JP2019151370A - Packaging specification determination method of electronic component, and packaging container of electronic component - Google Patents

Abstract

To provide a packaging specification determination method of an electronic component which can determine a proper packaging specification that can efficiently inhibit damage of pin parts, and can efficiently inhibit the packaging specification from becoming excessive due to excessive use of a cushioning material.SOLUTION: A packaging specification determination method of an electronic component includes: a strength characteristic value determination step S101 of determining a strength characteristic value of pin parts 112 on the basis of a result of a yield test of the pin parts 112; a cushioning characteristic derivation step S102 of deriving a relation between a static stress and an input impact characteristic value to a sheet material 46 as a cushioning characteristic of a cushioning material 12 on the basis of a result of an impact test in which a weight 44 is made to fall under a plurality of sheet material conditions; and a cushioning material specification determination step S103 of determining a specification of the cushioning material 12 which is arranged on each inner face of a maximum face, a minimum face, and a middle face so that a transfer impact characteristic value obtained by multiplying the input impact characteristic value by a predetermined magnification becomes the strength characteristic value or less in a target value of weight and a drop distance of the weight 44, in either the maximum face, the minimum face, or the middle face of a case 11 on the basis of the cushioning characteristic.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a method for determining the packing specification of an electronic component for determining the packing specification when the electronic component is stored in a rectangular parallelepiped case and packed, and the packaging of the electronic component for storing and packing the electronic component Concerning the container.

  Conventionally, when an article is conveyed, the article is conveyed in a state where the article is stored in a case and packed. Further, when packing an article, the article is packed in a state where a cushioning material is disposed in the case in order to prevent the article from being damaged by an impact that may occur during transportation.

  In patent document 1, the packing material which packs goods in the state which has arrange | positioned the shock absorbing material in the case is disclosed. The packaging material disclosed in Patent Document 1 is configured as a packaging material suitable when the article to be packaged is an electronic device such as a hard disk, a DVD, or a laptop computer. And the packing material of patent document 1 is a cube-shaped case which arrange | positions and stores an air cushioning material in the up-and-down, right-and-left, and all the circumferences of the front and back of the stored thing which is an electronic device, Comprising: The protrusion is provided, and is configured as a packing material that supports the outer peripheral surface of the air cushioning material by the flat end surface of the protrusion.

Utility Model Registration No. 3108122

  Patent Document 1 discloses a packing material in which electronic devices such as a hard disk, a DVD, and a laptop computer are stored and packed as a single unit. On the other hand, packing with a cushioning material placed in the case to prevent damage due to impact that may occur during transportation is not limited to the case where the packing target is an electronic device as described above, This is also performed when is an electronic component.

  When the packaging object is an electronic component, unlike an electronic device that is packaged as a single unit, such as when using the packaging material disclosed in Patent Document 1, a plurality of electronic components are stored in a rectangular parallelepiped case. And packed. In addition to the main body, the electronic parts that are to be packed often adopt a form having a pin portion that protrudes from the main body portion as a portion that is electrically connected to other equipment or a substrate. Has been. That is, when the packing object is an electronic component, the electronic component having a main body portion and a pin portion is packed in a state in which a plurality of electronic components are gathered.

  When a case in which electronic parts are packed is transported, an impact load is often applied to the case during transportation due to vibration or acceleration generated in the case during transportation or dropping of the case. In particular, when the case is dropped, a large impact load is likely to be applied to the case. And when the electronic parts having the main body part and the pin part are packed and transported in a state of being assembled, when an impact load is applied to the case at the time of transportation, it is relaxed by the cushioning material arranged inside the case The impact is transmitted to each of the plurality of electronic components in the case. In other words, the shock that has been alleviated by the buffer material is transmitted from the electronic components adjacent to each other to the individual electronic components in the case. And since an electronic component is a structure where the pin part protruded from the main-body part, when an impact is added with respect to each electronic component, it will become easy to produce damage to pin parts, such as a bending deformation of a pin part. For this reason, it is desirable to determine a packing specification so that damage to a pin part can be suppressed.

  On the other hand, by setting a large amount of cushioning material to be placed in the rectangular parallelepiped case, the impact applied from the outside of the case is sufficiently mitigated by the cushioning material to reduce the impact transmitted to individual electronic components. Thus, the packing specification can be determined so as to suppress the breakage of the pin portion. However, the packing specification determined in this way has a problem that it becomes an excessive packing specification due to excessive use of the cushioning material.

  The present invention relates to a packing specification in the case of storing and packing a plurality of electronic parts having a main body part and a pin part in a state of being gathered in view of the above situation, and can effectively prevent breakage of the pin part and buffer. It is an object of the present invention to provide an electronic component packaging specification determination method capable of determining an appropriate packaging specification that can efficiently suppress an excessive packaging specification due to excessive use of materials. The present invention also relates to a packaging container for storing and packing a plurality of electronic parts having a main body part and a pin part in an assembled state, and can efficiently prevent damage to the pin part and excessive use of a cushioning material. It is another object of the present invention to provide a packaging container for electronic components that can efficiently suppress the excessive packaging specification due to the above.

(1) An electronic component packaging specification determination method according to an aspect of the present invention for achieving the above object is a rectangular parallelepiped in a state in which a plurality of electronic components having a main body portion and a pin portion protruding from the main body portion are assembled. The present invention relates to a method for determining a packing specification of an electronic component for determining a packing specification when a plurality of the electronic components are accommodated in a case and packed. The electronic component packaging specification determination method according to an aspect of the present invention includes: (a) applying a load to the pin portion so as to relatively displace the tip side portion of the pin portion with respect to the main body portion. A strength characteristic value determining step for determining a strength characteristic value indicating the strength characteristic of the pin portion based on a result of a yield test for yielding the pin portion; and (b) arranged as a buffer material on the inner surface of the case. The static weight obtained by dividing the weight of the weight by the area of the sheet material based on the result of an impact test in which the weight is dropped and a shock load is applied to the sheet material under a plurality of sheet material conditions. A buffer that derives a relationship between the mechanical stress and an input impact characteristic value that indicates a characteristic of an impact that is measured when the weight falls on the sheet material and is input to the sheet material, as a buffer characteristic of the buffer material; A characteristic derivation step; c) Based on the cushioning characteristics, the largest surface having the largest area, the smallest surface having the smallest area, and the smallest surface having a smaller area than the largest surface among the three types of surfaces having different areas in the rectangular parallelepiped case. In any of the intermediate surfaces having a larger area than the target value of the weight and the target value of the falling distance of the weight, the input impact characteristic value is set by multiplying by a predetermined magnification. The buffer disposed on the inner surface of each of the maximum surface, the minimum surface, and the intermediate surface so that a transmission impact property value indicating an impact property transmitted to the pin portion is equal to or less than the strength property value. A buffer material specification determining step for determining a material specification.

  According to this configuration, the strength characteristic value of the pin portion of the electronic component to be packed is determined in the strength characteristic value determination step. In this step, the strength characteristic value is based on the result of a yield test that yields the pin portion by applying a load to the pin portion so as to displace the portion on the tip side of the pin portion relative to the main body portion. It is determined. The strength characteristic value determined in this way is used in the buffer material specification determining step for determining the specifications of the buffer material. Therefore, when determining the packaging specification of the electronic component, the specification of the cushioning material can be determined based on the strength characteristic value of the pin portion of the electronic component to be packaged so as to suppress the breakage of the pin portion.

  In addition, when an impact load is applied to the case due to the fall of the case, the impact that is alleviated by the cushioning material arranged inside the case is transmitted from the electronic components adjacent to each other to the individual electronic components in the case. Will be. At this time, in the electronic component to which the impact is transmitted, the impact from the other electronic component is further transmitted to the pin portion in a state where the displacement of the main body portion is restrained with respect to the other adjacent electronic components. It is easy to become a state. For this reason, when grasping the strength characteristics of the pin part for evaluating the damage of the pin part when an impact is applied to each of the electronic parts packed in a plurality of packages, By performing the grasp based on the yield condition of the pin portion when an impact is applied so that the portion is relatively displaced, the strength characteristic of the pin portion can be accurately grasped. According to the above configuration, in the strength characteristic value determination step, the strength characteristic value of the pin portion is determined by applying a load to the pin portion so as to displace the tip side portion of the pin portion relative to the main body portion. It is determined based on the result of the yield test to yield. For this reason, according to said structure, the strength characteristic of the pin part for evaluating the damage of a pin part at the time of an impact being applied with respect to each of the electronic component of the state collected in multiple sets is more correctly grasped | ascertained be able to.

  Moreover, according to said structure, the impact test which drops a weight with respect to the sheet | seat raw material used as a buffer material is performed at a buffer characteristic derivation | leading-out step. Then, in this step, based on the result of the impact test, the cushioning material as a relation between the static stress based on the weight and the sheet material area and the input impact characteristic value to the sheet material when the weight is dropped. A buffer characteristic is derived. Therefore, when determining the packaging specifications for electronic components, determine the specifications of the cushioning material based on the cushioning characteristics of the cushioning material so that the conditions for the cushioning material necessary to prevent damage to the pin part can be secured. Can do.

  As the impact load applied to the case, the impact load generated when the case is dropped is the largest, which is the most problematic. In this case, the impact load applied to the case increases according to the weight of the case in which a plurality of electronic components are stored. Further, when the case falls, the impact is dispersed according to the area of the cushioning material disposed inside the surface of the case that collides with the floor surface or the like. In addition, depending on the conditions when the case is dropped, the characteristics of the impact input to the cushioning material when the case is dropped also change. Therefore, when grasping the cushioning characteristics of the cushioning material, the relationship between the weight of the case in which a plurality of electronic components are housed, the relationship between the area of the cushioning material, and the impact input to the cushioning material when the case is dropped By grasping the relationship with the characteristic, it is possible to accurately grasp the buffer characteristic of the cushioning material. According to the above configuration, in the buffer characteristic derivation step, an impact test is performed in which a weight is dropped on the sheet material serving as the buffer material, and based on the result of the impact test, based on the weight of the weight and the sheet material area. The buffer characteristic of the buffer material is derived as a relation between the static stress and the input impact characteristic value to the sheet material when the weight is dropped. For this reason, according to said structure, the buffer characteristic of a shock absorbing material can be correctly grasped | ascertained based on the impact test result which reflected the influence of the impact at the time of dropping of the case which becomes the most problem more accurately.

  Moreover, according to said structure, a buffer material specification determination step is performed. In the shock absorber specification determination step, a transmission impact characteristic value that is set based on the input impact characteristic value and that indicates the characteristic of the impact transmitted to the pin portion is set. In this step, the transmission impact characteristic value is the strength characteristic value at the weight weight target value and the weight fall distance target value at any of the maximum surface, the minimum surface, and the intermediate surface of the rectangular parallelepiped case. The specifications of the cushioning material disposed on the inner surfaces of the maximum surface, the minimum surface, and the intermediate surface are determined as follows. Therefore, even when an impact load according to the weight and drop distance conditions set as target values is applied to the case, the impact transmitted to the pin part of the electronic component is The specifications of the cushioning material disposed on the inner surfaces of the maximum surface, the minimum surface, and the intermediate surface are determined so as not to exceed. For this reason, even if a shock load according to the weight weight and drop distance conditions set as target values is applied to the case, the specifications of the cushioning material are such that damage to the pin portion is suppressed Will be determined. And even if the impact is applied from any of the maximum surface, the minimum surface, and the intermediate surface with different areas, each of the maximum surface, the minimum surface, and the intermediate surface is suppressed so that the breakage of the pin portion is suppressed. The specification of the cushioning material corresponding to is determined. For this reason, in any of the maximum surface, the minimum surface, and the intermediate surface, it is possible to suppress the specification of an excessive buffer material in which the buffer material is excessively used. Therefore, damage to the pin portion can be efficiently suppressed, and excessive packing specifications due to excessive use of the cushioning material can be efficiently suppressed.

  In addition, as the target value of the weight of the weight, a predetermined weight that is equal to or greater than the weight of the case in which a plurality of electronic components are housed can be set as the target value. In addition, as a target value of the falling distance of the weight, even if a case in which a plurality of electronic components are housed falls, a predetermined level that is higher than a desired height level is desired to suppress damage to the pin portion. The height can be set as a target value.

  In addition, when the impact input to the cushioning material is transmitted to the pin portion of the electronic component, the pin portion is elastically deformed. Therefore, the impact transmitted to the pin portion is the time during which the impact is applied to the pin portion. Will change between. Then, the impact transmitted to the pin portion fluctuates around the impact input to the cushioning material according to the acceleration at the time of elastic deformation occurring in the pin portion. For this reason, in order to evaluate the breakage of the pin portion, it is necessary to reflect a state in which the impact transmitted to the pin portion is maximized. According to the above configuration, the transmission impact characteristic value set based on the input impact characteristic value and indicating the characteristic of the impact transmitted to the pin portion is set by multiplying the input impact characteristic value by a predetermined magnification. The For this reason, the transmission impact characteristic value can be set reflecting the state where the impact transmitted to the pin portion is maximized.

  Therefore, according to the above configuration, regarding the packing specification in the case of storing and packing a plurality of electronic parts having a main body part and a pin part in a collective state, damage to the pin part can be efficiently suppressed and the cushioning material is excessive. It is possible to provide an electronic component packaging specification determination method capable of determining an appropriate packaging specification capable of efficiently suppressing an excessive packaging specification due to use.

(2) The strength characteristic value may be determined as a value obtained by dividing a load applied to the pin portion when the pin portion yields is divided by a mass of the pin portion.

  According to this configuration, since the strength characteristic value of the pin part is determined as a value obtained by dividing the load applied to the pin part when the pin part yields by the mass of the pin part, the strength of the pin part based on the yield test result The characteristic value can be easily determined. Note that if the magnitude of the impact transmitted to the pin portion of the electronic component exceeds a predetermined magnitude, the pin portion yields and breaks. And when a pin part yields and is damaged by the impact transmitted to the pin part of an electronic component, the acceleration according to the magnitude | size of the transmitted impact acts on a pin part. For this reason, the strength characteristic of the pin part for evaluating the breakage of the pin part can be grasped by evaluating the acceleration acting on the pin part when the pin part yields. According to the above configuration, the strength characteristic value of the pin portion is determined as a value obtained by dividing the load applied to the pin portion when the pin portion yields by the mass of the pin portion. It is possible to easily evaluate the acting acceleration and easily determine the strength characteristic value of the pin portion.

(3) The input impact characteristic value may be set as a measured value of a maximum acceleration generated in the weight when the weight falls on the sheet material.

  According to this configuration, the input impact characteristic value is set as a measurement value of the maximum acceleration that occurs on the weight when the weight falls on the sheet material, so the input when the weight is dropped on the sheet material based on the result of the impact test The impact characteristic value can be set easily. When the weight falls on the sheet material and an impact is input to the sheet material, an impact corresponding to the maximum acceleration when the weight is dropped on the sheet material is input to the sheet material. Therefore, by measuring the maximum acceleration when the weight is dropped onto the sheet material, it is possible to grasp the input impact characteristic value when the weight is dropped onto the sheet material. According to the above configuration, since the input impact characteristic value is set as a measured value of the maximum acceleration when the weight is dropped on the sheet material, the input impact characteristic value when the weight is dropped on the sheet material is easily determined. be able to.

(4) In the buffer characteristic deriving step, a plurality of conditions set by changing the number of layers of the sheet material on which the weight falls are selected as the plurality of sheet material conditions, and the buffer material specification determining step Then, as the specifications of the cushioning material disposed on the inner surfaces of the maximum surface, the minimum surface, and the intermediate surface, the maximum surface, the minimum surface, and the intermediate surface are disposed on the inner surfaces, respectively. The number of layers of the sheet material may be determined.

  According to this configuration, the number of sheet material layers arranged on the inner surfaces of the maximum surface, the minimum surface, and the intermediate surface of the case is determined as the specification of the cushioning material. Therefore, each of the maximum surface, the minimum surface, and the intermediate surface is controlled so that damage to the pin portion is suppressed even when an impact is applied from any of the maximum surface, the minimum surface, and the intermediate surface with different areas. The number of layers of the sheet material as a cushioning material corresponding to is determined. For this reason, it can suppress easily that it becomes the specification of the excess buffer material in which the buffer material was used excessively in any surface of the maximum surface, the minimum surface, and an intermediate surface. Therefore, it is possible to easily determine an appropriate packing specification that can efficiently suppress the breakage of the pin portion and efficiently suppress the excessive packing specification due to excessive use of the cushioning material.

(5) A packaging container for electronic components according to an aspect of the present invention for achieving the above-described object includes a plurality of electronic components each having a main body portion and a pin portion protruding from the main body portion. The present invention relates to an electronic component packing container for storing and packing the electronic component. An electronic component packaging container according to an aspect of the present invention includes a rectangular parallelepiped case and a cushioning material that includes a sheet material and is disposed on an inner surface of the case, and the case has a rectangular parallelepiped shape. As the three types of surfaces having different areas in the case, the largest surface having the largest area, the smallest surface having the smallest area, and the intermediate surface having an area smaller than the largest surface and larger than the smallest surface, The cushioning material is not disposed on the inner surface of the maximum surface, or the cushioning material is disposed on the inner surface of the intermediate surface rather than the number of layers of the sheet material in the cushioning material disposed on the inner surface of the maximum surface. The number of layers of the sheet material in is larger, the number of layers of the sheet material in the cushioning material arranged on the inner surface of the intermediate surface of the sheet material in the cushioning material arranged on the inner surface of the minimum surface And wherein the direction of a large number.

  According to this configuration, the packing container is configured to be housed and packed in a case in a state in which a plurality of electronic components having a main body portion and a pin portion are assembled. When an impact load is applied to the case of the packing container due to the dropping of the packing container or the like, an impact that is alleviated by the cushioning material disposed inside the case is transmitted to the individual electronic components in the case. Will be. At this time, the impact is dispersed according to the area of the cushioning material arranged inside the surface to which the impact load is input in the case. And the packaging container of said structure is comprised so that a buffer material may not be arrange | positioned on the inner surface of the largest surface of a case. Or the packaging container of said structure is comprised so that the number of layers of the sheet material of the inner surface of an intermediate surface may be set more than the number of layers of the sheet material in the buffer material of the inner surface of the largest surface. Furthermore, the packaging container having the above-described configuration is configured such that the number of sheet materials on the inner surface of the minimum surface is greater than the number of layers of the sheet material on the inner surface of the intermediate surface.

  Therefore, according to the above configuration, when an impact load is input, the sheet surface has the fewest number of layers or the sheet material is arranged on the maximum surface where the area is the largest and the impact per unit area is the smallest. The packaging is configured so that it is not. When the impact load is input, the packaging container is configured such that the number of layers of the sheet material is maximized on the minimum surface where the area is the smallest and the impact per unit area is the greatest. Furthermore, when the impact load is input, the number of layers of the sheet material is larger than the maximum surface on the intermediate surface where the area of the case surface is intermediate and the impact per unit area is intermediate. The packaging container is configured so as to be less than the minimum surface. For this reason, the sheet material having an appropriate number of layers according to the impact per unit area can be disposed on the inner surface of each surface of the case. As a result, in the packaging container, it is possible to efficiently suppress the damage of the pin portion, and avoid the use of an excessive number of layers of the sheet material and suppress the excessive packing specification due to the excessive use of the cushioning material. Can do.

  Therefore, according to the above configuration, with respect to a packaging container for storing and packing a plurality of electronic parts having a main body part and a pin part in a collective state, damage to the pin part can be efficiently suppressed and an excessive amount of cushioning material can be used. Thus, it is possible to provide a packaging container for electronic components that can efficiently suppress excessive packing specifications due to various uses.

  According to the present invention, regarding packing specifications when storing and packing a plurality of electronic components having a main body portion and a pin portion in a collective state, damage to the pin portion can be efficiently suppressed and the buffer material is excessively used. It is possible to provide an electronic component packaging specification determination method capable of determining an appropriate packaging specification capable of efficiently suppressing an excessive packaging specification. The present invention also relates to a packaging container for storing and packing a plurality of electronic components having a main body portion and a pin portion in an assembled state, and can efficiently prevent breakage of the pin portion and excessive cushioning material. It is possible to provide an electronic component packaging container that can efficiently suppress an excessive packaging specification due to use.

1A and 1B are diagrams illustrating a packaging container for electronic components according to an embodiment of the present invention, in which FIG. 1A is a perspective view of the packaging container, and FIG. 1B is X1 in FIG. FIG. 1C is a cross-sectional view as viewed from the position indicated by the arrows X1-X1, and FIG. 1C is a cross-sectional view as viewed from the positions indicated by arrows X2-X2 in FIG. It is sectional drawing of the packaging container shown in FIG. 1, Comprising: It is sectional drawing which shows the state accommodated and packed in the state in which multiple electronic components gathered in the packaging container. It is a perspective view shown in the state which decomposed | disassembled the packaging container shown in FIG. It is a flowchart for demonstrating the process of the packing specification determination method of the electronic component which concerns on one embodiment of this invention. It is a figure which shows an example of the electronic component which is a packing object by which a packing specification is determined by the packing specification determination method, Comprising: FIG. 5 (A) is a side view of an electronic component, FIG.5 (B) is an electronic component. FIG. It is a figure for demonstrating the yield test performed in the intensity | strength characteristic value determination step in a packing specification determination method. It is a figure for demonstrating the result of the yield test performed in an intensity | strength characteristic value determination step. It is a figure for demonstrating the impact test performed in the buffer characteristic derivation | leading-out step in the packing specification determination method. It is a figure for demonstrating the result of the impact test performed in a buffer characteristic derivation | leading-out step. It is a figure for demonstrating the buffer characteristic of the buffer material derived | led-out in a buffer characteristic derivation | leading-out step.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. The present invention relates to a method for determining a packing specification of an electronic component for determining a packing specification when the electronic component having a main body portion and a pin portion is assembled and packed in a rectangular parallelepiped case. It can be widely applied to various uses. In addition, the present invention can be widely applied to various uses as a packaging container for electronic parts for storing and packing a plurality of electronic parts having a main body part and a pin part in an assembled state. is there.

  In the following description, first, an electronic component packaging container according to an embodiment of the present invention will be described, and then an electronic component packaging specification determination method according to an embodiment of the present invention will be described.

(Packing container)
[Outline of packing container]
FIG. 1 is a diagram showing an electronic component packaging container 1 (hereinafter, the electronic component packaging container 1 is also simply referred to as a packaging container 1) according to an embodiment of the present invention. And FIG. 1 (A) is a perspective view of the packaging container 1, FIG. 1 (B) is a sectional view of the packaging container 1 viewed from the X1-X1 line arrow position of FIG. 1 (A), FIG. 1C is a cross-sectional view of the packaging container 1 viewed from the position indicated by arrows X2-X2 in FIG. In FIG. 1, the packaging container 1 in a state where no electronic component is stored is illustrated. FIG. 2 is a cross-sectional view of the packaging container 1 and shows a state in which a plurality of electronic components 100 are stored and packed in the packaging container 1. Note that the cross-sectional view of FIG. 2 corresponds to the cross-section viewed from the X2-X2 arrow position of FIG. FIG. 3 is a perspective view showing the packaging container 1 in an exploded state. In the exploded perspective view of the packaging container 1 shown in FIG. 3, the bag 13 that houses the electronic component 100 is also shown together with the packaging container 1.

  A packaging container 1 shown in FIGS. 1 to 3 is configured as a packaging container for storing and packaging a plurality of electronic components 100 in a state where a plurality of electronic components 100 are assembled. And the electronic component 100 accommodated and packed in the packing container 1 in the aggregated state is comprised as an electrical connector, for example, and has the main-body part 101 and the pin part 102. FIG.

  The main body 101 of the electronic component 100 is made of an insulating resin material and has a casing-like basic outer shape. The pin portion 102 is made of a conductive metal material, has a cylindrical or prismatic basic outer shape, is held by the main body portion 101, and is provided so as to protrude from the main body portion 101. In the electronic component 100, a plurality of pin portions 102 are provided, and the plurality of pin portions 102 protrude from the main body portion 101 in parallel with each other. In addition, the electronic component 100 shown in FIG. 2 as an electronic component accommodated and packed in the packaging container 1 is an illustration. The electronic component packed in the packaging container 1 is not limited to the electronic component 100, and may be an electronic component having a main body portion and a pin portion.

  As shown in FIGS. 1 to 3, the packaging container 1 includes a rectangular parallelepiped case 11 and a cushioning material 12 disposed on the inner surface of the case 11. And the packing container 1 is comprised so that the electronic component 100 of the state with which two or more sets were gathered may be accommodated in the inside of the case 11 by which the buffer material 12 was arrange | positioned on the inner surface. In addition, in this embodiment, as shown in FIG. 2, the form with which the several electronic component 100 was packed in the packing container 1 in the state accommodated in the inside of the bag 13 and illustrated was illustrated. The bag 13 is configured, for example, as a plastic bag or a paper bag.

[Case]
The case 11 of the packaging container 1 is configured as, for example, a paper box formed in a rectangular parallelepiped shape. The case 11 may be configured as a resin box. In the present embodiment, the case 11 includes a box body 21 and a lid body 22.

  The box body 21 has five surfaces (an upper surface, a front surface, a rear surface, a right side surface, and a left side surface) other than the bottom surface, and is configured with the bottom surface open. The lid body 22 has five surfaces (front surface, back surface, right side surface, left side surface, bottom surface) other than the top surface, and is configured in a state where the top surface is open. The case 11 is configured as a rectangular parallelepiped box having six surfaces by combining the box body 21 and the lid body 22. In addition, the case 11 does not need to be limited to the form having the box body 21 and the lid 22 and may be a rectangular parallelepiped case. For example, the case 11 may be configured as a box configured by being assembled from a single development view.

  The case 11 has a maximum surface (23a, 23b), a minimum surface (24a, 24b), and an intermediate surface (25a, 25b) as three types of surfaces having different areas in the rectangular parallelepiped case 11. ing.

  The maximum surface (23a, 23b) is configured as a surface having the largest area among the three types of surfaces having different areas in the rectangular parallelepiped case 11. The maximum surfaces (23a, 23b) are provided as a pair of surfaces arranged in parallel to each other in the case 11, and are configured as an upper surface and a bottom surface in the case 11 in this embodiment.

  The minimum surface (24a, 24b) is configured as a surface having the smallest area among the three types of surfaces having different areas in the rectangular parallelepiped case 11. The minimum surfaces (24a, 24b) are provided as a pair of surfaces arranged in parallel with each other in the case 11, and are configured as a front surface and a back surface in the case 11 in this embodiment.

  The intermediate surfaces (25a, 25b) are surfaces having a smaller area than the maximum surface (23a, 23b) and a larger area than the minimum surface (24a, 24b) among the three types of surfaces having different areas in the rectangular parallelepiped case 11. It is configured as. That is, the intermediate surfaces (25a, 25b) are configured as surfaces having an intermediate area among the three types of surfaces having different areas in the rectangular parallelepiped case 11. The intermediate surfaces (25a, 25b) are provided as a pair of surfaces arranged parallel to each other in the case 11, and are configured as a right side surface and a left side surface in the case 11 in this embodiment.

[Buffer material]
The cushioning material 12 is configured to include a sheet material that is a sheet-like material having elasticity and is a material for relaxing an impact input from the outside. In the present embodiment, the cushioning material 12 is formed by processing a sheet material according to the shape of the inner surface of the case 11. The cushioning material 12 is disposed on the inner surface of the case 11 in order to mitigate the impact transmitted from the outside through the case 11.

  In the packaging container 1, a first buffer material 26 and a second buffer material 27 are provided as the buffer material 12. The first cushioning material 26 and the second cushioning material 27 are both made of a sheet material, and are composed of, for example, a bubble cushioning material formed in a sheet shape. As the bubble cushioning material constituting the first and second cushioning materials (26, 27), for example, a plurality of polyethylene sheets are integrated, and air is regularly dispersed between the polyethylene sheets. A confined cushion-like sheet material can be used.

  The first buffer material 26 is formed by bending a single rectangular sheet material at three locations along a direction perpendicular to the longitudinal direction. The first buffer material 26 is provided with a first wall portion 26a, a second wall portion 26b, a third wall portion 26c, and a fourth wall portion 26d by being bent at three locations. For this reason, the 1st wall part 26a, the 2nd wall part 26b, the 3rd wall part 26c, and the 4th wall part 26d are comprised by the sheet | seat raw material of one layer. In the first buffer material 26, the first wall portion 26a is disposed on the inner surface of the minimum surface 24a of the case 11, the second wall portion 26b is disposed on the inner surface of the maximum surface 23b of the case 11, and the third wall portion 26c. Is arranged on the inner surface of the minimum surface 24 b of the case 11, and the fourth wall portion 26 d is arranged on the inner surface of the case 11 with the fourth wall portion 26 d being arranged on the inner surface of the maximum surface 23 a of the case 11.

  The second cushioning material 27 is formed in a state in which one rectangular sheet material is equally folded at a fold along the longitudinal direction into two elongated layers, and is perpendicular to the elongated direction. It is formed by being bent at three locations along the direction. Therefore, the second cushioning material 27 is formed in a shape that is folded so that the sheet material that is folded and overlapped to form two layers forms a rectangular outer frame. As a result, the second buffer material 27 is provided with a first wall portion 27a, a second wall portion 27b, a third wall portion 27c, and a fourth wall portion 27d that are made of a two-layer sheet material. In the second buffer material 27, the first wall portion 27a is disposed on the inner surface of the intermediate surface 25b of the case 11, the second wall portion 27b is disposed on the inner surface of the minimum surface 24a of the case 11, and the third wall portion 27c. Is disposed on the inner surface of the intermediate surface 25 a of the case 11, and the fourth wall portion 27 d is disposed on the inner surface of the minimum surface 24 b of the case 11 and is disposed on the inner side of the case 11.

  In the packaging container 1, as described above, the first cushioning material 26 having the first to fourth wall portions (26 a to 26 d) made of one layer of sheet material and the two layers of sheet material are used. A second buffer material 27 having first to fourth wall portions (27 a to 27 d) is disposed on the inner surface of the case 11. And each wall part (26a-d, 27a-d) of the 1st and 2nd shock absorbing material (26, 27) is on the inner surface of each surface (23a, 23b, 24a, 24b, 25a, 25b) of case 11. On the other hand, it arrange | positions by the above-mentioned correspondence.

  As described above, the fourth wall portion 26d of the first cushioning material 26 is disposed on the inner surface of the maximum surface 23a of the case 11, and the number of layers of the sheet material disposed on the inner surface of the maximum surface 23a of the case 11 is one layer. Is set to And the 2nd wall part 26b of the 1st shock absorbing material 26 is arrange | positioned at the inner surface of the largest surface 23b of the case 11, and the number of layers of the sheet | seat raw material arrange | positioned at the inner surface of the largest surface 23b of the case 11 is one layer. Is set.

  In addition, on the inner surface of the minimum surface 24 a of the case 11, the first wall portion 26 a of the first buffer material 26 and the second wall portion 27 b of the second buffer material 27 are arranged, and on the inner surface of the minimum surface 24 a of the case 11. The number of layers of the sheet material to be arranged is set to 3 layers. And on the inner surface of the minimum surface 24b of the case 11, the third wall portion 26c of the first buffer material 26 and the fourth wall portion 27d of the second buffer material 27 are arranged, and on the inner surface of the minimum surface 24b of the case 11 The number of layers of the sheet material to be arranged is set to 3 layers.

  Further, the third wall 27c of the second buffer material 27 is disposed on the inner surface of the intermediate surface 25a of the case 11, and the number of sheet materials disposed on the inner surface of the intermediate surface 25a of the case 11 is two layers. Is set. And the 1st wall part 27a of the 2nd shock absorbing material 27 is arrange | positioned at the inner surface of the intermediate surface 25b of case 11, and the number of layers of the sheet | seat raw material arrange | positioned at the inner surface of the intermediate surface 25b of case 11 is two layers. Is set.

  As described above, in the packaging container 1, one sheet material is disposed on the inner surface of the maximum surface (23 a, 23 b) of the case 11, and three sheet materials are disposed on the inner surface of the minimum surface (24 a, 24 b) of the case 11. The sheet material is arranged in two layers on the inner surface of the intermediate surface (25a, 25b) of the case 11. Thereby, the packaging container 1 is a sheet | seat in the shock absorbing material 12 arrange | positioned on the inner surface of an intermediate | middle surface (25a, 25b) rather than the number of layers of the sheet | seat raw material in the shock absorbing material 12 arrange | positioned at the inner surface of the largest surface (23a, 23b). It is configured so that the number of material layers is larger. Furthermore, the packing container 1 is a sheet material in the cushioning material 12 disposed on the inner surface of the minimum surface (24a, 24b) than the number of layers of the sheet material in the cushioning material 12 disposed on the inner surface of the intermediate surface (25a, 25b). The number of layers is configured to be larger.

[Packing electronic components in packing containers]
When the electronic component 100 is packed in the packing container 1 described above, first, the first buffer material 26 is disposed inside the box body 21 of the case 11. At this time, the first buffer material 26 is arranged inside the box body 21 with the third wall portion 26c and the fourth wall portion 26d extending in substantially the same direction. Next, the second cushioning material 27 is disposed further inside the box body 21 in which the first cushioning material 26 is disposed. The second buffer material 27 is disposed between the first wall portion 26 a and the third wall portion 26 c in the first buffer material 26 inside the box body 21.

  In the above state, the bag 13 accommodated in a state where the plurality of electronic components 100 are gathered is disposed inside the second cushioning material 27 inside the box body 21. Next, the first cushioning material 26 is bent between the third wall portion 26c and the fourth wall portion 26d. And the box main body 21 is closed with the cover body 22, and it combines so that the box main body 21 and the cover body 22 may become a rectangular parallelepiped shape. Thereby, packing of the electronic component 100 by the packing container 1 is complete | finished.

[Effect of embodiment of packaging container]
According to the above embodiment, the packaging container 1 is configured to be housed and packaged in the case 11 in a state where a plurality of electronic components 100 having the main body portion 101 and the pin portion 102 are assembled. When an impact load is applied to the case 11 of the packaging container 1 due to the dropping of the packaging container 1 or the like, the cushioning material 12 disposed inside the case 11 is applied to the individual electronic components 100 in the case 11. The shock that has been relaxed is transmitted. At this time, the impact is dispersed according to the area of the cushioning material 12 disposed inside the surface of the case 11 where the impact load is input. In the packing container 1, the number of layers of the sheet material on the inner surface of the intermediate surface (25a, 25b) is set larger than the number of layers of the sheet material on the cushioning material 12 on the inner surface of the maximum surface (23a, 23b). As configured. Further, the packaging container 1 is configured so that the number of layers of the sheet material on the inner surface of the minimum surface (24a, 24b) is larger than the number of layers of the sheet material on the inner surface of the intermediate surface (25a, 25b).

  Therefore, according to the above-described embodiment, when the impact load is input, the number of sheet material layers is the smallest on the maximum surface (23a, 23b) where the area is the largest and the impact per unit area is the smallest. Thus, the packaging container 1 is configured. When the impact load is input, the packaging container 1 is arranged so that the number of layers of the sheet material is the largest on the minimum surface (24a, 24b) where the area is the smallest and the impact per unit area is the largest. Composed. Further, when an impact load is input, the sheet material layer is formed on the intermediate surface (25a, 25b) in which the area of the surface of the case 11 is intermediate and the impact per unit area is intermediate. The packaging container 1 is configured such that the number is greater than the maximum surface (23a, 23b) and less than the minimum surface (24a, 24b). For this reason, on the inner surface of each surface of the case 11, it is possible to arrange the sheet material having an appropriate number of layers according to the impact per unit area. Thereby, in the packaging container 1, while being able to suppress the damage of the pin part 102 efficiently, it avoids the use of the sheet material of an excessive number of layers, and will become the excessive packing specification by excessive use of the shock absorbing material 12. Can be suppressed.

  Therefore, according to the above-described embodiment, breakage of the pin portion 102 can be efficiently suppressed with respect to a packaging container for storing and packing a plurality of electronic components 100 having the main body portion 101 and the pin portion 102 in a collective state. At the same time, it is possible to provide a packaging container 1 for electronic components that can efficiently suppress an excessive packing specification due to excessive use of the buffer material 12.

(Method for determining packaging specifications for electronic components)
Next, an electronic component packaging specification determination method according to an embodiment of the present invention (hereinafter, the electronic component packaging specification determination method is also simply referred to as a packaging specification determination method) will be described. In the description of the packing specification determination method of the present embodiment, elements that are configured in the same manner as the elements described in the above-described embodiment of the packaging container 1 are described by quoting the same reference numerals, and thus redundant description is made. Description to be omitted is omitted.

[Outline of packing specification determination method]
FIG. 4 is a flowchart for explaining the steps of the packing specification determination method of the present embodiment. FIG. 5 is a diagram illustrating an example of an electronic component 110 that is a packaging target for which a packaging specification is determined by the packaging specification determination method of the present embodiment, and FIG. 5A is a side view of the electronic component 110. FIG. 5B is a plan view of the electronic component 110.

  The packing specification determination method of the present embodiment shown in FIG. 4 is for determining a packing specification for storing and packing a plurality of electronic components 110 in a rectangular parallelepiped case 11 in a state where a plurality of electronic components 110 are assembled. It is configured as a packing specification determination method. The electronic component 110 to be packed whose packing specification is determined by the packing specification determination method of the present embodiment is configured as an electrical connector, for example, and has a main body 111 and a pin 112. In this embodiment, according to the packing specification determination method shown in FIG. 4, as a packing specification when storing and packing a plurality of electronic components 110 in a rectangular parallelepiped case 11 in a state where a plurality of electronic components 110 are assembled, An example in which the packaging specification of the packaging container 1 is determined will be described.

  The main body 111 of the electronic component 110 is made of an insulating resin material and has a casing-like basic outer shape. The pin portion 112 is made of a conductive metal material, has a cylindrical or prismatic basic outer shape, is held by the main body portion 111, and is provided so as to protrude from the main body portion 111. In the electronic component 110, a plurality of pin portions 112 are provided, and the plurality of pin portions 112 protrude from the main body portion 111 in parallel with each other. Note that the electronic component 110 shown in FIG. 5 as an example of the electronic component to be packed whose packing specification is determined by the packing specification determination method of this embodiment is an example. The electronic component to be packed whose packing specification is determined by the packing specification determining method of the present embodiment is not limited to the electronic component 110, and may be an electronic component having a main body portion and a pin portion.

  As shown in FIG. 4, the packaging specification determination method of the present embodiment includes a strength characteristic value determination step S101, a buffer characteristic derivation step S102, and a buffer material specification determination step S103. Further, according to the packing specification determination method of the present embodiment, the strength characteristic value determination step S101, the buffer characteristic derivation step S102, and the buffer material specification determination step S103 are executed, so that the packing specification of the packing container 1 is Packing specifications are determined.

[Strength characteristic value determination step]
The strength characteristic value determination step S101 is configured as a step of determining a strength characteristic value that indicates the strength characteristic of the pin portion 112 of the electronic component 110. In the strength characteristic value determination step S101, first, a yield test is performed in which a load is applied to the pin portion 112 so that the tip portion of the pin portion 112 is relatively displaced with respect to the main body portion 111 to yield the pin portion 112. Is done. Next, in the strength characteristic value determination step S101, based on the result of the yield test, a strength characteristic value that indicates the strength characteristic of the pin portion 112 is determined.

  FIG. 6 is a diagram for explaining the yield test performed in the strength characteristic value determination step S101. In the yield test in the strength characteristic value determination step S101, a yield test machine 30 shown in FIG. 6 is used. The yield test machine 30 includes a jig 31 and a load application mechanism 32.

  The jig 31 is provided as a mechanism that holds the main body 111 of the electronic component 110 in a state of being fixed to the jig 31. The jig 31 includes an upper mold 31a and a lower mold 31b, and the main body 111 is fixed by sandwiching the main body 111 of the electronic component 110 between the upper mold 31a and the lower mold 31b. It is configured.

  The load application mechanism 32 presses the pin portion 112 of the electronic component 110 to apply a load to the pin portion 112, the push shaft support portion 32b that supports the push shaft 32a, and the push shaft support portion 32b in a linear direction. A main body housing (not shown) that is supported so as to be relatively displaceable along, a drive unit (not shown) that drives the push shaft support portion 32b to be relatively displaced with respect to the main body housing, and the like. The push shaft 32a is supported by the push shaft support portion 32b. When the push shaft support portion 32b is displaced with respect to the main body housing by the operation of the drive portion, the push shaft 32a approaches the pin portion 112. And is driven to contact. Incidentally, as a mechanism of the drive unit for driving the push shaft support part 32b relative to the main body housing, a rack and pinion mechanism including an electric motor, a ball screw mechanism including an electric motor, a servo hydraulic cylinder mechanism, etc. Various configurations can be exemplified.

  Further, when the push shaft 32 a is driven to come into contact with the pin portion 112, the tip portion of the push shaft 32 a comes into contact with the tip portion of the pin portion 112 of the electronic component 110 fixed to the jig 31. The position of the electronic component 110 in the jig 31 is fixed. In the yield test using the yield test machine 30, the push shaft support portion 32b is displaced together with the push shaft 32a with respect to the main body housing, and the push shaft 32a is a pin portion of the electronic component 110 fixed to the jig 31. By pressing the tip of 112, a load is applied to the pin 112. As a result, a load is applied to the pin portion 112 so as to displace the tip portion of the pin portion 112 relative to the main body portion 111.

  Further, in the yield test using the yield test machine 30, even after the push shaft 32a comes into contact with the pin portion 112 and a load is generated, the push shaft 32a remains at least until the pin portion 112 yields. It is driven so as to be displaced while pressing and a load is applied to the pin portion 112. That is, at least the push shaft 32a is displaced while pressing the pin portion 112 until the pin portion 112 that has been elastically deformed when a load is applied from the push shaft 32a yields and starts plastic deformation. Thus, the drive of the push shaft 32a is continued, and the load is continuously applied to the pin portion 112.

  Further, the yield test machine 30 is provided with a displacement meter (not shown) for measuring the displacement amount of the push shaft 32a and the push shaft support portion 32b with respect to the main body housing. Further, the push shaft support portion 32b is provided with a load meter (not shown) for measuring a load generated between the push shaft 32a and the pin portion 112 when the push shaft 32a presses the pin portion 112. Yes. A yield test using the yield test machine 30 is performed, and while a load is applied from the push shaft 32a to the pin portion 112, the displacement of the push shaft 32a is measured by the displacement meter, and the load The load applied to the pin portion 112 from the push shaft 32a is measured by the meter.

  FIG. 7 is a diagram for explaining the result of the yield test performed using the yield tester 30 in the strength characteristic value determination step S101. The yield testing machine 30 calculates the displacement amount of the push shaft 32a measured by the displacement meter and the load measured by the load meter while applying a load from the push shaft 32a to the pin portion 112. Record as a result of the yield test. In FIG. 7, regarding the relationship between the displacement amount of the push shaft 32a and the load recorded in the yield test machine 30, the horizontal axis represents the displacement amount and the vertical axis represents the load. An example of the result is shown.

  As shown in FIG. 7, when the push shaft 32a abuts on the pin portion 112 to generate a load, the magnitude of the generated load increases in proportion to the increase in the displacement amount of the push shaft 32a. However, when the pin portion 112 yields and plastic deformation of the pin portion 112 starts, the load does not increase in proportion to the displacement amount, and the increase in the load with respect to the displacement amount slows down. When the push shaft 32a is further displaced and the pressing of the pin portion 112 is continued, the change in the load generated in the pin portion 112 is reduced, and the plastic deformation of the pin portion 112 is performed in a state where a substantially constant load is generated. Will continue. In the strength characteristic value determination step S101, the drive of the push shaft 32a is stopped when it is confirmed that the load generated on the pin portion 112 does not increase in proportion even if the displacement amount of the push shaft 32a increases. The yield test is stopped.

In the strength characteristic value determination step S101, when the yield test is completed, the strength characteristic value that indicates the strength characteristic of the pin portion 112 is determined based on the result of the yield test (the strength characteristic of the pin portion 112 is indicated as an index). The intensity characteristic value to be performed is hereinafter referred to as intensity characteristic value Ac). The strength characteristic value Ac is determined as a value obtained by dividing the load applied to the pin portion 112 when the pin portion 112 yields by the mass of the pin portion 112. For this reason, the unit of the intensity characteristic value Ac is m / s ² .

  The load applied to the pin portion 112 when the pin portion 112 yields, that is, the load when the pin portion 112 yields is obtained based on the result of the yield test. Specifically, the load at the time of yielding of the pin portion 112 is, in the yield test, the pin portion 112 yields and plastic deformation of the pin portion 112 starts, and the load increases in proportion to the amount of displacement of the push shaft 32a. It is calculated | required as a load added to the pin part 112 at the time of stopping. If the load at the yield of the pin portion 112 is specified based on the yield test result shown in FIG. 7, the load at the yield of the pin portion 112 is proportional to the amount of displacement of the push shaft 32a. Thus, it is obtained as the load Wy when it does not increase.

  In the strength characteristic value determination step S <b> 101, the mass of the pin portion 112 is also measured. For example, the mass M is measured as the mass of the pin portion 112. When the load Wy at the time of yielding of the pin portion 112 is obtained and the mass M of the pin portion 112 is measured, the strength characteristic value Ac is determined based on these values. The strength characteristic value Ac is determined as a value obtained by dividing the load Wy when the pin portion 112 yields by the mass M of the pin portion 112. That is, the value of the intensity characteristic value Ac is determined as Ac = Wy / M.

[Buffer characteristic derivation step]
The buffer characteristic deriving step S102 is configured as a step of deriving the buffer characteristic of the buffer material 12. In the buffer characteristic deriving step S102, first, an impact test is performed in which a weight is dropped on a sheet material arranged as the buffer material 12 on the inner surface of the case 11 under a plurality of sheet material conditions to add an impact load. Done. Next, in the shock absorbing characteristic deriving step S102, the static stress obtained by dividing the weight of the weight by the area of the sheet material based on the result of the impact test and the weight when the weight is dropped on the sheet material are measured. A relationship with an input impact characteristic value indicating an impact characteristic input to the sheet material is derived as a buffer characteristic of the buffer material 12.

  FIG. 8 is a diagram for explaining the impact test performed in the buffer characteristic deriving step S102. In the shock test in the buffer characteristic derivation step S102, the shock tester 40 shown in FIG. 8 is used. The impact testing machine 40 includes a base 41, a cradle 42, a pair of guide shafts (43a, 43b), a weight 44, an accelerometer 45, and the like.

  In the impact tester 40, a pedestal 42 is installed with respect to the base 41, and a pair of guide shafts (43a, 43b) are supported. The pair of guide shafts (43a, 43B9) are supported with respect to the base 41 in a state extending along the vertical direction, that is, in a state extending along the vertical direction.

  The weight 44 is slidably supported along the axial direction of the pair of guide shafts (43a, 43b) with respect to the pair of guide shafts (43a, 43b). That is, the weight 44 is supported so as to be slidable along the vertical direction with respect to the pair of guide shafts (43a, 43b). The weight 44 is configured to be detachably installed with respect to the pair of guide shafts (43a, 43b). Further, the weight 44 is configured to be able to be changed to various weights. For example, the impact testing machine 40 includes a plurality of weights 44 set to a plurality of levels of weight, and a weight 44 having a desired weight is appropriately selected during the impact test, and the selected weights are selected. 44 is installed with respect to a pair of guide shafts (43a, 43b).

  The impact testing machine 40 is configured such that the weights 44 installed on the pair of guide shafts (43a, 43b) can be fixed at a desired height position with respect to the pair of guide shafts (43a, 43b). Yes. Then, the impact tester 40 releases the fixed state of the weights 44 fixed at a desired height position to the pair of guide shafts (43a, 43b), and the weights 44 of the pair of guide shafts (43a, 43b) are released. Along the axial direction (that is, along the vertical direction), it is configured so that it can be freely dropped from a desired drop position.

  The cradle 42 has a flat surface and is installed on the upper surface of the base 41. The cradle 42 is installed on the upper surface of the base 41 with its flat surface spread in the horizontal direction. Then, on the surface of the cradle 42, a sheet material 46 that is a sheet material that is the same material as the sheet material disposed on the inner surface of the case 11 as the cushioning material 12 and that is a sheet material to be subjected to an impact test is spread. It is arranged in the state. In the impact tester 40, an impact test is performed in which the weight 44 is freely dropped in a state where the sheet material 46 is disposed on the cradle 42.

  The accelerometer 45 is installed as a weight 44 and is configured as an accelerometer that measures and records the acceleration generated in the weight 44. In the accelerometer 45, the acceleration generated in the weight 44 after the weight 44 starts free fall and until the weight 44 b collides with the sheet material 46 arranged on the cradle 42 and the displacement of the weight 44 substantially stops. Is measured and recorded.

  In the impact test using the impact tester 40, first, the sheet material 46 is placed on the cradle 42. The weight 44 is fixed to the pair of guide shafts (43a, 43b) at a predetermined height position corresponding to the target value of the falling distance of the weight 44. The target value of the drop distance of the weight 44 is a height level at which it is desired to suppress damage to the pin portion 112 even when the case 11 containing a plurality of electronic components 110 is dropped. The above predetermined height is set as the target value.

  When the weight 44 is fixed to the pair of guide shafts (43a, 43b) at a predetermined height position corresponding to the target value of the drop distance, the fixed state of the weight 44 is then released. As a result, the weight 44 freely falls along the pair of guide shafts (43a, 43b) and collides with the sheet material 46 disposed on the cradle 42. By causing the weight 44 to freely fall and collide with the sheet material 46, an impact test is performed in which an impact load is applied from the weight 44 to the sheet material 46. In the impact test, the acceleration of the weight 44 is measured by the accelerometer 45 and recorded.

  FIG. 9 is a diagram for explaining the result of the impact test performed in the buffer characteristic deriving step S102. Specifically, FIG. 9 is a diagram showing the result of measuring and recording the acceleration of the weight 44 by the accelerometer 45 during the impact test. In FIG. 9, with respect to the change of the acceleration of the weight 44 recorded in the accelerometer 45 of the impact tester 40 with respect to time, the time is plotted on the horizontal axis and the acceleration is plotted on the vertical axis. An example of the result is shown.

  As shown in FIG. 9, when the weight 44 falls and collides with the sheet material 46, an impact load is applied to the sheet material 46, and the acceleration of the weight 44 rapidly increases. When the acceleration of the weight 44 rapidly increases, the accelerometer 45 measures the maximum acceleration Amax that is the maximum value of the acceleration generated in the weight 44. When the weight 44 collides with the sheet material 46 and the acceleration of the weight 44 reaches the maximum value, the acceleration generated in the weight 44 rapidly decreases until it reaches about zero. Then, the weight 44 is vibrated by the collision with the sheet material 46, and the vibration of the weight 44 is gradually reduced. At this time, the acceleration of the weight 44 is generated so as to vibrate in the vicinity of zero and gradually converges to zero.

In the buffer characteristic deriving step S102, the characteristic of the impact measured when the weight 44 is dropped onto the sheet material 46 and inputted to the sheet material 46 based on the result of the impact test using the impact tester 40. (Hereinafter, the input impact characteristic value that is measured when the weight 44 is dropped and is input to the sheet material 46 is referred to as an input impact characteristic value Ain). . This input impact characteristic value Ain is set as a measured value of the maximum acceleration Amax generated in the weight 44 when the weight 44 falls on the sheet material 46. That is, the value of the input impact characteristic value Ain is determined as Ain = Amax. For this reason, the unit of the input impact characteristic value Ain is m / s ² .

  In the buffer characteristic deriving step S102, an impact test is performed on a plurality of types of sheet materials 46 having different sheet material conditions. That is, an impact test is individually performed on each of a plurality of types of sheet materials 46 having different sheet material conditions. Thereby, in the buffer characteristic deriving step S102, an impact test is performed in which the weight 44 is dropped and an impact load is applied under a plurality of sheet material conditions.

  In the buffer characteristic deriving step S102, a plurality of conditions set by changing the number of layers of the sheet material on which the weight 44 falls are selected as the plurality of sheet material conditions. That is, an impact test is individually performed on each of a plurality of types of sheet materials 46 having different numbers of layers of sheet materials. For example, for each of the sheet material 46 having one sheet material layer, the sheet material 46 having two sheet material layers, and the sheet material 46 having three sheet material layers, individually. An impact test is performed.

  In the buffer characteristic deriving step S102, the impact test is performed a plurality of times by changing the weight of the weight 44 for each sheet material condition. That is, for each sheet material condition, an impact test is performed in which weights 44 having a plurality of levels of weight are dropped. For example, a plurality of impact tests are performed on the sheet material 46 having one layer of the sheet material by changing the weight of the weight 44. The impact test is performed a plurality of times on the sheet material 46 having two layers of the sheet material by changing the weight of the weight 44. Further, a plurality of impact tests are performed on the sheet material 46 having three layers of the sheet material by changing the weight of the weight 44.

In the buffer characteristic deriving step S102, a static stress (hereinafter referred to as a static stress Ss) obtained by dividing the weight 44 by the area of the sheet material 46 is also obtained. That is, the static stress Ss is obtained by dividing the weight of the weight 44 dropped in the impact test by the area of the sheet material 46 to which the impact load is applied in the impact test. For this reason, the unit of the static stress Ss is N / m ² .

  In the buffer characteristic deriving step S102, the static stress Ss and the input impact characteristic are calculated based on the result of an impact test in which the weight 44 is dropped under a plurality of sheet material conditions and an impact load is applied to the sheet material 46. The relationship with the value Ain is derived as the buffer characteristic of the buffer material 12.

  FIG. 10 is a diagram for explaining the buffer characteristic of the buffer material 12 derived in the buffer characteristic deriving step S102. The cushioning characteristics of the cushioning material 12 shown in FIG. 10 are derived based on the result of an impact test under the sheet material conditions in which the number of layers of the sheet material is changed to one layer, two layers, and three layers. 10 is derived based on the result of an impact test performed by changing the weight of the weight 44 to a plurality of levels under each sheet material condition. 10 is based on the result of the impact test described above, the relationship between the static stress Ss and the input impact characteristic value Ain takes the static stress Ss on the horizontal axis and the vertical axis. It is derived by taking the input impact characteristic value Ain.

[Buffer material specification determination step]
In the cushioning material specification determination step S103, the maximum surface (23a, 23b), the minimum surface (24a, 24b), and the intermediate surface (25a, 25b) of the case 11 based on the buffer property derived in the buffer property derivation step S102. It is comprised as a step which determines the specification of the buffer material 12 arrange | positioned on each inner surface. In the cushioning material specification determining step S103, the maximum surface (23a, 23b), the minimum surface (24a, 24b), and the intermediate surface (25a, 25b) of the case 11 are all based on the above-described buffer characteristics. The transmission impact characteristic value indicating the characteristic of the impact transmitted to the pin portion 112 in the target value of the weight of the weight 44 and the target value of the fall distance of the weight 44 is the strength determined in the strength characteristic value determination step S101. The specifications of the cushioning material 12 arranged on the inner surfaces of the maximum surface (23a, 23b), the minimum surface (24a, 24b), and the intermediate surface (25a, 25b) are determined so as to be equal to or less than the characteristic value Ac. .

  In addition, as a target value of the weight of the weight 44, a predetermined weight that is equal to or greater than the weight of the case 11 in a state in which the plurality of electronic components 110 are accommodated is set as the target value. Moreover, as a target value of the falling distance of the weight 44, a height level at which it is desired to suppress damage to the pin portion 112 even when the case 11 in a state where a plurality of electronic components 11 are housed is dropped. The above predetermined height is set as the target value. In the shock test performed when the buffer characteristic is derived in the buffer characteristic deriving step S102, the shock test is performed by dropping the weight 44 from a predetermined height position corresponding to the target value of the drop distance of the weight 44. Has been done. For this reason, the specification of the shock absorbing material 12 is determined based on the shock absorbing property derived in the shock absorbing property deriving step S102, so that the condition of the target value of the falling distance of the weight 44 is reflected. It becomes.

  In addition, a transmission impact characteristic value (hereinafter referred to as a transmission impact characteristic value Aout) indicating the characteristic of the impact transmitted to the pin portion 112 is set by multiplying the input impact characteristic value Ain by a predetermined magnification. . Here, as the predetermined magnification, for example, 2 times can be selected. In addition, when the impact input to the cushioning material 12 is transmitted to the pin portion 112 of the electronic component 110, the pin portion 112 is elastically deformed, so that the impact transmitted to the pin portion 112 is applied to the pin portion 112. Will change during the time that is acting. The impact transmitted to the pin portion 112 is in a state where the impact is zero and a state where the impact is maximum, centering on the impact input to the cushioning material 12 according to the acceleration at the time of elastic deformation occurring in the pin portion 112. Will fluctuate between. Therefore, by multiplying the input impact characteristic value Ain by a factor of 2 to set the transmission impact characteristic value Aout, that is, by setting Aout as Aout = Ain × 2, it is transmitted to the pin portion 112. Can be set to the transmission impact characteristic value Aout reflecting the state in which the impact is maximum.

  Further, in the cushioning material specification determination step S103, the cushioning material 12 disposed on the inner surfaces of the maximum surface (23a, 23b), the minimum surface (24a, 24b), and the intermediate surface (25a, 25b) of the case 11 is provided. As specifications, the number of sheet material layers arranged on the inner surfaces of the maximum surface (23a, 23b), the minimum surface (24a, 24b), and the intermediate surface (25a, 25b) is determined. Specifically, the number of sheet materials disposed on the inner surface of the maximum surface (23a, 23b) of the case 11 is determined as one layer, and is disposed on the inner surface of the minimum surface (24a, 24b) of the case 11. The number of sheet material layers is determined to be three, and the number of sheet material layers arranged on the inner surface of the intermediate surface (25a, 25b) of the case 11 is determined to be two layers.

  Here, the determination of the specifications of the buffer material 12 in the buffer material specification determination step S103 will be described based on a specific example with reference to the buffer characteristics of the buffer material 12 shown in FIG.

  A case where the case 11 in which the plurality of electronic components 110 are stored has a height: width: depth of 1: 2.5: 4 will be described as an example. In this case, the area ratio of the maximum surface (23a, 23b), the intermediate surface (25a, 25b), and the minimum surface (24a, 24b) is as follows: area of maximum surface: area of intermediate surface: area of minimum surface = 2.5 X4: 1x4: 1x2.5 = 10: 4: 2.5. In the following description, the maximum surfaces (23a, 23b) are also simply referred to as maximum surfaces, the intermediate surfaces (25a, 25b) are also simply referred to as intermediate surfaces, and the minimum surfaces (24a, 24b) are also simply referred to as minimum surfaces. When the target value of the weight of the weight 44 is set due to the above area ratio, the target value of the weight of the weight 44 is obtained by dividing by the respective areas of the maximum surface, the intermediate surface, and the minimum surface. The ratio of the magnitudes of the static stress Ss on each surface is the maximum surface static stress Ss: the intermediate surface static stress Ss: the minimum surface static stress Ss = 1: 2.5: 4.

Here, as a specific example when the maximum surface static stress Ss: intermediate surface static stress Ss: minimum surface static stress Ss = 1: 2.5: 4, the maximum surface static stress Ss is 200 N / ^{m 2,} static stress Ss is 500 N / ^{m 2} of the intermediate surface, a minimum surface of the static stress Ss, is described as an example the case of 800 N / ^{m 2.} Further, the case where the intensity characteristic value Ac of the pin portion 112 determined in the intensity characteristic value determination step S101 is 6000 m / s ² will be described as an example.

  In the case of the above example, when determining the specifications of the cushioning material 12 disposed on the inner surfaces of the maximum surface, the intermediate surface, and the minimum surface, the static stresses on the maximum surface, the intermediate surface, and the minimum surface, respectively. The specifications of the cushioning material 12 on each of the maximum surface, the intermediate surface, and the minimum surface are determined so that the transmission impact characteristic value Aout corresponding to Ss is equal to or less than the strength characteristic value Ac of the pin portion 112.

Specifically, when determining the specifications of the buffer material 12 disposed on the inner surface of the maximum surface, first, since the static stress Ss of the maximum surface is 200 N / m ² , the buffer characteristics shown in FIG. Based on this, an input impact characteristic value Ain corresponding to the case where the static stress Ss is 200 N / m ² is obtained. Then, based on the obtained input impact characteristic value Ain, a transmission impact characteristic value Aout is obtained. The input impact characteristic value Ain corresponding to the case where the static stress Ss is 200 N / m ² is 2800 m / s ² when the number of layers of the sheet material is 1, and the number of layers of the sheet material is 2 layers. Is 2000 m / s ² , and 1800 m / s ² when the number of layers of the sheet material is three. The transmission impact characteristic value Aout is set to a value twice the input impact characteristic value Ain. Therefore, the transmission impact characteristic value Aout is 5600 m / s ² when the number of layers of the sheet material is one, and 4000 m / s ² when the number of layers of the sheet material is two. When the number is 3 layers, it is 3600 m / s ² .

When the transmission impact characteristic value Aout corresponding to the maximum surface is obtained as described above, the transmission impact characteristic value Aout is arranged on the inner surface of the maximum surface so as to be equal to or less than the strength characteristic value Ac of the pin portion 112. The specification of the cushioning material 12 is determined. The strength characteristic value Ac is 6000 m / s ² , and the transmission impact characteristic value Aout corresponding to the maximum surface is 6000 m / s ² or less regardless of the number of layers of the sheet material. is there. For this reason, even if the number of layers of the sheet material is one, damage to the pin portion 112 can be suppressed. Therefore, in order to suppress an excessive packing specification due to an excessive specification of the cushioning material, the specification of the cushioning material 12 arranged on the inner surface of the maximum surface is a specification in which the number of layers of the sheet material is one layer. It is determined.

Next, when determining the specifications of the cushioning material 12 disposed on the inner surface of the intermediate surface, first, since the static stress Ss of the intermediate surface is 500 N / m ² , based on the buffer characteristics shown in FIG. The input impact characteristic value Ain corresponding to the case where the static stress Ss is 500 N / m ² is obtained. Then, based on the obtained input impact characteristic value Ain, a transmission impact characteristic value Aout is obtained. The input impact characteristic value Ain corresponding to the case where the static stress Ss is 500 N / m ² is 4300 m / s ² when the number of layers of the sheet material is 1, and the number of layers of the sheet material is 2 layers. Is 2700 m / s ² , and 2100 m / s ² when the number of layers of the sheet material is three. The transmission impact characteristic value Aout is set to a value twice the input impact characteristic value Ain. Therefore, the transmission impact characteristic value Aout is 8600 m / s ² when the number of layers of the sheet material is 1, and 5400 m / s ² when the number of layers of the sheet material is ² , and the layer of the sheet material When the number is 3 layers, it is 4200 m / s ² .

When the transmission impact characteristic value Aout corresponding to the intermediate surface is obtained as described above, the transmission impact characteristic value Aout is arranged on the inner surface of the intermediate surface so as to be equal to or less than the strength characteristic value Ac of the pin portion 112. The specification of the cushioning material 12 is determined. The strength characteristic value Ac is 6000 m / s ² , and the transmission impact characteristic value Aout corresponding to the intermediate surface exceeds 6000 m / s ² when the number of sheet material layers is one, and the number of sheet material layers In the case of 2 layers and 3 layers, it is 6000 m / s ² or less. For this reason, even if the number of layers of the sheet material is two, breakage of the pin portion 112 can be suppressed. Therefore, in order to suppress an excessive packing specification due to an excessive specification of the cushioning material, the specification of the cushioning material 12 arranged on the inner surface of the intermediate surface is a specification in which the number of layers of the sheet material is two layers. It is determined.

Next, when determining the specifications of the buffer material 12 disposed on the inner surface of the minimum surface, first, since the static stress Ss of the minimum surface is 800 N / m ² , based on the buffer characteristics shown in FIG. The input impact characteristic value Ain corresponding to the case where the static stress Ss is 800 N / m ² is obtained. Then, based on the obtained input impact characteristic value Ain, a transmission impact characteristic value Aout is obtained. The input impact characteristic value Ain corresponding to the case where the static stress Ss is 800 N / m ² is 5100 m / s ² when the number of layers of the sheet material is 1, and the number of layers of the sheet material is 2 layers. Is 3100 m / s ² , and is 2300 m / s ² when the number of sheet material layers is three. The transmission impact characteristic value Aout is set to a value twice the input impact characteristic value Ain. Therefore, transfer impact properties value Aout, if the number of layers of sheet material of one layer is 10200m / ^{s 2,} if the number of layers of sheet material has a two-layer was 6200m / ^{s 2,} a layer of sheet material When the number is 3 layers, it is 4600 m / s ² .

When the transmission impact characteristic value Aout corresponding to the minimum surface is obtained as described above, the transmission impact characteristic value Aout is arranged on the inner surface of the minimum surface so as to be equal to or less than the strength characteristic value Ac of the pin portion 112. The specification of the cushioning material 12 is determined. The strength characteristic value Ac is 6000 m / s ² , and the transmission impact characteristic value Aout corresponding to the minimum surface exceeds 6000 m / s ² when the number of layers of the sheet material is one layer and two layers. When the number of layers is three, it is 6000 m / s ² or less. For this reason, the damage of the pin part 112 can be suppressed by setting the number of layers of the sheet material to three. Therefore, in order to suppress the excessive packing specification due to the excessive specification of the cushioning material by setting the number of layers of the sheet material to 4 layers or more, the specification of the cushioning material 12 disposed on the inner surface of the minimum surface is The specification is such that the number of sheet material layers is three.

  As described above, according to the packing specification determination method shown in FIG. 4, as a packing specification when a plurality of electronic components 110 are stored and packed in a rectangular parallelepiped case 11 in a state where a plurality of electronic components 110 are assembled, a packing container is used. 1 packing specification is determined. That is, according to the packing specification determination method shown in FIG. 4, the number of layers of the sheet material disposed on the inner surface of the maximum surface of the case 11 is 1 as the packing specification when the electronic component 110 is stored in the case 11 and packed. A packing specification in which the number of layers of the sheet material disposed on the inner surface of the intermediate surface of the case 11 is two and the number of layers of the sheet material disposed on the inner surface of the minimum surface of the case 11 is three layers. ,It is determined.

[Operation and Effect of Embodiment of Packing Specification Determination Method]
According to the present embodiment, the strength characteristic value Ac of the pin portion 112 of the electronic component 110 to be packaged is determined in the strength characteristic value determination step S101. Further, in this step S101, the strength characteristic value Ac is a yield test in which a load is applied to the pin portion 112 to yield the pin portion 112 so as to displace the portion on the tip side of the pin portion 112 relative to the main body portion 111. Based on the result of The strength characteristic value Ac determined in this way is used in the buffer material specification determining step S103 for determining the specifications of the buffer material 12. Therefore, when determining the packaging specification of the electronic component 110, the specification of the cushioning material 12 is determined based on the strength characteristic value Ac of the pin portion 112 of the electronic component 110 to be packaged so as to suppress damage to the pin portion 112. can do.

  When an impact load is applied to the case 11 due to the fall of the case 11 or the like, the impact relaxed by the cushioning material 12 disposed inside the case 11 is applied to the individual electronic components 110 in the case 11. It is transmitted from the electronic components 110 adjacent to each other. At this time, in the electronic component 110 to which the impact is transmitted, the displacement of the main body 111 is restrained with respect to other adjacent electronic components 110, and further from the other electronic components 110 to the pin portion 112. It is easy to be in a state where the impact of is transmitted. For this reason, when grasping the strength characteristics of the pin portion 112 for evaluating the breakage of the pin portion 112 when an impact is applied to each of the electronic components 110 that are packed in a plurality of groups, the main body portion 111 is used. On the other hand, it is possible to accurately grasp the strength characteristics of the pin portion 112 by performing grasping based on the yield condition of the pin portion 112 when an impact is applied so that the pin portion 112 is relatively displaced. According to the present embodiment, in the strength characteristic value determination step S101, the strength characteristic value Ac of the pin portion 112 is applied to the pin portion 112 so as to displace the portion on the distal end side of the pin portion 112 relative to the main body portion 111. In addition, it is determined based on the result of a yield test that yields the pin portion 112. For this reason, according to the present embodiment, the strength characteristics of the pin portion 112 for evaluating the damage of the pin portion 112 when an impact is applied to each of the electronic components 110 in a state where a plurality of electronic components 110 are packed together are more accurate. Can grasp.

  Further, according to the present embodiment, an impact test is performed in which the weight 44 is dropped on the sheet material 46 serving as the buffer material 12 in the buffer characteristic deriving step S102. In step S102, based on the result of the impact test, the static stress Ss based on the weight of the weight 44 and the sheet material area and the input impact characteristic value Ain on the sheet material 46 when the weight 44 is dropped are calculated. The buffer characteristic of the buffer material 12 as a relation is derived. Therefore, in determining the packaging specification of the electronic component 110, the buffer material 12 can be secured so as to ensure the condition of the buffer material 12 necessary for suppressing the breakage of the pin portion 112 based on the buffer characteristics of the buffer material 12. Specifications can be determined.

  Incidentally, as the impact load applied to the case 11, the impact load generated when the case 11 is dropped is the largest, which is the most problematic. In this case, the impact load applied to the case 11 increases according to the weight of the case 11 in a state where the plurality of electronic components 110 are accommodated. Further, when the case 11 falls, the impact is dispersed according to the area of the cushioning material 12 disposed inside the surface of the case 11 that collides with the floor surface or the like. In addition, depending on the conditions when the case 11 is dropped, the characteristics of the impact input to the cushioning material 12 when the case 11 is dropped also change. Therefore, when grasping the buffer characteristics of the buffer material 12, the relationship between the weight of the case 11 in the state in which the plurality of electronic components 110 are accommodated, the relationship between the area of the buffer material 12, and the buffer material when the case 11 is dropped. By grasping the relationship with the characteristics of the impact input to 12, the cushioning characteristics of the cushioning material 12 can be accurately grasped. According to the present embodiment, in the shock absorbing characteristic deriving step S102, an impact test is performed in which the weight 44 is dropped on the sheet material 46 serving as the shock absorbing material 12. Based on the result of the impact test, the weight of the weight 44 and The buffer characteristic of the buffer material 12 is derived as a relationship between the static stress Ss based on the sheet material area and the input impact characteristic value Ain to the sheet material when the weight 44 is dropped. For this reason, according to the present embodiment, it is possible to accurately grasp the cushioning characteristics of the cushioning material 12 based on the impact test result that more accurately reflects the impact of the impact when the case 11 falls, which is the most problematic.

  Further, according to the present embodiment, the buffer material specification determining step S103 is performed. In the shock absorber specification determination step S103, a transmission impact characteristic value Aout that is set based on the input impact characteristic value Ain and that indicates the characteristic of the impact transmitted to the pin portion 112 is set. And in this step S103, the target value of the weight of the weight 44 on any of the maximum surface (23a, 23b), the minimum surface (24a, 24b) and the intermediate surface (25a, 25b) of the rectangular parallelepiped case 11 In addition, the specifications of the cushioning material 12 arranged on the inner surfaces of the maximum surface, the minimum surface, and the intermediate surface are such that the transmission impact characteristic value Aout is equal to or less than the strength characteristic value Ac at the target value of the fall distance of the weight 44 and the weight 44 It is determined. Therefore, even when an impact load corresponding to the weight 44 and the drop distance condition set as the target value is applied to the case 11, the impact transmitted to the pin portion 112 of the electronic component 110 is The specifications of the cushioning material 12 disposed on the inner surfaces of the maximum surface, the minimum surface, and the intermediate surface are determined so as not to exceed the strength of the pin portion 112. For this reason, even when an impact load according to the weight and fall distance conditions set as the target values is applied to the case 11, the buffering is performed so that damage to the pin portion 112 is suppressed. The specification of the material 12 will be determined. Even if the impact is applied from any of the maximum surface, the minimum surface, and the intermediate surface having different areas, the maximum surface, the minimum surface, and the intermediate surface are suppressed so that the pin portion 112 is prevented from being damaged. The specifications of the cushioning material 12 corresponding to each are determined. For this reason, in any of the maximum surface, the minimum surface, and the intermediate surface, the specification of the excessive cushioning material 12 in which the cushioning material 12 is excessively used is suppressed. Therefore, damage to the pin portion 112 can be efficiently suppressed, and excessive packing specifications due to excessive use of the cushioning material can be efficiently suppressed.

  In addition, when the impact input to the cushioning material 12 is transmitted to the pin portion 112 of the electronic component 110, the pin portion 112 is elastically deformed, so that the impact transmitted to the pin portion 112 is applied to the pin portion 112. Will change during the time that is acting. Then, the impact transmitted to the pin portion 112 varies around the impact input to the cushioning material 12 according to the acceleration at the time of elastic deformation occurring in the pin portion 112. For this reason, in order to evaluate the breakage of the pin portion 112, it is necessary to reflect a state in which the impact transmitted to the pin portion 112 is maximized. According to the present embodiment, the transmission impact characteristic value Aout that is set based on the input impact characteristic value Ain and indicates the characteristic of the impact transmitted to the pin portion 112 is multiplied by the input impact characteristic value Ain by a predetermined magnification. Is set. For this reason, the transmission impact characteristic value Aout can be set reflecting the state where the impact transmitted to the pin portion 112 is maximized.

  Therefore, according to the present embodiment, regarding the packing specification when storing and packing a plurality of electronic components 110 having the main body portion 111 and the pin portion 112 in a collective state, damage to the pin portion 112 can be efficiently suppressed. It is possible to provide an electronic component packaging specification determination method that can determine an appropriate packaging specification that can efficiently suppress an excessive packaging specification due to excessive use of the cushioning material 12.

  Further, according to the present embodiment, the strength characteristic value Ac of the pin portion 112 is determined as a value obtained by dividing the load Wy added to the pin portion 112 when the pin portion 112 yields by the mass M of the pin portion 112. The strength characteristic value Ac of the pin portion 112 based on the yield test result can be easily determined. In addition, if the magnitude | size of the impact transmitted to the pin part 112 of the electronic component 110 exceeds a predetermined magnitude | size, the pin part 112 will yield and will be damaged. When the pin portion 112 yields and breaks due to the impact transmitted to the pin portion 112 of the electronic component 110, an acceleration corresponding to the magnitude of the transmitted impact acts on the pin portion 112. Become. Therefore, by evaluating the acceleration acting on the pin portion 112 when the pin portion 112 yields, the strength characteristic of the pin portion 112 for evaluating the damage of the pin portion 112 can be grasped. According to the present embodiment, the strength characteristic value Ac of the pin portion 112 is determined as a value obtained by dividing the load Wy applied to the pin portion 112 when the pin portion 112 yields by the mass M of the pin portion 112. The acceleration acting on the pin portion 112 when the portion 112 yields can be easily evaluated to easily determine the strength characteristic value Ac of the pin portion 112.

  Further, according to the present embodiment, the input impact characteristic value Ain is set as a measured value of the maximum acceleration Amax generated in the weight 44 when the weight 44 falls on the sheet material 46 (that is, Ain = Amax is set). Therefore, it is possible to easily set the input impact characteristic value Ain when the weight 44 is dropped onto the sheet material 46 based on the result of the impact test. When the weight 44 drops onto the sheet material 46 and an impact is input to the sheet material 46, the sheet material 46 has an impact corresponding to the maximum acceleration Amax when the weight 44 is dropped onto the sheet material 46. Will be entered. Therefore, by measuring the maximum acceleration Amax when the weight 44 is dropped onto the sheet material 46, the input impact characteristic value Ain when the weight 44 is dropped onto the sheet material 46 can be grasped. According to the present embodiment, since the input impact characteristic value Ain is set as a measured value of the maximum acceleration Amax when the weight 44 is dropped onto the sheet material 46, the input impact characteristic when the weight 44 is dropped onto the sheet material 46 is set. The value Ain can be easily determined.

  Moreover, according to this embodiment, it is arrange | positioned on each inner surface of the maximum surface (23a, 23b), minimum surface (24a, 24b), and intermediate | middle surface (25a, 25b) of the case 11 as a specification of the shock absorbing material 12. The number of sheet material layers is determined. Therefore, even if an impact is applied from any of the maximum surface, the minimum surface, and the intermediate surface having different areas, the maximum surface, the minimum surface, and the intermediate surface are suppressed so that the damage of the pin portion 112 is suppressed. The number of sheet materials as the cushioning material 12 corresponding to each is determined. For this reason, it can suppress easily that it becomes the specification of the excessive buffer material 12 in which the buffer material 12 was used excessively in any surface of the maximum surface, the minimum surface, and an intermediate surface. Therefore, it is possible to easily determine an appropriate packing specification that can efficiently suppress the damage of the pin portion 112 and efficiently suppress the excessive packing specification due to excessive use of the cushioning material 12.

[Modification]
Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made as long as they are described in the claims. For example, the following modifications may be made.

(1) In the above-described embodiment of the packaging container, the case where the cushioning material is disposed on all inner surfaces of the maximum surface, the intermediate surface, and the minimum surface of the case has been described as an example, but this need not be the case. The form of the packaging container in which the cushioning material is not disposed on the inner surface of the maximum surface of the case but the cushioning material is disposed on the inner surface of the intermediate surface and the minimum surface of the case may be implemented. In this case, the packaging container has a larger number of layers of the sheet material in the cushioning material disposed on the inner surface of the minimum surface than the number of layers of the sheet material in the cushioning material disposed on the inner surface of the intermediate surface of the case. As long as it is configured. With this configuration, as in the case of the above-described packaging container, the electronic component can efficiently suppress the breakage of the pin portion and can effectively suppress the excessive packing specification due to excessive use of the cushioning material. Can be provided.

(2) In the above-described embodiment of the packaging container, one layer of sheet material is disposed on the inner surface of the maximum surface of the case, two layers of sheet material are disposed on the inner surface of the intermediate surface of the case, and the sheet is disposed on the inner surface of the minimum surface of the case. Although an example in which the material is arranged in three layers has been described, the number of layers of the sheet material may not be as described above. In the packing container, the number of layers of the sheet material in the cushioning material disposed on the inner surface of the intermediate surface of the case is larger than the number of layers of the sheet material in the cushioning material disposed on the inner surface of the maximum surface of the case. It is sufficient that the number of layers of the sheet material in the cushioning material disposed on the inner surface of the minimum surface of the case is larger than the number of layers of the sheet material in the cushioning material disposed on the inner surface of the intermediate surface. .

(3) In the embodiment of the packing specification determination method described above, one layer of sheet material is disposed on the inner surface of the maximum surface of the case, two layers of sheet material are disposed on the inner surface of the intermediate surface of the case, and the inner surface of the minimum surface of the case However, the number of sheet material layers determined as the buffer material specification is not limited to this. Good. Not only the number of layers of the sheet material exemplified in the above embodiment, but also the sheet in the cushioning material disposed on the inner surface of the intermediate surface of the case than the number of layers of the sheet material in the cushioning material disposed on the innermost surface of the case The number of layers of the material is larger, and the number of layers of the sheet material in the cushioning material arranged on the inner surface of the smallest surface of the case than the number of layers of the sheet material in the cushioning material arranged on the inner surface of the intermediate surface of the case It is only necessary to determine the specifications of the cushioning material so as to increase.

(4) In the embodiment of the packing specification determination method described above, each of the maximum surface, the minimum surface, and the intermediate surface is used as the specification of the cushioning material disposed on the inner surfaces of the maximum surface, the minimum surface, and the intermediate surface of the case. Although an example in which the number of sheet material layers arranged on the inner surface of the sheet is determined has been described, this need not be the case. As the specifications of the cushioning material arranged on the inner surfaces of the maximum surface, the minimum surface, and the intermediate surface of the case, the difference or structure of the types of sheet materials disposed on the inner surfaces of the maximum surface, the minimum surface, and the intermediate surface A form in which the difference or the like is determined may be implemented. For example, a form in which sheet materials having different thickness dimensions are arranged on the inner surfaces of the maximum surface, the minimum surface, and the intermediate surface according to the determined specifications of the cushioning material may be implemented. Further, in accordance with the determined specifications of the cushioning material, a mode is implemented in which sheet materials configured as bubble cushioning materials having different bubble dispersion structures are arranged on the inner surfaces of the maximum surface, the minimum surface, and the intermediate surface, respectively. Also good.

  The present invention relates to a method for determining the packing specification of an electronic component for determining the packing specification when the electronic component is stored in a rectangular parallelepiped case and packed, and the packaging of the electronic component for storing and packing the electronic component As a container, it can be widely applied.

11 Case 12 Buffer material 23a, 23b Maximum surface 24a, 24b Minimum surface 25a, 25b Intermediate surface 44 Weight 46 Sheet material 110 Electronic component 111 Main body 112 Pin portion S101 Strength characteristic value determination step S102 Buffer characteristic derivation step S103 Buffer material specification determination Step

Claims (5)

An electronic device for determining a packing specification for storing and packing a plurality of electronic components in a rectangular parallelepiped case in a state where a plurality of electronic components having a main body portion and a pin portion protruding from the main body portion are assembled. A method for determining the packaging specification of a component,
(A) Based on a result of a yield test in which a load is applied to the pin portion so as to displace the tip side portion of the pin portion relative to the main body portion to yield the pin portion. An intensity characteristic value determining step for determining an intensity characteristic value indicating the intensity characteristic;
(B) The weight of the weight based on the result of an impact test in which a weight is dropped under a plurality of sheet material conditions and an impact load is applied to a sheet material arranged as a cushioning material on the inner surface of the case. Between the static stress obtained by dividing the sheet material by the area of the sheet material and the input impact characteristic value indicating the characteristic of the impact measured when the weight falls on the sheet material and input to the sheet material Deriving as a buffering characteristic of the buffer material, a buffering characteristic deriving step;
(C) Based on the buffer characteristics, the largest surface, the smallest surface having the smallest area, and the smallest surface having the smallest area among the three types of surfaces having different areas in the rectangular parallelepiped case, and the smallest surface having the smallest area. The weight is set by multiplying the input impact characteristic value by a predetermined magnification in the target value of the weight of the weight and the target value of the falling distance of the weight in any of the intermediate surfaces having a larger area than the surface. And disposed on the respective inner surfaces of the maximum surface, the minimum surface, and the intermediate surface such that a transmission impact characteristic value indicating an impact characteristic transmitted to the pin portion is equal to or less than the strength characteristic value. A buffer material specification determination step for determining the specifications of the buffer material;
A method for determining the packaging specification of an electronic component, comprising: A packaging specification determination method for an electronic component according to claim 1,
The method for determining a packing specification for an electronic component, wherein the strength characteristic value is determined as a value obtained by dividing a load applied to the pin portion when the pin portion yields by a mass of the pin portion. . A method for determining a packaging specification for an electronic component according to claim 1 or 2,
The method for determining a packing specification for an electronic component, wherein the input impact characteristic value is set as a measured value of a maximum acceleration generated in the weight when the weight falls on the sheet material. The electronic component packaging specification determination method according to any one of claims 1 to 3,
In the buffer characteristic derivation step, a plurality of conditions set by changing the number of layers of the sheet material on which the weight falls are selected as the plurality of sheet material conditions,
In the cushioning material specification determining step, as the specifications of the cushioning material disposed on the inner surfaces of the maximum surface, the minimum surface, and the intermediate surface, the maximum surface, the minimum surface, and the intermediate surface, respectively. A method for determining a packing specification for an electronic component, wherein the number of layers of the sheet material disposed on the inner surface is determined. A packaging container for electronic components for storing and packaging a plurality of electronic components in a state in which a plurality of electronic components having a main body portion and a pin portion protruding from the main body portion are assembled,
A rectangular parallelepiped case,
A cushioning material disposed on the inner surface of the case, including a sheet material,
The case has three types of surfaces with different areas in the rectangular parallelepiped case, the largest surface having the largest area, the smallest surface having the smallest area, and the area smaller than the largest surface and smaller than the smallest surface. Having a large intermediate surface,
The cushioning material is not disposed on the inner surface of the maximum surface, or the cushioning material is disposed on the inner surface of the intermediate surface rather than the number of layers of the sheet material in the cushioning material disposed on the inner surface of the maximum surface. There are more layers of the sheet material in
The number of layers of the sheet material in the cushioning material disposed on the inner surface of the minimum surface is greater than the number of layers of the sheet material in the cushioning material disposed on the inner surface of the intermediate surface, Packaging container for electronic components.

Images