JP2020059046A - High-frequency induction heating head, and high-frequency induction heating device with use thereof - Google Patents

Abstract

To provide a high-frequency induction heating head and a high-frequency induction heating device with use of the same for improving productivity.SOLUTION: A high-frequency induction heating head comprises: core bodies 8, 9 in which heating parts 8c, 9c provided on respective tip sides thereof are so located on one side surface of a printed wiring board 3 as to face each other with a first gap therebetween; and a movable mechanism which can move at least one of these core bodies 8, 9, and adjusts a distance of the first gap interposed between a heating part 8c of the core body and a heating part 9c of the core body 9. The core bodies 8, 9 are magnetically coupled at shaft support parts 8a, 9a other than the heating parts 8c, 9c of the core bodies 8, 9 via a second gap smaller than the first gap which exists between the heating parts 8c, 9c of the core bodies 8, 9 during heating.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a high frequency induction heating head and a high frequency induction heating device using the same.

  As a method of soldering components on a circuit board, by arranging first and second core bodies on the upper and lower sides of the circuit board and supplying magnetic flux from the heating coil to the first and second core bodies. A method for soldering an electronic component mounted on a circuit board has been proposed (the following Patent Document 1 is similar to this, and Patent Document 1 below exists).

It is also proposed that one annular core body is arranged on the surface of a circuit board, and a magnetic flux is supplied to the core body from a heating coil.
In this core body, a cutout portion is provided in a part of the annular core body, the cutout portion is moved to a soldering place, the solder is melted in the cutout portion, and soldering is performed (this The following patent document 2 exists as a prior document similar to the above).

JP 2000-42730 A JP, 2014-120649, A

In the former prior art, since the first and second core bodies are arranged above and below the circuit board, only the soldering portion on the circuit board sandwiched between the first and second core bodies is provided. You will be able to heat.
Therefore, there is an advantage that it is unnecessary to inadvertently heat other electronic components on the circuit board.

However, other components are mounted on the upper and lower surfaces of the circuit board, and the sizes and heights of the components are different, so in consideration of them, the first and second core bodies are desired. It is very difficult to move to the location of, and productivity improvement is required.
Therefore, in the latter prior document, one core body is arranged on the surface of the circuit board, and the magnetic flux is supplied to the core body from the heating coil. This can be done only on the top, and in that respect, workability can be improved.

However, in this latter prior document, since the size of the cutout portion of the core body is fixed, the core body is replaced depending on the condition of the soldering portion, that is, the size and shape of the component to be soldered. The need arises, and in that respect, improving productivity is an issue.
Then, this invention aims at improving productivity.

In order to achieve this object, in the high frequency induction heating head of the present invention, on one surface side of the circuit board, the heating units provided on the respective tip sides are arranged to face each other with a first gap therebetween. A second core body and at least one of the first and second core bodies are movable, and a first core body exists between the heating section of the first core body and the heating section of the second core body. And a movable mechanism that adjusts the distance of the distance between the first and second core bodies, wherein the first and second core bodies are portions other than the heating portion of the first and second core bodies, and The second core body is magnetically coupled via a second gap that is smaller than the first gap that exists between the heating portions of the two core bodies.
A high frequency induction heating apparatus using a high frequency induction heating head has a configuration in which an XY table is arranged on the tip side of the heating parts of the first and second cores.

  As described above, in the high-frequency induction heating head of the present invention, the first and second core bodies in which the heating portions provided on the respective tip sides on the one surface side of the circuit board are arranged to face each other with the first gap therebetween. And moving at least one of the first and second core bodies to adjust the distance of the first interval existing between the heating portion of the first core body and the heating portion of the second core body. The first and second core bodies are parts other than the heating part of the first and second core bodies, and the first and second core bodies are heated at the time of heating. It is configured to be magnetically coupled via a second gap that is smaller than the first gap that exists between the parts.

Therefore, it suffices to move the high-frequency induction heating head on one surface of the circuit board, and since the facing distance between the heating portions of the first and second core bodies can be changed, the shape and size of the heating portion can be changed. Also, since it is not necessary to replace the high frequency induction heating head, the productivity can be improved also in this respect.
Further, since the high-frequency induction heating device using this high-frequency induction heating head has a configuration in which the XY table is arranged on the tip side of the heating parts of the first and second cores, the high-frequency induction heating head moves up and down. It suffices to perform the opening / closing operation, which simplifies the configuration and improves productivity.

It is a perspective view of the high frequency induction heating device using the high frequency induction heating head concerning one embodiment of the present invention. FIG. 3 is a front view of the same high frequency induction heating device. FIG. 3 is a right side view of the same high frequency induction heating device. FIG. 3 is a left side view of the same high frequency induction heating device. FIG. 3 is a plan view of the same high frequency induction heating device. FIG. 3 is a perspective view showing an example of a sample for soldering using the same high-frequency induction heating device. FIG. 3 is a partially enlarged perspective view of a high frequency induction heating head of the same high frequency induction heating device. FIG. 6 is a diagram explaining the operation of the high frequency induction heating head of the high frequency induction heating device. FIG. 6 is a diagram explaining the operation of the high frequency induction heating head of the high frequency induction heating device. FIG. 3 is a control block diagram of the same high frequency induction heating device. FIG. 6 is a diagram explaining the operation of the high frequency induction heating head of the high frequency induction heating device. FIG. 6 is a diagram explaining the operation of the high frequency induction heating head of the high frequency induction heating device. FIG. 6 is a diagram explaining the operation of the high frequency induction heating head of the high frequency induction heating device. FIG. 6 is a diagram explaining the operation of the high frequency induction heating head of the high frequency induction heating device. FIG. 6 is a diagram explaining the operation of the high frequency induction heating head of the high frequency induction heating device. FIG. 6 is a diagram explaining the operation of the high frequency induction heating head of the high frequency induction heating device. FIG. 6 is a diagram explaining the operation of the high frequency induction heating head of the high frequency induction heating device. FIG. 6 is a diagram explaining the operation of the high frequency induction heating head of the high frequency induction heating device. FIG. 6 is a diagram explaining the operation of the high frequency induction heating head of the high frequency induction heating device. FIG. 6 is a diagram explaining the operation of the high frequency induction heating head of the high frequency induction heating device. FIG. 6 is a diagram explaining the operation of the high frequency induction heating head of the high frequency induction heating device. 6 is a flowchart illustrating the operation of the high frequency induction heating device. 6 is a flowchart illustrating the operation of the high frequency induction heating device.

An embodiment of the present invention will be described below with reference to the accompanying drawings.

(Embodiment 1)
1 to 5 show a high-frequency induction heating device, which includes a high-frequency induction heating head 1 and an XY table 2.
As an example of a wiring board, a printed wiring board 3 shown in FIG. 6 is mounted on the movable frame 2a of the XY table 2 as shown in FIGS.
On the printed wiring board 3 used in this embodiment, an electronic component 4 is temporarily fixed to the lower surface of the printed wiring board 3 with an adhesive (not shown), and as shown in FIG. The through hole 6 provided in the substrate 3 penetrates from below to above, and its tip projects above the printed wiring board 3.

Further, lands 7 for soldering are provided by copper or the like in the through holes 6 of the printed wiring board 3 shown in FIG. 6 and at the opening edges of the through holes 6 on the upper and lower surfaces of the printed wiring board 3. ing.
Further, cream solder is applied to the land 7 in advance.

  In the present embodiment, as shown in FIGS. 1 to 5, on the upper surface side of the printed wiring board 3, the high frequency induction heating head 1 heats the terminals 5 of the electronic component 4 and the cream solder of the lands 7 to form a cream. The solder is melted, and a part of the melted solder is also flown into the through hole 6, whereby the terminal 5 of the electronic component 4 is electrically and mechanically connected to the land 7 part and the through hole 6. .

Now, as shown in FIGS. 1 to 5, the high frequency induction heating head 1 for performing such soldering is provided with core bodies 8 and 9 made of, for example, a soft magnetic material such as ferrite.
Each of the core bodies 8 and 9 has a C shape, and they are assembled with their opening sides facing each other.

Specifically, the core body 8 is provided with a shaft supporting portion 8a on the upper side, a magnetic path portion 8b on the middle portion, and a heating portion 8c on the lower side.
Similarly, the core body 9 is provided with a shaft supporting portion 9a on the upper side, a magnetic path portion 9b on the middle portion, and a heating portion 9c on the lower side.

Then, as described above, the core bodies 8 and 9 are combined with their opening sides facing each other.
At this time, the shaft-supporting portions 8a and 9a of the core bodies 8 and 9 are overlapped, and in this state, the through-holes (not shown) provided in the shaft-supporting portions 8a and 9a are inserted into the shaft-supporting portions 8a and 9a as shown in FIGS. As shown, the rotation support shaft 10 is penetrated.
That is, the core bodies 8 and 9 are rotatably supported around the rotation support shaft 10.

The description of the core bodies 8 and 9 will be continued.
Although these core bodies 8 and 9 are formed of plate-like bodies, the cross-sectional area in the plate thickness direction in the heating portions 8c and 9c (the area of the cross section existing there when cut in the plate thickness direction) is The cross-sectional area in the plate thickness direction in the vicinity of the magnetic path parts 8b and 9b and the shaft support parts 8a and 9a (the area of the cross section existing there when cut in the plate thickness direction) is made smaller.

  That is, as shown in FIGS. 11 and 12, when the high frequency induction heating head 1 heats the terminals 5 of the electronic component 4 and the cream solder of the lands 7 to melt the cream solder, the core body 8, The heating portions 8c, 9c of 9 are brought close (in a non-contact state) to both sides of the terminal 5, but in order to heat only the target terminal 5 and to concentrate the magnetic flux, the core body 8, It is preferable that the heating portions 8c and 9c of 9 are downsized (the cross-sectional area in the plate thickness direction is reduced).

  On the other hand, the magnetic path portions 8b and 9b and the shaft supporting portions 8a and 9a have a cross-sectional area in the plate thickness direction (when cutting in the plate thickness direction, the cross-sectional areas of the magnetic path parts 8b and 9a are so arranged that the magnetic flux can easily pass through). It is necessary to make the area) larger than the cross-sectional area of the heating portions 8c and 9c in the plate thickness direction (the area of the cross section existing there when cut in the plate thickness direction).

In addition, the cross-sectional area in the plate thickness direction (area of the cross section existing there when cut in the plate thickness direction) in the vicinity of the shaft supporting portions 8a and 9a is measured in the plate thickness direction in the magnetic path parts 8b and 9b. It is made larger than the cross-sectional area (the area of the cross section existing there when cut in the plate thickness direction).
This is because even when the core bodies 8 and 9 perform the opening / closing operation, magnetic flux flows between the shaft supporting portions 8a and 9a through the gaps existing in the overlapping and sliding portions, so that the shaft supporting portion 8a , 9a are made larger so that the magnetic flux easily flows between the shaft support portions 8a, 9a and the magnetic flux is not concentrated on a part of the shaft support portions 8a, 9a.

  In consideration of such a situation, the distance of the clearance (second interval) existing in the overlapping portion of the shaft supporting portions 8a and 9a is set to the distance (first interval) existing between the heating portions 8c and 9c during heating. It is made smaller than the above, so that the magnetic coupling at the shaft supporting portions 8a and 9a is effectively performed.

In addition, to explain this part in another expression, since the core bodies 8 and 9 are formed of plate-like bodies, they can be described in the following expression.
That is, when the core body 8 is viewed in a plan view, the axial support portion 8a has a larger plane area than the magnetic path portion 8b and the heating portion 8c.

Further, when the core body 9 is viewed in a plan view, the axial support portion 9a has a larger plane area than the magnetic path portion 9b and the heating portion 9c.
Then, since the core bodies 8 and 9 are opened and closed in a state in which the shaft supporting portions 8a having such large areas are overlapped as shown in FIGS. 2 and 11, the shaft supporting portions 8a and 9a are always large in area and narrow. Since they oppose each other at a distance, as a result, the magnetic resistance between the shaft supporting portions 8a and 9a is small, and the movement of the magnetic flux is effectively performed.

1 to 5, the configuration for opening and closing the core bodies 8 and 9 will be described.
One end of a rotary support shaft 10 for opening / closing (rotating) the core bodies 8 and 9 is fixed to the lower vertical surface of the base 11 in a horizontal state with the XY table 2.

The motor 12 is fixed to the upper horizontal surface of the base 11. Since this motor 12 is a general one composed of a stepping motor as disclosed in, for example, Japanese Patent Laid-Open No. 2016-59170, only a brief description will be given in order to avoid complication of the description.
That is, as described in JP-A-2016-59170, a male screw is formed on the inner shaft of the rotor magnet, and the moving body 13 that moves up and down is screwed onto the male screw of the shaft. .

The lower end of the moving body 13 is connected to the connecting portion 14 arranged above the core bodies 8 and 9.
Further, the link mechanisms 15 and 16 are connected to the connecting portion 14 so as to face each other in the left-right direction shown in FIG.
The link mechanisms 15 and 16 have a well-known structure and are composed of two bent plates. The joint part of the upper part is rotatably supported by the connecting part 14, and the joint part is also present in the middle part, and the lower part is , Are fixed to the shaft supporting portions 8a and 9a of the core bodies 8 and 9 by claws.

With the above configuration, by rotating the motor 12 in the normal direction or in the reverse direction, the moving body 13 is moved up and down, the connecting portion 14 is also moved up and down, and the bending state of the link mechanisms 15 and 16 is changed, whereby the core body is changed. The heating units 8c and 9c of 8 and 9 are opened and closed.
That is, as shown in FIG. 20, when the terminal 5 of the electronic component 4 is thin, the heating portions 8c and 9c of the core bodies 8 and 9 are brought close to each other (the gap between the heating portions 8c and 9c is narrow), and As shown in FIG. 21, when the terminal 5 of the electronic component 4 is thick, the heating parts 8c and 9c of the core bodies 8 and 9 are made wider than in FIG. 20 (the gap between the heating parts 8c and 9c is widened). .

Next, the vertical movement of the core bodies 8 and 9 will be described.
The base bodies 11 supporting the core bodies 8 and 9 and the motor 12 are connected to a vertical movement mechanism 17, and by moving the base body 11 up and down by the vertical movement mechanism 17, the core bodies 8 and 9 are also moved up and down.

  The vertical movement mechanism 17 causes the motor 18 to rotate the shaft 18 having a spiral groove on the outer periphery in the normal direction or the reverse direction to vertically move the coupling body 20 screwed and coupled to the outer periphery of the shaft 18 to move the coupling body 20. The base body 11 fixed to the above is moved up and down, whereby the core bodies 8 and 9 are moved up and down.

  Note that the motor 19 is also a general one, which is composed of a stepping motor as disclosed in, for example, Japanese Patent Laid-Open No. 2016-59170. Therefore, in order to avoid complication of the description, only a brief description will be given.

The motor 19 differs from the above-described motor 12 in that the shaft 18 is connected to the shaft of the internal rotor magnet. That is, the shaft 18 is configured to rotate.
In order to smoothly move the connecting body 20 up and down, a supporting shaft 21 is also provided in parallel with the shaft 18, so that the connecting body 20 to which the base 11 is fixed is supported by the shaft 18 and the supporting shaft 21. Will move up and down.

Next, the coil 22 for supplying the magnetic flux to the core bodies 8 and 9 will be described.
The coil 22 has a pipe shape in which cooling water is circulated, and is supplied with a current of 1 MHz and 100 A as an example.
Therefore, in order to stably supply the cooling water, the coil 22 is arranged in a fixed position above the XY table 2 as shown in FIGS. 13 to 19, and itself is basically not movable, The movable frame 2a of the XY table 2 and the core bodies 8 and 9 are moved.

FIG. 13 shows a state in which the core bodies 8 and 9 are lowered while the terminals 5 to be soldered of the printed wiring board 3 of FIG. 6 are moved to the set position by the XY table 2.
That is, at the time of soldering, as shown in FIG. 11, since the coil 22 must be present between the core bodies 8 and 9, the heating portions 8c and 9c are opened as shown in FIGS. 13 to 14. In this state, the core bodies 8 and 9 are lowered from above.

  Next, as described in FIGS. 20 and 21, the core bodies 8 and 9 are closed as shown in FIG. 15 up to the gap between the heating portions 8c and 9c corresponding to the thickness and shape of the terminal 5 to be heated. After that, as shown in FIGS. 15 to 16, the core bodies 8 and 9 are lowered to the position of the terminal 5 described in FIGS.

  Then, in this state, the coil 22 is energized, and the terminals 5 of the electronic component 4 and the cream solder of the land 7 are heated by the high-frequency induction heating head 1 on the upper surface side of the printed wiring board 3 so that the cream solder of the land 7 is heated. Is melted and a part thereof is also flown into the through hole 6, whereby the terminal 5 of the electronic component 4 is electrically and mechanically connected to the land 7 and the through hole 6.

Next, the power supply to the coil 22 is stopped, and the core bodies 8 and 9 are raised in the closed state as shown in FIGS.
In this embodiment, as shown in FIG. 6, since there are a plurality of terminals 5 of the same shape to be heated, in FIGS. 17 and 18, the gap between the heating portions 8c and 9c is maintained, and The core bodies 8 and 9 are raised until the coil 22 exists between the core bodies 8 and 9.

18, in that state, the XY table 2 is used to move the terminal 5 to be heated next to below the heating portions 8c and 9c, and then, as shown in FIG. Down to.
In this state, the coil 22 is energized, and the terminals 5 of the electronic component 4 and the cream solder of the land 7 are heated by the high frequency induction heating head 1 on the upper surface side of the printed wiring board 3 to melt the cream solder. , A part thereof is also made to flow into the through hole 6, so that the terminal 5 of the electronic component 4 is electrically and mechanically connected to the land 7 and the through hole 6.
Thereafter, FIGS. 15 to 19 are repeated to solder all the terminal 5 portions shown in FIG.
FIG. 10 shows a control circuit.

A motor (M1) 12 that opens and closes the core bodies 8 and 9 and a motor (M2) 19 that moves the core bodies 8 and 9 up and down are connected to a controller 23.
The X-axis motor (M3) 24 of the XY table 2, the Y-axis motor (M4) 25, the timer 26, and the memory 27 are also connected to the control unit 23.
Further, the coil 22 is connected to the control unit 23 via the inverter 28.
A stepping motor is also used as the motors 24 and 25 of the XY table 2.

  As is well known, for example, in Japanese Unexamined Patent Publication No. 2016-59170, the stepping motor is rotated by an angle peculiar to the stepping motor each time a pulse is applied, in the forward rotation direction and the reverse rotation direction. This is also adopted in the present embodiment because the control is accurate and simple.

Further, the fact that the current position can be detected by using a photo interrupter or a micro switch is also the reason why stepping motors are used as the motors 12, 19, 24 and 25.
Further, the position information for controlling the motors 12, 19, 24, 25 and the like are stored in the memory 27 together with the operation programs shown in FIGS. 22 and 23.

The operation of the above configuration will be described.
First, the controller 23 drives the XY table 2.
That is, since the setting positions of the terminals 5 to be soldered on the printed wiring board 3 shown in FIG. 6 are stored as position information in the memory 27, the XY table 2 is used to reach the positions shown in FIG. Are moved (S1, S2 in FIG. 22).

When the printed wiring board 3 is moved to the fixed position, the motor 19 lowers the core bodies 8 and 9 from above with the motors 8c and 9c opened as shown in FIGS. 13 to 14 (FIG. 22). S3).
When the core bodies 8 and 9 descend to the fixed positions (position information stored in the memory 27) shown in FIG. 14, the motor 12 closes the core bodies 8 and 9 (S4 and S5 in FIG. 22).

  As shown in FIG. 15, until the gap position (the position information is stored in the memory 27) between the heating portions 8c and 9c corresponding to the thickness and shape of the terminal 5 to be heated, which is described in FIGS. When 8 and 9 are closed, the motor 19 lowers the core bodies 8 and 9 (S6 in FIG. 22, S7 in FIG. 23).

  As shown in FIG. 16, when the core bodies 8 and 9 are lowered to the position of the terminal 5 (position information is stored in the memory 27) described in FIGS. 20 and 21, the inverter 28 starts energizing the coil 22. (S8 and S9 in FIG. 23).

  When the timer 26 determines that the energization time is completed, the energization of the coil 22 is stopped (S10 to S12 in FIG. 23).

7 to 9 are diagrams for explaining the heating operation by energizing the coil 22.
In the present embodiment, as shown in FIGS. 7 to 9, the facing distance between the heating portion 8c of the core body 8 and the heating portion 9c of the core body 9 at the time of heating is determined by the distance on the side of the shaft support portions 8a and 9a. The distance (T2) on the tip side (on the side of the printed wiring board 3) is made smaller than (T1).
Therefore, as shown in FIG. 8, the magnetic flux concentrates on the tip side of the heating portions 8c and 9c, that is, on the printed wiring board 3 side, and as a result, the terminal 5 of the electronic component 4 and the land 7 are formed. Of the cream solder is effectively heated in a short time to melt the cream solder, and a part of the cream solder is caused to flow into the through hole 6 as well, whereby the terminal 5 of the electronic component 4 is connected to the land 7 and the through hole. 6 can be electrically and mechanically connected.

  In addition, in the present embodiment, at least one of the heating portions 8c and 9c of the core bodies 8 and 9 (on the side of the printed wiring board 3) is provided with a tip magnetic flux that expands toward the tip side on the inside thereof. Reinforced portions 8d and 9d are provided. More specifically, as shown in FIG. 7, the heating portions 8c and 9c have a protruding shape directed downward (the printed wiring board 3 side can also be expressed as the opposite side to the shaft supporting portions 8a and 9a). Thus, the facing area is increased and a sufficient magnetic path can be formed to the lower end side. Then, in such a state that a sufficient magnetic path is formed up to the lower end portion, in that state, as described above, the tip magnetic flux strengthening portions 8d and 9d that expand the angle toward the tip side are provided inside each of them. ing.

  The tip magnetic flux strengthening portions 8d and 9d are also referred to as so-called C end surfaces on the tip side (the printed wiring board 3 side) of the heating portions 8c and 9c. By providing the tip magnetic flux strengthening portions 8d and 9d, As shown in FIG. 9, the magnetic flux amount toward the land 7 increases, and the solder previously applied on the land 7 melts in a short time and easily flows into the through hole 6 of the printed wiring board 3. As a result, the reliability of electrically and mechanically connecting the terminal 5 of the electronic component 4 to the land 7 and the through hole 6 is improved.

  By providing the tip magnetic flux strengthening portions 8d and 9d, the solder previously applied on the land 7 is melted in a short time and easily flows into the through hole 6 of the printed wiring board 3. Although the clear reason for this point has not been sufficiently clarified at present, a large amount of magnetic flux also flows in the solder on the land 7, the solder is melted, and Lorentz force acts on the melted solder, It is thought that this may be because the liquid state also occurs in itself.

When the soldering of the terminal 5 at the land 7 portion is completed as described above, the core bodies 8 and 9 are moved by the motor 19 to the fixed positions (position information is stored in the memory 27 in FIG. 18) as shown in FIGS. Memory) (S13, S14 in FIG. 23).
Then, in this embodiment, as shown in FIG. 6, since there are a plurality of terminals 5 to be soldered, as shown in FIGS. 17 to 18, in a state where the gap between the heating portions 8c and 9c is maintained, Moreover, the core bodies 8 and 9 are raised to the state where the coil 22 exists between the core bodies 8 and 9, and in this state, the printed wiring board 3 is moved by the XY table 2, and thereafter, as shown in FIG. As described above, the core bodies 8 and 9 are lowered and the next terminal 5 is soldered (S16, S17, S7 to S12 in FIG. 23).

  Then, when all the soldering is completed, in S15, since there is no next place for soldering, the heating portions 8c and 9c of the core bodies 8 and 9 are opened as shown in FIG. 14, and then, as shown in FIG. Then, the core bodies 8 and 9 are raised and the operation is stopped (S15, S18 to S22 in FIG. 23).

  INDUSTRIAL APPLICABILITY The present invention is utilized, for example, in solder connection of components to a printed wiring board.

1 High Frequency Induction Heating Head 2 XY Table 2a Movable Frame 3 Printed Circuit Board 4 Electronic Component 5 Terminal 6 Through Hole 7 Land 8 Core 8a Shaft Support 8b Magnetic Path 8c Heating 8d Tip Magnetic Flux Enhancement 9 Core 9a Shaft Support 9b Magnetic path portion 9c Heating portion 9d Tip magnetic flux strengthening portion 10 Rotating support shaft 11 Base body 12 Motor 13 Moving body 14 Connecting portion 15 Link mechanism 16 Link mechanism 17 Vertical moving mechanism 18 Shaft 19 Motor 20 Connecting body 21 Support shaft 22 Coil 23 Control Part 24 Motor 25 Motor 26 Timer 27 Memory 28 Inverter

Claims (12)

On one surface side of the circuit board, heating portions provided on the respective tip sides, first and second core bodies arranged to face each other with a first gap,
At least one of the first and second core bodies is moved to adjust the distance of the first interval existing between the heating section of the first core body and the heating section of the second core body. Movable mechanism to
A coil for supplying magnetic flux to the first and second cores,
The first and second core bodies are portions other than the heating portions of the first and second core bodies, and the first and second core bodies are present between the heating portions of the first and second core bodies during heating. A high-frequency induction heating head, characterized in that it is magnetically coupled via a second interval smaller than one interval.   At least one of the first and second core bodies has a shaft support portion rotatably supported by a rotation support shaft, and a magnetic path portion provided between the shaft support portion and the heating portion on the tip side. The high frequency induction heating head according to claim 1, wherein the high frequency induction heating head has a configuration including:   Each of the first and second core bodies includes a shaft support portion that is rotatably supported by a rotation support shaft, and a magnetic path portion provided between the shaft support portion and the heating portion on the tip end side. And a shaft supporting portion of the first core body and a shaft supporting portion of the second core body are overlapped with each other, and the shaft supporting portion of the first core body and the shaft supporting portion of the second core body are The high frequency induction heating head according to claim 2, wherein the rotation spindle is penetrated.   The first and second core bodies are each formed of a plate-shaped body, and the cross-sectional area in the plate thickness direction of each of the first and second core bodies in the vicinity of the shaft supporting portion is defined by the magnetic path. The high-frequency induction heating head according to claim 3, wherein the cross-sectional area in the plate thickness direction of the portion is larger than that of the other portion.   The first and second core bodies are each formed of a plate-like body, and the cross-sectional area in the plate thickness direction of each of the first and second core bodies in each heating portion is measured in the vicinity of each shaft supporting portion. 5. The high frequency induction heating head according to any one of claims 1 to 4, wherein the cross-sectional area in the plate thickness direction and the cross-sectional area in each magnetic path portion in the plate thickness direction are smaller.   The first facing distance between the heating portion of the first core body and the heating portion of the second core body during heating is set such that the distance on the tip end side is smaller than the distance on the shaft support portion side. 5. The high frequency induction heating head according to any one of 5 above.   7. The tip magnetic flux strengthening section for expanding the angle toward the tip side is provided on the tip side of at least one heating section of the first and second core bodies, according to any one of claims 1 to 6. High frequency induction heating head.   The heating portion of the first and second core bodies has a projecting shape toward the side opposite to the shaft support portion, and a tip magnetic flux strengthening portion for expanding the angle toward the tip side is provided on the tip side thereof. 7. The high frequency induction heating head according to 7.   The first and second core bodies are configured so that the heating unit is brought into contact with and separated from each other in the left-right direction by the movable mechanism, and a vertical movement mechanism for vertically moving the first and second core bodies is provided. The high frequency induction heating head according to any one of claims 1 to 8.   A structure in which a part of the coil is arranged in a portion surrounded by the first and second core bodies, and the first and second core bodies are moved up and down with respect to the coil by the vertical movement mechanism. The high frequency induction heating head according to claim 9.   A high-frequency induction heating device comprising: the high-frequency induction heating head according to claim 1; and an XY table arranged on a tip side of a heating portion of each of the first and second core bodies. The movable mechanism of the high-frequency induction heating head has a first motor, the vertical movement mechanism has a second motor, and the XY table has an X-axis motor and a Y-axis motor. The high-frequency induction heating device according to claim 11, wherein the first motor, the second motor, the X-axis motor, the Y-axis motor, and the coil are connected to a control unit.