JP2019112594A - Resin composition for bonding, primer, adhesive agent and article - Google Patents
Resin composition for bonding, primer, adhesive agent and article Download PDFInfo
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- JP2019112594A JP2019112594A JP2017249397A JP2017249397A JP2019112594A JP 2019112594 A JP2019112594 A JP 2019112594A JP 2017249397 A JP2017249397 A JP 2017249397A JP 2017249397 A JP2017249397 A JP 2017249397A JP 2019112594 A JP2019112594 A JP 2019112594A
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- mass
- parts
- resin composition
- polysiloxane
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- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 42
- 239000000853 adhesive Substances 0.000 title claims description 11
- -1 polysiloxane Polymers 0.000 claims abstract description 79
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 50
- 239000000805 composite resin Substances 0.000 claims abstract description 31
- 229920000642 polymer Polymers 0.000 claims abstract description 17
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims abstract 4
- 239000000203 mixture Substances 0.000 claims description 76
- 239000011248 coating agent Substances 0.000 claims description 56
- 238000000576 coating method Methods 0.000 claims description 55
- 239000004840 adhesive resin Substances 0.000 claims description 21
- 229920006223 adhesive resin Polymers 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 10
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 claims description 6
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 claims description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 27
- 239000000463 material Substances 0.000 abstract description 15
- 238000003860 storage Methods 0.000 abstract description 15
- 230000000704 physical effect Effects 0.000 abstract description 6
- 229920002554 vinyl polymer Polymers 0.000 description 66
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 48
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 46
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 45
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 39
- 239000000243 solution Substances 0.000 description 36
- 238000006243 chemical reaction Methods 0.000 description 34
- 238000006482 condensation reaction Methods 0.000 description 32
- 230000007062 hydrolysis Effects 0.000 description 32
- 238000006460 hydrolysis reaction Methods 0.000 description 32
- 230000015572 biosynthetic process Effects 0.000 description 29
- 239000000178 monomer Substances 0.000 description 26
- 239000008367 deionised water Substances 0.000 description 25
- 229910021641 deionized water Inorganic materials 0.000 description 25
- 238000003786 synthesis reaction Methods 0.000 description 25
- 239000003960 organic solvent Substances 0.000 description 23
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 23
- LTPSRQRIPCVMKQ-UHFFFAOYSA-N 2-amino-5-methylbenzenesulfonic acid Chemical compound CC1=CC=C(N)C(S(O)(=O)=O)=C1 LTPSRQRIPCVMKQ-UHFFFAOYSA-N 0.000 description 22
- 102100027370 Parathymosin Human genes 0.000 description 22
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 21
- 238000011156 evaluation Methods 0.000 description 21
- 125000005372 silanol group Chemical group 0.000 description 18
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 17
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 17
- 239000004793 Polystyrene Substances 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 17
- 229920002223 polystyrene Polymers 0.000 description 17
- GUGNSJAORJLKGP-UHFFFAOYSA-K sodium 8-methoxypyrene-1,3,6-trisulfonate Chemical compound [Na+].[Na+].[Na+].C1=C2C(OC)=CC(S([O-])(=O)=O)=C(C=C3)C2=C2C3=C(S([O-])(=O)=O)C=C(S([O-])(=O)=O)C2=C1 GUGNSJAORJLKGP-UHFFFAOYSA-K 0.000 description 16
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 14
- 229910001873 dinitrogen Inorganic materials 0.000 description 14
- 239000007788 liquid Substances 0.000 description 13
- 238000001816 cooling Methods 0.000 description 12
- 238000004821 distillation Methods 0.000 description 12
- 239000000047 product Substances 0.000 description 10
- 229910000077 silane Inorganic materials 0.000 description 9
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 239000003505 polymerization initiator Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- RWZVFCIPMBYBCY-UHFFFAOYSA-N methyl 2,2-dihydroxyoctadecanoate Chemical compound CCCCCCCCCCCCCCCCC(O)(O)C(=O)OC RWZVFCIPMBYBCY-UHFFFAOYSA-N 0.000 description 7
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 6
- VLXBWPOEOIIREY-UHFFFAOYSA-N dimethyl diselenide Natural products C[Se][Se]C VLXBWPOEOIIREY-UHFFFAOYSA-N 0.000 description 6
- WQOXQRCZOLPYPM-UHFFFAOYSA-N dimethyl disulfide Chemical compound CSSC WQOXQRCZOLPYPM-UHFFFAOYSA-N 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000005227 gel permeation chromatography Methods 0.000 description 5
- 230000009477 glass transition Effects 0.000 description 5
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 125000003545 alkoxy group Chemical group 0.000 description 4
- 150000004945 aromatic hydrocarbons Chemical group 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 230000014759 maintenance of location Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 4
- 229920001451 polypropylene glycol Polymers 0.000 description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- MSXVEPNJUHWQHW-UHFFFAOYSA-N 2-methylbutan-2-ol Chemical compound CCC(C)(C)O MSXVEPNJUHWQHW-UHFFFAOYSA-N 0.000 description 3
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000003368 amide group Chemical group 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 3
- 230000003301 hydrolyzing effect Effects 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000011147 inorganic material Substances 0.000 description 3
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 230000000379 polymerizing effect Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 150000004756 silanes Chemical class 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 230000002087 whitening effect Effects 0.000 description 3
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 2
- XDQWJFXZTAWJST-UHFFFAOYSA-N 3-triethoxysilylpropyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C=C XDQWJFXZTAWJST-UHFFFAOYSA-N 0.000 description 2
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- 229920000298 Cellophane Polymers 0.000 description 2
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical class C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 125000004423 acyloxy group Chemical group 0.000 description 2
- 125000003302 alkenyloxy group Chemical group 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- BYLOHCRAPOSXLY-UHFFFAOYSA-N dichloro(diethyl)silane Chemical compound CC[Si](Cl)(Cl)CC BYLOHCRAPOSXLY-UHFFFAOYSA-N 0.000 description 2
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N ethylene glycol monomethyl ether acetate Natural products COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- QPPQHRDVPBTVEV-UHFFFAOYSA-N isopropyl dihydrogen phosphate Chemical compound CC(C)OP(O)(O)=O QPPQHRDVPBTVEV-UHFFFAOYSA-N 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 239000007870 radical polymerization initiator Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 125000005415 substituted alkoxy group Chemical group 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 2
- 229920001567 vinyl ester resin Polymers 0.000 description 2
- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 1
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- JWTGRKUQJXIWCV-UHFFFAOYSA-N 1,2,3-trihydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(O)C(O)CO JWTGRKUQJXIWCV-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical class CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- 125000004206 2,2,2-trifluoroethyl group Chemical group [H]C([H])(*)C(F)(F)F 0.000 description 1
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- 125000003504 2-oxazolinyl group Chemical group O1C(=NCC1)* 0.000 description 1
- LPIQIQPLUVLISR-UHFFFAOYSA-N 2-prop-1-en-2-yl-4,5-dihydro-1,3-oxazole Chemical compound CC(=C)C1=NCCO1 LPIQIQPLUVLISR-UHFFFAOYSA-N 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- MCDBEBOBROAQSH-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl prop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C=C MCDBEBOBROAQSH-UHFFFAOYSA-N 0.000 description 1
- LEPRPXBFZRAOGU-UHFFFAOYSA-N 3-trichlorosilylpropyl prop-2-enoate Chemical compound Cl[Si](Cl)(Cl)CCCOC(=O)C=C LEPRPXBFZRAOGU-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Natural products OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
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- QUPCNWFFTANZPX-UHFFFAOYSA-M paramenthane hydroperoxide Chemical compound [O-]O.CC(C)C1CCC(C)CC1 QUPCNWFFTANZPX-UHFFFAOYSA-M 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
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- 239000005011 phenolic resin Substances 0.000 description 1
- 239000005054 phenyltrichlorosilane Substances 0.000 description 1
- 230000001699 photocatalysis Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
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- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- YOSXAXYCARLZTR-UHFFFAOYSA-N prop-2-enoyl isocyanate Chemical compound C=CC(=O)N=C=O YOSXAXYCARLZTR-UHFFFAOYSA-N 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 238000007717 redox polymerization reaction Methods 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
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- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- 239000000454 talc Substances 0.000 description 1
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- WYKYCHHWIJXDAO-UHFFFAOYSA-N tert-butyl 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)C WYKYCHHWIJXDAO-UHFFFAOYSA-N 0.000 description 1
- 125000001302 tertiary amino group Chemical group 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
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- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
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- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- ZOYFEXPFPVDYIS-UHFFFAOYSA-N trichloro(ethyl)silane Chemical compound CC[Si](Cl)(Cl)Cl ZOYFEXPFPVDYIS-UHFFFAOYSA-N 0.000 description 1
- ORVMIVQULIKXCP-UHFFFAOYSA-N trichloro(phenyl)silane Chemical compound Cl[Si](Cl)(Cl)C1=CC=CC=C1 ORVMIVQULIKXCP-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- XYJRNCYWTVGEEG-UHFFFAOYSA-N trimethoxy(2-methylpropyl)silane Chemical compound CO[Si](OC)(OC)CC(C)C XYJRNCYWTVGEEG-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- 238000007039 two-step reaction Methods 0.000 description 1
- 229940124543 ultraviolet light absorber Drugs 0.000 description 1
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- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000004711 α-olefin Chemical class 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
本発明は、接着用樹脂組成物、プライマー、接着剤及び物品に関するものである。 The present invention relates to an adhesive resin composition, a primer, an adhesive and an article.
近年、無機材料と有機材料の特性を兼備させた高機能材料の開発が各産業分野で広く行われており、無機材料は耐候性、耐熱性、耐擦傷性等の耐久性に優れ、有機材料は柔軟性・加工性に富んでいることが一般的に知られている。このような中、無機材料と有機材料とを複合化した硬化性樹脂組成物が提案されている(例えば、特許文献1参照。)。この硬化性樹脂組成物は、耐候性、耐熱性等の各種物性に優れる塗膜が得られるものの、ポリプロピレン等の難付着基材や、異種素材間の接着に適用するためには、接着性が十分ではなかった。 In recent years, development of high performance materials combining the properties of inorganic materials and organic materials has been widely carried out in each industrial field, and inorganic materials have excellent durability such as weather resistance, heat resistance and scratch resistance, and organic materials Is generally known to be rich in flexibility and processability. Among these, a curable resin composition in which an inorganic material and an organic material are complexed has been proposed (see, for example, Patent Document 1). Although this curable resin composition can obtain a coating film excellent in various physical properties such as weather resistance, heat resistance, etc., in order to be applied to a difficultly adhering substrate such as polypropylene or adhesion between different materials, the adhesiveness is It was not enough.
そこで、耐候性等の各種物性に優れるとともに、難付着基材や異種素材間の接着に適用可能な材料が求められていた。 Then, while it is excellent in various physical properties, such as a weather resistance, the material applicable to adhesion between a poor adhesion base material and a dissimilar material was called for.
本発明が解決しようとする課題は、保存安定性に優れ、難付着基材や異種素材間の接着性、耐候性、耐熱性等の各種物性に優れた塗膜を形成可能である接着用樹脂組成物、プライマー、接着剤及び該接着用樹脂組成物の塗膜を有する物品を提供することである。 The problem to be solved by the present invention is an adhesive resin which is excellent in storage stability and can form a coating film excellent in various physical properties such as adhesion between a poor adhesion substrate and different materials, weatherability, heat resistance and the like. It is an object of the present invention to provide an article having a composition, a primer, an adhesive and a coating of the adhesive resin composition.
本発明者等は、上記課題を解決すべく鋭意研究を重ねた結果、特定のポリシロキサン及び特定の重合体セグメントが結合した複合樹脂が媒体中に溶解又は分散した接着用樹脂組成物が、保存安定性に優れ、難付着基材や異種素材間の接着性、耐候性、耐熱性等の各種物性に優れた塗膜を形成可能であることを見出し、本発明を完成させた。 As a result of intensive studies to solve the above problems, the present inventors have found that a resin composition for adhesion in which a specific resin and a composite resin to which a specific polymer segment is bonded is dissolved or dispersed in a medium is stored. The inventors have found that it is possible to form a coating film which is excellent in stability and excellent in various physical properties such as adhesion between a hardly adhering substrate and different materials, weatherability, heat resistance and the like, and the present invention has been completed.
すなわち、本発明は、一般式(1)又は(2)で表される構造単位(U1)、及び一般式(3)で表される構造単位(U2)を有するポリシロキサン(a1)と重合体(a2)とが一般式(4)で表される結合により結合した複合樹脂(A)が、媒体中に溶解又は分散している接着用樹脂組成物であって、前記複合樹脂(A)中の前記ポリシロキサン(a1)が75〜99質量%であり、前記ポリシロキサン(a1)中の前記構造単位(U1)が10〜55質量%であることを特徴とする接着用樹脂組成物に関する。 That is, in the present invention, a polysiloxane (a1) having a structural unit (U1) represented by the general formula (1) or (2) and a structural unit (U2) represented by the general formula (3) and a polymer An adhesive resin composition in which a composite resin (A) in which (a2) and (a) are bonded by a bond represented by the general formula (4) is dissolved or dispersed in a medium, and in the composite resin (A) The resin composition for adhesion is characterized in that the polysiloxane (a1) is 75 to 99% by mass, and the structural unit (U1) in the polysiloxane (a1) is 10 to 55% by mass.
本発明の接着用樹脂組成物は、難付着基材や異種素材間の接着性、耐候性等の各種物性に優れた塗膜を形成可能であることから、プライマー、及び接着剤等に好適に使用することができる。 The resin composition for adhesion of the present invention can form a coating film excellent in various physical properties such as adhesion between a low adhesion substrate and different materials, weatherability, etc. It can be used.
本発明の接着用樹脂組成物は、一般式(1)又は(2)で表される構造単位(U1)、及び一般式(3)で表される構造単位(U2)を有するポリシロキサン(a1)と重合体(a2)とが一般式(4)で表される結合により結合した複合樹脂(A)が、媒体中に溶解又は分散している接着用樹脂組成物であって、前記複合樹脂(A)中の前記ポリシロキサン(a1)が75〜99質量%であり、前記ポリシロキサン(a1)中の前記構造単位(U1)が10〜55質量%であるものである。 The adhesive resin composition of the present invention comprises a polysiloxane (a1) having a structural unit (U1) represented by the general formula (1) or (2) and a structural unit (U2) represented by the general formula (3) The resin composition for adhesion, wherein the composite resin (A) in which the polymer (a2) and the polymer (a2) are bonded by the bond represented by the general formula (4) is dissolved or dispersed in a medium, The polysiloxane (a1) in (A) is 75 to 99% by mass, and the structural unit (U1) in the polysiloxane (a1) is 10 to 55% by mass.
まず、前記複合樹脂(A)について説明する。前記複合樹脂(A)は、前記ポリシロキサン(a1)と前記重合体(a2)とが前記一般式(4)で表される結合により結合したものである。 First, the composite resin (A) will be described. The composite resin (A) is obtained by bonding the polysiloxane (a1) and the polymer (a2) by a bond represented by the general formula (4).
前記複合樹脂(A)の形態としては、例えば、前記ポリシロキサン(a1)が前記重合体(a2)の側鎖として化学的に結合したグラフト構造を有する複合樹脂や、前記重合体(a2)と前記ポリシロキサン(a1)とが化学的に結合したブロック構造を有する複合樹脂等が挙げられる。 As a form of the composite resin (A), for example, a composite resin having a graft structure in which the polysiloxane (a1) is chemically bonded as a side chain of the polymer (a2), or the polymer (a2) Composite resin etc. which have the block structure which the said polysiloxane (a1) couple | bonded chemically are mentioned.
前記一般式(4)で表される結合は、前記ポリシロキサン(a1)が有するシラノール基及び/または加水分解性シリル基と、前記重合体(a2)が有するシラノール基及び/または加水分解性シリル基とが脱水縮合反応することにより生じる。したがって、前記一般式(4)中、炭素原子は前記重合体(a2)の一部分を構成し、酸素原子のみに結合したケイ素原子は、前記ポリシロキサン(a1)の一部分を構成するものとする。 The bond represented by the general formula (4) is a silanol group and / or a hydrolyzable silyl group which the polysiloxane (a1) has, and a silanol group and / or a hydrolyzable silyl which the polymer (a2) has. It is generated by dehydration condensation reaction with a group. Accordingly, in the general formula (4), a carbon atom constitutes a part of the polymer (a2), and a silicon atom bonded only to an oxygen atom constitutes a part of the polysiloxane (a1).
前記複合樹脂(A)中の前記ポリシロキサン(a1)は、75〜99質量%であることが重要であるが、より接着性、耐熱性及び耐候性に優れる塗膜が得られることから、80〜98質量%であることが好ましく、85〜95質量%であることがより好ましい。 It is important that the amount of the polysiloxane (a1) in the composite resin (A) is 75 to 99% by mass, but a coating film having more excellent adhesion, heat resistance and weatherability can be obtained, so 80 It is preferable that it is -98 mass%, and it is more preferable that it is 85-95 mass%.
なお、前記ポリシロキサン(a1)の質量割合は、前記複合樹脂(A)の製造に使用する原料の仕込み割合に基づき、加水分解縮合反応によって生成しうるメタノールやエタノール等の副生成物の生成を考慮し算出した値である。 The mass ratio of the polysiloxane (a1) is based on the preparation ratio of the raw materials used for the production of the composite resin (A), and the formation of by-products such as methanol and ethanol which can be generated by hydrolysis condensation reaction It is a value calculated taking into consideration.
前記ポリシロキサン(a1)は、ケイ素原子と酸素原子とからなる鎖状構造を有するものであって、加水分解性シリル基及び/又はシラノール基等を有するものである。 The polysiloxane (a1) has a chain structure composed of a silicon atom and an oxygen atom, and has a hydrolyzable silyl group and / or a silanol group.
前記加水分解性シリル基は、加水分解性基が前記ケイ素原子に直接結合した原子団であって、例えば、下記一般式(5)に示される構造からなるものである。 The hydrolyzable silyl group is an atomic group in which a hydrolyzable group is directly bonded to the silicon atom, and has, for example, a structure represented by the following general formula (5).
前記加水分解性基は、水の影響により水酸基を形成しうるものであって、例えば、ハロゲン原子、アルコキシ基、置換アルコキシ基、アシロキシ基、フェノキシ基、メルカプト基、アミノ基、アミド基、アミノオキシ基、イミノオキシ基、アルケニルオキシ基等が挙げられ、なかでもアルコキシ基や置換アルコキシ基であることが好ましい。 The hydrolyzable group is capable of forming a hydroxyl group under the influence of water, and includes, for example, a halogen atom, an alkoxy group, a substituted alkoxy group, an acyloxy group, a phenoxy group, a mercapto group, an amino group, an amide group Groups, iminooxy groups, alkenyloxy groups and the like are mentioned, and among them, alkoxy groups and substituted alkoxy groups are preferable.
前記シラノール基は、水酸基が前記ケイ素原子に直接結合した原子団を示すものであって、前記加水分解性シリル基が加水分解した際に形成される。 The silanol group is an atomic group in which a hydroxyl group is directly bonded to the silicon atom, and is formed when the hydrolyzable silyl group is hydrolyzed.
前記ポリシロキサン(a1)は、保存安定性に優れ、接着性に優れる塗膜が得られることから、前記一般式(1)又は(2)で表される構造単位(U1)を10〜55質量%有することが重要であるが、10〜40質量%有することがより好ましい。 Since the said polysiloxane (a1) is excellent in storage stability and a coating film excellent in adhesiveness is obtained, 10-55 mass of structural units (U1) represented by the said General formula (1) or (2) It is important to have%, but it is more preferable to have 10 to 40% by mass.
また、前記ポリシロキサン(a1)は、耐候性、耐熱性に優れる塗膜が得られることから、前記一般式(3)で表される構造単位(U2)を10質量%以上有することが重要であり、15質量%以上有することが好ましい。 Moreover, since the said polysiloxane (a1) is a coating film which is excellent in a weather resistance and heat resistance, it is important that it has 10 mass% or more of structural units (U2) represented by the said General formula (3). It is preferable to have 15% by mass or more.
前記ポリシロキサン(a1)は、前記構造単位(U1)、前記構造単位(U2)以外の構造単位として、例えば、下記一般式(6)又は(7)で表される構造単位(U3)等を有することができる。 The polysiloxane (a1) is a structural unit other than the structural unit (U1) and the structural unit (U2), for example, a structural unit (U3) represented by the following general formula (6) or (7), etc. It can have.
前記ポリシロキサン(a1)としては、例えば、後述するシラン化合物を完全にまたは部分的に加水分解縮合して得られるものを使用することができる。 As said polysiloxane (a1), what is obtained by carrying out the hydrolysis condensation of the silane compound mentioned later completely or partially can be used, for example.
前記ポリシロキサン(a1)の有する前記構造単位(U1)は、例えば、フェニルトリメトキシシラン、フェニルトリエトキシシラン、ジフェニルジメトキシシラン、メチルフェニルジメトキシシラン、フェニルトリクロロシラン、ジフェニルジクロロシラン等の芳香環を有するシラン化合物や、それらの部分加水分解縮合物などを使用することにより、前記ポリシロキサン(a1)中に容易に導入することができるが、これらの中でも、保存安定性、接着性がより向上することから、フェニルトリメトキシシラン又はジフェニルジメトキシシランを使用することが好ましい。 The structural unit (U1) of the polysiloxane (a1) has, for example, an aromatic ring such as phenyltrimethoxysilane, phenyltriethoxysilane, diphenyldimethoxysilane, methylphenyldimethoxysilane, phenyltrichlorosilane, diphenyldichlorosilane, etc. By using a silane compound or a partial hydrolytic condensate thereof, etc., it can be easily introduced into the polysiloxane (a1), but among these, the storage stability and the adhesiveness are further improved. It is preferable to use phenyltrimethoxysilane or diphenyldimethoxysilane.
また、前記構造単位(U2)は、例えば、メチルトリメトキシシラン、メチルトリエトキシシラン、メチルトリ−n−ブトキシシラン、エチルトリメトキシシラン、エチルトリエトキシシラン、メチルトリクロロシラン、エチルトリクロロシラン等のシラン化合物や、それらの部分加水分解縮合物などを使用することにより、前記ポリシロキサン(a1)中に容易に導入することができる。 The structural unit (U2) is, for example, a silane compound such as methyltrimethoxysilane, methyltriethoxysilane, methyltri-n-butoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, methyltrichlorosilane, ethyltrichlorosilane, etc. And the partial hydrolysis condensates thereof can be easily introduced into the polysiloxane (a1).
また、前記構造単位(U3)は、例えば、n−プロピルトリメトキシシラン、iso−ブチルトリメトキシシラン、シクロヘキシルトリメトキシシラン、ビニルトリメトキシシラン、3−(メタ)アクリロイルオキシプロピルトリメトキシシラン、3−(メタ)アクリロイルオキシプロピルトリエトキシシラン、3−(メタ)アクリロイルオキシプロピルトリクロロシラン、ビニルトリクロロシラン、ジメチルジメトキシシラン、ジメチルジエトキシシラン、ジメチルジ−n−ブトキシシラン、ジエチルジメトキシシラン、メチルシクロヘキシルジメトキシシラン、ジメチルジクロロシラン、ジエチルジクロロシラン等のシラン化合物や、それらの部分加水分解縮合物などを使用することにより、前記ポリシロキサン(a1)中に容易に導入することができる。 The structural unit (U3) is, for example, n-propyltrimethoxysilane, iso-butyltrimethoxysilane, cyclohexyltrimethoxysilane, vinyltrimethoxysilane, 3- (meth) acryloyloxypropyltrimethoxysilane, 3- (Meth) acryloyloxypropyltriethoxysilane, 3- (meth) acryloyloxypropyltrichlorosilane, vinyltrichlorosilane, dimethyldimethoxysilane, dimethyldiethoxysilane, dimethyldi-n-butoxysilane, diethyldimethoxysilane, methylcyclohexyldimethoxysilane, It is easily introduced into the polysiloxane (a1) by using silane compounds such as dimethyldichlorosilane and diethyldichlorosilane, and partial hydrolytic condensates thereof. Rukoto can.
これらのシラン化合物は、単独で使用してもよいし、2種類以上の併用でもよい。 These silane compounds may be used alone or in combination of two or more.
前記重合体(a2)は、前記ポリシロキサン(a1)と反応しうる加水分解性シリル基及び/又はシラノール基を有するものである。 The polymer (a2) has a hydrolyzable silyl group and / or a silanol group capable of reacting with the polysiloxane (a1).
前記重合体(a2)としては、保存安定性に優れ、得られる塗膜の接着性がより向上することから、3,000〜100,000の数平均分子量を有するものを使用することが好ましく、5,000〜25,000の数平均分子量を有するものを使用することがより好ましい。ここで、数平均分子量はゲル浸透クロマトグラフィー(以下、「GPC」と略記する。)測定に基づきポリスチレン換算した値である。 As the polymer (a2), it is preferable to use one having a number average molecular weight of 3,000 to 100,000, since the storage stability is excellent and the adhesion of the obtained coating film is further improved. It is more preferred to use those having a number average molecular weight of 5,000 to 25,000. Here, the number average molecular weight is a value converted to polystyrene based on gel permeation chromatography (hereinafter abbreviated as "GPC") measurement.
前記重合体(a2)としては、例えば、アクリル重合体、フルオロオレフィン重合体、ビニルエステル重合体、芳香族ビニル重合体等のビニル重合体;ポリエステル樹脂、アルキド樹脂、ポリウレタン樹脂などが挙げられるが、保存安定性に優れ、得られる塗膜の接着性がより向上することからビニル重合体が好ましい。 Examples of the polymer (a2) include vinyl polymers such as acrylic polymers, fluoroolefin polymers, vinyl ester polymers, and aromatic vinyl polymers; polyester resins, alkyd resins, polyurethane resins, etc. Vinyl polymers are preferable because they are excellent in storage stability and the adhesion of the resulting coating film is further improved.
前記ビニル重合体は、例えば、有機溶剤中、各種ビニル単量体を重合開始剤の存在下で重合することによって製造したものを使用することができる。 As the vinyl polymer, for example, those produced by polymerizing various vinyl monomers in an organic solvent in the presence of a polymerization initiator can be used.
前記加水分解性シリル基は、例えば、加水分解性シリル基を有するビニル単量体を重合することによって、前記ビニル重合体中に容易に導入することができる。 The hydrolyzable silyl group can be easily introduced into the vinyl polymer, for example, by polymerizing a vinyl monomer having a hydrolyzable silyl group.
前記加水分解性シリル基を有するビニル単量体としては、例えば、ビニルトリメトキシシラン、3−(メタ)アクリロイルオキシプロピルトリメトキシシラン、3−(メタ)アクリロイルオキシプロピルトリエトキシシランもしくは3−(メタ)アクリロイルオキシプロピルメチルジメトキシシラン等を使用することができ、なかでも、3−(メタ)アクリロイルオキシプロピルトリメトキシシランを使用することが好ましい。 Examples of the vinyl monomer having a hydrolyzable silyl group include vinyltrimethoxysilane, 3- (meth) acryloyloxypropyltrimethoxysilane, 3- (meth) acryloyloxypropyltriethoxysilane or 3- (meth) Acryloyloxypropylmethyldimethoxysilane etc. can be used, and among them, it is preferable to use 3- (meth) acryloyloxypropyltrimethoxysilane.
前記加水分解性シリル基を有するビニル単量体以外の前記ビニル重合体の原料としては、例えば、メチル(メタ)アクリレート、エチル(メタ)アクリレート、n−ブチル(メタ)アクリレート、2−エチルヘキシル(メタ)アクリレート、シクロヘキシル(メタ)アクリレート等の(メタ)アクリル酸エステル化合物;2−ヒドロキシエチル(メタ)アクリレート、2−ヒドロキシプロピル(メタ)アクリレート、4−ヒドロキシブチル(メタ)アクリレート、ポリエチレングリコールモノ(メタ)アクリレート、ポリプロピレングリコール(メタ)アクリレート、ポリエチレングリコール−ポリプロピレングリコール(メタ)アクリレート、グリセロールモノ(メタ)アクリレート等の水酸基を有するビニル単量体;メトキシポリエチレングリコール(メタ)アクリレート、エトキシポリエチレングリコール(メタ)アクリレート、フェノキシポリエチレングリコール(メタ)アクリレート、メトキシポリプロピレングリコール(メタ)アクリレート、メトキシポリエチレングリコール−ポリプロピレングリコール(メタ)アクリレートフェノキシポリエチレングリコール−ポリプロピレングリコール(メタ)アクリレート等の末端がアルコキシ基又はフェノキシ基で封止されたポリオキシアルキレン基を有するビニル単量体;N,N−ジメチルアミノエチル(メタ)アクリレート等の三級アミノ基を有するビニル単量体;N−メチルアミノエチル(メタ)アクリレート等の二級アミノ基を有するビニル単量体;アミノメチルアクリレート等の一級アミノ基を有するビニル単量体等の塩基性窒素原子を有する基を有するビニル単量体;2,2,2−トリフルオロエチル(メタ)アクリレート等のフッ素原子を有するビニル単量体;酢酸ビニル等のビニルエステル化合物;メチルビニルエーテル等のビニルエーテル化合物;(メタ)アクリロニトリル等の不飽和カルボン酸のニトリル化合物;スチレン等の芳香族環を有するビニル化合物;イソプレン等のα−オレフィン化合物、グリシジル(メタ)アクリレート等のエポキシ基を有するビニル単量体;(メタ)アクリルアミド等のアミド基を有するビニル単量体;N−メチロール(メタ)アクリルアミド等のメチロールアミド基及びそのアルコキシ化物を有するビニル単量体;2−アジリジニルエチル(メタ)アクリレート等のアジリジニル基を有するビニル単量体;(メタ)アクリロイルイソシアナート等のイソシアナート基及び/またはブロック化イソシアナート基を有するビニル単量体;2−イソプロペニル−2−オキサゾリン等のオキサゾリン基を有するビニル単量体;ジシクロペンテニル(メタ)アクリレート等のシクロペンテニル基を有するビニル単量体;アクロレイン等のカルボニル基を有するビニル単量体;アセトアセトキシエチル(メタ)アクリレート等のアセトアセチル基を有するビニル単量体;(メタ)アクリル酸、イタコン酸、マレイン酸、もしくはこれらの半エステルまたはこれらの塩等のカルボキシル基を有する単量体などを使用することができる。 Examples of the raw material of the vinyl polymer other than the vinyl monomer having the hydrolyzable silyl group include methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, 2-ethylhexyl (meth) ) (Meth) acrylic acid ester compounds such as acrylate and cyclohexyl (meth) acrylate; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, polyethylene glycol mono (meth) acrylate A vinyl monomer having a hydroxyl group such as acrylate), polypropylene glycol (meth) acrylate, polyethylene glycol-polypropylene glycol (meth) acrylate, glycerol mono (meth) acrylate; methoxypolyethylene Glycol (meth) acrylate, ethoxy polyethylene glycol (meth) acrylate, phenoxy polyethylene glycol (meth) acrylate, methoxypolypropylene glycol (meth) acrylate, methoxy polyethylene glycol-polypropylene glycol (meth) acrylate phenoxy polyethylene glycol-polypropylene glycol (meth) acrylate Etc., a vinyl monomer having a polyoxyalkylene group in which the end is capped with an alkoxy group or a phenoxy group; a vinyl monomer having a tertiary amino group such as N, N-dimethylaminoethyl (meth) acrylate; -A vinyl monomer having a secondary amino group such as methylaminoethyl (meth) acrylate; a single monomer having a primary amino group such as aminomethyl acrylate Vinyl monomer having a group having a basic nitrogen atom such as; vinyl monomer having a fluorine atom such as 2,2,2-trifluoroethyl (meth) acrylate; vinyl ester compounds such as vinyl acetate; methyl vinyl ether Vinyl compounds such as (N); nitrile compounds of unsaturated carboxylic acids such as (meth) acrylonitrile; vinyl compounds having an aromatic ring such as styrene; α-olefin compounds such as isoprene; vinyl having an epoxy group such as glycidyl (meth) acrylate Monomers; vinyl monomers having an amide group such as (meth) acrylamide; methylolamide groups such as N-methylol (meth) acrylamide and vinyl monomers having an alkoxy compound thereof; 2-aziridinylethyl (meth) ) Vinyl monomers having an aziridinyl group such as acrylates; Ta) Vinyl monomer having isocyanate group such as acryloyl isocyanate and / or blocked isocyanate group; Vinyl monomer having oxazoline group such as 2-isopropenyl-2-oxazoline; Dicyclopentenyl (meth) Vinyl monomers having a cyclopentenyl group such as acrylates; vinyl monomers having a carbonyl group such as acrolein; vinyl monomers having an acetoacetyl group such as acetoacetoxyethyl (meth) acrylate; (meth) acrylic acid It is possible to use monomers having a carboxyl group such as itaconic acid, maleic acid or their half esters or their salts.
前記ビニル重合体を製造する際に使用可能な有機溶剤としては、例えば、ヘキサン、ヘプタン、オクタン、シクロヘキサン、シクロペンタン、シクロオクタン等の脂肪族系ないしは脂環族系の炭化水素化合物;トルエン、キシレンもしくはエチルベンゼン等の芳香族炭化水素化合物;酢酸エチル、酢酸ブチル、酢酸アミル、エチレングリコールモノメチルエーテルアセテート、エチレングリコールモノエチルエーテルアセテート、エチレングリコールモノブチルエーテルアセテート等のエステル化合物;メタノール、エタノール、n−プロパノール、i−プロパノール、n−ブタノール、i−ブタノール、sec−ブタノール、tert−ブタノール、n−アミルアルコール、i−アミルアルコール、tert−アミルアルコール、エチレングリコールモノメチルエーテル、エチレングリコールモノエチルエーテル、エチレングリコールモノブチルエーテル等のアルコール化合物;アセトン、メチルエチルケトン、メチルイソブチルケトン、メチルアミルケトン、シクロヘキサノン等のケトン化合物;ジメトキシエタン、テトラヒドロフラン、ジオキサン、ジイソプロピルエーテル、ジ−n−ブチルエーテル等のエーテル化合物;クロロホルム、メチレンクロライド、四塩化炭素、トリクロロエタン、テトラクロロエタン等の塩素化炭化水素化合物;N−メチルピロリドン、ジメチルフォルムアミド、ジメチルアセトアミド、エチレンカーボネートなどを使用することができる。これらの有機溶剤は、単独で使用してもよいし、2種類以上の併用でもよい。 Examples of the organic solvent that can be used when producing the vinyl polymer include aliphatic or alicyclic hydrocarbon compounds such as hexane, heptane, octane, cyclohexane, cyclopentane, cyclooctane and the like; toluene, xylene Or an aromatic hydrocarbon compound such as ethylbenzene; ethyl acetate, butyl acetate, amyl acetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ester compound such as ethylene glycol monobutyl ether acetate; methanol, ethanol, n-propanol, i-propanol, n-butanol, i-butanol, sec-butanol, tert-butanol, n-amyl alcohol, i-amyl alcohol, tert-amyl alcohol, ethylene Alcohol compounds such as recalled monomethyl ether, ethylene glycol monoethyl ether and ethylene glycol monobutyl ether; ketone compounds such as acetone, methyl ethyl ketone, methyl isobutyl ketone, methyl amyl ketone and cyclohexanone; dimethoxyethane, tetrahydrofuran, dioxane, diisopropyl ether, di-n -Ether compounds such as butyl ether; Chlorinated hydrocarbon compounds such as chloroform, methylene chloride, carbon tetrachloride, trichloroethane, tetrachloroethane, etc .; N-methylpyrrolidone, dimethyl formamide, dimethylacetamide, ethylene carbonate, etc. can be used. These organic solvents may be used alone or in combination of two or more.
前記ビニル重合体を製造する際に使用可能な重合開始剤としては、例えば、過硫酸塩、有機過酸化物、過酸化水素等のラジカル重合開始剤や、4,4’−アゾビス(4−シアノ吉草酸)、2,2’−アゾビス(2−アミジノプロパン)二塩酸塩等のアゾ開始剤を使用することができる。また、前記ラジカル重合開始剤は、例えば、アスコルビン酸等の還元剤と併用しレドックス重合開始剤として使用してもよい。これらの重合開始剤は、単独で使用してもよいし、2種類以上の併用でもよい。 Examples of polymerization initiators that can be used when producing the vinyl polymer include, for example, radical polymerization initiators such as persulfates, organic peroxides and hydrogen peroxide, and 4,4′-azobis (4-cyano Azo initiators such as valeric acid), 2,2'-azobis (2-amidinopropane) dihydrochloride can be used. The radical polymerization initiator may be used as a redox polymerization initiator, for example, in combination with a reducing agent such as ascorbic acid. These polymerization initiators may be used alone or in combination of two or more.
前記重合開始剤の代表的なものである過硫酸塩としては、例えば、過硫酸カリウム、過硫酸ナトリウム、過硫酸アンモニウム等が挙げられ、有機過酸化物として、具体的には、例えば、過酸化ベンゾイル、ラウロイルパーオキサイド、デカノイルパーオキサイド等のジアシルパーオキサイド、t−ブチルクミルパーオキサイド、ジクミルパーオキサイド等のジアルキルパーオキサイド、t−ブチルパーオキシ−2−エチルヘキサノエート、t−ブチルパーオキシラウレート、t−ブチルパーオキシベンゾエート等のパーオキシエステル、クメンハイドロパーオキサイド、パラメンタンハイドロパーオキサイド、t−ブチルハイドロパーオキサイド等のハイドロパーオキサイド等を使用することができる。 Examples of the persulfate which is representative of the above-mentioned polymerization initiator include potassium persulfate, sodium persulfate, ammonium persulfate and the like, and as the organic peroxide, specifically, for example, benzoyl peroxide , Diacyl peroxides such as lauroyl peroxide and decanoyl peroxide, dialkyl peroxides such as t-butylcumyl peroxide and dicumyl peroxide, t-butylperoxy-2-ethylhexanoate, t-butylperoxy Peroxy esters such as laurate, t-butylperoxybenzoate, cumene hydroperoxide, paramenthane hydroperoxide, hydroperoxides such as t-butyl hydroperoxide, etc. can be used.
重合開始剤の使用量は、重合が円滑に進行する量を使用すれば良いが、ビニル重合体(a2)の製造に使用するビニル単量体の全量に対して、10質量%以下とすることが好ましい。 The amount of polymerization initiator used may be such that the polymerization proceeds smoothly, but should be 10% by mass or less based on the total amount of vinyl monomers used for producing the vinyl polymer (a2). Is preferred.
前記ビニル重合体のガラス転移温度は、得られる塗膜の接着性がより向上することから、−50〜90℃の範囲内であることが好ましい。なお、本発明において、ガラス転移温度(Tg)とは、下記のFOXの式で計算されるガラス転移温度いう。
FOXの式:1/Tg=W1/Tg1+W2/Tg2+・・・
(Tg:求めるべきガラス転移温度、W1:成分1の重量分率、Tg1:成分1のホモポリマーのガラス転移温度)
The glass transition temperature of the vinyl polymer is preferably in the range of −50 to 90 ° C. because the adhesion of the resulting coating film is further improved. In the present invention, the glass transition temperature (Tg) is a glass transition temperature calculated by the following formula of FOX.
Formula of FOX: 1 / Tg = W1 / Tg1 + W2 / Tg2 +.
(Tg: glass transition temperature to be determined, W1: weight fraction of component 1, Tg1: glass transition temperature of homopolymer of component 1)
また、前記ポリシロキサン(a1)は、前記複合樹脂(A)を製造する工程において、2段階の反応工程を経ることによって形成することが好ましい。具体的には、前記ビニル重合体(a1)の有する加水分解性基等に、フェニルトリメトキシシラン等の比較的低分子量のシラン化合物を反応させることでポリシロキサン構造を形成し、次いで、該反応物と、メチルトリメトキシシランやエチルトリメトキシシラン等の縮合物とを反応させることによって、ポリシロキサン(a1)からなる構造を形成することができる。これにより、より一層、接着性及び耐候性、耐熱性等の耐久性に優れた塗膜を形成可能な接着用樹脂組成物を得ることができる。 Moreover, it is preferable to form the said polysiloxane (a1) by passing through a two-step reaction process in the process of manufacturing the said composite resin (A). Specifically, a polysiloxane structure is formed by reacting a relatively low molecular weight silane compound such as phenyltrimethoxysilane with the hydrolyzable group etc. possessed by the vinyl polymer (a1), and then the reaction By reacting a substance with a condensate such as methyltrimethoxysilane or ethyltrimethoxysilane, a structure composed of polysiloxane (a1) can be formed. Thereby, the resin composition for adhesion | attachment which can form the coating film which was further excellent in durability, such as adhesiveness and a weather resistance, heat resistance, can be obtained.
前記複合樹脂(A)は、例えば、以下の(I)〜(II)の工程によって製造することができる。 The composite resin (A) can be produced, for example, by the following steps (I) to (II).
(I)の工程は、有機溶剤中で、前記したビニル単量体を前記重合開始剤の存在下で重合することによってビニル重合体(a2)の有機溶剤溶液を得る工程である。 The step (I) is a step of polymerizing the above-mentioned vinyl monomer in the presence of the above-mentioned polymerization initiator in an organic solvent to obtain an organic solvent solution of the vinyl polymer (a2).
かかる重合反応は、例えば、重合開始剤を含む有機溶剤中に、前記ビニル単量体を逐次供給または一括供給し、次いで、攪拌下、20〜120℃の範囲で0.5〜24時間程度行うことが好ましい。 The polymerization reaction is carried out, for example, by sequentially feeding or batch feeding the vinyl monomer in an organic solvent containing a polymerization initiator, and then performing stirring for about 0.5 to 24 hours at a range of 20 to 120 ° C. Is preferred.
また、(II)の工程は、前記ビニル重合体(a2)の有機溶剤溶液下で前記ビニル重合体(a2)の有する加水分解性シリル基等の反応性官能基と、シラン化合物の有する加水分解性シリル基またはシラノール基との反応と、前記シラン化合物間の加水分解縮合反応とを進行させることによって、前記ビニル重合体(a2)と前記ポリシロキサン(a1)とが結合した前記複合樹脂(A)の有機溶剤溶液を得る工程である。 In the step (II), a reactive functional group such as a hydrolyzable silyl group possessed by the vinyl polymer (a2) in the organic solvent solution of the vinyl polymer (a2) and a hydrolysis possessed by the silane compound The composite resin (A) in which the vinyl polymer (a2) and the polysiloxane (a1) are bonded by advancing the reaction with a reactive silyl group or silanol group and the hydrolytic condensation reaction between the silane compounds A step of obtaining an organic solvent solution of
かかる反応は、例えば、(I)の工程に引き続き、前記ビニル重合体(a2)の有機溶剤溶液中に、前記ポリシロキサン(a1)を形成しうる前記シラン化合物を逐次供給または一括供給し、次いで、攪拌下、20〜120℃の範囲で0.5〜24時間程度行うことが好ましい。 Such reaction is carried out, for example, sequentially or collectively supplying the silane compound capable of forming the polysiloxane (a1) into the organic solvent solution of the vinyl polymer (a2) subsequently to the step (I). Under stirring, it is preferable to carry out in the range of 20 to 120 ° C. for about 0.5 to 24 hours.
(II)の工程は、更に2段階の反応工程を経ることが好ましい。具体的には前記ビニル重合体(a2)の有する加水分解性シリル基またはシラノール基と、前記したフェニルトリメトキシシラン等の比較的低分子量のシラン化合物とを反応させる工程と、次いで、該反応物と、メチルトリメトキシシランやエチルトリメトキシシラン等のメチルトリアルコキシシラン及びエチルトリアルコキシシランを予め縮合させた縮合物とを反応させる工程とを経ることが好ましい。ポリシロキサン(a1)の構造形成を上記のような2段階で行うことで、一層、接着性及び耐候性、耐熱性等の耐久性に優れた塗膜を形成可能な接着用樹脂組成物を得ることができる。 The step (II) is preferably further subjected to two reaction steps. Specifically, the step of reacting the hydrolyzable silyl group or silanol group possessed by the vinyl polymer (a2) with a relatively low molecular weight silane compound such as the above-mentioned phenyltrimethoxysilane, and then the reaction product And a condensation product obtained by previously condensing methyltrialkoxysilane such as methyltrimethoxysilane or ethyltrimethoxysilane and ethyltrialkoxysilane. By performing the structure formation of the polysiloxane (a1) in two steps as described above, an adhesive resin composition capable of forming a coating film excellent in durability such as adhesiveness, weather resistance, heat resistance, etc. is obtained. be able to.
本発明の接着用樹脂組成物は、前記複合樹脂(A)が、媒体中に溶解又は分散しているものであるが、前記媒体としては、例えば、前記ビニル重合体を製造する際に使用可能なものとして列挙した各種の有機溶剤等が挙げられる。 The adhesive resin composition of the present invention is one in which the composite resin (A) is dissolved or dispersed in a medium, and the medium can be used, for example, when producing the vinyl polymer. And various organic solvents listed as examples.
前記接着用樹脂組成物には、必要に応じて熱硬化性樹脂を含有させることも可能である。かかる熱硬化性樹脂としては、ビニル系樹脂、ポリエステル樹脂、ポリウレタン樹脂、エポキシ樹脂、エポキシエステル樹脂、アクリル樹脂、フェノール樹脂、石油樹脂、ケトン樹脂、シリコン樹脂、あるいはこれらの変性樹脂等が挙げられる。 The adhesive resin composition may also contain a thermosetting resin, if necessary. Examples of the thermosetting resin include vinyl resins, polyester resins, polyurethane resins, epoxy resins, epoxy ester resins, acrylic resins, phenol resins, petroleum resins, ketone resins, silicone resins, and modified resins thereof.
前記接着用樹脂組成物には、必要に応じて粘土鉱物、金属、金属酸化物、ガラス等の各種の無機粒子を使用することができる。金属の種類としては、金、銀、銅、白金、チタン、亜鉛、ニッケル、アルミニウム、鉄、シリコン、ゲルマニウム、アンチモン、それらの金属酸化物等が挙げられる。 Various inorganic particles such as clay mineral, metal, metal oxide, glass and the like can be used in the adhesive resin composition, if necessary. Examples of metals include gold, silver, copper, platinum, titanium, zinc, nickel, aluminum, iron, silicon, germanium, antimony, metal oxides thereof, and the like.
前記接着用樹脂組成物には、必要に応じて光触媒性化合物や無機顔料、防錆顔料、体質顔料、有機顔料、ワックス、界面活性剤、安定剤、密着性付与剤、流動調整剤、染料、レベリング剤、レオロジーコントロール剤、紫外線吸収剤、酸化防止剤、可塑剤等の各種の添加剤等を使用することができる。 The adhesive resin composition may, if necessary, be a photocatalytic compound, an inorganic pigment, a rust preventive pigment, an extender pigment, an organic pigment, a wax, a surfactant, a stabilizer, an adhesion promoter, a flow control agent, a dye, Various additives such as leveling agents, rheology control agents, ultraviolet light absorbers, antioxidants, plasticizers and the like can be used.
前記接着用樹脂組成物は、各種基材への接着性に優れた塗膜を形成できることから、プライマーや接着剤等に好適に使用できる。特に、難付着基材に対するプライマーや異種基材間の接着に有用であり、耐候性、耐熱性に優れる塗膜を形成できることから、透明基材の接着剤としても非常に有用である。 The adhesive resin composition can be suitably used as a primer, an adhesive and the like because it can form a coating film excellent in adhesion to various substrates. In particular, it is useful for adhesion of a primer to a hard-to-deposition substrate and adhesion between different types of substrates, and can form a coating film excellent in weather resistance and heat resistance, so it is also very useful as an adhesive for transparent substrates.
前記プライマーを塗布し塗膜を形成する基材としては、例えば、ステンレス、アルミナ、グラファイト、タルク等の無機質基材、亜鉛めっき鋼板、冷間圧延鋼板等の金属基材、ポリカーボネート、ABS、ポリオレフィン系等のプラスチック基材、ガラス基材、NBR、SBR、シリコンゴム等のゴム基材、紙や木材基材、FRP等の繊維質基材等が挙げられる。 Examples of the substrate on which the primer is applied to form a coating film include inorganic substrates such as stainless steel, alumina, graphite and talc, metal substrates such as galvanized steel plates and cold rolled steel plates, polycarbonate, ABS, and polyolefins Etc., glass substrates, rubber substrates such as NBR, SBR, silicone rubber, etc., paper and wood substrates, fibrous substrates such as FRP, and the like.
また、前記基材の形状としては、例えば、板状、球状、フィルム状、シート状等が挙げられる。また、これらの基材表面に微細な凹凸を有するものであってもよい。 Moreover, as a shape of the said base material, plate shape, spherical shape, a film shape, sheet shape etc. are mentioned, for example. Moreover, you may have fine unevenness | corrugation on these base-material surfaces.
前記プライマーの塗膜を有する物品は、前記したような種々の基材上に、前記プライマーを塗装し、硬化させることによって得ることができる。その際に、(1)前記プライマーを基材に直接塗装する、(2)基材に下塗り塗料として前記プライマーを塗装し、次いで別の上塗り塗料を塗装し塗膜を形成させる等の塗装方法により塗装物を得ることができる。 An article having a coating of the primer can be obtained by coating and curing the primer on various substrates as described above. At that time, (1) the primer is applied directly to the substrate, (2) the primer is applied to the substrate as an undercoat paint, and then another top coat is applied to form a coating film, etc. It is possible to obtain a paint.
前記プライマー剤を塗装する方法としては、例えば、刷毛塗り、ローラー塗装、スプレー塗装、浸漬塗装、フロー・コーター塗装、ロール・コーター塗装、電着塗装等が挙げられる。 Examples of the method for coating the primer agent include brush coating, roller coating, spray coating, dip coating, flow coater coating, roll coater coating, electrodeposition coating and the like.
前記乾燥し硬化を進行させる方法としては、常温下で1〜10日程度養生する方法であってもよいが、硬化を迅速に進行させる観点から、50〜250℃の温度で、1〜600秒程度加熱する方法が好ましい。 The drying and curing may be progressed at about 1 to 10 days under normal temperature, but from the viewpoint of rapidly curing, it may be 1 to 600 seconds at a temperature of 50 to 250 ° C. A method of heating to a certain extent is preferred.
前記プライマーを用いて形成する塗膜の膜厚は、基材の使用される用途等に応じて、0.5〜1,000μmとすることができる。 The film thickness of the coating film formed using the said primer can be 0.5-1,000 micrometers according to the use etc. in which a base material is used.
上記のような方法により、前記プライマーを用いて形成された塗膜を有する物品としては、例えば、鋼構造物;橋梁、タンク、プラント、外壁や屋根等の建築部材;ガードレール、防音壁、排水溝等の土木部材;家電製品、産業機械、航空機、自動車等の部品;駆動部品、排気部品、火力発電所部材などに使用することができる。 Articles having a coating film formed using the primer by the method as described above include, for example, steel structures; bridges, tanks, plants, building members such as outer walls and roofs; guard rails, sound barriers, drainage grooves Civil engineering members such as: Home appliances, industrial machines, aircraft, parts of automobiles, etc .; Drive parts, exhaust parts, thermal power plant members, etc.
前記接着剤の塗膜を有する物品は、前記したような種々の基材上に、前記接着剤を塗装し、硬化させることによって得ることができる。その際に、(1)前記接着剤を基材にバーコート法、スプレー法により塗装する、(2)オープンタイムを設け、溶剤を一部揮発させた後、重石、プレス装置、ラミネート装置で80〜150℃で5分以上加熱しながら圧締めし、硬化させることにより物品を得ることができる。 An article having a coating of the adhesive can be obtained by coating and curing the adhesive on various substrates as described above. At that time, (1) the adhesive is applied to the substrate by a bar coating method or a spray method, (2) an open time is provided to partially volatilize the solvent, and then the weight, the pressing device, the laminating device 80 An article can be obtained by pressing and curing while heating at ̃150 ° C. for 5 minutes or more.
前記接着剤の塗膜を有する物品としては、例えば、前記プライマーを用いて形成された塗膜を有する物品として例示した用途に使用することができる。 As an article which has a coat of the above-mentioned adhesives, it can be used for an application illustrated as an article which has a coat formed, for example using the above-mentioned primer.
次に、本発明を、実施例及び比較例により具体的に説明をする。なお、樹脂の平均分子量は、下記のGPC測定条件で測定したものである。また、評価用の基材として、シリコンゴムシート(JIS K6380)、その他の基材は株式会社エンジニアリングテストサービス製のものを使用した。 Next, the present invention will be specifically described by way of examples and comparative examples. In addition, the average molecular weight of resin is measured on the following GPC measurement conditions. Moreover, as a base material for evaluation, a silicon rubber sheet (JIS K6380) and the other base material used the thing by Engineering Test Service Co., Ltd.
[GPC測定条件]
測定装置:高速GPC装置(東ソー株式会社製「HLC−8220GPC」)
カラム:東ソー株式会社製の下記のカラムを直列に接続して使用した。
「TSKgel G5000」(7.8mmI.D.×30cm)×1本
「TSKgel G4000」(7.8mmI.D.×30cm)×1本
「TSKgel G3000」(7.8mmI.D.×30cm)×1本
「TSKgel G2000」(7.8mmI.D.×30cm)×1本
検出器:RI(示差屈折計)
カラム温度:40℃
溶離液:テトラヒドロフラン(THF)
流速:1.0mL/分
注入量:100μL(試料濃度4mg/mLのテトラヒドロフラン溶液)
標準試料:下記の単分散ポリスチレンを用いて検量線を作成した。
[GPC measurement conditions]
Measuring device: High-speed GPC device ("HLC-8220GPC" manufactured by Tosoh Corporation)
Column: The following columns manufactured by Tosoh Corporation were used in series connection.
"TSKgel G5000" (7.8 mm ID × 30 cm) × 1 "TSK gel G 4000" (7.8 mm ID × 30 cm) × 1 "TSK gel G 3000" (7.8 mm ID × 30 cm) × 1 This "TSKgel G2000" (7.8 mm ID × 30 cm) × 1 detector: RI (differential refractometer)
Column temperature: 40 ° C
Eluent: Tetrahydrofuran (THF)
Flow rate: 1.0 mL / min Injection volume: 100 μL (tetrahydrofuran solution with a sample concentration of 4 mg / mL)
Standard sample: A calibration curve was prepared using the following monodispersed polystyrene.
(単分散ポリスチレン)
東ソー株式会社製「TSKgel 標準ポリスチレン A−500」
東ソー株式会社製「TSKgel 標準ポリスチレン A−1000」
東ソー株式会社製「TSKgel 標準ポリスチレン A−2500」
東ソー株式会社製「TSKgel 標準ポリスチレン A−5000」
東ソー株式会社製「TSKgel 標準ポリスチレン F−1」
東ソー株式会社製「TSKgel 標準ポリスチレン F−2」
東ソー株式会社製「TSKgel 標準ポリスチレン F−4」
東ソー株式会社製「TSKgel 標準ポリスチレン F−10」
東ソー株式会社製「TSKgel 標準ポリスチレン F−20」
東ソー株式会社製「TSKgel 標準ポリスチレン F−40」
東ソー株式会社製「TSKgel 標準ポリスチレン F−80」
東ソー株式会社製「TSKgel 標準ポリスチレン F−128」
東ソー株式会社製「TSKgel 標準ポリスチレン F−288」
東ソー株式会社製「TSKgel 標準ポリスチレン F−550」
(Monodispersed polystyrene)
Tosoh Corporation "TSKgel standard polystyrene A-500"
Tosoh Corporation "TSKgel standard polystyrene A-1000"
Tosoh Corporation "TSKgel standard polystyrene A-2500"
Tosoh Corporation "TSKgel standard polystyrene A-5000"
Tosoh Corporation "TSKgel standard polystyrene F-1"
Tosoh Corporation "TSKgel standard polystyrene F-2"
Tosoh Corporation "TSKgel standard polystyrene F-4"
Tosoh Corporation "TSKgel standard polystyrene F-10"
Tosoh Corporation "TSKgel standard polystyrene F-20"
Tosoh Corporation "TSKgel standard polystyrene F-40"
Tosoh Corporation "TSKgel standard polystyrene F-80"
Tosoh Corporation "TSKgel standard polystyrene F-128"
Tosoh Corporation "TSKgel standard polystyrene F-288"
Tosoh Corporation "TSKgel standard polystyrene F-550"
(合成例1:メチルトリメトキシシランの縮合物(a1’−1)の合成)
攪拌機、温度計、滴下ロート、冷却管及び窒素ガス導入口を備えた反応容器に、メチルトリメトキシシラン(以下、「MTMS」と略記する。)1,421質量部を仕込んで、60℃まで昇温した。次いで、前記反応容器中にiso−プロピルアシッドホスフェート(SC有機化学株式会社製「Phoslex A−3」)0.17質量部と脱イオン水207質量部との混合物を5分間で滴下した後、80℃の温度で4時間撹拌して加水分解縮合反応させた。
上記の加水分解縮合反応によって得られた縮合物を、温度40〜60℃及び40〜1.3kPaの減圧下(メタノールの留去開始時の減圧条件が40kPaで、最終的に1.3kPaとなるまで減圧する条件をいう。以下、同様。)で蒸留し前記反応過程で生成したメタノール及び水を除去することによって、数平均分子量1,000のMTMSの縮合物(a1’−1)を含有する液(有効成分70質量%)1,000質量部を得た。
なお、前記有効成分とは、MTMS等のシランモノマーのメトキシ基が全て縮合反応した場合の理論収量(質量部)を、縮合反応後の実収量(質量部)で除した値〔シランモノマーのメトキシ基が全て縮合反応した場合の理論収量(質量部)/縮合反応後の実収量(質量部)〕により算出したものである。
Synthesis Example 1: Synthesis of methyltrimethoxysilane condensate (a1′-1)
In a reaction vessel equipped with a stirrer, thermometer, dropping funnel, cooling pipe and nitrogen gas inlet, 1,421 parts by mass of methyltrimethoxysilane (hereinafter abbreviated as "MTMS") was charged, and the temperature was raised to 60 ° C. It warmed. Then, a mixture of 0.17 parts by mass of iso-propyl acid phosphate ("Phoslex A-3" manufactured by SC Organic Chemical Co., Ltd.) and 207 parts by mass of deionized water is dropped into the reaction vessel over 5 minutes, and then 80 The mixture was stirred at a temperature of ° C for 4 hours for hydrolysis and condensation reaction.
The condensate obtained by the above hydrolysis condensation reaction is reduced in temperature at 40 to 60 ° C. and 40 to 1.3 kPa (the reduced pressure condition at the start of distillation of methanol is 40 kPa and finally it becomes 1.3 kPa) Refers to the conditions under which the pressure is reduced down to the following: Same as above) and removes methanol and water generated in the reaction process, thereby containing MTMS condensate (a1'-1) with a number average molecular weight of 1,000. 1,000 parts by mass of liquid (70% by mass of active ingredient) was obtained.
The above-mentioned effective ingredient is the value obtained by dividing the theoretical yield (parts by mass) when all the methoxy groups of silane monomers such as MTMS are condensation reacted by the actual yield (parts by mass) after the condensation reaction [methoxy of silane monomer It is calculated by the theoretical yield (mass part) / real yield after condensation reaction (mass part)] when all the groups carry out a condensation reaction.
(実施例1:接着用樹脂組成物(1)の製造)
攪拌機、温度計、滴下ロート、冷却管及び窒素ガス導入口を備えた反応容器に、n−ブタノール(以下、「BuOH」と略記する。)150質量部、フェニルトリメトキシシラン(以下、「PTMS」と略記する。)88質量部、ジメチルジメトキシシラン(以下、「DMDMS」と略記する。)233質量部を仕込んで80℃まで昇温した。
次いで、同温度でメチルメタクリレート(以下、「MMA」と略記する。)84質量部、ブチルメタクリレート(以下、「BMA」と略記する。)16質量部、ブチルアクリレート(以下、「BA」と略記する。)13質量部、3−メタクリルオキシプロピルトリメトキシシラン(以下、「MPTS」と略記する。)7質量部、BuOH12質量部及びtert−ブチルパーオキシ−2−エチルヘキサノエート(以下、「TBPEH」と略記する。)2.4質量部を含有する混合物を、前記反応容器中へ4時間で滴下し、滴下終了後、更に同温度で20時間反応させて加水分解性シリル基を有する数平均分子量が10,200のビニル重合体(a2−1)の有機溶剤溶液を得た。
次いで、iso−プロピルアシッドホスフェート(SC有機化学株式会社製「Phoslex A−3」、以下「A−3」と略記する。)0.04質量部と脱イオン水94質量部との混合物を、5分間で滴下し、更に同温度で10時間攪拌して加水分解縮合反応させることで、ビニル重合体(a2−1)の有する加水分解性シリル基と、前記PTMS及びDMDMS由来のポリシロキサンの有する加水分解性シリル基及びシラノール基とが結合した複合樹脂を含有する液を得た。
次いで、この液に合成例1で得られたMTMSの縮合物(a1’−1)398質量部、脱イオン水 67質量部を添加し、同温度で10時間攪拌して加水分解縮合反応させたものを、合成例1と同様の条件で蒸留することによって生成したメタノール及び水を除去し、次いで、BuOH 250質量部を添加し、不揮発分が60.1質量%の接着用樹脂組成物(1)を1,000質量部得た。
Example 1 Production of Resin Composition for Bonding (1)
150 parts by mass of n-butanol (hereinafter abbreviated as "BuOH"), phenyltrimethoxysilane (hereinafter "PTMS") in a reaction vessel equipped with a stirrer, thermometer, dropping funnel, cooling pipe and nitrogen gas inlet 88 parts by mass, and 233 parts by mass of dimethyldimethoxysilane (hereinafter abbreviated as "DMDMS") were charged, and the temperature was raised to 80.degree.
Subsequently, 84 parts by mass of methyl methacrylate (hereinafter abbreviated as "MMA"), 16 parts by mass of butyl methacrylate (hereinafter abbreviated as "BMA") at the same temperature, and butyl acrylate (hereinafter abbreviated as "BA") ) 13 parts by mass, 7 parts by mass of 3-methacryloxypropyltrimethoxysilane (hereinafter abbreviated as "MPTS"), 12 parts by mass of BuOH and tert-butylperoxy-2-ethylhexanoate (hereinafter "TBPEH") A mixture containing 2.4 parts by mass is dropped into the reaction vessel over 4 hours, and after completion of the dropping, the mixture is further reacted at the same temperature for 20 hours to obtain a number average having a hydrolyzable silyl group. An organic solvent solution of vinyl polymer (a2-1) having a molecular weight of 10,200 was obtained.
Then, a mixture of 0.04 parts by mass of iso-propyl acid phosphate ("Phoslex A-3" manufactured by SC Organic Chemical Co., Ltd., hereinafter abbreviated as "A-3") and 94 parts by mass of deionized water is The reaction solution is added dropwise for 1 minute, and the mixture is further stirred for 10 hours at the same temperature to cause a hydrolysis condensation reaction, whereby the hydrolysis of the hydrolyzable silyl group possessed by the vinyl polymer (a2-1) and the hydrolysis possessed by the PTMS and DMMS derived from polysiloxane. A liquid containing a composite resin in which a degradable silyl group and a silanol group were bonded was obtained.
Next, 398 parts by mass of the MTMS condensate (a1′-1) obtained in Synthesis Example 1 and 67 parts by mass of deionized water were added to this solution, and the mixture was stirred at the same temperature for 10 hours to cause a hydrolysis condensation reaction. The product was subjected to distillation under the same conditions as in Synthesis Example 1 to remove methanol and water formed, and then 250 parts by mass of BuOH was added, and a resin composition for adhesion having a nonvolatile content of 60.1% by mass (1 1,000 parts by mass was obtained.
(実施例2:接着用樹脂組成物(2)の製造)
攪拌機、温度計、滴下ロート、冷却管及び窒素ガス導入口を備えた反応容器に、BuOH 150質量部、PTMS 99質量部、DMDMS 263質量部を仕込んで80℃まで昇温した。
次いで、同温度でMMA 42質量部、BMA 8質量部、BA 7質量部、MPTS 4質量部、BuOH 6質量部及びTBPEH 1.2質量部を含有する混合物を、前記反応容器中へ5時間で滴下し、滴下終了後、更に同温度で20時間反応させて加水分解性シリル基を有する数平均分子量が10,300のビニル重合体(a2−2)の有機溶剤溶液を得た。
次いで、A−3 0.04質量部と脱イオン水 106質量部との混合物を、5分間で滴下し、更に同温度で10時間攪拌して加水分解縮合反応させることで、ビニル重合体(a2−2)の有する加水分解性シリル基と、前記PTMS及びDMDMS由来のポリシロキサンの有する加水分解性シリル基及びシラノール基とが結合した複合樹脂を含有する液を得た。
次いで、この液に合成例1で得られたMTMSの縮合物(a1’−1)447質量部、脱イオン水 76質量部を添加し、同温度で10時間攪拌して加水分解縮合反応させたものを、合成例1と同様の条件で蒸留することによって生成したメタノール及び水を除去し、次いで、BuOH 250質量部を添加し、不揮発分が60.0質量%の接着用樹脂組成物(2)を1,000質量部得た。
Example 2 Production of Resin Composition for Bonding (2)
In a reaction vessel equipped with a stirrer, a thermometer, a dropping funnel, a cooling pipe and a nitrogen gas inlet, 150 parts by mass of BuOH, 99 parts by mass of PTMS and 263 parts by mass of DMDS were charged, and the temperature was raised to 80 ° C.
Then, a mixture containing 42 parts by mass of MMA, 8 parts by mass of BMA, 7 parts by mass of BA, 4 parts by mass of MPTS, 6 parts by mass of BuOH and 1.2 parts by mass of TBPEH at the same temperature for 5 hours into the reaction vessel It dripped and it made it react at the same temperature for 20 hours after completion | finish of dripping, and obtained the organic solvent solution of the vinyl polymer (a2-2) of the number average molecular weight 10,300 which has a hydrolysable silyl group.
Next, a mixture of 0.04 parts by mass of A-3 and 106 parts by mass of deionized water is added dropwise over 5 minutes, and the mixture is further stirred for 10 hours at the same temperature to cause a hydrolysis condensation reaction, whereby a vinyl polymer (a2 There was obtained a liquid containing a composite resin in which the hydrolyzable silyl group possessed by (-2) and the hydrolyzable silyl group and silanol group possessed by the PTMS and the DMMS derived from polysiloxane are bonded.
Next, 447 parts by mass of the MTMS condensate (a1'-1) obtained in Synthesis Example 1 and 76 parts by mass of deionized water were added to this solution, and the mixture was stirred at the same temperature for 10 hours to cause a hydrolysis condensation reaction. The product was subjected to distillation under the same conditions as in Synthesis Example 1 to remove methanol and water formed, and then 250 parts by mass of BuOH was added, and a resin composition for adhesion having a nonvolatile content of 60.0% by mass (2 1,000 parts by mass was obtained.
(実施例3:接着用樹脂組成物(3)の製造)
攪拌機、温度計、滴下ロート、冷却管及び窒素ガス導入口を備えた反応容器に、BuOH 150質量部、PTMS 105質量部、DMDMS 277質量部を仕込んで80℃まで昇温した。
次いで、同温度でMMA 21質量部、BMA 4質量部、BA 3質量部、MPTS 2質量部、BuOH 3質量部及びTBPEH 0.6質量部を含有する混合物を、前記反応容器中へ6時間で滴下し、滴下終了後、更に同温度で20時間反応させて加水分解性シリル基を有する数平均分子量が10,000のビニル重合体(a2−3)の有機溶剤溶液を得た。
次いで、A−3 0.04質量部と脱イオン水 112質量部との混合物を、5分間で滴下し、更に同温度で10時間攪拌して加水分解縮合反応させることで、ビニル重合体(a2−3)の有する加水分解性シリル基と、前記PTMS及びDMDMS由来のポリシロキサンの有する加水分解性シリル基及びシラノール基とが結合した複合樹脂を含有する液を得た。
次いで、この液に合成例1で得られたMTMSの縮合物(a1’−1)472質量部、脱イオン水 80質量部を添加し、同温度で10時間攪拌して加水分解縮合反応させたものを、合成例1と同様の条件で蒸留することによって生成したメタノール及び水を除去し、次いで、BuOH 250質量部を添加し、不揮発分が60.1質量%の接着用樹脂組成物(3)を1,000質量部得た。
Example 3 Production of Resin Composition for Bonding (3)
In a reaction vessel equipped with a stirrer, a thermometer, a dropping funnel, a cooling pipe and a nitrogen gas inlet, 150 parts by mass of BuOH, 105 parts by mass of PTMS and 277 parts by mass of DMDS were charged, and the temperature was raised to 80 ° C.
Then, a mixture containing 21 parts by mass of MMA, 4 parts by mass of BMA, 3 parts by mass of BA, 2 parts by mass of MPTS, 3 parts by mass of BuOH and 0.6 parts by mass of TBPEH at the same temperature for 6 hours into the reaction vessel It dripped and it made it react at the same temperature for 20 hours after completion | finish of dripping, and obtained the organic solvent solution of the vinyl polymer (a2-3) of the number average molecular weight 10,000 which has a hydrolysable silyl group.
Next, a mixture of 0.04 parts by mass of A-3 and 112 parts by mass of deionized water is added dropwise over 5 minutes, and the mixture is further stirred for 10 hours at the same temperature to cause a hydrolysis condensation reaction, whereby a vinyl polymer (a2 There was obtained a liquid containing a composite resin in which the hydrolyzable silyl group of -3) and the hydrolyzable silyl group and silanol group of the PTMS and the polysiloxane derived from DMMS are bonded.
Next, to this solution, 472 parts by mass of the MTMS condensate (a1′-1) obtained in Synthesis Example 1 and 80 parts by mass of deionized water were added, and the mixture was stirred at the same temperature for 10 hours to cause a hydrolysis condensation reaction. The product was subjected to distillation under the same conditions as in Synthesis Example 1 to remove methanol and water formed, and then 250 parts by mass of BuOH was added, and a resin composition for adhesion having a non-volatile content of 60.1% by mass (3 1,000 parts by mass was obtained.
(実施例4:接着用樹脂組成物(4)の製造)
攪拌機、温度計、滴下ロート、冷却管及び窒素ガス導入口を備えた反応容器に、BuOH 150質量部、PTMS 108質量部、DMDMS 286質量部を仕込んで80℃まで昇温した。
次いで、同温度でMMA 8質量部、BMA 2質量部、BA 1質量部、MPTS 1質量部、BuOH 2質量部及びTBPEH 0.3質量部を含有する混合物を、前記反応容器中へ6時間で滴下し、滴下終了後、更に同温度で20時間反応させて加水分解性シリル基を有する数平均分子量が10,300のビニル重合体(a2−4)の有機溶剤溶液を得た。
次いで、A−3 0.05質量部と脱イオン水 115質量部との混合物を、5分間で滴下し、更に同温度で10時間攪拌して加水分解縮合反応させることで、ビニル重合体(a2−4)の有する加水分解性シリル基と、前記PTMS及びDMDMS由来のポリシロキサンの有する加水分解性シリル基及びシラノール基とが結合した複合樹脂を含有する液を得た。
次いで、この液に合成例1で得られたMTMSの縮合物(a1’−1)487質量部、脱イオン水 82質量部を添加し、同温度で10時間攪拌して加水分解縮合反応させたものを、合成例1と同様の条件で蒸留することによって生成したメタノール及び水を除去し、次いで、BuOH 250質量部を添加し、不揮発分が60.2質量%の接着用樹脂組成物(4)を1,000質量部得た。
Example 4 Production of Resin Composition for Bonding (4)
In a reaction vessel equipped with a stirrer, a thermometer, a dropping funnel, a cooling pipe and a nitrogen gas inlet, 150 parts by mass of BuOH, 108 parts by mass of PTMS and 286 parts by mass of DMDMS were charged and the temperature was raised to 80 ° C.
Then, a mixture containing 8 parts by mass of MMA, 2 parts by mass of BMA, 1 part by mass of BA, 1 part by mass of MPTS, 2 parts by mass of BuOH and 0.3 parts by mass of TBPEH at the same temperature for 6 hours into the reaction vessel It dripped and it made it react at the same temperature for 20 hours after completion | finish of dripping, and obtained the organic solvent solution of the vinyl polymer (a2-4) of the number average molecular weight 10,300 which has a hydrolysable silyl group.
Next, a mixture of 0.05 parts by mass of A-3 and 115 parts by mass of deionized water is added dropwise over 5 minutes, and the mixture is further stirred for 10 hours at the same temperature to cause a hydrolysis condensation reaction, whereby a vinyl polymer (a2 There was obtained a liquid containing a composite resin in which the hydrolyzable silyl group possessed by (4) and the hydrolyzable silyl group possessed by the PTMS and the polysiloxane derived from DMDMS and the silanol group are bonded.
Next, 487 parts by mass of the MTMS condensate (a1'-1) obtained in Synthesis Example 1 and 82 parts by mass of deionized water were added to this solution, and the mixture was stirred at the same temperature for 10 hours to cause a hydrolysis condensation reaction. The product was subjected to distillation under the same conditions as in Synthesis Example 1 to remove methanol and water formed, and then 250 parts by mass of BuOH was added, and a resin composition for adhesion having a nonvolatile content of 60.2% by mass (4 1,000 parts by mass was obtained.
(実施例5:接着用樹脂組成物(5)の製造)
実施例2で使用した、MMA 42質量部、BMA 8質量部、BA 7質量部、MPTS 4質量部、BuOH 6質量部及びTBPEH 1.2質量部を含有する混合物の代わりに、MMA 18質量部、BMA 14質量部、BA 7質量部、アクリル酸(以下、「AA」と略記する。)1質量部、MPTS 2質量部、BuOH 6質量部及びTBPEH 0.9質量部を含有する混合物を使用した以外は、実施例2と同様の操作を行い、不揮発分が60.0%の接着用樹脂組成物(5)を1,000質量部得た。
Example 5 Production of Resin Composition for Bonding (5)
MMA 18 parts by weight instead of the mixture used in Example 2 containing 42 parts by weight of MMA, 8 parts by weight of BMA, 7 parts by weight of BA, 4 parts by weight of MPTS, 6 parts by weight of BuOH and 1.2 parts by weight of TBPEH , BMA 14 parts by mass, BA 7 parts by mass, acrylic acid (hereinafter abbreviated as “AA”) 1 part by mass, MPTS 2 parts by mass, BuOH 6 parts by mass and TBPEH 0.9 parts by mass. An operation was performed in the same manner as in Example 2 except for the above to obtain 1,000 parts by mass of a bonding resin composition (5) having a nonvolatile content of 60.0%.
(実施例6:接着用樹脂組成物(6)の製造)
実施例2で使用した、MMA 42質量部、BMA 8質量部、BA 7質量部、MPTS 4質量部、BuOH 6質量部及びTBPEH 1.2質量部を含有する混合物の代わりに、MMA 12質量部、シクロヘキシルメタクリレート 15質量部、2−エチルヘキシルアクリレート 32質量部、MPTS 1質量部、BuOH 6質量部及びTBPEH 0.6質量部を含有する混合物を使用した以外は、実施例2と同様の操作を行ない、不揮発分が60.2%の接着用樹脂組成物(6)を1,000質量部得た。
Example 6 Production of Resin Composition for Bonding (6)
MMA 12 parts by mass instead of the mixture used in Example 2 containing 42 parts by mass of MMA, 8 parts by mass of BMA, 7 parts by mass of BA, 4 parts by mass of MPTS, 6 parts by mass of BuOH and 1.2 parts by mass of TBPEH The procedure of Example 2 is repeated except that a mixture containing 15 parts by mass of cyclohexyl methacrylate, 32 parts by mass of 2-ethylhexyl acrylate, 1 part by mass of MPTS, 6 parts by mass of BuOH and 0.6 parts by mass of TBPEH is used. As a result, 1,000 parts by mass of a bonding resin composition (6) having a nonvolatile content of 60.2% was obtained.
(実施例7:接着用樹脂組成物(7)の製造)
攪拌機、温度計、滴下ロート、冷却管及び窒素ガス導入口を備えた反応容器に、BuOH 150質量部、ジフェニルジメトキシシラン(以下、「DPDMS」と略記する。)133質量部、DMDMS 350質量部を仕込んで80℃まで昇温した。
次いで、同温度でMMA 18質量部、BMA 14質量部、BA 7質量部、AA 1質量部、MPTS 2質量部、BuOH 6質量部及びTBPEH 0.9質量部を含有する混合物を、前記反応容器中へ5時間で滴下し、滴下終了後、更に同温度で10時間反応させて加水分解性シリル基を有する数平均分子量が20,000のビニル重合体(a2−7)の有機溶剤溶液を得た。
次いで、A−3 0.05質量部と脱イオン水 134質量部との混合物を、5分間で滴下し、更に同温度で10時間攪拌して加水分解縮合反応させることで、ビニル重合体(a2−7)の有する加水分解性シリル基と、前記DPDMS及びDMDMS由来のポリシロキサンの有する加水分解性シリル基及びシラノール基とが結合した複合樹脂を含有する液を得た。
次いで、この液に合成例1で得られたMTMSの縮合物(a1’−1)309質量部、脱イオン水 52質量部を添加し、同温度で15時間攪拌して加水分解縮合反応させたものを、合成例1と同様の条件で蒸留することによって生成したメタノール及び水を除去し、次いで、BuOH 250質量部を添加し、不揮発分が60.0質量%の接着用樹脂組成物(7)を1,000質量部得た。
Example 7 Production of Resin Composition for Bonding (7)
150 parts by mass of BuOH, 133 parts by mass of diphenyldimethoxysilane (hereinafter abbreviated as "DPDMS"), and 350 parts by mass of DMDMS in a reaction vessel equipped with a stirrer, thermometer, dropping funnel, cooling pipe and nitrogen gas inlet The mixture was charged and heated to 80 ° C.
Subsequently, a mixture containing 18 parts by mass of MMA, 14 parts by mass of BMA, 7 parts by mass of BA, 1 part by mass of AA, 2 parts by mass of MPTS, 6 parts by mass of BuOH and 0.9 parts by mass of TBPEH at the same temperature The reaction solution is dropped for 5 hours and allowed to react at the same temperature for 10 hours to obtain an organic solvent solution of a vinyl polymer (a2-7) having a hydrolyzable silyl group and having a number average molecular weight of 20,000. The
Next, a mixture of 0.05 parts by mass of A-3 and 134 parts by mass of deionized water is added dropwise over 5 minutes, and the mixture is further stirred for 10 hours at the same temperature to cause a hydrolysis condensation reaction, whereby a vinyl polymer (a2 A liquid containing a composite resin in which the hydrolyzable silyl group possessed by (7) and the hydrolyzable silyl group possessed by the DDPMS and the polysiloxane derived from DMDMS and the silanol group are bonded is obtained.
Next, 309 parts by mass of the MTMS condensate (a1′-1) obtained in Synthesis Example 1 and 52 parts by mass of deionized water were added to this solution, and the mixture was stirred at the same temperature for 15 hours to cause a hydrolysis condensation reaction. The product was subjected to distillation under the same conditions as in Synthesis Example 1 to remove methanol and water formed, and then 250 parts by mass of BuOH was added, and a resin composition for adhesion having a nonvolatile content of 60.0% by mass (7 1,000 parts by mass was obtained.
(実施例8:接着用樹脂組成物(8)の製造)
攪拌機、温度計、滴下ロート、冷却管及び窒素ガス導入口を備えた反応容器に、BuOH 150質量部、PTMS 249質量部、DMDMS 263質量部を仕込んで80℃まで昇温した。
次いで、同温度でMMA 18質量部、BMA 14質量部、BA 7質量部、AA 1質量部、MPTS 2質量部、BuOH 6質量部及びTBPEH 0.9質量部を含有する混合物を、前記反応容器中へ5時間で滴下し、滴下終了後、更に同温度で10時間反応させて加水分解性シリル基を有する数平均分子量が20,100のビニル重合体(a2−8)の有機溶剤溶液を得た。
次いで、A−3 0.05質量部と脱イオン水 147質量部との混合物を、5分間で滴下し、更に同温度で10時間攪拌して加水分解縮合反応させることで、ビニル重合体(a2−8)の有する加水分解性シリル基と、前記PTMS及びDMDMS由来のポリシロキサンの有する加水分解性シリル基及びシラノール基とが結合した複合樹脂を含有する液を得た。
次いで、この液に3−グリシドキシプロピルトリメトキシシラン 76質量部、合成例1で得られたMTMSの縮合物(a1’−1)231質量部、脱イオン水 56質量部を添加し、同温度で15時間攪拌して加水分解縮合反応させたものを、合成例1と同様の条件で蒸留することによって生成したメタノール及び水を除去し、次いで、BuOH 250質量部を添加し、不揮発分が60.0質量%の接着用樹脂組成物(8)を1,000質量部得た。
Example 8 Production of Resin Composition for Bonding (8)
In a reaction vessel equipped with a stirrer, a thermometer, a dropping funnel, a condenser and a nitrogen gas inlet, 150 parts by mass of BuOH, 249 parts by mass of PTMS and 263 parts by mass of DMDS were charged, and the temperature was raised to 80 ° C.
Subsequently, a mixture containing 18 parts by mass of MMA, 14 parts by mass of BMA, 7 parts by mass of BA, 1 part by mass of AA, 2 parts by mass of MPTS, 6 parts by mass of BuOH and 0.9 parts by mass of TBPEH at the same temperature The reaction solution is dropped for 5 hours into the mixture, and after completion of the dropping, the mixture is further reacted at the same temperature for 10 hours to obtain an organic solvent solution of a vinyl polymer (a2-8) having a hydrolyzable silyl group and a number average molecular weight of 20,100 The
Next, a mixture of 0.05 parts by mass of A-3 and 147 parts by mass of deionized water is added dropwise over 5 minutes, and the mixture is further stirred for 10 hours at the same temperature to cause a hydrolysis condensation reaction, whereby a vinyl polymer (a2 There was obtained a liquid containing a composite resin in which the hydrolyzable silyl group possessed by -8) and the hydrolyzable silyl group possessed by the PTMS and the DMMS derived from polysiloxane and the silanol group are bonded.
Subsequently, 76 parts by mass of 3-glycidoxypropyltrimethoxysilane, 231 parts by mass of the MTMS condensate (a1'-1) obtained in Synthesis Example 1, and 56 parts by mass of deionized water are added to this solution, Methanol and water which were produced by distilling under the same conditions as those of Synthesis Example 1 were removed by stirring at a temperature for 15 hours for hydrolysis and condensation reaction, then 250 parts by mass of BuOH was added, and the non volatile matter was 1,000 parts by mass of 60.0% by mass of the adhesive resin composition (8) were obtained.
(実施例9:接着用樹脂組成物(9)の製造)
攪拌機、温度計、滴下ロート、冷却管及び窒素ガス導入口を備えた反応容器に、BuOH 150質量部、PTMS 414質量部、DMDMS 263質量部を仕込んで80℃まで昇温した。
次いで、同温度でMMA 18質量部、BMA 14質量部、BA 7質量部、AA 1質量部、MPTS 2質量部、BuOH 6質量部及びTBPEH 0.9質量部を含有する混合物を、前記反応容器中へ6時間で滴下し、滴下終了後、更に同温度で10時間反応させて加水分解性シリル基を有する数平均分子量が19,600のビニル重合体(a2−9)の有機溶剤溶液を得た。
次いで、A−3 0.07質量部と脱イオン水 192質量部との混合物を、5分間で滴下し、更に同温度で10時間攪拌して加水分解縮合反応させることで、ビニル重合体(a2−9)の有する加水分解性シリル基と、前記PTMS及びDMDMS由来のポリシロキサンの有する加水分解性シリル基及びシラノール基とが結合した複合樹脂を含有する液を得た。
次いで、この液に合成例1で得られたMTMSの縮合物(a1’−1)154質量部、脱イオン水 26質量部を添加し、同温度で5時間攪拌して加水分解縮合反応させたものを、合成例1と同様の条件で蒸留することによって生成したメタノール及び水を除去し、次いで、BuOH 250質量部を添加し、不揮発分が60.1質量%の接着用樹脂組成物(9)を1,000質量部得た。
Example 9 Production of Resin Composition for Bonding (9)
In a reaction vessel equipped with a stirrer, a thermometer, a dropping funnel, a condenser and a nitrogen gas inlet, 150 parts by mass of BuOH, 414 parts by mass of PTMS and 263 parts by mass of DMDMS were charged and the temperature was raised to 80 ° C.
Subsequently, a mixture containing 18 parts by mass of MMA, 14 parts by mass of BMA, 7 parts by mass of BA, 1 part by mass of AA, 2 parts by mass of MPTS, 6 parts by mass of BuOH and 0.9 parts by mass of TBPEH at the same temperature The reaction solution is dropped for 6 hours, and after completion of the dropwise addition, the reaction is carried out for 10 hours at the same temperature to obtain an organic solvent solution of a vinyl polymer (a2-9) having a hydrolyzable silyl group and a number average molecular weight of 19,600. The
Next, a mixture of 0.07 parts by mass of A-3 and 192 parts by mass of deionized water is added dropwise over 5 minutes, and the mixture is further stirred for 10 hours at the same temperature to cause a hydrolysis condensation reaction, whereby a vinyl polymer (a2 There was obtained a liquid containing a composite resin in which the hydrolyzable silyl group of -9) and the hydrolyzable silyl group and silanol group of the PTMS and the polysiloxane derived from DMMS are bonded.
Next, 154 parts by mass of the MTMS condensate (a1'-1) obtained in Synthesis Example 1 and 26 parts by mass of deionized water were added to this solution, and the mixture was stirred for 5 hours at the same temperature to cause a hydrolysis condensation reaction. The product was subjected to distillation under the same conditions as in Synthesis Example 1 to remove methanol and water formed, and then 250 parts by mass of BuOH was added, and a resin composition for adhesion having a non-volatile content of 60.1% by mass (9 1,000 parts by mass was obtained.
(比較例1:接着用樹脂組成物(R−1)の製造)
攪拌機、温度計、滴下ロート、冷却管及び窒素ガス導入口を備えた反応容器に、BuOH 150質量部、PTMS 33質量部、DMDMS 88質量部を仕込んで80℃まで昇温した。
次いで、同温度でMMA 294質量部、BMA 55質量部、BA 46質量部、MPTS 25質量部、BuOH 42質量部及びTBPEH 8.4質量部を含有する混合物を、前記反応容器中へ3時間で滴下し、滴下終了後、更に同温度で20時間反応させて加水分解性シリル基を有する数平均分子量が11,000のビニル重合体(Ra2−1)の有機溶剤溶液を得た。
次いで、A−3 0.01質量部と脱イオン水 35質量部との混合物を、5分間で滴下し、更に同温度で10時間攪拌して加水分解縮合反応させることで、ビニル重合体(Ra2−1)の有する加水分解性シリル基と、前記PTMS及びDMDMS由来のポリシロキサンの有する加水分解性シリル基及びシラノール基とが結合した複合樹脂を含有する液を得た。
次いで、この液に合成例1で得られたMTMSの縮合物(a1’−1)149質量部、脱イオン水 25質量部を添加し、同温度で10時間攪拌して加水分解縮合反応させたものを、合成例1と同様の条件で蒸留することによって生成したメタノール及び水を除去し、次いで、BuOH 250質量部を添加し、不揮発分が60.0質量%の接着用樹脂組成物(R−1)を1,000質量部得た。
Comparative Example 1: Production of Resin Composition for Adhesion (R-1)
In a reaction vessel equipped with a stirrer, a thermometer, a dropping funnel, a cooling pipe and a nitrogen gas inlet, 150 parts by mass of BuOH, 33 parts by mass of PTMS, and 88 parts by mass of DMDMS were charged and the temperature was raised to 80 ° C.
Then, at the same temperature, a mixture containing 294 parts by mass of MMA, 55 parts by mass of BMA, 46 parts by mass of BA, 25 parts by mass of MPTS, 42 parts by mass of BuOH and 8.4 parts by mass of TBPEH is introduced into the reaction vessel for 3 hours It dripped and it made it react at the same temperature for 20 hours after completion | finish of dripping, and obtained the organic solvent solution of the vinyl polymer (Ra2-1) of the number average molecular weight 11,000 which has a hydrolysable silyl group.
Next, a mixture of 0.01 part by mass of A-3 and 35 parts by mass of deionized water is added dropwise over 5 minutes, and the mixture is further stirred for 10 hours at the same temperature to cause a hydrolysis condensation reaction, thereby obtaining a vinyl polymer (Ra2). There was obtained a liquid containing a composite resin in which the hydrolyzable silyl group possessed by -1) and the hydrolyzable silyl group possessed by the PTMS and the DMMS derived from polysiloxane and the silanol group are bonded.
Subsequently, 149 parts by mass of the MTMS condensate (a1'-1) obtained in Synthesis Example 1 and 25 parts by mass of deionized water were added to this solution, and the mixture was stirred at the same temperature for 10 hours to cause a hydrolysis condensation reaction. The product was subjected to distillation under the same conditions as in Synthesis Example 1 to remove methanol and water generated, and then 250 parts by mass of BuOH was added, and a resin composition for adhesion having a nonvolatile content of 60.0% by mass (R 1,000 parts by mass of -1) were obtained.
(比較例2:接着用樹脂組成物(R−2)の製造)
攪拌機、温度計、滴下ロート、冷却管及び窒素ガス導入口を備えた反応容器に、BuOH 150質量部、PTMS 66質量部、DMDMS 175質量部を仕込んで80℃まで昇温した。
次いで、同温度でMMA 168質量部、BMA 31質量部、BA 26質量部、MPTS 14質量部、BuOH 24質量部及びTBPEH 4.8質量部を含有する混合物を、前記反応容器中へ4時間で滴下し、滴下終了後、更に同温度で20時間反応させて加水分解性シリル基を有する数平均分子量が10,200のビニル重合体(Ra2−2)の有機溶剤溶液を得た。
次いで、A−3 0.03質量部と脱イオン水 70質量部との混合物を、5分間で滴下し、更に同温度で10時間攪拌して加水分解縮合反応させることで、ビニル重合体(Ra2−2)の有する加水分解性シリル基と、前記PTMS及びDMDMS由来のポリシロキサンの有する加水分解性シリル基及びシラノール基とが結合した複合樹脂を含有する液を得た。
次いで、この液に合成例1で得られたMTMSの縮合物(a1’−1)298質量部、脱イオン水 50質量部を添加し、同温度で10時間攪拌して加水分解縮合反応させたものを、合成例1と同様の条件で蒸留することによって生成したメタノール及び水を除去し、次いで、BuOH 250質量部を添加し、不揮発分が60.0質量%の接着用樹脂組成物(R−2)を1,000質量部を得た。
Comparative Example 2: Production of Resin Composition for Adhesion (R-2)
In a reaction vessel equipped with a stirrer, a thermometer, a dropping funnel, a cooling pipe and a nitrogen gas inlet, 150 parts by mass of BuOH, 66 parts by mass of PTMS and 175 parts by mass of DMDS were charged, and the temperature was raised to 80 ° C.
Then, at the same temperature, a mixture containing 168 parts by mass of MMA, 31 parts by mass of BMA, 26 parts by mass of BA, 14 parts by mass of MPTS, 24 parts by mass of BuOH and 4.8 parts by mass of TBPEH is introduced into the reaction vessel for 4 hours It dripped and it made it react at the same temperature for 20 hours after completion | finish of dripping, and obtained the organic solvent solution of the vinyl polymer (Ra2-2) of the number average molecular weight 10,200 which has a hydrolysable silyl group.
Then, a mixture of 0.03 parts by mass of A-3 and 70 parts by mass of deionized water is added dropwise over 5 minutes, and the mixture is further stirred for 10 hours at the same temperature to cause a hydrolysis condensation reaction, thereby obtaining a vinyl polymer (Ra2). There was obtained a liquid containing a composite resin in which the hydrolyzable silyl group possessed by (-2) and the hydrolyzable silyl group and silanol group possessed by the PTMS and the DMMS derived from polysiloxane are bonded.
Next, 298 parts by mass of the MTMS condensate (a1'-1) obtained in Synthesis Example 1 and 50 parts by mass of deionized water were added to this solution, and the mixture was stirred at the same temperature for 10 hours to cause a hydrolysis condensation reaction. The product was subjected to distillation under the same conditions as in Synthesis Example 1 to remove methanol and water generated, and then 250 parts by mass of BuOH was added, and a resin composition for adhesion having a nonvolatile content of 60.0% by mass (R 1,000 parts by mass of 2) were obtained.
(比較例3:接着用樹脂組成物(R−3)の製造)
攪拌機、温度計、滴下ロート、冷却管及び窒素ガス導入口を備えた反応容器に、BuOH 150質量部、PTMS 111質量部、DMDMS 292質量部を仕込んで80℃まで昇温した。
次いで、同温度でA−3 0.05質量部と脱イオン水 118質量部との混合物を、5分間で滴下し、更に同温度で10時間攪拌して加水分解縮合反応させることで、前記PTMS及びDMDMS由来のポリシロキサンを含有する液を得た。
次いで、この液に合成例1で得られたMTMSの縮合物(a1’−1)497質量部、脱イオン水 84質量部を添加し、同温度で10時間攪拌して加水分解縮合反応させたものを、合成例1と同様の条件で蒸留することによって生成したメタノール及び水を除去し、次いで、BuOH 250質量部を添加し、不揮発分が60.0質量%の接着用樹脂組成物(R−3)を1,000質量部得た。
(Comparative example 3: manufacture of resin composition (R-3) for adhesion)
In a reaction vessel equipped with a stirrer, a thermometer, a dropping funnel, a cooling pipe and a nitrogen gas inlet, 150 parts by mass of BuOH, 111 parts by mass of PTMS, and 292 parts by mass of DMDS were charged, and the temperature was raised to 80 ° C.
Then, a mixture of 0.05 parts by mass of A-3 and 118 parts by mass of deionized water is added dropwise over 5 minutes at the same temperature, and the PTMS is further subjected to a hydrolysis condensation reaction by stirring for 10 hours at the same temperature. And the liquid containing the polysiloxane derived from DMDMS was obtained.
Next, 497 parts by mass of the MTMS condensate (a1'-1) obtained in Synthesis Example 1 and 84 parts by mass of deionized water were added to this solution, and the mixture was stirred at the same temperature for 10 hours to cause a hydrolysis condensation reaction. The product was subjected to distillation under the same conditions as in Synthesis Example 1 to remove methanol and water generated, and then 250 parts by mass of BuOH was added, and a resin composition for adhesion having a nonvolatile content of 60.0% by mass (R 1,000 parts by mass of -3) were obtained.
(比較例4:接着用樹脂組成物(R−4)の製造)
攪拌機、温度計、滴下ロート、冷却管及び窒素ガス導入口を備えた反応容器に、BuOH 150質量部、PTMS 41質量部、DMDMS 263質量部を仕込んで80℃まで昇温した。
次いで、同温度でMMA 42質量部、BMA 8質量部、BA 7質量部、MPTS 4質量部、BuOH 6質量部及びTBPEH 1.2質量部を含有する混合物を、前記反応容器中へ5時間で滴下し、滴下終了後、更に同温度で20時間反応させて加水分解性シリル基を有する数平均分子量が10,400のビニル重合体(Ra2−4)の有機溶剤溶液を得た。
次いで、A−3 0.04質量部と脱イオン水 90質量部との混合物を、5分間で滴下し、更に同温度で10時間攪拌して加水分解縮合反応させることで、ビニル重合体(Ra2−4)の有する加水分解性シリル基と、前記PTMS及びDMDMS由来のポリシロキサンの有する加水分解性シリル基及びシラノール基とが結合した複合樹脂を含有する液を得た。
次いで、この液に合成例1で得られたMTMSの縮合物(a1’−1)501質量部、脱イオン水 85質量部を添加し、同温度で10時間攪拌して加水分解縮合反応させたものを、合成例1と同様の条件で蒸留することによって生成したメタノール及び水を除去し、次いで、BuOH 250質量部を添加し、不揮発分が60.0質量%の接着用樹脂組成物(R−4)を1,000質量部得た。
Comparative Example 4 Production of Resin Composition for Adhesion (R-4)
In a reaction vessel equipped with a stirrer, a thermometer, a dropping funnel, a cooling pipe and a nitrogen gas inlet, 150 parts by mass of BuOH, 41 parts by mass of PTMS and 263 parts by mass of DMDMS were charged and the temperature was raised to 80 ° C.
Then, a mixture containing 42 parts by mass of MMA, 8 parts by mass of BMA, 7 parts by mass of BA, 4 parts by mass of MPTS, 6 parts by mass of BuOH and 1.2 parts by mass of TBPEH at the same temperature for 5 hours into the reaction vessel It dripped and after completion | finish of dripping, it was made to react at the same temperature for 20 hours, and the organic solvent solution of the vinyl polymer (Ra2-4) of the number average molecular weight 10,400 which has a hydrolysable silyl group was obtained.
Next, a mixture of 0.04 parts by mass of A-3 and 90 parts by mass of deionized water is added dropwise over 5 minutes, and the mixture is further stirred for 10 hours at the same temperature to cause a hydrolysis condensation reaction, thereby obtaining a vinyl polymer (Ra2). There was obtained a liquid containing a composite resin in which the hydrolyzable silyl group possessed by (4) and the hydrolyzable silyl group possessed by the PTMS and the polysiloxane derived from DMDMS and the silanol group are bonded.
Next, to this solution was added 501 parts by mass of the MTMS condensate (a1'-1) obtained in Synthesis Example 1 and 85 parts by mass of deionized water, and the mixture was stirred at the same temperature for 10 hours to cause a hydrolysis condensation reaction. The product was subjected to distillation under the same conditions as in Synthesis Example 1 to remove methanol and water generated, and then 250 parts by mass of BuOH was added, and a resin composition for adhesion having a nonvolatile content of 60.0% by mass (R 1,000 parts by mass of -4) was obtained.
(比較例5:接着用樹脂組成物(R−5)の製造)
攪拌機、温度計、滴下ロート、冷却管及び窒素ガス導入口を備えた反応容器に、BuOH 150質量部、PTMS 332質量部、DMDMS 350質量部を仕込んで80℃まで昇温した。
次いで、同温度でMMA 42質量部、BMA 8質量部、BA 7質量部、MPTS 4質量部、BuOH 6質量部及びTBPEH 1.2質量部を含有する混合物を、前記反応容器中へ6時間で滴下し、滴下終了後、更に同温度で20時間反応させて加水分解性シリル基を有する数平均分子量が10,000のビニル重合体(Ra2−5)の有機溶剤溶液を得た。
次いで、A−3 0.07質量部と脱イオン水 195質量部との混合物を、5分間で滴下し、更に同温度で10時間攪拌して加水分解縮合反応させることで、ビニル重合体(Ra2−5)の有する加水分解性シリル基と、前記PTMS及びDMDMS由来のポリシロキサンの有する加水分解性シリル基及びシラノール基とが結合した複合樹脂を含有する液を得た。
次いで、この液に3−グリシドキシプロピルトリメトキシシラン 153質量部、脱イオン水 35質量部を添加し、同温度で10時間攪拌して加水分解縮合反応させたものを、合成例1と同様の条件で蒸留することによって生成したメタノール及び水を除去し、次いで、BuOH 250質量部を添加し、不揮発分が60.0質量%の接着用樹脂組成物(R−5)を1,000質量部得た。
(Comparative example 5: Manufacture of a resin composition (R-5) for adhesion)
In a reaction vessel equipped with a stirrer, a thermometer, a dropping funnel, a cooling pipe and a nitrogen gas inlet, 150 parts by mass of BuOH, 332 parts by mass of PTMS and 350 parts by mass of DMDMS were charged and the temperature was raised to 80 ° C.
Then, a mixture containing 42 parts by mass of MMA, 8 parts by mass of BMA, 7 parts by mass of BA, 4 parts by mass of MPTS, 6 parts by mass of BuOH and 1.2 parts by mass of TBPEH at the same temperature for 6 hours into the reaction vessel It dripped and it made it react at the same temperature for 20 hours after completion | finish of dripping, and obtained the organic solvent solution of the vinyl polymer (Ra2-5) of the number average molecular weight 10,000 which has a hydrolysable silyl group.
Next, a mixture of 0.07 parts by mass of A-3 and 195 parts by mass of deionized water is added dropwise over 5 minutes, and the mixture is further stirred for 10 hours at the same temperature to cause a hydrolysis condensation reaction, thereby obtaining a vinyl polymer (Ra2). There was obtained a liquid containing a composite resin in which the hydrolyzable silyl group possessed by (-5) and the hydrolyzable silyl group and silanol group possessed by the PTMS and the polysiloxane derived from DMDS are bonded.
Subsequently, 153 parts by mass of 3-glycidoxypropyltrimethoxysilane and 35 parts by mass of deionized water were added to this solution, and the mixture was stirred for 10 hours at the same temperature for hydrolysis and condensation reaction, as in Synthesis Example 1. Of methanol and water generated by distillation under the following conditions, and then adding 250 parts by mass of BuOH, and 1,000 parts by mass of the adhesive resin composition (R-5) having a nonvolatile content of 60.0% by mass. I got a part.
(比較例6:接着用樹脂組成物(R−6)の製造)
攪拌機、温度計、滴下ロート、冷却管及び窒素ガス導入口を備えた反応容器に、BuOH 690質量部を仕込んで80℃まで昇温した。
次いで、同温度でMMA 193質量部、BMA 36質量部、BA 30質量部、MPTS 17質量部、BuOH 28質量部及びTBPEH 5.5質量部を含有する混合物を、前記反応容器中へ3時間で滴下し、滴下終了後、更に同温度で20時間反応させて数平均分子量が10,300のビニル重合体(Ra2−6)の有機溶剤溶液を得た。
次いで、比較例3で得た接着用樹脂組成物(R−3)808質量部と不揮発分が28.0質量%のビニル重合体(Ra2−6)の有機溶剤溶液 192質量部とを混合し、同温度で1時間攪拌することで不揮発分が53.8質量%の接着用樹脂組成物(R−6)を1,000質量部得た。
(Comparative example 6: manufacture of resin composition (R-6) for adhesion)
In a reaction vessel equipped with a stirrer, a thermometer, a dropping funnel, a cooling pipe and a nitrogen gas inlet, 690 parts by mass of BuOH were charged and the temperature was raised to 80 ° C.
Then, a mixture containing 193 parts by mass of MMA, 36 parts by mass of BMA, 30 parts by mass of BA, 17 parts by mass of MPTS, 28 parts by mass of BuOH and 5.5 parts by mass of TBPEH at the same temperature for 3 hours into the reaction vessel It dripped and made it react at the same temperature for 20 hours after completion | finish of dripping, and the organic solvent solution of the vinyl polymer (Ra2-6) of a number average molecular weight 10,300 was obtained.
Subsequently, 808 parts by mass of the adhesive resin composition (R-3) obtained in Comparative Example 3 and 192 parts by mass of an organic solvent solution of a vinyl polymer (Ra2-6) having a nonvolatile content of 28.0% by mass are mixed. By stirring at the same temperature for 1 hour, 1,000 parts by mass of a bonding resin composition (R-6) having a non-volatile content of 53.8% by mass was obtained.
[保存安定性の評価]
上記で得られた接着用樹脂組成物の保存安定性を、50℃において、30日間保存したものの粘度(いわゆる経時粘度)を分子とし、初期粘度を分母とする粘度比で評価した。粘度測定は、E型粘度計(東京計器株式会社製)を用いて25℃にて行った。また、サンプルの保存は、得られた金属用コーティング剤をガラス製チュ−ブに入れて、50℃の環境下で30日間静置せしめることによって行った。この粘度比が1に近い値であるほど、保存安定性が優れているということを意味しており、粘度比が0.9以上1.1以下で保存安定性が非常に優れている樹脂組成物であるものと判定した。
[Evaluation of storage stability]
The storage stability of the adhesive resin composition obtained above was evaluated at a viscosity ratio with an initial viscosity as a denominator, with the viscosity (so-called viscosity over time) of what was stored at 50 ° C. for 30 days as a molecule. The viscosity was measured at 25 ° C. using an E-type viscometer (manufactured by Tokyo Keiki Co., Ltd.). Moreover, the storage of the sample was performed by putting the obtained coating agent for metals in a glass tube and allowing it to stand for 30 days under an environment of 50 ° C. A resin composition having a viscosity ratio of 0.9 or more and 1.1 or less and a very excellent storage stability, as the viscosity ratio is closer to 1 means that the storage stability is more excellent. It was determined to be a thing.
[評価用硬化塗膜の作製]
上記で得られた接着用樹脂組成物を、軟質ガラス板(JIS R 3202)、クロメート処理アルミ板(JIS H 4000:A5052P)、ポリエチレンテレフタレート板(東レ株式会社製ルミラーT−60)、アルミ板(JIS H 4000:A1050P)、ポリプロピレン板(JIS K 6921)、ポリ塩化ビニル板(JIS K 6745)、及びシリコンゴムシートの各基材上に、硬化塗膜の膜厚が30μmとなるように塗装し、120℃の環境下で15分間乾燥させて評価用硬化塗膜を得た。
[Preparation of cured film for evaluation]
The resin composition for bonding obtained above was treated with a soft glass plate (JIS R 3202), a chromate-treated aluminum plate (JIS H 4000: A5052P), a polyethylene terephthalate plate (Lumirror T-60 manufactured by Toray Industries, Inc.), an aluminum plate ( JIS H 4000: A1050P), a polypropylene plate (JIS K 6921), a polyvinyl chloride plate (JIS K 6745), and a silicone rubber sheet are coated to a thickness of 30 μm on the cured coating film. The coated film was dried for 15 minutes in an environment of 120 ° C. to obtain a cured coating for evaluation.
[全光線透過率の測定]
上記で得られたガラス基材上の評価用硬化塗膜について、日本電色工業社製ヘイズメーターNDH−5000により、全光線透過率の測定を行った。
[Measurement of total light transmittance]
About the cured coating film for evaluation on the glass base material obtained above, the measurement of the total light transmittance was performed by Nippon Denshoku Industries Co., Ltd. make haze meter NDH-5000.
[塗膜外観の評価]
上記で得られたガラス板及びクロメート処理アルミ板上の評価用硬化塗膜について、目視で観察し、下記の基準で塗膜外観を評価した。
○:クラックおよび白化の発生が認められない。
△:若干のクラックまたは白化の発生が認められる。
×:クラックまたは白化の発生が認められる。
[Evaluation of coating film appearance]
The cured coating films for evaluation on the glass plate and the chromate-treated aluminum plate obtained above were visually observed, and the coating film appearance was evaluated according to the following criteria.
○: No occurrence of cracking and whitening was observed.
Δ: Some occurrence of cracking or whitening is observed.
X: Occurrence of cracking or whitening is observed.
[接着性の評価]
上記で得られた各基材上の評価用硬化塗膜について、JIS K−5600 碁盤目試験法に基づいて測定した。前記硬化塗膜の上にカッターで1mm幅の切込みを入れ碁盤目の数を100個とし、全ての碁盤目を覆うようにセロハンテープを貼り付け、すばやく引き剥がして付着して残っている碁盤目の数を数え、下記の基準で評価した。
○:はがれなし。
△:はがれの面積が、全碁盤目面積の1〜64%。
×:はがれの面積は、全碁盤目面積の65%以上。
[Evaluation of adhesion]
About the cured coating film for evaluation on each base material obtained above, it measured based on the JIS K-5600 cross-cut test method. A cut of 1 mm in width is made with a cutter on the cured coating film, the number of grids is 100, a cellophane tape is pasted so as to cover all grids, and the grids are peeled off and adhered Were counted and evaluated according to the following criteria.
○: There is no peeling.
Δ: The area of peeling is 1 to 64% of the total grid area.
×: Peeling area is 65% or more of the total grid area.
[耐熱性(外観)の評価]
上記で得られたガラス板及びクロメート処理アルミ板上の評価用硬化塗膜について、300℃雰囲気の乾燥機に24時間静置した後に乾燥機から取り出した後の外観を目視で観察し、下記の基準で評価した。
○:クラックの発生が認められない。
△:若干のクラックの発生が認められる。
×:クラックの発生が認められる。
[Evaluation of heat resistance (appearance)]
The cured coating film for evaluation on the glass plate and the chromate-treated aluminum plate obtained above was allowed to stand in a dryer at 300 ° C. for 24 hours, and then the appearance after taking it out from the dryer was visually observed. It evaluated by the standard.
○: No occurrence of cracks observed.
Δ: Some occurrence of cracks is observed.
X: Generation of a crack is recognized.
[耐熱性(接着性)の評価]
上記で得られたガラス板及びクロメート処理アルミ板上の評価用硬化塗膜について、300℃雰囲気の乾燥機に24時間静置した後に乾燥機から取り出し1時間静置した。その後、塗膜の上にカッターで1mm幅の切込みを入れ碁盤目の数を100個とし、全ての碁盤目を覆うようにセロハンテープを貼り付け、すばやく引き剥がして付着して残っている碁盤目の数を数え、下記の基準で評価した。
○:はがれなし。
△:はがれの面積は、全碁盤目面積の1〜64%。
×:はがれの面積は、全碁盤目面積の65%以上。
[Evaluation of heat resistance (adhesiveness)]
The cured coating film for evaluation on the glass plate and the chromate-treated aluminum plate obtained above was allowed to stand in a dryer at 300 ° C. for 24 hours and then removed from the dryer and allowed to stand for 1 hour. After that, cut a 1 mm width with a cutter on the coating and cut the number of grids to 100, paste the cellophane tape so as to cover all grids, remove it quickly, and adhere and leave the grids Were counted and evaluated according to the following criteria.
○: There is no peeling.
Δ: Peeling area is 1 to 64% of total grid area.
×: Peeling area is 65% or more of the total grid area.
[耐候性(外観)の評価]
上記で得られたクロメート処理アルミ板上の評価用硬化塗膜について、デューパネル光ウェザーメーター(スガ試験機株式会社製、光照射時:30W/m2、70℃;湿潤時:湿度90%以上、50℃、光照射/湿潤サイクル=8時間/4時間)で1,000時間曝露を行なった後の塗膜を目視で観察し、下記の基準で塗膜外観を評価した。
○:クラックの発生が認められない。
△:若干のクラックの発生が認められる。
×:クラックの発生が認められる。
[Evaluation of weatherability (appearance)]
With regard to the cured film for evaluation on the chromate-treated aluminum plate obtained above, a Dew panel light weather meter (manufactured by Suga Test Instruments Co., Ltd., at the time of light irradiation: 30 W / m 2 , 70 ° C .; wet: 90% or more of humidity) After 1,000 hours of exposure at 50 ° C., light irradiation / wet cycle = 8 hours / 4 hours), the coating film was visually observed, and the coating appearance was evaluated based on the following criteria.
○: No occurrence of cracks observed.
Δ: Some occurrence of cracks is observed.
X: Generation of a crack is recognized.
[耐候性(光沢保持率)の評価]
上記で得られた作製直後のクロメート処理アルミ板上の評価用硬化塗膜の鏡面反射率(光沢値)(%)と、該硬化塗膜を、デューパネル光ウェザーメーター(スガ試験機株式会社製、光照射時:30W/m2、70℃;湿潤時:湿度90%以上、50℃、光照射/湿潤サイクル=8時間/4時間)で1,000時間曝露した後の塗膜の鏡面反射率(光沢値)(%)の、曝露前の硬化塗膜の鏡面反射率(光沢値)に対する保持率(光沢保持率:%)〔(100×暴露後の塗膜の鏡面反射率)/(曝露前の硬化塗膜の鏡面反射率)〕で評価した。保持率の値が大きいほど、耐候性が良好であることを示す。
[Evaluation of weather resistance (gloss retention)]
The specular reflectance (gloss value) (%) of the cured coating film for evaluation on the chromate-treated aluminum plate immediately after preparation obtained as described above, and the cured coating film were measured using a de-panel optical weather meter (manufactured by Suga Test Instruments Co., Ltd.) At the time of light irradiation: 30 W / m 2, 70 ° C .; at the time of humidity: 90% or more of humidity, 50 ° C., light irradiation / wet cycle = 8 hours / 4 hours) specular reflectance of coating film after 1,000 hours exposure Retention rate (gloss retention rate) (% glossiness) of the (Gloss value) (%) relative to the specular reflectance (gloss value) of the cured coating film before exposure [(specular reflectance of coating after exposure) / (exposure Specular reflectance of previous cured coating film)]. The larger the retention value, the better the weather resistance.
[剥離強度の評価]
上記で得られた接着用樹脂組成物を、一方の基材上の中心部に1g塗装後、もう一方の基材を十字になるように重ね、120℃で10分間圧着させて評価用試験片を得た。
この評価用試験片について精密万能試験機AG−I/XR(株式会社島津製作所製)で剥離強度を下記条件にて評価した。
サンプル形状:25mm×100mm×5mm
引張速度:1mm/分
測定雰囲気:23℃、50%RH
[Evaluation of peel strength]
After coating 1 g of the adhesive resin composition obtained above on the center of one substrate, overlay the other substrate so as to form a cross, and press-bond at 120 ° C. for 10 minutes for evaluation test pieces I got
The peel strength of the test piece for evaluation was evaluated by the precision universal testing machine AG-I / XR (manufactured by Shimadzu Corporation) under the following conditions.
Sample shape: 25mm x 100mm x 5mm
Tensile speed: 1 mm / min Measurement atmosphere: 23 ° C, 50% RH
上記の実施例1〜9及び比較例1〜6の評価結果を表1〜表4に示す。 Tables 1 to 4 show the evaluation results of Examples 1 to 9 and Comparative Examples 1 to 6 described above.
実施例1〜9の本発明の接着用樹脂組成物は保存安定性に優れ、これらの接着用樹脂組成物からは、外観、接着性、耐熱性、及び耐候性等の各種塗膜物性に優れる硬化塗膜が得られることが確認された。また、これらの接着用樹脂組成物は、異種基材間の接着性に優れることが確認された。 The adhesive resin compositions of Examples 1 to 9 are excellent in storage stability, and from these adhesive resin compositions, they are excellent in various coating film properties such as appearance, adhesiveness, heat resistance, and weather resistance. It was confirmed that a cured coating was obtained. Moreover, it was confirmed that these resin compositions for adhesion are excellent in the adhesiveness between dissimilar substrates.
比較例1及び2は、複合樹脂(A)中のポリシロキサン(a1)が、本発明の下限である75質量%より低い例であるが、得られる塗膜の耐熱性が不十分であり、異種基材間の接着性に劣ることが確認された。 Comparative Examples 1 and 2 are examples in which the polysiloxane (a1) in the composite resin (A) is lower than the lower limit of 75% by mass of the present invention, but the heat resistance of the resulting coated film is insufficient. It was confirmed that the adhesion between dissimilar substrates was poor.
比較例3は、重合体(a2)を含有しない例であるが、保存安定性が不十分であり、また、塗膜形成が不十分であることが確認された。 Although Comparative Example 3 is an example which does not contain a polymer (a2), it was confirmed that the storage stability is insufficient and that the coating film formation is insufficient.
比較例4は、ポリシロキサン(a1)中の構造単位(U1)が、本発明の下限である10質量%より少ない例であるが、保存安定性、塗膜外観、接着性、及び耐熱性が不十分であり、異種基材間の接着性に劣ることが確認された。 Comparative Example 4 is an example in which the structural unit (U1) in the polysiloxane (a1) is less than 10% by mass, which is the lower limit of the present invention, but storage stability, coating film appearance, adhesiveness, and heat resistance It was confirmed that the adhesion between the different substrates was poor.
比較例5は、ポリシロキサン(a1)中に構造単位(U2)を有しない例であるが、得られる塗膜の耐候性が不十分であることが確認された。 Although the comparative example 5 is an example which does not have a structural unit (U2) in polysiloxane (a1), it was confirmed that the weather resistance of the coating film obtained is inadequate.
比較例6は、ポリシロキサン溶液とビニル系重合体溶液をブレンドした例であるが、保存安定性、塗膜形成が不十分であり、異種基材間の接着性に劣ることが確認された。 Comparative Example 6 is an example in which a polysiloxane solution and a vinyl polymer solution were blended, but storage stability, film formation was insufficient, and it was confirmed that adhesion between different types of substrates was poor.
Claims (5)
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CN111187294A (en) * | 2020-01-06 | 2020-05-22 | 万华化学集团股份有限公司 | Epoxy group-containing unsaturated organosilicon compound, heat-resistant high-toughness peelable adhesive, and preparation method and application thereof |
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