JP2019110214A - Capacitor module - Google Patents

Abstract

To provide a capacitor module that maintains a function as the capacitor module and that can continue use even when any of ceramic capacitors may be broken.SOLUTION: A capacitor module comprises: an insulation substrate 11 on which a first metal evaporation pattern 21 and a second metal evaporation pattern 22 are formed; and a plurality of ceramic capacitors 12 in which one external electrode 34 is connected to the first metal evaporation pattern 21 and other external electrode 35 is connected to the second metal evaporation pattern 22, and the capacitor module comprises: parallel patterns 21a, 22a in which the first metal evaporation pattern 21 and the second metal evaporation pattern 22 are arranged in parallel to each other; a plurality of serial patterns 21b, 22b that respectively extend from the parallel patterns 21a, 22a; and a plurality of capacitor arrangement patterns 21c, 22c which extend from the serial pattern 21b, 22b and in which the external electrodes 34, 35 of the ceramic capacitor are arranged.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a capacitor module in which a ceramic capacitor is disposed on an insulating substrate.

  As this type of capacitor module, one having a plurality of ceramic capacitors and an insulating substrate, and in which the ceramic capacitors are conductively connected to lands formed on the insulating substrate is disclosed (see Patent Document 1). In this capacitor module, a plurality of ceramic capacitors are arranged in parallel on the lands of the insulating substrate.

JP 2002-232110 A

  However, in the capacitor module described in Patent Document 1, since the plurality of ceramic capacitors are arranged in parallel to the lands of the insulating substrate, the insulator separating the conductors in any of the ceramic capacitors is broken, There is a problem if the insulation can not be maintained. When the so-called dielectric breakdown mode of this ceramic capacitor is a short circuit that shorts between the conductors, the entire capacitor module is shorted, and the entire capacity of the capacitor module is lost. As a result, there is a problem that the use of the capacitor module can not be continued.

  The present invention was made to solve such a problem, and provides a capacitor module that can maintain its function as a capacitor module and can be used even if any ceramic capacitor is destroyed. As an issue.

  In the capacitor module according to the present invention, an insulating substrate on which a first metal deposition pattern and a second metal deposition pattern are formed, and one electrode connected to the first metal deposition pattern, the second metal And a parallel pattern in which the first metal vapor deposition pattern and the second metal vapor deposition pattern are disposed in parallel with each other, and a plurality of ceramic capacitors in which the other electrode is connected to the vapor deposition pattern, and A plurality of series patterns extending respectively, and a plurality of capacitor arrangement patterns extending from the series pattern and in which the electrodes of the ceramic capacitor are arranged are characterized.

  In the capacitor module according to the present invention, the plurality of ceramic capacitors includes the parallel pattern of the first metal vapor deposition pattern and the second metal vapor deposition pattern, the plurality of serial patterns respectively extending from the parallel pattern, and the plurality of ceramic capacitors extending from the serial pattern Connected to the capacitor arrangement pattern of These ceramic capacitors are electrically connected in parallel with one another. Then, when any of the ceramic capacitors is broken and a short circuit occurs, a part of the capacitor arrangement pattern connecting the broken ceramic capacitors is evaporated and the electrical connection is cut off. With this configuration, even if one of the ceramic capacitors is broken and a short circuit occurs, only the broken ceramic capacitor does not function, and the other ceramic capacitors maintain the function. As a result, the use of the capacitor module is continued.

  According to the present invention, it is possible to provide a capacitor module which can maintain its function as a capacitor module even if any ceramic capacitor is broken and can be used continuously.

FIG. 1 is a perspective view of a capacitor module according to an embodiment of the present invention. The perspective view of the insulating substrate which constitutes the capacitor module concerning the embodiment of the present invention. It is a figure of the ceramic capacitor which comprises the capacitor | condenser module which concerns on embodiment of this invention, FIG. 3 (a) shows the perspective view of a ceramic capacitor, FIG.3 (b) shows sectional drawing of a ceramic capacitor. It is a perspective view of a capacitor module concerning an embodiment of the present invention, and shows the state where a part of ceramic capacitors broke short. Explanatory drawing explaining the physique of the capacitor | condenser module which concerns on embodiment of this invention.

  A capacitor module 10 according to an embodiment to which a capacitor module according to the present invention is applied will be described with reference to the drawings.

  As shown in FIG. 1, the capacitor module 10 according to the embodiment is configured of an insulating substrate 11 and nine ceramic capacitors 12.

  As shown in FIG. 2, the insulating substrate 11 is formed into a flat plate having a length L1 (mm), a width L2 (mm) and a thickness t (mm), and has good electrical insulation and thermal conductivity. The substrate is, for example, a ceramic substrate such as aluminum nitride (AlN) or a substrate such as a glass epoxy substrate impregnated with an epoxy resin (EP) on which a cloth of glass fibers is stacked. The materials of L1, L2, and t and the substrate are appropriately selected based on the data such as the configuration and size of the capacitor module 10, the setting conditions of the arrangement of the ceramic capacitor 12, and the experimental values.

  The insulating substrate 11 has a top surface 11 a on which a first metal vapor deposition pattern 21 and a second metal vapor deposition pattern 22 are formed. The first metal vapor deposition pattern 21 includes a parallel pattern 21 a disposed in parallel to the second metal vapor deposition pattern 22, three serial patterns 21 b extending from the parallel pattern 21 a, and the respective serial patterns 21 b. It has nine capacitor arrangement patterns 21 c on which an external electrode 34 described later of the capacitor 12 is arranged.

  The first metal vapor deposition pattern 21 is formed of a vapor deposition thin film formed by vacuum vapor deposition in which the vapor deposition material which has become gas molecules by heating, vaporizing and subliming the vapor deposition material in high vacuum is made to collide and adhere to the insulating substrate 11. The deposition material is made of a metal material having good withstand voltage characteristics such as aluminum (Al) or zinc (Zn).

  Specifically, the first metal vapor deposition pattern 21 is formed to have a width of about 0.3 mm, and has a surface resistivity that is an amount that represents the electrical resistance of a thin film or a film-like substance having a uniform thickness, so-called sheet resistance (Ω) is formed at about 10 Ω. The thickness and the sheet resistance are set such that a part of the first metal vapor deposition pattern 21 is evaporated by the inflow current (A) which flows when the ceramic capacitor 12 is short-circuited due to a short circuit failure.

  The second metal vapor deposition pattern 22 includes a parallel pattern 22a disposed in parallel with the first metal vapor deposition pattern 21, three serial patterns 22b extending respectively from the parallel pattern 22a, and a ceramic which extends from each serial pattern 22b. The capacitor 12 has nine capacitor layout patterns 22c on which an external electrode 35 described later of the capacitor 12 is disposed. The second metal vapor deposition pattern 22 is also made of a vapor deposition thin film similar to the first metal vapor deposition pattern 21, and is formed with the same thickness and sheet resistance as the first metal vapor deposition pattern 21.

  In the capacitor module 10, as shown in FIG. 1, the external electrodes 34 of nine ceramic capacitors 12 are connected to nine capacitor layout patterns 21 c of the first metal deposition pattern 21, and the second metal deposition pattern 22 is obtained. The external electrodes 35 of the nine ceramic capacitors 12 are connected to the nine capacitor layout patterns 22c.

  Therefore, the nine ceramic capacitors 12 are all electrically connected in parallel between the first metal deposition pattern 21 and the second metal deposition pattern 22. With this configuration, even if any of the ceramic capacitors 12 is short-circuited due to a short circuit, the capacitor arrangement pattern 21c of the first metal deposition pattern 21 or the capacitor arrangement pattern 22c of the second metal deposition pattern 22 evaporates, The functions of the other ceramic capacitors 12 are not lost, and the use as the capacitor module 10 is continued.

As shown in FIGS. 3A and 3B, the ceramic capacitor 12 is composed of a plurality of ceramic dielectrics 31, a plurality of internal electrodes 32, 33, and an external electrode 34, 35. The plurality of ceramic dielectrics 31 and the plurality of internal electrodes 32, 33 are alternately stacked. The ceramic dielectric 31 is constituted by a high dielectric constant system using a material having a high dielectric constant such as barium titanate (BaTiO ₃ : BTO). Each internal electrode 32 is connected to the external electrode 34, and each internal electrode 33 is connected to the external electrode 35.

  The external electrode 34 is formed of a highly conductive metal material such as copper (Cu), and the surface thereof is plated with nickel (Ni), tin (Sn) or the like. The external electrode 34 is configured to be electrically connected to the capacitor disposition pattern 21 c in the first metal vapor deposition pattern 21 by bonding means such as soldering. The external electrode 35 is also formed in the same manner as the external electrode 34, and is configured to be electrically connected to the capacitor disposition pattern 22c in the second metal vapor deposition pattern 22 by bonding means such as soldering.

  Specifically, the ceramic capacitor 12 has a withstand voltage of 600 V or more so as to secure a necessary minimum withstand voltage (V). Further, the preferable capacitance (μF) is configured to be 0.5 μF or less. The capacitance of each ceramic capacitor 12 is set such that the capacitance is within the range of allowable variation in capacity even if the ceramic capacitor 12 of a part of the capacitor module 10 is broken down.

  Hereinafter, the effects of the capacitor module 10 according to the present embodiment will be described.

  In the capacitor module 10 according to the present embodiment, the first metal vapor deposition pattern 21 and the second metal vapor deposition pattern 22 formed on the insulating substrate 11 are parallel patterns 21 a and 22 a arranged in parallel with each other, and a plurality of series. It has patterns 21 b and 22 b and a plurality of capacitor layout patterns 21 c and 22 c on which the external electrodes 34 and 35 of the ceramic capacitor are disposed. Therefore, the nine ceramic capacitors 12 of the embodiment are all electrically connected in parallel between the first metal vapor deposition pattern 21 and the second metal vapor deposition pattern 22.

  With this configuration, even if any of the ceramic capacitors 12 is short-circuited due to a short circuit breakdown, the capacitor layout pattern 21c of the first metal deposition pattern 21 connected to the shorted ceramic capacitor 12 or the second metal deposition pattern 22 By evaporating the capacitor arrangement pattern 22c, the function of the other ceramic capacitors 12 is not lost, and the effect that the use as the capacitor module 10 can be continued can be obtained.

  A plurality of ceramic capacitors are electrically connected in series to the arrangement of the ceramic capacitors 12 in the capacitor module 10 according to the present embodiment, and when any of the ceramic capacitors is shorted, a short circuit occurs in the entire capacitor module. It can be configured not to. However, when a plurality of ceramic capacitors are connected in series, the number of elements required for securing the capacitance is significantly increased, and the size of the capacitor module is increased.

  The capacitor module 10 according to the present embodiment solves the conventional problems by forming the parallel patterns 21a and 22a, the plurality of series patterns 21b and 22b, and the plurality of capacitor arrangement patterns 21c and 22c on the insulating substrate 11. Even if the number of ceramic capacitors is increased, it is possible to obtain the effect that the heat resistance is high and the size of the capacitor module can be reduced.

  Specifically, as shown in FIG. 5, the size of the capacitor can be made significantly smaller than that of capacitors of other structures. FIG. 5 shows the capacitance (μF) of the capacitor module in the upper row, and the configuration of the capacitor module in the left column.

Comparison with current film capacitors
The capacitor module 10 configured with the ceramic capacitor 12 of the embodiment is 56% smaller at 50 μF, 46% smaller at 100 μF, and 26% smaller at 500 μF than the capacitor module configured with the current film capacitor. , Reduced by 20% at 1000 μF. The current film capacitor to be compared has a dielectric film made of polypropylene (PP), a dielectric constant ε of 2.2, a film thickness of 2.3 μm, and an exterior for moisture resistance around the capacitor element. It is coated with a thickness of 5 mm.

  In the capacitor module 10 according to the embodiment, as described above, the first metal vapor deposition pattern 21 and the second metal vapor deposition pattern 22 are made of aluminum (Al), and the width of the aluminum pattern in the vicinity of the ceramic capacitor 12 is , 0.3 mm, and the sheet resistance is 10 Ω.

Comparison with heat-resistant film capacitors
The capacitor module 10 according to the embodiment is significantly smaller in size than the capacitor module configured of the heat-resistant film capacitor with the sizes 50 μF, 100 μF, 500 μF, and 1000 μF, respectively. In the heat-resistant film capacitor, the dielectric film is made of polyphenylene sulfide (PPS), the dielectric constant ε is 3.0, the film thickness is 3.0 μm, and the exterior for moisture resistance is 5 mm around the capacitor element. It is covered with a thickness.

<Comparison with ceramic capacitors>
The capacitor module 10 according to the embodiment is significantly smaller in size than the capacitor module formed of a ceramic capacitor with 50 μF, 100 μF, 500 μF, and 1000 μF, respectively.

  The ceramic capacitor has a size of 5750 according to the JIS standard, and is a cube of 6.0 mm × 5.0 mm × 5.0 mm. The ceramic capacitor has a withstand voltage (V) of 630 V, an electrostatic capacity (μF) of 0.3 μF when using a load, and a high dielectric ceramic capacitor, and two series arrangement and necessary number of parallel arrangement Is being done.

  As mentioned above, although the embodiment of the present invention was explained in full detail, the present invention is not limited to the above-mentioned embodiment, and various designs are possible in the range which does not deviate from the spirit of the present invention described in the claim. It is possible to make changes.

DESCRIPTION OF SYMBOLS 10 ... Capacitor module, 11 ... Insulating substrate, 11a ... Upper surface, 12 ... Ceramic capacitor, 21 ... 1st metal vapor deposition pattern, 21a, 22a ... Parallel pattern, 21b, 22b ... Series pattern, 21c, 22c ... Capacitor arrangement pattern, 22 ... Second metal deposition pattern, 31 ... Ceramic dielectric, 32, 33 ... Internal electrode, 34, 35 ... External electrode

Claims (1)

An insulating substrate on which a first metal deposition pattern and a second metal deposition pattern are formed;
A plurality of ceramic capacitors having one electrode connected to the first metal vapor deposition pattern and the other electrode connected to the second metal vapor deposition pattern;
The first metal vapor deposition pattern and the second metal vapor deposition pattern are parallel patterns arranged in parallel with each other, a plurality of series patterns extending respectively from the parallel patterns, and extending from the series patterns and the ceramic capacitor And a plurality of capacitor arrangement patterns in which the electrodes are arranged.

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