JP2020146709A - Manufacturing method for joined body - Google Patents

Abstract

To provide a manufacturing method for a joined body that can suppress occurrence of welding defect in a blowhole and the like.SOLUTION: A joining method for a joined body 1 includes: a partially curing step in which a thermosetting adhesive 41 is arranged at a portion on a first surface 11 of a first member 10 and a thermally-cured part 44 thermally-cured is formed on a portion of the arranged adhesive 41; an overlapping step in which the first member 10 and a second member 20 are overlapped with each other so that at least the thermally-cured part 44 of the adhesive 41 in the first surface 11 of the first member 10 is coated with a second surface 21 in the second member 20, after the partially curing step; and a welding step in which the first member 10 and the second member 20 are welded to each other by emitting a beam (L) to the first member 10 after the overlapping step or/and the second member 20 after the overlapping step to weld a portion at which the adhesive 41 is not arranged in the first surface 11 to the second surface 21.SELECTED DRAWING: Figure 2

Description

The present disclosure relates to a method for producing a bonded body.

Conventionally, in manufacturing a joined body in which two members (first member and second member) are joined, a first is performed by irradiating a beam such as a laser beam after superimposing the first member and the second member. Welding (beam welding) of a member and a second member is performed (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2009-39720

By the way, when the beam is irradiated, "evaporative gas" is generated by evaporating the components of the constituent materials of the first member and the second member, the oil component adhering to the first member and the second member, and the like. Sometimes. In the case of the above-mentioned conventional technique, since the beam is irradiated in a state where the passage of the evaporative gas is not secured, there is a possibility that welding defects such as blow holes may occur in the joint due to the evaporative gas.

The present disclosure has been made in view of the above, and an object of the present disclosure is to provide a method for manufacturing a bonded body capable of suppressing the occurrence of welding defects such as blow holes.

In order to achieve the above object, in the method of joining a joined body according to the present disclosure, a thermosetting adhesive is arranged on a part of a first surface which is a predetermined surface of the first member, and the arranged bonding is performed. At least the thermosetting portion of the adhesive on the first surface of the first member after the partially curing step of forming a thermosetting portion that is thermally cured in a part of the agent is A polymerization step of superimposing the first member and the second member so as to be covered by a second surface of the second member facing the first surface, and the first member after the polymerization step. Or / and, by irradiating the second member after the polymerization step with a beam to weld the portion of the first surface where the adhesive is not arranged and the second surface. Includes a joining step of joining the first member and the second member.

According to the present disclosure, it is possible to suppress the occurrence of welding defects such as blow holes.

FIG. 1A is a schematic plan view schematically showing the upper surface of the joined body according to the embodiment. FIG. 1B is a schematic disassembled perspective view schematically showing the first member and the second member of the joint according to the embodiment in an exploded manner. It is a process flow diagram of the manufacturing method of the joined body which concerns on embodiment. FIG. 3A is a schematic plan view schematically showing a state in which the adhesive is arranged on the first member in the partial curing step according to the embodiment. FIG. 3B is a schematic plan view schematically showing how a part of the adhesive is thermosetting in the partial curing step according to the embodiment. FIG. 4A is a schematic plan view for explaining the polymerization step according to the embodiment. FIG. 4B is a schematic cross-sectional view schematically showing a cross section taken along line AA of the first member and the second member in FIG. 4A. It is a schematic plan view for demonstrating the joining process which concerns on embodiment.

The manufacturing method of the bonded body 1 according to the embodiment of the present disclosure will be described with reference to the drawings. Specifically, first, the configuration of the bonded body 1 manufactured by the manufacturing method according to the present embodiment will be described, and then the manufacturing method according to the present embodiment will be described. FIG. 1A is a schematic plan view schematically showing the upper surface of the bonded body 1. FIG. 1B is a schematic disassembled perspective view schematically showing the first member 10 and the second member 20 described later of the joint body 1 in an exploded manner. In addition, in FIG. 1B, the illustration of the adhesive portion 40 and the welded portion 30 described later is omitted. 1 (a) and 1 (b) show Cartesian coordinates of the X-axis-Y-axis-Z-axis. In the present embodiment, the Z direction (positive direction of the Z axis) in the Cartesian coordinates is upward, and the directions along the X axis (X direction and −X direction) are the lengths of the first member 10 and the second member 20. The direction.

The joint body 1 is manufactured by joining the first member 10 and the second member 20. Specifically, the first surface 11 (which is the upper surface in the present embodiment) which is a predetermined surface of the first member 10 and the second surface 21 (which is the surface facing the first surface 11) of the second member 20. The first member 10 and the second member 20 are joined so as to overlap each other (which is the lower surface in the present embodiment).

In FIG. 1A, the end face of the second member 20 on the X direction side is located on the −X direction side of the end face of the first member 10 on the X direction side, and is on the −X direction side of the second member 20. The end face is located on the −X direction side of the end face on the −X direction side of the first member 10. In this way, the second member 20 is joined to the first member 10 in a state of being deviated from the first member 10 by a predetermined distance in the −X direction. However, the joining mode of the first member 10 and the second member 20 is not limited to this. To give another example, for example, the end face of the second member 20 on the X direction side coincides with the end face of the first member 10 on the X direction side, or the end face of the second member 20 on the X direction side is the first. The second member 20 may be joined to the first member 10 so as to be located on the X direction side of the end surface of the first member 10 on the X direction side.

Further, referring to FIG. 1A, in the joint body 1, the first surface 11 of the first member 10 and the second surface 21 of the second member 20 are joined by at least a welded portion 30. The welded portion 30 is a portion joined by welding performed in a joining step described later. Further, the first surface 11 of the first member 10 and the second surface 21 of the second member 20 according to the present embodiment are also joined by the adhesive portion 40. The adhesive portion 40 is a portion joined by the adhesive 41 in the joining step described later.

The materials of the first member 10 and the second member 20 may be any materials that can be welded by irradiation of the beam (L) in the joining step described later, and the specific materials thereof are not particularly limited. In the present embodiment, a metal is used as a specific example of the material of the first member 10 and the second member 20, specifically, an iron-based metal (a metal containing iron as a main component), and more specifically. Uses steel. That is, the first member 10 and the second member 20 according to the present embodiment are steel plate members (that is, steel plates).

Further, the first member 10 and the second member 20 according to the present embodiment are specifically members used for vehicles such as passenger cars, trucks, and buses. However, the first member 10 and the second member 20 are not limited to such members for vehicles, and may be members of various structures such as industrial machines, ships, and aircraft.

Further, a plating layer (a layer composed of plating components) is provided on the surface of at least the first surface 11 of the first member 10 according to the present embodiment. Similarly, a plating layer is also provided on the surface of at least the second surface 21 of the second member 20 according to the present embodiment. Specifically, the outer surface of each of the first member 10 and the second member 20 according to the present embodiment is entirely plated, so that a plating layer is provided on the outer surface as a whole. There is. The specific components of the plating layer of the first member 10 and the second member 20 are not particularly limited, but in this embodiment, zinc is used as an example. That is, the first member 10 and the second member 20 according to this embodiment are galvanized steel plates.

However, the configuration of the first member 10 and the second member 20 is not limited to the configuration having the plating layer as described above. For example, the first member 10 and the second member 20 may be members that do not have a plating layer (members that have not been plated).

Subsequently, a method for manufacturing the bonded body 1 will be described. FIG. 2 is a process flow chart of the manufacturing method of the bonded body 1 according to the present embodiment. The manufacturing method according to the present embodiment includes a partial curing step (step S10), a polymerization step (step S20), and a joining step (step S30). The polymerization step is carried out after the partial curing step, and the joining step is carried out after the polymerization step. Hereinafter, each of these steps will be described in order.

3 (a) and 3 (b) are schematic plan views for explaining a partial curing step. Specifically, FIG. 3 (a) schematically shows a state in which the adhesive 41 is arranged on the first member 10 in the partial curing step, and FIG. 3 (b) shows the adhesive in the partial curing step. A state in which a part of 41 is thermoset is schematically shown. In the partial curing step according to the present embodiment, as shown in FIG. 3A, the thermosetting adhesive 41 is arranged on the first surface 11 of the first member 10. Specifically, a paste-like thermosetting adhesive 41 is applied onto the first surface 11. Next, as shown in FIG. 3B, a thermosetting portion 44, which is a thermosetting portion, is formed on a part of the adhesive 41 arranged on the first surface 11.

The adhesive 41 may be any one having thermosetting property, and its specific component is not particularly limited. To give a specific example of the adhesive 41, known thermosetting adhesives such as a thermosetting adhesive containing an epoxy resin and a thermosetting adhesive containing a urethane resin can be used. Further, in the present embodiment, a paste-like adhesive is used as the adhesive 41, but the present invention is not limited to this, and the adhesive 41 is, for example, a tape-like adhesive (for example, thermosetting on the surface). A double-sided tape having an adhesive 41 and an adhesive for sticking on the back surface) can also be used.

Further, the specific temperature at which the adhesive 41 is thermoset is not particularly limited, but the adhesive 41 according to the present embodiment is, as an example, a predetermined temperature selected from the range of 100 ° C to 200 ° C. It shall be thermoset at temperature.

Further, the adhesive 41 according to the present embodiment is arranged in a plurality of lines. Specifically, the adhesive 41 according to the present embodiment is arranged in two lines. However, the number of the adhesive 41 is not limited to two, and may be three or more.

Here, of the plurality of line-shaped adhesives 41, two line-shaped adhesives 41 adjacent to each other are defined as a first line portion 42 and a second line portion 43. The first line portion 42 and the second line portion 43 according to the present embodiment are arranged so as to extend in the X direction on the first surface 11. Further, the first line portion 42 is arranged on the Y direction side of the second line portion 43 while having a predetermined distance from the second line portion 43.

With reference to FIG. 3B, in the present embodiment, in forming the thermosetting portion 44 on a part of the adhesive 41, a part of the adhesive 41 is irradiated with a beam (L), and this beam is formed. A part of the adhesive 41 is thermoset by the heat of (L). Specifically, by irradiating the adhesive 41 with a beam having an output value lower than the output value (W) of the beam used in the joining step described later, a part of the adhesive 41 is thermoset and heat is generated. The hardened portion 44 is formed.

Further, in the partial curing step according to the present embodiment, a plurality of thermosetting portions 44 are formed in the first line portion 42, and at least one thermosetting portion 44 is formed in the second line portion 43. Has been done. As a specific example of this, in FIG. 3B, two thermosetting portions 44 are formed in the first line portion 42, and one thermosetting portion 44 is formed in the second line portion 43. .. Then, the thermosetting portion 44 of the first line portion 42 and the thermosetting portion 44 of the second line portion 43 are placed between the two thermosetting portions 44 adjacent to each other in the first line portion 42 of the second line portion 43. It is formed in a "staggered arrangement" such that the thermosetting portion 44 is located.

To explain this from another viewpoint, "thermosetting portion 44 of the first line portion 42" and "thermosetting portion 43 of the second line portion 43" located on the X direction side of the thermosetting portion 44 toward the X direction. When the "section 44" and the "thermosetting section 44 of the first line section 42" located on the X-direction side of the thermosetting section 44 are connected in order by a line, a plurality of portions so that this line becomes zigzag. The thermosetting portion 44 is formed.

The beam (L) used in the partial curing step may be any beam (L) capable of curing a part of the adhesive 41, and the specific type thereof is not particularly limited, but one according to the present embodiment. In the partial curing step, a laser beam is used as an example of the beam (L). Specifically, in the partial curing step according to the present embodiment, a laser beam is irradiated using a laser welder. The specific type of the laser welder is not particularly limited, but in the present embodiment, a laser welder including a galvanoscan system having a galvanomirror is used. According to such a laser welder, the laser beam can be easily and accurately scanned, so that the thermosetting portion 44 can be easily and accurately formed.

The heat source used when curing the adhesive 41 in the partial curing step is not limited to the beam (L) as described above. As another example, a part of the adhesive 41 can be thermoset by using a heat source such as a dryer that blows warm air heated by a heating wire. However, when the beam (L) is used, it is easier to locally heat the adhesive 41 than when a heat source such as a dryer is used. Therefore, the staggered arrangement as in the present embodiment. The thermosetting portion 44 of the embodiment can be easily formed.

Subsequently, the polymerization step will be described. FIG. 4A is a schematic plan view for explaining the polymerization step. In the polymerization step according to the present embodiment, at least the thermosetting portion 44 of the adhesive 41 on the first surface 11 of the first member 10 after the partial curing step is covered with the second surface 21 of the second member 20. The first member 10 and the second member 20 are overlapped with each other. Specifically, in FIG. 4A, the entire adhesive 41 on the first surface 11 of the first member 10 after the partial curing step is covered by the second surface 21 of the second member 20. The first member 10 and the second member 20 are overlapped with each other.

FIG. 4B is a schematic cross-sectional view schematically showing a cross section taken along line AA of the first member 10 and the second member 20 in FIG. 4A. As described above, since the thermosetting portion 44 is formed in a part of the adhesive 41 before this polymerization step, when the first member 10 and the second member 20 are overlapped in the polymerization step, the first member 10 is first. A gap 50 is formed between the surface 11 and the second surface 21. The gap 50 functions as a path for evaporative gas generated in the joining process described later.

Subsequently, the joining process will be described. FIG. 5 is a schematic plan view for explaining the joining process. In the joining step according to the present embodiment, the second member 20 after the polymerization step is irradiated with the beam (L), and the adhesive 41 is not arranged on the first surface 11 of the first member 10. And the second surface 21 of the second member 20 are welded to join the first member 10 and the second member 20. The region where the beam (L) is irradiated is referred to as an “irradiation region 60”.

Specifically, in the present embodiment, the beam (L) is irradiated to the surface (upper surface of the second member 20) opposite to the second surface 21 of the second member 20 after the polymerization step. Therefore, the portion of the first surface 11 where the adhesive 41 is not arranged and the second surface 21 are beam welded. More specifically, in the region between the portion of the upper surface of the second member 20 corresponding to the back surface side (back surface side) of the first line portion 42 and the portion corresponding to the back surface side of the second line portion 43. On the other hand, the beam (L) is irradiated. As a result, the portion of the irradiation region 60 of the second member 20 is melted and solidified and joined to the first member 10 to form the welded portion 30 (FIG. 1 (a) described above). As a result, the first member 10 and the second member 20 are joined (that is, welded) via the welded portion 30.

The evaporative gas generated from the first surface 11 and / or the second surface 21 during this welding passes through the gap 50 described above and is discharged to the outside. Specifically, this evaporative gas is used for evaporation of components of the constituent materials of the first member 10 and the second member 20 (which includes a plating component), and for the first member 10 and the second member 20. It is an evaporation gas generated by the evaporation of the attached oil component.

Further, in the joining step according to the present embodiment, the heat generated during welding in this joining step also heat-cures the portion of the adhesive 41 other than the thermosetting portion 44. At this time, the first member 10 and the second member 20 are also joined by the thermosetting portion (which becomes the adhesive portion 40 in FIG. 1A).

By executing the joining step as described above, the joined body 1 described with reference to FIG. 1A can be obtained. In the joined body 1 manufactured in this manner, the first member 10 and the second member 20 are joined to each other via both the welded portion 30 and the bonded portion 40.

However, the content of the joining process is not limited to the above content. In the joining step, at least the welded portion 30 may be formed, and the portion of the adhesive 41 other than the thermosetting portion 44 may not be thermoset. As a result, the obtained joined body 1 has a structure in which the joined body 1 is mainly joined to each other by the welded portion 30. Further, in this case, after the joining step, the portion other than the thermosetting portion 44 of the adhesive 41 may be thermally cured by heating the bonded body 1. To give a specific example of this, for example, when coating (for example, baking coating) is performed on the bonded body 1 (mainly the bonded body 1 joined by the welded portion 30) after the joining process, heat is applied to the bonded body 1. By adding, the portion of the adhesive 41 other than the thermosetting portion 44 may be thermoset.

Alternatively, when the bonding strength between the first member 10 and the second member 20 is not so required and the bonding by only the welded portion 30 is sufficient, the portion of the adhesive 41 other than the thermosetting portion 44 is thermoset. You can leave it untouched.

The beam (L) used in the joining step may be any beam (L) capable of welding the first member 10 and the second member 20, and the specific type thereof is not particularly limited, but in the present embodiment. Then, a laser beam is used as an example of the beam (L). Specifically, in the present embodiment, a laser welding machine is used to irradiate a laser beam. The specific type of this laser welding machine is not particularly limited, but in the present embodiment, a laser welding machine provided with a galvanoscan system is used as in the case of the partial curing step described above. .. As the beam (L), for example, a plasma beam, an electron beam, an ion beam, or the like can be used in addition to the laser beam.

Further, the portion (irradiation region 60) where the beam (L) is irradiated in the joining step is not limited to the second member 20. To give another example, in the joining step, in addition to the second member 20, the beam (L) is further irradiated to, for example, the lower surface of the first member 10 (the surface opposite to the first surface 11). Alternatively, the second member 20 may not be irradiated with the beam (L), and the beam (L) may be irradiated only to the lower surface of the first member 10. That is, in the joining step, the beam (L) may be applied to the first member 10 and / or the second member 20 after the polymerization step.

Further, in the joining step, the portion where the welded portion 30 is formed by the beam (L) is not limited to the region between the first line portion 42 and the second line portion 43 as in the present embodiment. The portion where the welded portion 30 is formed is, in addition to or in place of this region, for example, a region on the Y direction side of the first line portion 42 or a region on the −Y direction side of the second line portion 43. Etc., various places where the formation of the welded portion 30 is desired can be used.

According to the present embodiment as described above, when the first member 10 and the second member 20 are superposed in the polymerization step, the first member 10 and the second member are formed by the thermosetting portion 44 of the adhesive 41. A gap 50 is formed between the gap 50 and the gap 50, which can serve as a path for the evaporative gas generated in the joining process. As a result, it is possible to suppress the occurrence of welding defects such as blow holes.

Further, according to the present embodiment, as described in the partial curing step, the thermosetting portion 44 of the first line portion 42 and the thermosetting portion 44 of the second line portion 43 are adjacent to each other in the first line portion 42. Since it is formed in a "staggered arrangement mode" in which the thermosetting portion 44 of the second line portion 43 is located between the thermosetting portions 44, it is easy to secure a wide gap 50 that can be a path for the vaporized gas. At the same time, it is possible to easily secure the gap 50 in a stable manner.

Although the embodiment according to the present disclosure has been described above, the present disclosure is not limited to such a specific embodiment, and various modifications and changes can be made within the scope of the claims. ..

1 Joined body 10 1st member 11 1st surface 20 2nd member 21 2nd surface 30 Welded part 40 Adhesive part 41 Adhesive 42 1st line part 43 2nd line part 44 Thermosetting part 50 Gap 60 Irradiation area

Claims (2)

A partial curing step of arranging a thermosetting adhesive on a part of a first surface which is a predetermined surface of the first member and forming a thermosetting portion on a part of the arranged adhesive. When,
At least the thermosetting portion of the adhesive on the first surface of the first member after the partial curing step is covered with a second surface which is a surface of the second member facing the first surface. As described above, the polymerization step of superimposing the first member and the second member,
A location where the adhesive is not arranged on the first surface by irradiating the first member and / or the second member after the polymerization step with a beam. A method for manufacturing a bonded body, which comprises a joining step of joining the first member and the second member by welding the second surface. In the partial curing step, the adhesive is arranged in a plurality of lines on the first surface of the first member.
When the two line-shaped adhesives adjacent to each other are defined as the first line portion and the second line portion among the plurality of line-shaped adhesives.
A plurality of the thermosetting portions are formed in the first line portion.
At least one thermosetting portion is formed in the second line portion.
The thermosetting portion of the first line portion and the thermosetting portion of the second line portion are located between two thermosetting portions adjacent to each other in the first line portion and the thermosetting portion of the second line portion. The method for manufacturing a bonded body according to claim 1, wherein the joints are formed in a staggered arrangement such that the portions are located.

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