JP2019175902A - Alignment method of chip component and magnet - Google Patents

Abstract

To provide an alignment method of a chip component, capable of effectively aligning a plurality of chip components, and a magnet used for the method.SOLUTION: In an alignment device 300, an alignment method is for arranging a chip component 11 into a plurality of concave parts 110 formed in a first direction of a tool 100 of a nonmagnetic material, relatively moving a magnet 200 and the tool, and thereby aligning a plurality of chip components in each concave part so that a peripheral surface faces a first direction.SELECTED DRAWING: Figure 12

Description

  The present invention relates to a chip part aligning method in a manufacturing process of a multilayer ceramic capacitor or the like, and a magnet used in the method.

  Conventionally, in the manufacturing process of a multilayer ceramic capacitor, a technique for aligning internal electrodes of chip parts before forming external electrodes in a certain direction has been known.

  For example, in Patent Document 1, a chip part is accommodated in a concave pocket larger than the planar dimension of the chip part, and the magnet is moved from the outside of a non-magnetic pallet provided with the pocket, thereby changing the direction of the internal electrode. A method for aligning the orientation of chip components that aligns perpendicularly to the bottom of the pocket is described. In this alignment method, a magnetic force is applied to the extraction electrode of the internal electrode exposed at the end in the width direction of the chip component, and the chip component is aligned by attracting and rolling inside the pocket.

JP 2003-7574 A JP 2003-142352 A

  However, Patent Document 1 does not disclose a specific configuration of a magnet for efficiently aligning a large number of chip parts.

  In view of the circumstances as described above, it is an object of the present invention to provide a chip component aligning method and a magnet used in the method capable of efficiently aligning a large number of chip components.

In order to achieve the above object, a chip component alignment method according to an aspect of the present invention is an alignment method in which a plurality of chip components are aligned using a non-magnetic jig having a plurality of recesses.
Each chip component from which the internal electrode is exposed from the peripheral surface is disposed in each recess formed in the first direction.
A plurality of magnet pieces each including an N pole and an S pole arranged in a second direction orthogonal to the first direction are connected to each other in a third direction orthogonal to the first direction and the second direction via a nonmagnetic material. The plurality of chips in each of the recesses so that the peripheral surface faces the first direction by relatively moving the magnet having the above-described configuration and the jig in a direction orthogonal to the first direction. The parts are aligned.

In the alignment method, the magnet used for aligning the chip parts has a plurality of magnet pieces connected with a non-magnetic material interposed therebetween. Thereby, the magnet pieces adjacent in the third direction form a magnetic field as individual magnets, and magnetic fluxes formed by the magnet pieces are synthesized. The components parallel to the third direction of the magnetic flux formed by the corners of the adjacent magnet pieces are in the opposite direction, and the components parallel to the first direction and the second direction are in the same direction. For this reason, in the magnetic flux in which these are combined, components parallel to the third direction cancel each other, and components parallel to the first and second directions are superimposed.
That is, in the magnetic field formed by the magnet, a magnetic flux having a component only in the first direction and the second direction is uniformly generated along the third direction. Therefore, with the magnet, a strong magnetic force that contributes to alignment can be applied uniformly to the chip components in the jig, and alignment efficiency can be increased.

The plurality of magnet pieces may be configured in a prismatic shape symmetric with respect to a plane orthogonal to the third direction.
For example, the plurality of magnet pieces may be configured in a rectangular parallelepiped shape.
Thereby, the magnetic flux formed by each magnet piece is also symmetrical with respect to the plane. For this reason, the components parallel to the third direction in the magnetic flux can be canceled more reliably by connecting these magnet pieces in the third direction.

  In addition, since the plurality of magnet pieces are configured with the same size and shape, the symmetry of the magnetic flux formed by the magnet pieces can be further increased.

1 mm or more and 30 mm or less may be sufficient as the dimension along the said 3rd direction of the said magnet piece.
Thereby, while being able to produce a magnet easily, the magnetic force of the intensity | strength which can align the chip components of each magnet piece can be produced.

The dimension of the magnet along the third direction may be larger than the dimension of the jig along the third direction.
Thereby, the magnetic force by a magnet can be made to act on the whole 3rd direction of a jig | tool, and alignment efficiency can be improved.

A magnet according to another embodiment of the present invention is a chip component aligning magnet for aligning a plurality of chip components,
A plurality of magnet pieces each including a north pole and a south pole arranged in a uniaxial direction and connected via a nonmagnetic material in a direction orthogonal to the uniaxial direction are provided.

  As described above, according to the present invention, it is possible to provide a chip component alignment method capable of efficiently aligning a large number of chip components and a magnet used in the method.

1 is a perspective view of a multilayer ceramic capacitor according to a first embodiment of the present invention. It is sectional drawing along the AA 'line of FIG. 1 of the said multilayer ceramic capacitor. It is sectional drawing along the BB 'line | wire of FIG. 1 of the said multilayer ceramic capacitor. It is a flowchart which shows the manufacturing method of the said multilayer ceramic capacitor. It is a perspective view which shows the manufacturing process of the said multilayer ceramic capacitor. It is a perspective view which shows the manufacturing process of the said multilayer ceramic capacitor. It is a flowchart which shows the alignment method of the ceramic element | base_body (chip component) in the manufacture process of the said multilayer ceramic capacitor. It is a top view which shows the alignment process of the said ceramic body. FIG. 9 is a cross-sectional view taken along the line CC ′ of FIG. 8 showing an alignment process of the ceramic body. It is sectional drawing which shows the alignment process of the said ceramic element | base_body. It is sectional drawing which shows the alignment process of the said ceramic element | base_body. It is sectional drawing which shows the alignment process of the said ceramic element | base_body. It is sectional drawing which shows the alignment process of the said ceramic element | base_body. It is a top view which shows the alignment process of the said ceramic body. It is sectional drawing which shows the alignment process of the said ceramic element | base_body. It is a top view of the magnet used for alignment of the said ceramic body. It is a top view of the magnet piece contained in the said magnet. It is a top view of the said magnet. It is a top view of the magnet which concerns on the comparative example of this embodiment. It is a perspective view of the unbaking laminated chip (chip component) concerning a 2nd embodiment of the present invention. It is a perspective view which shows the manufacturing process of the said unbaking multilayer chip | tip. It is a perspective view of the unsintered ceramic body formed using the unsintered multilayer chip.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[Configuration of Multilayer Ceramic Capacitor 10]
1-3 is a figure which shows the multilayer ceramic capacitor 10 which concerns on 1st Embodiment of this invention. FIG. 1 is a perspective view of a multilayer ceramic capacitor 10. 2 is a cross-sectional view of the multilayer ceramic capacitor 10 taken along the line AA ′ of FIG. 3 is a cross-sectional view of the multilayer ceramic capacitor 10 taken along line BB ′ of FIG.
In the figure, an x axis, a y axis, and a z axis that are orthogonal to each other as appropriate are shown. These three axes are coordinate axes indicating the postures of the multilayer ceramic capacitor 10 and a ceramic body 11 described later.

  The multilayer ceramic capacitor 10 is a three-terminal multilayer ceramic capacitor including a ceramic body 11, a first external electrode 14, a second external electrode 15, a third external electrode 16, and a fourth external electrode 17. It is. The ceramic body 11 is configured as a chip component in the present embodiment.

  The chip component is a substantially rectangular parallelepiped component in which flat-plate internal electrodes and dielectric layers are alternately stacked in the z-axis direction, and has a length in the x-axis direction. It is assumed that the internal electrode is exposed from at least one of the surfaces (circumferential surfaces) oriented in the direction.

  In the multilayer ceramic capacitor 10, for example, the external electrodes 14 and 15 are configured as through electrodes, and the external electrodes 16 and 17 are configured as ground electrodes. The external electrodes 14 and 15 are also referred to as end surface external electrodes 14 and 15, and the external electrodes 16 and 17 are also referred to as side surface external electrodes 16 and 17.

  The ceramic body 11 includes two end faces 11a and 11b facing in the x-axis direction, two side faces 11c and 11d facing in the y-axis direction, and two main faces 11e and 11f facing in the z-axis direction. Have. The end surfaces 11 a and 11 b and the side surfaces 11 c and 11 d constitute a “peripheral surface” of the ceramic body 11. The ridges connecting the surfaces of the ceramic body 11 are chamfered, but the present invention is not limited to this. In FIG. 1, the configuration of the ceramic body 11 covered with the external electrodes 14, 15, 16, and 17 is indicated by a broken line.

  The ceramic body 11 has a length in the x-axis direction. For this reason, the areas of the end surfaces 11a and 11b substantially orthogonal to the x-axis direction are smaller than the areas of the side surfaces 11c and 11d and the main surfaces 11e and 11f extending along the x-axis direction. Further, the width dimension in the y-axis direction and the height dimension in the z-axis direction of the ceramic body 11 are substantially the same, and the difference in height dimension with respect to the width dimension is 10% or less. That is, the areas of the side surfaces 11c and 11d and the main surfaces 11e and 11f are substantially the same.

  The end surface external electrodes 14 and 15 are formed to face each other in the x-axis direction and cover the end surfaces 11a and 11b. The end face external electrodes 14 and 15 are both connected to a first internal electrode 12 described later and have the same polarity.

  The side external electrodes 16 and 17 oppose each other in the y-axis direction and are provided on the side surfaces 11c and 11d of the ceramic body 11, respectively. The side external electrodes 16 and 17 are each formed in a strip shape extending in the z-axis direction from one main surface 11e to the other main surface 11f. The side external electrodes 16 and 17 are both connected to a second internal electrode 13 to be described later, have the same polarity, and have a polarity different from that of the end surface external electrodes 14 and 15.

  The external electrodes 14, 15, 16, and 17 are formed of a good electrical conductor. For example, copper (Cu), nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), silver (Ag), as a good electrical conductor for forming the external electrodes 14, 15, 16, and 17, Examples thereof include metals or alloys mainly composed of gold (Au).

  The ceramic body 11 includes a laminated portion 18 and a cover portion 19. The stacked portion 18 has a configuration in which the internal electrodes 12 and 13 are alternately stacked in the z-axis direction via the ceramic layer 20. The cover portion 19 covers the upper and lower surfaces of the stacked portion 18 in the z-axis direction.

  The first internal electrode 12 is formed in a strip shape extending over the entire length of the ceramic body 11 in the x-axis direction. The first internal electrode 12 includes lead portions 12a and 12b exposed at the end faces 11a and 11b, and is connected to the end face external electrodes 14 and 15 via the lead portions 12a and 12b.

  The second internal electrode 13 is formed at the center of the ceramic body 11 in the xy plane. The second internal electrode 13 includes lead portions 13a and 13b exposed on the side surfaces 11c and 11d, and is connected to the side surface external electrodes 16 and 17 by the lead portions 13a and 13b. The width dimension in the y-axis direction of the first internal electrode 12 and the width dimension in the y-axis direction of the second internal electrode 13 excluding the lead portions 13a and 13b are formed substantially the same.

  With such a configuration, in the multilayer ceramic capacitor 10, when a voltage is applied between the end face external electrodes 14 and 15 and the side face external electrodes 16 and 17, a gap between the first internal electrode 12 and the second internal electrode 13 is obtained. A voltage is applied to the plurality of ceramic layers 20. Thereby, in the multilayer ceramic capacitor 10, charges corresponding to the voltage between the end face external electrodes 14, 15 and the side face external electrodes 16, 17 are stored.

The ceramic layer 20 is formed of a dielectric ceramic having a high dielectric constant in order to increase the capacity. Examples of the dielectric ceramic having a high dielectric constant include a perovskite structure material containing barium (Ba) and titanium (Ti) typified by barium titanate (BaTiO ₃ ).

The ceramic layer 20 is made of strontium titanate (SrTiO ₃ ), calcium titanate (CaTiO ₃ ), magnesium titanate (MgTiO ₃ ), calcium zirconate (CaZrO ₃ ), calcium zirconate titanate (Ca (Zr, Ti) O ₃ ), barium zirconate (BaZrO ₃ ), titanium oxide (TiO ₂ ), and the like may be used.

  The cover part 19 is also formed of dielectric ceramics. The material for forming the cover portion 19 may be an insulating ceramic, but the internal stress in the ceramic body 11 is suppressed by using a dielectric ceramic similar to the ceramic layer 20.

  The internal electrodes 12 and 13 are good electrical conductors and are formed of a ferromagnetic material. As a material for forming the internal electrodes 12 and 13, for example, a metal or alloy containing nickel (Ni) as a main component can be cited.

  The configuration of the multilayer ceramic capacitor 10 according to the present embodiment is not limited to the configuration shown in FIGS. For example, the number of internal electrodes 12 and 13 can be appropriately determined according to the size and performance required for the multilayer ceramic capacitor 10.

[Method of Manufacturing Multilayer Ceramic Capacitor 10]
FIG. 4 is a flowchart showing a method for manufacturing the multilayer ceramic capacitor 10. 5 and 6 are diagrams schematically showing a manufacturing process of the multilayer ceramic capacitor 10. Hereinafter, a method for manufacturing the multilayer ceramic capacitor 10 will be described along FIG. 4 with reference to FIGS. 5 and 6 as appropriate.

(Step S11: Preparation of unfired ceramic body 111)
In step S11, the first ceramic sheet 101 and the second ceramic sheet 102 for forming the laminated portion 18 and the third ceramic sheet 103 for forming the cover portion 19 are laminated as shown in FIG. Thus, an unfired ceramic body 111 is produced.

  The ceramic sheets 101, 102, and 103 are configured as unfired dielectric green sheets mainly composed of dielectric ceramics. The ceramic sheets 101, 102, and 103 are formed into a sheet shape using, for example, a roll coater or a doctor blade. The thickness of the ceramic sheets 101, 102, 103 can be adjusted as appropriate.

  As shown in FIG. 5, an unfired first internal electrode 112 corresponding to the first internal electrode 12 is formed on the first ceramic sheet 101, and an unfired first internal electrode 112 corresponding to the second internal electrode 13 is formed on the second ceramic sheet 102. A fired second internal electrode 113 is formed. Internal electrodes are not formed on the third ceramic sheet 103.

  The internal electrodes 112 and 113 can be formed by applying a conductive paste to the ceramic sheets 101 and 102. For the application of the conductive paste, for example, a screen printing method or a gravure printing method can be used.

  As shown in FIG. 5, the first ceramic sheets 101 and the second ceramic sheets 102 are alternately stacked in the z-axis direction, and the third ceramic sheets 103 are stacked vertically in the z-axis direction of the stacked body. Thereby, an unfired ceramic body 111 is produced.

  The unfired ceramic body 111 is integrated by pressing the ceramic sheets 101, 102, 103. For pressure bonding of the ceramic sheets 101, 102, 103, for example, hydrostatic pressure or uniaxial pressure is used.

  In the above description, the unfired ceramic body 111 corresponding to one ceramic body 11 has been described. However, actually, a laminated sheet configured as a large sheet that is not separated into individual pieces is formed, and the ceramic body is formed. Each body 111 is singulated.

(Step S12: Firing)
In step S12, the unfired ceramic body 111 obtained in step S11 is sintered to produce the ceramic body 11 shown in FIGS. Thereby, the laminated part 18 corresponding to the laminated body of the ceramic sheets 101 and 102 and the cover part 19 corresponding to the laminated body of the ceramic sheet 103 are formed. Firing can be performed, for example, in a reducing atmosphere or a low oxygen partial pressure atmosphere. The unfired ceramic body 111 may be fired and then chamfered by barrel polishing or the like.

  As shown in FIG. 6, in the ceramic body 11, the first internal electrodes 12 are exposed at the end faces 11a and 11b, and the second internal electrodes 13 are exposed at the side faces 11c and 11d.

(Step S13: Formation of external electrodes 14, 15, 16, 17)
In step S <b> 13, external electrodes 14, 15, 16, and 17 are formed on the ceramic body 11. The external electrodes 14, 15, 16, and 17 are formed by applying a conductive paste to the ceramic body 11 and baking the conductive paste.

For the application of the conductive paste to the ceramic body 11, for example, a coating device such as a roller coating machine or a dip coating machine can be used.
The conductive paste can be baked, for example, in a reducing atmosphere or a low oxygen partial pressure atmosphere.

  Referring to FIG. 1, end surface external electrodes 14 and 15 are formed to cover end surfaces 11a and 11b. Application of the conductive paste to the end surfaces 11a and 11b is typically performed by holding the ceramic body 11 with a jig and maintaining the end surfaces 11a and 11b in a posture in the vertical direction. At this time, from the viewpoint of production efficiency, it is preferable that a plurality of ceramic bodies 11 are aligned in the above-described posture and the ceramic bodies 11 are processed simultaneously.

  The end surfaces 11a and 11b have smaller areas than the side surfaces 11c and 11d and the main surfaces 11e and 11f extending in the x-axis direction, which is the longitudinal direction. For this reason, by inserting the ceramic element body 11 into a jig having an opening of a size that allows only the end faces 11a and 11b to be inserted, the ceramic body 11 can be relatively easily aligned in the above posture.

  On the other hand, the side external electrodes 16 and 17 are provided in regions where the second internal electrodes 113 on the side surfaces 11c and 11d are exposed. In applying the conductive paste to the side surfaces 11c and 11d, it is preferable to align the plurality of ceramic bodies 11 so that the side surfaces 11c and 11d are oriented in the vertical direction.

  However, since the side surfaces 11c and 11d are surfaces having a length in the x-axis direction, the side surfaces 11c and 11d are larger than the end surfaces 11a and 11b and are close to the main surfaces 11e and 11f. For this reason, if the ceramic body 11 is simply inserted into a jig having an opening into which the side surfaces 11c and 11d can be inserted, either surface may face the opening side. Therefore, it is difficult to selectively direct only the side surfaces 11c and 11d in the vertical direction.

  Therefore, in the present embodiment, the plurality of ceramic bodies 11 can be aligned by the following alignment method so that the side surfaces 11c and 11d face a fixed direction.

[Method of aligning ceramic body 11]
FIG. 7 is a flowchart showing a method for aligning the ceramic body 11. 8 to 19 are diagrams schematically showing an alignment process of the ceramic body 11. Hereinafter, an alignment method of the multilayer ceramic capacitor 10 will be described along FIG. 7 with reference to FIGS.
8 to 19 show an X axis, a Y axis, and a Z axis that are orthogonal to each other. The X-axis direction and the Y-axis direction indicate the planar direction of the jig 100 described later, and the Z-axis direction indicates the thickness direction of the jig 100.
In addition, an x axis, a y axis, and a z axis that indicate the posture of the ceramic body 11 are also shown as necessary.

(Step S21: Preparation of jig 100)
In step S21, a jig 100 used for aligning the plurality of ceramic element bodies 11 is prepared.

8 is a plan view showing the jig 100, and FIG. 9 is a cross-sectional view of the jig 100 taken along the line CC ′ of FIG.
The jig 100 has a lower surface 100a and an upper surface 100b facing in the Z-axis direction, and is configured in a flat plate shape that extends in the XY plane as a whole. Typically, the jig 100 is arranged so that the Z-axis direction is in the vertical direction. The lower surface 100a is configured as an outer bottom surface of the jig 100 facing downward in the Z axis.

  The jig 100 is made of a metal or a nonmetal nonmagnetic material. Thereby, it can prevent that the jig | tool 100 is magnetized by the magnet 200 mentioned later, and the behavior of the ceramic element | base_body 11 can be stabilized.

  The jig 100 has a plurality of recesses 110 formed in the Z-axis direction from the upper surface 100b toward the lower surface 100a. The plurality of recesses 110 are arranged in the X-axis direction and the Y-axis direction, respectively.

  Each recess 110 is configured as a pocket in which each ceramic body 11 can be placed. Each recess 110 is partitioned by partitions 120 arranged in a lattice shape along the X-axis direction and the Y-axis direction. A surface of the partition 120 facing upward in the Z-axis direction constitutes an upper surface 100b. In addition, the number of the recessed parts 110 in the jig | tool 100 is not limited to the example of illustration.

FIG. 10 is a partially enlarged view of FIG. 9 showing a cross section of the recess 110.
The recess 110 has a bottom surface 110a and an opening 110b. The opening 110b is formed in the upper surface 100b, and is configured so that the ceramic body 11 can be inserted.

  The bottom surface 110a is a flat surface facing in the Z-axis direction, and has a rectangular planar shape including two sides along the X-axis direction and two sides along the Y-axis direction. The bottom surface 110a may be larger than each surface of the ceramic body 11 and may have a size that allows the ceramic body 11 disposed in the recess 110 to rotate.

  In addition, the long side of the illustrated bottom surface 110a is parallel to the Y-axis direction, and the short side is parallel to the X-axis direction, but is not limited thereto. For example, the long side of the bottom surface 110a may be parallel to the X-axis direction, and the short side may be parallel to the Y-axis direction.

  The depth dimension D1 along the Z-axis direction of the recess 110 is configured to be smaller than the width dimension W along the y-axis direction of the ceramic body 11. With this configuration, when the side surfaces 11c and 11d are aligned in a posture oriented in the Z-axis direction, one of the side surfaces 11c and 11d protrudes from the opening 110b, and handling in subsequent processes can be improved. The width dimension W of the ceramic body 11 is the largest dimension along the y-axis direction.

  The depth dimension D1 of the recess 110 is a dimension along the Z-axis direction from the upper surface 100b surrounding the periphery of the recess 110 to the bottom surface 110a of the recess 110. The depth dimension D1 when the upper surface 100b is a curved surface is the above-described dimension at the highest position in the Z-axis direction on the upper surface 100b around the recess 110. In addition, it is not limited to the said structure, The depth dimension D1 of the recessed part 110 may be larger than the width dimension W. FIG.

(Step S22: Arrangement of the ceramic body 11 in the recess 110)
In step S <b> 22, the plurality of ceramic element bodies 11 are respectively arranged in the recesses 110 of the jig 100. One ceramic body 11 is disposed in each recess 110.

FIG. 11 is a cross-sectional view showing step S22, and shows a cross-section at the same position as in FIG.
In step S <b> 22, the ceramic body 11 is randomly transferred onto the jig 100, and at least one of vibration and inclination is applied to the jig 100. The vibration may be applied in any direction as shown in FIG. The inclination may be given around the Y axis as shown by the white arrow in FIG. 11 or around other axes.

  Thereby, many ceramic body 11 can be arrange | positioned in the recessed part 110 in a short time. Furthermore, by destabilizing the posture of each ceramic body 11 by vibration or inclination, the ceramic body 11 can have a stable posture with a low center of gravity. That is, each ceramic body 11 can be arranged in a posture in which the main surfaces 11e and 11f or the side surfaces 11c and 11d face the Z-axis direction.

  In addition, among the ceramic body 11 transferred onto the jig 100, the ceramic body 11 that is not disposed in the recess 110 is removed before step S23.

(Step S23: Alignment)
In step S23, the plurality of ceramic elements 11 in the jig 100 are aligned using the magnet 200 so that the side surfaces 11c and 11d face the Z-axis direction.

FIG. 12 is a cross-sectional view showing step S23 and shows a cross-section at the same position as in FIG.
The jig 100 and the magnet 200 constitute the alignment device 300 of the present embodiment.

  The magnet 200 moves in the plane direction while applying a magnetic force to the ceramic body 11 in the jig 100. FIG. 12 shows an example in which the magnet 200 is moved in the X-axis direction along the lower surface 100a. A white arrow in FIG. 12 indicates a moving direction of the magnet 200. The magnet 200 may be moved along the direction orthogonal to the Z-axis direction, that is, along the plane direction of the jig 100, or may be moved in the Y-axis direction.

  The magnet 200 has an N-pole part 210 and an S-pole part 220 that face each other in the X-axis direction. The magnet 200 applies a magnetic force rotating around the Y axis to the ceramic body 11 to align the ceramic body 11.

  13 to 15 are partial enlarged views of FIG. 12, and are diagrams illustrating an example of the behavior of the ceramic body 11 in the recess 110.

  FIG. 13 shows a state in which the magnet 200 is approaching the ceramic body 11. The ceramic body 11 of FIG. 13 is disposed in the recess 110 in such a posture that the internal electrodes 12 and 13 are parallel to the X-axis direction and the main surfaces 11e and 11f are oriented in the Z-axis direction.

  The magnetic flux F <b> 1 is a magnetic flux that rotates around the Y axis from the N pole portion 210 toward the S pole portion 220. The magnetic flux F1 is represented by a magnetic field line that has at least a component parallel to the X-axis direction and does not have a component parallel to the Y-axis direction. When the magnet 200 approaches the ceramic body 11, the lead-out portions 13a and 13b of the side surfaces 11c and 11d through which the magnetic flux F1 easily passes and the second internal electrode 13 including the same are magnetized.

  Then, as shown in FIG. 14, as the magnet 200 passes through the ceramic element body 11, the second internal electrode 13 is affected by the magnetic flux F <b> 1 having a component parallel to the X-axis direction and the Z-axis direction. Receives moment to rotate around the axis.

  Furthermore, when the magnetic flux F1 having a component parallel to the Z-axis direction passes, the magnetized lead portions 13a and 13b are attracted to the bottom surface 110a. Therefore, as shown in FIG. 15, the ceramic body 11 after the magnet 200 has passed is in a posture in which the side surfaces 11 c and 11 d face the Z-axis direction.

  For the ceramic body 11 in which the side surfaces 11c and 11d face the Z-axis direction before the magnetic flux F1 acts, when the magnet 200 approaches, the lead portions 13a and 13b are magnetized by the magnetic flux F1 parallel to the Z-axis direction. To do. For this reason, one of the side surfaces 11c and 11d is attracted to the bottom surface 110a of the recess 110, and the posture of the ceramic body 11 is constrained. Therefore, even after the magnet 200 passes, the posture in which the side surfaces 11c and 11d face the Z-axis direction is maintained.

Thus, in step S23, the ceramic body 11 can be rotated by the magnetic flux F1 formed by the magnet 200 so that the side surfaces 11c and 11d face the Z-axis direction. Thereby, the several ceramic element | base_body 11 can be aligned easily and for a short time.
Further, by using the magnet 200 having the following configuration, the magnetic flux F1 can be uniformly formed with a sufficient magnetic flux density, and the alignment efficiency can be increased.

[Composition of magnet]
FIG. 16 is a plan view of a part of the magnet 200 and the jig 100 viewed from the Z-axis direction.
The magnet 200 is configured in a bar shape extending in the Y-axis direction as a whole. The dimension D2 in the Y-axis direction of the magnet 200 is configured to be larger than the dimension D3 in the X-axis direction in which the N-pole part 210 and the S-pole part 220 are arranged. Furthermore, the dimension D2 of the magnet 200 in the Y-axis direction is configured to be larger than the dimension D4 of the jig 100 in the Y-axis direction. Thereby, the whole Y-axis direction of the jig | tool 100 can be covered with the one magnet 200, and alignment efficiency can be improved.

  The magnet 200 has a plurality of magnet pieces 230 connected in the Y-axis direction via a nonmagnetic material. The magnet piece 230 is made of a ferromagnetic material, and is preferably made of a permanent magnet such as a neodymium magnet, a ferrite magnet, or an alnico magnet. The number of magnet pieces 230 in the magnet 200 is not limited to the illustrated example, and can be set as appropriate according to the size of the magnet piece 230 and the dimension D4 of the magnet 200 in the Y-axis direction.

  The magnet piece 230 is a so-called square magnet configured in a rectangular parallelepiped shape. The rectangular parallelepiped shape includes a shape in which a ridge connecting each surface is chamfered. Each magnet piece 230 is configured with the same size and shape. The size of the magnet piece 230 can be appropriately set according to the size of the ceramic body 11 and the required magnetic force. For example, the dimension D5 along the Y-axis direction of the magnet piece 230 can be 1 mm or more and 30 mm or less. As a result, the work for connecting the magnet pieces 230 can be facilitated, and the uniformity in the direction and strength of the magnetic field formed by the magnet 200 can be improved as will be described later.

  Each magnet piece 230 has an N pole 231 and an S pole 232 arranged side by side in the X-axis direction. The magnet pieces 230 adjacent in the Y-axis direction are arranged so that the same poles face each other in the Y-axis direction.

An adhesive layer 240 is provided between the adjacent magnet pieces 230. Thereby, the magnet pieces 230 having repulsive force acting in the Y-axis direction can be connected.
The adhesive layer 240 is a non-magnetic material and is formed of a material that can adhere the magnet pieces 230. For example, the adhesive layer 240 is formed of a synthetic resin adhesive such as an epoxy adhesive or an acrylic adhesive, a resin tape, or the like. By making the adhesive layer 240 non-magnetic, the magnet pieces 230 adjacent in the Y-axis direction are magnetically separated, and a magnet 200 having a structure in which the same poles of a plurality of square magnets are arranged in parallel is manufactured. can do.

  Specifically, the adhesive layer 240 is provided on at least a part of the side surfaces 230c and 230d (see FIG. 17) facing the Y-axis direction of the magnet piece 230. The thickness dimension along the Y-axis direction of the adhesive layer 240 can be set to, for example, 50 μm to 1 mm. The thickness of the adhesive layer 240 may be non-uniform, and in that case, the dimension of the thickest portion can be the above dimension. Adhesive strength can be sufficiently ensured by setting the thickness dimension of the adhesive layer 240 to 50 μm or more. In addition, by setting the thickness dimension to 1 mm or less, the adjacent magnet pieces 230 can be sufficiently close to each other, and the direction of the lines of magnetic force formed by the magnetic flux of the entire magnet 200 can be made uniform. Details of the magnetic flux in the magnet 200 will be described later.

FIG. 17 is a plan view of the magnet piece 230 as viewed from the Z-axis direction, and shows an example of the configuration of the magnet piece 230 and the magnetic flux distribution formed by the magnet piece 230.
The magnet piece 230 has end surfaces 230a and 230b facing in the X-axis direction, a pair of side surfaces 230c and 230d facing in the Y-axis direction, and an upper surface 230e and a lower surface 230f facing in the Z-axis direction.

  A magnetic flux F1 that does not have a component parallel to the Y-axis direction and contributes to the alignment of the ceramic body 11 extends from the central part C of the magnet piece 230 in the Y-axis direction. On the other hand, magnetic fluxes F21 and F22, which are different from the magnetic flux F1, extend from the corner portion R including the portion where the end surfaces 230a and 230b, the side surfaces 230c and 230d, and the upper and lower surfaces 230e and 230f are in contact with each other.

  The magnetic fluxes F21 and F22 are magnetic fluxes having a component parallel to the Y-axis direction, and are represented by magnetic field lines that are convexly curved in the Y-axis direction when viewed from the Z-axis direction. The magnetic flux F21 on the side surface 230c side and the magnetic flux F22 on the side surface 230d side are configured symmetrically with respect to a plane orthogonal to the Y-axis direction. The magnetic fluxes F <b> 21 and F <b> 22 may cause a magnetic force that rotates around the axis intersecting the Y axis to act on the ceramic body 11, and may promote unnecessary behavior for alignment. Further, since the corner portion R includes a portion where the three surfaces are in contact with each other, the magnetic poles are concentrated compared to the central portion C, and the value of the magnetic flux density is larger than that of the central portion C.

  Therefore, in this embodiment, by connecting the magnet pieces 230 in the Y-axis direction, the magnetic fluxes F21 and F22 can be combined, and the magnetic flux F1 can be formed densely over the entire Y-axis direction of the magnet 200.

FIG. 18 is a plan view of the magnet 200 viewed from the Z-axis direction, and shows an example of a magnetic flux distribution formed by the magnet 200. FIG.
The Y-axis direction end portion (end portion) 250 of the magnet 200 includes a corner portion R of the magnet piece 230 located outward in the Y-axis direction. That is, magnetic fluxes F21 and F22 represented by magnetic flux lines protruding outward in the Y-axis direction are formed at the end portion 250.

  In the intermediate portion (intermediate portion) 260 in the Y-axis direction of the magnet 200 positioned between the end portions 250, the magnetic fluxes F21 and F22 are combined because the corner portions R of the adjacent magnet pieces 230 are close to each other. The components parallel to the X-axis direction and the Z-axis direction of the magnetic fluxes F21 and F22 are superimposed because they are in the same direction, but the components parallel to the Y-axis direction are reversed and cancel each other. Therefore, a uniform and dense magnetic flux F <b> 1 is formed in the intermediate portion 260 of the magnet 200.

  On the other hand, in the case of the magnet 400 composed of a permanent magnet extending in the Y-axis direction instead of the magnet having the above configuration, the magnetic flux distribution as shown in FIG. 19 is obtained. Similarly to the magnet 200, the magnet 400 has an N-pole part 410 and an S-pole part 420 arranged in the X-axis direction.

  In magnet 400, the magnetic fluxes of other magnets are not synthesized. Further, the corner portions R ′ where the three surfaces are in contact with each other are separated in the Y-axis direction. For this reason, the magnetic flux density gradually decreases from the corner R ′ toward the Y-axis direction center C ′. For this reason, a difference occurs in the magnitude of the magnetic force acting between the center and the peripheral edge of the jig 100, and insufficient rotation of the ceramic body 11 disposed at the center of the jig 100 is likely to occur.

  Further, in the magnet 400, the region where the magnetic flux F1 is formed is limited to the central portion C ′. For this reason, only a part of the ceramic body 11 in the jig 100 is subjected to a magnetic force in a direction suitable for alignment, and the overall alignment efficiency of the jig 100 cannot be improved.

  In the present embodiment, the magnet 200 includes a plurality of magnet pieces 230 connected via a nonmagnetic material, whereby the magnetic flux F1 can be formed uniformly and densely along the Y-axis direction. Therefore, a sufficient magnetic force can be applied to the alignment of the ceramic body 11 over the entire jig 100, and the alignment efficiency of the ceramic body 11 can be increased.

  Further, the size of the magnet 200 can be freely adjusted according to the size of the jig 100 by adjusting the number of the magnet pieces 230. Further, the magnetic force is not reduced by adjusting the size. Thereby, the desired alignment efficiency can be obtained regardless of the size of the jig 100 used.

<Second Embodiment>
In the above-described embodiment, the ceramic body 11 of the three-terminal multilayer ceramic capacitor 10 has been described as a chip component. However, the present invention is not limited to this.
In the present invention, for example, an unfired laminated chip in which an unfired internal electrode and a ceramic green sheet are laminated can be applied as a chip component.

FIG. 20 is a perspective view showing an unfired laminated chip 216.
The laminated chip 216 includes unfired laminated bodies 218 in which the unfired first internal electrodes 212 and the second internal electrodes 213 are alternately laminated in the z-axis direction via the unfired ceramic layers 214, and the laminated body 218. an unfired cover portion 219 that covers the upper and lower sides in the z-axis direction. The multilayer chip 216 is configured as a chip component of this embodiment.

  The multilayer chip 216 has two end faces 216a and 216b facing in the x-axis direction, two side faces 216c and 216d facing in the y-axis direction, and two main faces 216e and 216f facing in the z-axis direction. . The internal electrodes 212 and 213 are exposed from the side surfaces 216c and 216d. The first internal electrode 212 is exposed from the end face 216a, and the second internal electrode 213 is exposed from the end face 216b.

  The unfired laminated chip 216 is formed by cutting the large laminated sheet 204 shown in FIG. 21 along predetermined cutting lines along the x-axis direction and the y-axis direction.

  In the laminated sheet 204, the unfired first ceramic sheets 201 and the unfired second ceramic sheets 202 on which the unfired second internal electrodes 213 are formed are alternately laminated in the z-axis direction. The laminated body of the ceramic sheets 201 and 202 corresponds to the unfired laminated body 218.

  Each of the internal electrodes 212 and 213 is formed in a band-shaped pattern along the y-axis direction, and a plurality of the band-shaped patterns are arranged apart from each other in the x-axis direction. However, the internal electrodes 212 and 213 are patterned by shifting by one element in the x-axis direction.

  In addition, a ceramic sheet 203 on which no internal electrode is formed is laminated above and below the laminated body of ceramic sheets 201 and 202 in the z-axis direction. The region where the ceramic sheets 203 are laminated corresponds to the unfired cover portion 219.

  The laminated sheet 204 is pressure-bonded in the same manner as the unfired ceramic body 111 of the first embodiment. The laminated sheet 204 thus bonded is cut at a predetermined position along the x-axis direction, and cut at a position where one of the internal electrodes 212 and 213 is not formed along the y-axis direction, as shown in FIG. A laminated chip 216 can be formed.

  Subsequently, unfired side margin portions 217 are formed on both side surfaces 216c and 216d of the multilayer chip 216 by sticking a ceramic sheet or applying ceramic slurry. Thereby, the unfired ceramic body 211 shown in FIG. 22 is formed.

In the step of forming the side margin portion 217, it is preferable to align the plurality of laminated chips 216 in a posture in which the side surfaces 216c and 216d where the internal electrodes 212 and 213 are exposed are directed in the vertical direction from the viewpoint of production efficiency.
Therefore, the laminated chips 216 can be aligned by applying the alignment method of steps S21 to S23 described in the first embodiment.

  That is, each laminated chip 216 is disposed in the concave portion 110 of the jig 100 and the magnet 200 is moved along the X-axis direction, thereby aligning the laminated chips 216 so that the side surfaces 216c and 216d face the Z-axis direction.

  Thereby, the process of forming the side margin part 217 with respect to the some laminated | multilayer chip | tip 216 of the same attitude | position where the side surfaces 216c and 216d faced the Z-axis direction can be performed, and production efficiency can be improved.

  As mentioned above, although each embodiment of the present invention was described, the present invention is not limited to the above-mentioned embodiment, and it is needless to say that various changes can be made without departing from the gist of the present invention. For example, the embodiment of the present invention can be an embodiment in which the embodiments are combined.

  In the above-described embodiment, the mode of moving the magnet 200 has been described. However, in the present invention, the magnet 200 and the jig 100 may be relatively moved. That is, the magnet 200 may be fixed and the jig 100 may be moved, or both the magnet 200 and the jig 100 may be moved. Also in these cases, the moving direction is the plane direction of the jig 100 orthogonal to the Z-axis direction.

  The magnet 200 to which the magnet piece 230 is connected may have a cover member that covers the surface. Thereby, the discreteness of each magnet piece can be prevented more reliably. As a material of the cover member, a magnetic body that does not reduce the magnetic force of the magnet 200 is preferable.

  The magnet may be composed of a plurality of rows in which a plurality of magnet pieces 230 are continuous in the Y-axis direction. When there are a plurality of rows of magnet pieces 230, the magnet poles 230 adjacent to each other in the X-axis direction may be arranged so as to face each other in the Y-axis direction.

  The configuration of the magnet pieces is not limited to a rectangular parallelepiped shape. For example, like a trapezoidal column, it is a prismatic shape configured symmetrically with respect to a plane orthogonal to the Y-axis direction, and each magnet piece may have the same shape. Thereby, the components parallel to the Y-axis direction of the magnetic flux extending from the corner R of the adjacent magnet piece are reversed and cancel each other, and the magnetic flux F1 can be configured with a uniform strength. In addition, also in this case, the ridge part which connects each surface may be chamfered. Moreover, the size of each magnet piece may differ.

  In the first embodiment, the ceramic body of a three-terminal type multilayer ceramic capacitor has been described as a chip component. However, a multi-terminal type multilayer ceramic capacitor in which a plurality of external electrodes are formed on the side surface can also be applied.

  Although it has been described as a method for manufacturing a multilayer ceramic capacitor that an unfired ceramic body is fired and then an external electrode is formed, the present invention is not limited to this. For example, a conductive paste can be applied to an unfired ceramic body, and the ceramic body and the external electrode can be fired simultaneously. In this case, the alignment method of the present invention can be applied using an unfired ceramic body as a chip component.

  Each dimension of the alignment apparatus 500 is not limited to the above, and can be set as appropriate according to the size of the chip component and the production scale of the multilayer ceramic capacitor.

10 ... Multilayer ceramic capacitor 11 ... Ceramic body (chip parts)
12, 13, 212, 213... Internal electrode 216... Unfired multilayer chip (chip component)
11a, 11b, 216a, 216b ... end face 11c, 11d, 216c, 216d ... end face 11e, 11f, 216e, 216f ... end face 100 ... jig 200 ... magnet 230 ... magnet piece 231 ... N pole 232 ... S pole 300 ... alignment device

Claims (7)

An alignment method for aligning a plurality of chip parts using a non-magnetic jig having a plurality of recesses,
Each chip component from which the internal electrode is exposed from the peripheral surface is disposed in each recess formed in the first direction,
A plurality of magnet pieces each including an N pole and an S pole arranged in a second direction orthogonal to the first direction are connected to each other in a third direction orthogonal to the first direction and the second direction via a nonmagnetic material. The plurality of chips in each of the recesses so that the peripheral surface faces the first direction by relatively moving the magnet having the configuration described above and the jig in a direction orthogonal to the first direction. Aligning parts Chip chip alignment method. The chip part alignment method according to claim 1,
The plurality of magnet pieces are configured in a prismatic shape symmetric with respect to a plane orthogonal to the third direction. The chip part alignment method according to claim 2,
The plurality of magnet pieces are configured in a rectangular parallelepiped shape. A chip component alignment method according to any one of claims 1 to 3,
The plurality of magnet pieces are all configured with the same size and shape. A chip part aligning method according to any one of claims 1 to 4,
The dimension along the said 3rd direction of the said magnet piece is 1 mm or more and 30 mm or less The chip component alignment method. A chip component alignment method according to any one of claims 1 to 5,
The dimension of the magnet along the third direction is larger than the dimension of the jig along the third direction. A chip part aligning magnet for aligning a plurality of chip parts,
A magnet comprising a plurality of magnet pieces each including a north pole and a south pole arranged in a uniaxial direction and connected via a nonmagnetic material in a direction orthogonal to the uniaxial direction.

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