JP2019046804A - Conductive film and conductive film roll - Google Patents

Abstract

To provide a conductive film and a conductive film roll, which can maintain high quality without being adhered between adjacent films.SOLUTION: A conductive film roll of the present invention includes: a film base material; a first transparent conductor layer formed on a first surface side of the film base material; a first metal layer formed on the first transparent conductor layer; a first metal oxide coating layer formed on the first metal layer; a second transparent conductor layer formed on a second surface side of the film base material; and a second metal layer formed on the second transparent conductor layer, in which the first metal layer is made of at least one material selected from the group consisting of silver, copper, aluminum, a copper alloy, and a silver alloy, the first metal oxide coating layer is made of an oxide of the metal constituting the first metal layer, and a surface resistance value of the first transparent conductor layer and the second transparent conductor layer is 500 Ω/square or lower.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a conductive film and a conductive film roll applied to an input display device or the like capable of inputting information by contact with a finger or a stylus pen.

  Conventionally, a conductive film including a transparent conductor layer formed on both surfaces of a film substrate and a metal layer formed on the surface of each transparent conductor layer is known (Patent Document 1). When such a conductive film is used for, for example, a touch sensor, it is possible to realize a narrow frame by processing a metal layer and forming a wiring around an outer edge portion of the touch input region. Yes.

JP 2011-060146 A

  However, in the said conventional conductive film, when this film is wound in roll shape, there exists a problem that adjacent films will crimp. If the pressure-bonded films are peeled off, scratches may occur in the transparent conductor layer in the film, which may cause a deterioration in quality.

  The objective of this invention is providing the electroconductive film and electroconductive film roll which can maintain high quality, without adjoining films adhering to each other.

  In order to achieve the above object, a conductive film according to the present invention includes a film base, a first transparent conductor layer formed on the first surface side of the film base, and the first transparent conductor layer. A first metal layer formed thereon, a first metal oxide film layer formed on the first metal layer, a second transparent conductor layer formed on the second surface side of the film substrate, A second metal layer formed on the second transparent conductor layer, wherein the first metal layer is at least one material selected from the group consisting of silver, copper, aluminum, a copper alloy, and a silver alloy The first metal oxide film layer is made of an oxide of a metal constituting the first metal layer, and the surface resistance values of the first transparent conductor layer and the second transparent conductor layer are 500Ω / □. It is as follows.

  Further, it is preferable that a second metal oxide film layer is further formed on the second metal layer.

  Moreover, it is preferable that the said 2nd metal oxide film layer consists of an oxide of the metal which comprises the said 2nd metal layer.

  Moreover, the electroconductive film roll of this invention winds the said electroconductive film roll in roll shape.

  According to the present invention, the conductive film includes a film base, a first transparent conductor layer formed on the first surface side of the film base, and a first transparent conductor layer formed on the first transparent conductor layer. 1 metal layer, 1st metal oxide film layer formed on this 1st metal layer, 2nd transparent conductor layer formed in the 2nd surface side of the said film base material, and this 2nd transparent conductor A second metal layer formed on the layer. The first metal layer is made of at least one material selected from the group consisting of silver, copper, aluminum, copper alloy, and silver alloy, and the first metal oxide film layer constitutes the first metal layer. The surface resistance value of the first transparent conductor layer and the second transparent conductor layer is 500Ω / □ or less. According to the present invention, adjacent films are not pressure-bonded, and high quality can be maintained.

It is a flowchart which shows the manufacturing method of the electroconductive film roll which concerns on embodiment of this invention. It is a figure which shows roughly the sputtering device with which the manufacturing method of FIG. 1 is applied. It is a perspective view which shows an example of the electroconductive film roll manufactured with the sputtering device of FIG.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  As shown in FIG. 1, in the method for producing a conductive film roll according to the present embodiment, first, a long film base material is conveyed while being in contact with the first film forming roll (step S11), and the film base material is used. A first transparent conductor layer, a first metal layer, and a metal oxide film layer are sequentially laminated on the first surface that is not in contact with the first film-forming roll by a sputtering method. Is formed (step S12). Next, the film base material on which the first laminated body is formed is supplied to the second film-forming roll without being wound into a roll (step S13), and the metal oxide film layer of the first laminated body is changed to the first 2 It conveys while making it contact with a film-forming roll (step S14), and the 2nd transparent conductor layer and the 2nd metal layer are formed on the 2nd surface side in which the 1st layered product of the film base is not formed. Then, the second stacked body is formed by sequentially stacking by a sputtering method (step S15). And the film base material (electroconductive film) in which the 1st and 2nd laminated body was formed is wound in roll shape (step S16).

  The conductive film roll obtained by this manufacturing method has a metal oxide film layer on the side opposite to the first transparent conductor layer of the first metal layer, so that the interleaf is interposed between the conductive films when winding. Even if the (slip sheet) is not inserted, an excellent effect is achieved in that it is not crimped. This is because the metal oxide film layer having no free electrons is interposed between the adjacent first copper layer and the second copper layer when the conductive film is wound into a roll shape, so that the first It is estimated that it is possible to prevent metal bonding between the copper layer and the second copper layer.

  Moreover, according to the said manufacturing method, the said step S12 to step S15 are continuously implemented by supplying the 1st laminated body obtained by step S12 to a 2nd film-forming roll, without winding in roll shape. Therefore, compared with the case where each step is divided and carried out, there is an additional effect that the productivity of the conductive film roll is excellent. In addition, since Steps S11 to S16 are continuously performed, there is an effect that it is difficult for dust to be mixed between the layers, and a conductive film roll with few defects and excellent quality can be obtained.

  The above manufacturing method is preferably carried out by a sputtering apparatus as shown in FIG. 2 is an exemplification, and the sputtering apparatus to which the manufacturing method of the present invention is applied is not limited to that shown in FIG.

As shown in FIG. 2, the sputtering apparatus 1 includes a chamber 10 for creating a low-pressure environment (for example, 1 × 10 ⁻⁵ Pa to 1 Pa), and an initial roll in which a long film substrate is wound. 30 is held between the holding unit 11, the holding unit 11 and a film forming roll, which will be described later, and a guide roll 12 that guides the film substrate conveyed to the film forming roll, and a temperature (for example, 20 ° C.). ˜250 ° C.) is configured to be controllable, and is electrically connected to a film forming roll 13 (first film forming roll) that forms the first laminated body on one surface of the film base and a DC power source (not shown). In addition, the target materials 14, 15, 16 (first, second, and third target materials) respectively disposed so as to face the film forming roll 13 and the transport direction indicated by the arrows in the drawing are sequentially disposed, And the film in which the first laminate is formed Guide rolls 17a to 17d for transporting the base material to a film forming roll, which will be described later, and a temperature (for example, 20 ° C. to 250 ° C.) can be controlled, and a second laminate is formed on the other surface of the film base material. A film forming roll 18 (second film forming roll) and a target material 19 and 20 (fourth and fourth) electrically connected to a DC power source (not shown) and arranged to face the film forming roll 18, respectively. 5 target material), a guide roll 21 arranged on the downstream side of the film-forming roll 18, and a roll 31 obtained by winding a film substrate on which the first and second laminates are formed. Part 22.

  The chamber 10 includes a transfer chamber 23 that holds the initial roll 30 and the processed roll 31 and that transfers the film base material on which the first laminate is formed to two processing chambers described later. In addition, three processing chambers 24, 25, and 26 are provided around the film forming roll 13 so that the sputtering process can be performed using the target materials 14, 15, and 16 under different conditions. Similarly, two processing chambers 27 and 28 are provided around the film forming roll 18 so that the sputtering process can be performed using the target materials 19 and 20 under different conditions.

  In such a sputtering apparatus, for example, a voltage (for example, −400 V to −100 V) is applied between the film forming roll 13 and each target material or between the film forming roll 18 and each target material. And the cations in the plasma collide with the target material which is a negative electrode, so that the substance scattered from the surface of the target material can be attached to the film substrate.

  The first laminate obtained in the above step S12 uses a target (for example, a fired body target containing indium oxide and tin oxide) capable of forming a transparent conductor layer as the target material 14, and a metal target as the target material 15. It can be produced by using a metal oxide target as the target material 16 and carrying out a sputtering process while transporting the film substrate along the peripheral surface of the film forming roll 13.

The metal oxide film layer uses a non-oxidized metal target as the target material 16 instead of the metal oxide target, and the oxygen partial pressure around the target material 16 is 1 × 10 ⁻⁴ Pa to 0 ×. It can also be produced by forming a film while supplying oxygen gas so as to be 1 Pa.

  The second laminate B obtained in step S15 is a film base on which the first laminate is formed using a target that can form a transparent conductor layer as the target material 19 and a metal target as the target material 20. The material can be produced by carrying out a sputtering treatment while being conveyed along the peripheral surface of the film forming roll 18.

  In the present invention, another target material (sixth target material) is further provided on the downstream side in the conveyance direction of the target material 20, and a second metal oxide film layer is further laminated on the second metal layer. May be.

  FIG. 3 is a perspective view showing an example of a conductive film roll manufactured by the sputtering apparatus of FIG. The conductive film roll obtained by the production method of the present invention is obtained by winding a long conductive film into a roll.

  In FIG. 3, the conductive film 41 includes a film substrate 42, a transparent conductor layer (first transparent conductor layer) 43 formed on one side of the film substrate, and a film of the transparent conductor layer 43. A metal layer (first metal layer) 44 formed on the opposite side of the substrate 42, a transparent conductor layer (second transparent conductor layer) 45 formed on the other side of the film substrate 42, and transparent A metal layer (second metal layer) 46 formed on the side of the conductor layer 45 opposite to the film base 42 and a metal oxide film layer 47 formed on the side of the metal layer 44 opposite to the transparent conductor layer 43. And have. The transparent conductor layer 43, the metal layer 44, and the metal oxide film layer 47 constitute the first laminate A, and the transparent conductor layer 45 and the metal layer 46 constitute the second laminate B. In the conductive film roll 40 configured by winding the conductive film 41, the metal oxide film layer 47 is interposed between the metal layer 44 and the metal layer 46.

  The length of the conductive film 41 is typically 100 m or more, and preferably 500 m to 5000 m. In the central part of the conductive film roll 40, a plastic or metal core for winding the conductive film is usually arranged.

  The material forming the film substrate 42 is preferably polyethylene terephthalate, polycycloolefin, or polycarbonate from the viewpoint of excellent transparency and heat resistance. The film base material 42 has an easy-adhesive layer (anchor coat layer) for increasing the adhesive strength between the transparent electrode pattern and the film base material, and a refractive index adjustment layer for adjusting the reflectance of the film base material. (Index-matching layer), or a hard coat layer for increasing the surface hardness of the film substrate.

  The transparent conductor layers 43 and 45 have a high transmittance (80% or more) in the visible light region (400 nm to 700 nm) and a surface resistance value (Ω / □: Ohms per square) per unit area of 500Ω / □ or less. Is a layer. The material forming the transparent conductor layers 43 and 45 is preferably indium tin oxide, indium zinc oxide, or indium oxide-zinc oxide composite oxide. The thickness of the transparent conductor layers 43 and 45 is preferably 20 nm to 80 nm.

  The material forming the metal layers 44 and 46 is preferably copper, silver, aluminum, a copper alloy, a nickel alloy, a titanium alloy, or a silver alloy, and more preferably copper. The surface resistance value per unit area of the metal layers 44 and 46 is preferably 10Ω / □ or less, and more preferably 0.1Ω / □ to 1Ω / □. The thickness of the metal layers 44 and 46 is preferably 20 nm to 300 nm from the viewpoint of workability of the lead wiring.

  The material for forming the metal oxide film layer is preferably a metal oxide obtained by oxidizing the material for forming the first metal layer, and more preferably copper oxide. The thickness of the metal oxide film layer is preferably 1 nm to 15 nm from the viewpoint of preventing pressure bonding.

  In addition, the said electroconductive film roll may further have the 2nd metal oxide film layer similar to what was formed in the 1st copper layer on the 2nd copper layer.

  As described above, according to the present embodiment, the film substrate 42 is conveyed while being in contact with the film forming roll 13, and the transparent conductor layer 43, the metal layer 44, and the first surface side of the film substrate 42 are Then, the metal oxide film layer 47 is sequentially laminated by the sputtering method to form the first laminated body A (first step). And the film base material in which the said 1st laminated body was formed is supplied to the film-forming roll 18 without winding in roll shape, The metal oxide film layer 47 of this 1st laminated body is contacted with the film-forming roll 18 A transparent conductor layer 45 and a metal layer 46 are sequentially laminated by sputtering on the second surface side of the film base where the first laminate is not formed. B is formed (second step). According to this method, since the metal oxide film layer 47 is interposed between the metal layer 44 and the metal layer 46 when the conductive film is wound into a roll, the adjacent films are not pressure-bonded, High quality can be maintained.

  Next, examples of the present invention will be described.

Example 1
A roll of a film substrate made of a polycycloolefin film having a length of 1000 m and a thickness of 100 μm (trade name “ZEONOR (registered trademark)” manufactured by Nippon Zeon Co., Ltd.) is placed in the sputtering apparatus of FIG. A first transparent conductor layer made of an indium tin oxide layer having a thickness of 20 nm is formed on the first surface side of the film base that is not in contact with the first film-forming roll, while being brought into contact with the film roll. A first copper layer having a thickness of 50 nm and a copper oxide layer having a thickness of 2.5 nm were sequentially stacked by a sputtering method to form a first stacked body.

  Next, the first laminated body is supplied to the second film forming roll without being wound in a roll shape, and the side on which the copper oxide layer of the first laminated body is laminated is the second film forming roll. A first transparent conductor layer composed of an indium tin oxide layer having a thickness of 20 nm and a second layer having a thickness of 50 nm on the second surface side of the film base on which the first laminate is not formed. One copper layer was sequentially laminated to form a second laminate (conductive film).

  Then, the said 2nd laminated body was wound around the plastic core, and it was made roll shape, and produced the electroconductive film roll.

  Next, the conductive film roll of Example 1 was measured and evaluated by the following method.

(1) Measurement of thickness of metal oxide film layer The thickness of the copper oxide layer was measured using an X-ray photoelectron spectroscopy analyzer (product name “QuanteraSXM” manufactured by PHI).

(2) Measurement of the thickness of the transparent conductor layer, metal layer, and film substrate The thickness of the transparent conductor layer, copper layer, and film substrate was observed with a transmission electron microscope (H-7650 manufactured by Hitachi, Ltd.). And measured.

  The thickness of the film substrate was measured using a film thickness meter (Digital Dial Gauge DG-205 manufactured by Peacock).

(3) Presence / absence of pressure bonding of conductive film roll The conductive film was unwound from the conductive film roll, and confirmed by observing the roll surface.

When the conductive film roll of Example 1 was rewound and the roll surface was observed, no peeling noise was produced during the rewinding, and the surface of the transparent conductor layer was uniform. That is, the pressure bonding of the conductive film was not recognized.
(Comparative Example 1)
As Comparative Example 1, a conductive film roll was produced in the same manner as in Example 1 except that the copper oxide layer was not formed.

  When this conductive film roll was rewound and the roll surface was observed, peeling sound was generated during rewinding, and numerous scratches were generated on the surface of the transparent conductor layer, and the pressure bonding of the conductive film was observed. .

  Therefore, in the production method of the present invention, the film substrate on which the first laminate including the copper oxide layer is formed is supplied to the second film-forming roll without being wound into a roll, and the film substrate It was found that if the second laminate was formed on the side where the one laminate was not formed, high quality could be maintained without the adjacent films being pressed.

  The conductive film roll obtained by the manufacturing method according to the present invention is preferably used for a touch sensor of a capacitance type or the like, in which the drawn conductive film is cut into a display size.

DESCRIPTION OF SYMBOLS 1 Sputtering apparatus 10 Chamber 11, 22 Holding part 12 Guide roll 13, 18 Film-forming roll 14, 15, 16, 19, 20 Target material 17a, 17b, 17c, 17d Guide roll 21 Transfer chamber 23, 24, 25, 26, 27, 28 Processing chamber 30 Initial roll 31 Roll 40 Conductive film roll 41 Conductive film 42 Film substrate 43 Transparent conductor layer 44 Metal layer 45 Transparent conductor layer 46 Metal layer 47 Metal oxide film layer

Claims (4)

A film substrate;
A first transparent conductor layer formed on the first surface side of the film substrate;
A first metal layer formed on the first transparent conductor layer;
A first metal oxide film layer formed on the first metal layer;
A second transparent conductor layer formed on the second surface side of the film substrate;
A second metal layer formed on the second transparent conductor layer;
A conductive film comprising:
The first metal layer is made of at least one material selected from the group consisting of silver, copper, aluminum, copper alloy, silver alloy,
The first metal oxide film layer is made of an oxide of a metal constituting the first metal layer,
The electroconductive film whose surface resistance value of a said 1st transparent conductor layer and a said 2nd transparent conductor layer is 500 ohms / square or less.   The conductive film according to claim 1, wherein a second metal oxide film layer is further formed on the second metal layer.   The conductive film according to claim 1 or 2, wherein the second metal oxide film layer is made of an oxide of a metal constituting the second metal layer.   The electroconductive film roll formed by winding the electroconductive film as described in any one of Claims 1 thru | or 3 in roll shape.

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