JP2020116513A - Wire processing method - Google Patents

Abstract

To provide a wire processing method that can exert high-cleaning effect without affecting property of a wire.SOLUTION: A wire processing method includes a dry type processing of moving a wire relatively to a fiber assembly while bringing the fiber assembly into contact with a surface of the wire.SELECTED DRAWING: Figure 1

Description

The present invention relates to a method for treating a wire rod.

In the superconducting wire, for example, a superconducting layer is formed on a base material made of a metal tape via an intermediate layer having a good crystal orientation. A protective layer is formed on the superconducting layer to protect the superconducting layer. A metal stabilizing layer is formed on the protective layer.

In order to improve the characteristics of the superconducting wire, it is effective to clean the surface by cleaning the wire, but foreign substances attached to the wire are difficult to remove by a non-contact cleaning method such as air cleaning. On the other hand, although the method of cleaning the surface of the wire by brushing or the like has a high cleaning effect, the surface of the wire may be damaged and the characteristics of the superconducting wire may be affected.
Patent Document 1 describes performing ultrasonic cleaning while the superconducting wire is immersed in water. The ultrasonic cleaning does not damage the wire and has a good cleaning effect. However, the underlayer, the intermediate layer, and the superconducting layer may be hydroxylated in water to cause a change in chemical composition. Therefore, in the method described in Patent Document 1, the uniformity of the degree of orientation becomes low, which may affect the characteristics of the superconducting wire.
When the superconducting wire is thinned by laser processing, dross may adhere to the surface of the superconducting wire. The dross may cause problems in the appearance of the wire and adhesion of the film when the film is formed on the surface of the wire.

JP, 2011-181192, A

An object of one embodiment of the present invention is to provide a method for treating a wire rod that can obtain a high cleaning effect without affecting the characteristics of the wire rod.

One aspect of the present invention provides a method for treating a wire rod, which performs a dry process of moving the wire rod relative to the fiber aggregate while bringing the fiber aggregate into contact with the surface of the wire rod.

In the treatment, it is preferable to run the wire rod in the length direction while bringing the fiber aggregate into contact with the wire rod.

In the treatment, it is preferable to press the fiber assembly against the wire rod.

The wire includes (i) a first structure in which a base material and an intermediate layer are laminated, (ii) a second structure in which a base material, an intermediate layer, and a superconducting layer are laminated in this order, and (iii) a base material. And a third structure in which an intermediate layer, an oxide superconducting layer, and a first protective layer are laminated in this order, (iv) a base material, an intermediate layer, an oxide superconducting layer, and a first protective layer are laminated in this order. It may be either a fourth structure having a second protective layer formed on the surface of the laminate, or (v) a fifth structure having a stabilizing layer formed on the surface of the fourth structure.

The wire may be a wire thinned by laser processing.

In the fiber assembly, the widthwise dimension of the wire is preferably 1.5 times or more the width of the wire.

According to one aspect of the present invention, a high cleaning effect can be obtained without affecting the characteristics of the wire.

It is a block diagram of the processing apparatus which can implement the processing method of the wire rod of embodiment. It is process drawing of the processing method using the processing apparatus of FIG. It is process drawing of the processing method using the processing apparatus of FIG. It is process drawing of the processing method using the processing apparatus of FIG. It is process drawing of the processing method using the processing apparatus of FIG. It is process drawing of the processing method using the processing apparatus of FIG. It is a schematic diagram which shows the cross section of the processing apparatus of FIG. It is the schematic which shows the constructional example of a wire. It is explanatory drawing which shows an example of thinning of a wire. It is the schematic which shows the constructional example of a wire. It is the schematic which shows the constructional example of a wire. It is the schematic which shows the constructional example of a wire. It is the schematic which shows the constructional example of a wire.

Hereinafter, the present invention will be described based on preferred embodiments with reference to the drawings.

[wire]
FIG. 8 is a schematic view showing a superconducting wire 10 which is a structural example of the wire. As shown in FIG. 8, the superconducting wire 10 includes a superconducting laminated body 5, a second protective layer 6, and a stabilizing layer 8. The superconducting wire 10 is a tape wire formed in a tape shape.
The superconducting laminate 5 has a structure in which the oxide superconducting layer 3 and the first protective layer 4 are formed on the base material 1 with the intermediate layer 2 interposed therebetween. Specifically, the superconducting laminate 5 has a structure in which the intermediate layer 2, the oxide superconducting layer 3, and the first protective layer 4 are laminated in this order on one surface of the base material 1.

In FIG. 8, the Y direction is the thickness direction of the superconducting wire 10, and is the direction in which the base material 1, the intermediate layer 2, the oxide superconducting layer 3, the first protective layer 4 and other layers are laminated. The X direction is the width direction of the superconducting wire 10 and is a direction orthogonal to the longitudinal direction and the thickness direction of the superconducting wire 10.

The base material 1 has a tape shape and is made of, for example, metal. Specific examples of the metal constituting the base material 1 include nickel alloys represented by Hastelloy (registered trademark); stainless steel; oriented Ni—W alloys in which a texture is introduced into nickel alloys. One surface of the base material 1 (the surface on which the intermediate layer 2 is formed) is referred to as a first main surface 1a.

The intermediate layer 2 is provided between the base material 1 and the oxide superconducting layer 3. The intermediate layer 2 is formed on the first major surface 1a of the base material 1. The intermediate layer 2 may have a multi-layered structure and may have, for example, a diffusion prevention layer, a bed layer, an alignment layer, a cap layer, and the like in the order from the base material 1 side to the oxide superconducting layer 3 side.

The diffusion prevention layer has a function of suppressing a part of components of the base material 1 from diffusing and being mixed as an impurity into the oxide superconducting layer 3 side. The diffusion prevention layer is made of, for example, Si ₃ N ₄ , Al ₂ O ₃ , GZO (Gd ₂ Zr ₂ O ₇ ), or the like.
A bed layer may be formed on the diffusion prevention layer to reduce the reaction at the interface between the base material 1 and the oxide superconducting layer 3 and to improve the orientation of the layer formed thereon. Examples of the material of the bed layer include Y ₂ O ₃ , Er ₂ O ₃ , CeO ₂ , Dy ₂ O ₃ , Eu ₂ O ₃ , Ho ₂ O ₃ and La ₂ O ₃ .
The orientation layer is formed of a biaxially oriented material to control the crystal orientation of the cap layer thereon. Examples of the material of the alignment layer include Gd ₂ Zr ₂ O ₇ , MgO, ZrO ₂ —Y ₂ O ₃ (YSZ), SrTiO ₃ , CeO ₂ , Y ₂ O ₃ , Al ₂ O ₃ , Gd ₂ O ₃ , and Examples thereof include metal oxides such as Zr ₂ O ₃ , Ho ₂ O ₃ and Nd ₂ O ₃ . The alignment layer is preferably formed by an IBAD (Ion-Beam-Assisted Deposition) method.
The cap layer is formed on the surface of the above-mentioned orientation layer, and is made of a material in which crystal grains can be self-oriented in the in-plane direction. Examples of the material of the cap layer include CeO ₂ , Y ₂ O ₃ , Al ₂ O ₃ , Gd ₂ O ₃ , ZrO ₂ , YSZ, Ho ₂ O ₃ , Nd ₂ O ₃ , and LaMnO ₃ .

The oxide superconducting layer 3 is composed of an oxide superconductor. As an oxide superconductor, particularly, but not limited to, for example, the general formula _{REBa 2 Cu 3 O X (RE123} ) with REBa-Cu-O based oxide superconductor represented the like. Examples of the rare earth element RE include one or more of Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu. Among them, one of Y, Gd, Eu, and Sm, or a combination of two or more of these elements is preferable. Generally, X is 7-x (oxygen deficiency amount x: about 0 to 1).
The oxide superconducting layer 3 is formed on the main surface 2a of the intermediate layer 2 (the surface opposite to the base material 1 side).

The first protective layer 4 has a function of bypassing an overcurrent generated at the time of an accident and suppressing a chemical reaction that occurs between the oxide superconducting layer 3 and a layer provided on the first protective layer 4. .. Examples of the material of the first protective layer 4 include silver (Ag), copper (Cu), gold (Au), an alloy of gold and silver, other silver alloys, copper alloys, gold alloys, and the like. The first protective layer 4 covers at least the main surface 3a of the oxide superconducting layer 3 (the surface opposite to the intermediate layer 2 side).

The first protective layer 4 may cover a part or all of a region selected from the side surface of the oxide superconducting layer 3, the side surface of the intermediate layer 2, the side surface of the base material 1, and the back surface. The first protective layer 4 may be composed of two or more kinds or two or more metal layers.

The second protective layer 6 is made of copper, silver, or the like, and integrally covers the outer surface of the superconducting laminated body 5.
The superconducting laminated body 5 and the second protective layer 6 are collectively referred to as a superconducting laminated body 7.

The stabilizing layer 8 is formed so as to cover at least a part of the surface of the superconducting laminated body 7. The stabilizing layer 8 has a function as a bypass portion that commutates an overcurrent generated when the oxide superconducting layer 3 changes to the normal conducting state. Examples of the constituent material of the stabilizing layer 8 include metals such as copper, copper alloys (for example, Cu-Zn alloys, Cu-Ni alloys, etc.), aluminum, aluminum alloys, silver, and the like.
One surface of the superconducting wire 10 is referred to as a first surface 10a. The surface opposite to the first surface 10a is referred to as the second surface 10b.

The superconducting wire 10 shown in FIG. 8 can be manufactured, for example, as follows.
The superconducting laminate 5 is obtained by sequentially forming the intermediate layer 2, the oxide superconducting layer 3, and the first protective layer 4 on the first main surface 1a of the base material 1. Then, the second protective layer 6 is formed on the surface of the superconducting laminated body 5 by a sputtering method or the like to obtain the superconducting laminated body 7. Then, the stabilizing layer 8 is formed by, for example, a plating method (for example, electrolytic plating). The superconducting wire 10 is obtained through the above steps.

[Wire processing equipment]
Next, a processing apparatus capable of carrying out the wire rod processing method of the embodiment will be described.
FIG. 1 is a configuration diagram of a processing apparatus 100 capable of implementing the wire rod processing method of the embodiment. 2 and 3 are process diagrams of a processing method using the processing apparatus 100. 1 to 3 are schematic views of the processing apparatus 100 viewed from the side.

As shown in FIG. 1, the processing apparatus 100 includes a pair of pressing members 20, 20 and a pair of fiber assemblies 30, 30.
The pressing members 20, 20 are formed in a block shape and have flat pressing surfaces 20a, 20a. The pressing members 20 and 20 are arranged so that the pressing surfaces 20a and 20a face each other. The pressing members 20 and 20 are movable in directions approaching and separating from each other. The pressing surfaces 20a, 20a are parallel to each other.

The fiber assembly 30 is a sheet body configured by collecting fibers having an average yarn diameter of about 5 to 15 μm, and is, for example, a woven fabric (woven fabric), a non-woven fabric (nonwoven fabric), a knitted fabric, a felt, a mat, or the like. .. Examples of the fibers that form the fiber assembly 30 include synthetic fibers, natural fibers, and inorganic fibers. The synthetic fiber is composed of, for example, polyester, polyamide, aramid, polyethylene, polypropylene, polyacrylonitrile, polyimide, polysulfone, polyether sulfone, polyurethane, polyvinyl alcohol, or the like. Natural fibers include, for example, vegetable fibers (cotton, hemp, etc.), animal fibers (animal hair, silk, etc.), and the like. The inorganic fiber is made of, for example, carbon or glass.
The fiber assembly 30 preferably has flexibility. Further, the fiber assembly 30 preferably has a very small amount of self-generated dust and an amount of eluted ions in order to prevent recontamination.

The fiber assemblies 30 and 30 are provided so as to cover the pressing surfaces 20a and 20a of the pressing members 20 and 20, respectively. Therefore, the fiber assemblies 30, 30 are arranged to face each other, and the superconducting wire 10 can be sandwiched. The facing surfaces 30a, 30a of the fiber assemblies 30, 30 are in contact with the first surface 10a and the second surface 10b of the superconducting wire 10 respectively (see FIG. 5). The fiber assemblies 30 and 30 are pressed against the superconducting wire 10 by the pressing members 20 and 20.

The fiber assembly 30 has a structure capable of capturing the deposit 50 on the surface (the first surface 10a and the second surface 10b) of the superconducting wire 10. For example, the fiber assembly 30 can hold the deposit 50 in the space between the fibers.

The fiber assembly 30 can capture the deposit 50 on the surface of the superconducting wire 10 by performing a dry process on the surface of the superconducting wire 10. “Dry” refers to a form of treatment in which the liquid does not touch the object to be treated. That is, the dry process is a process performed without touching the superconducting wire 10 as the object to be treated with a liquid such as water or alcohol. Only the solid fiber assembly 30 touches the superconducting wire 10 in this process.

FIG. 7 is a schematic diagram showing a cross section of the processing apparatus 100. FIG. 7 is a view showing a cross section of the superconducting wire rod 10 orthogonal to the length direction. As shown in FIG. 7, the width W1 of the fiber assembly 30 (dimension in the width direction of the superconducting wire 10) is preferably 1.5 times or more the width W of the superconducting wire 10. As a result, even if the position of the superconducting wire 10 in the width direction is displaced, the superconducting wire 10 is less likely to come out of the contact area of the fiber assembly 30.

[Processing method of wire rod]
Next, a method of treating the wire rod according to the embodiment will be described.
4 to 6 are process diagrams of a processing method using the processing apparatus 100. 4 to 6 are views showing a cross section of the superconducting wire rod 10 orthogonal to the length direction.

As shown in FIGS. 1 and 4, deposits 50 may adhere to the surfaces (first surface 10a and second surface 10b) of superconducting wire 10 when manufacturing superconducting wire 10. The adhered matter 50 is particles (fine particles) or the like generated when the superconducting wire 10 is manufactured. The superconducting wire 10 has a length of 10 m or more, for example.

The superconducting wire 10 is run in the length direction (rightward in FIG. 1). In order to run the superconducting wire 10, for example, a method of taking up the superconducting wire 10 sent from a sending roller (not shown) by a winding roller (not shown) can be adopted.

As shown in FIGS. 2 and 5, when the pressing members 20, 20 are moved toward each other, the fiber assemblies 30, 30 move toward the superconducting wire 10. The facing surfaces 30a, 30a of the fiber assemblies 30, 30 are in contact with the surfaces (first surface 10a and second surface 10b) of the superconducting wire 10.

The pressing member 20 can press the fiber assembly 30 against the superconducting wire 10 (that is, bring the fiber assembly 30 into contact with the superconducting wire 10 in a pressed state). Thereby, even if the adhesion force of the deposit 50 on the surface of the superconducting wire 10 is high, the deposit 50 can be easily removed.

The superconducting wire 10 travels with the fiber assembly 30 in contact with the superconducting wire 10, so that the superconducting wire 10 slides on the fiber assembly 30. This process is called "wiping process" or simply "process". In this process, at least a part of the deposit 50 enters the voids between the fibers forming the fiber assembly 30 and becomes difficult to be detached from the fiber assembly 30. Therefore, the fiber assembly 30 can capture the deposit 50. Therefore, the fiber assembly 30 can remove at least a part of the deposit 50 on the surface of the superconducting wire 10 and clean the surface of the superconducting wire 10. The fiber assembly 30 can remove, for example, the deposit 50 (foreign matter) having an average particle size of 0.1 μm or more from the superconducting wire 10. This process is a dry process (a process performed without touching the superconducting wire 10 with a liquid such as water).

Next, as shown in FIGS. 3 and 6, by moving the pressing members 20, 20 in the directions away from each other, the fiber assemblies 30, 30 are separated from the superconducting wire 10. Since the deposit 50 is captured by the fiber assembly 30, the surface of the superconducting wire 10 is clean.

[Effects Obtained by Processing Method of Embodiment]
In the treatment method of the embodiment, unlike ultrasonic cleaning, water is not used to remove the deposit 50. Therefore, it is possible to prevent the characteristics of superconducting wire 10 from being deteriorated due to chemical changes in the underlayer, the intermediate layer, and the superconducting layer due to the use of water. The treatment method of the embodiment also has an advantage that the treatment operation is easy because water is not used.

In the treatment method of the embodiment, since the fibrous aggregate 30 is used to remove the deposit 50 on the superconducting wire 10, the force applied to the superconducting wire 10 can be reduced as compared to the method using brushing. Therefore, the superconducting wire 10 is less likely to be damaged. Therefore, it is possible to suppress the deterioration of the characteristics due to the damage of the superconducting wire 10.

In the treatment method of the embodiment, since the fibrous aggregate 30 is brought into contact with the superconducting wire 10 to remove the deposit 50, the effect of removing the deposit 50 (cleaning) is higher than that of a non-contact cleaning method such as air cleaning. It is excellent in terms of (effect).

According to the treatment method of the embodiment, since the fibrous aggregate 30 removes the deposit 50 on the superconducting wire 10, it is possible to improve the degree of orientation of the intermediate layer or the like of the superconducting wire 10, unlike ultrasonic cleaning using water. You can Therefore, the superconducting wire 10 having uniform characteristics in the longitudinal direction can be obtained. Therefore, in the superconducting wire 10, a local decrease in the critical current value is unlikely to occur. Therefore, the characteristics of the superconducting wire 10 can be improved.
According to the method for treating a superconducting wire of the embodiment, for example, a long superconducting wire 10 having a length of 10 m or more can be cleaned.

According to the treatment method of the embodiment, the superconducting wire rod 10 is run in the length direction while the fiber aggregate 30 is in contact with the superconducting wire rod 10, so that the treatment can be efficiently performed.

When the superconducting wire is thinned by laser processing, dross may adhere to the surface of the superconducting wire. For example, FIG. 9 is a cross-sectional view of a laminate (superconducting wire) having a base material 1, an intermediate layer 2, an oxide superconducting layer 3, and a first protective layer 4 (a cross section orthogonal to the length direction of the laminate is shown. Figure). As shown in FIG. 9, this laminated body can be thinned by cutting with laser processing along the length direction at the cutting locations 11, 11. That is, by dividing the laminate into a plurality of pieces in the width direction, a plurality of laminates having a width narrower than that of the original laminate can be manufactured. Dross may adhere to the surface of the laminate during the cutting process. Dross may cause a problem in the appearance of the wire and a decrease in film adhesion when a film is formed on the surface of the wire.
The thinned superconducting wire can be the target of the processing method of the embodiment. According to the treatment method of the embodiment, the dross attached to the surface of the superconducting wire can be removed, so that the appearance of the superconducting wire can be improved. Further, the adhesion of the film can be improved when the film is formed on the surface of the superconducting wire in the next step.

Although the present invention has been described above based on the preferred embodiments, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention.
The mechanism by which the fiber assembly captures the deposits on the surface of the wire is not particularly limited. For example, the fiber assembly may capture the deposit of the wire material by electrical adsorption (electrostatic adsorption).
In the processing method of the embodiment, the wire rod is moved with respect to the fiber aggregate, but the wire rod may be moved relative to the fiber aggregate. Therefore, either the wire rod or the fiber assembly may move.
Since the treatment method of the embodiment is one step in manufacturing the wire rod, it can be said to be an embodiment of the “wire rod manufacturing method”.

Although the superconducting wire rod 10 having the structure shown in FIG. 8 has been described as the processing target of the processing method of the embodiment, the processing target is not limited to this. 10 to 13 are schematic diagrams showing a structural example of a wire rod to be processed. As shown in FIG. 10, the processing target may be the first structure (wire 10A) in which the base material 1 and the intermediate layer 2 are laminated. As shown in FIG. 11, the processing target may be a second structure (wire 10B) in which a base material 1, an intermediate layer 2, and an oxide superconducting layer 3 are laminated in this order. As shown in FIG. 12, the treatment target may be a third structure (wire 10C) in which a base material 1, an intermediate layer 2, an oxide superconducting layer 3, and a first protective layer 4 are laminated in this order. .. As shown in FIG. 13, the processing target may be the fourth structure (wire 10D) in which the second protective layer 6 is provided on the outer surface of the wire 10C (see FIG. 12). The superconducting wire 10 shown in FIG. 8 is the fifth structure.

DESCRIPTION OF SYMBOLS 1... Base material, 2... Intermediate layer, 3... Oxide superconducting layer (superconducting layer), 4... 1st protective layer, 6... 2nd protective layer, 8... Stabilizing layer, 10... Superconducting wire (wire), 10A. -10D... wire rod, 10a... 1st surface (surface of superconducting wire), 10b... 2nd surface (surface of superconducting wire), 20... pressing member, 30... fiber aggregate, 50... adherent, W... superconducting wire Width, W1... Width of the fiber assembly.

Claims (6)

A method for treating a wire rod, which comprises performing a dry process of moving the wire rod relative to the fiber aggregate while bringing the fiber aggregate into contact with the surface of the wire rod. The method for treating a wire rod according to claim 1, wherein in the treatment, the wire rod is caused to travel in the length direction while the fiber aggregate is in contact with the wire rod. The method for treating a wire rod according to claim 1, wherein the fiber assembly is pressed against the wire rod during the treatment. The wire includes (i) a first structure in which a base material and an intermediate layer are laminated, (ii) a second structure in which a base material, an intermediate layer, and a superconducting layer are laminated in this order, and (iii) a base material. And a third structure in which an intermediate layer, an oxide superconducting layer, and a first protective layer are laminated in this order, (iv) a base material, an intermediate layer, an oxide superconducting layer, and a first protective layer are laminated in this order. It is one of a fourth structure having a second protective layer formed on the surface of the laminate, and (v) a fifth structure having a stabilizing layer formed on the surface of the fourth structure. The method for treating the wire according to any one of 1 to 3. The wire rod processing method according to any one of claims 1 to 4, wherein the wire rod is a wire rod thinned by laser processing. The method for treating a wire rod according to claim 1, wherein the fiber assembly has a widthwise dimension of the wire rod that is 1.5 times or more the width of the wire rod.

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