JP2020136405A - Wafer processing method - Google Patents

Abstract

To form a device chip without deteriorating quality.SOLUTION: A wafer processing method for dividing a wafer in which a plurality of devices are formed in each region on a surface partitioned by division schedule lines into individual device chips comprises a polyester-based sheet arranging step, an integrating step, a dividing step, and a picking-up step. The polyester-based sheet arranging step positions the wafer in an opening of a frame and arranges a polyester-based sheet in a rear surface of the wafer and an outer periphery of the frame, the opening housing the wafer. The integrating step heats and presses the polyester-based sheet, and integrates the wafer and the frame via the polyester-based sheet. The dividing step forms a division groove by irradiating the wafer with a laser beam of a wavelength having absorbability to the wafer along the division schedule lines and divides the wafer into individual device chips. The picking-up step applies ultrasonic waves to the polyester-based sheet, pushes up the device chip, and picks up the device chip from the polyester-based sheet.SELECTED DRAWING: Figure 4

Description

The present invention relates to a method for processing a wafer in which a wafer formed in each region of a surface in which a plurality of devices are partitioned by a planned division line is divided into individual device chips.

In the manufacturing process of device chips used in electronic devices such as mobile phones and personal computers, first, a plurality of intersecting planned division lines (streets) are set on the surface of a wafer made of a material such as a semiconductor. Then, devices such as ICs (Integrated Circuits), LSIs (Large-Scale Integrated circuits), and LEDs (Light Emitting Diodes) are formed in each area partitioned by the planned division line.

After that, an adhesive tape called a dicing tape, which is attached to an annular frame having an opening so as to close the opening, is attached to the back surface of the wafer, and the wafer, the adhesive tape, and the annular frame are integrated. Form a frame unit. Then, when the wafer included in the frame unit is processed and divided along the planned division line, individual device chips are formed.

For example, a laser processing apparatus is used for dividing the wafer (see Patent Document 1). The laser processing apparatus includes a chuck table that holds the wafer via an adhesive tape, and a laser processing unit that irradiates the wafer with a laser beam having a wavelength that absorbs the wafer.

When dividing the wafer, the frame unit is placed on the chuck table, and the wafer is held by the chuck table via the adhesive tape. Then, while the chuck table and the laser processing unit are relatively moved along the direction parallel to the upper surface of the chuck table, the laser processing unit irradiates the wafer with the laser beam. When the laser beam is irradiated, a division groove is formed in the wafer along each planned division line by ablation, and the wafer is divided.

After that, the frame unit is taken out from the laser processing device, and the adhesive tape is subjected to a treatment such as irradiating ultraviolet rays to reduce the adhesive strength of the adhesive tape and pick up the device chip. As a processing apparatus having high production efficiency of device chips, there is known a processing apparatus capable of continuously dividing a wafer and irradiating an adhesive tape with ultraviolet rays with one apparatus (see Patent Document 2). The device chip picked up from the adhesive tape is mounted on a predetermined wiring board or the like.

Japanese Unexamined Patent Publication No. 10-305420 Japanese Patent No. 3076179

The adhesive tape includes, for example, a base material layer formed of a vinyl chloride sheet or the like, and a glue layer disposed on the base material layer. In the laser processing apparatus, in order to reliably divide the wafer by ablation processing, the laser beam is applied to the wafer under the condition that the dividing groove from the front surface to the back surface of the wafer can be reliably formed. Therefore, below and around the formed dividing groove, the glue layer of the adhesive tape melts due to the thermal effect of the irradiation of the laser beam, and a part of the glue layer is formed on the back surface side of the device chip formed from the wafer. Stick.

In this case, even if the adhesive tape is irradiated with ultraviolet rays when the device chip is picked up from the adhesive tape, the part of the glue layer remains on the back surface side of the picked up device chip. .. Therefore, deterioration of the quality of the device chip becomes a problem.

The present invention has been made in view of the above problems, and an object of the present invention is that the glue layer does not adhere to the back surface side of the device chip to be formed, and the quality derived from the adhesion of the glue layer to the device chip. It is to provide a method of processing a wafer which does not cause deterioration.

According to one aspect of the present invention, a plurality of devices are a method for processing a wafer in which a wafer formed in each region of a surface partitioned by a planned division line is divided into individual device chips, and the wafer is accommodated. A polyester-based sheet disposing step of positioning a wafer in the opening of a frame having an opening and disposing a polyester-based sheet on the back surface of the wafer and the outer periphery of the frame, and heating and pressing the polyester-based sheet. An integration step of integrating the wafer and the frame via the polyester sheet, and irradiating the wafer with a laser beam having a wavelength capable of absorbing the wafer along the planned division line to form a division groove. In the dividing step of forming the wafer and dividing the wafer into individual device chips, and in individual regions corresponding to each device chip of the polyester-based sheet, ultrasonic waves are applied to the polyester-based sheet to the polyester-based sheet side. Provided is a method for processing a wafer, which comprises a pick-up step of pushing up the device chip from the wafer and picking up the device chip from the polyester-based sheet.

Further, preferably, in the integration step, after the integration is performed, the polyester-based sheet protruding from the outer periphery of the frame is removed.

Also, preferably, in the pickup step, the polyester-based sheet is expanded to widen the distance between each device chip.

Further, preferably, the polyester-based sheet is either a polyethylene terephthalate sheet or a polyethylene naphthalate sheet.

Further, preferably, in the integration step, the heating temperature is 250 ° C. to 270 ° C. when the polyester-based sheet is the polyethylene terephthalate sheet, and heating is performed when the polyester-based sheet is the polyethylene naphthalate sheet. The temperature is 160 ° C to 180 ° C.

Further, preferably, the wafer is composed of any of Si, GaN, GaAs, and glass.

In the method for processing a wafer according to one aspect of the present invention, when forming the frame unit, the frame and the wafer are formed by using a polyester-based sheet having no glue layer without using an adhesive tape having a glue layer. Integrate. The integration step of integrating the frame and the wafer via the polyester-based sheet is realized by heating and pressing.

After the integration step is performed, the wafer is irradiated with a laser beam having a wavelength that is absorbent to the wafer, and a dividing groove is formed along the planned division line by ablation to divide the wafer. Then, in each region of the polyester-based sheet corresponding to each device chip, ultrasonic waves are applied to the polyester-based sheet, the device chip is pushed up from the polyester-based sheet side, and the device chip is picked up from the polyester-based sheet. Each of the picked-up device chips is mounted on a predetermined mounting target. If ultrasonic waves are applied to the polyester-based sheet at the time of pickup, the polyester-based sheet can be easily peeled off, so that the load on the device chip can be reduced.

When the wafer is ablated, the heat generated by the irradiation of the laser beam is transferred to the polyester-based sheet below or near the dividing groove. However, since the polyester-based sheet does not have a glue layer, the glue layer does not melt and stick to the back surface side of the device chip.

That is, according to one aspect of the present invention, since the frame unit can be formed by using a polyester-based sheet without a glue layer, an adhesive tape having a glue layer is unnecessary, and as a result, a device caused by adhesion of the glue layer. There is no deterioration in chip quality.

Therefore, according to one aspect of the present invention, there is provided a method for processing a wafer in which the glue layer does not adhere to the back surface side of the formed device chip and the quality does not deteriorate due to the adhesion of the glue layer to the device chip. ..

It is a perspective view which shows typically the wafer. It is a perspective view which shows typically the state of positioning a wafer and a frame on the holding surface of a chuck table. It is a perspective view which shows typically the polyester-based sheet arrangement process. It is a perspective view which shows an example of the integration process typically. FIG. 5A is a perspective view schematically showing how the polyester-based sheet is cut, and FIG. 5B is a perspective view schematically showing the formed frame unit. It is a perspective view which shows typically the division process. It is a perspective view which shows typically the carry-in of a frame unit into a pickup device. FIG. 8A is a cross-sectional view schematically showing a frame unit fixed on a frame support base, and FIG. 8B is a cross-sectional view schematically showing a pickup process.

An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. First, a wafer processed by the wafer processing method according to the present embodiment will be described. FIG. 1 is a perspective view schematically showing the wafer 1.

The wafer 1 is, for example, a material such as Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or other semiconductor, or a material such as sapphire, glass, or quartz. It is a substantially disk-shaped substrate made of. The glass is, for example, alkaline glass, non-alkali glass, soda-lime glass, lead glass, borosilicate glass, quartz glass and the like.

The surface 1a of the wafer 1 is partitioned by a plurality of scheduled division lines 3 arranged in a grid pattern. Further, devices 5 such as ICs, LSIs, and LEDs are formed in each region of the surface 1a of the wafer 1 divided by the planned division lines 3. In the processing method of the wafer 1 according to the present embodiment, the wafer 1 is divided by forming a dividing groove along the scheduled division line 3 on the wafer 1 by ablation processing to form individual device chips.

Before the wafer 1 is carried into the laser processing apparatus 8 (see FIG. 6) in which the ablation processing is performed, the wafer 1, the polyester-based sheet, and the frame are integrated to form a frame unit. The wafer 1 is carried into a laser processing apparatus in the state of a frame unit and processed. The individual device chips formed are supported by a polyester-based sheet. After that, the space between the device chips is widened by expanding the polyester-based sheet, and the device chips are picked up by the pickup device.

The annular frame 7 (see FIG. 2 and the like) is made of, for example, a material such as metal and includes an opening 7a having a diameter larger than the diameter of the wafer 1. When forming the frame unit, the wafer 1 is positioned in the opening 7a of the frame 7 and is accommodated in the opening 7a.

The polyester-based sheet 9 (see FIG. 3 and the like) is a flexible resin-based sheet, and the front and back surfaces are flat. The polyester sheet 9 has a diameter larger than the outer diameter of the frame 7 and does not have a glue layer. The polyester-based sheet 9 is a polymer sheet synthesized by using a dicarboxylic acid (a compound having two carboxyl groups) and a diol (a compound having two hydroxyl groups) as monomers, and is, for example, a polyethylene terephthalate sheet or a polyethylene terephthalate sheet. , Polyethylene naphthalate sheet, etc. A sheet that is transparent or translucent to visible light. However, the polyester-based sheet 9 is not limited to this, and may be opaque.

Since the polyester-based sheet 9 does not have adhesiveness, it cannot be attached to the wafer 1 and the frame 7 at room temperature. However, since the polyester-based sheet 9 has thermoplasticity, when it is heated to a temperature near the melting point in a state where it is bonded to the wafer 1 and the frame 7 while being pressed by applying a predetermined pressure, it partially melts and the wafer 1 and the wafer 1 and the frame 7 are bonded to each other. Can be adhered to the frame 7. Therefore, in the wafer 1 processing method according to the present embodiment, the wafer 1, the frame 7, and the polyester-based sheet 9 are integrated to form a frame unit by heating and pressing as described above.

Next, each step of the wafer 1 processing method according to the present embodiment will be described. First, a polyester-based sheet disposing step is carried out in preparation for integrating the wafer 1, the polyester-based sheet 9, and the frame 7. FIG. 2 is a perspective view schematically showing how the wafer 1 and the frame 7 are positioned on the holding surface 2a of the chuck table 2. As shown in FIG. 2, the polyester-based sheet arrangement step is carried out on a chuck table 2 having a holding surface 2a on the upper portion.

The chuck table 2 is provided with a porous member having a diameter larger than the outer diameter of the frame 7 in the center of the upper portion. The upper surface of the porous member is the holding surface 2a of the chuck table 2. As shown in FIG. 3, the chuck table 2 has an exhaust path inside which one end leads to the porous member, and a suction source 2b is arranged on the other end side of the exhaust path. The exhaust passage is provided with a switching portion 2c for switching between a communicating state and a disconnected state, and when the switching portion 2c is in the communicating state, a negative force generated by the suction source 2b on the object to be held placed on the holding surface 2a. Pressure acts to suck and hold the object to be held on the chuck table 2.

In the polyester-based sheet disposing step, first, as shown in FIG. 2, the wafer 1 and the frame 7 are placed on the holding surface 2a of the chuck table 2. At this time, the surface 1a side of the wafer 1 is directed downward, and the wafer 1 is positioned in the opening 7a of the frame 7. Next, the polyester-based sheet 9 is arranged on the back surface 1b of the wafer 1 and the outer periphery of the frame 7. FIG. 3 is a perspective view schematically showing a polyester-based sheet arrangement process. As shown in FIG. 3, a polyester-based sheet 9 is arranged on both the wafer 1 and the frame 7 so as to cover them.

In the polyester sheet disposing step, a polyester sheet 9 having a diameter larger than that of the holding surface 2a of the chuck table 2 is used. When the negative pressure of the chuck table 2 is applied to the polyester sheet 9 in the integration step to be performed later, if the entire holding surface 2a is not covered by the polyester sheet 9, the negative pressure leaks from the gap. This is because pressure cannot be appropriately applied to the polyester-based sheet 9.

In the processing method of the wafer 1 according to the present embodiment, next, an integration step of heating and pressing the polyester-based sheet 9 to integrate the wafer 1 and the frame 7 via the polyester-based sheet 9 is performed. .. FIG. 4 is a perspective view schematically showing an example of the integration process. In FIG. 4, what can be visually recognized through the polyester-based sheet 9 which is transparent or translucent with respect to visible light is shown by a broken line.

In the integration step, first, the switching portion 2c of the chuck table 2 is operated to connect the suction source 2b to the porous member on the upper part of the chuck table 2, and the negative pressure generated by the suction source 2b is applied to the polyester sheet 9. Make it work. Then, the polyester-based sheet 9 comes into close contact with the wafer 1 and the frame 7 due to the atmospheric pressure.

Next, the polyester-based sheet 9 is heated and further pressed to perform thermocompression bonding. As shown in FIG. 4, the heating and pressing of the polyester-based sheet 9 is carried out using a heat roller 4 having a heat source inside.

The heat roller 4 is heated to a predetermined temperature, and the heat roller 4 is placed on one end of the holding surface 2a of the chuck table 2. Then, the heat roller 4 is rotated, and the heat roller 4 is rolled on the chuck table 2 from one end to the other end. Then, the polyester-based sheet 9 is thermocompression bonded to the wafer 1 and the frame 7. At this time, a force is applied in the direction of pushing down the polyester sheet 9 by the heat roller 4, and thermocompression bonding is performed at a pressure higher than the atmospheric pressure. It is preferable to coat the surface of the heat roller 4 with a fluororesin.

Further, the polyester sheet 9 may be heated and pressed by using an iron-shaped pressing member having a heat source inside and having a flat bottom plate instead of the heat roller 4. In this case, the pressing member is heated to a predetermined temperature to form a hot plate, and the polyester-based sheet 9 held on the chuck table 2 is pressed from above by the pressing member.

After the polyester-based sheet 9 is thermocompression-bonded, the switching portion 2c is operated to release the communication state between the porous member of the chuck table 2 and the suction source 2b, and the suction by the chuck table 2 is released.

Next, the polyester-based sheet 9 protruding from the outer periphery of the frame 7 is cut and removed. FIG. 5A is a perspective view schematically showing how the polyester-based sheet 9 is cut. As shown in FIG. 5A, an annular cutter 6 is used for cutting. The cutter 6 has a through hole and is rotatable around a rotation axis pierced through the through hole.

First, the annular cutter 6 is positioned above the frame 7. At this time, the rotation axis of the cutter 6 is aligned with the radial direction of the chuck table 2. Next, the cutter 6 is lowered to sandwich the polyester-based sheet 9 between the frame 7 and the cutter 6, and the polyester-based sheet 9 is cut. Then, a cutting mark 9a is formed on the polyester sheet 9.

Further, the cutter 6 is made to go around the opening 7a of the frame 7 along the frame 7, and the cut marks 9a surround a predetermined region of the polyester sheet 9. Then, the polyester-based sheet 9 in the region on the outer peripheral side of the cut mark 9a is removed so as to leave the region of the polyester-based sheet 9. Then, the unnecessary portion of the polyester-based sheet 9 can be removed including the region protruding from the outer periphery of the frame 7.

An ultrasonic cutter may be used for cutting the polyester-based sheet, or a vibration source that vibrates the above-mentioned annular cutter 6 at a frequency in the ultrasonic band may be connected to the cutter 6. Further, when cutting the polyester-based sheet 9, the polyester-based sheet 9 may be cooled and cured in order to facilitate cutting. As described above, the frame unit 11 in which the wafer 1 and the frame 7 are integrated via the polyester-based sheet 9 is formed. FIG. 5B is a perspective view schematically showing the formed frame unit 11.

When carrying out the integration step, the polyester-based sheet 9 is preferably heated to a temperature equal to or lower than its melting point. This is because if the heating temperature exceeds the melting point, the polyester-based sheet 9 may melt and the shape of the sheet may not be maintained. Further, the polyester-based sheet 9 is preferably heated to a temperature equal to or higher than its softening point. This is because the integration process cannot be properly performed unless the heating temperature reaches the softening point. That is, the polyester-based sheet 9 is preferably heated to a temperature above its softening point and below its melting point.

Furthermore, some polyester-based sheets 9 may not have a clear softening point. Therefore, when carrying out the integration step, the polyester-based sheet 9 is preferably heated to a temperature 20 ° C. lower than its melting point and lower than its melting point.

When the polyester-based sheet 9 is a polyethylene terephthalate sheet, the heating temperature is preferably 250 ° C to 270 ° C. When the polyester-based sheet 9 is a polyethylene naphthalate sheet, the heating temperature is preferably 160 ° C. to 180 ° C.

Here, the heating temperature refers to the temperature of the polyester-based sheet 9 when the integration step is carried out. For example, a model in which the output temperature can be set is put into practical use as a heat source such as a heat roller 4, but even if the polyester sheet 9 is heated using the heat source, the temperature of the polyester sheet 9 is set. It may not reach the output temperature. Therefore, in order to heat the polyester-based sheet 9 to a predetermined temperature, the output temperature of the heat source may be set higher than the melting point of the polyester-based sheet 9.

Next, in the wafer processing method according to the present embodiment, the wafer 1 in the state of the frame unit 11 is ablated to form a dividing groove along the planned division line 3 to divide the wafer 1. Carry out the process. The dividing step is carried out, for example, by the laser processing apparatus shown in FIG. FIG. 6 is a perspective view schematically showing the division process.

The laser processing apparatus 8 includes a laser processing unit 10 that ablates the wafer 1 and a chuck table (not shown) that holds the wafer 1. The laser processing unit 10 includes a laser oscillator (not shown) capable of oscillating a laser, and can emit a laser beam 12 having a wavelength (wavelength that the wafer 1 can absorb) having absorbency with respect to the wafer 1. The chuck table can be moved (processed and fed) along a direction parallel to the upper surface.

The laser processing unit 10 irradiates the wafer 1 held on the chuck table with the laser beam 12 emitted from the laser oscillator. The processing head 10a included in the laser processing unit 10 has a mechanism for condensing the laser beam 12 at a predetermined height position on the wafer 1.

When the wafer 1 is ablated, the frame unit 11 is placed on the chuck table, and the wafer 1 is held by the chuck table via the polyester sheet 9. Then, the chuck table is rotated to align the scheduled division line 3 of the wafer 1 with the processing feed direction of the laser processing apparatus 8. Further, the relative positions of the chuck table and the laser processing unit 10 are adjusted so that the processing head 10a is arranged above the extension line of the scheduled division line 3.

Next, while irradiating the wafer 1 with the laser beam 12 from the laser processing unit 10, the chuck table and the laser processing unit 10 are relatively moved along the processing feed direction parallel to the upper surface of the chuck table. Then, the laser beam 12 is irradiated to the wafer 1 along the scheduled division line 3, and the dividing groove 3a along the scheduled division line 3 is formed on the wafer 1 by ablation.

The irradiation conditions of the laser beam 12 in the dividing step are set as follows, for example. However, the irradiation conditions of the laser beam 12 are not limited to this.
Wavelength: 355 nm
Repeat frequency: 50kHz
Average output: 5W
Feed rate: 200 mm / sec

After performing ablation processing along one scheduled division line 3, the chuck table and the laser processing unit 10 are moved relative to the indexing feed direction perpendicular to the processing feed direction, and along the other scheduled division lines 3. Similarly, the wafer 1 is ablated. After forming the split groove 3a along all the scheduled split lines 3 along one direction, the chuck table is rotated around the axis perpendicular to the holding surface and along the scheduled split lines 3 along the other direction. Similarly, the wafer 1 is ablated.

When the wafer 1 is ablated along all the planned division lines 3 of the wafer 1, the division process is completed. When the dividing step is completed and the dividing grooves 3a from the front surface 1a to the back surface 1b are formed on the wafer 1 along all the scheduled division lines 3, the wafer 1 is divided and individual device chips are formed.

When the wafer 1 is ablated by the laser processing unit 10, processing debris derived from the wafer 1 is generated from the irradiated portion of the laser beam 12, and the processing debris is scattered around the irradiated portion of the wafer 1. It adheres to the surface 1a. Even if the surface 1a of the wafer 1 is cleaned by the cleaning unit described later after the wafer 1 is ablated, it is not easy to completely remove the adhering processing chips. If the work chips remain on the device chip formed from the wafer 1, the quality of the device chip deteriorates.

Therefore, the surface 1a of the wafer 1 to be ablated by the laser processing apparatus 8 may be previously coated with a water-soluble liquid resin that functions as a protective film that protects the surface 1a of the wafer 1. When the liquid resin is applied to the surface 1a of the wafer 1, the processing chips scattered when performing the ablation processing adhere to the upper surface of the liquid resin, so that the processing chips do not directly adhere to the surface 1a of the wafer 1. .. Then, the processing waste is removed together with the liquid resin by the cleaning unit described below.

The laser processing apparatus 8 may include a cleaning unit (not shown). In this case, the wafer 1 ablated by the laser processing unit 10 is conveyed to the cleaning unit and cleaned by the cleaning unit. For example, the cleaning unit includes a cleaning table that holds the frame unit 11 and a cleaning water supply nozzle that can reciprocate above the frame unit 11.

The cleaning table is rotated around an axis perpendicular to the holding surface, and while supplying cleaning liquid such as pure water from the cleaning water supply nozzle to the wafer 1, the cleaning water supply nozzle is horizontal in a path passing above the center of the holding surface. By reciprocating in the direction, the surface 1a side of the wafer 1 can be cleaned.

In the wafer 1 processing method according to the present embodiment, a pickup step of picking up the individual device chips from the polyester-based sheet 9 is then carried out. In the pickup process, the pickup device 14 shown in the lower part of FIG. 7 is used. FIG. 7 is a perspective view schematically showing the loading of the frame unit 11 into the pickup device 14.

The pickup device 14 includes a cylindrical drum 16 having a diameter larger than the diameter of the wafer 1 and a frame holding unit 18 including a frame support 22. The frame support base 22 of the frame holding unit 18 has an opening having a diameter larger than the diameter of the drum 16, is arranged at the same height as the upper end of the drum 16, and the upper end of the drum 16 is on the outer peripheral side. Surround from.

A clamp 20 is arranged on the outer peripheral side of the frame support base 22. When the frame unit 11 is placed on the frame support base 22 and the frame 7 of the frame unit 11 is gripped by the clamp 20, the frame unit 11 is fixed to the frame support base 22.

The frame support base 22 is supported by a plurality of rods 24 extending in the vertical direction, and an air cylinder 26 for raising and lowering the rods 24 is arranged at the lower end of each rod 24. The plurality of air cylinders 26 are supported by a disc-shaped base 28. When each air cylinder 26 is operated, the frame support base 22 is pulled down with respect to the drum 16.

Inside the drum 16, a push-up mechanism 30 for pushing up the device chip supported by the polyester-based sheet 9 from below is arranged. The push-up mechanism 30 includes, for example, an ultrasonic vibrator 30a made of piezoelectric ceramics such as lead zirconate titanate (PZT), barium titanate, lead titanate, or a crystal oscillator at the upper end. Further, a collet 32 (see FIG. 8B) capable of sucking and holding the device chip is arranged above the drum 16. The push-up mechanism 30 and the collet 32 are movable in the horizontal direction along the upper surface of the frame support base 22. Further, the collet 32 is connected to the suction source 32a (see FIG. 8B) via the switching portion 32b (see FIG. 8B).

In the pickup process, first, the height of the frame support 22 is adjusted by operating the air cylinder 26 so that the height of the upper end of the drum 16 of the pickup device 14 and the height of the upper surface of the frame support 22 match. To do. Next, the frame unit 11 carried out from the laser processing device 8 is placed on the drum 16 and the frame support 22 of the pickup device 14.

After that, the frame 7 of the frame unit 11 is fixed on the frame support 22 by the clamp 20. FIG. 8A is a cross-sectional view schematically showing the frame unit 11 fixed on the frame support base 22. A dividing groove 3a is formed and divided in the wafer 1 by a dividing step.

Next, the air cylinder 26 is operated to pull down the frame support base 22 of the frame holding unit 18 with respect to the drum 16. Then, as shown in FIG. 8B, the polyester-based sheet 9 is expanded in the outer peripheral direction. FIG. 8B is a cross-sectional view schematically showing the pickup process.

When the polyester-based sheet 9 is expanded in the outer peripheral direction, the distance between the device chips 1c supported by the polyester-based sheet 9 is widened. Then, the device chips 1c are less likely to come into contact with each other, and the individual device chips 1c can be easily picked up. Then, the device chip 1c to be picked up is determined, the push-up mechanism 30 is moved below the device chip 1c, and the collet 32 is moved above the device chip 1c.

After that, the ultrasonic vibrator 30a is operated to generate vibration at a frequency in the ultrasonic band, and the ultrasonic vibrator 30a is brought into contact with the region corresponding to the device chip 1c of the polyester-based sheet 9 to generate ultrasonic waves in the region. Is given. Further, the push-up mechanism 30 is operated to push up the device chip 1c from the polyester-based sheet 9 side. Then, the switching portion 32b is operated to communicate the collet 32 with the suction source 32a. Then, the device chip 1c is sucked and held by the collet 32, and the device chip 1c is picked up from the polyester-based sheet 9. The individual device chips 1c picked up are then mounted on a predetermined wiring board or the like for use.

When ultrasonic waves are applied to the region of the polyester-based sheet 9 by the ultrasonic vibrator 30a, the polyester-based sheet 9 can be easily peeled off. Therefore, the load applied to the device chip at the time of peeling from the polyester-based sheet 9 is reduced.

For example, when the frame unit 11 is formed using the adhesive tape, the heat generated by the irradiation of the laser beam 12 in the dividing step is transferred to the adhesive tape, and the glue layer of the adhesive tape is melted and fixed to the back surface side of the device chip. To do. Then, the deterioration of the quality of the device chip due to the adhesion of the glue layer becomes a problem.

On the other hand, according to the wafer processing method according to the present embodiment, it is possible to form a frame unit using a polyester-based sheet that does not have a glue layer by thermocompression bonding, so that an adhesive tape having a glue layer is unnecessary. Is. As a result, the quality of the device chip does not deteriorate due to the adhesion of the glue layer to the back surface side.

The present invention is not limited to the description of the above embodiment, and can be implemented with various modifications. For example, in the above embodiment, the case where the polyester-based sheet 9 is, for example, a polyethylene terephthalate sheet or a polyethylene naphthalate sheet has been described, but one aspect of the present invention is not limited thereto. For example, as the polyester-based sheet, other materials may be used, and polytrimethylene terephthalate sheet, polybutylene terephthalate sheet, polybutylene naphthalate sheet, and the like may be used.

In addition, the structure, method, etc. according to the above-described embodiment can be appropriately modified and implemented as long as the scope of the object of the present invention is not deviated.

1 Wafer 1a Front surface 1b Back surface 3 Scheduled division line 3a Division groove 5 Device 7 Frame 7a Opening 9 Polyester sheet 9a Cutting mark 11 Frame unit 2 Chuck table 2a Holding surface 2b, 32a Suction source 2c, 32b Switching part 4 Heat roller 6 Cutter 8 Laser processing equipment 10 Laser processing unit 10a Processing head 12 Laser beam 14 Pickup equipment 16 Drum 18 Frame holding unit 20 Clamp 22 Frame support 24 Rod 26 Air cylinder 28 Base 30 Push-up mechanism 30a Ultrasonic oscillator 32 Collet

Claims (6)

A method of processing a wafer in which a plurality of devices divide a wafer formed in each region of a surface partitioned by a planned division line into individual device chips.
A polyester-based sheet arranging step of locating a wafer in the opening of a frame having an opening for accommodating a wafer and arranging a polyester-based sheet on the back surface of the wafer and the outer periphery of the frame.
An integration step of heating and pressing the polyester-based sheet to integrate the wafer and the frame via the polyester-based sheet.
A division step of irradiating the wafer with a laser beam having a wavelength capable of absorbing the wafer along the planned division line to form a division groove and dividing the wafer into individual device chips.
In the individual region corresponding to each device chip of the polyester-based sheet, ultrasonic waves are applied to the polyester-based sheet, the device chip is pushed up from the polyester-based sheet side, and the device chip is picked up from the polyester-based sheet. Pickup process and
A method for processing a wafer, which comprises. The method for processing a wafer according to claim 1, wherein in the integration step, after the integration is performed, the polyester-based sheet protruding from the outer periphery of the frame is removed. The wafer processing method according to claim 1, wherein in the pickup step, the polyester-based sheet is expanded to widen the distance between each device chip. The method for processing a wafer according to claim 1, wherein the polyester-based sheet is either a polyethylene terephthalate sheet or a polyethylene naphthalate sheet. In the integration step, the heating temperature is 250 ° C. to 270 ° C. when the polyester-based sheet is the polyethylene terephthalate sheet, and the heating temperature is 160 ° C. to 270 ° C. when the polyester-based sheet is the polyethylene naphthalate sheet. The method for processing a wafer according to claim 4, wherein the temperature is 180 ° C. The wafer processing method according to claim 1, wherein the wafer is composed of any of Si, GaN, GaAs, and glass.

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