JP2019155445A - Processing method, processing system, and processing program - Google Patents

Abstract

To provide a processing method capable of forming an internal surface of a cavity portion into a desired shape and shortening processing time when processing a workpiece having the cavity portion inside.SOLUTION: There is provided a processing method for processing a light-permeable material by laser beam irradiation to prepare a processed material having a cavity portion inside. The method includes irradiating a processing site corresponding to the internal surface of the cavity portion with a laser beam with a first spot size, and irradiating the processing site corresponding to the inside of the internal surface with the laser beam with a second spot size larger than the first spot size.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a machining method for creating a workpiece having a hollow portion therein, a machining system for executing the machining method, and a machining program for causing the machining system to execute the machining method.

  Microfluidic devices are widely used in bio / biochemical fields and chemical engineering. The microfluidic device includes a port for supplying a fluid (for example, blood) into the device, a port for discharging the fluid out of the device, and a flow path portion communicating between the ports. The port and the channel are formed by fine processing such as heat treatment or etching treatment using laser light.

  For example, when the flow path portion L of the microfluidic device is created, as shown in FIG. 8, the surface of the material M (resin material, glass material, etc.) is finely processed to form the groove C, and another portion is formed thereon. The material M ′ is generally bonded together.

  On the other hand, in Patent Document 1, a glass substrate is directly irradiated with laser light to reduce etching resistance, and then the portion irradiated with the laser light is etched to form a flow path portion therein. A method of manufacturing a microfluidic device is disclosed.

Japanese Patent Laid-Open No. 2006-148592

  As described above, the conventional manufacturing method of the microfluidic device requires a plurality of different processes such as attaching another material after forming a groove in the material, or performing an etching process after irradiating a laser beam. It is. In addition, there is a problem that when the materials are bonded together, a portion where the adhesion is insufficient is generated, and the fluid leaks from the portion.

  Furthermore, there is a demand for a multi-channel or large-scale microfluidic device, such as forming a plurality of ports and a plurality of flow path portions with a multilayer structure, or complicating the shape of the flow path portions. In this case, the above problem becomes more prominent.

  For example, when the inclined flow path portion L is created in the microfluidic device, as shown in FIG. 9A, the surface of each of the plurality of materials M is finely processed to form the holes H. The material M ′ is pasted together.

  However, since it is necessary to work a plurality of materials or to bond each material, it is complicated. Moreover, since a plurality of materials are bonded together, there is a higher possibility that a portion having insufficient adhesion will occur. Furthermore, the inner wall surface of the flow path portion L is required to have a smooth shape so that the fluid flows smoothly. However, when the flow path portion L is formed by laminating a plurality of materials, as shown in FIG. 9B (cross section AA in FIG. 9A), a step or a joint is generated on the inner wall surface.

  An object of the present invention is to provide a technique capable of forming an inner wall surface of a hollow portion into a desired shape and shortening a machining time when a workpiece having a hollow portion is processed.

One invention for achieving the above object is a processing method of processing a light-transmitting material by irradiating a laser beam to create a workpiece having a hollow portion therein, and the inner wall surface of the hollow portion. The laser beam is irradiated with the first spot size to the processing site corresponding to the second, and the processing site corresponding to the inner side of the inner wall surface of the cavity portion is larger than the first spot size. This is a processing method of irradiating the laser beam with a spot size of.
Other features of the present invention will become apparent from the description of this specification.

  According to the present invention, there is provided a technique capable of forming the inner wall surface of a hollow portion into a desired shape and shortening the machining time when a workpiece having a hollow portion is processed.

It is the figure which showed the processed material which concerns on embodiment. It is a mimetic diagram showing composition of a processing system concerning an embodiment. It is a figure which shows the process path | route of the port which concerns on embodiment. It is a figure which shows the process route of the port which concerns on embodiment. It is a figure which shows the process route of the port which concerns on embodiment. It is a figure which shows the process path | route of the flow-path part which concerns on embodiment. It is a figure which shows the process path | route of the flow-path part which concerns on embodiment. It is a figure which shows the process path | route of the flow-path part which concerns on embodiment. It is a flowchart which shows the processing method which concerns on embodiment. It is a figure which shows the port processed by the processing method which concerns on embodiment. It is a figure which shows the port processed by the processing method which concerns on embodiment. It is a figure which shows the flow-path part processed by the processing method which concerns on embodiment. It is a figure which shows the flow-path part processed by the processing method which concerns on embodiment. It is a figure which shows the flow-path part processed by the processing method which concerns on embodiment. It is a figure for demonstrating the creation method of the workpiece in a prior art example. It is a figure for demonstrating the creation method of the workpiece in a prior art example. It is an AA cross section of the workpiece shown in FIG. 9A.

== Outline of processing method ==
The processing method according to the present embodiment is a method of creating a workpiece having a cavity with a predetermined shape inside the material by irradiating the processing site with laser light. By using laser light, non-contact processing can be performed on the material.

  As the material according to this embodiment, a material that transmits laser light (light-transmitting material) is used. Examples of the light-transmitting material include glass or glass doped with elements, ions, and particles to provide a desired function. For example, a light-transmitting resin such as PMMA or a zirconia-based material may be used. Can be used. The zirconia-based material may be a composite material such as a zirconia-containing glass ceramic, or a zirconia simple substance having a certain transmittance. Further, the light transmittance of the material does not need to be 100%, and may be a value that allows laser light to reach a predetermined position (processing part) and be processed.

  The processing site is a position where the laser beam is irradiated on the material surface or inside the material. The processing site is set as a plurality of line segments (straight line or curved line), a surface (a two-dimensional region having a predetermined area), or a solid (a three-dimensional region having a predetermined volume). A part of the material is removed by irradiating the processing site with laser light. Note that modification (change in the composition and structure of the material) occurs in the processing site irradiated with the laser beam.

  As the laser light, light from a short pulse laser is used. In particular, in order to irradiate a laser beam directly to a processing site inside the material, it is preferable to use light from an ultrashort pulse laser. An ultrashort pulse laser is a laser that emits laser light having a pulse width of several picoseconds to several femtoseconds. Ablation processing (non-thermal processing) can be performed by irradiating the processing site inside the material with laser light by an ultrashort pulse laser for a short time. Ablation processing instantly evaporates, scatters, and removes the melted portion by the laser beam, so that damage to the processing site due to heat is small compared to general laser processing (thermal processing). The ablation process used in the present embodiment is a method used when, for example, a flow path of a microfluidic device is created by generating holes by internal processing. That is, ablation processing is technically distinguished from a method such as thermal processing and a method of forming minute scratches (cracks) in a material such as 3D laser engraving.

  A processed product is a product obtained by processing a material. The workpiece has a hollow portion having a predetermined shape inside. The shape of the hollow portion is set based on design data (described later) created by the CAD system 300. The workpiece according to this embodiment is a microfluidic device.

  The microfluidic device is composed of a plurality of components according to the purpose of use. The component is a configuration for performing injection of a reagent or specimen, mixing of the reagent and specimen, reaction, separation, purification, detection, or the like. Specifically, the constituent elements are a flow path, a port, a reaction chamber, a micro pump, and the like.

  The port is a part for injecting a reagent or the like into the microfluidic device. The port has an opening in the surface of the microfluidic device. The port has a hollow shape having a predetermined depth from the opening. The flow path is a portion through which the reagent or the like injected from the port flows. That is, in the microfluidic device, the port (hollow part) and the flow path are connected. Moreover, the opening part of a port is a part (part which connects a flow path and the material exterior) to the exterior in the material surface.

  FIG. 1 shows an example of a microfluidic device D. In FIG. 1, the longitudinal direction of the microfluidic device D is the X direction, the short direction is the Y direction, and the longitudinal direction is the Z direction. The microfluidic device D has three ports P1 to P3 and a bifurcated flow path portion F.

  Each of the ports P1 to P3 is a cylindrical cavity extending in the Z direction (the cylindrical bottom surface is closed). Each port has an opening portion O1 to an opening portion O3. The flow path portion F is a cylindrical cavity extending on the XY plane, and is a bifurcated cavity that communicates the ports P1 and P3 and the ports P2 and P3. The ports P1 to P3 and the flow path portion F are examples of the “cavity portion”. The port may be provided not only to extend in the Z direction but also to be inclined in the X direction or the Y direction. Further, the flow path portion F may be provided not only in the XY two-dimensional plane but also in the Z direction.

  Irradiation of the laser beam to the material is performed based on processing data (described later) created in advance. Specifically, the processing method according to the present embodiment irradiates the processing portion corresponding to the inner wall surface of the hollow portion with laser light at the first spot size, and performs processing corresponding to the inner side of the inner wall surface of the hollow portion. The part is irradiated with laser light with a second spot size larger than the first spot size. Moreover, the processing method according to the present embodiment is performed by a processing system 100 as shown in FIG. The processing system 100 processes a material by executing a processing program created by the CAM system 200. Hereinafter, “design data”, “machining data”, “machining system”, and “machining by the machining system (machining method)” will be described in detail.

== Design data ==
The design data is data indicating the components of the microfluidic device formed inside the material. The CAD system 300 (see FIG. 2) can create design data (the design data creation method is referred to Japanese Patent Application No. 2017-032591). Not limited to).

  The design data according to the present embodiment includes material data and element data.

  The material data is information for specifying the material that is the basis of the workpiece (microfluidic device). Information for specifying the material includes, for example, the material (glass, resin, zirconia, etc.), shape (cylinder, rectangular parallelepiped, cube, etc.), size (vertical, horizontal, height (thickness), etc.), color, and inside of the material. Refractive index.

  The element data is data indicating the specific position, shape, etc. of each component of the workpiece. The element data includes coordinate values for each component. For example, in the element data of the microchannel device D shown in FIG. 1, the coordinate values of the ports P1 to P3 and the channel portion F are set. The coordinate values are XYZ values when a certain point (for example, a corner portion of the material) is the origin.

  The element data includes attribute information for each constituent element. The attribute information includes the depth, thickness, cross-sectional shape, and the like inside the material. For example, the port attribute information includes a depth from a position corresponding to the opening portion to a predetermined position inside the material (in the case of the microfluidic device D shown in FIG. 1, Z from the position corresponding to the opening portion to the predetermined position). This is information including a direction distance), a thickness (diameter or radius if circular, a diagonal length if square), and a cross-sectional shape (circular or square). The attribute information of the flow path includes the position in the depth direction inside the material (the position in the Z direction in the case of the microfluidic device D shown in FIG. 1), the thickness (in the case of a circle, the diameter and radius, and in the case of a square Information including the length of the diagonal line) and the cross-sectional shape (circular, square). Flow rate and connection destination information (coordinate values) may be included as port and flow path attribute information.

  Depending on the microfluidic device, the flow path is multilayered (when a plurality of flow path portions F in FIG. 1 are provided in the Z direction) and three-dimensional (the flow path portions F in FIG. 1 are inclined in the Z direction). May be required). Even in such a case, design data can be obtained by setting element data for each component. The design data may be data having the coordinate values and attribute information of the ports and flow paths, or may be three-dimensional data (solid data or the like) created using them.

== Processing data ==
The machining data is data used in the machining system 100 when creating a workpiece having a hollow portion. The machining data is created by the CAM system 200 based on the design data created by the CAD system 300.

  The machining data according to the present embodiment includes at least machining site data, spot size data, and machining path data.

  The processed part data is data (data corresponding to the processed part) for specifying the processed part in the material. The processing site data is created for each component included in the design data. The machining site is specified by the coordinate value of each component included in the design data. The processing site data is composed of a plurality of point data, for example. The point data is set at predetermined intervals in consideration of the size of the material, the shape of the workpiece (the shape of the hollow portion), and the like. Each point data has three-dimensional (XYZ) coordinate values and vector information.

  Each coordinate value is used when determining the focal position of the laser beam (that is, each coordinate value corresponds to a position where the laser beam is irradiated on the material surface or inside the material). The vector information is used when determining the irradiation direction of the laser beam (the incident direction of the laser beam with respect to the material). In addition, when a laser beam is incident inside the material, an influence of reflection on the material surface occurs. Therefore, when setting the vector information, it is more preferable to set so that the laser beam is incident perpendicular to the material surface. Further, the processing site data may not be a plurality of point data as long as a hollow portion can be formed inside the material. For example, it may be two-dimensional or three-dimensional region data for setting a range (position and width) in which a material is irradiated with laser light.

  In addition, since the refractive index varies depending on the material, even if the laser beam is irradiated with the laser beam with the focal position of the laser beam aligned with the coordinate value included in the design data, the laser beam does not hit the processing site due to the influence of the refractive index. There is also. Therefore, the CAM system 200 may correct the coordinate value of the processed part data in consideration of the refractive index included in the material data.

  The spot size data is data indicating the spot size of the laser beam irradiated to the processing site. The spot size corresponds to the diameter (spot diameter) when the laser beam is irradiated with a spot. On the other hand, when laser light is irradiated to a two-dimensional region or a three-dimensional region using an LCOS-SLM or the like described later, the spot size corresponds to the area of the two-dimensional region or the volume of the three-dimensional region.

  Spot size data is set for each processed part. In the present embodiment, the spot size (second spot size) set for the machining portion corresponding to the inside of the inner wall surface of the hollow portion is set for the machining portion corresponding to the inner wall surface of the hollow portion. It is set to be larger than the spot size (first spot size).

  The first spot size (second spot size) for a certain processing site and the first spot size (second spot size) for another processing site may be set to the same value, Different values may be set. For example, the first spot size when processing the ports P1 to P3 shown in FIG. 1 and the first spot size when processing the flow path portion F may be set to the same value or different. A value may be set.

  The processing route data is data for setting a route and order for performing laser light irradiation. The order of irradiating the laser light is determined by the number and arrangement of components, the shape of the hollow portion, and the like. For example, the processing path data in the microfluidic device D of FIG. 1 can be set such that the port portions P1 to P3 are first processed and then the flow path portion F is processed.

  Here, in the case of non-thermal processing, modification occurs in the processing site irradiated with laser light (the composition and structure of the material change depending on the energy of the laser light). In this case, the laser beam cannot reach a position far from the modified processing site, or unintended refraction or reflection of the laser beam occurs due to the effect of roughening due to the modification. Therefore, it becomes difficult to irradiate the set processing site with laser light, and as a result, there is a possibility that a desired cavity portion cannot be created.

  Therefore, the processing path data is set so that the laser light is emitted in the order of distance from the material surface where the laser light enters (in the order farthest from the material surface) when there is a processing part that overlaps in the direction of laser light irradiation. To do. The distance between the material surface and the processing site is determined along the incident direction of the laser beam with respect to the material.

  For example, the processing path data set for the port P1 and the flow path portion F shown in FIG.

  3A and 3B are views of the port P1 shown in FIG. 1 viewed from the Z direction. 3C is a view of the port P1 shown in FIG. 1 as viewed from the Y direction. In this example, it is assumed that the laser beam is irradiated from the upper side to the lower side along the Z direction to process the port P1. In this case, first, a circular machining path L1 is set along the diameter of the port P1 (see FIG. 3A). By irradiating laser light along the processing path L1, the inner wall surface of the port P1 can be formed. Thereafter, a plurality of machining paths L2 concentric with the machining path L1 are set inside the machining path L1 (see FIG. 3B). By irradiating the laser beam along the processing path L2, a hollow portion (portion inside the inner wall surface) of the port P1 can be formed.

  On the other hand, since the port P1 is formed with a predetermined length in the Z direction, if the laser beam is first irradiated to the processing site located on the upper side, the laser is applied to the processing site located on the lower side. It becomes difficult to irradiate light. Therefore, the machining path is set so as to machine from the lower side to the upper side of the port P1 (see FIG. 3C. A thick arrow indicates the direction of machining). That is, in the example of FIG. 3C, the machining path is set from the lower side to the upper side along the Z direction. It is also possible to divide the port P1 into several layers in the Z direction and set the machining path shown in FIGS. 3A and 3B for each layer. In this case, a processing path (processing order) is set so that laser light is irradiated in order from the lowest layer.

  4A to 4C are cross-sectional views of the flow path portion F shown in FIG. 1 as viewed from the Y direction. In this example, it is assumed that the flow path portion F is processed by irradiating laser light from the upper side to the lower side along the Z direction. In this case, since the flow path portion F is formed with a predetermined diameter in the Z direction, if the laser beam is first irradiated to the processing portion located on the upper side, the processing portion located on the lower side thereof It becomes difficult to irradiate the laser beam. Therefore, as the machining path, first, the machining path L1 is set in order from the lower side with respect to the lower half of the diameter of the flow path portion F (see FIG. 4A). By irradiating the laser beam along the processing path L1, the lower half of the inner wall surface of the flow path portion F can be formed. Next, a plurality of machining paths L2 are set in order from the lower side inside the machining path L1 (see FIG. 4B). By irradiating the laser beam along the processing path L2, a hollow portion (portion inside the inner wall surface) of the flow path portion F can be formed. Finally, the machining path L3 is set in order from the lower side with respect to the upper half of the diameter of the flow path portion F (see FIG. 4C). By irradiating the laser beam along the processing path L3, the upper half of the inner wall surface of the flow path portion F can be formed. Since the flow path portion F is formed with a predetermined length in the Y direction, each processing path has a predetermined length in the Y direction. Alternatively, the flow path portion F can be divided into several layers in the X direction, and the processing paths shown in FIGS. 4A to 4C can be set for each layer.

  The processing data may include irradiation pattern data. The irradiation pattern data is data for determining a method of irradiating the processing site with laser light (a specific example of the irradiation pattern will be described later). As the irradiation pattern data, one data may be set for certain processing data, or different irradiation pattern data may be set for each processing site data. The processing system 100 determines the performance of the laser to be mounted and the configuration of the adjustment unit 20. Therefore, even if an irradiation pattern is set on the CAM system 200 side, it may not be executed. Therefore, the irradiation pattern may be set on the processing system 100 side during processing without including the irradiation pattern in the processing data.

  The processing data includes information on the output of laser light other than the irradiation pattern (laser light irradiation speed or irradiation time per unit time, intensity, etc.) and information on processing accuracy (feed speed of irradiation unit 10 and holding unit 20, processing pitch) And information on angles, etc.) and information on wall processing after processing (finishing processing, mirror processing and surface modification) may be included.

  The machining data once created can be arbitrarily changed on the CAM system 200 (or on the machining system 100). For example, a creator of machining data can change the material used on the CAM system 200 after creating certain machining data. In this case, the CAM system 200 can correct the coordinate value of the processing site data included in certain processing data based on the refractive index included in the material data of the changed material.

  The CAM system 200 outputs the created machining data to the machining system 100. The processing system 100 processes the material by irradiating the processing site with laser light along the set processing path based on the processing data. The format of the output data is not particularly limited as long as it can be used in the processing system 100.

== Machining system ==
FIG. 2 is a diagram schematically showing the processing system 100. The processing system 100 irradiates a laser beam to process a material, and creates a workpiece having a hollow portion inside. The processing system 100 includes a processing apparatus 1 and a computer 2. However, the processing system 100 may be configured by the processing device 1 alone by realizing the function performed by the computer 2 by the processing device 1.

  The processing apparatus 1 according to the present embodiment includes five drive axes (X axis, Y axis, Z axis, A rotation axis (rotation axis around the X axis), and B rotation axis (rotation axis around the Y axis)). Have. The processing apparatus 1 processes the material M by irradiating the processing site with laser light based on the processing data. The processing apparatus 1 includes an irradiation unit 10, an adjustment unit 20, a holding unit 30, and a drive mechanism 40.

  The irradiation unit 10 irradiates the material M with laser light. The irradiation unit 10 includes a laser light oscillator 10a, a lens group 10b for condensing the laser light from the oscillator 10a on the material M, and the like. The laser oscillator 10 a may be provided outside the processing apparatus 1.

  The adjustment unit 20 adjusts the spot size and irradiation pattern of the laser light. The adjusting unit 20 is a member such as a galvano mirror, a Fresnel lens, a diffractive optical element (DOE), a spatial light phase modulator (LCOS-SLM), or the like. The adjusting unit 20 is disposed in the irradiating unit 10 between, for example, the oscillator 10a and the lens group 10b. The irradiation pattern that can be used in a certain processing apparatus is determined by the configuration of the adjusting unit 20 provided in each apparatus.

  Here, a specific example of the irradiation pattern will be described.

  For example, a pattern in which a laser beam having a predetermined spot diameter is irradiated as a point to a processing site is possible. In this way, when processing a processing site with points (point groups), processing time is required, but finer processing is possible.

  In addition, a pattern can be used in which a laser beam having a predetermined spot diameter is irradiated to a processing site while scanning in a predetermined direction.

  This can be realized by using a galvanometer mirror as the adjustment unit 20. The galvanometer mirror has two mirrors, and by driving each mirror separately, the laser light from the oscillator 10a can be scanned in the XY plane. Since the galvanometer mirror can scan at high speed, the processing time can be shortened.

  As another irradiation pattern, a pattern in which a two-dimensional or three-dimensional processing site is irradiated with a laser beam at once can be realized by using a spatial light phase modulator as the adjustment unit 20. The spatial light phase modulator can shape the laser light from the transmitter 10a into an arbitrary shape by adjusting the orientation of the liquid crystal. For example, a spatial light phase modulator can irradiate a thin plate-like laser beam (three-dimensional laser beam) by forming a beam-like laser beam into a flat surface and giving it a predetermined thickness. . By using such a spatial light phase modulator, for example, ablation processing can be performed with a single irradiation on a certain processing site. That is, since a wide range of processing parts can be processed collectively by using the spatial light phase modulator, the processing time can be shortened. In addition, the spatial light phase modulator can adjust the alignment of the liquid crystal to change the beam shape of the laser light in various ways even when the shape of the processing site is complicated (for example, the boundary surface of the processing site is wavy). It can be transformed into a shape (dotted, linear, etc.). Note that the adjustment unit 20 may not be a spatial light phase modulator as long as the irradiation pattern can be realized. For example, a MEMS mirror can be used as the adjusting unit 20 in order to make the laser light planar.

  Alternatively, an optical system such as a Fresnel lens or a diffractive optical element can be adjusted so that the laser beam has a plurality of focal points (multifocal points) in a direction parallel or perpendicular to the optical axis. By using these optical systems as the adjusting unit 20, it is possible to process a predetermined region in the width direction or the thickness direction of the processing site with a single irradiation. Further, by combining a galvanometer mirror with a Fresnel lens or a diffraction grating, it is possible to scan a laser beam in a wider range.

  In addition, the adjustment part 20 in this embodiment can change a spot size according to a process site | part, when irradiating a laser beam with each irradiation pattern. For example, in the case of an irradiation pattern using a galvanometer mirror, the spot diameter can be changed by the adjustment unit 20 adjusting the focal position of the laser beam. In the case of an irradiation pattern using a spatial light phase modulator, the spot size can be changed by the adjustment unit 20 shaping the laser light into an arbitrary shape.

  The holding unit 30 holds the material M. The method for holding the material M is not particularly limited as long as the held material M can be moved and rotated along the five axes.

  The drive mechanism 40 moves the irradiation unit 10 (adjustment unit 20) and the holding unit 30 relatively. The drive mechanism 40 includes a servo motor for driving. The drive mechanism 40 can process the inside of the material three-dimensionally, which can move at least one of the irradiation unit 10 and the holding unit 30 simultaneously in three axes in the XYZ directions.

  The computer 2 controls the operation of various configurations included in the processing apparatus 1. For example, the computer 2 controls the drive mechanism 40 so that the focal point of the laser beam is located at the processing site, and the relative positional relationship between the irradiation unit 10 and the holding unit 30 (the material M held by the holding unit 30). Adjust. And the computer 2 controls the irradiation part 10, and irradiates a laser beam for every process site | part.

  In the present embodiment, the computer 2 irradiates the processing portion corresponding to the inner wall surface of the hollow portion with the laser beam with the first spot size based on the processing data, and corresponds to the inner side of the inner wall surface of the hollow portion. The irradiation unit 10 and the drive mechanism 40 are controlled to irradiate the laser beam with a second spot size larger than the first spot size with respect to the processing site. Thus, a cavity part can be formed in a material by irradiating a laser beam and performing ablation processing to a processing part. At this time, the computer 2 controls the adjustment unit 20 so that the laser beam is irradiated with a predetermined spot size and a predetermined irradiation pattern for each processing site.

  Furthermore, the computer 2 may control the irradiation unit 10 and adjust the intensity of the laser light, the irradiation time, and the like. The intensity and irradiation time of the laser light affect the output (energy) of the irradiated laser light. These values may be previously incorporated into the machining data as described above, or may be set on the machining apparatus 1 side. Moreover, when determining these values, the type and characteristics of the material to be processed may be taken into account. The computer 2 is an example of a “control unit”.

  Note that the machining system 100 does not need to have five axes as long as a machining method described later can be performed. For example, it is also possible to use a three-axis machining device that drives the irradiation unit 10 in the Z direction and drives the holding unit 30 in the X and Y directions.

== Machining by machining system ==
Next, specific examples of the processing method according to the present embodiment will be described with reference to FIGS. In the present embodiment, an example in which the material M is processed to produce the microfluidic device D shown in FIG. 1 will be described.

  Processing data of the microfluidic device D is created in advance by the CAM system 200. This machining data includes ports P1 to P3, machining site data of the flow path portion F, spot size data, and machining path data. For processing route data, refer to FIGS. 3A to 3C and FIGS. 4A to 4C.

  FIG. 5 is a flowchart showing the processing method according to the present embodiment. The processing method is executed by the processing system 100. Further, the machining method is preinstalled in the machining system 100 as a dedicated machining program.

  First, the material M to be used is selected and set in the holding unit 30 of the processing apparatus 1 (material setting. S10). The material M preferably has a shape corresponding to the shape data (outer shape) used when creating the processing data. However, the material M may be a shape that includes at least the microfluidic device D.

  The computer 2 causes the processing apparatus 1 to process the material M based on the processing data of the microfluidic device D.

  First, the computer 2 specifies a port P1 for performing laser light irradiation first based on the processing path data. The computer 2 selects the processing site data and spot size data corresponding to the specified port P1 (selects the processing site data and spot size data of the port. S11).

  Next, the computer 2 controls the processing apparatus 1 so as to irradiate the processing portion corresponding to the port P1 selected in S11 with laser light. The computer 2 performs adjustment so that the focal position of the laser beam matches the processing site. Specifically, the computer 2 adjusts the relative positions of the irradiation unit 10 and the drive mechanism 40, adjusts the orientation and angle of the lens group included in the irradiation unit 10, the state of the adjustment unit 20, and the like. After matching the focal position of the laser beam and the processing site, the computer 2 irradiates the processing site with the laser beam in a predetermined irradiation pattern.

  At this time, the computer 2 irradiates the processing site corresponding to the inner wall surface of the port P1 with laser light with the first spot size S1 based on the spot size data (the processing site corresponding to the inner wall surface of the port). Irradiate laser light with the first spot size (S12). FIG. 6A shows an example in which laser light is irradiated along the processing path L1 shown in FIG. 3A.

  Further, the computer 2 irradiates a laser beam with a second spot size S2 that is larger than the first spot size S1, based on the spot size data, on the processing site corresponding to the inside of the inner wall surface of the port P1 ( The laser beam is irradiated with the second spot size to the processing site corresponding to the inside of the inner wall surface of the port (S13). FIG. 6B shows an example in which laser light is irradiated along the processing path L2 shown in FIG. 3B. Here, as is clear from FIG. 6B, the spot size S2 of the laser light irradiated along the processing path L2 is larger than the spot size S1 of the laser light irradiated along the processing path L1.

  Note that the laser beam irradiation to the processing path L1 and the processing path L2 of the port P1 is performed from the lower side to the upper side of the material M along the Z direction. Steps 12 and 13 may be performed in the reverse order.

  After the irradiation of the laser beam to the processing parts corresponding to the ports P1 to P3 is completed (in the case of Y in S14), the computer 2 specifies the flow path portion F communicating with the ports P1 to P3. The computer 2 selects processing site data and spot size data corresponding to the identified flow path portion F (selects processing site data and spot size data of the flow path portion. S15). The computer 2 controls the processing apparatus 1 so as to irradiate the processing portion corresponding to the selected flow path portion F with laser light.

  At this time, the computer 2 irradiates the lower half of the processed portion corresponding to the inner wall surface of the flow path portion F with the laser beam with the first spot size S1 based on the spot size data (flow). Laser beam is irradiated with the first spot size to the processing site corresponding to the lower half of the inner wall surface of the road portion (S16). FIG. 7A shows an example in which laser light is irradiated along the processing path L1 shown in FIG. 4A.

  Next, the computer 2 irradiates the processing site corresponding to the inner side of the inner wall surface of the flow path portion F with the laser beam with the second spot size S2 based on the spot size data (the inner wall surface of the flow path portion). Laser beam is irradiated with the second spot size to the processing site corresponding to the inner side (S17). FIG. 7B shows an example in which laser light is irradiated along the processing path L2 shown in FIG. 4B.

  Finally, the computer 2 irradiates the upper half of the machining site corresponding to the inner wall surface of the flow path portion F with laser light at the first spot size S1 based on the spot size data (flow). The processing site corresponding to the upper half of the inner wall surface of the road portion is irradiated with laser light at the first spot size (S18). FIG. 7C shows an example in which laser light is irradiated along the processing path L3 shown in FIG. 4C. As is apparent from FIG. 7C, the spot size S2 of the laser light irradiated along the processing path L2 is larger than the spot size S1 of the laser light irradiated along the processing path L1 and the processing path L3. .

  In addition, irradiation of the laser beam to the processing path L1 to the processing path L3 of the flow path portion F is performed from the lower side to the upper side of the material M along the Z direction.

  By irradiating all the processing parts corresponding to the flow path part F (in the case of Y in S19), the microfluidic device D in which the ports P1 to P3 and the cavity part F are formed can be obtained (workpieces) Completion S20).

  Thus, according to the processing method according to the present embodiment, a processing method of processing a light-transmitting material by irradiating a laser beam and creating a workpiece having a hollow portion therein, A laser beam is irradiated with a first spot size to the processing site corresponding to the inner wall surface, and a second larger than the first spot size is applied to the processing site corresponding to the inner side of the inner wall surface of the cavity portion. Irradiate laser light at spot size.

  A processing portion corresponding to the inside of the inner wall surface of the hollow portion is a portion removed by processing. That is, machining accuracy corresponding to the inside of the inner wall surface does not require machining accuracy. Therefore, by irradiating the processing site with laser light with a second spot size larger than the first spot size, a wide range can be processed with a single laser light irradiation. Therefore, the processing time can be shortened as compared with the case where the entire cavity portion is processed by irradiating the laser beam with the same spot size. On the other hand, fine processing is possible by irradiating the laser beam with the first spot size smaller than the second spot size to the processing portion corresponding to the inner wall surface of the hollow portion. Therefore, the inner wall surface can be formed in a desired shape. In addition, by forming a hollow portion using laser light, it is not necessary to process a plurality of materials or to bond materials together, so that a workpiece can be easily created in a short time. Furthermore, since it is not necessary to bond materials together, there are no steps or joints in the flow path, and no fluid leaks from the bonded locations. That is, according to the processing method according to the present embodiment, when processing a workpiece having a hollow portion therein, the inner wall surface of the hollow portion can be formed into a desired shape, and the processing time can be shortened.

  Further, in the processing method according to the present embodiment, when there are processing parts that overlap in the irradiation direction of the laser light, the laser light is irradiated to the overlapping processing parts in an order away from the material surface on which the laser light is incident. be able to. As described above, the irradiated laser light is not affected by the modification by irradiating the laser beam with the laser beam in the order away from the surface of the material on which the laser beam is incident on the overlapped processing site. In other words, there is a problem that the laser beam cannot be transmitted through the modified processing site, and a problem that the laser beam is refracted or reflected at the modified processing site, and the laser beam cannot be accurately irradiated to another processing site. hard. Thus, according to the processing method according to the present embodiment, it is possible to create a workpiece without being affected by the modification of the material accompanying the irradiation of laser light.

  Moreover, the processing method according to the present embodiment can irradiate the laser beam while simultaneously moving the laser beam along the orthogonal X axis, Y axis, and Z axis. By moving the laser light in three axes simultaneously in this way, even if the hollow portion has a complicated shape (crossed shape or inclined shape), it can be easily processed.

  Alternatively, the processing system 100 according to the present embodiment processes a light transmissive material by irradiating a laser beam, and creates a workpiece having a hollow portion inside. The processing system 100 includes an irradiation unit 10, a holding unit 30, a drive mechanism 40, and the computer 2. The irradiation unit 10 emits laser light. The holding unit 30 holds the material M. The drive mechanism 40 moves the irradiation unit 10 and the holding unit 30 relatively. The computer 2 irradiates the processing portion corresponding to the inner wall surface of the hollow portion with the first spot size, and the first spot is applied to the processing portion corresponding to the inner side of the inner wall surface of the hollow portion. The irradiation unit 10 and the drive mechanism 40 are controlled so that the laser beam is irradiated with a second spot size larger than the size. The processing program according to the present embodiment is a program executed by the processing system 100 that processes a light transmissive material by irradiating a laser beam and creates a workpiece having a hollow portion therein. The machining program causes the machining system 100 to irradiate the machining site corresponding to the inner wall surface of the cavity portion with laser light at the first spot size, and to the machining site corresponding to the inner side of the inner wall surface of the cavity portion. Then, the laser beam is irradiated with a second spot size larger than the first spot size. According to such a processing system 100 and a processing program, when processing a workpiece having a hollow portion therein, the inner wall surface of the hollow portion can be formed into a desired shape, and the processing time can be shortened.

[Others]
The workpiece that can be created by the above processing method is not limited to a microfluidic device. The said processing method can be widely utilized when producing the workpiece which has a cavity part inside.

  It is also possible to supply a program to a computer using a non-transitory computer readable medium with an executable program, in which a machining program for performing the machining method of the above embodiment is stored. . Examples of non-transitory computer-readable media include magnetic recording media (for example, flexible disks, magnetic tapes, hard disk drives), CD-ROMs (Read Only Memory), and the like.

  The above embodiment is presented as an example of the invention and does not limit the scope of the invention. The above configuration can be variously omitted, replaced, and changed without departing from the gist of the invention. The above-described embodiments and modifications thereof are included in the invention described in the claims and equivalents thereof in the same manner as included in the scope and spirit of the invention.

DESCRIPTION OF SYMBOLS 1 Processing apparatus 2 Computer 10 Irradiation part 20 Adjustment part 30 Holding part 40 Drive mechanism 100 Processing system

Claims (5)

A processing method of processing a light transmissive material by irradiating a laser beam and creating a workpiece having a hollow portion inside,
Irradiating the laser beam with a first spot size to the processing site corresponding to the inner wall surface of the hollow portion,
A processing method of irradiating the laser beam with a second spot size larger than the first spot size to a processing site corresponding to the inner side of the inner wall surface of the hollow portion.   2. When there is a processing portion that overlaps in the irradiation direction of the laser light, the laser light is irradiated to the overlapping processing portion in order away from the material surface on which the laser light is incident. The processing method described.   3. The processing method according to claim 1, wherein the laser beam is irradiated while simultaneously moving along the X axis, the Y axis, and the Z axis that are orthogonal to each other. A processing system for processing a light-transmitting material by irradiating a laser beam and creating a workpiece having a hollow portion inside,
An irradiation unit for irradiating a laser beam;
A holding part for holding the material;
A drive mechanism for relatively moving the irradiation unit and the holding unit;
The laser beam is irradiated with a first spot size to the processing site corresponding to the inner wall surface of the hollow portion, and the first spot is applied to the processing site corresponding to the inner side of the inner wall surface of the hollow portion. A control unit for controlling the irradiation unit and the drive mechanism to irradiate the laser beam with a second spot size larger than the size;
Processing system. A program that is executed in a processing system that processes a light-transmitting material by irradiating a laser beam and creates a workpiece having a hollow portion therein,
The processing system is configured to irradiate the laser beam with a first spot size to a processing site corresponding to the inner wall surface of the hollow portion, and to the processing site corresponding to the inner side of the inner wall surface of the hollow portion. A processing program for irradiating the laser beam with a second spot size larger than the first spot size.

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