JP2018202737A - Resin mold die and resin mold device - Google Patents

Abstract

To fix a cavity piece so as to prevent it from being moved even when a resin pressure is increased, and to prevent occurrence of resin flush.SOLUTION: A resin mold die 10 resin-molds a workpiece W on which a second member Wb is mounted on a first member Wa, and includes a first die 20 provided with a work support part 31 and a second mold 21 provided with a cavity 32, where the second die 21 is provided with a position fixing mechanism 12 for fixing a position of the cavity piece 23 in a mold opening/closing direction, the position fixing mechanism 12 includes a movable taper block 14 having a first tapered surface 14c, a fixed taper block 16 which has a second tapered surface 16c and is arranged so as to face to the first tapered surface 14c and be brought into contact with it and a first pressing/moving piece 18 that presses and moves the movable taper block 14, and has a first elastic member 27 for generating a resilient force between the movable taper block 14 and the first pressing/moving piece 18.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a resin mold for resin-molding a workpiece, and a resin mold apparatus including the resin mold.

  In the resin molding apparatus, a workpiece (molded product) is clamped with a resin mold, and a resin is filled in the cavity while applying resin pressure in this state, and resin molding is performed. Therefore, when the resin is filled in the cavity, it is necessary to clamp the workpiece with a sufficient clamping force on the workpiece substrate, the lead frame, or the like so that the resin does not leak from the cavity. For this reason, in the resin mold mold, the clamp position of the mold is set in advance according to the thickness of the work, and when the work is clamped, it is clamped by a predetermined clamping force.

  However, when there is a large variation in the thickness of the workpieces that are sequentially molded, the clamping force against the workpiece becomes too strong and the workpiece itself is damaged, or the clamping force is insufficient and the resin is discharged from the cavity. Leakage may occur, causing a problem of resin flash.

  To solve these problems, the cavity block that clamps the workpiece is made movable in the mold opening and closing direction, a spring is provided on the back of the cavity block, or the cavity block is hydraulically controlled by pushing the workpiece thickness. There is a technique (see Japanese Patent Application Laid-Open No. 11-58435) that absorbs variations in the above. In addition, a technique is provided in which a plurality of chips provided on a substrate can be adjusted with a wedge or a screw to adjust a clamping position of a mold (patent document 2: JP 2011-11426 A). And the like).

JP-A-11-58435 JP 2011-11426 A

  As an example of the above prior art, when the workpiece W is a chip exposed package (a package in which the chip Wb on the substrate Wa is exposed), the cavity piece 23 that comes into contact with the upper surface portion of the chip Wb to be exposed has a float structure. FIG. 14 shows a configuration example of a resin mold 90 in which a spring (for example, a coil spring) 24 is incorporated to make the cavity piece 23 movable. According to the said structure, the effect which can correct | amend the dispersion | variation in the height of the chip | tip Wb of the workpiece | work W is acquired. However, if the thrust (elastic force) of the incorporated spring 24 is too strong, the tip Wb may be damaged, and conversely, if it is too weak, a flash may occur on the upper surface of the tip Wb. Further, since the resin molding pressure is applied to the surface (resin projection portion) other than the exposed portion of the chip Wb, a force for opening the cavity piece 23 (force for pushing up) is generated. For this reason, the incorporated spring 24 requires a thrust of a magnitude obtained by adding a thrust for pressing so that no flash is generated on the upper surface of the chip Wb and a thrust that can counter the resin molding pressure. In this case, when this added thrust leads to breakage of the tip Wb of the workpiece W, the configuration cannot be adopted.

  The present invention has been made in view of the above circumstances, and is capable of resin molding without damaging the chips regardless of the number and arrangement of workpieces, and is fixed so that the cavity piece does not move even when the resin pressure is increased. An object of the present invention is to provide a resin mold and a resin mold apparatus that can prevent the occurrence of resin flash.

  The present invention solves the above-mentioned problem by means of solving as described below as an embodiment.

  The resin mold according to the present invention is a resin mold for resin molding a work having a second member mounted on a first member, and the first mold provided with a work support portion for supporting the work. And a second mold provided with a cavity for accommodating the second member of the workpiece, the cavity being disposed so as to be slidable with respect to the insert that forms a side portion. The second die is provided with a position fixing mechanism for fixing the position of the cavity piece in the mold opening / closing direction. A movable tapered block having a tapered surface and arranged to be movable in a direction orthogonal to the mold opening / closing direction, and a second tapered surface, the second tapered surface facing the first tapered surface of the movable tapered block Shi A fixed taper block disposed so as to be able to contact and movable in the mold opening and closing direction; and a first pushing piece that pushes the movable taper block; and the movable taper block and the It is a requirement that a first elastic member for generating a resilient force is disposed between the first pushing piece.

  According to this, it is possible to obtain an action of pushing the fixed taper block and the cavity piece in the mold opening / closing direction by pushing the movable taper block in a direction orthogonal to the mold opening / closing direction by a simple mechanical mechanism. Therefore, since the position of the cavity piece can be fixed by pushing and moving the movable taper block to a predetermined position, even when the resin pressure reaction force acts on the cavity piece during resin molding, The cavity piece does not move, and the occurrence of resin flash can be prevented. In addition, when the force with which the first pushing piece pushes the movable taper block becomes equal to or greater than a predetermined value, the intervening first elastic member contracts so that the movable taper block can be prevented from being pushed. , Can prevent work damage.

  The second mold is provided with a second pushing piece movable in the mold opening and closing direction, and the first pushing piece is opposite to the one end facing the first elastic member. The second pusher piece has a fourth taper surface at one end, and the fourth taper surface is opposed to the third taper surface of the first pusher piece. It is preferable that they are arranged so as to be able to come into contact with each other. According to this, a mechanism for converting the moving action in the mold opening / closing direction of the second pushing piece into the moving action in the direction orthogonal to the mold opening / closing direction of the first pushing piece can be realized.

  The first mold is provided with a dummy plunger that is movable in the mold opening and closing direction, and one end of the dummy plunger and the other end of the second push piece are disposed so as to contact each other. Preferably it is. According to this, it is possible to realize a mechanism that transmits the moving action in the mold opening / closing direction of the dummy plunger provided in the first mold to the moving action in the mold opening / closing direction of the second pushing piece provided in the second mold.

  Further, it is preferable that a second elastic member for generating a resilient force is disposed between the chase block holding the insert and the cavity piece and one end of the second push piece. According to this, when the action of the force for pushing the second pushing piece in the direction toward the first pushing piece disappears, it can be returned to the reverse direction by the elastic force of the second elastic member.

  The first elastic member is preferably a spring formed using a metal material. According to this, the elastic force, that is, the spring constant of the spring can be set easily and accurately according to the molding conditions, so that highly accurate molding can be performed.

  The first mold or the second mold is provided with an overflow cavity that communicates with the cavity and allows the overflowed resin to flow in, and the overflow cavity is slidably disposed therein. And a third elastic member that is disposed between the bottom and the piston and generates a resilient force. According to this, since the mold resin can overflow from the cavity to the overflow cavity, the voids in the cavity can be pushed away, and the resin filling property can be improved. Further, by providing the third elastic member having a predetermined elastic force, a predetermined resin pressure (final molding pressure) can be applied to the mold resin filled in the cavity.

  Further, the first mold is provided with a plunger for supplying resin into the cavity, and a transfer drive mechanism for moving the plunger is commonly used as a drive mechanism for moving the dummy plunger. preferable. According to this, the dummy plunger is moved using the transfer driving mechanism for moving the plunger provided on the first mold side by an extremely simple mechanical mechanism, and the cavity piece provided on the second mold side is moved. Can be made. Therefore, a low-cost device can be realized with a simple configuration.

  Moreover, the resin mold apparatus which concerns on this invention makes it a requirement to provide the said resin mold metal mold | die.

  According to this, since the adjustment mechanism that enables the cavity piece to be fixed at a position suitable for molding can be provided as a configuration that is completed within the mold of the resin mold, the entire structure of the resin mold apparatus is configured. Can be simplified.

  According to the present invention, it is possible to perform resin molding without damaging the second member regardless of the number and arrangement of second members (eg, chips) mounted on the first member (eg, substrate) of the workpiece. It becomes. In particular, chip exposure molding can be suitably performed without damaging the chip in a package or the like that exposes the chip. Further, with a simple mechanical configuration, the cavity piece can be fixed so as not to move even if the pressure of the resin to be molded is increased, and it is possible to prevent the occurrence of a resin flush during molding.

It is the schematic (plan view) which shows the example of the resin mold apparatus provided with the resin mold metal mold | die which concerns on 1st embodiment of this invention. It is the schematic (front sectional drawing) which shows the example of the resin mold metal mold | die which concerns on 1st embodiment of this invention, and is explanatory drawing of resin mold operation | movement. It is the schematic (front sectional drawing) which shows the example of the resin mold metal mold | die which concerns on 1st embodiment of this invention, and is explanatory drawing of the resin mold operation | movement following FIG. It is the schematic (front sectional drawing) which shows the example of the resin mold metal mold | die which concerns on 1st embodiment of this invention, and is explanatory drawing of the resin mold operation | movement following FIG. It is the schematic (front sectional drawing) which shows the example of the resin mold metal mold | die which concerns on 1st embodiment of this invention, and is explanatory drawing of the resin mold operation | movement following FIG. It is the schematic (front sectional drawing) which shows the example of the resin mold metal mold | die which concerns on 1st embodiment of this invention, and is explanatory drawing of the resin mold operation | movement following FIG. It is the schematic (front sectional drawing) which shows the example of the resin mold metal mold | die which concerns on 2nd embodiment of this invention, and is explanatory drawing of resin mold operation | movement. It is the schematic (front sectional drawing) which shows the example of the resin mold metal mold | die which concerns on 2nd embodiment of this invention, and is explanatory drawing of the resin mold operation | movement following FIG. It is the schematic (front sectional drawing) which shows the example of the resin mold metal mold | die which concerns on 2nd embodiment of this invention, and is explanatory drawing of the resin mold operation | movement following FIG. It is the schematic (front sectional drawing) which shows the example of the resin mold metal mold | die which concerns on 2nd embodiment of this invention, and is explanatory drawing of the resin mold operation | movement following FIG. It is the schematic (front sectional drawing) which shows the example of the resin mold metal mold | die which concerns on 2nd embodiment of this invention, and is explanatory drawing of the resin mold operation | movement following FIG. It is the schematic (front sectional drawing) which shows the example of the resin mold metal mold | die which concerns on 3rd embodiment of this invention, and is explanatory drawing of resin mold operation | movement. It is the schematic (front sectional drawing) which shows the example of the resin mold metal mold | die which concerns on 3rd embodiment of this invention, and is explanatory drawing of the resin mold operation | movement following FIG. It is the schematic (front sectional drawing) which shows the example of the resin mold metal mold | die which concerns on the conventional embodiment.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic view (plan view) illustrating an example of a resin mold apparatus 100 including a resin mold 10 according to the first embodiment of the present invention. 2 to 6 are schematic views (front sectional views) showing an example of the resin mold 10 according to the first embodiment of the present invention (these drawings are also used as operation explanatory diagrams). For convenience of explanation, the vertical direction of the resin mold 10 may be described with reference to FIG. In all the drawings for explaining each embodiment, members having the same function are denoted by the same reference numerals, and repeated description thereof may be omitted.

  The resin molding apparatus 100 according to the present embodiment is an apparatus that performs resin molding of a workpiece (molded product) W. Hereinafter, as the resin molding apparatus 100, a first mold (lower mold) 20 provided with a pot 35 in which a mold resin (sometimes simply referred to as “resin”) is accommodated, and a second member Wb of the workpiece W are provided. A transfer molding apparatus including a resin mold 10 having a second mold (upper mold) 21 provided with a cavity 32 to be accommodated will be described as a main example.

  First, the workpiece W to be formed has a configuration in which the second member Wb is mounted on the first member Wa. More specifically, examples of the first member Wa include various plate-shaped members such as a resin substrate, a ceramic substrate, a metal substrate, a lead frame, a carrier, and a wafer formed in a strip shape. Further, examples of the second member Wb include various members such as a semiconductor chip (sometimes simply referred to as “chip”), a heat sink, a lead frame for wiring and heat dissipation, and a bump for electrical connection. It is done. In other words, the workpiece W in the present invention refers to a workpiece in which the second member Wb is mounted (flip chip mounting, wire bonding mounting, etc.) and overlapped on the first member Wa. Therefore, in the workpiece W, one or more stages of chips are mounted on the substrate, a semiconductor device is mounted on the substrate, an image sensor is mounted on the substrate, and light transmission glass is bonded to the light receiving surface of the image sensor. Also included. Also, regarding the form of resin molding, there are cases where individual mounting parts are individually housed in cavities and resin molding is performed, or multiple mounting parts mounted on a substrate are housed in one cavity and resin is collectively Sometimes it is molded.

  Then, the outline | summary of the resin mold apparatus 100 is demonstrated. As shown in FIG. 1, the resin molding apparatus 100 includes a workpiece supply unit 100A for supplying a workpiece W, a preheating unit 100B for preheating the workpiece W, a press unit 100C for resin molding the workpiece W, and a molded product Wp after the resin molding. A molded product storage unit 100D for storage and a transport mechanism 100E are provided.

  First, the workpiece supply unit 100A includes a stocker 102 that stores a magazine (not shown) that stores workpieces W. The workpieces W sent from each magazine by a pusher (not shown) are arranged facing the set table 104 in pairs, for example.

  A tablet supply unit 106 for supplying mold resin (for example, resin tablet T) is provided on the side of the set table 104. The workpiece W on the set table 104 is held by a loader 122 of a transfer mechanism 100E described later and transferred to the preheating unit 100B. Further, the resin tablet T of the tablet supply unit 106 is held by the loader 122 and transferred to the press unit 100C.

  Next, the preheating unit 100B includes a heater block 108 that preheats the workpiece W. The workpiece W transferred from the workpiece supply unit 100A by the transport mechanism 100E (loader 122) is placed on the heater block 108 and heated (preheated) to a predetermined temperature in that state. The preheated workpiece W is held by the loader 122 of the transport mechanism 100E and transferred to the press unit 100C.

  Next, the press unit 100C includes a press device 110 that clamps and pre-heats a work W that has been preheated by opening and closing a resin mold 10 that will be described later. The press device 110 is a known clamping mechanism that pushes the resin mold 10 in the mold opening / closing direction, and a known transfer drive that fills the cavity 32 with resin melted in the pot 35 of the resin mold 10. It has a mechanism.

  In the present embodiment, the mold surface (resin mold surface) of the resin mold 10 is covered with the release film F and resin molded. Therefore, the press device 110 includes a film supply mechanism 112 that supplies the release film F to the mold surface of the resin mold 10. The film supply mechanism 112 includes a supply roll 112 a that supplies the release film F to the mold surface (upper mold surface) and a take-up roll 112 b that winds the release film F on both sides of the resin mold 10. For the release film F, a film material excellent in heat resistance, ease of peeling, flexibility, and extensibility, for example, PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidine chloride and the like is preferable. Used. However, the mold surface of the resin mold 10 may not be covered with the release film F.

  Next, the molded product storage unit 100D includes a set unit 114 for setting a molded product Wp after resin molding, a gate break unit 116 for removing unnecessary resin such as a gate from the molded product Wp, and a molded product Wp from which unnecessary resin has been removed. Is provided. The molded product Wp is stored in a storage magazine 120, and the magazine 120 in which the molded product is stored is sequentially stored in a stocker 118.

  Next, the transport mechanism 100E includes a loader 122 that carries the workpiece W into the press unit 100C and an unloader 124 that carries the molded product Wp out of the press unit 100C. In the workpiece supply unit 100A, the preheating unit 100B, the press unit 100C, and the molded product storage unit 100D, the resin mold apparatus 100 is assembled by connecting the unitized stands. Guide units 126 are provided on the back side of each unit, and a guide rail is formed by assembling the guide units 126 so as to be linearly connected. Each of the loader 122 and the unloader 124 is provided so as to be linearly movable back and forth along a guide rail from a predetermined position on the guide portion 126 toward the workpiece supply portion 100A, the preheating portion 100B, the press portion 100C, and the molded product storage portion 100D. It has been.

  Therefore, by changing the configuration of the unit, the configuration mode of the resin mold apparatus 100 can be changed while maintaining the state where the guide portions 126 are connected to each other. For example, the example shown in FIG. 1 is an example in which two press devices 110 are installed, but it is also possible to configure a resin mold device (not shown) in which a single press device or a plurality of three or more press devices 110 are connected. It is.

  Then, the structure of the resin mold metal mold | die 10 with which the resin mold apparatus 100 is provided is demonstrated.

  Schematic diagrams (front sectional views) of the resin mold 10 according to the present embodiment are shown in FIGS. 2 to 6 (note that these drawings are also used as operation explanatory diagrams). As described above, the resin mold 10 includes the first mold (lower mold) 20 and the second mold (upper mold) 21. In addition, although the case where the first mold (lower mold) 20 is a movable mold and the second mold (upper mold) 21 is a fixed mold will be described as an example, the present invention is not limited to this configuration.

  First, the first mold (lower mold) 20 will be described. As shown in FIG. 2, the first mold (lower mold) 20 has a drive transmission mechanism (link mechanism such as a toggle link or a screw shaft) driven by a drive source (electric motor) and has a chase block (lower The mold is opened and closed by a known mold clamping mechanism that raises and lowers the lower mold movable platen on which the mold chase block) 33 is placed. In addition, the raising / lowering operation | movement of the 1st metal mold | die (lower mold | type) 20 can set arbitrarily a moving speed, pressurizing force, etc.

  On the upper surface of the lower chase block 33, a work support portion 31 on which a work W (first member Wa side) is placed is provided. As an example, a plurality of workpiece support portions 31 are provided so that a plurality of workpieces W can be placed thereon.

  The lower chase block 33 is provided with a cylindrical pot 35 in which a mold resin (here, resin tablet T) is loaded. The upper end surface of the lower chase block 33 is formed flush with the upper end surface of the pot 35. A plunger 36 that moves up and down by a known transfer drive mechanism is provided in the pot 35. As an example, the plunger 36 employs a multi-plunger structure in which a plurality of plungers 36 are provided on a support block (not shown) corresponding to the plurality of pots 35. An elastic member (not shown) is provided on the support portion of each plunger 36, and each plunger 36 is slightly displaced by the elastic force of the elastic member to release an excessive pressing force, and at the time of holding the pressure of the resin tablet T. It is possible to adapt to variations in the amount of resin.

  Next, the second mold (upper mold) 21 will be described. As shown in FIG. 2, the second die (upper die) 21 includes a cavity piece 23 that forms a bottom of a cavity 32 in a chase block (upper die chase block) 22 via a spring (for example, a coil spring) 24. Suspended and supported. As an example, an insert (upper mold insert) 26 is fixedly supported on the upper chase block 22, and the cavity piece 23 penetrates so as to form a bottom portion of a cavity 32 formed in the upper mold insert 26. It is inserted into the hole 26a and supported so as to be slidable.

  As an example, the cavity 32 is configured such that a side portion is formed by the upper mold insert 26 and a bottom portion is formed by the cavity piece 23. Further, the upper mold insert 26 is provided with resin paths such as an upper mold cull 26 b and an upper mold runner 26 c communicating with the cavity 32. The side portion of the cavity 32 may be formed by the upper chase block 22.

  Here, the second mold (upper mold) 21 is provided with a position fixing mechanism 12 that fixes the cavity piece 23 at a predetermined position in the mold opening / closing direction while pushing the cavity piece 23 in the mold closing direction. As an example, the position fixing mechanism 12 includes a movable taper block 14 having a first tapered surface 14c and arranged to be movable in a direction orthogonal to the mold opening / closing direction (not limited to a right-angled intersection), and a second tapered surface 16c. The fixed taper block is arranged so that the second taper surface 16c is opposed to the first taper surface 14c of the movable taper block and can come into contact with the second taper surface 16c and is movable in the mold opening and closing direction. 16.

  More specifically, the movable taper block 14 has a first taper surface 14c formed at a predetermined inclination angle so that the plate thickness is reduced at one end 14a at the tip. On the other hand, one end 16a of the fixed taper block 16 is supported in contact with the cavity piece 23, and the other end 16b opposite to the one end 16a is formed at a predetermined inclination angle corresponding to the first taper surface 14c. And a second tapered surface 16c. In the present embodiment, the movable taper block 14 is formed separately from the cavity piece 23, but may be formed integrally.

  According to this configuration, the first taper surface 14c and the second taper surface 16c come into contact with each other by pushing the movable taper block 14 in the direction from the rear end (the other end 14b) toward the front end (the one end 14a) ( The fixed taper block 16 is pushed in the direction from the upper end (the other end 16b) to the lower end (the one end 16a), that is, the cavity piece 23 is downward in the mold opening / closing direction (the direction toward the cavity 32). The pushing action can be obtained. Therefore, the movable taper block 14 is pushed to a predetermined position where the first taper surface 14c and the second taper surface 16c come into contact with each other (sliding contact) and stopped, so that the position of the fixed taper block 16 in the mold opening / closing direction is reduced. Fixing can be performed. That is, in the step of performing the resin molding, even when pressure (final pressure) is applied in the cavity 32 and the pressure is applied to the cavity piece 23, the fixed taper block 16 is fixed and the movable taper that contacts is fixed. Since the load is supported by the upper chase block 22 via the block 14, the cavity piece 23 does not move, and it is possible to prevent the occurrence of resin flash.

  In order to effectively produce the above action, the predetermined inclination angle of the first taper surface 14c and the second taper surface 16c is about 1 [°] to 30 [°] with respect to the surface perpendicular to the mold opening / closing direction. It is preferable that the angle is formed. As a result, most of the pressure (resin pressure reaction force) acting on the cavity piece 23 can be applied in the support direction by the upper chase block 22 and the movable taper block 14 can be prevented from being pushed back.

  In the present embodiment, a first pushing piece 18 is provided as a member that pushes the movable taper block 14 in a direction orthogonal to the mold opening / closing direction (not limited to a right-angled intersection). More specifically, the movable taper block 14 is not directly pushed by the first pushing piece 18, but a predetermined elastic force is generated between the movable tapered block 14 and the first pushing piece 18. One elastic member 27 is interposed and pushed. As an example, the first elastic member 27 employs a spring (coil spring) formed using a metal material. However, it is not limited to this, Other springs, such as a leaf spring, and elastic members other than a spring may be used.

  According to this configuration, the movable taper block 14 is moved in the same direction via the first elastic member 27 by pushing the first pusher piece 18 in the direction toward the movable taper block 14 perpendicular to the mold opening / closing direction. Can be pushed. Further, at this time, when the force with which the first pushing piece 18 pushes the first elastic member 27 becomes a predetermined value or more, the first elastic member 27 (here, a spring) is contracted to move the movable tapered block. 14 can be in a state of not being pushed. If the first pusher piece 18 is configured to push the movable taper block 14 directly, the first pusher piece 18 is always pushed by the cavity piece through the movable taper block 14 and the fixed taper block 16. 23 causes a pushing force toward the workpiece W, which may cause damage to the workpiece W. On the other hand, in the case of the configuration of the present embodiment, the movable taper block 14 is not pushed as described above when the force for pushing the first pushing piece 18 exceeds a predetermined value. Therefore, the cavity piece 23 is not pushed toward the workpiece W, and the workpiece W can be prevented from being damaged. In addition, what is necessary is just to set the elastic force (for example, spring constant of a spring) of the 1st elastic member 27 suitably according to mold conditions.

  In the present embodiment, the second pushing piece 19 is provided as a member for pushing the first pushing piece 18, and the dummy plunger 38 is provided as a member for pushing the second pushing piece 19. ing. First, the second pushing piece 19 is disposed in the second mold (upper mold) 21 so as to be movable in the mold opening / closing direction. Here, the first pushing piece 18 has a third tapered surface 18 c formed at a predetermined inclination angle at the other end 18 b opposite to the one end 18 a facing the first elastic member 27. On the other hand, the second pushing piece 19 has a fourth tapered surface 19c formed at a predetermined inclination angle corresponding to the third tapered surface 18c at one end 19a facing the first pushing piece 18. At this time, the second pushing piece 19 is disposed such that the fourth tapered surface 19c faces the third tapered surface 18c of the first pushing piece 18 and can contact.

  According to this configuration, by pushing the second pushing piece 19 in the direction from the lower end (the other end 19b) to the upper end (the one end 19a) in the mold opening / closing direction, the fourth tapered surface 19c and the third tapered surface 18c. The first push piece 18 can be pushed in the direction from the rear end (the other end 18b) to the front end (the one end 18a) in the direction orthogonal to the mold opening / closing direction.

  A second elastic member 28 is provided as a member for moving the second pushing piece 19 in the direction opposite to the pushing direction. More specifically, a predetermined elasticity is applied between the chase block (upper chase block) 22 that holds the insert (upper mold insert) 26 and the cavity piece 23 and one end of the second pushing piece 19. A second elastic member 28 to be generated is disposed. Therefore, when the force of pushing the second pushing piece 19 in the direction from the lower end (the other end 19b) to the upper end (the one end 19a) in the mold opening / closing direction is lost, the elastic force of the second elastic member 28 is lost. Thus, an action of moving the second pushing piece 19 in the direction from the upper end (one end 19a) toward the lower end (the other end 19b) is obtained. As an example, the second elastic member 28 employs a spring (coil spring) formed using a metal material. However, it is not limited to this, Other springs, such as a leaf spring, and elastic members other than a spring may be used.

  Next, the dummy plunger 38 is disposed in the first mold (lower mold) 20 so as to be movable in the mold opening / closing direction. Here, the dummy plunger 38 is disposed such that the upper end (one end 38 a) faces the lower end (the other end 19 b) of the second pushing piece 19 and can be contacted.

  According to this configuration, the dummy plunger 38 is pushed in the direction from the lower end (the other end 38b) to the upper end (the one end 38a) in the mold opening / closing direction, whereby the upper end (the one end 38a) of the dummy plunger 38 is pushed in the second direction. The second pushing piece 19 can be pushed in the same direction by contacting the lower end (the other end 19b) of the piece 19.

  In this embodiment, in order to move the dummy plunger 38, the transfer drive mechanism for moving the plunger 36 is used as a common drive mechanism. Therefore, since the above-described configuration can be added without significantly changing the configuration of the conventional device, a low-cost device can be realized with a simple configuration. In FIG. 2, for ease of understanding, the dummy plunger 38 and the plunger 36 are shown on the same surface. However, in the multi-plunger type transfer drive mechanism, the dummy plunger 38 and the plunger 36 are It is good also as a structure arranged in a line. In other words, the position fixing mechanism 12 includes two sets of tapered blocks that are combined with the tapered surfaces facing each other, and these are linked via an elastic member, so that the existing transfer mechanism can be used. It can be driven by some dummy plungers 38. According to such a configuration, it is possible to fix the cavity piece 23 at a position suitable for molding with a simple configuration.

  Next, the opening / closing operation associated with the resin molding operation of the resin mold 10 will be described with reference to FIGS.

  First, as shown in FIG. 2, the work W is supplied to the first mold (lower mold) 20 of the resin mold 10 that has been opened by a loader 122 (see FIG. 1). Further, the release film F is supplied between the second mold (upper mold) and the first mold (lower mold) (above the workpiece W) by the film supply mechanism 112. Further, the resin tablet T is loaded in the pot 35. In addition, in order to simplify a figure, illustration of the release film F is abbreviate | omitted in FIGS. Moreover, it is good also as a structure which does not provide the release film F by providing the sealing structure for resin leak prevention in the outer periphery of the cavity piece 23. FIG.

  Next, as shown in FIG. 3, the first mold (lower mold) 20 is raised and the resin mold 10 is closed. At this time, the lower mold chase block 33 contacts the upper mold chase block 22, and a closed space is formed between the second mold (upper mold) 21 and the first mold (lower mold) 20. The closed space is depressurized by a depressurization mechanism (not shown). Further, the cavity piece 23 comes into contact with the second member of the work W via the release film F, and the clamping operation is performed.

  Here, for example, when there is a variation in the height of the second member for each workpiece W, the spring 24 that supports the suspension of the cavity piece 23 is expanded and contracted by being pushed up by the mold member during clamping. By doing so, the effect that the cavity piece 23 moves in the mold opening and closing direction is obtained. Therefore, when clamping each workpiece | work W, the said dispersion | variation is absorbed and clamping operation | movement can be performed with an appropriate force, Therefore The damage of the workpiece | work W can be prevented. At this time, since the mold resin is not filled in the cavity 32, the cavity piece 23 is not affected by the resin pressure reaction force.

  Next, as shown in FIG. 4, the transfer drive mechanism is operated to push the plunger 36 in the direction of the second mold (upper mold) 21 to melt the mold resin into the upper mold 26b and the upper mold runner. It pumps to the cavity 32 through 26c. At this time, the upper surface of the second member Wb of the workpiece W is pressed by the cavity piece 23 via the release film F. Thereby, the second member exposure molding for exposing the second member Wb becomes possible. Of course, if the cavity piece 23 is set so as not to contact the second member Wb of the workpiece W via the release film F, molding without exposing the second member Wb is also possible.

  At this time, the dummy plunger 38 is also pushed in the direction of the second mold (upper mold) 21 by the operation of the transfer drive mechanism and comes into contact with the second pushing piece 19.

  At this time, since the filling of the mold resin into the cavity 32 has not been completed yet, a predetermined resin pressure (final molding pressure) is not applied, and only the pressure due to the resin flow is compared. Thus, the pressure is very low, and the cavity piece 23 does not move due to the resin reaction force.

  Next, as shown in FIG. 5, the transfer drive mechanism is operated, and the plunger 36 is further pushed in the direction of the second mold (upper mold) 21 to move the mold resin to the upper mold cull 26b and the upper mold runner 26c. The pressure is fed so as to reach the entire inside of the cavity 32. At the same time, the operation of the transfer drive mechanism causes the dummy plunger 38 to push the second pushing piece 19 in the direction of the second mold (upper die) 21 and the second pushing piece 19 moves to the first pushing piece. The piece 18 is pushed in the direction toward the movable taper block 14. As a result, the first pushing piece 18 pushes the movable taper block 14 via the first elastic member 27, and the first taper surface 14c and the second taper surface 16c are in contact with each other. It is pushed to a predetermined position where it slides and stops. Therefore, the operation of fixing the position of the fixed taper block 16 in the mold opening / closing direction is obtained.

  As described above, when the filling of the mold resin is almost completed, the fixed taper block 16 is mechanically fixed in the mold opening / closing direction by the operation of the transfer driving mechanism, that is, the cavity piece 23 is moved in the mold opening / closing direction. The effect of fixing the position is obtained. At this time, the resin pressure is gradually increasing toward the final molding pressure, and the cavity piece 23 gradually receives the resin pressure reaction force. However, since the cavity piece 23 is fixed, it does not move due to the resin pressure reaction force.

  Next, as shown in FIG. 6, the transfer drive mechanism is operated, and the plunger 36 is further pushed toward the second mold (upper mold) 21 to a predetermined uppermost position to fill the cavity 32. A predetermined resin pressure (final molding pressure) is applied to the molded resin. At the same time, by the operation of the transfer drive mechanism, the dummy plunger 38 further pushes the second pushing piece 19 in the direction of the second mold (upper die) 21 and the second pushing piece 19 is moved to the first pushing piece. The moving piece 18 is pushed in the direction toward the movable taper block 14. Thereby, the first pushing piece 18 further pushes the movable taper block 14 via the first elastic member 27. However, since the movable taper block 14 is stopped at a position where it abuts against the fixed taper block 16, the stage in which the force for pushing the first pushing piece 18 exceeds the predetermined elastic force of the first elastic member 27. Thus, an action is obtained in which the first elastic member 27 contracts and the movable taper block 14 is pushed with a force of a predetermined value or more.

  Thus, even in the stage where the final molding pressure is applied to the mold resin filled in the cavity 32, the position of the fixed taper block 16 is mechanically fixed in the mold opening / closing direction by the operation of the transfer drive mechanism. An action, that is, an action of fixing the position of the cavity piece 23 in the mold opening / closing direction is obtained. At this time, the cavity piece 23 receives the maximum resin pressure reaction force (final molding pressure). However, since the cavity piece 23 is fixed, the cavity piece 23 does not move due to the resin pressure reaction force. Further, the cavity piece 23 is not pushed against the workpiece W with a force equal to or greater than a predetermined value, and the clamping operation can be performed with an appropriate force, so that the workpiece W can be prevented from being damaged.

  As described above, according to the present embodiment, the cavity provided on the second mold (upper mold) 21 side using the transfer movement mechanism for moving the plunger provided on the first mold (lower mold) 20 side. The piece 23 can be moved. Accordingly, the cavity piece 23 can be prevented from moving due to the resin reaction force, and the workpiece W can be prevented from being clamped beyond an appropriate force. Therefore, it is possible to achieve both prevention of resin flash and prevention of breakage of the workpiece W, and high-precision molding quality can be realized. Thus, it has a great technical significance in that the above effect is achieved by an extremely simple mechanical mechanism without requiring complicated electrical control.

(Second embodiment)
Next, the resin mold 40 according to the second embodiment of the present invention will be described. The resin mold 40 according to the present embodiment has the same basic configuration as that of the resin mold 10 according to the first embodiment described above, but differs particularly in the configuration including the overflow cavity 42. Hereinafter, the present embodiment will be described focusing on the difference.

  Schematic diagrams (front sectional views) of the resin mold 40 according to this embodiment are shown in FIGS. 7 to 11 (these figures are also used as operation explanatory diagrams). As shown in the figure, the resin mold 40 is provided with an overflow cavity 42 in the second mold (upper mold) that allows the overflowed mold resin to flow into the cavity 32.

  According to this configuration, the mold resin can overflow from the cavity 32 to the overflow cavity 42 when the workpiece W is resin-molded. Therefore, the void in the cavity 32 can be pushed away to improve the resin filling property.

  Here, the overflow cavity 42 includes a piston 44 slidably disposed therein, a third elastic member 46 disposed between the bottom portion 42a and the piston 44 and generating a predetermined elastic force. It is configured with. As an example, the third elastic member 46 employs a spring (coil spring) formed using a metal material. However, it is not limited to this, Other springs, such as a leaf spring, and elastic members other than a spring may be used.

  According to this configuration, a predetermined resin pressure (final molding pressure) can be applied to the mold resin filled in the cavity 32. The elastic force (for example, the spring constant of the spring) of the third elastic member 46 may be set as appropriate according to the molding conditions.

  Note that the present invention is not limited to the above configuration, and as a modification, an overflow cavity 42 communicating with the cavity 32 of the second mold (upper mold) 21 may be provided in the first mold (lower mold) 20. Good (not shown).

  Next, the opening / closing operation associated with the resin molding operation of the resin mold 40 will be described with reference to FIGS. Of course, resin molding of the workpiece W in which the second member Wb is flip-chip mounted on the first member Wa is also possible as in the first embodiment, but in the present embodiment, the first member Wa includes the first member Wab. While taking the case of the workpiece | work W by which the two members Wb were mounted by wire bonding as an example, the resin mold operation | movement suitable for the said workpiece | work W is demonstrated.

  First, as shown in FIG. 7, the work W is supplied to the first mold (lower mold) 20 of the resin mold 10 that has been opened by a loader 122 (see FIG. 1). Further, the release film F is supplied between the second mold (upper mold) 21 and the first mold (lower mold) 20 (above the workpiece W) by the film supply mechanism 112. Further, the resin tablet T is loaded in the pot 35. In addition, illustration of the release film F is abbreviate | omitted in FIGS. 7-11 for the simplification of a figure.

  Next, as shown in FIG. 8, the first mold (lower mold) 20 is raised to close the resin mold 10. At this time, the lower mold chase block 33 contacts the upper mold chase block 22, and a closed space is formed between the second mold (upper mold) 21 and the first mold (lower mold) 20. The closed space is depressurized by a depressurization mechanism (not shown). Here, unlike the first embodiment described above, the cavity piece 23 is suspended and supported by the upper chase block 22 via the spring 24 at a position where it does not contact the second member Wb of the workpiece W. It is in a state. That is, the height dimension in the cavity 32 is set to be larger than the thickness dimension of the workpiece W, and the clamping operation in which the cavity piece 23 contacts the workpiece W is not performed. However, if the configuration of the cavity piece 23 is a configuration (not shown) having a protrusion at the lower end that contacts only the flat portion of the workpiece W mounted by wire bonding, the resin molding operation similar to the first embodiment described above Can also be performed.

  Next, as shown in FIG. 9, the transfer driving mechanism is operated to push the plunger 36 in the direction of the second mold (upper mold) 21 to melt the mold resin into the upper mold cull 26b and the upper mold runner. It pumps to the cavity 32 through 26c. At this time, the dummy plunger 38 is also pushed in the direction of the second mold (upper mold) 21 by the operation of the transfer driving mechanism and comes into contact with the second pushing piece 19.

  At this time, the height in the cavity 32 is larger than the thickness of the workpiece W, that is, the space in the cavity 32 is widely secured. Therefore, compared with the case where the space in the cavity 32 is narrow, the flow rate of the mold resin filled in the cavity 32 can be reduced. Therefore, it is possible to reduce the load applied to the workpiece W by the resin being pumped and to prevent the workpiece W from being damaged. In particular, a remarkable effect is exerted on a configuration including a thin wiring (wire) such as a workpiece W mounted by wire bonding.

  Next, as shown in FIG. 10, the transfer drive mechanism is operated, and the plunger 36 is further pushed in the direction of the second mold (upper mold) 21 to move the mold resin to the upper mold cull 26b and the upper mold runner 26c. The pressure is fed so as to reach the entire inside of the cavity 32. At the same time, the operation of the transfer drive mechanism causes the dummy plunger 38 to push the second pushing piece 19 in the direction of the second mold (upper die) 21 and the second pushing piece 19 moves to the first pushing piece. The piece 18 is pushed in the direction toward the movable taper block 14. As a result, the first pushing piece 18 pushes the movable taper block 14 via the first elastic member 27, and the first taper surface 14 c of the movable taper block 14 and the second taper surface 16 c of the fixed taper block 16. Are in contact with each other and further pushed to a sliding state. Accordingly, the fixed taper block 16 is pushed in the direction from the upper end (the other end 16b) to the lower end (the one end 16a), and the cavity piece 23 is pushed downward in the mold opening / closing direction (the direction toward the cavity 32). Is obtained. The operation of the plunger 36 and the cavity piece 23 causes the mold resin to overflow from the cavity 32 to the overflow cavity 42.

  As described above, when the filling of the mold resin is almost completed, the cavity piece 23 is mechanically pushed downward (in the direction toward the cavity 32) in the mold opening / closing direction by the operation of the transfer driving mechanism. An effect of narrowing the space (reducing the height dimension in the cavity 32) is obtained. At this time, due to the overflow of the mold resin into the overflow cavity 42, the voids in the cavity 32 can be pushed away to improve the resin filling property. Further, the cavity piece 23 gradually receives the resin pressure reaction force, but receives the resin pressure reaction force by the action of the movable taper block 14 and the fixed taper block 16 as in the first embodiment. Thus, the cavity piece 23 does not move.

  Next, as shown in FIG. 11, the transfer drive mechanism is operated, and the plunger 36 is further pushed toward the second mold (upper mold) 21 to a predetermined uppermost position to fill the cavity 32. A predetermined resin pressure (final molding pressure) is applied to the molded resin. Even when the mold resin overflows into the overflow cavity 42, the configuration including the third elastic member 46 allows a predetermined resin pressure (final molding pressure) to be applied to the mold resin in the cavity 32.

  At the same time, by the operation of the transfer drive mechanism, the dummy plunger 38 further pushes the second pushing piece 19 in the direction of the second mold (upper die) 21 and the second pushing piece 19 is moved to the first pushing piece. The moving piece 18 is pushed in the direction toward the movable taper block 14. As a result, the first pushing piece 18 further pushes the movable taper block 14 via the first elastic member 27, and the movable taper block 14 pushes the fixed taper block 16. Accordingly, the cavity piece 23 is pushed by the fixed taper block 16 to a predetermined position in the mold opening / closing direction. At this time, when the force for pushing the first pushing piece 18 exceeds the predetermined elastic force of the first elastic member 27, the first elastic member 27 is contracted, and the movable taper block is moved with a force greater than a predetermined value. Therefore, the cavity piece 23 is pushed to a predetermined position in the mold opening / closing direction and stopped.

  As described above, even when the final molding pressure is applied to the mold resin filled in the cavity 32, the fixed taper block 16 is mechanically pushed to a predetermined position in the mold opening / closing direction by the operation of the transfer drive mechanism. An action of moving and stopping, that is, an action of stopping and stopping the cavity piece 23 to a predetermined position in the mold opening / closing direction is obtained. At this time, the cavity piece 23 receives the maximum resin pressure reaction force (final molding pressure). However, since the cavity piece 23 is fixed, the cavity piece 23 does not move due to the resin pressure reaction force. Further, the cavity piece 23 is not pushed against the workpiece W with a force equal to or greater than a predetermined value, and the clamping operation can be performed with an appropriate force, so that the workpiece W can be prevented from being damaged.

  As described above, according to the present embodiment, the cavity provided on the second mold (upper mold) 21 side using the transfer movement mechanism for moving the plunger provided on the first mold (lower mold) 20 side. The piece 23 can be moved. As a result, the space in the cavity 32 can be gradually narrowed during the filling of the mold resin, so that the initial flow velocity of the resin to be filled can be reduced, and particularly, it is thin like a workpiece W mounted by wire bonding. A remarkable effect is obtained in preventing damage to the workpiece W provided with wiring (wires). Further, it is possible to prevent the cavity piece 23 from moving due to the resin pressure reaction force, and it is possible to prevent the workpiece W from being pressurized beyond an appropriate force. Therefore, it is possible to achieve both prevention of resin flash and prevention of breakage of the workpiece W, and high-precision molding quality can be realized. Thus, it has a great technical significance in that the above effect is achieved by an extremely simple mechanical mechanism without requiring complicated electrical control.

(Third embodiment)
Next, the resin mold 50 according to the third embodiment of the present invention will be described. The resin mold 50 according to the present embodiment is an example configured as a compression mold, although the basic configuration is the same as that of the resin mold 10 according to the first embodiment described above. That is, the resin mold apparatus provided with the resin mold 50 is not a transfer molding apparatus according to the first embodiment and the second embodiment but a compression molding apparatus. Accordingly, the resin mold 50 is different in that the resin mold 50 does not have the configuration of the pot 35, the plunger 36, the upper mold cull 26b communicating with the cavity 32, the upper mold runner 26c, etc. To do. Hereinafter, the present embodiment will be described focusing on the difference.

  Schematic views (front sectional views) of the resin mold 50 according to the present embodiment are shown in FIGS. 12 and 13 (these figures are also used as operation explanatory diagrams). As shown in the figure, the resin mold 50 is configured such that the first mold (lower mold) 20 does not include the pot 35 and the plunger 36 that are the components of the resin mold 10. Further, the second mold (upper mold) does not include the upper mold cull 26b and the upper mold runner 26c that communicate with each other.

  Next, the opening / closing operation associated with the resin molding operation of the resin mold 50 will be described with reference to FIGS. As in the first embodiment described above, the work W in which the second member Wb is flip-chip mounted on the first member Wa will be described as an example. However, the configuration of the workpiece W is not limited.

  First, as shown in FIG. 12, a workpiece W is supplied to a first mold (lower mold) 20 of a resin mold 10 by a loader 122 (see FIG. 1), and a second mold (upper mold) is received by a film supply mechanism 112. The release film F is supplied between the mold 21 and the first mold (lower mold) 20 (above the workpiece W), and a predetermined amount of mold resin (here, the liquid resin R) is placed on the workpiece W. In the state of being placed (dropped), the first mold (lower mold) 20 is raised to close the resin mold 10. At this time, the lower mold chase block 33 contacts the upper mold chase block 22, and a closed space is formed between the second mold (upper mold) 21 and the first mold (lower mold) 20. Here, unlike the first embodiment described above, the cavity piece 23 is suspended and supported by the upper chase block 22 via the spring 24 at a position where it does not contact the second member Wb of the workpiece W. It is in a state. That is, the height dimension in the cavity 32 is set to be larger than the thickness dimension of the workpiece W, and the clamping operation in which the cavity piece 23 contacts the workpiece W is not performed. For simplification of the drawing, the release film F is not shown in FIGS.

  Next, as shown in FIG. 13, the drive mechanism (for example, a mechanism similar to the transfer drive mechanism according to the first embodiment described above may be employed) is operated, and the dummy plunger 38 is moved to the second mold. It pushes in the direction of (upper die) 21. Thereby, the dummy plunger 38 pushes the second pushing piece 19 in the direction of the second mold (upper die) 21, and the second pushing piece 19 moves the first pushing piece 18 to the movable taper block 14. Push in the direction you head. As a result, the first pushing piece 18 pushes the movable taper block 14 via the first elastic member 27, and the first taper surface 14 c of the movable taper block 14 and the second taper surface 16 c of the fixed taper block 16. Are in contact with each other and further pushed to a sliding state. Accordingly, the fixed taper block 16 is pushed in the direction from the upper end (the other end) to the lower end (the one end), and the cavity piece 23 is pushed downward in the mold opening / closing direction (the direction toward the cavity 32). It is done.

  At this time, when the force for pushing the first pushing piece 18 exceeds the predetermined elastic force of the first elastic member 27, the first elastic member 27 is contracted, and the movable taper block is moved with a force greater than a predetermined value. The effect | action which avoids the state which pushes 14 is acquired. That is, if the elastic force (for example, the spring constant of the spring) of the first elastic member 27 is appropriately set, compression molding in which the internal pressure (resin pressure) of the cavity 32 is controlled to the optimum value can be performed. .

  As described above, according to the present embodiment, the cavity piece 23 provided on the second mold (upper mold) 21 side is moved using the drive mechanism provided on the first mold (lower mold) 20 side. be able to. If the elastic force (for example, the spring constant of the spring) of the first elastic member 27 is appropriately set, the internal pressure (resin pressure) of the cavity 32 can be controlled to an optimum value. Therefore, it is possible to prevent the workpiece W from being pressed beyond an appropriate force, and to realize high-precision molding quality. Thus, it has a great technical significance in that the above effect is achieved by an extremely simple mechanical mechanism without requiring complicated electrical control.

  As described above, according to the resin mold and the resin molding apparatus according to the present invention, the position of the cavity piece can be fixed by a simple mechanical mechanism during resin molding. Even if the reaction force acts, the cavity piece does not move, and the occurrence of resin flash can be prevented. Moreover, when the force with which the first pushing piece pushes the movable taper block becomes equal to or greater than a predetermined value, the intervening first elastic member contracts, so that the movable taper block cannot be pushed. Therefore, it is possible to perform resin molding without damaging the second member regardless of the number and arrangement of the second members (for example, chips) mounted on the first member (for example, the substrate) of the workpiece. In particular, chip exposure molding can be suitably performed without damaging the chip in a package exposing the chip.

  The present invention is not limited to the embodiments described above, and various modifications can be made without departing from the present invention. In particular, the transfer molding apparatus has been described as an example in the first embodiment and the second embodiment, but application to a compression molding apparatus is possible as shown in the third embodiment.

10, 40, 50, 90 Resin mold 12 Position fixing mechanism 14 Movable taper block 14c First taper surface 16 Fixed taper block 16c Second taper surface 18 First push piece 18c Third taper surface 19 Second push piece 19c Fourth taper surface 20 First mold (lower mold)
21 Second mold (upper mold)
22 Chase block (upper chase block)
23 Cavity piece 24 Spring 26 Insert (upper mold insert)
27 First elastic member 28 Second elastic member 31 Work support portion 32 Cavity 33 Chase block (lower chase block)
36 Plunger 38 Dummy plunger 42 Overflow cavity 46 Third elastic member 100 Resin molding device 102 Stocker 104 Set stand 106 Tablet supply unit 108 Heater block 110 Press device 112 Film supply mechanism 114 Set unit 116 Gate break unit 118 Stocker 120 Magazine 122 Loader 124 Unloader 126 Guide part F Release film R Liquid resin T Resin tablet W Work Wa First member Wb Second member Wp Molded product

Claims (8)

A resin mold that resin molds a work in which a second member is mounted on a first member,
A first mold provided with a workpiece support portion for supporting the workpiece;
A second mold provided with a cavity for accommodating the second member of the workpiece,
The cavity is composed of an insert that forms a side portion, and a cavity piece that is slidably disposed with respect to the insert and forms a bottom portion,
The second mold is provided with a position fixing mechanism for fixing the position of the cavity piece in the mold opening and closing direction,
The position fixing mechanism includes a movable taper block having a first taper surface and arranged to be movable in a direction orthogonal to the mold opening / closing direction, and a second taper surface, the second taper surface being the movable taper block. A fixed taper block that is disposed so as to be able to abut against the first taper surface and is movable in the mold opening and closing direction, and a first pushing piece that pushes the movable taper block. With
A resin mold mold, wherein a first elastic member for generating an elastic force is disposed between the movable taper block and the first pushing piece. The second mold is provided with a second pushing piece movable in the mold opening and closing direction,
The first pushing piece has a third tapered surface at the other end opposite to the one end facing the first elastic member,
The second pushing piece has a fourth taper surface at one end, and the fourth taper surface is disposed so as to be able to abut against the third taper surface of the first pushing piece. The resin mold according to claim 1. The first mold is provided with a dummy plunger movable in the mold opening and closing direction,
The resin mold mold according to claim 2, wherein one end of the dummy plunger and the other end of the second pushing piece are disposed so as to contact each other. The second elastic member for generating an elastic force is disposed between the chase block holding the insert and the cavity piece and one end of the second pushing piece. The resin mold according to claim 3. The resin mold die according to any one of claims 1 to 4, wherein the first elastic member is a spring formed using a metal material. The first mold or the second mold is provided with an overflow cavity that allows the overflowed resin to flow in communication with the cavity.
The overflow cavity includes a piston slidably disposed therein, and a third elastic member disposed between the bottom portion and the piston to generate a resilient force. Item 6. A resin mold according to any one of Items 1 to 5. The first mold is provided with a plunger for supplying resin into the cavity,
The resin mold according to claim 3, wherein a transfer drive mechanism for moving the plunger is commonly used as the drive mechanism for moving the dummy plunger. A resin mold apparatus comprising the resin mold according to claim 1.

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