JP2019181722A - Liquid discharge head manufacturing method - Google Patents

Abstract

To provide a method for manufacturing a liquid discharge head which is positioned on a support substrate in the state that an element substrate is thermally expanded, in which positional deviation of the element substrate with respect to the support substrate is suppressed.SOLUTION: A heated second element substrate C2 is located on a support substrate, a thermosetting adhesive, which is interposed between the second element substrate C2 and the support substrate, is cured, whereby the second element substrate C2 is joined to the support substrate. Specifically, an arrangement position in a first direction of the heated second element substrate C2 in the support substrate is determined on the basis of an expansion amount of the second element substrate C2 in the first direction during heating, the heated second element substrate C2 is located at an arrangement position of the support substrate, and the second element substrate C2 is joined to the support substrate. The arrangement position is so determined that when the second element substrate C2 returns to a temperature before heating, a reference point of the second element substrate C2 is positioned in a desired area in the first direction of the support substrate.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for manufacturing a liquid discharge head used in a recording apparatus that performs a recording operation by discharging a liquid.

An apparatus (for example, a recording apparatus) provided with a liquid discharge head is widely used as an output device of a computer. The liquid discharge head includes an element substrate including an energy generating element that generates energy required for liquid discharge, such as ink, and a liquid discharge port. In recent years, it has been desired to perform recording at high speed, and a liquid discharge head having a long print width may be used for that purpose. However, when a liquid discharge head having a long print width is constituted by a single element substrate, it is necessary to use a long element substrate, which causes problems such as a decrease in yield of the element substrate. For this reason, a configuration is used in which a plurality of element substrates having appropriate lengths are linearly arranged on a common support substrate to realize a liquid discharge head having a long print width as a whole. There is also known a recording apparatus that outputs a variety of printed materials by arranging a plurality of element substrates in parallel on a support substrate and changing the color of ink ejected for each element substrate.
Patent Document 1 discloses a method for manufacturing a liquid discharge head in which an element substrate is bonded to a support substrate using an adhesive having a property of being cured by heating. The element substrate is sucked and held by fingers, positioned with respect to the support substrate by image processing, and pressed against the surface of the support substrate. Thereafter, the adhesive applied to the support substrate is heated with infrared rays to cure the adhesive, and the element substrate is bonded to the support substrate.

JP 2002-79676 A

As a method of heating the adhesive, for example, it is conceivable to hold the element substrate with a finger having a built-in heater and to transfer the heat generated by the heater to the adhesive through the element substrate. Since this method does not require a mechanism for infrared irradiation, the structure of the bonding apparatus can be simplified. However, according to this method, the element substrate thermally expanded by the heat transmitted from the fingers is positioned with respect to the support substrate and bonded to the support substrate. For this reason, when the temperature of the element substrate decreases after bonding, the thermally expanded element substrate contracts, and the element substrate may be slightly deviated from the positioned position and bonded to the support substrate. As a result, there is a possibility that the position of the discharge port is also shifted and the output image quality is lowered.
An object of the present invention is to provide a method for manufacturing a liquid discharge head in which an element substrate is positioned on a support substrate in a thermally expanded state, and displacement of the element substrate with respect to the support substrate is suppressed.

  According to one aspect of the present invention, a method for manufacturing a liquid ejection head includes placing a heated element substrate on a support substrate and curing a thermosetting adhesive interposed between the element substrate and the support substrate. Thus, the element substrate is bonded to the support substrate. This manufacturing method determines the arrangement position of the heated element substrate in the first direction on the support substrate based on the expansion amount in the first direction when the element substrate is heated, and the heated element substrate. Is arranged at the arrangement position of the support substrate, and the element substrate is bonded to the support substrate, and the arrangement position is such that when the element substrate returns to the temperature before heating, the reference point of the element substrate is It is determined to be located in a desired region in the first direction of the support substrate.

  According to the present invention, when the element substrate returns to the temperature before heating, the reference point of the element substrate can be positioned in a desired region in the first direction of the support substrate. Therefore, according to the present invention, it is possible to provide a method for manufacturing a liquid discharge head in which the element substrate is positioned on the support substrate in a thermally expanded state and the positional deviation of the element substrate with respect to the support substrate is suppressed.

It is a flowchart of the joining flow which concerns on one Embodiment of this invention. It is the schematic of the liquid discharge head manufactured by the manufacturing method of this invention. It is the schematic of the mounter used by this invention. It is a figure explaining the installation position of a camera. It is a figure explaining the positional relationship of a support substrate, an element substrate, and a camera. It is a figure explaining the detection position of the alignment mark image | photographed with the camera. It is a figure explaining the shift | offset | difference of the position of alignment before and behind a heating. It is the schematic of the element substrate of a parallelogram. It is a figure explaining the detection position of the alignment mark of the element substrate of FIG.

  Several embodiments of the present invention will be described with reference to the drawings. In the following description and drawings, the first direction is a direction parallel to the longitudinal direction of the element substrate, and is hereinafter referred to as the X direction. The second direction is a direction parallel to the short direction of the element substrate, and is hereinafter referred to as the Y direction. The X direction and the Y direction are orthogonal to each other. The Z direction is a vertical direction and is orthogonal to the X direction and the Y direction.

(First embodiment)
First, the liquid discharge head 4 manufactured by the manufacturing method of this embodiment will be described with reference to FIG. FIG. 2A shows that two element substrates C that discharge a liquid such as ink are bonded to the support substrate 1 (they may be referred to as a first element substrate C1 and a second element substrate C2). FIG. 2 is a perspective view of the liquid discharge head 4 that has been made. The element substrate C has a liquid supply port (not shown), a pressure chamber (not shown) communicating with the liquid supply port, and an energy generating element (not shown) that generates energy required for the liquid to be discharged. And a discharge port 2 that communicates with the pressure chamber and discharges the liquid (see FIG. 2B). An electrothermal transducer or a piezoelectric element can be used as the energy generating element. The support substrate 1 is made of alumina having excellent insulating properties, thermal conductivity, and mechanical strength, but can also be made of resin or other materials. The first element substrate C1 and the second element substrate C2 are disposed and bonded to the upper surface of the support substrate 1 via a thermosetting adhesive (hereinafter referred to as an adhesive P) that is cured by applying heat. ing. As a method for heating the adhesive P, for example, irradiation with infrared rays can be mentioned.

  The two element substrates C1 and C2 have the same or substantially the same rectangular shape having a longitudinal direction and a lateral direction, and are arranged so that the respective longitudinal axes are located on the same straight line. The number of element substrates C is not limited to two, and it is sufficient that at least two element substrates C are bonded to the support substrate 1. The orientation of the element substrate C is not limited in the present embodiment, and as shown in the plan view of FIG. 2D, the plurality of element substrates C are arranged so that the short direction axes are located on the same straight line. Also good. That is, the long axis may be parallel to the Y direction and the short axis may be parallel to the X direction. The shape of the element substrate C is not limited to a rectangle, and may be a parallelogram or a trapezoid.

FIG. 2B is a perspective view showing the appearance of the element substrate C. FIG. A plurality of discharge ports 2 are formed in a row on the element substrate C. One alignment mark 3a, 3b is formed on each side end of the element substrate C in the longitudinal direction. Since the discharge port 2 and the alignment marks 3a and 3b are formed using the same exposure apparatus, the accuracy of their relative positions is very high. The alignment marks 3a and 3b are circular, but the shape thereof is not limited as long as the alignment marks 3a and 3b can be used as the reference point of the element substrate C, and may be, for example, a cross shape. It is also possible to use the corners of the element substrate C as reference points without forming the alignment marks 3a and 3b. The number of rows of the discharge ports 2 is not limited to the above, and for example, two rows of discharge ports may be provided on the element substrate C.
FIG. 2C shows an ideal relative positional relationship between the first element substrate C1 and the second element substrate C2 shown in FIG. The distance (interval) in the X direction between the alignment marks 3a and 3b adjacent to each other on the first element substrate C1 and the second element substrate C2 is k. A total of four alignment marks 3a and 3b of the first element substrate C1 and the second element substrate C2 are on one straight line extending in the X direction (that is, the positions in the Y direction are the same).

Next, the configuration of a bonding apparatus (hereinafter also referred to as a mounter 10) for bonding the element substrate C to the support substrate 1 will be described with reference to FIG. FIG. 3A is a plan view showing a schematic configuration of the mounter 10. The mounter 10 includes a transport unit 20 for the element substrate C and a transport unit 30 for the support substrate 1. The transport unit 20 takes out the element substrates C stored in the tray 5 one by one and transports them to the transport unit 30. As shown in FIG. 3B, an XYZ stage 21 is attached to the leading end 20 a of the transport unit 20. A finger 23 for adsorbing and holding the element substrate C is provided directly below the XYZ stage 21 via an L-shaped jig 22. The finger 23 includes a heater that heats the finger 23 and a temperature sensor (none of which is shown) that constantly monitors the temperature of the finger 23. By connecting the heater and the temperature sensor to a temperature regulator (not shown) and controlling the output of the heater, the finger temperature can always be kept at a set temperature. The element substrate C is held by the fingers 23, heated by the fingers 23, and disposed on the support substrate 1. Then, the heat transferred from the finger 23 to the element substrate C cures the thermosetting adhesive P interposed between the element substrate C and the support substrate 1, whereby the element substrate C is bonded to the support substrate 1. The
As shown in FIG. 3C, the transport unit 30 includes an XY stage 31 that is movable in the XY directions, and a base jig 32 that is installed on the XY stage 31 and on which the support substrate 1 can be mounted. Yes. The base jig 32 is provided with a plurality of positioning pins 34, and the support substrate 1 is abutted against the positioning pins 34 by the positioning cylinder 33 and fixed on the base jig 32.

  Next, referring to FIG. 4, a camera used for alignment (positioning) of the element substrate C will be described. As will be described later, the camera is installed to detect the positions of the alignment marks 3a and 3b on the element substrate C by image processing. FIG. 4 is a perspective view showing two cameras 51 and 52 fixed to the mounter 10 above the transport unit 30. In the bonding process described below, the camera 51 photographs the alignment mark 3b of the first element substrate C1 and the alignment mark 3a of the second element substrate C2. The camera 52 images the alignment mark 3b of the second element substrate C2. The cameras 51 and 52 can move in the Z direction so that the focus can be adjusted, but do not move in the X and Y directions. 4A shows a state during alignment of the first element substrate C1, and FIG. 4B shows a state during alignment of the second element substrate C2. In FIG. 4, the transport unit 20 is omitted. The cameras 51 and 52 have 1600 pixels in the horizontal direction (X direction) and 1200 pixels in the vertical direction (Y direction), and the spatial resolution of the optical system including the lens is about 0.7 micrometers per pixel in both the vertical and horizontal directions. It is. The mounter 10 includes a memory (not shown) that stores the pixel positions of the alignment marks 3a and 3b photographed by the cameras 51 and 52.

Next, a method of bonding the first element substrate C1 and the second element substrate C2 to the support substrate 1 will be described with reference to FIGS. FIG. 1 is a flowchart showing a procedure of bonding the first element substrate C1 and the second element substrate C2 to the support substrate 1. FIG. 5 is a side view showing the support substrate 1, the first element substrate C 1, the second element substrate C 2, and the cameras 51 and 52. FIGS. 6 and 7 are schematic views showing alignment marks 3a and 3b photographed and detected by the cameras 51 and 52. FIG.
First, in step S1, the support substrate 1 is fixed to the base jig 32 (see FIG. 3C). An adhesive P is applied in advance to a region where the first and second element substrates C1 and C2 of the support substrate 1 are bonded (hereinafter referred to as a bonding region).
Next, in step S2, the first element substrate C1 of the two element substrates C shown in FIG. Specifically, first, the XY stage 31 is driven to move the bonding region of the first element substrate C1 on the support substrate 1 directly below the cameras 51 and 52. The first element substrate C1 held by the finger 23 is positioned with a predetermined positional relationship with respect to a reference point (not shown) provided on the support substrate 1 and bonded to the support substrate 1. The finger 23 is heated in advance by a heater (100 ° C. in the present embodiment), the first element substrate C1 held by the finger 23 is heated to a second temperature at which the adhesive P is cured, and the heat is applied to the adhesive. P is told. The inclination of the first element substrate C1 is adjusted before bonding, and the adjustment method is the same as the inclination adjustment in step S6, and will be described later.

Next, in step S3, the XY stage 31 is transported in the X direction by one pitch of the element substrate C. As shown in FIG. 2C, one pitch is a length obtained by adding a distance k to the length L from the alignment mark 3a to the alignment mark 3b of the first element substrate C1. As a result, the support substrate 1 is transported in the X direction, and the bonding region of the second element substrate C2 adjacent to the first element substrate C1 moves immediately below the cameras 51 and 52 as shown in FIG. .
Next, in step S4, the camera 51 is lowered to focus on the first element substrate C1, and the alignment mark 3b is detected. Referring to FIG. 6A, the alignment mark 3b of the first element substrate C1 is detected in the imaging region 61 of the camera 51. The X-direction pixel position 70x and the Y-direction pixel position 70y of the alignment mark 3b are stored in the memory of the mounter 10. Note that the X-direction pixel position and the Y-direction pixel position are the coordinates of the pixel in the imaging region of the camera, and the coordinates of the lower left corner in FIG. 6A are (1, 1) and the coordinates of the upper right corner are (1600, 1200).

  Next, in step S5, energization of the heater built in the finger 23 is stopped, and the finger temperature is lowered to the first temperature. The first temperature is a temperature lower than the temperature at which the adhesive P starts to be cured, for example, a room temperature of about 25 ° C. Thereafter, the transport unit 20 is driven, the second element substrate C2 on the tray 5 is sucked and held by the fingers 23, and transported to just below the cameras 51 and 52 (see FIG. 5B). In FIG. 5B, the conveyance unit 20 is not shown. The temperature of the second element substrate C2 held by the finger 23 is the first temperature. Referring to FIG. 6B, the alignment mark 3a of the second element substrate C2 is detected in the imaging region 61, and the X direction pixel position is 71x and the Y direction pixel position is 71y. The alignment mark 3b of the second element substrate C2 is detected in the imaging region 62, and the X-direction pixel position is 81x and the Y-direction pixel position is 81y. Due to the influence of the dimensional accuracy of the tray 5 in which the second element substrate C2 is stored, an error occurs in the adsorption position when the second element substrate C2 is adsorbed to the finger 23. The longitudinal axis may tilt with respect to the X direction.

Next, in step S6, the inclination of the second element substrate C2 around the Z axis is adjusted. That is, the orientation of the second element substrate C2 is adjusted so that the longitudinal axis of the second element substrate C2 faces the X direction. Specifically, the conveyance unit 20 is driven, and the Y-direction pixel positions of the alignment marks 3a and 3b are adjusted to be the same (for example, 72y) as shown in FIG. 6C.
In step S7, the X-direction pixel positions of the alignment marks 3a and 3b of the second element substrate C2 after the tilt adjustment are stored as the X-direction pixel positions at the first temperature. The X-direction pixel position of the alignment mark 3a is 72x, and the X-direction pixel position of the alignment mark 3b is 82x. After these pixel positions are stored in the memory of the mounter 10, energization to the heater built in the finger 23 is started and waits until the set temperature is reached. The second element substrate C2 is heated from the first temperature to the second temperature by the heat from the fingers 23.

Next, in step S8, alignment in the XY directions is performed. This step will be described with reference to the detailed flow shown in FIG.
First, in step S21, the pixel positions of the alignment marks 3a and 3b on the second element substrate C2 are detected. Referring to FIG. 6D, the X direction pixel position of the alignment mark 3a of the second element substrate C2 is 73x, and the Y direction pixel position is 73y. Compared with FIG. 6C, the X-direction pixel position 73x is on the minus side (left side in the figure) with respect to the X-direction pixel position 72x, and the Y-direction pixel position 73y is on the minus side with respect to the Y-direction pixel position 72y (see FIG. 6). (Just below). Further, the X-direction pixel position of the alignment mark 3b of the second element substrate C2 is 83x. Compared with FIG. 6C, the X-direction pixel position 83x is a plus side (in the figure, relative to the X-direction pixel position 82x). To the right). Since the finger 23 is in the same position in FIG. 6C and FIG. 6D, the movement of the alignment marks 3a and 3b indicates that the second element substrate C2 is expanded by being heated.

Next, in step S22, how much the second element substrate C2 has expanded by heating is calculated. The X-direction pixel position 72x is A, the X-direction pixel position 82x is B, the X-direction pixel position 73x is D, the X-direction pixel position 83x is E, and the spatial resolution in the X direction of the optical system is Nx. dx is expressed by the following equation.
dx = (− (DA) + (EB)) × Nx (Formula 1)
That is, the expansion amount in the X direction is calculated based on the difference between the reference points (alignment marks 3a, 3b) before and after heating the second element substrate C2 and based on the difference between the reference points before and after heating. It will be required by doing.
The expansion amount dy in the Y direction of the second element substrate C2 is obtained based on the expansion amount dx in the X direction. That is, the expansion amount dy is the length of the second element substrate C2 in the Y direction (short direction) at the first temperature M, and the length from the alignment mark 3a to the alignment mark 3b at the first temperature is L. Then, it is expressed by the following formula.
dy = M × (L + dx) ÷ L (Formula 2)

Next, in step S23, a target position for aligning the second element substrate C2 in the XY direction is calculated. Prior to this, the captured image of the second element substrate C2 that has returned to the first temperature after bonding and the detection position of the alignment mark 3a will be described with reference to FIG. FIG. 7A shows an imaging region 61 of the camera 51, and the interval in the X direction between the alignment mark 3b of the first element substrate C1 and the alignment mark 3a of the second element substrate C2 is k. The Y-direction pixel positions of the alignment mark 3b of the first element substrate C1 and the alignment mark 3a of the second element substrate C2 are the same.
FIG. 7B shows a target position during alignment for the alignment mark 3a of the second element substrate C2 that has returned to the first temperature after bonding to be positioned at the position shown in FIG. 7A. The X-direction pixel position 70x and the Y-direction pixel position 70y of the alignment mark 3b of the first element substrate C1 are stored in the memory of the mounter 10 in step S4. When the stored X-direction pixel position 70x is F, the X-direction target pixel position Tx (position corresponding to 75x in FIG. 7B) of the alignment mark 3a of the second element substrate C2 is expressed by the following equation. The
Tx = (2k−dx) ÷ 2Nx + F (Formula 3)
That is, the X-direction target pixel position Tx on the support substrate 1 of the heated second element substrate C2 is determined based on the expansion amount dx in the X direction when the second element substrate C2 is heated. Further, if the stored Y-direction pixel position 70y is G and the spatial resolution in the Y-direction of the optical system is Ny, the Y-direction target pixel position Ty of the alignment mark 3a of the second element substrate C2 (FIG. 7B). (Position corresponding to 75y) is expressed by the following equation.
Ty = G−dy ÷ 2Ny (Formula 4)

As described above, the X-direction target pixel position Tx and the Y-direction target pixel position Ty (hereinafter also referred to as target position) of the second element substrate C2 are the reference of the first element substrate C1 already bonded to the support substrate 1. It is obtained as a relative position with respect to the point (alignment mark 3b). In other words, the target position of the second element substrate C2 on the support substrate 1 is determined based on the expansion amounts dx and dy in the X direction and the Y direction when the second element substrate C2 is heated to the second temperature. Is done. As a result, the target position of the second element substrate C2 is the desired position of the support substrate 1 when the reference point (alignment mark 3a) is in the X direction and the Y direction when the second element substrate C2 returns to the temperature before heating. It will be determined to be located in the area of.
In other words, the second element substrate C2 is such that the reference position (alignment mark 3a) of the second element substrate C2 satisfies a predetermined positional relationship S1 <S2 with respect to a predetermined position of the support substrate 1. Is disposed on the support substrate 1. Here, S1 is a deviation between the reference point (alignment mark 3a) and a predetermined position when the temperature of the second element substrate C2 returns to the first temperature. In S2, after the second element substrate C2 is bonded so that the reference point (alignment mark 3a) coincides with a predetermined position at the second temperature, the temperature of the second element substrate C2 returns to the first temperature. This is the deviation between the reference point and the predetermined position. The predetermined position is a position on the support substrate where the reference point of the second element substrate C2 should be positioned at the first temperature. The deviation between the reference point and the predetermined position when the temperature of the second element substrate C2 returns to the first temperature is ideally zero, but it does not become zero if the above positional relationship is satisfied. Also good.

  Next, in step S24, the XYZ stage 21 is driven in the X direction and the Y direction, and the second element substrate C2 is supported so that the detection position of the alignment mark 3a becomes Tx in Expression 3 and Ty in Expression 4. Position with respect to the substrate 1. That is, by placing the reference point (alignment mark 3a) at the target position Tx, Ty of the support substrate 1 obtained based on the expansion amounts dx, dy, the heated second element substrate C2 is a predetermined position of the support substrate 1. It will be arranged at the arrangement position.

  Next, in step S25, the actual position of the alignment mark 3a of the second element substrate C2 after alignment is detected. In step S26, it is determined whether or not the detected position is within a preset allowable range or a desired region. If the detected position is within the allowable range, the flow returns to the flow of FIG. If it is outside the allowable range, the process returns to step S21, and the steps after step S21 are repeated. This is because the expansion amount of the second element substrate C2 may vary with time.

When the flow returns to the flow of FIG. 1A, the XYZ stage 21 is lowered to join the second element substrate C2 to the support substrate 1 in step S9. The adhesive P applied to the support 1 is heated and cured by heat transmitted from the finger 23 via the second element substrate C2.
Finally, in step S10, the support substrate 1 is discharged from the mounter 10, and a series of steps is completed. When the expanded second element substrate C2 returns to the first temperature (room temperature), the second element substrate C2 contracts to the original state, and the second element substrate C2 shown in FIG. A positional relationship in which the alignment mark 3a enters an allowable range or a desired region can be obtained. Therefore, the discharge port is also arranged at a desired position, and high-quality image output is possible.
In the present embodiment, the example in which the two element substrates C1 and C2 are bonded to the support substrate 1 is shown, but the number of element substrates is not limited. When three or more element substrates are bonded to the support substrate 1, the previously bonded element substrate is bonded to the first element substrate C1 and the first element substrate C1 adjacent to the first element substrate C1. The above-described steps may be repeated using the element substrate to be processed as the second element substrate C2.

(Second Embodiment)
The second embodiment is the same as the first embodiment except that the step of calculating the expansion amount of the second element substrate C2 is different from the first embodiment. The same reference numerals as those in the first embodiment are used for the same members, elements, steps, and the like as those in the first embodiment. The shape and number of element substrates C and the shape of the support substrate 1 are the same as those in the first embodiment. This embodiment can be suitably applied when there is little variation in the distance (L in FIG. 2C) between the alignment mark 3a and the alignment mark 3b on the element substrate C.

In the present embodiment, steps S1 to S7 in FIG. 1 are performed on the other first and second element substrates C1 ′ and C2 ′ in advance before executing the flow shown in FIG. Then, the X-direction pixel position 72x and the Y-direction pixel position 82x of the alignment mark 3b obtained with respect to the other second element substrate C2 ′ are registered or stored in the mounter 10 as parameters. Thereafter, the first element substrate C1 and the second element substrate C2 are bonded to the support substrate 1 according to the flow shown in FIG. However, in step S7, since the pixel position of the alignment mark 3b registered as a parameter is read from the mounter 10, execution of step S7 is unnecessary. That is, registration of the pixel position of the alignment mark 3b in step S7 is not performed. In step S22, the pixel positions registered as A and B in Equation 1 are used. For this reason, when calculating the expansion amount of any element substrate C, the same pixel position registered in advance is used.
In order to obtain the expansion amount, the pixel position of the alignment mark 3a after the heating of the second element substrate C2 is detected. Then, the amount of expansion is based on the difference in position between the alignment mark 3b before heating the other second element substrate C2 ′ read from the memory of the mounter 10 and the alignment mark 3a after heating the second element substrate C2. Is calculated. In this embodiment, step S7 is not necessary, and thus cooling and reheating of the fingers 23 are not necessary. Therefore, the time required for cooling and reheating the finger 23 is not required, and the bonding time of the element substrate C can be shortened.

(Third embodiment)
The third embodiment is the same as the second embodiment except that the temperature before heating is the operating temperature of the liquid ejection head 4. The same reference numerals as those in the second embodiment are used for the same members, elements, steps, and the like as those in the second embodiment. The shape and number of element substrates C and the shape of the support substrate 1 are the same as those in the first embodiment. This embodiment can be suitably applied when there is little variation in the distance (L in FIG. 2C) between the alignment mark 3a and the alignment mark 3b on the element substrate C.

The liquid discharge head 4 is generally used at normal temperature, and the liquid (ink) to be discharged is often at normal temperature. However, depending on the liquid ejection head, the liquid to be ejected may be used while being kept warm (temperature adjustment) at a temperature higher than room temperature (for example, about 45 ° C.). Since there is a liquid whose temperature is adjusted to a high temperature inside the support substrate 1 and the element substrate C, the support substrate 1 and the element substrate C are warmed by this liquid, and expand slightly to the normal temperature.
In the present embodiment, a heater and a temperature sensor (both not shown) are incorporated in the base jig 32 of the mounter 10 so that the base jig 32 can be heated and monitored. Further, the heater and the temperature sensor are connected to a temperature regulator (not shown), and the base jig 32 is always maintained at a constant temperature based on the temperature measured by the temperature sensor. In the present embodiment, the temperature of the base jig 32 is maintained at 45 ° C.

  Also in the present embodiment, steps S1 to S7 in FIG. 1 are performed on the other first and second element substrates C1 'and C2' in advance before executing the flow shown in FIG. Then, the X-direction pixel position 72x and the Y-direction pixel position 82x of the alignment mark 3b obtained with respect to the other second element substrate C2 'are registered or stored in the mounter 10 as parameters. However, when obtaining the X-direction pixel position 72x and the Y-direction pixel position 82x of the alignment mark 3b of the other second element substrate C2 ', the temperature of the finger 23 is maintained at 45 ° C. The rest is the same as in the second embodiment. In the present embodiment, the second element substrate C2 is positioned at a desired position of the support substrate 1 when the second element substrate C2 reaches the actual use temperature of the liquid ejection head 4, that is, the liquid temperature. Higher quality image output is possible.

(Fourth embodiment)
The fourth embodiment is the same as the second embodiment except that the step of calculating the expansion amount of the second element substrate C2 is different from the second embodiment. The same reference numerals as those in the second embodiment are used for the same members, elements, steps, and the like as those in the second embodiment. The number of element substrates C and the shape of the support substrate 1 are the same as in the second embodiment, but the element substrate C has a parallelogram shape as shown in FIG. 8, and the temperature of the liquid is normal temperature. This embodiment can be suitably applied when there is little variation in the distance (L in FIG. 2C) between the alignment mark 3a and the alignment mark 3b on the element substrate C.

In the present embodiment, as in the second embodiment, before executing the flow shown in FIG. 1, steps S1 to S1 in FIG. 1 are performed on the other first and second element substrates C1 ′ and C2 ′ in advance. S7 is executed. Then, the X-direction pixel position 72x and the Y-direction pixel position 82x of the alignment mark 3b obtained with respect to the other second element substrate C2 ′ are registered or stored as parameters in the memory of the mounter 10. In the present embodiment, the steps after step S21 are further performed on the other second element substrate C2 ′ in advance, and the detection is performed in a state where the second temperature, that is, the other second element substrate C2 ′ is expanded. The registered pixel position of the alignment mark 3a is also registered. Thereafter, the first element substrate C1 and the second element substrate C2 are bonded to the support substrate 1 according to the flow shown in FIG. However, at step S7, since the pixel position of the alignment mark 3b of the other second element substrate C2 ′ registered as a parameter is read from the mounter 10, execution of step S7 is unnecessary. Therefore, since the finger 23 is always maintained in a heated state, the same effect as that of the second embodiment can be obtained in this embodiment.
In step S22, pixel positions registered in advance are used as A, B, D, and E in Equation 1. Since the target position of the second element substrate C2 is calculated based on the pixel position registered in advance, when the second element substrate C2 is gripped by the finger 23, the positioning with respect to the support substrate 1 is performed immediately (step S24). Can do. That is, in this embodiment, the position of the reference point before and after heating of the other second element substrate C2 ′ is detected and registered or stored in advance, and the reference point before and after heating of the other second element substrate C2 ′ is detected. The expansion amount of the second element substrate C2 is calculated (predicted) in advance based on the position difference. The expansion amount of the second element substrate C2 can be calculated in advance and registered in the memory of the mounter 10, and the expansion amount of the second element substrate C2 registered in the memory of the mounter 10 can be read in step S23. This method is effective because it is not necessary to perform calculation each time a large number of element substrates C are joined to the support substrate 1 in succession.

  FIG. 9 shows an example of the alignment marks 3a and 3b of the second element substrate C shown in FIG. 8 whose inclination is adjusted in step S6. FIG. 9A shows a state in which the second element substrate C is at room temperature, and FIG. 9B shows a state in which the second element substrate C is heated to 100 ° C. At normal temperature, the alignment mark 3a is detected at the X-direction pixel position 90x, and the alignment mark 3b is detected at the X-direction pixel position 100x. Regarding the Y-direction pixel position, both the alignment marks 3a and 3b are detected at the same Y-direction pixel position 90y. The alignment mark 3a of the second element substrate C2 after being heated to 100 ° C. is detected at the X direction pixel position 91x and the Y direction pixel position 91y, and the alignment mark 3b is detected at the X direction pixel position 101x and the Y direction pixel position 101y. Yes. The Y-direction pixel position 91y has a smaller value than the Y-direction pixel position 101y (the Y coordinate has a positive upward direction), and it can be seen from this that the expansion amount of the second element substrate C2 is different on the left and right. In this case, in the tilt adjustment in step S6, the alignment marks 3a and 3b are not adjusted so as to have the same Y-direction pixel position, but the difference between the Y-direction pixel position is the difference between the Y-direction pixel position 91y and the Y-direction pixel position 101y. It is preferable to adjust so as to be the same as the difference. As a result, when the second element substrate C2 is heated and the expansion amount differs between the left and right sides of the second element substrate C2, the second element substrate C is attached to the support substrate 1 when the temperature returns to room temperature. Since it can be located at a desired position, high-quality image output is possible.

DESCRIPTION OF SYMBOLS 1 Support substrate 4 Liquid discharge head C1 1st element substrate C2 2nd element substrate

Claims (11)

A liquid ejection head that bonds the element substrate to the support substrate by disposing a heated element substrate on the support substrate and curing a thermosetting adhesive interposed between the element substrate and the support substrate. A manufacturing method of
Determining an arrangement position of the heated element substrate in the first direction on the support substrate based on an amount of expansion in the first direction when the element substrate is heated;
Arranging the heated element substrate at the arrangement position of the support substrate, and bonding the element substrate to the support substrate;
The arrangement position is determined such that a reference point of the element substrate is positioned in a desired region in the first direction of the support substrate when the element substrate returns to a temperature before heating. Manufacturing method of the discharge head.   The disposing the heated element substrate at the disposition position of the support substrate includes disposing the reference point at a target position of the support substrate determined based on the expansion amount. A method for manufacturing the liquid discharge head described above.   The method of manufacturing a liquid ejection head according to claim 2, wherein the target position is obtained as a relative position with respect to a reference point of an element substrate already bonded to the support substrate.   4. The liquid ejection head according to claim 3, wherein the reference point of the element substrate and the already bonded element substrate are alignment marks respectively formed on the element substrate and the already bonded element substrate. Manufacturing method.   5. The method of manufacturing a liquid ejection head according to claim 3, wherein a position of the reference point of the element substrate and a position of the reference point of the already bonded element substrate is detected by image processing.   The expansion amount is obtained by detecting a position of the reference point before and after heating the element substrate and calculating the expansion amount based on a difference between positions of the reference point before and after heating. Item 6. The method for manufacturing a liquid discharge head according to any one of Items 1 to 5.   The expansion amount is determined in advance by detecting the position of the reference point before heating the other element substrate, detecting the position of the reference point after heating the element substrate, and before heating the other element substrate. 6. The liquid ejection according to claim 1, wherein the liquid ejection is obtained by calculating the expansion amount based on a difference in position between the reference point and the reference point after the element substrate is heated. Manufacturing method of the head.   The expansion amount is calculated in advance based on the detection of the position of the reference point before and after heating the other element substrate and the difference in the position of the reference point before and after the heating of the other element substrate. 6. The method of manufacturing a liquid ejection head according to claim 1, wherein the liquid ejection head is obtained by:   The element substrate has a longitudinal direction parallel to the first direction and a short direction parallel to the second direction, and the expansion amount of the element substrate in the second direction is the same as the first direction. The arrangement position of the element substrate in the second direction is obtained based on the amount of expansion, and the arrangement position of the support substrate in the second direction when the element substrate returns to the temperature before heating is desired. The method of manufacturing a liquid ejection head according to claim 1, wherein the liquid ejection head is determined so as to be located in the region of the liquid ejection head.   The method for manufacturing a liquid discharge head according to claim 1, wherein the temperature before the heating is a use temperature of the liquid discharge head. A liquid ejection head that bonds the element substrate to the support substrate by disposing a heated element substrate on the support substrate and curing a thermosetting adhesive interposed between the element substrate and the support substrate. A manufacturing method of
Heating the element substrate from a first temperature to a second temperature at which the adhesive cures;
The element substrate heated to the second temperature is disposed on the support substrate such that a reference point of the element substrate is in a predetermined positional relationship with a predetermined position of the support substrate, and the element substrate Bonding to the support substrate,
The predetermined position is a position on the support substrate where the reference point of the element substrate should be located at the first temperature,
The predetermined positional relationship is that when the temperature of the element substrate returns to the first temperature, a deviation between the reference point and the predetermined position indicates that the reference point at the second temperature After bonding so as to coincide with the predetermined position, the liquid is determined to be smaller than a deviation between the reference point and the predetermined position when the temperature of the element substrate returns to the first temperature. Manufacturing method of the discharge head.

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