JP2020065327A - Electronic component module, electric connection box, and wire harness - Google Patents

Abstract

To provide an electronic component module capable of suppressing a temperature rise, and to also provide an electric connection box or a wire harness which is configured by comprising the electronic component module.SOLUTION: An electronic component module 1 is configured by comprising: a substrate 36 on which a relay 42hot that is an electric heating body is mounted; a box-shaped cover 2 in which the entire substrate 36 is accommodated; and a connector block 47 integrally including a connector 37 to be a connection destination of an external mating connector. The cover 2 includes a housing insertion hole 8. The housing insertion hole 8 is a portion for exposing a housing 49 of the connector 37 outsides. The substrate 36 includes a metallic heat radiation bus bar 43 extending from the vicinity of the relay 42hot to a connection side of the connector 37. Heat generated by the relay 42hot is conducted upwards by the heat radiation bus bar 43 and radiated to the outside by air passing a clearance between the housing insertion hole 8 and the housing 49.SELECTED DRAWING: Figure 8

Description

  The present invention relates to an electronic component module including a substrate, a box-shaped cover that houses the entire substrate, and a connector block having a connector. In addition, the present invention relates to an electric connection box including the electronic component module and a wire harness.

  A technique regarding an electronic component module and an electric connection box is disclosed in, for example, Patent Document 1 below. The electronic component module includes a bottomed cylindrical cover, a substrate accommodated inside the cover from the outside, and a connector block having a connector portion. The electronic component module is formed such that the bottom of the cover is at the top and the connector block is at the bottom. The electrical connection box is configured to include the electronic component module and a frame that accommodates and locks the electronic component module inside. The electric junction box is mounted on a vehicle, and the electronic component module includes, for example, a relay module.

JP, 2017-103914, A

  The above-mentioned conventional technique has a problem that the heat of the relay mounted on the substrate is trapped in the cover, which raises the temperature of the electronic component module. If the temperature of the electronic component module rises, it will affect the electrical junction box equipped with this electronic component module.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide an electronic component module capable of suppressing a temperature rise. Another object is to provide an electrical junction box and a wire harness that are equipped with this electronic component module.

  The electronic component module of the present invention according to claim 1, which is made to solve the above-mentioned problems, includes a substrate on which an electronic component that is a heating element is mounted, a box-shaped cover that accommodates the entire substrate, and an external component. A connector block to which the mating connector is connected, and the connector is connected to the substrate, wherein the cover has a ceiling wall located on the upper side and a bottom wall located on the lower side. And a plurality of side walls positioned between them, and one side wall of the plurality of side walls has a housing insertion hole for exposing the housing of the connector to the outside, and the housing insertion hole, The heat dissipation bus made of metal, which is disposed and formed on the side of the ceiling wall of the one side wall, extends from the vicinity of the electronic component mounted on the side of the bottom wall toward the connection side of the connector. Has over, heat generated by the electronic component is characterized in that it is released to the outside by the air passing through the gap between and the housing insertion hole and the housing is transmitted upwardly by the heat radiating busbar.

  According to the present invention having the characteristics of claim 1, since the structure is such that a gap is formed between the housing insertion hole and the housing, heat is not trapped inside the cover and the external space is provided through the gap. Can be released to. Further, according to the present invention, because of the structure having the heat dissipation bus bar, even if the mounting of the electronic component as the heating element is sufficiently separated from the gap, that is, the bottom wall side of the cover, It can be drawn close to the gap, thus contributing to discharge (heat dissipation) through the gap.

  According to a second aspect of the present invention, in the electronic component module according to the first aspect, the heat dissipation bus bar has a substantially bridge shape in which an intermediate portion of the heat dissipation bus bar is separated from the mounting surface of the substrate at a predetermined interval. A guide rib is formed on the inner surface of the cover to guide the middle of the heat dissipation bus bar.

  According to the present invention having the features of claim 2, the structure is such that the heat dissipation bus bar provided on the substrate is guided by the guide ribs on the inner surface of the cover. It is possible to facilitate the operation and to contribute to the prevention of rattling of the substrate after accommodating the substrate.

  According to a third aspect of the present invention, in the electronic component module according to the first or second aspect, the cover includes an upper cover and an under cover that are divided according to the position of the housing insertion hole. A double wall structure is formed in the cover and the connector by a cover wall at an opening edge of the housing insertion hole and a flange-shaped flange wall of the housing.

  According to the present invention having the features of the third aspect, since the double-wall structure is formed, it is possible to make it difficult for moisture to enter from the outside even if there is a gap. According to the present invention, it is possible to provide an electronic component module having both a heat dissipation structure and a waterproof structure.

  Further, an electrical junction box of the present invention according to claim 4 made to solve the above-mentioned problems is an electronic component module according to claim 1, 2 or 3, and a frame to which the electronic component module is assembled. And a lid member that covers a frame opening portion of the frame.

  According to the present invention having the features of claim 4 as described above, since the electronic component module having the above effect is provided, it is possible to provide a better electric junction box.

  The wire harness of the present invention according to claim 5 made to solve the above problems is characterized in that the terminal is equipped with the electric connection box according to claim 4 and is routed to an automobile.

  According to the present invention having the features of claim 5 as described above, since the electronic component module having the above effect is provided, it is possible to provide a better wire harness.

  According to the electronic component module of the present invention, it is possible to suppress the temperature rise of the electronic component module due to the structure having the gap between the housing insertion hole and the housing and the heat dissipation bus bar. Further, according to the electric connection box and the wire harness of the present invention, since the electronic component module having the above-described effect is provided, it is possible to provide a better product.

It is a perspective view (including a mating connector) showing an embodiment of an electronic component module of the present invention. It is a perspective view of an electronic component module. It is an exploded perspective view of an electronic component module. It is sectional drawing of an upper cover, (a) is an AA line sectional view, (b) is a BB line sectional view, (c) is a CC sectional view. It is sectional drawing of an undercover, (a) is DD sectional drawing, (b) is EE sectional drawing, (c) is FF sectional drawing. It is a figure of a substrate, (a) is a top view and (b) is a GG line sectional view. It is a longitudinal cross-sectional view of an electronic component module. It is a longitudinal cross-sectional view of an electronic component module. It is an enlarged view of the box H of FIG. FIG. 9 is an enlarged view of box I in FIG. 8. It is an enlarged view of the circle J of FIG. It is an enlarged view of the circle K of FIG.

  The electronic component module has a substrate on which an electronic component that is a heating element is mounted, a box-shaped cover that accommodates the entire substrate, and a connector that is a connection destination of an external mating connector, and the connector is a substrate. And a connector block connected to. The cover has a ceiling wall located on the upper side, a bottom wall located on the lower side, and a plurality of side walls located between them. Further, the cover has a housing insertion hole in one of the plurality of side walls. The housing insertion hole is a portion for exposing the housing of the connector to the outside and is arranged and formed on the side of the ceiling wall of the one side wall. The substrate has a metal heat dissipation bus bar extending from the vicinity of the electronic component mounted on the bottom wall side toward the connection side of the connector. The heat generated by the electronic component is transmitted upward by the heat dissipation bus bar and is released to the outside by the air passing through the gap between the housing insertion hole and the housing.

  Hereinafter, embodiments will be described with reference to the drawings. FIG. 1 is a perspective view (including a mating connector) showing an embodiment of an electronic component module of the present invention. 2 is a perspective view of the electronic component module, FIG. 3 is an exploded perspective view of the electronic component module, FIG. 4 is a sectional view of an upper cover, FIG. 5 is a sectional view of an under cover, FIG. 6 is a substrate diagram, and FIG. 8 is a longitudinal section of the electronic component module, FIG. 9 is an enlarged view of the box H in FIG. 7, FIG. 10 is an enlarged view of the box I in FIG. 8, FIG. 11 is an enlarged view of the circle J in FIG. 9, and FIG. It is an enlarged view of the circle K of FIG.

  1 to 3, the arrow P indicates the up-down direction, the arrow Q indicates the left-right direction, and the arrow R indicates the front-back direction.

<About electrical junction box>
For example, an electric connection box mounted on a vehicle is provided on a side of a wire harness (not shown) arranged at a predetermined position of the vehicle on which a terminal 7 described later is provided. The wire harness is installed to electrically connect the devices. The electrical junction box includes an electronic component module 1, a frame (not shown, which constitutes an electrical junction box main body) for accommodating and locking an undercover 10 side of the electronic component module 1, which will be described later, and the electronic component module 1 And a lid member that covers the frame opening of the frame from above. The electrical junction box is the attachment destination of the electronic component module 1.

<About the configuration of the electronic component module 1>
1 to 3, the electronic component module 1 is called, for example, a relay module or a device control module, and the former will be described as an example here. The electronic component module 1 as a relay module includes a box-shaped cover 2 and a substrate ASSY 3 housed in the cover 2. In the present embodiment, the electronic component module 1 may be regarded as having a smaller electric connection box in the electric connection box. As will be understood from the following description, the electronic component module 1 can suppress the temperature rise more than the conventional example.

  Reference numerals 4 to 6 in FIG. 1 denote mating connectors provided on the terminal 7 of the wire harness. The mating connectors 4 to 6 each include a terminal fitting provided on the electric wire of the terminal 7 and a connector housing that houses the terminal fitting. There are three mating connectors 4 to 6 in this embodiment, but this number is not particularly limited.

<About cover 2 and housing insertion hole 8>
1 to 4, the cover 2 is a box-shaped resin molded product that entirely accommodates the substrate ASSY 3, and includes an upper cover 9 and an under cover 10 that are divided according to the positions of the housing insertion holes 8. It is configured with. The cover 2 is arranged such that the upper cover 9 is on the upper side and the under cover 10 is on the lower side in the vertical direction of the arrow P. The housing insertion hole 8 of the cover 2 projects the housings 49 to 51 of the board ASSY3 described later to electrically connect the mating connectors 4 to 6 and the connectors 37 to 39 (described later) of the board ASSY3. It is formed in a portion where As will be described below, the housing insertion hole 8 is formed in an opening portion such that the upper cover 9 side is cut out.

<About the upper cover 9>
2 to 4, the upper cover 9 has a front wall 11, a rear wall 12, a left wall 13, and a right wall 14 as side walls, and is formed in the illustrated shape having a ceiling wall 15 and an opening 16. . A housing insertion hole 8 is formed in a front wall 11 (one side wall) of the upper cover 9. An opening 16 is arranged below the upper cover 9. In the vicinity of the opening 16, a plurality of engaging holes 17 that are engaging portions with the under cover 10 are formed. Various ribs are arranged and formed on the inner surface of the upper cover 9 in accordance with the substrate ASSY 3. For example, the ribs indicated by reference numerals 18 and 19 are arranged and formed so as to match the side portion and the back surface of the substrate 36 described later. Further, the rib indicated by reference numeral 20 is arranged and formed so as to match with housings 49 and 51 described later. The rib 20 is formed in a portion of the housing 49, 51 facing a rear end portion of a flange wall 53, which will be described later.

  The upper cover 9 is formed in a shape in which the depth from the opening 16 to the ceiling wall 15 is sufficiently shallower than that of the under cover 10. Further, the upper cover 9 is formed in a shape in which the side walls (the front wall 11, the rear wall 12, the left wall 13, and the right wall 14) are stepped on the side of the opening 16. In addition, the stepped shape refers to a shape that includes a contact portion 21 that abuts a peripheral edge of an opening 28 described later of the under cover 10 and surrounds a part of an outer surface of the under cover 10 (FIG. 7 and FIG. 8).

<About housing insertion hole 8>
2 to 4, the housing insertion hole 8 is formed as a portion through which the housings 49 to 51 described later are projected, as described above. In other words, it is formed as a portion exposing the housings 49 to 51 to the outside. The housing insertion hole 8 is formed in the illustrated shape so as to largely cut out the front wall 11 of the upper cover 9. Of course, the housing insertion hole 8 has a complete hole shape after the upper cover 9 and the under cover 10 are engaged with each other. In the present embodiment, the housing insertion hole 8 has a shape in which only the front wall 11 of the upper cover 9 is cut out, but the shape is not limited to this, and the shape of the under cover 10 side may be cut out.

  A portion of the front wall 11 that serves as an opening edge of the housing insertion hole 8, that is, an opening edge portion indicated by reference numeral 22 is formed in a portion that constitutes a double wall structure 54 with a flange wall 53 of the housings 49 to 51 described later. It The opening edge portion 22 is a minute portion between the flange wall 53 and the front surface of the flange wall 53 and the portion overlapping the front end of the flange wall 53. A gap S1 (see FIG. 11, which will be described later) is formed to form the minute gap S1 in a maze-like portion. The opening edge portion 22 is a portion that corresponds to the “cover wall of the opening edge of the housing insertion hole” described in the claims together with the opening edge portion 30 described later.

<About undercover 10>
2, 3, and 5, the undercover 10 has a front wall 23, a rear wall 24, a left wall 25, and a right wall 26, which are side walls, and a bottom wall 27 and an opening 28. Is formed. An opening 28 is arranged on the upper side of the under cover 10. In the vicinity of the opening 28, a plurality of engaging protrusions 29 that are engaging portions with the upper cover 9 are formed. A portion which becomes an opening edge of the housing insertion hole 8, that is, an opening edge portion 30 on the side of the under cover 10 is formed at the upper end of the front wall 23 (one side wall) forming the opening 28. The opening edge portion 30 is a portion that is located behind the rear surface of the flange wall 53, a portion that overlaps with the rear surface end portion of the flange wall 53, and a minute gap between the opening edge portion 30 and the flange wall 53. S2 (see FIG. 12, which will be described later) is generated to form this minute gap S2 in a labyrinthine portion.

  A plurality of substantially hook-shaped receiving portions 31 are formed on the outer surface near the upper end of the front wall 23. The receiving portion 31 is formed in a portion into which a flange wall 53, which will be described later, is inserted when the upper cover 9 and the under cover 10 are engaged with each other, and in a portion capable of receiving the inserted flange wall 53. It In addition, the receiving portion 31 is formed in a portion that restricts the forward movement of the flange wall 53.

  On the outer surface of the under cover 10, a lock portion 32 for attachment to the frame (not shown) is formed. Further, various ribs are arranged and formed on the inner surface of the under cover 10 in accordance with the substrate ASSY 3. For example, the ribs indicated by reference numerals 33 and 34 are arranged and formed so as to match the side portion and the back surface of the substrate 36 described later. Further, the guide ribs indicated by reference numeral 35 are arranged and formed so as to match the heat dissipation bus bar 43 described later. The rib 33 is formed in a portion that guides a side portion of the substrate 36. The rib 34 is formed in a portion facing the back surface of the substrate 36.

  The guide rib 35 is formed as a portion that guides a later-described middle 44 of the heat dissipation bus bar 43 (see FIGS. 7 and 8). The guide ribs 35 are formed so as to extend straight in the insertion direction (vertical direction) of the substrate 36. The guide ribs 35 are formed, together with the ribs 33 and 34, as a portion that facilitates the substrate housing operation when housing the substrate 36 and contributes to preventing rattling of the substrate 36 after housing the substrate. The guide rib 35 is arranged and formed on the inner surface of the front wall 23. The guide rib 35 has a tapered portion (reference numeral omitted) on the side of the opening 28. The tapered portion is formed at the guide portion (wide portion) of the heat dissipation bus bar 43 at the start of housing.

<About substrate ASSY3>
In FIGS. 3 and 6, the board ASSY 3 includes a board 36 and connectors 37 to 39 mounted on the board 36. The board ASSY 3 is a member housed in the box-shaped cover 2 including the upper cover 9 and the under cover 10. The board ASSY 3 and the mating connectors 4 to 6 (see FIG. 1) via the connectors 37 to 39 and the inside of the cover 2 are connected to each other. It is configured so that it can be electrically connected to the substrate 36. The board ASSY 3 is arranged inside the cover 2 in a “vertical” state in which the directions of the front and back surfaces of the board 36 are aligned with the front-back direction of the arrow R, and the connectors 37 to 39 mounted on the board 36 are located on the upper side. Housed in.

<About the substrate 36>
In FIGS. 3 and 6, the substrate 36 has a substrate body 40 which is a plate-shaped member having a rectangular shape when viewed from the front and back directions (the front and rear direction of the arrow R). On the back surface of the substrate body 40, a desired circuit (not shown) is formed. In addition, a large number of small through holes (reference numeral omitted) are formed in the substrate body 40. A plurality of resistors 41, relays 42, and heat dissipation bus bars 43 are mounted on the front surface side (mounting surface side) of such a substrate body 40 using the through holes. The resistor 41, the relay 42, and the heat dissipation bus bar 43 are connected to the circuit by soldering on the back surface side. A pin terminal 52, which will be described later, which constitutes the connectors 37 to 39 is also inserted into the through hole and then connected to the circuit by soldering.

<About the relay 42>
In FIG. 6, the relay 42 opens and closes a switch by an input signal given to the coil, and a known one is used. In this embodiment, ten relays 42 are mounted on the front surface side of the substrate body 40. The relay 42 is a heating element that generates heat when operated by energization. Of the 10 relays 42, those that are far from the connectors 37 to 39 (indicated by reference numeral 42hot; in other words, the four located in the bottom row) are heating elements that generate particularly large amounts of heat. Is. The four relays 42 hot are arranged on the side of the under cover 10 near the bottom wall 27. The four relays 42 hot will increase the ambient temperature on the side near the bottom wall 27 (including air). Since this temperature rise leads to a temperature rise of the electronic component module 1 itself, the heat dissipation bus bar 43 described below is effective as a countermeasure. The four relays 42hot correspond to the "electronic component that is a heating element" described in the claims.

  The upper relay 42, which does not correspond to the four relays 42hot, is also a heating element in reality, but since it is mounted at a position close to the gaps S1 and S2 described later, the air passing through the gaps S1 and S2 cannot be used. It will be released to the outside.

<About the heat dissipation bus bar 43>
3 and 6, the heat dissipating bus bar 43 is a member for "heat-extracting" the heat of the lower portion of the substrate body 40 warmed by the four relays 42 hot to the vicinity of the mounting portions of the connectors 37 to 39. And is formed by pressing a metal plate having high thermal conductivity. The heat dissipation bus bar 43 efficiently "heats" the heat of the lower portion of the substrate body 40 (specifically, the heat generated in the soldering portion) to the vicinity of the mounting portions of the connectors 37 to 39, so that the middle 44 is the substrate body. It is formed in a substantially bridge shape separated from the surface (mounting surface) of 40 at a predetermined interval. Three heat dissipation bus bars 43 are used in this embodiment, and each of them is arranged so as to extend straight in the vertical direction. The heat dissipation bus bar 43 has the above-described shape and arrangement, and the air passes through the gaps S1 and S2 to be described later, so that a temperature gradient is generated between the lower leg portion 45 and the upper leg portion 46. Therefore (especially because the middle portion 44 is floated so that the temperature gradient is easily generated), it is possible to efficiently “heat-extract”. The heat dissipation bus bar 43 of the present embodiment is used not only for "heat extraction" but also as a circuit. The use as a circuit has an advantage that the circuit pattern of the upper relay 42 can be widened, thereby reducing the current value flowing around the upper relay 42.

<About the connectors 37 to 39 and the connector block 47>
3, FIG. 6, FIG. 7, FIG. 8, FIG. 9, and FIG. 10, the connectors 37 to 39 are formed into a block-shaped member that is integrated side by side. In this embodiment, this is called a connector block 47. The connector block 47 has a pair of fixed leg portions 48, and is screwed to the vicinity of the upper end of the substrate body 40 via the pair of fixed leg portions 48. The connectors 37 to 39 include resin housings 49 to 51, and a plurality of metal pin terminals 52 having one end protruding into the housings 49 to 51 and the other end connected to the circuit by soldering. To be done.

  The housings 49 to 51 are formed according to the housing shapes of the mating connectors 4 to 6. A flange wall 53 is integrally formed on the intermediate outer surface of the housings 49 to 51. The flange wall 53 is formed in a flange-shaped (collar-shaped) wall portion that surrounds the side-by-side housings 49 to 51 over the entire circumference. The flange wall 53 is formed in a portion which overlaps with the opening edge portion 22 of the upper cover 9 (which faces the opening edge portion 22 with a gap S1 described later). This overlapping portion is formed as a double wall structure 54 on the upper cover 9 side (see FIGS. 9 and 10). Further, the flange wall 53 is formed in a portion that overlaps with the opening edge portion 30 of the under cover 10 (it is assumed to face each other with a gap S2 described later). This overlapping portion is formed as a double wall structure 55 on the under cover 10 side (see FIGS. 9 and 10). The double wall structure 54, 55 is formed as a portion that makes it difficult for moisture to enter. It should be noted that the flange wall 53 is not required to be formed (the formation of the double wall structures 54 and 55) if there is no risk of water intrusion.

<Assembly of electronic component module 1>
In FIG. 3, the substrate ASSY 3 is accommodated from the lower end on the mounting side of the four relays 42 hot inside the undercover 10 with the opening 28 facing upward, and after this, the upper cover 9 with the opening 16 facing downward is undercovered. When engaged with 10, the assembly of the electronic component module 1 is completed. The electronic component module 1 is assembled in a state where the housings 49 to 51 are exposed to the outside through the housing insertion hole 8.

<Regarding suppression of temperature rise in electronic component module 1>
In FIGS. 7 and 8, the heat of the lower portion of the substrate body 40 (specifically, the heat generated in the soldering portion) warmed by the four relays 42 hot warms the ambient air and the like. The warmed air rises toward the connectors 37-39. On the other hand, the heat of the heated lower portion of the substrate body 40 is “heated” upward by the heat dissipation bus bar 43. 9 and 10, gaps S1 and S2 (see FIGS. 11 and 12) are formed between the housing insertion hole 8 and the housings 49 to 51 around the mounting portion of the connector block 47 near the upper end of the substrate body 40. Since it occurs, the air passing through the gaps S1 and S2 radiates heat to the outside. The warm air or the like does not collect inside the upper cover 9, and as a result of the above heat dissipation, the temperature rise in the electronic component module 1 is suppressed.

<Effects of electronic component module 1>
As described above with reference to FIGS. 1 to 12, according to the electronic component module 1 of the embodiment of the present invention, the gaps S1 and S2 are provided between the housing insertion hole 8 and the housings 49 to 51. Because of the structure for generating heat, heat can be released to the outside through the gaps S1 and S2 without trapping heat in the cover 2. Further, according to the electronic component module 1, since it has the structure including the heat dissipation bus bar 43, even if the mounting of the relay 42hot serving as a heating element is sufficiently separated from the gaps S1 and S2, the heat is released from the gap S1. It can be drawn close to S2, which can contribute to discharge (heat dissipation) through the gaps S1 and S2.

  Therefore, according to the electronic component module 1, the temperature rise of the electronic component module 1 can be suppressed by the structure having the gaps S1 and S2 between the housing insertion hole 8 and the housings 49 to 51 and the heat dissipation bus bar 43. Play. Further, according to the electric connection box and the wire harness (not shown), since the electronic component module 1 having the above-mentioned effect is provided, it is possible to provide a better product.

  Needless to say, the present invention can be modified in various ways without departing from the spirit of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Electronic component module, 2 ... Cover, 3 ... Board ASSY, 4-6 ... Mating connector, 7 ... Terminal, 8 ... Housing insertion hole, 9 ... Upper cover, 10 ... Undercover, 11 ... Front wall (side wall, one) Side wall), 12 ... rear wall, 13 ... left wall, 14 ... right wall, 15 ... ceiling wall, 16 ... opening, 17 ... engaging hole, 18-20 ... rib, 21 ... contact portion, 22 ... opening edge Part (cover wall), 23 ... Front wall (side wall, one side wall), 24 ... Rear wall, 25 ... Left wall, 26 ... Right wall, 27 ... Bottom wall, 28 ... Opening, 29 ... Engaging protrusion, 30 ... Opening edge part (cover wall), 31 ... Receiving part, 32 ... Lock part, 33, 34 ... Rib, 35 ... Guide rib, 36 ... Board, 37-39 ... Connector, 40 ... Board body, 41 ... Resistance, 42 ... Relay , 42hot ... Relay (electronic component that is a heating element), 43 ... Thermal bus bar, 44 ... Intermediate, 45 ... Lower leg, 46 ... Upper leg, 47 ... Connector block, 48 ... Fixed leg, 49-51 ... Housing, 52 ... Pin terminal, 53 ... Flange wall, 54, 55 … Double wall structure, S1, S2… Gap

Claims (5)

A board on which electronic components that are heating elements are mounted,
A box-shaped cover that accommodates the entire substrate,
An external mating connector, which has a connector to be connected to, and a connector block to which the connector is connected to the substrate,
The cover has a ceiling wall located on the upper side, a bottom wall located on the lower side, and a plurality of side walls positioned between them, and one of the plurality of side walls has a housing for the connector. Has a housing insertion hole for exposing the
The housing insertion hole is arranged and formed on the side of the ceiling wall in the one side wall,
The substrate has a metal heat dissipation bus bar extending from the vicinity of the electronic component mounted on the bottom wall side toward the connection side of the connector,
The electronic component module is characterized in that heat generated by the electronic component is transferred upward by the heat dissipation bus bar and is radiated to the outside by air passing through a gap between the housing insertion hole and the housing. The electronic component module according to claim 1,
The heat dissipation bus bar is formed in a substantially bridge shape in which the middle of the heat dissipation bus bar is separated from the mounting surface of the substrate at a predetermined interval.
An electronic component module, wherein a guide rib is formed on an inner surface of the cover to guide the middle of the heat dissipation bus bar. The electronic component module according to claim 1 or 2,
The cover is configured to include an upper cover and an under cover that are divided according to the position of the housing insertion hole,
An electronic component module, wherein a double wall structure is formed in the cover and the connector by a cover wall at an opening edge of the housing insertion hole and a flange-shaped flange wall of the housing. An electrical junction box comprising: the electronic component module according to claim 1, 2 or 3, a frame to which the electronic component module is assembled, and a lid member that covers a frame opening of the frame. A wire harness, characterized in that the terminal is equipped with the electrical connection box according to claim 4 and is routed to an automobile.

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