JP2019135758A - Coil component - Google Patents

Abstract

To provide a coil component that contributes to improvement of a bonding state of a wire while suppressing corrosion of an electrode.SOLUTION: An Ag layer 71 constituting an electrode of a coil component is covered by a Cu plating layer 72, a Ni plating layer 73, and a Sn plating layer 74 in this order. Lead-out sections 51a, 51b, 52a, 52b of a wire are brought into contact with the Cu plating layer 72.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a coil component.

  Conventionally, as a coil component, a common mode choke coil is known in which a pair of wires are wound around a core portion of a drum core and the ends of the wires are electrically connected to electrode portions provided on the flange portions of the drum core, respectively. (For example, refer to Patent Document 1). In such a common mode choke coil, the lead wire, which is the terminal of each wire, is electrically connected to the electrode of the core flange. The electrode of the buttock may be plated (for example, refer to Patent Document 2).

JP 2014-75533 A JP 2009-26897 A

  By the way, in the common mode choke coil as described above, the lead portion (lead wire) which is a terminal of the wire is electrically connected to the electrode of the collar portion of the core. It is general that the electrode of such a common mode choke coil is covered with Ni plating and Sn plating, but it has been found that the core and the electrode may be peeled off due to the residual stress of Ni plating. Similarly, not only in the common mode choke coil but also in other coil parts, if the electrode is covered with Ni plating and Sn plating, there is a possibility that the electrode is peeled off from the core due to the residual stress of Ni plating.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a coil component that can prevent electrode peeling due to Ni residual stress.

  A coil component that solves the above problems includes a core having a core part, a core having a pair of flanges provided at both ends of the core part, electrodes provided on each of the pair of flanges, and the core part. And a lead portion having a wire electrically connected to the electrode, and the electrode is covered in the order of a Cu plating layer, a Ni plating layer, and a Sn plating layer.

  According to this configuration, by covering the electrode in the order of the Cu plating layer, the Ni plating layer, and the Sn plating layer, Ni in the Ni plating layer has a high residual stress, and thus there is a possibility that the electrode may be peeled off from the drum core. . Therefore, stress can be relaxed by interposing a relatively soft Cu plating layer between the Ni plating layer and the electrode.

In the coil component, it is preferable that the lead portion of the wire is in contact with the Cu plating layer.
According to this configuration, when the lead portion of the wire comes into contact with the Cu plating layer, for example, so-called Cu biting that occurs by using thermocompression bonding when the lead portion is electrically connected to the electrode of the collar portion occurs. However, since Cu is supplied from the Cu plating layer, it is possible to suppress the thinning of the wire. As a result, it can contribute to the improvement of the bonding state of the wires.

In the coil component, the wire preferably contains Cu, and the thickness of each plating layer is preferably 1 to 10 μm.
According to this configuration, the thickness of each plating layer is in the range of 1 to 10 μm, so that the wire can be crimped with high strength.

In the coil component, it is preferable that an intermediate Cu plating layer is located between the Ni plating layer and the Sn plating layer.
According to this configuration, since the wire is more reliably brought into contact with Cu by having the intermediate Cu plating layer, it is possible to prevent the wire from being thinned.

  According to the coil component of the present invention, it is possible to suppress electrode peeling due to Ni residual stress.

The perspective view of the coil components in 1st Embodiment. The bottom view of the coil components in the embodiment. The side view of the coil components in the embodiment. The front view of the coil components in the embodiment. (A)-(d) is sectional drawing which shows an example of the shape of the drum core in the embodiment. Sectional drawing which shows the plating structure in the collar part of the drum core in the embodiment. (A) (b) Explanatory drawing for demonstrating the ridge part and ridgeline part of a plate-shaped core in the embodiment. The perspective view of the coil components in 2nd Embodiment. The perspective view of the drum core in the embodiment. Sectional drawing for demonstrating the relationship between the slope and coil in the embodiment. The perspective view of the coil components in 3rd Embodiment. The perspective view of the drum core in the embodiment. The perspective view of the coil components in a modification. Sectional drawing which shows the plating structure in the collar part of the drum core in a modification.

(First embodiment)
Hereinafter, the first embodiment will be described. In the accompanying drawings, components may be shown in an enlarged manner for easy understanding. The dimensional ratios of the components may be different from the actual ones or in other drawings.

  As shown in FIG. 1, the coil component 10 is, for example, a common mode choke coil. The coil component 10 includes a drum core 11, a plate-like core 41 attached to the drum core 11, and first and second wires 51 and 52 wound around the drum core 11.

  As shown in FIG. 1, the drum core 11 has a rectangular parallelepiped core portion 21 and a pair of flange portions 31 provided at both ends of the core portion 21. The core portion 21 and the pair of flange portions 31 are integrally formed.

  Here, in this specification, as shown in FIGS. 1 to 4, the direction in which the pair of flange portions 31 are arranged (parallel direction) is defined as the “length direction Ld”, and the main surface of the plate-like core 41 is defined. A direction in which the plate-like core 41 and the flange portion 31 of the drum core 11 abut on each other is defined as a “height direction (thickness direction) Td”, and a “length direction Ld” and a “height direction Td”. A direction orthogonal to any of these is defined as “width direction Wd”.

The drum core 11 of this example is made of a magnetic material such as NiCuZn ferrite.
As shown in FIGS. 1 and 2, the core portion 21 is configured such that the first and second wires 51 and 52 are wound around the core portion 21.

  For example, the core portion 21 is formed in a rectangular parallelepiped shape extending in the length direction Ld. The central axis of the winding core portion 21 extends substantially parallel to the length direction Ld. The winding core portion 21 has a pair of main surfaces 21a and 21b facing each other in the height direction Td and a pair of side surfaces 21c and 21d facing each other in the width direction Wd. Here, in the main surfaces 21a and 21b, the side that is not the plate core 41 side in the height direction Td is the main surface 21a, and the plate core 41 side is the main surface 21b in the height direction Td.

  In addition, in this specification, “rectangular shape” includes a rectangular parallelepiped in which corners and ridge lines are chamfered (C chamfering), a rectangular parallelepiped that is rounded so that corners and ridges are appropriately R-planes, and corners. And a rectangular parallelepiped with a recessed ridgeline. Further, unevenness or the like may be formed on part or all of the main surface and side surfaces. An example of the cross-sectional shape of the core part 21 is shown to Fig.5 (a)-FIG.5 (d). As for the core part 21 shown to Fig.5 (a), the corner | angular part 21f has an angular recess. The core portion 21 shown in FIG. 5B is rounded so that the corner portion 21f has a curved shape. The core part 21 shown in FIG.5 (c) becomes a shape (C surface shape) by which the corner | angular part 21f was chamfered. The core part 21 shown in FIG.5 (d) is comprised so that a cross section may make an octagon (non-regular octagon) shape. In any configuration, when the wires 51 and 52 described later are wound around the core portion 21 in comparison with the configuration in which the cross section is rectangular (corner portion is 90 degrees), the wire 51 located at the corner portion 21f. , 52 becomes an obtuse angle. For this reason, it is possible to wind the wires 51 and 52 more closely to the core 21 than when the core is rectangular (rectangular).

  As shown in FIGS. 1-4, a pair of each collar part 31 is formed in the rectangular parallelepiped shape short in the length direction Ld. Each flange portion 31 is formed so as to project around the core portion 21 in the height direction Td and the width direction Wd. Specifically, the planar shape of each collar portion 31 when viewed from the length direction Ld is formed so as to protrude in the height direction Td and the width direction Wd with respect to the core portion 21.

  Each flange 31 includes a pair of main surfaces 31a and 31b facing each other in the length direction Ld, a pair of side surfaces 31c and 31d facing each other in the width direction Wd, and a pair of side surfaces 31e facing each other in the height direction Td. , 31f. The main surface 31a of each flange portion 31 faces the opposite side of the core portion 21 in the length direction Ld (outside of the drum core 11 in the length direction Ld). Here, the main surface 31 a of the flange portion 31 corresponds to the end surface of the flange portion 31. The main surface 31b of each flange portion 31 faces the winding core portion 21 side in the length direction Ld (inside the drum core 11 in the length direction Ld). That is, the main surfaces 31b of the flanges 31 correspond to opposing surfaces that face each other.

  Each flange 31 has two mounting surfaces 32a and 32b that are separated from each other on the side surface 31f that is mounted on a substrate (not shown), a central recess 33 that divides the two mounting surfaces 32a and 32b, and the central recess 33. On the opposite side to the mounting surfaces 32a and 32b, there are outer depressions 34a and 34b adjacent to the mounting surfaces 32a and 32b. The mounting surfaces 32a and 32b are configured to protrude in the height direction Td from the central recess portion 33 and the outer recess portions 34a and 34b. In this example, the distance from the mounting surfaces 32a and 32b to the main surface 21a of the core portion 21 is set to about 0.1 to 0.5 mm.

  Each flange 31 has a slope 35. The slope 35 is a linear slope that continues from the end of the main surface 21a in the axial direction of the core 21 to the outer recess 34b of the flange 31 with almost no step. The inclination angle of the slope 35 of this example is set to a range of 5 to 20 degrees with respect to the width direction Wd of the main surface 21a of the core part 21, and is about 14 degrees as shown in FIGS. It is preferable. Here, for example, when the inclination angle of the slope 35 is low, the wires 51 and 52 are likely to float from the slope 35. When the inclination angle of the slope 35 is high, it is difficult to apply a load to the wires 51 and 52 after crimping. Thus, floating of the wires 51 and 52 and an appropriate load on the wires 51 and 52 can be applied.

  As shown in FIG. 3, when the flanges 31 are viewed from the side (when viewed from the length direction Ld, which is the juxtaposed direction of the flanges 31), the slope 35 is formed by the main surface 31 a of the flanges 31. It is a hidden position. That is, the slope 35 is positioned closer to the core portion 21 in the height direction Td than the central recess portion 33. In addition, since the first and second wires 51 and 52 are hidden by the main surface 31a that is the end surface opposite to the main surface 31b that is the opposite surface of the flange 31 when viewed from the juxtaposed direction of the flange, For example, the resin at the time of molding can be prevented from coming into contact with the first and second wires 51 and 52, and the first and second wires 51 and 52 can be pulled even when an impact or molding resin expands or contracts. It is possible to prevent disconnection. Furthermore, the slope 35 is hidden when viewed from a direction parallel to the mounting surfaces 32a and 32b. With such a configuration, exposure of the wires 51 and 52 (drawers 51b and 52b described later) in the same direction is suppressed.

Moreover, the slope 35 is formed so that it may become a wide shape gradually from the core part 21 side to the collar part 31 (outside hollow part 34b).
Electrodes 36a and 36b are formed on the mounting surfaces 32a and 32b and the outer depressions 34a and 34b of one flange 31. More specifically, the electrode 36a is formed over the adjacent mounting surface 32a and the outer depression 34a, and the electrode 36b is formed over the adjacent mounting surface 32b and the outer depression 34b. Yes. Further, the mounting surfaces 32 a and 32 b are in a non-conductive state by the central depression 33. As a result, two electrodes 36 a and 36 b are formed on one flange 31.

  Further, terminal electrodes 36a and 36b are formed on the mounting surfaces 32a and 32b and the outer depressions 34a and 34b of the other flange portion 31, respectively. More specifically, the electrode 36a is formed over the adjacent mounting surface 32a and the outer depression 34a, and the electrode 36b is formed over the adjacent mounting surface 32b and the outer depression 34b. Yes. Further, the mounting surfaces 32 a and 32 b are in a non-conductive state by the central depression 33. As a result, two electrodes 36 a and 36 b are formed on the other flange 31.

  The electrode 36a of one flange 31 is located on the opposite side of the electrode 36a of the other flange 31 in the width direction Wd. The electrode 36b of one flange 31 is positioned on the opposite side of the electrode 36b of the other flange 31 in the width direction Wd. The electrode 36b is located on the outer depression 34b side, that is, on the terminal end side of the slope 35 as described above. In addition, the electrodes 36a and 36b of each collar part 31 are shown by the dot pattern (satin texture) in each figure.

Then, lead-out portions 51a, 51b, 52a, 52b of first and second wires 51, 52 described later are electrically connected to the electrodes 36a, 36b.
As shown in FIGS. 3 and 4, the collar portion 31 has a curved surface shape by rounding the ridge portions 31h and 31i around the side surface 31e opposite to the surface on which the electrodes 36a and 36b are formed. Yes.

  Specifically, as shown in FIG. 7A, the ridge line portion 31 h passes through the main surface 31 a of the flange portion 31 and extends on the extended surface SL1 along the main surface 31 a and the side surface 31 e of the flange portion 31. It has a shape that is recessed toward the center side of the collar portion 31 rather than a virtual ridgeline portion that passes through the extended surface SL2 along the side surface 31e. That is, the ridge line portion 31 h of the flange portion 31 is recessed toward the center side of the flange portion 31 as compared with the case where the angle in the cross-sectional shape of the ridge line portion is 90 degrees.

  Further, as shown in FIG. 7B, the ridge line portion 31i passes over the side surfaces 31c and 31d of the flange portion 31 and extends on the extended surface SL3 along the side surfaces 31c and 31d and the side surface 31e of the flange portion 31. It has a shape that is recessed toward the center side of the collar portion 31 with respect to the virtual ridge line portion with reference to the extended surface SL4 along the side surface 31e. That is, the ridge line portion 31 i of the flange portion 31 is recessed toward the center side of the flange portion 31 as compared with a case where the ridge line portion is a so-called pin angle. The ridge line portions 31h and 31i in this example have a radius of curvature of, for example, 30 μm or more and 100 μm or less.

  As described above, since the respective ridge line portions 31h and 31i are recessed, the spaces S1 and S2 exist in the ridge line portions 31h and 31i when the adhesive applied during the manufacturing described later flows. S1 and S2 act as a reservoir for storing the adhesive, and the adhesive can be prevented from flowing out. Note that the adhesive does not necessarily need to be stored in the spaces S1 and S2 serving as storage units.

  The length dimension L1 along the length direction Ld of the drum core 11 configured as described above is set in a range of about 1.2 to about 4.5 mm. Also, the height dimension along the height direction Td of the drum core 11 (the height dimension from the mounting surfaces 32a, 32b to the side surface 31e of the flange portion 31 along the height direction Td) T1 is about 0.5 to about The range is set to 2.1 mm. The width dimension along the width direction Wd of the drum core 11 (the width dimension along the width direction Wd of the flange 31) W1 is set in a range of 1.0 to 3.2 mm.

  As shown in FIGS. 1 to 4, the plate-like core 41 is bonded and fixed with an adhesive so as to straddle a pair of flanges 31, for example. The plate-like core 41 can be composed of a magnetic material or a nonmagnetic material. By providing the plate-like core 41, when the coil component 10 is mounted on the substrate, it is easy to be sucked by the suction nozzle of the automatic mounting machine. Further, when the plate-like core 41 is made of a magnetic material such as ferrite, a closed magnetic path can be formed by the drum core 11 and the plate-like core 41 that are also made of ferrite, so that leakage flux can be reduced. I can expect.

  The length dimension L4 along the length direction Ld of the plate-like core 41 of this example is slightly longer than the length dimension L1 of the drum core 11. Moreover, the height dimension T3 along the height direction Td of the plate-like core 41 is set in a range of 0.15 to 1.0 mm. The width dimension W3 along the width direction Wd of the plate-like core 41 is slightly longer than the width dimension W1 of the drum core 11 (the flange portion 31).

  Here, the change in the L value due to the difference between the plate-like core 41, the length dimension L4, and the length dimension L1 of the drum core 11 will be described. As shown in Table 1 and Table 2 below, when the length L4 of the plate core 41 is shortened by 0.1 mm with respect to the length L1 of the drum core 11 ("-0.1" in Table 1). ), L in the case of changing the amount of deviation in the length direction Ld with respect to the plate core of the drum core in three patterns of the same length, 0.1 mm longer ("0.1" in Table 1) The amount of change and the rate of change (%) were investigated. The amount of deviation in the length direction Ld indicates a case where there is no deviation and a case where the deviation is 0.1 mm from a predetermined position (position where there is no deviation), and both of the pair of flange portions 31 are displaced by 0.1 mm. Therefore, it is indicated as “0.2” in Table 1 because there is a total deviation of 0.2 mm.

As can be seen from Table 1 and Table 2, when the length dimension L4 of the plate core 41 is made longer than the length dimension L1 of the drum core 11, the drum core and the plate core are relatively positioned with respect to the length direction Ld. Even in the case of deviation, the value of the L value hardly changes. Therefore, as described above, the length L4 of the plate core 41 is longer than the length L1 of the drum core 11, or the width W3 of the plate core 41 is longer than the width W1 of the drum core 11. Thus, even if the length L1 of the drum core or the width W1 of the drum core is longer than the dimension tolerance, contact between the drum core 11 (the flange 31) and the plate core 41 is possible. Since a sufficient area can be secured, variation in L value due to dimensional tolerance can be suppressed.

As shown in FIGS. 3 and 4, the ridge line portions 41 a and 41 b of the plate-like core 41 have a recessed shape (notched shape).
Specifically, as illustrated in FIG. 7A, the ridge line portion 41 a passes through the main surface 42 of the plate core 41 and extends along the main surface 42, and the end surface of the plate core 41. 43 has a shape recessed toward the center side of the plate-like core 41 from the virtual ridge line portion with reference to the extended surface SL6 along the end surface 43. That is, the ridge line portion 41 a of the plate-like core 41 is recessed toward the center side of the plate-like core 41 as compared with the case where the ridge line portion is a so-called pin angle.

  Further, as shown in FIG. 7B, the ridge line portion 41 b passes over the main surface 42 of the plate core 41 and extends on the extended surface SL5 along the main surface 42 and the side surface 44 of the plate core 41. It has a shape that is recessed toward the center of the plate-like core 41 from the virtual ridge line portion through which the extended surface SL7 along the side surface 44 intersects. That is, the ridge line portion 41 a of the plate-like core 41 is recessed toward the center of the plate-like core 41 as compared with the case where the angle in the cross-sectional shape of the ridge line portion is 90 degrees.

  As described above, by forming the ridges 41a and 41b in a recessed shape, when the adhesive flows, the spaces S3 and S4 exist in the ridges 41a and 41b. It acts as a reservoir for storing, and can prevent the adhesive from flowing out. Note that the adhesive does not necessarily need to be stored in the spaces S3 and S4 serving as storage units.

  Further, the storage areas Ar1 and Ar3 of the spaces S1 and S2 of the ridge line portions 31h and 31i are preferably larger than the storage areas Ar2 and Ar4 of the spaces S3 and S4 of the ridge line portions 41a and 41b. Each storage area | region Ar1-Ar4 means the area of each space S1-S4 when the drum core 11 and the plate-shaped core 41 are cut | disconnected in the direction containing each ridgeline part 31h, 31i, 41a, 41b. In addition, each ridgeline part 31h, 31i, 41a, 41b may be shape | molded in the shape shown in each figure previously, and may be formed by post-processing, such as grinding | polishing. By setting it as such a structure, many adhesive agents can be guide | induced to the space by the side of the drum core 11 (ridge part 31). And since the length dimension L4 of the plate-shaped core 41 is longer than the length dimension L1 of the drum core 11, the unintentional enlargement in the length dimension of the coil component 10 can be suppressed by guiding the adhesive to the drum core 11 side. it can. Further, since the width dimension W3 of the plate-like core 41 is longer than the width dimension W1 of the flange 31 of the drum core 11, the unintentional enlargement of the width dimension of the coil component 10 is suppressed by guiding the adhesive to the drum core 11 side. Can do.

  The first and second wires 51 and 52 are covered electric wires, and are wound around the core portion 21 in the same winding direction to constitute a coil conductor. As the first and second wires 51 and 52, for example, ones having a diameter in the range of about 15 to about 80 μm can be used. As an example, a covered electric wire having a diameter of about 15 μm is used. The first and second wires 51 and 52 are wound around the core portion 21 so as to have the same number of turns. In this example, for example, the first and second wires 51 and 52 are wound to have 16 turns (32 turns in total).

  In addition, the lead portion 51 a which is one terminal of the first wire 51 is connected to the electrode 36 a of the one flange portion 31, and the lead portion 51 b which is the other terminal of the first wire 51 is connected to the other hook portion 31. Connected to the electrode 36b. At this time, the drawer portion 51b has a shape along the slope 35.

  The lead portion 52a which is one end of the second wire 52 is connected to the electrode 36b of the one flange portion 31, and the lead portion 52b which is the other end of the second wire 52 is the electrode 36a of the other flange portion 31. Connected. At this time, the lead portion 52b has a shape along the slope 35.

Next, the manufacturing method of the coil component 10 comprised as mentioned above is demonstrated.
First, the drum core 11 is formed using a mold.
Next, electrodes 36 a and 36 b are formed on the mounting surfaces 32 a and 32 b and the outer depressions 34 a and 34 b of each flange 31. The electrodes 36a, 36b can be formed by, for example, screen printing or dry plating Ag (silver) or the like on the mounting surfaces 32a, 32b and the outer depressions 34a, 34b of the flanges 31. At this time, the mounting surfaces 32a and 32b and the outer depressions 34a and 34b may be divided into two screen printing methods or a method using both screen printing and dry plating. At this time, the thickness of the electrodes 36a and 36b in the mounting surfaces 32a and 32b and the outer depressions 34a and 34b is set to about 0.1 to 0.5 μm in the case of dry plating, and about 0.1 in the case of screen printing. It is set to 10 μm to about 30 μm.

  Next, electrodes 36 a and 36 b are formed on the main surface 31 a (end surface) of the flange portion 31. At this time, it is formed so as to be electrically connected to the electrodes 36a, 36b formed on the mounting surfaces 32a, 32b and the outer depressions 34a, 34b. The electrodes 36a and 36b can be formed by screen-printing or dry-plating Ag, for example, on the main surface 31a (end surface) of each flange 31. At this time, the thickness of the electrodes 36a and 36b on the main surface 31a (end surface) is set to about 0.1 to about 0.5 μm in the case of dry plating, and about 10 μm to about 30 μm in the case of screen printing. Is set.

  Next, a plating process is performed. In this example, the plating process is performed in the order of Cu (copper) plating, Ni (nickel) plating, and Sn (tin) plating. That is, as shown in FIG. 6, the Cu plating layer 72, the Ni plating layer 73, and the Sn plating layer 74 are formed on the flange portion 31 on the Ag layer 71 constituting the electrodes 36 a and 36 b in this order from the outer depressions 34 a and 34 b. The three-layer plating process will be performed. Further, a new Cu plating layer may be applied between the Ni plating layer 73 and the Sn plating layer 74. The thickness of each layer by each plating treatment is set in the range of about 0.5 to about 15 μm, and more preferably in the range of about 1 to 10 μm. Note that Au (gold) may be used instead of Sn.

  Next, first and second wires 51 and 52 are prepared. As the first and second wires 51 and 52, for example, a wire containing Cu such as a CuNi alloy wire containing Ni can be adopted. Further, a resin material such as imide-modified polyurethane can be used for the coating. Thereby, Cu erosion of the wires 51 and 52 by the Sn plating layer 74 at the time of thermocompression bonding can be suppressed.

Next, the first and second wires 51 and 52 are wound around the core 21.
Next, the coating of the first and second wires 51 and 52 on the lead portions 51a, 51b, 52a and 52b is peeled off as necessary. The peeling method is not particularly limited, but for example, peeling can be performed using a laser. For example, when there is no need to peel off with a coating material, this step can be omitted.

  Next, in a state where the lead portions 51a, 51b, 52a, 52b of the first and second wires 51, 52 are pulled in parallel with the surfaces of the outer recess portions 34a, 34b, the electrodes 36a, It is electrically connected to 36b. There is no particular limitation on the pressure bonding method. For example, thermocompression bonding using a heater chip can be employed. At this time, the amount of crushing of the wires 51 and 52 (drawers 51a, 51b, 52a, and 52b) during crimping is less than 50%. At this time, the lead portions 51a, 51b, 52a, 52b of the wires 51, 52 may be in contact with the Cu plating layer 72 at least across the Sn plating layer 74 and the Ni plating layer 73 by thermocompression bonding with a heater chip. preferable. In this case, since Cu can be supplied from the Cu plating layer 72 to the wires 51 and 52 even when Cu erosion occurs, the wires 51 and 52 are prevented from becoming thin and the wires 51 and 52 are disconnected. Is suppressed.

  Next, the ends of the lead portions 51a, 51b, 52a, 52b of the first and second wires 51, 52 are cut. At this time, cutting is performed with the end portions of the lead portions 51a, 51b, 52a, 52b of the first and second wires 51, 52 extending from one of the main surface 31a and the side surfaces 31c, 31d (projected state). Is preferred. And it is more preferable that the edge part of the drawer | drawing-out part 51a, 51b, 52a, 52b after a cutting | disconnection will be in the state along either the main surface 31a and the side surfaces 31c, 31d. As described above, since the ends of the first and second wires 51 and 52 extending from either the main surface 31a or the side surfaces 31c and 31d are cut, the cutting is performed outside the drum core 11 and is easy to cut. It becomes. Furthermore, the influence which it has on the dimension of the coil component 10 whole can be made small by making the edge part of the drawer | drawing-out part 51a, 51b, 52a, 52b after a cutting | disconnection into the shape along the drum core 11. FIG. Further, the end portions of the lead portions 51a, 51b, 52a, and 52b extend to the main surface 31a and the side surfaces 31c and 31d, so that the wires 51 and 52 and the Sn plating layer 74 are not brought into contact with each other at that portion.

  Next, the plate core 41 is attached to the drum core 11. Specifically, a resin is applied to the side surface 31e of the collar portion 31 as an adhesive by dispensing or pin transfer. The plate-like core 41 can be brought into contact with the side surface 31e coated with the resin and pasted.

Next, the effect | action of the structure which said coil component 10 has is demonstrated.
In the coil component 10 of the present embodiment, the slope 35 is provided on the main surface 31b side of the flange portion 31 so that the drawer portions 51b and 52b are guided along the slope 35, that is, the drawer portions 51b and 52b are slope 35. It is a shape along. This prevents the drawer portions 51b and 52b from being bent. In addition, since the slope 35 is hidden by the flange 31 (main surface 31a) in a side view, the drawer portions 51b and 52b are also naturally hidden by the flange 31 (main surface 31a) in a side view. Thereby, for example, resin during molding can be prevented from coming into contact with the first and second wires 51 and 52, and the first and second wires 51 and 52 are pulled even when an impact or molding resin expands or contracts. It is possible to prevent disconnection.

  In addition, since each of the lead portions 51a, 51b, 52a, and 52b is provided in the outer recess portions 34a and 34b at positions recessed from the mounting surfaces 32a and 32b, the lead portions 51a, 51b, 52a, and 52b are mounted on the substrate during mounting. Therefore, disconnection can be suppressed.

  Furthermore, by covering the electrodes 36a and 36b in this order with the Cu plating layer 72, the Ni plating layer 73, and the Sn plating layer 74, there is an Sn plating layer 74 with good solder wettability when the coil component 10 is mounted on the substrate. Thus, the bondability between the electrodes 36a and 36b and the substrate (substrate land) is improved. For example, if only Sn is plated on the Ag layer 71, the Sn is dissolved and the Ag layer 71 is exposed, and Ag ion migration occurs between the two electrodes 36a and 36b, resulting in a short circuit risk. For this reason, since the effect | action which prevents Ag from moving by covering the electrodes 36a and 36b with the Ni plating layer 73 arises, the above-mentioned short circuit can be suppressed. Here, since Ni in the Ni plating layer 73 has a high residual stress, there is a possibility that the Ag layer 71 constituting the electrodes 36 a and 36 b may be peeled off from the drum core 11. Therefore, stress can be relieved by interposing a relatively soft Cu plating layer 72 between the Ni plating layer 73 and the Ag layer 71 constituting the electrodes 36a and 36b. In addition, the coil component 10 includes a ridge line portion 31h. By providing the spaces S1 and S2 in 31i and the spaces S3 and S4 in the ridge line portions 41a and 41b of the plate-like core 41, the adhesive can be stored in the spaces S1, S2, S3 and S4. Yes. By storing the adhesive in the spaces S1, S2, S3, and S4, it is possible to suppress the influence on the outer dimensions of the coil component 10, and to prevent the appearance shape from being damaged, and to suppress the unintended enlargement of the coil component 10. It has been.

As described above, according to the present embodiment, the following effects can be obtained.
(1) Slope 35 for guiding the lead portions 51b and 52b to the electrode 36b is provided in the flange portion 31, thereby suppressing the bending of the wires 51 and 52 (lead portions 51b and 52b) and suppressing the disconnection of the wires 51 and 52. Can do.

  (2) Since the slope 35 is provided in both of the pair of flange portions 31, the bending portions 51b and 52b of the first and second wires 51 and 52 connected to the electrode 36b of each flange portion 31 can be bent. This can suppress the disconnection of the first and second wires 51 and 52.

  (3) The first and second wires 51, 52 are hidden by the main surface 31 a opposite to the main surface 31 b side, which is the opposite surface of the heel portion, when viewed from the length direction Ld that is the juxtaposed direction of the heel portion 31. Because of this configuration, for example, after the coil component 10 is mounted on the substrate, when the periphery of the coil component 10 is molded with resin or the like, the resin flows from the flange 31 side and is molded into the first and second wires 51 and 52. Resin is suppressed. Here, for example, when the mold resin reaches the first and second wires 51 and 52, the first and second wires 51 and 52 may be pulled and disconnected due to expansion and contraction of the mold resin due to thermal shock. . Therefore, the disconnection of the first and second wires 51 and 52 can be suppressed by suppressing the mold resin from reaching the first and second wires 51 and 52 as described above.

  (4) Because the slope 35 is hidden when viewed from the length direction Ld, which is the direction in which the flanges 31 are arranged, and the width direction Wd, which is the direction orthogonal to the height direction Td, which is the direction in which the electrodes 36a, 36b face. , Exposure of the wires 51 and 52 (drawers 51b and 52b) in the same direction is suppressed.

  (5) By providing the lead portions 51b and 52b in a straight line along the slope 35, the lead portions 51b and 52b are not bent and the wire 51 and 52 (drawers 51b and 52b) can be prevented from being disconnected. it can.

  (6) The electrodes 36a and 36b are covered with the Cu plating layer 72, the Ni plating layer 73, and the Sn plating layer 74 in this order, so that the Ni plating layer 73 and the electrodes 36a and 36b (Ag layer 71) are relatively soft. By interposing the Cu plating layer 72, the stress can be relaxed.

  (7) The lead portions 51 a, 51 b, 52 a, 52 b of the wires 51, 52 are in contact with the Cu plating layer 72. And even if what is called Cu erosion generated by using thermocompression when electrically connecting the lead portions 51a, 51b, 52a, 52b to the electrodes 36a, 36b as in the present example, the Cu plating layer 72 Since Cu is supplied, the thinning of the wires 51 and 52 can be suppressed. As a result, it is possible to contribute to the improvement of the bonding state of the wires 51 and 52.

(8) By setting the thickness of each plating layer in the range of 1 to 10 μm, it is possible to strengthen the crimping of the wire.
(9) Since the lead portions 51a, 51b, 52a, 52b of the wires 51, 52 extend to the main surface 31a and the side surfaces 31c, 31d of the flange portion 31, the end portions of the lead portions 51a, 51b, 52a, 52b are Sn. Contact with the plating layer 74 can be suppressed. Therefore, it is possible to supply Cu at the end portions (portions not in contact with the Sn plating layer 74) of the lead portions 51a, 51b, 52a, and 52b to the lead portions 51a, 51b, 52a, and 52b of the crimping portions.

  (10) By having the spaces S1, S2, S3, and S4 as storage portions for storing the adhesive, even when the adhesive is about to flow to the outside when the plate-like core 41 and the drum core 11 are bonded and fixed, It can be stored in the spaces S1, S2, S3, S4 located in the ridge lines 31h, 31i, 41a, 41b. For this reason, it is possible to prevent the adhesive from spilling outside the outer dimensions of the plate-like core 41 and the drum core 11, and to prevent the appearance shape from being damaged, and to prevent unintended enlargement of the coil component 10.

  (11) The length L4 of the plate-like core 41 is longer than the length L1 of the flange 31 so that the contact position between the plate-like core 41 and the flange 31 is shifted in the length direction. Even in this case, the plate-like core 41 and the flange portion 31 can be reliably brought into contact with each other, and variations in the L value can be suppressed.

  (12) Even if the contact position between the plate-shaped core 41 and the flange 31 in the width direction is shifted by making the width dimension W3 of the plate-shaped core 41 longer than the width dimension W1 of the flange 31, the flange The enlargement of the coil component 10 due to the portion 31 protruding outside the plate-like core 41 can be suppressed. Furthermore, the plate-shaped core 41 and the collar part 31 can be reliably brought into contact with each other, and variations in the L value can be suppressed.

  (13) Since the spaces S <b> 1 to S <b> 4 as storage portions are provided in both the pair of flange portions 31 and the plate-shaped core 41, the adhesive is stored in the spaces S <b> 1 to S <b> 4 of both the flange portion 31 and the plate-shaped core 41. be able to.

  (14) By making the storage areas of the spaces S1 and S2 of the flange 31 larger than the storage areas of the spaces S3 and S4 of the plate-like core 41, a large amount of adhesive can flow toward the flange 31. Moreover, since the collar part 31 will be located relatively inside by making the length and width of the plate-shaped core 41 longer than the length and width of the collar part as described above, the collar part 31 side Even if many adhesives are flowed, it is possible to suppress an increase in size from the outer dimensions of the plate-like core 41.

(15) The ridge line portions 41a and 41b of the plate-like core 41 are recessed to prevent unintentional enlargement of the coil component 10.
(16) Adhesive that leaks can be sufficiently secured by setting the radii of curvature of the ridge portions 31h and 31i to 30 μm or more, and securing the bonding strength between the flange portion 31 and the plate core 41 by setting the curvature radius to 100 μm or less. Can do.

(Second Embodiment)
Hereinafter, a second embodiment will be described with reference to FIGS. Hereinafter, the difference from the first embodiment will be mainly described.

As shown in FIGS. 8 and 9, the drum core 11 of the coil component 10 of the present embodiment is different in that a groove 35 a is provided in the slope 35.
As shown in FIGS. 8 to 10, the groove 35 a provided in the slope 35 has a semicircular cross section and can be fitted with a part of the lead portions 51 b and 52 b of the first and second wires 51 and 52. Have Thereby, the displacement of the drawer portions 51b and 52b is suppressed, and the drawer portions 51b and 52b can be reliably guided. The groove 35a has a depth of 1/3 or more with respect to the diameters of the first and second wires 51 and 52, and more preferably has a depth of 1/2 or more. In addition, the inclination angle of the slope 35 of this example is set to a range of 5 to 20 degrees with respect to the width direction Wd of the main surface 21a of the core part 21, and is shown by, for example, about 10 degrees in FIGS. ing. The first and second wires 51 and 52 can each have a diameter in the range of about 15 to about 80 μm, for example, and in this example, a covered electric wire having a diameter of about 30 μm is used.

Next, the operation of the coil component 10 will be described.
In the coil component 10 of the present embodiment, a groove portion 35 a for allowing the lead portions 51 b and 52 b of the first and second wires 51 and 52 to run along the slope 35 is formed.

As described above, according to the present embodiment, the following effects can be obtained in addition to the effects (1) to (16) of the first embodiment.
(17) By providing the slope 35 with the groove portion 35a into which the lead portions 51b and 52b are fitted, the lead portions 51b and 52b are guided more reliably to suppress the bending of the lead portions 51b and 52b, and the wires 51 and 52 (drawers The disconnection of the portions 51b and 52b) can be suppressed.

(Third embodiment)
Hereinafter, the third embodiment will be described with reference to FIGS. 11 and 12. Hereinafter, the description will focus on differences from the first and second embodiments.

  As shown in FIGS. 11 and 12, the drum core 11 of the coil component 10 according to the present embodiment is different in that a wall 61 that is flush with the mounting surfaces 32 a and 32 b is provided in the central recess 33 of the flange 31. . The wall portion 61 is provided so as to connect the mounting surfaces 32 a and 32 b at the central recess portion 33. Thereby, inflow of the resin from the center hollow part 33 can be suppressed when molding with resin etc. so that the whole coil component 10 or the whole board | substrate may be insulation-coated. The distance from the mounting surfaces 32a and 32b of the drum core 11 to the main surface 21a of the core portion 21 is set to about 0.1 to about 0.5 mm.

  The angle of the slope 35 of the drum core 11 configured as described above is set in a range of 5 to 20 degrees with respect to the width direction Wd of the main surface 21a of the core portion 21, and in FIG. 11 and FIG. It shows 5.5 degrees.

As described above, according to this embodiment, in addition to the effects (1) to (17) of the first embodiment and the second embodiment, the following effects can be obtained.
(18) The wall portion 61 is provided so as to connect the mounting surfaces 32a and 32b to each other in the central recess portion 33. Thereby, inflow of the resin from the center hollow part 33 can be suppressed when molding with resin etc. so that the whole coil component 10 or the whole board | substrate may be insulation-coated. Therefore, it is possible to suppress disconnection by suppressing the influence on the wires 51 and 52 (the lead portions 51b and 52b).

In addition, you may implement each said embodiment in the following aspects.
In each of the above embodiments, the slope 35 is provided on both the pair of flanges 31. However, a configuration in which the slope 35 is provided only on one of the pair of flanges 31 may be employed.

  In each of the above embodiments, the slope 35 is configured to gradually widen from the core portion 21 side to the flange portion 31, but is not limited thereto. For example, a configuration in which the width is equal from the core portion 21 side to the flange portion 31 or a configuration in which the width is narrow from the core portion 21 side to the flange portion 31 may be employed.

In each of the embodiments described above, the slope 35 is a linear inclined surface, but it may be an inclined surface having a curved shape.
In the third embodiment, the wall 61 is provided in the central depression 33 so that the mounting surfaces 32a and 32b and the wall 61 are flush with each other. However, the present invention is not limited to this. For example, as shown in FIG. 13, you may employ | adopt the structure without the center hollow part 33. FIG. Even if it is such a structure, there exists an effect similar to (6).

  In each of the above embodiments, the length dimension L4 of the plate-like core 41 is longer than the length dimension L1 of the drum core 11, but this is not restrictive. For example, the length L4 of the plate core 41 and the length L1 of the drum core 11 are the same, or the length L1 of the drum core 11 is longer than the length L4 of the plate core 41. May be.

  In each of the above embodiments, the width dimension W3 of the plate-like core 41 is longer than the width dimension W1 of the flange 31 of the drum core 11. However, the present invention is not limited to this. For example, a configuration in which the width dimension W3 of the plate core and the width dimension W1 of the flange 31 of the drum core 11 are the same, or a structure in which the width dimension W1 of the drum core 11 is longer than the width dimension W3 of the plate core 41 is adopted. Also good.

  In each of the above embodiments, the Cu plating layer 72, the Ni plating layer 73, and the Sn plating layer 74 are plated in this order on the Ag layer 71 constituting the electrode, but an intermediate Cu plating layer is further added. A configuration may be adopted.

  As shown in FIG. 14, an intermediate Cu plating layer 75 is disposed between the Ni plating layer 73 and the Sn plating layer 74. By setting it as such a structure, since a wire will contact Cu more reliably, it can suppress that a wire becomes thin.

In the above-described embodiment, the ridge line portions 41a and 41b of the plate-like core 41 are recessed, but the present invention is not limited to this. For example, the ridge portions 41a and 41b may have a curved surface shape or a C surface shape.
-You may combine the said embodiment and each modification suitably.

  DESCRIPTION OF SYMBOLS 10 ... Coil components, 11 ... Drum core (core), 21 ... Core part, 31 ... Gutter part, 31h, 31i ... Ridge part, 32a, 32b ... Mounting surface, 35 ... Slope, 35a ... Groove part, 36a, 36b ... Electrode , 41 ... plate-like core, 41a, 41b ... ridge line part, 51 ... first wire (wire), 51a, 51b ... drawer part, 52 ... second wire (wire), 52a, 52b ... drawer part, 72 ... Cu plating Layer, 73 ... Ni plating layer, 74 ... Sn plating layer, 75 ... intermediate Cu plating layer, Ar1, Ar2, Ar3, Ar4 ... storage region, S1, S2, S3, S4 ... space (storage part), SL1, SL2, SL3, SL4, SL5, SL6, SL7 ... Extension surface.

Claims (4)

A core having a core portion and a pair of flange portions provided at both ends of the core portion, electrodes provided on each of the pair of flange portions, wound around the core portion and a lead portion A wire electrically connected to the electrode,
The electrode is a coil component covered with a Cu plating layer, a Ni plating layer, and a Sn plating layer in this order.   The coil component according to claim 1, wherein the lead portion of the wire is in contact with the Cu plating layer.   The coil component according to claim 1 or 2, wherein the wire contains Cu, and the thickness of each plating layer is 1 to 10 µm. The coil component according to any one of claims 1 to 3, wherein an intermediate Cu plating layer is located between the Ni plating layer and the Sn plating layer.