JP2019145609A - Coil-equipped substrate and manufacturing method thereof - Google Patents

Abstract

To provide a coil-equipped substrate and a manufacturing method thereof capable of reducing the number of components and stably and easily attaching a coil bobbin around which a coil wire is wound to a substrate.SOLUTION: In a coil-equipped substrate 1 in which a coil bobbin 20 around which a coil wire 40 is wound is attached to a substrate 50, the substrate 1 is provided with an attachment portion to which a coil bobbin 20 is attached and a pad 54 to which one end portion of the coil wire 40 is connected. The coil bobbin 20 is provided with a fixing portion 30 for fixing one end portion of the coil wire 40 to the position of the pad 54 of the substrate 50, and the one end portion of the coil wire 40 is electrically connected to the pad 54 of the substrate 50 by a bonding material.SELECTED DRAWING: Figure 2

Description

The present invention relates to a substrate with a coil and a method for manufacturing the substrate with a coil. More specifically, the present invention relates to a substrate with a coil suitable for attaching a coil bobbin around which a coil wire is wound to the substrate, and a method for manufacturing the substrate with a coil.

Conventionally, as various sensors, an apparatus in which a coil bobbin around which a coil wire is wound is connected to a circuit board (printed board) is used.

For example, Patent Document 1 discloses a coil device in which an L-shaped terminal pin (carage pin) attached to a coil bobbin is inserted into a terminal hole of a circuit board and soldered.

Further, Patent Document 2 discloses a proximity switch including an electromagnetic coil in which a coil lead wire is wound around an L-shaped conductive terminal (carragage pin), and the tip of the conductive terminal is a circuit board. It is inserted into the terminal hole and soldered.

JP 2010-034339 A JP-A-8-306285

However, as described in Patent Documents 1 and 2, in the method of connecting a coil to a circuit board via a carrageen pin, the number of parts increases by the amount of the carrageen pin. Further, the method of inserting the L-shaped carragage pin into the terminal hole makes it difficult to attach the coil to the circuit board from a direction other than the normal direction of the main surface of the circuit board. Further, in the coil device described in Patent Document 1, since the carragage pin is only inserted into the coil bobbin and is not fixed, it is difficult to ensure the relative positional accuracy between the coil bobbin and the circuit board.

On the other hand, as shown in FIG. 20, a method of directly soldering and connecting the coil to the circuit board without using the carage pin is also conceivable, but there is room for improvement in the following points. That is, as in the lower coil 113 in FIG. 20, a method of soldering each end portion 141 of the coil wire inserted into the connection hole 156 of the circuit board 150 onto the corresponding pad 154 of the circuit board 150 Then, since each edge part 141 of a coil wire will leave | separate easily from the corresponding pad 154, it cannot solder stably. Further, as in the case of the upper coil 113 in FIG. 20, if each end portion 141 of the coil wire inserted into the connection hole 156 is fixed with a tape or hand and soldered, each end portion 141 is separated from the corresponding pad 154. However, in such a method, since the position of each end 141 of the coil wire cannot be fixed in a stable state, the attachment and connection of the coil cannot be automated.

The present invention has been made in view of the above-described present situation, and can reduce the number of components, and can also stably and easily attach a coil bobbin around which a coil wire is wound to a substrate with a coil and a coil An object of the present invention is to provide a method for manufacturing a substrate.

The present invention is a substrate with a coil in which a coil bobbin around which a coil wire is wound is attached to a substrate, and the substrate has an attachment portion to which the coil bobbin is attached and a contact point to which one end of the coil wire is connected. The coil bobbin is provided with a fixing portion that fixes one end of the coil wire to the position of the contact portion of the substrate, and the one end of the coil wire is bonded to the substrate by the bonding material. It is electrically connected to the contact portion.

Further, the present invention is the above invention, wherein the substrate has a planar shape in which a protruding portion is provided at one end, the mounting portion is the protruding portion, and the coil bobbin is inserted into the protruding portion. It is characterized by being attached.

Further, in the present invention according to the above invention, the fixing portion has a pair of protrusions protruding at a predetermined interval, and one end of the coil wire is wound around the pair of protrusions. Features.

Further, in the present invention according to the above invention, one end of the coil wire is wound around one of the pair of protrusions and is passed from the substrate side of the one protrusion to the other of the pair of protrusions. The other projection is wound from the substrate side.

Moreover, the present invention is characterized in that, in the above-mentioned invention, one end of the coil wire is wound around the pair of protrusions in an 8-shape.

Moreover, the present invention is characterized in that, in the above-mentioned invention, one end of the coil wire is wound around the pair of protrusions in an annular shape.

Moreover, the present invention is characterized in that, in the above-mentioned invention, the fixing portion has one protrusion, and one end of the coil wire is wound around the one protrusion.

Further, the present invention is a method of manufacturing a substrate with a coil in which a coil bobbin around which a coil wire is wound is attached to the substrate, wherein the coil wire is wound around the coil bobbin and the coil bobbin is fixed to the coil bobbin. Fixing the one end of the wire, attaching the coil bobbin wound with the coil wire to the attachment portion of the substrate such that the one end of the coil wire is located at the contact portion of the substrate, And a step of electrically connecting one end portion of the coil wire to the contact portion of the substrate by a bonding material.

According to the substrate with a coil and the method for manufacturing the substrate with a coil of the present invention, the number of components can be reduced, and the coil bobbin around which the coil wire is wound can be stably and easily attached to the substrate.

FIG. 3 is a schematic perspective view of an oscillation coil and a reception coil provided in the coil-attached substrate according to the first embodiment. It is a perspective schematic diagram of the board | substrate with a coil which concerns on Embodiment 1, and shows the state before soldering an oscillation coil to a circuit board. It is a schematic diagram of the coil bobbin with which the board | substrate with a coil which concerns on Embodiment 1 is equipped, (a) is a top view, (b) is a perspective view. FIG. 3 is a schematic plan view of an oscillation coil provided in the coiled substrate according to the first embodiment. It is a plane schematic diagram of the circuit board of the board | substrate with a coil which concerns on Embodiment 1, (a) shows one main surface in which the receiving coil was mounted, (b) shows the other main surface in which the pad was formed. . It is a perspective schematic diagram of the board | substrate with a coil which concerns on Embodiment 1, and shows the state before inserting an oscillation coil in the edge part of a circuit board. It is a perspective schematic diagram of the board | substrate with a coil which concerns on Embodiment 1, and shows the state after soldering an oscillation coil to a circuit board. It is a schematic diagram of the coil bobbin with which the board | substrate with a coil which concerns on Embodiment 2 is equipped, (a) is a top view, (b) is a perspective view. FIG. 5 is a schematic plan view of an oscillation coil provided on a substrate with a coil according to a second embodiment. It is a plane schematic diagram of the board | substrate with a coil which concerns on Embodiment 2, and shows the state before soldering an oscillation coil to a circuit board. It is a perspective schematic diagram of the board | substrate with a coil which concerns on Embodiment 2, and shows the state after soldering an oscillation coil to a circuit board. It is a perspective schematic diagram which showed the connection part of the oscillation coil and circuit board in the board | substrate with a coil which concerns on Embodiment 2, and shows the state of the coil wire before soldering. It is another perspective schematic diagram which showed the connection part of the oscillation coil and circuit board in the board | substrate with a coil which concerns on Embodiment 2, and shows the state of the coil wire before soldering. FIG. 10 is a schematic perspective view illustrating a connection portion between an oscillation coil and a circuit board in a coil-equipped substrate according to a modification of the second embodiment. 10 is a schematic cross-sectional view of an oscillation coil provided in a substrate with a coil according to another modification of Embodiment 2. FIG. It is a plane schematic diagram of the oscillation coil with which the board | substrate with a coil which concerns on the modification of this invention is equipped. It is a plane schematic diagram of the oscillation coil with which the board | substrate with a coil which concerns on another modification of this invention is equipped. It is a plane schematic diagram of the oscillation coil with which the board | substrate with a coil which concerns on another modification of this invention is equipped. It is a plane schematic diagram of the oscillation coil with which the board | substrate with a coil which concerns on another modification of this invention is equipped. It is a perspective schematic diagram of the board | substrate with a coil which concerns on a comparison form.

DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of a substrate with a coil and a method for manufacturing a substrate with a coil according to the present invention will be described with reference to the drawings. Although the use of the board | substrate with a coil which concerns on this invention is not specifically limited, It is one of the preferable aspects utilized for the magnetic detection apparatus (magnetic sensor) which detects the magnetic characteristic of a coin. Hereinafter, the present invention will be described by taking as an example a magnetic detection device including a substrate with a coil according to the present invention.

(Embodiment 1)
The magnetic detection device according to this embodiment includes a substrate with a coil. The magnetic detection device according to the present embodiment is provided in a coin identification device (coin identification sensor) for performing denomination identification of coins, and the coin identification device performs processing such as counting of coins. Mounted on a coin processor. The magnetic detection device according to the present embodiment detects a magnetic characteristic of a coin, applies a magnetic field by an oscillating coil to a coin conveyed through a conveyance path of the coin identification device, and generates an electromagnetic wave generated in a receiving coil by the magnetic field. An output signal based on the guidance is output to the coin identifying device.

As shown in FIG. 1, the coiled substrate 1 according to the present embodiment includes a plurality of mutual induction type coils having one channel on the primary side and multiple channels on the secondary side, and an oscillation coil (primary coil) 11. And a plurality of receiving coils (secondary coils) 12. The oscillating coil 11 and the receiving coil 12 are arranged above or below the transport path P of the coin C provided in the coin processor (the lower case is shown in FIG. 1), and the coin C is transported through the transport path P. Then, each receiving coil 12 outputs an output signal based on the induced voltage induced by the magnetic field generated by the oscillation coil 11 in the transport path P.

Coins C are transported one by one on the transport path P one by one by transport means (fins, transport belts, etc.) of the coin processor. The coin C slides on the conveyance surface that supports the lower surface of the coin C on the conveyance path P in a state where the coin C is shifted to one end Pa of the conveyance path P. The coin C may be transported in any transport direction indicated by the double arrows in FIG.

The plurality of receiving coils 12 are arranged in a direction intersecting with the coin C conveying direction, preferably in a direction orthogonal thereto. The receiving coils 12 are arranged in one or a plurality of rows (in the case of one row in FIG. 1) in parallel with the transport surface. As described above, the plurality of receiving coils 12 are arranged above or below the conveyance path P in a direction intersecting the conveyance direction of the coins C, so that the plurality of reception coils 12 are magnetized in the coins C to be conveyed. A signal related to characteristics (magnetic signal) can be output for each of a plurality of areas. That is, it is possible to improve the resolution in the direction intersecting with the coin C conveyance direction.

Each receiving coil 12 is a wire-wound chip inductor and is wound around a core (not shown). The oscillation coil 11 is wound so as to surround the plurality of reception coils 12 and their cores, and the core for each reception coil 12 also functions as the core of the oscillation coil 11.

As shown in FIG. 2, the substrate with coil 1 has a structure in which a rectangular tube-shaped coil bobbin 20 around which a coil wire 40 is wound is inserted and attached to an end of a circuit substrate 50 on which the receiving coil 12 is mounted. ing. Both ends of the coil wire 40 at the start of winding and at the end of winding are wound around the protrusions 31 of the coil bobbin 20 as the fixing portion 30. The coil wire 40 wound around the coil bobbin 20 functions as the oscillation coil 11.

As shown in FIGS. 3A and 3B, the coil bobbin 20 has a rectangular tube-shaped main body portion 21, and the main body portion 21 is a narrow flange provided at the front end and the rear end in the axial direction. It has the part 22 and 23, and the strip | belt-shaped recessed part 24 pinched | interposed by the flange parts 22 and 23. FIG. The recess 24 is provided in an annular shape (for one turn) on the peripheral surface of the main body 21. Two notches 25 are formed in the flange 23 on the rear end side in the axial direction. From these cutout portions 25, projections (claws) 31 are projected in the axial direction one by one. The main body portion 21 of the coil bobbin 20 has a rectangular cross section orthogonal to the axial direction, and the two protrusions 31 are arranged at predetermined positions relative to the axial center line L of the longitudinal surface of the main body portion 21. It is provided by a distance of. Each protrusion 31 has a flat plate shape that is long in the axial direction, and is connected to the recess 24 via the notch 25 without a step. The coil bobbin 20 is integrally formed of an insulating material such as an insulating synthetic resin.

As shown in FIG. 4, a coil portion 42 that functions as the oscillation coil 11 is formed by winding the coil wire 40 around the recess 24 of the coil bobbin 20 with a certain tension. Both end portions 41 of the coil wire 40 connected to both ends of the coil portion 42 are drawn out and wound around the protruding portion 31 provided at the tip thereof from another notch portion 25. In this way, each end 41 of the coil wire 40 is fixed to the corresponding protrusion 31. Each protrusion 31 is constricted in the middle in the axial direction, and the coil wire 40 is wound around the constricted portion.

In this embodiment, the coil wire 40 is wound around the coil bobbin 20 in a state where tension is applied from one end to the other end, and there is no need to provide slack. Therefore, the winding operation of the coil wire 40 around the coil bobbin 20 can be automated.

As shown in FIGS. 5A and 5B, the circuit board (printed board) 50 has a planar shape in which one side of a rectangular board is formed in a convex shape and a protruding portion 52 is provided at one end 51. Have. Various wiring patterns (not shown) are provided on both main surfaces of the circuit board 50, and the receiving coil 12 that is a chip inductor, and electronic components that constitute a predetermined electronic circuit such as an oscillation circuit and a signal processing circuit (Not shown except the receiving coil 12) is mounted. As shown in FIG. 5A, the plurality of receiving coils 12 are arranged at equal intervals on the protrusions 52 of the circuit board 50. As shown in FIG. 5B, two pads (terminals) 54 are formed as contact portions 53 on the main surface on the side where the receiving coil 12 is not provided. The two pads 54 are provided at positions corresponding to the two protrusions 31 of the coil bobbin 20, and are provided at an interval similar to the interval between the two protrusions 31. Each pad 54 is surface-treated with a solder leveler, preflux or the like. The protruding portion 52 of the circuit board 50 functions as an attachment portion 55 to which the coil bobbin 20 is attached.

In the above configuration, as shown in FIG. 6, the protrusion 31 is on the pad 54 side, and the coil bobbin 20 around which the coil wire 40 is wound is fitted in the protruding portion 52 on which the receiving coil 12 is mounted with some play. . Then, as shown in FIG. 2, each protrusion 31 of the coil bobbin 20 and the end 41 of the coil wire 40 wound therearound are positioned on the corresponding pad 54. Then, as shown in FIG. 7, using solder 61 as the bonding material 60, both ends 41 of the coil wire 40 wound around the protrusion 31 are soldered to the pads 54 to be electrically connected and fixed. To do. Further, an adhesive (not shown) is injected into the gap between the coil bobbin 20 and the circuit board 50 to fix it more firmly. Thereby, the board | substrate 1 with a coil is completed.

In the case where the coil bobbin 20 is formed of a synthetic resin, when the both end portions 41 of the coil wire 40 are soldered to the pads 54, the protrusions 31 are usually deformed by heat. However, there is no particular problem with the electrical connection and fixing of the coil wire 40 to the circuit board 50. Further, in the present embodiment, since both end portions 41 of the coil wire 40 are soldered to the circuit board 50 together with the protrusions 31 of the coil bobbin 20, the coil bobbin 20 and the circuit board 50 are not fixed with an adhesive as described above. Even in such a case, the oscillation coil 11 can be fixed to the circuit board 50.

Although the manufacturing method (assembly method) of the substrate with coil 1 according to the present embodiment has already been mentioned, it will be described again here.

First, as described above, the coil wire 40 is wound around the coil bobbin 20, and each end portion 41 of the coil wire 40 is fixed to the corresponding protrusion 31 (fixed portion 30) of the coil bobbin 20. Thereby, the coil part 42 which functions as the oscillation coil 11 is formed, and each end part 41 of the coil wire 40 is fixed at a predetermined position. Although this step can be performed manually, as described above, it is preferable to automate it with an automatic winding device or the like. The order of forming the coil portion 42 and fixing the end portions 41 of the coil wire 40 to the corresponding protrusions 31 is not particularly limited and can be set as appropriate.

Next, the coil bobbin 20 around which the coil wire 40 is wound is placed on the protruding portion 52 (on the circuit board 50 so that each end 41 of the coil wire 40 is positioned on the corresponding pad 54 (contact point 53) of the circuit board 50. It attaches to the attachment part 55). At this time, the position of each end 41 of the coil wire 40 is fixed by the corresponding protrusion 31 (fixed portion 30). It is not necessary to fix the position of each end 41.

Then, each end portion 41 of the coil wire 40 is electrically connected to the corresponding pad 54 (contact portion 53) by the solder 61 (bonding material 60). At this time, the position of each end 41 of the coil wire 40 is fixed by the corresponding protrusion 31 (fixed portion 30), so that each end 41 of the coil wire 40 corresponds to the corresponding pad 54 (contact point). Part 53) can be connected stably and easily. Further, each end portion 41 of the coil wire 40 can be directly connected to the corresponding pad 54 (contact portion 53) without using another conductive member such as a carragage pin. Therefore, the number of parts can be reduced.

Thereafter, if necessary, the coil bobbin 20 is more firmly fixed to the circuit board 50 using an adhesive as described above. As a result, the coiled substrate 1 according to the present embodiment is completed.

(Embodiment 2)
In the present embodiment, features unique to the present embodiment will be mainly described, and the description overlapping with the first embodiment will be omitted. Moreover, in this embodiment and Embodiment 1, the same code | symbol is attached | subjected to the member which has the same or the same function, and description of the member is abbreviate | omitted in this embodiment.

As shown in FIGS. 8A and 8B, in this embodiment, a pair of protrusions 32 protrude from a pair of end portions of the flange portion 23 located on both sides of each notch portion 25. The pair of protrusions 32 is provided with a gap 33 having a predetermined size. Each protrusion 32 has a flat plate shape that is long in the axial direction, and is connected to the recess 24 through the notch 25 without a step.

As shown in FIG. 9, both end portions 41 of the coil wire 40 are respectively drawn out from the notch portions 25 to the pair of protrusion portions 32 and are wound around and fixed to the pair of protrusion portions 32. Each protrusion 32 is constricted in the axially intermediate portion on the side opposite to the gap 33, and the coil wire 40 is wound around the constricted portion.

In the above configuration, the protrusion 32 is on the pad 54 side, and the coil bobbin 20 around which the coil wire 40 is wound is fitted in the protruding portion 52 on which the receiving coil 12 is mounted with some play. Then, as shown in FIG. 10, the pair of protrusions 32 are positioned on both sides of the pad 54, and both end portions 41 of the coil wire 40 wound around the pair of protrusions 32 are positioned on the pad 54. . Then, as shown in FIG. 11, solder 61 is used as the bonding material 60, and both ends 41 of the coil wire 40 wound around the pair of protrusions 32 are soldered to the pads 54 to be electrically connected. Fix together. At this time, each end 41 of the coil wire 40 is soldered to the pad 54 alone, not to each protrusion 32. Then, an adhesive (not shown) is injected into the gap between the coil bobbin 20 and the circuit board 50 to fix it more firmly. In this embodiment, since each protrusion 32 is not fixed with the solder 61, it is preferable to fix the coil bobbin 20 to the circuit board 50 using an adhesive in this way.

In this embodiment, since both ends 41 of the coil wire 40 are wound around the pair of protrusions 32, respectively, the solder wire can be soldered with a gap 33 between the pair of protrusions 32. Thus, the oscillation coil 11 can be attached to the circuit board 50 more easily.

However, each end 41 of the coil wire 40 is wound around the corresponding pair of protrusions 32 in an annular manner, and soldered from the front side of the pad 54, as shown in FIG. 12 is pushed and fixed toward the pad 54 in the state as shown in FIG. 12, there is a concern that the protrusions 32 on both sides thereof are pulled inward and cracked or broken. Further, as shown in FIG. 13, a force is always applied to the coil wire 40 opposite to the pad 54 in a direction away from the circuit board 50, so that the solder 61 is peeled off or a crack is generated in the solder 61. There is concern.

On the other hand, if a sufficient interval between the pair of protrusions 32 can be secured, only the coil wire 40 on the pad 54 side can be soldered to the pad 54, and the occurrence of such a problem can be avoided. Can do.

Further, from the viewpoint of effectively preventing the occurrence of such problems, as shown in FIG. 14, the end portions 41 of the coil wire 40 are spanned across the circuit board 50 side of the corresponding pair of protrusions 32. Also good. More specifically, each end 41 of the coil wire 40 is wound around one of the corresponding pair of protrusions 32, and from the circuit board 50 side of the one protrusion 32 to the other of the pair of protrusions 32. It may be passed and wound around the other protrusion 32 from the circuit board 50 side.

Further, as shown in FIG. 15, each end portion 41 of the coil wire 40 may be wound around a pair of corresponding protrusions 32 in a shape of eight. In this case as well, although not as much as shown in FIG. 14, each end 41 of the coil wire 40 can be brought close to the pad 54, so that the occurrence of the above-described problems can be suppressed. This winding method is particularly suitable when each pad 54 is surface-treated with a solder leveler. Since the solder that covers the pad 54 that has been surface-treated with the solder leveler is usually convex, the end 41 of the coil wire 40 is wound in an 8-shape to form a solder that covers the corresponding pad 54. This is because the end portions 41 can be disposed along the coil wire 40 so that an excessive force is not applied to the coil wire 40.

As described above, in the first and second embodiments, each end 41 of the coil wire 40 is fixed at the position of the corresponding contact portion 53 of the circuit board 50 by the fixing portion 30 provided on the coil bobbin 20. It is not necessary to fix the position of each end 41 of the coil wire 40 with a tape or a hand. Therefore, the mounting operation of the coil bobbin 20 around which the coil wire 40 is wound, preferably the soldering operation, can be performed stably and easily. In addition, the mounting operation (soldering operation) can be automated, and the number of assembling steps for the coiled substrate 1 can be reduced.

In the first and second embodiments, each end portion 41 of the coil wire 40 fixed by the fixing portion 30 is electrically connected to the corresponding contact portion 53 by the bonding material 60. The end portions 41 of the coil wires 40 can be directly connected to the corresponding contact portions 53 without using the conductive members. Therefore, it is possible to reduce the number of parts, and it is not necessary to use a heat resistant material for the material of the coil bobbin 20.

In the first and second embodiments, the attachment portion 55 of the circuit board 50 to which the coil bobbin 20 is attached is a protrusion 52 formed at one end 51 of the circuit board 50, and the coil bobbin 20 is inserted into the protrusion 52. Since the coil bobbin 20 is simply inserted into the circuit board 50, each end 41 of the coil wire 40 can be aligned, and the coil bobbin 20 can be attached to the circuit board 50 more easily. Can do.

Further, in the first embodiment, each end 41 of the coil wire 40 is wound around the corresponding one protrusion 31, and therefore each end 41 of the coil wire 40 together with the protrusion 31 is joined by the bonding material 60. A corresponding contact portion 53 can be connected. Therefore, the work of fixing the coil bobbin 20 to the circuit board 50 with an adhesive can be omitted.

In the second embodiment, the fixed portion 30 has two pairs of protrusion portions 32 protruding at a predetermined interval, and each end portion 41 of the coil wire 40 is wound around the corresponding pair of protrusion portions 32. Therefore, each end portion 41 of the coil wire 40 can be electrically connected to the corresponding contact portion 53 by the bonding material 60 through the gap 33 between the corresponding pair of protrusions 32, and the coil wire 40 is wound. The coil bobbin 20 can be attached more easily, and preferably soldered.

In the second embodiment, each end 41 of the coil wire 40 is wound around one of the corresponding pair of protrusions 32, and the pair of protrusions 32 from the circuit board 50 side of the one protrusion 32. Since the other protrusion 32 is wound around the other protrusion 32 from the circuit board 50 side, each protrusion 32 can be prevented from being cracked or broken, and the bonding material 60 can be peeled off or bonded. It is possible to suppress the occurrence of cracks in 60.

In the second embodiment, each end 41 of the coil wire 40 is wound around the corresponding pair of protrusions 32 in the shape of an eight, so that the coil wire 40 is hung on the circuit board 50 side. Although not as much as when handing over, each end 41 of the coil wire 40 can be brought close to the corresponding pad 54, so that the occurrence of the above-described problems can be suppressed.

As mentioned above, although embodiment of this invention was described referring drawings, this invention is not limited to the said embodiment. In addition, the configurations of the respective embodiments may be appropriately combined or changed within a range not departing from the gist of the present invention.

Specifically, for example, in the first and second embodiments, the case where the solder (soft solder) 61 is used as the bonding material 60 is described. However, the type of the bonding material 60 is not particularly limited. The end portions 4 of the coil wires 40 may be brazed to the corresponding contact portions 53, and the end portions 4 of the coil wires 40 are electrically connected to the corresponding contact portions 53 by a conductive adhesive. It may be fixed together.

Moreover, in the said Embodiment 2, when each edge part 41 of the coil wire 40 is wound in parallel with the winding direction of the coil wire 40 in the recessed part 24 between the pair of projection parts 32 which protruded in the axial direction. As shown in FIG. 16, two pairs of projections 34 projecting in a direction orthogonal to the axial direction are provided, and each end 41 of the coil wire 40 is recessed between the corresponding pair of projections 43. 24 may be wound in a direction perpendicular to the winding direction of the coil wire 40. In this case, each end 41 of the coil wire 40 is soldered to a corresponding pad 54 (not shown in FIG. 16) and electrically connected in the gap 35 between the projections 43 of each set.

In the second embodiment, the case where each end portion 41 of the coil wire 40 is connected to the corresponding pad 54 through the gap 33 between the corresponding pair of protrusions 32 has been described. However, as shown in FIG. 24 is provided in the coil bobbin 20 with a step protruding in the axial direction without a step, a notch 37 is provided at a position corresponding to the pad 54 of the extension 36, and each end 41 of the coil wire 40 is connected to these ends 41. You may wind around the overhang | projection part 36 so that the notch part 37 may be straddled. In this case, each end 41 of the coil wire 40 is soldered to a corresponding pad 54 (not shown in FIG. 17) at each notch 37 and electrically connected. Further, as shown in FIG. 18, a protruding portion 38 that protrudes in the axial direction from the concave portion 24 without any step is provided in the coil bobbin 20, a through hole 39 is provided at a position corresponding to the pad 54 of the protruding portion 38, and the coil wire 40 These end portions 41 may be wound around the peripheral portions of the through holes 39 while passing through these through holes 39. In this case, each end 41 of the coil wire 40 is soldered and electrically connected to a corresponding pad 54 (not shown in FIG. 18) around each through hole 39 and / or around it.

Moreover, in the said Embodiment 1, 2, although the structure of the fixing | fixed part 30 which fixes the both ends 41 of the coil wire 40 was mutually demonstrated, those structures may mutually differ. Further, only the structure for fixing one end portion 41 of the coil wire 40 is the structure of any of the above embodiments, and the structure for fixing the other end portion 41 of the coil wire 40 is a conventionally known structure such as a carragage pin. The structure may be fixed to the circuit board 50 via a pin.

Moreover, in the said Embodiment 1, 2, although the case where two fixing | fixed parts 30 were provided in one coil bobbin 20 was demonstrated, the number of the fixing | fixed parts 30 provided in one coil bobbin 20 is not specifically limited, For example, three It may be the above. Specifically, for example, as shown in FIG. 19, three protrusions 31 that protrude from the recess 24 through the corresponding notch 25 in the axial direction without a step may be provided as the fixing portion 30. In this case, one end of another coil wire (not shown in FIG. 19) is wound around the left and right protrusions 31 and fixed, and the middle protrusion 31 is commonly used for the coil wires. Wind and fix the other end of the wire.

Further, in the first and second embodiments, the case where the circuit board (printed board) 50 is used as the board has been described. However, the board is not particularly limited as long as the coil bobbin can be attached. MID (Molded Interconnect Device) may be used, and the present invention may be applied to such a three-dimensional circuit component.

As described above, the present invention is a technique useful for attaching a coil bobbin around which a coil wire is wound to a printed board.

1: Substrate with coil 11: Oscillation coil (primary coil)
12: Receive coil (secondary coil)
20: Coil bobbin 21: Main body part 22, 23: Flange part 24: Concave part 25: Notch part 30: Fixing part 31, 32, 34: Protrusion part 33, 35: Gap 36, 38: Overhang part 37: Notch part 39: Through hole 40: Coil wire 41: End 42: Coil 50: Circuit board 51: One end 52 of the circuit board 52: Projection 53: Contact 54: Pad (terminal)
55: Mounting portion 60: Bonding material 61: Solder C: Coin P: Conveying path Pa: One end L of the conveying path L: Center line in the axial direction

Claims (8)

A coil bobbin around which a coil wire is wound is a substrate with a coil attached to the substrate,
An attachment portion to which the coil bobbin is attached to the substrate;
A contact portion to which one end of the coil wire is connected;
The coil bobbin is provided with a fixing portion that fixes one end of the coil wire to the position of the contact portion of the substrate,
One end of the coil wire is electrically connected to the contact portion of the substrate by a bonding material. The substrate has a planar shape provided with a protruding portion at one end,
The mounting portion is the protruding portion,
The said coil bobbin is inserted and attached to the said protrusion part, The board | substrate with a coil of Claim 1 characterized by the above-mentioned. The fixing portion has a pair of protrusions protruding at a predetermined interval,
3. The substrate with a coil according to claim 1, wherein one end of the coil wire is wound around the pair of protrusions. One end of the coil wire is wound around one of the pair of protrusions and passed from the substrate side of the one protrusion to the other of the pair of protrusions, and the other protrusion is connected to the substrate side. The substrate with a coil according to claim 3, wherein the substrate is wound around. 4. The substrate with a coil according to claim 3, wherein one end portion of the coil wire is wound around the pair of protrusions in a shape of an eight. The substrate with a coil according to claim 3, wherein one end of the coil wire is wound around the pair of protrusions in an annular shape. The fixing portion has one protrusion,
The substrate with a coil according to claim 1 or 2, wherein one end of the coil wire is wound around the one protrusion. A coil bobbin around which a coil wire is wound is a method for manufacturing a substrate with a coil attached to a substrate,
Winding the coil wire around the coil bobbin, and fixing one end of the coil wire to the fixed portion of the coil bobbin;
Attaching the coil bobbin around which the coil wire is wound to the attachment portion of the substrate such that one end portion of the coil wire is positioned at a contact portion of the substrate;
And a step of electrically connecting one end portion of the coil wire to the contact portion of the substrate with a bonding material.

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