JP2020050887A - Surface treatment apparatus - Google Patents

Abstract

To provide a surface treatment apparatus that can easily move a chip component in a treatment vessel while reducing a shock to the chip component.SOLUTION: A surface treatment apparatus 1 is an apparatus for performing a surface treatment onto a chip component 100 by rotating a treatment vessel 2 that houses the chip component 100. The chip component 100 on a bottom surface 21 of the treatment vessel 2 is moved to an outer peripheral side by a centrifugal force. An inclined part 20 can increase a force F4 acting on the chip component 100 toward the outer peripheral side while suppressing the increase in the rotational frequency of the treatment vessel 2. In other words, the inclined part 20 can easily move the chip component 100 toward the outer peripheral side while suppressing the increase in the rotational frequency of the treatment vessel 2. In addition, by suppressing the increase in the rotational frequency of the treatment vessel 2, the shock can be suppressed when the chip component 100 collides with an electrode ring 13 of an outer peripheral edge.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a surface treatment device.

  2. Description of the Related Art Conventionally, a surface treatment apparatus disclosed in Patent Document 1 is known. The surface treatment apparatus includes a processing container and a vertical rotation axis that rotates the processing container on a horizontal plane about the center of rotation, and performs a surface treatment on the chip component by rotating the processing container storing the chip component. It is. The bottom surface of the processing container of this surface processing apparatus is a flat surface that extends in the horizontal direction.

JP 2008-13815 A

  The above-described surface treatment apparatus applies centrifugal force to the chip components in the processing container by rotation to move the chip components to the outer peripheral side. The chip component is subjected to a surface treatment by contacting the electrode on the outer peripheral side of the processing container. Here, in the region on the inner peripheral side of the bottom surface of the processing container, the chip component hardly moves because the centrifugal force acting on the chip component is small. In order to move the chip component in the area, it is necessary to increase the rotation speed. However, when the rotation speed increases, the impact on the chip component when colliding with the electrode may increase.

  The present invention has been made to solve such a problem, and it is an object of the present invention to provide a surface treatment apparatus capable of easily moving a chip component in a processing container while reducing an impact on the chip component. Aim.

  The surface treatment apparatus according to the present invention includes a processing container, and a vertical rotation axis that rotates the processing container on a horizontal plane at the center of rotation, and rotates the processing container containing the chip component to perform surface treatment on the chip component. In the surface treatment apparatus, a first inclined portion is formed on a bottom surface of the processing container, the first inclined portion being lowered from an inner peripheral side to an outer peripheral side.

  The surface treatment apparatus according to the present invention performs a surface treatment on a chip component by rotating a treatment container containing the chip component. The chip component on the bottom surface of the processing container moves to the outer peripheral side by centrifugal force. Here, a first inclined portion is formed on the bottom surface of the processing container so as to decrease from the inner peripheral side toward the outer peripheral side. In this case, in addition to the centrifugal force, a force to slide down from the inner peripheral side to the outer peripheral side acts on the chip component on the first inclined portion. For this reason, the first inclined portion can increase the force acting on the chip component toward the outer peripheral side while suppressing an increase in the rotation speed of the processing container. That is, the first inclined portion can easily move the chip component to the outer peripheral side while suppressing an increase in the rotation speed of the processing container. In addition, by suppressing an increase in the number of rotations of the processing container, it is possible to suppress an impact when the chip component collides with the electrode on the outer peripheral edge. As described above, the chip component can be easily moved in the processing container while reducing the impact on the chip component.

  A second inclined portion that rises from the inner peripheral side toward the outer peripheral side may be formed at a position on the outer peripheral side of the first inclined part on the bottom surface of the processing container. Since the chip component must go up the second inclined portion from the inner peripheral side toward the outer peripheral side against the gravity, the moving speed from the inner peripheral side to the outer peripheral side decreases. As described above, the moving speed of the chip component is reduced before the chip component collides with the electrode on the outer peripheral edge, so that the impact on the chip component can be reduced.

  The first inclined portion may have a conical shape centered on the center of the bottom surface. In this case, since the inclined surface can be formed at a constant inclination angle, the first inclined portion can be easily formed.

  The first inclined portion may be formed in a region occupying a distance of １ ／ to ／ of a distance in a horizontal direction between a central portion of the bottom surface and an outer peripheral end. By appropriately setting the range in which the first inclined portion is formed as described above, the speed at which the first inclined portion is too wide and moves toward the outer peripheral side is increased while the chip component is easily moved to the outer peripheral side. It can suppress that it becomes too much.

  The first inclined portion may be constituted by a plurality of inclined surfaces. In this case, the inclined surface can be adjusted to an appropriate angle according to the distance from the center.

  ADVANTAGE OF THE INVENTION According to this invention, the surface treatment apparatus which can make it easy to move a chip component in a processing container, reducing the impact to a chip component can be provided.

It is a sectional view of a surface treatment device concerning an embodiment of the present invention. It is an enlarged view of the chip component in the state arrange | positioned at the inclination part. It is sectional drawing of the surface treatment apparatus which concerns on a modification. It is sectional drawing of the surface treatment apparatus which concerns on a modification. It is sectional drawing of the surface treatment apparatus which concerns on a modification.

  The configuration of the surface treatment apparatus according to the present embodiment will be described with reference to FIG. FIG. 1 is a sectional view of the surface treatment apparatus according to the present embodiment. The surface treatment apparatus 1 is an apparatus that performs a surface treatment on the chip component 100 by rotating the processing container 2 containing the chip component 100. The surface treatment apparatus 1 according to the present embodiment performs an electroplating process. However, the surface treatment apparatus 1 can perform not only an electroplating process but also a process that requires energization, such as a composite plating process, an anionic electrodeposition coating process, a cationic electrodeposition coating process, and an acid electrolysis process. Alternatively, an electrolytic polishing treatment or the like can be performed. The chip component 100 is an electronic element such as a coil or a capacitor in which the external electrode 102 is provided on the element body 101 (see FIG. 2). As shown in FIG. 1, the surface treatment device 1 includes a treatment container 2 and a vertical rotation shaft 3.

  The processing container 2 is a container in which the plating solution W and the chip component 100 are stored, and the chip component 100 is subjected to surface treatment. The processing container 2 includes a substrate 11, a bottom plate 12, an electrode ring 13, a cover 14, and an electrode 16.

  The substrate 11 is a disk-shaped member that forms the bottom wall of the processing container 2 and extends in the horizontal direction. The substrate 11 is made of a conductive material. The bottom plate 12 is a member that is provided above the substrate 11 and forms a bottom surface 21 of the internal space of the processing container 2. The bottom plate 12 is a substantially disk-shaped member that extends horizontally on the substrate 11. The bottom plate 12 is made of a non-conductive material such as a resin. The substrate 11 and the bottom plate 12 are arranged such that their respective central axes coincide with the central axis CL of the surface treatment apparatus 1. The diameter of the substrate 11 and the diameter of the bottom plate 12 are the same. An inclined portion 20 (first inclined portion) is formed at a central position of the bottom plate 12. The detailed configuration of the inclined portion 20 will be described later.

  The electrode ring 13 is an annular member that forms a side wall of the processing container 2. The electrode ring 13 is made of a conductive material, and functions as a cathode in the surface treatment device 1. The electrode ring 13 is disposed so as to extend upward from the upper surface of the outer peripheral edge of the bottom plate 12. The outer diameter of the electrode ring 13 is the same as the diameter of the bottom plate 12. The electrode ring 13 is arranged such that its central axis coincides with the central axis CL of the surface treatment apparatus 1. The inner peripheral surface of the electrode ring 13 functions as a contact surface 13a that contacts the chip component 100. Since the cross-sectional shape of the electrode ring 13 is formed in a rectangular shape, the contact surface 13a forms a surface that extends straight in the vertical direction. However, the shape of the contact surface 13a is not particularly limited, and may have an inclined surface that is inclined from the inner peripheral side to the outer peripheral side.

  The electrode ring 13 is fixed to the substrate 11 and the bottom plate 12 by inserting bolts 17 from above. The bolt 17 is inserted into the electrode ring 13 from above via a flange portion 14 a of the cover 14 described later, penetrates the electrode ring 13 and the bottom plate 12, and reaches the substrate 11. A discharge port (not shown) for discharging the plating solution W to the outside is formed between the electrode ring 13 and the bottom plate 12. The outlet is formed by arranging a porous member between the electrode ring 13 and the bottom plate 12 or by providing a gap.

  The cover 14 is a frustoconical cylindrical member that forms the ceiling wall of the processing container 2. The cover 14 is made of a non-conductive material such as a resin. The cover 14 is arranged such that its central axis coincides with the central axis CL of the surface treatment apparatus 1. The cover 14 is joined to the electrode ring 13 at a lower end portion at a flange portion 14a that extends horizontally toward the outer periphery. The flange portion 14 a of the cover 14 is disposed on the upper surface of the electrode ring 13 and is fixed by bolts 17. A circular opening 14 b is formed at the upper end of the cover 14.

  The electrode 16 functions as an anode in the surface treatment device 1. The electrode 16 is inserted into the processing chamber 2 from above via the opening 14b of the cover 14. The electrode 16 is configured by housing a metal material for plating in a container through which a liquid passes, such as a mesh structure. For example, when the nickel plating is performed on the chip component 100, the container of the electrode 16 stores a solid of nickel, and when the copper plating is performed, the container of the electrode 16 stores a solid of copper. The positive side of the power supply 19 is connected to the electrode 16, and the negative side is connected to the electrode ring 13. Thereby, the metal ions of the metal material of the electrode 16 dissolve into the plating solution W. Although FIG. 1 schematically illustrates that the power supply 19 is directly connected to the electrode ring 13, for example, the electrode ring 13 may include a vertical rotating shaft formed of a conductive material, the substrate 11. , And the bolt 17.

  The vertical rotation shaft 3 is connected to the processing container 2 and is a member for rotating the processing container 2 around its rotation center. The vertical rotation shaft 3 is a columnar member fixed to the lower surface of the substrate 11 and extending vertically downward. The center axis of the vertical rotation shaft 3 is arranged so as to coincide with the center axis CL of the processing container 2. Accordingly, the processing container 2 rotates around the central axis CL as the rotation of the vertical rotation shaft 3. The number of rotations of the processing container 2 is not particularly limited, but may be set to about 60 rpm to 120 rpm.

  As described above, the rotation of the vertical rotation shaft 3 rotates the processing container 2, and the centrifugal force toward the outer peripheral side acts on the chip component 100 inside the processing container 2. A large number of chip components 100 arranged on the bottom plate 12 move to the outer peripheral side under the influence of centrifugal force and come into contact with the contact surface 13a of the electrode ring 13 serving as a cathode. As a result, a reduction reaction occurs at the external electrode 102 (see FIG. 2) of the chip component 100 in contact with the electrode ring 13, and the metal ions during plating receive electrons, so that a metal plating layer is formed on the external electrode 102. Is done.

  Next, the inclined portion 20 of the bottom plate 12 will be described in detail. The inclined portion 20 is formed on the bottom surface 21 of the processing container 2. The inclined portion 20 is inclined so as to descend from the inner peripheral side to the outer peripheral side. In the present embodiment, the inclined portion 20 has a conical shape centered on the central portion 21a of the bottom surface 21. That is, the inclined portion 20 is disposed so as to have the top 20a on the central axis CL. The top 20a is arranged at a position lower than the electrode 16 so as not to interfere with the electrode 16. The inclined surface 20b of the inclined portion 20 is inclined straight so as to form a certain angle with respect to the horizontal direction. The inclination angle of the inclined surface 20b is appropriately changed depending on the number of rotations, the friction coefficient of the bottom surface 21, and the like, and is not particularly limited. For example, the inclination angle may be set to about 40 ° to 80 °. The details of the setting of the inclination angle will be described later together with the description of the operation and effect.

  The bottom surface 21 has a central region E1 where the inclined portion 20 is formed, and a peripheral region E2 where the inclined portion 20 is not formed. The region E2 is a region between the inclined portion 20 and the outer peripheral end 21b of the bottom surface 21, and is a plane that extends in the horizontal direction. The inclined portion 20 is formed in a region occupying a distance of 1/7 to 3/7 of a horizontal distance between the central portion 21a of the bottom surface 21 and the outer peripheral end 21b. The horizontal distance between the central portion 21a of the bottom surface 21 and the outer peripheral end 21b is indicated by "L1" in the figure. The distance occupied by the inclined portion 20 of the distance (L1) is indicated by “L2” which is the distance in the horizontal direction between the central portion 21a and the lower end 20c. That is, the range of “L2 / L1” is 1/7 to 3/7. When “L2 / L1” is equal to or greater than 1/7, by making the range of the inclined portion 20 sufficiently large, it is possible to suppress the generation of the immovable chip component 100 near the central portion 21a of the bottom surface 21. Further, when “L2 / L1” is 3/7 or less, it is possible to prevent the movement speed of the chip component 100 from becoming too large due to the inclined portion 20 being too wide.

  Next, the operation and effect of the surface treatment apparatus 1 according to the present embodiment will be described.

  The surface treatment apparatus 1 according to the present embodiment is configured to perform a surface treatment on the chip component 100 by rotating the processing container 2 containing the chip component 100. The chip component 100 on the bottom surface 21 of the processing container 2 moves to the outer peripheral side by centrifugal force. The chip component 100 comes into contact with the contact surface 13a of the electrode ring 13 on the outer peripheral side. Since the electrode ring 13 functions as a cathode, the metal ions in the plating solution W receive electrons at the external electrode 102 (see FIG. 2) of the chip component 100 that comes into contact with the electrode ring 13 and the external electrode 102 is plated. You.

  Here, an inclined portion 20 is formed on the bottom surface 21 of the processing container 2 so as to descend from the inner peripheral side to the outer peripheral side. In this case, in addition to the centrifugal force, a force acting to slide down from the inner peripheral side toward the outer peripheral side acts on the chip component 100 on the inclined portion 20.

  Specifically, as shown in FIG. 2, a centrifugal force F1 acts on the chip component 100 in a horizontal direction, a gravitational force F2 acts vertically downward, and a friction force F3 acts in a direction parallel to the inclined surface 20b. I do. The inclination angle of the inclined portion 20 is “θ”. Of the centrifugal force F1, the parallel component F1a to the inclined surface 20b becomes “F1 · cos θ” obliquely downward, and the vertical component F1b to the inclined surface 20b becomes “F1 · sin θ” obliquely upward. Of the gravity F2, the vertical component F2a to the inclined surface 20b becomes “F2 · cos θ” obliquely downward, and the parallel component F2b to the inclined surface 20b becomes “F2 · sin θ” obliquely downward.

  At this time, the vertical reaction force N of the inclined surface 20b against the chip component 100 is “vertical component F2a of gravity F2−vertical component F1b of centrifugal force F1”. Therefore, the frictional force F3 is “the coefficient of static friction μ × (the vertical component F2a of the gravity F2−the vertical component F1b of the centrifugal force F1)”. The static friction coefficient μ is set to about 0.2 to 0.6. In order for the chip component 100 to move to the outer peripheral side, the force F4 in the direction opposite to the frictional force F3, that is, the force F4 parallel to the inclined surface 20b toward the inner peripheral side may be larger than the frictional force F3. Here, the force F4 toward the inner peripheral side is defined as “parallel component F1a of centrifugal force F1 + parallel component F2b of gravity F2”. As described above, in addition to the parallel component F2b of the centrifugal force F1, the chip component 100 on the inclined portion 20 receives the parallel component F2b of the gravity F2 as a force to slide down from the inner peripheral side toward the outer peripheral side. Works. Note that, as the inclination angle θ increases, the parallel component F2b of the gravity F2 to be added increases, so that the force F4 is easily made larger than the frictional force F3. However, it is preferable to control the inclination angle θ so that the speed toward the outer peripheral side after the chip component 100 starts moving does not become too large.

  The centrifugal force F1 decreases as the distance from the center of rotation decreases. As a comparative example, in the case of a surface treatment apparatus in which the entire area of the bottom surface 21 is a horizontal plane, the chip components 100 near the center are arranged on the horizontal plane. If the centrifugal force F1 acting on the chip component 100 near the center is smaller than the frictional force F3, the chip component 100 stops and cannot move to the outer peripheral side. In this case, in order to make the force F4 heading toward the inner circumference larger than the frictional force F3, it is necessary to increase the rotation speed of the processing container 2. However, when the rotation speed is increased, the impact on the chip component 100 when colliding with the electrode ring 13 may be increased.

  On the other hand, when the chip component 100 is disposed on the inclined portion 20, the parallel component F2b of the gravity F2 can be added to the force F4 directed toward the inner circumference. Therefore, the centrifugal force F1 required to make the force F4 toward the inner peripheral side of this embodiment larger than the frictional force F3 is smaller than that of the surface treatment apparatus according to the comparative example. As described above, the inclined portion 20 can increase the force F4 acting on the chip component 100 toward the outer peripheral side while suppressing an increase in the rotation speed of the processing container 2. That is, the inclined portion 20 can easily move the chip component 100 to the outer peripheral side while suppressing an increase in the rotation speed of the processing container 2. In addition, by suppressing an increase in the number of revolutions of the processing container 2, it is possible to suppress an impact when the chip component 100 collides with the electrode ring 13 on the outer peripheral edge. As described above, the chip component 100 can be easily moved in the processing container 2 while reducing the impact on the chip component 100.

  The inclined portion 20 has a conical shape centered on a central portion 21 a of the bottom surface 21. In this case, since the inclined surface 20b can be formed at a constant inclination angle, the inclined portion 20 can be easily formed.

  The inclined portion 20 is formed in a region occupying a distance of 1/7 to 3/7 of a horizontal distance between the central portion 21a of the bottom surface 21 and the outer peripheral end 21b. By appropriately setting the range in which the inclined portion 20 is formed, it is possible to easily move the chip component 100 to the outer peripheral side, and to increase the speed toward the outer peripheral side due to the excessively wide inclined portion 20. Can be suppressed.

  The present invention is not limited to the above embodiment.

  For example, a surface treatment apparatus 1 according to a modification as shown in FIG. 3 may be employed. As shown in FIG. 3, the inclination angle of the inclined portion 120 (first inclined portion) changes in a plurality of stages. The inclined portion 120 changes so that the inclination angle becomes smaller from the central portion 121a of the bottom surface 121 toward the outer peripheral side. The inclined portion 120 has an inclined surface 120b inclined downward from the top portion 120a, and an inclined surface 120d inclined from the lower end of the inclined surface 120b toward the lower end 120c. The inclination angle of the inclined surface 120b is larger than that of the inclined surface 120d. The bottom surface 121 has a plane extending horizontally from the lower end 120c of the inclined portion 120 to the outer peripheral end 121b.

  As described above, since the inclined portion 120 is constituted by the plurality of inclined surfaces 120b and 120d, the inclined surfaces 120b and 120d can be adjusted to an appropriate angle according to the distance from the center. As described above with reference to FIG. 2, the centrifugal force becomes smaller as the position is closer to the central portion 121 a, and therefore, it is necessary to increase the inclination angle of the inclined portion. Since it becomes large, the inclination angle may be small. In the embodiment of FIG. 1, when the entire inclined portion 20 has a large inclination angle in accordance with the required inclination angle near the central portion 21a, the position of the top portion 20a is high. In order to avoid interference between the electrode 16 and the inclined portion 20, it is necessary to arrange the electrode 16 at a high position. On the other hand, as shown in FIG. 3, an inclined surface 120b having a large inclination angle is formed in the vicinity of the central portion 121a so as to obtain a required inclination angle, and an inclined surface 120d having an unnecessarily large inclination angle is formed on the outer peripheral side. Is formed. Therefore, the position of the top 120a can be lowered. As a result, the electrode 16 can be arranged at a lower position, so that the range of the electrode 16 immersed in the plating solution W becomes larger. Thereby, the plating efficiency can be improved. Further, in the inclined surface 120d, the inclination angle is suppressed from increasing more than necessary, so that the moving speed of the chip component 100 can be suppressed from increasing more than necessary.

  Further, a surface treatment apparatus 1 according to a modification as shown in FIG. 4 may be employed. As shown in FIG. 4, the inclined portion 220 (first inclined portion) is curved such that the inclination angle continuously changes from the inner peripheral side to the outer peripheral side. The inclined portion 220 changes such that the inclination angle becomes smaller from the central portion 221a of the bottom surface 221 toward the outer peripheral side. The inclined portion 220 has a curved surface 220b whose inclination angle gradually decreases from the top portion 220a toward the outer peripheral side. The curved surface 220b is curved so as to project downward. The inclination angle of the curved surface 220b becomes almost equal to 0 ° near the lower end 220c. The bottom surface 221 has a plane extending horizontally from the lower end 220c of the inclined portion 220 to the outer peripheral end 221b. In this modification, the inclination angle of the curved surface 220b corresponds to the angle of a tangent at an arbitrary position.

  As described above with reference to FIG. 2, the centrifugal force becomes smaller as the position is closer to the central portion 221a, and therefore, it is necessary to increase the inclination angle of the inclined portion. Since it becomes large, the inclination angle may be small. Therefore, as shown in FIG. 4, the bottom surface 221 has a curved surface 220b near the center portion 221a such that the inclination angle is large so that a required inclination angle is obtained, and the inclination angle is not unnecessarily large on the outer peripheral side. have. Therefore, the position of the top 220a can be lowered. As a result, the electrode 16 can be arranged at a lower position, so that the range of the electrode 16 immersed in the plating solution W becomes larger. Thereby, the plating efficiency can be improved. In addition, on the outer peripheral side, the inclination angle is suppressed from increasing more than necessary, so that the moving speed of the chip component 100 can be suppressed from increasing more than necessary.

  Further, a surface treatment apparatus 1 according to a modification as shown in FIG. 5 may be employed. As shown in FIG. 5, on the bottom surface 321 of the processing container 2, an inclined portion 320 (second inclined portion) that rises from the inner peripheral side to the outer peripheral side is formed at a position on the outer peripheral side of the inclined part 20. You. The inclined portion 320 is inclined so as to descend from the outer peripheral end 321b of the bottom surface 321 toward the inner peripheral side. A region between the inclined portion 20 on the central portion 321a side and the inclined portion 320 on the outer peripheral side is a horizontal plane. In addition, the inclined part 20 may be changed to the inclined part 120 shown in FIG. 3 and the inclined part 220 shown in FIG.

  According to the configuration as shown in FIG. 5, since the chip component 100 must climb the inclined portion 320 from the inner peripheral side to the outer peripheral side against the gravity, the moving speed from the inner peripheral side to the outer peripheral side is increased. Decrease. As described above, before the chip component 100 collides with the electrode ring 13 on the outer peripheral edge, the moving speed of the chip component is reduced, so that the impact on the chip component 100 can be reduced.

  DESCRIPTION OF SYMBOLS 1 ... Surface treatment apparatus, 2 ... Processing container, 3 ... Vertical rotation axis, 20, 120, 220 ... Inclined part (1st inclined part), 21, 121, 221, 321 ... Bottom surface, 21a, 121a, 221a, 321a ... Central portion, 21b, 121b, 221b, 321b ... outer peripheral end, 120b, 120d ... inclined surface, 320 ... inclined portion (second inclined portion).

Claims (5)

A processing container,
A vertical rotation axis for rotating the processing vessel on a horizontal plane at the center of rotation,
A surface treatment apparatus that performs a surface treatment on the chip component by rotating a processing container containing the chip component,
A surface treatment apparatus, wherein a first inclined portion that descends from an inner peripheral side to an outer peripheral side is formed on a bottom surface of the processing container.   2. The surface according to claim 1, wherein a second inclined portion that rises from the inner peripheral side toward the outer peripheral side is formed at a position on the outer peripheral side of the first inclined part on the bottom surface of the processing container. 3. Processing equipment.   The surface treatment device according to claim 1, wherein the first inclined portion has a conical shape centered on a central portion of the bottom surface.   The said 1st inclination part is formed in the area | region which occupies the distance of 1/7-3/7 with respect to the distance in the horizontal direction between the center part of the said bottom face, and an outer periphery. The surface treatment apparatus according to any one of claims 1 to 4.   The surface treatment device according to any one of claims 1 to 4, wherein the first inclined portion is configured by a plurality of inclined surfaces.

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