JP2019199051A - Lattice structure and body - Google Patents

Abstract

To provide a three-dimensional structure, capable of being easily manufactured, and having different properties depending on locations.SOLUTION: A lattice structure has a first lattice having a three-dimensional lattice structure of a first pitch, and a second lattice having a three-dimensional lattice structure of a second pitch different from the first pitch. The first lattice and the second lattice can be lattices having octahedron as repeating sequences for example. The second pitch can be 1/2 of the first pitch for example. Such lattice structure can be easily manufactured by using a 3D printer.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a lattice structure and a housing.

  As electronic devices become more sophisticated and smaller and lighter, how to ensure the reliability of the devices is an important issue. For example, efficient heat dissipation of a heat generating member such as a semiconductor element is important for ensuring the reliability of the device. However, if a block heat sink or the like is used for heat dissipation, it is difficult to reduce the size and weight.

  On the other hand, in addition to manufacturing methods such as cutting and molding that have been used for a long time, additive shaping methods have been developed in recent years. In additive modeling, generally, three-dimensional CAD (Computer Aided Design) data is divided into layers, and for each divided layer, a material is added so that the layers are stacked on top of each other to produce a three-dimensional structure. Such an additive molding method is defined as Additive Manufacturing in the international standard. This manufacturing method invented in the 1980's is generally called a 3D printer (3D printer). In recent years, 3D printers are attracting attention as a new manufacturing method because they can easily manufacture complex shapes without using a mold if there is 3D CAD data.

  In 3D printers, shapes that were once difficult to manufacture, such as mesh shapes and porous shapes, can be easily and accurately manufactured, unlike removal processing by cutting and molding processing in which a material is poured into a mold and hardened. There are various methods for 3D printers. For example, in the powder sintering lamination method, the powder material is spread one layer at a time on the entire modeling stage, and a predetermined portion corresponding to each layer is irradiated with a laser or the like to apply the powder material. Melt and integrate. By repeating this, the desired shaped product can be obtained. In the powder sintering lamination method, not only a resin but also a metal can be used as a material. When metal modeling is used, it is possible to reduce the size and weight of electronic devices.

  For example, Patent Document 1 discloses a three-dimensional structural component having a base and a three-dimensional lattice structure provided integrally with the base. By adopting such a structure, the weight can be reduced while maintaining the rigidity.

Japanese Patent Laying-Open No. 2015-093461

  However, in the technique of Patent Document 1, for example, properties such as thermal conductivity cannot be changed for each place. For example, in a housing of an electronic device, it is necessary to promote heat dissipation by increasing the thermal conductivity at a contact portion with a semiconductor element that generates a large amount of heat. On the other hand, it is desirable that the thermal conductivity be low in a portion that comes into contact with a heat-sensitive component such as a sensing device in order not to transmit heat generated in a semiconductor element or the like. In the technique of Patent Document 1, there is a problem that it is not possible to manufacture a case having different properties for each place so as to meet such a demand.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a three-dimensional structure that can be easily manufactured and has different properties for each place.

  In order to solve the above problems, the lattice structure of the present invention has a first lattice having a three-dimensional lattice structure having a first pitch and a three-dimensional lattice structure having a second pitch different from the first pitch. And a second lattice.

  An effect of the present invention is that a three-dimensional structure that can be easily manufactured and has different properties for each place can be provided.

It is a side view which shows the lattice structure of 1st Embodiment. It is a perspective view which shows a part of lattice structure of 1st Embodiment. It is a side view which shows the lattice structure of 2nd Embodiment. It is a side view which shows the lattice structure of 3rd Embodiment. It is a side view which shows another lattice structure of 3rd Embodiment. It is a side view which shows the lattice structure of 4th Embodiment. It is a side view which shows the lattice structure of the 1st modification of 4th Embodiment. It is a side view which shows the lattice structure of the 2nd modification of 4th Embodiment. It is a side view which shows the lattice structure of the 3rd modification of 4th Embodiment. It is a side view which shows the lattice structure of the 4th modification of 4th Embodiment. It is a side view which shows the lattice structure of the 5th modification of 4th Embodiment. It is a top view which shows the example of the lattice element of 5th Embodiment. It is sectional drawing which shows an example of the housing | casing of 6th Embodiment. It is a top view which shows an example of the electronic device of 6th Embodiment. It is sectional drawing which shows an example of the electronic device of 6th Embodiment. It is sectional drawing which shows an example of the lattice structure of the electronic device of 6th Embodiment. It is a top view which shows another example of the electronic device of 6th Embodiment. It is sectional drawing which shows another example of the lattice structure of the electronic device of 6th Embodiment. It is sectional drawing which shows an example of the electronic device of 7th Embodiment. It is sectional drawing which shows an example of the electronic device of 9th Embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, the preferred embodiments described below are technically preferable for carrying out the present invention, but the scope of the invention is not limited to the following. In addition, the same number is attached | subjected to the same component of each drawing, and description may be abbreviate | omitted.

(First embodiment)
FIG. 1 is a side view showing the lattice structure of the first embodiment. The lattice structure 1 includes a first lattice 10 having a three-dimensional lattice structure having a first pitch and a second lattice 20 having a three-dimensional lattice structure having a second pitch different from the first pitch. ing.

  FIG. 2 is a perspective view showing a connecting portion between the first lattice 1 and the second lattice 2 in the lattice structure of FIG. At the lattice points a and b at which the pitch is switched, the first lattice 1 and the second lattice 2 share the lattice points. Here, both the first lattice 10 and the second lattice 20 show examples of a lattice (the same shape as a body-centered cubic lattice) in which octahedrons are repeatedly arranged. Further, the second pitch is set to ½ of the first pitch. Thus, when the second pitch is ½ of the first pitch, the first lattice 10 and the second lattice 20 can be connected without distortion. However, the present embodiment is not limited to this example, and other lattice structures and other ratios may be used. Such a lattice structure can be easily manufactured by using a 3D printer.

  Note that the first element 11 constituting the tenth lattice and the second element 21 constituting the second lattice 20 may be made of the same material or different materials. However, when the materials are different, it is necessary to make a combination that can secure the adhesive strength between the two.

  In addition, the above “element” refers to a side connecting a lattice point and an adjacent lattice point, and may be referred to as “side” in the following description.

  As described above, according to the present embodiment, it is possible to easily configure a lattice structure having different properties depending on places.

(Second Embodiment)
FIG. 3 is a side view showing the lattice structure of the second embodiment. Similar to the first embodiment, the lattice structure of the present embodiment includes a first lattice 30 having a three-dimensional lattice structure with a first pitch, and a three-dimensional lattice having a second pitch different from the first pitch. And a second lattice 40 having a structure. In FIG. 3, the first lattice 30 and the second lattice 40 are both simple square lattices. As shown in FIG. 3, even if the lattice structure is different from that of the first embodiment, a lattice structure having different properties depending on the location can be easily configured.

(Third embodiment)
FIG. 4 is a side view showing the lattice structure of the third embodiment. Similar to the first embodiment, the lattice structure of the present embodiment includes a first lattice 50 having a three-dimensional lattice structure having a first pitch, and a three-dimensional lattice having a second pitch different from the first pitch. And a second lattice 60 having a structure. In addition, an additional element 52 and an additional element 62 different from the respective repeating structures are provided at the boundary between the first lattice 50 and the second lattice 60.

  As shown in FIG. 4, the plurality of additional elements 52 and additional elements 62 are arranged to face a specific direction. Note that the specific direction is not particularly limited as long as it is a fixed direction, and may be an arbitrary direction according to the structure of the first lattice 50 and the second lattice 60. By providing the additional elements 52 and 62 facing in a specific direction as described above, the strength of the boundary portion can be increased.

  The materials of the first element 51 and the second element are not particularly limited. However, for example, a metal such as stainless steel, aluminum, titanium, or copper can be used when it is desired to add a heat dissipation function. Moreover, the cross section of the 1st element 51, the 2nd element 61, the additional element 52, and the additional element 62 can be made into a circle, a rectangle, a polygon, etc., for example.

  FIG. 5 is a side view showing an example of another lattice structure 4 of the present embodiment. In the lattice structure 4, as in the second embodiment, the first lattice 70 and the second lattice 80 are both simple square lattices. In addition, an additional element 72 different from each of the repeating structures is provided at the boundary between the first lattice 70 and the second lattice 80.

  The plurality of additional elements 72 face one specific direction. By providing this additional element 72, the strength of the boundary between the first lattice 70 and the second lattice 80 can be increased.

(Fourth embodiment)
FIG. 6 is a side view showing the lattice structure 100 of the fourth embodiment. The lattice structure 100 includes a first lattice 110 having a three-dimensional lattice structure having a first pitch, and a second lattice having a three-dimensional lattice structure having a second pitch connected to the first lattice and different from the first pitch. The lattice 120 is provided. Further, a third lattice 130 having a three-dimensional lattice structure with a third pitch different from the second pitch connected to the second lattice is provided. Here, it is assumed that the first, second, and third lattices 110, 120, and 130 form a lattice in which octahedrons are repeatedly arranged, for example. With this configuration, the first lattice 110 and the second lattice 120 can share a lattice point at the boundary. The second lattice 120 and the third lattice 130 also share a lattice point at the boundary.

  In the example of FIG. 6, the second pitch is 1/2 of the first pitch, and the third pitch is 1/2 of the second pitch. That is, the third pitch is 1/4 of the first pitch. In terms of manufacturing technology, there is no difficulty in producing a structure in which the second lattice 120 is omitted and the third lattice 130 is connected to the first lattice 110. However, by sandwiching an intermediate pitch lattice between the two, stress concentration at the boundary surface of different lattices can be reduced.

  The difference between the properties of the first lattice 110 and the third lattice 130, for example, the thermal conductivity, is larger than the difference between the properties of the first lattice 110 and the second lattice 120. Therefore, by adopting a structure in which a lattice having an intermediate pitch is sandwiched as shown in FIG. 6, the property depending on the location can be greatly changed while maintaining the strength.

  FIG. 7 is a side view showing a modification of the configuration of FIG. The lattice structure 101 in FIG. 7 includes an additional element 112 and an additional element 122 at the boundary between the first lattice 110 and the second lattice 120. The plurality of additional elements 112 and the additional elements 122 face the same specific direction (upward in FIG. 7). By providing these additional elements, the strength at the boundary of the lattice can be increased.

  FIG. 8 is a side view showing another modification of the configuration of FIG. The lattice structure 200 of FIG. 8 includes a plurality of second lattices 220 between the first lattice 210 and the third lattice second. For example, the pitch of the second lattice 220 may be ½ of the pitch of the first lattice 210. Further, the pitch of the third lattice 230 can be set to ½ of the pitch of the second lattice 220, for example. As described above, the second lattice 220 serving as the intermediate layer may have a three-dimensional three-dimensional lattice structure.

  FIG. 9 is a side view showing a modification of FIG. The lattice structure 201 of FIG. 9 has an additional element 212 and an additional element 222 at the boundary between the first lattice 210 and the second lattice 220. The plurality of additional elements 212 and 222 face one specific direction. With this configuration, the strength of the boundary between the first lattice 210 and the second lattice 220 can be increased. The lattice structure 201 includes an additional element 223 and an additional element 232 at the boundary between the second lattice 220 and the third lattice 230. The plurality of additional elements 223 and 232 face one specific direction. With this configuration, the strength of the boundary portion between the second lattice 220 and the third lattice 230 can be increased.

  Furthermore, a modified example will be described. FIG. 10 is a side view showing an example in which the lattice is a square lattice. The lattice structure 300 includes a first lattice 310 composed of a square lattice with a first pitch, a second lattice 320 connected to the first lattice 310, and a third lattice 330 connected to the second lattice 320. have. The second lattice 320 is a square lattice whose pitch is ½ of the first pitch, and the third lattice 330 is a square lattice whose pitch is ¼ of the first pitch.

  The lattice structure 300 of FIG. 10 includes an additional element 312 and an additional element 322 at the boundary between the first lattice 310 and the second lattice 320. The plurality of additional elements 312 and 322 face one specific direction. With this configuration, the strength of the boundary between the first lattice 310 and the second lattice 320 can be increased.

  FIG. 11 is a side view showing a modified lattice structure 301 of the lattice structure 300 of FIG. In the lattice structure 301, the second lattice has a square lattice of a plurality of stages. An additional element 312 is provided at the boundary between the first lattice 310 and the second lattice 320. The plurality of additional elements 312 are directed in one specific direction. Further, an additional element 322 is provided at the boundary between the second lattice 320 and the third lattice 330. With this configuration, the strength of the boundary portion between the first lattice 310 and the second lattice 320 and the boundary portion between the second lattice 320 and the third lattice 330 is increased.

  As described above, according to the present embodiment, by interposing a lattice having an intermediate pitch between lattices having different pitches, stress concentration can be reduced and the overall strength can be increased. .

(Fifth embodiment)
The diameter (thickness) of the linear lattice element in the first to fourth embodiments can be constant, but can also be a shape whose diameter changes midway. FIG. 12 is a plan view showing an example of element diameters. FIG. 12A shows a part of an octahedral lattice constituted by the first element 11a having a constant element diameter. FIG. 12B shows an example of the first element 11b in which the element diameter increases linearly from the lattice point toward the center. FIG. 12C shows an example of the first element 11c in which the diameter of the element is increased in an arc shape. The ratio of the diameters of the central portion and the end portion is not particularly limited, but can be about 1.5 to 2 times as an example. Thus, the strength of the lattice can be increased while the heat conduction from the end portion is suppressed by making the center portion thicker and the end portion thinner.

(Sixth embodiment)
When a 3D printer is used, the lattice structure described in the first to fifth embodiments and the block-like portion can be easily integrally formed. For this reason, it is possible to easily create a housing having a lattice structure. FIG. 13 is a cross-sectional view showing an example of such a housing. The housing 1000 includes a solid base portion 1100 that serves as a frame and a lattice structure 1200. The lattice structure 1200 is a first lattice 1210 having a large pitch at a portion in contact with the base portion 1100, and a second lattice having a smaller pitch than the first lattice 1210 on the inside. When the base portion 1100 and the lattice structure 1200 are formed of metal, in this cross section, the structure is such that heat is not easily transmitted between the base portion 1100 and the second lattice 1220. Control the properties such as thermal conductivity for each location of the housing by creating a block-shaped part and a lattice-shaped part as in this example, or changing the pitch in the lattice structure. Can do.

  FIG. 14 is a plan view showing an electronic device 10000 using the casing 1000 of FIG. A heat generating component 2100, a non-heat generating component 2200, and a non-heat generating component 2300 are mounted on the circuit board 2000, and the circuit board 2000 is mounted on the lattice structure 1200 of the housing 1000.

  FIG. 15 is a cross-sectional view showing a cross section taken along line AA ′ of FIG. A heat dissipation pad 2010 is formed on the back surface of the heat generating component 2100 of the circuit board 2000. A solid heat radiation column 1100a is formed at a portion corresponding to the heat radiation pad 2010 of the housing 1000, and the heat radiation pad 2010 and the heat radiation column 1100a are in contact with each other. A bottom portion and a side surface of the housing 1000 are solid base portions 1100. A lattice structure 1200 is formed between the heat radiation column 100 a and the base portion 1100.

  In the above configuration, the heat generated in the heat generating component 2100 is dissipated to the heat radiating column 1100 a and the base portion 1100 via the heat radiating pad 2010. On the other hand, the heat generating component 2100 and the heat radiation column 1100a and the non-heat generating components 2200 and 2300 are thermally insulated by the lattice structure 1200. For this reason, the heat of the heat generating component 2100 is not easily transmitted to the non-heat generating components 2200 and 2300. Thus, heat of the heat generating component can be efficiently dissipated while the non-heat generating component is thermally separated from the heat generating component. The heat generating component 2100 is, for example, a semiconductor processor, and the non-heat generating elements 2200, 2300 are, for example, sensing devices that have low heat resistance and are easily affected by vibrations.

  FIG. 16 is an enlarged cross-sectional view in the vicinity of the heat radiation column 1100a. In the example of FIG. 16, the portion of the lattice structure 1200 that contacts the heat dissipation column 1100 a and the base portion 1100 is a first lattice having a large pitch, and the inside is a second lattice having a small pitch. In this way, the non-heat-generating component 2300 can be reliably supported while suppressing heat transfer from the base portion 1100 to the non-heat-generating component 2300.

  FIG. 17 is a modification of the electronic device of FIG. A modified example of the electronic device 10001 uses a housing 1101. The housing 1101 includes a base plate 1100b in a portion corresponding to the non-heat generating components 2200 and 2300 in addition to the configuration of FIG. In the 3D printer, the block-shaped base plate 1100b integrated with the lattice structure 1200 can be easily created. By using the base plate 1100b, the non-heat generating components 2200 and 2300 can be supported more firmly.

  18 is an enlarged cross-sectional view showing an example of the vicinity of the heat dissipation column 1100a of FIG. In this example, a first lattice having a large pitch is provided in a portion of the lattice structure 1200 that contacts the heat dissipation column 1100a, a portion that contacts the base portion 1100, and a portion that contacts the base plate 1100b. With this configuration, heat generated in the heat generating component 2100 is prevented from being transmitted to the non-heat generating components 2200 and 2300. Further, by providing the additional element 1211 at the boundary between the first lattice and the second lattice, the first lattice having a large pitch is reinforced against vibration in the vertical direction.

  It is also possible to create only a lattice structure with a 3D printer and paste the lattice structure to a separately created frame to produce a housing. The material of the lattice structure at that time may be different from that of the frame.

(Seventh embodiment)
FIG. 19 is a cross-sectional view illustrating an electronic apparatus 10002 according to the seventh embodiment. An electronic device 10002 is different from the sixth embodiment in a housing 1102. The housing 1002 includes a vent 1100 c in addition to the structure of the housing 1001. By sending the cooling air 3000 from the vent 1100c to the lattice structure 1200, the heat of the heat generating component 2100 can be dissipated more efficiently.

(Eighth embodiment)
Among the various 3D printer methods, there is laser metal deposition (Laser Metal Deposition), which is being developed recently in national projects. In laser metal deposition, a metal powder is sprayed from a nozzle onto a portion where the metal powder is to be laminated, and is laminated by irradiating a laser. This method has a feature that different materials can be easily stacked by changing the material sprayed from the nozzle.

  When this method is used, in the production of the lattice structure described in the third to sixth embodiments, the elements constituting the lattice main body and the additional elements can be made of different materials. For example, a light-weight material is used for the elements that occupy most of the volume of the lattice, and a light-weight, high-strength, good heat-insulating lattice structure is created by making the additional elements materials with high strength and low thermal conductivity. It becomes possible to do. As a lightweight material, for example, a plastic material such as nylon, polyphenylene sulfide, polyether ether ketone, or the like can be used. Further, a predetermined amount of glass or the like may be added to these materials. For example, a metal having a high thermal conductivity can be used for the base portion and the heat radiation column. As the metal, for example, stainless steel, aluminum, titanium, copper or the like can be used.

  As described above, according to the present embodiment, the performance of the housing can be improved by using different materials for each part.

(Ninth embodiment)
The electronic device using the housing having the lattice structure described in the sixth and seventh embodiments can be manufactured using a lattice structure having a uniform pitch. FIG. 20 is a cross-sectional view illustrating an electronic device 10003 using a housing 1003 having a lattice structure 1201 having a uniform pitch. The casing 1003 is inferior to the casings of the sixth and seventh embodiments in the contrast between heat transfer and heat insulation, but it is easy to create data for a 3D printer and can be manufactured in a short time.

  The present invention has been described above using the above-described embodiment as an exemplary example. However, the present invention is not limited to the above embodiment. That is, the present invention can apply various modes that can be understood by those skilled in the art within the scope of the present invention.

1, 2, 3, 4, 1200 Lattice structure 10, 30, 50, 70, 110 First lattice 11 First element 20, 40, 60, 80, 120 Second lattice 21 Second element 52, 62 72 Additional element 130 Third lattice 1000 Housing 1100 Base portion 1100a Heat radiation column 2000 Circuit board 2100 Heating component 10000 Electronic device

Claims (10)

A first lattice having a three-dimensional lattice structure of a first pitch;
A lattice structure comprising: a second lattice connected to the first lattice and having a three-dimensional lattice structure having a second pitch different from the first pitch. The lattice structure according to claim 1, wherein a pitch of the second lattice is ½ of a pitch of the first lattice. 3. The third lattice according to claim 1, further comprising a third lattice connected to the second lattice and having a three-dimensional lattice structure having a third pitch different from the second pitch. 4. Lattice structure. The lattice structure according to claim 3, wherein the third pitch is ½ of the second pitch. 5. The lattice structure according to claim 3, wherein the second lattice and the third lattice share a lattice point at a boundary between both. The lattice structure according to any one of claims 1 to 5, wherein the first lattice and the second lattice share a lattice point at a boundary between the first lattice and the second lattice. At least one of the second lattice and the third lattice is
The lattice structure according to any one of claims 3 to 5, further comprising a plurality of additional elements that are added to the three-dimensional lattice structure at a boundary between the two and directed in a certain direction. At least one of the first lattice and the second lattice is
The lattice structure according to any one of claims 1 to 7, further comprising a plurality of additional elements that are added to the three-dimensional lattice structure at a boundary between the two and directed in a certain direction. The lattice structure according to any one of claims 1 to 8,
And a solid base part integrally formed with the lattice structure. Forming a first lattice having a three-dimensional lattice structure of a first pitch;
A method for producing a lattice structure, comprising: forming a second lattice that is connected to the first lattice and has a three-dimensional lattice structure having a second pitch different from the first pitch.

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