JP2019048941A - Adhesive ape and manufacturing method of electronic component using the same - Google Patents

Abstract

To provide an adhesive tape capable of suppressing generation of an organic gas even with a heating treatment, and a manufacturing method of an electronic component using the same.SOLUTION: There is provided an adhesive tape having an adhesive lone, the adhesive layer contains (A) a (meth)acrylic acid ester copolymer, (B) an isocyanate-based curing agent, and (C) a tackifier resin, the (A) (meth)acrylic acid ester copolymer contains (A-1) (meth)acrylic acid alkyl ester having 4 to 8 carbon atoms of an alkyl group, (A-2) at least one kind of methyl methacrylate, acrylic nitrile, methacrylonitrile and styrene, (A-3) (meth)acrylic acid ester having a glycidyl group, and (A-4) (meth)acrylic acid ester having a hydroxyl group.SELECTED DRAWING: None

Description

  The present invention relates to a pressure-sensitive adhesive tape and a method of manufacturing an electronic component using the same.

BACKGROUND ART Adhesive tapes are used for the purpose of protecting parts, masking the support members of parts, and the like in the manufacturing process and processing process of precision parts, optical parts or electronic parts. In these manufacturing processes and processing processes, high temperatures of 200 ° C. or higher may occur, and pressure-sensitive adhesive tapes having heat resistance are required. As a heat-resistant adhesive tape, one using a polyimide resin as a substrate of a masking adhesive tape (see, for example, Patent Document 1), excellent adhesion and heat resistance, adhesive residue in a predetermined adhesive residue test One that uses no silicone pressure-sensitive adhesive composition (see, for example, Patent Document 2) is known.
Unexamined-Japanese-Patent No. 2016-222863 JP, 2015-193803, A

  A substrate formed of a polyimide-based resin is usually produced by a solvent casting method, and therefore often contains a residual solvent. If the substrate contains a residual solvent, the residual solvent may volatilize and a gas may be generated when the pressure-sensitive adhesive tape is heat-treated at a high temperature. When a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer formed of a silicone pressure-sensitive adhesive is heat-treated at a high temperature, a siloxane gas derived from the silicone pressure-sensitive adhesive may be generated. When such a conventional adhesive tape is used, for example, as a masking tape when vacuum-depositing a component, a vapor deposition film formed on the surface of the component may be colored by the generated organic gas, or the inside of the chamber may be Deposits may be deposited to deteriorate the quality.

  An object of the present invention is to provide a pressure-sensitive adhesive tape capable of suppressing the generation of an organic gas even when heat treatment is performed, and a method of manufacturing an electronic component using the same.

  The pressure-sensitive adhesive tape according to the present invention has a pressure-sensitive adhesive layer on at least one surface of a substrate film, the substrate film contains polyether sulfone, and the pressure-sensitive adhesive layer comprises (A) (meth) acrylic acid ester co-ester The polymer (B), an isocyanate-based curing agent, and (C) a tackifier resin, wherein the (A) (meth) acrylic ester copolymer has 4 to 8 carbon atoms of the (A-1) alkyl group 55% by mass or more and 90% or less of (meth) acrylic acid alkyl ester which is the following, (A-2) 5% by mass or more and 30% by mass or less of at least one selected from methyl methacrylate, acrylonitrile, methacrylonitrile and styrene And (A-3) 0.1 to 10% by mass of (meth) acrylic acid ester having a glycidyl group, and (A-4) having a hydroxyl group ) Containing 15 mass% or less than 0.1 wt% of acrylic acid ester.

  The pressure-sensitive adhesive layer comprises (A) 100 parts by mass of (meth) acrylic acid ester copolymer, (B) 1 part by mass or more and 30 parts by mass or less of an isocyanate curing agent, and (C) 1 part by mass or more of a tackifier resin It is preferable to contain the mass part or less.

  The (C) tackifying resin is preferably a terpene phenol resin having a softening point of 100 ° C. or more and 180 ° C. or less.

  In the method of manufacturing an electronic component according to the present invention, a sticking step of sticking any one of the above-mentioned adhesive tapes to a support plate, a fixing step of fixing an electronic component on the adhesive tape, and a film is formed on the surface of the electronic component Forming a film forming step.

  In the film forming step, at least one film selected from metal oxides, metal nitrides, nonmetal oxides, and nonmetal nitrides is formed on the surface of the electronic component under a vacuum atmosphere of 100 ° C. or higher. can do.

  According to the present invention, it is possible to provide a pressure-sensitive adhesive tape capable of suppressing the generation of an organic gas even when heat treatment is performed, and a method of manufacturing an electronic component using the same.

  Hereinafter, an embodiment of the present invention will be described in detail. The present invention is not limited to the following embodiments, and can be implemented with appropriate modifications as long as the effects of the present invention are not impaired. In the present specification, "(meth) acrylic acid" is a generic name of acrylic acid and methacrylic acid, and "(meth) acrylate" is a generic name of acrylate and methacrylate.

First Embodiment
The pressure-sensitive adhesive tape of the present embodiment has a pressure-sensitive adhesive layer on at least one surface of a substrate film.
(Base film)
The substrate film comprises polyether sulfone. Polyethersulfone has heat resistance and can form a film by an extrusion method, so it does not contain a residual solvent like a film formed by a solvent casting method. Therefore, even when the pressure-sensitive adhesive tape is heat-treated at a high temperature of 200 ° C. or more, the generation of the organic gas can be suppressed.

  The polyether sulfone may be a homopolymer comprising only any one of the repeating units of formulas (1) to (10), and two or more kinds of repeating units of formulas (1) to (10) may be used. It may be a copolymer having one. However, when it is set as a copolymer, it is preferable to contain 50 mol% or more in polyether sulfone, and, as for any one sort of repeating units of Formula (1)-(10), it is still more preferable to contain 80 mol% or more. By adjusting any one of the repeating units of the formulas (1) to (10) in this range, a base film excellent in film strength, heat resistance and molding processability can be obtained.

When a copolymer is used as the polyether sulfone, it may be either a block copolymer, a random copolymer, or an alternating copolymer. In addition, it may be a modified product having another chemical structure only at the end. As a specific example of polyether sulfone, trade name by Solvay Specialty Polymers: Radel R series, trade name by BASF: Ultra Zone P series and Ultra Zone E series, Sumika Excel PES series by Sumitomo Chemical Co., Ltd. Be

  The glass transition temperature of the polyether sulfone is preferably 200 ° C. or more, more preferably 220 ° C. or more, and still more preferably 225 ° C. or more. When the glass transition temperature is 220 ° C. or higher, the thermal contraction rate can be suppressed from increasing. The glass transition temperature is DSC measurement from room temperature to 380 ° C at a temperature rising rate of 10 ° C / min in a nitrogen atmosphere according to JIS K7121 using a differential thermogravimeter, and two folds derived from glass transition It is an intermediate value of the curve point temperature.

  The substrate film can optionally contain a thermoplastic resin other than polyether sulfone. The thermoplastic resin is not particularly limited, but from the viewpoint of heat resistance, polyetheretherketone, polyarylate, and the like can be used.

  The base film may be blended with additives such as a plasticizer and a stabilizer, if necessary. The plasticizer is not particularly limited, and for example, phthalate plasticizers such as dioctyl phthalate, epoxy plasticizers such as epoxidized soybean oil, and polyester plasticizers such as polyethylene glycol phthalate phthalate can be used. The stabilizer is not particularly limited. For example, an epoxy stabilizer, a barium stabilizer, a calcium stabilizer, a tin stabilizer, a zinc stabilizer, a calcium-zinc system (Ca-Zn system) or a barium-zinc system. Compounds (Ba-Zn-based), calcium fatty acid, fatty acid zinc, fatty acid barium and other metal soaps, hydrotalcite, β-diketone compounds, copolymers of glycidyl methacrylate and methyl methacrylate, etc. Be These stabilizers may be used alone or in combination of one or more.

  In the base film, organic and inorganic fine particles having an average particle diameter of about 0.01 to 20 μm are used as a lubricant, for example, in a blending ratio of 0.005 to 20% by mass, in order to improve the slipperiness of the film. It can be contained. The average particle size is the average particle size (average primary particle size) of primary particles, and the largest diameter of several tens to about 100 particles is measured using a transmission electron microscope (TEM), It is a value for which an average value is obtained.

  Specific examples of fine particles include calcium carbonate, calcium oxide, amyl oxide, titanium oxide, graphite, kaolin, silicon oxide, zinc oxide, carbon black, silicon carbide, tin oxide, acrylic resin particles, crosslinked styrene resin particles, melamine resin particles And silicone resin particles can be preferably mentioned.

  In addition to the above, an antistatic agent, an organic lubricant, a catalyst, a pigment, a fluorescent whitening agent, a crosslinking agent, a sliding agent, an ultraviolet absorber, another resin, etc. can be added to the substrate film as required. .

  The content of these additives is not particularly limited, and can be 0.1 parts by mass to 20 parts by mass with respect to 100 parts by mass of polyether sulfone.

  The thickness of the substrate film is not particularly limited, and can be 5 μm to 150 μm, preferably 10 μm to 75 μm. In addition, the base film may be a single layer, or may have a multilayer structure of two or more layers.

  The formation method of a base film can employ | adopt an extrusion method, a calendar film forming method, a T-die processing method, etc. The surface of the base film may be subjected to a treatment for forming fine irregularities, if necessary. (I) A method of forming a film by forming a film by extruding a melt-kneaded resin from a T-die and sandwiching it with a metal roll and another pressure-bonding roll is a method of forming a fine unevenness using a metal roll having fine unevenness And (ii) forming a multilayer film, and then bringing it into close contact with a metal roll having fine asperities to form asperities. Among these, the method (i) is preferable from the viewpoint of simplification of the apparatus.

(Adhesive layer)
The pressure-sensitive adhesive layer (hereinafter also referred to as "first pressure-sensitive adhesive layer") contains (A) (meth) acrylic acid ester copolymer, (B) isocyanate-based curing agent, and (C) tackifier resin. Since the adhesive layer contains (A) (meth) acrylic acid ester copolymer, (B) isocyanate-based curing agent, and (C) tackifying resin, it has heat resistance and contains a residual solvent in the substrate It is also possible to achieve siloxane gas free. As a result, even when the pressure-sensitive adhesive tape is heat-treated at a high temperature, the generation of the organic gas can be prevented.

  The (A) (meth) acrylic acid ester copolymer comprises 55% by mass or more and 90% by mass or less of a (meth) acrylic acid alkyl ester having 4 to 8 carbon atoms in the (A-1) alkyl group; 2) 5 mass% or more and 30 mass% or less of at least one of methyl methacrylate, acrylonitrile, methacrylonitrile and styrene, (A-3) 0.1 mass% or more and 10 mass% of (meth) acrylic acid ester having a glycidyl group 0.1% by mass or more and 15% by mass or less of (meth) acrylic acid ester having (%) or less and (A-4) hydroxyl group.

  (A) In the (meth) acrylic acid ester copolymer, the (A-1) alkyl group contains 55% by mass or more and 90% by mass or less of a (meth) acrylic acid alkyl ester having 4 to 8 carbon atoms. Thus, an adhesive layer having sufficient adhesiveness to an adherend can be obtained. The content of the (meth) acrylic acid alkyl ester having 4 to 8 carbon atoms of the (A-1) alkyl group is 60% by mass or more and 70 mass% in the (A) (meth) acrylic acid ester copolymer % Or more, or 80% by mass or less.

  (A-1) Examples of the (meth) acrylic acid alkyl ester having 4 to 8 carbon atoms in the alkyl group include n-butyl (meth) acrylate, 2-butyl (meth) acrylate, t-butyl (meth) acrylate, Examples include pentyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate and the like. One or more selected from these can be used.

  Sufficient by containing at least one of (A-2) methyl methacrylate, acrylonitrile, methacrylonitrile and styrene in an amount of 5% by mass or more and 30% by mass or less in the (A) (meth) acrylic acid ester copolymer An adhesive layer having a cohesive force can be obtained, and the releasability, the adhesive property and the mass change after heating can be suppressed. The content of at least one of (A-2) methyl methacrylate, acrylonitrile, methacrylonitrile and styrene is 8% by mass or more and 10% by mass or more in the (A) (meth) acrylic acid ester copolymer It may be 25 mass% or less.

  (A) In the adhesive layer, the (meth) acrylic ester containing (A-3) glycidyl group is contained in an amount of 0.1% by mass or more and 10% by mass or less in the (meth) acrylic ester copolymer It is possible to suppress the adhesive retention and the mass change after heating. The content of the (meth) acrylic acid ester containing (A-3) glycidyl group is 0.5 mass% or more and 1.0 mass% or more in the (A) (meth) acrylic acid ester copolymer It may be 8% by mass or less and 5% by mass or less.

  (A-3) Examples of glycidyl group-containing (meth) acrylic acid esters include glycidyl (meth) acrylate, allyl glycidyl ether and the like, and one or more selected from these may be used. Can.

  (A) (A-4) By containing (A) a hydroxyl group-containing (meth) acrylic ester in an amount of 0.1% by mass or more and 15% by mass or less, (B) It becomes possible to control the cross-linking structure with the isocyanate-based curing agent, and it is possible to obtain a pressure-sensitive adhesive layer having sufficient adhesive strength, and to suppress peelability, adhesive retention and mass change after heating. . The content of (A-4) hydroxyl group-containing (meth) acrylic acid ester is 0.5% by mass or more and 1.0% by mass or more in the (A) (meth) acrylic acid ester copolymer 10 mass% or less and 8 mass% or less may be sufficient.

  (A-4) As the (meth) acrylic acid ester containing a hydroxyl group, for example, 2-hydroxymethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxy Examples thereof include butyl (meth) acrylate, pentaerythritol triacrylate, glycidol di (meth) acrylate, dipentaerythritol pentaacrylate and the like, and one or more selected from these can be used.

  As the isocyanate-based curing agent (B), it is preferable to use a polyfunctional isocyanate curing agent. Examples of polyfunctional isocyanate curing agents include aromatic polyisocyanate curing agents, aliphatic polyisocyanate curing agents, and alicyclic polyisocyanate curing agents, and trimers thereof or adducts with trimethylolpropane may be used. it can.

  The aromatic polyisocyanate curing agent is not particularly limited, and, for example, 1,3-phenylene diisocyanate, 4,4′-diphenyl diisocyanate, 1,4-phenylene diisocyanate, 4,4′-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate Isocyanate, 2,6-tolylene diisocyanate, 4,4'-toluidine diisocyanate, 2,4,6-triisocyanate toluene, 1,3,5-triisocyanate benzene, dianisidine diisocyanate, 4,4'-diphenyl ether diisocyanate 4,4 ', 4'-triphenylmethane triisocyanate, ω, ω'-diisocyanate-1,3-dimethylbenzene, ω, ω'-diisocyanate-1,4-dimethylbenzene, ω, ω'-diisocyanate-1 , 4- Ethylbenzene, 1,4-tetramethylxylylene diisocyanate, and 1,3-tetramethylxylylene diisocyanate and the like.

  The aliphatic polyisocyanate curing agent is not particularly limited. For example, trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylene diisocyanate, 2,3-butylene diisocyanate, 1,3-butylene diisocyanate And dodecamethylene diisocyanate, and 2,4,4-trimethylhexamethylene diisocyanate.

  The alicyclic polyisocyanate curing agent is not particularly limited. For example, 3-isocyanatomethyl-3,5,5-trimethylcyclohexylisocyanate, 1,3-cyclopentadiisocyanate, 1,3-cyclohexanediisocyanate, 1,4-cyclohexane Diisocyanate, methyl-2,4-cyclohexanediisocyanate, methyl-2,6-cyclohexanediisocyanate, 4,4'-methylenebis (cyclohexylisocyanate), 1,4-bis (isocyanatomethyl) cyclohexane, and 1,4-bis (isocyanate) Methyl) cyclohexane and the like.

  The adduct with trimer or trimethylolpropane is not particularly limited, and an adduct of 2,4-tolylene diisocyanate and trimethylolpropane is preferably used.

  The content of the (B) isocyanate-based curing agent is preferably 1 part by mass or more and 30 parts by mass or less, and 2 parts by mass or more and 20 parts by mass with respect to 100 parts by mass of (A) (meth) acrylic acid ester copolymer. It is more preferable that the amount is equal to or less by mass. By setting the content of the curing agent in the above range, it becomes possible to control the cross-linking structure with the (A) (meth) acrylic acid ester copolymer, and sufficient adhesive power can be obtained, It is possible to suppress the releasability, the adhesive retention and the mass change after heating.

  (C) As tackifying resin, terpene resin, terpene phenol resin, alicyclic saturated hydrocarbon resin, rosin ester, rosin, styrene resin, aliphatic hydrocarbon resin etc. can be mentioned, and terpene phenol resin is used Is preferred.

  As a terpene resin, the homopolymer or copolymer of a terpene monomer is mentioned, for example. As a terpene monomer, (alpha)-pinene, (beta)-pinene, limonene etc. are mentioned, These may be used independently and may be used together. As an alicyclic saturated hydrocarbon resin, resin obtained by carrying out partial hydrogenation or complete hydrogenation of aromatic (C9 type | system | group) petroleum resin is mentioned, for example. Examples of the rosin include natural rosins such as gum rosin, tall oil rosin and wood rosin, and hydrogenated rosins obtained by subjecting natural rosins to a hydrogenation reaction. Examples of rosin esters include methyl esters of the above-mentioned rosins, triethylene glycol esters, glycerin esters and the like.

  Examples of the terpene phenol resin include those produced by reacting a terpene compound and a phenol according to a conventionally known method, and are not particularly limited. However, 1 mole of the terpene compound and a phenol 0.1 to 50 What was made to react with a mole by a conventionally well-known method can be mentioned.

  Examples of the terpene compounds include myrcene, alloocimene, α-pinene, β-pinene, limonene, α-terpinene, γ-terpinene, camphene, terbinolene, delta-3-carene and the like. Among these compounds, α-pinene, β-pinene, limonene, myrcene, alloocimene and α-terpinene are preferably used.

  Phenols include, but are not limited to, phenol, cresol, xylenol, catechol, resorcinol, hydroquinone, bisphenol A and the like. The proportion of phenols in the terpene phenol resin is about 25 to 50 mol%, but is not limited thereto. Although the hydroxyl value of terpene phenol resin is about 50-250, it is not limited to these.

  The softening point of the terpene phenolic resin is preferably 100 ° C. or more and 180 or less. By setting it in this range, it is possible to suppress the releasability, the adhesive property and the mass change after heating.

  The content of the tackifier resin (C) is preferably 1 part by mass or more and 20 parts by mass or less, and 3 parts by mass or more and 15 parts by mass with respect to 100 parts by mass of (A) (meth) acrylic acid ester copolymer. Part or less is more preferable. By making content of tackifying resin into the said range, while being able to acquire sufficient adhesive force, the peelability after heating, adhesive property, and a mass change can be suppressed.

(Other additives etc.)
The adhesive layer may contain various additives such as, for example, a softener, an antiaging agent, a filler, a conductive agent, an ultraviolet absorber, and a light stabilizer. The content of the other additive is not particularly limited, and can be 0 parts by mass to 20 parts by mass with respect to 100 parts by mass of the (meth) acrylic acid ester polymer (A).

  The thickness of the adhesive layer is preferably 5 μm to 50 μm. By setting the thickness of the pressure-sensitive adhesive layer to 5 μm or more, it is possible to ensure sufficient adhesiveness and to prevent a decrease in thickness accuracy and adhesive strength. By setting the thickness of the pressure-sensitive adhesive layer to 50 μm or less, it is possible to easily form the pressure-sensitive adhesive layer, and to prevent adhesive residue after heating, cost increase, decrease in productivity, etc. it can.

  The pressure-sensitive adhesive composition containing (A) (meth) acrylic acid ester copolymer, (B) isocyanate-based curing agent, (C) tackifying resin, and an additive used as needed, etc. The article can be coated on a substrate. As the method, for example, a method of directly applying the pressure-sensitive adhesive composition onto the base film with a coater such as a gravure coater, comma coater, bar coater, knife coater or roll coater, or applying the pressure-sensitive adhesive composition onto a release film There is a method of bonding to a substrate film after drying. The pressure-sensitive adhesive composition may be printed on a substrate film by convex printing, intaglio printing, lithographic printing, flexographic printing, offset printing, screen printing, or the like.

Second Embodiment
The pressure-sensitive adhesive tape of the present embodiment has a pressure-sensitive adhesive layer on both sides of a substrate film. That is, in the pressure-sensitive adhesive tape according to the first embodiment, the pressure-sensitive adhesive tape according to the present embodiment further includes a pressure-sensitive adhesive layer (hereinafter referred to as a “second pressure-sensitive adhesive layer”) (Also referred to as “.”). About a substrate film and the 1st adhesion layer, since it is the same as that of a 1st embodiment, it omits explanation here.

(Second adhesive layer)
As the second adhesive layer, the same (meth) acrylate copolymer as the (A) (meth) acrylate copolymer or a different (meth) acrylate copolymer as the (A) (meth) acrylate copolymer, B) It can form using an adhesive agent composition which contains an isocyanate type curing agent or an epoxy type curing agent, and also does not contain (C) tackifying resin. The same resin as the (meth) acrylic acid ester copolymer, the (B) isocyanate-based curing agent, and the (C) tackifying resin are the same as described above, and thus the description thereof is omitted here.

  (A) As the (meth) acrylic acid ester copolymer different from the (meth) acrylic acid ester copolymer, mention may be made of a (meth) acrylic acid ester copolymer resin not containing one or both of a hydroxyl group and a glycidyl group. Can.

  As the epoxy curing agent, a polyfunctional epoxy curing agent can be used. A polyfunctional epoxy curing agent mainly refers to a compound having two or more epoxy groups and one or more tertiary nitrogen atoms, N, N-glycidyl aniline, N, N-glycidyl toluidine, m-N, N-glycidyl amino Phenyl glycidyl ether, p-N, N-glycidyl aminophenyl glycidyl ether, triglycidyl isocyanurate, N, N, N ', N'-tetraglycidyl diaminodiphenylmethane, N, N, N', N'-tetraglycidyl-m -Xylylene diamine, N, N, N ', N', N ''-pentaglycidyl diethylene triamine etc. are mentioned. In addition, about the thickness and formation method of a 2nd adhesion layer, it is the same as that of a 1st adhesion layer.

[Adhesive tape]
The pressure-sensitive adhesive tapes according to the first embodiment and the second embodiment can prevent the generation of the organic gas even when heat treatment is performed at a high temperature. Therefore, even when this adhesive tape is used as a masking tape or the like in the production of an electronic component or the like, the contamination or coloring of the electronic component or device or the like or the deposition of a deposit can be prevented by the organic gas. . Moreover, since it can also suppress that the adhesiveness rises excessively after heat processing, generation | occurrence | production of adhesive residue can be prevented.

The pressure-sensitive adhesive tape preferably has a mass reduction rate of less than 4% by mass after heating at 250 ° C. for 1 hour. When the mass reduction rate is less than 4% by mass, it is possible to suppress the generation of organic gas even when the adhesive tape is heated at high temperature. In addition, mass reduction rate measures the mass of the adhesive tape before and after heating, and is the value computed by the following formula I.
Mass reduction rate = [(mass before heating−mass after heating) / (mass before heating)] × 100 (mass%)
... I

  The adhesive tape preferably has an adhesive strength at a width of 20 mm after heating at 100 ° C. of 0.7 N / 20 mm or more and less than 9 N / 20 mm. By setting the adhesive strength after heating to this range, the adhesive residue after the heat treatment can be suppressed. The adhesion is a value measured according to JIS Z 0237.

[Use]
The pressure-sensitive adhesive tapes of the first and second embodiments can be used in various applications. For example, it can be used in applications such as production and transport of electronic components, substrate fixing in chip size package mounting process, and film-like substrate production process. The pressure-sensitive adhesive tape can suppress the generation of organic gas even when it is heat-treated, and therefore, is used in applications for fixing the electronic component in the step of heating the electronic component at high temperature and applications for protecting the electronic component It can also be used for transporting electronic components in subsequent processes. For example, a process of forming a vapor deposition film on the surface of an electronic component, a process of thinning a material in wafer level package (WLP), organic EL, and LED manufacturing, an electrode forming process, a thin film circuit forming process, and a resin sealing process It can be used as a masking tape that can be consistently transported and supported. In addition, it can be used as a masking tape for a support in the surface treatment of a semiconductor wafer, an electronic component, glass and the like.

[Method of manufacturing electronic parts]
In the method of manufacturing an electronic component according to the present embodiment, a process of attaching the above-mentioned adhesive tape to a support plate, a process of fixing the electronic component on the adhesive tape, and a film forming a film on the surface of the electronic component The steps are included in this order.

(Pasting process)
At a sticking process, an adhesive tape is stuck on a support plate. The support plate is a plate for fixing the electronic component, and the material thereof is not particularly limited, but may be metal, alloy, glass, or plastic. From the viewpoint of heat resistance, metals, alloys and glasses are preferred. The shape and size of the support plate can be appropriately selected according to the application. The adhesive layer (first adhesive layer) of the adhesive tape is brought into close contact with one side of the support plate, and the adhesive tape is attached to the support plate. The location to which the adhesive tape is to be applied may be only a location on the support plate that corresponds directly below and around the electronic component or may be the entire surface of the support plate. By sticking an adhesive tape on the entire surface of the support plate, the adhesive tape acts as a masking tape for the support plate to protect the support plate from deposits and the like.

(Fixing process)
In the fixing step, the electronic component is fixed on the adhesive tape. An electronic component is a component used for an electronic device, for example, the component which consists of a glass plate, an epoxy resin, a plastic film, a metal, an alloy etc. can be mentioned. When the pressure-sensitive adhesive tape has a second pressure-sensitive adhesive layer, the electronic component is tightly attached to the surface of the second pressure-sensitive adhesive layer. When the pressure-sensitive adhesive tape does not have the second pressure-sensitive adhesive layer, the electronic component is fixed on the surface of the base film opposite to the surface on which the first pressure-sensitive adhesive layer is formed Do.

(Film forming process)
In the film forming step, a film of metal or nonmetal or the above metal or nonmetal oxide, nitride, fluorine or sulfide is formed on the electronic component fixed on the adhesive tape. In one embodiment, at least one film selected from metal oxides, metal nitrides, nonmetal oxides, and nonmetal nitrides can be formed. The film may be a single layer or multiple layers. The film is a vapor deposition method in which the metal or the like is deposited as a vapor deposited film by heating and evaporating the metal or the like under vacuum, or a rare gas ionized by applying a high voltage to the metal or the like under vacuum It can form by the sputtering method etc. which make an element and nitrogen collide and make the generated metal atom adhere to the surface of an electronic component. The oxide film is preferably SiO ₂ or TiO ₂ , and the nitride film is preferably SiN or TiN.
The heating temperature can be appropriately selected depending on the application, and can be, for example, 100 ° C. or more, or 250 ° C. or more. Since the pressure-sensitive adhesive tape of the present embodiment has heat resistance, the generation of organic gas can be suppressed even when heating at a high temperature of 100 ° C. or higher, and the adhesive property is prevented from being excessively increased to prevent adhesive residue. Can be suppressed. The heating time can be, for example, 1 minute or more, or 300 minutes or less.

EXAMPLES Although an Example is shown to the following and this invention is more concretely demonstrated to it, these Examples do not limit the interpretation of this invention.
[material]
The following materials were used in the examples and comparative examples.
(Base film)
PES: Polyether sulfone resin film, "Sumika Excel PES 4800 G" manufactured by Sumitomo Chemical Co., Ltd., Tg 225 ° C
PAR: Polyarylate resin film, "U polymer U-100" manufactured by Unitika, Tg 193 ° C
PI: Polyimide resin film (thermoplastic polyimide), Mitsui Chemicals "Auram PL450C", Tg 250 ° C
PET: polyethylene terephthalate resin film, “G2P2” manufactured by Teijin DuPont Films

(Adhesive layer)
(A) (meth) acrylic acid ester copolymer:
The following were used for (A-1)-(A-4) which comprise (A) (meth) acrylic acid ester copolymer, respectively.
(A-1) (Meth) acrylic acid alkyl ester · n-butyl acrylate having 4 to 8 carbon atoms in alkyl group: manufactured by Nippon Shokubai Co., Ltd., Tg-54 ° C of homopolymer, molecular weight 128
-2-ethylhexyl acrylate: manufactured by Nippon Shokubai Co., Ltd., Tg-70 ° C of homopolymer, molecular weight 184
(A-2) at least one of methyl methacrylate, acrylonitrile, methacrylonitrile and styrene Methyl methacrylate: manufactured by Mitsubishi Gas Chemical Co., Tg of homopolymer, molecular weight: 100
Acrylonitrile: manufactured by Mitsubishi Rayon Co., Tg 100 ° C. of homopolymer, molecular weight 53
-Methacrylonitrile: manufactured by Asahi Kasei Co., Ltd., Tg 120 ° C. of homopolymer, molecular weight 67
Styrene: manufactured by NS Styrene Monomer Co., Tg 100 ° C. of homopolymer, molecular weight 104
(A-3) (Meth) acrylic acid ester glycidyl methacrylate having a glycidyl group: manufactured by NOF Corporation, Tg 41 ° C. of homopolymer, molecular weight 142
(A-4) (Meth) acrylic acid ester having a hydroxyl group and 2-hydroxyethyl methacrylate: manufactured by Nippon Shokuhin Co., Ltd., Tg of homopolymer of Tg 55 ° C., molecular weight 130, hydroxyl value 431 mg KOH / g
(B) Isocyanate curing agent:
B-1: TDI-TMP adduct: Toron Corp. "Corronate L-45E"
(C) Tackifying resin:
C-1: Terpene phenol resin, "YS Polystar G150" manufactured by Yashara Chemical Co., Ltd., softening point 150 ° C.
C-2: Terpene phenol resin, "YS Polystar T80" manufactured by Yashara Chemical Co., Ltd., softening point 80 ° C.
C-3: Terpene phenol resin, "YS Polystar T160" manufactured by Yashara Chemical Co., softening point 160 ° C

Example 1
A pressure-sensitive adhesive composition for forming a pressure-sensitive adhesive layer was produced as follows. First, a (meth) acrylic acid ester copolymer was synthesized as follows. In a 1-liter separable flask, 200 parts by mass of water containing 0.2% by mass of polyvinyl alcohol, 72 parts by mass of n-butyl acrylate, 20 parts by mass of methyl methacrylate, 3 parts by mass of glycidyl methacrylate, 2 A homogeneous liquid mixture containing 5 parts by mass of hydroxyethyl methacrylate, 0.1 parts by mass of benzoyl peroxide as a polymerization initiator, and a chain transfer agent for molecular weight adjustment was charged.
The mixture was heated to 70 ° C. with stirring under a nitrogen atmosphere, and was subjected to suspension polymerization for 4 hours. The suspension was then dewatered by decantation. The solid matter is washed with water while suction filtering, and after removing moisture, vacuum drying is performed at 60 ° C., and a copolymer resin having a moisture content of 0.5% or less ((A) (meth) acrylic acid of Example 1) An ester copolymer was obtained.
The obtained (meth) acrylic acid ester copolymer was melted and stirred in toluene. An isocyanate-based curing agent and a tackifier resin were added thereto, and the mixture was stirred and mixed to obtain a pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition is coated on a PES film having a width of 300 mm, a length of 400 mm, and a thickness of 25 μm using an applicator such that the thickness after curing is 20 μm, and then conditions of 100 ° C. for 2 minutes Heated and dried. A polyester film having a width of 300 mm, a length of 400 mm and a thickness of 38 μm which has been subjected to a release treatment was attached to the adhesive surface to obtain an adhesive tape. The resultant was subjected to aging treatment at 40 ° C. for 3 days in an oven to obtain a crosslinked adhesive layer, which was a pressure-sensitive adhesive tape of Example 1 having a width of 300 mm, a length of 400 mm and a thickness of 0.083 mm.

[Examples 2-18, Comparative Examples 1-12]
The adhesive tape was produced by the same method as Example 1 except having used the base film of Table 1 and Table 2, and the adhesion layer. In Example 18, a PES film of 20 μm and a PAR film of 5 μm were produced by coextrusion to obtain a base film having a two-layer structure and a thickness of 25 μm.

[Evaluation]
The following evaluation was performed about the adhesive tape obtained by the Example and the comparative example. The results are shown in Tables 1 and 2.
(Mass change rate)
A tape 21 mm wide x 200 mm long is cut out from the adhesive tape obtained in Examples and Comparative Examples, and mass (before heating) using an electronic balance (manufactured by Shin Optoelectronics, model: HTR-220) under an environment of 23 ° C. Mass) was measured. Thereafter, the tape was heated in an oven under heating conditions of 250 ° C. for 1 hour, and the mass (weight after heating) of the adhesive tape after heating was measured by the above-mentioned electronic balance. The mass change (mass reduction rate) by heating of the adhesive tape was calculated as a ratio to the mass before heating according to the following formula I.
Mass reduction rate = [(mass before heating−mass after heating) / (mass before heating)] × 100 (mass%)
... I
3: 0 mass% or more and less than 3 mass% 2: 3 mass% or more and less than 4 mass% 1: 4 mass% or more

(Initial adhesion)
A 10 mm wide tape is cut from the adhesive tape obtained in Examples and Comparative Examples, and placed on one side of a 10 cm square, 0.5 mm thick aluminum plate (arithmetic mean surface roughness Ra: 1.0 ± 0.1 μm), From the top, a 2 kg roller was made to reciprocate once to bond the adhesive tape to the aluminum plate. After leaving the aluminum plate with the adhesive tape to stand at 23 ° C. for 30 minutes, the adhesive tape is peeled off under the conditions of peeling angle 180 ° and peeling speed (pulling speed) of 300 mm / min. The adhesion was measured.
3: 1.0 N / 20 mm to 6 N / 20 mm or less 2: 0.7 N / 20 mm to 1.0 N / 20 mm, or more than 6 N / 20 mm and less than 9 N / 20 mm 1: 0.7 N / 20 mm or less, 9 N / 20 mm that's all

(Adhesive force after heating)
The tape of 10 mm width was cut out from the adhesive tape obtained by the Example and the comparative example, and it bonded to the above-mentioned aluminum plate by the same method as the above. The aluminum plate with adhesive tape was heated in an oven at 250 ° C. for 1 hour, cooled at 23 ° C. for 2 hours, and the adhesive strength was measured in the same manner as described above.
3: 1.0 N / 20 mm to 6 N / 20 mm or less 2: 0.7 N / 20 mm to 1.0 N / 20 mm, or more than 6 N / 20 mm and less than 9 N / 20 mm 1: 0.7 N / 20 mm or less, 9 N / 20 mm that's all

(Adhesion retention)
Each adhesive tape after the initial tack measurement and after the tack measurement after heating was peeled off from the aluminum plate. The area | region of 10 mm x 40 mm was observed by 100-times magnification using the microscope among the location to which the adhesive tape was bonded on the aluminum plate surface, and the following references | standards evaluated.
3: No adhesive residue 2: Adhesive residue of 1 or more and less than 10 1: Adhesive residue of 10 or more

Claims (5)

An adhesive layer is provided on at least one surface of the substrate film,
The substrate film comprises polyether sulfone,
The pressure-sensitive adhesive layer comprises (A) (meth) acrylic acid ester copolymer, (B) an isocyanate-based curing agent, and (C) a tackifier resin,
The (A) (meth) acrylic acid ester copolymer is
55% by mass or more and 90% by mass or less of (meth) acrylic acid alkyl ester in which the carbon number of the (A-1) alkyl group is 4 or more and 8 or less,
(A-2) 5% by mass or more and 30% by mass or less of at least one selected from methyl methacrylate, acrylonitrile, methacrylonitrile and styrene,
(A-3) 0.1% by mass or more and 10% by mass or less of (meth) acrylic acid ester having a glycidyl group, and
(A-4) A pressure-sensitive adhesive tape containing (meth) acrylic acid ester having a hydroxyl group in an amount of 0.1% by mass or more and 15% by mass or less.   The adhesive layer comprises 100 parts by mass of the (A) (meth) acrylic acid ester copolymer, 1 to 30 parts by mass of the (B) isocyanate-based curing agent, and 1 part by mass of the (C) tackifying resin The pressure-sensitive adhesive tape according to claim 1, containing at least 20 parts by mass.   The adhesive tape according to claim 1 or 2, wherein the (C) tackifying resin is a terpene phenol resin having a softening point of 100 ° C or more and 180 ° C or less. A sticking step of sticking the pressure-sensitive adhesive tape according to any one of claims 1 to 3 on a support plate,
A fixing step of fixing an electronic component on the adhesive tape;
And a film forming step of forming a film on the surface of the electronic component.   In the film forming step, at least one film selected from metal oxides, metal nitrides, nonmetal oxides, and nonmetal nitrides is formed on the surface of the electronic component under a vacuum atmosphere of 100 ° C. or higher. The manufacturing method of the electronic component according to claim 4.