JP2019109014A - Heat treatment device - Google Patents

Abstract

To provide a heat treatment device capable of efficiently recovering impurities included in a workpiece.SOLUTION: Provided is a heat treatment device where a workpiece is heated and fired, comprising: a heating chamber; a relay chamber; a cooling chamber; a valve body; a heater for the heating chamber; a heater for the relay chamber; a vacuum pump; and a control part. The cooling chamber is provided with an impurity recovery plate and a cooling plate, and the control part practices: a first heating step of, in a state where a workpiece is arranged at the heating chamber and the valve body is arranged at an opening position, driving the heater for the heating chamber and the heater for the relay chamber and heating the heating chamber and the relay chamber, thus vaporizing impurities included in the workpiece so as to be fed to the cooling chamber via the relay chamber; and a second heating step of, after the first heating step, in a state where the valve body is arranged at a closed position, at least driving the heater for the heating chamber and heating the heating chamber, thus heating and firing the workpiece in the heating chamber.SELECTED DRAWING: Figure 1

Description

  The present disclosure relates to a heat treatment apparatus that heats and bakes a workpiece.

  Conventionally, a heat treatment apparatus is known which heats and bakes a work such as powder (see, for example, Patent Document 1).

  A metal component is mixed as an impurity into the powdery workpiece. It is desirable to remove such impurities before firing the work. In order to remove impurities, for example, there is an apparatus which heats the workpiece before firing to vaporize the metal component and leads it to a cooling device, and then solidifies and recovers (see, for example, Patent Documents 2 and 3). Among such apparatuses, there is one which guides a gas containing a vaporized impurity to a vacuum exhaust system of a vacuum heat treatment apparatus and recovers it (see, for example, Patent Document 4). In addition, when the impurity is a reusable metal component, it is preferable that the recovery efficiency be high.

JP, 2013-015249, A JP, 2010-180461, A JP, 2013-127456, A JP 10-43708 A

  However, since there is a temperature gradient in the flow path in which the vaporized impurities flow toward the cooling device, the impurities may be deposited and attached at a low temperature part in the middle of the flow path before reaching the cooling device. Such impurities need to be removed manually, resulting in poor recovery efficiency. Thus, it can be said that there is still room for improvement in efficiently recovering the impurities contained in the work.

  This indication solves the above-mentioned subject, and it aims at providing a heat treatment apparatus which can collect efficiently the impurities contained in work.

  The heat treatment apparatus according to one aspect of the present disclosure is a heat treatment apparatus that heats and bakes a workpiece, and includes a heating chamber for heating the workpiece, a relay chamber connected to the heating chamber and extending downward, and a lower portion of the relay chamber. A heating chamber for heating the heating chamber, a cooling chamber connected to the side, an open position for opening the opening at the connection point between the heating chamber and the relay chamber, a valve body movable between closed positions for closing the opening; A relay for heating the relay chamber, a vacuum pump connected to the cooling chamber, and a control unit for controlling the operation of the heat treatment apparatus; An impurity recovery plate whose upper surface is directed to face the lower side end of the chamber, and a cooling plate having a cooling function in contact with the lower surface of the impurity recovery plate are provided, and the control unit Place the work in the room In the state where the valve element is disposed at the open position, the heater contained in the heating chamber and the heater disposed in the relay chamber are operated to heat the heating chamber and the relay chamber, whereby the impurities contained in the workpiece are removed. After the first heating step of vaporizing and sending to the cooling chamber through the relay chamber, and the first heating step, at least the heater for the heating chamber is placed in a state where the valve body is disposed at the closed position. By operating and heating the heating chamber, control is performed to execute a second heating step of heating and baking the work in the heating chamber.

  According to the above configuration, the impurities vaporized in the first heating step can be deposited on the upper surface of the impurity recovery plate cooled by the cooling plate. Thereby, the impurities can be efficiently recovered while performing the operation of firing the work.

  In the heat treatment apparatus, the cooling plate can move up and down between a contact position contacting the lower surface of the impurity recovery plate and a retracted position retracted from the lower surface, and the control unit performs the first heating step. The cooling plate may be disposed at the contact position, and in the second heating step, the cooling plate may be disposed at the retracted position. Thereby, the impurities can be recovered more efficiently.

  In the heat treatment apparatus, the lower end portion of the relay chamber is a cylindrical tubular portion which protrudes downward toward the impurity recovery plate of the cooling chamber, and the upper surface of the impurity recovery plate An auxiliary plate may be provided to surround the outer periphery of the cylindrical portion at an interval from the outside. Thereby, the vaporized impurities can be easily deposited on the upper surface of the impurity recovery plate and the periphery thereof, and the impurities can be recovered more efficiently.

  In the heat treatment apparatus, the relay chamber is connected to a side of the heating chamber, and forms a first space provided with the valve body and a second space extending downward from the first space. The relay room heater includes a first heater for heating the first space, and a second heater for heating the second space, and the second heater is of the relay room. A section not provided with a heater may be provided above the end face of the lower end and between the second heater and the lower end of the relay chamber. Thus, by providing the heaters in each of the first space and the second space, the vaporized state of the impurities can be maintained for a long time, and the impurities can be recovered more efficiently. On the other hand, by providing a section not equipped with a heater between the second heater and the lower end of the relay chamber, the temperature of the impurity recovery plate is reduced by the radiant heat of the second heater, and the impurity is recovered. The ability to capture impurities by the plate can be maintained.

  In the heat treatment apparatus, the impurity recovery plate may be detachably provided in the cooling chamber. Thus, by removing the impurity recovery plate, the impurities attached to the impurity recovery plate can be easily removed.

  The heat treatment apparatus further includes a vacuum pump connected to the cooling chamber, and a valve for opening and closing a connection flow path connecting the vacuum pump to the cooling chamber, and the control unit controls the first heating step. The valve may be opened and controlled to close in the second heating step. Thus, by performing the first heating step under reduced pressure or vacuum, the impurities contained in the workpiece can be vaporized at a lower temperature, and the usage of the heater can be suppressed to a low level.

  In the heat treatment apparatus, the shape of the opening and the shape of the surface of the valve closing the opening may be circular, and the flow passage cross section of the relay chamber connected to the opening may be rectangular. As a result, the path through which the vaporized impurities pass can be increased, and thus, the impurities can be easily induced to the impurity recovery plate.

  According to the heat treatment apparatus of the present disclosure, the impurities contained in the work can be efficiently recovered.

Longitudinal sectional view showing a schematic configuration of a heat treatment apparatus according to an embodiment Schematic view from the XX direction of FIG. 1 Schematic view of the valve body and the opening viewed from the oblique direction Enlarged view of the cooling chamber equipped with the impurity recovery mechanism Flow chart showing the heat treatment method of the embodiment Schematic longitudinal cross-sectional view for demonstrating the heat processing method of embodiment Schematic longitudinal cross-sectional view for demonstrating the heat processing method of embodiment Schematic longitudinal cross-sectional view for demonstrating the heat processing method of embodiment Schematic longitudinal cross-sectional view for demonstrating the heat processing method of embodiment

  Hereinafter, preferred embodiments of a heat treatment apparatus and a heat treatment method using the same according to the present disclosure will be described with reference to the attached drawings. The present disclosure is not limited to the specific configurations of the following embodiments, and configurations based on similar technical ideas are included in the present disclosure.

(Embodiment)
FIG. 1 is a longitudinal sectional view showing a schematic configuration of a heat treatment apparatus 2 in the embodiment.

  The heat processing apparatus 2 shown in FIG. 1 is an apparatus which heats and bakes the workpiece | work P which is a to-be-processed object. The workpiece P is, for example, a powder such as graphite, but is not limited thereto.

  The heat treatment apparatus 2 shown in FIG. 1 includes a first furnace body 4, a door 6, a second furnace body 8, and a control unit 9.

  The first furnace body 4 is a furnace body in which the heating chamber 10 and the relay chamber 12 are formed in the inner space thereof.

  The heating chamber 10 is a space for heating and baking the workpiece P, which is an object to be treated. A door 6 is attached to the inlet portion of the heating chamber 10. By opening and closing the door 6, the work P can be carried into and out of the heating chamber 10, and the heating chamber 10 can be sealed.

  As shown in FIG. 1, a heater 14 for the heating chamber is built in a wall around the heating chamber 10. The heating chamber heater 14 can heat the temperature of the heating chamber 10 to, for example, about 2400 degrees.

  As described later, in the heating chamber 10, two-step heat treatment is performed, which is a first heating step and a second heating step.

  According to the heat treatment apparatus 2 of the present embodiment, in the first heating step, the workpiece P in the heating chamber 10 is heated to a first heating temperature (for example, 1200 ° C.), whereby an impurity (for example, Vaporize metal components). The vaporized impurities are sent to the cooling chamber 24 in the second furnace body 8 through the relay chamber 12 by the suction force of the vacuum pump 36 described later. In the second heating step performed after the first heating step, the work P is fired by heating to a second heating temperature (for example, 2400 degrees) higher than the first heating temperature. Thereby, a work P having desired physical properties is generated.

  The relay chamber 12 is a portion connected to the downstream side of the heating chamber 10. The relay chamber 12 is connected to the second furnace body 8.

  In the relay chamber 12, a first space 12A and a second space 12B are formed in this order from the upstream side. The first space 12A is a space extending laterally from the heating chamber 10. The second space 12B is a space extending downward from the first space 12A. In FIG. 1, the area of the second space 12B is shown divided by a dotted line.

  A relay chamber heater 16 is built in a wall around the relay chamber 12. The relay chamber heater 16 can heat the temperature of the relay chamber 12 to, for example, about 1200 degrees.

  The relay chamber heater 16 includes a first heater 16A and a second heater 16B. The first heater 16A is a heater for heating the first space 12A, and the second heater 16B is a heater for heating the second space 12B. The second heater 16 </ b> B does not reach the end surface 15 of the lower end 13 of the relay chamber 12 and is disposed above the end surface 15.

  A valve body 18 is provided in the first space 12A of the relay chamber 12. The valve body 18 is a member which opens and closes the opening 20 which is a connection place of the heating chamber 10 and the relay chamber 12. The valve body 18 is connected to the cylinder 22 via the drive shaft 21. The valve body 18 is provided slidably in the horizontal direction by the drive of the cylinder 22 and is movable between an open position where the opening 20 is opened and a closed position where the opening 20 is closed. In FIG. 1, the state in which the valve body 18 is in the open position is shown by a solid line, and the state in which it is in the closed position is shown by a two-dot chain line.

  The relationship between the valve body 18 and the opening 20 will be described with reference to FIGS. 2A and 2B. FIG. 2A is a schematic view seen from the XX direction in FIG. 1, and FIG. 2B is a schematic view seeing the valve 18 and the opening 20 from an oblique direction. As shown to FIG. 2A and FIG. 2B, the flow-path cross section A in the circumference | surroundings of the opening 20 is comprised by the rectangular shape. On the other hand, the surface shape (outer cross section) of the valve body 18 which closes the opening 20 is circular. According to such a configuration, the flow passage area of the impurity in the vaporized state which enters the relay chamber 12 from the heating chamber 10 through the opening 20 can be widened, and the impurity collection efficiency is improved.

  Returning to FIG. 1, the second furnace body 8 is a furnace body connected to the lower side of the first furnace body 4. The second furnace body 8 forms a cooling chamber 24 in its internal space. The cooling chamber 24 is a space for cooling the vaporized impurities sent from the first furnace body 4.

  An impurity recovery mechanism 26 is provided in the cooling chamber 24 as a configuration for cooling and recovering the vaporized impurities. The impurity recovery mechanism 26 includes an impurity recovery plate 28, a cooling plate 30, an auxiliary plate 32, and a sealing furnace body 34.

  The configuration of the impurity recovery mechanism 26 will be described with reference to FIG. FIG. 3 is an enlarged view of the cooling chamber 24 in which the impurity recovery mechanism 26 is provided.

  The impurity recovery plate 28 is a plate that cools, solidifies and recovers the vaporized impurities flowing from the second space 12B. The impurity recovery plate 28 has an upper surface 28A and a lower surface 28B. The upper surface 28 </ b> A is disposed facing upward so as to face the lower end 13 of the relay chamber 12. The lower surface 28 B is disposed facing downward so as to face the cooling plate 30 provided below the impurity recovery plate 28.

  The cooling plate 30 is a plate for contacting the impurity recovery plate 28 to cool the impurity recovery plate 28. The cooling plate 30 has a cooling function of cooling the impurity recovery plate 28, and is constituted of, for example, a plate provided with a water pipe 42 through which cooling water passes. The cooling plate 30 is supported by a liftable support column 41, and can be moved up and down by a drive source (not shown). The cooling plate 30 is in contact with the impurity recovery plate 28 to cool the impurity recovery plate 28 (cooling position), and a noncontact position where it is retracted downward from the impurity recovery plate 28 and is not in contact with the impurity recovery plate 28 Position) can be moved up and down. In FIG. 1, the state in which the cooling plate 30 is in the contact position is indicated by a solid line, and the state in which the cooling plate 30 is in a non-contact position is indicated by a two-dot chain line.

  The auxiliary plate 32 is a plate erected on the upper surface 28 A of the impurity recovery plate 28. The auxiliary plate 32 is a cylindrical plate surrounding the outer periphery of the downstream end 13 of the relay chamber 12 described above at an interval from the outside. The height position of the upper end 35 of the auxiliary plate 32 is set higher than the height position of the end surface 15 of the lower end 13 of the relay chamber 12. With such height setting, the flow passage area in the vicinity of the impurity recovery plate 28 can be reduced, and the vaporized impurity contacts the cooling surface (lower end portion 13, impurity recovery plate 28, auxiliary plate 32) Increase the probability of As a result, the impurities are easily deposited on the cooling surface, and the recovery efficiency is improved.

  The sealing furnace body 34 is a furnace body for sealing the cooling chamber 24 in which the impurity recovery plate 28, the cooling plate 30, the auxiliary plate 32, and the like are installed. The sealing furnace body 34 is connected to the lower side of the second furnace body 8 to seal the cooling chamber 24.

  The impurity recovery mechanism 26 including the impurity recovery plate 28 described above is configured to be removable from the second furnace body 8. Specifically, the sealing furnace body 34 can be connected and attached to the second furnace body 8 together with the impurity recovery plate 28 and the like, and separated by the flange portion 44 and integrally moved them downward. Thus, the second furnace body 8 can be removed. By removing the impurity recovery mechanism 26 from the second furnace body 8, the impurities D attached to the impurity recovery plate 28 and the auxiliary plate 32 can be removed from the heat treatment apparatus 2 and recovered. A detailed method of recovering the impurity D using the impurity recovery mechanism 26 will be described later.

  A vacuum pump 36 is connected to the second furnace body 8. The vacuum pump 36 is a pump for reducing the internal space of the second furnace body 8 and the first furnace body 4 to a reduced pressure state or a vacuum state. The vacuum pump 36 generates a flow for guiding the gas in the heating chamber 10 containing the impurities vaporized from the work P to the cooling chamber 24 by the suction force. The vacuum pump 36 and the second furnace body 8 are connected by the connection flow path 38. A valve 40 is provided in the middle of the connection flow path 38. The valve 40 is a valve for opening and closing the connection flow path 38. By opening and closing the valve 40, it is possible to adjust the pressure condition, the suction force, and the pressure reduction time of the internal space of the first furnace body 4 and the second furnace body 8.

  The control unit 9 shown in FIG. 1 is a member that controls the operation of the heat treatment apparatus 2. The control part 9 is electrically connected to each component of the heat processing apparatus 2 mentioned above, and can control operation of each component. The control unit 9 is configured by, for example, a microcomputer.

  An example of the flow of the heat treatment when the heat treatment apparatus 2 configured as described above is operated will be described using FIGS. 4 and 5A to 5D. FIG. 4 is a flowchart showing the heat treatment method of the embodiment, and FIGS. 5A to 5D are schematic longitudinal sectional views for explaining the heat treatment method of the embodiment.

  As shown in FIG. 4, first, a first heating step is performed (step S1). The first heating step is a step in which the control unit 9 controls the respective constituent members of the heat treatment apparatus 2 to vaporize impurities such as metal components contained in the workpiece P as the object to be treated and remove them from the workpiece P (Impurity removal step).

  Specifically, as shown in FIG. 5A, a workpiece P at normal temperature is disposed in the heating chamber 10. In this state, the valve body 18 is moved to the open position where the opening 20 is opened, and the heating chamber 10 and the relay chamber 12 are communicated. Further, the cooling plate 30 of the impurity recovery mechanism 26 is moved to the contact position where the lower surface 28 B of the impurity recovery plate 28 is in contact. As a result, the temperature of the impurity recovery plate 28 is lowered to provide a cooled state in which the impurities are easily captured. Further, by opening the valve 40, the heating chamber 10 and the relay chamber 12 are brought into a reduced pressure state close to a vacuum state. In such a state, the heating chamber heater 14 and the relay chamber heater 16 are operated to raise the temperatures of the relay chamber 10 and the relay chamber 12 to a preset first heating temperature (for example, 1200 degrees) for heating Do.

  By heating the workpiece P in the heating chamber 10 to the first heating temperature, the impurities mixed in the workpiece P are vaporized (not shown). Since the heating chamber 10 is in a reduced pressure state close to a vacuum state, the evaporation temperature at which the impurities are vaporized is lower than in the case of normal pressure. Therefore, the impurities can be vaporized at a lower temperature, and the amount of use of the heater 14 for the heating chamber can be reduced.

  The vaporized impurities pass through the opening 20 and enter the relay chamber 12. Since the relay chamber 12 is also heated by the relay chamber heater 16, the temperature of the vaporized impurity can be maintained at or above a predetermined temperature, and the vaporized state can be maintained.

  The vaporized impurities then enter the second space 12B from the first space 12A. The vaporized impurities entering the second space 12 B further travel downward toward the cooling chamber 24.

  The impurity recovery plate 28 provided at a position facing the lower end 13 of the relay chamber 12 is in a state of being cooled by the cooling plate 30, and its temperature is low (for example, 700 degrees). Impurities in the vaporized state flowing downward from the relay chamber 12 contact the upper surface 28A of the impurity recovery plate 28 and are cooled. Thereby, it precipitates as liquid or solid impurity D1. By depositing on the upper surface 28A of the impurity recovery plate 28, the impurity D1 can be recovered later.

  Here, since the temperature of the impurity recovery plate 28 is low, the temperature around the impurity recovery plate 28 is also low. In the configuration shown in FIG. 5A, the lower end 13 (section A without the heater) of the relay chamber 12 and the auxiliary plate 32 are present in the vicinity of the impurity collection plate 28, and the temperature is particularly low. As shown in FIG. 5A, the impurity D2 is deposited also on the wall surface of the lower end 13 of the relay chamber 12. Such an impurity D2 adheres to the inner wall of the first furnace body 4 and can not be detached and removed like the impurity recovery mechanism 26. Therefore, it may take time, for example, a worker manually removes the heat treatment apparatus 2 while the operation of the heat treatment apparatus 2 is stopped.

  Next, the control unit 9 of the heat treatment apparatus 2 performs a second heating step (step S2). The second heating step is a step of firing the work P by further heating the work P heated in the first heating step by the control unit 9 controlling each component of the heat treatment apparatus 2 (baking (baking Step).

  Specifically, as shown in FIG. 5B, the valve 18 in the open position is moved to the closed position in which the opening 20 is closed. Thus, the heating chamber 10 is sealed from the relay chamber 12. Further, the cooling plate 30 of the impurity recovery mechanism 26 is lowered from the contact position to the retracted position. As a result, the temperature of the impurity recovery plate 28 is raised without cooling the impurity recovery plate 28 by the cooling plate 30. Furthermore, the valve 40 is closed, and the atmospheric on-off valve and the gas introduction valve (both not shown) provided in the relay chamber 12 are opened to bring the relay chamber 12 into an atmospheric pressure state. In such a state, the heater 14 for the heating chamber and the heater 16 for the relay chamber are operated, and the temperatures of the heating chamber 10 and the relay chamber 12 are increased to a second heating temperature (for example, 2400 degrees) higher than the first heating temperature. Raise it.

  The work P in the heating chamber 10 can be fired by raising the heating chamber 10 to the second heating temperature. The fired workpiece P is then taken out of the heat treatment apparatus 2 with the door 6 opened.

  In the cooling chamber 24, since the cooling plate 30 is retracted and the impurity recovery plate 28 is not cooled, the temperature of the lower end 13 of the relay chamber 12 near the impurity recovery plate 28 is increased. Thus, the temperature of the impurity D2 attached to the lower end 13 is increased. The impurity D2 is liquid or solid, but melts when the temperature of the impurity D2 rises and becomes equal to or higher than the melting point. As a result, most of the impurities D2 become liquid and flowability increases, and therefore they fall downward by gravity as shown in FIG. 5B. The dropped impurities D2 are received by the impurity recovery plate 28 and mixed with the impurities D1 already captured in the impurity recovery plate 28. At this time, it is preferable to adjust the distance for separating the cooling plate 30 from the impurity collection plate 28 and the output of the relay chamber heater 16 so that the temperature of the cooling surface does not evaporate the impurity D again.

  If the second heating step is continuously performed, as shown in FIG. 5C, most of the impurity D2 can be removed from the lower end 13 of the relay chamber 12 and the impurity recovery plate 28 can be supplemented as the impurity D3.

  Next, a recovery step is performed (step S3). Specifically, as shown in FIG. 5D, the flange portion 44 is separated, and the detachably attached impurity recovery mechanism 26 is removed from the second furnace body 8. Thus, the impurity recovery mechanism 26 can be placed outside the heat treatment apparatus 2 to recover the impurity D3 captured by the impurity recovery plate 28. The impurity recovery plate 28 is supported from below by a support (not shown) provided on the sealing furnace body 34.

  As described above, the heat treatment apparatus 2 of the present embodiment performs the first heating step, which is an impurity removing step, and the second heating step, which is a baking step. In the first heating step, by bringing the cooling plate 30 into contact with the impurity recovery plate 28, the temperature of the impurity recovery plate 28 and the periphery thereof is lowered. Thereby, the vaporized impurities can be deposited on the upper surface 28A of the impurity recovery plate 28 and the periphery thereof. Furthermore, in the second heating step, the cooling plate 30 is retracted from the impurity recovery plate 28 to raise the temperature of the impurity recovery plate 28 and the periphery thereof. Thereby, the impurities attached to the portion other than the impurity recovery plate 28 can be dissolved. In particular, the impurity D2 attached to the wall surface of the lower side end 13 of the relay chamber 12 can be dissolved and dropped downward, and can be recovered to the impurity recovery plate 28. Thus, the impurity D3 can be efficiently recovered.

  Further, in the present embodiment, the auxiliary plate 32 surrounding the outer periphery of the lower end 13 of the relay chamber 12 at an interval from the outer side is provided on the upper surface 28A of the impurity recovery plate 28. By providing such an auxiliary plate 32, it is possible to form a narrow path through which the vaporized impurity passes between the auxiliary plate 32 and the lower end 13 of the relay chamber 12. As a result, the impurities are easily deposited on the auxiliary plate 32 and the lower end 13 of the relay chamber 12. The impurity D2 attached to the lower end 13 of the relay chamber 12 and the periphery thereof can be dissolved in the second heating step and collected on the impurity collection plate 28. Thus, the impurity D3 can be efficiently recovered.

  Further, in the present embodiment, the relay chamber heater 16 includes the first heater 16A and the second heater 16B, and the second heater 16B is closer to the end surface 15 of the lower end 13 of the relay chamber 12 It is located at the top. Thus, by providing the first heater 16A and the second heater 16B and arranging the heaters in the entire relay chamber 12, the entire relay chamber 12 can be uniformly heated, and the vaporized state of the impurities is maintained. can do. Also, the first space 12A and the second space 12B can be controlled to different temperatures. Further, by arranging the second heater 16B above the end surface 15 of the lower end 13 of the relay chamber 12, the temperature of the lower end 13 close to the cooling chamber 24 and easily cooled is the first heating step. Can be prevented from becoming excessively high, and it becomes easy to precipitate impurities. The deposited impurities D2 can be dissolved in the second heating step and recovered by the impurity recovery plate 28.

  Further, in the present embodiment, the impurity recovery plate 28 is detachably provided in the cooling chamber 24. Thus, by removing the impurity recovery plate 28, the impurity D3 attached to the impurity recovery plate 28 can be removed to the outside of the heat treatment apparatus 2. Therefore, the impurity D3 can be efficiently recovered.

  In the present embodiment, the valve 40 is controlled to be opened in the first heating step and to be closed in the second heating step. Thus, by performing the first heating step under reduced pressure or vacuum, the impurities contained in the workpiece P can be vaporized at a lower temperature. Therefore, the amount of use of the heating chamber heater 14 can be reduced.

  Further, in the present embodiment, the shape of the opening 20 which is the connection point between the heating chamber 10 and the relay chamber 12 and the shape of the surface of the valve 18 closing the opening 20 are circular, and the flow of the relay chamber 12 connected to the opening 20 is The road cross section A is rectangular. According to such a configuration, the path through which the gas in the heating chamber 10 is introduced to the vacuum pump 36 can be enlarged. Thus, in the first heating step, many impurities can be introduced to the cooling surface, and the impurity collection efficiency is improved. Further, the gas in the heating chamber 10 can be smoothly exhausted by the vacuum pump 36, the inside of the heating chamber 10 can be easily depressurized, and the impurities can be vaporized at a lower temperature.

  While the present disclosure has been fully described in connection with the preferred embodiments with reference to the accompanying drawings, various changes and modifications will be apparent to those skilled in the art. Such variations and modifications are to be understood as included within the scope of the present disclosure as set forth in the appended claims unless they depart therefrom. In addition, changes in the combination or order of elements in each embodiment can be realized without departing from the scope and spirit of the present disclosure.

  The present disclosure is applicable to any heat treatment apparatus that heats and bakes a workpiece.

DESCRIPTION OF SYMBOLS 2 Heat processing apparatus 4 1st furnace body 6 door 8 2nd furnace body 9 control part 10 heating chamber 12 relay chamber 12A 1st space 12B 2nd space 13 lower side end part 14 heater for heating chamber 15 end surface 16 relay Chamber heater 16A 1st heater 16B 2nd heater 18 Valve body 20 Opening 21 Drive shaft 22 Cylinder 24 Cooling chamber 26 Impurity recovery mechanism 28 Impurity recovery plate 28A Upper surface 28B Lower surface 30 Cooling plate 32 Auxiliary plate 34 Sealing furnace body 35 upper end 36 vacuum pump 38 connection flow path 40 valve 41 lift column 42 water piping 44 flange section A section without heater A D, D1, D2, D3 impurity P work

Claims (6)

A heat treatment apparatus that heats and bakes a workpiece, and
A heating chamber for heating the workpiece,
A relay chamber connected to the heating chamber and extending downward;
A cooling chamber connected to the lower side of the relay chamber;
An open position for opening an opening at a connection point between the heating chamber and the relay chamber, and a valve body movable between a closed position for closing the opening;
A heater for heating the heating chamber;
A relay room heater for heating the relay room;
A vacuum pump connected to the cooling chamber;
And a control unit that controls the operation of the heat treatment apparatus.
The cooling chamber is provided with an impurity recovery plate whose upper surface is directed to face the lower side end of the relay chamber, and a cooling plate having a cooling function in contact with the lower surface of the impurity recovery plate. ,
The control unit operates the heater for the heating chamber and the heater for the relay chamber in a state where the work is disposed in the heating chamber and the valve body is disposed at the open position, and the heating chamber and the relay chamber are operated. Heating the valve body to a position after the first heating step of vaporizing the impurities contained in the work and sending it to the cooling chamber through the relay chamber, and after the first heating step, closing the valve body at the closed position And controlling the second heating step of heating and baking the work in the heating chamber by operating at least the heater for the heating chamber and heating the heating chamber in a state of being disposed in Heat treatment equipment. The cooling plate is vertically movable between a contact position contacting the lower surface of the impurity recovery plate and a retracted position retracted from the lower surface.
The heat treatment according to claim 1, wherein the control unit arranges the cooling plate at the contact position in the first heating step, and arranges the cooling plate at the retracted position in the second heating step. apparatus. The lower side end of the relay chamber is a cylindrical tubular portion that protrudes downward toward the impurity recovery plate of the cooling chamber,
The heat treatment apparatus according to claim 1 or 2, wherein an auxiliary plate is provided on the upper surface of the impurity recovery plate to surround the outer periphery of the cylindrical portion at an interval from the outside. The relay chamber forms a first space connected to the side of the heating chamber and provided with the valve body, and a second space extending downward from the first space.
The relay room heater includes a first heater for heating the first space, and a second heater for heating the second space, and the second heater is disposed below the relay room. The section which is disposed above the end face of the side end and which does not have a heater is provided between the second heater and the lower end of the relay chamber. The heat treatment apparatus as described in 1 or 2. It further comprises a valve for opening and closing a connection flow path connecting the vacuum pump to the cooling chamber,
The heat processing apparatus according to any one of claims 1 to 4, wherein the control unit controls the valve to open in the first heating step and close the valve in the second heating step.   The shape of the surface of the valve body that closes the shape of the opening and the opening and the opening is circular, and the flow passage cross section of the relay chamber connected to the opening is rectangular. Heat treatment apparatus as described.

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