JP2019161979A - Power conversion device - Google Patents

Abstract

To provide a power conversion device capable of securely cooling a capacitor module.SOLUTION: On a capacitor case 14 formed of a metal material or a synthetic resin of a capacitor module 10, a cooling water supply path 16 and a cooling water discharge path 17 are formed. A power semiconductor module 11 has a module body 11A, and is provided integrally with a cooler 11B for power semiconductor having a power semiconductor coolant flow passage provided therein. The capacitor case 14 and the cooler 11B for power semiconductor are joined to each other in a surface-contact state, and the cooling water supply path 16, and the cooling water discharge path 17 and the power semiconductor coolant flow passage are directly connected to each other to circulate a cooling medium therethrough.SELECTED DRAWING: Figure 8

Description

  The present invention relates to a power conversion device including a power semiconductor module and a capacitor module.

As this type of power conversion device, a power conversion device described in Patent Document 1 is known.
This power conversion device forms a power semiconductor module that converts DC power into AC power, a capacitor module that smoothes voltage and current, a DC input connector, an AC output connector, a cooler in which a cooling medium circulates, and a storage space Equipped with a housing. A power semiconductor module in which a capacitor module, a DC input connector, and an AC output connector are stored in the housing space of the housing, and an opening communicating with the housing space is formed on the outer wall of the housing, and a cooler is joined. Is inserted through the opening and disposed in the storage space, and the opening is closed and fixed with a cooler.
And the power semiconductor module which generate | occur | produced heat | fever by switching operation is cooled by flowing a cooling medium in the cooling chamber of a cooler.
Since the power converter of this patent document 1 uses the cooler which obstruct | occludes an opening part and is fixed as a part of housing | casing, it can aim at reduction of manufacturing cost.

JP 2017-60291 A

By the way, the power converter of Patent Document 1 generates a large amount of heat in the capacitor module when smoothing the voltage and current, and heat is transferred to the housing by contacting the capacitor module with the inner wall of the housing, and the opening portion. The condenser module is cooled by cooling the casing with a cooler that closes the casing.
However, in the structure in which the cooler cools the capacitor module via the housing, the cooling efficiency during power conversion may be reduced.
Then, this invention aims at providing the power converter device which can cool a capacitor | condenser module reliably.

  In order to achieve the above object, a power converter according to an aspect of the present invention includes a power semiconductor module that converts DC power into AC power, a capacitor module that smoothes voltage and current, a power semiconductor module, and a capacitor module. The housing | casing which accommodates is provided. In the capacitor module, a capacitor refrigerant flow path is embedded in a capacitor case formed of a metal material or a synthetic resin. The power semiconductor module is integrally provided with a power semiconductor cooler having a power semiconductor refrigerant flow path provided therein. The condenser case and the power semiconductor cooler are joined in a surface contact state, and the condenser refrigerant flow path and the power semiconductor refrigerant flow path are directly connected to circulate the cooling medium.

  According to the power conversion device of the present invention, the capacitor module can be reliably cooled.

It is a perspective view showing the power converter of a 1st embodiment concerning the present invention. It is the figure which showed the apparatus which comprises the power converter device of 1st Embodiment with the perspective view. It is a side view of the apparatus which comprises the power converter device of 1st Embodiment. It is a perspective view which shows the capacitor | condenser module which comprises the power converter device of 1st Embodiment. It is a figure which shows the structure of the power semiconductor side supply connection port of the capacitor | condenser module which comprises the power converter device of 1st Embodiment. It is a perspective view which shows the state which joined the power semiconductor module to the capacitor | condenser module of 1st Embodiment. It is the perspective view which showed the power semiconductor module of 1st Embodiment from the cooler side. It is a figure which shows the principal part sectional drawing of the state which joined the power semiconductor module to the capacitor | condenser module of 1st Embodiment. It is a figure which shows the principal part sectional drawing of the state which joined the power semiconductor module to the capacitor | condenser module of 2nd Embodiment which concerns on this invention.

Next, first and second embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the relationship between the thickness and the planar dimensions, the ratio of the thickness of each layer, and the like are different from the actual ones. Therefore, specific thicknesses and dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.
Further, the following first and second embodiments exemplify apparatuses and methods for embodying the technical idea of the present invention, and the technical idea of the present invention is a material of a component, The shape, structure, arrangement, etc. are not specified below. The technical idea of the present invention can be variously modified within the technical scope defined by the claims described in the claims.

[Power Converter of First Embodiment]
Hereinafter, the power converter of a 1st embodiment concerning one mode of the present invention is explained, referring to drawings suitably. In the drawings, reference numerals X1 and X2 denote one and the other of the first direction, reference numeral Y denotes a second direction orthogonal to the first direction X1 and X2, and reference signs Z1 and Z2 denote the first direction X and the second direction Y. One and the other in the third direction orthogonal to the virtual plane including
FIG. 1 shows a power converter 1 according to a first embodiment used as a DC / AC inverter.
The power conversion device 1 includes a rectangular parallelepiped housing 2, a cooling water supply pipe 3 and a discharge pipe 4 penetrating from one side wall in the longitudinal direction of the housing 2, and a longitudinal direction of the housing 2. The input connector 5, the control connector 6, and the output connector 7 are provided on the other side wall.
The housing 2 is formed, for example, by die-casting aluminum or aluminum alloy having high thermal conductivity, and a box-shaped housing case 8 having an open top, and a lid that closes the opening of the housing case 8. 9.
A through hole 2a for inserting the cooling water supply pipe 3 and a through hole 2b for inserting the discharge pipe 4 are formed on one side wall of the casing 2 in the longitudinal direction.
As shown in FIG. 2, a capacitor module 10, a power semiconductor module 11, a control circuit board 12, and a drive circuit board 13 are housed inside the housing 2.

[Capacitor module]
The capacitor module 10 is a device for smoothing the voltage and current supplied to the power semiconductor module 11, and as shown in FIGS. 2 and 3, a rectangular parallelepiped capacitor case formed of a metal material such as aluminum die-casting. 14, the capacitor element 15 embedded in the capacitor case 14, the cooling water supply path 16 and the cooling water discharge path 17 formed in the capacitor case 14 in a state of being located around the capacitor element 15, and the capacitor element 15 And a plurality of capacitor terminals 18 projecting from the capacitor case 14 to the outside.

As shown in FIG. 2, the capacitor terminal 18 includes a protruding portion 18a extending in one X1 in the first direction, and a first fold extending from the tip of the protruding portion 18a to one Z1 in the third direction. A bent portion 18b, a second bent portion 18c extending from the tip of the first bent portion 18b to the other X2 in the first direction, and a tip of the second bent portion 18c from the tip of the second bent portion 18c to one Z1 in the third direction. And an extended terminal portion 18d.
Further, as shown in FIG. 3, one side X <b> 1 in the first direction of the capacitor case 14 provided with the capacitor terminal 18 protrudes toward the first bent portion 18 b and extends in the second direction Y. The protruding protrusion 14a is formed.

A long heat dissipation sheet HD1 is affixed to the end face of one X1 in the first direction of the protrusion 14a. The protrusion 14a and the first bent portion 18b of the capacitor terminal 18 are joined in a surface contact state via the heat dissipation sheet HD1.
Further, the cooling water supply path 16 and the cooling water discharge path 17 are formed of metal cooling pipes, and as shown in FIG. 4, the cooling water supply path 16 is the other X2 of the capacitor case 14 in the first direction. And an external supply connection port 16a that is open on the surface facing the power semiconductor side, and a power semiconductor side supply connection port 16b that is open on the surface facing one side Z1 of the capacitor case 14 in the third direction.

Further, the cooling water discharge passage 17 is opened on the surface of the capacitor case 14 that faces the other X2 in the first direction and the surface that faces the other direction X1 of the capacitor case 14 in the third direction. Power semiconductor side discharge connection port 17b.
As shown in FIG. 5, a circumferential groove 20a is formed at the opening periphery of the power semiconductor side supply connection port 16b, and an O-ring R1 is attached to the circumferential groove 20a. Further, a circumferential groove (not shown) is formed at the opening periphery of the power semiconductor side discharge connection port 17b, and an O-ring R1 is attached to the circumferential groove.
Here, the surface of the capacitor case 14 in which the power semiconductor side supply connection port 16b and the power semiconductor side discharge connection port 17b are formed faces one side Z1 in the third direction is referred to as a power semiconductor bonding surface 20.

[Power semiconductor module]
6 and 7, the power semiconductor module 11 is provided integrally with the module main body 11A and the module main body 11A, and is connected to the cooling water supply path 16 and the cooling water discharge path 17 provided in the capacitor module 10. And a cooler 11B through which cooling water circulates.
The module body 11A includes a rectangular parallelepiped resin package 19 and a metal base plate (not shown) disposed on the bottom surface of the resin package, and a cooler 11B is integrally provided on the metal base plate side.
The resin package 19 includes three IGBT upper arm semiconductor chips (not shown), upper arm wiring pattern portions, upper arm wiring conductor plates, lower arm semiconductor chips, lower arm wiring pattern portions, and lower arm wiring conductor plates. In addition, the ground wiring pattern portion and the like are embedded, and the upper arm semiconductor chip and the lower arm semiconductor chip are in contact with the metal base plate.

The resin package 19 has positive side terminals 21U, 21V, and 21W and negative side terminals 22U, 22V, and 22W arranged in a row on one side surface in the longitudinal direction, and an output terminal on the other side surface in the longitudinal direction. 23U, 23V, and 23W are provided in a line.
The positive side terminals 21U, 21V, and 21W are connected to the collector of the upper arm semiconductor chip through the upper arm wiring pattern portion, and the negative side terminals 22U, 22V, and 22W are connected to the ground wiring pattern portion and the lower arm wiring. The output terminals 23U, 23V, and 23W are connected to the emitter of the upper arm semiconductor chip via the lower arm wiring pattern portion and the upper arm wiring conductor plate. It is connected to the collector of the lower arm semiconductor chip.

Further, as shown in FIG. 6, on the upper surface of the resin package 19, a plurality of upper arm lead frames 28U, 28V, 28W connected to a plurality of control electrodes for the upper arm, and a plurality of controls for the lower arm. A plurality of lower arm lead frames 29U, 29V, 29W connected to the electrodes are provided protruding upward.
As shown in FIG. 7, the cooler 11B is joined to the bottom surface of the resin package 19, and a cooling water circulation path (not shown) provided inside the cooler 11B is connected to the bottom wall 11a of the cooler 11B. A supply pipe 24 that is an inlet for supplying cooling water and a discharge pipe 25 that is an outlet for discharging the cooling water that has passed through the cooling water circulation path are provided.

Circumferential grooves 24a and 25a are formed on the outer periphery of the supply pipe 24 and the discharge pipe 25. An O-ring R2 shown in FIG. 8 to be described later is attached to the circumferential groove 24a of the supply pipe 24 and the circumferential groove 25a of the discharge pipe 25.
The power semiconductor module 11 having the above configuration is bonded to the power semiconductor bonding surface 20 of the capacitor case 14.
At this time, as shown in FIG. 4, a heat radiation sheet HD <b> 2 having substantially the same shape as the bottom wall 11 a of the cooler 11 </ b> B is laid on the power semiconductor joint surface 20 of the capacitor case 14.
Then, the supply pipe 24 provided on the bottom wall 11 of the cooler 11B is inserted into the cooling water supply path 16 from the power semiconductor side supply connection port 16b in a state where the bottom wall 11a is in surface contact with the heat radiation sheet HD2, and the discharge pipe 25 is inserted into the cooling water discharge path 17 from the power semiconductor side discharge connection port 17b.

4 and 6, the screw insertion portion 11b provided on the module body 11A of the power semiconductor module 11 is made to correspond to the screw fixing portion 26 provided on the power semiconductor joint surface 20, and the mounting screw 27 is screwed. By screwing into the fixing portion 26, the power semiconductor module 11 is joined to the power semiconductor joining surface 20 of the capacitor case 14 in a surface contact state via the heat dissipation sheet HD2.
Further, the positive side terminals 21U, 21V, 21W and the negative side terminals 22U, 22V, 22W of the power semiconductor module 11 are electrically connected to the terminal portions 18d of the plurality of capacitor terminals 18 of the capacitor module 10 with screws.

Here, in FIG. 8, when the power semiconductor module 11 is joined to the power semiconductor joining surface 20 of the capacitor case 14, the supply pipe 24 provided on the bottom wall 11 of the cooler 11 </ b> B is inserted into the cooling water supply path 16. Indicates the state. In this state, the O-ring R1 attached to the opening periphery of the power semiconductor side supply connection port 16b is crushed by the bottom wall 11a of the cooler 11B, and the O-ring attached to the circumferential groove 24a of the supply pipe 24 described above. The ring R2 is in a state of being crushed by the inner wall of the cooling water supply path 16.
Although not shown, when the discharge pipe 25 provided on the bottom wall 11a of the cooler 11B is inserted into the cooling water discharge path 17, the O attached to the periphery of the opening of the power semiconductor side discharge connection port 17b is not shown. The ring R1 is crushed by the bottom wall 11a of the cooler 11B, and the O-ring R2 attached to the circumferential groove 25a of the discharge pipe 25 is crushed by the inner wall of the cooling water discharge passage 17.

[Control circuit board and drive circuit board]
As shown in FIG. 4, a plurality of columnar control circuit board struts 30 and a plurality of columnar drive circuit board struts 31 having a height lower than that of the control circuit board struts 30 are formed on the capacitor case 14. It is provided to rise from the edge of the power semiconductor bonding surface 20.
These control circuit board column 30 and drive circuit board column 31 are metallic members, and screw holes are formed at the tops.
As shown in FIG. 3, a screw is attached to the top of the plurality of drive circuit board columns 31 at a position above the power semiconductor module 11 joined to the power semiconductor joint surface 20 of the capacitor case 14 (one Z1 in the third direction). The drive circuit board 13 is arranged in a stopped state. Here, although not shown, the upper arm lead frames 28U, 28V, and 28W and the lower arm lead frames 29U, 29V, and 29W are inserted into through holes (not shown) having lands of the drive circuit board 13, although not shown. The lead frames and the through holes are soldered.

Further, as shown in FIG. 3, the tops of the plurality of control circuit board columns 30 are arranged at an upper position (one Z1 in the third direction) of the drive circuit board 13 supported and arranged by the drive circuit board columns 31. The control circuit board 12 is arranged in a state of being screwed to the control circuit board 12.
The power semiconductor cooler described in the present invention corresponds to the cooler 11B, and the condenser refrigerant flow path described in the present invention corresponds to the cooling water supply path 16 and the cooling water discharge path 17, The insertion pipe described in the present invention corresponds to the supply pipe 24 and the discharge pipe 25, and the refrigerant pipe described in the present invention corresponds to the cooling water supply pipe 4 and the discharge pipe 4.

[Operation of Power Conversion Device of First Embodiment]
The power semiconductor module 11 is joined to the power semiconductor joint surface 20 of the capacitor module 10 shown in FIG. 6, and the control circuit board 12 and the drive circuit board 13 are assembled to the upper position (one Z1 in the third direction) of the power semiconductor module 11. The device is accommodated in the housing 2.
At this time, the side surface of the capacitor case 14 on which the external supply connection port 16a and the external discharge connection port 17a are formed is brought close to the inner wall of the housing 2, and the external supply connection port 16a is made to correspond to the through hole 2a formed in the housing 2. The external discharge connection port 17a is made to correspond to the through hole 2b. Then, the cooling water supply pipe 3 is connected from the outside of the housing 2 to the external supply connection port 16a by press-fitting through the through hole 2a. Further, the discharge pipe 4 is connected from the outside of the housing 2 to the external discharge connection port 17a by press-fitting through the through hole 2b.
In the power conversion device 1 configured as described above, when a direct current is supplied from an external converter (not shown) via the input connector 5, the capacitor module 10 smoothes the voltage and current.
A control voltage is supplied to the control circuit board 12 from the control connector 6. When a gate signal, for example, a pulse width modulation signal is output from the control circuit board 12 to the drive circuit board 13, the drive circuit board 13 A drive signal is output to the power semiconductor module 11, and U-phase, V-phase, and W-phase three-phase alternating current is output to the load via the output connector 7.

[Effect of the power conversion device of the first embodiment]
In the capacitor module 10 that smoothes the voltage and current, the capacitor element 15 embedded in the capacitor case 14 is in a heat generating state.
In contrast, in the power conversion device 1 of the first embodiment, the capacitor case 14 of the capacitor module 10 is formed of a metal material, and the capacitor case 14 has a cooling water supply path 16 and a cooling water discharge path 17. Therefore, the capacitor case 14 is immediately cooled by the circulation of the cooling water. For this reason, the capacitor element 15 embedded in the capacitor case 14 can be efficiently cooled.
When the power semiconductor module 11 is in an operating state, the upper arm semiconductor chip and the lower arm semiconductor chip embedded in the resin package 19 are in a heat generating state.

On the other hand, the module main body 11A of the power semiconductor module 11 is integrated with the cooler 11B through which the cooling water circulates, so that the upper arm semiconductor chip and the lower arm semiconductor chip embedded in the resin package 19 are efficiently used. Can be cooled.
Further, the cooler 11B of the power semiconductor module 11 is joined to the power semiconductor joint surface 20 of the capacitor case 14 through the heat dissipation sheet HD2 in a surface contact state, and the heat of the cooler 11B is immediately transferred to the capacitor case 14. Therefore, the upper arm semiconductor chip and the lower arm semiconductor chip 19 embedded in the resin package can be further efficiently cooled.

In addition, the connection portion between the positive side terminals 21U, 21V, 21W and the negative side ends 22U, 22V, 22W of the power semiconductor module 11 and the terminal portions 18d of the plurality of capacitor terminals 18 of the capacitor module 10 is in a heat generation state due to power loss. There is a risk.
In contrast, the first bent portion 18b of the capacitor terminal 18 is joined to the capacitor case 14 (protrusion 14a) in a surface contact state via the heat dissipation sheet HD1, and the capacitor case 14 cools the capacitor terminal 18. As a result, the positive-side terminals 21U, 21V, 21W and the connection portions between the negative-side terminals 22U, 22V, 22W and the capacitor terminal 18 of the power semiconductor module 11 can also prevent a heat generation state due to power loss.

Further, since the heat radiation sheet HD2 is disposed between the cooler 11B and the power semiconductor joint surface 20 of the capacitor case 14, for example, even if the power semiconductor joint surface 20 is deformed by thermal stress, the power semiconductor joint surface 20 Since the thickness of the heat dissipation sheet HD2 changes according to the uneven surface due to the deformation, the surface contact state between the cooler 11B and the power semiconductor bonding surface 20 of the capacitor case 14 can be maintained.
In addition, the control circuit board 12 is supported and arranged on a plurality of metal control circuit board posts 30 rising from the power semiconductor bonding surface 20 of the capacitor case 14, and the drive circuit board 13 is also arranged on the power semiconductor bonding surface. Even when heat is generated in the circuit components of the control circuit board 12 and the drive circuit board 13, the heat is generated by the metal. The heat is immediately transferred to the capacitor case 14 through the control circuit board column 30 and the drive circuit board column 31 manufactured. Therefore, it is possible to prevent a heat generation state that occurs in the circuit components of the control circuit board 12 and the drive circuit board 13.

Further, since the O-ring R1 and the O-ring R2 are arranged at the cooling water circulation path connecting portion of the cooler 11B of the power semiconductor module 11 and the condenser case 14, the double liquid-tightness of the cooler 11B and the condenser case 14 is provided. By adopting the structure, leakage of cooling water can be reliably prevented.
Furthermore, since the cooling water supply path 16 and the cooling water discharge path 17 are formed in the capacitor case 14, the capacitor module 10 can be reduced in size and weight.
In the first embodiment, the heat radiating sheet HD2 is provided between the power semiconductor joint surface 20 of the capacitor case 14 and the cooler 11B of the power semiconductor module 11, but the same applies even if heat radiating grease such as silicon grease is used. The effect of can be produced.

[Power Converter of Second Embodiment]
Next, FIG. 9 shows the principal part of the power converter device 1 of 2nd Embodiment which concerns on this invention.
The capacitor module 10 according to the second embodiment includes a rectangular parallelepiped capacitor case 35 formed of a synthetic resin such as polyphenylene sulfite (PPS) resin, and a capacitor element (not shown) embedded in the capacitor case 35. And a cooling water supply path 36 and a cooling water discharge path 37 embedded in the capacitor case 35.
The cooling water supply path 36 is formed of a metal pipe having a bent portion 36a bent in an arc shape.

The cooling water discharge passage 37 is also formed of a metal pipe having a bent portion 37a bent in an arc shape.
On the other hand, a plurality of reinforcing ribs 38 are formed on the control circuit board support 30 provided on the power semiconductor bonding surface 20 of the capacitor case 35 so as to rise from the power semiconductor bonding surface 20 at a predetermined interval in the circumferential direction of the outer periphery. Yes. A plurality of reinforcing ribs 39 are also formed on the control circuit board support 31 provided on the power semiconductor bonding surface 20 so as to rise from the power semiconductor bonding surface 20 at a predetermined interval in the circumferential direction of the outer periphery.

In the second embodiment, a capacitor case 35 is formed using a synthetic resin as a material, and the capacitor case 35 is provided with a cooling water supply path 36 formed of a metal pipe having an arc-shaped bent portion 36a, and an arc-shaped shape. When the cooling water supply path 37 made of a metal pipe provided with the bent portion 37a is embedded, it is possible to prevent resin cracking and resin peeling of the capacitor case 35 during the power conversion operation.
Further, it is possible to reduce a pressure loss when cooling water flows through the reject water supply path 36 provided with the arc-shaped bent portion 36a and the cooling water supply path 37 provided with the arc-shaped bent portion 37a. The cooling efficiency of 35 can be increased.
Further, the periphery of the control circuit board column 30 provided on the power semiconductor joint surface 20 of the capacitor case 35 is reinforced by a plurality of reinforcing ribs 38, and the periphery of the control circuit board column 31 is also reinforced by a plurality of reinforcing ribs 39. Therefore, the control circuit board 12 and the drive circuit board 13 disposed above the power semiconductor module 11 can be reliably supported.

DESCRIPTION OF SYMBOLS 1 Power converter 2 Housing | casing 2a, 2b Through-hole 3 Cooling water supply pipe 4 Discharge pipe 5 Input connector 6 Control connector 7 Output connector 8 Housing case 9 Lid 10 Capacitor module 11 Power semiconductor module 11A Module main body 11B Cooler 11a Bottom wall 12 Control circuit board 13 Drive circuit board 14 Capacitor case 14a Protrusion 15 Capacitor element 16 Cooling water supply path 16a External supply connection port 16b Power semiconductor side supply connection port 17 Cooling water discharge path 17a External discharge connection port 17b Power semiconductor side Discharge connection port 18 Capacitor terminal 18a Protruding portion 18b First bent portion 18c Second bent portion 18d Terminal portion 19 Resin package 20 Power semiconductor joint surface 20a Circumferential grooves 21U, 21V, 21W Positive side terminals 22U, 22V, 22W Negative side Terminal 23U, 23V, 23W Output terminal 24 Supply piping 25 Discharge piping 24a, 25a Circumferential groove 26 Screw fixing portion 27 Mounting screws 28U, 28V, 28W Upper arm lead frame 29U, 29V, 29W Lower arm lead frame 30 Control circuit board column 31 Drive circuit board column 35 Condenser case 36 Cooling water supply path 36a Bent part 37 Cooling water discharge path 37a Bent parts 38, 39 Reinforcing rib HD1 Heat radiation sheet HD2 Heat radiation sheet R1, R2 O-ring

Claims (10)

A power semiconductor module that converts DC power into AC power;
A capacitor module for smoothing voltage and current;
A housing for housing the power semiconductor module and the capacitor module;
The capacitor module has a capacitor refrigerant channel embedded in a capacitor case formed of a metal material such as aluminum die cast, or a synthetic resin.
The power semiconductor module is integrally provided with a power semiconductor cooler provided with a power semiconductor refrigerant channel inside.
The power conversion device, wherein the capacitor case and the power semiconductor cooler are joined in a surface contact state, and the cooling medium circulates by directly connecting the capacitor refrigerant flow path and the power semiconductor refrigerant flow path. A circumferential groove fitted with a first O-ring is formed on one of the peripheral edge of the connection port of the capacitor refrigerant flow path and the peripheral edge of the connection port of the power semiconductor refrigerant flow path,
When the capacitor case and the power semiconductor cooler are joined in surface contact with each other, the other of the peripheral edge of the connection port of the capacitor refrigerant channel and the peripheral edge of the connection port of the power semiconductor refrigerant channel is the first The power conversion device according to claim 1, wherein the condenser refrigerant flow path and the power semiconductor refrigerant flow path are communicated with each other while the O-ring is crushed. One of the capacitor refrigerant flow path and the power semiconductor refrigerant flow path is connected by protruding an insertion pipe to the outside, and a second O-ring is attached to the outer periphery of the insertion pipe protruding to the outside.
The insertion pipe is inserted into the other of the condenser refrigerant flow path and the power semiconductor refrigerant flow path in a state where the second O-ring is crushed by the inner wall of the flow path, and the condenser refrigerant flow path and the power semiconductor are inserted. The power conversion device according to claim 1, wherein the refrigerant flow path is communicated.   The power converter according to any one of claims 1 to 3, wherein the capacitor case and the cooler for power semiconductor are joined via a heat-dissipating sheet having elasticity.   The power converter according to any one of claims 1 to 3, wherein the capacitor case and the cooler for a power semiconductor are joined together through heat radiation grease. The capacitor module includes a capacitor terminal protruding from the capacitor case,
The power converter according to any one of claims 1 to 5, wherein a part of the capacitor terminal and the capacitor case are joined in a surface contact state.   The power converter according to claim 6, wherein a part of the capacitor terminal and the capacitor case are joined via a heat dissipation sheet.   A plurality of metal columns are raised from the periphery of the joint surface to which the power semiconductor cooler of the capacitor case is joined, and the drive circuit for the power semiconductor module is mounted above the power semiconductor module The drive circuit board and the control circuit board on which the control circuit of the power semiconductor module is mounted are supported and arranged at the tips of the plurality of supports. The power conversion device according to item 1.   9. The power conversion device according to claim 1, wherein the capacitor refrigerant flow path embedded in the capacitor case is configured by a metal pipe having a bent portion that bends in an arc shape. 10. .   When the capacitor module is housed in the housing, the connection port of the capacitor refrigerant flow path of the capacitor module corresponds to the through hole formed in the housing, and passes through the through hole from the outside of the housing. The power conversion device according to any one of claims 1 to 9, wherein the refrigerant pipe is connected to the connection port.

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