JP2019145821A - Conveying device, control method therefor, and substrate processing system - Google Patents

Abstract

To provide a conveying device that never limits action of an arm part and has superior durability.SOLUTION: An electrostatic pick 44 of a first conveying device 17 is allowed to enter a process module 12 so as to electrostatically attract a wafer to the electrostatic pick 44. When the first conveying device 17 is driven to convey the wafer to a load lock module 14, the electrostatic pick 44 is placed in an electrical float state while the wafer is electrostatically attracted by the electrostatic pick 44, and after conveyance of the wafer to the load lock module 14 is completed, the electrostatic pick 44 is electrostatically discharged to release the wafer from being electrostatically attracted by the electrostatic pick 44.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a transport apparatus that transports a transport body, a control method thereof, and a substrate processing system.

  For example, in a plasma processing apparatus that performs processing such as plasma etching processing on a semiconductor wafer (hereinafter referred to as “wafer”), plasma processing is performed in which a wafer contained in a container is maintained in a vacuum atmosphere using a transfer device (transfer robot). It is transported to the room.

  Generally, a plasma processing apparatus includes a plurality of plasma processing chambers, and a single transfer device is configured to be accessible to each plasma processing chamber. Therefore, as an example of the transfer device, an apparatus having a multi-joint structure transfer arm in which a plurality of arm portions are rotatably connected via joint portions is used, and the arm portions intersect by rotation at the joint portions. Access to each plasma processing chamber is made possible by changing the angle.

  In such a transfer device, a pick is attached to the tip of the arm portion on the tip side, and the wafer is transferred in a state of being placed on the pick. At this time, a pick including a mechanism for electrostatically attracting the wafer has been proposed in order to prevent the wafer from being displaced on the pick or falling from the pick (see Patent Document 1).

JP 2011-77288 A

  2. Description of the Related Art A conventional articulated transfer device including a pick having an electrostatic chucking mechanism is provided with a cable for supplying power to the electrostatic chucking mechanism along the arm from the base of the transfer device. Therefore, there is a problem that an extra cable length needs to be secured in the vicinity of the joint so that the cable is not cut in a state where the arms are bent at the maximum angle. In other words, there is a problem that the rotation angle at the joint is limited by the cable length. Moreover, since the excess cable arrange | positioned at a joint part repeats bending with rotation in a joint part, there exists a problem in durability.

  An object of the present invention is to provide a transport device having excellent durability, a control method thereof, and a substrate processing system without restricting the operation of an arm portion.

  In order to achieve the above object, a transfer apparatus according to claim 1 is provided at a transfer arm for transferring a transfer body, a driving means for driving the transfer arm, and a tip of the transfer arm, and the transfer body is mounted thereon. A pick to be placed, an electrostatic electrode including an internal electrode provided on the pick, and electrostatically attracting the transport body to the pick; a control means for controlling the electrostatic attracting means; When the pick is present at each of the transport source and the transport destination, the control means and the internal electrode are electrically connected, and the control means and the internal electrode are connected while the pick is moved from the transport source to the transport destination. And a terminal portion configured to cut off conduction between the two, and the control means controls the electrostatic attraction means so that when the pick is at the transport source, the transport body is fixed to the pick. Electroadsorption When the pick is at the transport destination, the pick is discharged, and while the pick moves from the transport source to the transport destination, the internal electrode is electrically floated by the terminal portion, thereby The state in which the transport body is electrostatically attracted to the pick is maintained.

  The transfer device according to claim 2 is the transfer device according to claim 1, wherein the transfer arm includes at least one arm portion and a joint portion that rotatably holds the arm portion, and the terminal portion is A terminal base provided in the joint part, a plurality of terminals provided on one surface of the terminal base so as to be arranged at predetermined positions on the same circumference, and another terminal provided in the arm part And a biasing means for bringing the another terminal into contact with the one surface of the terminal base, and when the arm portion rotates around the joint portion, the other terminal is the same circle. By moving in a circumferential direction on the circumference, the contact state and the non-contact state of the plurality of terminals and the other terminal are switched, and when the plurality of terminals and the another terminal are in a contact state, The control means and the internal electrode are electrically connected, and the plurality of When the said other terminal and the child is in non-contact state, wherein the continuity is broken between said control means and said internal electrode.

  The conveying device according to claim 3 is the conveying device according to claim 2, wherein the other terminals are lifted from the one surface of the terminal base against the urging force of the urging means. And a floating means for bringing the other terminal into a non-contact state.

  According to a fourth aspect of the present invention, there is provided the transporting device according to the first aspect, wherein the transporting device is configured to hold the transporting arm so that the transporting arm can advance and retreat in one direction and includes a plurality of terminals arranged at predetermined intervals in the one direction. The transport arm has another terminal, and an urging unit that brings the another terminal into contact with a surface on which the plurality of terminals are arranged in the holding unit, and the transport arm in the one direction As the other terminal moves in the one direction as the arm advances and retreats, a contact state and a non-contact state between the plurality of terminals and the other terminal are switched, and the plurality of terminals and the another terminal are switched. Between the control means and the internal electrode when the plurality of terminals and the other terminal are in a non-contact state. It is characterized in that the conduction of is cut off.

  The transport device according to claim 5 is the transport device according to any one of claims 2 to 4, wherein the control means generates an electrostatic adsorption force on the pick during transport of the transport body. The voltage signal is continuously applied to the plurality of terminals.

  In order to achieve the above object, a control method for a transfer apparatus according to claim 8 is provided at a transfer arm for transferring a transfer body, a driving means for driving the transfer arm, and a tip of the transfer arm, A pick on which a body is placed, an internal electrode provided on the pick, electrostatic attracting means for electrostatically attracting the transport body to the pick, control means for controlling the electrostatic attracting means, When the pick is present at each of the transport source and transport destination of the transport body, the control means and the internal electrode are electrically connected, and the control means and the internal are moved while the pick is moved from the transport source to the transport destination. And a terminal unit configured to cut off electrical continuity between the electrodes, wherein the control unit controls the electrostatic attraction unit, and the pick is moved to the transport source. When An electrostatic chucking step for electrostatically attracting a body to the pick, and while the control means controls a connection state between the control means and the internal electrode, and the pick moves from the transport source to the transport destination. An electrostatic adsorption maintaining step for maintaining the state in which the transport body is electrostatically attracted to the pick when the internal electrode is electrically floated by the terminal portion, and the control means includes the electrostatic And a static elimination step of controlling the suction means to neutralize the pick when the pick is at the transport destination.

  According to the present invention, in a transport device including a pick having an electrostatic attraction mechanism, a configuration in which the rotation angle at the joint portion is not limited is realized while maintaining the state where the transport body is held by the electrostatic attraction force on the pick. As a result, the time required for transporting the transport body can be shortened. Moreover, durability can be improved by setting it as the structure which does not use a cable for the joint part conventionally. Furthermore, since it is not necessary to pass a cable through the joint portion, the degree of freedom of configuration at the joint portion can be increased, and a more compact joint portion can be realized.

It is a top view which shows schematic structure of the substrate processing system which concerns on embodiment of this invention. It is the top view and side view which show schematic structure of the 1st conveying apparatus with which the substrate processing system of FIG. 1 is provided. It is the schematic plan view and schematic sectional drawing which show the terminal structure in the 2nd joint part of the 1st conveying apparatus of FIG. It is a figure which shows the sequence which generates an electrostatic attraction force to the electrostatic pick with which the 1st conveying apparatus of FIG. 2 is provided. It is a schematic plan view which shows another terminal structure in the 2nd joint part of the 1st conveying apparatus of FIG. FIG. 6 is a diagram illustrating a sequence for generating an electrostatic attraction force on an electrostatic pick when the second joint portion of the first transport device of FIG. 2 includes the terminal structure of FIG. 5. FIG. 10 is a schematic plan view, a schematic cross-sectional view, and a partial plan development view showing still another terminal structure at a second joint portion of the first transport device of FIG. 2. 8 is a cross-sectional view simply showing a contact state / non-contact state of a terminal in the terminal structure shown in FIG. It is the partial top view and partial sectional view which show schematic structure of a rectilinear conveyance apparatus.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Here, a semiconductor wafer (hereinafter referred to as “wafer”) having a diameter of 450 mm (φ450 mm) is taken up as a carrier, and a substrate processing system (plasma processing system) that performs plasma processing on the wafer is taken up.

  FIG. 1 is a plan view showing a schematic configuration of a substrate processing system 10 according to an embodiment of the present invention. The substrate processing system 10 is configured to perform plasma processing on wafers W (one by one). Specifically, the substrate processing system 10 includes a transfer module 11 (substrate transfer chamber) having a substantially pentagonal shape in plan view, and six process modules 12 arranged radially around the transfer module 11 and connected to the transfer module 11. (Substrate processing chamber), a loader module 13 disposed opposite to the transfer module 11, and two load lock modules 14 (atmosphere / vacuum switching chamber) interposed between the transfer module 11 and the loader module 13. Prepare.

  The process module 12 has a vacuum chamber, and a columnar stage 15 as a mounting table on which the wafer W is mounted is provided in the vacuum chamber. In the process module 12, after the wafer W is placed on the stage 15, the inside of the vacuum chamber is set to a predetermined degree of vacuum, a processing gas is introduced and high-frequency power is applied to the inside of the vacuum chamber to generate plasma, and the generated plasma The wafer W is subjected to plasma processing such as etching processing. The process module 12 and the transfer module 11 are partitioned by a gate valve 16 that can be freely opened and closed.

  The stage 15 included in the process module 12 is provided with a plurality of (for example, three) thin rod-shaped lift pins so as to protrude from the upper surface of the stage 15. These lift pins are arranged on the same circumference in a plan view, and project from the upper surface of the stage 15 to support and lift the wafer W placed on the stage 15. On the contrary, the lift pins exit into the stage 15. As a result, the supported wafer W is placed on the stage 15.

  The transfer module 11 is maintained in a vacuum (reduced pressure) atmosphere, and a first transfer device 17 is disposed therein. The first transfer device 17 has a multi-joint structure having three joint portions, and is provided with a pick (hereinafter referred to as “electrostatic pick 44”) that holds the wafer W by electrostatic attraction at the tip thereof. ing. The first transfer device 17 is movable in the X direction along a guide rail (not shown) arranged on the inner bottom wall of the transfer module 11 so as to extend in the X direction. The wafer W is transferred between the lock modules 14. Details of the structure and operation of the first transport device 17 will be described later.

  The load lock module 14 is configured as an internal pressure variable chamber that can be switched between a vacuum atmosphere and an atmospheric pressure atmosphere. The load lock module 14 and the transfer module 11 are partitioned by an openable / closable gate valve 19a, and the load lock module 14 and the loader module 13 are partitioned by an openable / closable gate valve 19b. A cylindrical stage 18 as a mounting table on which the wafer W is mounted is disposed inside the load lock module 14. Like the stage 15 of the process module 12, lift pins are provided on the stage 18. It is provided so as to protrude from the upper surface.

  When the wafer lock W is transferred from the loader module 13 to the transfer module 11, the load lock module 14 receives the wafer W from the loader module 13 while maintaining the interior at atmospheric pressure, and then depressurizes the interior to a vacuum to transfer the wafer W. The wafer W is delivered to the module 11. Conversely, when the wafer W is transferred from the transfer module 11 to the loader module 13, the inside is maintained in a vacuum and the wafer W is received from the transfer module 11, and then the inside is increased to atmospheric pressure to increase the loader module 13. Deliver wafer W to

  The loader module 13 is configured as a rectangular parallelepiped atmospheric transfer chamber. The load lock module 14 is connected to one long side surface, and a container for storing a plurality of wafers W on the other long side surface. A plurality (three in this case) of hoop mounting tables 21 for mounting a hoop (not shown) are connected.

  A second transfer device 20 for transferring the wafer W is disposed inside the loader module 13. The second transfer device 20 includes a guide rail (not shown) extending in the Y direction and a SCARA arm type transfer arm. 20a. The transfer arm 20a is movable in the Y direction along the guide rail, and is configured to be rotatable and extendable. A pick 20b for mounting and holding the wafer W is attached to the tip of the transfer arm 20a. The pick 20b supports the wafer W by a frictional force with a pad or the like. In the loader module 13, the second transfer device 20 transfers the wafer W between the FOUP placed on the FOUP placement table 21 and each load lock module 14.

  The substrate processing system 10 has a control device 22 formed of a computer. The control device 22 controls the operation of the entire substrate processing system 10.

  Next, the configuration, operation, and control method of the first transport device 17 will be described. FIG. 2A is a plan view (top view) illustrating a schematic configuration of the first transport device 17, and FIG. 2B is a side view illustrating a schematic configuration of the first transport device 17.

  The first transport device 17 includes a first joint part 31, a second joint part 32, a third joint part 33, a first arm part 41, a second arm part 42, a third arm part 43, and an electrostatic pick 44. FIG. 2 shows a state where the first arm portion 41 and the second arm portion 42 are extended in the X direction. In FIG. 2, the drive system of the first transport device 17 is not shown.

  The 1st joint part 31, the 2nd joint part 32, and the 3rd joint part 33 are respectively comprised by the some member containing a roller bearing etc. The first joint portion 31 is disposed on a base (not shown), and one end portion of the first arm portion 41 is rotatably attached to the first joint portion 31. The other end of the first arm portion 41 is fixed to the second joint portion 32. One end portion of the second arm portion 42 is rotatably attached to the second joint portion 32, and the other end portion is fixed to the third joint portion 33. One end portion of the third arm portion 43 is rotatably attached to the third joint portion 33, and the electrostatic pick 44 is fixed to the other end portion. Note that the third arm portion 43 and the electrostatic pick 44 may have an integrated structure using the same material as the base material.

  The first arm portion 41 is rotatable around the first joint portion 31. Since the second arm part 42 is rotatable around the second joint part 32, the bending angle between the first arm part 41 and the second arm part 42 is variable by the second joint part 32. Since the third arm portion 43 is rotatable around the third joint portion 33, the bending angle between the second arm portion 42 and the third arm portion 43 is variable by the third joint portion 33. If such a movement is possible, the connection form of the arm parts in each joint part is not limited to the said form.

  The electrostatic pick 44 includes an electrode (not shown) therein, and a predetermined voltage is applied to the electrode to generate an electrostatic force so that the wafer W placed on the electrostatic pick 44 is statically moved. Electroadsorb. Therefore, in a state where the electrostatic pick 44 electrostatically attracts the wafer W, the wafer W is displaced on the electrostatic pick 44 or falls from the electrostatic pick 44 even if the first transfer device 17 is driven at high speed. Therefore, throughput can be improved, and the wafer W can be transferred to an accurate position of the transfer destination.

  Next, a configuration for applying a voltage to the electrodes provided inside the electrostatic pick 44 (arrangement form of cables and connection terminals) and a control method (voltage application method) will be described. As shown in FIG. 2B, the first cable 51 for voltage application is connected from the base to the first joint portion 31 and the first arm portion 41 using the inner hole provided in the first joint portion 31. And is connected to a terminal portion provided in the second joint portion 32. Further, the second cable 52 for voltage application is connected to another terminal provided in the second joint portion 32, and is pulled from the other terminal to the third joint portion 33 through the inside of the second arm portion 42. It is rotated and further connected to the internal electrode of the electrostatic pick 44. Details of the terminal structure in the second joint portion 32 will be described later.

  In the present embodiment, the first arm centered on the first joint portion 31 is used when the movement enabling the electrostatic pick 44 to be inserted into and removed from each of the load lock module 14 and the process module 12 is realized. It is assumed that the rotation angle of the part 41 and the rotation angle of the third arm part 43 around the third joint part 33 may be within a certain narrow range. In that case, the first joint portion 31 and the third joint portion 33 do not use a terminal structure at the second joint portion 32 described later, and according to the respective rotations of the first arm portion 41 and the third arm portion 43. The extra length portions 51a and 52a in which the bending amount changes are provided, thereby preventing the first cable 51 and the second cable 52 from being disconnected. In addition, since the rotation angle in the 1st joint part 31 and the 3rd joint part 33 is not large, when the 1st arm part 41 and the 3rd arm part 43 are rotated, the load concerning the surplus length parts 51a and 52a is small. Therefore, even if the extra length portions 51a and 52a are provided, there is no problem in durability.

  FIG. 3A is a schematic plan view showing the terminal structure on the first arm portion 41 side in the second joint portion 32, and FIG. 3B is a schematic view showing the terminal structure in the second joint portion 32. It is sectional drawing. In the following description, the terminal structure shown in FIG. 3 is appropriately referred to as a first terminal structure.

  A terminal base 61 having a cylindrical shape and made of an insulating material (dielectric material) is fixed to the frame of the first arm portion 41. On the upper surface of the terminal base 61, annular first terminals 62 and second terminals 63 are provided so as to be concentric. Each of the first terminal 62 and the second terminal 63 is made of a highly conductive metal such as copper, and has a certain thickness so as to be durable against sliding with a third terminal 72 and a fourth terminal 73 described later. have.

  On the upper surface of the terminal base 61, an annular insulating member 65 is disposed between the first terminal 62 and the second terminal 63. Since the first transport device 17 is disposed in a vacuum (decompressed) atmosphere, the insulating member 65 prevents discharge from occurring due to a potential difference between the first terminal 62 and the second terminal 63. Since the distance between the first terminal 62 and the second terminal 63 is sufficiently large, a voltage for causing the electrostatic pick 44 to generate an electrostatic attraction force is applied to the first terminal 62 and the second terminal 63. The insulating member 65 is not necessarily required when there is no risk of discharge when applied.

  The first cable 51 is connected to connection terminals 66 a and 66 b provided on the side surface of the terminal base 61, and the connection terminals 66 a and 66 b are respectively connected to the first terminal through wiring provided in the terminal base 61. 62 and the second terminal 63 are connected. The first cable 51 is provided with switches 64 a and 64 b that can be controlled by the control device 22. The switches 64 a and 64 b may be provided in any position in the control device 22, the first arm portion 41, or between the control device 22 and the first arm portion 41.

  A support member 71 fixed to the frame of the second arm portion 42 is disposed inside the second arm portion 42. The support member 71 is provided with springs 75 and 76 (for example, coil springs that generate a biasing force by expansion and contraction), and a third terminal 72 and a fourth terminal 73 are attached to the springs 75 and 76, respectively. The spring 75 presses the third terminal 72 against the first terminal 62, and the spring 76 presses the fourth terminal 73 against the second terminal 63. The insulating member 65 has a height (thickness) that can prevent discharge from occurring between the third terminal 72 and the fourth terminal 73. A second cable 52 is connected to each of the third terminal 72 and the fourth terminal 73.

  When the second arm portion 42 rotates with respect to the first arm portion 41 around the second joint portion 32, the third terminal 72 is in contact with (pressurized contact with) the first terminal 62. The fourth terminal 73 slides along the circumference of the second terminal 63 while being in contact with the second terminal 63. Therefore, the second arm part 42 can be rotated with respect to the first arm part 41 without limitation. At this time, the third terminal 72 and the fourth terminal 73 are always the first terminal 62 and the second terminal, respectively. It is kept in contact with 63 and conducting.

  As described above, in the second joint portion 32, since it is not necessary to pass a cable for supplying a voltage to the electrostatic pick 44 into the second joint portion 32, the degree of freedom of configuration in the second joint portion 32 is increased. Can be made compact.

  FIG. 3C is a diagram showing another form in which the third terminal 72 and the fourth terminal 73 are brought into contact with the first terminal 62 and the second terminal 63, respectively. In FIG. 3B, the springs 75 and 76 are coil springs. However, as biasing means for bringing the third terminal 72 and the fourth terminal 73 into contact with the first terminal 62 and the second terminal 63, respectively, The leaf springs 78 and 79 may be used, and the biasing means is not particularly limited.

  FIG. 4 is a diagram showing a sequence for causing the electrostatic pick 44 to generate an electrostatic attraction force. In FIG. 4, “chuck” indicates a state in which the electrostatic pick 44 is electrostatically attracting the wafer W, and “dechuck” is a state in which the electrostatic pick 44 is neutralized (electrostatic adsorption to the wafer W). State in which no force is generated). “Positive / Zero / Negative” of “Voltage” indicates a voltage applied to the internal electrode of the electrostatic pick 44. “On / off” of “switches 64a and 64b” indicates the on and off states of the switches 64a and 64b. In the present embodiment, when the switch 64a is on and the switch 64b is off, a positive voltage is applied from the control device 22 to the internal electrode of the electrostatic pick 44, and conversely, the switch 64a is off and When the switch 64b is on, a negative voltage is applied from the control device 22 to the internal electrode of the electrostatic pick 44.

  At time t0, the electrostatic pick 44 does not hold the wafer W, and thus is in a state of “dechuck”, “switches 64a and 64b: off”, and “voltage: zero”. For example, the electrostatic pick 44 enters the process module 12 in order to transfer the wafer W that has been processed in the process module 12 (transfer source) to the load lock module 14 (transfer destination), and at time t1 When the wafer W is placed on the pick 44, the "switch 64b: ON" is controlled, and as a result, "voltage: negative" is generated and an electrostatic attraction force is generated, resulting in a "chuck" state.

  At time t2 when a predetermined time has elapsed from time t1, “switch 64b: off” is controlled. Thereby, since the electrostatic pick 44 is electrically floated, the state where the electrostatic attraction force is generated is maintained. Therefore, even if the first transfer device 17 is driven to transfer the wafer W to the load lock module 14, the position of the wafer W is shifted on the electrostatic pick 44 during the transfer, or the wafer W falls from the electrostatic pick 44. Is prevented. And since there is no restriction | limiting in the rotation angle of the 2nd arm part 42 in the 2nd joint part 32, it can be rotated to the conveyance destination by the most efficient rotation angle, and this can shorten conveyance time. .

  In addition, what is necessary is just to set the time between time t1-t2 to produce sufficient electrostatic attraction force for hold | maintaining the wafer W to time. Further, since the operation of carrying out the electrostatic pick 44 from the process module 12 can be started at a predetermined timing between the time t1 and the time t2, the time t2 does not affect the throughput in the substrate processing system 10.

  At time t3 when the electrostatic pick 44 enters the load lock module 14 and stops, it is controlled to be “switch 64a: ON”. As a result, a positive voltage is applied to the internal electrode of the electrostatic pick 44, the static pick 44 is neutralized, and the wafer W on the electrostatic pick 44 is moved to the "dechuck" state at time t4. It is possible to transfer the product onto a stage provided in the load lock module 14. If the “switch 64a: ON” state is continued for a long time, an electrostatic adsorption force is generated again after static elimination. Therefore, the “switch 64a: ON” state is limited to the time required for static elimination of the electrostatic pick 44. It is done.

  Since the state at the time t5 when the electrostatic pick 44 has left the load lock module 14 and the wafer W is not placed is the same as the state at the time t0, the load between the process modules 12 or the process module 12 will be described hereinafter. The wafer W can be transferred to and from the lock module 14 in the same manner as described above.

  In the description of FIG. 4, static electricity is removed by applying a negative voltage to the internal electrode of the electrostatic pick 44 to generate an electrostatic attraction force and applying a positive voltage with a reverse potential. The sign may be reversed. That is, static electricity may be removed by applying a positive voltage to the internal electrode of the electrostatic pick 44 to generate an electrostatic attraction force and applying a negative voltage with a reverse potential.

  Further, when the wafer W is transferred to the lift pins in the process module 12 or the load lock module 14, the lift pins connected to the ground potential (grounded) come into contact with the substrate to the wafer W, so that the static electricity on the back surface of the wafer W is reached. Can be removed. Similarly, for example, after the electrostatic pick 44 electrostatically attracting the wafer W is inserted into a predetermined module and stopped, before the lift pins are brought into contact with the wafer W, the switches 64a and 64b and the control device 22 are used. The electrostatic pick 44 can be neutralized by connecting (grounding) the internal electrode of the electrostatic pick 44 to the ground potential.

  FIG. 5 is a schematic plan view showing another terminal structure on the terminal base 61 side in the second joint portion 32. In the following description, the terminal structure shown in FIG. 5 is appropriately referred to as a second terminal structure.

  In the first terminal structure shown in FIG. 3, an annular first terminal 62 and second terminal 63 are arranged (embedded) in the terminal base 61. On the other hand, the second terminal structure shown in FIG. 5 has three sets on each circumference of two concentric circles, that is, one set of first terminal 62a and second terminal 63a, and one set of first terminal 62b. And the second terminal 63b, a set of the first terminal 62c and the second terminal 63c are arranged (embedded).

  In the first terminal structure, the switches 64a and 64b are provided for the first cable 51. However, in the second terminal structure, the switches 64a and 64b are not provided. In FIG. 5, connections between the terminals, the first cable 51, and the control device 22 are simply illustrated. Here, the first terminals 62 a to 62 c and the second terminals 63 a to 63 c have a circular shape in plan view, but are not limited thereto, and are, for example, substantially long having a certain length in the circumferential direction of the terminal base 61. The shape may be a circle or the like. The number of sets of terminals provided on the terminal base 61 is not limited to 3, and may be 2 sets or 4 sets or more.

  The reason why the second terminal structure on the first arm portion 41 side in the second joint portion 32 can be adopted is as follows. In other words, the first transport device 17 adjusts the position in the X direction shown in FIG. 1, so that the second joint portion 32 is in a state where the electrostatic pick 44 has entered the arbitrary load lock module 14 and the process module 12. The angle of the second arm part 42 with respect to the first arm part 41 can be configured to always have two or three values. In that case, there is no need to use the annular first terminal 62 and the second terminal 63, and the terminal structure on the first arm portion 41 side is such that the second arm portion 42 has a predetermined angle with respect to the first arm portion 41. It is sufficient that the third terminal 72 and the fourth terminal 73 are configured to be electrically connected to the first cable 51 only when it becomes. Therefore, the second terminal structure shown in FIG. 5 can be obtained.

  The positions of the first terminals 62a to 62c and the second terminals 63a to 63c in the second terminal structure are merely examples, and the present invention is not limited thereto. The configuration of the third terminal 72 and the fourth terminal 73 on the second arm portion 42 side in the first terminal structure can be applied to the second terminal structure as it is.

  In the state shown in FIG. 2A, when the second joint portion 32 side is viewed from the first joint portion 31, the second arm portion 42 bends 90 degrees to the left and the longitudinal direction of the first arm portion 41 In a state where the longitudinal directions of the second arm part 42 are orthogonal, the third terminal 72 and the fourth terminal 73 are in contact with the first terminal 62a and the second terminal 63a. Similarly, when the second joint portion 32 side is viewed from the first joint portion 31, the second arm portion 42 bends 90 degrees to the right, and the longitudinal direction of the first arm portion 41 and the longitudinal direction of the second arm portion 42. In the state where the two are orthogonal, the third terminal 72 and the fourth terminal 73 are in contact with the first terminal 62b and the second terminal 63b. In a state where the first arm portion 41 and the second arm portion 42 overlap when viewed from the Z direction in FIG. 2B, the third terminal 72 and the fourth terminal 73 are the first terminal 62c and the second terminal 63c. To touch.

  FIG. 6 is a diagram illustrating a sequence for causing the electrostatic pick 44 to generate an electrostatic attraction force when the second joint portion 32 includes the second terminal structure. In FIG. 6, “chuck” indicates a state where the electrostatic pick 44 is electrostatically attracting the wafer W, and “dechuck” is a state where the electrostatic pick 44 has been neutralized (electrostatic adsorption to the wafer W). State in which no force is generated). “ON” of “conduction” means a state in which the control device 22 and the internal electrode of the electrostatic pick 44 are in conduction (any one of the first terminals 62a to 62c and the second terminals 63a to 63c in the second joint portion 32). A state in which one set of terminals is in contact with the third terminal 72 and the fourth terminal 73), and “OFF” of “conduction” indicates that the control device 22 and the internal electrode of the electrostatic pick 44 are connected. Indicates a state that is not. “On” of the “control signal” indicates a state in which a voltage signal for generating an electrostatic attraction force from the control device 22 to the electrostatic pick 44 is output, and “off” of the “control signal” indicates the control device. 22 shows a state where the electrostatic pick 44 is connected to the ground potential (state where the electrostatic attraction force of the electrostatic pick 44 disappears).

  At time t0, the electrostatic pick 44 does not hold the wafer W, and the third terminal 72 and the fourth terminal 73 are not in contact with any of the first terminals 62a to 62c and the second terminals 63a to 63c. To do. In this case, at time t0, “dechuck”, “conduction: off”, and “control signal: off” are set.

  For example, in order to transfer the wafer W that has been processed in the process module 12 to the load lock module 14, the electrostatic pick 44 enters the process module 12, and the wafer W is placed on the electrostatic pick 44 at time t1. Suppose that In this case, the electrostatic pick 44 is stationary in the process module 12 before the time t1, and therefore the third terminal 72 and the fourth terminal 73 are, for example, the first terminal at a predetermined timing before the time t1. The first terminal 62a and the second terminal 63a are brought into contact with each other and become “conductive: on”. The timing at which “conduction: ON” is determined by the timing at which the operation (rotation) at the second joint portion 32 ends. Then, when “control signal: on” is turned on at time t1, the state “chuck” is quickly established.

  When the operation of unloading the electrostatic pick 44 from the process module 12 is started at time t2, the third terminal 72 and the second terminal 32 in the case of the above example according to the timing at which the second joint portion 32 is rotated. The fourth terminal 73 is not in contact with the first terminal 62a and the second terminal 63a. Therefore, “conduction: off” is turned on at a predetermined timing after time t2, but the electrostatic pick 44 is in an electrically floating state, so that the “chuck” state in which the electrostatic attraction force is generated is maintained. The Accordingly, even if the first transfer device 17 is driven to transfer the wafer W to the load lock module 14, the position of the wafer W is shifted on the electrostatic pick 44 or the wafer W falls from the electrostatic pick 44. Can be prevented. Moreover, since there is no restriction | limiting in the rotation angle of the 2nd arm part 42 in the 2nd joint part 32, it can be rotated to the conveyance destination by the most efficient rotation angle, and, thereby, conveyance time can be shortened. .

  In the load lock module 14 to which the wafer W is transferred, the third terminal 72 and the fourth terminal 73 are in contact with the first terminal 62c and the second terminal 63c.

  It is assumed that the electrostatic pick 44 enters the load lock module 14 and the electrostatic pick 44 is stationary at time t3. In this case, the third terminal 72 and the fourth terminal 73 come into contact with the first terminal 62c and the second terminal 63a at a predetermined timing before the time t3, and the state is “conductive: on”. At this time, since the state of “signal: on” is maintained even after time t2, even if it becomes “conduction: on” at time t3, the electrostatic attraction force of the electrostatic pick 44 is not lost.

  At time t <b> 3, “signal: OFF” is controlled in order to remove static electricity from the electrostatic pick 44, and thereby the state becomes “dechuck”, whereby the wafer W on the electrostatic pick 44 is placed in the load lock module 14. It becomes possible to deliver it on the provided stage.

  When the electrostatic pick 44 is withdrawn from the load lock module 14 at time t4, the third terminal 72 and the fourth terminal 73 are used in the above example according to the timing at which the second joint portion 32 is rotated. Is not in contact with the first terminal 62c and the second terminal 63c. Therefore, “conduction: off” is set at a predetermined timing after time t4. Since the subsequent state at time t5 is the same as the state at time t0, the wafer W is transferred between the process modules 12 or between the process module 12 and the load lock module 14 in the same manner as described above. Can do.

  Next, a configuration for reducing wear of the third terminal 72 and the fourth terminal 73 will be described with reference to FIGS. FIG. 7A is a plan view showing still another terminal structure on the terminal base 61 side in the second joint portion 32. The terminal structure shown in FIG. 7A is different from the second terminal structure (FIG. 5) in that a standing wall portion 81 is provided on the outer periphery of the upper surface of the terminal base 61, but the other configurations are the same. It is. Therefore, the configuration of the standing wall portion 81 will be described below.

  7B is a cross-sectional view taken along the line AA shown in FIG. 7A, and FIG. 7C is a plan development view of the standing wall portion 81. The standing wall portion 81 corresponds to a portion corresponding to the outside of the first terminal 62a and the second terminal 63a, a portion corresponding to the outside of the first terminal 62b and the second terminal 63b, and the outside of the first terminal 62c and the second terminal 63c. This region has a structure that is lower in height than other regions.

  FIG. 8A is a cross-sectional view schematically showing a state where the first terminal 62c and the second terminal 63c and the third terminal 72 and the fourth terminal 73 are in contact with each other. FIG. 8B is a cross-sectional view schematically showing a state in which the second arm portion 42 is rotated 45 degrees from the state shown in FIG. In FIG. 8, the second cable 52 connected to the third terminal 72 and the fourth terminal 73 is not shown.

  The third terminal 72 and the fourth terminal 73 are attached to one end of a rod-shaped support member 82. The other end portion 82a of the support member 82 is fixed to the frame of the second arm portion 42 via a spring 83 which is a biasing means.

  In the state of FIG. 8A, the intermediate portion in the length direction of the support member 82 is in contact with the upper surface of the standing wall portion 81, and the spring 83 always urges the end portion 82a of the support member 82 in the direction of arrow F1. ing. Accordingly, the third terminal 72 and the fourth terminal 73 are pressed toward the terminal base 61 side by the principle of leverage, and are in contact with the first terminal 62c and the second terminal 63c.

  When the second arm portion 42 is rotated to change from the state of FIG. 8A to the state of FIG. 8B, the position where the support member 82 contacts the standing wall portion 81 along the upper surface of the standing wall portion 81. It moves, and the standing wall portion 81 lifts the support member 82 against the urging force of the spring 83. That is, with the contact point between the standing wall portion 81 and the support member 82 as a fulcrum, the spring 83 contracts, and the third terminal 72 and the fourth terminal 73 are lifted from the surface of the terminal base 61 and contact with the surface of the terminal base 61. Is released. Thus, the durability of the third terminal 72 and the fourth terminal 73 can be enhanced by adopting a configuration in which the third terminal 72 and the fourth terminal 73 and the terminal base 61 do not slide. It goes without saying that the state change from the state of FIG. 8B to FIG. 8A is reversible with the state change from the state of FIG. 8A to FIG. 8B.

  In the first terminal structure (FIG. 3), the terminal base 61 is provided with the standing wall portion 81, and the connection terminals 66a and 66b and the control device 22 are always connected without providing the switches 64a and 64b. The terminal structure functions substantially the same as the second terminal structure (FIG. 5). Therefore, in this case, the sequence shown in FIG. 6 is applied.

  The first terminal structure (FIG. 3) and the second terminal structure (FIG. 5) described above are not limited to the joint portion for performing the rotation operation as described above, and the electrostatic pick 44 is linearly arranged in one direction. The present invention can also be applied to a transporting device that is moved. Then, next, an example in which the second terminal structure is applied to a transfer device that linearly moves the electrostatic pick 44 in one direction will be described.

  FIG. 9A is a partial plan view showing a schematic configuration of a straight-ahead type conveyance device. The electrostatic pick 44 is fixed to a holding member 91 (stage). The holding member 91 is fitted with a guide 93 provided on the base 90 so as to extend in the X direction so as to be able to advance and retreat (slide) in one direction (here, the X direction). The holding member 91 is screwed with a screw 92 disposed on the base 90 so as to extend in the X direction. The holding member 91 can be moved in the X direction by rotating the screw 92 by a motor (not shown).

  Two first terminals 94 are arranged on the holding member 91 side by side in the Y direction. In addition, second terminals 95a, 95b, and 95c made of two terminals arranged in the Y direction are arranged on the base 90 at predetermined intervals in the X direction, and the holding member 91 is moved in the X direction. Contact state / non-contact state between the first terminal 94 and the second terminals 95a, 95b, and 95c occurs.

  FIG. 9B is a cross-sectional view showing a state where the first terminal 94 and the second terminal 95b are in contact with each other. Similar to the first terminal structure (FIG. 3), here, the first terminal 94 is pressed toward the base 90 using a spring 96, thereby bringing the first terminal 94 and the second terminal 95 b into contact and conduction. Is secured. 9 is controlled by the sequence shown in FIG.

  As mentioned above, although embodiment of this invention was described, this invention is not limited to said embodiment. For example, the first terminal structure and the second terminal structure described with reference to FIG. 3 and FIG. 5 are applied to the second joint portion 32 of the first transport device 17. The present invention can be applied to the first joint portion 31 and the third joint portion 33, and can also be applied to the joint portion of the second transport device 20.

  Further, the wafer W can be transferred by applying the control signal shown in FIG. 6 to the terminal structure of FIG. In that case, the switches 64a and 64b are always closed (that is, the control device 22 and the connection terminals 66a and 66b are connected by the first cable 51 without providing the switches 64a and 64b). The control device 22 and the second cable 52 are always kept in a conductive state. As a result, while the electrostatic pick 44 holds the wafer W, the voltage for generating the electrostatic adsorption force is applied to the internal voltage of the electrostatic pick 44. Even in this case, the rotation angle in the second joint portion 32 is not limited, and the effect that the wafer W can be transferred at the minimum rotation angle can be obtained.

  Furthermore, in the above-described embodiment, the transfer apparatus that transfers the wafer W has been described. However, the transfer target is not limited to the wafer W, and may be another substrate, component, or the like.

DESCRIPTION OF SYMBOLS 10 Substrate processing system 11 Transfer module 12 Process module 14 Load lock module 17 1st conveying apparatus 22 Control apparatus 32 2nd joint part 41 1st arm part 42 2nd arm part 44 Electrostatic pick 51 1st cable 52 2nd cable 61 Terminal base 62, 62a, 62b, 62c First terminal 63, 63a, 63b, 63c Second terminal 72 Third terminal 73 Fourth terminal 75, 76 Spring

Claims (7)

A transport arm for transporting the transport body;
Drive means for driving the transfer arm;
A pick provided at a tip of the transfer arm, on which the transfer body is placed;
An electrostatic attracting means including an internal electrode provided on the pick, and electrostatically attracting the carrier to the pick;
Control means for controlling the electrostatic adsorption means;
When the pick is present at each of the transport source and transport destination of the transport body, the control means and the internal electrode are electrically connected to each other, and the control means and the control unit are moved while the pick is moved from the transport source to the transport destination. A terminal portion configured to break conduction between the internal electrodes, and
The control means controls the electrostatic attraction means to cause the transport body to electrostatically attract to the pick when the pick is at the transport source, and when the pick is at the transport destination. While the static electricity is removed and the pick moves from the transport source to the transport destination, the internal electrode is electrically floated by the terminal portion, so that the transport body is electrostatically attracted to the pick. Is maintained. The transfer arm is
At least one arm part;
A joint part that rotatably holds the arm part,
The terminal portion is
A terminal base provided at the joint;
A plurality of terminals provided on one surface of the terminal base so as to be arranged at predetermined positions on the same circumference;
Another terminal provided on the arm portion;
Biasing means for bringing the another terminal into contact with the one surface of the terminal base;
When the arm portion rotates around the joint portion, the other terminal moves in the circumferential direction on the same circumference, so that the contact state and the non-contact state between the plurality of terminals and the another terminal And
When the plurality of terminals and the other terminal are in a contact state, the control means and the internal electrode are electrically connected, and when the plurality of terminals and the another terminal are in a non-contact state, The transport apparatus according to claim 1, wherein conduction between the control unit and the internal electrode is cut off.   It has a floating means for bringing the plurality of terminals and the other terminals into a non-contact state by floating the other terminal from the one surface of the terminal base against the urging force of the urging means. The transport apparatus according to claim 2, wherein Holding the transfer arm so as to be able to advance and retreat in one direction, and having a holding means having a plurality of terminals arranged at predetermined intervals in the one direction;
The transfer arm is
Another terminal,
Biasing means for bringing the another terminal into contact with the surface on which the plurality of terminals are arranged in the holding means;
As the other arm moves in the one direction as the transfer arm advances and retreats in the one direction, a contact state and a non-contact state between the plurality of terminals and the other terminal are switched, The control means and the internal electrode are electrically connected when the other terminal is in contact with the other terminal, and the control means is in a non-contact state with the plurality of terminals and the other terminal. 2. The transport device according to claim 1, wherein conduction between the first electrode and the internal electrode is cut off.   5. The control unit according to claim 2, wherein the control unit continues to apply a voltage signal for generating an electrostatic attraction force to the picks to the plurality of terminals while the transport body is transported. The transfer device according to item. A transport arm for transporting the transport body, a driving means for driving the transport arm, a pick provided at a tip of the transport arm, on which the transport body is placed, and an internal electrode provided on the pick, An electrostatic attracting means for electrostatically attracting the transport body to the pick, a control means for controlling the electrostatic attracting means, and the control means when there is the pick at each of a transport source and a transport destination of the transport body And a terminal portion configured to disconnect the control means and the internal electrode while the pick is moved from the transport source to the transport destination. An apparatus control method comprising:
An electrostatic chucking step in which the control unit controls the electrostatic chucking unit to electrostatically chuck the transporter to the pick when the pick is at the transport source;
The control unit controls a connection state between the control unit and the internal electrode, and the internal electrode is electrically floated by the terminal portion while the pick moves from the transfer source to the transfer destination. An electrostatic adsorption maintaining step for maintaining the state where the transport body is electrostatically adsorbed to the pick by becoming,
The control unit controls the electrostatic attraction unit to neutralize the pick when the pick is at the transport destination.
A control method for a conveying apparatus, comprising: 6. A substrate processing system using the transfer apparatus according to claim 1, wherein the transfer arm is provided in a substrate transfer chamber capable of depressurization.