JP2020107460A - Lighting device - Google Patents

Lighting device Download PDF

Info

Publication number
JP2020107460A
JP2020107460A JP2018244410A JP2018244410A JP2020107460A JP 2020107460 A JP2020107460 A JP 2020107460A JP 2018244410 A JP2018244410 A JP 2018244410A JP 2018244410 A JP2018244410 A JP 2018244410A JP 2020107460 A JP2020107460 A JP 2020107460A
Authority
JP
Japan
Prior art keywords
cover
lighting device
light emitting
resin
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018244410A
Other languages
Japanese (ja)
Inventor
山岡 裕幸
Hiroyuki Yamaoka
裕幸 山岡
英司 宮脇
Eiji Miyawaki
英司 宮脇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Priority to JP2018244410A priority Critical patent/JP2020107460A/en
Publication of JP2020107460A publication Critical patent/JP2020107460A/en
Pending legal-status Critical Current

Links

Images

Abstract

To provide a lighting device which can be easily manufactured while improving airtightness between a cover part and a housing part.SOLUTION: A lighting device according to the invention includes: a light emission part having a semiconductor light-emitting element; a housing part which houses the light emission part; and a cover part which covers the light emission part. The cover part has: a cover under part which contacts with the housing part; and a cover body part. The cover under part is made of a material which is softer than the cover body part, serves as a contact point between the housing part and the cover part, and is disposed so as to fill a gap therebetween.SELECTED DRAWING: Figure 3

Description

本発明は、防虫、防水性に優れ、生産性の優れた照明装置に関するものである。 The present invention relates to a lighting device which is excellent in insect proofing and waterproofing and has excellent productivity.

従来のダウンライトに用いられる照明装置として、防水、防虫を目的として、シリコンゴム製のパッキンを用いて、カバーと外部ケースの隙間を埋める照明装置が知られている。 2. Description of the Related Art As a conventional lighting device used for a downlight, a lighting device that fills a gap between a cover and an outer case by using a silicone rubber packing for waterproofing and insect repellent is known.

特許文献1には、カバー部とカバー部を収容するケース部との間に、シリコン製のパッキンを用いて、カバー部とケース部の隙間を埋め、カバー部とケース部との隙間を埋め、ダウンライトに対して、浸水や虫の侵入を防ぐ照明装置が開示されている。 In Patent Document 1, a silicon packing is used between the cover part and the case part that accommodates the cover part to fill the gap between the cover part and the case part, and to fill the gap between the cover part and the case part. A lighting device that prevents flooding and insects from entering a downlight is disclosed.

特開2017−68936号公報JP, 2017-68936, A

しかしながら、従来のダウンライト照明では、各部品を個別で製作し、後工程で手作業により組み立てを行うことが多く、作業性が悪く、また、パッキンの取付忘れによる不良品の発生の恐れがあった。 However, in conventional downlight illumination, each component is often manufactured individually and assembled manually in the post process, which results in poor workability and may cause defective products due to forgetting to attach the packing. It was

本発明は、上記課題を鑑みてなしたものであり、その目的は、カバー部と収容部の間の気密性を高めつつ、容易に製造できる照明装置を提供することである。 The present invention has been made in view of the above problems, and an object thereof is to provide an illuminating device that can be easily manufactured while enhancing the airtightness between the cover portion and the housing portion.

上記課題を解決するために、本発明に係る照明装置は、半導体発光素子を有する発光部と、前記発光部を収容する収容部と、前記発光部を覆うカバー部と、を備え、前記カバー部は、前記収容部と接触するカバーアンダー部と、カバー本体部とを有し、前記カバーアンダー部は前記カバー本体部より柔らかい素材であり、前記収容部と前記カバー部との接点となり、隙間を埋めるように配置されている。 In order to solve the above problems, a lighting device according to the present invention includes a light emitting section having a semiconductor light emitting element, a housing section for housing the light emitting section, and a cover section for covering the light emitting section. Has a cover under portion that comes into contact with the accommodating portion and a cover main body portion, and the cover under portion is a material that is softer than the cover main body portion, and serves as a contact point between the accommodating portion and the cover portion to form a gap. It is arranged to fill.

本発明によれば、カバー部と収容部の間の隙間の気密性が高められ、かつ、防水性、防虫性、気密性を高める目的で取り付けるパッキンの取付忘れを防止する照明装置が実現される。 ADVANTAGE OF THE INVENTION According to this invention, the illuminating device which improves the airtightness of the clearance gap between a cover part and a storage part, and prevents forgetting to attach the packing attached in order to improve waterproofness, insect-proof property, and airtightness is implement|achieved. ..

実施の形態に係る照明装置の外観斜視図である。It is an appearance perspective view of the lighting installation concerning an embodiment. 実施の形態に係る照明装置の分解斜視図である。It is a disassembled perspective view of the illuminating device which concerns on embodiment. 実施の形態に係る照明装置の断面図である。It is sectional drawing of the illuminating device which concerns on embodiment. 実施の形態に係る照明装置のカバー部を上方から見た斜視図である。It is the perspective view which looked at the cover part of the lighting installation concerning an embodiment from the upper part. 実施の形態に係る照明装置のカバー部の断面図である。It is sectional drawing of the cover part of the illuminating device which concerns on embodiment.

以下、実施の形態について、図面を参照しながら説明する。なお、以下で説明する実施の形態は、本発明を具体化した一例であり、本発明を限定する主旨のものではない。 Hereinafter, embodiments will be described with reference to the drawings. The embodiment described below is an example of embodying the present invention and is not intended to limit the present invention.

図1は、本発明に係る照明装置1の外観斜視図である。本発明に係る照明装置1は、図1に示すように、例えば、天井部材に形成された埋込孔に設置される埋込型照明器具(ダウンライト)を用いた照明装置である。 FIG. 1 is an external perspective view of a lighting device 1 according to the present invention. As shown in FIG. 1, a lighting device 1 according to the present invention is a lighting device that uses, for example, an embedded lighting fixture (downlight) installed in an embedded hole formed in a ceiling member.

照明装置1は、天井部材に取り付けられ、天井部材の上面(天井裏)には、照明装置1を点灯させるための電源回路が配置されている。 The lighting device 1 is attached to a ceiling member, and a power supply circuit for lighting the lighting device 1 is arranged on the upper surface (under the ceiling) of the ceiling member.

照明装置1は、電源線を介して、電源回路と電気的に接続されている。電源回路は、外部の商用交流電源(図示しない)と電気的に接続されており、商用交流電源から入力される電力を直流電力に変換して照明装置1に供給する。なお、電源回路は、照明装置1の基板上に発光部と一体となって内蔵されてもよい。 The lighting device 1 is electrically connected to a power supply circuit via a power supply line. The power supply circuit is electrically connected to an external commercial AC power supply (not shown), converts electric power input from the commercial AC power supply into DC power, and supplies the DC power to the lighting apparatus 1. The power supply circuit may be incorporated on the substrate of the lighting device 1 integrally with the light emitting unit.

次に、照明装置1の詳細な構成について説明する。図2は本発明に係る照明装置1の主な構成の分解斜視図であり、図3は本発明に係る照明装置1の断面図である。図2に示すように、照明装置1は、発光部2と、発光部2が収容される収容部3と、発光部2を覆うカバー部4とを備える。 Next, a detailed configuration of the lighting device 1 will be described. 2 is an exploded perspective view of the main configuration of the lighting device 1 according to the present invention, and FIG. 3 is a cross-sectional view of the lighting device 1 according to the present invention. As shown in FIG. 2, the lighting device 1 includes a light emitting unit 2, a housing unit 3 in which the light emitting unit 2 is housed, and a cover unit 4 that covers the light emitting unit 2.

発光部2は、本体部21と、本体部21の下面に接続され、中心から外側面に向かって傾斜している傾斜面22を有している。傾斜面22は、略円筒形状であり、略円筒形状の中心であり、本体部21の中心部に設けられた凹部に発光モジュール23が載置されている。 The light emitting portion 2 has a main body portion 21 and an inclined surface 22 that is connected to the lower surface of the main body portion 21 and is inclined from the center toward the outer side surface. The inclined surface 22 has a substantially cylindrical shape and is the center of the substantially cylindrical shape, and the light emitting module 23 is placed in a recess provided in the central portion of the main body portion 21.

本体部21の側面には、カバー部4を取り付ける際に、カバー部4を固定する凸部が設けられており、発光部2とカバー部4は凹凸の嵌合によって固定される。 The side surface of the main body portion 21 is provided with a convex portion that fixes the cover portion 4 when the cover portion 4 is attached, and the light emitting portion 2 and the cover portion 4 are fixed by fitting the concave and convex portions.

傾斜面22の傾斜面は、反射機能を有しており、発光モジュール23が点灯した際の光を傾斜面22で反射することで、より多くの光を提供する
なお、傾斜面22の傾斜面には、反射板を別途備えていてもよく、、反射板の下方に水平方向に導光板を備えてもよい。
The inclined surface of the inclined surface 22 has a reflection function, and provides more light by reflecting the light when the light emitting module 23 is turned on by the inclined surface 22. In addition, a reflection plate may be separately provided, or a light guide plate may be horizontally provided below the reflection plate.

発光モジュール23は、例えば、基板と複数の半導体発光素子を有する発光モジュール23であり、半導体発光素子としては、LED、有機ELなどが用いられる。発光モジュール23は、照明装置1の光源として機能する。 The light emitting module 23 is, for example, a light emitting module 23 having a substrate and a plurality of semiconductor light emitting elements, and an LED, an organic EL, or the like is used as the semiconductor light emitting element. The light emitting module 23 functions as a light source of the lighting device 1.

基板は、例えば、略四角形状の基板であり、アルミ二ウム、セラミック、熱伝導性樹脂などの材料により形成される。 The substrate is, for example, a substantially quadrangular substrate, and is made of a material such as aluminum, ceramics, or a heat conductive resin.

基板の上面には、基板の接点に直接電気線を繋いで電気的に接続されている。 The upper surface of the substrate is electrically connected to the contacts of the substrate by directly connecting electrical lines.

なお、基板の上面に半導体発光素子への給電用のコネクタを設けて、電気線と電気的に接続させたり、端子を接点に接触させて電気的に接続させてもよい。 A connector for supplying power to the semiconductor light emitting element may be provided on the upper surface of the substrate to be electrically connected to an electric wire, or a terminal may be brought into contact with a contact to be electrically connected.

反射板は、平面視形状が略円形上の板状の部材であり、導光板と対向配置されている。反射板は、導光板内を導光する半導体発光素子からの光を反射する。 The reflection plate is a plate-shaped member having a substantially circular shape in a plan view, and is arranged to face the light guide plate. The reflection plate reflects light from the semiconductor light emitting element that guides the light inside the light guide plate.

反射板は、例えば、高反射ポリカーボネート樹脂、高反射ナイロン樹脂、高反射ポリブチレンテレフタレート樹脂、高反射発泡樹脂などの光反射の高い材料により形成される。 The reflector is made of a material having a high light reflection such as a highly reflective polycarbonate resin, a highly reflective nylon resin, a highly reflective polybutylene terephthalate resin, and a highly reflective foamed resin.

導光板は、半導体発光素子が発する光を導光して面発光する光学部材である。導光板は
、反射板と同様の略円形上の板状部材であり、例えば、アクリル樹脂、ポリカーボネート樹脂、ポリスチレン樹脂、ガラスなどの透光性材料により形成される。
The light guide plate is an optical member that guides the light emitted by the semiconductor light emitting element to emit light in a plane. The light guide plate is a substantially circular plate-like member similar to the reflection plate, and is formed of a translucent material such as acrylic resin, polycarbonate resin, polystyrene resin, or glass.

収容部3は、略台形円錐状のケース本体31の上方に略円柱形状のケース取付部32が一体となって成型されており、例えば、アルミ合金、鉄などの耐熱性、放熱性に優れた金属材料で形成されている。 The accommodating portion 3 is formed by integrally forming a case mounting portion 32 having a substantially columnar shape above a case body 31 having a substantially trapezoidal cone shape, and is made of, for example, an aluminum alloy, iron or the like, which has excellent heat resistance and heat dissipation. It is made of metal material.

カバー部4は、カバー本体部41とカバー本体部41を収容部3に取り付ける取付部42が一体となって構成されており、カバー本体部41は、反射板24、導光板25を含む発光部2を上方から覆う略円柱形の光学部材である。 The cover portion 4 is configured by integrally forming a cover body portion 41 and a mounting portion 42 that attaches the cover body portion 41 to the housing portion 3. The cover body portion 41 includes a light emitting portion including a reflection plate 24 and a light guide plate 25. 2 is a substantially cylindrical optical member that covers 2 from above.

カバー部4は、例えば、ポリエチレン樹脂、アクリル樹脂、ポリカーボネート樹脂などの透光性樹脂により形成される。カバー部4に用いられる透光性樹脂は、光拡散性、耐光性、耐熱性を持ち、成形がしやすく、射出成型が可能な樹脂であればよい。本実施の形態では、アクリル樹脂を用いたものについて説明する。 The cover portion 4 is formed of a translucent resin such as polyethylene resin, acrylic resin, or polycarbonate resin. The translucent resin used for the cover 4 may be any resin that has light diffusivity, light resistance, and heat resistance, is easy to mold, and is injection-moldable. In the present embodiment, an acrylic resin will be described.

取付部42は、略円形状を有し、発光部2と収容部3との間に形成される隙間に嵌めこむ形で取り付けられ、取付部42の外径は、カバー本体部41の外径よりも小さい。 The mounting portion 42 has a substantially circular shape and is mounted so as to fit into a gap formed between the light emitting portion 2 and the housing portion 3. The outer diameter of the mounting portion 42 is the outer diameter of the cover body portion 41. Smaller than.

また、カバー本体部41と取付部42との境界部分は、カバー本体部41の外径部が突出しており、突出した部分の平面上、かつ、取付部42の外周側にカバーアンダー部43が形成されている。 At the boundary between the cover body 41 and the mounting portion 42, the outer diameter portion of the cover body 41 projects, and the cover under portion 43 is provided on the plane of the projecting portion and on the outer peripheral side of the mounting portion 42. Has been formed.

カバーアンダー部43は、照明装置1に防虫性、防水性を持たせる作用があり、照明装置1の点灯時に影が生じにくい透明または半透明の部材であり、厚さは2mm〜4mm 程度である。 The cover under portion 43 is a transparent or translucent member that has an action of making the lighting device 1 insect-proof and waterproof, and is less likely to cause a shadow when the lighting device 1 is turned on, and has a thickness of about 2 mm to 4 mm. ..

カバーアンダー部43は、収容部3にカバー部4を取り付けた際に形成される隙間をなくし、カバーアンダー部43は収容部3に密着するように取り付けられる。 The cover under portion 43 eliminates a gap formed when the cover portion 4 is attached to the accommodation portion 3, and the cover under portion 43 is attached so as to be in close contact with the accommodation portion 3.

カバーアンダー部43は、カバー本体部41と取付部42との境界部分に融着して取り付けられる略円形状の部材であり、例えば、スチロール樹脂、オリフェン樹脂、ポリエチレン樹脂などの熱可塑性樹脂により形成される。 The cover under portion 43 is a substantially circular member that is fused and attached to the boundary portion between the cover body portion 41 and the attachment portion 42, and is formed of, for example, a thermoplastic resin such as styrene resin, orifene resin, or polyethylene resin. To be done.

また、カバーアンダー部43に用いられる熱可塑性樹脂は、主に熱可塑性エラストマであり、カバー部4に用いられる樹脂よりも弾性の優れた樹脂材料であり、硬度15度〜40度 の範囲でカバー部4に用いられる樹脂材料よりも軟らかい樹脂材料である。 The thermoplastic resin used for the cover under portion 43 is mainly a thermoplastic elastomer, which is a resin material having a higher elasticity than the resin used for the cover portion 4, and has a hardness in the range of 15 to 40 degrees. The resin material is softer than the resin material used for the part 4.

この際、カバーアンダー部43に用いる樹脂材料は、カバー部4に用いる樹脂材料融点よりも低い温度で変形する樹脂材料であることが好ましい。 At this time, the resin material used for the cover under portion 43 is preferably a resin material that deforms at a temperature lower than the melting point of the resin material used for the cover portion 4.

また、カバーアンダー部43に用いられる熱可塑性樹脂の条件としては、耐光性、耐熱性に優れており、成形しやすい樹脂材料であればよく、収容部3とカバー部4との間に形成される隙間を埋めるように変形できるものであればよい。 The thermoplastic resin used for the cover under portion 43 may be a resin material that is excellent in light resistance and heat resistance and can be easily molded, and may be formed between the housing portion 3 and the cover portion 4. Any material can be used as long as it can be deformed to fill the gap.

より具体的には、収容部3の中に発光部2が収容され、カバー部4は発光部2を覆うように収容部3の内側に配置され、取付部42が発光部2の側面に備えられている凸部に嵌合することにより固定される。 More specifically, the light emitting part 2 is housed in the housing part 3, the cover part 4 is arranged inside the housing part 3 so as to cover the light emitting part 2, and the mounting part 42 is provided on the side surface of the light emitting part 2. It is fixed by fitting into the convex portion.

この際に、収容部3とカバー部4の間には、隙間ができることがあるが、パッキン機能
を持つカバーアンダー部43をカバー部4の外周側に配置することにより、カバーアンダー部43が収容部3とカバー部4の隙間の形に沿うように押し潰されるように変形し、収容部3とカバー部4の間に形成される小さな隙間を埋める機能を有する。
At this time, a gap may be formed between the housing portion 3 and the cover portion 4, but by disposing the cover under portion 43 having a packing function on the outer peripheral side of the cover portion 4, the cover under portion 43 is accommodated. It has a function of being deformed so as to be crushed so as to follow the shape of the gap between the portion 3 and the cover portion 4, and filling a small gap formed between the housing portion 3 and the cover portion 4.

これにより、収容部3とカバー部4の間の気密性が高められ、照明装置1の防水性、防虫性を高めることができる。 Thereby, the airtightness between the housing portion 3 and the cover portion 4 is enhanced, and the waterproofness and insect repellency of the lighting device 1 can be enhanced.

次に、カバー部4とカバーアンダー部43の製造方法について説明する。カバー部4とカバーアンダー部43は、双方とも射出成型により成型される樹脂材料からなっており、射出機から金型に樹脂材料が射出され、自然冷却されることで成型される。 Next, a method of manufacturing the cover portion 4 and the cover under portion 43 will be described. Both the cover part 4 and the cover under part 43 are made of a resin material that is molded by injection molding, and the resin material is injected from the injection machine into the mold and naturally cooled.

本実施の形態では、カバー部4とカバーアンダー部43の成型は、射出成型機Aと射出成型機Bを用いた2色成型によりカバー部4とカバーアンダー部43を一体に成型する。 In the present embodiment, the cover part 4 and the cover under part 43 are molded integrally by two-color molding using the injection molding machine A and the injection molding machine B.

カバー部4の成型に用いる金型Aとカバーアンダー部43の成型に用いる金型Bを上下方向に重ねて配置し、射出成型機Aから金型Aにカバー部4の成型に用いる熱可塑性樹脂材料Aを射出し、射出成型機Bから金型Bにカバーアンダー部43の成型に用いる熱可塑性樹脂Bが射出されるように金型A,B、および、射出成型機A、Bが配置される。 A mold A used for molding the cover part 4 and a mold B used for molding the cover under part 43 are arranged in a vertically overlapping manner, and a thermoplastic resin used for molding the cover part 4 from the injection molding machine A to the mold A. The molds A and B and the injection molding machines A and B are arranged so that the material A is injected and the thermoplastic resin B used for molding the cover under portion 43 is injected from the injection molding machine B into the mold B. It

まず、射出成型機Aから金型Aに樹脂材料Aが射出され、カバー部4を成型する。次に、金型Aで成型されたカバー部4を上方に設置した金型Bに移動させ、射出成型機Bから金型Bに樹脂材料Aよりも融点の低い樹脂材料Bを射出し、カバー部4にカバーアンダー部43を融着させる形で成型する。 First, the resin material A is injected from the injection molding machine A into the mold A to mold the cover portion 4. Next, the cover 4 molded by the mold A is moved to the mold B installed above, and the resin material B having a lower melting point than the resin material A is injected from the injection molding machine B into the mold B to cover the cover. The cover under portion 43 is fused and bonded to the portion 4.

この際、射出成型機Bから金型Bへの樹脂材料Bの射出と同時に射出成型機Aから金型Aへ樹脂材料Aが射出され、次のカバー部4が成型されることで、カバー部4、および、カバーアンダー部43の生産性を向上させることができる。 At this time, the resin material A is injected from the injection molding machine A into the mold A at the same time as the injection of the resin material B from the injection molding machine B into the mold B, and the next cover part 4 is molded, so that the cover part 4 is formed. 4 and the productivity of the cover under portion 43 can be improved.

なお、樹脂材料Aの硬化中に樹脂材料Bを射出することにより、硬化中の樹脂材料Aに樹脂材料Bをより融着させやすくなり、カバー部4とカバーアンダー部43の隙間と融着させることで双方の密着強度を向上させることができる。 By injecting the resin material B during the curing of the resin material A, the resin material B is more easily fused to the resin material A being cured, and is fused with the gap between the cover portion 4 and the cover under portion 43. This can improve the adhesion strength between the two.

また、カバー部4とカバーアンダー部43を融着させる構成としたが、融着しなくても成型後に密着していればよく、
以上説明したように、照明装置1は、発光部2と、発光部2を収容する収容部3と、発光部2を覆うカバー部4と、を備え、カバー部4は収容部3と接触するカバーアンダー部43と、カバー本体部41とを有し、カバーアンダー部43はカバー本体部41より柔らかい素材であり、収容部3とカバー部4により外郭を形成している。
Further, although the cover portion 4 and the cover under portion 43 are configured to be fusion-bonded to each other, they may be adhered after molding without fusion,
As described above, the lighting device 1 includes the light emitting unit 2, the housing unit 3 that houses the light emitting unit 2, and the cover unit 4 that covers the light emitting unit 2, and the cover unit 4 contacts the housing unit 3. The cover under section 43 and the cover main body section 41 are provided. The cover under section 43 is a material softer than the cover main body section 41, and the housing section 3 and the cover section 4 form an outer shell.

このように、カバーアンダー部43がカバー部4に隙間やずれなどが生じないように密着して成型されることによって、収容部3とカバー部4の気密性が高められ、防水、防虫性が優れた照明装置1が実現される。さらに、カバー部4にパッキン機能を有するカバーアンダー部43が密着されて成型されることで、パッキンの取付忘れが防止される。 In this way, the cover under portion 43 is molded in close contact with the cover portion 4 so as not to cause a gap or a shift, whereby the airtightness of the housing portion 3 and the cover portion 4 is enhanced, and the waterproof and insect-proof properties are improved. An excellent lighting device 1 is realized. Further, since the cover under portion 43 having a packing function is closely attached to the cover portion 4 and is molded, it is possible to prevent forgetting to attach the packing.

また、カバー部3とカバーアンダー部43は2色成型により、カバー部3にカバーアンダー部43が融着する形で成型される。これにより、カバー部3とカバーアンダー部43は融着して同時に成型されるため、従来防虫・防水目的で取り付けられていたパッキンの取付作業工程を省略することが可能となり、照明装置1の生産性を向上させることができる。 Further, the cover part 3 and the cover under part 43 are molded by two-color molding so that the cover under part 43 is fused to the cover part 3. As a result, the cover part 3 and the cover under part 43 are fused and molded at the same time. Therefore, it is possible to omit the packing work process which has been conventionally mounted for insect repellent/waterproof purposes, and to manufacture the lighting device 1. It is possible to improve the sex.

以上、本実施の形態に係る照明装置について説明したが、本発明は、このような実施の形態に限定されるものではない。 Although the illumination device according to the present embodiment has been described above, the present invention is not limited to such an embodiment.

例えば、上記の実施の形態では、発光モジュールには、発光素子としてLEDが用いられていたが、半導体レーザ、有機ELなどの半導体発光素子を用いてもよい。 For example, in the above-described embodiment, the light emitting module uses the LED as the light emitting element, but a semiconductor light emitting element such as a semiconductor laser or an organic EL may be used.

また、上記の実施の形態では、照明装置のカバー部の外観形状は略円形状であったが、多角形状、楕円形状、円形に近い多角形状など、照明装置の機能が失われない形状であればどんな形状であってもよい。 Further, in the above embodiment, the outer shape of the cover portion of the lighting device is a substantially circular shape, but may be a shape such as a polygonal shape, an elliptical shape, a polygonal shape close to a circle, or the like that does not lose the function of the lighting device. It may have any shape.

また、収容部およびカバー部の形状に伴い、カバーアンダー部の形状は変更可能であり、収容部とカバー部により形成される隙間の形状に応じて、隙間を完全に埋める形状に変形するように成形することが好ましい。 Further, the shape of the cover under portion can be changed according to the shapes of the accommodating portion and the cover portion, and the shape of the cover under portion can be changed so as to completely fill the gap according to the shape of the gap formed by the accommodating portion and the cover portion. Molding is preferred.

また、上記の実施の形態では、カバー部とカバーアンダー部の成型について、2色成型の際に2つの金型を上下方向に並べたが、これに限られるものではない。例えば、左右方向に並べて設置したり、縦方向に並べて設置してもよい。金型Aで成形したカバー部を金型Bに移動できる配置であればよい。 Further, in the above-described embodiment, the two dies are vertically arranged in the two-color molding for molding the cover portion and the cover under portion, but the present invention is not limited to this. For example, they may be installed side by side in the left-right direction or may be installed side by side in the vertical direction. Any arrangement may be used as long as the cover formed by the mold A can be moved to the mold B.

また、上記の実施の形態では、カバー部とカバーアンダー部の成型について、2色成型によって融着して成型する製造方法であったが、これに限られるものではなく、他の複合成型方法を用いてもよい。 Further, in the above-mentioned embodiment, the cover portion and the cover under portion are molded by the two-color molding method by fusion-bonding, but the present invention is not limited to this, and other composite molding methods may be used. You may use.

1 照明装置
2 発光部
3 収容部
4 カバー部
21 本体部
22 傾斜面
23 発光モジュール
24 反射板
25 導光板
31 ケース本体
32 ケース取付部
41 カバー本体部
42 取付部
43 カバーアンダー部
DESCRIPTION OF SYMBOLS 1 Lighting device 2 Light emitting part 3 Housing part 4 Cover part 21 Main body part 22 Sloping surface 23 Light emitting module 24 Reflecting plate 25 Light guide plate 31 Case main body 32 Case mounting part 41 Cover main part 42 Mounting part 43 Cover under part

Claims (10)

半導体発光素子を有する発光部と、
前記発光部を収容する収容部と、
前記発光部を覆うカバー部と、を備え、
前記カバー部は、前記収容部と接触するカバーアンダー部と、カバー本体部とを有し、
前記カバーアンダー部は前記カバー本体部より柔らかい素材であり、
前記収容部と前記カバー部との接点となり隙間のないように配置されている
照明装置
A light emitting portion having a semiconductor light emitting element,
A housing portion housing the light emitting portion,
A cover portion that covers the light emitting portion,
The cover portion has a cover under portion that contacts the housing portion, and a cover body portion,
The cover under section is made of a softer material than the cover body section,
An illuminating device that serves as a contact point between the accommodating portion and the cover portion and is arranged without a gap
前記カバー部は、樹脂材料で形成され、
前記カバーアンダー部の樹脂材料は、前記カバー本体部の樹脂材料より硬度の低い樹脂材料である
請求項1に記載の照明装置。
The cover part is made of a resin material,
The lighting device according to claim 1, wherein the resin material of the cover under portion is a resin material having a hardness lower than that of the resin material of the cover body portion.
前記カバーアンダー部は、前記カバー本体部に密着されて成形されている
請求項1または2に記載の照明装置。
The lighting device according to claim 1, wherein the cover under portion is formed in close contact with the cover main body portion.
前記カバー部は射出成形により成形され、
前記カバーアンダー部と前記カバー本体部は、二色成形により密着されて成形される
請求項1〜3のいずれか一項に記載の照明装置。
The cover portion is molded by injection molding,
The lighting device according to any one of claims 1 to 3, wherein the cover under portion and the cover main body portion are closely formed by two-color molding.
前記カバーアンダー部は、前記本体部に融着されて一体に成型されている
請求項1~4のいずれか一項に記載の照明装置。
The lighting device according to any one of claims 1 to 4, wherein the cover under portion is fused and integrally formed with the main body portion.
前記第1の材料は、透光性樹脂である
請求項1〜5のいずれか一項に記載の照明装置。
The lighting device according to claim 1, wherein the first material is a translucent resin.
前記第2の材料は、熱可塑性樹脂である
請求項1〜6のいずれか一項に記載の照明装置。
The lighting device according to claim 1, wherein the second material is a thermoplastic resin.
前記半導体発光素子はLEDである
請求項1〜7のいずれか一項に記載の照明装置。
The lighting device according to claim 1, wherein the semiconductor light emitting element is an LED.
前記第2の材料は、スチロール系熱可塑性樹脂である
請求項1〜8のいずれか一項に記載の照明装置。
The lighting device according to claim 1, wherein the second material is a styrene thermoplastic resin.
前記第2の材料は、ポリスチレン系熱可塑性樹脂である
請求項1〜8のいずれか一項に記載の照明装置。


The lighting device according to claim 1, wherein the second material is a polystyrene-based thermoplastic resin.


JP2018244410A 2018-12-27 2018-12-27 Lighting device Pending JP2020107460A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018244410A JP2020107460A (en) 2018-12-27 2018-12-27 Lighting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018244410A JP2020107460A (en) 2018-12-27 2018-12-27 Lighting device

Publications (1)

Publication Number Publication Date
JP2020107460A true JP2020107460A (en) 2020-07-09

Family

ID=71449341

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018244410A Pending JP2020107460A (en) 2018-12-27 2018-12-27 Lighting device

Country Status (1)

Country Link
JP (1) JP2020107460A (en)

Similar Documents

Publication Publication Date Title
JP5859985B2 (en) LIGHTING DEVICE AND HOLDER MANUFACTURING METHOD
JP4681071B1 (en) lighting equipment
KR100631903B1 (en) High power LED housing and its manufacturing method
KR100715039B1 (en) lamp assembly using light emitting diode
CN105492820B (en) By the assembling for the semiconductor lamp that the component independently manufactured is constituted
KR20150018493A (en) Vehicular lighting instrument semiconductor light source light source unit and vehicular lighting instrument
JP2013175465A (en) Light-emitting element lamp and lighting fixture
JP3156685U (en) Light bulb lamp
US20140118990A1 (en) Led module
WO2015133045A1 (en) Lighting apparatus
CN108458291A (en) Floodlight tube module and preparation method thereof and floodlight tube combination
US20180080619A1 (en) Light device comprising a surface light source
JP5768966B2 (en) Lamp apparatus and lighting apparatus
JP6331193B2 (en) LED unit and lighting apparatus using the same
KR200426124Y1 (en) Lamp using LED
JP2020107460A (en) Lighting device
JP2012099358A (en) Lamp device and lighting system
JP6112403B2 (en) Lighting device
JP5723825B2 (en) Base, illumination lamp, and base manufacturing method
KR101404555B1 (en) Led fish-luring lamp
JP6704116B2 (en) lighting equipment
KR200426125Y1 (en) Lamp using LED
JP2012074134A (en) Light-emitting device and lighting fixture equipped with light-emitting device
JP2006324529A (en) Light emitting diode line module
KR20200070661A (en) Slim type LED recessed luminaire

Legal Events

Date Code Title Description
RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20190124