JP2020001280A - Electronic board - Google Patents

Abstract

To provide an electronic board capable of being reduced in a cost with a simple configuration.SOLUTION: An electronic board 10 includes: a writing board 10a; a pen receiving part 19 arranged below the writing board 10a to mount a pen thereon in using the electronic board 10; a power source button 191 for turning ON or OFF a power source of the electronic board 10; and a connection terminal 193 for electrically connecting a storage medium for storing a data file generated on the electronic board 10. The power source button 191 and the connection terminal 193 are disposed at a side face part 19a of the pen receiving part 19.SELECTED DRAWING: Figure 24

Description

  The present invention relates to an electronic board capable of leaving handwriting such as characters with a writing instrument.

  BACKGROUND ART Conventionally, an electronic board (display-type electronic board) using a display with a touch panel has been proposed. In a display-type electronic board, an image corresponding to document data, image data, or the like is displayed on a display screen, and writing information handwritten on the display screen with an electronic pen or the like is displayed as an image on the display screen. In a display-type electronic board, an image on a display screen to which writing information is added can be saved or printed (for example, see Patent Literature 1).

JP 2004-188736 A

  However, a conventional electronic board uses a display that displays an image based on image data, writing information, and the like, so that the configuration of the electronic board becomes complicated and costs increase.

  An object of the present invention is to provide an electronic board capable of reducing cost with a simple configuration.

  An electronic board according to one embodiment of the present invention is an electronic board capable of detecting a contact position on a writing board at which a pen tip of a pen, which is a writing instrument, is in contact, wherein the pen tip of the pen is in contact with the pen. Then, the writing board on which the visible handwriting remains, a pen receiving portion arranged below the writing board, for placing the pen when using the electronic board, and an operating portion for operating the electronic board And the operating unit is provided in the pen receiving unit.

  ADVANTAGE OF THE INVENTION According to this invention, the electronic board which can aim at cost reduction with a simple structure can be provided.

FIG. 1 is an explanatory diagram illustrating a configuration example of a handwriting input system according to an embodiment of the present invention. FIG. 2 is an explanatory diagram showing an example of a mode in which the handwriting input system according to the embodiment of the present invention is used. FIG. 3 is an explanatory diagram showing the arrangement of the X parallel electrode lines and the Y parallel electrode lines in the electronic board according to the embodiment of the present invention. FIG. 4 is an explanatory diagram showing the function of the loop switching circuit in the electronic board according to the embodiment of the present invention. FIG. 5 is an explanatory diagram schematically showing a configuration in a vertical cross section of the electronic board according to the embodiment of the present invention. FIG. 6 is an explanatory diagram illustrating an example of a definition that associates a resonance frequency with a pen attribute in the writing input system according to the embodiment of the present invention. FIG. 7 is a rear view of the electronic board according to the embodiment of the present invention as viewed from the rear side. FIG. 8 is a diagram showing a part (right end) of the AA cross section of FIG. FIG. 9 is a diagram showing a part (upper end, lower end) of the BB section in FIG. 7. FIG. 10 is a view showing a part (lower end) of the BB section of FIG. 7. FIG. 11 is a diagram showing a part (upper end) of the BB section in FIG. 7. FIG. 12 is a perspective view showing a part (upper end) of the AA cross section in FIG. FIG. 13 is a perspective view showing a part (upper end) of a cross section taken along the line CC of FIG. FIG. 14 is a perspective view of the electronic board according to the embodiment of the present invention as viewed from the rear side. FIG. 15 is an exploded perspective view of the electronic board according to the embodiment of the present invention as viewed from the rear side. FIG. 16 is an exploded perspective view showing a method of fixing the electronic board at the upper corner of the electronic board according to the embodiment of the present invention. FIG. 17 is a perspective view showing a configuration of a corner reinforcing plate of the electronic board according to the embodiment of the present invention. FIG. 18 is a perspective view illustrating a configuration of a board installation board of the electronic board according to the embodiment of the present invention. FIG. 19A is a perspective view showing a state in which a corner reinforcing plate and a board mounting plate are fixed with screws at the upper right corner of the electronic board according to the embodiment of the present invention. FIG. 19B is a perspective view showing a state in which a corner reinforcing plate and a board mounting plate are fixed with screws at the upper left corner of the electronic board according to the embodiment of the present invention. FIG. 19C is a perspective view showing a state in which a corner reinforcing plate and a board mounting plate are fixed with screws at the lower right corner of the electronic board according to the embodiment of the present invention. FIG. 19D is a perspective view illustrating a state in which a corner reinforcing plate and a board mounting plate are fixed with screws at a lower left corner of the electronic board according to the embodiment of the present invention. FIG. 20 is a perspective view showing a state in which a corner reinforcing plate and a board mounting plate are fixed with screws at a lower corner portion of the electronic board according to the embodiment of the present invention. FIG. 21A is a perspective view showing a state where the chassis fixing plate and the rear cover pressing plate are fixed with screws at the upper center part of the electronic board according to the embodiment of the present invention. FIG. 21B is a perspective view showing a state where the chassis fixing plate and the rear cover pressing plate are fixed with screws at the lower center part of the electronic board according to the embodiment of the present invention. FIG. 22 is a perspective view of the electronic board according to the embodiment of the present invention as viewed from the rear side. FIG. 23 is a perspective view showing a state in which the electronic board according to the embodiment of the present invention is mounted on a frame of a stand. FIG. 24 is a perspective view showing a configuration of a pen receiving portion including a power supply and connection terminals of the electronic board according to the embodiment of the present invention. FIG. 25 is a cross-sectional perspective view showing an internal configuration of a pen receiving portion including a power supply and connection terminals of the electronic board according to the embodiment of the present invention. FIG. 26 is a perspective view of a portion including a power supply and connection terminals of the electronic board according to the embodiment of the present invention, as viewed from the back side. FIG. 27A is a circuit diagram of a general series resistor, and FIG. 27B is a circuit diagram of a touch sensor circuit. FIG. 28 is a diagram illustrating a configuration of a sensor substrate of the electronic board according to the embodiment of the present invention. FIG. 29 is a diagram illustrating a configuration of a sensor substrate of the electronic board according to the embodiment of the present invention.

  Hereinafter, the present invention will be described in more detail with reference to the drawings. It should be noted that the following description is an example in all points and should not be construed as limiting the present invention.

  FIG. 1 is an explanatory diagram illustrating a configuration example of a handwriting input system 100 according to an embodiment of the present invention. FIG. 2 is an explanatory diagram showing an example of a mode in which the handwriting input system 100 shown in FIG. 1 is used. FIG. 3 is an explanatory diagram showing the configuration of the electronic board according to the embodiment of the present invention, particularly the arrangement of the X parallel electrode lines and the Y parallel electrode lines. FIG. 4 is an explanatory diagram showing functions of a loop switching circuit in the electronic board shown in FIG. FIG. 5 is an explanatory diagram schematically showing an outline of a configuration in a vertical cross section of the electronic board shown in FIG. 1.

  The writing input system 100 shown in FIG. 1 is roughly composed of a pen 30 and an electronic board 10. The pen 30 is a writing implement having a pen body 31, a cap 32, a pen tip 33, an identifier 34, and an ink supply unit 36. In FIG. 1, the pen 30 is schematically shown in a form in which the shape can be grasped. The identifier 34 has an identification circuit not shown in FIG. The specific configuration of the identifier 34 will be described later.

  The cap 32 is detachable from the pen body 31 and covers the pen tip 33 so as not to be exposed when mounted on the pen body 31.

  The pen point 33 is made of, for example, a felt material impregnated with ink. The pen tip 33 can be configured to be generally known as a marker pen for a whiteboard (white board). The pen tip 33 is exposed by removing the cap 32, and when its tip touches the writing board 10 a, which is a writing area of the electronic board 10, ink adheres to that position and the handwriting 40 visible on the electronic board 10. (See FIG. 2).

  The other end of the pen tip portion 33 is in contact with the ink supply portion 36 in which ink is stored, and the ink is supplied from the ink supply portion 36 to the pen tip portion 33 by a capillary phenomenon.

  An identifier 34 is mounted on the outer periphery of the pen body 31 near the place where the cap 32 fits. The identifier 34 has an identification circuit not shown in FIG. The identification circuit is configured by, for example, an LC resonance circuit including an inductance component L and a capacitor component C.

  The writing board 10a is made of a material that is written with the pen 30 and leaves handwriting. The writing board 10a is preferably made of a material capable of erasing the handwriting. The writing board 10a may be disposable as long as it can be constructed at low cost, but is preferably made of a material that can erase handwriting and can be written many times. For example, the writing board 10a is made of a resin material. When the pen 30 is a marker pen, the writing board 10a has a surface like a marker board.

  As shown in FIG. 5, the electronic board 10 is surrounded by a bezel 110 serving as a frame member to ensure strength. The front side of the electronic board 10 surrounded by the bezel 110 is the writing board 10a in the writing area. At the lower end of the electronic board 10, a pen receiver 19 (pen tray) is arranged. In addition, as described later, the pen receiving portion 19 may be formed integrally with a part of the bezel 110 (a lower bezel 110a described later).

  As shown in FIG. 1, the electronic board 10 has a coordinate detection unit 11 and a pen identification unit 12 when roughly classified into functions.

  The coordinate detecting section 11 (an example of a position detecting section of the present invention) detects the coordinates of the position at which the pen tip 33 of the pen 30 contacts the electronic board 10 (the writing board 10a). The pen identification unit 12 detects an identification signal from the identifier 34 attached to the pen 30.

  As a configuration example that realizes these functions, the coordinate detection unit 11 of the present embodiment operates as a capacitance-type touch panel. In addition, the pen identification unit 12 operates as an electromagnetic induction circuit and detects an identification signal from the identifier 34.

  The coordinate detection unit 11 includes a Y parallel electrode line 13y, a Y detection circuit 15y, an X parallel electrode line 13x, an X detection drive circuit 14x, and a loop switching circuit 16. The coordinate detection unit 11 shares hardware with the pen identification unit 12 for the X parallel electrode lines 13x and the X detection drive circuit 14x. The loop switching circuit 16 is a circuit for performing switching between the case where the shared hardware is used for the coordinate detecting unit 11 and the case where the shared hardware is used for the pen identifying unit 12.

  The pen identification unit 12 includes an X parallel electrode line 13x, an X detection drive circuit 14x, a loop switching circuit 16, and an X detection circuit 15x, which are shared with the coordinate detection unit 11.

  The X parallel electrode wires 13x (an example of a first electrode wire of the present invention) are a plurality of electrode wires buried near the surface of the electronic board 10 (writing board 10a) written by the pen 30. Each X parallel electrode line 13x is arranged side by side in the X direction (lateral direction) (an example of the second direction of the present invention) and extends in the Y direction (vertical direction) (an example of the first direction of the present invention). (See FIG. 3).

  On the other hand, the Y parallel electrode wires 13y (an example of the second electrode wire of the present invention) are a plurality of electrode wires buried near the surface of the electronic board 10 (writing board 10a) written by the pen 30. Each Y parallel electrode line 13y is arranged in the Y direction (vertical direction) and extends in the X direction (horizontal direction) (see FIG. 3). Each electrode line of the Y parallel electrode lines 13y is embedded at a different depth (layer) from each electrode line of the X parallel electrode lines 13x. Further, each electrode line of the Y parallel electrode line 13y and each electrode line of the X parallel electrode line 13x intersect via an insulating film having a predetermined thickness, and do not contact each other (see FIG. 5). ). The X parallel electrode lines 13x and the Y parallel electrode lines 13y are made of, for example, copper wiring.

  Since the X parallel electrode lines 13x and the Y parallel electrode lines 13y are arranged near the surface of the writing board 10a, the writing board 10a is made of aluminum which electrically shields the X parallel electrode lines 13x and the Y parallel electrode lines 13y. Plates, magnetically shielded steel plates and the like are not suitable. For example, a resin material such as an epoxy resin or a polycarbonate resin whose surface is coated with a melamine resin is suitable.

  As shown in FIG. 3, the X detection drive circuit 14x is connected to one end of the X parallel electrode lines 13x, and applies a predetermined voltage to each X parallel electrode line 13x. The predetermined voltage may be different between when functioning as the coordinate detecting unit 11 and when functioning as the pen identifying unit 12. The X detection drive circuit 14x sequentially applies, for example, an impulse-like voltage from the leftmost X parallel electrode line 13x to the rightmost X parallel electrode line 13x.

  The Y detection circuit 15y detects the magnitude of the voltage or current induced in each Y parallel electrode line 13y as the X detection drive circuit 14x is driven. The size depends on the magnitude of the coupling capacitance between each of the X parallel electrode lines 13x and each of the Y parallel electrode lines 13y, and the dielectric and the metal are in contact with the electronic board 10 near the intersection of the two. The magnitude of the coupling capacitance differs between the case and the case where the dielectric and the metal are not in contact. For example, since the pen tip 33 and the finger of the person impregnated with the ink are made of a dielectric material, when they come into contact with the electronic board 10, the coupling capacity becomes large. By detecting the change in the coupling capacitance, it is possible to detect the position coordinates where the pen tip 33 or the finger of the person touches the electronic board 10. This is known as the operation of a capacitive touch panel.

  In general, since the magnitude of the coupling capacitance is different between the finger of the person and the pen tip portion 33, not only the position coordinates in contact with the electronic board 10 are detected, but also the magnitude of the coupling is determined based on the difference in the coupling capacitance. May be determined as the finger or the pen tip 33.

  As shown in FIG. 4, the loop switching circuit 16 switches whether or not to connect two X parallel electrode lines 13x separated by a predetermined distance from the plurality of X parallel electrode lines 13x at the other end. Includes a changeover switch 16a. When the pair of X parallel electrode lines 13x is connected at the other end by the first changeover switch 16a, a U-shaped current path is thereby formed. This functions as an induction coil of the pen identification unit 12. A second changeover switch 16b is arranged on one end side of the U-shaped current path.

  The second changeover switch 16b operates in synchronization with the first changeover switch 16a. While the first switch 16a disconnects the pair of X parallel electrode lines 13x, the second switch 16b connects the X parallel electrode line 13x to the X detection drive circuit 14x. While the first switch 16a connects the pair of X parallel electrode lines 13x, the second switch 16b connects the X parallel electrode line 13x to the X detection circuit 15x. Therefore, when the pair of X parallel electrode lines 13x are disconnected, each X parallel electrode line 13x is driven by the corresponding X detection drive circuit 14x.

  On the other hand, in a state where the pair of X parallel electrode lines 13x are connected to form a U-shaped current path as an induction coil, the second changeover switch 16b connects the X parallel electrode line 13x at one end of the U-shaped current path to X. Connect to detection circuit 15x. The other end of the U-shaped current path has no changeover switch, and the other end is driven by the X detection drive circuit 14x.

  In the present embodiment, there are a plurality of U-shaped current paths forming an induction coil, which are arranged in the X direction (lateral direction).

  When the loop switching circuit 16 uses the X parallel electrode lines 13x as the pen identification unit 12, for example, the loop switching circuit 16 sequentially drives the leftmost induction coil one by one to the rightmost induction coil. In FIG. 4, to indicate that only the leftmost induction coil is being driven, the leftmost induction coil 13c is indicated by a line thicker than the other induction coils. The other end of the induction coil 13c, which is a U-shaped current path, is driven by the X detection drive circuit 14x while changing the drive frequency. Then, the magnitude of the current flowing through the induction coil corresponding to the frequency is detected by the X detection circuit 15x at one end of the induction coil 13c. Subsequently, the same detection is performed for the induction coil on the right, and the detection is performed by sequentially moving to the induction coil on the right.

  The loop switching circuit 16 is a component necessary for the coordinate detecting unit 11 and the pen identifying unit 12 to share the X parallel electrode lines 13x.

  When the identifier 34 exists in the vicinity of the driven induction coil and the induction coil is driven at a drive frequency corresponding to the resonance frequency of the identifier, a large resonance current is generated in the resonance circuit by electromagnetic coupling with the induction coil. Flows. Correspondingly, a large current also flows on the side of the induction coil. By detecting the magnitude of the current with the X detection circuit 15x, it is possible to detect in which area in the X direction the resonance frequency identifier 34 exists.

  In the present embodiment, the resonance frequency of the identifier 34 is predetermined in accordance with the attribute of the pen 30.

  FIG. 6 is an explanatory diagram illustrating an example of a definition that associates the resonance frequency f0 with the attribute of the pen 30 in the present embodiment. The list (a) shown in FIG. 6 shows an example in which the ink color (writing color) of the pen is associated with the resonance frequency f0 of the identifier 34. Different resonance frequencies f0 are defined for the pens of black, blue, green, yellow, orange, and red, respectively. According to the writing color of the pen, the user wears the identifier 34 corresponding to the resonance frequency f0.

  The list shown in FIG. 6B illustrates an example in which not only the writing color of the pen 30 but also attributes such as the thickness of the pen tip and the shape of the pen tip are defined in correspondence with the resonance frequency f0 according to the combination thereof. Is shown. By assigning a resonance frequency f0 that uniquely corresponds to a combination of attributes of a plurality of items as in the list (b), it is possible to obtain attributes of a plurality of items corresponding to the detected resonance frequency f0. The resonance frequency f0 is not limited to the value shown in FIG. 6, but is selected based on the balance between the size of the resonance coil 341 of the identifier 34 and the oscillation energy (strength). For example, the resonance frequency f0 may be defined in a range from 400 to 700 kHz.

  When the coordinate detection unit 11 detects the position coordinates of the pen tip unit 33 in the area where the pen identification unit 12 has detected the presence of the identifier 34, handwriting data is generated according to the position coordinates and the attribute of the pen corresponding to the identification information. be able to.

  The handwriting data may be generated, for example, by causing a personal computer to execute a dedicated processing program and detecting the contents of the coordinate detection unit and the pen identification unit. Alternatively, a microcomputer may be incorporated in the electronic board 10 to cause the microcomputer to execute not only the process of the coordinate detecting unit 11 or the pen identifying unit 12 but also the process of generating handwriting data.

  In FIG. 1, a control unit 20 shows an entity that processes generation of handwriting data. The control unit 20 includes a CPU, a microcomputer, and peripheral circuits such as a timer and an input / output circuit, a memory, and the like.

  The control unit 20 may be separate from the electronic board 10, or may be integrated with the electronic board 10, that is, may be incorporated in the electronic board 10. In other words, the processing may be performed outside the handwriting input system 100 in the present embodiment, or may be included in the handwriting input system 100. In the former case, the handwriting input system 100 detects and provides information serving as a basis for generating handwriting data. In the latter case, the handwriting input system 100 additionally includes generation of handwriting data.

  When the handwriting input system 100 according to the embodiment of the present invention includes generation of handwriting data, for example, as shown in FIG. 2, the display unit 21 is connected to the control unit 20 to display the generated handwriting data in real time. You can also. Of course, even if there is no display on the display device 21, the handwriting 40 written with the pen 30 remains on the writing board 10a of the electronic board 10.

  The display device 21 is effective for confirming that the handwriting data generated by the control unit 20 matches the handwriting 40 of the writing board 10a.

  The attributes of the pen 30 are reflected in the handwriting data. For example, according to the definition of FIG. 6A, the writing color of the handwriting data displayed on the display device 21 matches the writing color of the handwriting 40. Further, according to the definition of FIG. 6B, the displayed handwriting data further reflects the thickness and shape of the pen tip 33 in the handwriting thickness and shape. When a hard copy of the handwriting data is printed using a color printer (not shown), a handwriting color or the one reflecting the thickness and shape of the pen tip can be obtained.

[Configuration of electronic board]
Subsequently, a specific configuration of the electronic board 10 according to the embodiment of the present invention will be described. The electronic board 10 is used, for example, installed on a stand 50 as shown in FIG. 2 or installed on a wall surface. Further, the electronic board 10 may be detachably installed, for example, by being hooked on the frame 51 of the stand 50.

  FIG. 7 is a rear view of the electronic board 10 according to the present embodiment as viewed from the rear side. FIG. 8 is a diagram showing a part (right end) of the AA cross section of FIG. 9 is a view showing a part (upper end, lower end) of the BB section in FIG. 7, and FIG. 10 is a view showing a part (lower end) of the BB section in FIG. 11 is a view showing a part (upper end) of the BB section in FIG. 7, and FIG. 12 is a perspective view showing a part (upper part) of the AA section in FIG. FIG. 13 is a perspective view showing a part (upper part) of a CC section of FIG.

  The electronic board 10 includes a writing board 10a made of a resin material in which the handwriting 40 written by the pen 30 remains, a sensor sheet 150 arranged on the back side of the writing board 10a, and a sensor board 150 arranged on the back side of the sensor sheet 150. The vehicle includes a chassis 120 to which the sheet 150 is attached, a rear cover 130 disposed on the rear side of the chassis 120 and covering the rear surface of the electronic board 10, and a bezel 110 surrounding the electronic board 10 and forming an outer frame.

  The writing board 10a, the sensor sheet 150, and the chassis 120 are adhered to each other with a double-sided tape, an adhesive, or the like (an example of the adhesive material of the present invention) to be integrally formed. The integrated writing board 10a, sensor sheet 150, and chassis 120 constitute a sensor unit 10b (FIG. 8 and the like). Note that the writing board 10a, the sensor sheet 150, and the chassis 120 may be fixed to each other and integrally formed. For example, the surrounding side surfaces may be integrally formed by an adhesive or the like, or a separate member ( Screws, frames, etc.).

  As shown in FIG. 14 described later, the bezel 110 is formed in a frame shape by connecting a lower bezel 110a, an upper bezel 110b, a right bezel 110c, and a left bezel 110d to each other. The lower bezel 110a or the upper bezel 110b is an example of a first bezel of the present invention, and the right bezel 110c or the left bezel 110d is an example of a second bezel of the present invention. The sensor unit 10b is arranged in the frame of the bezel 110, and a metal fitting (a corner reinforcing plate 210a and a chassis fixing plate 210b, which will be described later) that supports the sensor unit 10b from the back side is attached to the back surface of the sensor unit 10b. The rear cover 130 is attached.

  As shown in FIG. 9, the lower bezel 110a is integrally formed with a pen receiving portion 19 and spaces 110s and 19s for storing various wirings and the like.

  The sensor sheet 150 includes a transparent film on which the X parallel electrode lines 13x are arranged, a transparent film on which the Y parallel electrode lines 13y are arranged, and an insulating film disposed between these electrode lines. It is configured to be adhered and fixed to each other by the like. The sensor sheet 150 has a film shape as a whole and has flexibility. A sensor substrate 150a (an example of a first sensor substrate of the present invention) is connected to a lower end of the sensor sheet 150, and a sensor substrate 150b is connected to an upper end of the sensor sheet 150. The sensor board 150c (an example of the second sensor board of the present invention) is connected to the left end). One end (lower end) of the X parallel electrode line 13x is connected to the sensor substrate 150a, the other end (upper end) of the X parallel electrode line 13x is connected to the sensor substrate 150b, and Y parallel is connected to the sensor substrate 150c. One end (right end) of the electrode line 13y is connected.

  Sensor wires (sensor wires 152x, 152y in FIGS. 28 and 29) are arranged on the sensor substrate 150a, and one end of the sensor wire and one end of the X parallel electrode line 13x are electrically connected. The other end of the sensor wiring is electrically connected to a connector connection portion (connector connection portion 156 in FIGS. 28 and 29) mounted on sensor substrate 150a. A relay wiring (not shown) is connected to the connector connection portion, and the relay wiring is electrically connected to the X detection drive circuit 14x and the X detection circuit 15x.

  The sensor wiring is arranged on the sensor substrate 150b, and one end of the sensor wiring and the other end of the X parallel electrode line 13x are electrically connected. The other end of the sensor wiring is electrically connected to a connector connecting portion mounted on the sensor board 150b. A relay wiring is connected to the connector connection portion, and the relay wiring is electrically connected to the above-described loop switching circuit 16.

  The sensor wiring is arranged on the sensor substrate 150c, and one end of the sensor wiring is electrically connected to the Y parallel electrode line 13y. The other end of the sensor wiring is electrically connected to a connector connecting portion mounted on the sensor substrate. A relay wire is connected to the connector connection portion, and the relay wire is electrically connected to the above-described Y detection circuit 15y. Each of the relay wirings is arranged on the rear side of the chassis 120 and connected to the controller board 172 (see FIG. 14). The specific configuration of the sensor boards 150a, 150b, 150c will be described later.

  Note that the sensor substrate 150a may be connected to the right end of the sensor sheet 150, the sensor substrate 150b may be connected to the left end of the sensor sheet 150, and the sensor substrate 150c may be connected to the upper end (or lower end) of the sensor sheet 150.

  FIG. 14 is a perspective view of the electronic board 10 as viewed from the rear side. In FIG. 14, the back cover 130 is omitted. On the rear surface of the chassis 120, a reinforcing plate 111 is arranged vertically. The reinforcing plate 111 has a lower end screwed to the lower bezel 110 a, an upper end screwed to the upper bezel 110 b, and a central portion in contact with the rear surface of the chassis 120. A board tray 170 is disposed between the reinforcing plate 111 and the right bezel 110c, and an interface connection plate 171, a controller board 172, and an interface board 173 are mounted on the board tray 170. On the controller board 172, the control unit 20, the X detection drive circuit 14x, the X detection circuit 15x, the loop switching circuit 16, the Y detection circuit 15y, and the like are mounted. For example, a cable (wiring) connected to an external device such as a personal computer (PC) or a projector is connected to the interface board 173. In the writing input system 100, for example, an image output from a projector is projected on the writing board 10a, and when the user writes information such as handwritten characters on the writing board 10a while referring to the projected image, the information ( Handwriting data) can be added and overwritten and saved. The data file and the like generated in the electronic board 10 can be stored in a storage medium such as USB (registered trademark).

  The rear surface of the chassis 120 is supported by a corner reinforcing plate 210a disposed at a corner (four corners) and a chassis fixing plate 210b disposed at a portion other than the corner. The corner reinforcing plate 210a and the chassis fixing plate 210b are examples of the support member of the present invention. FIG. 14 shows four corner reinforcing plates 210a and five chassis fixing plates 210b. The number of the chassis fixing plates 210b is not limited. The corner reinforcing plate 210a is screw-fixed to two (two sides) bezels 110 adjacent to each other at the corner, and the chassis fixing plate 210b is screw-fixed to one (one side) bezel 110.

  FIG. 15 is an exploded perspective view of the electronic board 10 as viewed from the rear side. The lower bezel 110a, the upper bezel 110b, the right bezel 110c, and the left bezel 110d are connected to each other by corner connecting plates 110e (L-shaped fittings) arranged at corners (four corners), thereby forming a frame-shaped bezel. 110 is formed. The frame-shaped bezel 110 may be integrally formed of a metal material, a resin material, or the like.

  A board mounting plate 220a (an example of a mounting member of the present invention) is screw-fixed to the back surface of the corner reinforcing plate 210a, and a back cover pressing plate 220b is screw-fixed to the back surface of the chassis fixing plate 210b. An opening 130a is formed in the rear cover 130 at a portion overlapping the corner reinforcing plate 210a and a portion overlapping the chassis fixing plate 210b. The board mounting plate 220a is inserted into the opening 130a from the rear side of the rear cover 130, and is fixed to the corner reinforcing plate 210a with screws. The rear cover pressing plate 220b is inserted into the opening 130a from the rear side of the rear cover 130, and is fixed to the chassis fixing plate 210b with screws. The rear cover 130 is fixed (sandwiched) between the corner reinforcing plate 210a and the board mounting plate 220a and between the chassis fixing plate 210b and the rear cover pressing plate 220b.

  FIG. 16 is an exploded perspective view showing a method of fixing the electronic board 10 at a corner. The upper bezel 110b and the right bezel 110c are connected to each other by screws or the like by a corner connecting plate 110e. The writing board 10a, the sensor sheet 150, and the chassis 120 are arranged in this order, and are attached to each other via an adhesive material (for example, a double-sided tape) to be integrally formed. The integrated sensor unit 10b is inserted inside a bezel 110 formed in a frame shape.

  As shown in FIG. 16, the corner reinforcing plate 210a is screw-fixed to the upper bezel 110b and the right bezel 110c while pressing the rear surface of the chassis 120 of the sensor unit 10b. FIG. 17 is a perspective view showing the configuration of the corner reinforcing plate 210a. As shown in FIG. 17, the corner reinforcing plate 210a includes an upper surface portion 201a, a first side surface portion 201b (an example of a first side surface portion of the present invention), and a second side surface portion 201c (an example of a second side surface portion of the present invention). , A third side surface portion 201d, and a chassis pressing portion 201e (corresponding to the chassis pressing portion of the present invention). The upper surface portion 201a is a portion parallel to the rear surface of the chassis 120, and has four screw holes for fixing the board mounting plate 220a with screws. The first side surface portion 201b extends from the end of the upper surface portion 201a to the rear side of the chassis 120, and has two screw holes for screw fixing with the upper bezel 110b (see FIG. 16). The second side surface portion 201c extends from the end of the upper surface portion 201a to the rear side of the chassis 120, and has two screw holes for screw fixing with the right bezel 110c (see FIG. 16). The third side surface portion 201d extends from the end of the upper surface portion 201a to the rear side of the chassis 120, and the chassis holding portion 201e extends from the end of the third side surface portion 201d in a direction parallel to the rear surface of the chassis 120. I do. A space S2 is formed in a portion surrounded by the upper surface portion 201a, the first side surface portion 201b, the second side surface portion 201c, and the third side surface portion 201d. When the first side surface portion 201b and the second side surface portion 201c of the corner reinforcing plate 210a are fixed to the upper bezel 110b and the right side bezel 110c by screws, the chassis holding portion 201e contacts the rear surface of the chassis 120 and moves the sensor unit 10b to the rear surface. Support from the side. A gap corresponding to the space S2 is formed between the upper surface portion 201a of the corner reinforcing plate 210a and the chassis 120 (see FIG. 11).

  As shown in FIG. 16, the board mounting plate 220a is inserted into the opening 130a from the back side of the back cover 130 and fixed to the corner reinforcing plate 210a with screws. FIG. 18 is a perspective view showing the configuration of the board installation plate 220a. As shown in FIG. 18, the board mounting plate 220a includes a lower surface 202a, a first rear cover pressing portion 202b, a second rear cover pressing portion 202c, a third rear cover pressing portion 202d, a hook portion 202e, and a fastening portion. 202f. The lower surface portion 202a is a portion parallel to the rear surface of the chassis 120, and has two screw holes for screw fixing with the corner reinforcing plate 210a. The first back cover holding portion 202b, the second back cover holding portion 202c, and the third back cover holding portion 202d extend from each end of the lower surface portion 202a toward the back surface of the electronic board 10 by a height H1 and have a chassis. 120 extends in a direction parallel to the back surface. The first back cover pressing portion 202b, the second back cover pressing portion 202c, and the third back cover pressing portion 202d are examples of the back cover pressing portion of the present invention.

  The hook portion 202e extends from the lower end portion of the lower surface portion 202a toward the back surface of the electronic board 10 by a height H2, and the fastening portion 202f extends from the end portion of the hook portion 202e in a direction parallel to the back surface of the chassis 120 ( Downward). The height H1 is set substantially equal to the thickness of the back cover 130. When the board mounting plate 220a is inserted into the opening 130a of the back cover 130 and the lower surface 202a of the board mounting plate 220a is fixed to the upper surface 201a of the corner reinforcing plate 210a by screws, the first rear cover pressing portion 202b The second rear cover pressing portion 202c and the third rear cover pressing portion 202d are in contact with the rear surface of the rear cover 130 to support the rear cover 130 from the rear side. The hook portion 202e and the fastening portion 202f are hooked on the frame 51 (see FIG. 2). The hook portion 202e may be provided at the upper end portion of the lower surface portion 202a or may be provided at the upper end portion of the first back cover pressing portion 202b. It is preferable to be provided at the lower end of the lower surface 202a.

  FIG. 19A is a perspective view showing a state in which a corner reinforcing plate 210a and a board mounting plate 220a are fixed with screws at the upper right corner of the electronic board 10. In FIG. 19A, the back cover 130 is omitted. The corner reinforcing plate 210a is fixed to the upper bezel 110b and the right bezel 110c with screws, and the chassis pressing portion 201e presses and supports the chassis 120 from the rear side. The board mounting plate 220a has a lower surface portion 202a fixed to the upper surface portion 201a of the corner reinforcing plate 210a with screws, and the first rear cover pressing portion 202b, the second rear cover pressing portion 202c, and the third rear cover pressing portion 202d are The back cover 130 (see FIG. 15) is supported from the back side.

  Here, as shown in FIG. 19B, the board mounting plate 220a may have a configuration in which the second rear cover pressing portion 202c and the third rear cover pressing portion 202d are omitted. FIG. 19B is a perspective view showing a state where the corner reinforcing plate 210a and the board mounting plate 220a are fixed with screws at the upper left corner of the electronic board 10. The board mounting plate 220a has a lower surface portion 202a fixed to the upper surface portion 201a of the corner reinforcing plate 210a with screws, and a first rear cover pressing portion 202b supports the rear cover 130 (see FIG. 15) from the rear side.

  Further, the four corner reinforcing plates 210a attached to each corner (four corners) have a common structure. FIG. 19A shows a corner reinforcing plate 210a arranged at the upper right corner, FIG. 19B shows a corner reinforcing plate 210a arranged at the upper left corner, and FIG. 19D shows a corner reinforcing plate 210a arranged at the lower left corner of FIG. 19D. The corner reinforcing plates 210a arranged at the respective corner portions have a common structure, and are rotated and positioned so as to correspond to the respective corner portions, and fixed by screws.

  FIG. 20 is a perspective view showing a state where the corner reinforcing plate 210a and the board mounting plate 220a are fixed with screws at the lower corner portion of the electronic board 10. Again, the back cover 130 is omitted. The corner reinforcing plate 210a is fixed to the lower bezel 110a and the right bezel 110c with screws, and the chassis pressing portion 201e presses and supports the chassis 120 from the rear side. The board mounting plate 220a has a lower surface portion 202a fixed to the upper surface portion 201a of the corner reinforcing plate 210a with screws, and the first rear cover pressing portion 202b, the second rear cover pressing portion 202c, and the third rear cover pressing portion 202d are The back cover 130 (see FIG. 15) is supported from the back side.

  FIG. 21A is a perspective view showing a state in which the chassis fixing plate 210b and the rear cover pressing plate 220b are fixed with screws at the upper central portion of the electronic board 10. Again, the back cover 130 is omitted. The chassis fixing plate 210b is fixed to the upper bezel 110b with screws, and the pressing portion 203e presses and supports the chassis 120 from the rear side. The rear cover pressing plate 220b has a lower surface portion 204a fixed to the upper surface portion 203a of the chassis fixing plate 210b with screws, and includes a first rear cover pressing portion 204b, a second rear cover pressing portion 204c, a third rear cover pressing portion 204d, and The fourth back cover pressing portion 204e supports the back cover 130 (see FIG. 15) from the back side.

  FIG. 21B is a perspective view showing a state in which the chassis fixing plate 210b and the rear cover pressing plate 220b are fixed with screws at the lower central portion of the electronic board 10. Again, the back cover 130 is omitted. The chassis fixing plate 210b is screw-fixed to the lower bezel 110a, and the pressing portion 203e presses and supports the chassis 120 from the rear side. The rear cover pressing plate 220b has a lower surface portion 204a fixed to the upper surface portion 203a of the chassis fixing plate 210b with screws, and includes a first rear cover pressing portion 204b, a second rear cover pressing portion 204c, a third rear cover pressing portion 204d, and The fourth back cover pressing portion 204e supports the back cover 130 (see FIG. 15) from the back side.

  Note that the rear cover holding plate 220b may be omitted. In this case, as shown in FIG. 22, the back surface of the back cover 130 is supported at the corners (four corners) by the board mounting plate 220a, and is fixed to the chassis fixing plate 210b at the center by screws or the like. When the back cover pressing plate 220b is omitted, the number of components of the electronic board 10 can be reduced. Further, the processing of the opening 130a of the back cover 130 becomes unnecessary. The electronic board 10 is not limited to the configuration shown in FIG. 14, but may have the configuration shown in FIG.

[Sensor board fixing method 1]
A first fixing method of the sensor boards 150a, 150b, 150c will be described. The sensor boards 150a and 150b arranged on the long sides (upper and lower sides) of the electronic board 10 are arranged on the back side of the chassis 120 and the sensor boards arranged on the shorter sides (for example, the right side) of the electronic board 10. 150c is arranged on the side surface of the chassis 120.

  Specifically, as shown in FIG. 9, the sensor substrate 150 a is rotated by 180 degrees at the lower end of the chassis 120 so that the sensor sheet 150 covers the lower end (lower side surface) of the chassis 120, and is placed on the rear surface of the chassis 120. Be placed. A cushioning member 160a is disposed between the sensor substrate 150a disposed on the rear surface of the chassis 120 and the corner reinforcing plate 210a supporting the rear surface of the chassis 120 (space S2 (see FIG. 10)). Specifically, when the corner reinforcing plate 210a is screwed to the lower bezel 110a and the right bezel 110c, a gap formed between the upper surface portion 201a of the corner reinforcing plate 210a and the rear surface of the chassis 120 (FIG. 10). The cushioning material 160a is arranged in the space S2). The cushioning member 160a contacts and presses the upper surface of the sensor substrate 150a. The chassis pressing portion 201e of the corner reinforcing plate 210a presses the chassis 120 from the rear side in a region of the rear surface of the chassis 120 where the sensor substrate 150a is not disposed. As a result, the sensor substrate 150a is supported in a state of being pressed (pressed) to the front side by the cushioning material 160a. The sensor unit 10b is sandwiched between the corner reinforcing plate 210a and the bezel 110.

  As shown in FIG. 9, similarly to the sensor substrate 150 a, the sensor substrate 150 b is rotated 180 degrees at the upper end of the chassis 120 so that the sensor sheet 150 covers the upper end (upper side) of the chassis 120, and Located on the back. As shown in FIG. 12, a cushioning member 160b is provided between the sensor board 150b disposed on the rear surface of the chassis 120 and the corner reinforcing plate 210a supporting the rear surface of the chassis 120 (space S2 (see FIG. 11)). Be placed. Specifically, when the corner reinforcing plate 210a is fixed to the upper bezel 110b and the right bezel 110c with screws, a gap formed between the upper surface portion 201a of the corner reinforcing plate 210a and the rear surface of the chassis 120 (see FIG. 11). The cushioning material 160b is arranged in the space S2). The buffer member 160b contacts and presses the upper surface of the sensor substrate 150b. The chassis pressing portion 201e of the corner reinforcing plate 210a presses the chassis 120 from the rear side in a region of the rear surface of the chassis 120 where the sensor substrate 150b is not disposed. As a result, the sensor substrate 150b is supported (pressed) by the cushioning member 160b toward the front side. The sensor unit 10b is sandwiched between the corner reinforcing plate 210a and the bezel 110. The cushioning members 160a and 160b may be elastic members such as rubber, but are preferably conductive members having conductivity such as gaskets or earth springs. By using a conductive member for the buffer members 160a and 160b, the ground of the sensor substrates 150a and 150b can be strengthened, and it is effective for EMI (Electro Magnetic Interference) measures.

  As shown in FIG. 13, the cushioning member 160 b similarly contacts and presses the upper surface of the sensor substrate 150 b in a portion other than the corner portion (for example, the center portion). The holding portion 203e of the chassis fixing plate 210b presses the chassis 120 from the rear side in a region of the rear surface of the chassis 120 where the sensor substrate 150b is not disposed. As a result, the sensor substrate 150b is supported (pressed) by the cushioning member 160b toward the front side. The sensor unit 10b is sandwiched between the chassis fixing plate 210b and the bezel 110.

  As shown in FIG. 8, the sensor sheet 150 is disposed on the side surface of the chassis 120 after the sensor sheet 150 is bent at the right end of the chassis 120 and rotated 90 degrees at the right end (right side surface) of the chassis 120. A cushioning member 161c is arranged between the sensor board 150c arranged on the side surface of the chassis 120 and the right bezel 110c. Accordingly, the sensor substrate 150c is supported in a state where it is pressed (pressed) to the side surface by the cushioning material 161c. The cushioning member 161c may be an elastic member such as rubber, like the cushioning members 160a and 160b, but is preferably a conductive member having conductivity such as a gasket or an earth spring. By using a conductive member for the buffer member 161c, the ground of the sensor substrate 150c can be strengthened, and it is effective for EMI measures.

  According to the above-described configuration, the sensor boards 150a and 150b are provided on the rear surface of the chassis 120 in the gap (space S2) formed between the chassis 120, the corner reinforcing plate 210a, and the chassis fixing plate 210b. It is supported by 160a and 160b. In addition, the sensor substrate 150c is supported on a side surface of the chassis 120 by a cushioning member 161c disposed in a gap formed between the chassis 120 and the bezel 110. As described above, the sensor boards 150a and 150b arranged on the long side of the electronic board 10 and the sensor board 150c arranged on the short side of the electronic board 10 are located at different positions (the back, Side). The sensor boards 150a, 150b, 150c are not fixed to the chassis 120 and other parts by screws or the like, but are movably supported (held) by the cushioning members 160a, 160b, 161c. For this reason, for example, even when the sensor unit 10b is deformed such as distortion due to an environmental change or the like, the influence on the sensor substrates 150a, 150b, and 150c is unlikely to occur. Problems such as damage due to deformation and erroneous detection can be prevented.

  Here, in the above-described configuration, when the sensor substrates 150a, 150b, and 150c are arranged on the rear surface or the side surface of the chassis 120, the sensor sheet 150 is partially bent. In particular, when arranging the sensor boards 150a and 150b on the rear surface of the chassis 120, the sensor sheet 150 is partially bent by 180 degrees. For this reason, there is a possibility that a portion (bent portion) where the sensor sheet 150 is bent may be damaged. Therefore, the present embodiment further has a structure for preventing the sensor sheet 150 from being damaged.

  Specifically, as shown in FIG. 9, a gap is formed between the lower end (lower side surface) of the chassis 120 and the lower bezel 110a, and the bent portion of the sensor sheet 150 is bent at the gap in the gap. Is formed. Similarly, a gap is formed between the upper end (upper side) of the chassis 120 and the upper bezel 110b, and a bent portion 151b is formed at a bent portion of the sensor sheet 150 in the gap. Thus, since the bent portion of the sensor sheet 150 can be bent, for example, when the sensor unit 10b is deformed, the amount of deformation corresponding to the deformation can be absorbed by the bent portion 151b. Therefore, damage to the sensor sheet 150 can be prevented. In order to prevent the bent portion of the sensor sheet 150 from contacting the lower bezel 110a and the upper bezel 110b, at the lower end and the upper end of the chassis 120, the bent portion of the sensor sheet 150 and the lower bezel 110a and the upper bezel 110b are connected. It is preferable that the cushioning members 161a and 161b (see FIG. 9) are arranged between them.

  Note that the sensor boards 150a and 150b are disposed at the lower end of the chassis 120, and the sensor sheet 150 is bent at the lower end of the chassis 120, rotated 90 degrees and disposed on the side surface of the chassis 120, and the sensor substrate 150c is disposed at the right end ( On the right side), the sensor sheet 150 may be rotated by 180 degrees and placed on the back of the chassis 120 so as to cover the right end (right side) of the chassis 120.

[Sensor board fixing method 2]
A second fixing method of the sensor boards 150a, 150b, 150c will be described with reference to FIGS. The configuration in which the sensor substrates 150a and 150b are arranged on the back surface of the chassis 120 and supported by the cushioning materials 160a and 160b, and the configuration in which the sensor substrate 150c is disposed on the side surface of the chassis 120 and supported by the cushioning material 161c are described above. It is the same as the first fixing method.

  As shown in FIG. 10, the writing board 10a, the sensor sheet 150, and the chassis 120 that constitute the sensor unit 10b are attached and fixed such that the lower end of the chassis 120 is located above the lower end of the writing board 10a. When the sensor unit 10b thus integrated is attached to the lower bezel 110a, the lower end of the writing board 10a is placed and supported on the placement portion 110h of the lower bezel 110a. That is, the sensor unit 10b is supported by the lower end of the writing board 10a being mounted on the mounting portion 110h of the lower bezel 110a. Therefore, the load (self-weight) of the sensor unit 10b is applied to the mounting portion 110h. As a result, a gap S1 is formed between the lower end of the chassis 120 and the lower bezel 110a. A bent portion 151a corresponding to the gap S1 is formed in the bent portion of the sensor sheet 150. The bending portion 151a is bent at a predetermined radius of curvature corresponding to, for example, the gap S1.

  The height of the mounting portion 110h may be higher than a portion of the lower bezel 110a facing the lower end of the chassis 120. In this case, the sensor unit 10b may be bonded and fixed such that the lower end of the chassis 120 and the lower end of the writing board 10a are at the same height (the same plane). Also in this configuration, the gap S1 can be formed between the lower end of the chassis 120 and the lower bezel 110a.

  Also, as shown in FIG. 11, a gap (space S3) is formed between the upper end of the chassis 120 and the upper bezel 110b. In the bent portion of the sensor sheet 150, a bent portion 151b bent at a predetermined radius of curvature according to the space S3 is formed. The sizes of the spaces S1 and S3 are set to optimal values by appropriately adjusting the length of the chassis 120 in the vertical direction.

  According to the fixing method 2, the curve of the bent portion of the sensor sheet 150 can be made gentle (the radius of curvature can be increased). Therefore, damage to the sensor sheet 150 can be reliably prevented.

[Chassis configuration]
The sensor sheet 150 is formed in a film shape and has flexibility. In addition, the writing board 10a is formed of a resin material having a thickness of about several mm in order to reduce the weight of the entire electronic board 10, and is likely to be bent. The sensor sheet 150 and the writing board 10a are attached to the chassis 120 to suppress the bending of the sensor sheet 150 and the writing board 10a. Since the writing board 10a, the sensor sheet 150, and the chassis 120 are integrally formed, the sensor unit 10b has a structure that is unlikely to be bent.

  The chassis 120 also has a function of preventing the detection accuracy of the position coordinates from being reduced due to the influence of noise. Specifically, the sensor sheet 150 is made of copper wiring having a low wiring resistance, and is easily affected by noise. In particular, when a metal material such as a metal fitting (the corner reinforcing plate 210a and the chassis fixing plate 210b) for fixing the sensor unit 10b is close to the sensor sheet 150, noise from the metal material is easily received. Therefore, it is preferable to set the thickness t1 (see FIG. 11) of the chassis 120 to a thickness that is not easily affected by noise, for example, about 15 mm to 20 mm. Further, in consideration of thinning, it is more preferable to set the thickness t1 to approximately 15 mm.

[Configuration of power supply and connection terminals]
As shown in FIG. 24, the electronic board 10 further notifies a power button 191 for turning on or off the power of the electronic board 10 and a state of the power of the electronic board 10 (ON state or OFF state) to the outside ( A connection terminal for connecting an LED 192 (indicator) (an example of a notification unit of the present invention) to be displayed) and a storage medium for storing a data file generated on the electronic board 10, input information of a human finger or a pen 30, and the like. 193 (interface terminal). The power button 191 and the connection terminal 193 are examples of the operation unit of the present invention. The operation unit of the present invention includes an adjustment unit for adjusting a display state (brightness, brightness, etc.) of the electronic board 10, an input terminal for inputting an external signal, an output terminal for outputting an internal signal, and software installed on the electronic board 10. Function buttons for executing the various functions described above.

  The power of the electronic board 10 is supplied, for example, via a power cable (not shown). The user can turn on the electronic board 10 by pressing the power button 191. When the user presses the power button 191 while the electronic board 10 is on, the electronic board 10 turns off. The LED 192 is turned on, for example, when the electronic board 10 is in an ON state, and is turned off when the electronic board 10 is in an OFF state.

  The storage medium is, for example, a USB memory, an SD memory card, a CD-ROM, a DVD-ROM, or the like. When the storage medium is a USB memory, the connection terminal 193 is configured with a USB terminal. When the storage medium is an SD memory card, the connection terminal 193 is configured with an SD card slot. When the storage medium is a CD-ROM or a DVD-ROM, the connection terminal 193 is constituted by, for example, a USB terminal, and is connected to an external drive of the CD-ROM or the DVD-ROM via a USB cable. Note that the connection terminal 193 in FIG. 24 represents a USB terminal. The connection terminal 193 may be a terminal to which a device (a wireless or wired communication device, a communication cable, or the like) for transmitting the data file, the input information, or the like to an external device is connected.

  The power button 191 and the connection terminal 193 are provided on a side surface portion 19 a of the pen receiving portion 19, and the LED 192 is provided on a front surface portion 19 b of the pen receiving portion 19.

  As shown in FIG. 25, components constituting the power button 191, the LED 192, and the connection terminal 193 are stored in a space 19 s inside the lower bezel 110 a, which is an internal space below (on the back side of) the pen receiver 19. A circuit board 194 on which a circuit for supplying various signals to the power button 191, the LED 192, and the connection terminal 193 is mounted in the space 19 s and a mounting bracket 195 fixed to the housing of the pen receiver 19 with screws. It is attached. Incidentally, the side surface portion 19a of the pen receiving portion 19 is formed by a cap (lid), and the power button 191, the LED 192, the connection terminal 193, the circuit board 194, and the mounting bracket 195 may be attached to the cap. In this case, the cap is fitted and fixed to the side surface of the pen receiving portion 19.

  An opening 19c (see FIGS. 25 and 26) is formed in the lower bezel 110a. As shown in FIG. 26, a cable 196 connected to the circuit board 194 is connected to the lower bezel 110a through the opening 19c. It is introduced into the space 110s. In addition, the cable 196 is introduced to the rear side of the chassis 120 from a notch 19d formed in the partition 110f of the lower bezel 110a, and is connected to the interface board 173 through the rear surface of the chassis 120.

  In a conventional electronic board, a power supply, connection terminals, and the like are provided on the front of the electronic board (for example, next to a writing board). In this conventional configuration, the frame of the electronic board becomes large. On the other hand, in the electronic board 10 according to the present embodiment, the power button 191 and the connection terminal 193 are provided on the side surface 19 a of the pen receiver 19. Therefore, the frame of the electronic board 10 can be narrowed. In addition, when a commercially available pen 30 is used, foreign matter such as debris generated from the pen 30 may accumulate in the pen receiving portion 19. Even in such a case, the power button 191 and the connection terminal 193 are connected to the pen receiving portion 19. The power supply button 191 and the connection terminal 193 can be prevented from being attached to the side surface portion 19a.

  Further, in the electronic board 10 according to the present embodiment, the internal space (space 19s) where the power button 191, the LED 192, and the circuit board 194 of the connection terminal 193 are arranged, the sensor sheet 150, and various circuits for detecting the contact position. A partition 110f (see FIGS. 25 and 26) is disposed between the substrate and the space in which the substrate is disposed. Therefore, it is possible to reduce the influence of noise on the sensor sheet 150 and the various circuit boards from the power button 191, the LED 192, and the connection terminal 193. The power button 191, the LED 192, and the circuit board 194 of the connection terminal 193 may be arranged in the space 19s or 110s (see FIG. 26).

  The power button 191 and the connection terminal 193 may be provided on the front surface 19b of the pen receiver 19 (see FIG. 24), similarly to the LED 192. When the pen receiving portion 19 is made of aluminum and the side surface portion 19a is made of resin and has a structure to be fitted into the pen receiving portion 19, the power button 191 and the power button 191 are used from the viewpoint of ease of assembly and safety. The connection terminal 193 is desirably provided on the side surface 19a.

[Structure of sensor board]
Copper wirings (sensor wirings 152) having low wiring resistance are arranged on the sensor boards 150a, 150b, and 150c, and are easily affected by noise.

  Here, the influence of noise on the sensor wiring 152 will be considered. FIG. 27A is a circuit diagram of a general series resistor. FIG. 27B is a diagram in which the series resistor circuit of FIG. 27A is replaced with a touch sensor circuit. The X detection circuit and the Y detection circuit sequentially transmit and detect the touch detection signal, and are a closed circuit in operation.

  The voltage between both ends of the resistor R2 is calculated based on the resistor division ratio. Considering that the resistance R1 is replaced by the wiring resistance up to the touch sensor of the touch panel circuit, and the resistance R2 is replaced by the resistance component of the touch sensor itself, the sensor wiring (about 1/100 of the resistance value of the conventional metal mesh sensor) It can be seen that the copper wire) has a large voltage contribution of the wiring resistance (the voltage across the resistor R1 is high). Considering that the power supply V0 is replaced with a noise source, it means that the noise has a very large effect on the resistor R1, that is, the wiring resistance (wiring within the substrate) up to the touch sensor. For this reason, noise countermeasures are important for the sensor wiring arranged on the sensor substrate.

  The sensor boards 150a, 150b, 150c according to the embodiment of the present invention have a structure that is not easily affected by noise. Since the sensor substrates 150a, 150b, and 150c have the same configuration, the sensor substrate 150a will be described here as an example.

  FIG. 28 and FIG. 29 are diagrams illustrating the configuration of the sensor substrate 150a. The sensor substrate 150a has a four-layer structure. FIG. 28A shows the first layer. A terminal 155 to which an electrode wire (X parallel electrode wire 13x) is connected and a connector connection portion 156 are formed on the base material 154, and the entire surface of the base material 154 (back surface; corresponding to the first surface of the present invention) ), A shield layer 157x (an example of a first shield layer of the present invention) made of a copper material is formed in a solid shape.

  FIG. 28B shows the second layer. A sensor wiring 152x (an example of a first sensor wiring of the present invention) is pattern-formed on the front surface side (corresponding to the second surface of the present invention) of the base material 154. The sensor wiring 152x is electrically connected to the odd-numbered terminal 155x.

  FIG. 29A shows the third layer. On the front surface side of the base material 154, a sensor wiring 152y (an example of the second sensor wiring of the present invention) is pattern-formed on the sensor wiring 152x via an insulating film. The sensor wiring 152y is electrically connected to the even-numbered terminals 155y.

  FIG. 29B shows the fourth layer. On the front surface side of the base material 154, a shield layer 157y (an example of a second shield layer of the present invention) made of a copper material is formed in a solid pattern over the entire surface of the sensor wiring 152y.

  The front and back surfaces of the sensor substrate 150a having the four-layer structure are covered with shield layers 157x and 157y. Therefore, the influence of noise on the sensor wirings 152x and 152y of the sensor substrate 150a can be suppressed. As described above, the noise in the electronic board 10 can be reduced with a simple configuration, and the cost for noise countermeasures can be reduced. Therefore, it is possible to realize the electronic board 10 capable of reducing cost with a simple configuration.

  In the sensor substrate 150a, the adjacent sensor wirings 152x and 152y are arranged in different layers (second and third layers), so that a wiring failure due to contact between the adjacent sensor wirings 152x and 152y can be prevented. it can. Furthermore, since the sensor wirings 152x and 152y are alternately and evenly arranged, the mutual capacitive coupling between the adjacent sensor wirings 152x and 152y (adjacent channels) can be made uniform. In the present embodiment, the sensor wirings 152x and 152y are arranged alternately (every other line) in the second layer and the third layer. However, the present invention is not limited to this. May be arranged.

  Here, the shield layers (157x, 157y) may be connected to a circuit ground, or may be connected to a reference potential (ground) of a drive circuit of the touch panel. In the case where the configuration in which the shield layers 157x and 157y are connected to the reference potential is employed, there is a problem that the parasitic capacitance is increased, that is, the signal line sandwiched between the large-area ground layers is signal-coupled with the ground layers (virtual capacitor formation). The problem of level attenuation can occur. As a method of solving this problem, for example, a dummy signal (a reference signal having the same frequency and the same phase as the touch panel drive signal) is applied to the shield layer, and the potential difference between the signal line (the sensor wirings 152x and 152y) is negated. It is conceivable to apply a method of disabling the generation of the parasitic capacitance while maintaining the above. If the signal level attenuation does not affect the touch detection accuracy in actual use, the above method may not be used.

[How to install the electronic board]
When the electronic board 10 is in use, as shown in FIG. 23, the frame 51 such as the stand 50 (see FIG. 2) by the hooking portion 202e and the fastening portion 202f of the board installation plate 220a, as shown in FIG. Example). The board mounting plate 220a attached to the frame 51 is screw-fixed to a corner reinforcing plate 210a that firmly fixes the bezel 110 with screws. In this manner, the electronic board 10 is supported by the board setting plate 220a which is fixed by screws to the corner reinforcing plates 210a arranged at the corners (four corners). For this reason, in the use state, the electronic board 10 can be securely set on the stand 50, so that the electronic board 10 is less likely to be deformed due to its own weight or the like.

10: Electronic board 10a: Writing board 10b: Sensor unit 11: Coordinate detection unit 12: Pen identification unit 13x: X parallel electrode line 13y: Y parallel electrode line 19: Pen receiving unit 20: Control unit 21: Display device 30: Pen 100: writing input system 110: bezel 110a: lower bezel 110b: upper bezel 110c: right bezel 110d: left bezel 110e: corner connecting plate 120: chassis 130: rear cover 150: sensor sheet 150a: sensor substrate 150b: sensor substrate 150c : Sensor board 152: sensor wiring 152 x: sensor wiring 152 y: sensor wiring 157 x: shield layer 157 y: shield layer 160 a: buffer material 160 b: buffer material 161 a: buffer material 161 b: buffer material 161 c: buffer material 171: in Over the face connecting plate 172: Controller board 173: interface board 191: Power button 192: LED
193: connection terminal 194: circuit board 210a: corner reinforcing plate 210b: chassis fixing plate 220: back cover holding plate 220a: board installation plate 220b: back cover holding plate 343: holding member

Claims (7)

An electronic board capable of detecting a contact position on a writing board at which a pen tip of a pen as a writing implement has contacted,
The writing board that leaves visible handwriting when the pen tip of the pen contacts,
A pen receiving portion arranged below the writing board, for placing the pen when using the electronic board,
An operation unit for operating the electronic board,
With
The operation unit is provided in the pen receiving unit,
Electronic board. The operation unit includes:
A power button for turning on or off the power of the electronic board;
A storage medium that stores input information input to the electronic board, or a connection terminal for connecting a communication device that transmits the input information to an external device,
The electronic board according to claim 1, comprising: The power button and the connection terminal are provided on a side surface of the pen receiver.
The electronic board according to claim 2. The electronic board further includes a notifying unit for notifying a power supply state to the outside,
The notification unit is provided on a front surface of the pen receiving unit,
The electronic board according to claim 3. Further provided is a sensor sheet disposed on the back of the writing board and including an electrode wire for detecting the contact position,
A circuit board mounted with a circuit for supplying various signals to the power button, the notification unit, and the connection terminal is disposed in an internal space below the pen receiving unit,
Between the internal space and the space where the sensor sheet is disposed, a partition is disposed,
The electronic board according to claim 4. A chassis that fixes the sensor sheet, and a back cover that covers a back surface of the electronic board,
The cable connected to the circuit board is introduced into the space between the chassis and the rear cover from the internal space, through a cutout portion formed in the partition, and is disposed on the rear side of the chassis. Connected to the interface board
The electronic board according to claim 5. A position detection unit that detects the contact position on the writing board where the pen tip has contacted,
A pen identification unit that detects an identification signal output from the pen,
The electronic board according to any one of claims 1 to 6, further comprising: