JP2019021851A - Board attachment structure to electronic equipment enclosure - Google Patents

Board attachment structure to electronic equipment enclosure Download PDF

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JP2019021851A
JP2019021851A JP2017141408A JP2017141408A JP2019021851A JP 2019021851 A JP2019021851 A JP 2019021851A JP 2017141408 A JP2017141408 A JP 2017141408A JP 2017141408 A JP2017141408 A JP 2017141408A JP 2019021851 A JP2019021851 A JP 2019021851A
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electronic device
substrate
device casing
board
face cover
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輝男 垣谷
Teruo Kakiya
輝男 垣谷
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Contec Co Ltd
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Contec Co Ltd
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Abstract

To provide a board attachment structure to an electronic equipment enclosure capable of facilitating positioning of the board to the electronic equipment enclosure, when inserting the board into the electronic equipment enclosure.SOLUTION: In a board attachment structure to an electronic equipment enclosure 10, the electronic equipment enclosure 10 is provided with a guide rail 21 molded integrally with the inner wall surface of a wall part, and elongating in an insertable direction of a board 90, and includes a face cover 30 insertable from an opening end 11A of the electronic equipment enclosure 10 while holding the board 90 from a direction orthogonal to the insertable direction of the board 90. A guided body 33 to be guided by the guide rail 21 is molded integrally with the face cover 30. The guided body 33 has a board holding part 33a molded integrally at one side of the guided body 33, and holding from the insertion start end to the insertion terminal of the board 90 to the electronic equipment enclosure 10, and a rib 33b molded integrally at the other side of the guided body 33, and being fitted into the guide rail 21 slidably.SELECTED DRAWING: Figure 1

Description

本発明は、一端が開口しており、その開口端から基板が挿脱可能であり、挿入された基板が取り付けられる電子機器筐体への基板取付構造に関するものである。   The present invention relates to a substrate mounting structure to an electronic device casing to which one end is open and a substrate can be inserted and removed from the open end, and the inserted substrate is mounted.

従来、この種の電子機器筐体においては、特許文献1に示すように、拡張ボード等の基板が電子機器筐体内のガイドレールの溝に案内されながら挿入されることにより電子機器筐体内に収納される。当該基板は、電子機器筐体への挿入始端側にコネクタが固着されているとともに、電子機器筐体への挿入終端側に前面板(フェイスカバー)が固着されている。当該基板に固着されている板状のフェイスカバーは、基板が電子機器筐体内に収納されることで電子機器筐体の開口を塞ぐように構成されている。   Conventionally, in this type of electronic device casing, as shown in Patent Document 1, a board such as an extension board is inserted into the electronic device casing while being guided by a guide rail groove in the electronic device casing. Is done. The board has a connector fixed to the insertion start end side to the electronic device casing and a front plate (face cover) fixed to the insertion end side to the electronic device casing. The plate-like face cover fixed to the substrate is configured to close the opening of the electronic device casing when the substrate is accommodated in the electronic device casing.

また、上記基板には、その電子機器筐体への挿入終端側に他のモジュールを接続するためのコネクタ部を有するものがある。そして、当該コネクタ部は上記フェイスカバーに支持される。さらに、上記電子機器筐体には振動や衝撃等が加わる場合があり、そのような場合でも基板が電子機器筐体内で充分に保持されるように、上記フェイスカバーには電子機器筐体に係止可能な係止機構が設けられる。このように、フェイスカバーによりコネクタ部を支持し、或いは、フェイスカバーに係止機構を設けるためには、フェイスカバー自体をボックス状に(基板の電子機器筐体への挿入終端部を覆うように)形成する必要がある。   Some of the substrates have a connector portion for connecting another module on the insertion end side of the electronic device casing. The connector portion is supported by the face cover. Furthermore, vibrations and shocks may be applied to the electronic device casing. Even in such a case, the face cover is attached to the electronic device casing so that the substrate is sufficiently held in the electronic device casing. A locking mechanism that can be stopped is provided. As described above, in order to support the connector portion by the face cover or to provide a locking mechanism for the face cover, the face cover itself is formed in a box shape (so as to cover the insertion end portion of the board to the electronic device casing). ) Need to be formed.

実開昭60−103888号公報Japanese Utility Model Publication No. 60-103888

しかしながら、上記フェイスカバーをボックス状に形成すると、基板の電子機器筐体への挿入終端側がフェイスカバーによって覆われるため、電子機器筐体においてフェイスカバーが取り付けられる部分、すなわち、電子機器筐体の開口端側部分に、基板を案内するためのガイドレールを設けることができない。そのため、基板を電子機器筐体の奥側(筐体内部側)まで挿入しないと、基板が電子機器筐体に対して位置決めされないという問題があった。   However, when the face cover is formed in a box shape, the terminal end of the substrate inserted into the electronic device casing is covered with the face cover, so that the portion where the face cover is attached in the electronic device casing, that is, the opening of the electronic device casing A guide rail for guiding the substrate cannot be provided at the end portion. Therefore, there is a problem that the substrate is not positioned with respect to the electronic device casing unless the substrate is inserted to the back side (inside the housing) of the electronic device casing.

そこで、本発明は、電子機器筐体への基板の挿入時に、電子機器筐体に対する基板の位置決めを容易に行うことが可能な電子機器筐体への基板取付構造を提供することを目的とする。   Accordingly, an object of the present invention is to provide a structure for mounting a substrate on an electronic device casing that can easily position the substrate with respect to the electronic device casing when the substrate is inserted into the electronic device casing. .

本発明の解決しようとする課題は以上であり、次にこの課題を解決するための手段を説明する。
即ち、本発明の電子機器筐体への基板取付構造は、一端が開口しており、その開口端から基板が挿脱可能であり、挿入された基板が取り付けられる電子機器筐体への基板取付構造であって、前記電子機器筐体には、その壁部の内壁面に一体に成形され、前記基板の挿脱方向に延伸するガイド溝が前記開口端側から設けられ、前記基板の挿脱方向と直交する方向から前記基板を保持した状態で前記電子機器筐体の開口端から挿脱される基板保持枠を備え、前記基板保持枠には、前記ガイド溝に案内される被ガイド体が一体に成形され、前記被ガイド体は、前記被ガイド体の一方側に一体に成形され、前記基板の前記電子機器筐体への挿入始端から挿入終端までを保持する基板保持部と、前記被ガイド体の他方側に一体に成形され、前記ガイド溝に摺動可能に嵌め込まれるリブ部と、を有するものである。
上記構成では、電子機器筐体の開口端側のガイド溝から被ガイド枠のリブ部を嵌め込んで摺動させることができる。
The problem to be solved by the present invention is as described above. Next, means for solving the problem will be described.
That is, the substrate mounting structure to the electronic device casing of the present invention has one end opened, and the substrate can be inserted and removed from the opening end, and the substrate mounting to the electronic device casing to which the inserted substrate is mounted The electronic device casing has a guide groove formed integrally with an inner wall surface of the wall portion and extending in the insertion / removal direction of the substrate from the opening end side. A substrate holding frame that is inserted and removed from the opening end of the electronic device casing in a state where the substrate is held from a direction orthogonal to the direction, and the substrate holding frame has a guided body guided by the guide groove. The substrate body is integrally formed, the guided body is integrally formed on one side of the guided body, and holds the substrate from the insertion start end to the insertion end of the electronic device casing; The guide groove is formed integrally with the other side of the guide body. And the rib portion to be fitted slidably and has a.
In the above configuration, the rib portion of the guided frame can be fitted and slid from the guide groove on the opening end side of the electronic device casing.

本発明の電子機器筐体への基板取付構造は、前記リブ部は、前記基板保持部において保持される基板の前記電子機器筐体への挿入始端から挿入終端に沿って形成されるものである。
上記構成では、基板の電子機器筐体への挿入始端から挿入終端までが被ガイド体を介してガイド溝に案内される。
In the substrate mounting structure to the electronic device casing of the present invention, the rib portion is formed from the insertion start end of the substrate held by the substrate holding portion to the electronic device casing from the insertion end. .
In the above configuration, the substrate from the insertion start end to the insertion end to the electronic device casing is guided to the guide groove via the guided body.

本発明の電子機器筐体への基板取付構造によれば、電子機器筐体の開口端側からガイド溝を延設して、被ガイド体のリブ部を電子機器筐体の開口端側のガイド溝から嵌め込んで摺動可能としたことから、電子機器筐体への基板の挿入時に、電子機器筐体に対する基板の位置決めを容易に行うことができる。また、電子機器筐体への基板の挿入時に、基板が電子機器筐体に当たることがないため、基板に実装されている部品や電子機器筐体自体を傷付けたり破損させることがない。   According to the substrate mounting structure to the electronic device casing of the present invention, the guide groove is extended from the opening end side of the electronic device casing, and the rib portion of the guided body is guided to the opening end side of the electronic device casing. Since it can be slid by fitting from the groove, the substrate can be easily positioned with respect to the electronic device casing when the substrate is inserted into the electronic device casing. Further, since the substrate does not hit the electronic device case when the substrate is inserted into the electronic device case, the components mounted on the substrate and the electronic device case itself are not damaged or damaged.

本発明に係る電子機器筐体への基板取付構造を示す斜視図である。It is a perspective view which shows the board | substrate attachment structure to the electronic device housing | casing which concerns on this invention. 本発明に係る電子機器筐体への基板取付構造において基板を電子機器筐体に挿入する場合の斜視図である。It is a perspective view at the time of inserting a board | substrate in an electronic device housing | casing in the board | substrate attachment structure to the electronic device housing | casing which concerns on this invention. 本発明に係る電子機器筐体の正面図である。It is a front view of the electronic device housing | casing which concerns on this invention. 本発明に係る基板保持枠の図である。It is a figure of the board | substrate holding frame which concerns on this invention. 本発明に係る電子機器筐体に対して基板保持枠を挿入する場合の図である。It is a figure at the time of inserting a board | substrate holding frame with respect to the electronic device housing | casing which concerns on this invention. 本発明に係る電子機器筐体への基板取付構造において固定補強材を用いた場合の斜視図である。It is a perspective view at the time of using a fixed reinforcing material in the board | substrate attachment structure to the electronic device housing | casing which concerns on this invention. 本発明に係る固定補強材の図である。It is a figure of the fixed reinforcement material which concerns on this invention.

本発明に係る電子機器筐体10への基板90の取付構造について説明する。
(電子機器筐体10)
図1から図3に示すように、電子機器筐体10は、前側端に開口部11を有する樹脂製の略矩形状の筐体であり、背面壁部12と、上側壁部13と、下側壁部14と、右側壁部15と、左側壁部16と、を有する。電子機器筐体10は、開口部11から拡張ボード等の基板90を挿入し、その内部に取り付けて収納する。電子機器筐体10は、電子機器筐体10を壁面に設置するための壁取付部17が背面壁部12に設けられ、壁取付部17にネジ等の固定部材(図示せず)を取り付けることで壁面に設置される。また、電子機器筐体10は、DINレール等の支持レール(図示せず)と係合可能な係合部材を背面壁部12に備え、当該係合部材を介して支持レールに着脱可能に支持されるように構成されている。電子機器筐体10は、開口部11に、複数の基板90(図1では4体の基板90)を挿脱するための複数の受け部20及びガイドレール21(「ガイド溝」の一例)と、基板90の挿入始端である前側端部91を受ける複数のコネクタ18と、を備える。
A structure for attaching the substrate 90 to the electronic device casing 10 according to the present invention will be described.
(Electronic device casing 10)
As shown in FIGS. 1 to 3, the electronic device housing 10 is a substantially rectangular housing made of resin having an opening 11 at the front end, and includes a back wall portion 12, an upper wall portion 13, and a lower wall portion. The side wall part 14, the right side wall part 15, and the left side wall part 16 are provided. The electronic device casing 10 is inserted and accommodated in a board 90 such as an expansion board inserted through the opening 11. In the electronic device housing 10, a wall mounting portion 17 for installing the electronic device housing 10 on a wall surface is provided on the back wall portion 12, and a fixing member (not shown) such as a screw is attached to the wall mounting portion 17. Installed on the wall. Further, the electronic device casing 10 includes an engagement member that can be engaged with a support rail (not shown) such as a DIN rail on the back wall portion 12 and is detachably supported on the support rail via the engagement member. It is configured to be. The electronic device housing 10 includes a plurality of receiving portions 20 and guide rails 21 (an example of “guide grooves”) for inserting / removing a plurality of substrates 90 (four substrates 90 in FIG. 1) in the opening 11. And a plurality of connectors 18 that receive a front end 91 that is an insertion start end of the substrate 90.

受け部20は、開口部11側の上側壁部13及び下側壁部14(「壁部」の一例)において互いに対向する上側内壁面13A及び下側内壁面14A(「内壁面」の一例)から正面視略凹形状に突出して形成される部分であり、上側内壁面13A及び下側内壁面14Aのそれぞれに一体に成形される。受け部20は、開口部11の上側及び下側の開口端11Aに沿って、並列に複数箇所(図1では上側内壁面13A及び下側内壁面14Aに各4箇所)形成されている。上側内壁面13Aの受け部20と下側内壁面14Aの受け部20とは、その凹み部分が互いに対向するように配置される。   The receiving portion 20 includes an upper inner wall surface 13A and a lower inner wall surface 14A (an example of an “inner wall surface”) that face each other in the upper wall portion 13 and the lower wall portion 14 (an example of a “wall portion”) on the opening 11 side. It is a part formed so as to protrude in a substantially concave shape when viewed from the front, and is formed integrally with each of the upper inner wall surface 13A and the lower inner wall surface 14A. The receiving portion 20 is formed at a plurality of locations in parallel along the upper and lower opening ends 11A of the opening portion 11 (four locations on the upper inner wall surface 13A and the lower inner wall surface 14A in FIG. 1). The receiving portion 20 of the upper inner wall surface 13A and the receiving portion 20 of the lower inner wall surface 14A are arranged so that the recessed portions thereof face each other.

ガイドレール21は、上側内壁面13A及び下側内壁面14Aにおいて溝状に成形される部分であり、上側内壁面13A及び下側内壁面の開口部11側から背面壁部12側に向けて延設される。ガイドレール21は、上側内壁面13A及び下側内壁面14Aに複数箇所(図1では上側内壁面13A及び下側内壁面14Aに各4箇所)形成され、互いに平行に配置されている。上側内壁面13Aのガイドレール21と下側内壁面14Aのガイドレール21とは、その溝状の凹み部分が互いに対向するように配置される。基板90は、対向する上側内壁面13Aのガイドレール21と下側内壁面14Aのガイドレール21との当該凹み部分の間において挿脱される。   The guide rail 21 is a portion formed into a groove shape on the upper inner wall surface 13A and the lower inner wall surface 14A, and extends from the opening 11 side of the upper inner wall surface 13A and the lower inner wall surface toward the rear wall portion 12 side. Established. A plurality of guide rails 21 are formed on the upper inner wall surface 13A and the lower inner wall surface 14A (in FIG. 1, four locations on each of the upper inner wall surface 13A and the lower inner wall surface 14A) and are arranged in parallel to each other. The guide rail 21 on the upper inner wall surface 13A and the guide rail 21 on the lower inner wall surface 14A are arranged so that their groove-shaped dents face each other. The board 90 is inserted / removed between the concave portions of the guide rail 21 on the upper inner wall surface 13A and the guide rail 21 on the lower inner wall surface 14A.

(フェイスカバー30)
図2及び図4に示すように、基板90は、前側端部91(電子機器筐体10への挿入始端)側と反対側の端部である後側端部92(電子機器筐体10への挿入終端)側からフェイスカバー30(「基板保持枠」の一例)によって保持された状態で電子機器筐体10に収納される。フェイスカバー30は、基板90を電子機器筐体10内で保持するための枠体であるとともに、基板90を電子機器筐体10の開口端11Aから挿脱するための枠体であり、本体31と、爪体32と、被ガイド体33と、から構成されている。
(Face cover 30)
As shown in FIGS. 2 and 4, the substrate 90 has a rear end portion 92 (to the electronic device casing 10) that is an end portion opposite to the front end portion 91 (starting end of insertion into the electronic device casing 10) side. Is inserted into the electronic device casing 10 while being held by the face cover 30 (an example of a “board holding frame”) from the side of the insertion end. The face cover 30 is a frame for holding the substrate 90 in the electronic device casing 10, and is a frame for inserting and removing the substrate 90 from the opening end 11 </ b> A of the electronic device casing 10. And a claw body 32 and a guided body 33.

本体31は、フェイスカバー30の主たる部分であり、樹脂製の長尺状の部材により構成される。本体31は、フェイスカバー30を電子機器筐体10に挿入した際に、電子機器筐体10の開口部11を塞ぐように、開口部11側の上側壁部13と下側壁部14との間に配置される。本体31は、基板90の後側端部92を支持するとともに、基板90の後側端部92側に設けられるピンコネクタ等のコネクタ部95を支持可能に構成されている。   The main body 31 is a main part of the face cover 30 and is constituted by a long member made of resin. The main body 31 is disposed between the upper wall portion 13 and the lower wall portion 14 on the opening 11 side so as to close the opening 11 of the electronic device housing 10 when the face cover 30 is inserted into the electronic device housing 10. Placed in. The main body 31 is configured to support the rear end portion 92 of the substrate 90 and to support a connector portion 95 such as a pin connector provided on the rear end portion 92 side of the substrate 90.

爪体32は、フェイスカバー30が電子機器筐体10に収納される際に、電子機器筐体10の受け部20に係止される部分である。爪体32は、本体31の長手方向の両端部に、本体31と一体に成形された樹脂製の部材により構成される。すなわち、爪体32は、フェイスカバー30の電子機器筐体10への挿入方向S(挿脱方向)と直交する方向の両端部に設けられている。   The claw body 32 is a portion that is locked to the receiving portion 20 of the electronic device casing 10 when the face cover 30 is housed in the electronic device casing 10. The claw body 32 is formed of a resin member formed integrally with the main body 31 at both ends in the longitudinal direction of the main body 31. In other words, the claw bodies 32 are provided at both ends of the face cover 30 in the direction orthogonal to the insertion direction S (insertion / removal direction) of the face cover 30 with respect to the electronic device casing 10.

爪体32は、その一端部側が自由端であり、且つその他端部側が本体31と一体に成形される固定端であるとともに、電子機器筐体10への挿入方向S側であって、固定端と自由端との間に折り返し部分が形成されている。具体的には、爪体32は、側面視略U字状に形成され、電子機器筐体10への挿入方向Sと反対方向に延設され、延設方向の先端が自由端である外側部材32aと、本体31に連結された固定端を有し、電子機器筐体10への挿入方向Sに延設される内側部材32bと、内側部材32bから外側部材32aへ折り返す部分である折り返し部材32cと、から構成される。外側部材32a、内側部材32b、折り返し部材32cの幅方向(電子機器筐体10への挿入方向Sと水平に直交する方向)の長さは、電子機器筐体10の受け部20の凹み部分の幅と略同程度の長さである。   The claw body 32 has a free end on one end side and a fixed end formed integrally with the main body 31 on the other end side, and is on the side S in the insertion direction S to the electronic device housing 10 and has a fixed end. And a folded portion is formed between the free ends. Specifically, the claw body 32 is formed in a substantially U shape in a side view, extends in a direction opposite to the insertion direction S to the electronic device housing 10, and an outer member whose distal end in the extending direction is a free end. 32a, an inner member 32b having a fixed end connected to the main body 31 and extending in the insertion direction S to the electronic device casing 10, and a folding member 32c that is a portion that is folded from the inner member 32b to the outer member 32a. And. The lengths of the outer member 32a, the inner member 32b, and the folding member 32c in the width direction (the direction perpendicular to the insertion direction S into the electronic device casing 10) are the lengths of the recesses of the receiving portion 20 of the electronic device casing 10. The length is approximately the same as the width.

爪体32は、フェイスカバー30(本体31)の中央側に近づく方向に弾性変形する。具体的には、爪体32は、外側部材32aの自由端側部分(外側部材32aの一端部)を押圧することで、外側部材32aが折り返し部材32cを支点に内側部材32bに近づく方向に弾性変形する。フェイスカバー30においては、本体31の両端部に設けられている爪体32を弾性変形させることにより、爪体32の外側部材32aの一端部同士の間隔が、電子機器筐体10の上側壁部13及び下側壁部14に設けられる受け部20同士の間隔より小さくなる。   The nail | claw body 32 is elastically deformed in the direction approaching the center side of the face cover 30 (main body 31). Specifically, the claw body 32 is elastic in a direction in which the outer member 32a approaches the inner member 32b with the folded member 32c as a fulcrum by pressing the free end side portion (one end portion of the outer member 32a) of the outer member 32a. Deform. In the face cover 30, the claw bodies 32 provided at both ends of the main body 31 are elastically deformed so that the distance between the one end portions of the outer member 32 a of the claw body 32 is the upper side wall portion of the electronic device casing 10. 13 and the interval between the receiving portions 20 provided on the lower wall portion 14.

爪体32は、外側部材32aの外側面の中央部に、凸状の係止部32dが外側部材32aと一体に成形されている。係止部32dは、フェイスカバー30が電子機器筐体10に収納される際に、電子機器筐体10の受け部20により直接係止される部分であり、電子機器筐体10への挿入方向Sに傾斜した(傾斜面が電子機器筐体10への挿入方向S側に向いた)側面視三角形状(山形状)の樹脂製の突出部材により成形される。係止部32dは、外側部材32aの自由端側部分(外側部材32aの一端部)を押圧して爪体32を弾性変形させることで、内側部材32bに近づく方向に移動し、受け部20による係止が解除される。すなわち、外側部材32aの自由端側部分(外側部材32aの一端部)が、受け部20による係止部32dの係止を解除するための係止解除部32eであり、フェイスカバー30を電子機器筐体10に装着した際に、係止解除部32eを操作することで受け部20による係止部32dの係止が解除される。   The claw body 32 has a convex locking portion 32d formed integrally with the outer member 32a at the center of the outer surface of the outer member 32a. The locking portion 32 d is a portion that is directly locked by the receiving portion 20 of the electronic device housing 10 when the face cover 30 is housed in the electronic device housing 10, and is inserted into the electronic device housing 10. It is molded by a resin-made protruding member that is inclined to S (the inclined surface faces the insertion direction S to the electronic device casing 10) and has a triangular shape (mountain shape) in side view. The locking portion 32d moves in a direction approaching the inner member 32b by pressing the free end side portion (one end portion of the outer member 32a) of the outer member 32a and elastically deforming the claw body 32, and is received by the receiving portion 20. The lock is released. That is, the free end side portion of the outer member 32a (one end portion of the outer member 32a) is an unlocking portion 32e for releasing the locking of the locking portion 32d by the receiving portion 20, and the face cover 30 is connected to the electronic device. When mounted on the housing 10, the locking portion 32d is unlocked by the receiving portion 20 by operating the locking releasing portion 32e.

係止解除部32eは、フェイスカバー30を電子機器筐体10に装着した際に、電子機器筐体10の開口部11側であって、開口部11の開口端11Aより外側に突出するように設けられる。すなわち、係止解除部32eは、基板90の挿入始端側(前側端部91側)と反対側の基板90の挿入終端側(後側端部92側)の位置に設けられ、開口部11側から操作可能に構成されている。このように、係止解除部32eが電子機器筐体10の開口部11側であって、開口部11の開口端11Aより外側に突出して設けられることで、電子機器筐体10がレール等に固定されている場合であっても、係止解除部32eを容易に操作することができる。
係止解除部32eは、その外側面及び内側面に突起部32fが外側部材32aと一体に成形されている。突起部32fは、係止解除部32e(外側部材32aの自由端側)を補強するための突起である。
When the face cover 30 is attached to the electronic device casing 10, the unlocking portion 32 e is on the opening 11 side of the electronic device casing 10 and protrudes outside the opening end 11 </ b> A of the opening 11. Provided. That is, the lock release portion 32e is provided at a position on the insertion end side (rear end portion 92 side) of the substrate 90 on the opposite side to the insertion start end side (front end portion 91 side) of the substrate 90, and on the opening 11 side. It is configured to be operable from. In this way, the locking release portion 32e is provided on the opening 11 side of the electronic device casing 10 and protrudes outward from the opening end 11A of the opening 11, so that the electronic device casing 10 can be used as a rail or the like. Even if it is fixed, the unlocking portion 32e can be easily operated.
As for the latch release part 32e, the protrusion part 32f is integrally formed with the outer side member 32a on the outer surface and inner surface. The protrusion 32f is a protrusion for reinforcing the locking release part 32e (the free end side of the outer member 32a).

被ガイド体33は、基板90の上側端部93及び下側端部94を支持するとともに、フェイスカバー30を電子機器筐体10に挿脱する際に、電子機器筐体10のガイドレール21に案内される部分である。被ガイド体33は、本体31の長手方向の両端部に爪体32と平行に設けられ、本体31と一体に成形された樹脂製の部材により構成される。   The guided body 33 supports the upper end portion 93 and the lower end portion 94 of the substrate 90 and is attached to the guide rail 21 of the electronic device casing 10 when the face cover 30 is inserted into and removed from the electronic device casing 10. It is the part to be guided. The guided body 33 is formed of a resin member which is provided in parallel with the claw body 32 at both ends in the longitudinal direction of the main body 31 and is formed integrally with the main body 31.

被ガイド体33は、本体31の長手方向の両端部から電子機器筐体10への挿入方向Sに延設される長尺状の部材であり、基板90の上側端部93及び下側端部94の全体を覆うように構成されている。被ガイド体33は、その一端部側が自由端であり、且つその他端部側が本体31と一体に成形される固定端である。   The guided body 33 is a long member extending in the insertion direction S from the longitudinal direction of the main body 31 to the electronic device casing 10, and includes an upper end 93 and a lower end of the substrate 90. 94 is configured to cover the whole. One end of the guided body 33 is a free end, and the other end is a fixed end formed integrally with the main body 31.

被ガイド体33は、その一方側である内側面に基板保持部33aが一体に成形されている。基板保持部33aは凹状の長溝部分であり、基板90の上側端部93及び下側端部94が嵌め込まれる。基板保持部33aは、基板90の上側端部93及び下側端部94の前側端部91側(電子機器筐体10への挿入始端)から後側端部92側(電子機器筐体10への挿入終端)までを保持するように、被ガイド体33の長手方向に沿って延設される。すなわち、基板保持部33aは、基板90の挿入方向S(挿脱方向)に沿って延設され、基板90の挿入方向S(挿脱方向)と直交する方向から基板90を保持する。   The guided body 33 is integrally formed with a substrate holding portion 33a on an inner surface which is one side thereof. The substrate holding portion 33a is a concave long groove portion, and the upper end portion 93 and the lower end portion 94 of the substrate 90 are fitted therein. The substrate holding portion 33a is configured such that the upper end 93 and the lower end 94 of the substrate 90 are moved from the front end 91 side (starting insertion into the electronic device casing 10) to the rear end 92 (from the electronic device casing 10). Is extended along the longitudinal direction of the guided body 33 so as to hold up to the insertion end). That is, the substrate holding part 33a extends along the insertion direction S (insertion / removal direction) of the substrate 90, and holds the substrate 90 from a direction orthogonal to the insertion direction S (insertion / removal direction) of the substrate 90.

被ガイド体33は、その他方側である外側面にリブ部33bが一体に成形されている。すなわち、リブ部33bは、基板保持部33aが成形されている面と反対側の面に成形されている。リブ部33bは、凸状に突出した長尺の突出部分であり、電子機器筐体10のガイドレール21に摺動可能に嵌め込まれる。リブ部33bは、被ガイド体33の長手方向に沿って延設される。すなわち、リブ部33bは、基板保持部33aにおいて保持される基板90の前側端部91側(電子機器筐体10への挿入始端)から後側端部92側(電子機器筐体10への挿入終端)に沿って形成される。リブ部33bは、被ガイド体33の中央部分で分割して設けられる。分割されたリブ部33bの間(被ガイド体33の中央部)には、基板90を基板保持部33aに係止させるための係止孔33cが設けられている。基板90に設けられる引っ掛け部分を係止孔33cに引っ掛けることで、基板90と基板保持部33aとの接続が強化される。   In the guided body 33, a rib portion 33b is integrally formed on the outer surface on the other side. That is, the rib portion 33b is formed on the surface opposite to the surface on which the substrate holding portion 33a is formed. The rib portion 33 b is a long protruding portion protruding in a convex shape, and is slidably fitted into the guide rail 21 of the electronic device housing 10. The rib portion 33 b extends along the longitudinal direction of the guided body 33. That is, the rib portion 33b is inserted into the electronic device casing 10 from the front end portion 91 side (the insertion start end of the electronic device casing 10) to the rear end portion 92 side of the substrate 90 held by the substrate holding portion 33a. (End). The rib portion 33 b is provided by being divided at the central portion of the guided body 33. A locking hole 33c for locking the substrate 90 to the substrate holding portion 33a is provided between the divided rib portions 33b (the central portion of the guided body 33). By hooking the hook portion provided on the substrate 90 into the locking hole 33c, the connection between the substrate 90 and the substrate holding portion 33a is strengthened.

このように被ガイド体33を形成することで、基板90の上側端部93及び下側端部94の略全体(電子機器筐体10への挿入始端から挿入終端まで)が被ガイド体33(リブ部33b)を介してガイドレール21に案内される。そのため、基板90(被ガイド体33)に対するガイドレール21の有効範囲が広くなり、電子機器筐体10の開口端11A側で電子機器筐体10に対する基板90の位置決めを行うことができる。   By forming the guided body 33 in this way, substantially the entire upper end 93 and lower end 94 of the substrate 90 (from the insertion start end to the insertion end of the electronic device housing 10) is guided body 33 ( It is guided to the guide rail 21 via the rib part 33b). Therefore, the effective range of the guide rail 21 with respect to the substrate 90 (guided body 33) is widened, and the substrate 90 can be positioned with respect to the electronic device housing 10 on the opening end 11A side of the electronic device housing 10.

次に、電子機器筐体10への基板90の取り付け方法について説明する。
図2及び図5(a)に示すように、フェイスカバー30を装着した基板90を電子機器筐体10の開口端11Aから挿入する。この時、フェイスカバー30の被ガイド体33のリブ部33bを電子機器筐体10の開口端11A側から延設されるガイドレール21に挿入する。これにより、電子機器筐体10に対するフェイスカバー30の位置決めを行う。すなわち、電子機器筐体10の開口端11A側において電子機器筐体10に対する基板90の位置決めを行うことができる。
Next, a method for attaching the substrate 90 to the electronic device housing 10 will be described.
As shown in FIGS. 2 and 5A, the substrate 90 with the face cover 30 attached is inserted from the opening end 11 </ b> A of the electronic device housing 10. At this time, the rib portion 33b of the guided body 33 of the face cover 30 is inserted into the guide rail 21 extending from the opening end 11A side of the electronic device casing 10. As a result, the face cover 30 is positioned with respect to the electronic device casing 10. That is, the substrate 90 can be positioned with respect to the electronic device casing 10 on the opening end 11 </ b> A side of the electronic device casing 10.

続いて、図5(b)に示すように、フェイスカバー30の爪体32を電子機器筐体10の受け部20に挿入する。これにより、被ガイド体33のリブ部33bがガイドレール21に沿って案内されるとともに、爪体32の係止部32dが受け部20に当接する。さらに、フェイスカバー30の本体31を電子機器筐体10内に押し込むことで、爪体32の係止部32dが受け部20により押圧され、図5(c)に示すように、爪体32の外側部材32aが折り返し部材32cを支点に内側部材32bに近づく方向に押し込まれる。すなわち、本体31の両端部に設けられる爪体32の係止部32d同士の間隔が、電子機器筐体10の上側壁部13及び下側壁部14に設けられる受け部20同士の間隔より小さくなる。そして、係止部32dの頂部が受け部20を通過するまでフェイスカバー30の本体31を電子機器筐体10内に押し込むことで、図5(d)に示すように、係止部32dが受け部20に嵌り込むとともに、外側部材32aが元に位置に戻る。これにより、フェイスカバー30を装着した基板90が電子機器筐体10に取り付けられる。   Subsequently, as shown in FIG. 5B, the claw body 32 of the face cover 30 is inserted into the receiving portion 20 of the electronic device casing 10. Accordingly, the rib portion 33 b of the guided body 33 is guided along the guide rail 21, and the locking portion 32 d of the claw body 32 comes into contact with the receiving portion 20. Furthermore, when the main body 31 of the face cover 30 is pushed into the electronic device casing 10, the locking portion 32d of the nail body 32 is pressed by the receiving portion 20, and the nail body 32 has a structure as shown in FIG. The outer member 32a is pushed in a direction approaching the inner member 32b with the folded member 32c as a fulcrum. That is, the interval between the locking portions 32 d of the claw body 32 provided at both ends of the main body 31 is smaller than the interval between the receiving portions 20 provided on the upper wall portion 13 and the lower wall portion 14 of the electronic device casing 10. . Then, by pushing the main body 31 of the face cover 30 into the electronic device casing 10 until the top of the locking portion 32d passes through the receiving portion 20, the locking portion 32d receives the locking portion 32d as shown in FIG. The outer member 32a returns to its original position while being fitted into the portion 20. Thereby, the substrate 90 on which the face cover 30 is mounted is attached to the electronic device casing 10.

次に、電子機器筐体10からの基板90の取り外し方法について説明する。フェイスカバー30を装着した基板90が電子機器筐体10に取り付けられた状態で、本体31の両端部に設けられるそれぞれの爪体32の係止解除部32e(外側部材32aの自由端部)を操作する。具体的には、本体31の両端部に設けられるそれぞれの爪体32の外側部材32aを本体31の中央側に押圧する。これにより、外側部材32aが折り返し部材32cを支点に内側部材32bに近づく方向に押し込まれ、本体31の両端部に設けられる爪体32の係止部32d同士の間隔が、電子機器筐体10の上側壁部13及び下側壁部14に設けられる受け部20同士の間隔より小さくなる。すなわち、受け部20による係止部32dの係止が解除される。   Next, a method for removing the substrate 90 from the electronic device housing 10 will be described. In a state where the substrate 90 with the face cover 30 attached is attached to the electronic device casing 10, the unlocking portions 32 e (the free ends of the outer members 32 a) of the respective nail bodies 32 provided at both ends of the main body 31. Manipulate. Specifically, the outer members 32 a of the respective claws 32 provided at both ends of the main body 31 are pressed toward the center of the main body 31. Thereby, the outer member 32a is pushed in the direction approaching the inner member 32b with the folding member 32c as a fulcrum, and the interval between the locking portions 32d of the claw bodies 32 provided at both ends of the main body 31 is It becomes smaller than the space | interval of the receiving parts 20 provided in the upper side wall part 13 and the lower side wall part 14. FIG. That is, the locking of the locking portion 32d by the receiving portion 20 is released.

続いて、外側部材32aを本体31の中央側に押圧した状態で、フェイスカバー30を電子機器筐体10の開口端11Aから外側に引き出す。これにより、受け部20による爪体32の嵌り込みが外れ、続いて、ガイドレール21による被ガイド体33の案内が外れる。すなわち、フェイスカバー30を装着した基板90が電子機器筐体10から取り外される。   Subsequently, the face cover 30 is pulled out from the opening end 11 </ b> A of the electronic device housing 10 in a state where the outer member 32 a is pressed toward the center of the main body 31. Thereby, the fitting of the claw body 32 by the receiving portion 20 is released, and subsequently, the guide of the guided body 33 by the guide rail 21 is released. That is, the substrate 90 on which the face cover 30 is mounted is removed from the electronic device casing 10.

以上のように、本実施の形態によると、電子機器筐体10の開口端11A側からガイドレール21を延設して、被ガイド体33のリブ部33bを電子機器筐体10の開口端11A側のガイドレール21から嵌め込んで摺動可能としたことから、電子機器筐体10への基板90の挿入時に、電子機器筐体10に対する基板90の位置決めを容易に行うことができる。   As described above, according to the present embodiment, the guide rail 21 is extended from the opening end 11 </ b> A side of the electronic device housing 10, and the rib portion 33 b of the guided body 33 is connected to the opening end 11 </ b> A of the electronic device housing 10. Since the side guide rail 21 is fitted and slidable, the substrate 90 can be easily positioned with respect to the electronic device housing 10 when the substrate 90 is inserted into the electronic device housing 10.

なお、本実施の形態においては、フェイスカバー30の爪体32を電子機器筐体10の受け部20に係止させることによりフェイスカバー30を電子機器筐体10に固定しているが、これに限定されるものではなく、フェイスカバー30に爪体32を設けずに、ネジ等の固定部材によりフェイスカバー30を電子機器筐体10に固定しても構わない。   In the present embodiment, the face cover 30 is fixed to the electronic device casing 10 by locking the claw body 32 of the face cover 30 to the receiving portion 20 of the electronic device casing 10. Without being limited thereto, the face cover 30 may be fixed to the electronic device housing 10 by a fixing member such as a screw without providing the claw body 32 on the face cover 30.

また、本実施の形態においては、電子機器筐体10の受け部20によりフェイスカバー30の爪部を係止することで基板90を電子機器筐体10に取り付ける構造であるが、これに限定されるものではなく、例えば、図6に示すような固定補強材40を用いて、基板90を電子機器筐体10に取り付ける構造であっても構わない。   In the present embodiment, the substrate 90 is attached to the electronic device housing 10 by locking the claw portion of the face cover 30 by the receiving portion 20 of the electronic device housing 10. However, the present invention is not limited to this. For example, a structure in which the substrate 90 is attached to the electronic device housing 10 by using a fixing reinforcing member 40 as shown in FIG. 6 may be used.

図6に示すように、固定補強材40は、電子機器筐体10に基板90(フェイスカバー30)を取り付けた上で、フェイスカバー30の爪体32及び被ガイド体33と、電子機器筐体10の上側壁部13及び下側壁部14と、に嵌め合わされる。これにより、フェイスカバー30と電子機器筐体10の上側壁部13及び下側壁部14とが固定補強材40を介して固定される。   As shown in FIG. 6, the fixing reinforcing member 40 is formed by attaching the substrate 90 (face cover 30) to the electronic device casing 10, the nail body 32 and the guided body 33 of the face cover 30, and the electronic device casing. 10 are fitted to the upper side wall part 13 and the lower side wall part 14. As a result, the face cover 30 and the upper wall portion 13 and the lower wall portion 14 of the electronic device casing 10 are fixed via the fixing reinforcing material 40.

図7に示すように、固定補強材40は、側面視略J字状の樹脂製の部材であり、電子機器筐体10への挿入方向Sに延設され、延設方向の先端が自由端である第1壁部41と、第1壁部41に対向して電子機器筐体10への挿入方向Sに延設され、延設方向の先端が自由端である第2壁部42と、第1壁部41から第2壁部42へ折り返す部分である折り返し壁部43と、から構成される。   As shown in FIG. 7, the fixed reinforcing member 40 is a resin member having a substantially J shape in a side view, and extends in the insertion direction S into the electronic device casing 10, and the distal end in the extending direction is a free end. A first wall portion 41, a second wall portion 42 facing the first wall portion 41, extending in the insertion direction S into the electronic device housing 10, and having a free end at the distal end in the extending direction; And a folded wall portion 43 that is a portion that is folded from the first wall portion 41 to the second wall portion 42.

第1壁部41と第2壁部42との間には、複数(図7では3箇所)の係合突出部44が折り返し壁部43から側面視略L字状に突出して形成されている。係合突出部44の上部には、電子機器筐体10の上側壁部13或いは下側壁部14を受ける壁受け部44aが設けられる。固定補強材40においては、壁受け部44aと第1壁部41の内壁面との間に上側壁部13或いは下側壁部14が嵌め込まれる。   Between the first wall portion 41 and the second wall portion 42, a plurality of (three in FIG. 7) engagement protrusion portions 44 are formed so as to protrude from the folded wall portion 43 in a substantially L shape in a side view. . A wall receiving portion 44 a that receives the upper wall portion 13 or the lower wall portion 14 of the electronic device casing 10 is provided on the upper portion of the engaging protrusion 44. In the fixed reinforcing member 40, the upper wall portion 13 or the lower wall portion 14 is fitted between the wall receiving portion 44 a and the inner wall surface of the first wall portion 41.

第1壁部41と第2壁部42との間であって隣り合う係合突出部44の間には、フェイスカバー30の爪体32の外側部材32a(係止解除部32e)を受ける爪受け部43aが設けられている。爪受け部43aには、固定補強材40を電子機器筐体10に取り付ける際に、爪体32の外側部材32a(係止解除部32e)が嵌め込まれる。爪受け部43aの入口部を形成する係合突出部44の突出先端44bは、爪体32の外側部材32a(係止解除部32e)を爪受け部43aに嵌め込み易くするためにテーパー状に形成されている。   A claw that receives the outer member 32a (locking release portion 32e) of the claw body 32 of the face cover 30 between the first wall portion 41 and the second wall portion 42 and between the adjacent engagement protrusions 44. A receiving portion 43a is provided. When the fixed reinforcing member 40 is attached to the electronic device housing 10 in the claw receiving portion 43a, the outer member 32a (lock release portion 32e) of the claw body 32 is fitted. The protruding tip 44b of the engaging protruding portion 44 that forms the inlet portion of the claw receiving portion 43a is formed in a tapered shape so that the outer member 32a (locking release portion 32e) of the claw body 32 can be easily fitted into the claw receiving portion 43a. Has been.

第2壁部42における電子機器筐体10への挿入方向S側端部には、複数(図7では4箇所)の差し込み部42aが設けられている。差し込み部42aは、固定補強材40を電子機器筐体10に取り付ける際に、フェイスカバー30の爪体32の外側部材32aと内側部材32bとの間に折り返し部材32cに向けて差し込まれる。差し込み部42aは、その先端部が外側部材32aと内側部材32bとの間に差し込まれ易くするために湾曲状に形成されている。   A plurality of (four locations in FIG. 7) insertion portions 42a are provided at the end of the second wall portion 42 in the insertion direction S side with respect to the electronic device housing 10. The insertion portion 42 a is inserted toward the folded member 32 c between the outer member 32 a and the inner member 32 b of the claw body 32 of the face cover 30 when the fixed reinforcing member 40 is attached to the electronic device housing 10. The insertion portion 42a is formed in a curved shape so that the tip portion can be easily inserted between the outer member 32a and the inner member 32b.

10 電子機器筐体
11A 開口端
21 ガイドレール(ガイド溝)
30 フェイスカバー(基板保持枠)
33 被ガイド体
33a 基板保持部
33b リブ部
90 基板
10 Electronic Equipment Case 11A Open End 21 Guide Rail (Guide Groove)
30 Face cover (board holding frame)
33 Guided body 33a Substrate holding part 33b Rib part 90 Substrate

Claims (2)

一端が開口しており、その開口端から基板が挿脱可能であり、挿入された基板が取り付けられる電子機器筐体への基板取付構造であって、
前記電子機器筐体には、その壁部の内壁面に一体に成形され、前記基板の挿脱方向に延伸するガイド溝が前記開口端側から設けられ、
前記基板の挿脱方向と直交する方向から前記基板を保持した状態で前記電子機器筐体の開口端から挿脱される基板保持枠を備え、
前記基板保持枠には、前記ガイド溝に案内される被ガイド体が一体に成形され、
前記被ガイド体は、
前記被ガイド体の一方側に一体に成形され、前記基板の前記電子機器筐体への挿入始端から挿入終端までを保持する基板保持部と、
前記被ガイド体の他方側に一体に成形され、前記ガイド溝に摺動可能に嵌め込まれるリブ部と、
を有すること
を特徴とする電子機器筐体への基板取付構造。
One end is open, the board can be inserted and removed from the open end, and the board mounting structure to the electronic equipment housing to which the inserted board is attached,
The electronic device casing is integrally formed on the inner wall surface of the wall portion, and a guide groove extending in the insertion / removal direction of the substrate is provided from the opening end side,
A substrate holding frame that is inserted and removed from the opening end of the electronic device casing in a state in which the substrate is held from a direction orthogonal to the insertion and removal direction of the substrate;
A guided body guided by the guide groove is integrally formed on the substrate holding frame,
The guided body is:
A substrate holding part that is integrally formed on one side of the guided body and holds the substrate from the insertion start end to the insertion end of the electronic device housing;
A rib formed integrally with the other side of the guided body and slidably fitted into the guide groove;
A board mounting structure to an electronic device casing, characterized by comprising:
前記リブ部は、前記基板保持部において保持される基板の前記電子機器筐体への挿入始端から挿入終端に沿って形成されること
を特徴とする請求項1に記載の電子機器筐体への基板取付構造。
2. The electronic device housing according to claim 1, wherein the rib portion is formed from an insertion start end of the substrate held in the substrate holding portion to the electronic device housing from an insertion end. Board mounting structure.
JP2017141408A 2017-07-21 2017-07-21 Board attachment structure to electronic equipment enclosure Pending JP2019021851A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2017141408A JP2019021851A (en) 2017-07-21 2017-07-21 Board attachment structure to electronic equipment enclosure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017141408A JP2019021851A (en) 2017-07-21 2017-07-21 Board attachment structure to electronic equipment enclosure

Publications (1)

Publication Number Publication Date
JP2019021851A true JP2019021851A (en) 2019-02-07

Family

ID=65353284

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017141408A Pending JP2019021851A (en) 2017-07-21 2017-07-21 Board attachment structure to electronic equipment enclosure

Country Status (1)

Country Link
JP (1) JP2019021851A (en)

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