JP2019202793A - Cover tape and electronic component packaging body - Google Patents

Abstract

To provide a cover tape which includes an antistatic layer which has favorable adhesion with a base material film even in the case where coating is performed on a surface of the base material film where corona treatment is not performed, and to provide an electronic component packaging body including this cover tape.SOLUTION: A cover tape 10 includes a polyester film, and an antistatic layer provided at least on one surface of the polyester film. The antistatic layer is a coating layer comprising a resin composition containing: (A) an antistatic agent; (B) polyalkylene glycol; (C) polyurethane resin where the polyol component is made of polyester polyol, or polyester resin, or binder resin made of a combination of these.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a cover tape and an electronic component package. In more detail, it is related with the cover tape for electronic component package bodies, and an electronic component package body provided with the same.

  Electronic parts such as semiconductor IC chips are packed with packaging materials to prevent contamination until they are subjected to a mounting process after being manufactured, and wound around a paper or plastic reel. Stored and transported. For packaging electronic components, a tape-shaped packaging material is used so as to correspond to a mounting process on a substrate by an automatic mounting apparatus, and the packaging material is placed on a long sheet at a predetermined interval. The carrier tape includes a plurality of concave storage pockets and a cover tape heat-sealed to the carrier tape. The electronic component packed with such a packaging material is automatically taken out of the package after the cover tape is peeled off from the carrier tape, and mounted on the electronic circuit board.

  The packaging material containing the electronic components is transported in a state of being wound on a reel and stored until use. The package in the state of being wound on the reel is formed by static electricity generated by friction between the cover tape or carrier tape and the electronic component during transportation, and contact between the carrier tape and the cover tape during transportation. Charged by the generated static electricity. Further, when the package is used, static electricity is generated when the cover tape is peeled off from the carrier tape. Furthermore, static electricity is generated from dust and contents attached to the package. Due to the static electricity thus generated, the housed electronic component may break down (electrostatic breakdown), or the electronic component may stick to the carrier tape or the cover tape when the electronic component is taken out. Therefore, the carrier tape and the cover tape have been required to have an antistatic ability.

  Various studies have been made to solve the above-described problems. For example, in a cover tape in which a base material layer and a sealant layer are laminated, the surface opposite to the surface on which the sealant layer of the base material layer is laminated. In addition, a technique for providing an antistatic layer has been proposed (Patent Document 1). Patent Document 1 describes that an antistatic layer is provided on the outermost surface of a base material layer in a cover tape having a base material layer and an adhesive layer heat-sealed to the carrier tape. Patent Document 1 describes that the surface of the base material layer on which the antistatic layer is applied is subjected to corona treatment to improve the wettability of the coating agent.

International Publication No. 2013/054867

  However, when corona treatment is applied to the base material layer, equipment for corona treatment is required, which leads to an increase in manufacturing cost. Moreover, although the base film (for example, biaxially stretched PET film) by which the corona treatment was given previously can be used, a commercially available base film is generally a single-sided corona treatment film. When the corona-treated surface is used as the coating surface of the antistatic layer, the adhesive layer is coated on the non-corona-treated surface side of the base film. However, when an adhesive layer is applied to the uncorona-treated surface of the base film, adhesion failure may occur. Although a base film having both sides corona-treated is commercially available, this is expensive and thus leads to an increase in the manufacturing cost of the entire cover film.

  The present invention relates to a cover tape including an antistatic layer having good adhesion to the base film even when applied to an uncorona-treated surface of the base film, and an electronic component package including the cover tape The purpose is to provide.

  As a result of intensive studies, the inventor has used a specific thermoplastic resin in combination with polyalkylene glycol as an antistatic layer, so that a coating layer made of a resin composition containing these has become a base layer. The present invention was completed by finding that it has excellent adhesiveness.

（式（１）において、ＥＯはオキシエチレン基を表し、ＡＯは炭素数３〜４のオキシアルキレン基を表し、ａおよびｂは各々独立して、２〜１００であり、ａ＋ｂは１０〜１００であり、ｍは１０〜１００であり、Ｒ１は、水素原子、炭素数１〜４のアルキル基または炭素数１〜４のアシル基であり、−（ＥＯ）_ａ−（ＡＯ）_ｍ−（ＥＯ）_ｂ−は、ＥＯとＡＯとからなるブロック共重合構造である。） According to the present invention,
Polyester film,
An antistatic layer provided on at least one side of the polyester film, and a cover tape comprising:
The antistatic layer is
(A) an antistatic agent;
(B) a polyalkylene glycol represented by the following formula (1);
(C) There is provided a cover tape which is a coating layer made of a resin composition containing a polyurethane resin whose polyester component is made of polyester polyol, or a binder resin made of polyester resin or a combination thereof.

(In Formula (1), EO represents an oxyethylene group, AO represents an oxyalkylene group having 3 to 4 carbon atoms, a and b are each independently 2 to 100, and a + b is 10 to 100. Yes, m is 10 to 100, R1 is a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an acyl group having 1 to 4 carbon atoms,-(EO) _a- (AO) _m- (EO) _b- is a block copolymer structure composed of EO and AO.)

Also according to the invention,
A carrier tape containing electronic components;
There is provided an electronic component package including a sealant layer bonded to the carrier tape so as to seal the electronic component, and the cover tape.

  ADVANTAGE OF THE INVENTION According to this invention, the cover tape in which the adhesiveness of an antistatic layer and a base material layer was improved, and an electronic component packaging body provided with this cover tape are provided.

It is sectional drawing which shows the structure of the cover tape which concerns on this embodiment. It is a figure which shows an example of the state which sealed the cover tape for electronic component packaging which concerns on this embodiment to the carrier tape.

（式（１）において、ＥＯはオキシエチレン基を表し、ＡＯは炭素数３〜４のオキシアルキレン基を表し、ａおよびｂは各々独立して、２〜１００であり、ａ＋ｂは１０〜１００であり、ｍは１０〜１００であり、Ｒ１は、水素原子、炭素数１〜４のアルキル基または炭素数１〜４のアシル基であり、−（ＥＯ）_ａ−（ＡＯ）_ｍ−（ＥＯ）_ｂ−は、ＥＯとＡＯとからなるブロック共重合構造である。） The cover tape according to the present embodiment includes a polyester film and an antistatic layer provided on at least one side of the polyester film. In the present embodiment, the antistatic layer comprises (A) an antistatic agent, (B) a polyalkylene glycol represented by the following formula (1), and (C) a polyurethane resin in which a polyol component is a polyester polyol, or polyester. It is a coating layer which consists of a resin composition containing resin or binder resin which consists of these combination.

(In Formula (1), EO represents an oxyethylene group, AO represents an oxyalkylene group having 3 to 4 carbon atoms, a and b are each independently 2 to 100, and a + b is 10 to 100. Yes, m is 10 to 100, R1 is a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an acyl group having 1 to 4 carbon atoms,-(EO) _a- (AO) _m- (EO) _b- is a block copolymer structure composed of EO and AO.)

  In the cover tape of this embodiment, the adhesion between the antistatic layer and the polyester film as the base material layer is improved by using a coating film obtained by forming the above composition as the antistatic layer. Therefore, even when a polyester film with one side corona-treated is used as the base material layer and an antistatic layer is applied to the non-corona-treated surface, the antistatic layer is strongly applied to the non-corona-treated surface of the polyester film. In close contact. In this embodiment, since it is not necessary to apply the antistatic layer to the corona-treated surface side of the polyester film, it is not necessary to newly apply a corona treatment to the non-corona-treated surface. The corona-treated surface of the polyester film can also be used to form a sealant layer or a multilayer structure including a sealant layer. When another resin layer is formed on the corona-treated surface of the polyester film, strong adhesion between the sealant layer and the polyester film can be obtained. By using the antistatic layer of this embodiment, since the commercially available single-sided corona-treated polyester film can be used without the need for further surface corona treatment, the production cost of the cover tape can be suppressed.

  Here, a cover tape provided with the antistatic layer formed from the above-mentioned resin composition, and an electronic component package provided with this cover tape will be described. FIG. 1 is a schematic sectional view showing an example of a cover tape. In the present embodiment, the cover tape 10 includes a base material layer 1 that is a polyester film and an antistatic layer 3 that is provided on one surface side of the base material layer 1. When the sealant layer 2 is provided, the sealant layer 2 is preferably disposed on the side of the base layer 1 opposite to the side on which the antistatic layer 3 is provided.

  Next, a method of using the cover tape 10 will be described with reference to FIG. The cover tape 10 is used as a cover material for a carrier tape 20 in which concave pockets 21 are continuously provided according to the shape of the electronic component. Specifically, the cover tape 10 is used by adhering the sealant layer 2 to the surface of the carrier tape 20 (for example, heat sealing) so as to cover the entire opening of the pocket 21 of the carrier tape 20. In the following description, a structure obtained by bonding the cover tape 10 and the carrier tape 20 is referred to as an electronic component package (or package) 100.

  In manufacturing an electronic device, an electronic component is accommodated in the pocket 21 of the carrier tape 20, and then the cover tape 10 is bonded to the surface of the carrier tape 20 so as to cover the entire opening of the pocket 21 of the carrier tape 20. Thus, the package 100 containing the electronic components is produced. As described above, the package 100 is transported to a work area where surface packaging is performed on an electronic circuit board or the like in a state where the package 100 is wound around a paper or plastic reel. In the surface mounting process of the electronic component, the cover tape 10 is peeled off from the carrier tape 20, and the electronic component is automatically taken out from the package and mounted on the electronic circuit board.

  The cover tape 10 according to the present embodiment includes an antistatic layer 3 in order to reduce charging due to static electricity generated when the cover tape 10 is peeled from the package 100. The antistatic layer 3 is a coating film made of the above-described resin composition, and this coating film has excellent adhesion to the polyester film as the base material layer 1. Therefore, during the period from winding of the package 100 onto the reel to use of the package 100, the antistatic ability is maintained without peeling.

  The polyester film used as the base material layer 1 of the cover tape 10 of the present embodiment may be a film that is generally used in this field. Here, the polyester is a dicarboxylic acid such as terephthalic acid, isophthalic acid, 2,6-naphthalenedicarboxylic acid, adipic acid, sebacic acid, 4,4′-diphenyldicarboxylic acid, 1,4-cyclohexyldicarboxylic acid or the like. It is a polyester produced by melt polycondensation of an ester with glycols such as ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, 1,4-butanediol, neopentyl glycol, and 1,4-cyclohexanedimethanol. . Polyesters composed of these acid components and glycol components can be produced by conventional methods.

  The polyester film used in the present embodiment is preferably a biaxially stretched polyester film, and a commercially available film can be used. The thickness of the polyester film is 5 μm or more and 50 μm or less. If it is less than 5 μm, the tear strength is inferior, and if it exceeds 50 μm, there may be a problem in adhesion to the carrier tape. The polyester film may be a film that has been subjected to corona treatment on one side or both sides or subjected to easy adhesion treatment. In order to achieve both reduction in manufacturing cost and adhesion to the sealant layer 2, it is preferable to use a polyester film whose one side is corona-treated. The polyester film may contain inorganic particles or organic particles. Furthermore, the polyester film may have a single layer structure or a multilayer structure. In the case of a multilayer structure, it is sufficient that at least one surface is a layer made of polyester.

  In the present embodiment, the resin composition constituting the antistatic layer 3 includes (A) an antistatic agent, (B) polyalkylene glycol, and (C) a binder resin, where the binder resin (C) is The polyol component is a polyurethane resin made of polyester polyol, a polyester resin, or a binder resin made of a combination thereof. Hereinafter, each component will be described in detail.

  Examples of the antistatic agent (A) used in the present embodiment include a lithium ion-containing polymer type antistatic resin, a polyamide copolymer such as polyether ester amide, a block polymer of polyolefin and polyether, a polymer composed of polyethylene ether and glycol. , Carboxylic acid group-containing polymers such as potassium ionomers, quaternary ammonium base-containing copolymers, metal particles such as tin oxide, zinc oxide, and titanium oxide, and thiophene conductive materials such as polyethylenedioxythiophene / polystyrene sulfonic acid (PEDOT / PSS) Examples include, but are not limited to, conductive polymers and carbon nanotubes. Among these, conductive polymers such as polyethylene dioxythiophene / polystyrene sulfonic acid (PEDOT / PSS), metal particles, and carbon nanotubes are preferably used.

式（１）において、ＥＯはオキシエチレン基を表し、ＡＯは炭素数３〜４のオキシアルキレン基を表し、ａおよびｂは各々独立して、２〜１００であり、ａ＋ｂは１０〜１００であり、ｍは１０〜１００であり、Ｒ１は、水素原子、炭素数１〜４のアルキル基または炭素数１〜４のアシル基であり、−（ＥＯ）_ａ−（ＡＯ）_ｍ−（ＥＯ）_ｂ−は、ＥＯとＡＯとからなるブロック共重合構造である。
上記ポリアルキレングリコール（Ｂ）は優れた成膜性を有するため、これを含む組成物は優れた塗布性を有する。 The polyalkylene glycol (B) used in the present embodiment is a compound represented by the formula (1).

In Formula (1), EO represents an oxyethylene group, AO represents an oxyalkylene group having 3 to 4 carbon atoms, a and b are each independently 2 to 100, and a + b is 10 to 100 , M is 10 to 100, R 1 is a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an acyl group having 1 to 4 carbon atoms, and — (EO) _a — (AO) _m — (EO) _b -Is a block copolymer structure composed of EO and AO.
Since the polyalkylene glycol (B) has an excellent film forming property, the composition containing the polyalkylene glycol (B) has an excellent coating property.

  The polyurethane resin or polyester resin used as the component (C) in the present embodiment is used as a binder resin for improving the film formability of the resulting resin composition and for exhibiting adhesion to the base material layer. It is done. Moreover, since such a component (C) is excellent in the dispersibility with respect to said polyalkylene glycol, the composition obtained is excellent in a handleability and applicability | paintability.

  The polyester resin used as the component (C) can be the same polyester as the material of the polyester film used as the base material layer 1. Preferably, the polyester resin has a molecular weight of 5000 to 25000. More preferably, the polyester resin is a resin having a polyethylene terephthalate skeleton.

  The polyurethane resin is a resin whose polyol component is a polyester polyol. The polyurethane resin is a resin obtained by a reaction between a hydroxyl group and an isocyanate. The hydroxyl group used as a raw material is a polyol. For example, polyether polyols, polyester polyols, polycarbonate polyols, polyolefin polyols, and acrylic polyols are used. These polyols may be used alone or in combination.

  Examples of polyether polyols include polyethylene glycol, polypropylene glycol, polyethylene propylene glycol, polytetramethylene ether glycol, polyhexamethylene ether glycol, and the like.

  Polyester polyols include polycarboxylic acids (malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, sebacic acid, fumaric acid, maleic acid, terephthalic acid, isophthalic acid, etc.) or their acid anhydrides. Product and polyhydric alcohol (ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, dipropylene glycol, tripropylene glycol, butanediol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol, 2-methyl-1,3-propanediol, 1,5-pentanediol, neopentyl glycol, 1,6-hexanediol, 3-methyl-1,5-pentanediol, 2-methyl-2,4-pentanediol 2-methyl-2-propyl-1 3-propanediol, 1,8-octanediol, 2,2,4-trimethyl-1,3-pentanediol, 2-ethyl-1,3-hexanediol, 2,5-dimethyl-2,5-hexanediol 1,9-nonanediol, 2-methyl-1,8-octanediol, 2-butyl-2-ethyl-1,3-propanediol, 2-butyl-2-hexyl-1,3-propanediol, cyclohexane Diol, bishydroxymethylcyclohexane, dimethanolbenzene, bishydroxyethoxybenzene, alkyl dialkanolamine, lactone diol, etc.).

  Examples of polycarbonate polyols include polycarbonate diols obtained by dealcoholization reaction from polyhydric alcohols and dimethyl carbonate, diethyl carbonate, diphenyl carbonate, ethylene carbonate, and the like, such as poly (1,6-hexylene) carbonate, poly ( And 3-methyl-1,5-pentylene) carbonate.

  Among these, a polyester polyol is preferable, and a polyester polyol having an aromatic ring is more preferable.

  Examples of the polyisocyanate compound used for obtaining the polyurethane resin include aromatic diisocyanates such as tolylene diisocyanate, xylylene diisocyanate, methylene diphenyl diisocyanate, phenylene diisocyanate, naphthalene diisocyanate, and tolidine diisocyanate, α, α, α ′, α ′. -Aliphatic diisocyanates with aromatic rings such as tetramethylxylylene diisocyanate, aliphatic diisocyanates such as methylene diisocyanate, propylene diisocyanate, trimethylhexamethylene diisocyanate, hexamethylene diisocyanate, cyclohexane diisocyanate, methylcyclohexane diisocyanate, isophorone diisocyanate, dicyclohexyl methane Isocyanates, alicyclic diisocyanates such as isopropylidene dicyclohexyl diisocyanates. These may be used alone or in combination.

  In the present embodiment, the resin composition constituting the antistatic layer 3 may further contain a crosslinking agent in addition to the components (A) to (C). Examples of the crosslinking agent include carbodiimide crosslinking agents, oxazoline crosslinking agents, isocyanate crosslinking agents, epoxy crosslinking agents, melamine crosslinking agents, amine crosslinking agents, melamine crosslinking agents, and the like. These may be used alone or in combination.

  In one embodiment, the resin composition constituting the antistatic layer 3 may contain a release agent, a slipperiness imparting agent, a paint, and the like as long as the function of the obtained coating film is not impaired.

  The amount of the antistatic agent (A) in the resin composition forming the antistatic layer 3 is 5% by weight or more and 20% by weight or less, preferably 8% by weight or more and 18% by weight or more based on the total solid content of the resin composition. % Or less.

  The polyalkylene glycol (B) in the resin composition forming the antistatic layer 3 is 4% by weight or more and 10% by weight or less, preferably 5% by weight or more and 9% by weight, based on the entire solid content of the resin composition. It is as follows.

  The component (C) in the resin composition forming the antistatic layer 3 is 58% by weight or more and 87% by weight or less, preferably 70% by weight or more and 80% by weight or less, based on the entire solid content of the resin composition. is there.

The antistatic layer 3 is a coating film of the resin composition, and is provided on one surface of the base material layer 1 that is a polyester film. When a single-sided corona-treated film is used as the polyester film, the antistatic layer is provided on the non-corona-treated surface of the polyester film.
The antistatic layer 3 has a thickness of 0.02 μm to 0.2 μm, preferably 0.03 μm to 0.1 μm, and more preferably 0.03 μm to 0.08 μm. If the thickness of the antistatic layer 3 is less than 0.02 μm, substrate adhesion may not be obtained. On the other hand, if the thickness of the antistatic layer exceeds 0.2 μm, the antistatic layer 3 itself may be detached due to cohesive failure of the antistatic layer 3, which may cause a problem as a foreign matter. As will be described later, the antistatic layer 3 is usually coated with a solution in which various components constituting the antistatic layer 3 are dissolved or dispersed, or an emulsion of various components constituting the antistatic layer 3 is applied. However, when formed by a coating method, the thickness here is the thickness after drying.

  In a preferred embodiment, the sealant layer 2 is provided on the surface opposite to the surface on which the antistatic layer 3 is formed of the base material layer 1 which is a polyester film. When a single-sided corona-treated film is used as the polyester film, the sealant layer 2 is provided on the corona-treated surface of the polyester film. The sealant layer 2 has a heat sealing property with respect to the carrier tape 20 and is made of a thermoplastic resin exhibiting easy peelability that can be easily peeled off during use. For example, a polyethylene resin, an ethylene-vinyl acetate copolymer, ethylene -At least one resin selected from ethylene polymers such as ethyl acrylate copolymer and ethylene-butene-1 random copolymer, and styrene-butadiene copolymer, polystyrene, high-impact polystyrene, etc. A mixture of one or more resins selected from styrene polymers can be used. Among them, an ethylene methyl methacrylate copolymer, an acrylic-styrene copolymer blend, and a carboxyl group-containing acrylic are preferable in that the peel strength when the carrier tape 20 is heat sealed and peeled is continuously stable. The thickness of the sealant layer 2 is preferably 0.2 μm or more and 40 μm or less, and more preferably 0.3 μm or more and 30 μm or less. When the thickness of the sealant layer 2 is less than 0.2 μm, it is difficult to obtain sufficient peel strength at the time of heat sealing. On the other hand, when the thickness of the sealant layer 2 exceeds 40 μm, at the time of peeling due to the flow of the sealant layer at the time of heat sealing The occurrence of fibrous foreign matter is conceivable, which tends to cause restrictions on use.

  In one embodiment, the thickness of the cover tape 10 in which the sealant layer 2, the base material layer 1, and the antistatic layer 3 are laminated in this order is 25 μm or more and 200 μm or less, and preferably 30 μm or more and 150 μm or less. The width of the cover tape 10 is, for example, 2 mm or more and 100 mm or less, preferably 2 mm or more and 80 mm or less, and more preferably 2 mm or more and 50 mm or less.

  In this embodiment, the cover tape 10 can be manufactured using a manufacturing method generally used in this field. For example, the base material layer 1 and the sealant layer 2 are prepared, and a laminate is manufactured by a dry lamination or extrusion lamination method. Next, the antistatic layer 3 is applied to the surface of the laminate on the side of the base material layer 1 using, for example, a gravure coater, reverse coater, kiss coater, air knife coater, Mayer bar coater, dip coater or the like. In this coating, the above-described resin composition of the present invention is prepared in a varnish form, and this is applied to a laminate.

  Or the cover tape 10 of this embodiment melt-kneads the resin which comprises the sealant layer 2, and the resin which comprises the base material 1 using another single-screw or biaxial extruder, respectively, and both feed block Or a multi-manifold die is laminated and integrated, and then co-extruded by the T-die method or the inflation method to form a two-layer film comprising a sealant layer 2 and a substrate layer 1, and the substrate layer 1 side of this two-layer film Can be produced by a method of laminating the antistatic layer 3 by the dry laminating method or the extrusion laminating method.

In a preferred embodiment, the surface resistance value R1 of the antistatic layer 3 under 12% RH after 80 reciprocating frictions with a dry cloth is 10 ⁴ Ω or more and 10 ¹⁰ Ω or less. When the resin composition contains the above components, the antistatic layer 3 obtained from the resin composition adheres strongly to the polyester film. The surface resistance value under 12% RH after 80 reciprocating frictions with a dry cloth is an index of the adhesion of the antistatic layer 3 to the polyester film. If the surface resistance value R1 is in the above range, the electronic component package Adhesiveness to the extent that it can be used as 100 is guaranteed.

  As mentioned above, although embodiment of this invention was described, these are illustrations of this invention and can employ | adopt various structures other than the above.

The following was used for the binder resin as a component (C).
-Vinyl acetate-acrylic: Boncoat CF-2800 (manufactured by DiC)
Acrylic-styrene (1): Boncoat 5400EF (manufactured by DiC)
Acrylic-styrene (2): Aron NW-7060 (manufactured by Toa Gosei Co., Ltd.)
-Acrylic-silicon: Boncoat SA-6360 (manufactured by DiC)
Special propylene: Chemipearl XHP-400 (Mitsui Chemicals)
Polyester-acrylic-styrene copolymer: Polysol FP-3000A (manufactured by Showa Denko KK)
-Mixture of polyester and acrylic: Aron NS-1200 (1) (manufactured by Toa Gosei Co., Ltd.)
Acrylic acid: Aron A-104 (manufactured by Toa Gosei Co., Ltd.)
Polyester (1): Elitel KA5034 (manufactured by Unitika), molecular weight 8500
Polyester (2): Plus coat Z760 (manufactured by Kyoyo Chemical Co., Ltd.), molecular weight 3000
Acrylic-urethane: Boncoat CG-5010EF (manufactured by DiC)

The following were used for the polyalkylene glycol as a component (B).
Polyalkylene glycol: WI-115 (manufactured by NOF Corporation)

The following was used as a crosslinking agent.
-Carbodiimide: Carbolite V02-L2 (Nisshinbo Co., Ltd.)
Oxazoline: Epocross E-20308 (manufactured by Nippon Shokubai Co., Ltd.)

(Examples 1-8 and Comparative Examples 1-9)
[Preparation of coating solution (antistatic layer-forming composition)]
First, conductive assistant (Wako Pure Chemical Industries, Ltd .: ethylene glycol) 2 parts by weight, pH adjuster (Wako Pure Chemical Industries, Ltd .: triethylamine) 0.09 parts by weight, antistatic agent (Soken Chemicals: Verazol WED-SM) ) In addition to 10 parts by weight, a coating solution was prepared by mixing a binder resin, a 50% IPA aqueous solution, a surfactant, and a crosslinking agent so as to have the compositions shown in Tables 1 and 2.
The binder resin was adjusted to a solid content of 25 wt%, and the surfactant was adjusted to a solid content of 2 wt% in advance.
[Production of cover tape]
Next, on the polyethylene surface subjected to the corona treatment of the substrate layer obtained above, the coating solution is wet coated using a bar coat (RK Print Coat Instruments, K202 Control Coater Bar # 2) with a wet coating amount of 4 g / It was applied at m ^{2 and} dried at 100 ° C. for 1 minute to obtain a cover tape with a sealant layer.

The obtained cover tape was evaluated for the following items. The evaluation results are shown in Tables 1 and 2.
(Surface resistance before friction)
The surface resistance value was measured using a surface resistance measuring device manufactured by SIMCO. If the surface resistance value is less than 10 ¹⁰ Ω, it can be suitably used as a cover tape for an electronic component housing.
(Surface resistance after friction)
A dry cloth (Asahi Kasei Co., Ltd .: Bencott 3M) is attached to a 63 mm square surface using a Gakushin type abrasion tester (manufactured by Shinto Kagaku Co., Ltd .: TYPE-HEIDON-14DK), load 500 g, speed 6000 mm / speed. The surface resistance value (surface resistance value after friction) after rubbing the surface of the base surface of the cover tape with a dry cloth at min and runout width of 80 mm for 80 reciprocations (surface resistance value after friction) (SIMCO ST) -3) was used in a 23 ° C. 12% RH environment. If the surface resistance value after friction is 10 ⁴ Ω or more and 10 ¹⁰ Ω or less, it can be considered that the adhesion between the polyester film and the antistatic layer is maintained.

The antistatic layer of the cover tape of the example has a surface resistance value after friction in the range of 10 ⁴ Ω to 10 ⁹ Ω, and it can be evaluated that the antistatic layer is strongly adhered to the polyester film.
On the other hand, the surface resistance value after friction of the antistatic layer of the comparative example is in the range of 10 ¹⁰ Ω or more, which is considered that the antistatic layer is peeled off by friction.

DESCRIPTION OF SYMBOLS 1 Base material layer 2 Sealant layer 3 Antistatic layer 10 Cover tape for electronic component packaging (cover tape)
10a Cover tape surface (antistatic layer surface)
20 Carrier tape 20a Bottom surface 21 of carrier tape Pocket 100 Electronic component package

Claims (4)

Polyester film,
An antistatic layer provided on at least one side of the polyester film, and a cover tape comprising:
The antistatic layer is
(A) an antistatic agent;
(B) a polyalkylene glycol represented by the following formula (1);
(C) It is a coating layer made of a resin composition, including a polyurethane resin whose polyester component is made of polyester polyol, or a polyester resin, or a binder resin made of a combination thereof.
Cover tape.

(In Formula (1), EO represents an oxyethylene group, AO represents an oxyalkylene group having 3 to 4 carbon atoms, a and b are each independently 2 to 100, and a + b is 10 to 100. Yes, m is 10 to 100, R1 is a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an acyl group having 1 to 4 carbon atoms,-(EO) _a- (AO) _m- (EO) _b- is a block copolymer structure composed of EO and AO.)   The cover tape according to claim 1, wherein (C) is a polyester resin, and the polyester resin has a molecular weight of 5000 to 25000. The cover tape according to claim 1 or 2, wherein the antistatic layer has a surface resistance value R1 of 10 ⁴ Ω or more and 10 ⁹ Ω or less under 12% RH after 80 reciprocating frictions with a dry cloth. A carrier tape containing electronic components;
A cover tape according to any one of claims 1 to 3, wherein a sealant layer is bonded to the carrier tape so as to seal the electronic component.

Images