JP2019145689A - Abrasive pad laminate - Google Patents

Abstract

To provide an abrasive pad laminate in which occurrence of exfoliation of abrasive pad is restrained, even if acidic oxidant solution is used as polishing liquid in polish processing of CMP method.SOLUTION: Since adhesive 16b composed of silicone-based resin adhesive where high polymer material having, as a main chain, concatenation of binding energy of 100 kcal/mol or more, i.e., polymer having siloxane bond as main skeleton, and excellent in chemical resistance and tackiness, is located on the underside of an abrasive pad 14, the abrasive pad is chemically stable and does not deteriorate even if acidic oxidant solution is used as the polishing liquid, and thereby exfoliation is restrained suitably on the interface of the abrasive pad 14 and a double-sided adhesive sheet 16.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a polishing pad laminate suitably used for chamfering a semiconductor wafer or polishing the surface by a CMP method.

  A CMP (Chemical Mechanical Polishing) method is known as polishing for flattening and smoothing the surface of a semiconductor wafer such as Si or SiC. The CMP method is a method in which a semiconductor wafer is pressed against a resin polishing pad affixed on a polishing surface plate, and the polishing surface plate and the semiconductor wafer are relatively rotated while supplying a slurry containing fine abrasive particles. By doing so, the semiconductor wafer is polished. According to this CMP method, the polishing process is performed under a constant supply of slurry, so that a large amount of expensive abrasive particles contained in the slurry is consumed.

  On the other hand, there has been proposed an abrasive particle-encapsulated type polishing pad for performing polishing by a CMP method without using a slurry. For example, the polishing pads described in Patent Document 1 and Patent Document 2 are examples thereof. Since this polishing pad contains abrasive particles in continuous air holes formed in a matrix resin such as polyvinyl fluoride, sufficient polishing efficiency and polishing performance can be obtained regardless of slurry, and for polishing semiconductor wafers. The proportion of abrasive particles that contribute is dramatically increased.

  By the way, in order to adhere | attach between a polishing pad and the support body which supports it, it is proposed to use the double-sided adhesive sheet by which the adhesive agent was apply | coated to both surfaces of the base material sheet. For example, the polishing pads described in Patent Document 3 and Patent Document 4 are examples thereof.

Japanese Patent No. 4266579 Japanese Patent No. 5511266 JP 2006-066781 A JP 2017-119313 A

  However, when a semiconductor wafer is repeatedly polished using the above polishing pad, if an acidic oxidant aqueous solution is used as a polishing liquid during polishing, the acidic oxidant aqueous solution permeates through the continuous vents of the polishing pad and polishes. There was a problem that the adhesive ability of the double-sided adhesive sheet used for bonding the pad and the support supporting the pad deteriorates, and peeling occurs at the interface between the support and the double-sided adhesive sheet.

  The present invention has been made against the background of the above circumstances, and its purpose is to suppress the occurrence of peeling of the polishing pad even when an acidic oxidizer aqueous solution is used as a polishing liquid for polishing by the CMP method. An object of the present invention is to provide a polishing pad laminate.

  As a result of continual research to develop such an abrasive pad laminate, the present inventor has found that an adhesive applied to both surfaces of a base sheet is an adhesive having a main skeleton of a chain having a binding energy of 100 kcal / mol or more. It has been found that when an agent is used, a double-sided adhesive sheet is obtained in which the adhesive ability is not deteriorated even in the presence of an acidic oxidizing agent aqueous solution. The present invention has been made based on such an idea.

  The gist of the first invention is that (a) a plurality of layers including a polishing pad in which a large number of abrasive particles are encapsulated in the continuous air holes in the base material resin are laminated through a plurality of adhesive layers. And (b) an adhesive used for an adhesive layer in contact with the polishing pad among the plurality of adhesive layers has a binding energy of 100 kcal / mol or more. The main component is a polymer material having a chain as a main chain.

  Further, the gist of the second invention is that, in the first invention, the adhesive used for the adhesive layer in contact with the polishing pad is composed mainly of a polymer material having a siloxane bond as a main chain. It is.

  The gist of the third invention is that, in the first invention or the second invention, the adhesive used for the adhesive layer in contact with the polishing pad is composed of a silicone resin adhesive.

  The gist of the fourth invention is that in any one of the first to third inventions, an acidic oxidizer aqueous solution is used in polishing using the polishing pad laminate bonded to the polishing platen. It is to be supplied onto the polishing pad.

  The gist of the fifth invention is that, in any one of the first to fourth inventions, the polishing pad laminate is applied to both surfaces of the second substrate sheet and the second substrate sheet. A second double-sided adhesive sheet having an adhesive, a cushion layer, a first base sheet and a first double-sided adhesive sheet having an adhesive applied to both sides of the first base sheet; and the polishing pad Are laminated in order on the polishing surface plate, and the adhesive applied to the surface on the polishing pad side of both surfaces of the first base sheet is an adhesive layer in contact with the polishing pad. There is to be.

  The gist of the sixth invention is that, in any one of the first to fourth inventions, the polishing pad laminate is applied to both surfaces of the second substrate sheet and the second substrate sheet. A second double-sided adhesive sheet having an adhesive, a cushion layer, a first base sheet and a first double-sided adhesive sheet having an adhesive applied to both sides of the first base sheet, and a third base A single-sided adhesive sheet having a sheet and an adhesive applied to one side of the polishing pad side of the third base sheet, and the polishing pad are sequentially laminated on the polishing surface plate, The adhesive applied to one surface of the third base sheet on the polishing pad side is an adhesive layer that contacts the polishing pad.

  According to the first invention, the polishing pad in which a large number of abrasive particles are encapsulated in the continuous air holes in the base material resin is a double-sided adhesive in which an adhesive is applied to at least the polishing pad side of both surfaces of the base sheet. A polishing pad laminate bonded to a support through a sheet, wherein the adhesive applied to the polishing pad side of both surfaces of the base sheet has a chain having a binding energy of 100 kcal / mol or more. Since the main chain is composed of a polymer material as a main component, the polymer material is excellent in chemical resistance and tackiness, and an adhesive composed of the polymer material as a main component is polished. Even if an acidic oxidizer aqueous solution is used as the liquid, it is chemically stable and does not deteriorate, and therefore peeling is suitably suppressed at the interface between the polishing pad and the double-sided adhesive sheet.

  According to the second invention, since the adhesive applied to the polishing pad side of the surface adhesive sheet is composed mainly of a polymer material having a siloxane bond as a main chain, it is 100 kcal or more. It is composed mainly of a polymer material whose main skeleton is a chain with binding energy, and even when an acidic oxidizer aqueous solution is used as the polishing liquid, it is chemically stable and does not deteriorate. Peeling is suitably suppressed at the interface with the sheet.

  The gist of the third invention is that the adhesive applied to the polishing pad side of the surface adhesive sheet is a silicone-based resin adhesive, so that even if an acidic oxidizing agent aqueous solution is used as a polishing liquid, Therefore, peeling is preferably suppressed at the interface between the polishing pad and the double-sided adhesive sheet.

  The gist of the fourth invention is that, in the polishing process using the polishing pad laminate bonded onto the polishing surface plate, when the acidic oxidizing agent aqueous solution is supplied onto the polishing pad, the surface adhesive sheet Since the adhesive applied to the polishing pad side is chemically stable and does not deteriorate even when contacted with the aqueous acidic oxidizer solution, peeling is suitably suppressed at the interface between the polishing pad and the double-sided adhesive sheet.

  According to a fifth aspect of the present invention, the polishing pad laminate includes a second double-sided adhesive sheet having a second base material sheet and an adhesive applied to both surfaces of the second base material sheet, and a cushion layer. The first double-sided adhesive sheet having the first base material sheet and the adhesive applied to both surfaces of the first base material sheet, and the polishing pad are sequentially laminated on the polishing surface plate. Yes, the adhesive applied to the surface on the polishing pad side of both surfaces of the first base sheet is an adhesive layer that comes into contact with the polishing pad. Accordingly, the polishing pad laminate can be easily assembled by using the second double-sided adhesive sheet and the first double-sided adhesive sheet. Further, by interposing a cushion layer between the second double-sided adhesive sheet and the first double-sided adhesive sheet, it is possible to achieve both flattening and smoothing of the polished surface.

  The gist of the sixth invention is that the polishing pad laminate includes a second base sheet and a second double-sided adhesive sheet having an adhesive applied to both sides of the second base sheet, a cushion layer, A first double-sided adhesive sheet having a first base sheet and an adhesive applied to both sides of the first base sheet; a third base sheet and one side of the third base sheet on the polishing pad side A single-sided adhesive sheet having an adhesive applied to the surface and the polishing pad are sequentially laminated on the polishing surface plate, and applied to one side of the third base sheet on the polishing pad side. The adhesive thus formed is an adhesive layer in contact with the polishing pad. Accordingly, the polishing pad laminate can be easily assembled by using the second double-sided adhesive sheet, the first double-sided adhesive sheet, and the single-sided adhesive sheet. Further, by interposing a cushion layer between the second double-sided adhesive sheet and the first double-sided adhesive sheet, it is possible to achieve both flattening and smoothing of the polished surface.

It is sectional drawing which illustrates typically the state by which the polishing pad laminated body of one Example of this invention was fixed on the polishing surface plate. It is a SEM photograph which expands and shows the cross section of the polishing pad located in the uppermost stage of the polishing pad laminated body shown in FIG. It is a figure explaining the structure of the polishing processing apparatus by CMP method using the polishing pad laminated body shown in FIG. It is a figure which shows typically the state by which the polishing pad laminated body of the other Example of this invention was fixed on the polishing surface plate, Comprising: It is a figure equivalent to FIG. It is a figure which shows typically the state by which the conventional polishing pad laminated body was fixed on the polishing surface plate, Comprising: It is a figure corresponded in FIG. It is a figure which shows typically the state by which the conventional polishing pad laminated body was fixed on the polishing surface plate, Comprising: It is a figure corresponded in FIG. It is a figure which shows typically the state by which the conventional polishing pad laminated body was fixed on the polishing surface plate, Comprising: It is a figure corresponded in FIG.

(Example 1)
An embodiment of the present invention will be described below with reference to the drawings. In the following embodiments, the drawings are appropriately simplified or modified, and the dimensional ratios, shapes, and the like of the respective parts are not necessarily drawn accurately.

  FIG. 1 is a cross-sectional view schematically illustrating a state in which a polishing pad laminate 10 according to an embodiment of the present invention is fixed on a polishing surface plate 12. In FIG. 1, a polishing pad laminate 10 fixed on a polishing surface plate 12 includes a polishing pad 14, a first double-sided adhesive sheet 16, a cushion layer 18, and a second double-sided adhesive sheet 20, and is exclusively CMP (Chemical). It is adhered on a polishing surface plate 12 of a polishing apparatus described later used for polishing by a mechanical polishing (chemical mechanical polishing) method.

  The polishing pad 14 located on the surface (uppermost layer) of the polishing pad laminate 10 functions as a polishing body that slides on and polishes a semiconductor wafer such as a wafer of Si, SiC (crystalline material) or the like. Further, the first double-sided adhesive sheet 16, the cushion layer 18, and the second double-sided adhesive sheet 20 function as a support 22 that supports the polishing pad 14. That is, the polishing pad 14 is fixed to the polishing surface plate 12 via the support 22.

  The polishing pad 14 is formed in a disk shape with a base resin 14a and a large number of abrasive particles 14c enclosed in a continuous vent 14b formed in the base resin 14a. It has dimensions of about 1000 (mmφ) × thickness 2 (mm). As the base material resin 14a, for example, a polysulfone-based resin is used, but at least one of other resins such as polyamide, polyamideimide, polyimide, polyacrylonitrile, polyvinylidene fluoride, cellulose acetate, polyvinyl alcohol, and polyurethane is used. It may be included. As the abrasive particles 14c, silica is preferably used, but other abrasive particles such as ceria, alumina, zirconia, titania, manganese oxide, barium carbonate, chromium oxide, and iron oxide are included. May be used. As the silica, for example, fumed silica (silica fine particles obtained by high-temperature combustion of silicon tetrachloride, chlorosilane, etc. in the presence of hydrogen and oxygen) and the like are preferably used. The average particle diameter of the abrasive particles 14c is preferably 0.005 to 3.0 (μm).

  FIG. 2 is an SEM photograph showing an example of a cross section of the polishing pad 14 magnified 1000 times. In FIG. 2, the base material resin 14a is continuous in a three-dimensional stitch shape, and the continuous air holes 14b are shown in the gaps between the base material resins 14a continuous in the stitch shape. A large number of small spheres existing in the space indicate the abrasive particles 14c.

  Returning to FIG. 1, the first double-sided adhesive sheet 16 includes a first base sheet 16a and adhesives 16b and 16c applied to both sides of the first base sheet 16a. The adhesive 16b applied to the surface on the polishing pad 14 side is a polymer material having a chain having a bond energy of 100 kcal / mol or more, for example, a siloxane bond (-Si-Si-Si-) as the main chain. This is a silicone resin adhesive mainly composed of a silicone resin. The adhesive 16c on the polishing surface plate 12 side is, for example, an acrylic resin adhesive mainly composed of an acrylic resin. This acrylic resin has a carbon bond (—C—C—C—) as the main chain, and its bond energy is 85 kcal / mol. The bond energy of the main chain (CH2 = CH-CH-H) of the diene polymer constituting the rubber-based adhesive is 77 kcal / mol. In general, the bond energy is used as an indicator of chemical resistance, and as the bond energy of the main chain is higher, the chemical resistance is better. Thereby, the acrylic resin adhesive has better chemical resistance than the rubber adhesive, and the silicone resin adhesive has better chemical resistance than the acrylic resin adhesive. The silicone resin adhesive not only has a function as an adhesive, but also has excellent tackiness.

  The first base sheet 16a of the first double-sided adhesive sheet 16 is made of, for example, a PET resin film. The adhesive 16c applied to the surface of the first double-sided adhesive sheet 16 opposite to the polishing pad 14 is an acrylic resin adhesive mainly composed of an acrylic resin.

  The cushion layer 18 is made of, for example, a polyurethane foam whose surface is buffed and subjected to corona treatment, and has a thickness of about 0.8 mm, for example.

  The second double-sided adhesive sheet 20 includes a second base sheet 20a and adhesives 20b and 20c applied to both sides of the second base sheet 20a. The 2nd base material sheet 20a is comprised from the PET resin film, for example like the 1st base material sheet 16a of the 1st double-sided adhesive sheet 16. FIG. The adhesives 20b and 20c are acrylic resin adhesives mainly composed of an acrylic resin, like the adhesive 16c of the first double-sided adhesive sheet 16.

  As shown in FIG. 3, the polishing pad laminate 10 fixed on the polishing surface plate 12 configured as described above is bonded to the polishing surface plate 12 of the polishing apparatus 30 by the CMP method. Thus, when used for polishing the semiconductor wafer 34 which is the object to be polished, for example, an acidic oxidizing agent aqueous solution having a pH of 5 or less is supplied. In FIG. 3, the polishing apparatus 30 is provided with a polishing surface plate 12 rotatably supported around a vertical axis C <b> 1, and the polishing surface plate 12 is driven by a surface plate driving motor 32. , And is driven to rotate in one rotation direction indicated by an arrow in the figure. The polishing pad laminate 10 of this embodiment is attached to the upper surface of the polishing surface plate 12, that is, the surface to which the semiconductor wafer 34 is pressed.

  On the other hand, at a position eccentric from the axis C1 on the polishing surface plate 12, a workpiece holding member 36 that holds a semiconductor wafer 34 such as an SiC wafer on the lower surface by suction or using a holding frame or the like rotates around the axis C2. The workpiece holding member 36 is arranged so as to be movable in the direction of the axis C2. The workpiece holding member 36 is indicated by an arrow in FIG. 3 by a workpiece driving motor (not shown) or a rotational moment received from the polishing surface plate 12. It can be rotated in the direction of rotation.

  The semiconductor wafer 34 is held on the lower surface of the work holding member 36, that is, the surface facing the polishing pad stack 10, and the semiconductor wafer 34 is pressed against the polishing pad stack 10 with a predetermined load. Further, a dripping nozzle 38 and / or a spray nozzle 40 are provided in the vicinity of the work holding member 36 of the polishing apparatus 30, and the polishing liquid 42, which is an oxidizing aqueous solution sent from a tank (not shown), is supplied to the polishing surface plate. 12 is supplied.

  In FIG. 3, an adjustment tool holding member (not shown) arranged so as to be rotatable about an axis parallel to the axis C <b> 1 of the polishing surface plate 12 and movable in the direction of the axis and the radial direction of the polishing surface plate 12. Also, a polishing body adjusting tool (conditioner) such as a diamond wheel (not shown) attached to the lower surface of the adjusting tool holding member, that is, the surface facing the polishing pad laminate 10 is omitted.

  When polishing by the CMP method by the polishing apparatus 30, the polishing surface plate 12, the polishing pad laminate 10 attached thereto, the work holding member 36 and the semiconductor wafer 34 held on the lower surface thereof are driven by a surface plate. The polishing liquid 42 is supplied onto the surface of the polishing pad 14 from the dropping nozzle 38 and / or the spray nozzle 40 while being rotated around the respective axis centers by the motor 32 and the work drive motor, while being applied to the work holding member 36. The held semiconductor wafer 34 is pressed against the polishing pad laminate 10. By doing so, the surface to be polished of the semiconductor wafer 34, that is, the surface facing the polishing pad laminate 10, is chemically supplied by the polishing liquid 42, and is contained in the polishing pad 14 and supplied from the polishing pad 14. It is polished flat by the mechanical polishing action by the abrasive particles. For example, silica having an average particle diameter of about 80 nm is used for the abrasive particles. Further, as the polishing liquid 42, for example, one having an oxidation-reduction potential of 500 to 1020 (Eh) and a hydrogen ion concentration pH of about 4.5 to 5.5 is used.

  According to the polishing pad laminate 10 of the present embodiment, the polishing pad 14 in which a large number of abrasive particles are included in the continuous air holes in the base resin is formed on both surfaces of the first base sheet (base sheet) 16a. Is bonded to the support 22 via a first double-sided sheet (surface adhesive sheet) 16 coated with an adhesive on at least the polishing pad 14 side, and the polishing pad 14 side of both surfaces of the first base sheet 16a. The adhesive 16b applied to is composed mainly of a polymer material whose main chain is a chain having a binding energy of 100 kcal / mol or more. As a result, the adhesive 16b is formed under the polishing pad 14 as a main component of a polymer material having a chain having a binding energy of 100 kcal / mol or more as a main chain, and having excellent chemical resistance and tackiness. However, even if an acidic oxidizing agent aqueous solution is used as the polishing liquid 42, it is chemically stable and does not deteriorate. Therefore, peeling is preferable at the interface between the polishing pad 14 and the first double-sided adhesive sheet 16. To be suppressed.

  Further, according to the polishing pad laminate 10 of the present example, the adhesive 16b applied to the polishing pad 14 side of the first base sheet 16a is composed mainly of a polymer material having a siloxane bond as the main chain. Therefore, it is composed mainly of a polymer material having a main skeleton of a chain having a binding energy of 100 kcal or more, and is chemically stable even when an acidic oxidizer aqueous solution is used as a polishing liquid. Therefore, the peeling is preferably suppressed at the interface between the polishing pad 14 and the first double-sided adhesive sheet 16.

  Further, according to the polishing pad laminate 10 of the present embodiment, the adhesive 16b applied to the polishing pad 14 side of the first double-sided adhesive sheet 16 is a silicone resin adhesive, so that it is acidic oxidized as a polishing liquid. Even if an aqueous solution of the agent is used, it is chemically stable and does not deteriorate, so that peeling is suitably suppressed at the interface between the polishing pad 14 and the first double-sided adhesive sheet 16.

  Further, according to the polishing pad laminate 10 of the present embodiment, an acidic oxidizer aqueous solution is used as the polishing liquid 42 on the polishing pad 14 during polishing using the polishing pad laminate 10 bonded to the polishing surface plate 12. However, since the adhesive 16b applied to the polishing pad 14 side of the first double-sided adhesive sheet 16 is chemically stable and does not deteriorate, at the interface between the polishing pad 14 and the first double-sided adhesive sheet 16 Peeling is suitably suppressed.

  Further, the polishing pad laminate 10 of the present embodiment includes a first double-sided adhesive sheet (surface adhesive sheet) 16 in which an adhesive 16b is applied to at least the polishing pad 14 side of both surfaces of the first base material sheet 16a. Since the adhesive 16b applied to the polishing pad 14 side of both surfaces of the first base sheet 16a is an adhesive layer that contacts the polishing pad 14, the first double-sided adhesive sheet 16 can be used easily. The polishing pad laminate 10 can be assembled.

  In addition, the polishing pad laminate 10 of this example includes the adhesives 20b and 20c applied to both surfaces of the second base sheet 20a and the second base sheet 20a, which are bonded onto the polishing surface plate 12. A first double-sided adhesive sheet 16 having a second double-sided adhesive sheet 20, a cushion layer 18, adhesives 16b and 16c applied to both sides of the first base sheet 16a, and a first base sheet 16a, and polishing The pad 14 is laminated in order, and the adhesive 16b applied to the surface on the polishing pad 14 side of both surfaces of the first base material sheet 16a is an adhesive layer in contact with the polishing pad 14. Accordingly, the polishing pad laminate 10 can be easily assembled by using the second double-sided adhesive sheet 20 and the first double-sided adhesive sheet 16. Further, by interposing the cushion layer 18 between the second double-sided adhesive sheet 20 and the first double-sided adhesive sheet 26, it is possible to achieve both flattening and smoothing of the polished surface.

  In the following, another embodiment of the present invention will be described. In the following description, parts common to those in the above-described embodiment are denoted by the same reference numerals and description thereof is omitted.

(Example 2)
FIG. 4 is a schematic view illustrating a cross-sectional configuration of a polishing pad laminate 50 according to another embodiment. 4, the polishing pad laminate 50 includes a second double-sided adhesive sheet 20 coated with adhesives 20b and 20c applied on both sides of the second base sheet 20a, a cushion layer 18, and a first base sheet. A first double-sided adhesive sheet 16 having adhesives 16c and 16d applied to both sides of 16a and a first base sheet 16a, and an adhesive 52b applied to one side of the third base sheet 52a on the polishing pad 14 side The single-sided adhesive sheet 52 having the third base material sheet 52a and the polishing pad 14 are sequentially bonded and laminated on the polishing surface plate 12. In the present embodiment, since the adhesive 52b applied to one surface of the third base sheet 52a on the polishing pad 14 side is an adhesive layer that comes into contact with the polishing pad 14, the second adhesive in the polishing pad laminate 10 of the first embodiment. Similar to the adhesive 16b of the one-sided adhesive sheet 16, it is made of a silicone resin adhesive. Moreover, the 3rd base material sheet 52a is comprised, for example from the PET film. In the polishing pad laminate 50 of the present embodiment, the adhesive 16d applied to the surface of the polishing pad 14 of the first base sheet 16a of the first double-sided adhesive sheet 16 is the same acrylic resin as the adhesive 16c. It is an adhesive.

  According to the polishing pad laminate 50 of this example, a polymer material having a chain having a bond energy of 100 kcal / mol or more, that is, a polymer having a siloxane bond as a main skeleton, below the polishing pad 14. Since the adhesive 52b, which is composed of a silicone resin adhesive having a main component and is excellent in chemical resistance and tackiness, is located, as in the above-described embodiment, the acidic oxidation is used as the polishing liquid 42. Even if an aqueous solution of the agent is used, it is chemically stable and does not deteriorate, so that peeling is suitably suppressed at the interface between the polishing pad 14 and the first double-sided adhesive sheet 16.

  5, 6, and 7 show conventional polishing pad laminates 60, 70, and 80. In the polishing pad laminate 60 shown in FIG. 5, the first double-sided adhesive sheet 16 in which adhesives 16 c and 16 d are applied to both surfaces of the first base sheet 16 a and the polishing pad 14 are disposed on the polishing surface plate 12. They are bonded and laminated in order. In this polishing pad laminate 60, the adhesive 16d applied to the surface of the polishing pad 14 of the first base sheet 16a of the first double-sided adhesive sheet 16 is an acrylic resin adhesive similar to the adhesive 16c.

  The polishing pad laminate 70 shown in FIG. 6 includes a second double-sided adhesive sheet 20 in which adhesives 20b and 20c are applied to both sides of the second base sheet 20a, the cushion layer 18, and both sides of the first base sheet 16a. A first double-sided adhesive sheet 16 coated with adhesives 16c and 16d and a polishing pad 14 are sequentially bonded and laminated on the polishing surface plate 12. Also in this polishing pad laminate 70, the adhesive 16d applied to the surface of the polishing pad 14 of the first base sheet 16a of the first double-sided adhesive sheet 16 is an acrylic resin adhesive similar to the adhesive 16c. .

  The polishing pad laminate 80 shown in FIG. 7 includes a second double-sided adhesive sheet 20 in which adhesives 20b and 20c are applied to both sides of the second base sheet 20a, a cushion layer 18, and both sides of the first base sheet 16a. The first double-sided adhesive sheet 16 coated with the adhesives 16c and 16d and the urethane-based hot melt adhesive 82 are sequentially adhered and laminated on the polishing surface plate 12.

  Each of the conventional polishing pad laminates 60, 70, 80 has a polymer structure having a chain having a bond energy of 100 kcal / mol or more, that is, a siloxane bond as a main skeleton on the lower side of the polishing pad 14. CMP method using an aqueous solution of an acidic oxidant as the polishing liquid 42 because an adhesive layer having a high chemical resistance and tackiness is not provided. In this polishing process, the occurrence of peeling of the polishing pad 14 was inevitable.

  The preferred embodiments of the present invention have been described in detail with reference to the drawings. However, the present invention is not limited to these embodiments, and may be implemented in other modes.

  For example, in the above-described embodiment, the silicone-based resin adhesives 16b and 52b are disposed as a part of the first double-sided adhesive sheet 16 and the single-sided adhesive sheet 52 on the lower side of the polishing pad 14. It may be arranged as.

  In the above-described embodiment, the polishing pad laminates 10 and 50 are used for polishing the entire surface of the semiconductor wafer 34 such as a Si wafer or a SiC wafer, which is the object to be polished. Pad laminates 10 and 50 may be used, for example, for polishing the outer peripheral end surface of semiconductor wafer 34, the back surface of a semiconductor wafer with a pattern, and glass substrates for various electronic devices. That is, even if it is such a to-be-polished object, the kind of to-be-polished object will not be ask | required if the effect of this invention can be enjoyed.

  It should be noted that the above description is merely an embodiment, and other examples are not illustrated. However, the present invention is implemented in variously modified and improved modes based on the knowledge of those skilled in the art without departing from the spirit of the present invention. Can do.

DESCRIPTION OF SYMBOLS 10, 50: Polishing pad laminated body 12: Polishing surface plate 14: Polishing pad 14a: Base material resin 14b: Continuous ventilation hole 14c: Polishing particle 16: 1st double-sided adhesive sheet 16b, 52b: Silicone resin adhesive (adhesive, Adhesive layer)
18: Cushion layer 20: Second double-sided adhesive sheet 42: Acidic oxidizer aqueous solution 52: Single-sided adhesive sheet

Claims (6)

A polishing pad laminate in which a plurality of layers including a polishing pad containing a large number of abrasive particles in a continuous vent hole in a base material resin as the uppermost layer are laminated via a plurality of adhesive layers and adhered onto a polishing surface plate Because
The adhesive used for the adhesive layer in contact with the polishing pad among the plurality of adhesive layers contains, as a main component, a polymer material having a chain having a binding energy of 100 kcal / mol or more as a main chain. Polishing pad laminate. The polishing pad laminate according to claim 1, wherein the adhesive used for the adhesive layer in contact with the polishing pad is composed mainly of a polymer material having a siloxane bond as a main chain. 3. The polishing pad laminate according to claim 1, wherein the adhesive used for the adhesive layer in contact with the polishing pad is composed of a silicone-based resin adhesive. The acidic oxidizer aqueous solution is supplied onto the polishing pad during polishing using the polishing pad laminate bonded onto the polishing surface plate. 4. Polishing pad laminate. The polishing pad laminate includes a second double-sided adhesive sheet having a second base material sheet and an adhesive applied to both surfaces of the second base material sheet, a cushion layer, a first base material sheet, and the first base material sheet. A first double-sided adhesive sheet having an adhesive applied to both sides of a base sheet, and the polishing pad are sequentially laminated on the polishing surface plate;
The polishing according to any one of claims 1 to 4, wherein the adhesive applied to the surface on the polishing pad side of both surfaces of the first base sheet is an adhesive layer in contact with the polishing pad. Pad laminate. The polishing pad laminate includes a second double-sided adhesive sheet having a second base material sheet and an adhesive applied to both surfaces of the second base material sheet, a cushion layer, a first base material sheet, and the first base material sheet. One side having a first double-sided adhesive sheet having an adhesive applied to both sides of the base sheet, a third base sheet and an adhesive applied to one side of the third base sheet on the polishing pad side The adhesive sheet and the polishing pad are laminated in order on the polishing surface plate,
The polishing pad laminate according to any one of claims 1 to 4, wherein the adhesive applied to one surface of the third base sheet on the polishing pad side is an adhesive layer in contact with the polishing pad. .