JP2019115076A - Antenna module and communication device - Google Patents

Abstract

To provide an easily customizable antenna module in accordance with requirements specifications of various models.SOLUTION: An antenna module is configured to mount a high frequency integrated circuit element and includes a dielectric substrate provided with: a circuit element mounting portion including a ground land and a plurality of lands for high-frequency signal; an antenna element including at least one radiation element; an exposure terminal portion including an exposed ground land and an exposed land for high-frequency signal; a first transmission line connecting a high-frequency signal land of the circuit element mounting portion and the radiation element; a second transmission line connecting an another high-frequency signal land of the circuit element mounting portion and a high-frequency signal land of the exposure terminal portion; and a ground conductor connecting a ground land of the circuit element mounting portion and a ground land of the exposure terminal portion. A post-attaching antenna element is connected to the exposed ground land of the exposure terminal portion and the exposed land for high-frequency signal.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an antenna module and a communication device.

  A wireless communication device provided with an antenna integrated module is known (Patent Document 1). The wireless communication device includes a mounting substrate having a rectangular through hole, and an antenna integrated module covering the through hole and mounted on the mounting substrate. A patch antenna is provided on the surface of the integrated antenna module exposed to the through hole. Radio waves radiated from the patch antenna propagate in the through hole and are radiated in the front direction as it is.

JP, 2009-81833, A

  Usually, in front of the patch antenna, it is necessary to have an opening in which no metal member serving as a radio wave shield is disposed. In small portable terminals such as smartphones, the position at which the opening can be provided in the housing is limited. Because the large display is disposed on the front of the housing, the position of the opening provided on the front is particularly restricted. Since the position of the opening is restricted, the installation location of the antenna module including the patch antenna and the like is also limited.

  If the installation place is limited for each model of the portable terminal, it is necessary to design an antenna module having a shape and directivity characteristic suitable for the installation place for each model of the portable terminal. Even if the required specification for the antenna module differs depending on the model of the portable terminal, an antenna module that can be easily customized according to the required specification of various models is desired.

  An object of the present invention is to provide an antenna module that can be easily customized according to the required specifications of various models. Another object of the present invention is to provide a communication device including this antenna module.

According to one aspect of the invention
A dielectric substrate,
A circuit element mounting portion provided on the dielectric substrate and configured to mount a high frequency integrated circuit element, and including a land for ground and a plurality of lands for high frequency signals;
An antenna element including at least one radiating element provided on the dielectric substrate;
An exposed terminal portion provided on the dielectric substrate and including an exposed land for ground and an exposed land for high frequency signal;
A first transmission line provided on the dielectric substrate and connecting the high-frequency signal land of the circuit element mounting portion to the radiation element;
A second transmission line provided on the dielectric substrate and connecting another land for a high frequency signal of the circuit element mounting portion and a land for a high frequency signal of the exposed terminal portion;
A ground conductor for connecting a ground land of the circuit element mounting portion and a ground land of the exposed terminal portion;
There is provided an antenna module having a post-installed antenna element connected to an exposed land for ground of the exposed terminal portion and an exposed land for high frequency signal.

According to another aspect of the invention:
The above-mentioned antenna module,
There is provided a communication device having a housing for housing the antenna module.

  A retrofit antenna element customized to the required specification can be mounted on the exposed terminal portion. By mounting a common antenna module on mobile terminals of different models and mounting a post-installed antenna element customized for each model on the exposed terminal of the antenna module, it is possible to flexibly meet the required specifications of each model. It is.

FIG. 1A is a cross-sectional view of an antenna module according to a first embodiment, and FIG. 1B is a plan view of an exposed terminal portion. FIG. 2A is a cross-sectional view of the antenna module according to the first example used in the first usage form, and FIG. 2B is a first implementation of the state used in the first usage type It is a top view of the exposed terminal part of the antenna module by an example. FIG. 3 is a cross-sectional view of the antenna module according to the first embodiment in a state of being used in the second utilization mode. FIG. 4 is a cross-sectional view of the antenna module according to the first embodiment in the state of being used in the third usage mode. FIG. 5 is a partial cross-sectional view of a portable terminal on which the antenna module according to the second embodiment is mounted. FIG. 6 is a partial cross-sectional view of another portable terminal on which the antenna module according to the second embodiment is mounted. FIG. 7 is a cross-sectional view of an antenna module according to a third embodiment and a high frequency component mounted on the antenna module. FIG. 8 is a cross-sectional view of an antenna module according to a modification of the third embodiment and a high frequency component mounted on the antenna module. FIG. 9 is a cross-sectional view of an antenna module according to a fourth embodiment and a high frequency component mounted on the antenna module. FIG. 10 is a cross-sectional view of an antenna module according to the fifth embodiment.

First Embodiment
An antenna module according to a first embodiment will be described with reference to FIGS. 1A to 4.

  FIG. 1A is a cross-sectional view of an antenna module according to a first embodiment. A circuit element mounting portion 11, an antenna element 12, and an exposed terminal portion 13 are provided on the dielectric substrate 10. The antenna element 12 includes a radiating element 12A provided on one surface (upper surface) of the dielectric substrate 10 and a radiating element 12B provided on the other surface (lower surface). The radiation element 12A is covered with a solder resist film 31 formed on the upper surface of the dielectric substrate 10, and the radiation element 12B is covered with a solder resist film 32 formed on the lower surface of the dielectric substrate 10.

  Circuit element mounting portion 11 includes a plurality of lands 11A for ground provided on the upper surface of dielectric substrate 10 and a plurality of lands 11B for high frequency signals. The terminals of the high frequency integrated circuit element 30 are connected to the lands 11A and 11B. For example, the ground terminals of the high frequency integrated circuit element 30 are connected to the plurality of lands 11A for ground, and the corresponding high frequency signal terminals of the high frequency integrated circuit element 30 are connected to the plurality of lands 11B for high frequency signals. Ru. As described above, the circuit element mounting unit 11 is configured to mount the high frequency integrated circuit element 30.

  The exposed terminal portion 13 includes at least one ground land 13A provided on the top surface of the dielectric substrate 10 and at least one high frequency signal land 13B. A part of the upper surface of each of the lands 13A and 13B of the exposed terminal portion 13 is exposed in the opening provided in the solder resist film 31.

  Ground conductors 15 are disposed on the upper surface and the inside of the dielectric substrate 10. Furthermore, a first transmission line 16, a second transmission line 17, and a third transmission line 18 are provided inside the dielectric substrate 10. The first transmission line 16 connects the land 11B for high frequency signals of the circuit element mounting unit 11 and the radiation element 12A. The second transmission line 17 connects another land 11 B for high frequency signals of the circuit element mounting portion 11 and the land 13 B for high frequency signals of the exposed terminal portion 13. The third transmission line 18 connects the land 11B for a further high frequency signal of the circuit element mounting portion 11 and the radiation element 12B. The ground conductor 15 connects the land 11A for ground of the circuit element mounting portion 11 and the land 13A for ground of the exposed terminal portion 13.

  The radiating elements 12A and 12B constitute a patch antenna together with the ground conductor 15 of the inner layer. The radiation element 12A emits radio waves to the upper surface side of the dielectric substrate 10, and the radiation element 12B emits radio waves to the lower surface side of the dielectric substrate 10.

  FIG. 1B is a plan view of the exposed terminal portion 13. A land 13B for high frequency signal is disposed between the pair of ground lands 13A. The lands 13A for ground are continuous with the ground conductors 15 disposed on the upper surface or the inner layer of the dielectric substrate 10, respectively. The land 13 B for high frequency signals is connected to the second transmission line 17 (FIG. 1A) in the inner layer through the conductor via 19.

  When the high frequency integrated circuit element 30 is mounted on the circuit element mounting portion 11, high frequency power is supplied from the high frequency integrated circuit element 30 to the radiation element 12 A via the first transmission line 16 and exposed via the second transmission line 17. The high frequency power is supplied to the land 13 B for high frequency signals of the terminal portion 13, and the high frequency power is supplied to the radiation element 12 B through the third transmission line 18.

  Next, with reference to FIGS. 2A and 2B, a first application of the antenna module according to the first embodiment will be described.

  FIG. 2A is a cross-sectional view of the antenna module according to the first embodiment in a state of being used in the first usage mode. A high frequency integrated circuit element 30 is mounted on the circuit element mounting portion 11. The high frequency probe 33 of the high frequency inspection apparatus 35 is brought into contact with the exposed terminal portion 13.

  FIG. 2B is a plan view of the exposed terminal portion 13 of the antenna module according to the first embodiment in a state of being used in the first usage mode. The probes 34A, 34B, 34C of the high frequency probe 33 (FIG. 2A) are brought into contact with the land 13A for ground, the land 13B for high frequency signal, and the other land 13A for ground.

  By bringing the high frequency probe 33 into contact with the exposed terminal portion 13, the inspection of the high frequency integrated circuit element 30 can be performed by wire. By performing the inspection in a wired manner, the inspection can be performed more simply and with higher accuracy than the inspection in which the radio waves radiated from the radiation elements 12A and 12B are measured. As described above, in the first usage form, the exposed terminal portion 13 is used as a terminal for inspection.

  Next, with reference to FIG. 3, a second application of the antenna module according to the first embodiment will be described.

  FIG. 3 is a cross-sectional view of the antenna module according to the first embodiment in a state of being used in the second utilization mode. The high frequency integrated circuit element 30 is mounted on the circuit element mounting portion 11, and the antenna element 40 (for example, a chip antenna) is mounted on the exposed terminal portion 13. The antenna element 40 includes a radiation element 41 and a ground conductor 42. The radiation element 41 and the ground conductor 42 constitute a patch antenna. The radiation element 41 is connected to the land 13B for high frequency signals, and the ground conductor 42 is connected to the land 13A for ground. The antenna element 40 emits radio waves to the upper surface side of the dielectric substrate 10.

  The antenna element 40 is retrofitted to the antenna module according to the first embodiment. On the other hand, the antenna element 12 (FIG. 1A) is built in the antenna module.

  Next, with reference to FIG. 4, a third application of the antenna module according to the first embodiment will be described.

  FIG. 4 is a cross-sectional view of the antenna module according to the first embodiment in the state of being used in the third usage mode. The high frequency integrated circuit element 30 is mounted on the circuit element mounting portion 11, and the antenna element 45 (for example, a chip antenna) is mounted on the exposed terminal portion 13. The antenna element 45 includes a monopole antenna 46, a reflector 47 and a waveguide 48. The monopole antenna 46 is connected to the land 13B for high frequency signals. The reflector 47 and the waveguide 48 are connected to the land 13A for ground. The antenna element 45 emits radio waves in the direction in which one end face of the dielectric substrate 10 faces. The antenna element 45 is retrofitted to the antenna module according to the first embodiment.

  In the second and third modes of use shown in FIGS. 3 and 4 as described above, the exposed terminal portion 13 is used as a terminal for mounting an antenna element.

  Next, excellent effects when using the antenna module according to the first embodiment in the second and third usage modes will be described.

  When the lower surface of the dielectric substrate 10 (FIG. 1A) is brought into close contact with the inner surface such as the glass surface of the housing of a portable terminal such as a smartphone or the front surface made of dielectric material, it is provided on the lower surface of the dielectric substrate 10 The positional relationship between the radiating element 12B (FIG. 1A) and the surface of the housing is substantially constant regardless of the model of the portable terminal. For this reason, the directivity characteristics and the like of the radiation element 12B are not easily influenced by the difference in the structure of the portable terminal on which the antenna module is mounted. Accordingly, the radiating element 12B need not be designed separately for each model of the terminal to be accommodated, and may be designed to have common characteristics for a plurality of models.

  On the other hand, the directivity characteristic of the antenna element installed at the end of the case depends on the positional relationship between the antenna element and the end of the case, and the positional relationship between the antenna element and peripheral parts. These positional relationships are not necessarily the same for each model of the portable terminal. For this reason, in order to obtain desired directional characteristics with various models, it is necessary to adjust the characteristics of the antenna element located at the end of the housing for each model.

  In the antenna module according to the first embodiment, the antenna element 40 (FIG. 3) and the antenna element 45 (FIG. 4) to be retrofitted have optimum characteristics (for example, polarization characteristics and the like) according to the type of terminal mounted. Can be customized to obtain directional characteristics). Since the characteristics of the radiating element 12B are unlikely to be affected by the difference in the structure of the portable terminal, the antenna module incorporating the radiating element 12B can be commonly applied to a plurality of models.

Second Embodiment
Next, an antenna module according to a second embodiment will be described with reference to FIGS. 5 and 6. Hereinafter, differences from the antenna module according to the first embodiment shown in FIGS. 1A to 4 will be described, and the description of the common configuration will be omitted.

  FIG. 5 is a partial cross-sectional view of a portable terminal on which the antenna module 20 according to the second embodiment is mounted. The antenna module 20 includes a dielectric substrate 10, a circuit element mounting portion 11, an exposed terminal portion 13, and an antenna element 24. The antenna element 24 includes a plurality of radiating elements 23 provided on the lower surface of the dielectric substrate 10. The plurality of radiating elements 23 constitute a patch array antenna. The plurality of radiation elements 23 are connected to the high frequency signal terminals of the high frequency integrated circuit element 30 mounted on the circuit element mounting unit 11 respectively.

  A flexible printed wiring board (FPC board) 50 is connected to the exposed terminal portion 13. The FPC board 50 is provided with a transmission line 51 and an antenna element 52. The antenna element 52 is connected to the ground land 13A of the exposed terminal portion 13 and the land 13B for a high frequency signal through the transmission line 51. As the antenna element 52, for example, a patch antenna including a radiation element and a ground plane is used.

  The antenna module 20 is accommodated in a thin case 60 such as a portable terminal. The surface of the dielectric substrate 10 on which the antenna element 24 is provided is in close contact with the inner surface of the front plate 60F of the housing 60. The antenna element 52 provided on the FPC board 50 is in close contact with the inner surface of the back plate 60B of the housing 60 by bending the FPC board 50.

  The antenna element 24 built in the antenna module 20 emits radio waves in the front direction of the housing 60, and the antenna element 52 provided on the FPC board 50 emits radio waves in the back direction of the housing 60.

  FIG. 6 is a partial cross-sectional view of another portable terminal on which the antenna module 20 according to the second embodiment is mounted. The antenna element 52 provided on the FPC board 50 is disposed inside the end plate 60E of the housing 60. The antenna element 52 emits radio waves in a direction (a direction parallel to the front and back) in which the end plate 60E of the housing 60 faces.

  Next, the excellent effects of the antenna module according to the second embodiment will be described.

  When both the front-facing antenna element and the rear-facing antenna element are disposed on the dielectric substrate 10, the positional relationship between the front-facing antenna element and the rear-facing antenna element can not be adjusted. In some cases, it is difficult to secure a space for housing the antenna module at a position in the housing where good antenna characteristics can be obtained for both the front-side antenna element and the rear-side antenna element.

  On the other hand, in the antenna module according to the second embodiment, as shown in FIG. 5, the relative position between the antenna element 24 for the front and the antenna element 52 for the back can be obtained by deforming the FPC board 50. It can be adjusted. For this reason, the antenna element 24 for front side and the antenna element 52 for back side can be arrange | positioned in the position where a favorable antenna characteristic is obtained, respectively. Even when the antenna module is housed in a portable terminal of a different model, the position of the built-in antenna element 24 and the antenna element 52 to be attached later can be changed by changing the shape and dimensions of the FPC board 50 It is possible to optimize for each.

  The radiation element 23 of the antenna element 24 is provided on the surface opposite to the surface on which the circuit element mounting portion 11 and the exposed terminal portion 13 are provided. Therefore, the radiation element 23 can be disposed in close contact with or in close proximity to the front plate 60F of the housing 60.

  Furthermore, as shown in FIG. 6, it is also possible to arrange the antenna element 52 so as to emit radio waves in the direction in which the end plate 60E of the housing 60 faces.

  Next, various modifications of the second embodiment will be described. A patch array antenna may be used as the retrofitted antenna element 52 shown in FIGS. 5 and 6 similarly to the built-in antenna element 24. In this case, lands 13 B for high frequency signals corresponding to the number of radiating elements of the patch array antenna may be disposed on the exposed terminal portion 13, and a plurality of transmission lines may be provided on the FPC board 50.

  In the second embodiment, an example in which the antenna element 52 is provided on the FPC board 50 has been described. However, a mounting portion is provided for mounting the antenna element on the FPC board 50, and desired characteristics are provided to the mounting portion. You may make it mount the antenna element which it has.

  In the example shown in FIG. 5, the antenna element 24 provided on the dielectric substrate 10 is brought into close contact with the inner surface of the front plate 60F of the housing 60, and the antenna element 52 provided on the FPC substrate 50 is provided in the housing 60. Although the inner surface of the back plate 60B is in close contact, the antenna element 24 may be in close contact with the inner surface of the back plate 60B and the antenna element 52 may be in close contact with the inner surface of the front plate 60F. The antenna elements 24 and 52 do not necessarily have to be in close contact with the inner surface of the housing 60, and a gap may be provided between the antenna elements 24 and 52 and the inner surface of the housing 60.

  Although the patch antenna is used as the antenna element 52 provided on the FPC board 50 in the examples shown in FIGS. 5 and 6, an antenna having another structure may be used. For example, a monopole antenna, a dipole antenna, a slot antenna or the like may be used.

Third Embodiment
Next, an antenna module according to a third embodiment will be described with reference to FIGS. 7 and 8. Hereinafter, differences from the antenna modules according to the first and second embodiments will be described, and the description of the common configuration will be omitted.

  FIG. 7 is a cross-sectional view of an antenna module according to a third embodiment and a high frequency component mounted on the antenna module. In the first embodiment and the second embodiment, lands 13A for ground and lands 13B for high frequency signals are disposed in the exposed terminal portion 13 (FIG. 1A, FIG. 5). In the third embodiment, a land 13C for an intermediate frequency signal and a land 13D for a DC power supply are further disposed in the exposed terminal portion 13.

  Lands for intermediate frequency signals and lands for DC power supply are also arranged in the circuit element mounting portion 11. The land for the intermediate frequency signal of the circuit element mounting portion 11 and the land for the DC power supply do not appear in the cross section shown in FIG. The land for the intermediate frequency signal of the circuit element mounting portion 11 and the land 13 C for the intermediate frequency signal of the exposed terminal portion 13 are connected by a fourth transmission line 58 provided on the dielectric substrate 10. The land for the DC power supply of the circuit element mounting portion 11 and the land 13D for the DC power supply of the exposed terminal portion 13 are connected by the power supply wiring 59 provided on the dielectric substrate 10.

  In addition to the transmission line 51 for high frequency signals, the FPC board 50 connected to the exposed terminal portion 13 is provided with a transmission line 53 for intermediate frequency signals and a wire 54 for DC power supply. The antenna element 52 is provided on the FPC board 50, and the baseband integrated circuit element 55 is mounted. The baseband integrated circuit element 55 is connected to the land 13C for the intermediate frequency signal of the exposed terminal portion 13 and the land 13D for the DC power supply via the transmission line 53 and the wiring 54 of the FPC board 50.

  Next, an antenna module according to a modification of the third embodiment will be described with reference to FIG.

  FIG. 8 is a cross-sectional view of an antenna module according to a modification of the third embodiment and a high frequency component mounted on the antenna module. In the third embodiment, the exposed terminal portion 13 is provided with a land 13A for ground, a land 13B for high frequency signal, a land 13C for intermediate frequency signal, and a land 13D (FIG. 7) for DC power supply. . On the other hand, in the modification shown in FIG. 8, the land 14A for ground, the land 14B for intermediate frequency signal, and the land 14C for DC power supply are provided in the exposed terminal portion 14 different from the exposed terminal portion 13. ing. The FPC board 57 on which the baseband integrated circuit element 55 is mounted is connected to the exposed terminal portion 14.

  Next, the superior effects of the antenna module according to the third embodiment and its modification will be described. In the third embodiment, the high frequency integrated circuit element 30 and the baseband integrated circuit element 55 are connected via the FPC board 50 connected to the exposed terminal portion 13. In the modification of the third embodiment, the high frequency integrated circuit element 30 and the baseband integrated circuit element 55 are connected via the FPC board 57 connected to the exposed terminal portion 14. Therefore, it is not necessary to provide the dielectric substrate 10 with a connector for connecting to the baseband integrated circuit device 55.

Fourth Embodiment
Next, an antenna module according to a fourth embodiment will be described with reference to FIG. Hereinafter, differences from the antenna modules according to the first and second embodiments will be described, and the description of the common configuration will be omitted.

  FIG. 9 is a cross-sectional view of an antenna module according to a fourth embodiment and a high frequency component mounted on the antenna module. In the first and second embodiments, a rigid dielectric substrate 10 is used for the antenna module. On the other hand, in the fourth embodiment, the FPC board 70 is used for the antenna module.

  The circuit element mounting portion 11, the exposed terminal portion 13, and the antenna element 24 are provided on the FPC board 70. The antenna element 24 is provided on the surface opposite to the surface on which the circuit element mounting portion 11 is provided, and is disposed at a position at least partially overlapping the circuit element mounting portion 11. The exposed terminal portion 13 is disposed at a position not overlapping any of the circuit element mounting portion 11 and the antenna element 24. The high frequency integrated circuit element 30 is mounted on the circuit element mounting portion 11, and the antenna element 71 for retrofitting is mounted on the exposed terminal portion 13.

  The area of the FPC board 70 where the antenna element 24 is disposed is in close contact with the inner surface of the front plate 60F of the housing 60, and the antenna element 71 is a back plate 60B of the housing 60 by bending the FPC board 70. The antenna module is housed in the housing 60 so as to be in close contact with the inner surface of the antenna.

  Next, the excellent effects of the antenna module according to the fourth embodiment will be described.

Since the exposed terminal portion 13 is disposed at a position not overlapping any of the circuit element mounting portion 11 and the antenna element 24, the antenna element 71 mounted on the exposed terminal portion 13 by deforming the FPC board 70, The positional relationship with the built-in antenna element 24 can be changed. Since the built-in antenna element 24 and the circuit element mounting portion 11 at least partially overlap, the area of the FPC board 70 can be reduced as compared to the case where the both are not overlapped.
Compared with the second application mode (FIG. 3) of the antenna module according to the first embodiment, in the antenna module according to the fourth embodiment, the degree of freedom of the position of the retrofitted antenna element 71 can be enhanced. As compared with the antenna module (FIG. 5) according to the second embodiment, in the fourth embodiment, the antenna element 71 having a chip antenna structure may be prepared as a component to be retrofitted to the antenna module, and the dielectric shown in FIG. It is necessary to prepare the FPC board 50 for connecting to the body board 10

Fifth Embodiment
Next, an antenna module according to a fifth embodiment will be described with reference to FIG. Hereinafter, differences from the antenna module according to the fourth embodiment will be described, and the description of the common configuration will be omitted.

  FIG. 10 is a cross-sectional view of an antenna module according to the fifth embodiment. In the fourth embodiment, the exposed terminal portion 13 (FIG. 9) is provided on the FPC board 70, and the antenna element 71 is attached to the exposed terminal portion 13 later. On the other hand, in the fifth embodiment, the FPC board 70 is used as in the fourth embodiment, but both the antenna element 24 and the antenna element 75 are incorporated in the antenna module. One antenna element 24 is disposed at a position partially overlapping the circuit element mounting portion 11, and the other antenna element 75 is disposed at a position not overlapping any of the circuit element mounting portion 11 and the antenna element 24.

  The exposed terminal portion 13 is provided with lands 13 E for connecting the antenna auxiliary component 76. By mounting the antenna auxiliary component 76 on the exposed terminal portion 13, the characteristics of the antenna element 75 can be adjusted. Examples of the antenna auxiliary component 76 include a reflector and a parasitic element. By mounting the antenna auxiliary component 76, the antenna element 75 can be made into a wide band, directivity characteristics control, suppression of characteristic deterioration, and the like.

  It goes without saying that the above-described embodiments are exemplification, and partial replacement or combination of the configurations shown in the different embodiments is possible. Similar advantages and effects resulting from similar configurations of the multiple embodiments will not be sequentially described in each embodiment. Furthermore, the invention is not limited to the embodiments described above. For example, it will be apparent to those skilled in the art that various modifications, improvements, combinations, and the like can be made.

DESCRIPTION OF SYMBOLS 10 dielectric substrate 11 circuit element mounting part 11A land 11B for ground of circuit element mounting part land for high frequency signal of circuit element mounting part 12 antenna element 12A, 12B radiation element 13 exposed terminal part 13A for exposed terminal Land 13B Land 13C for high frequency signal of exposed terminal area Land 13D for intermediate frequency signal of exposed terminal area Land 13E for DC power supply of exposed terminal area Land for antenna auxiliary component of exposed terminal area 14 Exposed terminal area 14A for ground Land 14B Land for intermediate frequency signal 14C Land for DC power supply 15 Ground conductor 16 First transmission line 17 Second transmission line 18 Third transmission line 19 Conductor via 20 Antenna module 23 Radiation element 24 Antenna element 30 High frequency Integrated circuit elements 31, 32 Solder resist film 33 High frequency pro 34A, 34B, 34C Probe 35 High frequency inspection device 40 Antenna element 41 Radiation element 42 Ground conductor 45 Antenna element 46 Monopole antenna 47 Reflector 48 Waveguide 50 Flexible printed wiring (FPC) substrate 51 Transmission line 52 Antenna element 53 Transmission line 54 for intermediate frequency signals Wiring 55 for DC power supply Baseband integrated circuit element 57 FPC board 58 Fourth transmission line 59 Power supply wiring 60 Case 60B Back plate 60E End plate 60F Front plate 70 FPC board 71 Antenna element 75 Antenna element 76 Antenna auxiliary parts

Claims (9)

A dielectric substrate,
A circuit element mounting portion provided on the dielectric substrate and configured to mount a high frequency integrated circuit element, and including a land for ground and a plurality of lands for high frequency signals;
An antenna element including at least one radiating element provided on the dielectric substrate;
An exposed terminal portion provided on the dielectric substrate and including an exposed land for ground and an exposed land for high frequency signal;
A first transmission line provided on the dielectric substrate and connecting the high-frequency signal land of the circuit element mounting portion to the radiation element;
A second transmission line provided on the dielectric substrate and connecting another land for a high frequency signal of the circuit element mounting portion and a land for a high frequency signal of the exposed terminal portion;
A ground conductor for connecting a ground land of the circuit element mounting portion and a ground land of the exposed terminal portion;
An antenna module having a post-installed antenna element connected to an exposed land for ground of the exposed terminal portion and an exposed land for high frequency signal. The antenna element includes the radiation element provided on the surface of the dielectric substrate opposite to the surface provided with the circuit element mounting portion,
The antenna module according to claim 1, wherein the exposed terminal portion is provided on the same surface as the surface on which the circuit element mounting portion of the dielectric substrate is provided. The dielectric substrate is composed of a flexible printed wiring board,
The antenna element is provided on the surface of the dielectric substrate opposite to the surface on which the circuit element mounting portion is provided, and the radiation element is disposed at a position at least partially overlapping the circuit element mounting portion. Including
The antenna module according to claim 1, wherein the exposed terminal portion is disposed at a position not overlapping any of the circuit element mounting portion and the radiation element. And a flexible printed wiring board connecting the exposed terminal portion and the post-installed antenna element,
The said retrofit antenna element is connected to the exposed land for grounds of the said exposed terminal part, and the exposed land for high frequency signals via the transmission line provided in the said flexible printed wiring board. The antenna module as described in. The circuit element mounting portion further includes a land for an intermediate frequency signal,
The exposed terminal portion further includes an exposed land for an intermediate frequency signal,
further,
A baseband integrated circuit element mounted on the flexible printed wiring board;
It has a fourth transmission line for the intermediate frequency signal which is provided on the dielectric substrate and connects the land for the intermediate frequency signal of the circuit element mounting portion and the land for the intermediate frequency signal of the exposed terminal portion. ,
The antenna module according to claim 4, wherein the baseband integrated circuit element is connected to an exposed land for an intermediate frequency signal of the exposed terminal portion through another transmission line provided on the flexible printed wiring board. . The circuit element mounting portion further includes a land for an intermediate frequency signal,
further,
A land for an intermediate frequency signal provided on a second exposed terminal portion of the dielectric substrate different from the exposed terminal portion;
A second flexible printed wiring board mounting a baseband integrated circuit element and connecting the baseband integrated circuit element and a land for an intermediate frequency signal of the second exposed terminal portion;
A fourth transmission line for an intermediate frequency signal provided on the dielectric substrate and connecting a land for an intermediate frequency signal of the circuit element mounting portion and a land for an intermediate frequency signal of the exposed terminal portion The antenna module according to Item 4.   The antenna module according to any one of claims 1 to 6, wherein the antenna element and the retrofit antenna element are patch antennas and face in opposite directions.   The antenna module according to any one of claims 1 to 6, wherein the antenna element and the retrofit antenna element are patch antennas and directed in directions orthogonal to each other. The antenna module according to any one of claims 1 to 8.
A communication apparatus comprising: a housing for housing the antenna module.

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