JP2020027724A - Electrical connector and manufacturing method of the same - Google Patents

Abstract

To provide a simple manufacturing method of an electrical connector, preventing a short circuit between adjacent wires in an electrical connector and using magnetic force, and an electrical connector improved in connectivity to electronic devices.SOLUTION: An electrical connector 10 disposed between a connection terminal of a first electronic device and a connection terminal of a second electronic device to electrically connect the connection terminals includes: a substrate sheet (1); a plurality of first conductive parts (5) penetrating through the substrate sheet in a thickness direction; and a second conductive part (8) projecting to a first surface (1a) side of the substrate sheet and continuously integrated with at least one of the first conductive parts (5). The first conductive parts and the second conductive part are formed from the same resin composition including a resin and conductive particles (F).SELECTED DRAWING: Figure 12

Description

  The present invention relates to an electrical connector and a method for manufacturing the same.

  2. Description of the Related Art Conventionally, in order to connect electronic devices, a connector (hereinafter, referred to as an electrical connector) for connecting fine electrodes by pressure welding has been used. A normal electrical connector is sheet-shaped, has a plurality of conductive portions and an insulating portion that insulates them from each other, and is disposed between a connection terminal of the first device and a connection terminal of the second device. Make an electrical connection. As a method of manufacturing such an electrical connector, Patent Document 1 discloses a method of applying a photosensitive resin composition containing conductive particles to the surface of a substrate, pre-baking the coating film, and applying a magnetic field to the conductive film. The particles are oriented in the thickness direction of the coating. Further, photolithography is performed using a mask that matches the arrangement of the terminals of the electronic device to be connected to form a conductive portion of the electrical connector. Then, an insulating portion made of resin is formed around the conductive portion.

JP-A-11-154550

  The method of Patent Literature 1 requires expensive equipment for performing photolithography, and has a problem that the manufacturing cost of the electrical connector increases.

  Therefore, as a method of eliminating the need for photolithography, the present inventor has set a mold O that holds a plurality of magnets J in accordance with the arrangement of terminals of an electronic device to be connected, as shown in FIG. The following methods to use were considered. That is, a resin composition layer G containing conductive particles F is formed between a pair of molds O arranged so as to face each other, and the conductive particles F are arranged only between the magnets J facing each other. Tried. However, it was difficult to control the arrangement of all the conductive particles F only by the magnetic force. Therefore, in the resin composition layer G, a part of the conductive particles F forming the first wiring and a part of the conductive particles F forming the second wiring adjacent thereto come into contact with each other. There is a concern that the first wiring and the second wiring are short-circuited. In the drawing, a portion surrounded by a broken-line circle is an example of a portion where a short circuit is likely to occur.

  Further, in the method of Patent Document 1 and the method shown in FIG. 13, the end of the through wiring made of conductive particles is flush with the surface of the electrical connector. It is usually difficult to press-contact the terminal formed by the end of the through wiring of the electric connector to the depression electrode of the electronic device. If the end of the through wiring can be made to protrude from the surface of the electrical connector, the pressure contact with the depressed electrode becomes easy. However, since the through wiring is an aggregate of conductive particles, if the resin base material around the end of the through wiring is removed by etching or the like, the end is broken. As another method for facilitating connection to the depressed electrode, a solder ball may be placed just above the end of the through wiring to form a conductive protrusion (bump). However, there are problems such as poor bondability between the solder ball and the through wiring, an increase in electric resistance, and a possibility of removing the solder ball by pressure welding.

  The present invention has been made in view of the above circumstances, and prevents a short circuit between adjacent wirings in an electrical connector, improves a simple method of manufacturing an electrical connector using magnetic force, and improves connectivity to an electronic device. Provides electrical connectors.

  As a result of extensive studies by the present inventor, as shown in FIG. 11 and the like, a base material sheet 1 is prepared, a hole 2 is formed in advance at a place where a through wiring is to be formed, and a resin material containing conductive particles F is formed. By applying a method of applying the resin material to the surface of the material sheet 1 and injecting a part of the resin material into the hole portion 2 and orienting the conductive particles F in the hole portion 2 in the thickness direction by magnetic force, the through wirings are connected to each other. Solved the problem of short circuit. Further, a method of curing the remaining portion of the resin material on the surface of the base material sheet 1 and forming a conductive protruding portion having no boundary or joining surface continuous with each through-wiring and directly above the through-wiring is used for an electronic device. Improved connectivity and durability. The present invention has the following aspects.

[1] A method for manufacturing an electrical connector arranged between a connection terminal of a first electronic device and a connection terminal of a second electronic device for electrically connecting them, wherein a plurality of protrusions are formed. A first resin material containing a resin or a resin precursor is introduced into the formed mold, and the first resin material is cured, so that a penetrating or non-penetrating hole corresponding to each convex portion of the molding die is first. A step (A1) of preparing a base sheet having an opening on a surface; and forming a second resin material containing conductive particles containing a ferromagnetic material and a resin or a resin precursor on the first surface of the base sheet. Applying, while injecting a part of the second resin material into each of the holes, keeping the rest of the second resin material on the first surface, further applying a magnetic force, the inside of the holes After aligning the conductive particles in the depth direction of the hole, the conductive particles are poured into the hole. Forming the first conductive portion in each of the holes by curing the second resin material entered, and the second resin material retained on the first surface; Forming a continuous conductive layer with each of the parts on the first surface, and removing a part of the conductive layer by etching to form a plurality of second conductive parts which are separated from each other ( B). A method for producing an electrical connector, comprising:
[2] A method of manufacturing an electrical connector disposed between a connection terminal of a first electronic device and a connection terminal of a second electronic device and electrically connecting the connection terminals, wherein a resin or a resin Introducing a first resin material containing a precursor, curing the first resin material to produce a sheet, forming a plurality of through or non-penetrating holes that open on the first surface of the sheet, A sheet obtaining step (A2), and applying a second resin material containing conductive particles containing a ferromagnetic material and a resin or a resin precursor to the first surface of the base sheet; While injecting a part of the second resin material into, the remaining part of the second resin material is retained on the first surface, and further magnetic force is applied to move the conductive particles in the hole into the hole. The second tree injected into the hole after being aligned in the depth direction of the second tree A first conductive portion is formed in each of the holes by curing the grease material and the second resin material retained on the first surface, and one of the first conductive portions is formed with each of the first conductive portions. (B) forming a subsequent conductive layer on the first surface, and further removing a part of the conductive layer by etching to form a plurality of second conductive portions partitioned independently of each other. A method for manufacturing an electrical connector.
[3] A method for manufacturing an electrical connector arranged between a connection terminal of a first electronic device and a connection terminal of a second electronic device to electrically connect them, the method comprising: Prepare a base sheet having a plurality of penetrating or non-penetrating holes that open on one surface, and on the first surface of the base sheet, conductive particles containing a ferromagnetic material and a resin or resin precursor A second resin material containing a body is applied, the second resin material is injected into each of the holes, and the rest of the second resin material is retained on the first surface, and a magnetic force is applied. After aligning the conductive particles in the hole in the depth direction of the hole, the second resin material injected into the hole, and the second resin retained on the first surface By curing the material, a first guide is introduced into each of the holes. Forming an electrical part, forming a continuous conductive layer with each of the first conductive parts on the first surface, further removing a part of the conductive layer by etching, and partitioning independently of each other. A method for manufacturing an electrical connector, comprising a step (B) of forming a plurality of second conductive portions.
[4] An electrical connector arranged between the connection terminal of the first electronic device and the connection terminal of the second electronic device for electrically connecting them, wherein the base sheet and the base sheet A plurality of first conductive portions penetrating in a thickness direction of the first conductive portion, and a second conductive portion protruding toward the first surface side of the base sheet and integrally formed with at least one of the plurality of first conductive portions. Wherein the first conductive portion and the second conductive portion are formed of the same resin composition including a resin and conductive particles.

According to the method for manufacturing an electrical connector of the present invention, it is not always necessary to use photolithography, so that an electrical connector can be easily manufactured. In addition, since the insulating portion is formed before the conductive portion using the molding die, a short circuit between adjacent wirings can be reliably prevented. Furthermore, since conductive particles are densely aggregated by utilizing magnetic force, a wiring having excellent conductivity can be formed. In addition, the second conductive portion, which is continuous with the first conductive portion that is a through wiring and protrudes toward the first surface side of the electrical connector, can be easily formed.
Since the electrical connector of the present invention has the second conductive portion protruding on the first surface side, the connectivity to the electrodes of the electronic device is improved. In addition, since the second conductive portion protruding toward the first surface is integrally formed with the first conductive portion that is a through wiring, the conductivity is high, and the durability in repeated use is excellent.

It is a top view showing signs that electric connector 10 is manufactured in a manufacturing method of a first embodiment of the present invention. FIG. 2 is a sectional view taken along the line II-II in FIG. 1. FIG. 4 is a cross-sectional view illustrating a state in which the electrical connector 10 is manufactured. 1 is a plan view of a base sheet 1 used in a manufacturing method according to a first embodiment of the present invention. FIG. 4 is a plan view illustrating a state in which the electrical connector 10 is manufactured. It is sectional drawing cut | disconnected by the VI-VI line of FIG. FIG. 4 is a plan view illustrating a state in which the electrical connector 10 is manufactured. FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 7. FIG. 1 is a plan view of an electric connector 10 which is an example of the present invention. It is sectional drawing cut | disconnected by XX of FIG. It is sectional drawing which shows a mode that the electric connector 10 is manufactured in the manufacturing method of 2nd Embodiment of this invention. FIG. 3 is an enlarged cross-sectional view of a part of the electric connector 10 cut along a thickness direction. FIG. 3 is a cross-sectional view showing a state where an attempt is made to arrange conductive particles F widely dispersed in a resin composition G between magnets J facing each other. FIG. 2 is a cross-sectional view showing a state in which each electronic device is connected to each surface of the electrical connector 10 in a state where one electronic device is pressed against the other.

製造 Method of manufacturing electrical connector≫
<First embodiment>
The first embodiment of the method for manufacturing an electrical connector according to the present invention is a method of manufacturing an electrical connector which is disposed between a connection terminal of a first electronic device and a connection terminal of a second electronic device, and electrically connects these. It is a manufacturing method and has at least the following steps (A1) and (B).
In the step (A1), a first resin material containing a resin or a resin precursor is introduced into a molding die having a plurality of projections formed thereon, and the first resin material is cured, so that the first resin material is cured. This is a step of producing a base material sheet in which a corresponding through or non-through hole is opened on the first surface.
In the step (B), a second resin material containing conductive particles containing a ferromagnetic substance and a resin or a resin precursor is applied to the first surface of the base sheet, and the second resin material is applied to each of the holes. While injecting a part of the second resin material, keeping the remaining part of the second resin material on the first surface, and further applying a magnetic force to move the conductive particles in the hole to a depth of the hole. After being aligned in the vertical direction, the second resin material injected into the hole and the second resin material retained on the first surface are cured, so that the second resin material is filled into each of the holes. Forming one conductive portion, forming a continuous conductive layer with each of the first conductive portions on the first surface, further removing a part of the conductive layer by etching, and partitioning independently of each other. Forming a plurality of second conductive portions.
Hereinafter, an example of an embodiment will be described with reference to the drawings.

<Mold K>
The production of the electrical connector 10 shown in FIGS. 9 and 10 will be exemplified. First, a mold K shown in FIGS. 1 and 2 is prepared. On the surface of the molding die K, a concave portion N and a plurality of columnar convex portions M arranged in the concave portion N are formed.
The shape of the concave portion N roughly corresponds to the outer shape of the electrical connector 10. In the illustrated example, a concave portion N, which is a flat rectangular parallelepiped space opened upward, is formed on the surface inside the molding die K. The concave portion N is a space where the insulating portion 6 of the electric connector 10 is formed, and the electric connector 10 having the base sheet 1 reflecting the shape of the concave portion N can be formed.
Each cross-sectional shape and arrangement of the convex portion M corresponds to each cross-sectional shape and arrangement of the first conductive portion 5 which is a through wiring included in the electrical connector 10.
The height of each protrusion M may be the same as the depth of the recess N, or may be different. That is, the position of the tip of the convex portion M may be flush with the surface Ka of the molding die K, may be at a position lower than the surface Ka (that is, inside the concave portion N), or may be the surface Ka. It may be at a higher position (that is, outside and above the concave portion N). In the illustrated example, the height position of each protrusion M is flush with the surface Ka of the molding die K.

<Step A1>
As shown in FIGS. 1 and 2, a liquid first resin material L1 containing a resin or a resin precursor is applied to the surface of a molding die K having a concave portion N and a convex portion M. The first resin material L1 is an insulating material that forms the insulating portion 6. The first resin material L1 is introduced into the concave portion N by the application. At this time, the surplus first resin material L1 that does not completely enter the concave portion N overflows to the surface Ka of the molding die K. In order to promote the introduction of the first resin material L1 into the concave portion N, vacuum processing, pushing with a squeegee, or the like may be performed.

Next, as shown in FIG. 3, the first resin material L1 filled in each concave portion N of the molding die K is cured to form the base sheet 1 in the molding die K. At this time, the first resin material L1 that overflows without entering the concave portion N becomes a residual film R that covers one main surface (second surface) of the base sheet 1.
Subsequently, the base sheet 1 is released from the molding die K. A plurality of holes 2 corresponding to the protrusions M of the mold K are formed on the first surface 1a of the obtained base sheet 1 (FIG. 4).

  In the illustrated example, the hole 2 is a non-through hole, but the hole 2 may be formed as a through hole. For example, when the height of the convex portion M of the mold K is sufficiently higher than the depth of the concave portion N and the tip of the convex portion M protrudes from the surface of the first resin material L1 applied to the surface of the mold K, The hole 2 of the material sheet 1 becomes a through hole.

<Step B>
As shown in FIGS. 5 and 6, the second resin material L2 is applied to the first surface 1a of the base sheet 1. At this time, an excessive amount of the second resin material L2 that does not fit into the hole 2 is applied to the first surface 1a. Subsequently, as shown in FIGS. 7 and 8, a part of the second resin material L2 including the conductive particles is injected into each of the holes 2. The remaining portion of the second resin material L2 including the conductive particles, which has not survived the hole portion 2, overflows to cover the first surface 1a of the base sheet 1.
The method of injecting the second resin material L2 into the hole 2 is not particularly limited, and examples thereof include a method in which the second resin material L2 flows naturally under vacuum while utilizing a capillary phenomenon, and a method in which the second resin material L2 is forcibly pushed by a squeegee.
After the completion of the injection, the excess second resin material L2 remaining on the first surface 1a of the base sheet 1 without being injected into the hole 2 is left on the first surface 1a as it is. As a method of retaining, for example, a method of placing a frame (not shown) on the first surface 1a and retaining the second resin material L2 in the frame is exemplified.

  After injecting a part of the second resin material L2 into each of the holes 2, in the state shown in FIGS. 7 and 8, the second resin material L2 is substantially parallel to the depth direction of the holes 2 (the thickness direction of the base sheet 1). By applying a magnetic field, the conductive particles contained in the second resin material L2 in the hole 2 are aligned in the depth direction of the hole 2 by magnetic force. The first surface 1a of the base sheet 1 has a first end and the second end 1b has A through wiring having a portion is formed.

  By hardening the second resin material L2 in each hole 2 and the second resin material L2 retained on the first surface 1a in a state where the conductive particles form the through wiring, the resin The conductive particles are fixed. As a result, a first conductive portion 5 is formed in each of the holes 2 as a penetrating wiring penetrating the base sheet 1 in the thickness direction. And a continuous conductive layer 7 with each of the first conductive portions 5 can be formed. The thickness of the conductive layer 7 can be arbitrarily adjusted by the amount of the second resin material L2 retained on the first surface 1a or by slicing the conductive layer 7. The thickness of the conductive layer 7 is, for example, 1 μm to 50 μm.

  Next, a part of the conductive layer 7 covering the first surface 1a is removed by etching to form a plurality of second conductive portions 8 partitioned independently from each other. In the examples of FIGS. 9 and 10, the conductive layer 7 on the lines of the grid stripes is removed such that a plurality of the second conductive portions 8 each having a rectangular shape in a plan view are arranged in a vertical and horizontal grid pattern. As a result, there is a state in which there is one first conductive part 5 that forms a through wiring immediately below each second conductive part 8, and one set of the second conductive part 8 and the first conductive part 5 is continuous. There are no clear boundaries and they are integrated. Therefore, since the bonding property between the second conductive part 8 and the first conductive part 5 is excellent, the conductivity is high and the durability is excellent.

  As a method for etching a part of the conductive layer 7, laser processing is preferable. The UV laser has a small laser diameter and is particularly suitable for forming the fine second conductive portion 8. The portion of the second conductive portion 8 irradiated with the processing laser is removed by heat. At this time, since the second conductive portion 8 including the conductive particles includes the conductive particles, the second conductive portion 8 easily absorbs the laser and is easily removed. When the second conductive portion 8 is removed, the first surface 1a is exposed. Although the exposed first surface 1a does not contain conductive particles, it is relatively difficult to remove the first surface 1a. However, even if the first surface 1a is slightly etched (overetching occurs), the function of the electrical connector 10 is not adversely affected.

  In the laser processing, an arbitrary region of the conductive layer 7 can be etched in a desired shape, so that the second conductive portion 8 can be formed in an arbitrary pattern or pattern. For example, as a modified example of the electric connector 10 of FIGS. 9 and 10, another form in which the second conductive portions 8 which are adjacent to each other in the electric connector 10 are etched so as to be combined in an arbitrary combination can be cited. In this other embodiment, a plurality of first conductive portions 5 are connected to one second conductive portion 8 in a row.

  Finally, if necessary, the remaining film R remaining on the second surface 1b of the base sheet 1 is removed, and a part of the base sheet 1 is formed in order to form the shape (outer shape) of the outer frame portion in plan view. Is cut off to obtain the intended electrical connector 10 (FIGS. 9 and 10).

When the end of the first conductive portion 5 is not exposed on the second surface 1b, the removal of the residual film R covering the second surface 1b is indispensable to make the first conductive portion 5 a through wiring. . As a method for removing the residual film R, for example, a known contact-type method for cutting or polishing the surface of a general substrate, a non-contact-type known method such as laser processing, plasma processing, and the like are exemplified.
On the other hand, when the end of the first conductive portion 5 is exposed on the second surface 1b of the base sheet 1, the removal of the remaining film R is not essential. For example, when each hole 2 of the base sheet 1 is a through-hole, the second resin material L2 is injected into the through-hole and cured to form the through-hole formed of the first conductive portion 5 formed in the through-hole. The end of the wiring can be exposed on the second surface 1b regardless of the presence or absence of the residual film R.

  One end of each first conductive portion 5 and a continuous second conductive portion 8 are exposed on the first surface 1a of the electrical connector 10 obtained above, and each first conductive portion 8 is exposed on the second surface 1b. The other end of 5 is exposed. Since the first conductive part 5 and the second conductive part 8 are integrated continuously, the bonding property between the second conductive part 8 and the first conductive part 5 is excellent, the conductivity is high, and even when used repeatedly. Shows excellent durability to withstand. Further, since each second conductive portion 8 protrudes from the first surface 1a, the second conductive portion 8 can be easily applied to the electrode of the electronic device pressed against the first surface 1a when the electrical connector 10 is used. Can be connected. Similarly, when the electrode is a depressed electrode, it can be easily connected.

  The method of adjusting the height h of each of the second conductive portions 8 of the electrical connector 10 is as follows: (1) The thickness of the second resin material L2 to be fixed on the first surface 1a of the base sheet 1 at the time of manufacture and cured. (2) a method of slicing the upper portion of the formed conductive layer 7 or the second conductive portion 8 to adjust the thickness, and (3) a method of adjusting the degree of the overetching. Can be

<Second embodiment>
The second embodiment of the method for manufacturing an electrical connector according to the present invention is a method for manufacturing an electrical connector, which is disposed between a connection terminal of a first electronic device and a connection terminal of a second electronic device, and electrically connects these. It is a manufacturing method and has at least the following steps (A2) and (B).
In the step (A2), a first resin material containing a resin or a resin precursor is introduced into a mold, and the first resin material is cured to form a sheet. This is a step of forming a plurality of non-penetrating holes to obtain a base material sheet.
Step (B) is the same as step (B) of the first embodiment.

  First, as shown in FIG. 11A, a liquid first resin material L1 containing a resin or a resin precursor is provided on a surface Wa of a molding die W in which a concave portion U corresponding to the outer shape of the electrical connector 10 to be manufactured is formed. Is applied. At this time, the surplus first resin material L1 that does not completely enter the concave portion U overflows the surface Wa of the mold W.

Next, as shown in FIG. 11B, the first resin material L1 filled in the concave portion U of the molding die W is cured to form the sheet α in the molding die W. At this time, the first resin material L1 that has overflowed without entering the concave portion U becomes a residual film R that covers one main surface (second surface) of the sheet α.
Subsequently, as shown in FIG. 11C, the base sheet 1 is obtained by forming a plurality of holes 2 penetrating in the thickness direction of the sheet α released from the molding die W. The arrangement of each hole 2 corresponds to the arrangement of the first conductive portion 5 of the electrical connector 10 to be manufactured. The method for forming the hole 2 is not particularly limited. For example, a known method for forming a penetrating or non-penetrating hole in a resin sheet such as drilling or laser processing is applied. The depth of the hole is adjusted depending on the degree of drilling and laser processing. In the illustrated example, a hole 2 as a through hole is formed.

Next, as shown in FIG. 11D, the second resin material L2 is applied to the first surface 1a of the base sheet 1 and a part of the second resin material L2 is injected into the hole 2. As the method of application and injection, the same method as in the first embodiment can be used. The remaining portion of the second resin material L2 including the conductive particles, which has not entered the hole portion 2, overflows to cover the first surface 1a of the base sheet 1.
Further, in the state shown in FIG. 11E, a magnetic field substantially parallel to the thickness direction of the base sheet 1 is applied to apply conductive particles contained in the second resin material L2 in the hole 2 to the hole 2. In the depth direction (the thickness direction of the base sheet 1). The first surface 1a of the base sheet 1 has a first end and the second end 1b has A through wiring having a portion is formed. In this state, the second resin material L2 is cured to fix the conductive particles. As a result, a first conductive portion 5 is formed in each of the holes 2 as a through wiring penetrating the base sheet 1 in the thickness direction. And a continuous conductive layer 7 with each of the first conductive portions 5 can be formed.
Next, a part of the conductive layer 7 covering the first surface 1a is removed by etching to form a plurality of second conductive portions 8 partitioned independently from each other.
Finally, if necessary, the residual film R remaining on the second surface 1b is removed and the outer shape is formed, thereby obtaining the target electrical connector 10 as shown in FIG. 11 (f).

<Third embodiment>
In the first embodiment and the second embodiment described above, the base sheet 1 was manufactured using a mold. In the manufacturing method of the present invention, the step of producing the base sheet 1 is not necessarily essential, and the base sheet 1 having the through-hole or non-penetrating hole 2 opened in the first surface 1a can be formed by any method (for example, The electrical connector 10 may be manufactured by preparing in accordance with a method of purchasing from three parties) or the like, and performing the process (B) and subsequent steps in the same manner as in the first embodiment.

[Method of applying magnetic field]
In the manufacturing method of each embodiment, the method for aligning (orienting) the conductive particles contained in the second resin material L2 injected into the hole 2 of the base material sheet 1 in the depth direction of the hole 2 is as follows. Is preferable to place the base sheet 1 in a magnetic field in which lines of magnetic force are present along the depth direction of the substrate sheet. Here, geomagnetism does not correspond to the magnetic force of the present invention.
As a specific method, a method described in JP-A-11-154550 can be applied. For example, electromagnets are arranged near the first surface 1a and near the second surface 1b of the base sheet 1, respectively, and the electromagnets are operated in a state where the base sheet 1 is arranged between a pair of electromagnets. As a result of the parallel magnetic field acting in the thickness direction of the base sheet 1, the conductive particles in the holes 2 are oriented so as to be arranged in the thickness direction.

The intensity of the parallel magnetic field is, for example, 1000 to 10000 gauss.
The region where the parallel magnetic field is applied may be only the hole 2 or the entire base sheet 1. When a parallel magnetic field is applied only to the hole 2, magnets are arranged directly above and directly below the hole 2. From the viewpoint of applying a magnetic field to the plurality of holes 2 with uniform strength, it is preferable to apply a parallel magnetic field to the entire base sheet 1.

[Conductive particles]
Examples of the conductive particles containing a ferromagnetic material included in the second resin material L2 include, for example, conductive particles containing one or more ferromagnetic materials and made of only a ferromagnetic material, and the one or more types of conductive particles. Composite conductive particles containing a ferromagnetic material and further containing a conductive substance other than the ferromagnetic material are exemplified.
The ferromagnetic material preferably exhibits ferromagnetism at 10 to 40 ° C., and more preferably one or more selected from iron, cobalt, nickel, and gadolinium.
Examples of the conductive material other than the ferromagnetic material include copper, zinc, chromium, platinum, gold, silver, aluminum, palladium, and a carbon material. Examples of the carbon material include carbon black, Ketjen black, carbon nanotube, fullerene, graphene, graphite, and the like.

  The structure of the composite conductive particles includes a ferromagnetic material as a core material, a structure in which the core material is coated with the conductive material, and a core material containing the conductive material. And a structure in which the ferromagnetic material and the conductive material are mixed without distinction between the core material and the coating. The thickness of the coating is, for example, about 50 nm to 1 μm. The content of the core substance with respect to the total mass of the conductive polymer composed of the core substance and the coating is, for example, 90 to 99% by mass.

  The shape of the conductive particles is not particularly limited, and is preferably a shape other than a fibrous shape, a rod shape, and a flake shape, and more preferably a spherical shape or a star shape, from the viewpoint of enhancing dispersibility in the second resin material L2.

  As long as the conductivity of the surface of the conductive particles is not lost, the surface of the conductive particles may be treated with a coupling agent such as a silane coupling agent or a titanium coupling agent.

  The kind of the conductive particles contained in the first conductive part 5 and the second conductive part 8 may be one kind or two or more kinds.

The content ratio of the conductive particles in the first conductive portion 5 and the second conductive portion 8 is, for example, 1 to 50% by volume fraction, preferably 10 to 30% by volume fraction. It is preferable that the content of the conductive particles in the second resin material L2 is adjusted so that the above volume fraction is realized.
The average particle diameter of the conductive particles is, for example, 10 nm to 10 μm, and preferably 50 nm to 5 μm. Within this range, the conductive particles can be easily oriented by the magnetic force, and the first conductive portion 5 having high conductivity (low resistance) can be easily obtained. The average particle diameter of the conductive particles is determined by randomly selecting 100 conductive particles contained in the first conductive part 5 and the second conductive part 8 and observing their major diameter (diameter in the case of a spherical shape) by microscopic observation. Measured and determined as the arithmetic mean of 100 measurements.

  The diameter of the smallest circle including a cross section obtained by cutting an arbitrary portion of the first conductive portion 5 in a direction orthogonal to the thickness direction of the base sheet 1 is defined as the thickness of the first conductive portion 5. Here, the ratio of the thickness of the first conductive portion 5 to the average particle size of the conductive particles (thickness / average particle size) is, for example, preferably 3 to 1000, more preferably 5 to 500, and more preferably 10 to 200. Is more preferred. Within these preferred ranges, the conductive particles can be easily oriented by magnetic force, and the first conductive portion 5 having high conductivity can be easily obtained.

[Resin or resin precursor]
The resin or the resin precursor contained in the first resin material L1 is a main material constituting the insulating portion 6 of the base sheet 1.
The resin or the resin precursor contained in the second resin material L2 is a material that keeps the conductive particles in contact with each other.
The resin precursor is a compound that forms a resin, and includes, for example, a monomer that forms a resin by a polymerization reaction.
Examples of the resin include known curable resins such as a photopolymerizable resin, a thermopolymerizable resin, an active energy ray polymerizable resin, and a catalyst polymerizable resin.

From the viewpoint of manufacturing the electrical connector 10 having flexibility, the resin of the first resin material L1 is preferably an elastomer.
Examples of the elastomer include urethane rubber, isoprene rubber, ethylene propylene rubber, natural rubber, ethylene propylene diene rubber, styrene butadiene rubber, and silicone rubber. Among them, silicone rubber, which has a small dimensional change after being removed from the mold, hardly generates warpage after being removed from the mold, has a small compression set, and has high heat resistance, is preferred. The silicone rubber may be either a condensation type or an addition type.

The resin or the resin precursor contained in the first resin material L1 and the second resin material L2 may be the same or different from each other, and bond the first conductive part 5 and the second conductive part to the insulating part 6. It is preferable that they are the same from the viewpoint of improving the properties. When the adhesiveness is improved, the flexibility of the electric connector 10 is improved, so that it is easy to install the terminals of the electronic device, which is preferable.
The resin contained in the second resin material L2 is preferably an elastomer. Specific examples of the suitable elastomer are the same as those of the first resin material L1.

[First resin material]
In the first resin material used in each embodiment, in addition to the above-described resin or resin precursor, any substance added to the base material of the conventional electrical connector, for example, a catalyst that promotes polymerization of the resin precursor, resin A crosslinking agent, an antioxidant, a dye, a pigment, a filler, a leveling agent, or the like that promotes crosslinking between them may be added. These additives may be contained, for example, at about 0 to 5% by mass based on the total mass of the first resin material. Further, a diluting solvent may be added to the first resin material in order to improve the coatability of the first resin material to the mold.

[Second resin material]
In the second resin material used in each embodiment, in addition to the conductive particles and the resin or the resin precursor described above, for example, a surfactant for improving the dispersibility of the conductive particles, polymerization of the resin precursor , A crosslinking agent that promotes crosslinking between resins, an antioxidant, a dye, a pigment, a filler, a leveling agent, and the like may be added. These additives may be contained, for example, at about 0 to 5% by mass based on the total mass of the second resin material. Further, a diluting solvent may be added to the second resin material in order to improve the coatability of the second resin material on the base sheet.

≪Electric connector≫
The electrical connector of the present invention is a connector provided between the connection terminal of the first electronic device and the connection terminal of the second electronic device, and is an electrical connector for electrically connecting these. A plurality of first conductive portions penetrating in the thickness direction of the base material sheet, a first portion protruding toward the first surface side of the base material sheet, and integrally integrated with at least one of the plurality of first conductive portions. And a two conductive portion.

  The electrical connector of the present invention can be manufactured by the method described above. An electrical connector 10 as an example of the electrical connector of the present invention includes a base sheet 1 as shown in FIGS. 9 and 10. The base sheet 1 has a first surface 1a and a second surface 1b opposed thereto. The base sheet 1 includes a plurality of first conductive portions 5 and insulating portions 6, and forms a sea-island structure in which the first conductive portions 5 are island portions and the insulating portions 6 are sea portions. Each first conductive portion 5 forms a wiring penetrating from the first surface 1a to the second surface 1b, and has a first end portion extending to the second conductive portion 8 protruding from the first surface 1a, and an exposed portion on the second surface. Having a second end. The first conductive portions 5 are independent of each other, and the insulation of each other is maintained by the insulating portion 6. Further, each second conductive portion 8 is formed on the insulating portion 6, and is mutually insulated by air.

The electrical connector 10 has a rectangular sheet shape. The longitudinal direction is the X direction, the short direction is the Y direction, and the direction perpendicular to the first surface 1a (that is, the thickness direction of the sheet) is the Z direction.
The shape of the electrical connector 10 in plan view is not limited to a rectangle, and may be a circle, an ellipse, a polygon, or any other shape.
The length × width size of the electrical connector 10 is not particularly limited, and may be, for example, 1 mm × 1 mm to 10 cm × 10 cm.
The thickness of the electrical connector 10 can be, for example, not less than 50 μm and not more than 500 μm.
The form, size, thickness, and the like of the electrical connector 10 are appropriately set according to the shape of the electronic device connected to the first surface 1a and the second surface 1b and the arrangement of the terminals.

(First conductive part 5)
The first conductive portion 5 of the electrical connector 10 is an island portion of the sea-island structure, and is a plurality of columnar conductive portions that are independent from each other by the sea portion. Since each first conductive portion 5 penetrates the base sheet 1 of the electrical connector 10, the first end of each first conductive portion 5 is exposed on the first surface 1 a of the electrical connector 10. Subsequent to 8, the opposite second end is exposed on the second surface 1b. Each first conductive part 5 is arranged at a constant pitch along the X direction and the Y direction.

  The shape of the first conductive portion 5 is preferably a column shape. The cross-sectional shape of the first conductive portion 5 cut along the XY plane includes, for example, a circle, an ellipse, a square, and other polygons. The cross-sectional shape of the first end on the first surface 1a side of the first conductive portion 5 and the cross-sectional shape of the second end exposed on the second surface 1b may be the same or different, The same is preferable from the viewpoint of connection stability to the electronic device.

  The axis of the central axis of the columnar first conductive portion 5 may be perpendicular to the first surface 1a and the second surface 1b, or may be inclined.

Referring to FIG. The size S1 of the end exposed on the second surface of each first conductive portion 5 is the diameter of the smallest circle including the end. The diameter is preferably, for example, 1 μm to 100 μm, more preferably 3 μm to 50 μm, and more preferably 5 μm to 5 μm, from the viewpoint of reducing the resistance of the first conductive portion 5 and the viewpoint corresponding to the narrow pitch of the terminals in the electronic device to be connected. 25 μm is more preferred. The sizes S1 of the end portions of the individual first conductive portions 5 may be the same or different.
The diameter can be measured by a known microstructure observation means such as a measuring microscope.

The aspect ratio of the columnar first conductive portion 5 represented by (size S1: height H) is preferably 1: 5 to 1:30, and more preferably 1: 8.5 to 1: 25.5.
If it is not less than the lower limit of the above range, the pitch between the adjacent first conductive portions 5 can be narrowed.
If it is not more than the upper limit of the above range, the mechanical strength of the first conductive portion 5 can be increased, disconnection can be prevented when an external stress is applied, and the resistance value can be reduced.
The individual size S1 and height H (the length in the thickness direction of the electrical connector 10) can be measured using a known microstructure observation means such as a measuring microscope.

  The pitch between the adjacent ends of the first conductive portion 5 exposed on the second surface 1b is the center-to-center distance between the smallest circles including the individual ends. This pitch is set arbitrarily according to the arrangement of the terminals of the electronic device to be connected. The arrangement of the first conductive portion 5 corresponds to the arrangement of the holes 2 that can be formed at any position when the electrical connector 10 is manufactured.

  The arrangement of the first conductive portions 5 on the second surface 1b of the electrical connector 10 is a two-dimensional array of X columns × Y rows. The arrangement of the first conductive portions 5 is not limited to this example, and an arbitrary arrangement pattern is adopted. In X columns × Y rows, for example, X and Y can each independently be any integer from 10 to 1000. The arrangement pattern may be a two-dimensional array form, a zigzag form, any other pattern, or a random arrangement.

(Insulating part 6)
The insulating part 6 of the electrical connector 10 is a sea part of the sea-island structure and is an insulating part.
The length of the insulating portion 6 in the Z direction is the same as the thickness of the base sheet 1 and is preferably 25 μm or more and 750 μm or less, more preferably 50 μm or more and 500 μm or less.
When the length is equal to or more than the lower limit, the mechanical strength of the electrical connector 10 increases. When the length is equal to or less than the upper limit, the flexibility of the electrical connector 10 is further increased, and the electrical connector 10 can be easily mounted inside an electronic device that needs to be thin.

The content of the elastomer with respect to the total mass of the insulating portion 6 is preferably 70 to 100% by mass, more preferably 80 to 100% by mass, and still more preferably 90 to 100% by mass.
When the content is 70% by mass or more, the flexibility of the electrical connector 10 is sufficiently increased.

(Second conductive part 8)
The shape in plan view of each of the second conductive portions 8 of the electrical connector 10 is not particularly limited, and any shape can be applied. For example, a square, a circle, an ellipse, other polygons, and the like can be given. The shapes of the respective second conductive portions 8 in plan view may be the same as each other, or may be different.
The size S2 in plan view of each of the second conductive portions 8 included in the electrical connector 10 is not particularly limited, and can be appropriately set according to the shape of the electrode of the electronic device to be connected. Here, the size S2 is the diameter of the smallest circle including the shape of the single second conductive portion 8 in plan view. The diameter is, for example, preferably 1 μm to 100 μm, more preferably 3 μm to 50 μm, and more preferably 5 μm to 5 μm from the viewpoint of reducing the resistance of the second conductive portion 8 and the viewpoint corresponding to the narrow pitch of the terminals in the electronic device to be connected. 25 μm is more preferred.
The diameter can be measured by a known microstructure observation means such as a measuring microscope.
From the viewpoint of further improving the connectivity to the electronic device, the size S2 of the second conductive portion 8 in a plan view is larger than the size S1 of the end portion of the second conductive portion 8 and the continuous first conductive portion 5. Is also preferably large.

The height h of the second conductive portion 8 is not particularly limited, and may be, for example, 1 μm to 50 μm. The heights h of the respective second conductive portions 8 may be the same or different.
As shown in FIG. 12, the height h of the second conductive portion 8 is obtained from an image obtained by capturing a cross section of the electrical connector 10 in the thickness direction by a known method. The height h of the above-mentioned second conductive portion 8 is, for example, 5 or more, preferably 10 or more selected at random from an image of a cross section in which 10 or more, preferably 30 or more second conductive portions 8 are captured. It is preferable that the average value is obtained by calculating the heights of the two or more second conductive portions 8 by image processing.

  When the electrical connector of the present invention is manufactured by the above-described method, the resin composition forming the first conductive portion 5 and the resin composition forming the second conductive portion 8 are the same. The reason is that the resin contained in the first conductive part 5 and the resin contained in the second conductive part 8, and the conductive particles contained in the first conductive part 5 and the conductive particles contained in the second conductive part 8 are: This is because they are formed by the common second resin material L2. Therefore, if the first conductive part 5 and the second conductive part 8 are formed of the same resin composition, the type of the resin, the composition of the resin, the type of the conductive particles, and the amount of the conductive particles should be substantially the same. It is.

[How to use electrical connector]
Examples of the use of the electric connector 10 as an example of the present invention include the same uses as known electric connectors. The present invention can be applied to so-called mounting applications such as connecting a plurality of electronic devices (for example, circuit boards) provided in an electronic device, in addition to inspection applications for conducting a continuity test of terminals of an electronic device.
FIG. 14 shows an example of a state in which a plurality of electronic devices are connected via the electric connector 10. Each electronic device is pressed against the electrical connector 10. In this example, the plurality of terminals T1 of the first electronic device D1 are in contact with any of the second conductive portions 8 protruding on the first surface 1a of the electrical connector 10. The plurality of terminals T2 of the second electronic device D2 are in contact with any of the ends of the first conductive portion 5 exposed on the second surface 1b of the electrical connector 10. If the target terminal of each electronic device is connected, it is not necessary that all of the first conductive portion 5 and the second conductive portion 8 of the electrical connector 10 are in contact with the terminal of each electronic device.

  When the base sheet 1 of the electrical connector 10 contains an elastomer, the electrical connector 10 has flexibility and elastic deformation, so that the electrical connector 10 can be relatively easily installed and removed from the electronic device, and the terminal of the electronic device can be easily removed. Can be prevented from being damaged. Further, from the viewpoint of more reliably preventing damage to the terminals of the electronic device, the first conductive portion 5 and the second conductive portion 8 preferably include an elastomer.

DESCRIPTION OF SYMBOLS 1 ... Base sheet, 2 ... Hole part, 5 ... First conductive part, 6 ... Insulating part, 7 ... Conductive layer, 8 ... Second conductive part, 10 ... Electrical connector, D1 ... First electronic device, D2 ... No. Two electronic devices, G: resin composition layer, J: magnet, K: mold, M: convex, N: concave, L1: first resin material, L2: second resin material, O: mold, F ... Conductive particles, R: residual film, T1: terminal, T2: terminal, U: concave portion, W: mold

Claims (4)

A connection terminal of the first electronic device, disposed between the connection terminal of the second electronic device, a method of manufacturing an electrical connector for electrically connecting them,
A first resin material containing a resin or a resin precursor is introduced into a molding die having a plurality of projections formed thereon, and the first resin material is cured, and the penetration or non-penetration corresponding to each projection of the molding die is performed. A step (A1) of preparing a base material sheet in which the hole of (1) opens on the first surface;
On the first surface of the base sheet, a second resin material containing conductive particles containing a ferromagnetic material and a resin or a resin precursor is applied, and the second resin material is placed in each of the holes. While injecting a part of the second resin material, the remaining portion of the second resin material was retained on the first surface, and further magnetic force was applied to align the conductive particles in the hole in the depth direction of the hole. rear,
By curing the second resin material injected into the hole, and the second resin material retained on the first surface,
Forming a first conductive portion in each of the holes, forming a continuous conductive layer with each of the first conductive portions on the first surface;
(B) removing a part of the conductive layer by etching to form a plurality of second conductive portions partitioned independently of each other;
A method for producing an electrical connector, comprising: A connection terminal of the first electronic device, disposed between the connection terminal of the second electronic device, a method of manufacturing an electrical connector for electrically connecting them,
A first resin material containing a resin or a resin precursor is introduced into a molding die, a sheet is produced by curing the first resin material, and a plurality of penetrating or non-penetrating holes that are opened on the first surface of the sheet. Forming a base sheet to obtain a base sheet (A2);
On the first surface of the base sheet, a second resin material containing conductive particles containing a ferromagnetic material and a resin or a resin precursor is applied, and the second resin material is placed in each of the holes. While injecting a part of the second resin material, the remaining portion of the second resin material was retained on the first surface, and further magnetic force was applied to align the conductive particles in the hole in the depth direction of the hole. rear,
By curing the second resin material injected into the hole, and the second resin material retained on the first surface,
Forming a first conductive portion in each of the holes, forming a continuous conductive layer with each of the first conductive portions on the first surface;
(B) removing a part of the conductive layer by etching to form a plurality of second conductive portions partitioned independently of each other;
A method for producing an electrical connector, comprising: A connection terminal of the first electronic device, disposed between the connection terminal of the second electronic device, a method of manufacturing an electrical connector for electrically connecting them,
Prepare a base sheet formed with a resin, a plurality of through or non-penetrating holes that are opened on the first surface,
On the first surface of the base sheet, a second resin material containing conductive particles containing a ferromagnetic material and a resin or a resin precursor is applied, and the second resin material is placed in each of the holes. While injecting the remaining of the second resin material on the first surface, further applying a magnetic force, after aligning the conductive particles in the hole in the depth direction of the hole,
By curing the second resin material injected into the hole, and the second resin material retained on the first surface,
Forming a first conductive portion in each of the holes, forming a continuous conductive layer with each of the first conductive portions on the first surface;
And (B) forming a plurality of second conductive portions partitioned independently from each other by removing a part of the conductive layer by etching. A connection terminal of the first electronic device, disposed between the connection terminal of the second electronic device, an electrical connector for electrically connecting them,
A base sheet,
A plurality of first conductive portions penetrating in the thickness direction of the base sheet,
Projecting to the first surface side of the base sheet, comprising a second conductive portion integrated with at least one of the plurality of first conductive portions in succession,
The electrical connector, wherein the first conductive portion and the second conductive portion are formed of the same resin composition including a resin and conductive particles.

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