JP2019032687A - Input device - Google Patents

Abstract

To provide an input device capable of suppressing a cost increase without an adverse effect to a detection area when an element to suppress noises is provided.SOLUTION: An input device according to an aspect of the present invention includes: a plurality of electrode parts provided at a detection area of a substrate; and a wiring part which is electrically connected to the plurality of electrode parts and extends outwardly relative to the detection area. The input device further includes a low-pass filter that includes a resistance part and a capacitance part. In the low-pass filter, the resistance part is provided in the halfway of the wiring part, and the capacitance part is provided between the wiring part and a ground part.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an input device, and more particularly to an input device including a touch sensor that detects a position where a finger or the like approaches.

  A touch panel often used as an input device includes a touch sensor that detects a position where a finger or the like approaches a detection area (hereinafter, the approach includes contact). For example, a mutual capacitive touch panel has a drive electrode and an output electrode, and a drive pulse is applied to the drive electrode to detect a change in capacitance due to the approach of a finger or the like with the output electrode. doing. In the touch panel, since the position is detected by a change in capacitance, if noise is mixed in the electrode and the wiring that is electrically connected to the electrode, it may cause a false detection.

  Patent Document 1 discloses a touch screen that reduces the influence of a high-frequency interference signal. In this touch screen, a transparent conductor resistor is inserted into the metal trace path of the touch panel to form a low-pass filter.

  Patent Document 2 discloses a capacitance detection circuit that realizes low noise characteristics without increasing the circuit scale and power consumption and enables accurate capacitance detection with a high S / N ratio. This capacitance detection circuit detects a continuous-time CV conversion circuit that converts a capacitance change of a capacitive touch sensor included in a touch panel into a voltage signal, and an output signal from the continuous-time CV conversion circuit using a synchronous detection signal. A synchronous detection circuit, a low-pass filter circuit that limits the band of an output signal from the synchronous detection circuit, and a control unit that generates a synchronous detection signal are provided.

  Patent Document 3 discloses a capacitance sensor that suppresses the influence of stray electromagnetic radiation from the outside, such as a display device near the sensor. In this capacitance sensor, the passive circuit element is integrated with the capacitance sensor.

JP 2008-310818 A Japanese Patent Application Laid-Open No. 2015-075984 Special table 2013-525918 gazette

  In input devices such as touch panels, when connecting element elements such as resistors and capacitors for noise suppression to the wiring, make sure that the area of the detection area, such as the installation location and size of the element elements, is not affected. Is desired. It is also desirable to avoid layout restrictions due to the provision of element elements for noise suppression and increase in cost due to an increase in the number of manufacturing steps.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an input device capable of suppressing layout restrictions and cost increase without affecting the detection region when providing element elements for noise suppression.

  In order to solve the above problems, one embodiment of the present invention provides an input including a plurality of electrode portions provided in a detection region of a base material and a wiring portion that is electrically connected to the plurality of electrode portions and extends to the outside of the detection region. The apparatus includes a low-pass filter having a resistance portion and a capacitance portion. The low-pass filter has a resistance portion provided in the middle of the wiring portion, and a capacitance portion provided between the wiring portion and the ground portion.

  According to such a configuration, in the input device including the low-pass filter configured by the resistance unit and the capacitance unit, the resistance unit is provided in the middle of the wiring unit so that a part of the wiring unit is used as the resistance unit. Can do. Here, the capacitance portion is disposed on the downstream side of the resistance portion as viewed from the electrode portion. For example, the capacitor portion is provided between a resistance portion provided in the middle of the wiring portion and an end portion (such as a pad portion) of the wiring portion.

  In the input device, the wiring portion has a stacked structure including a first wiring layer formed of a light-transmitting conductive material and a second wiring layer formed of a metal material, and the resistance portion includes a first wiring layer. The wiring layer may be provided and the second wiring layer may not be provided. Thereby, the resistance of the wiring part is reduced by the laminated structure of the first wiring layer and the second wiring layer, and the resistance part is not provided with the second wiring layer in the laminated structure of the wiring part. The resistance is higher than other parts. Moreover, since the resistance part is provided with the 1st wiring layer contained in a wiring part, it is comprised as a part of wiring part.

  In the input device, the resistance portion may be provided in a portion where the line width is narrowed in a part of the wiring portion. As a result, by reducing the line width in a part of the wiring part, it is possible to configure a resistance part having a higher resistance than in other parts of the wiring part.

  In the above input device, the wiring portion and the ground portion may be juxtaposed in a plan view of the base material, and a dielectric layer constituting the capacitor portion may be provided so as to cover the wiring portion and the ground portion. Thus, when the wiring part and the installation part are juxtaposed on the base material, the capacitor part can be easily configured by providing a dielectric layer between the wiring part and the installation part. it can. In this case, when the wiring part and the installation part are provided in the same layer, it is easier to configure the capacitor part.

  The input device may include a plurality of wiring units and a plurality of grounding units, and each of the plurality of wiring units and each of the plurality of grounding units may be alternately arranged in a plan view of the substrate. . As a result, a capacitor portion is formed between each of the plurality of wiring portions.

  In the above input device, the wiring portion and the ground portion may be provided in different layers, and a dielectric layer constituting the capacitor portion may be provided in a layer between the wiring portion and the ground portion. As a result, a capacitor portion having a laminated structure in which a dielectric layer is sandwiched between the wiring portion and the ground portion is formed. In this case, a plurality of wiring portions may be juxtaposed in a plan view of the substrate, and a dielectric layer may be provided so as to cover the plurality of wiring portions.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the input device which can suppress the restrictions of a layout and a cost increase, without affecting a detection area in providing the element for noise suppression.

(A) And (b) is a figure which illustrates the input device which concerns on this embodiment. It is a schematic diagram which shows the usage example of the input device which concerns on this embodiment. It is a schematic plan view which shows the example of arrangement | positioning of a low-pass filter. It is a schematic plan view which shows the example (the 1) of a resistance part. (A) And (b) is a schematic diagram which shows the example (the 2) of a resistance part. FIG. 6 is a schematic cross-sectional view illustrating an example (part 1) of a capacitor portion. (A) And (b) is a schematic diagram which illustrates the example (the 2) of a capacity | capacitance part. (A) And (b) is a schematic diagram which illustrates the example (the 3) of a capacity | capacitance part. FIG. 6 is a schematic plan view illustrating an example (part 4) of a capacitor. FIG. 10 is a schematic plan view illustrating an example (No. 5) of a capacitor unit.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the same members are denoted by the same reference numerals, and the description of the members once described is omitted as appropriate.

(Configuration of input device)
1A and 1B are diagrams illustrating an input device according to the present embodiment, where FIG. 1A is a plan view and FIG. 1B is a circuit diagram illustrating an example of a low-pass filter.
FIG. 2 is a schematic diagram illustrating an example of use of the input device according to the present embodiment.

  As shown to Fig.1 (a), the input device 1 which concerns on this embodiment is a touch panel provided with the capacitive touch sensor, for example. The touch sensor performs position detection based on a change in capacitance when a finger or the like approaches the detection region S. The input device 1 according to the present embodiment includes a first electrode 11 and a second electrode 12 provided in the detection region S of the base material 10. The base material 10 is formed of a light-transmitting flexible film such as PET (Polyethylene Terephthalate) or COP (cycloolefin polymer), a hard light-transmitting plate material such as acrylic resin or polycarbonate resin, or a glass plate. .

  The first electrode 11 extends in the X direction along the surface of the substrate 10, and the second electrode 12 extends in the Y direction perpendicular to the X direction along the surface of the substrate 10. The first electrode 11 and the second electrode 12 are insulated from each other. In the present embodiment, a plurality of first electrodes 11 are arranged at a predetermined pitch in the Y direction, and a plurality of second electrodes 12 are arranged at a predetermined pitch in the X direction.

  Although there are various electrode patterns constituting the first electrode 11 and the second electrode 12, in the present embodiment, each of the first electrode 11 and the second electrode 12 has a plurality of island-shaped electrode portions. Each island-shaped electrode part has a shape close to, for example, a rhombus.

  A lead wiring 11 a is connected to each of the plurality of first electrodes 11 as a wiring portion that is led out of the detection region S. In addition, a lead wiring 12 a is connected to each of the plurality of second electrodes 12 as a wiring portion that is led out of the detection region S. That is, the plurality of first electrodes 11 and the lead wiring 11a are electrically connected, and the plurality of second electrodes 12 and the lead wiring 12a are electrically connected.

  In the capacitive touch sensor, a change in current flowing through each of the lead wires 11a and 12a is detected by a detection circuit (not shown). That is, when a finger is brought close to the detection region S in a state where a predetermined potential is applied to the first electrode 11 and the second electrode 12, capacitance between each of the first electrode 11 and the second electrode 12 and the finger. Occurs. By detecting the potential drop caused by this capacitance, the X and Y coordinates in the detection region S where the finger approaches are determined.

  In the input device 1 according to the present embodiment, the resistance portion 21 is provided in the middle of the lead-out wirings 11a and 12a that are wiring portions. The resistance portion 21 is a portion having a higher resistance than the lead wires 11a and 12a.

Furthermore, in the input device 1 according to the present embodiment, the capacitor portion 22 is provided between the lead wires 11a and 12a and the ground portion (grounded wire) 15. The resistor portion 21 and the capacitor portion 22 constitute a low-pass filter 20 shown in FIG. Since the low-pass filter 20 is formed in the wiring portion, the capacitance portion 22 is viewed from the electrodes (first electrode 11 and second electrode 12) rather than the resistance portion 21 provided in the middle of the wiring portion (leading wires 11a and 12a). It is provided between the grounding unit 15 on the downstream side.
The low-pass filter 20 is preferably provided outside the detection region S in the base material 10. Thereby, the influence which it has on the area and translucency of the detection region S can be suppressed.

  By providing the low-pass filter 20 in the lead wires 11a and 12a, noise (high frequency component) mixed in the lead wires 11a and 12a can be removed, and erroneous detection due to noise can be suppressed.

  As shown in FIG. 2, the touch panel which is the input device 1 is attached on a display device 100 such as a liquid crystal. Therefore, the detection area S of the touch panel has a position detection function and has translucency so that an image displayed by the display device 100 can be transmitted. For this reason, a light-transmitting conductive material (ITO (Indium Tin Oxide), a conductive nano material, a metal material formed in a mesh shape, etc.) is used for the first electrode 11 and the second electrode 12.

  On the other hand, the lead wires 11a and 12a are drawn to the outside of the detection region S. Since the translucency is not required outside the detection region S, a material having a lower specific resistance than the first electrode 11 and the second electrode 12 can be used in a portion outside the detection region S of the lead-out wirings 11a and 12a.

  In the present embodiment, the resistance portion 21 is configured by providing a portion having a higher resistance than the lead wires 11a and 12a in the middle of the lead wires 11a and 12a. Thereby, a part of wiring part (leading wiring 11a and 12a) can be utilized as the resistance part 21. FIG. Further, by providing the low-pass filter 20 in the lead-out wirings 11a and 12a outside the detection region S, the influence (area reduction) on the detection region S in providing the noise suppression elements (resistor 21 and capacitor 22). And wiring layout restrictions).

FIG. 3 is a schematic plan view illustrating an arrangement example of the low-pass filter.
As shown in FIG. 3, the low-pass filter 20 is provided in the middle of the lead wires 11a and 12a outside the detection region S. In this example, the grounding portion 15 is provided so as to be adjacent to each of the plurality of lead wires 11a and 12a. That is, each of the plurality of lead wires 11 a and 12 a and each of the plurality of grounding portions 15 are alternately arranged in a plan view of the base material 10.

  A dielectric layer 220 is provided between the lead wires 11 a and 12 a and the ground portion 15, whereby a capacitor portion is provided between each of the lead wires 11 a and 12 a and the adjacent ground portion 15. 22 is configured. In the example shown in FIG. 3, the capacitor portion 22 is disposed at a location proximal to the pad portion P provided at the end of each of the lead wires 11a and 12a, and the lead wire 11a and the ground portion 15 or the lead wire 12a and the ground. A dielectric layer 220 is provided so as to cover the portion 15, and the capacitor portion 22 is configured. Further, the resistance portion 21 is provided in the middle of each of the lead wires 11a and 12a. The resistance portion 21 is disposed at a location farther from the pad portion P than the capacitance portion 22.

  Since the resistance portion 21 and the capacitance portion 22 are provided outside the detection region S, the low-pass filter 20 can be configured without affecting the area of the detection region S. In addition, since part of the lead wires 11a and 12a is used as the resistor portion 21, an increase in the installation area can be suppressed as compared with the case where the resistor portion 21 is separately provided, and the manufacturing process of the lead wires 11a and 12a can be suppressed. The resistor portion 21 can be formed by being incorporated.

FIG. 4 is a schematic plan view showing an example (part 1) of the resistance portion.
The resistance portion 21 shown in FIG. 4 is provided in a portion where the line width is narrowed in a part of the lead wires 11a and 12a which are wiring portions. The portion where the line width is narrowed has a higher resistance than the non-thinned portion. This part is used as the resistance part 21. Thereby, the resistance part 21 can be formed in the same process as the process of forming the extraction wirings 11a and 12a. Moreover, since the resistance part 21 is provided in the middle of the lead-out wiring 11a and 12a, the increase in installation area can be suppressed compared with the case where the resistance part 21 is formed separately.

  Further, when the lead-out wirings 11a and 12a are formed by, for example, photolithography and etching, the resistance portion 21 can be formed by narrowing the line width by setting an exposure pattern, which is a manufacturing process for forming the resistance portion 21. No addition is necessary.

  As an example, the line widths of the lead wires 11a and 12a are, for example, about 5 μm to 50 μm, whereas the line width of the resistance portion 21 is about 1/50 to 1/2 (for example, about 1 μm to 25 μm). The resistance value of the resistance portion 21 can be set by the material, line width, and length of the lead wires 11a and 12a.

FIGS. 5A and 5B are schematic views showing an example (part 2) of the resistance portion, where FIG. 5A is a plan view and FIG. 5B is a cross-sectional view taken along line AA of FIG.
In the resistance portion 21 shown in FIG. 5, the layer structure is different from the lead-out wirings 11a and 12a which are wiring portions.
That is, the lead-out wirings 11a and 12a have a laminated structure including a first wiring layer L1 formed of a light-transmitting conductive material and a second wiring layer L2 formed of a metal material. The first wiring layer L1 formed of a light-transmitting conductive material extends from the same electrode layer of the light-transmitting conductive material as the first electrode 11 and the second electrode 12, for example. In the lead-out wirings 11a and 12a, a second wiring layer L2 made of a metal material is laminated on the first wiring layer L1 in order to reduce the resistance outside the detection region S.

  The resistance portion 21 has a structure including the first wiring layer L1 and not including the second wiring layer L2. In the example shown in FIG. 5, the resistance portion 21 has a structure in which the second wiring layer L <b> 2 having a laminated structure is not provided in part of the lead-out wirings 11 a and 12 a. For example, the resistance portion 21 has a structure including only the first wiring layer L1.

  Thereby, the resistance part 21 is comprised in the part which is not provided with the 2nd wiring layer L2 in a part of extraction wiring 11a and 12a. For example, in order to form the resistance portion 21, after forming the laminated structure (first wiring layer L1 and second wiring layer L2) of the lead wires 11a and 12a, which are wiring portions, a part of the second wiring in the laminated structure is formed. Layer L2 is removed. The portion from which the second wiring layer L2 has been removed becomes the resistance portion 21.

  The resistance unit 21 may have a structure including the first wiring layer L1 and another layer (not shown). For example, a structure in which a wiring layer using a material having higher resistance than the second wiring layer L2 and the first wiring layer L1 are stacked in a part of the lead wirings 11a and 12a may be used. In any structure, the resistance portion 21 may be configured by providing a portion having a higher resistance than the stacked structure of the lead wires 11a and 12a.

  In the resistor portion 21 shown in any of the examples of FIGS. 4 and 5, a part of the lead-out wirings 11 a and 12 a that are wiring portions is configured as the resistor portion 21, so that it is not necessary to provide a separate resistor portion 21. Thereby, in providing the element element for noise suppression, the area of the detection region S is not affected, and layout restrictions and cost increase can be suppressed.

FIG. 6 is a schematic cross-sectional view illustrating an example (part 1) of the capacitor portion.
FIG. 6 shows a cross-sectional structure of the capacitor 22 shown in FIG.
In the capacitor portion 22, the wiring portion (leading wires 11a and 12a) and the grounding portion 15 are juxtaposed in the same layer on the base material 10, and specifically, a plurality of wiring portions (leading wires 11a and 12a) and A plurality of grounding portions 15 are alternately arranged. A dielectric layer 220 is provided so as to cover between and above these wiring portions and the ground portion 15. As the dielectric layer 220, polyvinylidene fluoride or the like is used. As a result, the capacitor portion 22 is formed between the wiring portions adjacent to each other (the lead wires 11 a and 12 a) and the ground portion 15. In this example, the capacitance can be set according to the distance between the wiring portions adjacent to each other (leading wires 11 a and 12 a) and the ground portion 15 and the dielectric constant of the material constituting the dielectric layer 220.

FIGS. 7A and 7B are schematic views illustrating an example (part 2) of the capacitor portion, where FIG. 7A is a plan view and FIG. 7B is a cross-sectional view taken along line BB in FIG. .
In the capacitor portion 22 shown in FIG. 7, wiring portions (leading wires 11 a and 12 a) and a ground portion 15 are provided in different layers, and a dielectric layer 220 is provided between the wiring portion and the ground portion 15. Yes. For example, the wiring portion (leading wires 11a and 12a) and the grounding portion 15 are provided in different layers, and a wide pattern portion WP1 is provided in a part of the wiring portions (leading wires 11a and 12a). In addition, a wide pattern portion WP2 is provided in a part of the ground portion 15, and the pattern portion WP2 is disposed so as to face the pattern portion WP1. A dielectric layer 220 is provided between the pattern portion WP1 and the pattern portion WP2. The capacitor portion 22 is configured by this laminated structure.

  In the capacitor portion 22 shown in FIG. 7, in addition to selecting the material of the dielectric layer 220, the capacitance value can be set by the size (area in plan view) of the pattern portion WP1 and the pattern portion WP2.

FIGS. 8A and 8B are schematic views illustrating an example (part 3) of the capacitor portion, where FIG. 8A is a plan view and FIG. 8B is a cross-sectional view taken along the line CC of FIG. .
8 is provided with a dielectric layer 220 between the wiring portions (lead wirings 11a and 12a) provided in different layers and the grounding portion 15, similarly to the capacitive portion 22 shown in FIG. It is composed of that. On the other hand, in the capacitor portion 22 shown in FIG. 8, a plurality of lead wires 11a and 12a are provided in parallel, and one pattern portion WP2 is opposed to these wires (the plurality of lead wires 11a and 12a). Is provided. Accordingly, the dielectric layer 220 is provided between the plurality of lead wires 11a and 12a and one pattern portion WP2, thereby forming the capacitor portion 22.

  In the capacitor unit 22 shown in FIG. 8, in configuring the capacitor unit 22 corresponding to each of the plurality of lead-out wirings 11a and 12a, one pattern unit WP2 disposed collectively on the plurality of lead-out wirings 11a and 12a. It becomes possible to respond by forming.

FIG. 9 is a schematic plan view illustrating an example (part 4) of the capacitor unit.
9 has a configuration in which one grounding portion 15 is shared by two wiring portions (leading wires 11a and 12a) in order to form the capacitive portion 22. That is, the capacitor unit 22 is configured between two adjacent wiring units (lead wirings 11a and 12a) and one ground unit 15 disposed therebetween.

  In the example shown in FIG. 9, the wiring portion (leading wires 11 a and 12 a) and the grounding portion 15 are juxtaposed in a plan view of the base material 10, and between two adjacent wiring portions (leading wires 11 a and 12 a). One grounding portion 15 is provided. A dielectric layer 220 is provided between the two wiring parts (lead wirings 11a and 12a) and one grounding part 15. For example, the dielectric layer 220 is provided so as to cover the two wiring portions (leading wires 11a and 12a) and one grounding portion 15. As a result, two capacitor portions 22 are formed corresponding to the two wiring portions (leading wires 11a and 12a). The dielectric layer 220 may be provided so as to collectively cover the plurality of wiring portions (leading wires 11a and 12a) and the plurality of grounding portions 15.

  One grounding part 15 is shared by two wiring parts (leading lines 11a and 12a), so that each wiring part (leading lines 11a and 12a) is provided with a grounding part 15 on a one-to-one basis. Thus, the number of grounding portions 15 can be reduced.

FIG. 10 is a schematic plan view illustrating an example (part 5) of the capacitor unit.
In the example shown in FIG. 10, the capacitor 22 is provided only in the lead-out wiring 12a among the lead-out wirings 11a and 12a. The lead wire 11 a is electrically connected to the first electrode 11, and the lead wire 12 a is electrically connected to the second electrode 12. For example, in the mutual-capacitance detection type input device 1 in which the first electrode 11 is a drive electrode and the second electrode 12 is a reception electrode, the resistance portion 21 is provided in the lead-out wiring 12a that is electrically connected to the second electrode 12 that is the reception electrode. The capacitor portion 22 may be configured by providing the ground line 15 between the two lead lines 12 a and providing the dielectric layer 220 between the lead line 12 a and the ground line 15.

  As described above, in the example in which the capacitor portion 22 is formed only in the lead-out wiring 12a, it is not necessary to provide the resistance portion 21 and the dielectric layer 220 in the lead-out wiring 11a connected to the first electrode 11, and therefore adjacent to each other. There is no need to provide the ground portion 15 between the two lead wires 11a. For this reason, it is possible to reduce the size of the wiring portion.

  As described above, according to the present embodiment, in providing the element elements (resistor 21 and capacitor 22) for noise suppression, the area of the detection region S and the layout of the wiring and the like are not affected. be able to. Further, by providing the resistance portion 21 in a part of the lead-out wirings 11a and 12a, it is possible to suppress an increase in manufacturing man-hours and an increase in cost compared to the case where the resistance portion 21 is separately provided.

  Although the present embodiment has been described above, the present invention is not limited to these examples. For example, the arrangement, material, shape, and the like of the resistance unit 21 and the capacitor unit 22 are examples, and are not limited thereto. In addition, those in which those skilled in the art appropriately added, deleted, and changed the design of the above-described embodiments, and combinations of the features of each embodiment as appropriate also include the gist of the present invention. As long as they are within the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Input device 10 ... Base material 11 ... 1st electrode 11a ... Lead wire 12 ... 2nd electrode 12a ... Lead wire 15 ... Grounding part 20 ... Low pass filter 21 ... Resistance part 22 ... Capacitance part 100 ... Display apparatus 220 ... Dielectric Layer L1 ... first wiring layer L2 ... second wiring layer P ... pad portion S ... detection region WP1 ... pattern portion WP2 ... pattern portion

Claims (8)

An input device comprising: a plurality of electrode portions provided in a detection region of a substrate; and a wiring portion that is electrically connected to the plurality of electrode portions and extends to the outside of the detection region,
A low-pass filter having a resistance portion and a capacitance portion,
The input device according to claim 1, wherein the resistance portion is provided in the middle of the wiring portion, and the capacitance portion is provided between the wiring portion and a ground portion. The wiring portion has a laminated structure including a first wiring layer formed of a translucent conductive material and a second wiring layer formed of a metal material,
The input device according to claim 1, wherein the resistance unit has a structure including the first wiring layer and not including the second wiring layer.   The input device according to claim 1, wherein the resistance portion is provided in a portion where a line width is narrowed in a part of the wiring portion. The wiring portion and the grounding portion are juxtaposed in a plan view of the base material,
4. The input device according to claim 1, wherein a dielectric layer constituting the capacitor unit is provided so as to cover the wiring unit and the ground unit. 5.   The input device according to claim 4, wherein the wiring portion and the grounding portion are provided in the same layer. A plurality of the wiring portions, and a plurality of the grounding portions,
6. The input device according to claim 4, wherein each of the plurality of wiring portions and each of the plurality of grounding portions are alternately arranged in a plan view of the base material. The wiring part and the grounding part are provided in different layers,
A dielectric layer constituting the capacitor portion is provided in a layer between the wiring portion and the ground portion,
The input device according to any one of claims 1 to 3. The input device according to claim 7, wherein a plurality of the wiring portions are juxtaposed in a plan view of the base material, and the dielectric layer is provided so as to cover the plurality of wiring portions.