JP2020129493A - Conductive device, antenna device, and method for manufacturing conductive device - Google Patents

Abstract

To provide a conductive device, an antenna device, and a method for manufacturing a conductive device which are capable of improving form accuracy of a conductive portion.SOLUTION: A conductive device 1 comprises a substrate 2 and a conductive portion 3. The conductive portion 3 is formed on the substrate 2. The conductive portion 3 has a conductive part 4. The conductive part 4 is formed on the substrate 2, and includes conductive particles and an organic binder. On the substrate 2, grooves 23 which overlap the conductive portion 3 in a plan view from a thickness direction D1 of the substrate 2 are formed along edges 33 of the conductive portion 3. In a plan view from the thickness direction D1 of the substrate 2, the edges 33 of the conductive portion 3 and an opening edge 231 closer to the edges 33 of the conductive portion 3 of a pair of opening edges 231, 232 in a width direction D2 of the grooves 23 are overlapped. The conductive portion 3 has protrusions 32 penetrated into the grooves 23.SELECTED DRAWING: Figure 1

Description

The present disclosure generally relates to a conductive device, an antenna device, and a method of manufacturing a conductive device, and more specifically, a conductive device including a substrate and a conductive portion, an antenna device including the conductive device, and a substrate and a conductive portion. The present invention relates to a method for manufacturing a conductive device including:

Conventionally, as a conductive device, for example, an electrode having a base material (substrate) and a conductive portion formed on the base material, wherein the conductive portion is a thermoplastic resin, a thermosetting resin, a curing agent, An electrode composed of a conductive composition containing a metal particle and a metal particle is known (Patent Document 1).

JP, 2013-164990, A

In a conductive device including a substrate and a conductive portion including conductive particles and an organic binder, the conductive portion sometimes protrudes from a desired region in a plan view from the thickness direction of the substrate.

An object of the present disclosure is to provide a conductive device, an antenna device, and a method for manufacturing a conductive device that can improve the shape accuracy of a conductive portion.

A conductive device according to one aspect of the present disclosure includes a substrate and a conductive portion. The conductive portion is formed on the substrate. The conductive portion has a conductive portion. The conductive portion is formed on the substrate and includes conductive particles and an organic binder. The substrate is formed with a groove that overlaps with the conductive portion and is along the edge of the conductive portion when seen in a plan view from the thickness direction of the substrate. When seen in a plan view from the thickness direction of the substrate, the edge of the conductive portion and an opening edge of the pair of opening edges in the width direction of the groove close to the edge of the conductive portion overlap each other. There is. The conductive portion has a protrusion that extends into the groove.

An antenna device according to an aspect of the present disclosure includes the conductive device.

A method for manufacturing a conductive device according to an aspect of the present disclosure is a method for manufacturing the conductive device according to the above aspect. In this method for manufacturing a conductive device, a substrate preparing step of preparing a substrate having the groove, and a conductive paste containing the conductive particles, the organic binder, and a solvent in a region where the conductive portion is to be formed on the substrate. A coating step of coating and a thermosetting step of heating the conductive paste to form the conductive portion are provided.

In the conductive device, the antenna device, and the method of manufacturing the conductive device according to the present disclosure, it is possible to improve the shape accuracy of the conductive portion.

1 is a cross-sectional view of a conductive device according to a first embodiment, which is orthogonal to a longitudinal direction of a conductive portion. FIG. 2 is a partially cutaway perspective view of the above conductive device. FIG. 3 is a cross-sectional view of the conductive device of the above, which is orthogonal to the width direction of the conductive portion. FIG. 4 is a partially cutaway plan view of a substrate prepared in the above-described method for manufacturing a conductive device. FIG. 5A is an explanatory diagram of a step of applying a conductive paste in the above-described method for manufacturing a conductive device. FIG. 5B is an explanatory diagram of a step of forming a conductive portion in the above-described method for manufacturing a conductive device. FIG. 6 is an explanatory diagram of a step of applying a conductive ink in the above-described method for manufacturing a conductive device. FIG. 7 is a plan view of an antenna device including the above conductive device. FIG. 8: is sectional drawing of the film insert molded product provided with the electrically conductive device same as the above. FIG. 9 is a cross-sectional view of a radio device including the above conductive device. FIG. 10 is a plan view of a conductive device according to a modified example of the first embodiment. FIG. 11 is a cross-sectional view of the conductive device according to the second embodiment, which is orthogonal to the longitudinal direction of the conductive portion. FIG. 12 is a cross-sectional view of the conductive device according to the third embodiment, which is orthogonal to the longitudinal direction of the conductive portion.

1 to 12 described in the following embodiments and the like are schematic views, and the ratio of the size and thickness of each component in the drawings does not always reflect the actual dimensional ratio. Absent.

(Embodiment 1)
(1) Overview Hereinafter, the conductive device 1 according to the first embodiment will be described with reference to FIGS.

The conductive device 1 includes a substrate 2 and a conductive portion 3. The conductive portion 3 is formed on the substrate 2. The conductive portion 3 is formed so as to overlap a part of the substrate 2 in the thickness direction D1 of the substrate 2. The conductive portion 3 has a conductive portion 4. In addition, the conductive portion 3 further includes a low resistance conductive layer 5. In addition, the conductive device 1 further includes a protective sheet 7. The protective sheet 7 is laminated on the substrate 2 so as to cover the conductive portion 3.

(2) Each Component of Conductive Device Next, each component of the conductive device 1 will be described with reference to the drawings.

(2.1) Substrate The substrate 2 has a first main surface 21 and a second main surface 22 opposite to the first main surface 21.

The substrate 2 is, for example, a flexible substrate and has flexibility. The thickness of the substrate 2 is, for example, 30 μm or more and 200 μm or less, and is 50 μm as an example. The substrate 2 is, for example, a plastic film. The plastic film is a polyethylene terephthalate film, but is not limited to this, and may be, for example, an ABS film, a polyethylene naphthalate film, a polyether sulfone film, a polycarbonate film, a polyester film, or the like. The substrate 2 is not limited to a plastic film, and may be, for example, an inorganic substrate. The inorganic substrate is, for example, a glass substrate, a piezoelectric substrate, or the like.

In the substrate 2, a plurality of grooves 20 (see FIG. 4) are formed on the first main surface 21. The plurality of grooves 20 are arranged at equal intervals, for example, but the present invention is not limited to this, and they may be arranged at unequal intervals, for example. The depth DP1 of the groove 20 is, for example, 5 μm to 10 μm. The opening width H1 of the groove 20 in the width direction is, for example, 5 μm to 10 μm. The distance L1 between the adjacent grooves 20 is, for example, 10 μm to 30 μm. The lengths of the plurality of grooves 20 may be the same or different. Further, the plurality of grooves 20 are linear, but not limited to this, and may be, for example, curved or annular. Further, each of the plurality of grooves 20 is a U-shaped groove in the cross-sectional view of the substrate 2 orthogonal to the longitudinal direction of the groove 20, but the present invention is not limited to this, and for example, a V-shaped groove in the cross-sectional view of the substrate 2 is provided. It may be a groove.

The plurality of grooves 20 include a groove 23 (hereinafter, also referred to as a first groove 23) that overlaps the conductive portion 3 and is along the edge 33 of the conductive portion 3 in a plan view from the thickness direction D1 of the substrate 2. The first groove 23 is formed along the edge 33 of the conductive portion 3. The formation position of the first groove 23 is, for example, in plan view from the thickness direction D1 of the substrate 2, the edge 33 of the conductive portion 3 and the pair of opening edges 231 and 232 of the first groove 23 in the width direction D2. Of these, the opening edge 231 near the edge 33 of the conductive portion 3 is defined to overlap.

The plurality of grooves 20 are formed in a portion overlapping with a portion inside the edge 33 of the conductive portion 3 in a plan view from the thickness direction D1 of the substrate 2 (hereinafter, also referred to as the second groove 25). Including). The second groove 25 extends along the same direction as the first groove 23 in a plan view from the thickness direction D1 of the substrate 2. Here, the second groove 25 is, for example, parallel to the first groove 23 in a plan view from the thickness direction D1 of the substrate 2. In addition, the plurality of grooves 20 include a groove 24 (hereinafter, also referred to as a third groove 24) that overlaps the conductive portion 4 and is along the edge 43 of the conductive portion 4 in a plan view from the thickness direction D1 of the substrate 2. The third groove 24 is included in the plurality of second grooves 25. The formation position of the third groove 24 is, for example, in plan view from the thickness direction D1 of the substrate 2, the outer circumference of the edge 43 of the conductive portion 4 and the pair of opening edges 241 and 242 in the width direction of the third groove 24. Of these, the opening edge 241 close to the edge 43 of the conductive portion 4 is defined to overlap.

Further, the plurality of grooves 20 include a plurality of recesses 26 formed in a region where only the protective sheet 7 overlaps with the protective sheet 7 and the conductive portion 3 in a plan view from the thickness direction D1 of the substrate 2.

Note that it is not essential that the plurality of grooves 20 be formed in the substrate 2 in the conductive device 1, and in the conductive device 1, at least the groove 23 of the plurality of grooves 20 may be formed in the substrate 2.

The substrate 2 is formed by using the imprint method, but not limited to this, and may be formed by, for example, a molding method.

(2.2) Conductive Part The conductive part 3 is formed on the substrate 2 and is in close contact with the substrate 2. The conductive portion 3 has a conductive portion 4 and a low resistance conductive layer 5. The conductive portion 3 has, for example, a line shape in a plan view from the thickness direction D1 of the substrate 2. Here, the shape of the conductive portion 3 is semicircular in a cross section orthogonal to the length direction of the conductive portion 3.

The conductive portion 4 is formed on the substrate 2. The shape of the conductive portion 4 is, for example, a line shape that is narrower than the conductive portion 3 in a plan view from the thickness direction D1 of the substrate 2. Here, the conductive portion 4 has a semicircular shape in a cross section orthogonal to the lengthwise direction of the conductive portion 4.

The conductive portion 4 has elasticity. Here, the conductive part 4 has elasticity compared with, for example, a copper foil, a plating layer, or the like. The conductive portion 4 is formed by using the conductive paste 400 (see FIG. 5A). The conductive portion 4 includes conductive particles 410 (see FIG. 3) and an organic binder 420 (see FIG. 3). The conductive particles 410 are metal particles, but are not limited thereto, and may be metal compound particles or the like, for example. The conductive paste 400 is, for example, a silver paste, but is not limited to this, and may be, for example, a copper paste or the like. When the conductive paste 400 is a silver paste, the conductive particles 410 are, for example, silver particles. When the conductive paste 400 is a copper paste, the conductive particles 410 are copper particles.

The shape of the conductive particles 410 is, for example, a scaly shape, but is not limited to this and may be, for example, a spherical shape. The average particle size of the conductive particles 410 is, for example, 1 μm to 4 μm. The average particle diameter of the conductive particles 410 is, for example, a cross section SEM obtained by observing a cross section of a sample obtained by cutting the conductive portion 4 along the thickness direction D1 of the substrate 2 by, for example, a scanning electron microscope (SEM). This is a value calculated using the particle size value of the conductive particles 410 obtained by acquiring the image and performing image processing on the cross-sectional SEM image. The “particle size value” is the diameter of a circle having the same area as the area of the conductive particles 410 obtained from the cross-sectional SEM image, and the “average particle size” is a predetermined number (for example, 50) of the conductive particles 410. Is the average value of the particle size values of. In discussing the relative size relationship of the average particle size, the average particle size is not limited to the above-mentioned average value, and may be, for example, the median size (d ₅₀ ) obtained from the number-based particle size distribution curve. The number-based particle size distribution curve is obtained by measuring the particle size distribution by an image imaging method. Specifically, the number-based particle size distribution curve is a curve obtained from the size (biaxial average diameter) and the number of the conductive particles 410 obtained by image-processing the above SEM image. In the number-based particle size distribution curve, the particle size value when the integrated value is 50% is called the median diameter (d ₅₀ ).

Examples of the organic binder 420 include acrylic resin, polyethylene, polypropylene, polyethylene terephthalate, polymethyl methacrylate, polystyrene, polyether sulfone, polyarylate, polycarbonate resin, polyurethane, polyacrylonitrile, polyvinyl acetal, polyamide, polyimide, diacryl phthalate. It is a resin, a cellulosic resin, polyvinyl chloride, polyvinylidene chloride, polyvinyl acetate, another thermoplastic resin, or a copolymer of two or more kinds of monomers constituting these resins.

The low resistance conductive layer 5 is, for example, laminated on the entire surface 41 of the conductive portion 4. The surface 41 of the conductive portion 4 is a surface of the conductive portion 4 that is not in contact with the substrate 2. The low-resistance conductive layer 5 has, for example, a line shape wider than the conductive portion 4 in a plan view from the thickness direction D1 of the substrate 2. Here, the shape of the low resistance conductive layer 5 is an arc shape in a cross section orthogonal to the length direction of the low resistance conductive layer 5.

The low resistance conductive layer 5 is formed by using the conductive ink 500 (see FIG. 6A). The low resistance conductive layer 5 is a sintered metal layer containing a plurality of conductive nanoparticles. The sintered metal layer is a sintered body in which conductive nanoparticles are bonded together by sintering. The sintered metal layer is a porous metal. Therefore, the low resistance conductive layer 5 has elasticity compared with copper foil, a plating layer and the like.

The shape of the conductive nanoparticles is, for example, spherical. The average particle size of the conductive nanoparticles is smaller than the average particle size of the conductive particles 410. The average particle size of the conductive nanoparticles is, for example, 10 nm to 300 nm. The average particle size of the conductive nanoparticles can be determined by, for example, observing a cross section of a sample obtained by cutting the low-resistance conductive layer 5 along the thickness direction D1 of the substrate 2 with a transmission electron microscope (TEM). It is a value calculated using the particle size value of the conductive nanoparticles obtained by acquiring the cross-sectional TEM image and image-processing the cross-sectional TEM image. The “particle size value” is the diameter of a circle having the same area as the area of the conductive nanoparticles obtained from the cross-sectional TEM image, and the “average particle size” is a predetermined number (for example, 50) of the conductive nanoparticles. Is the average value of the particle size values of. In discussing the relative size relationship of the average particle size, the average particle size is not limited to the above-mentioned average value, and may be, for example, the median size (d ₅₀ ) obtained from the number-based particle size distribution curve. The number-based particle size distribution curve is obtained by measuring the particle size distribution by an image imaging method. Specifically, the number-based particle size distribution curve is a curve obtained from the size (biaxial average diameter) and the number of the conductive nanoparticles obtained by image-processing the above-mentioned TEM image. In the number-based particle size distribution curve, the particle size value when the integrated value is 50% is called the median diameter (d ₅₀ ).

In the low resistance conductive layer 5, the conductive nanoparticles are, for example, silver nanoparticles, and the sintered metal layer is, for example, a sintered silver layer (porous silver layer).

In the conductive device 1, in the plan view from the thickness direction D1 of the substrate 2, the edge 33 of the conductive portion 3 and the edge 33 of the conductive portion 3 of the pair of opening edges 231 and 232 of the groove 23 in the width direction D2. And the opening edge 231 close to are overlapped. The conductive portion 3 has a protrusion 32 that is inserted into the groove 23. The protrusion 32 is in contact with the inner surface of the groove 23. The protrusion 32 is preferably in contact with the entire bottom surface of the inner surface of the corresponding groove 23 and the pair of inner side surfaces. The edge 33 of the conductive portion 3 is constituted by the edge 53 of the low resistance conductive layer 5. The protrusion 32 of the conductive portion 3 is formed by the protrusion 52 that is in the groove 23 of the low resistance conductive layer 5.

In the conductive device 1, the edge 43 of the conductive portion 4 and the edge 43 of the conductive portion 4 of the pair of opening edges 241 and 242 in the width direction of the groove 24 are seen in a plan view from the thickness direction D1 of the substrate 2. The adjacent opening edge 241 overlaps. The conductive portion 4 has a protrusion 34 that is inserted into the groove 24. The protrusion 34 is in contact with the inner surface of the groove 24. The protrusions 34 are preferably in contact with the entire bottom surface of the inner surface of the corresponding groove 24 and the pair of inner side surfaces.

In addition to the protrusion 32 of the conductive portion 3 (hereinafter also referred to as the first protrusion 32 ), the conductive portion 3 is a second second groove 25 of the plurality of substrates 2 other than the third groove 24. It further has the 2nd projection part 35 which has entered into groove 25. The second protrusion 35 is in contact with the inner surface of the second groove 25. It is preferable that the second protrusion 35 is in contact with the entire bottom surface of the inner surface of the corresponding second groove 25 and the pair of inner side surfaces.

(2.3) Protective Sheet The protective sheet 7 is a sheet for protecting the conductive portion 3. Here, the protective sheet 7 preferably has gas barrier properties and moisture resistance. The protective sheet 7 may have water repellency.

The protective sheet 7 is laminated on the substrate 2 and covers the conductive portion 3. Here, the protective sheet 7 covers the substrate 2 and the conductive portion 3 on the side of the first main surface 21 of the substrate 2. The protective sheet 7 has a main surface 71 on the side opposite to the substrate 2 side. The protection sheet 7 has flexibility, for example. The thickness of the protective sheet 7 is, for example, 30 μm or more and 200 μm or less, and as an example, 50 μm. The protection sheet 7 is, for example, a plastic film. The plastic film is a polyethylene terephthalate film, but is not limited to this, and may be, for example, an ABS film, a polyethylene naphthalate film, a polyether sulfone film, a polycarbonate film, a polyester film, or the like.

The protective sheet 7 is laminated on the substrate 2. The protective sheet 7 has a plurality of protrusions 76 that are inserted one-on-one into the plurality of recesses 26. Each of the plurality of protrusions 76 is in contact with the inner surface of the corresponding recess 26 among the plurality of recesses 26. It is preferable that each of the plurality of protrusions 76 is in contact with the entire bottom surface of the corresponding recess 26 of the plurality of recesses 26 and the entire pair of inner side surfaces.

(3) Manufacturing Method of Conductive Device Hereinafter, a manufacturing method of the conductive device 1 will be described with reference to FIGS. 4, 5A, 5B and 6.

In the method for manufacturing the conductive device 1, for example, the following first step to fifth step are sequentially performed.

In the first step, as shown in FIG. 4, a substrate 2 having a plurality of grooves 20 is prepared. Here, the plurality of grooves 20 include the first groove 23, the plurality of second grooves 25, and the plurality of recesses 26, but it is sufficient that the plurality of grooves 20 include at least the first groove 23. In the method of manufacturing a conductive device according to the first embodiment, the first step constitutes a substrate preparation step of preparing the substrate 2 having the groove 23.

In the second step, as shown in FIG. 5A, the conductive paste 400 containing the conductive particles 410, the organic binder 420, and the solvent is applied to the region where the conductive portion 4 is to be formed on the substrate 2. In the method for manufacturing the conductive device 1 according to the first embodiment, the second step is to apply the conductive paste 400 containing the conductive particles 410, the organic binder 420, and the solvent to the region where the conductive portion 4 is to be formed on the substrate 2. The coating process (first coating process) is configured. As the conductive paste 400, for example, a paste obtained by mixing a powder containing a plurality of conductive particles 410 with an organic binder 420 and an organic solvent is used. In the second step, for example, the conductive paste 400 is applied using a dispenser system or the like. The dispenser system includes a table that holds the substrate 2, a dispenser head 441 (see FIG. 5A), and a nozzle 442 (see FIG. 5A) that is held by the dispenser head 441 and discharges the conductive paste 400. In FIG. 5A, in order to form the linear conductive portion 4, the dispenser head 441 is moved on the substrate 2 along the area where the conductive portion 4 is to be formed, and the conductive paste 400 is discharged from the nozzle 442 and applied. The situation is schematically shown.

In the example of FIG. 5A, by changing the discharge speed of the dispenser head 441, the dropping amount (application amount) of the conductive paste per unit time can be changed, and the dropping amount and the moving speed of the dispenser head 441 can be changed. As a result, the amount of the conductive paste 400 applied per unit area can be controlled, and the conductive paste 400 can have a coating shape based on the shape of the conductive portion 4. Here, the dispenser system includes a moving mechanism including a robot that moves the dispenser head 441, a sensor unit that measures the height from the table to the first main surface 21 of the substrate 2 and the nozzle 442, the moving mechanism and the nozzle 442. And a controller for controlling the discharge speed of the conductive paste 400 from the above. The controller can be realized, for example, by mounting an appropriate program on a microcomputer. The controller moves the dispenser head 441 based on data of a predetermined pattern in plan view in the design shape of the conductive portion 4 designed by CAD (Computer Aided Design), for example.

Further, the coating shape of the conductive paste 400 can be controlled by adjusting the viscosity, thixotropy, etc. of the conductive paste 400, for example. Further, the application shape of the conductive paste 400 can be controlled by adjusting the viscosity of the conductive paste 400, for example. The curvature of the surface 41 of the conductive portion 4 can be adjusted by the viscosity and surface tension of the conductive paste 400. Increasing the curvature can be realized by, for example, increasing the viscosity of the conductive paste 400 or increasing the surface tension. The dispenser system may include a heater that heats the conductive paste 400 so that the viscosity of the conductive paste 400 before application becomes a desired viscosity.

In the third step, the conductive paste 400 is heated to form the conductive portion 4 (see FIG. 5B). In the method for manufacturing a conductive device according to the first embodiment, the third step constitutes a thermosetting step of heating the conductive paste 400 to form the conductive portion 4.

In the fourth step, the conductive ink 500 containing conductive nanoparticles (see FIG. 6) is applied so as to cover the surface 41 of the conductive portion 4. In the method for manufacturing the electrically conductive device 1 according to the first embodiment, the fourth step constitutes a second application step of applying the conductive ink 500, which is the base of the low resistance conductive layer 5, to the region where the low resistance conductive layer 5 is to be formed. doing. The conductive ink 500 is an ink containing conductive nanoparticles (for example, silver nanoparticles), a volatile binder, and a solvent. In the fourth step, the conductive ink 500 is applied using a dispenser system or the like. The dispenser system used in the fourth step has substantially the same configuration as the dispenser system used in the second step, and includes a dispenser head 551 instead of the dispenser head 441, and a conductive material instead of the nozzle 442 that discharges the conductive paste 400. The difference is that a nozzle 552 for ejecting the sexual ink 500 is provided. The controller in the dispenser system used in the fourth step moves the dispenser head 551 based on data of a predetermined pattern in plan view in the design shape of the low resistance conductive layer 5 designed by CAD, for example. The viscosity of the conductive ink 500 is smaller than the viscosity of the conductive paste 400. The value of the viscosity may be, for example, a value measured at room temperature using a cone-and-plate type rotary viscometer.

In the fifth step, the low resistance conductive layer 5 (see FIG. 2) is formed by drying the conductive ink 500 and then heating it. In the fifth step, adjacent conductive nanoparticles are metal-bonded to each other. In the method for manufacturing the conductive device 1 according to the first embodiment, the fifth step constitutes a heat treatment step of forming the low resistance conductive layer 5 from the conductive ink 500.

(4) Application Example of Conductive Device The conductive device 1 is a device including the conductive portion 3 as a component having a conductive function.

Hereinafter, as an application example of the conductive device 1, an antenna device 100 including the conductive device 1 as illustrated in FIG. 7 is illustrated.

The antenna device 100 is a dipole antenna including a dielectric substrate 102 and two radiation conductors 103 arranged in one direction on the dielectric substrate 102. The two radiation conductors 103 are arranged one on each side of the power feeding unit 106 in the one direction. Each of the two radiation conductors 103 has a meandering shape. The dielectric substrate 102 of the antenna device 100 is composed of the substrate 2 of the conductive device 1. Each of the two radiation conductors 103 is constituted by the conductive portion 3 of the conductive device 1. In FIG. 7, the protective sheet 7 is not shown.

The conductive device 1 may include the protective sheet 7 and may form the film 81 in the film insert molded product 8 as shown in FIG. 8. The film insert molded product 8 includes a film 81 and a resin structure 80. In the film insert molded product 8, the film 81 is film insert molded on the resin structure 80.

The antenna device 100 is used for a wireless device 800, for example, as shown in FIG. The wireless device 800 includes a housing 801. The housing 801 is a film insert molded product in which the antenna device 100 including the conductive device 1 is used as a film. Here, the conductive device 1 is formed by film insert molding on the housing 801 without the protection sheet 7. Further, the wireless device 800 includes a wireless communication module 810 housed in the housing 801. The wireless communication module 810 performs wireless communication with a device outside the wireless device 800 via the antenna device 100. The wireless communication module 810 includes, for example, a printed wiring board and a plurality of electronic components mounted on the printed wiring board and forming a wireless communication circuit together with the printed wiring board.

(5) Effects In the conductive device 1 according to the first embodiment and the antenna device 100 including the conductive device 1, it is possible to improve the shape accuracy of the conductive portion 3. Here, the shape accuracy of the conductive portion 3 includes the shape accuracy of the conductive portion 3 with respect to a predetermined pattern in plan view in the designed shape of the conductive portion 3. In the conductive device 1, the shape accuracy of the conductive portion 3 is higher as the edge 33 of the conductive portion 3 is located outside or inside of the edge of the predetermined pattern.

Further, in the film insert molded product 8 including the conductive device 1, since the conductive portion 3 has elasticity, it is possible to prevent the conductive portion 3 from breaking during the film insert molding.

Further, in the method for manufacturing the conductive device 1 according to the first embodiment, it is possible to improve the shape accuracy of the conductive portion 3. In addition, in the method for manufacturing the conductive device 1 according to the first embodiment, it is possible to improve the reproducibility of the shape of the conductive portion 3 and reduce variations in the characteristics of the conductive device 1.

Further, in the antenna device 100 including the conductive device 1 according to the first embodiment, the antenna characteristics can be improved. Here, in the antenna device 100, since each radiating conductor 103 is configured by the conductive portion 3 including the low resistance conductive layer 5, as compared with the case where the conductive portion 3 is configured by only the conductive portion 4, The resistance can be reduced, and the transmission loss due to the skin effect of the conductive portion 3 can be reduced. In FIG. 3, a transmission path of a high frequency signal when the high frequency signal is transmitted through the conductive portion 3 of the conductive device 1 is schematically shown by an arrow F1. In the comparative example which has substantially the same configuration as the conductive device 1 and does not include the low resistance conductive layer 5, a plurality of conductive materials arranged in the length direction of the conductive portion 4 near the surface 41 of the conductive portion 4 due to the skin effect. A high frequency signal is transmitted along the surface of the particle 410. Therefore, in the comparative example, the transmission loss increases due to the unevenness of the surface 41 of the conductive portion 4, whereas in the conductive device 1 including the low resistance conductive layer 5, the low resistance conductive layer 5 is formed by the skin effect. Since the high frequency signal is transmitted along the line, the transmission loss is reduced.

(6) Modification Example A conductive device 1a according to a modification example of Embodiment 1 will be described below with reference to FIG.

The conductive device 1a according to the modification is substantially the same as the conductive device 1 according to the first embodiment, and includes a plurality of conductive portions 3. Regarding the conductive device 1b according to the modified example, the same components as those of the conductive device 1 according to the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

The conductive device 1a according to the modification can be used, for example, as a wiring device instead of a printed wiring board. In the conductive device 1a according to the modified example, for example, each of the plurality of conductive portions 3 constitutes a wiring portion.

In the conductive device 1a according to the modification, each of the plurality of conductive portions 3 has at least four grooves 20 among the plurality of grooves 20 of the substrate 2 in a plan view from the thickness direction D1 of the substrate 2 (see FIG. 1). Are formed so as to overlap.

In the conductive device 1a according to the modified example, it is possible to improve the shape accuracy of the conductive portion 3 as in the conductive device 1 according to the first embodiment. As a result, it is possible to improve the accuracy of the wiring width of the plurality of wiring portions formed by each of the plurality of conductive portions 3.

(Embodiment 2)
Hereinafter, the conductive device 1b according to the second embodiment will be described with reference to FIG.

The conductive device 1b according to the second embodiment is substantially the same as the conductive device 1 according to the first embodiment, and is different from the conductive device 1 according to the first embodiment in that a conductive portion 3b is provided instead of the conductive portion 3. To do. Regarding the conductive device 1b according to the second embodiment, the same components as those of the conductive device 1 according to the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

The conductive portion 3b of the conductive device 1b according to the second embodiment is composed of only the conductive portion 4 of the conductive portion 4 and the low resistance conductive layer 5 of the conductive portion 3 of the conductive device 1 according to the first embodiment. ..

In the conductive device 1b, the edge 33b of the conductive portion 3b and the edge 33b of the conductive portion 3b of the pair of opening edges 231b, 232b of the groove 23b in the width direction D2 in a plan view from the thickness direction D1 of the substrate 2. And the opening edge 231b close to are overlapped. The conductive portion 3b has a protrusion 32b that is inserted into the groove 23b. The protrusion 32b is in contact with the inner surface of the groove 23b. It is preferable that the protrusions 32b are in contact with the entire bottom surface of the inner surface of the corresponding groove 23b and the pair of inner side surfaces.

The protrusion 32 b is formed by the protrusion 34 of the conductive portion 4.

The method for manufacturing the conductive device 1b according to the second embodiment is substantially the same as the method for manufacturing the conductive device 1 according to the first embodiment, and does not include the fourth step and the fifth step. This is different from the method of manufacturing the device 1.

The conductive device 1b according to the second embodiment can improve the shape accuracy of the conductive portion 3 similarly to the conductive device 1 according to the first embodiment.

The conductive device 1b according to the second embodiment can be used as, for example, a wiring device.

(Embodiment 3)
Hereinafter, the conductive device 1c according to the third embodiment will be described with reference to FIG.

The conductive device 1c according to the third embodiment is substantially the same as the conductive device 1b according to the second embodiment, and differs from the conductive device 1b according to the second embodiment in that an insulating layer 6 is further provided. Regarding the conductive device 1c according to the third embodiment, the same components as those of the conductive device 1b according to the second embodiment are denoted by the same reference numerals and the description thereof will be omitted.

The insulating layer 6 is formed on the substrate 2. The insulating layer 6 is located outside the edge 33b of the conductive portion 3b in a plan view from the thickness direction D1 of the substrate 2. The material of the insulating layer 6 is different from the material of the substrate 2. The material of the insulating layer 6 is, for example, an acrylic polymer or the like. Here, the material of the insulating layer 6 is a material having lower wettability with respect to the conductive paste 400 than the material of the substrate 2. The material of the insulating layer 6 has a larger contact angle than the substrate 2. The insulating layer 6 has water repellency.

In the conductive device 1c according to the third embodiment, the insulating layer 6 and the conductive portion 3b are in contact with each other in a plan view from the thickness direction D1 of the substrate 2.

The method for manufacturing the conductive device 1c according to the third embodiment is substantially the same as the method for manufacturing the conductive device 1b according to the second embodiment, and the method for insulating the conductive paste 400 on the substrate 2 before applying the conductive paste 400 to the substrate 2 is as follows. This is different from the method for manufacturing the conductive device 1b according to the second embodiment in that it further includes an insulating layer forming step of forming the layer 6.

The conductive device 1c according to the third embodiment can further improve the shape accuracy of the conductive portion 3b as compared with the conductive device 1b according to the second embodiment.

The above embodiment is only one of the various embodiments of the present disclosure. The above-described embodiment can be variously modified according to the design and the like as long as the object of the present invention can be achieved.

For example, in the method of manufacturing the conductive device 1, the method of applying the conductive paste 400 is not limited to the method using the dispenser system, and may be, for example, a screen printing method or the like.

Further, in the method of manufacturing the conductive device 1, the method of applying the conductive ink 500 is not limited to the method using the dispenser system, and may be, for example, a screen printing method or the like.

Further, the shape of the radiation conductor 103 in the antenna device 100 is not limited to the meander shape, and may be another shape. Further, the antenna device 100 is not limited to the dipole antenna and may be another antenna.

Further, in the conductive device 1 according to the first embodiment, the insulating layer 6 of the conductive device 1c according to the third embodiment may be provided.

(Summary)
The conductive device (1; 1a; 1b; 1c) according to the first aspect includes a substrate (2) and a conductive portion (3; 3b). The conductive part (3; 3b) is formed on the substrate (2). The conductive part (3; 3b) has a conductive part (4). The conductive part (4) is formed on the substrate (2) and contains conductive particles (410) and an organic binder (420). The substrate (2) overlaps with the conductive portion (3; 3b) in a plan view from the thickness direction (D1) of the substrate (2) along the edge (33; 33b) of the conductive portion (3; 3b). Grooves (23; 23b) are formed. In a plan view from the thickness direction (D1) of the substrate (2), the edge (33; 33b) of the conductive portion (3; 3b) and the pair of openings in the width direction (D2) of the groove (23; 23b). Among the edges (231; 231b, 232; 232b), the opening edge (231; 231b) close to the edge (33; 33b) of the conductive portion (3; 3b) overlaps. The electrically conductive portion (3; 3b) has a protrusion (32; 32b) which fits into the groove (23; 23b).

In the conductive device (1; 1a; 1b; 1c) according to the first aspect, it is possible to improve the shape accuracy of the conductive portion (3; 3b).

The conductive device (1; 1a; 1b; 1c) according to the second aspect further comprises an insulating layer (6) in the first aspect. The insulating layer (6) is formed on the substrate (2) and is formed on the edge (33; 33b) of the conductive portion (3; 3b) in a plan view from the thickness direction (D1) of the substrate (2). It is located outside. The material of the insulating layer (6) is different from the material of the substrate (2).

In the conductive device (1; 1a; 1b; 1c) according to the second aspect, it is possible to further improve the shape accuracy of the conductive portion (3; 3b).

In the conductive device (1; 1a; 1b; 1c) according to the third aspect, in the first or second aspect, the substrate (2) is a flexible substrate.

The conductive device (1; 1a; 1b; 1c) according to the third aspect can be arranged not only on a flat surface but also on a curved surface or a surface having an uneven shape.

The conductive device (1; 1a; 1b; 1c) according to the fourth aspect further includes a protective sheet (7) according to any one of the first to third aspects. The protective sheet (7) is laminated on the substrate (2) and covers the conductive portions (3; 3b).

The conductive device (1; 1a; 1b; 1c) according to the fourth aspect can improve reliability.

In the conductive device (1; 1a; 1b; 1c) according to the fifth aspect, in the fourth aspect, the substrate (2) is electrically conductive with the protective sheet (7) in a plan view from the thickness direction (D1). A plurality of recesses (26) are formed in a region where only the protective sheet (7) overlaps with the portion (3; 3b). The protective sheet (7) has a plurality of protrusions (76) which are inserted one-to-one into the plurality of recesses (26).

In the conductive device (1; 1a; 1b; 1c) according to the fifth aspect, the adhesion between the protective sheet (7) and the substrate (2) can be improved.

In the conductive device (1; 1a; 1b; 1c) according to the sixth aspect, in any one of the first to fifth aspects, the substrate (2) extends from the thickness direction (D1) of the substrate (2). The second groove (25) different from the first groove composed of the grooves (23; 23b) is formed in a portion of the conductive portion (3; 3b) that overlaps the inner portion of the edge (33; 33b) in plan view. Has been formed. The conductive portion (3; 3b) has a second protrusion (35) which is inserted into the second groove (25), in addition to the first protrusion which is formed by the protrusion (32; 32b).

In the conductive device (1; 1a; 1b; 1c) according to the sixth aspect, the adhesion between the conductive portion (3; 3b) and the substrate (2) can be further improved.

In the conductive device (1; 1a; 1b; 1c) according to the seventh aspect, in the sixth aspect, the second groove (25) has a second shape in plan view from the thickness direction (D1) of the substrate (2). It is along the same direction as the one groove (23; 23b).

A conductive device (1; 1a; 1b; 1c) according to an eighth aspect is the one according to any one of the first to seventh aspects, and includes a plurality of conductive portions (3; 3b).

In the conductive device (1; 1a; 1b; 1c) according to the eighth aspect, it is possible to improve the shape accuracy of the plurality of conductive portions (3; 3b).

The antenna device (100) according to the ninth aspect includes the conductive device (1; 1a; 1b; 1c) according to any one of the first to eighth aspects.

In the antenna device (100) according to the ninth aspect, it is possible to improve the shape accuracy of the conductive portions (3; 3b).

A method of manufacturing a conductive device (1; 1a; 1b; 1c) according to a tenth aspect is the method of manufacturing a conductive device (1) according to any one of the first to eighth, wherein the groove (23; 23b) a substrate preparation step of preparing a substrate (2), and conductive containing conductive particles (410), an organic binder (420) and a solvent in a region where the conductive part (4) is to be formed on the substrate (2). And a heat curing step of heating the conductive paste (400) to form the conductive portion (4).

In the method of manufacturing the conductive device (1; 1a; 1b; 1c) according to the tenth aspect, it is possible to improve the shape accuracy of the conductive portion (3; 3b).

1, 1a, 1b, 1c Conductive device 2 Substrate 23, 23b Groove (first groove)
25 2nd groove 26 Recess 231, 231b Opening edge 232, 232b Opening edge 3, 3b Conductive part 32, 32b Projection (1st projection)
33, 33b Edge 35 Second protrusion 4 Conductive portion 41 Surface 400 Conductive paste 410 Conductive particles 420 Organic binder 5 Low resistance conductive layer 500 Conductive ink 6 Insulating layer 7 Protective sheet 76 Protrusion 100 Antenna device 800 Radio device 801 Housing D1 Thickness direction D2 Width direction

Claims (10)

Board,
A conductive portion formed on the substrate,
The conductive portion is
Formed on the substrate, having a conductive portion containing conductive particles and an organic binder,
The substrate has a groove formed along the edge of the conductive portion to overlap the conductive portion in a plan view from the thickness direction of the substrate,
When seen in a plan view from the thickness direction of the substrate, the edge of the conductive portion and an opening edge of the pair of opening edges in the width direction of the groove close to the edge of the conductive portion overlap each other. Cage,
The conductive portion has a protrusion that extends into the groove,
Conductive device. An insulating layer formed on the substrate, the insulating layer being located outside the edge of the conductive portion in a plan view from the thickness direction of the substrate,
The material of the insulating layer is different from the material of the substrate,
The conductive device according to claim 1. The substrate is a flexible substrate,
The conductive device according to claim 1 or 2. Further comprising a protective sheet laminated on the substrate and covering the conductive portion,
The conductive device according to claim 1. The substrate has a plurality of recesses formed in a region where only the protective sheet overlaps with the protective sheet and the conductive portion in a plan view from the thickness direction,
The protective sheet has a plurality of protrusions that are in a one-to-one correspondence with the plurality of recesses.
The conductive device according to claim 4. In the substrate, a second groove different from the first groove formed of the groove is formed in a portion overlapping with a portion inside the edge in the conductive portion in a plan view from the thickness direction,
The conductive portion has a second protrusion that is inserted into the second groove, in addition to the first protrusion that is the protrusion.
The conductive device according to claim 1. The second groove extends along the same direction as the first groove in a plan view from the thickness direction of the substrate,
The conductive device according to claim 6. A plurality of the conductive parts,
The conductive device according to claim 1. A conductive device according to any one of claims 1 to 8 is provided,
Antenna device. A method of manufacturing a conductive device according to any one of claims 1 to 8, comprising:
A substrate preparation step of preparing a substrate having the groove,
A coating step of coating a conductive paste containing the conductive particles, the organic binder, and a solvent in a region where the conductive portion is to be formed on the substrate,
A thermosetting step of heating the conductive paste to form the conductive portion,
Manufacturing method of conductive device.

Images