JP2020019991A5

JP2020019991A5 -

Info

Publication number: JP2020019991A5
Application number: JP2018143735A
Authority: JP
Filing date: 2018-07-31
Publication date: 2021-09-24
Anticipated expiration: 2038-07-31

Description

本発明の一側面としての成膜装置は、成膜対象物およびターゲットが配置されるチャンバと、前記チャンバ内の、前記ターゲットを介して前記成膜対象物と対向する位置に配置される磁場発生手段と、備えた成膜装置であって、前記ターゲットの長手方向に並んで配置された複数の導電部材と、前記複数の導電部材のうちの少なくとも２つの導電部材の電位が異なるように、前記複数の導電部材の少なくとも１つに電位を印加する電位印加手段と、有することを特徴とする。
また、本発明の別の一側面としての成膜装置は、成膜対象物およびターゲットが配置されるチャンバと、前記チャンバ内の、前記ターゲットを介して前記成膜対象物と対向する位置に配置される磁場発生手段と、を備えた成膜装置であって、前記ターゲットの表面の長手方向における一部の領域にのみ前記ターゲットと対向する導電部材と、前記導電部材に電位を印加する電位印加手段と、を有することを特徴とする。
また、本発明の別の一側面としての電子デバイスの製造方法は、成膜対象物をチャンバ内に配置し、前記成膜対象物と対向して配置されたターゲットから飛翔するスパッタ粒子を堆積させて成膜するスパッタ成膜工程を含む電子デバイスの製造方法であって、前記スパッタ成膜工程は、前記ターゲットの長手方向に垂直な断面における前記ターゲットの周囲の空間電位分布を前記ターゲットの中央部と端部とで異ならせた状態で成膜する工程であることを特徴とする。 The film forming apparatus as one aspect of the present invention is a magnetic field generation device in which a film forming object and a target are arranged and a position in the chamber facing the film forming object via the target. means, a film forming apparatus having a plurality of conductive members arranged side by side in the longitudinal direction before Symbol target, so that the potential of the at least two conductive members of the plurality of conductive members are different, It is characterized by having a potential applying means for applying a potential to at least one of the plurality of conductive members.
Further, the film forming apparatus as another aspect of the present invention is arranged at a position in the chamber where the film forming object and the target are arranged and facing the film forming object via the target in the chamber. a film forming apparatus and a magnetic field generating means which is, potentials applied to the conductive member facing the target only a part of the region, a potential to the conductive member in the longitudinal direction of the surface of the pre-Symbol target It is characterized by having an application means.
Further, in the method for manufacturing an electronic device as another aspect of the present invention, a film-forming object is arranged in a chamber, and spatter particles flying from a target arranged facing the film-forming object are deposited. This is a method for manufacturing an electronic device including a sputter film forming step of forming a film, wherein the sputter film forming step sets a spatial potential distribution around the target in a cross section perpendicular to the longitudinal direction of the target to a central portion of the target. It is characterized in that it is a step of forming a film in a state where the film is different from the end portion.

Claims

The chamber in which the film-forming object and the target are placed, and
A magnetic field generating means arranged at a position in the chamber facing the film-forming object via the target.
A film forming apparatus having a,
A plurality of conductive members arranged side by side in the longitudinal direction before Symbol target,
A potential applying means for applying a potential to at least one of the plurality of conductive members so that the potentials of at least two of the plurality of conductive members are different.
A film forming apparatus characterized by having.

Wherein the plurality of conductive members, before Symbol deposition apparatus according to claim 1, characterized in that it comprises at least three conductive members arranged side by side in the longitudinal direction of the target.

The potential applying means sets the potential of the plurality of conductive members so that the potential of the conductive member corresponding to the central portion of the target is higher than the potential of the conductive member corresponding to both ends of the target. The film forming apparatus according to claim 2, wherein the film forming apparatus is applied.

The chamber in which the film-forming object and the target are placed, and
A magnetic field generating means arranged at a position in the chamber facing the film-forming object via the target.
A film forming apparatus having a,
And the conductive member facing the target only in a partial region in the longitudinal direction of the surface of the pre-Symbol target,
An electric potential applying means for applying an electric potential to the conductive member, and
A film forming apparatus characterized by having.

The film forming apparatus according to claim 4, wherein the partial region is a portion deviated from both ends in the longitudinal direction of the surface of the target.

The film forming apparatus according to claim 5, wherein the partial region is a central portion of the surface of the target in the longitudinal direction.

The film forming apparatus according to claim 4, wherein the partial region is at least one of both ends in the longitudinal direction of the surface of the target.

A surface shape measuring means for measuring the surface shape of the target, and
Any one of claims 1 to 7, further comprising a control unit that controls the potential applied by the potential applying means according to the surface shape of the target measured by the surface shape measuring means. The film forming apparatus according to.

The film forming apparatus according to claim 8, wherein the surface shape measuring means measures the surface shape of a portion of the target that does not face the film forming object.

A film thickness distribution measuring means for measuring the film thickness distribution of the film formed on the film-forming object,
A control unit that controls the potential applied by the potential applying means according to the film thickness distribution of the film measured by the film thickness distribution measuring means.
The film forming apparatus according to any one of claims 1 to 7, wherein the film forming apparatus has.

Before Kishirube conductive member film forming apparatus according to any one of claims 1 to 7, characterized in that it constitutes a deposition-inhibitory member.

The film forming apparatus according to any one of claims 1 to 7 , wherein the target has a cylindrical shape and further includes a rotating means for rotating the target.

And a the said magnetic field generating means target, said magnetic field generating means, the cathode unit which is placed inside the target, any one of claims 1 to 7, characterized in that a plurality into said chamber The film forming apparatus according to one item.

A method for manufacturing an electronic device, which comprises a sputter film forming step of arranging a film forming object in a chamber and depositing sputter particles flying from a target arranged opposite to the film forming object to form a film. ,
The sputter film forming step is a step of forming a film in a state where the spatial potential distribution around the target in a cross section perpendicular to the longitudinal direction of the target is different between the central portion and the end portion of the target. The manufacturing method of the electronic device.

In the sputter film forming step, by applying a potential to the conductive member arranged around the target, the spatial potential distribution around the target in the cross section perpendicular to the longitudinal direction of the target is set with the central portion of the target. The method for manufacturing an electronic device according to claim 14, wherein the step is a step of forming a film in a state different from that of the end portion.

A plurality of the conductive members are arranged along the longitudinal direction of the target.
The sputter deposition process odor as the potential of the at least two conductive members of said conductive member several different Te, claim 15, characterized in that at least one of the potential of the conductive member more than is applied The method for manufacturing an electronic device according to.

The method for manufacturing an electronic device according to claim 15, wherein the conductive member is arranged at a central portion in the longitudinal direction of the target.

The method for manufacturing an electronic device according to claim 16, wherein the conductive members are arranged at both ends in the longitudinal direction of the target.