JP2019147231A - Processing device, processing method and processing system - Google Patents

Abstract

To provide a processing device that can detect abnormal behaviour of the processing device, a processing method and a processing system.SOLUTION: The processing device, which performs processing for grinding or polishing a work-piece to be processed, comprises: a first rotating body that holds and rotationally-operates a processor; a second rotating body that holds and rotationally-operates the work-piece; a shaft-directional driving part that makes at least either one of the processor and the work-piece to relatively approach in rotary shaft directions of the first and the second rotating bodies; a first detector that detects a state of the first rotating body; a second detector that detects a state of the second rotating body; and a third detector that detects a state of the shaft-directional driving part.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a processing apparatus, a processing method, and a processing system for grinding or polishing an object.

  For example, in manufacturing a semiconductor device, a workpiece is ground by a grinding device in order to thin a semiconductor substrate (hereinafter also referred to as a workpiece). The grinding device grinds the workpiece according to a procedure called a recipe stored in advance in the grinding device. In the recipe, for example, various items such as a workpiece rotation speed (rpm) and rotation direction, a grinding wheel rotation speed and rotation direction, a target workpiece thickness, and a grinding wheel feed rate are set.

  However, the optimum grinding conditions vary from time to time due to changes over time in the substrate processing apparatus, environment (temperature changes), wear of the grinding wheel, and the like. In a conventional grinding apparatus, when a workpiece after grinding causes an error in the inspection apparatus, it is necessary for an administrator, an operator, or the like to reset the recipe in order to optimize the grinding conditions. In addition, for changing the recipe, it is necessary for an administrator, a worker, or the like to actually process the workpiece with the changed recipe and to check the profile with the inspection device. Then, it may be necessary to repeat the recipe change and inspection a plurality of times until a normal profile within the spec range is obtained, which is a burdensome work. Furthermore, while the recipe is changed and inspected, the processing apparatus becomes downtime and does not contribute to production, so that productivity decreases. For this reason, although it is not a grinding process, a defect inspection of a substrate is performed after a workpiece process (polishing process), and a recipe is changed or a rework is performed based on the result (for example, patent document) 1).

JP2015-185571

  However, in the conventional processing apparatus and method, since defects are inspected after the workpiece is processed, it is difficult to prevent the occurrence of defects. In the case of grinding, the work cannot be regenerated by reworking, but must be discarded.

  The present invention has been made to solve the above-described problems, and an object thereof is to provide a processing device, a processing method, and a processing system that can detect an abnormal behavior of the processing device.

  In order to solve the above problems, a processing apparatus according to the present invention is a processing apparatus for grinding or polishing a workpiece to be processed, and includes a first rotating body that holds and rotates a processing tool, A second rotating body that holds and rotates the workpiece, an axial drive unit that relatively moves at least one of the processing tool and the workpiece in the rotation axis direction of the first and second rotating bodies; and A first detector that detects a state of the first rotating body; a second detector that detects a state of the second rotating body; and a third detector that detects the state of the axial drive unit. Features.

  According to the above configuration, the first detector that detects the state of the first rotating body, the second detector that detects the state of the second rotating body, and the third detector that detects the state of the axial drive unit. The abnormal behavior of the processing apparatus (particularly, the grinding and polishing processing apparatus with rotation) can be effectively detected. For this reason, generation | occurrence | production of the malfunction in a workpiece | work process can be suppressed. Further, damage to the processing apparatus due to abnormal behavior can be suppressed.

  Further, in the processing apparatus according to the present invention, the first detector detects at least one of shaft blurring and vibration of a rotating shaft of the first rotating body, and a load of a motor that rotationally drives the first rotating body. The second detector detects at least one of shaft blurring and vibration of the rotation shaft of the second rotating body, and a load of a motor that rotationally drives the second rotating body, and the third detector It is characterized by detecting at least one of vibrations of the axial drive unit and a load of a motor that rotationally drives the axial drive unit.

  According to the above configuration, the first detector detects at least one of shaft blurring and vibration of the rotating shaft of the first rotating body, and a load of the motor that rotationally drives the first rotating body, and the second detector The third detector detects at least one of shaft shake and vibration of the rotating shaft of the second rotating body and a load of the motor that rotationally drives the second rotating body, and the third detector detects vibration of the axial driving unit and the axial driving unit. Detects rotational drive. For this reason, it is possible to effectively detect an abnormality in a behavior that is easily connected to a defect in work processing. Moreover, damage to the processing apparatus due to abnormal behavior can be effectively suppressed.

  Further, the first detector of the processing apparatus according to the present invention includes an optical displacement sensor that measures displacements on an upper end side and a lower end side of a rotation shaft of the first rotating body, and the second detector An optical displacement sensor that measures the displacement of the upper end side and the lower end side of the rotation shaft of the second rotating body is provided.

  According to the above configuration, since the displacement of the upper end side and the lower end side of the rotating shaft is measured by the optical displacement sensor, even a minute change can be detected, and the accuracy of abnormality detection is improved.

  The processing apparatus according to the present invention includes a first determination unit that determines an abnormality of the first rotating body based on a detection state of the first detector, and a first determination unit that is based on the detection state of the second detector. A second determination unit that determines abnormality of the two-rotor, a third determination unit that determines abnormality of the axial drive unit based on a detection state of the third detector, the first and second rotation members, At least one operation of the first and second rotating bodies and the axial drive unit is changed based on at least one determination result of the control unit that controls the axial drive unit and the first to third determination units. And a changing unit to be provided.

  According to the above configuration, since the operations of the first and second rotating bodies and the axial drive unit are changed based on at least one determination result of the first to third determination units, the workpiece is processed under optimum conditions. can do. Moreover, it is possible to prevent a problem from occurring in the next workpiece by changing the operation content when the behavior changes.

  The processing method according to the present invention includes a first rotating body that holds and rotates a processing tool, a second rotating body that holds and rotates a workpiece to be processed, the processing tool, and the workpiece. A processing method for grinding or polishing a workpiece using a processing apparatus including an axial direction drive unit that relatively closes at least one of the first and second rotating bodies in the rotation axis direction, wherein the first detection A step of detecting a state of the first rotating body, a step of detecting a state of the second rotating body by a second detector, and a step of detecting a state of the axial drive unit by a third detector. It is characterized by having.

  According to the above configuration, the step of detecting the state of the first rotating body by the first detector, the step of detecting the state of the second rotating body by the second detector, and the axial direction of the third detector. And a step of detecting the state of the drive unit, it is possible to effectively detect an abnormal behavior of the processing apparatus (particularly, a processing apparatus for grinding and polishing with rotation). For this reason, generation | occurrence | production of the malfunction in a workpiece | work process can be suppressed. Further, damage to the processing apparatus due to abnormal behavior can be suppressed.

  Further, the processing system according to the present invention is a processing system for grinding or polishing a workpiece to be processed, the first rotating body holding and rotating the processing tool, and rotating and holding the workpiece. Detecting a state of the second rotating body, an axial drive unit that causes at least one of the processing tool and the workpiece to relatively approach each other in the rotating shaft direction of the first and second rotating bodies, and the state of the first rotating body A plurality of processing devices comprising: a first detector that detects a state of the second rotating body; a third detector that detects a state of the axial drive unit; A server comprising: an acquisition unit that acquires detection results detected by the first to third detectors of the processing device; and a storage control unit that stores the detection results acquired by the acquisition unit for each processing device. A processing system comprising: .

  According to the above configuration, the detection results detected by the first to third detectors are acquired from a plurality of processing devices and stored for each processing device. Therefore, the database is constructed by accumulating the detection results of each processing device. be able to. For this reason, the analysis result can be fed back to another processing apparatus by analyzing the behavior of each processing apparatus based on the accumulated database. In addition, by comparing the behavior of each processing device, a processing device that exhibits a behavior different from that of other processing devices can be detected at an early stage, and the occurrence of defects can be prevented in advance.

  As described above, according to the present invention, it is possible to provide a processing device, a processing method, and a processing system that can detect an abnormal behavior of the processing device.

It is a block diagram (side view) of the processing apparatus which concerns on 1st Embodiment. It is a functional lineblock diagram of the control device concerning a 1st embodiment. It is a flowchart which shows the main process of the processing apparatus which concerns on 1st Embodiment. It is a flowchart which shows the grinding process of the processing apparatus which concerns on 1st Embodiment. It is a flowchart which shows the abnormality detection process of the processing apparatus which concerns on 1st Embodiment. It is a flowchart which shows the profile measurement process of the processing apparatus which concerns on 1st Embodiment. It is a figure which shows the example of determination by the determination part which concerns on 1st Embodiment. It is a figure which shows the example of determination by the determination part which concerns on 1st Embodiment. It is a figure which shows the example of determination by the determination part which concerns on 1st Embodiment. It is a block diagram of the processing system which concerns on 2nd Embodiment. It is a block diagram (perspective view) of the processing apparatus which concerns on other embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, a grinding apparatus for grinding a workpiece is mainly described as the processing apparatus, but the present invention can also be applied to a polishing apparatus (lapping apparatus).

(First embodiment)
A processing apparatus and a processing method according to a first embodiment of the present invention will be described with reference to the drawings. The processing apparatus 10 according to the first embodiment is a grinding apparatus that grinds a workpiece W (for example, a substrate mainly composed of silicon (Si), sapphire, silicon carbide (SiC), gallium nitride (GaN), etc.). . The processing device 10 includes a plurality of detection sensors that detect the processing state, constantly collects detection results of these detection sensors, and detects an abnormality of the processing device 10 based on the detection results of these detection sensors. Further, the processing device 10 has a function of dynamically changing a processing step (hereinafter also referred to as a recipe) that defines the processing content for the workpiece W stored in the processing device 10 based on the detection result of the detection sensor.

  FIG. 1 is a side view of a processing apparatus 10 according to the first embodiment. In FIG. 1, only the main part of the processing apparatus 10 is illustrated. As shown in FIG. 1, the processing apparatus 10 includes a base 20 (main frame), a work holding unit 30 located on the lower side of the base 20, and an upper part of the base 20 facing the work holding unit 30. A tool rotation drive unit 40 located on the side, a swing mechanism 50 that swings the tool rotation drive unit 40, various sensors 61a to 61d, 62a to 62d, a control device 70, and a profile measuring instrument 80. ing. Although not shown in FIG. 1, a grinding liquid supply nozzle that supplies a grinding liquid to the workpiece W and the grindstone G during the processing of the processing apparatus 10 is provided.

  The work holding unit 30 includes a holding table 31 attached to the base 20, a motor 32 (preferably a servo motor), and a belt 33 (for example, a toothed belt, a V belt) that transmits the power of the motor 32 to the holding table 31. Etc.). The holding table 31 is attached to the spindle 311 that is rotated by the belt 33, the base 20, the bearing 312 that rotatably holds the spindle 311, and the rotation that is attached to the upper end side of the spindle 311 and rotates together with the spindle 311. A stage 313 (second rotating body).

  The rotary stage 313 includes a porous plate made of a porous material such as ceramic, metal, silicon, organic polymer porous material, and resin, a frame that supports the porous plate, and a base to which the frame is attached. . A suction path communicating with the porous plate is formed in the frame and base of the rotary stage 313. This suction path communicates with a vacuum generation source (not shown) such as a vacuum pump and a vacuum generation ejector, and is configured such that the workpiece W can be vacuum chucked to the rotary stage 313 via a porous plate.

  The tool rotation drive unit 40 includes a gantry 41 (frame), a tool spindle 42 (first rotating body), a spindle cover 43, and an axial drive of the tool spindle 42 (drive in the Z direction indicated by arrow α in the figure). A guide rail (not shown) for guiding the tool spindle, a feed screw 45 for raising and lowering the tool spindle 42, a tool rotation drive motor 46 (servo motor is preferred), and a belt for transmitting the power of the tool rotation drive motor 46 to the tool spindle 42 47 (for example, a toothed belt, a V-belt, etc.) and an axial drive motor 48 (preferably a servo motor). Further, a cylinder 49 for holding the weight of the unit that operates in the Z direction indicated by an arrow α in the figure is provided.

  The tool spindle 42 is rotationally driven by a tool rotation drive motor 46 via a belt 47. A grindstone G, which is a grinding tool, is attached to the lower end of the tool spindle 42 so as to face the holding table 31 of the work holding unit 30. The feed screw 45 is rotationally driven by an axial drive motor 48, and moves the tool spindle 42 up and down in the axial direction (Z direction indicated by arrow α in the figure) via a nut portion 421 with which the feed screw 45 is engaged.

  The tool spindle 42 is suspended from an extendable cylinder 49 attached to the base 20. The cylinder 49 is a counter balance cylinder, cancels the weight of the unit that operates in the Z direction indicated by the arrow α in the figure, such as the tool spindle 42 and the spindle cover 43, the tool rotation drive motor 46, the grindstone G, and the feed screw 45 The nut portion 421 and the axial direction drive motor 48 are less likely to be loaded. Further, as shown in FIG. 1, the feed screw 45 and the cylinder 49 are provided at positions facing each other with the tool spindle 42 interposed therebetween. For this reason, the tool spindle 42 is hardly subjected to an oblique load (relative to the vertical direction (z direction)), and the life of the feed screw 45, the nut portion 421, the guide rail (not shown), and the like is extended.

  In addition, the tool spindle 42 moves up and down along a guide rail (not shown) with almost no inclination with respect to the vertical direction, and the machining load applied to the grindstone G when machining the workpiece W is transmitted straight to the workpiece W. The cylinder 49 only needs to be able to cancel the weight of the unit that operates in the Z direction indicated by the arrow α in the figure, such as the tool spindle 42 and the spindle cover 43, the tool rotation drive motor 46, and the grindstone G. Any of the method and other methods may be used.

  The swing mechanism 50 has a guide rail 51 for swinging the mount 41 and one end connected to the mount 41, and swinging the mount 41 left and right (in the X direction indicated by arrow β in the figure) toward the paper surface. And a retractable cylinder 52 and a motor 53 (preferably a servo motor) that drives the cylinder 52 to expand and contract.

  Further, the processing apparatus 10 includes a plurality of vibration acceleration sensors 61a to 61d and displacement sensors 62a to 62d. The vibration acceleration sensor 61a is provided in the vicinity of the upper plate 41a of the gantry 41 where the axial drive motor 48 is attached, detects vibration, converts the vibration state into an electric signal, and outputs the electric signal. The vibration acceleration sensor 61b is provided in the vicinity of the upper end side of the tool spindle 42, detects vibration, converts the vibration state into an electric signal, and outputs the electric signal. The vibration acceleration sensor 61c is provided in the vicinity of the lower end side of the tool spindle 42, detects vibration, converts the vibration state into an electric signal, and outputs the electric signal. The vibration acceleration sensor 61b and the vibration acceleration sensor 61c are preferably provided at positions facing each other across the tool spindle 42 in a plan view (a surface perpendicular to the Z axis). The vibration acceleration sensor 61d is provided on a bearing 312 that rotatably holds the spindle 311. The vibration acceleration sensor 61d detects vibration, converts the vibration state into an electric signal, and outputs the electric signal.

  The displacement sensors 62a to 62d are optical (transmission type or reflection type) displacement sensors. The displacement sensors 62a to 62d include a light emitting unit and a light receiving unit. In the transmission type, the light emitting unit and the light receiving unit are arranged at positions facing each other with an object whose displacement is to be measured. Then, a laser beam collimated by a special lens is sent out from the light emitting unit and received by a CCD element built in the light receiving unit. When the object blocks parallel light, a shadow proportional to the size of the object is generated. The size and position of the shadow is detected on the CCD element, and converted into dimensions and edge positions to measure the displacement of the object. In the reflection type, a sensor body in which a light emitting unit and a light receiving unit are integrated is set close to a measurement target. Laser light emitted from the light emitting unit is detected by the CCD element of the light receiving unit, and the displacement of the target is measured by calculating the distance from the target based on the difference in the location of the plurality of densely arranged detection elements.

  The displacement sensor 62 a is provided near the upper end side of the tool spindle 42 (more specifically, between the engagement mechanism with the belt 47 provided at the upper end portion of the tool spindle 42 and the spindle cover 43), and the tool spindle 42. Measure the displacement (specifically shaft runout) on the upper end side of the. The displacement sensor 62a converts the measurement result into an electrical signal and outputs it. The displacement sensor 62b is provided in the vicinity of the lower end side of the tool spindle 42 (more specifically, between the spindle cover 43 and the grindstone G mounting mechanism provided at the lower end portion of the tool spindle 42). Measure the side displacement (specifically shaft runout). The displacement sensor 62b converts the measurement result into an electrical signal and outputs it. The displacement sensor 62c is provided in the vicinity of the upper end side of the spindle 311 (more specifically, between the bearing 312 and the rotary stage 313), and measures the displacement (specifically, shaft shake) of the upper end side of the spindle 311. . The displacement sensor 62c converts the measurement result into an electrical signal and outputs it. The displacement sensor 62d is provided near the lower side of the spindle 311 (more specifically, between the bearing 312 and the belt 33), and measures the displacement (specifically, shaft blur) on the lower end side of the spindle 311. The displacement sensor 62d converts the measurement result into an electrical signal and outputs it. As long as the displacement (shaft blur) can be measured, other types of displacement sensors such as a differential transformer type, an eddy current type, an ultrasonic type, a capacitance type, etc. can be used as the displacement sensor 62. Can be used.

  The profile measuring instrument 80 is, for example, a laser measuring instrument, and measures and outputs a distance L between the profile measuring instrument 80 and the workpiece W upper surface. In the first embodiment, the profile measuring instrument 80 is configured to scan the workpiece W held on the rotary stage 313 and measure the distance L from the upper surface of the workpiece W (that is, the profile measuring instrument). If the grinding accuracy can be kept within the apparatus specifications (spec), the rotation stage 313 may be scanned to measure the distance L from the upper surface of the workpiece W (that is, the rotation stage 313 side operates). To do).

  Further, the processing apparatus 10 includes a mechanical (contact type) workpiece thickness measuring mechanism (not shown). The workpiece thickness measuring mechanism measures a first measurement unit that measures the height of the upper surface of the workpiece W and a height of the reference surface (for example, an edge portion of the rotary stage 313 that holds the workpiece W by suction). The thickness of the workpiece | work W is calculated and output from the difference of the height of a 1st measurement part and a 2nd measurement part. The workpiece thickness measuring mechanism can also be used in the profile measuring instrument 80. When the workpiece W is attracted to the rotary stage 313, it is often mounted on a support substrate (solvent welding, adhesion, etc.) in order to prevent deformation and scratches, and the workpiece W is caused by the hysteresis between the support substrate and the workpiece W surface. Can be converted to the thickness of When the support substrate and the workpiece W are the same size, the hysteresis difference between the support substrate and the support substrate is determined based on the defective portion of the workpiece W due to the orientation flat portion (oriental flat). In this case, the profile measuring instrument 80 is moved slightly to the inner peripheral side from the periphery of the diameter of the workpiece W, and the workpiece W is rotated to detect both ends of the concave portion of the orientation flat portion. By calculating the center coordinates of the orientation flat from the rotation coordinates, the exposed portion of the support substrate by the orientation flat part is clarified, and thickness measurement by hysteresis is realized at the same time. As a result, the orientation flat position at the angular coordinates of the rotary stage 313 is recorded, and the thickness is measured by the profile measuring instrument 80 during the subsequent processing (work W in which the coordinates mounted on the rotary stage 313 are fixed). Can be executed continuously.

  The control device 70 controls the processing device 10. The control device 70 is configured by an electronic circuit unit including a CPU, RAM, ROM, interface circuit, and the like. The control device 70 may be composed of a plurality of electronic circuit units that can communicate with each other. FIG. 2 is a functional configuration diagram of the control device 70. The functions shown in FIG. 2 are realized by hardware stored in the control device 70 such as CPU, RAM, and ROM, and a program stored in a memory such as ROM.

  As shown in FIG. 2, the control device 70 includes a communication unit 71, a data acquisition unit 72, a load monitor unit 73, a determination unit 74, a recipe change unit 75, a data storage unit 76, and a storage unit 77. A control unit 78, a profile calculation unit 79, and the like. The communication unit 71 transmits a control signal for controlling the motor included in the processing device 10. The communication unit 71 communicates with a server (not shown) and transmits / receives data, control signals, and the like. The data acquisition unit 72 acquires data (electrical signals) output from the various sensors 61 and 62 via the communication unit 71 and stores the data in the data storage unit 76. When data is stored in the data storage unit 76, the data acquisition unit 72 associates each sensor with the data, in other words, stores the data for each sensor.

  The load monitor unit 73 monitors the current value (load) output from the motors 32, 46, and 48. The load monitor unit 73 stores the monitored loads (current values) of the motors 32, 46, and 48 in the data storage unit 76. When storing the data in the data storage unit 76, the load monitor unit 73 associates each motor with the data, in other words, stores the data for each motor. By monitoring the current values output from the servo motors 32, 46, and 48, the load on the motors 32, 46, and 48 can be monitored. It is possible to determine the danger and the like.

  The determination unit 74 determines abnormality based on detection states of the vibration acceleration sensor 61 and the displacement sensor 62 provided in the processing device 10. Specifically, the determination unit 74 determines abnormality of the feed screw 45 and the axial drive motor 48 based on the detection state of the vibration acceleration sensor 61a. Moreover, the determination part 74 determines the abnormality of the tool spindle 42 based on the detection state of the vibration acceleration sensors 61b and 61c. The determination unit 74 determines an abnormality on the upper end side of the tool spindle 42 based on the detection state of the vibration acceleration sensor 61b, and determines an abnormality on the lower end side of the tool spindle 42 based on the detection state of the vibration acceleration sensor 61c. The determination unit 74 determines whether the spindle 311 is abnormal based on the detection state of the vibration acceleration sensor 61d.

  Further, the determination unit 74 determines an abnormality (axial shake) of the tool spindle 42 based on the detection states of the displacement sensors 62a and 62b. The determination unit 74 determines an abnormality on the upper end side of the tool spindle 42 based on the detection state of the displacement sensor 62a, and determines an abnormality on the lower end side of the tool spindle 42 based on the detection state of the displacement sensor 62b. The determination unit 74 determines an abnormality (shaft blur) of the spindle 311 based on the detection state of the displacement sensors 62c and 62d. The determination unit 74 determines an abnormality on the upper end side of the spindle 311 based on the detection state of the displacement sensor 62c, and determines an abnormality on the lower end side of the spindle 311 based on the detection state of the displacement sensor 62d. Further, the determination unit 74 determines the abnormality of the motors 32, 46, and 48 from the monitoring result obtained by the load monitor unit 73.

  The determination unit 74 uses a first range (first reference value) in which values output from the vibration acceleration sensors 61a to 61d and the displacement sensors 62a to 62d are preset for each of the vibration acceleration sensors 61a to 61d and the displacement sensors 62a to 62d. If it is out of range, it is determined as a caution (abnormality of a level that can be repaired by resetting (changing) the recipe), and the second range (second reference) that is wider than the first range (first reference value range) When the value is out of the range, it is determined to be abnormal (abnormality that cannot be repaired even when the recipe is reset (changed)). The first range and the second range are set for each of the vibration acceleration sensors 61a to 61d and the displacement sensors 62a to 62d, and further set for each recipe that defines the procedure of the grinding process.

  Further, the determination unit 74 is careful when the value (current value) of the monitoring result in the load monitoring unit 73 deviates from the preset first range (first reference value range) (resetting (changing) the recipe). It is determined that the abnormality is at a level that can be repaired by an error, and if the second range (the second reference value range) that is wider than the first range (the first reference value range) is exceeded, an abnormality (recipe resetting (change) ), But it is configured to determine that the level of abnormality cannot be repaired. The first range and the second range are set for each of the motors 32, 46, and 48, and further set for each recipe that defines the procedure of the grinding process.

  The determination unit 74 calculates an average deviation or a moving average of values output from the vibration acceleration sensors 61a to 61d and the displacement sensors 62a to 62d within a predetermined time (for example, the latest 2 seconds), and calculates the average deviation or movement. It may be determined whether the average is out of the first range and / or the second range. Further, the determination unit 74 calculates an average deviation or moving average within a predetermined time (for example, the latest 2 seconds) of the load (current value) of the motors 32, 46, and 48, and the average deviation or moving average is within the first range. It may also be determined whether or not the second range is exceeded. In addition, the determination method of the displacement sensors 62a to 62d in the determination unit 74 may not only increase the displacement amount but also the length of the displacement cycle. The increase in the amount of displacement is the size of the shaft shake, which corresponds to the amplitude when the change transition of the electric signal of the displacement sensor is replaced with a waveform, and detects an increase in the absolute value of the amount of displacement. The length of the displacement cycle is the number of shaft shakes per unit time (for example, within one rotation of the shaft), which corresponds to the waveform or frequency when the change of the electrical signal from the displacement sensor is replaced with a waveform. Detects an increase in the number of times the amount exceeds the threshold.

  The recipe change unit 75 changes the recipe based on the determination result in the determination unit 74. A specific recipe changing method by the recipe changing unit 75 will be described later.

  The data storage unit 76 includes data (electrical signals) output from the various sensors 61 and 62 acquired by the data acquisition unit 72 and loads (current values) of the motors 32, 46 and 48 monitored by the load monitor unit 73. Are accumulated in time series.

  The storage unit 77 stores various recipes that are procedures for grinding the workpiece W. In the recipe, for example, the rotation speed (rpm) and rotation direction of the workpiece W, the rotation speed and rotation direction of the grindstone, the grinding amount (thickness of the target workpiece W), the feeding speed of the grindstone, and the oscillation (reciprocating motion during grinding) ) And the discharge amount of the grinding fluid are set. In addition, in the storage unit 77, the first and second ranges of the vibration acceleration sensors 61a to 61d, the displacement sensors 62a to 62d, and the motors 32, 46, and 48 are set for each recipe. The first range and the second range of the vibration acceleration sensors 61a to 61d, the displacement sensors 62a to 62d, and the motors 32, 46, and 48 may be set for each step of each recipe.

  Further, the storage unit 77 refers to data used by a profile calculation unit 79 described later, for example, position data (for example, position data for measuring a distance L from the upper surface of the workpiece W measured by controlling the profile measuring instrument 80) , A plurality of peripheral edge portions of the workpiece W, a plurality of internal portions and a central portion, etc.), a distance L2 from the profile measuring instrument 80 to a reference plane (for example, an edge portion of the rotary stage 313 that holds the workpiece W by suction), Correction data for correcting the thickness profile of the workpiece W is stored.

  Here, the correction data is acquired as follows. After attracting and holding a reference workpiece whose thickness is known in advance on the rotary stage 313, the distance L1 from the upper surface of the reference workpiece is measured at the same position as the measurement point on the workpiece W. Next, the distance L1 from the distance L2 to the pre-measured reference surface (for example, the edge of the rotary stage 313 that sucks and holds the workpiece W) stored in the storage unit 77 to the upper surface of the workpiece W actually measured. Is subtracted to calculate the thickness of the workpiece W for each of a plurality of measured points, thereby calculating the thickness profile of the reference workpiece. Next, correction data is created by subtracting the actual thickness from the calculated thickness profile of the reference workpiece. This correction data is data for correcting an error in the distance L1 due to a deviation or inclination from the rotary stage 313 when the profile measuring instrument 80 is scanned on the workpiece W.

  The control unit 78 controls the processing apparatus 10 based on a procedure (recipe) stored in the storage unit 77.

The profile calculation unit 79 calculates the thickness distribution (thickness profile) of the workpiece W.
The operation of the profile calculation unit 79 (calculation of the thickness profile of the workpiece W by the profile calculation unit 79) will be described in detail with reference to FIG.

(Main process)
FIG. 3 is a flowchart showing main processing of the processing apparatus 10 according to the first embodiment.
First, the user places the workpiece W on the rotary stage 313 of the holding table 31 and then holds the workpiece W on the rotary stage 313 by a vacuum chuck. Further, the user attaches the grindstone G to the lower end of the tool spindle 42 as necessary. Next, the user selects a recipe from an operation panel (not shown), inputs the grinding amount or the thickness of the target workpiece W, and executes (RUN) to start grinding the workpiece W by the processing apparatus 10. .

  In step S <b> 101, the control unit 78 refers to the selected recipe stored in the storage unit 77 and starts the grinding process. Specifically, the control unit 78 starts the grinding process by controlling the motors 32, 46, 48, 53 and the like according to the procedure defined by the recipe. The grinding process in step S101 will be described in detail with reference to FIG.

  In step S102, the load monitor unit 73 starts monitoring the loads (current values) of the motors 32, 46, and 48. In step S102, the determination unit 74 determines whether there is an abnormality in the values output from the vibration acceleration sensors 61a to 61d and the displacement sensors 62a to 62d. The abnormality detection process in step S102 will be described in detail with reference to FIG.

  In step S103, data of the vibration acceleration sensors 61a to 61d and the displacement sensors 62a to 62d acquired by the data acquisition unit 72 are stored in the data storage unit 76 in time series. In step S103, load (current value) data of the motors 32, 46, and 48 monitored by the load monitoring unit 73 is accumulated in the data accumulation unit 76 in time series.

  In step S <b> 104, the control unit 78 controls the profile measuring device 80 to measure the distribution (profile) of the distance L to the workpiece W. The profile calculation unit 79 distributes the thickness of the workpiece W based on the distribution (profile) of the distance L to the workpiece W measured by the profile measuring instrument 80 and the correction data stored in the storage unit 77 in advance. (Thickness profile) is calculated. Note that the profile confirmation processing in step S104 will be described in detail with reference to FIG.

(Grinding process)
FIG. 4 is a flowchart showing the grinding process of the processing apparatus 10 according to the first embodiment.
In step S <b> 201, the control unit 78 refers to the selected recipe stored in the storage unit 77. In step S202, the control unit 78 starts the grinding process by controlling the motors 32, 46, 48, 53, etc. according to the procedure defined by the recipe.

  In step S203, the control unit 78 starts measuring the workpiece thickness. Specifically, a mechanical (contact type) workpiece thickness measurement mechanism (not shown) is controlled to obtain the thickness of the workpiece W output from the workpiece thickness measurement mechanism.

  In step S204, the control unit 78 determines whether or not the thickness of the workpiece W output from the workpiece thickness measuring mechanism is the workpiece thickness (predetermined thickness) specified in the selected recipe. More specifically, the control unit 78 compares the thickness of the workpiece W output from the workpiece thickness measuring mechanism with the workpiece thickness (predetermined thickness) specified by the selected recipe, and the workpiece thickness measuring mechanism It is determined whether or not the thickness of the workpiece W to be output is within a predetermined range (for example, within a range of 1% from the workpiece thickness (predetermined thickness) defined by the selected recipe).

  If the thickness of the workpiece W output from the workpiece thickness measurement mechanism is the workpiece thickness (predetermined thickness) specified in the selected recipe in step 204 (YES), in step 205, the controller 78 In accordance with the procedure defined by the recipe, the motors 32, 46, 48, 53, etc. are controlled to finish the grinding operation, and then the grindstone G is retracted to finish the grinding process. When the thickness of the workpiece W output from the workpiece thickness measuring mechanism is not the workpiece thickness (predetermined thickness) specified in the selected recipe (NO) in step 204, the control unit 78 The grinding process is continued until the thickness of the workpiece W output from the workpiece thickness measuring mechanism reaches the workpiece thickness (predetermined thickness) defined by the selected recipe.

(Abnormality detection processing)
FIG. 5 is a flowchart showing an abnormality detection process of the processing apparatus according to the first embodiment.
In step S301, monitoring of the processing apparatus 10 is started. Specifically, the load monitor unit 73 starts monitoring the loads (current values) of the motors 32, 46, and 48. Further, the determination unit 74 starts monitoring values output from the vibration acceleration sensors 61a to 61d and the displacement sensors 62a to 62d.

  In step S <b> 302, the determination unit 74 determines whether or not the values of the monitoring results obtained by the various sensors 61 and 62 and the load monitor unit 73 are out of the first range (first reference value range) set in advance. . Specifically, the determination unit 74 determines whether or not the values output from the vibration acceleration sensors 61a to 61d and the displacement sensors 62a to 62d are out of a preset first range (first reference value range). judge. Further, the determination unit 74 determines whether or not the value (current value) of the monitoring result in the load monitoring unit 73 is out of a first range (first reference value range) set in advance.

  When it is outside the first range (the range of the first reference value) in step S302 (YES), the determination unit 74 determines that it is attention. In step S303, the control part 78 alert | reports an alert, if the determination part 74 determines with attention. The alert notification may be displayed on the monitor of the processing apparatus 10 and may be output as a buzzer sound from a speaker provided in the processing apparatus.

  In step S304, the recipe change unit 75 changes the selected recipe. Note that when the recipe selected by the recipe changing unit 75 is changed, the control unit 78 performs a grinding process using the changed recipe. The pattern for changing the recipe will be described in detail with reference to FIGS.

  If the first range (first reference value range) is not deviated in step S302 (NO), in step S305, the determination unit 74 determines that the values of the monitoring results from the various sensors 61 and 62 and the load monitor unit 73 are in advance. It is determined whether or not the second range (second reference value range) is set. Specifically, the determination unit 74 determines whether or not the values output from the vibration acceleration sensors 61a to 61d and the displacement sensors 62a to 62d are out of a preset second range (second reference value range). judge. Further, the determination unit 74 determines whether or not the value (current value) of the monitoring result in the load monitor unit 73 is out of a preset second range (second reference value range).

  When it is outside the second range (the range of the second reference value) in step S305 (YES), the determination unit 74 determines that there is an abnormality. In step S306, the control part 78 alert | reports an error, if the determination part 74 determines with abnormality. This error notification is displayed on the monitor of the processing apparatus 10 and is also output as a buzzer sound from a speaker provided in the processing apparatus 10. In step S307, the control unit 78 stops the processing of the processing device 10 because an unrecoverable error has occurred.

  When the second range (second reference value range) is not deviated in step S305 (NO), in step S308, the control unit 78 determines whether or not the grinding process is completed. When the grinding process is not completed in step S308 (NO), the control unit 78 returns to the operation in step S302. Further, when the grinding process is completed in step S307 (YES), the control unit 78 ends the grinding process.

(Profile measurement process)
FIG. 6 is a flowchart showing a profile measurement process of the processing apparatus according to the first embodiment. This profile measurement process is performed during the grinding process described with reference to FIG. For example, it is preferably executed when 50% to 80% of the set grinding amount is completed. If the grinding amount is less than 50% of the set grinding amount, the grinding amount is small for deriving the relationship between the grinding wheel G feed amount and the actual grinding amount of the workpiece W. If the grinding amount exceeds 80%, the grinding stone G feed amount is reduced. This is because even if correction is performed based on the actual grinding amount of the workpiece W, the grinding has progressed too much and the grinding processing of the workpiece W may not be recovered.

  In step S401, the profile measuring device 80 measures the profile of the workpiece W. Specifically, the control unit 78 controls the profile measuring instrument 80 to set a plurality of points of the workpiece W that are set in advance (for example, a plurality of locations at the peripheral edge of the workpiece W, a plurality of locations inside, a center portion, etc. ) To measure the distance L1 from the upper surface of the workpiece W.

  In step S402, the profile calculation unit 79 measures in step S401 from a distance L2 to a previously measured reference surface (for example, the edge of the rotary stage 313 that holds the workpiece W by suction) stored in the storage unit 77. The thickness L of the work W is calculated for each of a plurality of measured points by subtracting the distance L1 and the thickness profile of the work W is calculated.

  In step S403, the profile calculation unit 79 uses the correction data measured by sucking and holding the reference workpiece on the rotary stage 313 in advance stored in the storage unit 77, and the thickness of the workpiece W calculated in step S402. Correct the profile.

  In step S404, the profile calculation unit 79 calculates the difference between the feed amount of the grindstone G by the feed screw 45 and the actual grinding amount of the workpiece W based on the profile of the thickness of the workpiece W corrected in step S403. The recipe changing unit 75 corrects the feed amount of the grindstone G based on the difference calculated by the profile calculating unit 79. The controller 78 performs a grinding process based on the corrected feed amount.

  7-9 is a figure which shows the example of determination by the determination part 74 which concerns on 1st Embodiment. Hereinafter, a determination example by the determination unit 74 according to the first embodiment will be described with reference to FIGS. 7 to 9. In addition, the same code | symbol is attached | subjected to the structure same as the structure demonstrated in FIGS. 1-3, and the overlapping description is abbreviate | omitted.

  The example shown in FIG. 7 will be described. Normally, when grinding a workpiece W made of a uniform material at a constant feed rate, the load (current value) of the tool rotation drive motor 46 at the time of grinding is substantially constant and does not fluctuate so much. However, if there is some problem, for example, if there is a problem with the bearing of the tool spindle 42, the tool spindle 42 does not rotate smoothly as shown in FIG. Load (current value) increases (the torque required for the rotation of the tool spindle 42 increases).

  For this reason, the load (current value) of the tool rotation drive motor 46 at the time of grinding is monitored, and as shown in FIG. It can be determined that the error has occurred, and an error can be notified. Further, the load (current value) of the tool rotation drive motor 46 at the time of grinding is monitored. When the load is increased by, for example, 10% from the normal value, it is determined that the determination unit 74 is careful and an alert is notified. Further, when the value is increased by 20%, for example, from the normal value, the determination unit 74 may determine that there is an abnormality and notify the error.

  Not only the tool rotation drive motor 46 but also the other motors 32, 48, and 53 monitor the motor load (current value) during grinding in the same manner as the tool rotation drive motor 46, and the values are less than normal values. For example, when the value rises by 20%, the decision unit 74 decides that it is a caution (recoverable), notifies an alert, and when the value rises by, for example, 30% from the normal value, an abnormality (recovery) occurs. It may be determined that the error is not possible and an error is notified.

  Next, the example shown in FIG. 8 will be described. Normally, when grinding a workpiece W made of a uniform material at a constant feed rate, the flatness and surface roughness of the ground surface (machined surface) may be adversely affected by the vibration state of the tool spindle 42 during grinding. When the vibration state of the tool spindle 42 is not detected as shown in FIG. 8A, the torque of the axial drive motor 48 that feeds the grindstone G despite the fact that the vibration state of the tool spindle 42 has greatly changed during grinding. If the (current value) is kept constant without changing, the applied pressure (working pressure) of the grindstone G during grinding remains constant and vibration is not suppressed, so the flatness of the grinding surface (working surface) And surface roughness deteriorates.

  On the other hand, in the processing apparatus 10 according to the first embodiment, as shown in FIG. 8B, when the vibration state of the tool spindle 42 during grinding exceeds a predetermined value or changes rapidly, the recipe changing unit 75 The torque (current value) of the axial drive motor 48 that feeds the grindstone G is lowered. For this reason, since the applied pressure (cutting pressure) of the grindstone G during grinding is reduced and vibration is suppressed, it is possible to suppress the deterioration of the flatness and surface roughness of the ground surface (processed surface).

  Next, the example shown in FIG. 9 will be described. The example shown in FIG. 9 shows an example in which a recipe having at least three steps is executed. In FIG. 9, as the process proceeds from step 1 to step 3, the torque (current value) of the axial drive motor 48 that sends the grindstone G increases stepwise. That is, as the process proceeds from step 1 to step 3, the applied pressure (cutting pressure) of the grindstone G increases stepwise. In such a case, for example, when the vibration state of the tool spindle 42 exceeds a predetermined value in Step 3 or rapidly changes and falls outside the second range, the determination unit 74 determines that there is an abnormality, and the control unit 78 determines The grinding process is stopped.

  In the conventional processing apparatus, as shown in FIG. 9A, since the data storage unit 76 is not provided, it is difficult to investigate the cause when the operation is stopped due to an abnormality (analysis of the cause of the abnormality). On the other hand, in the processing apparatus 10 according to the first embodiment, as shown in FIG. 9B, the output data of the vibration acceleration sensors 61a to 61d and the displacement sensors 62a to 62d and the motor 32 are always during the grinding process by the recipe. Since the loads (current values) of 46 and 48 are accumulated, the cause investigation (analysis of the cause of the abnormality) when the operation stops due to the abnormality is facilitated.

  As described above, the processing apparatus 10 according to the first embodiment is a processing apparatus that performs grinding processing or polishing processing on the workpiece W. The processing spindle 10 holds the grindstone G and rotates it, and the workpiece to be processed. A spindle 311 that rotates while holding W, a vibration acceleration sensor 61 that detects the state of the axial drive motor 48 that drives the feed screw 45, a displacement sensor 62, and the like are provided. For this reason, it is possible to effectively detect an abnormal behavior of the processing apparatus 10 (particularly, a processing apparatus for grinding and polishing with rotation). For this reason, generation | occurrence | production of the malfunction in the process of the workpiece | work W can be suppressed. Moreover, damage to the processing apparatus 10 due to abnormal behavior can be suppressed.

  In addition, the processing apparatus 10 according to the first embodiment includes a vibration acceleration sensor 61, a displacement sensor 62, and a load monitor unit 73. The tool spindle 42 and the spindle 311 rotate and drive and rotate the tool spindle 42. At least one of the load current values of the tool rotation drive motor 46 to be detected is detected. The vibration acceleration sensor 61 detects vibration and load current of the feed screw 45 and the axial direction drive motor 48 that drives the feed screw 45. For this reason, it is possible to effectively detect an abnormality in a behavior that is easily connected to a defect in work processing. Moreover, damage to the processing apparatus 10 due to abnormal behavior can be effectively suppressed.

  Further, the displacement sensor 62 of the processing apparatus 10 according to the first embodiment includes an optical displacement sensor that measures the displacement of the upper end side and the lower end side of the rotation axis of the tool spindle 42, and the upper end side and the lower end of the rotation axis of the spindle 311. And an optical displacement sensor for measuring the displacement on the side. For this reason, since the displacement of the upper end side and the lower end side of the rotating shaft is measured by the optical displacement sensor, even a minute change can be detected, and the accuracy of abnormality detection is improved.

  Further, the processing apparatus according to the present invention includes a recipe change unit 75 that determines an abnormality based on the outputs of the vibration acceleration sensor 61, the displacement sensor 62, and the load monitor unit 73 and changes the recipe. For this reason, the workpiece W can be processed under optimum conditions. Moreover, it is possible to prevent a defect from occurring in the next workpiece W by changing the recipe when the behavior changes.

  In addition, you may make it change (correct | amend) at least 1 operation | movement of the motors 32, 46, 48, and 53 based on the determination result of only the workpiece | work W in process, without changing a recipe based on the determination result of the determination part 74. . If the abnormality is caused by the workpiece W, it is possible to prevent the processing of the subsequent workpiece W from being abnormal because the recipe has been changed.

  The processing method according to the first embodiment includes a tool spindle 42 that holds and rotates the grindstone G, a spindle 311 that holds and rotates the workpiece W to be processed, and at least the grindstone G and the workpiece W. This is a processing method for grinding or polishing the workpiece W by using the processing apparatus 10 including one of the tool spindle 42 and the feed screw 45 that relatively approaches the rotation axis direction of the spindle 311. The vibration acceleration sensor 61, the displacement sensor 62, and the load monitor unit 73 detect the state of the tool spindle 42, and the vibration acceleration sensor 61, the displacement sensor 62, and the load monitor unit 73 detect the state of the spindle 311. The vibration acceleration sensor 61 and the displacement sensor 62 detect the state of the feed screw 45. For this reason, it is possible to effectively detect an abnormal behavior of the processing apparatus 10 (particularly, a processing apparatus for grinding and polishing with rotation). For this reason, generation | occurrence | production of the malfunction in a workpiece | work process can be suppressed. Moreover, damage to the processing apparatus 10 due to abnormal behavior can be suppressed.

(Second Embodiment)
In the first embodiment and the first embodiment, data is accumulated for each processing device 10. However, as shown in FIG. 10, a plurality of processing devices 10 are connected by a network 100 and data from the processing devices 10 is stored. May be collected via the network 100 and stored in the server 90. Further, the server 90 may be provided with the functions of the load monitor unit 73, the determination unit 74, the recipe change unit 75, and the data storage unit 76 described in FIG.

  When data is stored in the server 90, an identifier is assigned to the processing apparatus 10, and data is stored in association with each identifier. Further, when determining an abnormality, the abnormality is not determined for each processing apparatus 10, but processing is performed from a statistical value (for example, an average value) of data collected from the processing apparatuses 10 connected to the network 100. You may make it determine with it being abnormal if it remove | deviates from the range.

  The processing system according to the second embodiment is a processing system for grinding or polishing a workpiece W, and holds and rotates a tool spindle 42 that holds and rotates a grindstone G and a workpiece W that is a processing target. A feed screw 45 that relatively brings at least one of the spindle 311, the grindstone G, and the workpiece W, various sensors 61 and 62 that detect the state of the tool spindle 42 and the spindle 311, a load monitor unit 73, and the feed screw 45. Detection results detected by the plurality of processing devices 10 including the vibration acceleration sensor 61 that detects the state of the axial drive motor 48 that drives the motor, and the various sensors 61 and 62 of the plurality of processing devices 10 and the load monitoring unit 73. And a storage control unit (database) that stores the detection result acquired by the acquisition unit for each processing device 10 It comprises a server 90 with and. For this reason, the analysis result can be fed back to another processing apparatus by analyzing the behavior of each processing apparatus 10 based on the accumulated database. In addition, by comparing the behaviors of the processing devices 10, it is possible to detect a processing device 10 that exhibits a behavior different from that of the other processing devices 10 at an early stage, and to prevent occurrence of problems.

  As described above, according to the present invention, it is possible to provide a processing device and a processing method capable of detecting an abnormal behavior of the processing device. In addition, the contents of the present invention are preferably applied mainly to semiconductor materials such as wafers and ceramics, and super-hard materials, but the same high-precision processing technology is also applicable to conventional structural materials such as steel. It is equally applicable. Further, since the shape of the workpiece W can be recognized by the profile measuring device 80, it is possible to target a shape other than a circle. Therefore, the subject of the present invention is not limited to the superhard material or the like that has been explained.

(Other embodiments)
In each of the above embodiments, the description has been made on the vertical type device in which the rotation axes of the tool spindle and the work spindle are oriented in the substantially vertical direction, but the present invention is not limited to this type, and these rotation axes are The present invention can be similarly applied to a horizontal type device oriented in a substantially horizontal direction. In the form shown, the work spindle located below forms the fixed spindle described in the prior art, and the tool spindle located above forms the same axial drive spindle. However, the vertical relationship between the fixed side and the drive side may be reversed. In the above embodiment, the tool spindle 42 side (the grindstone G side) is swung, but the spindle 311 side (work W side) may be swung. Furthermore, it is good also as a structure which rocks | fluctuates both the tool spindle 42 side (grinding stone G side) and the spindle 311 side (work W side).

  Further, as described above, the present invention can also be applied to a polishing apparatus (lapping apparatus). FIG. 11 is an enlarged view showing only a contact portion between a polishing tool and a workpiece to which the present invention is applied, and illustration of other configurations is omitted. In FIG. 11, a tool spindle 135 extends from below, and the tool spindle 135 rotates a lapping platen 136 in the direction of arrow γ by driving a motor (not shown). A polishing liquid (slurry) is applied to the lapping platen 136 so that the workpiece can be polished. In this specification, for convenience, the lapping platen 136 is included in the tool, and the spindle that drives the lapping platen 136 is referred to as a tool spindle 135.

  A work spindle 138 extends from above facing the lap surface plate 136, and a work W is fixed to a work holder 139 at the tip thereof. In the present embodiment, the work holder 139 is constituted by a vacuum chuck, that is, the work W is fixedly held using a vacuum. Since the work holder 139 and the lap surface plate 136 are formed to be adjustable so as to be parallel to each other, the work W fixed to the work holder 139 can always be kept parallel to the lap surface plate 136. The adjustment in the parallel direction can be performed, for example, by arranging adjustable lock bolts at four positions in the radial direction of the work holder 139.

  In the polishing apparatus shown in FIG. 11, various sensors (vibration acceleration sensor and displacement sensor) are provided to detect the behavior of the work spindle 138 and the tool spindle 135, whereby the processing apparatus 10 according to the first embodiment described above. The same effect can be obtained. Further, similarly to the processing apparatus 10 according to the first embodiment, a load of a motor that rotationally drives the work spindle 138 and the tool spindle 135 may be detected.

  Further, in the grinding apparatus of FIG. 1, the workpiece W and the grindstone G are shown as 1: 1 in the drawing, and in the polishing apparatus of FIG. 11, the workpiece holder 139 and the lapping surface plate 136 are shown as 1: 1. There are no restrictions on the combination such as one-to-many or many-to-many.

INDUSTRIAL APPLICABILITY The present invention can be used in the industrial fields of grinding and polishing that perform surface finishing of various materials. In particular, the present invention can be applied particularly effectively when grinding and polishing ultra-hard materials such as ceramics and semiconductor wafers efficiently and with high surface accuracy.

10 Processing Device 20 Base (Mainframe)
30 Workpiece Holding Unit 31 Holding Table 311 Spindle 312 Bearing 313 Rotating Stage (Second Rotating Body)
32 Motor (Power source)
33 belt (power transmission means)
40 Tool Rotation Drive Unit 41 Frame
42 Tool spindle (first rotating body)
421 Nut 43 Spindle cover 45 Feed screw 46 Tool rotation drive motor (power source)
47 Belt (power transmission means)
48 Axial drive motor 49 Cylinder 50 Oscillating mechanism 51 Guide rail 52 Cylinder 53 Motor (power source)
61a to 61d Vibration acceleration sensors 62a to 62d Displacement sensor 70 Control device 71 Communication unit 72 Data acquisition unit 73 Load monitoring unit 74 Determination unit 75 Recipe change unit 76 Data storage unit 77 Storage unit 78 Control unit 79 Profile calculation unit 80 Profile measuring device D1 Workpiece thickness D2 Workpiece grinding amount D3 Feed amount L1 Distance to rotary stage L2 Distance to workpiece upper surface before grinding L3 Distance to workpiece upper surface after grinding G Grinding wheel W Workpiece

Claims (6)

A processing apparatus for grinding or polishing a workpiece to be processed,
A first rotating body that rotates while holding the processing tool;
A second rotating body that rotates while holding the workpiece;
An axial direction drive unit that causes at least one of the processing tool and the workpiece to relatively approach each other in the rotational axis direction of the first and second rotating bodies;
A first detector for detecting a state of the first rotating body;
A second detector for detecting the state of the second rotating body;
And a third detector for detecting the state of the axial drive unit. The first detector is
Detecting at least one of shaft shake, vibration of the rotating shaft of the first rotating body, and a load of a motor that rotationally drives the first rotating body;
The second detector is
Detecting at least one of shaft shake, vibration of the rotating shaft of the second rotating body, and a load of a motor that rotationally drives the second rotating body;
The third detector is
The processing apparatus according to claim 1, wherein at least one of vibration of the axial drive unit and a load of a motor that rotationally drives the axial drive unit is detected. The first detector is
An optical displacement sensor for measuring the displacement of the upper end side and the lower end side of the rotation shaft of the first rotating body;
The second detector is
The processing apparatus according to claim 2, further comprising an optical displacement sensor that measures displacements of an upper end side and a lower end side of the rotation shaft of the second rotating body. A first determination unit for determining an abnormality of the first rotating body based on a detection state of the first detector;
A second determination unit that determines an abnormality of the second rotating body based on a detection state of the second detector;
A third determination unit that determines abnormality of the axial direction drive unit based on a detection state of the third detector;
A control unit for controlling the first and second rotating bodies and the axial drive unit;
And a changing unit that changes at least one operation of the first and second rotating bodies and the axial driving unit based on at least one determination result of the first to third determination units. The processing apparatus in any one of Claims 1 thru | or 3. A first rotating body that holds and rotates a processing tool, a second rotating body that rotates while holding a workpiece to be processed, and at least one of the processing tool and the workpiece is the first and second. A processing method for grinding or polishing a workpiece using a processing apparatus provided with an axial direction drive unit that is relatively approached in the rotational axis direction of a rotating body,
A first detector detecting a state of the first rotating body;
A step of detecting a state of the second rotating body by a second detector;
And a third detector detecting the state of the axial drive unit. A processing system for grinding or polishing a workpiece to be processed,
A first rotating body that holds and rotates the processing tool, a second rotating body that holds and rotates the work, and at least one of the processing tool and the work is attached to the first and second rotating bodies. An axial drive unit that is relatively approached in the rotational axis direction, a first detector that detects the state of the first rotating body, a second detector that detects the state of the second rotating body, and the axial direction A plurality of processing devices including a third detector for detecting the state of the drive unit;
An acquisition unit that acquires detection results detected by the first to third detectors of the plurality of processing devices, and a storage control unit that stores the detection results acquired by the acquisition unit for each of the processing devices. A processing system comprising: a server.

Images