JP2020010435A - Power conversion device - Google Patents

Abstract

To downsize a substrate.SOLUTION: Provided is a power conversion device including: a first substrate on which a first electronic component that is operated at a first voltage is mounted; a second substrate on which a second electronic component that is operated at a second voltage higher than the first voltage is mounted on a first side in a first direction perpendicular to a surface of the first substrate; and an insulating element that is disposed between the first substrate and the second substrate in the first direction, that has one end electrically connected to the first substrate and the other end electrically connected to the second substrate, and that is operable as an element on a power conversion circuit.SELECTED DRAWING: Figure 3

Description

  The present disclosure relates to a power conversion device.

  2. Description of the Related Art A technique for setting a high-voltage circuit region, a low-voltage circuit region, and an insulating region (a region that does not include any conductor, including an inner layer of a substrate) on one substrate is known.

JP 2009-130967 A

  However, in the above-described related art, it is necessary to set an insulating region between the high-voltage circuit region and the low-voltage circuit region, and thus it is difficult to reduce the size of the substrate for driving the inverter. It is useful to reduce the size of the substrate in response to the reduction in the size of the inverter power module.

  Therefore, in one aspect, an object of the present invention is to reduce the size of a substrate.

In one aspect, a first substrate on which a first electronic component operating at a first voltage is mounted;
A second substrate on which a second electronic component operating at a second voltage higher than the first voltage is mounted on a first side in a first direction perpendicular to a surface of the first substrate;
An insulating element having one end electrically connected to the first substrate and the other end electrically connected to the second substrate between the first substrate and the second substrate in the first direction; And an insulation element operable as an element of the power conversion circuit.

  According to one aspect, according to the present invention, it is possible to reduce the size of a substrate.

FIG. 3 is a diagram illustrating an example of an electric circuit including an inverter. It is a figure showing the example of composition of the control system of an inverter. FIG. 2 is a schematic cross-sectional view illustrating a substrate mounting mode of a control system of the inverter according to the first embodiment. It is a schematic sectional drawing which shows a 1st comparative example. It is a schematic sectional drawing which shows a 2nd comparative example. FIG. 7 is a schematic cross-sectional view illustrating a substrate mounting mode of a control system of an inverter according to a second embodiment. FIG. 7 is a cross-sectional view along the line AA in FIG. 6. It is a figure showing the state before assembly of the insulated communication element (state separated in the Z direction). FIG. 4 is a diagram illustrating a state before assembly of the insulating transformer (a state separated in the Z direction). FIG. 8 is a cross-sectional view showing a state before the insulating transformer is assembled in a cross-sectional view shown in FIG. 7.

  Hereinafter, each embodiment will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a diagram illustrating an example of an electric circuit 1 including an inverter 4. The electric circuit 1 is for driving a motor, for example.

  The electric circuit 1 includes a battery 2, an inverter (an example of a power converter) 4, and a smoothing capacitor C1. The motor 4 is electrically connected to the inverter 4. The motor 5 may be a traveling motor used in a hybrid vehicle or an electric vehicle. In this example, the motor 5 is a three-phase AC motor. The smoothing capacitor C1 is electrically connected between the positive electrode side and the negative electrode side of the battery 2.

  Inverter 4 includes a plurality of switching elements Q1 to Q6. Switching elements Q1 to Q6 are IGBTs (Insulated Gate Bipolar Transistors). However, instead of the IGBT, another switching element such as a MOSFET (Metal Oxide Semiconductor Field-Effect Transistor) may be used. Inverter 4 may include freewheel diodes D1 to D6 in parallel with switching elements Q1 to Q6, respectively.

  Hereinafter, several embodiments of the control system 7 of the inverter 4 will be sequentially described.

<Example 1>
FIG. 2 is a diagram illustrating a configuration example of a control system 7 (power conversion circuit) of the inverter 4 according to the first embodiment.

  The control system 7 of the inverter 4 includes a power module 10, a high voltage system circuit section 20, an insulating coupling section 30, a power supply control circuit 40, and a motor control circuit 42.

  The power module 10 includes switching elements Q1 to Q6 and freewheel diodes D1 to D6 (not shown), and may further include a temperature sensor 10c and an overcurrent detector 10d. The temperature sensor 10c is provided for managing the temperature of the power module 10. The overcurrent detector 10d is provided for monitoring current in the power module 10.

  The high voltage system circuit section 20 includes a driver 20a and a diagnostic circuit 20b. The driver 20a is a circuit that drives the switching elements Q1 to Q6. Specifically, the driver 20a turns on / off the switching elements Q1 to Q6 by giving a gate signal to the switching elements Q1 to Q6 in response to the on / off signal from the motor control circuit 42. The driver 20a may be provided for each phase arm (upper and lower arms). The diagnostic circuit 20b monitors (diagnoses) the temperature of the power module 10 and the presence or absence of an overcurrent based on information from the temperature sensor 10c and the overcurrent detector 10d. The diagnosis circuit 20b supplies a diagnosis result to the motor control circuit 42 at predetermined intervals or as needed. The diagnostic circuit 20b may be provided for each arm of each phase.

  The insulating coupling section 30 is provided between the high voltage system circuit section 20 and the low voltage system motor control circuit 42. One end of the insulating coupling unit 30 is electrically connected to the high-voltage circuit unit 20, the other end is electrically connected to the motor control circuit 42, and the one end and the other end are electrically insulated internally. You. The insulating coupling unit 30 includes an insulation type transformer 31 (hereinafter, referred to as “insulation transformer 31”) and insulation type communication elements 32, 33 (hereinafter, referred to as “insulation communication elements 32, 33”). The insulation transformer 31 and the insulation communication elements 32 and 33 may be provided for each phase arm. Note that the insulating transformer 31 and the insulating communication elements 32 and 33 are examples of an insulating element that can operate as an element of a power conversion circuit.

  The insulating transformer 31 supplies power to the high-voltage circuit section 20 under the control of the power supply control circuit 40. The insulating communication element 32 transmits a signal indicating a diagnosis result from the diagnosis circuit 20b to the motor control circuit 42. The insulating communication element 33 transmits an on / off signal from the motor control circuit 42 to the driver 20a. The insulating communication elements 32 and 33 may be insulating elements (for example, photocouplers) that optically couple the high-voltage circuit unit 20 and the low-voltage motor control circuit 42, or may be magnetically coupled. (For example, an insulating element using electromagnetic induction). The insulated communication element 33 may be incorporated in an insulated drive IC (Integrated Circuit) together with the driver 20a. That is, the insulated communication element 33 may be embodied as an insulated gate driver together with the driver 20a.

  Power supply control circuit 40 includes a transistor (not shown) for driving insulating transformer 31. In the example shown in FIG. 2, the power supply control circuit 40 is common to the driver 20a for each arm of each phase. The power supply control circuit 40 controls the power supplied to the plurality of drivers 20a collectively.

  The motor control circuit 42 controls the motor 5 by controlling the power module 10 via the insulated communication element 33 and the driver 20a. The motor control circuit 42 generates an on / off signal in accordance with, for example, a control target value corresponding to the accelerator opening, and turns on / off the switching elements Q1 to Q6.

  Here, the power module 10 and the high-voltage circuit 20 handle a high voltage such as a voltage across the smoothing capacitor C1 generated when the motor 5 is driven. The voltage handled is, for example, 400 V or more (an example of the second voltage). On the other hand, the power supply control circuit 40 and the motor control circuit 42 operate at a low voltage. For example, the power supply control circuit 40 and the motor control circuit 42 operate at a voltage of about 8 V to 16 V (an example of a first voltage). The insulating coupling portion 30 has a function of optically or magnetically coupling such a high-voltage system and a low-voltage system.

  FIG. 3 is a schematic cross-sectional view showing a substrate mounting mode of the control system 7 of the inverter 4 according to the present embodiment. FIG. 3 shows the Z direction. The Z direction corresponds to the thickness direction of the substrates 71 and 72.

  In this embodiment, two substrates 71 and 72 (an example of a first substrate and a second substrate) are used. The substrates 71 and 72 have the same outer shape, but may have different outer shapes. The two substrates 71 and 72 are provided so as to overlap when viewed in the Z direction. The two substrates 71 and 72 are separated from each other in the Z direction (an example of a first direction). The substrate 72 is located on the Z direction Z2 side (an example of a first side) of the substrate 71.

  A low-voltage electronic component is mounted on the substrate 71, and a high-voltage electronic component is mounted on the substrate 72. Hereinafter, the substrate 71 is also referred to as a “low-voltage substrate 71”, and the substrate 72 is also referred to as a “high-voltage substrate 72”. The power supply control circuit 40 and the motor control circuit 42 shown in FIG. 2 are mounted on the low-voltage board 71. For example, an electronic component 91A (an example of a first electronic component) schematically shown in FIG. 3 forms the power supply control circuit 40 and the motor control circuit 42. The high voltage system circuit section 20 shown in FIG. 2 is mounted on the high voltage system board 72. For example, an electronic component 91 </ b> B (an example of a second electronic component) schematically illustrated in FIG. 3 forms the high-voltage circuit unit 20. The power module 10 is provided so as to overlap the substrates 71 and 72 when viewed in the Z direction. For example, the power module 10 is provided on the Z1 side or the Z2 side of the substrates 71 and 72 in the Z direction via a shielding plate (not shown).

  The low-voltage board 71 and the high-voltage board 72 are, for example, solid type boards. The low-voltage board 71 and the high-voltage board 72 may be multilayer boards.

  An insulating coupling part 30 is provided between the low-voltage board 71 and the high-voltage board 72 in the Z direction. In FIG. 3, the boundary between the high voltage side and the low voltage side is schematically shown by a line L1.

  Specifically, as shown in FIG. 3, the insulating transformer 31 has a terminal 311 at an end on the Z1 side in the Z direction electrically connected to the low-voltage board 71 and a terminal 312 at an end on the Z2 side in the Z direction. Are electrically connected to the high voltage system substrate 72. As shown in FIG. 3, the terminal 311 is exposed on the Z-direction Z1 side of the low-voltage board 71 through the Z-direction through hole 710 of the low-voltage board 71, and the low-voltage board 71 is located on the Z-direction Z1 side. It is joined to an upper electrode (not shown) by solder 90 or the like. Similarly, as shown in FIG. 3, the terminal 312 is exposed to the Z-direction Z2 side of the high-voltage system board 72 through the Z-direction through hole 720 of the high-voltage system board 72, and the high-voltage An electrode (not shown) on the system board 72 is joined by solder 90 or the like. In a modification, the terminal 311 may be joined to an electrode (not shown) on the low-voltage substrate 71 on the surface of the low-voltage substrate 71 on the Z2 side by soldering or the like. In this case, the through hole 710 may be omitted. Alternatively, the terminal 312 may be joined to an electrode (not shown) of the high-voltage substrate 72 on the surface of the high-voltage substrate 72 on the Z direction Z1 side by soldering or the like. In this case, the through hole 720 may be omitted.

  As shown in FIG. 3, the insulated communication element 33 has a terminal 331 at the end on the Z1 side Z1 electrically connected to the low-voltage board 71 and a terminal 332 at the end on the Z2 side Z direction high. It is electrically connected to voltage system board 72. As shown in FIG. 3, the terminal 331 is exposed to the Z-direction Z1 side of the low-voltage board 71 through the Z-direction through hole 711 of the low-voltage board 71, and the low-voltage board 71 is It is joined to an upper electrode (not shown) by solder 90 or the like. Similarly, the terminal 332 is exposed to the Z-direction Z2 side of the high-voltage system board 72 through the Z-direction through hole 721 of the high-voltage system board 72 as shown in FIG. An electrode (not shown) on the system board 72 is joined by solder 90 or the like. In the modification, the terminal 331 may be joined to an electrode (not shown) on the low-voltage substrate 71 on the surface of the low-voltage substrate 71 on the Z2 side by soldering or the like. In this case, the through hole 711 may be omitted. Alternatively, the terminal 332 may be joined to an electrode (not shown) of the high-voltage substrate 72 on the surface of the high-voltage substrate 72 on the Z direction Z1 side by soldering or the like. In this case, the through hole 721 may be omitted.

  The insulating communication element 32 is not shown or described, but may be the same as the insulating communication element 33.

  Here, the effect of this embodiment (the board mounting mode shown in FIG. 3) will be described in comparison with the first comparative example and the second comparative example shown in FIGS.

  In the first comparative example shown in FIG. 4, one substrate 400 is used, and all or most of the electronic components 410 and 412 forming the control system of the inverter are mounted on the substrate 400. The substrate 400 is divided into a high-voltage circuit region and a low-voltage circuit region as schematically shown in FIG. 4 by a line L1 as a boundary between the high-voltage circuit region and the low-voltage circuit region. An insulating region 404 is provided at a boundary between the regions. The insulating region 404 is a region that does not include any conductors, including the inner layer of the substrate 400, extends between the high-voltage circuit region and the low-voltage circuit region, and has a function of electrically insulating both. The width of the insulating region 404 is set such that a required insulating distance can be secured. Note that the insulating transformer 431 and the insulating communication element 433 are provided on the insulating region 404 between the high-voltage circuit region and the low-voltage circuit region.

  In the first comparative example, since it is necessary to set the insulating region 404 between the high-voltage circuit region and the low-voltage circuit region, it is difficult to reduce the size of the substrate 400.

  By the way, the power module 10 is provided so as to be stacked on the substrates 71 and 72, and the inverter 4 is modularized as a whole. Therefore, if the size of the substrates 71 and 72 is excessively large with respect to the size of the power module 10, there is a problem that the size of the inverter 4 becomes large due to the size of the substrates 71 and 72.

  In this regard, in the first comparative example, the size of the substrate 400 is reduced due to the use of only one substrate 400 and the provision of the insulating region 404 between the high-voltage circuit region and the low-voltage circuit region. The size of the module 10 tends to be excessive.

  On the other hand, according to the present embodiment, since the two substrates 71 and 72 are used corresponding to the high-voltage system and the low-voltage system, respectively, the outer size of the substrate is easily reduced as compared with the first comparative example. it can. Further, according to this embodiment, the substrates 71 and 72 are separated from each other in the Z direction, and the substrates 71 and 72 are optically or magnetically coupled by the insulating coupling portion 30. The inconvenience caused in the first comparative example can be reduced. That is, according to the present embodiment, the size of the substrates 71 and 72 does not easily become excessively large with respect to the size of the power module 10. Thus, according to the present embodiment, it is possible to reduce the size of the substrates 71 and 72 in accordance with the reduction in the size of the inverter module.

  In this embodiment, the size of the power module 10 may be slightly smaller than the outer shapes of the substrates 71 and 72. In other words, the outer shapes of the boards 71 and 72 are determined according to the outer shape of the power module 10, and may be set to be at least as large as the outer shape of the power module 10.

  In the second comparative example shown in FIG. 5, two substrates 501 and 502 separated from each other in the Z direction are used, and a low-voltage electronic component 510 is provided on the substrate 501. Electronic parts 512 are provided. An insulating region 504 is provided on the substrate 502 at the boundary between the high-voltage circuit region and the low-voltage circuit region. The insulating transformer 531 and the insulating communication element 533 are provided on the insulating region 504 between the high voltage circuit region and the low voltage circuit region. The boards 501 and 502 are electrically connected by a connector 540. Note that, unlike the insulating element, the connector 540 cannot insulate between the substrates 501 and 502, and therefore requires an insulating region 504.

  In the second comparative example, the outer size of the board when viewed in the Z direction can be reduced by the use of the two boards 501 and 502, but only by the area of the insulating region 504 and the installation area of the connector 540. However, miniaturization of the substrates 501 and 502 is still hindered. In the second comparative example shown in FIG. 5, since the connector 540 is used, the number of components increases.

  On the other hand, according to the present embodiment, since the substrate 71 and 72 are optically or magnetically coupled by the insulating coupling portion 30, an insulating region and a connector are not required, and the inconvenience caused in the second comparative example is reduced. it can. That is, the size of the substrates 71 and 72 is unlikely to be too large with respect to the size of the power module 10. Thus, according to the present embodiment, it is possible to reduce the size of the substrates 71 and 72 in accordance with the reduction in the size of the inverter module.

<Example 2>
Second Embodiment Next, a second embodiment will be described with reference to FIGS. The second embodiment is different from the first embodiment in the mounting mode of the insulating coupling unit 30. In the following, components that may be the same as those in the above-described first embodiment are given the same reference numerals, and description thereof may be omitted.

  FIG. 6 is a schematic cross-sectional view illustrating a substrate mounting mode of the control system 7 of the inverter 4 according to the second embodiment. FIG. 7 is a sectional view taken along line AA of FIG.

  In the second embodiment, an insulating coupling portion 30A is provided between the low-voltage board 71 and the high-voltage board 72 in the Z direction.

  Specifically, as shown in FIG. 6, the insulating transformer 34 has a terminal 311A at the end on the Z1 side Z1 electrically connected to the low-voltage board 71 and a terminal 312A at the end on the Z2 side Z2. Are electrically connected to the high voltage system substrate 72. As shown in FIG. 6, the terminal 311A is connected to an electrode (not shown) on the low-voltage substrate 71 on the surface of the low-voltage substrate 71 on the Z direction Z2 side by a conductive leaf spring 92 (of an elastic member). Electrically connected via an example). Similarly, as shown in FIG. 6, the terminal 312A is connected to an electrode (not shown) of the high-voltage board 72 on the surface of the high-voltage board 72 on the Z direction Z1 side. They are electrically connected via 93 (an example of an elastic member).

  Note that the terminal 311A and the leaf spring 92 may be joined by welding, a conductive adhesive, or the like. Similarly, the terminal 312A and the leaf spring 93 may be joined by welding, a conductive adhesive, or the like. The leaf spring 92 may be joined to an electrode (not shown) of the low-voltage board 71 by welding, a conductive adhesive, or the like. Similarly, the leaf spring 93 may be joined to the high-voltage board 72 by welding, a conductive adhesive, or the like.

  In the present embodiment, as an example, the insulating transformer 34 has a form in which E-shaped cores 341 and 342 are opposed to each other in the Z direction as shown in FIGS. A primary winding 345 is wound around the core 342, and a secondary winding 346 is wound around the bobbin 344 around the core 342. Note that, in a modification, the insulating transformer 34 may include another type of core such as an I-shaped core.

  Both ends of the winding 345 may be electrically connected to the terminal 311A, or the terminal 311A itself may be formed. Similarly, both ends of the winding 346 may be electrically connected to the terminal 312A, or the terminal 312A itself may be formed. The insulating transformer 34 may include a center tap (not shown), and in this case, wiring from the center tap is provided.

  As shown in FIG. 6, the insulated communication element 36 has the terminal 331A at the end on the Z1 side in the Z direction electrically connected to the low-voltage board 71 and the terminal 332A on the end on the Z2 side in the Z direction has a high terminal. It is electrically connected to voltage system board 72. As shown in FIG. 6, the terminal 331A is electrically connected to a conductive leaf spring 94 (an example of an elastic member) via a bonding wire 601, and the leaf spring 94 is connected to the Z-direction Z2 of the low-voltage board 71. The surface on the side is electrically connected to an electrode (not shown) on the low voltage system substrate 71. Similarly, the terminal 332 </ b> A is electrically connected to a conductive leaf spring 95 (an example of an elastic member) via a bonding wire 602, and the leaf spring 95 is disposed on the surface of the high-voltage substrate 72 on the Z direction Z1 side. , Are electrically connected to electrodes (not shown) of the high voltage system substrate 72.

  The leaf spring 94 may be joined to an electrode (not shown) of the low-voltage board 71 by welding, a conductive adhesive, or the like. Similarly, the leaf spring 95 may be joined to the electrode of the high-voltage board 72 by welding, a conductive adhesive, or the like.

  In the present embodiment, as an example, the insulated communication element 36 includes a low-voltage chip 361 and a high-voltage chip 362, and the chips 361 and 362 face each other in the Z direction. The surfaces of the chips 361 and 362 facing each other are covered with insulating films 363 and 364, respectively. The chips 361 and 362 are incorporated in resin material molded portions 365 and 366, respectively. The chips 361 and 362 abut in the Z direction via insulating films 363 and 364, and are optically or magnetically coupled. For example, the chips 361 and 362 are a light emitting element and a light receiving element forming a photocoupler, respectively. Alternatively, the chips 361 and 362 may include a core and a coil using electromagnetic induction. In a modification, the chips 361 and 362 do not include the insulating films 363 and 364, and may be non-contact.

  According to this embodiment, the same effects as those of the first embodiment can be obtained. That is, according to the present embodiment, it is possible to reduce the size of the substrates 71 and 72 corresponding to the reduction in the size of the inverter module.

  Next, the assemblability or repairability according to the present embodiment will be described with reference to FIGS.

  8 shows a state before assembly of the insulated communication element 36 (a state separated in the Z direction), FIG. 9 shows a state before the assembly of the insulating transformer 34 (a state separated in the Z direction), and FIG. 7 shows a state before assembly of the insulating transformer 34 (a state separated in the Z direction) in a cross-sectional view shown in FIG.

  The insulated communication element 36 has a configuration in which a high-voltage part and a low-voltage part are separable, and are coupled in such a manner that the mold parts 365 and 366 abut in the Z direction. Therefore, the low voltage system substrate 71 to which the mold part 365 (in a state where the chip 361 and the insulating film 363 are sealed), which is a low voltage side part, is fixed, and the mold part 366 (the chip 362 and the insulating part) which is a high voltage side part is fixed. The insulated communication element 36 can be assembled by positioning the high voltage system substrate 72 to which the film 364 is sealed) and the mold parts 365 and 366 in the Z direction. At this time, the leaf springs 94 and 95 are bent, and the mold portions 365 and 366 are brought into close contact with each other in the Z direction.

  Preferably, the mold portions 365 and 366 may have complementary concave and convex shapes 365a and 366a, respectively, on the surfaces facing each other in the Z direction. The complementary relationship means that when one is concave in the Z direction, the other is a convex in the Z direction that fits in the concave shape. In this case, the concave and convex shapes 365a and 366a perform a positioning function in a plane perpendicular to the Z direction, so that the mold portions 365 and 366 can be easily brought into close contact with each other in a regular positional relationship in the Z direction.

  The insulating transformer 34 has a configuration in which a high voltage side part and a low voltage side part can be separated, and bobbins 343 and 344 are coupled together with the cores 341 and 342 in a manner to abut in the Z direction. Therefore, the low-voltage board 71 to which the low-voltage part (the core 341 and the bobbin 343 and the like) is fixed and the high-voltage board 72 to which the high-voltage part (the core 342 and the bobbin 344 and the like) are fixed are connected to the core. By positioning the bobbins 343 and 344 together with the 341 and 342 in the Z direction, the insulating transformer 34 can be assembled. At this time, the leaf springs 92 and 93 are bent, and the bobbins 343 and 344 are brought into close contact with the cores 341 and 342 in the Z direction.

  The bobbins 343 and 344 together with the cores 341 and 342 may preferably have complementary concave and convex shapes 370 and 371 on the surfaces facing each other in the Z direction. In this case, since the concave and convex shapes 370 and 371 perform a positioning function in a plane perpendicular to the Z direction, it is easy to bring the low-voltage side and the high-voltage side of the insulating transformer 34 into close contact with each other in a regular positional relationship in the Z direction. Becomes

  In the present embodiment, as compared with the above-described first embodiment, only the low-voltage board 71 and the high-voltage board 72 are aligned in the Z direction, and the portions on the high-voltage side of the insulating communication element 36 and the insulating transformer 34 are different from each other. The portion on the low voltage side abuts in the Z direction, and the assembling of the insulating communication element 36 and the insulating transformer 34 is substantially completed. Therefore, the assembling property is good. Also, when the low-voltage board 71 and the high-voltage board 72 are separated in the Z direction during repair or the like after assembly, the high-voltage side and the low-voltage side of the insulated communication element 36 and the insulating transformer 34 are separated. Can be easily separated in the Z direction. Thereby, the repairability of the insulating communication element 36, the insulating transformer 34, and the like is improved.

  In the present embodiment, the leaf spring 92 and the leaf spring 93 are provided for the insulating transformer 34, but one of the leaf spring 92 and the leaf spring 93 may be omitted. For example, the leaf spring 92 may be omitted, and the terminal 311A may be directly joined to the low-voltage board 71.

  As described above, the embodiments have been described in detail. However, the present invention is not limited to the specific embodiments, and various modifications and changes can be made within the scope described in the claims. It is also possible to combine all or a plurality of the components of the embodiment described above.

  For example, in the example shown in FIG. 1, a DC-DC converter (another example of the power conversion device) may be provided between the smoothing capacitor C1 and the battery 2. In this case, the present invention may be applied to a board mounting mode of a control system (not shown) related to the DC-DC converter.

<Appendix>
The following is further disclosed with respect to the above embodiment. Note that, among the effects described below, the effects according to each additional mode with respect to one mode are additional effects due to the additional modes.

In one mode, a first substrate (71) on which a first electronic component (91A) operating at a first voltage is mounted;
A second electronic component (91B) that operates at a second voltage higher than the first voltage is mounted on a first side (Z2) in a first direction (Z) perpendicular to the surface of the first substrate (71). A second substrate (72) to be
One end is electrically connected to the first substrate (71) and the other end is the second substrate between the first substrate (71) and the second substrate (72) in the first direction (Z). An insulation element (31, 32, 33, 34, 36) electrically connected to (72), the insulation element (31, 32, 33, 34, 36) being operable as an element of a power conversion circuit; It is a power converter (4) containing.

  According to the present embodiment, different first substrates (71) and second substrates (72) are used for electronic components operating at different voltages, so that the size of the substrates can be reduced as compared with the case where a single substrate is used. Can be achieved. In addition, since the insulating elements (31, 32, 33, 34, 36) are provided between the first substrate (71) and the second substrate (72), the mounting area of the first electronic component (91A) and the (2) There is no need to set an insulating region for electrically insulating the mounting region of the electronic component (91B) between the first substrate (71) and the second substrate (72), and the first substrate (71) and the The size of the two substrates (72) can be reduced.

  In the present embodiment, the first substrate (71) and the second substrate (72) may not have an insulating region for electrically insulating each other.

  In this case, it is possible to reduce the size of the first substrate (71) and the second substrate (72) by an amount not having the insulating region.

  Further, in the present embodiment, in the insulating element (31, 32, 33, 34, 36), at least one of the one end and the other end has the first substrate (71) and the second substrate (72). ) May pass through the through holes (710, 711, 720, 721) of the corresponding substrate in the first direction (Z).

  In this case, electrical connection can be realized by penetrating the substrate with the end of the insulating element (31, 32, 33, 34, 36) as a terminal.

  Further, in the present embodiment, the insulating element (31, 32, 33, 34, 36) has a configuration in which the first voltage side part and the second voltage side part can be separated, and the first substrate (71) and at least one of the second substrate (72) may be supported via conductive elastic members (92 to 95).

  In this case, the insulating elements (31, 32, 33, 34, 36) can be separated from the first voltage side part and the second voltage side part, so that the repairability is improved. In addition, by aligning the first voltage side portion and the second voltage side portion in the first direction (Z), the insulating elements (31, 32, 33, 34, 36) can be assembled, and the assembling property can be improved. Is improved.

  In this embodiment, the insulating elements (31, 32, 33, 34, 36) may include a transformer (31, 34) or a signal transmitting element (32, 33, 36). .

  In this case, it is possible to reduce the size of the first substrate (71) and the second substrate (72) by using the transformer (31, 34) or the element (32, 33, 36) for transmitting a signal. .

DESCRIPTION OF SYMBOLS 1 Electric circuit 2 Battery 4 Inverter 5 Motor 7 Control system 10 Power module 10c Temperature sensor 10d Overcurrent detector 20 High voltage system circuit part 20a Driver 20b Diagnostic circuit 30, 30A Insulation connection part 31 Insulation transformer 32 Insulation communication element 33 Insulation communication Element 34 Insulating transformer 36 Insulated communication element 40 Power control circuit 42 Motor control circuit 71 Low voltage system board 72 High voltage system board 90 Solder 91A Electronic component (low voltage side)
91B Electronic components (high voltage side)
92 to 95 Leaf spring 341 Core 342 Core 343 Bobbin 344 Bobbin 361 Chip 362 Chip 363 Insulating film 364 Insulating film 365 Molded portion 365a Uneven shape 366 Molded portion 366a Uneven shape 370 Uneven shape 371 Uneven shape 710 Through hole 711 Through hole 720 Through hole 721 Through hole

Claims (5)

A first substrate on which a first electronic component operating at a first voltage is mounted;
A second substrate on which a second electronic component operating at a second voltage higher than the first voltage is mounted on a first side in a first direction perpendicular to a surface of the first substrate;
An insulating element having one end electrically connected to the first substrate and the other end electrically connected to the second substrate between the first substrate and the second substrate in the first direction; And an insulating element operable as an element of the power conversion circuit.   The power converter according to claim 1, wherein the first substrate and the second substrate do not have an insulating region for electrically insulating each other.   3. The insulating element according to claim 1, wherein at least one of the one end and the other end passes through a through hole in the first direction of a corresponding substrate of the first substrate and the second substrate. 4. 3. The power converter according to claim 1.   The insulating element has a configuration in which the first voltage side portion and the second voltage side portion are separable, and at least one of the first substrate and the second substrate is provided with a conductive elastic member interposed therebetween. The power converter according to claim 1, which is supported.   The power converter according to any one of claims 1 to 4, wherein the insulating element includes a transformer or an element that transmits a signal.