JP2020150148A - Integrated circuit board, sensing device, biological information analyzing device, and manufacturing method of integrated circuit board - Google Patents

Abstract

To provide an integrated circuit board which suppresses damage of a wiring part due to a curve, a sensing device, a biological information analyzing device, and a manufacturing method of the integrated circuit board.SOLUTION: An integrated circuit board comprises: a film substrate 4 having flexibility; a plurality of electronic components 5 which are arranged on an upper side of the film substrate 4, and contains integrated circuits 5b and 5c; and wiring parts 6a to 6e which are arranged between the film substrate 4 and the plurality of electronic components 5, and electrically connects the plurality of electronic components 5. The wiring parts 6a to 6e are formed by laminating telescopic conductive parts 7a to 7e each having conductivity and low resistance conductive parts 8a to 8e, has a higher elasticity than that of the low resistance conductive parts 8a to 8e and the film substrate 4 while the telescopic conductive parts 7a to 7e are arranged so as to be extended while being opposite to the film substrate 4, and the low resistance conductive parts 8a to 8e have a lower resistivity than that of the telescopic conductive parts 7a to 7e and are connected to the plurality of electronic components 5 so as to be laminated on the upper side of the telescopic conductive parts 7a to 7e.SELECTED DRAWING: Figure 2

Description

The present invention relates to a method for manufacturing an integrated circuit board, a sensing device, a biological information analysis device and an integrated circuit board, and in particular, an integrated circuit board using a flexible substrate, a sensing device, a biological information analysis device and an integrated circuit. Regarding the method of manufacturing a substrate.

Conventionally, an integrated circuit board using a flexible substrate has been put into practical use. Since this integrated circuit board can be curved, it is applied to, for example, a biological information analysis device that senses and analyzes biological information obtained from a living body. The biometric information analysis device can reliably acquire biometric information by bending the integrated circuit board and attaching it along the surface of the biological body.
Here, when the biological information analysis device is attached to, for example, a wrist or a head, it is required to form an integrated circuit board thinly so as not to hinder the movement of the living body.

Therefore, as a technique for forming an integrated circuit board thinly, for example, Patent Document 1 proposes a polymer substrate that can be attached to various objects to be attached such as skin. Since the polymer substrate forms the substrate, the wiring portion, and the piezoelectric member on the order of μm, the integrated circuit board can be formed thinly.

Japanese Unexamined Patent Publication No. 2012-141186

However, in the polymer substrate of Patent Document 1, since the wiring portion is formed from a conductive material having low elasticity such as metal, the wiring portion is cracked or the like according to the curvature of the polymer substrate, and the electrical connection is cut. There was a risk. In particular, when a conductive material is applied to form a wiring portion by screen printing or the like, the wiring portion tends to be hard, and the wiring portion may be easily damaged.

The present invention has been made to solve such a conventional problem, and provides a method for manufacturing an integrated circuit board, a sensing device, a biological information analysis device, and an integrated circuit board that suppress damage to a wiring portion due to bending. The purpose is to do.

The integrated circuit substrate according to the present invention is arranged on a flexible substrate, on the upper side of the substrate, a plurality of electronic components including the integrated circuit, and a plurality of electrons arranged between the substrate and the plurality of electronic components. It is provided with a wiring portion for electrically connecting components, and the wiring portion is formed by laminating a stretchable conductive portion having conductivity and a low resistance conductive portion, and the stretchable conductive portion is arranged so as to extend facing the substrate. In addition, it has higher elasticity than the low-resistance conductive part and the substrate, and the low-resistance conductive part has a lower resistance than the stretchable conductive part, and is laminated on the upper side of the stretchable conductive part and connected to a plurality of electronic components. is there.

Here, it is preferable that the stretchable conductive portion has a stretch ratio that is twice or more larger than that of the substrate.

Further, it is preferable that the low resistance conductive portion further has a joint portion to be alloyed and joined with a plurality of electronic parts and the low resistance conductive portion, and the low resistance conductive portion has a higher alloying property with respect to the joint portion than the elastic conductive portion.

Further, the low resistivity conductive portion preferably has a resistivity of 1/5 or less of that of the telescopic conductive portion.

In addition, the stretchable conductive portion can include a metal material and an organic material.
Further, the stretchable conductive portion preferably contains at least one of urethane-based material, silicone-based material and carbon material.

Further, the low resistance conductive portion can be made of a metal material containing at least one of silver, copper and gold.

The sensing device according to the present invention includes the integrated circuit board according to any one of the above, and an external environment sensor that is arranged on the board of the integrated circuit board and connected to a wiring portion to sense changes in the external environment. It is a thing.

Here, the external environment sensor includes a pressure sensor that generates a voltage corresponding to the pressure from the external environment, and the end portion of the wiring portion protrudes in the direction along the film substrate with respect to the low resistance conductive portion. The pressure sensor has a pair of electrodes arranged so as to sandwich a dielectric layer having a dielectric property, and the end of one electrode is attached to the end of the wiring portion. It is preferable that it is formed so as to extend diagonally upward along the line and is connected to the low resistance conductive portion.

The biological information analysis device according to the present invention analyzes biological information based on the electrical signal output from the sensing device described in any of the above and the external environment sensor of the sensing device arranged so that changes in the living body can be input. It is provided with an analysis unit.

In the method for manufacturing an integrated circuit substrate according to the present invention, a conductive stretchable conductive portion having higher elasticity than the substrate is formed on the flexible substrate so as to extend toward the substrate, and the stretchable conductive portion is used. A low-resistance conductive part having a small resistance and elasticity is laminated on the upper side of the stretchable conductive part, and a plurality of electronic components including an integrated circuit are arranged on the upper side of a wiring part composed of the stretchable conductive part and the low-resistance conductive part. It is electrically connected to the low resistance conductive part.

Here, the stretchable conductive portion and the low resistance conductive portion are preferably coated by screen printing with a viscosity of 100 dPa · s to 1000 dPa · s.

According to the present invention, the wiring portion has a low resistance conductive portion, a stretchable conductive portion having higher elasticity than the substrate, and a plurality of electronic components laminated on the upper side of the stretchable conductive portion while having a lower resistance than the stretchable conductive portion. Since it is formed from a low-resistance conductive portion connected to, it becomes possible to provide a method for manufacturing an integrated circuit board, a sensing device, a biological information analysis device, and an integrated circuit board that suppress damage to a wiring portion due to bending. ..

It is a figure which shows the structure of the sensing apparatus provided with the integrated circuit board which concerns on Embodiment 1 of this invention. FIG. 1 is a cross-sectional view taken along the line AA of FIG. It is sectional drawing which shows the manufacturing method of the integrated circuit board and the sensing apparatus of Embodiment 1. FIG. It is sectional drawing which shows the appearance which the sensing apparatus was curved. It is a figure which shows the structure of the sensing apparatus provided with the integrated circuit board which concerns on Embodiment 2 of this invention. FIG. 5 is a sectional view taken along line BB of FIG. 5 showing a method of manufacturing the integrated circuit board and the sensing device according to the second embodiment. It is a figure which shows the structure of the biological information analysis apparatus which concerns on Embodiment 3 of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
Embodiment 1
FIG. 1 shows a configuration of a sensing device provided with an integrated circuit board according to a first embodiment of the present invention. This sensing device includes an integrated circuit board 1, a pressure sensor 2, and a temperature sensor 3.

The integrated circuit board 1 has a film substrate 4 and a plurality of electronic components 5.
The film substrate 4 has flexibility and is formed so as to spread thinly in a plane. The film substrate 4 can be made of, for example, a synthetic resin such as polyethylene naphthalate, polyethylene terephthalate, urethane, polycarbonate, and polyimide.

The electronic component 5 includes a passive element 5a, integrated circuits 5b and 5c, and a battery 5d. These electronic components 5 are electrically connected to each other by a wiring portion (not shown) and are also electrically connected to the pressure sensor 2 and the temperature sensor 3.
The passive element 5a is arranged on the film substrate 4 inside the pressure sensor 2, the temperature sensor 3, and the battery 5d. The passive element 5a is composed of, for example, a resistor and a capacitor.

The integrated circuits 5b and 5c are composed of, for example, a silicon large-scale integrated circuit (Si-LSI).
The integrated circuit 5b is arranged on the film substrate 4 in the vicinity of the passive element 5a. The integrated circuit 5b has a function of amplifying an electric signal, amplifies the electric signal output from the pressure sensor 2 and the temperature sensor 3, and outputs the electric signal to the integrated circuit 5c or the like.

The integrated circuit 5c is arranged on the film substrate 4 so as to sandwich the temperature sensor 3, the passive element 5a, and the integrated circuit 5b with the pressure sensor 2. The integrated circuit 5c performs wireless communication with an external device, and can be composed of, for example, a wireless communication unit, a memory, a processor, an AD conversion unit, and the like. As a result, under the control of the processor, the electric signal amplified by the integrated circuit 5b can be AD-converted and transmitted from the wireless communication unit to the external device. Further, the measurement data measured by the pressure sensor 2 and the temperature sensor 3 can be stored in the memory. Here, the wireless communication unit preferably communicates in the microwave band and the ultra-high frequency (UHF) band, and for example, a wireless communication unit that communicates in a short distance such as Bluetooth (registered trademark) can be used. Further, examples of the external device include ICT devices such as computers, tablets and mobile phones.
The battery 5d supplies electric power to each part of the sensing device to drive the battery 5d, and is arranged on the film substrate 4 so as to sandwich the passive element 5a and the integrated circuit 5b with the temperature sensor 3.

The pressure sensor 2 generates a voltage due to the pressure from the external environment of the sensing device, for example, the pressure from the living body when the sensing device is attached to the living body, and is connected to the integrated circuit 5c on the film substrate 4. It is arranged so as to sandwich the temperature sensor 3, the passive element 5a, and the integrated circuit 5b.
The temperature sensor 3 has characteristics such as resistivity that change according to the temperature of the external environment of the sensing device, for example, when the sensing device is attached to the living body, the resistivity and the like, and the battery 5d on the film substrate 4. It is arranged so as to sandwich the passive element 5a and the integrated circuit 5b between them. The temperature sensor 3 can be made of, for example, an organic material such as poly (3,4-ethylenedioxythiophene) (PEDOT).

Next, the configuration of the wiring portion that electrically connects each portion of the sensing device will be described in detail.
As shown in FIG. 2, the integrated circuit 5c and the battery 5d are arranged on the upper side of the film substrate 4. A wiring portion 6a is arranged between the film substrate 4, the integrated circuit 5c, and the battery 5d, and the integrated circuit 5c and the battery 5d are electrically connected by the wiring portion 6a. Similarly, the wiring portions 6b, 6c, 6d and 6e are arranged so as to electrically connect each portion of the sensing device.

The wiring portions 6a to 6e are formed by laminating the stretchable conductive portions 7a, 7b, 7c, 7d and 7e having conductivity and the low resistance conductive portions 8a, 8b, 8c, 8d and 8e having conductivity. There is.
The stretchable conductive portions 7a to 7e are arranged so as to extend so as to face the film substrate 4, and have higher elasticity than the low resistance conductive portions 8a to 8e and the film substrate 4. That is, the stretchable conductive portions 7a to 7e have conductivity and stretchability, and can be made of, for example, a material including a metal material and an organic material. Here, the stretchable conductive portions 7a to 7e preferably contain at least one of a urethane-based material, a silicone-based material, and a carbon material. Further, the stretchable conductive portions 7a to 7e preferably contain at least one of silver, copper and gold as a metal material, and more preferably contain silver.

For the elasticity, for example, the expansion / contraction ratio is calculated from the change in length when the elastic conductive portions 7a to 7e, the low resistance conductive portions 8a to 8e, and the film substrate 4 having the same shape are pulled in the plane direction with the same force. Can be obtained.
Further, the urethane-based material is composed of a compound containing urethane.
Further, the silicone-based material is composed of a compound containing siloxane.
Further, examples of the carbon material include a resin containing carbon nanotubes.

The low resistivity conductive portions 8a to 8e have a resistivity lower than that of the telescopic conductive portions 7a to 7e, and can be made of a metal material containing at least one of silver, copper and gold, for example. As a result, the current flowing through the wiring portions 6a to 6e mainly flows through the low resistance conductive portions 8a to 8e. The low-resistance conductive portions 8a to 8e are laminated on the upper side of the telescopic conductive portions 7a to 7e and connected to the electronic component 5. Specifically, the integrated circuit 5c is bonded to the low resistance conductive portion 8a by the bonding portion 9a, and the battery 5d is bonded to the low resistance conductive portion 8a by the bonding portion 9b.
The joining portion 9a is alloyed with the terminal of the integrated circuit 5c and the low resistance conductive portion 8a to join the integrated circuit 5c on the surface of the low resistance conductive portion 8a, and can be made of, for example, a material containing solder. .. Further, the bonding portion 9b can be composed of an anisotropic conductive film, a conductive adhesive, or the like, and the battery 5d is bonded onto the surface of the low resistance conductive portion 8a.

The wiring portion 6a is formed in a bridge shape so as to straddle the wiring portion 6b extending toward the electronic component 5 (not shown), and the integrated circuit 5c and the battery 5d are connected to both ends thereof. An insulating portion 10a is arranged between the wiring portion 6a and the wiring portion 6b, and an insulating portion 10b is arranged above the wiring portion 6a.

The wiring portion 6c is arranged so as to extend between the integrated circuit 5c and the temperature sensor 3, and the integrated circuit 5c and the temperature sensor 3 are connected to both ends thereof. The integrated circuit 5c is connected to the low resistance conductive portion 8c by the junction portion 9a. On the other hand, the temperature sensor 3 is arranged so as to extend from the wiring portion 6c to the wiring portion 6d along the surface of the film substrate 4, and one end portion thereof extends upward from the surface of the film substrate 4 to the low resistance conductive portion 8c. It is connected. Here, the end of the wiring portion 6c connected to the temperature sensor 3 is formed in a stepped shape with the telescopic conductive portion 7c protruding in the direction along the film substrate 4 with respect to the low resistance conductive portion 8c. Therefore, one end of the temperature sensor 3 is formed so as to extend diagonally upward along the end of the wiring portion 6c and is connected to the low resistance conductive portion 8c.

The wiring portion 6d is arranged so as to extend from the other end of the temperature sensor 3 toward the electronic component 5 (not shown). The other end of the temperature sensor 3 is connected to the telescopic conductive portion 7d.
The wiring portion 6e is arranged so as to extend between the pressure sensor 2 and the electronic component 5 (not shown). Here, the pressure sensor 2 has a pair of electrodes 11a and 11b and a ferroelectric layer 12 arranged between the electrodes 11a and 11b. Similar to the wiring portion 6c, the wiring portion 6e is formed in a stepped shape with the telescopic conductive portion 7e projecting in the direction along the film substrate 4 with respect to the low resistance conductive portion 8e. The electrode 11b of the pressure sensor 2 is formed so as to extend diagonally upward along the end portion of the wiring portion 6e, and one end portion thereof is connected to the low resistance conductive portion 8e.

The electrodes 11a and 11b of the pressure sensor 2 are electrically connected to the ferroelectric layer 12, and are made of a conductive material such as a metal material and an organic conductive material. Examples of the metal material include silver and copper. Examples of the organic conductive material include poly (3,4-ethylenedioxythiophene): poly (4-styrenesulfonic acid) (PEDOT: PSS) and the like.
The ferroelectric layer 12 is made of a material having ferroelectricity, for example, a poly (vinylidene-trifluoroethylene) copolymer (P (VDF-TrFE)) or the like.

Further, the insulating portion 10c is arranged between the wiring portion 6d and the wiring portion 6e, and the insulating portion 10d is arranged so as to cover the upper side of the wiring portions 6c to 6e, the pressure sensor 2 and the temperature sensor 3. The insulating portions 10a to 10d are made of an insulating material, and for example, polyester-based materials, epoxy-based materials, acrylic-based materials, and the like can be used. The insulating portions 10a to 10d preferably have an insulating resistance of 10 ¹² Ω · cm or more. Further, it is preferable that the insulating portions 10a to 10d have flexibility and have a stretch ratio that is twice or more larger than that of the film substrate 4.
Further, the protection unit 13 is arranged so as to cover the entire upper surface of the sensing device. The protective portion 13 has flexibility and water resistance, and is formed so as to spread thinly in a plane.

Next, a method of manufacturing the integrated circuit board 1 and the sensing device will be described.
First, as shown in FIG. 3A, a stretchable paste containing silver and an organic material is applied onto the film substrate 4 by screen printing and sintered at about 150 ° C. to form stretchable conductive portions 7b, 7c and 7e. Form. Subsequently, a low resistance paste containing silver nanoparticles is applied onto the stretchable conductive portions 7b, 7c and 7e by screen printing, and sintered at about 150 ° C. to form the low resistance conductive portions 8b, 8c and 8e. As a result, the wiring portions 6b, 6c and 6e in which the low resistance conductive portions 8b, 8c and 8e are laminated on the telescopic conductive portions 7b, 7c and 7e can be formed.

Here, the stretchable conductive portions 7b, 7c and 7e are formed so as to have higher stretchability than the low resistance conductive portions 8b, 8c, 8e and the film substrate 4. Further, the low resistivity conductive portions 8b, 8c and 8e are formed so as to have a resistivity lower than that of the telescopic conductive portions 7b, 7c and 7e. As a result, the low-resistance wiring portions 6b, 6c and 6e having elasticity can be formed.
Further, since the wiring portions 6b, 6c and 6e are formed by screen printing, they can be formed to be thin, such as having a thickness of about 20 μm. The viscosity of the stretchable paste and the low resistance paste is preferably adjusted to 100 dPa · s to 1000 dPa · s. As a result, the stretchable paste and the low resistance paste can be applied more flatly on the film substrate 4.

Further, at the positions corresponding to the wiring portions 6b, 6c and 6e, the low resistance paste is applied shorter than the total length of the expansion / contraction paste. As a result, the ends of the wiring portions 6b, 6c and 6e can be formed in a stepped shape. Here, both ends of the wiring portion 6b are formed in a stepped shape, and only one end of the wiring portions 6c and 6e is formed in a stepped shape.
As the film substrate 4, for example, a film substrate 4 having an area of 3 cm in length × 3 cm in width and a thickness of about 50 μm can be used.

Next, as shown in FIG. 3B, an insulating paste made of a polyester-based material is applied to the wiring portions 6b and 6e by screen printing to a thickness of about 40 μm, and the insulating portion is fired at about 150 ° C. 10a and 10c are formed. Further, a temperature sensor paste in which an organic material containing PEDOT is mixed is prepared, and the temperature sensor paste is applied so as to extend from the end of the wiring portion 6c toward the wiring portion 6e. Then, the temperature sensor 3 is formed by firing the applied paste for a temperature sensor at about 150 ° C.
At this time, one end of the applied temperature sensor paste is applied so as to extend diagonally upward from the wiring portion 6c formed in a stepped shape, and is connected to the low resistance conductive portion 8c. By forming the end portion of the wiring portion 6c in a stepped shape, it is possible to prevent the step difference due to stacking from becoming steep, and it is possible to form one end portion of the temperature sensor 3 so as to gently extend upward. Can be suppressed from disconnection.

Subsequently, as shown in FIG. 3C, the stretchable paste is applied by screen printing so as to cover the surface of the insulating portion 10a, and the stretchable paste extends from the temperature sensor 3 onto the insulating portion 10c. Is applied by screen printing. The stretchable stretchable paste 7a and 7d are formed by sintering the applied stretchable paste at about 150 ° C. Subsequently, the low-resistance paste is applied on the stretchable conductive portions 7a and 7d by screen printing and sintered at about 150 ° C. to form the low-resistance conductive portions 8a and 8d. As a result, it is possible to form the wiring portions 6a and 6d in which the low resistance conductive portions 8a and 8d are laminated on the telescopic conductive portions 7a and 7d.
In this way, similarly to the wiring portions 6b, 6c and 6e, the low-resistance wiring portions 6a and 6d having elasticity can be formed as thin as about 20 μm.

Further, an electrode paste containing PEDOT: PSS is applied on the film substrate 4 by screen printing and fired at about 150 ° C. to form the electrode 11b. At this time, one end of the applied electrode paste is applied so as to extend diagonally upward from the wiring portion 6e formed in a stepped shape and is connected to the low resistance conductive portion 8e, similarly to the temperature sensor 3. , It is possible to suppress the disconnection of the electrode 11b. Both ends of the wiring portion 6b are also formed in a stepped shape, and have the same functions as the wiring portions 6c and 6e.
Next, a ferroelectric paste containing P (VDF-TrFE) is applied on the electrode 11b by screen printing and fired at about 140 ° C. to form the ferroelectric layer 12. Then, an electrode paste containing PEDOT: PSS is applied on the ferroelectric layer 12 by screen printing and fired at about 150 ° C. to form the electrode 11a.
In this way, the pressure sensor 2 connected to the wiring portion 6e can be formed.

Subsequently, as shown in FIG. 3D, an insulating paste made of a polyester-based material is applied by screen printing to a thickness of about 40 μm and fired at about 150 ° C. to form insulating portions 10b and 10d. After that, the terminals of the integrated circuit 5c are joined to the wiring portions 6a and 6c by the joining portions 9a made of low melting point solder at a firing temperature of 170 ° C. or lower, and the terminals of the battery 5d are joined to the wiring portions 6a by a conductive adhesive. It is joined by the joining portion 9b at a firing temperature of 170 ° C. or lower.

At this time, since the terminals of the integrated circuit 5c are joined to the low resistance conductive parts 8a and 8c having higher alloying properties than the elastic conductive parts 7a and 7c with respect to the solder constituting the joint part 9a, the integrated circuit 5c is wired. It can be firmly fixed to the portions 6a and 6c. Here, since the low resistance conductive portions 8a and 8c contain silver nanoparticles having a higher alloying property with respect to the solder, the integrated circuit 5c can be more firmly fixed to the wiring portions 6a and 6c. Further, elastic conductive portions 7a and 7c having low alloying properties with respect to the solder are arranged below the low resistance conductive portions 8a and 8c. If the wiring part is composed only of the low resistance conductive part, the low resistance conductive part may become thin due to alloying with the solder and the wire may be broken. By arranging the 7a and 7c, it is possible to suppress the disconnection of the wiring portions 6a and 6c.
Similarly, the battery 5d can be firmly fixed to the wiring portion 6a. Electronic components 5 such as the passive element 5a and the integrated circuit 5b (not shown) are also firmly bonded to the low resistance conductive portion of the wiring portion by a joint portion such as solder.

The alloying property indicates the degree of alloying with the joint portion, and is determined based on, for example, the difference in wettability when the molten joint portion is dropped on the low resistance conductive portion and the stretchable conductive portion. Can be done.

Subsequently, as shown in FIG. 2, the protective portion 13 is arranged so as to cover the entire surface of the sensing device. In this way, as shown in FIG. 1, a thin and flexible integrated circuit board 1 and a sensing device are manufactured.

Here, the wiring portions 6a to 6e are configured by laminating the low resistance conductive portions 8a to 8e on the upper side of the stretchable conductive portions 7a to 7e having higher elasticity than the low resistance conductive portions 8a to 8e. Therefore, as shown in FIG. 4, even if the sensing device is curved, for example, curved with a radius of curvature of about 1 cm, the stretchable conductive portions 7a to 7e are deformed according to the curvature of the film substrate 4, and the low resistance conductive portions 8a to 8e are formed. It is possible to suppress the occurrence of damage such as cracks. Further, since the stretchable conductive portions 7a to 7e have higher elasticity than the film substrate 4, they can be smoothly deformed according to the curvature of the film substrate 4, and damage to the low resistance conductive portions 8a to 8e can be reliably suppressed. Can be done. In particular, the low-resistance conductive portions 8a to 8e tend to be formed hard because they are formed by screen printing. However, by arranging the stretchable conductive portions 7a to 7e below the low-resistance conductive portions 8a to 8e, the low-resistance conductive portions 8a to 8e It is possible to surely suppress the damage of the electronic component 5 and maintain the electrical connection of the electronic component 5 and the like by the low resistance conductive portions 8a to 8e.

The stretchable conductive portions 7a to 7e preferably have a stretch ratio that is twice or more larger than that of the film substrate 4. As a result, damage to the low resistance conductive portions 8a to 8e can be suppressed more reliably.
Further, in the wiring portions 6a to 6e, even if the low resistance conductive portions 8a to 8e are disconnected, current flows through the telescopic conductive portions 7a to 7e arranged below the low resistance conductive portions 8a to 8e. The electrical connection of the electronic component 5 and the like can be maintained.

Further, since the low resistivity conductive portions 8a to 8e have a resistivity lower than that of the stretch conductive portions 7a to 7e and contain more metal material than the stretch conductive portions 7a to 7e, the stretch conductive portions 9a and 9b are stretch conductive with respect to the joint portions 9a and 9b. It has a higher alloying property than parts 7a to 7e. Therefore, for example, the integrated circuit 5c can be firmly fixed to the low resistance conductive portions 8a and 8c by the joint portion 9a, and the integrated circuit 5c is detached from the low resistance conductive portions 8a and 8c even when the film substrate 4 is curved. This can be suppressed, and the electrical connection between the integrated circuit 5c and the low resistance conductive portions 8a and 8c can be reliably maintained.
Here, the low resistivity conductive portions 8a to 8e preferably have a resistivity of 1/5 or less of that of the telescopic conductive portions 7a to 7e. Further, the low resistivity conductive portions 8a to 8e preferably have a volume resistivity of 30 μΩ · cm or less.

Further, the ends of the wiring portions 6c and 6e are formed in a stepped shape with the telescopic conductive portions 7c and 7e projecting in the direction along the film substrate 4 with respect to the low resistance conductive portions 8c and 8e. The electrodes 11b of the temperature sensor 3 and the pressure sensor 2 are formed so as to extend diagonally upward at the ends of the wiring portions 6c and 6e and are connected to the low resistance conductive portions 8c and 8e. Therefore, the temperature sensor 3 and the electrode 11b can be brought into close contact with the ends of the wiring portions 6c and 6e over a wide area, and even if the film substrate 4 is curved, it is suppressed from peeling from the wiring portions 6c and 6e. be able to.

According to the present embodiment, the wiring portions 6a to 6e are laminated with the low resistance conductive portions 8a to 8e on the upper side of the low resistance conductive portions 8a to 8e and the stretchable conductive portions 7a to 7e having higher elasticity than the film substrate 4. Therefore, damage to the wiring portions 6a to 6e due to the curvature of the film substrate 4 can be suppressed.

Embodiment 2
In the first embodiment described above, the electronic component 5 is driven by the battery 5d, but the present invention is not limited to this as long as the electronic component 5 can be driven.
For example, in the first embodiment, the pressure sensor 2 and the battery 5d can be removed, the integrated circuit 21a can be arranged in place of the integrated circuit 5c, and the integrated circuit 21b and the antenna 22 can be newly arranged.

The integrated circuit 21a controls wireless communication with an external device, and can be composed of, for example, a memory, a processor, an AD conversion unit, and the like.
The integrated circuit 21b performs wireless communication with an external device, and has a so-called proximity communication function of wireless communication in the short wave (HF) band.

The antenna 22 is arranged so as to orbit a plurality of times around the temperature sensor 3 and the electronic component 5 along the edge of the film substrate 4.
As in the first embodiment, the wiring portion is arranged so as to electrically connect each portion of the sensing device.

As a result, electric energy for driving the electronic component 5 by magnetic field coupling can be obtained from an external device such as a reader / writer via the antenna 22 in a non-contact manner. Further, under the control of the integrated circuit 21a, the electric signal output from the temperature sensor 3 can be amplified and AD converted, wirelessly communicated via the antenna 22, and transmitted to the ICT device.

Next, a method of manufacturing the integrated circuit board 1 and the sensing device will be described.
First, as shown in FIG. 6A, a stretchable paste containing silver and an organic material is applied on the film substrate 4 by screen printing at positions corresponding to the wiring portion 23a, the wiring portion 23b, and the antenna 22, respectively, and about Sintered at 150 ° C. to form telescopic conductive portions 24a, 24b and 26a. Subsequently, a low-resistance paste containing silver nanoparticles is applied onto the stretchable conductive portions 24a, 24b and 26a by screen printing, and sintered at about 150 ° C. to form the low-resistance conductive portions 25a, 25b and 26b. As a result, the wiring portions 23a and 23b in which the low resistance conductive portions 25a and 25b are laminated on the telescopic conductive portions 24a and 24b are formed, and a part of the antenna 22 in which the low resistance conductive portions 26b are laminated on the telescopic conductive portions 26a. Is formed.
In this way, the low-resistance wiring portions 23a and 23b having elasticity can be formed.

Next, as shown in FIG. 6B, an insulating paste made of a polyester-based material is applied to the wiring portion 23a by screen printing, and the insulating portion 27a is formed by firing at about 150 ° C. Further, a temperature sensor paste in which an organic material containing PEDOT is mixed is prepared, and the temperature sensor paste is applied so as to extend from the end of the wiring portion 23b toward the antenna 22. Then, the temperature sensor 3 is formed by firing the applied paste for a temperature sensor at about 150 ° C.

Subsequently, as shown in FIG. 6C, the stretchable paste is applied on the film substrate 4 and on the surface of the insulating portion 27a by screen printing, and further extends from the end portion of the temperature sensor 3. As well as being applied on the low resistance conductive portion 26b. Then, these stretchable pastes are sintered at about 150 ° C. to form stretchable conductive portions 24c, 24d, 24e and 26c. Subsequently, a low resistance paste is applied onto the stretchable conductive portions 24c, 24d, 24e and 26c by screen printing and sintered at about 150 ° C. to form the low resistance conductive portions 25c, 25d, 25e and 26d. As a result, it is possible to form the low-resistance wiring portions 23c to 23e having elasticity, similarly to the wiring portions 23a and 23b. Further, since the antenna 22 is formed thick by sequentially laminating the telescopic conductive portion 26a, the low resistance conductive portion 26b, the telescopic conductive portion 26c, and the low resistance conductive portion 26d, its function can be improved.
Further, an insulating paste made of a polyester-based material is applied by screen printing and fired at about 150 ° C. to form insulating portions 27b and 27c.

Subsequently, as shown in FIG. 6D, the terminals of the integrated circuit 5b are joined to the wiring portions 23a and 23b by the joining portion 28a made of low melting point solder at a firing temperature of 170 ° C. or lower, and the integrated circuit 21a The terminals are joined to the wiring portions 23a and 23c by the joining portion 28b made of low melting point solder at a firing temperature of 170 ° C. or lower. At this time, since the terminals of the integrated circuits 5b and 21a are joined to the low resistance conductive portions 25a to 25c having a high alloying property with respect to the solder, the integrated circuits 5b and 21a are firmly fixed to the wiring portions 23a to 23c. can do.

Electronic components 5 such as the passive element 5a and the integrated circuit 21b (not shown) are also firmly bonded to the low resistance conductive portion of the wiring portion by a joint portion such as solder.
In this way, as shown in FIG. 5, a thin and flexible integrated circuit board 1 and a sensing device are manufactured.

According to the present embodiment, the wiring portions 23a to 23e are laminated with the low resistance conductive portions 25a to 25e on the upper side of the low resistance conductive portions 25a to 25e and the stretchable conductive portions 24a to 24e having higher elasticity than the film substrate 4. Therefore, damage to the wiring portions 23a to 23e due to the curvature of the film substrate 4 can be suppressed.
In the present embodiment, the same pressure sensor as in the first embodiment may be further arranged, or the pressure sensor may be arranged instead of the temperature sensor 3.

Embodiment 3
The sensing devices of the first and second embodiments can be used as a biometric information analysis device for analyzing biometric information.
For example, as shown in FIG. 7, the fixing unit 31 and the analysis unit 32 can be newly arranged in the first embodiment.

The fixing portion 31 is for fixing the sensing device to the wrist W of the living body, and is composed of a so-called wristband formed so as to be wound around the wrist W. A sensing device is arranged inside the fixing portion 31, and the sensing device is fixed at a predetermined position on the wrist W. As a result, the pressure sensor 2 and the temperature sensor 3 are arranged so that the pressure and temperature from the living body can be input.
The analysis unit 32 is wirelessly connected to the integrated circuit 5c of the sensing device, receives an electric signal output from the pressure sensor 2 and the temperature sensor 3 via the integrated circuit 5c, and analyzes biological information based on the electric signal. To do.

With such a configuration, when the sensing device is fixed to the wrist W of the living body by the fixing portion 31, vibration corresponding to the heartbeat is input to the pressure sensor 2, and an electric signal corresponding to the vibration is input from the pressure sensor 2 to the integrated circuit. It is output to 5c. Further, an electric signal corresponding to the body temperature is output from the temperature sensor 3 to the integrated circuit 5c.
When the electric signals output from the pressure sensor 2 and the temperature sensor 3 are input to the integrated circuit 5c, the integrated circuit 5c transmits the input electric signals to the analysis unit 32 by wireless communication. When the electric signal transmitted from the integrated circuit 5c is input to the analysis unit 32, the analysis unit 32 analyzes the biological information based on each electric signal.

The analysis unit 32 can measure, for example, the heart rate and blood pressure of the living body based on the electric signal output from the pressure sensor 2. In addition, the analysis unit 32 can measure the body temperature of the living body based on the electric signal output from the temperature sensor 3. The analysis unit 32 can determine the health state, drowsiness state, concentration state, and the like of the living body based on the changes in the biological information.

According to the present embodiment, since the sensing device is formed to be thin and flexible, the sensing device can be brought into close contact with the wrist W surface, and the pressure and temperature from the living body can be measured by the pressure sensor 2 and the pressure sensor 2. The temperature sensor 3 can be reliably input.
In the present embodiment, the fixing portion 31 fixes the sensing device to the wrist W, but the fixing device 31 is not limited to the wrist W as long as the sensing device can be fixed to the living body. For example, the fixing portion 31 can also fix the sensing device to the head, arms, and the like.

Further, the sensing devices of the above-described first and second embodiments can also be used as a physical distribution environment analysis device for monitoring the physical environment of goods in physical distribution. For example, in the first embodiment, the temperature sensor 3 fixes the sensing device to the product so that the temperature of the product can be measured. Then, the temperature change of the product can be calculated based on the electric signal output from the temperature sensor 3, and the state of the product can be analyzed.

In the above-described first to third embodiments, the pressure sensor 2 that senses the pressure change in the external environment and the temperature sensor 3 that senses the temperature change in the external environment are arranged as the sensing device, but the outside of the sensing device. It suffices if an external environment sensor that senses changes in the environment is arranged, and is not limited to the pressure sensor 2 and the temperature sensor 3.
For example, a sensing device externally uses a biochemical sensor that utilizes a biochemical reaction that senses a bioactive substance contained in the sweat and saliva of a living body and generates an electric signal according to the amount of the physiologically active substance. It can also be placed as an environmental sensor.

Further, in the above-described first to third embodiments, the wiring portion is composed of two layers of the telescopic conductive portion and the low resistance conductive portion, but the low resistance conductive portion may be laminated on the upper side of the telescopic conductive portion. It is not limited to two layers. For example, the wiring portion may be composed of three layers in which a stretchable conductive portion is further laminated on the upper side of the low resistance conductive portion. As a result, damage to the wiring portion due to the curvature of the film substrate 4 can be further suppressed.
Further, in the above-described first to third embodiments, the low resistance conductive portions are laminated so as to be in close contact with the telescopic conductive portion, but it is sufficient if they can be arranged above the telescopic conductive portion, and the present invention is not limited to this. Absent. For example, a conductive portion having a higher elasticity than the low resistance conductive portion and a smaller elasticity than the stretchable conductive portion can be arranged between the low resistance conductive portion and the stretchable conductive portion.

Further, in the above-described first to third embodiments, the telescopic conductive portion, the low resistance conductive portion, the insulating portion, the pressure sensor 2 and the temperature sensor 3 are formed by screen printing, but it is sufficient if each paste can be applied. It is not limited to. For example, it can be formed by gravure printing, reverse offset printing, inkjet printing, flexographic printing, or the like. Further, it can be applied by a method other than printing.

1 Integrated circuit board, 2 Pressure sensor, 3 Temperature sensor, 4 Film board, 5 Electronic components, 5a Passive element, 5b, 5c, 21a, 21b Integrated circuit, 5d Battery, 6a to 6e, 23a to 23e Wiring part, 7a to 7e, 24a to 24e, 26a, 26c Telescopic conductive part, 8a to 8e, 25a to 25e, 26b, 26d Low resistance conductive part, 9a, 9b, 28a, 28b Joint part, 10a to 10c, 27a to 27c Insulation part, 11a , 11b electrode, 12 strong dielectric layer, 13 protection part, 22 antenna, 31 fixing part, 32 analysis part, W wrist.

Claims (12)

With a flexible substrate,
A plurality of electronic components arranged on the upper side of the substrate and including integrated circuits,
It is provided with a wiring unit arranged between the substrate and the plurality of electronic components and electrically connecting the plurality of electronic components.
The wiring portion is formed by laminating a stretchable conductive portion having conductivity and a low resistance conductive portion, and is arranged so that the stretchable conductive portion extends so as to face the substrate, and the low resistance conductive portion and the substrate. An integrated circuit board having higher elasticity, the low resistance conductive portion having a lower resistance than the stretch conductive portion, and being laminated on the upper side of the stretch conductive portion and connected to the plurality of electronic components. The integrated circuit board according to claim 1, wherein the stretchable conductive portion has a stretch ratio that is twice or more larger than that of the board. Further having a joint portion for alloying and joining the plurality of electronic components and the low resistance conductive portion.
The integrated circuit board according to claim 1 or 2, wherein the low-resistance conductive portion has a higher alloying property than the telescopic conductive portion with respect to the joint portion. The integrated circuit board according to any one of claims 1 to 3, wherein the low-resistance conductive portion has a resistivity of 1/5 or less of that of the telescopic conductive portion. The integrated circuit board according to any one of claims 1 to 4, wherein the stretchable conductive portion includes a metal material and an organic material. The integrated circuit board according to claim 5, wherein the stretchable conductive portion includes at least one of a urethane-based material, a silicone-based material, and a carbon material. The integrated circuit board according to any one of claims 1 to 6, wherein the low resistance conductive portion is made of a metal material containing at least one of silver, copper and gold. The integrated circuit board according to any one of claims 1 to 7.
A sensing device including an external environment sensor that is arranged on the substrate of the integrated circuit board and connected to a wiring portion to sense changes in the external environment. The external environment sensor includes a pressure sensor that generates a voltage corresponding to the pressure from the external environment.
The end portion of the wiring portion is formed in a stepped shape so that the stretchable conductive portion extends in the direction along the film substrate with respect to the low resistance conductive portion.
The pressure sensor has a pair of electrodes arranged so as to sandwich a ferroelectric layer having a ferroelectricity, and is formed so that an end portion of one electrode extends diagonally upward along the end portion of the wiring portion. The sensing device according to claim 8, wherein the sensing device is connected to the low resistance conductive portion. The sensing device according to claim 8 or 9,
A biological information analysis device including an analysis unit that analyzes biological information based on an electric signal output from an external environmental sensor of the sensing device arranged so that changes in the living body can be input. On the flexible substrate, a conductive stretchable conductive portion having higher elasticity than the substrate is formed so as to extend toward the substrate.
A low resistivity conductive portion having a resistivity and elasticity smaller than that of the stretchable conductive portion is laminated on the upper side of the stretchable conductive portion.
A method for manufacturing an integrated circuit board in which a plurality of electronic components including an integrated circuit are arranged above the wiring portion composed of the telescopic conductive portion and the low resistance conductive portion and electrically connected to the low resistance conductive portion. The method for manufacturing an integrated circuit board according to claim 11, wherein the stretchable conductive portion and the low resistance conductive portion are coated by screen printing with a viscosity of 100 dPa · s to 1000 dPa · s.