JP2019196531A - Production method, inspection method, production method and program - Google Patents

Abstract

To provide a method of determining whether there is a formation state of a structure formed by melting and solidifying particles in a powder layer, for example, a nest, in a device for producing a three-dimensional laminate by irradiating a powder layer made of a metal material or the like with an electron beam, separately from a radiation thermometer that measures a surface temperature of molten and solidified particles in the powder layer.SOLUTION: A production device for producing a three-dimensional molded object includes: a cross-section formation part for forming a structure of a cross-section part of a three-dimensional molded object by using a powder material; a measurement part for measuring a measurement value corresponding to an eddy current flowing to the structure formed by the cross-section formation part; and a determination part for determining a formation state of the structure corresponding to the result of measurement by the measurement part. The cross-section formation part forms a structure by irradiating a powder layer including the powder material with a beam.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a manufacturing apparatus, an inspection method, a manufacturing method, and a program.

In a three-dimensional additive manufacturing apparatus that melts and solidifies a powder layer made of a metal material by irradiating an electron beam, a technique for detecting the surface temperature of the powder layer with a radiation thermometer during the irradiation of the electron beam is known. (For example, see Patent Document 1).
[Prior art documents]
[Patent Literature]
[Patent Document 1] US Pat. No. 7,454,262

  However, the above technique can detect the surface temperature of particles melted and solidified in the powder layer, but can determine the formation state of the structure formed by melting and solidifying particles in the powder layer, such as the presence or absence of nests. I couldn't.

  In one aspect of the present invention, a manufacturing apparatus for manufacturing a three-dimensional structure is formed by a cross-section forming section that forms a structure of a cross-sectional portion of a three-dimensional structure using a powder material, and a cross-section forming section. A manufacturing apparatus is provided that includes a measurement unit that measures a measurement value corresponding to an eddy current flowing through the structure, and a determination unit that determines a formation state of the structure according to a measurement result by the measurement unit.

  In one aspect of the present invention, there is provided an inspection method for inspecting a structure of a cross-sectional portion of a three-dimensional structure, and a cross-section forming stage in which a structure is formed using a powder material, and a structure formed in the cross-section forming stage. There is provided an inspection method including a measurement stage for measuring a measurement value according to a flowing eddy current, and a determination stage for determining a formation state of a structure according to a measurement result in the measurement stage.

  In one aspect of the present invention, a manufacturing method for manufacturing a three-dimensional structure is formed in a cross-section forming stage in which a structure of a cross-sectional portion of the three-dimensional structure is formed using a powder material, and in a cross-section forming stage. The measurement stage for measuring the measured value according to the eddy current flowing in the structure, the determination stage for determining the formation state of the structure according to the measurement result in the measurement stage, and the determination stage that the formation state is not good In some cases, a manufacturing method is provided comprising repairing the structure.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

It is a schematic diagram of the manufacturing apparatus 100 by 1st Embodiment. It is a schematic diagram of the measurement part 60 by 1st Embodiment. It is an exemplary graph for judging the formation state of the section structure of three-dimensional structure 36 by a 1st embodiment by the representative point in the surface of a section structure. It is a flowchart of the manufacturing method of the three-dimensional structure 36 by 1st Embodiment. It is an exemplary graph for determining the formation state of the cross-sectional structure of the three-dimensional structure 36 according to the second embodiment by performing a coil search on the surface of the cross-sectional structure. It is a schematic diagram of the measurement part 61 by 3rd Embodiment. It is an exemplary graph for determining the formation state of the cross-sectional structure of the three-dimensional structure 36 according to the third embodiment at a plurality of points on the surface of the cross-sectional structure. It is a schematic diagram of the manufacturing apparatus 101 by 4th Embodiment. It is a schematic diagram of the 2nd measurement part 70 by 4th Embodiment. The graph which shows the example of the relationship between the irradiation time which irradiates the electron beam EB to the specific position in the surface of the powder layer according to 4th Embodiment, and the intensity difference of the detection signal by the several electron detector arrange | positioned in a different direction It is. And FIG. 11 is a diagram illustrating an example of a computer 1200 in which aspects of the present invention may be embodied in whole or in part.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention. In the drawings, the same or similar parts are denoted by the same reference numerals, and redundant description may be omitted.

  FIG. 1 is a schematic view of a manufacturing apparatus 100 according to the first embodiment. In FIG. 1, an X axis whose right direction is the + X direction toward the paper surface, a Z axis whose upward direction is the + Z direction toward the paper surface, and a Y axis whose depth direction is the + Y direction toward the paper surface are They are shown as orthogonal to each other. Hereinafter, these three axes may be used for explanation.

  The manufacturing apparatus 100 deposits the powder 31 to form a powder layer, melts the powder 31 by irradiating the electron beam EB with the powder layer preheated, and forms the powder layer and the powder. The three-dimensional structure 36 is manufactured by repeating the melting of 31. The manufacturing apparatus 100 further inspects the formation state of the three-dimensional structure 36 by applying an alternating magnetic field when the powder 31 is in at least one of a pre-sintered state and a sintered state.

  As used herein, the sintered state refers to a state in which the powders 31 are completely bonded and solidified by melting, and the presintered state is incomplete to each other due to the melting of the powder 31 compared to the sintered state. Refers to the combined state. Adjacent powders 31 are electrically connected to each other by being pre-sintered. Therefore, the electrical resistance of the powder 31 in the presintered state is significantly reduced as compared to the state before presintering. The strength of the electron beam EB is stronger when the powder 31 is put into a sintered state than when the powder 31 is put into a pre-sintered state. Is heated to a powder 31 in a sintered state. The manufacturing apparatus 100 suppresses the powder 31 irradiated with the high-intensity electron beam EB from being scattered due to charge-up by putting the powder 31 in a pre-sintered state, and the manufactured three-dimensional structure 36 is manufactured. Reduce the overall stress.

  The powder 31 is a conductive and non-magnetic powder material made of a metal material such as a titanium-based, chromium-based or nickel-based alloy or SUS, for example. Although the powder 31 may be a magnetic body, the formation state of the three-dimensional structure 36 is inspected by applying an alternating magnetic field to the three-dimensional structure 36 constituted by the powder 31 in a temporarily sintered state. A non-magnetic material that is not affected by a magnetic field is preferred.

  The manufacturing apparatus 100 includes a column unit 200, a modeling unit 300, a measurement unit 60, a control unit 400, and a storage unit 500. The column unit 200 and the modeling unit 300 use a powder material, and form a cross-sectional structure of the three-dimensional model 36 by irradiating the powder layer containing the powder material with a beam and sintering or presintering the powder layer. It is an example of a cross-section formation part. In the following description, the structure of the cross-sectional portion of the three-dimensional structure 36 may be simply referred to as a cross-sectional structure.

  The column unit 200 outputs an electron beam EB toward the inside of the modeling unit 300. The column unit 200 includes an electron source 12, an electron lens 13, and a deflector 14.

  The electron source 12 generates electrons by the action of heat or an electric field. The electron source 12 accelerates the generated electrons in a −Z direction in FIG. 1 with a predetermined acceleration voltage, for example, −60 KV, and outputs the electron beam EB.

  The electron lens 13 converges the electron beam EB output from the electron source 12 on the surface of the powder layer deposited inside the modeling unit 300. The electron lens 13 is, for example, a magnetic lens, and includes a coil disposed around the lens axis, and a yoke that surrounds the coil and has an axisymmetric gap with respect to the lens axis.

  The deflector 14 deflects the electron beam EB output from the electron source 12 and passed through the electron lens 13 to adjust the irradiation position in the X-axis direction and the Y-axis direction on the surface of the powder layer. The deflector 14 includes, for example, two sets of deflection coils facing the X-axis direction and the Y-axis direction with the lens axis of the above-described electron lens 13 interposed therebetween.

  The modeling unit 300 models the three-dimensional model 36. The modeling unit 300 is provided adjacent to the column unit 200, and the internal space of the modeling unit 300 communicates with the internal space of the column unit 200. The modeling unit 300 includes a powder supply unit 34, a stage 52, a side wall 53, a drive rod 55, a drive unit 54, an exhaust unit 56, and a heater 57.

  The powder supply unit 34 supplies and deposits the powder 31 in the space surrounded by the stage 52 and the side wall 53 on the stage 52, and the surface of the deposited powder 31 is scraped off to flatten the surface. Forming a powder layer. The formed powder layer is held in shape by the stage 52 and the side wall 53. In the powder layer formed by the powder supply unit 34, the portion irradiated with the electron beam EB is melted to form a cross-sectional structure of the three-dimensional structure 36, and the other portions are the three-dimensional structure 36. The powder 31 is deposited around the periphery. Note that the powder layer melted by irradiation with the electron beam EB is formed on the already stacked three-dimensional structure 36 when the already stacked three-dimensional structure 36 exists adjacent to the −Z-axis direction. Combined with the end face, the three-dimensional structure 36 is increased in the Z-axis direction.

  The stage 52 has a surface extending in the XY plane direction. On the surface in the + Z direction, the stage 52 loads the powder 31 supplied by the powder supply unit 34 thereon, and holds the powder layer in a state where the powder 31 is deposited. The side wall 53 is disposed around the stage 52 and holds the side surface of the powder layer on the stage 52.

  The drive rod 55 is connected to the back surface of the stage 52 in the −Z direction and supports the stage 52. The drive unit 54 supports the drive rod 55 and drives the drive rod 55 so that the drive rod 55 moves up and down in the Z-axis direction. The drive unit 54 drives the drive rod 55 to drive the stage 52 so that the stage 52 moves up and down in the Z-axis direction. When the powder supply unit 34 irradiates the powder layer formed on the stage 52 with the electron beam EB and forms a cross-sectional structure, the driving unit 54 moves the stage 52 by the thickness of the cross-sectional structure in the Z-axis direction. Lower in the Z direction.

  The exhaust unit 56 exhausts the internal space of the manufacturing apparatus 100 through which the electron beam EB passes, and adjusts the internal space to have a predetermined degree of vacuum. Thereby, the exhaust unit 56 suppresses energy loss due to the electron beam EB colliding with gas particles in the atmosphere.

  The heater 57 is disposed on the outer periphery of the side wall portion 53 and heats the powder layer formed on the stage 52 through the side wall portion 53. The heating of the powder layer by the heater 57 is so-called preheating, and the heating temperature of the heater 57 may be lower than the heating temperature by the electron beam EB.

  The measurement unit 60 induces an eddy current in the conductive cross-sectional structure formed by the column unit 200 and the modeling unit 300, and measures a measurement value corresponding to the eddy current flowing in the cross-sectional structure.

  The control unit 400 controls each configuration of the manufacturing apparatus 100. The control unit 400 controls the irradiation time, irradiation speed, and irradiation position of the electron beam EB by controlling the electron source 12, the electron lens 13, and the deflector 14 of the column unit 200. The control unit 400 further controls the modeling of the three-dimensional model 36 on the stage 52 by controlling the powder supply unit 34, the driving unit 54, and the heater 57 of the modeling unit 300. Further, the control unit 400 controls the measurement unit 60 to control measurement of a measured value that indirectly indicates the formation state of the cross-sectional structure. The control unit 400 performs sequence control of these configurations by referring to the storage unit 500.

  The control unit 400 further determines the formation state of the cross-sectional structure according to the measurement result by the measurement unit 60. The control unit 400 functions as an example of a determination unit.

  The storage unit 500 stores reference data for determining the formation state of the cross-sectional structure, a determination result of the formation state of the cross-sectional structure, a sequence and a program for controlling each configuration in the manufacturing apparatus 100, and the like. The storage unit 500 is referred to by the control unit 400.

  FIG. 2 is a schematic diagram of the measurement unit 60 according to the first embodiment. The measurement unit 60 includes a coil 63, a coil housing 62, an arm 64, a coil drive unit 65, an AC power supply unit 67, and a detection circuit unit 66.

  The coil 63 is, for example, an air-core coil that is formed by winding a wire or the like in a spiral shape and has no magnetic core. The coil housing 62 has a cylindrical shape and accommodates the coil 63 therein. The coil housing 62 is made of a material that can easily pass an alternating magnetic field generated from the coil 63. The arm 64 is attached to the main body portion of the measuring unit 60 so as to be able to advance and retract in the X-axis direction while supporting the coil housing 62.

  The coil driving unit 65 moves the coil 63 to a predetermined position facing the surface of the cross-sectional structure via the coil housing 62 and the arm 64. The coil drive unit 65 moves the coil 63 to a specific position in the XY plane by moving the arm 64 forward and backward in the X-axis direction and moving it in the Y-axis direction. The coil drive unit 65 moves the coil 63 in the XY plane so as to be close to the surface of the cross-sectional structure so that the alternating magnetic field generated from the coil 63 and the induced magnetic field caused by the eddy current flowing in the cross-sectional structure can be coupled to each other. The coil drive unit 65 is an example of an actuator.

  The AC power source 67 is electrically connected to the coil 63 via the coil housing 62 and the arm 64, and causes an AC current to flow through the coil 63. In the state where the coil 63 is opposed to the surface of the cross-sectional structure, the AC power supply unit 67 causes an alternating current to flow through the coil 63, generates an alternating magnetic field in the coil 63, and generates an eddy current in the cross-sectional structure facing the coil 63. Is generated.

  The detection circuit unit 66 is electrically connected to the coil 63 via the coil housing 62 and the arm 64, and detects a change in impedance of the coil 63. The detection circuit unit 66 is connected to the coil 63 in parallel with the AC power supply unit 67.

  The detection circuit unit 66 has an impedance of the coil 63 in a state where an induced voltage is generated by a magnetic flux generated by the eddy current by facing the surface of the cross-sectional structure in a state where the eddy current is generated. Detect changes. The magnitude of the change in impedance of the coil 63 depends on whether or not the cross-sectional structure is well formed, that is, the powder 31 is in a pre-sintered state or a sintered state by irradiation with the electron beam EB, and the electrical resistance is remarkably small. Depending on whether or not it is, it differs significantly. When the cross-sectional structure is well formed, the current value of the eddy current generated by the alternating magnetic field of the coil 63 is significantly larger than that when the cross-sectional structure is not well formed. The change in impedance of the coil 63 which is approximately proportional to the magnitude of the coil 63 is significantly large.

  The detection circuit unit 66 may include, for example, a bridge circuit and an amplification circuit that are suitable for detecting a change in the impedance of the coil 63. In this case, as a pretreatment, an eddy current is generated on the surface of the cross-sectional structure in a good formation state, the impedance of the variable resistor of the bridge circuit is changed, the bridge circuit is balanced, and the current from the bridge circuit to the amplifier circuit is changed. Make sure that does not flow. When a bridge circuit that has been subjected to such processing in advance is used to generate an eddy current in a cross-sectional structure that is not well formed and a change in the impedance of the coil 63 is detected, the balance of the bridge is lost and amplification is performed. Current flows in the circuit. As described above, the detection circuit unit 66 can detect a cross-sectional structure in which the formation state is not good and distinguish it from a cross-sectional structure in which the formation state is good.

  As described above, the measurement unit 60 in the present embodiment induces eddy currents in the structure of the cross-sectional portion of the three-dimensional structure 36, and measures the impedance of the coil 63 as a measurement value corresponding to the eddy currents. As shown in FIG. 2, the measurement unit 60 in the present embodiment employs a self-induction method in which excitation and detection are performed by the same coil for reasons such as ease of equipment. Instead, the measurement unit 60 may use a mutual induction method in which excitation and detection are performed by different coils.

  FIG. 3 is an exemplary graph for determining the formation state of the cross-sectional structure of the three-dimensional structure 36 according to the first embodiment with the representative points on the surface of the cross-sectional structure. The horizontal axis of the graph is time [t], and the vertical axis is impedance [Ω].

On the graph, as a reference value according to the impedance change Z and the amplitude Z _amp of the coil 63 as a measurement value according to the eddy current flowing through the cross-sectional structure, and the eddy current flowing through the structure having a good formation state Impedance change Ref. Z and its amplitude Ref. Z _amp is shown. The structure having a good formation state referred to here is, for example, a structure formed based on the same shape data as the cross-sectional structure.

The control unit 400 uses the Z amplitude Z _amp as the measurement value and the Ref. Z amplitude Ref. The formation state of the cross-sectional structure is determined based on the result of comparison with Z _amp . As an example, the control unit 400 uses the Ref. A difference ΔZ between Z _amp and Z _amp is calculated, and it is determined whether or not the difference ΔZ is larger than a predetermined threshold value. When determining that the difference ΔZ is larger than the threshold value, the control unit 400 determines that the cross-sectional structure is not well formed. Further, the control unit 400 considers the determination result of the formation state at a predetermined representative point on the surface of the cross-sectional structure as the determination result of the formation state on the entire surface of the cross-sectional structure. Thereby, the manufacturing apparatus 100 can not only inspect the formation state of the cross-sectional structure of the three-dimensional structure 36 and appropriately repair it, but also the manufacturing time of the three-dimensional structure 36 compared with the case where the cross-sectional structure is inspected completely. Can be shortened.

  FIG. 4 is a flowchart of the manufacturing method of the three-dimensional structure 36 according to the first embodiment. The manufacturing method includes an inspection method for inspecting the cross-sectional structure of the three-dimensional structure 36. The description of the flow in FIG. 4 starts when the user performs an input to start manufacturing the three-dimensional structure 36 with respect to the manufacturing apparatus 100, for example.

  First, the control unit 400 controls the column unit 200 and the modeling unit 300 to execute the following steps S101 to S103 in order to form a cross-sectional structure of the three-dimensional model 36 using the powder material. In step S <b> 101, the powder supply unit 34 supplies the powder 31 onto the stage 52, and planarizes by scraping to form a powder layer on the stage 52. In step S102, the heater 57 preheats the powder layer.

  In step S103, the column unit 200 irradiates the surface of the powder layer with the electron beam EB output from the electron source 12. Of the powder layer formed by the powder supply unit 34, the portion irradiated with the electron beam EB is melted to form a cross-sectional structure, and the other portions remain as powder 31 around the cross-sectional structure.

  Next, the control unit 400 controls the measurement unit 60 to execute the following steps S105 to S109 in order to measure a measurement value corresponding to the eddy current flowing in the cross-sectional structure. In step S105, the coil drive unit 65 drives the arm 64 to move the coil 63 to a specific position in the XY plane, for example, a position facing a representative point on the surface of the cross-sectional structure.

  In step S107, the AC power supply unit 67 supplies an AC current to the coil 63 at a specific position. Thereby, the measurement unit 60 generates an alternating magnetic field from the coil 63 and induces an eddy current at a representative point on the surface of the cross-sectional structure facing the coil 63.

  In step S109, the measurement unit 60 measures the impedance of the coil 63 in a state where an induced voltage is generated by the induced magnetic field generated by the eddy current. More specifically, the detection circuit unit 66 of the measurement unit 60 detects a change in impedance of the coil 63.

  Next, the control unit 400 determines the formation state of the cross-sectional structure according to the measurement result by the measurement unit 60. If the formation state is not good, the following steps S111 to S115 are executed to repair the cross-sectional structure. To do. In step S <b> 111, the control unit 400 determines the formation state of the cross-sectional structure based on the data indicating the change in impedance of the coil 63 input from the detection circuit unit 66 of the measurement unit 60. The control unit 400 determines the formation state of the cross-sectional structure based on the result of comparing the data input from the detection circuit unit 66 and the reference data corresponding to the eddy current flowing in the structure having a good formation state.

  In step S113, when the control unit 400 determines that the formation state of the cross-sectional structure is good (S113: YES), the flow ends. When the control unit 400 determines in step S113 that the formation state of the cross-sectional structure is not good (S113: NO), the process proceeds to step S115, where the control unit 400 executes the cross-sectional structure repair process, and The flow ends.

  As an example of the repair process in step S115, the control unit 400 controls the column unit 200, so that the electron beam EB with increased output intensity is re-applied to the entire surface of the cross-sectional structure that is determined to be in a poor formation state. Irradiation ensures that the entire cross-sectional structure is in a pre-sintered state or a sintered state.

  The flow shown in FIG. 4 is repeated until the entire three-dimensional structure 36 in the pre-sintered state or the sintered state is formed. When the modeled three-dimensional structure 36 is in a temporarily sintered state, the control unit 400 controls the column unit 200 to generate an electron beam EB having a higher output intensity than the electron beam EB for temporary sintering, for example. By irradiating the three-dimensional structure 36, the pre-sintered three-dimensional structure 36 is brought into a sintered state.

  In the flow shown in FIG. 4, each time the manufacturing apparatus 100 forms a powder layer and irradiates the electron beam EB to form a cross-sectional structure, the coil 63 relates to some representative points on the surface of the cross-sectional structure. It has been described that the impedance of the film is measured to determine the formation state of the cross-sectional structure. Further, the manufacturing apparatus 100 has been described as performing the repair process before forming the next powder layer when it is determined that the formation state of the cross-sectional structure is not good by the determination. In this way, the manufacturing apparatus 100 may inspect the formation state every time one layer of the cross-sectional structure is formed. Instead, the cross-sectional structure may be subjected to repair processing for each of a plurality of layers, for example. If the cross-sectional structure is inspected every two or three layers and it is determined that the cross-sectional structure is not good, a plurality of layers may be repaired together. In this case, the manufacturing apparatus 100 may increase the intensity of the electron beam EB so that the electron beam EB penetrates to a cross-sectional structure of two or three layers.

  As described above, according to the manufacturing apparatus 100 of the present embodiment, the three-dimensional structure 36 is manufactured by inspecting the formation state of the cross-sectional structure every time the powder layer is melted and solidified to form the cross-sectional structure. In the inspection of the cross-sectional structure, the manufacturing apparatus 100 appropriately performs a repair process when an abnormality such as a nest is formed, so that the reliability of the manufactured three-dimensional structure 36 can be increased. . This is particularly useful when layered modeling of high-end structures such as engine parts and rocket parts.

  In addition, according to the manufacturing apparatus 100, compared to the case where the formation state of each layer is inspected by X-ray or CT scan after the three-dimensional structure 36 is completed, the modeling process is performed again from the beginning when an abnormality is found. Since it is not necessary, yield, manufacturing time and cost can be reduced. Moreover, according to the manufacturing apparatus 100, expensive equipment for performing X-rays or CT scans can be eliminated.

  Further, according to the manufacturing apparatus 100, an eddy current is generated in the cross-sectional structure, the impedance of the coil 63 is measured, and the formation state of the cross-sectional structure is determined according to the measurement result. Therefore, according to the manufacturing apparatus 100, not only can it be determined whether or not the powder 31 constituting the cross-sectional structure is melted and is in a pre-sintered state or a sintered state, but also based on the magnitude of the measured impedance change amplitude. The magnitude of the electrical resistance between the melted and solidified powder 31 can be detected, in other words, the degree of melting of the powder 31 can be determined. This can be said that the production apparatus 100 can detect the pre-sintered state or the sintered state of the powder 31 with high sensitivity. In addition, according to the manufacturing apparatus 100, not only the formation state of the cross-sectional structure of the uppermost layer but also the formation state of the plurality of laminated cross-sectional structures in the stacking direction can be detected within a range in which the alternating magnetic field generated by the coil 63 reaches.

  The representative point described with reference to FIG. 3 may be determined by the user of the manufacturing apparatus 100 or the control unit 400 based on the state of heat dissipation on the surface of the cross-sectional structure and the accuracy of the shape pattern of the cross-sectional structure. The area of the cross-sectional structure is simpler and occupies a large area. Compared to the more complex area that occupies a small area, the area of contact with the adjacent area is larger, and heat can easily escape to the surrounding area. Or it is difficult to make it into a sintered state. The accuracy of the shape pattern includes the fineness of the shape. The user of the manufacturing apparatus 100 or the control unit 400 may determine the representative point in consideration of these circumstances comprehensively.

  In the present embodiment, the measurement unit 60 measures the impedance of the coil 63 with respect to the representative point on the surface of the cross-sectional structure every time the cross-sectional structure is formed by forming a single powder layer and irradiating the electron beam EB. Explained as a thing. Instead of this, the measuring unit 60 forms a single powder layer and irradiates the electron beam EB to form a cross-sectional structure, so that the impedance of the coil 63 with respect to a plurality of representative points on the surface of the cross-sectional structure or the entire surface is measured. In this case, while the electron beam EB is irradiated on one part of the cross-sectional structure, an eddy current may be generated in the other part of the cross-sectional structure to measure the impedance of the coil 63. .

  In the present embodiment, the control unit 400 has been described as comparing the measurement value measured by the measurement unit 60 with reference data acquired from a cross-sectional structure with a good formation state. When the control unit 400 forms a plurality of three-dimensional structures 36 having the same shape in the modeling unit 300 of the manufacturing apparatus 100 or in the plurality of modeling units 300 of the plurality of manufacturing apparatuses 100 operating in parallel. Instead of this, the formation state of at least one cross-sectional structure is determined based on the result of comparing a plurality of measured values measured by the measurement unit 60 with respect to a plurality of cross-sectional structures formed together. Also good.

  In the present embodiment, the measurement unit 60 has been described as inducing an eddy current by generating an AC magnetic field by applying an AC current from the AC power supply unit 67 to the coil 63, but instead, a magnet is used. The magnetic field may be changed by repeatedly approaching the surface of the cross-sectional structure and releasing the eddy current, and an eddy current may be generated in the cross-sectional structure.

  FIG. 5 is an exemplary graph for determining the formation state of the cross-sectional structure of the three-dimensional structure 36 according to the second embodiment by performing a coil search on the surface of the cross-sectional structure. In the description of the present embodiment, the same reference numerals are used for the same configurations as those in the first embodiment, and duplicate descriptions are omitted. The same applies to other embodiments thereafter.

  The manufacturing apparatus 100 according to the present embodiment is different from the first embodiment in that the impedance of the coil 63 is not measured only with respect to the representative points on the surface of the cross-sectional structure, but the surface of the cross-sectional structure is searched with the coil 63. This is performed over the entire surface of the cross-sectional structure.

  More specifically, the coil drive unit 65 of the measurement unit 60 moves the coil 63 in a state where an alternating current is applied by the alternating current power supply unit 67 to a position facing the end of the surface of the cross-sectional structure, and the alternating current With the AC magnetic field generated, the X-axis direction is moved while facing the surface of the cross-sectional structure. When the coil 63 moved in the X-axis direction reaches the other end of the surface of the cross-sectional structure, the coil drive unit 65 moves the coil 63 by a certain distance in the Y-axis direction and similarly from the other end side in the X-axis direction. Move to. The coil drive unit 65 searches the entire surface of the cross-sectional structure by repeating the movement in the XY plane. The detection circuit unit 66 detects an impedance change of the coil 63 that moves in a state where an induced voltage is generated facing the surface of the cross-sectional structure in a state where an eddy current is generated by the AC magnetic field.

  In the graph of FIG. 5, the horizontal axis is the X coordinate, and the vertical axis is the impedance [Ω]. The origin of the X coordinate is the end in the −X direction on the surface of the cross-sectional structure to be searched for coils.

On the graph, it is determined that the transition of the amplitude Z _amp of the impedance change of the coil 63 as a measured value and the formation state of the cross-sectional structure measured by searching the coil on a straight line in the X-axis direction are not good. A threshold value Z _th as a predetermined reference value for this purpose is shown.

In the present embodiment, when the amplitude Z _amp measured by the measurement unit 60 is input together with the coordinate information of the coil 63 on the XY plane, the control unit 400 compares the amplitude Z _amp with the threshold value Z _th stored in the storage unit 500. Thus, the formation state of the cross-sectional structure is determined. The control unit 400 determines that the state of formation of the cross-sectional structure is not good at the position of the coil 63 at the time when the amplitude Z _amp becomes equal to or less than the threshold value Z _th , for example, as shown as the position Xa on the graph of FIG. Then, based on the coordinate information of the coil 63 corresponding to the amplitude Z _amp , a repair location of the cross-sectional structure is determined, and a repair process such as irradiating the repair location with a high-power electron beam EB is executed. .

  As described above, this embodiment also has the same effects as the above-described effects of the first embodiment. Further, according to the manufacturing apparatus 100 of the present embodiment, only a portion where the formation state is not good is irradiated with the high-power electron beam EB. The energy consumption can be suppressed as compared with the case where the entire surface of the powder layer to be irradiated is irradiated with the high-power electron beam EB.

  In addition, in the manufacturing apparatus 100 of this embodiment, it demonstrated as what scans over the whole surface in the state which made the coil 63 oppose the surface of a cross-sectional structure. Instead, the manufacturing apparatus 100 considers that the eddy current induced by the alternating magnetic field generated from the coil 63 spreads over a certain range, and the coil 63 is placed on the inner side of the surface with the coil 63 facing the surface of the cross-sectional structure. Only a narrow range may be scanned. Alternatively, in consideration of the fact that the eddy current induced by the alternating magnetic field generated from the coil 63 spreads over a certain range, the manufacturing apparatus 100 detects the surface defect of the cross-sectional structure with higher resolution and higher accuracy. The coil may be further miniaturized and the coil search may be performed more finely.

  In addition, according to the manufacturing apparatus 100 of this embodiment, the location where the formation state is not good locally is detected by performing a coil search on the surface of the cross-sectional structure, and after repairing the location locally, the next Move on to powder layer formation. Instead, when the manufacturing apparatus 100 detects a location where the formation state is not locally good in the cross-sectional structure, the manufacturing apparatus 100 proceeds to formation of the next powder layer without repairing the location locally, and the electron beam EB By forming the next cross-sectional structure in a state where the output is increased, the entire structure including the previous cross-sectional structure may be repaired.

  FIG. 6 is a schematic diagram of a measurement unit 61 according to the third embodiment. In the present embodiment, as a point different from the first embodiment, the measurement unit 61 has a coil array including a plurality of coil housings 62 and a plurality of coils 63 accommodated therein. However, in FIG. 6, for simplification of description, a plurality of coils 63 housed in a plurality of coil housings 62, an AC power supply unit 67 electrically connected to the plurality of coils 63, and a detection The circuit portion 66 is not shown. The plurality of coils 63 of the coil array can be moved by the coil driving unit 65 and face different regions on the surface of the cross-sectional structure.

  Further, as another point of difference, the AC power source 67 of the measuring unit 61 is mutually connected between regions having different magnetic fluxes generated by eddy currents generated in the same time zone in regions having different cross-sectional structures. An alternating current is passed through two or more coils 63 that do not interfere so that at least some of the time zones overlap. Thereby, the AC power supply unit 67 generates eddy currents simultaneously in different regions in at least a part of the time zone. The measuring unit 61 simultaneously detects a change in impedance of two or more coils 63 through which a corresponding alternating current is passed.

  The coil array exemplarily shown in FIG. 6 includes 25 sets of coil casings 62 and coils 63, but is not limited thereto, and may include any number of sets of coil casings 62 and coils 63. Good. Preferably, the coil housing 62 and the coil 63 are set so that the range of the eddy current generated by the alternating magnetic field of the plurality of coils 63 is approximately the same as the maximum area in the XY plane of the three-dimensional structure 36 manufactured by the manufacturing apparatus 100. Set the number of pairs. Thereby, it is possible to omit driving the coil array by the coil driving unit 65 and searching the surface of the cross-sectional structure for the coil.

  The coil array exemplarily shown in FIG. 6 has an arrangement of the coil casing 62 and the coil 63 that form a square as a whole, but is not limited thereto, and may be an arbitrary arrangement. Moreover, although the some coil housing | casing 62 and the coil 63 which are illustrated in FIG. 6 are arrange | positioned so that it may mutually contact, it is not limited to this, You may mutually space apart.

  FIG. 7 is an exemplary graph for determining the formation state of the cross-sectional structure of the three-dimensional structure 36 according to the third embodiment at a plurality of points on the surface of the cross-sectional structure. The horizontal axis of the graph indicates the coil number set for each of the 25 coils 63 included in the coil array. And the vertical axis is impedance [Ω].

On the graph, a plot of the amplitude change Z _amp of the impedance change as a measurement value measured by each of the plurality of coils 63 of the coil array and a predetermined value for determining that the formation state of the cross-sectional structure is not good. A threshold value Z _th as a reference value is shown.

  In the present embodiment, the control unit 400 controls the measurement unit 61 so as to sequentially detect and change the impedance change in the plurality of coils 63 of the coil array. More specifically, the AC power supply unit 67 switches the eddy current in order to different regions of the cross-sectional structure by sequentially switching and flowing an AC current to each of the plurality of coils 63 in a state of approaching the surface of the cross-sectional structure. Give rise to In addition, the detection circuit unit 66 detects a change in impedance of each of the plurality of coils 63 in a state where induced voltages are generated in the plurality of coils 63 facing different regions on the surface of the cross-sectional structure.

In the present embodiment, the control unit 400 compares the amplitude Z _amp measured by the measurement unit 60 with the threshold value Z _th stored in the storage unit 500 for each of the plurality of coils 63, thereby forming the cross-sectional structure. Determine the state. For example, the control unit 400 may have a coil No. on the graph of FIG. 4, it is determined that the formation state of the cross-sectional structure is not good at the position of the coil 63 where the amplitude Z _amp is equal to or smaller than the threshold value Z _th , and the coil No. of the coil 63 corresponding to the amplitude Z _amp is determined. A repair location of the cross-sectional structure is determined based on the position coordinates corresponding to 4, and a repair process such as irradiating the repair location with a high-power electron beam EB is executed at an arbitrary timing.

  As described above, the present embodiment also provides the same effects as the effects of the first embodiment and the second embodiment. Moreover, according to the manufacturing apparatus 100 of this embodiment, the range of the eddy current generated by the alternating magnetic field of the plurality of coils 63 is approximately the same as the maximum area in the XY plane of the three-dimensional structure 36 manufactured by the manufacturing apparatus 100. Thus, by setting the number of sets of the coil housing 62 and the coil 63, it is possible to omit the coil search for the surface of the cross-sectional structure, and to shorten the time for inspecting the formation state of the cross-sectional structure.

In the present embodiment, the threshold value Z _th as a reference value has been described as the same value for each amplitude Z _amp of the plurality of coils 63, that is, for different regions of the surface of the cross-sectional structure. Instead, a different value may be used for each position on the surface of the cross-sectional structure. The threshold value _{Zth in} this case may be different depending on, for example, the state of heat dissipation on the surface of the cross-sectional structure and the accuracy of the shape pattern of the cross-sectional structure.

  FIG. 8 is a schematic diagram of a manufacturing apparatus 101 according to the fourth embodiment, and FIG. 9 is a schematic diagram of a second measurement unit 70 according to the fourth embodiment. In the present embodiment, as a difference from the first embodiment, the manufacturing apparatus 101 additionally includes a second measurement unit 70 that is controlled by the control unit 400.

  As shown in FIG. 9, the second measuring unit 70 has a plurality of electron detectors (for example, four electron detectors 72a, 72b, 72c, 72d), and the electron beam EB incident on the powder layer is converted into the powder layer. Electrons scattered near the surface and emitted in various directions are detected. The plurality of electron detectors 72a and the like are disposed on the incident side of the electron beam EB with respect to the powder layer and at a position where electrons emitted from the surface of the powder layer can be detected. The plurality of electron detectors 72a and the like are arranged at the lower part of the column unit 200 coupled to the modeling unit 300, at a position that does not interfere with the powder supply unit 34, the measurement unit 60, and the like, for example, on the side wall of the modeling unit 300.

  The plurality of electron detectors 72a and the like surround the irradiation position at a position approximately equidistant from the irradiation position of the electron beam EB on the surface of the powder layer. Each of the plurality of electron detectors 72a and the like has a detection surface facing the irradiation position side of the electron beam EB on the surface of the powder layer, and a straight line connecting each of the plurality of electron detectors 72a and the like and the irradiation position is a Z axis. It is preferable to be installed at an angle of 45 to 80 ° with respect to the direction.

  Assuming a coordinate system with the irradiation position of the electron beam EB as the origin, the plurality of electron detectors 72a and the like are arranged in four directions having substantially the same angle as the Z axis and approximately the same angular interval around the Z axis. ing. Further, in the coordinate system, the electron detector 72a and the electron detector 72c are arranged at positions facing each other in the X-axis direction with the Z axis interposed therebetween, and the electron detector 72b and the electron detector 72d are arranged with the Z axis interposed therebetween. It arrange | positions in the position which opposes an axial direction.

  The plurality of electron detectors 72a and the like detect the intensity of electrons that reach the vicinity of the electron detector 72a and so on, that is, the number of electrons that reach a unit time by converting the magnitude of the current signal, that is, the intensity of the detection signal. It may be a semiconductor detector. The plurality of electron detectors 72 a and the like output a detection signal having an intensity proportional to the detected electron intensity to the control unit 400.

  The control unit 400 in the present embodiment determines the melt-bonded state of the powder layer based on detection signals from the plurality of electron detectors 72a and the like. In the state before the powder 31 is completely melted, the powder layer included in the irradiation range of the electron beam EB is in a state where the powder 31 is accumulated at least partially while maintaining the particle shape. The surface of the powder layer in this state has unevenness due to the presence of the particle-shaped powder 31 and the presence of gaps between the powders 31.

  Here, the shot of the electron beam EB, that is, the size of the region irradiated at one time may be set to be equal to or smaller than the particle size of the powder 31. The size of the powder 31 refers to the particle size of the metal particles when the powder 31 is composed only of primary particles of metal particles, for example, and is composed of secondary particles in which a plurality of metal particles are aggregated. In some cases, it refers to the particle size of the secondary particles.

  The intensity of electrons emitted from the surface of the powder layer reflects the uneven structure on the surface of the powder layer and the gap between the powders 31. In addition, electrons emitted from the surface of the powder layer are affected by the state of the surface and are easily emitted or difficult to be emitted depending on the direction. The intensity of the electrons emitted from the light varies depending on the emission direction. Therefore, when an uneven structure or the like exists on the surface of the powder layer, the electron detector 72a and the electron detector 72c facing each other in the X-axis direction across the Z-axis detect signals having different strengths, and similarly, the Z-axis The electron detector 72b and the electron detector 72d opposed to each other in the Y-axis direction with respect to each other also detect signals having different intensities.

  In the powder layer in the irradiation range of the electron beam EB, when the powder 31 is completely melted and the surface of the powder layer is smooth and uniform, electrons are uniformly emitted from the surface around the Z axis. . In this case, the plurality of electron detectors 72a and the like detect signals having substantially the same intensity.

  The control unit 400 determines the melt-bonded state of the powder layer based on the difference in the intensity of detection signals from the plurality of electron detectors 72a and the like arranged in different directions. More specifically, the control unit 400 calculates an intensity difference between detection signals of the electron detector 72a and the electron detector 72c and an intensity difference between detection signals of the electron detector 72b and the electron detector 72d, respectively. Is determined to be in a state where the powder 31 in the powder layer is completely melt-bonded, that is, in a pre-sintered state or a sintered state.

FIG. 10 shows the relationship between the irradiation time for irradiating a specific position on the surface of the powder layer with the electron beam EB and the difference in intensity of detection signals from a plurality of electron detectors arranged in different directions according to the fourth embodiment. It is a graph which shows an example. The horizontal axis of the graph is the irradiation time [t], and the vertical axis is the signal intensity difference. Further, on the graph, a predetermined threshold value ΔI _th of the signal intensity difference for determining that the powder 31 in the powder layer is completely melt-bonded is shown.

  As the irradiation time of the electron beam EB is increased, the signal intensity difference between a plurality of electron detectors arranged in different directions changes from a state where there is almost no signal intensity, that is, a state where the signal intensity difference is close to zero. . The change changes from a state in which the powder layer in the irradiation range includes the powder 31 before being completely melted to a state in which the powder 31 is completely melted and integrally joined to the lower cross-sectional structure. Corresponding to that.

State control unit 400, as shown in the graph of FIG. 10, the signal strength difference is a predetermined fixed time Δt after the equal to or less than a threshold value [Delta] I _th in the irradiation range, the powder 31 in the powder layer is completely melted bond It is determined that Control unit 400 may adjust conditions for determining that powder 31 in the powder layer is completely melt-bonded by adjusting threshold value ΔI _th and time Δt. The control unit 400 further controls the irradiation condition of the electron beam EB in the column unit 200 based on the determination result.

  As described above, this embodiment also has the same effects as the above-described effects of the first embodiment. In addition, according to the manufacturing apparatus 101 of the present embodiment, in addition to measuring the impedance of the coil 63 by generating an eddy current in the cross-sectional structure and determining the formation state of the cross-sectional structure according to the measurement result, the powder Since the formation state of the cross-sectional structure is determined using detection signals from a plurality of electron detectors 72a that detect the intensity of electrons emitted from the surface of the layer from different directions, the reliability of the manufactured three-dimensional structure 36 Can be further increased.

  In the present embodiment, the manufacturing apparatus 101 has been described on the assumption that the second measurement unit 70 has four electron detectors 72a and the like, but instead, surrounds the irradiation position in the same manner as the electron detector 72a and the like. You may have more or less than four electron detectors arranged in such a way.

  In any of the above embodiments, the electron beam EB may include an arbitrary beam such as a particle beam, an electromagnetic wave beam, or an ultrasonic beam. Further, a laser beam may be used instead of the electron beam EB. Further, instead of irradiation with the electron beam EB, the powder 31 may be temporarily sintered or sintered by heater heating, induction heating, or the like. Alternatively, the cross-sectional structure may be formed by melting the conductive material at room temperature and dropping it on the stage 52, and then heating the inside of the modeling part 300 in an oven. Further, instead of the configuration in which the powder 31 is uniformly deposited on the stage 52 to form a flat powder layer and then the electron beam EB is irradiated, the electron beam EB is supplied while supplying the powder 31 and the wire onto the stage 52. It is good also as a structure which does not supply the excess powder 31 etc. by irradiating. Each of the configurations for performing heater heating, induction heating, melting and dropping of a conductive material, heating, wire supply, and the like is also an example of a cross-section forming portion. When induction heating is performed, the coil 63 may be used as a heater, and induction heating may be performed by generating a strong eddy current in the powder layer.

  In the first and second embodiments described above, the coil 63 is moved to a position facing the surface of the cross-sectional structure after the irradiation of the electron beam EB to the powder layer as shown in FIG. The configuration for detecting 63 impedance changes has been described. Instead of this, while irradiating a part of the powder layer with the electron beam EB, the coil 63 is moved to a position facing the surface of the cross-sectional structure already formed in the other part of the powder layer to thereby change the impedance of the coil 63. A change may be detected. In this case, the interval between the beam irradiation portion and the portion to be inspected is more than a fixed value so that the electron beam EB irradiated at the same time is not bent by the alternating magnetic field generated by the alternating current flowing through the coil 63 or the induced magnetic field generated by the eddy current. Is preferably maintained.

  In any of the embodiments described above, a vertically placed coil is arranged in advance in a space on the stage 52 where the three-dimensional structure 36 is not formed, or in the same manner as the three-dimensional structure 36, As in the case of the coil 63 of the measurement unit 60, an eddy current may be generated in the three-dimensional structure 36 by the coil, and the impedance change of the coil may be detected. By using the detection result, it is possible to inspect whether the three-dimensional structure 36 is well formed in the stacking direction, whether it is not deformed by stress, or the like.

  In any of the above embodiments, the modeling unit 300 of the manufacturing apparatus 100 may further include a radiation thermometer for detecting the temperature distribution of the surface of the formed cross-sectional structure. In this case, the surface temperature of the powder layer may be estimated from the wavelength of light emitted from the surface of the powder layer detected by a radiation thermometer.

  Various embodiments of the invention may be described with reference to flowcharts and block diagrams, where a block is either (1) a stage in a process in which the operation is performed or (2) an apparatus responsible for performing the operation. May represent a section of Certain stages and sections are implemented by dedicated circuitry, programmable circuitry supplied with computer readable instructions stored on a computer readable medium, and / or processor supplied with computer readable instructions stored on a computer readable medium. It's okay. Dedicated circuitry may include digital and / or analog hardware circuitry and may include integrated circuits (ICs) and / or discrete circuits. Programmable circuits include memory elements such as logical AND, logical OR, logical XOR, logical NAND, logical NOR, and other logical operations, flip-flops, registers, field programmable gate arrays (FPGA), programmable logic arrays (PLA), etc. Reconfigurable hardware circuitry, including and the like.

  Computer readable media may include any tangible device capable of storing instructions to be executed by a suitable device, such that a computer readable medium having instructions stored thereon is specified in a flowchart or block diagram. A product including instructions that can be executed to create a means for performing the operation. Examples of computer readable media may include electronic storage media, magnetic storage media, optical storage media, electromagnetic storage media, semiconductor storage media, and the like. More specific examples of computer readable media include floppy disks, diskettes, hard disks, random access memory (RAM), read only memory (ROM), erasable programmable read only memory (EPROM or flash memory), Electrically erasable programmable read only memory (EEPROM), static random access memory (SRAM), compact disc read only memory (CD-ROM), digital versatile disc (DVD), Blu-ray (RTM) disc, memory stick, integrated A circuit card or the like may be included.

  Computer readable instructions can be assembler instructions, instruction set architecture (ISA) instructions, machine instructions, machine dependent instructions, microcode, firmware instructions, state setting data, or object oriented programming such as Smalltalk, JAVA, C ++, etc. Including any source code or object code written in any combination of one or more programming languages, including languages and conventional procedural programming languages such as "C" programming language or similar programming languages Good.

  Computer readable instructions may be directed to a general purpose computer, special purpose computer, or other programmable data processing device processor or programmable circuit locally or in a wide area network (WAN) such as a local area network (LAN), the Internet, etc. The computer-readable instructions may be executed to create a means for performing the operations provided via and specified in the flowchart or block diagram. Examples of processors include computer processors, processing units, microprocessors, digital signal processors, controllers, microcontrollers, and the like.

  FIG. 11 illustrates an example computer 1200 in which aspects of the present invention may be embodied in whole or in part. The program installed in the computer 1200 causes the computer 1200 to function as an operation associated with the apparatus according to the embodiment of the present invention or one or more “units” of the apparatus, or to perform the operation or the one or more “parts”. Can be executed and / or the computer 1200 can execute a process according to an embodiment of the present invention or a stage of the process. Such a program may be executed by CPU 1212 to cause computer 1200 to perform certain operations associated with some or all of the blocks in the flowcharts and block diagrams described herein.

  A computer 1200 according to this embodiment includes a CPU 1212, a RAM 1214, a graphic controller 1216, and a display device 1218, which are connected to each other by a host controller 1210. The computer 1200 also includes input / output units such as a communication interface 1222, a hard disk drive 1224, a DVD-ROM drive 1226, and an IC card drive, which are connected to the host controller 1210 via the input / output controller 1220. The computer also includes legacy input / output units such as ROM 1230 and keyboard 1242, which are connected to input / output controller 1220 via input / output chip 1240.

  The CPU 1212 operates according to programs stored in the ROM 1230 and the RAM 1214, thereby controlling each unit. The graphic controller 1216 acquires image data generated by the CPU 1212 in a frame buffer or the like provided in the RAM 1214 or the graphic controller 1216 itself, and causes the image data to be displayed on the display device 1218.

  The communication interface 1222 communicates with other electronic devices via a network. The hard disk drive 1224 stores programs and data used by the CPU 1212 in the computer 1200. The DVD-ROM drive 1226 reads a program or data from the DVD-ROM 1201 and provides the program or data to the hard disk drive 1224 via the RAM 1214. The IC card drive reads programs and data from the IC card and / or writes programs and data to the IC card.

  The ROM 1230 stores therein, for example, a boot program executed by the computer 1200 at the time of activation and / or a program depending on the hardware of the computer 1200. The input / output chip 1240 may also connect various input / output units to the input / output controller 1220 via a parallel port, a serial port, a keyboard port, a mouse port, and the like.

  The program is provided by a computer-readable storage medium such as a DVD-ROM 1201 or an IC card. The program is read from a computer-readable storage medium, installed in the hard disk drive 1224, the RAM 1214, or the ROM 1230, which is also an example of a computer-readable storage medium, and executed by the CPU 1212. Information processing described in these programs is read by the computer 1200 to bring about cooperation between the programs and the various types of hardware resources. An apparatus or method may be configured by implementing information operations or processing in accordance with the use of computer 1200.

  For example, when communication is performed between the computer 1200 and an external device, the CPU 1212 executes a communication program loaded in the RAM 1214 and performs communication processing on the communication interface 1222 based on processing described in the communication program. You may order. The communication interface 1222 reads transmission data stored in a transmission buffer area provided in a recording medium such as a RAM 1214, a hard disk drive 1224, a DVD-ROM 1201, or an IC card under the control of the CPU 1212, and the read transmission. Data is transmitted to the network or received data received from the network is written into a reception buffer area provided on the recording medium.

  Further, the CPU 1212 allows the RAM 1214 to read all or a necessary part of a file or database stored in an external recording medium such as a hard disk drive 1224, a DVD-ROM drive 1226 (DVD-ROM 1201), an IC card, etc. Various types of processing may be performed on the data on the RAM 1214. The CPU 1212 may then write back the processed data to an external recording medium.

  Various types of information, such as various types of programs, data, tables, and databases, may be stored on a recording medium to be processed. The CPU 1212 describes various types of operations, information processing, conditional judgment, conditional branching, unconditional branching, and information retrieval that are described throughout the present disclosure for data read from the RAM 1214 and specified by the instruction sequence of the program. Various types of processing may be performed, including / replacement, etc., and the result is written back to RAM 1214. In addition, the CPU 1212 may search for information in files, databases, etc. in the recording medium. For example, when a plurality of entries each having the attribute value of the first attribute associated with the attribute value of the second attribute are stored in the recording medium, the CPU 1212 selects the first entry from the plurality of entries. An entry that matches the condition for which the attribute value of the attribute is specified is read, the attribute value of the second attribute stored in the entry is read, and the first attribute that satisfies the predetermined condition is thereby read. The attribute value of the associated second attribute may be obtained.

  The program or software module according to the above description may be stored in a computer-readable storage medium on the computer 1200 or in the vicinity of the computer 1200. In addition, a recording medium such as a hard disk or a RAM provided in a server system connected to a dedicated communication network or the Internet can be used as a computer-readable storage medium, whereby the program is transmitted to the computer 1200 via the network. provide.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. In addition, the matters described in the specific embodiment can be applied to other embodiments within a technically consistent range. Moreover, each component may have the same characteristics as other components having the same name and different reference numerals. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

  The order of execution of each process such as operations, procedures, steps, and stages in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the description, and the drawings, even if it is described using “first”, “next”, etc. for convenience, it means that it is essential to carry out in this order. It is not a thing.

12 Electron source, 13 Electron lens, 14 Deflector, 31 Powder, 34 Powder supply part, 36 Three-dimensional structure, 52 Stage, 53 Side wall part, 54 Drive part, 55 Drive rod, 56 Exhaust unit, 57 Heater, 60, 61 measurement unit, 62 coil housing, 63 coil, 64 arm, 65 coil drive unit, 66 detection circuit unit, 67 AC power supply unit, 70 second measurement unit, 72a, 72b, 72c, 72d electron detector, 100, 101 Manufacturing apparatus, 200 column section, 300 modeling section, 400 control section, 500 storage section, 1200 computer, 1201 DVD-ROM, 1210 host controller, 1212 CPU, 1214 RAM, 1216 graphic controller, 1218 display device, 1220 input / output controller, 1222 messages Interface, 1224 hard disk drive, 1226 DVD-ROM drive, 1230 ROM, 1240 input / output chip, 1242 keyboard

Claims (14)

A manufacturing apparatus for manufacturing a three-dimensional structure,
A cross-section forming portion that forms a structure of a cross-sectional portion of the three-dimensional structure using a powder material;
A measurement unit for measuring a measurement value according to an eddy current flowing in the structure formed by the cross-section forming unit;
A manufacturing apparatus provided with the determination part which determines the formation state of the structure according to the measurement result by the measurement part. The cross-section forming unit irradiates a powder layer containing the powder material with a beam to form the structure.
The manufacturing apparatus according to claim 1. The measurement unit measures the measurement value of the other part of the structure while the beam is irradiated to a part of the structure by the cross-section forming unit.
The manufacturing apparatus according to claim 2. The measuring unit is
Coils,
An actuator for moving the coil to a position facing the surface of the structure;
A detection circuit that detects a change in impedance of the coil in a state in which the coil facing the surface generates an induced voltage due to a magnetic flux generated by the eddy current;
The manufacturing apparatus according to any one of claims 1 to 3. The measuring unit is
An AC power source for generating an eddy current in the structure by passing an AC current through the coil;
The actuator moves the coil in a state of facing the surface,
The detection circuit detects a change in impedance of the coil moving in a state where the induced voltage is generated facing the surface;
The manufacturing apparatus according to claim 4. The measuring unit is
A coil array including a plurality of the coils moved by the actuator and facing different areas of the surface;
The detection circuit detects a change in impedance of each of the plurality of coils in a state where the plurality of coils facing different regions of the surface generate the induced voltage.
The manufacturing apparatus according to claim 4. The measuring unit is
Among the plurality of coils, at least a part of time is required for two or more coils in which magnetic flux generated by the eddy current generated in the same time zone in different regions of the structure does not interfere with each other between the different regions. Having an AC power source for generating the eddy current by flowing an AC current so that the belts overlap,
The manufacturing apparatus according to claim 6. The cross-section forming part forms the structure in which the powder material is pre-sintered.
The manufacturing apparatus according to any one of claims 1 to 7. The determination unit determines the formation state of the structure based on a result of comparing the measured value according to the eddy current flowing through the structure and a reference value according to the eddy current flowing through the structure having a good formation state. judge,
The manufacturing apparatus according to any one of claims 1 to 8. The structure having a good formation state is a structure formed based on the same shape data as the structure.
The manufacturing apparatus according to claim 9. The determination unit determines a formation state of at least one structure based on a result of comparing the plurality of measurement values measured by the measurement unit with respect to the plurality of structures formed by the cross-section forming unit. ,
The manufacturing apparatus according to any one of claims 1 to 8. An inspection method for inspecting the structure of a cross-sectional portion of a three-dimensional structure,
A cross-section forming step using powder material to form the structure;
A measurement step of measuring a measurement value according to an eddy current flowing in the structure formed in the cross-section formation step;
An inspection method comprising: a determination step of determining a formation state of the structure according to a measurement result in the measurement step.   A program for causing a computer to execute the inspection method according to claim 12. A manufacturing method for manufacturing a three-dimensional structure,
A cross-section forming step of forming a structure of a cross-sectional portion of the three-dimensional structure using a powder material;
A measurement step of measuring a measurement value according to an eddy current flowing in the structure formed in the cross-section formation step;
In accordance with the measurement result in the measurement step, a determination step of determining the formation state of the structure;
A manufacturing method comprising: repairing the structure when it is determined that the formation state is not good in the determination step.