JP2019140352A - Printed circuit board and the same with electronic component - Google Patents

Abstract

To provide a printed circuit board capable of reliably connecting terminals of an electronic component and a conductive pattern formed on the printed circuit board.SOLUTION: The printed circuit board includes: a substrate body 10 including a first region on which electronic components are to be mounted; a first conductive pattern 11 provided on the first region and to be electrically connected to a terminal of the electronic component; a second conductive pattern 12 provided on the first region and spaced apart from the first conductive pattern and including a first pattern portion having an opening; and an insulating layer 13 covering the second conductive pattern.SELECTED DRAWING: Figure 1

Description

  Embodiments described herein relate generally to a printed circuit board and an electronic component mounting printed circuit board.

  When an electronic component such as a semiconductor integrated circuit chip is mounted on a printed circuit board, a ground pattern or a power supply pattern is usually provided immediately below the electronic component. In addition, the ground pattern and the power supply pattern are usually covered with a solder resist.

  However, if the solder resist is formed thick, there is a possibility that it is impossible to connect the terminals of the electronic component and the conductive pattern (such as a signal line pattern) formed on the printed circuit board.

  Therefore, there is a demand for a printed circuit board and an electronic component mounted printed circuit board that can reliably connect the terminals of the electronic component and the conductive pattern formed on the printed circuit board.

Japanese Patent Laid-Open No. 2007-13134

  Provided are a printed circuit board and an electronic component mounting printed circuit board that can reliably connect terminals of the electronic component and a conductive pattern formed on the printed circuit board.

  A printed circuit board according to an embodiment is provided on a substrate body including a first region on which an electronic component is to be mounted, and on the first region, and is to be electrically connected to a terminal of the electronic component. A first conductive pattern; a second conductive pattern provided on the first region, including a first pattern portion spaced from the first conductive pattern and having an opening; and the second conductive pattern And an insulating layer covering.

It is sectional drawing which showed typically the structure of the printed circuit board which concerns on 1st Embodiment. It is the top view which showed typically the structure of the printed circuit board which concerns on 1st Embodiment. It is sectional drawing which showed typically the structure of the electronic component mounting printed circuit board which concerns on 1st Embodiment. It is the top view which showed typically the structure of the electronic component mounting printed circuit board which concerns on 1st Embodiment. It is sectional drawing which showed typically a part of manufacturing method of the printed circuit board concerning 1st Embodiment. It is sectional drawing which showed typically a part of manufacturing method of the printed circuit board concerning 1st Embodiment. It is sectional drawing which showed typically the structure of the electronic component mounting printed circuit board which concerns on 2nd Embodiment. It is the top view which showed typically the structure of the electronic component mounting printed circuit board which concerns on 2nd Embodiment. It is sectional drawing which showed typically a part of manufacturing method of the printed circuit board concerning 2nd Embodiment. It is sectional drawing which showed typically a part of manufacturing method of the printed circuit board concerning 2nd Embodiment. It is sectional drawing which showed typically a part of manufacturing method of the printed circuit board concerning 2nd Embodiment. It is sectional drawing which showed typically a part of manufacturing method of the printed circuit board concerning 2nd Embodiment.

  Hereinafter, embodiments will be described with reference to the drawings.

(Embodiment 1)
First, the printed circuit board and electronic component mounting printed circuit board (printed circuit board on which electronic components are mounted) according to the first embodiment will be described. In the present embodiment, an LGA (land grid array) will be described as an example.

  FIG. 1 is a cross-sectional view schematically showing the configuration of the printed circuit board according to the first embodiment. FIG. 2 is a plan view schematically showing the configuration of the printed circuit board according to the first embodiment.

  A first conductive pattern 11, a second conductive pattern 12, and an insulating layer 13 are formed on the printed circuit board body 10 including a region where electronic components are mounted. In the present embodiment, a semiconductor integrated circuit chip is assumed as the electronic component.

  The first conductive pattern 11 and the second conductive pattern 12 are provided on the same plane and are made of the same material. As the material of the first conductive pattern 11 and the second conductive pattern 12, a metal material such as copper is used.

  The first conductive pattern 11 (signal line pattern or the like) is electrically connected to a terminal of an electronic component by a solder ball.

  The second conductive pattern 12 is separated from the first conductive pattern 11 and includes a first pattern portion having a plurality of openings 12p. Specifically, the first pattern portion is provided in a mesh shape. In other words, the plurality of openings 12p are provided in an array. The second conductive pattern 12 is used as a ground pattern or a power supply pattern. In the present embodiment, the second conductive pattern 12 is provided in an inner region and an outer region of the region where the first conductive pattern 11 is provided.

  The insulating layer 13 is formed of a solder resist and covers the second conductive pattern 12. The insulating layer 13 fills the opening 12p. The insulating layer 13 is also formed in a region between the adjacent first conductive patterns 11. In FIG. 2, the insulating layer 13 is not drawn for easy viewing of the drawing.

  FIG. 3 is a cross-sectional view schematically showing the configuration of the electronic component mounting printed circuit board (printed circuit board on which the electronic component is mounted) according to the first embodiment. FIG. 4 is a plan view schematically showing the configuration of the electronic component mounting printed board according to the first embodiment.

  The electronic component (semiconductor integrated circuit chip) 200 is mounted on the printed circuit board 100 (the printed circuit board shown in FIGS. 1 and 2). The electronic component includes an electronic component body (semiconductor integrated circuit chip body) 20 and terminals 21. The terminal 21 of the electronic component 200 is electrically and mechanically connected to the first conductive pattern 11 of the printed circuit board 100 via the solder ball 30. In FIG. 4, the electronic component main body 20 and the insulating layer 13 are not drawn for easy viewing of the drawing.

  As shown in FIG. 3, the insulating layer (solder resist) 13 is separated from the electronic component 200. That is, the insulating layer 13 is separated from the electronic component main body 20. Hereinafter, this point will be described.

  As already described, in the present embodiment, the second conductive pattern 12 is formed in a mesh shape and has an opening 12p. Therefore, when forming the insulating layer 13 covering the second conductive pattern 12, the insulating layer 13 is formed so as to fill the opening 12p. Thus, in this embodiment, since the 2nd conductive pattern 12 has the opening 12p, it can prevent that the insulating layer 13 is formed more thickly than necessary.

  On the other hand, in the conventional printed circuit board, the second conductive pattern 12 does not have the opening 12p. Further, since the second conductive pattern 12 is a ground pattern or a power supply pattern, the pattern area is large. Therefore, conventionally, when the insulating layer 13 covering the second conductive pattern 12 is formed, the insulating layer 13 may be formed thicker than necessary. Thus, when the insulating layer 13 is formed thicker than necessary, the insulating layer 13 may come into contact with the electronic component body 20. If the insulating layer 13 contacts the electronic component body 20, the first conductive pattern 11 of the printed circuit board 100 and the terminal 21 of the electronic component 200 may not be connected via the solder ball 30. As a result, there is a possibility that poor conduction occurs between the first conductive pattern 11 of the printed circuit board 100 and the terminal 21 of the electronic component 200.

  In the present embodiment, since the second conductive pattern 12 has the opening 12p, the insulating layer 13 can be prevented from being formed thicker than necessary, and the first conductive pattern 11 of the printed circuit board 100 can be prevented. And the terminal 21 of the electronic component 200 can be reliably connected via the solder ball 30.

  5 and 6 are cross-sectional views schematically showing the printed circuit board manufacturing method of this embodiment.

  First, a substrate with a copper foil is prepared, and the copper foil is patterned. As a result, as shown in FIG. 5, the first conductive pattern 11 and the second conductive pattern 12 are formed on the printed board body 10.

  Next, a solder resist film is formed so as to cover the second conductive pattern 12. At this time, a solder resist film is formed so as to fill the opening 12p of the second conductive pattern 12. Further, by patterning the solder resist film, a solder resist pattern (insulating layer pattern) 13 is formed as shown in FIG.

  Through the above steps, a printed circuit board as shown in FIGS. 1 and 2 is obtained. Thereafter, the first conductive pattern 11 of the printed circuit board 100 and the terminals 21 of the electronic component 200 are connected by the solder balls 30. Thereby, an electronic component mounting printed board as shown in FIGS. 3 and 4 is obtained.

  As described above, according to the present embodiment, since the second conductive pattern 12 has the opening, it is possible to prevent the insulating layer 13 from being formed thicker than necessary. Therefore, the first conductive pattern 11 of the printed circuit board 100 and the terminal 21 of the electronic component 200 can be reliably connected.

(Embodiment 2)
Next, a second embodiment will be described. Since basic matters are similar to those of the first embodiment, explanation of the matters described in the first embodiment is omitted.

  FIG. 7 is a cross-sectional view schematically showing a configuration of an electronic component mounting printed circuit board (printed circuit board on which an electronic component is mounted) according to the second embodiment. FIG. 8 is a plan view schematically showing the configuration of the electronic component mounting printed board according to the second embodiment. In FIG. 8, the electronic component main body 20 and the insulating layer 13 are not drawn in order to make the drawing easy to see.

  In the present embodiment, the printed circuit board body 10 has a recess 12 u at a position corresponding to the opening of the second conductive pattern 12. In addition to the first pattern portion 12a, the second conductive pattern 12 has a second pattern portion 12b electrically connected to the first pattern portion 12a at the bottom of the recess 12u. The first pattern portion 12a and the second pattern portion 12b are connected by a third pattern portion 12c formed along the inner wall of the recess 12u. Other basic configurations are the same as those in the first embodiment.

  9 to 12 are cross-sectional views schematically showing the method for manufacturing a printed circuit board according to this embodiment.

  First, the printed circuit board body 10 with the copper foil 15 is prepared, and holes are formed in the copper foil 15 and the printed circuit board body 10 using a laser. Thereby, as shown in FIG. 9, a recess 12 u is formed in the printed circuit board body 10.

  Next, a copper plating process is performed on the structure of FIG. Thereby, as shown in FIG. 10, a copper plating film 16 is formed. Moreover, the 2nd conductive pattern 12 containing the 1st pattern part 12a, the 1st pattern part 12b, and the 3rd pattern part 12c is obtained.

  Next, the copper foil 15 and the copper plating film 16 are patterned. Thereby, as shown in FIG. 11, the first conductive pattern 11 is formed.

  Next, a solder resist film is formed so as to cover the second conductive pattern 12. At this time, a solder resist film is formed so as to fill the recess 12 u of the second conductive pattern 12. Further, by patterning the solder resist film, a solder resist pattern (insulating layer pattern) 13 is formed as shown in FIG.

  A printed circuit board is obtained by the above process. Thereafter, the first conductive pattern 11 of the printed circuit board 100 and the terminals 21 of the electronic component 200 are connected by the solder balls 30 to obtain an electronic component mounted printed circuit board as shown in FIGS.

  As described above, in the present embodiment as well, as in the first embodiment, the second conductive pattern 12 has an opening, thereby preventing the insulating layer 13 from being formed thicker than necessary. Can do. Therefore, the first conductive pattern 11 of the printed circuit board 100 and the terminal 21 of the electronic component 200 can be reliably connected.

  In the first and second embodiments described above, the second conductive pattern 12 has a mesh shape, but may not necessarily have a mesh shape as long as it has an opening.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

DESCRIPTION OF SYMBOLS 10 ... Printed circuit board main body 11 ... 1st conductive pattern 12 ... 2nd conductive pattern 12a ... 1st pattern part 12b ... 2nd pattern part 12c ... 3rd pattern part 12p ... Opening 12u ... Recessed part 13 ... Insulating layer DESCRIPTION OF SYMBOLS 15 ... Copper foil 16 ... Copper plating film 20 ... Electronic component main body 21 ... Terminal 30 ... Solder ball 100 ... Printed circuit board 200 ... Electronic component

Claims (12)

A substrate body including a first region on which electronic components are to be mounted;
A first conductive pattern provided on the first region and to be electrically connected to a terminal of the electronic component;
A second conductive pattern provided on the first region, including a first pattern portion having an opening and spaced from the first conductive pattern;
An insulating layer covering the second conductive pattern;
A printed circuit board comprising: The printed circuit board according to claim 1, wherein the first pattern portion is provided in a mesh shape. The printed circuit board according to claim 1, wherein the second conductive pattern includes a ground pattern or a power supply pattern. The printed circuit board according to claim 1, wherein the insulating layer fills the opening. The printed circuit board according to claim 1, wherein the first conductive pattern and the second conductive pattern are provided on the same plane. The printed circuit board according to claim 1, wherein the first conductive pattern and the second conductive pattern are formed of the same material. The printed circuit board according to claim 1, wherein the insulating layer is formed of a solder resist. The substrate body has a recess at a position corresponding to the opening;
The printed circuit board according to claim 1, wherein the second conductive pattern includes a second pattern portion electrically connected to the first pattern portion at a bottom of the concave portion. The printed circuit board according to claim 1, wherein the electronic component includes a semiconductor integrated circuit chip. A substrate body including a first region;
An electronic component mounted on the first region;
A first conductive pattern provided on the first region and electrically connected to a terminal of the electronic component;
A second conductive pattern provided on the first region, including a first pattern portion having an opening and spaced from the first conductive pattern;
An insulating layer covering the second conductive pattern;
An electronic component-mounted printed circuit board comprising: The electronic component mounting printed circuit board according to claim 10, wherein the insulating layer is separated from the electronic component. The electronic component mounting printed circuit board according to claim 10, wherein a terminal of the electronic component is connected to the first conductive pattern via a solder ball.

Images