JP2019212862A - Mold, planar plate, imprint method, and article manufacturing method - Google Patents

Abstract

To provide a mold capable of reducing occurrences of pattern defects with a simple configuration.SOLUTION: A mold used in an imprint apparatus for forming a pattern on an imprint material on a substrate, includes: a convexoconcave pattern portion forming the pattern; and a projecting portion projecting from a convex portion of the pattern portion on the outer periphery of the pattern portion.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a mold, a flat plate, an imprint method, and an article manufacturing method.

  The demand for miniaturization of semiconductor devices, MEMS, and the like advances, and in addition to conventional photolithography technology, an uncured imprint material on a substrate is formed with a mold having a pattern portion, and a pattern of the imprint material is formed on the substrate. Microfabrication technology is attracting attention. This technique is also called an imprint technique, and can form a fine structure on the order of several nanometers on a substrate. For example, as one of imprint techniques, there is a photocuring method. In an imprint apparatus employing this photocuring method, first, an uncured imprint material is supplied onto the shot area of the substrate (supply process), and the imprint material on the substrate is brought into contact with the pattern portion of the mold ( Contact step), the imprint material is cured. After that, the mold is pulled away from the cured imprint material (mold release process), thereby forming a pattern of the imprint material corresponding to the fine concavo-convex pattern formed on the pattern portion on the shot area of the substrate. is there.

  When the imprint material on the substrate is brought into contact with the mold, the uncured imprint on the substrate may protrude from the shot area. If the imprint material in which the uncured imprint material protrudes from the shot area is cured as it is, it may remain as a residue in the adjacent shot area. This residue can cause pattern defects and mold breakage during imprint processing on adjacent shot areas. In Patent Document 1, an uncured imprint material is prevented from sticking out by disposing a liquid repellent pattern that can intentionally form a bubble bite on the outer peripheral edge of the pattern arrangement region. In Patent Document 2, the uncured imprint material that protrudes by heating and vaporizing the material to be transferred that protrudes outside the transfer region in a state where the template and the substrate to be transferred are opposed to each other, It is prevented from remaining as a residue.

JP2006-225370A JP2014-188869

  However, in Patent Document 1, it is necessary to form a complex liquid repellent pattern in the mold, and in Patent Document 2, a mechanism for heating the protruding imprint material is required, which increases the cost. sell.

  An object of the present invention is to provide a mold that reduces the occurrence of pattern defects with a simple configuration, for example.

  In order to solve the above-mentioned problems, the present invention is a mold used in an imprint apparatus for forming a pattern on an imprint material on a substrate, and has a concave and convex pattern portion for forming a pattern and an outer peripheral portion of the pattern portion. And a protruding portion that protrudes beyond the protruding portion of the pattern portion.

  According to the present invention, for example, it is possible to provide a mold that reduces the occurrence of pattern defects with a simple configuration.

It is a figure which shows the structure of the imprint apparatus to which the mold which concerns on one Embodiment of this invention is applied. It is sectional drawing of a part of mold which concerns on 1st Embodiment. It is a graph showing the change of the viscosity accompanying the change of the film thickness of an imprint material. It is a sectional view of a part of a mold concerning a 2nd embodiment. It is sectional drawing of a part of mold which concerns on 3rd Embodiment. It is sectional drawing of a part of mold which concerns on 4th Embodiment. It is sectional drawing of a part of mold which concerns on 5th Embodiment. It is sectional drawing of a part of mold concerning 6th Embodiment. It is a figure which shows the flow of a planarization process. It is sectional drawing of a part of mold which concerns on 7th Embodiment. It is a figure which shows the manufacturing method of articles | goods.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

(First embodiment)
First, an imprint apparatus to which a mold according to an embodiment of the present invention can be applied will be described. FIG. 1 is a diagram illustrating a configuration of an imprint apparatus to which a mold according to an embodiment of the present invention is applied. In the following drawings, a vertical axis is a Z axis, and two axes orthogonal to each other in a plane perpendicular to the Z axis are an X axis and a Y axis. The imprint apparatus 7 performs an imprint process for forming a pattern of the imprint material 8 on the substrate 4 using the mold 1. Specifically, the imprint material 8 is cured in a state where the pattern portion 3 formed on the mold 1 and the imprint material 8 supplied on the substrate 4 are in contact with each other, and the mold 1 is formed from the cured imprint material 8. Pull apart. Thereby, a three-dimensional pattern (uneven pattern) formed on the pattern portion 3 of the mold 1 is formed on the substrate 4.

  The imprint apparatus 7 of this embodiment includes an imprint head 9 that holds the mold 1, a substrate stage 5 that holds the substrate 4, and a supply unit 6.

  The imprint head 9 moves while holding the mold 1 by, for example, a vacuum suction force or an electrostatic force. The imprint head 9 includes, for example, a drive mechanism such as a linear motor, and is configured to be able to drive the mold 1 in the Z-axis direction. The imprint head 9 brings the pattern portion 3 of the mold 1 into contact with the imprint material 8 by moving the mold 1 in the −Z direction. For example, the imprint head 9 guides light (for example, ultraviolet light) from an unillustrated illumination system to the imprint material 8 supplied onto the substrate 4 and cures the imprint material 8. In this embodiment, a photocurable composition is used as the imprint material 8 as an example. However, when the imprint material 8 is a composition that is cured by heating, the photocurable composition may be cured by heating. The imprint material 8 can be appropriately selected depending on the type of semiconductor device to be manufactured. The imprint head 9 pulls the mold 1 away from the imprint material 8 cured by moving the mold 1 in the + Z direction.

  The substrate stage 5 moves while holding the substrate 4 by, for example, vacuum adsorption force or electrostatic force. The substrate stage 5 is movable by a drive mechanism (not shown) such as a linear motor or a piezoelectric actuator, for example. The drive mechanism may include a minute drive system for moving the substrate stage 5 by a minute amount and a coarse motion drive system for moving the substrate stage 5 by a larger amount of movement than the minute drive system. For example, the substrate stage 5 holds the substrate 4 and moves in the XY plane, thereby arranging a shot region for imprint processing immediately below the supply unit 6. Further, when the mold 1 and the imprint material 8 on the substrate are brought into contact, the mold 1 and the substrate 4 are positioned in the XY plane direction. The moving direction of the substrate stage 5 is not limited to this, and the substrate stage 5 may be configured to be movable in the X-axis direction, the Y-axis direction, the Z-axis direction, and the rotation directions around these axes. While the substrate stage 5 moves in the XY plane direction, the distance between the surface of the substrate 4 and the mold 1 is kept at 1 mm or less. With such a narrow gap, the contact operation and the separation operation of the mold 1 and the imprint material 8 can be quickly performed in the imprint process.

  The supply unit 6 can be configured to supply the uncured imprint material 8 on one or a plurality of shot regions. The supply amount of the imprint material 8 supplied from the supply unit 6 may be set in accordance with, for example, the pattern thickness (residual film thickness) formed on the substrate 4 or the pattern density of the imprint material 8. good.

  A control unit (not shown) is connected to components related to the imprint process such as the imprint head 9, the substrate stage 5, and the supply unit 6 through a wired or wireless communication line, and controls these operations.

  Next, the configuration of the mold according to this embodiment will be described with reference to FIG. FIG. 2 is a cross-sectional view of a part of the mold 1 according to the first embodiment. The mold 1 is, for example, a mold (mold material, mold) having a pattern portion 3 having a rectangular outer peripheral portion and a predetermined uneven pattern (for example, a circuit pattern) formed on a surface facing the substrate 4 in a three-dimensional shape. It is. The surface of the pattern portion 3 is processed with high flatness in order to maintain adhesion with the surface of the substrate 4. The material of the mold 1 is a material that can transmit ultraviolet rays, such as quartz.

  A protruding portion 2 is formed on the outer peripheral portion of the pattern portion 3 of the mold 1 so as to surround the pattern portion 3. The protruding portion 2 protrudes in the −Z direction from the convex portion 3 a of the pattern portion 3. FIG. 2 shows the mold 1 in a state where the mold 1 and the imprint material 8 are in contact with each other and a part of the periphery thereof. As the mold 1 moves in the −Z direction, the pattern portion 3 and the imprint material 8 come into contact with each other, and the imprint material 8 is spread in the X, Y, and Z directions and filled between the mold 1 and the substrate 4. It will be done. At this time, the thickness of the imprint material 8 in the Z direction is, for example, 50 nm or less. It is known that the viscosity of the imprint material 8 changes as the thickness in the Z direction decreases, and the thinner the imprint material 8, the harder the imprint material 8 moves in the X and Y directions.

  FIG. 3 is a graph showing a change in viscosity accompanying a change in the film thickness of the imprint material 8. In FIG. 3, the horizontal axis indicates the film thickness of the imprint material 8, and the vertical axis indicates the viscous resistance of the imprint material 8. As shown in the figure, when the film thickness is 5 nm or less, the viscosity resistance of the imprint material 8 rapidly increases. As such an imprint material 8, for example, a material mainly composed of isobornyl acrylate is known. The mold 1 is provided with a protruding portion 2 that protrudes from the convex portion 3 a of the pattern portion 3, and the imprint material 8 that contacts the protruding portion 2 when the mold 1 contacts the imprint material 8 on the substrate 4. Is thinner than the thickness of the imprint material 8 in contact with the pattern portion 3. Then, since the protrusion part 2 is formed in the outer peripheral part of the mold 1, the viscosity of the uncured imprint material 8 located in the outer peripheral part becomes high, and the uncured imprint material 8 is outside the mold 1 ( It becomes difficult to flow out in the direction opposite to the pattern portion 3). Therefore, by disposing the projecting portion 2 around the pattern portion 3 so as to surround the pattern portion 3, the imprint material from the pattern portion 3 to the outer periphery thereof is brought into contact with the mold 1 and the imprint material 8. It can suppress that 8 protrudes. As a result, occurrence of pattern defects can be suppressed. Although it is desirable that the protruding portion 2 protrudes in the −Z direction by 5 nm or more than the convex portion 3 a of the pattern portion 3, the present invention is not limited thereto.

  As described above, according to the present embodiment, it is possible to suppress the occurrence of pattern defects with a simple configuration in which the protrusion 1 that protrudes beyond the protrusion 3 a of the pattern portion 3 is provided in the mold 1.

(Second Embodiment)
Next, the mold according to the second embodiment will be described. Matters not mentioned in the second embodiment are the same as those in the above-described embodiment. FIG. 4 is a cross-sectional view of a part of the mold 1 according to the second embodiment. In the mold 1 of this embodiment, the side surface 11 on the pattern portion 3 side of the protruding portion 2 is inclined toward the pattern portion 3 side.

  The side surface 11 is a side surface of the protruding portion 2 on the pattern portion 3 side, and is a surface in contact with the imprint material 8. The side surface 11 is inclined toward the pattern portion 3 as it goes from the tip of the protruding portion 2 toward the base. The imprint material 8 is supplied in advance onto the substrate 4, and then the mold 1 moves in the −Z direction, whereby the mold 1 and the substrate 4 come into contact with each other, and the imprint material 8 is pushed and spread. The material 8 is filled between the mold 1 and the substrate 4. At this time, for example, when the angle of the edge portion 12 of the inner peripheral portion of the protruding portion 2 is less than 90 degrees, the edge portion 12 is hardly filled with the imprint material 8. The edge part 12 is located in the inner peripheral part of the protrusion part 2 as shown in FIG. 2, and is usually a part that is difficult to be filled with the imprint material. When the imprint process is completed in a state where the imprint material 8 is not filled, the thickness of the imprint material in the unfilled portion becomes thin, and a problem may occur in the process of the substrate 4 after the imprint process, for example, the etching process. Returning to FIG. 4, the side surface 11 is inclined toward the pattern portion 3 side, whereby the edge portion 12 is easily filled with the imprint material 8. The edge portion 12 may have a flat surface structure or a curved surface structure. However, when the edge portion 12 has a curved surface structure, the imprint material is more easily filled. As described above, by inclining the side surface of the mold 1 on the pattern portion 3 side, unfilling can be suppressed, and occurrence of pattern defects can be reduced.

(Third embodiment)
Next, a mold according to a third embodiment will be described. Matters not mentioned in the third embodiment are the same as those in the above-described embodiment. FIG. 5 is a cross-sectional view of a part of the mold 1 according to the third embodiment. The mold 1 of the present embodiment includes a groove 21 that is recessed from the bottom surface 3 b of the concave portion of the pattern portion 3 between the protruding portion 2 and the pattern portion 3.

  A groove 21 that is recessed in the −Z direction from the bottom surface 3 b of the concave portion of the pattern portion 3 is formed between the protruding portion 2 and the pattern portion 3. The groove 21 increases the capacity of the imprint material 8 that can be accommodated between the pattern portion 3 and the protruding portion 2, and the imprint material 8 is less likely to flow out of the mold 1 (in the direction opposite to the pattern portion 3). As described above, by forming the groove 21 between the protruding portion 2 and the pattern portion 3, the protrusion of the imprint material 8 can be further suppressed.

(Fourth embodiment)
Next, the mold of 4th Embodiment is demonstrated. Matters not mentioned in the fourth embodiment are the same as those in the above-described embodiment. FIG. 6 is a partial cross-sectional view of the mold 1 according to the fourth embodiment. The mold 1 of this embodiment includes a supply port 31 that supplies gas to the outer peripheral portion of the protruding portion 2.

  The supply port 31 has a cylindrical shape attached to the mold 1 and supplies gas between the protrusion 2 and the substrate 4. When the gas supplied from the supply port 31 is supplied to the imprint material 8 protruding from between the protrusion 2 and the substrate 4, volatilization of the imprint material 8 can be promoted. Thereby, even if the imprint material 8 flows out of the protruding portion 2 (in the direction opposite to the pattern portion 3), the outflowed imprint material 8 can be volatilized and removed. Examples of the gas supplied from the supply port 31 include air, clean dry air, nitrogen, oxygen, helium, and the like. These gases may be supplied from a first gas supply unit (not shown) for forming a gas barrier in the imprint processing space in the imprint apparatus 7, for example. In addition, a space between the mold 1 and the substrate 4 may be supplied from a second gas supply unit (not shown) that supplies a gas having high solubility or high diffusibility with respect to the imprint material. . The supply port 31 is not limited to this shape as long as gas can be supplied between the protruding portion 2 and the substrate 4. The supply port 31 may be, for example, a through hole that extends between the protruding portion 2 and the substrate 4.

  Further, the side surface 32 of the protruding portion 2 on the supply port 31 side is inclined toward the outer peripheral side from the tip of the protruding portion 2 toward the root. The protrusion part 2 of this embodiment becomes a shape where a width | variety becomes narrow as it goes to -Z direction. When the side surface 32 includes the inclination, the gas supplied from the supply port 31 can easily enter between the protrusion 2 and the substrate 4. Thereby, the imprint material 8 protruding from between the protruding portion 2 and the substrate 4 can be volatilized and removed more efficiently, and the occurrence of pattern defects can be reduced.

(Fifth embodiment)
Next, a mold according to a fifth embodiment will be described. Matters not mentioned in the fifth embodiment are the same as those in the above-described embodiment. FIG. 7 is a cross-sectional view of a part of the mold 1 according to the fifth embodiment. The mold 1 of the present embodiment has a conductive material 41 on the surface of the protruding portion 2.

  The conductive material 41 is attached to a part of the protrusion 2. In the imprint process, after contact between the mold 1 and the imprint material 8, the mold 1 moves in the + Z direction and moves away from the imprint material 8. At this time, it is known as a peeling charging phenomenon that the mold 1 is charged when the imprint material 8 and the mold 1 are separated. This peeling electrification phenomenon attracts minute foreign matters such as particles to the surface of the mold 1 by electrostatic force. Therefore, if the fine foreign matter adheres to the mold 1, the mold 1 may be damaged and cause pattern defects. . When the potential difference between the mold 1 and the imprint material 8 becomes higher than the discharge voltage due to the peeling charging phenomenon, an electronic avalanche phenomenon occurs between the mold 1 and the imprint material 8, and the surface of the mold 1 is It is neutralized. Since this discharge voltage is smaller for the conductor than for the insulator, the avalanche can be more easily caused by forming the portion of the protrusion 2 that opposes the substrate 4 with the conductive material 41. As a result, the surface of the mold 1 facing the substrate 4 can be easily neutralized, and the occurrence of pattern defects can be reduced. As the conductive material 41, a material having an electrical resistivity smaller than that of quartz glass is preferable. For example, boron or phosphorus may be ion-implanted to form the conductive material 41, or a metal material such as chromium or ruthenium may be formed.

(Sixth embodiment)
Next, the mold of 6th Embodiment is demonstrated. Matters not mentioned in the sixth embodiment are the same as those in the above-described embodiment. FIG. 8 is a cross-sectional view of a part of the mold 1 according to the sixth embodiment. In the mold 1 of the present embodiment, the protruding portion 2 is disposed only on a part of the outer peripheral portion of the pattern portion 3.

  FIG. 8 shows a case where the mold 1 is viewed from the −Z direction. Here, the square pattern portion 3 is shown as an example, but the pattern portion 3 may be a polygon having another shape. In the present embodiment, the plurality of protruding portions 2 are discontinuously arranged at positions other than the corners of the outer peripheral portion of the pattern portion 3. The corner portion of the pattern portion 3 is a portion that is difficult to be filled with the imprint material 8 in the imprint process. By not providing the protrusion 2 at the corner portion where the imprint material is difficult to be filled, the imprint material is likely to spread and fill the corner portion. Therefore, it is difficult for the imprint material 8 to flow out of the mold 1 (in the direction opposite to the pattern portion 3), and the filling properties of the corner portions of the pattern portion 3 are also improved.

(Seventh embodiment)
Next, a mold according to a seventh embodiment will be described. Matters not mentioned in the seventh embodiment are the same as those in the above-described embodiment. An apparatus to which a mold according to an embodiment of the present invention can be applied is a planarization apparatus that forms a planarization layer on a substrate. In the planarization apparatus, a planarization layer is formed on a substrate using a mold (planar template) in which a pattern is not formed. The planarization device performs local planarization in the substrate surface by pressing a planar plate against an uncured composition (imprint material) previously supplied to the substrate. The planarization treatment includes a step of curing the curable composition by light irradiation or heating while the flat portion of the planar template is in contact with the curable composition supplied on the substrate.

  In the planarization apparatus, a planarization layer is formed on a substrate using a planar template. The underlying pattern on the substrate has a concavo-convex profile resulting from the pattern formed in the previous process, and in particular with the recent multi-layer structure of memory elements, some process substrates have steps of about 100 nm. Yes. The level difference caused by the gentle undulation of the entire substrate can be corrected by the focus tracking function of the scan exposure apparatus used in the photo process. However, fine pitch irregularities that fall within the exposure slit area of the exposure apparatus consume the DOF (Depth Of Focus) of the exposure apparatus as it is. As a conventional method for smoothing the base pattern of the substrate, a method of forming a planarizing layer such as SOC (Spin On Carbon) or CMP (Chemical Mechanical Polishing) is used. However, the conventional technique has a problem that sufficient flattening performance cannot be obtained, and in the future, the difference in unevenness of the base due to multilayering tends to further increase.

  In order to solve this problem, the planarization apparatus of the present embodiment performs local planarization in the substrate surface by pressing a planar template (planar plate) against an uncured composition pre-applied to the substrate. . In the present embodiment, the configuration of the planarizing device can be substantially the same as that of the imprint apparatus 7 shown in FIG. However, in the planarization apparatus, instead of the mold having the pattern portion 3 on which the concavo-convex pattern is formed, a flat plate having an area equal to or larger than that of the substrate 4 is used and brought into contact with the entire surface of the composition layer on the substrate. . The imprint head 9 is configured to hold such a planar plate.

  Here, an outline of the flattening process will be described with reference to FIG. FIG. 9 is a diagram illustrating a flow of the flattening process. As shown in FIG. 9A, the imprint material 8 is supplied from the supply unit 6 to the substrate 4 on which the base pattern 91 is formed. FIG. 9A shows a state before the imprint material 8 is supplied onto the substrate and the flat plate 90 is brought into contact therewith. Next, as shown in FIG. 9B, the imprint material 8 on the substrate is brought into contact with the flat portion 92 of the mold 1. FIG. 9B shows a state in which the flat portion 92 of the flat plate 90 completely contacts the imprint material 8 on the substrate, and the flat portion 92 of the flat plate 90 follows the surface shape of the substrate 4. Then, in the state shown in FIG. 9B, the imprint material 8 is cured by irradiating the imprint material 8 on the substrate with light from the illumination system via the flat plate 90. Next, as shown in FIG. 9C, the flat plate 90 is pulled away from the cured imprint material 8 on the substrate. Thereby, the layer (planarization layer) of the imprint material 8 having a uniform thickness can be formed on the entire surface of the substrate 4. FIG. 9C shows a state in which the planarizing layer of the imprint material 8 is formed on the substrate.

  FIG. 10 is a cross-sectional view of a part of the mold according to the seventh embodiment. The mold of this embodiment is a flat plate 90 used in a flattening apparatus. The flat plate 90 has, for example, a circular or square outer shape, and includes a flat portion 91 that contacts the imprint material 8 (composition) on the substrate 4 and follows the surface shape of the substrate 4. The flat portion 91 is, for example, the same size as the substrate 4 or larger than the substrate 4. The flat surface portion 91 corresponds to the pattern portion 3 of the first to sixth embodiments. That is, the first to sixth embodiments can be applied to the flat plate 90.

  The flat plate 90 has a protruding portion 2 that protrudes from the flat portion 91 on the outer peripheral portion of the flat portion 91. The protruding portion 2 protrudes in the −Z direction from the plane portion 91. Since the flat plate 90 includes the protruding portion 2 that protrudes from the flat portion 92, the thickness of the imprint material 8 that contacts the protruding portion 2 when the flat plate 90 and the imprint material 8 on the substrate 4 are in contact with each other. Is thinner than the thickness of the imprint material 8 in contact with the flat surface portion 91. Then, since the protrusion 2 is formed on the outer peripheral portion of the flat plate 90, the viscosity of the uncured imprint material 8 located on the outer peripheral portion is increased, and the uncured imprint material 8 is formed on the flat plate 90. It becomes difficult to flow out to the outside (the direction opposite to the flat surface portion 91). Therefore, by providing the projecting portion 2 around the flat surface portion 91 so as to surround the flat surface portion 91, the imprint material 8 extends from the flat surface portion 91 to the outer peripheral portion when the flat plate 90 and the imprint material 8 are in contact with each other. Can be prevented from protruding. Although it is desirable that the protruding portion 2 is higher than the flat portion 91 by 5 nm or more in the −Z direction, the present invention is not limited to this.

  By setting it as such a structure, it can suppress that the residue of the imprint material generate | occur | produces and, as a result, it becomes possible to suppress that a pattern defect generate | occur | produces in the imprint process in the following process.

(Embodiment related to article manufacturing method)
The method for manufacturing an article according to an embodiment of the present invention is suitable, for example, for manufacturing an article such as a microdevice such as a semiconductor device or an element having a fine structure. The method for manufacturing an article according to this embodiment includes a step of forming a pattern on the imprint material applied to the substrate using the above-described imprint apparatus (a step of performing imprint processing on the substrate), and a pattern is formed by such a step. And processing the processed substrate. Further, the manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, composition peeling, dicing, bonding, packaging, and the like). The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

  The pattern of the cured product formed using the imprint apparatus 7 is used permanently on at least a part of various articles, or temporarily when various articles are manufactured. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, a mold, or the like. Examples of the electric circuit elements include volatile or nonvolatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include an imprint mold.

  The pattern of the cured product is used as it is as a constituent member of at least a part of the article or temporarily used as a composition mask. After etching or ion implantation or the like is performed in the substrate processing step, the composition mask is removed.

  Next, a specific method for manufacturing an article will be described. As shown in FIG. 11A, a substrate 4z such as a silicon substrate on which a workpiece 2z such as an insulator is formed is prepared. Subsequently, the substrate 4z is formed on the surface of the workpiece 2z by an inkjet method or the like. A printing material 3z is applied. Here, a state is shown in which the imprint material 3z in the form of a plurality of droplets is applied on the substrate.

  As shown in FIG. 11 (b), the imprint mold 4z is opposed to the imprint material 3z on the substrate with the side on which the concave / convex pattern is formed facing. As shown in FIG.11 (c), the board | substrate 4z with which the imprint material 3z was provided, and the mold 4z are made to contact, and a pressure is applied. The imprint material 3z is filled in the gap between the mold 4z and the workpiece 2z. In this state, when light is irradiated as energy for curing through the mold 4z, the imprint material 3z is cured.

  As shown in FIG. 11D, when the imprint material 3z is cured and then the mold 4z and the substrate 4z are separated, a pattern of a cured product of the imprint material 3z is formed on the substrate 4z. This cured product pattern has a shape in which the concave portion of the mold corresponds to the convex portion of the cured product, and the concave portion of the mold corresponds to the convex portion of the cured product, that is, the concave / convex pattern of the mold 4z is transferred to the imprint material 3z. It will be done.

As shown in FIG. 11E, when etching is performed using the pattern of the cured product as an etching resistant mask, the portion of the surface of the workpiece 2z where there is no cured product or remains thin is removed, and the groove 5z and Become. As shown in FIG. 11 (f), when the pattern of the cured product is removed, an article in which the groove 5z is formed on the surface of the workpiece 2z can be obtained. Although the cured product pattern is removed here, it may be used as, for example, a film for interlayer insulation contained in a semiconductor element or the like, that is, a constituent member of an article without being removed after processing.
In addition, although the example using the mold for circuit pattern transfer which provided the uneven | corrugated pattern as the mold 4z was described, the planar template which has a plane part without an uneven | corrugated pattern may be sufficient.

(Other embodiments)
As mentioned above, although embodiment of this invention has been described, this invention is not limited to these embodiment, A various change is possible within the range of the summary.

DESCRIPTION OF SYMBOLS 1 Mold 2 Protruding part 3 Pattern part 4 Substrate 5 Substrate stage 7 Imprint apparatus 9 Imprint head

Claims (14)

A mold used in an imprint apparatus for forming a pattern on an imprint material on a substrate,
An uneven pattern portion for forming the pattern;
A mold having an outer peripheral portion of the pattern portion and a protruding portion that protrudes more than a convex portion of the pattern portion.   The mold according to claim 1, wherein the protrusion protrudes 5 nm or more than the protrusion.   3. The mold according to claim 1, wherein a side surface of the projecting portion on the pattern portion side is inclined toward the pattern portion side toward a root from a tip of the projecting portion.   The mold according to any one of claims 1 to 3, wherein an edge portion of an inner peripheral portion of the protruding portion is a curved surface.   The mold according to any one of claims 1 to 4, further comprising a groove that is recessed from a bottom surface of the concave portion between the protruding portion and the pattern portion. A supply port for supplying gas to the outer peripheral portion of the protruding portion;
6. The mold according to claim 1, wherein a side surface of the protruding portion on the supply port side is inclined toward an outer peripheral side from a tip end of the protruding portion toward a base.   The mold according to claim 1, wherein the protrusion has a conductive material on a surface thereof.   The mold according to any one of claims 1 to 7, wherein the protruding portion is disposed at a part of an outer peripheral portion of a surface in contact with the substrate.   The mold according to claim 1, wherein the protrusion is disposed at a position other than a corner of the mold.   The mold according to claim 1, wherein the protruding portion is disposed so as to surround the pattern portion. A planar plate used in a planarization apparatus for forming a planarization layer with a composition on a substrate,
A planar portion for forming the planarizing layer;
A flat plate having an outer peripheral portion of the flat portion and a protruding portion protruding from the flat portion. An imprint method using a mold having a concave and convex pattern portion for forming a pattern on an imprint material on a substrate and a protruding portion that protrudes beyond the convex portion of the pattern portion on the outer periphery of the pattern portion. And
A supplying step of supplying the uncured imprint material on the substrate;
Contacting the mold with the imprint material; and
A mold release step of separating the mold from the imprint material,
In the contact step, the thickness of the imprint material in contact with the protruding portion is thinner than the thickness of the imprint material in contact with the pattern portion. Forming a pattern on a substrate using the mold according to any one of claims 1 to 10,
Processing the substrate on which the pattern is formed in the step;
Producing an article from the processed substrate;
A method for producing an article comprising: Forming a planarization layer of a composition on a substrate using the flat plate according to claim 11;
Processing the substrate on which the planarization layer is formed in the step;
Producing an article from the processed substrate;
A method for producing an article comprising:

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