, and finally the support material is removed to form a three-dimensional model made of a model material.

Conventionally, one of the model material and the support material is first discharged and cured, and then the other is continuously discharged and cured to suppress the mixing of the uncured model material and the support material. It is known (Patent Document 1).

Japanese Unexamined Patent Publication No. 2012-096430

By the way, as disclosed in Patent Document 1, if only one of the model material and the support material is first discharged and cured, the uncured model material gets wet and spreads after landing, and the edge accuracy deteriorates. There is a problem.

The present invention has been made in view of the above problems, and an object of the present invention is to improve the modeling quality of a three-dimensional model.

In order to solve the above problems, the device for modeling the three-dimensional model according to the present invention is
Multiple discharge means for discharging model material and support material, respectively,
The modeling stage on which the modeled object is placed and
One or more flattening means for flattening the surfaces of the discharged model material and the support material, respectively.
One or more curing means for curing each of the discharged model material and the support material, and
With means to control the modeling operation,
The modeling stage and the plurality of discharging means, flattening means, and curing means are arranged so as to be relatively movable.
The controlling means is
The plurality of discharge means and the modeling stage are relatively moved to each other.
A model material layer forming operation in which the model material is discharged on both the outward route and the return route, and immediately after the model material is discharged on the return route, the model material is flattened and cured by the flattening means and the curing means. ,
A support material layer forming operation in which the support material is discharged on both the outward route and the return route, and immediately after the support material is discharged on the return route, the support material is flattened and cured by the flattening means and the curing means. , Was configured to be controlled.

According to the present invention, it is possible to improve the modeling quality of a three-dimensional modeled object.

It is a schematic explanatory drawing of an example of the apparatus which shapes a three-dimensional model | object which concerns on this invention. It is a block diagram of the part related to the control of the modeling operation of the device. It is a flow figure which provides the explanation of the modeling operation in 1st Embodiment of this invention. It is also a plane explanatory view provided for the explanation of an example of a concrete operation. It is also a cross-sectional explanatory view of an example of a specific operation. It is a flow figure which provides the explanation of the modeling operation in 2nd Embodiment of this invention. It is also a plane explanatory view provided for the explanation of an example of a concrete operation. It is also a cross-sectional explanatory view of an example of a specific operation. It is sectional drawing which provides the explanation of the surface shape at the time of discharging the support material in the same embodiment. It is sectional drawing which provides the explanation of the modeled object when the height of a model material and the height of a support material are made the same. It is sectional drawing which provides the explanation of the modeled object when the height of a support material is made higher than the height of a model material. It is explanatory drawing which provides the explanation of the slice layer. It is sectional drawing which provides the explanation of the 3rd Embodiment of this invention. It is a flow figure which provides the explanation of the modeling operation of 3rd Embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. An outline of an example of an apparatus for modeling a three-dimensional object according to the present invention will be described with reference to FIG. FIG. 1 is a schematic explanatory view of the device.

The device (referred to as a three-dimensional modeling device) 100 for modeling this three-dimensional model is a material injection modeling device, and the modeling stage 11 on which the modeling object 10 is placed and the modeling object 10 are sequentially laminated on the modeling stage 11. It is equipped with a modeling unit 20 for modeling while.

The modeling stage 11 is configured to be movable in the X direction, the Y direction, and the Z direction. The modeling unit 20 may be moved in the X direction. As a result, the outbound and inbound modeling operations can be realized.

The modeling unit 20 includes, as a plurality of discharging means, a first head 21 which is a discharging means for discharging the model material 201 and a second head 22 which is a discharging means for discharging the support material 202. By moving the modeling unit 20 in the X direction without moving the modeling stage 11, the outbound and inbound modeling operations may be realized.

Further, the modeling unit 20 is modeled by irradiating one flattening roller 23, which is a flattening means for flattening (smoothing) the discharged model material 201 and the support material 202, and ultraviolet rays as active energy rays. It is provided with two curing units 24A and 24B for curing the material 201 and the support material 202, respectively.

Here, when the modeling stage 11 moves in the outward direction in the X direction, the flattening roller 23 is arranged on the upstream side of the first head 21, and the curing unit 24A is arranged on the upstream side of the flattening roller 23. Similarly, the second head 22 is arranged on the downstream side of the first head 21, and the curing unit 24B is arranged side by side on the downstream side of the second head 22.

Next, the outline of the part related to the control of the modeling operation of the three-dimensional modeling device will be described with reference to FIG. FIG. 2 is a block diagram of a part related to the control.

The modeling control means 501 is a means for controlling a modeling operation, for example, a CPU, a program including a program according to the present invention for causing a CPU to control a modeling operation including the control according to the present invention, and other fixed data. It is composed of a ROM that stores the above and a RAM that temporarily stores the modeling data and the like.

The modeling control means 501 receives modeling data from an external modeling data creating device 600. The modeling data creating device 600 is an apparatus for creating modeling data (cross-sectional data) which is slice data obtained by slicing a modeled object (three-dimensional modeled object) in the final form, and is composed of an information processing device such as a personal computer.

The modeling control means 501 transfers modeling data to the head drive control unit 508 that drives and controls the first head 21 that discharges the model material 201, and the head drive control unit 508 receives the model material from the first head 21 according to the modeling data. 201 is discharged.

The modeling control means 501 transfers modeling data to the head drive control unit 509 that drives and controls the second head 22 that discharges the support material 202, and the head drive control unit 509 receives the support material from the second head 22 according to the modeling data. 202 is discharged.

The modeling control means 501 drives a motor constituting the X-direction scanning mechanism 550 that moves the modeling stage in the X direction via the motor drive unit 510, and moves the modeling stage 11 reciprocating relative to the modeling unit 20. ..

The modeling control means 501 drives a motor constituting a Y-direction scanning mechanism 551 that moves the modeling stage 11 in the Y direction via a motor driving unit 511. The modeling control means 501 drives a motor constituting a Z-direction scanning mechanism 552 that moves (elevates) the modeling stage 11 in the Z direction via a motor driving unit 512. The modeling control means 501 moves the modeling stage 11 in the X, Y, or Z directions via the motor drive unit 510, 511, or 512, but moves the first head 21 or the second head 21 to the X, It may be moved in the Y or Z direction.

The modeling control means 501 rotationally drives the motor 556 that rotates the flattening roller 23 via the motor driving unit 516, and flattens the model material 201 and the support material 202 discharged on the modeling stage 11. The modeling control means 501 controls the irradiation of ultraviolet rays by the curing units 24A and 24B via the curing control unit 519 to control the curing of the discharged model material 201 and the support material 202.

Here, the modeling control means 501 relatively moves the first head 21, the second head 22, and the modeling stage 11 according to the program according to the present invention, discharges the model material 201 in both the outward path and the return path, and in the return path. Immediately after discharging the model material 201, the flattening roller 23 and the curing unit 24 flatten and cure the model material 201, and the support material 202 is discharged in both the outward and return paths to perform the return path. Immediately after the support material 202 is discharged, the flattening roller 23 and the curing unit 24 control the support material layer forming operation for flattening and curing the support material 202.

Next, the modeling operation in the first embodiment of the present invention will be described with reference to FIGS. 3 to 5. FIG. 3 is a flow diagram for explaining the modeling operation, FIG. 4 is a plan explanatory view for explaining an example of the specific operation, and FIG. 5 is a cross-sectional explanatory view of the same example of the specific operation.

With reference to FIG. 3, the model material 201 is discharged from the first head 21 in the first outbound route F1, a layer of the model material 201 having a thickness t1 is formed, and the model material 201 is cured by the curing unit 24A (step S1, hereinafter. , Simply written as "S1"). In this step S1, the surface of the model material 201 is not flattened by the flattening roller 23.

Next, the model material 201 is discharged from the first head 21 on the first return path R1, and the surface of the model material 201 is flattened by the flattening roller 23 immediately after the discharge while forming a layer of the model material 201 having a thickness t2. It is formed into a layer of model material 201 having a thickness of t3 (t3 ≦ t2) and cured by the curing unit 24A (S2). In these steps S1 and S2, the model material layer 211 laminated on the outward path and the return path is modeled (model material layer modeling operation).

At this time, the thickness t2 of the model material 201 discharged on the return path R1 is made thicker (t2> t1) than the thickness t1 of the model material 201 discharged on the outward path F1, so that the thickness t3 is surely maintained even if flattening is performed. Can be secured.

After that, the support material 202 is discharged from the second head 22 on the second outbound route F2 to form a layer of the support material 202 having a thickness t4, and the support material 202 is cured by the curing unit 24A (S3). In step S3 as well, the surface of the support material 202 is not flattened by the flattening roller 23 as in step S1.

Next, the support material 202 is discharged from the second head 22 on the second return path R2 to form a layer of the support material 202 having a thickness of t5, and immediately after the discharge, the surface of the support material 202 is flattened by the flattening roller 23. It is formed into a layer of a support material 202 having a thickness of t6 (t6 ≦ t5) and cured by the curing unit 24A (S4). In these steps S3 and S4, the support material layer 212 laminated on the outward path and the return path is formed (support material layer forming operation).

At this time, the thickness t5 of the support material 202 discharged on the return route R2 is thicker (t5> t4) than the thickness t4 of the support material 202 discharged on the outward route F2, so that the thickness t6 can be reliably maintained even if flattening is performed. Can be secured.

Next, a specific example of the modeling operation of the present embodiment will be described with reference to FIGS. 4 and 5.
For example, as shown in FIG. 5A, the model material 201 is discharged in the first outbound route F1 to form the layer 201a having a thickness t1. Then, the model material 201 is discharged in the first return path R1 to form the layer 201b having a thickness t2, and immediately after the discharge, the surface of the model material 201 having a thickness t2 is flattened to a thickness t3 and cured. As a result, as shown in FIGS. 4 and 5 (b), the model material layer 211 formed by the layer 201a and the layer 201b is formed.

After that, as shown in FIG. 5C, the support material 202 is discharged in the second outbound route F2 to form the layer 202a having a thickness t4. Then, the support material 202 is discharged on the second return path R2 to form the layer 202b having a thickness t5, and immediately after the discharge, the support material 202 having a thickness t5 is flattened to a thickness t6 and cured. As a result, as shown in FIGS. 4 and 5 (d), the support material layer 212 formed by the layer 202a and the layer 202b is formed.

The model material layer 211 and the support material layer 212 form a single layer 210 of the modeled object.

In this way, the model material 201 and the support material 202 are ejected and cured by different scans. For example, by curing the model material 201 and then discharging the support material 202 (or vice versa), it is possible to prevent the model material 201 and the support material 202 from being adjacent to each other in an uncured state.

Then, as in the present embodiment, the model material 201 or the support material 202 is discharged on the return path, flattened by the flattening roller 23, and cured by the curing unit 24, so that the model material and the support material are flattened immediately after being discharged. And can be cured.

As a result, a good edge with a small radius (R) can be formed, and the molding quality is improved.

As shown in FIGS. 4 (a) and 4 (b), the Y coordinates of the outward route and the return route may be the same or different. For example, in the example of FIG. 4A, the discharge positions of the Y coordinates are the same for the model material 201 of the first outbound route F1 and the first inbound route R1. Further, the model material 201 of the second outward route F2 and the second return route R2 has the same discharge position in the Y coordinate. The Y-coordinate discharge positions of the model material 201 and the support material 202 are the same.

Further, in the example of FIG. 4B, the discharge positions of the Y coordinates are different between the model material 201 of the first outward path F1 and the first return path R1. Further, the discharge positions of the Y coordinates are different for the model material 201 of the second outward route F2 and the second return route R2. The Y-coordinate discharge position is the same for the model material 201 of the first outbound route F1 and the second outbound route F2. The discharge position of the Y coordinate is the same for the model material 201 of the first return path R1 and the second return path R2.

Next, the modeling operation in the second embodiment of the present invention will be described with reference to FIGS. 6 to 8. FIG. 6 is a flow diagram for explaining the modeling operation, FIG. 7 is a plan explanatory view for explaining an example of the specific operation, and FIG. 8 is a cross-sectional explanatory view of the same example of the specific operation.

With reference to FIG. 6, the model material 201 is discharged from the first head 21 in the first outbound route F1, a layer of the model material 201 having a thickness t1 is formed, and the model material 201 is cured by the curing unit 24A (S11). In this step S11, the surface of the model material 201 is not flattened by the flattening roller 23.

After that, the model material 201 is discharged from the first head 21 on the first return path R1 to form a layer of the model material 201 having a thickness t2, and immediately after the discharge, the surface of the model material 201 is smoothed by the flattening roller 23. It is formed into a layer of model material 201 having a thickness of t3 (t3 ≦ t2) and cured by the curing unit 24A (S12). In these steps S1 and S2, the model material layer 211 laminated on the outward path and the return path is modeled (model material layer modeling operation).

Next, the model material 201 is discharged from the first head 21 on the second outbound route F2 to form a layer of the model material 201 having a thickness of t11, and the model material 201 is cured by the curing unit 24A (S13). In this step 13, the surface of the support material 202 is not flattened by the flattening roller 23 as in step S11.

After that, the model material 201 is discharged from the first head 21 on the second return path R2 to form a layer of the model material 201 having a thickness of t12, and immediately after the discharge, the surface of the model material 201 is smoothed by the flattening roller 23. It is formed into a layer of model material 201 having a thickness of t13 (t13 ≦ t12) and cured by the curing unit 24A (S14).

In this way, the model material layer 211 is modeled by performing the model material layer modeling operation twice in steps S11, S12, and 13 and 14.

Next, the support material 202 is discharged from the second head 22 on the third outbound route F3 to form a layer of the support material 202 having a thickness of t7 (t7> t1 + t3) and is cured by the curing unit 24A (S15). ). In this step S15, the surface of the support material 202 is not flattened by the flattening roller 23.

After that, the support material 202 is discharged from the second head 22 on the third return path R2 to form a layer of the support material 202 having a thickness of t8, and immediately after the discharge, the surface of the support material 202 is flattened by the flattening roller 23. It is formed into a layer of a support material 202 having a thickness of t9 (t9 ≦ t8) and cured by the curing unit 24A (S16).

As described above, in steps S15 and S16, the model material is formed by a plurality of model material layer forming operations by the support material layer forming operation less than the number of times (2 times) of the model material layer forming operation (1 time). A support material layer 212 having a thickness (t7 + t9) substantially the same as the thickness of the layer 211 (t1 + t3 + t11 + t13) is formed.

The one-time discharge amount of the first head 21 that discharges the model material 201 in steps S11 to S14 is smaller than the one-time discharge amount of the second head 22 that discharges the support material 202 in step S15.

Next, a specific example of the modeling operation of this embodiment will be described with reference to FIGS. 7 and 8.
For example, as shown in FIG. 8A, the model material 201 is discharged in the first outbound route F1 to form the layer 201a having a thickness t1 as described in the first embodiment. Then, the model material 201 is discharged in the first return path R1 to form the layer 201b having a thickness t2, and immediately after the discharge, the surface of the model material 201 having a thickness t2 is flattened to a thickness t3 and cured.

Further, the model material 201 is discharged in the second outbound route F2 to form the layer 201c having a thickness t12. Then, the model material 201 is discharged in the second return path R1 to form the layer 201d having a thickness t12, and immediately after the discharge, the surface of the model material 201 having a thickness t12 is flattened to a thickness t13 and cured. As a result, as shown in FIGS. 7 and 8 (b), the model material layer 211 formed by the layers 202a to 202d is formed.

After that, as shown in FIG. 8C, the support material 202 is discharged in the third outbound route F3 to form the layer 202a having a thickness t7. Then, the support material 202 is discharged on the third return path R3 to form the layer 202b having a thickness t8, and immediately after the discharge, the support material 202 having a thickness t8 is flattened to a thickness t9 and cured. As a result, as shown in FIGS. 7 and 8 (d), the support material layer 212 formed by the layer 202a and the layer 202b is formed.

The model material layer 211 and the support material layer 212 form a single layer 210 of the modeled object.

By doing so, the effects of the first embodiment can be obtained, the height of the layer 210 of the modeled object can be increased with a small number of scans, and the modeling speed can be improved.

That is, in the present embodiment, two layers of the model material 201 (model layer) are formed by the preceding two reciprocating scans, and then the layer (support layer) of the support material 202 is formed by the subsequent one reciprocating scan. Is substantially the same as the height (thickness) of two layers of the model layer.

As a result, in the first embodiment, the thickness of the layer 210 of the modeled object that can be modeled in 8 scans (4 reciprocating movements) can be modeled, and in the second embodiment, it can be modeled in 6 scans (3 reciprocating movements). it can.

Next, the relationship between the height (thickness) of the support material and the model material in the present embodiment will be described with reference to FIGS. 9 to 11. FIG. 9 is a cross-sectional explanatory view for explaining the surface shape when the support material is discharged. FIG. 10 is a cross-sectional explanatory view for explaining a modeled object when the height of the model material and the height of the support material are the same, and FIG. 11 is a modeled object when the height of the support material is higher than the height of the model material. It is sectional drawing which serves as the explanation of.

As shown in FIG. 9, when the support material 202 is discharged to form the layer after the model material layer 211 is formed, the height Z2 of the upper end of the interface between the support material 202 and the model material 201 is the height Z2 of the support material 202. It is lower than the height Z1 in the central part.

Therefore, as shown in FIG. 10A, if the film thickness of the layer 202a when the support material 202 is discharged in the third outward path F3 is insufficient, the support material 202 discharged in the third return path R3 When the layer 202b is flattened and cured, there is a high possibility that the interface between the layer 202b of the support material 202 and the model material layer 211 becomes incomplete (a gap 203 is generated).

As shown in FIG. 10 (b), when the overhang shape is formed by the layers 201e and 201f of the model material 201 in the next slice layer in the state where the interface is incomplete as described above, as shown in FIG. 10 (c). As shown, the shape of the inner edge 301 of the model 300 deteriorates.

Therefore, in the present embodiment, as shown in FIG. 11A, when the layer 202a of the support material 202 is formed on the third outbound route F3, the thickness t7 of the layer 202a is set to the layers 201a and 201b of the model material 201. It is thicker (t7> (t1 + t3) than the thickness of the two layers (t1 + t3) of the above.

As a result, the interface between the model material layer 211 and the support material 202 layer 202a is surely formed, and as shown in FIG. 11B, the overhang shape of the model material 201 layers 201e and 201f in the next slice layer. As shown in FIG. 11C, the shape of the inner edge 301 of the modeled object 300 becomes good (the radius becomes small) even when the modeled object 300 is formed.

Here, the "slice layer" will be described with reference to FIG. FIG. 12 is an explanatory diagram for explaining the slice layer.

The thickness of the model material layer 211 formed by reciprocating scanning for ejecting the preceding multiple times (n times) of the model material 201, and the support material formed by reciprocating scanning for ejecting the supporting material 202 less than n times afterwards. When the thickness of the layer 212 is substantially the same, the height (thickness) t at this time is referred to as “slice layer SL”.

Next, the third embodiment of the present invention will be described with reference to FIG. FIG. 13 is a cross-sectional explanatory view for explaining the embodiment.

Depending on the shape and orientation of the three-dimensional model, the modeling mode, and the like, there may be a slice layer SL in which only the model material 201 or the support material 202 exists in the slice layer SL.

For example, as shown in FIG. 13, when the slice layers SL1 to SL4 are laminated, the slice layer SL2 is a slice layer of only the model material 201, and the slice layer SL3 is a slice layer of only the support material 202.

In this way, when the slice layer to be modeled contains only one of the model material and the support material, scanning for ejecting the other support material or the model material which is not included is not performed. It is conceivable that the slice layer containing only the support material is formed for separation, for example, when two three-dimensional objects are modeled vertically.

As a result, the modeling time can be shortened and the modeling speed can be improved.

Next, the modeling operation of the third embodiment will be described with reference to the flow chart of FIG.

Here, an example is taken in which the slice layer SL discharges the model material 201 in the preceding two reciprocating scans and discharges the support material 202 in the subsequent one reciprocating scan.

When the modeling of the N = k-1st slice layer is completed (S20) and the modeling of the kth slice layer is performed, does the model material data exist in the kth slice layer (whether there is a model material area)? Whether or not it is determined (S21).

Here, when the model material data exists in the kth slice layer, the model material 201 is discharged and cured at the thickness t1 in the first outbound route (S22). Next, on the first return trip, the model material 201 is discharged at a thickness of t2, flattened to a thickness of t3, and cured (S23).

Then, in the second outbound route, the model material 201 is discharged and cured at a thickness of t11 (S24). Then, in the second return trip, the model material 201 is discharged at a thickness of t12, flattened to a thickness of t13, and cured (S25).

After that, in step S21, when the model material data does not exist in the kth slice layer, it is determined whether or not the support material data exists in the nth slice layer (whether there is a support area) (S26). ..

Here, when the support material data exists in the nth slice layer, the support material 202 is discharged and cured with a thickness of t7 (t7> t1 + t2) in the third outbound route (S27). Then, on the third return trip, the support material 202 is discharged at a thickness of t8, flattened to a thickness of t9, and cured (S28). After that, the next slice layer is set to (n = k + 1) (S29), and the process returns to step S21.

On the other hand, when the support material data does not exist in the nth slice layer, the next slice layer is set to (n = k + 1) (S29), the process returns to step S21, and the reciprocating scanning for ejecting the support material 202 is omitted. To do.

In this way, the modeling time can be further shortened as compared with the second embodiment.

100 Three-dimensional modeling device 10 Modeling object 11 Modeling stage 20 Modeling unit 21 1st head 22 2nd head 23 Flattening roller (flattening means)
24 Curing unit (curing means)
210 Modeling object layer 211 Model material layer 212 Support material layer 501 Modeling control means

Claims (8)

Multiple discharge means for discharging model material and support material, respectively,
The modeling stage on which the modeled object is placed and
One or more flattening means for flattening the surfaces of the discharged model material and the support material, respectively.
One or more curing means for curing each of the discharged model material and the support material, and
With means to control the modeling operation,
The modeling stage and the plurality of discharge means are arranged so as to be relatively movable.
The controlling means is
The plurality of discharge means and the modeling stage are relatively moved to each other.
A model material layer forming operation in which the model material is discharged on both the outward route and the return route, and immediately after the model material is discharged on the return route, the model material is flattened and cured by the flattening means and the curing means. ,
A support material layer forming operation in which the support material is discharged on both the outward route and the return route, and immediately after the support material is discharged on the return route, the support material is flattened and cured by the flattening means and the curing means. A device for modeling a three-dimensional model, which is characterized by controlling. The device for modeling a three-dimensional model according to claim 1, wherein the support material layer modeling operation is performed after the model material layer modeling operation is performed. After performing the model material layer forming operation a plurality of times, the model material formed by the model material layer forming operation a plurality of times in the support material layer forming operation less than the number of times of the model material layer forming operation. The device for modeling a three-dimensional model according to claim 2, wherein the support material layer having a thickness substantially the same as the thickness of the layer is modeled. The three-dimensional model according to claim 3, wherein the thickness of the support material discharged in the outward path of the support material layer modeling operation is made thicker than the thickness of the model material modeled by the model material layer modeling operation. A device for modeling. The three-dimensional model according to any one of claims 1 to 4, wherein the thickness of the model material discharged in the return path of the model material layer modeling operation is thicker than the thickness of the model material discharged in the outward path. A device for modeling. The three-dimensional model according to any one of claims 1 to 5, wherein when the model material layer or the support material is not modeled, the model material layer modeling operation or the support material layer modeling operation is omitted. Equipment to do. It is a method of modeling a three-dimensional model made of the model material while supporting the model material with a support material.
A plurality of discharge means for discharging the model material and the support material, respectively, and the modeling stage on which the modeled object is placed are relatively moved.
The operation of discharging the model material on both the outward route and the return route, and immediately after discharging the model material on the return route, flattening and hardening the model material to form a model material layer, and
It is characterized in that the support material is discharged on both the outward route and the return route, and immediately after the support material is discharged on the return route, the support material is flattened and hardened to form a support material layer. A method of modeling a three-dimensional model. It is a program for causing a computer to control a modeling operation for modeling a three-dimensional model made of the model material while supporting the model material with a support material.
A plurality of discharge means for discharging the model material and the support material, respectively, and the modeling stage on which the modeled object is placed are relatively moved.
Control of the operation of ejecting the model material on both the outward route and the return route, and immediately after discharging the model material on the return route, flattening and hardening the model material to form a model material layer,
Immediately after the support material is discharged on both the outward route and the return route, the support material is flattened and hardened to control the operation of forming the support material layer on the computer. Program to do.

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