JP2019144602A - Information processing apparatus, information processing method, information processing system and information processing program - Google Patents

Abstract

To provide an information processing apparatus capable of reducing calculation time and man-hours required when correcting a thermal circuit network model using reference data.SOLUTION: An information processing apparatus 1 includes an input processing unit 101 that processes input data including reference data for comparing a shape data of equipment to be analyzed, a calculation control condition for analysis, and a physical quantity analysis result, a circuit network generation unit 102 that generates a thermal circuit network model before correction based on input data, an arithmetic processing unit 103 that performs a predetermined analysis with regard to the thermal circuit model before correction, a circuit network correction unit 104 that outputs a thermal circuit network model after correction by comparing the analysis result with the reference data, and a display unit 3 that displays the thermal circuit network model after correction and/or the thermal circuit network model before correction. The circuit network correction unit 104 compares the thermal circuit network model before correction with the thermal circuit network model after correction, obtains a degree of correction in the corrected portion, and displays at least the obtained degree of correction on the display unit 3.SELECTED DRAWING: Figure 1

Description

  The present invention relates to thermal fluid analysis using a computer, and more particularly to an information processing apparatus, information processing method, information processing system, and information processing program suitable for performing thermal fluid analysis by a thermal network method.

  In recent years, many numerical analyzes for the purpose of state prediction and performance estimation have been performed in equipment design, and analysis plays an important role in design development. With the improved performance of CPUs and GPUs (Graphics Processing Units), it has become possible to perform analysis on a personal scale using a personal computer instead of a supercomputer. In addition, many general-purpose analysis software has been developed and marketed, making it possible to perform detailed analysis faithful to actual phenomena. However, there is still a problem that high expertise, a lot of calculation time and power consumption are still required for accurate detailed analysis such as large-scale three-dimensional analysis, combined heat transfer analysis of conduction, convection, and radiation, and unsteady analysis. There is.

  In thermal analysis of electronic devices, a thermal fluid analysis method called a thermal network method has been widely used for many years. In the thermal network method, nodes are set on elements such as parts, thermal conductance is set between the nodes, a thermal network model is created, and simultaneous linear equations obtained from the energy conservation formula between each element are solved. A physical quantity such as temperature is calculated. The thermal network method generally has an advantage that the calculation time can be reduced as compared with the detailed analysis because the analysis is performed with a smaller number of node elements than in the case of the detailed analysis. However, the following difficulties are known for creating a thermal network model from an analysis target model.

  The creation of thermal network models, such as the arrangement of nodes and the calculation of thermal conductance between nodes, is often done manually, so the reliability and accuracy of the analysis model may vary depending on factors such as the analyst's experience. End up. In addition, when the number of parts to be analyzed is large or the structure is complex, the creation of a thermal network model is a heavy burden, and the creation of a thermal network model that can reproduce complex phenomena is not limited to the field of heat transfer engineering or fluid mechanics. High expertise in the field is required. Therefore, while the calculation time for obtaining the solution from the analysis model is short, there is a problem that the work time at the stage of generating the analysis model is large.

  In addition, a technique has been widely used that enables more accurate analysis by correcting parameters of an analysis model by comparing data such as experimental results with analysis results. At this time, in order to compare the measurement value with the analysis value, it is necessary to obtain an analysis value corresponding to the measurement point coordinates. In the case of an analysis method such as the finite element method, since elements having analysis values exist densely, it is easy to obtain an analysis value corresponding to the measurement point coordinates by a method such as interpolation or interpolation. On the other hand, an analysis method with few elements, such as the thermal network method, often increases the distance between the node on the analysis model and the measurement point, and it is difficult to accurately obtain the analysis value corresponding to the measurement point coordinate. It was a problem in comparing the analysis results with the experimental results. In addition, in the method of correcting the parameters of the analysis model by comparing the reference data and the analysis result, there is a problem that a large calculation time is required because the calculation is generally repeatedly performed.

In a thermal analysis method using a thermal network method, for example, a technique described in Patent Document 1 has been proposed as a method for correcting an analysis model by comparing with an experiment. In Patent Document 1, a model integration / compression thermal circuit model generation unit that generates a compression model by reducing the number of parts or modules constituting a large-scale thermal model to only a part or module of a specific target part (decreasing the number of nodes), An arithmetic processing unit that performs thermal analysis of the generated compression model, and compares an experimental result with an analysis result of the compression model by the arithmetic processing unit, and if the difference (error) of the comparison result is within a predetermined range, the compression model And a correlation calculation unit. When the comparison result is out of the predetermined range, the compression model is corrected, a parametric study is performed, and a thermal analysis of a large-scale model is performed.
In Patent Document 2, a component identifier that is information indicating two components, a value of a physical quantity (amount of heat and temperature) transmitted between the two components, and a change in physical quantity regarding the two components change. An image showing an inter-component information storage unit having a state value, a resistance value acquiring unit that acquires resistance values of one or more components using inter-component information, and a transmission path having nodes respectively corresponding to the two or more components The display information is information for displaying a transmission path diagram, which is an image in which information indicating the resistance value is arranged at a node corresponding to one or more components from which the resistance value acquisition unit has acquired the resistance value. A configuration is disclosed that includes a display information generation unit that generates information using inter-component information, and an output unit that outputs display information generated by the display information generation unit. And a characteristic part is highlighted.

JP 2003-344327 A Japanese Patent Laying-Open No. 2015-82267

However, in Patent Document 1, no consideration is given to reducing the number of parameters to be corrected when the compression model is corrected, and there is a risk of increasing the number of work steps due to an increase in the number of correction parameters. May increase the burden of
Further, although Patent Document 2 discloses that a characteristic transmission path is displayed, no consideration is given to reducing the number of parameters to be corrected, and the number of work steps increases due to an increase in the number of correction parameters. May increase the burden on the operator.
Therefore, the present invention provides an information processing apparatus, an information processing method, an information processing system, and an information processing program capable of reducing the calculation time and man-hours required when correcting a thermal network model using reference data. To do.

  In order to solve the above-described problems, an information processing apparatus according to the present invention processes input data including shape data of a device to be analyzed, calculation control conditions for analysis, and reference data for comparison with a physical quantity analysis result. A processing unit, a circuit network generation unit that generates a thermal network model based on the input data, an arithmetic processing unit that performs a predetermined analysis on the generated thermal network model, and an analysis result by the arithmetic processing unit, A network correction unit that compares the reference data, corrects the generated thermal network model, and outputs the corrected thermal network model; and the analysis result, the corrected thermal network model, and / or A display unit for displaying a thermal network model by the circuit network generation unit, and the circuit network correction unit compares the thermal network model by the circuit network generation unit with the corrected thermal network model. , Fix Calculated correction degree in Tokoro, and displaying the corrected degree that at least determined on the display unit.

  The information processing method according to the present invention includes at least a circuit network generation unit that generates a thermal network model and an information processing apparatus that includes a processing unit that performs a predetermined analysis on the thermal network model. Processing the input data including the shape data of the device to be analyzed, the calculation control condition of the analysis, and the reference data for comparison with the analysis result of the physical quantity, and the circuit network generation unit is processed A thermal network model is generated based on the input data, and the arithmetic processing unit performs a predetermined analysis on the generated thermal network model, compares the analysis result by the arithmetic processing unit with the reference data, and Modify the generated thermal network model, output the modified thermal network model, compare the thermal network model generated by the circuit network generation unit with the modified thermal network model, and modify At the place Calculated correction degree that, and displaying the corrected degree that at least determined on the display unit together with the thermal network model after the correction.

  The information processing system of the present invention is an information processing system having an information processing device connected to a plurality of user terminal devices via a network, and the information processing device is connected to the user terminal device via the network. A circuit network generation unit that generates a thermal network model based on input data including reference data for comparison with shape data of an analysis target device, analysis calculation control conditions, and physical quantity analysis results, An arithmetic processing unit that performs a predetermined analysis on the generated thermal network model, compares the analysis result by the arithmetic processing unit and the reference data, corrects the generated thermal network model, A network correction unit that outputs a thermal network model, and the network correction unit includes a thermal network model by the network generation unit and the corrected thermal network model. Compare, obtains a correction degree in the modified location, and transmits to the user terminal apparatus via the network with thermal network model after the correction the correction degree in which at least determined.

  The information processing program according to the present invention includes a function for processing input data including shape data of a device to be analyzed, calculation control conditions for analysis, and reference data for comparison with an analysis result of a physical quantity, and the input data A function of generating a thermal network model based on the function, a function of executing a predetermined analysis on the generated thermal network model, an analysis result of the generated thermal network model and the reference data are compared, and The function of correcting the generated thermal network model and outputting the corrected thermal network model is compared with the generated thermal network model and the corrected thermal network model, and the correction is made at the correction location. And a function of displaying at least the obtained correction degree on the display unit.

  According to the present invention, it is possible to reduce calculation time and man-hours required when correcting a thermal network model using reference data.

  Problems, configurations, and effects other than those described above will be clarified by the following description of embodiments.

1 is an external view and a functional block diagram of an information processing apparatus according to an embodiment of the present invention. FIG. 2 is a functional block diagram of a network generation unit shown in FIG. 1. It is explanatory drawing of the data structure of the physical property value database shown in FIG. It is a functional block diagram of the network correction | amendment part shown in FIG. It is explanatory drawing which shows an example of an analysis object. It is the front view which looked at FIG. 5 from the A direction, and is explanatory drawing which shows an example of an experiment outline. It is explanatory drawing which shows an example of node arrangement | positioning. It is explanatory drawing of the data structure stored in the memory | storage part shown in FIG. It is an example of a thermal network analysis result, and is an explanatory view showing a thermal network model. It is explanatory drawing which shows an example of the thermal network model after correction, and a correction degree. It is explanatory drawing which shows an example of the thermal network model after correction | amendment, and the highlight display of a correction degree. FIG. 2 is a process flow diagram of the information processing apparatus illustrated in FIG. 1. FIG. 2 is a process flow diagram of a network correction unit shown in FIG. 1. It is a figure which shows an example of the screen display of the display part shown in FIG. It is a figure which shows an example of the screen display of the display part shown in FIG. It is explanatory drawing of the reduction effect of the number of parameters which should be corrected by the information processing apparatus shown in FIG. It is a figure which shows an example of the screen display of the display part which comprises the information processing apparatus of Example 2 which concerns on the other Example of this invention. It is explanatory drawing which shows the thermal circuit network model by the information processing apparatus of Example 3 which concerns on the other Example of this invention. It is a whole schematic block diagram of the information processing system of Example 4 which concerns on the other Example of this invention. It is a functional block diagram of the information processing part which comprises the information processing apparatus shown in FIG.

  Embodiments of the present invention will be described below with reference to the drawings.

(Overall configuration of information processing device)
FIG. 1 is an external view and a functional block diagram of an information processing apparatus according to an embodiment of the present invention. As shown in FIG. 1, the information processing apparatus 1 is a keyboard, a mouse, or the like, and compares the shape data (for example, CAD data) of the device to be analyzed, the calculation control condition of the analysis, and the analysis result of the physical quantity. It comprises an input unit 2 that allows an analyst (user) to input reference data for performing, a display unit 3 such as an LCD or an organic EL display, and an information processing unit 4. The information processing unit 4 includes an input processing unit 101, a circuit network generation unit 102, an arithmetic processing unit 103, a circuit network correction unit 104, a display control unit 105, and a storage unit 106, which are mutually connected via an internal bus 107. It is connected. In the present embodiment, a configuration in which the storage unit 106 is provided in the information processing unit 4 of the information processing apparatus 1 will be described as an example, but the configuration is not limited thereto. For example, the storage unit 106 may be connected to the information processing apparatus 1 as an external storage device.

  The input processing unit 101, the circuit network generation unit 102, the arithmetic processing unit 103, the circuit network correction unit 104, and the display control unit 105 include, for example, a processor such as a CPU, a ROM that stores a program, and a program read from the ROM. This is realized by a storage device such as a RAM that temporarily stores data of a process executed by the processor.

The input processing unit 101 is input by an analyst (user) via the input unit 2 to analyze the shape data of the device to be analyzed, the calculation control conditions for the analysis, and the reference data for comparison with the analysis result of the physical quantity (Hereinafter, may be collectively referred to as input data). The input processing unit 101 transfers input data to the circuit network generation unit 102 and the arithmetic processing unit 103 via the internal bus 107.
In addition, the circuit network generation unit 102 generates a thermal circuit network model (hereinafter also referred to as a pre-correction thermal network model) from the input data acquired from the input processing unit 101 via the internal bus 107. The circuit network generation unit 102 transfers the generated pre-correction thermal network model to the arithmetic processing unit 103 and the circuit network correction unit 104 via the internal bus 107.

The arithmetic processing unit 103 has a function of executing a predetermined analysis on the pre-correction thermal network model acquired from the circuit network generation unit 102 via the internal bus 107. The arithmetic processing unit 103 transfers the analysis result for the pre-correction thermal circuit network model to the display control unit 105 via the internal bus 107.
Further, the circuit network correction unit 104 compares the analysis result acquired from the arithmetic processing unit 103 with the reference data acquired from the input processing unit 101 via the internal bus 107, and the thermal circuit acquired from the circuit network generation unit 102. A function to modify the network model and generate a modified thermal network model, and to compare the unmodified thermal network model with the modified thermal network model and obtain the degree of modification for each modification location Have The network correction unit 104 transfers at least the obtained correction degree to the display control unit 105 via the internal bus 107.
(Configuration of network generator)
FIG. 2 is a functional block diagram of the network generation unit 102 shown in FIG. As shown in FIG. 2, the circuit network generation unit 102 includes a component shape processing unit 201, an inter-component structure processing unit 202, a physical property value database 203, and a thermal conductance processing unit 204, which are mutually connected by an internal bus 107a. It is connected. The component shape processing unit 201, the inter-component structure processing unit 202, and the thermal conductance processing unit 204 are, for example, a processor such as a CPU, a ROM that stores a program, data in a process in which the processor executes a program read from the ROM, and the like. This is realized by a storage device such as a RAM that temporarily stores.

The component shape processing unit 201 has a function of reading and processing shape data of components constituting the analysis target from the input processing unit 101. The component shape processing unit 201 transfers the processing result of the component shape data to the inter-component structure processing unit 202 via the internal bus 107a.
The inter-part structure processing unit 202 has a function of processing inter-part structure information such as a contact area based on the processing result acquired from the part shape processing unit 201. The inter-component structure processing unit 202 transfers the processing result of the inter-component structure information to the thermal conductance processing unit 204 via the internal bus 107a.
Details A physical property value database 203 described later stores physical property value information of materials.
The thermal conductance processing unit 204 also includes physical property value information stored in the physical property value database 203, component shape information as a processing result by the component shape processing unit 201, and an inter-component structure as a processing result by the inter-component structure processing unit 202. Based on the information, it has a function of calculating a thermal conductance between nodes and generating a pre-correction thermal network model. The thermal conductance processing unit 204 transfers the generated pre-correction thermal network model to the arithmetic processing unit 103 and the network correction unit 104 via the internal bus 107a. Here, an example in which thermal conductance is used as a coefficient necessary for calculating heat transfer will be described, but the present invention is not limited to this. As a coefficient necessary for calculating heat transfer, thermal resistance or thermal conductance is often used, but other coefficients may be used.
(Data structure of physical property database)
FIG. 3 is an explanatory diagram of the data structure of the property value database 203 shown in FIG. As shown in FIG. 3, the physical property value database 203 includes, for example, “material name”, “density, kg / m ³ ”, “specific heat, J / (kg · K)”, “heat” for each “material number”. Conductivity, W / (m · K) ”,“ total emissivity, − ”,“ kinematic viscosity, m ² / s ”, and“ Prandtl number, − ”are stored in association with each other. Here, the “Prandtl number” (Prandtl number) is a dimensionless physical property value related to heat conduction, and is a ratio between the kinematic viscosity of the fluid and the temperature diffusivity. When the viscosity of the fluid is μ, the specific heat is J, and the thermal conductivity is W, the Prandtl number is expressed by a dimensionless number Pr = μJ / W. The Prandtl number is also expressed as Pr = ν / κ using the kinematic viscosity ν = μ / ρ (ρ is the density of the fluid) and the temperature conductivity κ = W / ρJ.

As shown in FIG. 3, for example, when the “material number” is “1”, the “material name” is “air”, the “density, kg / m ³ ” is “1.1763”, the “specific heat, J / (kg). “K)” is “1007”, “Thermal conductivity, W / (m · K)” is “0.0614”, “Kinematic viscosity, m ² / s” is “1.58 × 10 ⁻⁵ ”, “ The Brandtl number, − ”is“ 0.717 ”.
When the “material number” is “2”, the “material name” is “water”, the “density, kg / m ³ ” is “996.62”, and the “specific heat, J / (kg · K)” is “4179”. ”,“ Thermal conductivity, W / (m · K) ”is“ 0.6104 ”,“ Kinematic viscosity, m ² / s ”is“ 8.57 × 10 ⁻⁷ ”,“ Prandtl number, − ”is“ 5.850 ".

When “Material number” is “101”, “Material name” is “Copper”, “Density, kg / m ³ ” is “8880”, “Specific heat, J / (kg · K)” is “386”, “Heat “Conductivity, W / (m · K)” is “398”, and “Total emissivity, −” is “0.023”.
When the “material number” is “102”, the “material name” is “aluminum”, the “density, kg / m ³ ” is “2688”, the “specific heat, J / (kg · K)” is “905”, “Thermal conductivity, W / (m · K)” is “237”, and “Total emissivity, −” is “0.014”.
(Configuration of network correction unit)
FIG. 4 is a functional block diagram of the network correction unit 104 shown in FIG. As shown in FIG. 4, the network correction unit 104 includes a comparison unit 401, a correction unit 402, a correction degree processing unit 403, and a correction condition processing unit 404, which are connected to each other via an internal bus 107b. . The comparison unit 401, the modification unit 402, the modification degree processing unit 403, and the modification condition processing unit 404 are, for example, a processor such as a CPU, a ROM that stores a program, and data in a process in which the processor executes a program read from the ROM. Etc. are realized by a storage device such as a RAM for temporarily storing them.

The comparison unit 401 compares the analysis result of the pre-correction thermal network model acquired from the arithmetic processing unit 103 with the reference data acquired from the input processing unit 101, and determines whether or not the thermal network model needs to be corrected. Have The comparison unit 401 transfers the determination result of the necessity of correction of the thermal network model to the correction unit 402 via the internal bus 107b.
When the determination result by the comparison unit 401 needs to correct the thermal circuit network model, the correction unit 402 corrects the pre-correction thermal network model acquired from the circuit network generation unit 102 to obtain a corrected thermal circuit network model. It has a function to generate. The correction unit 402 transfers the generated thermal circuit network model after correction to the correction degree processing unit 403 and also transfers the generated thermal circuit network model generated to the arithmetic processing unit 103 via the internal bus 107b.

The correction degree processing unit 403 compares the pre-correction thermal circuit network model acquired from the circuit network generation unit 102 with the corrected thermal circuit network acquired from the correction unit 402, and determines the correction level for each correction point. It has the required function. The modification degree processing unit 403 transfers at least the obtained modification degree to the display control unit 105 and the storage unit 106. At this time, the correction degree processing unit 403 may transfer the corrected thermal network to the display control unit 105 and the storage unit 106 in addition to the obtained correction degree.
The correction condition processing unit 404 has a function of acquiring a correction degree from the storage unit 106, which will be described in detail later, and generating a correction condition for the thermal circuit network model. The correction condition processing unit 404 transfers the generated correction condition of the thermal circuit network model to the correction unit 402 and transfers the generated correction condition of the generated thermal circuit network model to the display control unit 105 via the internal bus 107b.

Next, the operation of the information processing apparatus 1 according to the present embodiment will be described.
(Operation of information processing device)
FIG. 5 is an explanatory diagram showing an example of the analysis target, and FIG. 6 is a front view of the analysis target shown in FIG. FIG. 7 is an explanatory diagram showing an example of node arrangement with respect to the analysis target. FIG. 12 is a processing flowchart of the information processing apparatus shown in FIG. Below, the case where the thermal analysis of the analysis object shown in FIG. 5 is performed is demonstrated as an example.

As shown in FIG. 5, the analysis target as an example includes a block 11 and a flat plate 12.
In step S11 shown in FIG. 12, the information processing apparatus 1 reads an input file.
Specifically, the shape data of parts and calculation control conditions are input to the input processing unit 101 constituting the information processing apparatus 1 by an analyst (user) via the input unit 2. As the shape data of the part, for example, an STL (stereolithography) format file corresponding to each part is used. As the calculation control conditions, for example, a file in which initial conditions and boundary conditions of analysis, steady / non-stationary settings, convergence conditions, material designation information of each part, and the like are described is used. In these files, for example, a single file may include a plurality of items that specify an STL file and an item that specifies a material. These may be a plurality of files, or may be input on the spot by an analyst (user) via the input unit 2.

  The input processing unit 101 is supplied with a measurement data file including, for example, coordinates of measurement points and temperature measurement results as input reference data. The reference data may include not only measured data obtained by experiments, but also coordinates and temperature analysis data obtained by analysis, or arbitrary input values by an analyst (user). Further, the physical quantity included in the reference data may include not only the temperature but also the calorific value. The reference data may be time-series data or a steady value that gives a constant value over the entire analysis time.

Subsequently, as shown in FIG. 12, in step S12, the information processing apparatus 1 generates a thermal circuit network model.
Specifically, the circuit network generation unit 102 included in the information processing apparatus 1 generates a thermal circuit network model based on the input data as described above. The component shape processing unit 201 (FIG. 2) constituting the network generation unit 102 calculates the volume or the center of gravity position from the shape data of each component, and arranges nodes at the center of gravity position. Here, in addition to the nodes arranged at the position of the center of gravity of the part, the nodes associated with the measurement point coordinates included in the reference data are generated. The reference data input to the input processing unit 101 via the input unit 2 includes, for example, one or more measurement point coordinates for one or more parts and a temperature measurement result at the measurement point coordinates. Yes. Here, as the nodes associated with the measurement point coordinates, for example, the nodes are generated at the same coordinates as the measurement point coordinates. At this time, when the temperature measurement is a surface temperature measurement, the node is a surface node having no volume. When the temperature measurement is an internal temperature measurement of a part, a node having a volume and a heat capacity is generated at a corresponding position. Thereby, a plurality of nodes are arranged for one or more parts.

  As shown in FIG. 6, the case where the surface temperature measurement data of a part is used as reference data will be described. The block 11 is located on the upper surface of the flat plate 12, and a temperature measuring device 13 is installed at the center of the upper surface of the block 11. As shown in FIG. 7, in the node arrangement at this time, the node 21 is arranged at the coordinate located at the center of gravity of the block 11, and the node 22 is arranged at the coordinate located at the center of gravity of the flat plate 12. In addition, as coordinates associated with the measurement point coordinates of the temperature measuring device 13, a node 23, which is a surface node having no volume, is disposed at the center of the upper surface of the block 11. By arranging the nodes as described above, when the analysis result is compared with the reference data to correct the thermal network model, the analyst can perform operations such as interpolation and extrapolation to the measurement point coordinates far from the nodes. This eliminates the need for the (user) to perform, prevents a decrease in analysis accuracy, and reduces the burden on the analyst.

  Here, the data structure of the storage unit 106 shown in FIG. 1 will be described. FIG. 8 is an explanatory diagram of a data structure stored in the storage unit 106 shown in FIG. As shown in FIG. 8, the storage unit 106 stores “shape data”, “temperature, K”, and “heat generation, W” associated with each “node number” and stores each other. For each of the two nodes that are connected to form a heat transfer path, namely “node number 1” and “node number 2”, “pre-correction thermal conductance, W / K”, “correction conductance, W / K”, and “Modification degree,%” is linked and stored.

  For example, when the “node number” is “21”, the “shape data” is “block11.STL”, the “temperature, K” is “350”, and the “heat generation, W” is “10”. When the “node number” is “22”, the “shape data” is “plate12.STL”, the “temperature, K” is “320”, and the “heat generation, W” is “0”. The nodes whose “node number” is “21” and “node number” is “22” are the nodes 21 arranged at the coordinates located at the center of gravity of the block 11 and the center of gravity of the flat plate 12 shown in FIG. Corresponds to the node 22 arranged at the coordinates located at.

In the heat transfer path in which “node number 1” is “21” and “node number 2” is “22”, “pre-correction thermal conductance, W / K” is “10”, “correction conductance, W / K "Is" 13 "and" Modification degree,% "is" +30 ".
In the heat transfer path in which “node number 1” is “21” and “node number 2” is “24”, “pre-correction thermal conductance, W / K” is “6”, “correction conductance, W / K "is" 5.76 "and" Degree of correction,% "is" -4 ".
In the heat transfer path in which “node number 1” is “21” and “node number 2” is “25”, “pre-correction thermal conductance, W / K” is “1”, “correction conductance, W / K "0.94" and "Modification degree,%" is "-6".
In the heat transfer path in which “node number 1” is “22” and “node number 2” is “24”, “pre-correction thermal conductance, W / K” is “12”, “correction conductance, W / K "is" 12.96 "and" Modification degree,% "is" +8 ".
In the heat transfer path in which “node number 1” is “22” and “node number 2” is “25”, “pre-correction thermal conductance, W / K” is “2”, “correction conductance, W / K "2.02" and "Modification degree,%" is "+1".

Here, the description returns to the operation of the information processing apparatus 1. Next, the component shape processing unit 201 (FIG. 2) constituting the circuit network generation unit 102 recognizes shape information of a representative region for each node included in each component. As shape information, for example, the surface type, such as whether the surface constituting each region is a plane or a cylindrical surface, the unit normal vector of the surface, the surface area, the radius of the cylindrical surface, the volume of the region represented by the node Calculate
The inter-part structure processing unit 202 (FIG. 2) constituting the circuit network generation unit 102 recognizes the structural information between parts from the shape information acquired for each node. As structural information, for example, information necessary for calculating thermal conductance, such as the contact area between parts, the combination of each surface type of the two surfaces in contact, the form factor of radiation from one surface to the other, etc. To do.

  Next, the thermal conductance processing unit 204 constituting the network generation unit 102 calculates the thermal conductance between nodes. From the information on the arranged nodes, the structure information between the nodes, the material property value information stored in the property value database 203 shown in FIG. 3 and the calculation control conditions, the heat conductance by heat conduction, the heat by convection heat transfer The conductance and the thermal conductance due to radiant heat transfer are calculated, and the thermal conductance is calculated as the sum of them. The node information obtained so far and the information on the thermal conductance between the nodes are the pre-correction thermal network model. The pre-correction thermal circuit network model is transferred to the arithmetic processing unit 103 to perform analysis, and to the circuit network correction unit 104 to perform correction.

Next, in step S13 shown in FIG. 12, the information processing apparatus 1 performs a predetermined analysis on the generated thermal circuit network model (here, the pre-correction thermal circuit network model).
Specifically, the arithmetic processing unit 103 constituting the information processing apparatus 1 performs a predetermined analysis on the pre-correction thermal circuit network model acquired from the circuit network generation unit 102. The arithmetic processing unit 103 creates simultaneous linear equations representing the energy conservation law from the pre-correction thermal network model acquired from the network generation unit 102 and the calculation control condition (step S11 described above) acquired from the input processing unit 101. By solving this, the node temperature is calculated. The solution of the simultaneous linear equations is obtained, for example, by Gaussian elimination. Note that the solution of the simultaneous linear equations may be obtained by another calculation method instead of the Gaussian elimination method. The arithmetic processing unit 103 uses the calculated nodal temperature to repeatedly calculate the thermal conductance, the creation of simultaneous linear equations, and the nodal temperature calculation until the calculation result satisfies the convergence condition set in the calculation control condition. Repeat the process. By this iterative process, an analysis result for the pre-correction thermal network model is obtained. The obtained analysis result for the pre-correction thermal network model is transferred to the network correction unit 104 and the display control unit 105.

FIG. 9 is an explanatory diagram showing a thermal network model as an example of a thermal network analysis result. FIG. 9 shows an example in which the thermal network model is displayed together with the 3D model to be analyzed. As shown in FIG. 7, the nodes 21 and 22 are nodes arranged at coordinates located at the center of gravity of the block 11 and nodes arranged at coordinates located at the center of gravity of the flat plate 12, respectively. The nodes 24 and 25 are nodes representing the ambient environment to be analyzed, and are nodes representing ambient air and external radiation elements, respectively. The node 21 arranged in the block 11 is different from the node 23 that coincides with the measurement point coordinates of the temperature measuring device 13 shown in FIGS. 6 and 7. That is, the node 21 arranged in the block 11 is different from the measurement point coordinates of the temperature measuring device 13 included in the reference data. Therefore, the analyst (user) inputs in advance from the input unit 2 data obtained by interpolating the measurement point coordinates of the temperature measuring device 13 included in the reference data and the temperature measurement result as experimental data.
As described above, the node temperature obtained by the analysis by the arithmetic processing unit 103 is displayed in the vicinity of each node. In FIG. 9, the node temperature 31 obtained by the analysis of the node 21 is “350 K”, and the node temperature 32 obtained by the analysis of the node 22 is “320 K”. Further, the node temperature 34 obtained by the analysis of the node 24 is “300K”, and the node temperature 35 obtained by the analysis of the node 25 is “300K”. Although FIG. 9 shows an example in which the node temperature obtained by analysis is displayed, the present invention is not limited to this. For example, parameters such as thermal conductance between nodes may be displayed in addition to the node temperature. Moreover, it is good also as a structure which displays in another form, such as a table | surface, instead of displaying the node temperature etc. as an analysis result in the vicinity of a corresponding node.

Next, in step S14 shown in FIG. 12, the information processing apparatus 1 corrects the thermal circuit network model (here, the pre-correction thermal circuit network model) for which the predetermined analysis has been executed in step S13. Specifically, the circuit network correction unit 104 constituting the information processing apparatus 1 corrects the pre-correction thermal network model generated by the circuit network generation unit 102.
Hereinafter, the details of the correction processing of the thermal network model in step S14 will be described using the processing flowchart of the circuit network correction unit 104 shown in FIG.
In step S21 shown in FIG. 13, the network correction unit 104 refers to the past analysis result.
Specifically, the correction condition processing unit 404 constituting the network correction unit 104 refers to the storage unit 106 via the internal bus 107b and is stored in the storage unit 106 in the past. The post-correction thermal circuit network model obtained for the same analysis and the presence or absence of the correction degree are determined. When the past corrected thermal network model and the degree of correction obtained for the same analysis are stored in the storage unit 106, the correction condition processing unit 404 sets the past corrected thermal network model and the corrected thermal network model. The degree is acquired, and at least the past correction degree is transferred to the display control unit 105 and displayed on the screen of the display unit 3 (step S29). Here, for example, the corrected thermal processing network model and the correction degree obtained for the past analysis with the same shape data but different only temperature conditions are acquired from the storage unit 106 by the correction condition processing unit 404. In step S29, in addition to the past correction degree, the corresponding past corrected thermal circuit network model may be displayed on the screen of the display unit 3.

  In step S21, when the post-correction thermal circuit network model and the correction degree obtained for the same analysis performed in the past are not stored in the storage unit 106, or after execution of the above-described step S29, Proceed to step S22.

In step S22, in the case after execution of step S29 described above, the correction condition processing unit 404 performs the correction for each parameter based on the corrected thermal circuit network model and the correction degree information obtained for the acquired past analysis. Set correction conditions. For example, the necessity of correction of each parameter, the search range in correction, etc. are set. The setting of the correction condition for each parameter is determined by the analyst (user) referring to the acquired past corrected thermal network model and the correction degree displayed on the screen of the display unit 3 by executing step S29. Then, manually set the correction conditions for each parameter. Instead of setting correction conditions for each parameter by an analyst (user), a threshold is set in advance for the correction degree, and the correction condition processing unit 404 automatically sets the correction conditions for each parameter. You may do it.
On the other hand, when the corrected thermal circuit network model and the correction degree obtained for the same analysis performed in the past are not stored in the storage unit 106, the correction condition for each parameter is set via the input unit 2. Set by an analyst (user).
The correction condition processing unit 404 transfers the correction conditions for each set parameter to the correction unit 402 via the internal bus 107b.

In step S23 shown in FIG. 13, the network correction unit 104 compares the reference data with the analysis result.
Specifically, the comparison unit 401 included in the circuit network correction unit 104 compares the reference data acquired from the input processing unit 101 with the analysis result for the pre-correction thermal network model by the arithmetic processing unit 103. .

  In step S24 shown in FIG. 13, the network correction unit 104 determines whether or not the reference data and the analysis result match. If the reference data and the analysis result do not match, the circuit network correction unit 104 proceeds to step S25. If the analysis results match, the process proceeds to step S27. Whether or not the reference data and the analysis result match in step S24 is determined by the comparison unit 401 comparing the reference data acquired from the input processing unit 101 and the analysis result data acquired from the arithmetic processing unit 103. And whether or not the obtained difference is within a preset allowable range (difference threshold range) is determined. Here, the preset allowable range (difference threshold range) is input to the input processing unit 101 via the input unit 2 by an analyst (user), for example, and stored in a predetermined storage area in the storage unit 106. Stored.

In step S25 shown in FIG. 13, the circuit network correction unit 104 corrects the parameters of the thermal network model.
Specifically, the correction unit 402 corrects the parameters of the pre-correction thermal network model according to the correction conditions for the parameters set in step S22 described above, and sends the corrected parameters to the arithmetic processing unit 103. Forward.

In step S26 shown in FIG. 13, the arithmetic processing unit 103 performs a predetermined analysis using each corrected parameter, and the process returns to step S23.
Specifically, the arithmetic processing unit 103 executes the analysis again using the corrected parameters, and the obtained new analysis result is transferred to the comparison unit 401 again and compared with the reference data. Until the difference between the obtained new analysis result and the reference data is within a preset allowable range (difference threshold range) and it is determined that correction is not necessary, the processes from step S23 to step S26 described above are performed. Run repeatedly.

In step S27 shown in FIG. 13, the circuit network correction unit 104 performs a process of determining a corrected thermal network model.
Specifically, when the comparison unit 401 determines that the correction is not necessary in the above-described step S24, the correction unit 402 converts the thermal circuit network model at the time through the internal bus 107b to the corrected thermal network. The model is transferred to the modification degree processing unit 403.

In step S28 shown in FIG. 13, the network correction unit 104 calculates the correction degree.
Specifically, the degree-of-correction processing unit 403 that constitutes the circuit network correction unit 104 is the difference between the pre-correction thermal circuit network model acquired from the circuit network generation unit 102 and the post-correction thermal circuit network model acquired from the correction unit 402. Based on the above, the correction degree of the corrected thermal network model is obtained. The correction degree processing unit 403 transfers the obtained correction degree and the corrected thermal network model to the display control unit 105 and stores them in the storage unit 106 (FIG. 8).

The parameters to be corrected are not limited to the node temperature, but the thermal conductance between the nodes, the calorific value of the nodes, the coefficient of empirical formula required to calculate the thermal conductance, or the contact thermal resistance between components. Moreover, it is good also as arbitrary combinations among these.
As the degree of correction, for example, the rate of change in thermal conductance for each heat transfer path in the pre-correction heat circuit model and the post-correction heat circuit model is transferred to the display control unit 105 together with information on the nodes related to each heat transfer path. And stored in the storage unit 106.

  As a technique for optimizing the parameters of the thermal circuit network model for minimizing the difference between the analysis result by the arithmetic processing unit 103 and the reference data, which is executed by the correction unit 402 in the above-described step S25, for example, a genetic algorithm, An optimization algorithm such as a conjugate gradient method or a Kalman filter or a parameter estimation method is used. In many of the optimization methods, it is known that the initial value of the parameter affects the search accuracy and the calculation time. In the present embodiment, the parameter assigned to the pre-correction thermal network model by the network generation unit 102 can be used as an initial value, so that the analyst does not need to set the initial value by itself, reducing man-hours and calculating. Time can be reduced.

  For example, when it is desired to perform a plurality of analyzes by changing the temperature conditions for the same experimental apparatus, it is necessary to perform correction of the entire analysis model in a wide search range in all analyzes in the conventional method. For this reason, the calculation time required for correction increases and the advantage of the thermal network method that the amount of calculation is small cannot be fully utilized. Therefore, the correction condition processing unit 404 operates as described above, so that the entire analysis model can be corrected within a wide search range by only the first analysis. Refer to the initial correction degree, parameters that are so small that the correction degree can be ignored are not subject to correction in the second and subsequent analyses, and parameters that are so large that the correction degree cannot be ignored are corrected by limiting the search range. It becomes possible. This makes it possible to reduce the calculation time required for correction. The limitation of the parameter search range will be described later.

Here, returning to FIG. 12, in step S15, the information processing apparatus 1 displays the result on the screen of the display unit 3, and ends the process.
Specifically, the network correction unit 104 configuring the information processing apparatus 1 can identify a heat transfer path whose correction degree is within a predetermined range from other heat transfer paths whose correction degree is outside the predetermined range. The display command information is transferred to the display control unit 105 so as to display in a manner. For example, for the heat transfer path whose correction degree is out of a predetermined range, the display control unit 105 is emphasized so that the correction degree can be identified as compared with other heat transfer paths within the predetermined range. The display command information is transferred to. In addition, for example, for the heat transfer path having a correction degree within a predetermined range, it is not necessary to correct each parameter. Therefore, display command information is transferred to the display control unit 105 so as not to perform display. This makes it easy to quantitatively grasp the heat transfer path that is an analysis problem in the pre-correction thermal network model generated by the network generation unit 102 in the initial stage. For example, in a heat transfer path consisting of contact surfaces between parts, the thermal conductance of the modified thermal network model was modified to a value significantly smaller than the thermal conductance of the unmodified thermal network model. Is indicated by the display of the correction degree, it becomes easier to grasp that the influence of the contact thermal resistance is more remarkable in the heat transfer path than that considered in the pre-correction thermal circuit network model. Such an easy grasp of the heat transfer phenomenon for each heat transfer path has a beneficial effect in the examination of the design improvement plan. Moreover, it becomes easy to consider improvement of the automatic generation method of the thermal network model in the network generation part 102 by considering them.

  FIG. 10 is an explanatory diagram showing an example of the corrected thermal network model and the degree of correction. Here, an example in which the correction degree is displayed in a format added to the display of the thermal network model displayed together with the 3D model to be analyzed is shown as an example. As shown in FIG. 10, the correction degree of the corrected thermal network model obtained by the correction by the network correction unit 104 is displayed in the vicinity between the nodes. In addition, in FIG. 10, the case where the correction degree of the thermal conductance in the heat transfer path | route between two nodes is displayed as a correction degree is shown. As shown in FIG. 10, the degree of correction 41 of the thermal conductance of the heat transfer path formed by the nodes 21 and 25 is “−6%”, and the thermal conductance of the heat transfer path formed by the nodes 21 and 22 is The correction degree 42 is “+ 30%”. Further, the correction degree 43 of the thermal conductance of the heat transfer path formed by the nodes 22 and 24 is “+ 8%”, and the correction degree 44 of the thermal conductance of the heat transfer path formed by the nodes 24 and 21 is “ −4% ”, and the degree of correction 45 of the thermal conductance of the heat transfer path formed by the nodes 25 and 22 is“ + 1% ”.

  FIG. 11 is an explanatory diagram showing an example of the corrected thermal circuit network model and the correction degree emphasis display. In FIG. 11, the thermal conductance is adjusted so that the heat transfer path formed by the nodes 21 and 22 having a degree of correction of the thermal conductance outside the range of ± 10% can be identified in comparison with other heat transfer paths. An example in which “+ 30%”, which is a correction degree 42, is displayed in a different color scheme, and the heat transfer path formed by the nodes 21 and 22 is highlighted (a line indicating the heat transfer path is displayed by a thick broken line). Yes. In FIG. 11, the heat transfer path in which the degree of correction of the thermal conductance is within a range of ± 5%, that is, the heat transfer path formed by the nodes 21 and 22 and the heat transfer formed by the nodes 24 and 21. An example in which the degree of correction of the thermal conductance and the heat transfer path are not displayed for the path and the heat transfer path formed by the nodes 25 and 22 is shown.

  Information such as the pre-correction thermal circuit network model, the post-correction thermal network model, the analysis result, and the degree of correction of thermal conductance acquired by the display control unit 105 is processed at any time and displayed on the screen of the display unit 3.

  FIG. 14 is a diagram showing an example of the screen display of the display unit 3 shown in FIG. As shown in FIG. 14, the display screen 50 of the display unit 3 includes a first display area 51 for displaying a thermal network analysis result, a second display area 52 for displaying a correction degree, and various commands for inputting various commands. The area is composed of areas where a “correction degree” button 53 and a “narrow down” button 54 are displayed. In the uppermost area on the display screen 50, the entire window in which the first display area 51 and the second display area 52 are displayed is closed, reduced / enlarged, and displayed on the control bar of the display unit 3. A button for designating movement or the like is displayed.

In the first display area 51 shown in FIG. 14, the nodal temperature determined by the analysis by the pre-correction thermal network model and the arithmetic processing unit 103 together with the 3D model to be analyzed is displayed in the display form shown in FIG. Is displayed. As shown in FIG. 14, when the analyst (user) moves the mouse pointer from the input unit 2 such as a mouse onto the “correction degree” button 53 and is clicked, the “correction degree” button 53 becomes active. In response to this, the display control unit 105 (FIG. 1) displays the correction degree of thermal conductance and the corrected thermal network model, which are the execution results of step S28 in FIG. 13 described above by the network correction unit 104. Displayed in the second display area 52 in the display form shown in FIG. 10 so as to be visible together with the 3D model to be analyzed.
Thereby, the analyst (user) compares the display contents of the first display area 51 and the second display area 52 to analyze the pre-correction thermal circuit network model generated by the circuit network generation unit 102 in the analysis. It becomes possible to grasp easily the heat transfer path which becomes a problem of this quantitatively easily.

FIG. 15 is a diagram showing an example of the screen display of the display unit 3 shown in FIG. In FIG. 15, from the display state shown in FIG. 14, an analyst (user) moves the mouse pointer from the input unit 2 such as a mouse onto the “narrow down” button 54, and clicks on the “narrow down” button 54. The example of a screen display in the state where became active is shown. As shown in FIG. 15, the display content of the first display area 51 is the same as that of FIG. 14, but the second display area 52 has a heat transfer path whose thermal conductance correction degree is outside the range of ± 10%. The heat conductance correction degree “+ 30%” is displayed in a different color so that it can be distinguished from other heat transfer paths, and the heat conductance correction degree is “+ 30%”. Is highlighted (a line indicating a heat transfer path is indicated by a thick broken line). Further, in the heat transfer path whose thermal conductance correction degree is within a range of ± 5%, the heat conductance correction degree and the heat transfer path are not displayed.
As a result, the analyst (user) confirms the content displayed in the second display area 52, so that the heat transfer path whose thermal conductance correction degree is within the predetermined range is not displayed, and the heat Since the heat transfer path whose conductance correction degree is outside the predetermined range is highlighted, it is possible to immediately grasp the heat transfer path that is an analysis problem in the pre-correction heat network model. In addition, it is possible to immediately grasp that the thermal conductance of the modified thermal network model has been modified to a value that is significantly smaller than the thermal conductance of the unmodified thermal network model, and support the work for studying design improvement proposals. Can be achieved.

FIG. 15 shows an example in which the degree of thermal conductance correction outside the predetermined range is displayed in different colors, but the present invention is not limited to this. For example, the degree of thermal conductance correction outside a predetermined range may be displayed in hatching or blinking, and any display form may be used as long as the display form can be distinguished from other correction degrees.
FIG. 15 shows a configuration in which the degree of correction of the thermal conductance outside the predetermined range and the corresponding heat transfer path are not displayed by activating the “narrow down” button 54. However, the present invention is not limited to this. is not. For example, among the correction degrees of the thermal conductance displayed in the second display area 52 of FIG. 14, by moving the mouse pointer to a desired correction degree and specifying it by clicking, a parameter corresponding to the specified correction degree is obtained. Alternatively, it may be configured not to be subjected to analysis again.
14 and 15 illustrate an example in which the first display area 51 and the second display area 52 are included in the display screen 50, the present invention is not limited to this. For example, one display area may be provided in the display screen 50, and a display of the pre-correction thermal circuit network model and the analysis result thereof, and a display of the post-correction thermal circuit model and the correction degree of the thermal conductance may be switched and displayed. .

FIG. 16 is an explanatory diagram of the effect of reducing the number of parameters to be corrected by the information processing apparatus 1 shown in FIG. In FIG. 16, the horizontal axis indicates the parameter p ₁ and the vertical axis indicates the parameter p ₂ , and the parameter search range is shown. As described above, the parameters to be corrected include the node temperature, the thermal conductance between nodes, the calorific value of the node, the coefficient of empirical formula necessary for calculating the thermal conductance, or the contact between parts. Thermal resistance, or any combination of these. In the present embodiment, the above-described correction condition processing unit 404 operates as shown in step S22 of FIG. 13, so that the correction of the parameters of the entire analysis model is performed only in the first analysis in a wide search range. Refer to the initial correction degree, parameters that are so small that the correction degree can be ignored are not subject to correction in the second and subsequent analyses, and parameters that are so large that the correction degree cannot be ignored are corrected by limiting the search range. . Specifically, as shown in FIG. 16, the search range of the parameter (p _1, p ₂ ) is set to 0.4 to 0.6 for the parameter p ₁ by setting the correction condition by the correction condition processing unit 404. range, also for narrows the range of 0.6 to 0.8 for the parameter p _2, it is possible to reduce the computation time required for the correction of parameters.

As described above, according to the present embodiment, it is possible to reduce the calculation time and man-hours required when correcting the thermal circuit network model using the reference data.
In addition, according to the present embodiment, since the parameter assigned to the pre-correction thermal network model by the network generation unit 102 can be used as an initial value, it is not necessary for the analyst to set the initial value by himself / herself. And the calculation time can be reduced.
Furthermore, according to the present embodiment, in the pre-correction thermal network model generated by the network generation unit 102 in the initial stage, it is possible to quantitatively easily understand the heat transfer path that is an analysis problem. Become.
Further, according to the present embodiment, the heat transfer path whose thermal conductance correction degree is within the predetermined range is not displayed, and the heat transfer path whose thermal conductance correction degree is outside the predetermined range is highlighted. Therefore, in the pre-correction thermal network model, it is possible to immediately grasp the heat transfer path that is an analysis problem. In addition, it is possible to immediately grasp that the thermal conductance of the modified thermal network model has been modified to a value that is significantly smaller than the thermal conductance of the unmodified thermal network model, and support the work for studying design improvement proposals. Can be achieved.

  FIG. 17 is a diagram illustrating an example of a screen display of the display unit that configures the information processing apparatus according to the second embodiment of the present invention. In this embodiment, the correction degree of the corrected thermal network model obtained by the network correction unit 104 is displayed together with the corrected thermal circuit model in a tabular format instead of being displayed together with the corrected thermal circuit model. This is different from the first embodiment. Other configurations are the same as those of the first embodiment, and the description overlapping with the first embodiment is omitted below.

  As shown in FIG. 17, the display screen 50 of the display unit 3 includes a first display area 51 for displaying a thermal network analysis result, a second display area 52 for displaying a correction degree, and a “correction” for inputting a command. It consists of an area where a “degree” button 53 is displayed. In the uppermost area on the display screen 50, the entire window in which the first display area 51 and the second display area 52 are displayed is closed, reduced / enlarged, and displayed on the control bar of the display unit 3. A button for designating movement or the like is displayed.

  In the first display area 51 shown in FIG. 17, similarly to the above-described first embodiment, each node temperature obtained by the analysis by the pre-correction thermal circuit network model and the arithmetic processing unit 103 together with the 3D model to be analyzed is described above. Is displayed in the display form shown in FIG. As shown in FIG. 17, when the mouse pointer is moved on the “correction degree” button 53 by the analyst (user) from the input unit 2 such as a mouse and clicked, the “correction degree” button 53 becomes active. Correspondingly, the display control unit 105 (FIG. 1) determines the degree of correction of the thermal conductance in the heat transfer path between the two nodes, which is the execution result of step S28 in FIG. The data is displayed in the second display area 52 in a tabular format. The “correction degree,%” of the thermal conductance of the heat transfer path between two nodes having “node number” “21” and “node number” “22” is “+ 30%”, and “node number” is “ The “correction degree,%” of the thermal conductance of the heat transfer path between the two nodes having “21” and “node number” “24” is “−4%”. Further, the “degree of correction,%” of the thermal conductance of the heat transfer path between the two nodes whose “node number” is “21” and “node number” is “25” is “−6%”, and “node number” “22” and “Nodal number” is “24”, the “correction degree,%” of the thermal conductance of the heat transfer path between the two nodes is “+ 8%”, and the “node number” is “22”. The “correction degree,%” of the thermal conductance of the heat transfer path between the two nodes whose “node number” is “25” is “+ 1%”.

  Further, in the second display area 52 of FIG. 17, when the degree of correction of thermal conductance is outside the range of ± 10%, the degree of correction of thermal conductance of the heat transfer path is compared with the degree of correction of other thermal conductances. As can be discriminated, rows with the correction degree of thermal conductance “+ 30%” are displayed in different colors. In addition, a row having a thermal conductance correction degree of “+ 30%” is displayed with a marker 55 attached to the outside.

By adopting such a display form of the second display area 52, it becomes possible to numerically arrange and compare the degree of correction of thermal conductance for each heat transfer path, and it is complicated in a thermal circuit network model having a large number of parts. It is possible to make it easier for an analyst (user) to confirm design points to be improved than a thermal network diagram that tends to be.
Information such as the analysis result acquired by the display control unit 105 and the degree of correction of thermal conductance is processed by the display control unit 105 as needed and displayed on the screen of the display unit 3.

Although FIG. 17 shows an example in which the row of the degree of thermal conductance correction outside the predetermined range is displayed in a different color scheme, the present invention is not limited to this. For example, it may be configured to display a hatching display or a blink display for a row with a degree of thermal conductance correction outside a predetermined range, and any display form can be used as long as the display form can be distinguished from other correction degree lines. Also good.
Moreover, in FIG. 17, although the example which has the 1st display area 51 and the 2nd display area 52 in the display screen 50 was shown, it is not restricted to this. For example, one display area is provided in the display screen 50, the pre-correction thermal network model and its analysis result are displayed, and the correction degree of the thermal conductance is displayed in tabular form for each heat transfer path constituting the post-correction thermal network model. It is good also as a structure which switches and displays the display form displayed by.
In this embodiment, an example in which the degree of correction of thermal conductance is displayed has been shown, but the present invention is not limited to this. For example, it may be configured to display the degree of correction of empirical formulas necessary for calculating the calorific value of the nodes, thermal conductance, or contact thermal resistance between components.

  According to the present embodiment, in addition to the effects of the first embodiment, it is possible to numerically arrange and compare the degree of correction of the thermal conductance for each heat transfer path, which is a thermal network model with a large number of parts. However, it becomes possible for the analyst (user) to easily confirm the design points to be improved.

  FIG. 18 is an explanatory diagram showing a thermal circuit network model by the information processing apparatus according to the third embodiment of the present invention. The present embodiment is different from the first embodiment in that nodes are arranged at coordinates that coincide with the measurement point coordinates included in the reference data. Other configurations are the same as those of the first embodiment, and the description overlapping with the first embodiment is omitted below.

As shown in FIG. 18, a node 23 is arranged at a coordinate coincident with the measurement point coordinate of the temperature measuring device 13 included in the reference data, a node 21 is arranged at a coordinate located at the center of gravity of the block 11, and the center of gravity of the flat plate 12 is arranged. A node 22 is arranged at the coordinates located at. Further, the node 24 and the node 25 are nodes representing the surrounding environment of the analysis target composed of the block 11 and the flat plate 12, and are nodes representing ambient air and external radiation elements, respectively.
FIG. 18 shows an example in which these nodes 21 to 25 are displayed together with the 3D model to be analyzed. Nodes 23 arranged at coordinates that coincide with the measurement point coordinates are represented by nodes 21, 22, 24, And the case where it displays with a white circle so that identification with the node 25 is possible is shown. The arrangement of these nodes is the same as the measurement point coordinates and the components (block 11 and flat plate 12) included in the reference data acquired from the input processing unit 101 by the component shape processing unit 201 constituting the network generation unit 102 shown in FIG. ) Automatically based on shape data. Specifically, the component shape processing unit 201 places the nodes 23 with white circles at coordinates that coincide with the measurement point coordinates included in the reference data, calculates the centroid position from the shape data of each component, and calculates the centroid of the block 11. The node 21 is arranged at a position, and the node 22 is arranged at a center of gravity of the flat plate 12 by a black circle. The circuit network generating unit 102 displays the node information arranged in the coordinates that coincide with the measurement point coordinates in such a manner that it can be distinguished from other nodes in such a manner as to display the node information in the arithmetic processing unit 103 and the network correction. The data is transferred to the unit 104.

  In this embodiment, an example is shown in which the nodes 23 arranged at the coordinates coincident with the measurement point coordinates are displayed as white circles so as to be distinguishable from other nodes, but the present invention is not limited to this. For example, any display form may be used as long as it is a display form that can be distinguished from other nodes, such as blink display or hatching display of the nodes 23 arranged at coordinates that coincide with the fixed point coordinates.

  By displaying the nodes on the screen of the display unit 3 as described above, the analyst (user) can easily grasp the arrangement and number of measurement points on the thermal circuit diagram. How the measurement points exist for the entire analysis model is important information for considering the reliability of the correction result of the analysis model. Further, such measurement point arrangement information is fed back to the measurement conditions, and by changing the measurement position or increasing / decreasing the measurement location, it is possible to perform analysis or evaluation with high accuracy and efficiency.

  Information such as the analysis result obtained by the display control unit 105, the post-correction thermal circuit network, and the degree of correction is processed by the display control unit 105 at any time and displayed on the screen of the display unit 3.

According to the present embodiment, in addition to the effects of the first embodiment, an analyst (user) can easily grasp the arrangement and number of measurement points on the thermal circuit diagram.
In addition, according to the present embodiment, it is possible to efficiently perform highly accurate analysis or evaluation by changing the measurement position or increasing / decreasing the measurement location based on the measurement point arrangement information displayed on the screen. Become.

  FIG. 19 is an overall schematic configuration diagram of an information processing system according to a fourth embodiment according to another embodiment of the present invention. As illustrated in FIG. 19, the information processing system 10 includes an information processing device 1 a, a plurality of user terminal devices 5 a to 5 c, and a network 6 that connects them. The information processing device 1a is realized by, for example, a server, and the user terminal devices 5a to 5c are realized by, for example, a mobile computer, a desktop computer, a smartphone, or a tablet.

  The user terminal devices 5a to 5c are preliminarily sent from the information processing device 1a via the network 6 to the shape data of the analysis target device, the calculation control condition of the analysis, and the reference data for comparison with the analysis result of the physical quantity. Input screen for inputting, analysis area of 3D model to be analyzed, pre-correction thermal network model and each node temperature obtained by analysis, correction degree of thermal conductance, and post-correction thermal network model Display control such as a display area that can be viewed with the target 3D model, and a heat transfer path whose thermal conductance correction degree is outside a predetermined range so that it can be identified in comparison with other heat transfer paths Program is downloaded and installed in advance. As a result, the user terminal devices 5a to 5c can correct the pre-correction thermal network model and the respective nodal temperatures obtained by the analysis together with the 3D model to be analyzed, the post-correction thermal network model and the thermal conductance together with the 3D model to be analyzed. In addition, the heat transfer path whose heat conductance correction degree is outside a predetermined range can be displayed on its own display unit so as to be distinguishable from other heat transfer paths.

FIG. 20 is a functional block diagram of the information processing unit 4a constituting the information processing apparatus 1a shown in FIG. The same components as those in the first embodiment are denoted by the same reference numerals. As illustrated in FIG. 20, the information processing unit 4 a configuring the information processing apparatus 1 a includes a communication I / F 108, a circuit network generation unit 102, an arithmetic processing unit 103, a circuit network correction unit 104, a storage unit 106, and an internal 107. Prepare. In the present embodiment, a configuration in which the storage unit 106 is provided in the information processing unit 4a of the information processing apparatus 1a will be described as an example, but the configuration is not limited thereto. For example, the storage unit 106 may be connected to the information processing apparatus 1 as an external storage device.
These communication I / F 108, circuit network generation unit 102, arithmetic processing unit 103, circuit network correction unit 104, and storage unit 106 are connected to each other via an internal bus 107.

  For example, among the user terminal devices 5a to 5c, the reference data for comparing the shape data of the device to be analyzed, the calculation control condition of the analysis, and the analysis result of the physical quantity from the user terminal device 5a via the network 6. Is received by the communication I / F 108, the communication I / F 108 receives the shape data of the analysis target device and the calculation of analysis received by the network generation unit 102 and the network correction unit 104 via the internal bus 107. Control data and reference data for comparison with physical quantity analysis results are transferred.

As described in the first embodiment, the circuit network generation unit 102 executes step S12 shown in FIG. 12, obtains node information and information on thermal conductance between the nodes, and generates a pre-correction thermal network model. To do.
Further, as described in the first embodiment, the arithmetic processing unit 103 executes step S13 illustrated in FIG. 12 and the pre-correction thermal circuit network model acquired from the circuit network generation unit 102 and the user terminal device 5a. Further, the node temperature is calculated based on the calculation control condition of the analysis received via the network 6 and the communication I / F 108. Then, the arithmetic processing unit 103 uses the calculated nodal temperature to repeatedly calculate the thermal conductance, the creation of simultaneous linear equations, and the nodal temperature calculation, and the convergence result set by the calculation control condition is calculated. The process is repeated until it is satisfied, and an analysis result for the pre-correction thermal network model is obtained by this iterative process.
As described in the first embodiment, the circuit network correction unit 104 executes steps S21 to S28 shown in FIG. 13 and the pre-correction thermal circuit network model and the post-correction heat acquired from the circuit network generation unit 102. Based on the difference from the network model, the correction degree of the corrected thermal network model is obtained.

  The pre-correction thermal network model generated by the network generation unit 102 together with the 3D model to be analyzed and each node temperature obtained by analysis by the arithmetic processing unit 103, and the network correction unit 104 together with the 3D model to be analyzed The generated corrected thermal network model and the degree of thermal conductance correction are transmitted to the user terminal device 5a via the internal bus 107 and the communication I / F 108. The display contents shown in FIGS. 14 and 15 described in the first embodiment are displayed on the display screen of the user terminal device 5a. 14 and 15 show an example in which the display screen 50 includes the first display area 51 and the second display area 52, the present invention is not limited to this. For example, one display area may be provided in the display screen 50, and a display of the pre-correction thermal circuit network model and the analysis result thereof, and a display of the post-correction thermal circuit model and the correction degree of the thermal conductance may be switched and displayed. .

  In the present embodiment, the case where the information processing unit 4a configuring the information processing apparatus 1a executes the same processing as in the first embodiment has been described as an example, but instead, the above-described second embodiment or the above-described embodiment. 3 may be configured to perform the same processing or display as in FIG.

  According to the present embodiment, a plurality of user terminal devices can share the information processing apparatus, and the effects according to the first to third embodiments can be achieved.

  In addition, this invention is not limited to an above-described Example, Various modifications are included. For example, the above-described embodiments have been described in detail for easy understanding of the present invention, and are not necessarily limited to those having all the configurations described.

DESCRIPTION OF SYMBOLS 1, 1a ... Information processing apparatus 2 ... Input part 3 ... Display part 4, 4a ... Information processing part 5a, 5b, 5c ... User terminal device 6 ... Network 10 ... Information processing system 11 ... block 12 ... flat plate 13 ... temperature measuring devices 21, 22, 23, 24, 25 ... nodes 31, 32, 34, 35 ... node temperatures 41, 42, 43 , 44, 45... Correction degree 50... Display screen 51... First display area 52... Second display area 53 ... correction degree button 54. ... Input processing unit 101
102 ... Circuit network generation unit 103 ... Arithmetic processing unit 104 ... Circuit network correction unit 105 ... Display control unit 106 ... Storage units 107, 107a, 107b ... Internal bus 108 ... Communication I / F
201: Part shape processing unit 202 ... Inter-part structure processing unit 203 ... Physical property value database 204 ... Thermal conductance processing unit 401 ... Comparison unit 402 ... Correction unit 403 ... Degree of correction Processing unit 404 ... correction condition processing unit

Claims (18)

An input processing unit that processes input data including reference data for comparison with the shape data of the device to be analyzed, the calculation control condition of the analysis, and the analysis result of the physical quantity;
A network generation unit that generates a thermal network model based on the input data;
An arithmetic processing unit that performs a predetermined analysis on the generated thermal network model;
Comparing the analysis result by the arithmetic processing unit with the reference data, correcting the generated thermal network model, and outputting a corrected thermal network model; and
A display unit for displaying the analysis result, the corrected thermal network model and / or the thermal network model by the network generation unit,
The circuit network correction unit compares the thermal network model by the circuit network generation unit and the corrected thermal network model, determines a correction level at a correction location, and displays at least the determined correction level on the display unit An information processing apparatus characterized by: The information processing apparatus according to claim 1,
At least the post-correction thermal network model and correction degree information obtained for the past analysis, and the shape data of the analysis target device for each node, the calculation control condition of the analysis, and the physical quantity An information processing apparatus comprising a storage unit for storing. The information processing apparatus according to claim 2,
The network correction unit is
A correction condition processing unit for setting a correction condition for each parameter based on the corrected thermal network model and correction degree information obtained for the past analysis stored in the storage unit;
A comparison unit that compares the analysis result by the arithmetic processing unit with the reference data to obtain a difference, determines whether the obtained difference is within a preset allowable range, and determines whether correction is necessary,
A correction unit that corrects each parameter of the thermal network model generated by the network generation unit according to the correction condition;
On the basis of the difference between the thermal network model generated by the network generation unit and the corrected thermal network model having the parameters corrected by the correction unit, the correction degree for determining the correction degree at the correction location. An information processing apparatus comprising: a processing unit. The information processing apparatus according to claim 3.
The information processing apparatus, wherein the circuit network generation unit places nodes at least at positions corresponding to the measurement point coordinates included in the reference data or at positions corresponding to the measurement point coordinates. The information processing apparatus according to claim 4,
Each of the parameters is a node temperature, a thermal conductance of a heat transfer path formed by two nodes connected to each other, or a contact thermal resistance between components constituting the device to be analyzed. Information processing apparatus. The information processing apparatus according to claim 5,
The correction degree processing unit uses the change rate of the thermal conductance for each heat transfer path in the thermal circuit network model generated by the circuit network generation unit and the corrected thermal network model as the correction degree. Information processing apparatus. The information processing apparatus according to claim 4,
The display screen of the display unit is
A first display area for displaying an analysis result for the thermal network model together with the thermal network model generated by the circuit network generation unit;
A second display area for displaying the degree of correction at the correction location together with the corrected thermal network model, or the degree of correction in the heat transfer path between nodes in a tabular form;
An information processing apparatus that displays a correction degree outside a predetermined range out of the displayed correction degrees so as to be distinguishable from other correction degrees. The information processing apparatus according to claim 4,
On the display screen of the display unit,
A display form for displaying an analysis result for the thermal circuit model together with the thermal network model generated by the circuit network generation unit;
A display control unit that controls to switch between the display form for displaying the correction degree in the correction part together with the corrected thermal network model or the correction degree in the heat transfer path between the nodes in a table format. ,
An information processing apparatus that displays a correction degree outside a predetermined range out of the displayed correction degrees so as to be distinguishable from other correction degrees. An information processing method for an information processing apparatus having at least a circuit network generation unit that generates a thermal network model and an arithmetic processing unit that performs a predetermined analysis on the thermal network model,
Process the input data including the shape data of the device to be analyzed, the calculation control conditions of the analysis, and the reference data for comparison with the analysis result of the physical quantity,
The network generation unit generates a thermal network model based on the processed input data,
The arithmetic processing unit performs a predetermined analysis on the generated thermal network model,
Compare the analysis result by the arithmetic processing unit and the reference data, correct the generated thermal circuit network model, output the corrected thermal network model,
The thermal network model generated by the network generation unit is compared with the corrected thermal network model, the correction degree at the correction location is obtained, and at least the obtained correction degree together with the corrected thermal network model A display method characterized by displaying on a display unit. The information processing method according to claim 9,
Based on the corrected thermal network model and the degree of correction information obtained for the past analysis, set the correction conditions for each parameter,
Compare the analysis result by the arithmetic processing unit and the reference data to obtain a difference, determine whether the obtained difference is within a preset allowable range, determine whether correction is necessary,
Modify each parameter of the thermal network model generated by the network generation unit according to the correction condition,
Information for obtaining a correction degree at the correction location based on a difference between the thermal network model generated by the circuit network generation unit and the corrected thermal network model having each parameter after correction. Processing method. The information processing method according to claim 10,
The information processing method, wherein the network generation unit places nodes at least at positions corresponding to the measurement point coordinates included in the reference data or at positions corresponding to the measurement point coordinates. The information processing method according to claim 11,
Each of the parameters is a node temperature, a thermal conductance of a heat transfer path formed by two nodes connected to each other, or a contact thermal resistance between components constituting the device to be analyzed. Information processing method. The information processing method according to claim 12,
An information processing method characterized in that a change rate of thermal conductance for each heat transfer path in the thermal circuit network model generated by the circuit network generation unit and the corrected thermal circuit network model is set as the correction degree. The information processing method according to claim 11,
In the first display area of the display unit, the analysis result for the thermal circuit network model is displayed together with the thermal network model generated by the circuit network generation unit,
In the second display area of the display unit, the correction degree in the correction portion together with the corrected thermal network model, or the correction degree in the heat transfer path between the nodes in a tabular form,
An information processing method comprising: displaying a correction degree out of a predetermined range among displayed correction degrees so as to be distinguishable from other correction degrees. An information processing system having an information processing device connected to a plurality of user terminal devices via a network,
The information processing apparatus includes:
A thermal network model based on input data including reference data for comparison with shape data of an analysis target device input from the user terminal device via the network, calculation control conditions for analysis, and physical quantity analysis results A network generation unit for generating
An arithmetic processing unit that performs a predetermined analysis on the generated thermal network model;
Comparing the analysis result by the arithmetic processing unit and the reference data, correcting the generated thermal network model, and outputting a corrected thermal network model, and a network correction unit,
The circuit network correction unit compares the thermal network model by the circuit network generation unit and the corrected thermal network model, finds a correction degree at a correction point, and at least determines the calculated correction degree as the corrected heat network model. An information processing system which transmits to the user terminal device via the network together with a circuit network model. The information processing system according to claim 15,
The information processing apparatus is at least information on the post-correction thermal circuit network model and the correction degree obtained for the past analysis, shape data of the device to be analyzed for each node, calculation control conditions for analysis, And an information processing system comprising a storage unit that stores physical quantities in association with each other. The information processing system according to claim 16,
The network correction unit is
A correction condition processing unit for setting a correction condition for each parameter based on the corrected thermal network model and correction degree information obtained for the past analysis stored in the storage unit;
A comparison unit that compares the analysis result by the arithmetic processing unit with the reference data to obtain a difference, determines whether the obtained difference is within a preset allowable range, and determines whether correction is necessary,
A correction unit that corrects each parameter of the thermal network model generated by the network generation unit according to the correction condition;
On the basis of the difference between the thermal network model generated by the network generation unit and the corrected thermal network model having the parameters corrected by the correction unit, the correction degree for determining the correction degree at the correction location. An information processing system comprising: a processing unit. A function for processing input data including shape data of an analysis target device, calculation control conditions for analysis, and reference data for comparison with a physical quantity analysis result;
A function of generating a thermal network model based on the input data;
A function for executing a predetermined analysis on the generated thermal network model;
A function of comparing the analysis result for the generated thermal network model with the reference data, correcting the generated thermal network model, and outputting the corrected thermal network model;
Comparing the generated thermal circuit network model with the corrected thermal network model to determine a correction level at a correction location, and causing the calculation unit to execute at least a function of displaying the determined correction level on a display unit An information processing program characterized by that.

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