JP2019061869A - Plasma surface processing method and plasma surface treatment device - Google Patents

Plasma surface processing method and plasma surface treatment device Download PDF

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JP2019061869A
JP2019061869A JP2017186003A JP2017186003A JP2019061869A JP 2019061869 A JP2019061869 A JP 2019061869A JP 2017186003 A JP2017186003 A JP 2017186003A JP 2017186003 A JP2017186003 A JP 2017186003A JP 2019061869 A JP2019061869 A JP 2019061869A
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賢二 高島
Kenji Takashima
賢二 高島
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Abstract

To provide a plasma surface processing method and a plasma surface treatment device which are suitable for a surface treatment on an inner face of a tubular workpiece, and particularly enable an easy and reliable surface treatment on an inner face of an elongated workpiece or a workpiece of a small inner diameter.SOLUTION: A plasma surface processing method for performing a surface treatment on an inner face of a tubular workpiece W comprises the step of putting the workpiece W between opposing electrodes 2 with a high-frequency power put therebetween while introducing a process gas into the tube of the workpiece W. In the method, a gas easier to glow discharge than a gas interposed between the opposing electrodes 2 is used as the process gas; the glow discharge is caused only in the tube of the workpiece W without causing discharge between the opposing electrodes 2. In this way, the process gas in the tube is turned to plasma which is brought into contact with the inner face of the workpiece W, thereby performing the surface treatment on the inner face of the workpiece W.SELECTED DRAWING: Figure 1

Description

この発明はプラズマ表面処理方法およびプラズマ表面処理装置に関し、より詳細には、管状の被処理体の内面に対して表面処理を施す技術に関する。   The present invention relates to a plasma surface treatment method and a plasma surface treatment apparatus, and more particularly to a technique for applying a surface treatment to the inner surface of a tubular object to be treated.

近年、被処理体の親水性や撥水性などの各種性能の向上を目的として、被処理体の表面にプラズマ化(プラズマ活性化)された処理ガスを接触させることによる表面処理方法が提案されている(たとえば、特許文献1参照)。   Recently, for the purpose of improving various performances such as hydrophilicity and water repellency of the object to be treated, a surface treatment method has been proposed by contacting the surface of the object to be treated with plasmad (plasma activated) treatment gas. (See, for example, Patent Document 1).

ところで、このような表面処理方法を用いて、パイプやチューブなど管状の被処理体の内面に表面処理を施す場合、従来、プラズマ化した処理ガスを被処理体の一端からその管内に導入する方法が用いられている。   By the way, when performing surface treatment on the inner surface of a tubular object to be treated such as a pipe or tube using such a surface treatment method, conventionally, a method of introducing a processing gas converted into plasma from one end of the object into the tube Is used.

特開2002−237480号公報Japanese Patent Application Publication No. 2002-237480

しかしながら、このような表面処理には以下の問題があり、その改善が望まれていた。
すなわち、被処理体の一端からプラズマ化した処理ガスを管内に導入する方法によると、プラズマ化によって励起された処理ガスが管内に導入され、管内の内面(内壁面)と接触することによって、被処理体の内面に対して表面処理が施されることになるが、たとえば、処理ガス中の酸素ラジカルのように寿命の短い成分は、管端から比較的短い距離で消滅してしまうことから、長尺の被処理体の内面の表面処理には適用できないという問題があった。たとえば、管長が数m以上になると、管内の全面に対して表面処理を施すことは困難であった。
However, such surface treatments have the following problems, and their improvement has been desired.
That is, according to the method of introducing the processing gas which has been plasmatized into the tube from one end of the object to be treated, the processing gas excited by the plasmatization is introduced into the tube and contacts the inner surface (inner wall surface) inside the tube. Although the inner surface of the treatment body is subjected to surface treatment, for example, components having a short life, such as oxygen radicals in the treatment gas, disappear at a relatively short distance from the end of the tube, There is a problem that it can not be applied to the surface treatment of the inner surface of a long object to be treated. For example, when the pipe length is several meters or more, it has been difficult to apply a surface treatment to the entire surface of the pipe.

また、従来の方法では、被処理体Wの内径が小さい場合にも内面の表面処理が困難であった。すなわち、たとえば、カテーテルのようなチューブの場合、内径が数mm以下(たとえば、0.5mmや1mmなど)のものがあるが、このように内径が小さい場合には、プラズマ化した処理ガスを管内に導入するための経路が長くなってしまう傾向がある。そのため、プラズマ化した処理ガスが管内に導入された時点では、表面処理に有効な成分(たとえば、酸素ラジカルなど)の多くがすでに失われていることがあり、十分な表面処理効果を得られないことがあった。   Moreover, in the conventional method, even when the inner diameter of the object to be treated W is small, the surface treatment of the inner surface is difficult. That is, for example, in the case of a tube such as a catheter, there is one having an inner diameter of several mm or less (for example, 0.5 mm or 1 mm). There is a tendency for the route to introduce it to be longer. Therefore, at the time when the processing gas converted into plasma is introduced into the tube, many components (for example, oxygen radicals etc.) effective for surface treatment may have already been lost, and a sufficient surface treatment effect can not be obtained. There was a thing.

本発明は、このような問題点に鑑みてなされたものであって、その目的とするところは、管状の被処理体の内面の表面処理に適し、特に長尺の被処理体や内径の小さい被処理体の内面の表面処理を確実かつ容易に行うことができるプラズマ表面処理方法およびプラズマ表面処理装置を提供することにある。   The present invention has been made in view of such problems, and the object of the present invention is suitable for surface treatment of the inner surface of a tubular object to be treated, and in particular, a long object to be treated and a small inner diameter. It is an object of the present invention to provide a plasma surface treatment method and a plasma surface treatment apparatus capable of reliably and easily performing the surface treatment of the inner surface of an object to be treated.

上記目的を達成するため、本発明に係るプラズマ表面処理方法は、管状の被処理体の内面に対して表面処理を施すプラズマ表面処理方法であって、前記被処理体の管内に処理ガスを導入しつつ、高周波電力が印加された対向電極間に前記被処理体を配置することにより、前記被処理体の管内に存在する処理ガスをプラズマ化させて前記被処理体の内面に接触させ、これにより前記被処理体の内面に表面処理を施すことを特徴とする。   In order to achieve the above object, a plasma surface treatment method according to the present invention is a plasma surface treatment method for subjecting the inner surface of a tubular object to be treated to a surface treatment, wherein a treatment gas is introduced into a tube of the object. By disposing the object between the opposing electrodes to which high frequency power is applied, the processing gas present in the tube of the object is plasmatized to be in contact with the inner surface of the object, The surface treatment is applied to the inner surface of the object to be treated.

そして、その好適な実施態様として、前記処理ガスには、前記対向電極間に介在する気体よりも高周波電力の印加によってプラズマ化しやすい気体が用いられることを特徴とする。   And as a preferred embodiment thereof, the processing gas is characterized by using a gas which is more likely to be plasmatized by the application of high frequency power than the gas interposed between the counter electrodes.

また、他の好適な実施態様として、前記対向電極間に空気を介在させ、前記処理ガスとしてヘリウムまたはヘリウムと他の気体とを混合した混合気体を用いることを特徴とする。   In another preferred embodiment, air is interposed between the counter electrodes, and helium or a mixed gas of helium and another gas is used as the processing gas.

また、他の好適な実施態様として、前記対向電極間に空気を介在させ、前記処理ガスとしてヘリウムにフッ素系ガスを混合した混合気体を用いることを特徴とする。   In another preferred embodiment, a mixed gas in which air is interposed between the counter electrodes and helium is mixed with a fluorine-based gas is used as the processing gas.

また、他の好適な実施態様として、前記管内に処理ガスを導入した状態の前記被処理体を前記対向電極間に連続的に導入することによって、長尺の被処理体の内面に対して連続的に表面処理を施すことを特徴とする。   Further, as another preferred embodiment, by continuously introducing the object to be processed in a state in which the processing gas is introduced into the tube between the counter electrodes, the inner surface of the long object is continuous. Surface treatment.

また、本発明に係るプラズマ表面処理装置は、管状の被処理体の内面に対して表面処理を施すプラズマ表面処理装置であって、高周波電力が印加される対向電極と、前記被処理体の管内に処理ガスを供給するガス供給手段と、前記処理ガスが導入された前記被処理体を前記対向電極間に搬送する搬送手段とからなることを特徴とする。   Further, a plasma surface treatment apparatus according to the present invention is a plasma surface treatment apparatus for subjecting the inner surface of a tubular object to be treated to a surface treatment, the counter electrode to which high frequency power is applied, and a tube of the object to be treated. And a carrier means for carrying the processing object, into which the processing gas has been introduced, between the counter electrodes.

本発明によれば、管内に処理ガスが導入された状態の被処理体が、高周波電力が印加された対向電極間に配置されるので、処理ガスは被処理体の管内でプラズマ化されて被処理体の内面に接触し、被処理体の内面に表面処理が施される。   According to the present invention, the object to be treated in a state in which the process gas is introduced into the tube is disposed between the opposing electrodes to which the high frequency power is applied. The inner surface of the object to be treated is subjected to surface treatment while being in contact with the inner surface of the object to be treated.

このように、本発明では、被処理体の管内で処理ガスがプラズマ化されるので、処理ガス中に含まれる表面処理に有効な成分が寿命によって消滅する前に被処理体の内面に作用させることができる。したがって、長尺の被処理体や内径の小さい被処理体の内面に対する表面処理を漏れなく確実に、かつ容易に行うことができる。   As described above, in the present invention, since the processing gas is plasmatized in the tube of the object to be treated, components effective for surface treatment contained in the processing gas are allowed to act on the inner surface of the object before disappearing due to the life. be able to. Therefore, it is possible to reliably and easily carry out surface treatment on the inner surface of a long object to be treated or an object having a small inner diameter without leakage.

本発明に係るプラズマ表面処理装置の概略構成の一例を模式的に示した斜視図である。It is the perspective view which showed typically an example of schematic structure of the plasma surface treatment apparatus which concerns on this invention. 同プラズマ表面処理装置の断面を模式的に示した断面図である。FIG. 2 is a cross-sectional view schematically showing a cross section of the plasma surface treatment apparatus. 高周波電力の印加によりグロー放電が発生するポイントの一例を示す説明図である。It is explanatory drawing which shows an example of the point which glow discharge generate | occur | produces by application of high frequency electric power. 同プラズマ表面処理装置の他の一例を模式的に示した斜視図である。It is the perspective view which showed typically another example of the plasma surface treatment apparatus.

以下、本発明の実施形態を図面に基づいて詳細に説明する。
実施形態1
図1および図2は、本発明に係るプラズマ表面処理装置1の一例を示している。これらの図に示すプラズマ表面処理装置1は、管状の被処理体Wの内面に対する表面処理に適した表面処理装置である。
Hereinafter, embodiments of the present invention will be described in detail based on the drawings.
Embodiment 1
1 and 2 show an example of a plasma surface treatment apparatus 1 according to the present invention. The plasma surface treatment apparatus 1 shown in these figures is a surface treatment apparatus suitable for surface treatment of the inner surface of a tubular object to be treated W.

具体的には、本発明に係るプラズマ表面処理方法は、被処理体Wの表面処理にあたり、被処理体Wの管内に処理ガスを導入しつつ、高周波電力が印加された対向電極間に被処理体Wを配置することにより、被処理体Wの管内に存在する処理ガスをプラズマ化させて被処理体Wの内面に接触させ、これによって被処理体Wの内面に対して表面処理を施すことを特徴としており、プラズマ表面処理装置1は、このプラズマ表面処理方法を実施するための装置として構成されている。   Specifically, in the plasma surface treatment method according to the present invention, the treatment gas is introduced into the tube of the treatment object W during the treatment of the treatment object W, and the treatment is performed between the opposing electrodes to which the high frequency power is applied. By arranging the body W, the processing gas present in the tube of the object W is plasmatized and brought into contact with the inner surface of the object W, whereby the inner surface of the object W is subjected to surface treatment The plasma surface treatment apparatus 1 is configured as an apparatus for carrying out the plasma surface treatment method.

ここで、本発明に係るプラズマ表面処理装置1を用いて表面処理が施される管状の被処理体Wとしては、たとえば、パイプ、チューブなどの中空の管体が例示される。また、被処理体Wの材質については、天然樹脂や合成樹脂などの樹脂類、ガラスやセラミックスなどの無機誘電物質などの絶縁物で構成されたものが用いられる。   Here, as a tubular object to be treated W to be subjected to surface treatment using the plasma surface treatment apparatus 1 according to the present invention, for example, a hollow tube such as a pipe or a tube is exemplified. Moreover, as a material of the to-be-processed object W, what was comprised with insulators, such as resin, such as a natural resin and a synthetic resin, and inorganic dielectric materials, such as glass and ceramics, is used.

プラズマ表面処理装置1は、主として、大気圧または大気圧近傍の圧力環境下で使用する装置であって、高周波電力が印加される対向電極2と、被処理体Wの管内に処理ガスを供給するガス供給手段3とを主要部として備えている。   The plasma surface treatment apparatus 1 is an apparatus mainly used under the atmospheric pressure or a pressure environment near the atmospheric pressure, and supplies the processing gas into the counter electrode 2 to which high frequency power is applied and the tube of the object W to be processed. A gas supply means 3 is provided as a main part.

対向電極2は、管内に処理ガスが導入された被処理体Wに対して高周波電力を印加するための電極であって、高周波電源4が接続される電圧印加電極2aと、電気的に接地された接地電極2bとで構成される。本実施形態では、この対向電極2として、高周波電極4および接地電極5の双方の電極対向面が平板状に構成された平行平板型の電極を採用している。なお、対向電極2間の間隔(対向電極2間の距離)については、対向電極2に印加する高周波電力との関係で適宜設定される。すなわち、後述するように、本発明では、対向電極2間に配置される被処理体Wの管内にグロー放電を発生させることから、対向電極2間の間隔は、対向電極2間に印加する高周波電力(印加電圧等)との関係で、少なくとも被処理体Wの管内にグロー放電が生じうる感覚に設定される。   The counter electrode 2 is an electrode for applying high frequency power to the object to be processed W into which the processing gas is introduced into the tube, and is electrically grounded with the voltage application electrode 2a to which the high frequency power source 4 is connected. And the ground electrode 2b. In the present embodiment, a parallel plate type electrode in which both electrode facing surfaces of the high frequency electrode 4 and the ground electrode 5 are formed in a flat plate shape is adopted as the counter electrode 2. The distance between the opposing electrodes 2 (the distance between the opposing electrodes 2) is appropriately set in relation to the high frequency power applied to the opposing electrodes 2. That is, as described later, in the present invention, since glow discharge is generated in the tube of the object to be processed W disposed between the opposing electrodes 2, the distance between the opposing electrodes 2 is a high frequency applied between the opposing electrodes 2 It is set to the sense that glow discharge can occur at least in the tube of the object to be treated W in relation to the electric power (applied voltage or the like).

ここで、本発明では、被処理体Wは、上述したように、絶縁物で構成されることから、本実施形態に示すプラズマ表面処理装置1では、電圧印加電極4および接地電極5の双方の電極対向面は、いずれも電極を構成する金属が露出した構造の電極を採用している。もちろん、電圧印加電極4または接地電極5のいずれか一方または双方の電極対向面をセラミックスやガラス等の誘電体によって被覆する構造としてもよい。   Here, in the present invention, as described above, the object to be treated W is made of an insulator, so in the plasma surface treatment apparatus 1 shown in the present embodiment, both the voltage application electrode 4 and the ground electrode 5 are provided. The electrode opposing surface adopts an electrode having a structure in which the metal constituting the electrode is exposed. Of course, the electrode facing surface of either or both of the voltage application electrode 4 and the ground electrode 5 may be covered with a dielectric such as ceramic or glass.

ガス供給手段3は、被処理体Wの管端の開口部から管内に処理ガスを供給するための手段であって、具体的には、ガスボンベなどの処理ガスの供給源や被処理体Wの開口部への処理ガスの導入を案内するインレットなどで構成される。   The gas supply means 3 is a means for supplying the processing gas into the pipe from the opening of the pipe end of the body W to be processed, and more specifically, it is a supply source of the processing gas such as a gas cylinder or the like. It comprises an inlet for guiding the introduction of processing gas into the opening.

ここで、処理ガスについて説明する。使用する処理ガスは、表面処理の内容(たとえば、親水化処理、撥水化処理など)に応じて適宜選択されるが、本発明では、少なくとも、対向電極2間に介在する気体よりもプラズマ化しやすい気体が処理ガスとして用いられる。   Here, the processing gas will be described. The treatment gas to be used is appropriately selected according to the content of the surface treatment (for example, hydrophilization treatment, water repellent treatment, etc.), but in the present invention, it is more plasmatized than at least the gas interposed between the counter electrodes 2. An easy gas is used as the processing gas.

上述したように、本発明では、管内に処理ガスが導入された状態の被処理体Wを高周波電力が印加された対向電極間に配置することによって管内で処理ガスをプラズマ化させることから、対向電極2間の空間より先に管内にグロー放電を発生させる必要がある。そのため、処理ガスとしては、対向電極2間に高周波電力を印加することによって、対向電極2間に介在する気体よりも先に管内にグロー放電を発生させる気体、すなわち、対向電極2間に介在する気体よりもグロー放電に伴うプラズマ化が起きやすい気体が用いられる。   As described above, in the present invention, the processing gas is plasmatized in the tube by arranging the object W in a state in which the processing gas is introduced into the tube between the opposing electrodes to which the high frequency power is applied. It is necessary to generate glow discharge in the tube prior to the space between the electrodes 2. Therefore, as the processing gas, by applying high frequency power between the opposing electrodes 2, a gas which generates glow discharge in the tube earlier than the gas interposed between the opposing electrodes 2, ie, intervenes between the opposing electrodes 2 A gas is used that is more likely to cause plasma formation associated with glow discharge than gas.

図3は、高周波電力の印加に伴うグロー放電の発生ポイントを気体別(ガス種別)に例示している。気体が介在する電極間に高周波電力を印加すると、図3に示すように、気体ごとにグロー放電が発生するポイント(印加電力)が相違することが知られている。すなわち、図示ように、ヘリウム(He)と、アルゴン(Ar)と、空気(Air)とを比較した場合、ヘリウムが最も低い電力でグロー化し(つまり、最もグロー放電を発生させやすく)、次に、アルゴン、そして、最後に空気がグロー化する(空気が最もグロー化し難い)ことが知られている。本発明では、このような気体ごとのグロー放電の発生ポイントの相違に着目して、対向電極2間に介在する気体よりも先に管内にグロー放電を発生させる気体を処理ガスとして採用している。   FIG. 3 exemplifies the generation point of the glow discharge accompanying the application of the high frequency power, according to the type of gas (gas type). It is known that when high frequency power is applied between electrodes in which a gas intervenes, as shown in FIG. 3, the point (applied power) at which glow discharge occurs is different for each gas. That is, as illustrated, when helium (He), argon (Ar), and air (Air) are compared, helium glows at the lowest power (that is, it is most likely to cause glow discharge), and then , Argon, and finally, air is known to glow (the air is the most difficult to glow). In the present invention, focusing on the difference in the generation point of the glow discharge for each gas, the gas that generates the glow discharge in the tube earlier than the gas interposed between the counter electrodes 2 is adopted as the processing gas. .

具体的には、たとえば、対向電極2間に空気が介在している場合には、被処理体Wの管内に導入する処理ガスとしては、ヘリウムやアルゴン、または、これらヘリウム等と他の気体(たとえば、CDAなどの空気や窒素など)との混合気体が使用される。ちなみに、処理ガスとして混合気体を用いる場合、対向電極2間よりも先に管内でグロー放電が生じるように、ヘリウムまたはアルゴンを最も多く含んだ混合気体が使用される。   Specifically, for example, when air intervenes between the counter electrodes 2, helium, argon, helium or the like and other gases (such as helium or argon) are introduced as the processing gas introduced into the tube of the object W For example, a mixed gas with air such as CDA or nitrogen) is used. Incidentally, when a mixed gas is used as the processing gas, a mixed gas containing the largest amount of helium or argon is used so that glow discharge is generated in the tube before the space between the counter electrodes 2.

また、表面処理の内容から処理ガスを分類すると、たとえば、親水化処理を行う場合には、処理ガスとして、ヘリウム、アルゴン、または、これらヘリウム等と他の気体(たとえば、CDAなどの空気や窒素など)との混合気体が用いられる。これに対して、撥水化処理を行う場合には、上述したヘリウム、アルゴンまたはこれらと他の気体との混合気体に、フッ素系のガス(たとえば、四フッ化メタン(CF4)、六フッ化エタン(C26)、八フッ化プロパン(C38)、トリフルオロメタン(CHF3))を混合した気体が用いられる。なお、フッ素系のガスを混合する場合においてもヘリウムまたはアルゴンを最も多く含んだ混合気体が使用される。 In addition, when the treatment gas is classified based on the contents of the surface treatment, for example, when performing a hydrophilization treatment, helium, argon, or these helium etc. and other gases (eg air such as CDA or nitrogen) as the treatment gas Etc.) is used. In contrast, when performing the water repellent treatment, helium mentioned above, a mixed gas of argon or these and other gases, the fluorine-based gas (e.g., tetrafluoromethane (CF 4), hexafluoroarsenate A mixed gas of fluorinated ethane (C 2 F 6 ), propane octafluoride (C 3 F 8 ) and trifluoromethane (CHF 3 )) is used. Even in the case of mixing a fluorine-based gas, a mixed gas containing most helium or argon is used.

次に、プラズマ表面処理装置1を用いた被処理体Wの内面Wcの表面処理手順について、図1および図2を示して説明する。   Next, the surface treatment procedure of the inner surface Wc of the object to be treated W using the plasma surface treatment apparatus 1 will be described with reference to FIGS. 1 and 2.

図1は、長尺の被処理体Wを渦巻き状に巻装した状態で表面処理を施す場合を示している。また、本実施形態では、プラズマ表面処理装置1を大気圧(常圧)環境下で使用する場合を示している。したがって、対向電極2間の空間には空気が充満している。   FIG. 1 shows the case where surface treatment is performed in a state in which a long workpiece W is wound in a spiral shape. Moreover, in this embodiment, the case where plasma surface treatment apparatus 1 is used under atmospheric pressure (normal pressure) environment is shown. Therefore, the space between the opposing electrodes 2 is filled with air.

被処理体Wは、図1に示すように、その先端と基端とが対向電極2間から外れた外側に位置させ、その他の部分を対向電極2間に位置するように配置する。図2は、対向電極2間に配置された被処理体Wの状態を断面図で示しており、この図に示すように、本実施形態では、被処理体Wは接地電極2b上に載置される。なお、本実施形態では、被処理体Wを接地電極2b上に載置した(接触状態とした)場合を示したが、被処理体Wは対向電極2間に配置されるのであれば、電圧印加電極2aに接触する位置、あるいは電圧印加電極2aおよび接地電極2bの双方に接触することなく、対向電極2間に浮いた状態で配置される構造であってもよい。   As shown in FIG. 1, the object to be processed W is disposed such that its tip and base end are located outside of the space between the opposing electrodes 2 and the other portion is located between the opposing electrodes 2. FIG. 2 is a cross-sectional view showing the state of the object to be treated W disposed between the counter electrodes 2. As shown in this figure, in the present embodiment, the object to be treated W is placed on the ground electrode 2b. Be done. In the present embodiment, the case where the object to be treated W is placed on the ground electrode 2b (in a contact state) is shown, but if the object to be treated W is disposed between the counter electrodes 2, the voltage It may be arranged in a floating state between the opposing electrodes 2 without being in contact with the application electrode 2a or in contact with both the voltage application electrode 2a and the ground electrode 2b.

そして、この状態で、被処理体Wの基端Wbにガス供給手段3が接続され、ガス供給手段3から被処理体Wの管内に処理ガスが導入される。このとき、処理ガスは、被処理体Wの管内の全体に充満するように導入される。すなわち、被処理体Wにおいて、少なくとも対向電極2間に配置される部分については、管内の空気が処理ガスと置換されるように処理ガスが導入される。なお、本実施形態では、処理ガスとして、ヘリウムを単独で使用するものとする。   Then, in this state, the gas supply unit 3 is connected to the base end Wb of the object to be processed W, and the processing gas is introduced from the gas supply unit 3 into the pipe of the object to be processed W. At this time, the process gas is introduced so as to fill the entire tube of the object W to be treated. That is, in the object W to be processed, the processing gas is introduced such that the air in the tube is replaced with the processing gas at least in a portion disposed between the counter electrodes 2. In the present embodiment, helium is used alone as the processing gas.

被処理体Wの管内に処理ガスが充填されると、次に、対向電極2間に高周波電力を印加する。この高周波電力の印加にあたっては、被処理体Wの管内にのみグロー放電が発生するように高周波電力を印加する。具体的には、使用する処理ガスに応じてグロー放電の発生ポイント(印加電力)をあらかじめ測定または計算により求めておき、グロー放電の発生ポイントまたはそれ以上の電力を印加して被処理体Wの管内にグロー放電を発生させる。なお、このとき対向電極2間に印加する電力は、グロー放電の発生ポイント以上であればよいが、少なくとも対向電極2間にアーク放電が発生しないようにその上限が設定される。つまり、対向電極2間にアーク放電を発生させることなく、被処理体Wの管内にのみグロー放電を発生させる。   When the tube of the object to be treated W is filled with the treatment gas, next, high frequency power is applied between the counter electrodes 2. In applying the high frequency power, the high frequency power is applied so that glow discharge occurs only in the tube of the object to be treated W. Specifically, according to the processing gas to be used, the glow discharge occurrence point (applied power) is previously obtained by measurement or calculation, and power of the glow discharge occurrence point or more is applied to Generate glow discharge in the tube. The power applied between the opposing electrodes 2 at this time may be equal to or higher than the glow discharge occurrence point, but the upper limit is set so that arcing does not occur at least between the opposing electrodes 2. That is, glow discharge is generated only in the tube of the object W without generating arc discharge between the counter electrodes 2.

このようにして、被処理体Wの管内にグロー放電が発生すると、グロー放電に伴って処理ガスがプラズマ化され、プラズマ化した処理ガスが被処理体Wの管内においてそのWcに接触し、これによって被処理体Wの内面Wcに対する表面処理が施される。   In this way, when glow discharge occurs in the tube of the object W, the processing gas is plasmified along with the glow discharge, and the processing gas converted into plasma contacts the Wc in the tube of the object W, The surface treatment is applied to the inner surface Wc of the object W to be treated.

このように、本発明によれば、被処理体Wの管内で処理ガスをプラズマ化させて被処理体Wの内面Wcに表面処理を施すので、処理ガス中に含まれる表面処理に有効な成分が寿命によって消滅する前に被処理体の内面Wcに作用させることができる。そのため、長尺の被処理体Wや内径の小さい被処理体Wであっても、その管内に処理ガスを充満させておくことによって、容易にその内面Wcに対して漏れなく確実に表面処理を施すことができる。   As described above, according to the present invention, the surface gas is treated on the inner surface Wc of the object to be treated W by plasmatizing the treatment gas in the tube of the object to be treated W. Can act on the inner surface Wc of the object to be treated before it disappears due to the life. Therefore, even with a long workpiece W or a workpiece W with a small inner diameter, surface treatment can be carried out easily and reliably without leaking the inner surface Wc by filling the tube with the processing gas. It can be applied.

なお、上述した実施形態では、処理ガスとしてヘリウムを用いた場合を示したが、ヘリウムに代えて、またはヘリウムとともにアルゴンを処理ガスとして使用することも可能であり、さらには、これらに空気などの他の気体を混合したガスを使用することも可能である。また、撥水化処理を行う場合は、ヘリウム等のフッ素系のガスを添加した処理ガスが用いられるのは上述したとおりである。   In the embodiment described above, helium is used as the processing gas. However, argon may be used as the processing gas instead of or together with helium. It is also possible to use a mixture of other gases. Further, as described above, in the case of performing the water repellent treatment, a processing gas to which a fluorine-based gas such as helium is added is used.

実施形態2
次に、本発明の他の実施形態について、図4に基づいて説明する。
図4は、長尺の被処理体Wを対向電極間に連続的に導入しながら表面処理を行う場合を示しており、図示のプラズマ表面処理装置1は、被処理体Wの搬送手段(図示せず)を備える以外の構成は上述した実施形態1と共通する。したがって、構成が共通する部分には同一符号を付して説明を省略する。
Embodiment 2
Next, another embodiment of the present invention will be described based on FIG.
FIG. 4 shows the case where the surface treatment is performed while continuously introducing a long object W to be processed between the counter electrodes, and the plasma surface treatment apparatus 1 shown in FIG. The configuration other than the configuration including the not shown) is common to the first embodiment described above. Therefore, the same reference numerals are given to the parts having the same configuration and the description is omitted.

この実施形態では、被処理体Wは、対向電極2の一端側(図の左側)から対向電極2間に導入され、他端側(図の右側)から対向電極2外に排出されるように被処理体Wの搬送手段(図示せず)が備えられており、この搬送手段によって、被処理体Wが対向電極2間に連続的に導入できるように構成されている。   In this embodiment, the object to be processed W is introduced between the opposite electrodes 2 from one end side (left side in the drawing) of the opposite electrode 2 and discharged out of the opposite electrode 2 from the other end side (right side in the drawing). The conveyance means (not shown) of the to-be-processed object W is provided, and it is comprised by this conveyance means so that the to-be-processed object W can be continuously introduced between the counter electrodes 2.

そして、被処理体Wの基端Wbにガス供給手段3が接続され、ガス供給手段3から被処理体Wの管内に処理ガスが導入されるように構成されている。   The gas supply means 3 is connected to the base end Wb of the object W to be treated, and the processing gas is introduced from the gas supply means 3 into the pipe of the object W to be treated.

このように構成された本実施形態に示すプラズマ表面処理装置1では、被処理体Wの内面Wcの表面処理にあたり、まず、被処理体Wの基端Wbから被処理体Wの管内に処理ガスが導入される。そして、被処理体Wの管内に処理ガスが充填されると、対向電極2間に高周波電力を印加するとともに、処理ガスが充填された被処理体Wを対向電極2間に連続的に送り込む。これにより、被処理体Wは対向電極2間を通過する際に管内でグロー放電が発生し、プラズマ化した処理ガスによる被処理体Wの内面Wcの表面処理が施され、対向電極2外に排出されるようになる。   In the plasma surface treatment apparatus 1 shown in the present embodiment configured as described above, in the surface treatment of the inner surface Wc of the object to be treated W, first, the processing gas in the tube of the object to be treated W from the base end Wb of the object to be treated W Is introduced. Then, when the processing gas is filled in the tube of the object to be processed W, high frequency power is applied between the counter electrodes 2, and the object to be processed W filled with the processing gas is continuously fed between the counter electrodes 2. As a result, when the object W passes between the counter electrodes 2, glow discharge occurs in the tube, and the surface treatment of the inner surface Wc of the object W with the processing gas converted to plasma is performed. It will be discharged.

すなわち、本実施形態では、管内に処理ガスが充満した状態の被処理体Wを連続的に対向電極2間に送り込むことによって、被処理体Wの内面Wcの表面処理を連続的に行うことが可能となる。したがって、たとえば、数mまたは十数mを超えるような長尺の被処理体Wに対して効率よく内面Wcの表面処理を行うことができる。   That is, in the present embodiment, the surface treatment of the inner surface Wc of the object to be processed W is continuously performed by continuously feeding the object to be processed W in a state in which the processing gas is filled in the pipe between the opposing electrodes 2. It becomes possible. Therefore, for example, the surface treatment of the inner surface Wc can be efficiently performed on a long object to be treated W which exceeds several meters or ten and several meters.

なお、上述した実施形態はあくまでも本発明の好適な実施態様を示すものであって、本発明はこれらに限定されることなくその範囲内で種々の設計変更が可能である。   The embodiment described above is merely a preferred embodiment of the present invention, and the present invention is not limited to these, and various design changes can be made within the scope thereof.

たとえば、上述した実施形態では、プラズマ表面処理装置1の構成として、対向電極2として、平行平板型の電極を採用した場合を示したが、対向電極2間に被処理体Wを配置可能な構成であれば、電極の形状は平板でなくてもよい。たとえば、電極対向面が湾曲した形状の電極を用いることも可能である。   For example, in the embodiment described above, a parallel plate type electrode is adopted as the counter electrode 2 as the configuration of the plasma surface treatment apparatus 1, but a configuration in which the object W to be processed can be disposed between the counter electrodes 2 The shape of the electrode may not be flat. For example, it is also possible to use an electrode having a shape in which the electrode facing surface is curved.

また、上述した実施形態では、対向電極2を大気に解放した状態で使用する場合を示したが、たとえば、対向電極2の双方を覆うカバーを設け、このカバー内に対向電極2を収容するように構成することも可能である。すなわち、対向電極2をカバーで覆うことによって、対向電極2間に空気以外の気体を介在させたり、あるいは、対向電極2間を減圧するなどの方式を採用することができる。なお、その場合、被処理体Wの搬入・排出用の出入口をカバーに設けることは勿論である。   In the embodiment described above, the counter electrode 2 is used in the state of being released to the atmosphere. However, for example, a cover that covers both of the counter electrode 2 is provided, and the counter electrode 2 is accommodated in the cover It is also possible to configure. That is, by covering the counter electrode 2 with a cover, it is possible to adopt a method of interposing a gas other than air between the counter electrodes 2, or reducing the pressure between the counter electrodes 2. In that case, it is a matter of course to provide an inlet / outlet for carrying in / out the object W on the cover.

また、上述した実施形態2では、対向電極2間に導入する被処理体Wが1本の場合を例示したが、複数本の被処理体Wを並列に配列し、複数条同時に表面処理を行うように構成することも可能である。   Moreover, in Embodiment 2 mentioned above, although the case where the to-be-processed object W introduce | transduced between the counter electrodes 2 was one was illustrated, two or more to-be-processed objects W are arranged in parallel, and surface treatment is performed simultaneously in multiple stripes. It is also possible to configure.

1 プラズマ表面処理装置
2 対向電極
2a 電圧印加電極
2b 接地電極
3 ガス供給手段
W 被処理体
DESCRIPTION OF SYMBOLS 1 Plasma surface treatment apparatus 2 Counter electrode 2a Voltage application electrode 2b Grounding electrode 3 Gas supply means W Object to be processed

Claims (6)

管状の被処理体の内面に対して表面処理を施すプラズマ表面処理方法であって、
前記被処理体の管内に処理ガスを導入しつつ、高周波電力が印加された対向電極間に前記被処理体を配置することにより、前記被処理体の管内に存在する処理ガスをプラズマ化させて前記被処理体の内面に接触させ、これにより前記被処理体の内面に表面処理を施すことを特徴とするプラズマ表面処理方法。
It is a plasma surface treatment method of subjecting the inner surface of a tubular object to be treated to a surface treatment,
The processing gas existing in the tube of the object to be treated is converted into plasma by disposing the object to be treated between the opposing electrodes to which the high frequency power is applied while introducing the processing gas into the tube of the object to be treated. A plasma surface treatment method comprising bringing the inner surface of the object to be treated into contact with the inner surface of the object to be treated, thereby treating the inner surface of the object to be treated.
前記処理ガスには、前記対向電極間に介在する気体よりも高周波電力の印加によってプラズマ化しやすい気体が用いられることを特徴とする請求項1に記載のプラズマ表面処理方法。   The plasma surface treatment method according to claim 1, wherein the processing gas is a gas that is more easily converted to a plasma by application of high frequency power than the gas interposed between the counter electrodes. 前記対向電極間に空気を介在させ、前記処理ガスとしてヘリウムまたはヘリウムと他の気体とを混合した混合気体を用いることを特徴とする請求項1または2に記載のプラズマ表面処理方法。   The plasma surface treatment method according to claim 1 or 2, wherein air is interposed between the counter electrodes, and helium or a mixed gas of helium and another gas is used as the processing gas. 前記対向電極間に空気を介在させ、前記処理ガスとしてヘリウムにフッ素系ガスを混合した混合気体を用いることを特徴とする請求項1に記載のプラズマ表面処理方法。   The plasma surface treatment method according to claim 1, wherein air is interposed between the counter electrodes, and a mixed gas in which a fluorine-based gas is mixed with helium is used as the processing gas. 前記管内に処理ガスを導入した状態の前記被処理体を前記対向電極間に連続的に導入することによって、長尺の被処理体の内面に対して連続的に表面処理を施すことを特徴とする請求項1から4のいずれかに記載のプラズマ表面処理方法。   The surface treatment is continuously performed on the inner surface of a long object to be treated by continuously introducing the object to be treated in a state in which a processing gas is introduced into the tube between the counter electrodes. The plasma surface treatment method according to any one of claims 1 to 4. 管状の被処理体の内面に対して表面処理を施すプラズマ表面処理装置であって、
高周波電力が印加される対向電極と、
前記被処理体の管内に処理ガスを供給するガス供給手段と、
前記処理ガスが導入された前記被処理体を前記対向電極間に搬送する搬送手段とからなる
ことを特徴とするプラズマ表面処理装置。
A plasma surface processing apparatus for performing surface processing on the inner surface of a tubular object to be treated, comprising:
A counter electrode to which high frequency power is applied;
A gas supply unit for supplying a processing gas into a pipe of the object to be processed;
And a transfer unit configured to transfer the processing object into which the processing gas has been introduced between the counter electrodes.
JP2017186003A 2017-09-27 2017-09-27 Plasma surface processing method and plasma surface treatment device Pending JP2019061869A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020196491A1 (en) 2019-03-27 2020-10-01 Jxtgエネルギー株式会社 Hydrogen gas supplier and hydrogen gas supply method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020196491A1 (en) 2019-03-27 2020-10-01 Jxtgエネルギー株式会社 Hydrogen gas supplier and hydrogen gas supply method

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