JP2018200548A - Monitoring system - Google Patents

Abstract

To provide a monitoring system which can highly accurately detect an abnormal symptom of quality of a product produced by a processing device.SOLUTION: A monitoring system comprises: sensors 60 which measure a formal condition about a processing device 5 during processing of a product; an inspection device 8 which inspects a product processed by the processing device; and a processing device 1 which can communicate with the processing device and the inspection device. The processing device comprises: a communication part 12 which receives measured data acquired by the sensors and quality inspection data acquired by the inspection device; a calculation part 111 which, using the measured data, calculates index values to evaluate quality of the product that is under processing by the processing device; and a determination part 113 which determines whether or not there is an abnormal symptom of product quality caused by condition change of the processing device on the basis of the index values and the quality inspection data.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a monitoring system.

  With regard to processing devices such as grinding machines and lathes, changes in temperature due to changes in temperature, aging, wear and deflection of jigs, etc. lead to product quality abnormalities. Therefore, monitoring the change in state of the processing apparatus is important in product quality control.

  Japanese Patent Laying-Open No. 2006-173373 (hereinafter referred to as Patent Document 1) proposes a manufacturing system including a monitoring system for monitoring an abnormality of a processing apparatus. The monitoring system described in Patent Literature 1 measures a value representing the state of the machining apparatus, and detects an abnormality of the machining apparatus using a preset criterion for the state measurement value of the machining apparatus.

JP 2006-173373 A

  In the monitoring system described in Patent Literature 1, in order to monitor a product abnormality, the abnormality of the machining apparatus is detected by comparing the measured state value of the machining apparatus with only a set reference. If this monitoring system detects an abnormality in the processing device due to the above change in the state of the processing device, it stops the operation of the processing device and identifies the abnormality in the processing device that caused the product quality abnormality. Then, after identifying, work to eliminate the abnormality. Therefore, the period during which the machining apparatus is stopped is lengthened and productivity is lowered.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a monitoring system that can detect a sign of abnormality in machining quality by a machining apparatus with high accuracy.

The monitoring system according to the present invention includes a first sensor that measures at least one of a geometric state and an electrical state of a processing apparatus during product processing, and an inspection that inspects the quality of a product processed by the processing apparatus. A monitoring system including a device and a processing device capable of communicating with the first sensor and the inspection device, wherein the processing device receives measurement data by the first sensor and quality inspection data by the inspection device. Based on the receiving unit, the calculating unit for calculating the index value for evaluating the quality of the product being processed using the measurement data received by the receiving unit, and the shape of the processing device based on the index value and the quality inspection data A determination unit that determines whether or not there is a sign of an abnormal product quality due to at least one of a state change and an electrical state change.
According to this monitoring system, based on both data of measurement data of at least one of the shape state and electrical state of the processing device during processing of the product and quality inspection data of the product processed by the processing device. Thus, a sign of abnormality in the machining quality of the machining apparatus due to at least one of a change in the shape of the machining apparatus and an electrical state change is detected. In other words, in this detection method, not only the shape state or electrical state of the processing apparatus but also the quality inspection data is taken into account, and signs of abnormality in the processing quality are detected. Therefore, it is possible to detect a sign of an abnormality in the product quality before an actual abnormality occurs in the product quality, and to identify a state that causes the quality abnormality. Thereby, it is possible to prevent the occurrence of quality abnormality and to easily identify the cause of quality abnormality on the processing apparatus side. As a result, the period during which the processing apparatus is stopped can be shortened, and a decrease in productivity due to the stop of the processing apparatus can be suppressed.

Preferably, the monitoring system further includes a second sensor for measuring a processing amount of the product by the processing device, the first sensor measures a processing power amount in the processing device, and the index value is the processing per unit time. It is a value calculated using at least one of the machining amount by the apparatus and the ratio of the machining amount to the machining power amount per unit time as a parameter.
Thereby, in this detection method, the sign of abnormality of processing quality is detected using the actual processing amount in the processing apparatus. Therefore, it is possible to detect a sign of product quality abnormality with higher accuracy than a method of detecting a sign of product quality abnormality due to only a shape change of the processing apparatus without using an actual processing amount in the processing apparatus.

Preferably, the determination unit predicts the presence / absence of a sign of quality abnormality based on a change in a relationship between a plurality of index values calculated from each of a plurality of measurement data continuously measured and quality inspection data.
Thereby, even if it is determined that there is no sign of product quality abnormality at the time of determination, for example, the sign can be predicted in response to a change over time.

Preferably, the calculation unit stores a calculation formula for calculating the index value, and adjusts the calculation formula based on the index value and the quality inspection data.
As a result, the accuracy of detecting signs of product quality abnormality can be improved, and the quality of the product can be predicted with high accuracy based only on the measurement data in the processing apparatus.

  According to this invention, it is possible to detect a sign of abnormality in machining quality by the machining apparatus with high accuracy. In addition, it is possible to easily identify the cause of abnormality in processing quality on the processing apparatus side.

It is the schematic showing an example of the composition of the monitoring system concerning an embodiment. It is the schematic which shows an example of a structure of a process part and a sensor of the processing apparatus which is a grinding apparatus. FIG. 3 is an enlarged schematic view of the periphery of a workpiece being processed by the processing apparatus of FIG. It is the figure which showed the mode of the time change of the grinding electric power (graph A) in grinding, and the grinding residual amount (graph B). It is the schematic which shows an example of a structure of a processing apparatus. It is a flowchart showing an example of operation | movement of a processing apparatus. It is a flowchart showing the specific processing content of step S1 of FIG. It is a flowchart showing the specific processing content of step S1 of FIG.

  Hereinafter, preferred embodiments will be described with reference to the drawings. In the following description, the same parts and components are denoted by the same reference numerals. Their names and functions are also the same. Therefore, these descriptions will not be repeated.

[First Embodiment]
<System configuration>
FIG. 1 is a schematic diagram illustrating an example of a configuration of a monitoring system 100 according to the present embodiment. Referring to FIG. 1, a monitoring system 100 according to the present embodiment includes a processing device 1, a sensor 60 that is a measuring device that measures the geometric state of a processing device 5 during product processing, and an inspection device 8. , And output device 2. Further, as shown in FIG. 1, a server 3 as a storage device is included. The server 3 may be included in the processing device 1 or may be a different device connected to the processing device 1 via a wired or wireless communication network such as the Internet.

  The processing device 5 and the inspection device 8 are provided in the same production line. The workpiece (product) W is conveyed in the order of the processing device 5 and the inspection device 8 in the direction of arrow F in FIG. Therefore, the processing device 5 is arranged on the upstream side of the production line, and the inspection device 8 is arranged on the downstream side of the production line. The workpiece W is processed by the processing device 5, and then is carried to the inspection device 8 and inspected.

  In addition to the sensor 60, the processing device 5 further includes a processing unit 50 that processes the workpiece W, and a communication unit 70 configured by a wireless module or the like for communicating with the processing device 1. The sensor 60 measures the state of the processing unit 50 in order to measure the geometric state of the processing apparatus 5 during product processing. The sensor 60 is communicably connected to the communication unit 70 and inputs a signal indicating the measurement result to the communication unit 70. The communication unit 70 transmits measurement data based on a signal indicating a measurement result by the sensor 60 to the processing device 1.

  In addition, the inspection device 8 includes a measurement unit 80 that measures a part of the work W that is required for a predetermined inspection item, a communication unit 90 that includes a wireless module for communicating with the processing device 1, and the like. including. The measurement unit 80 is communicably connected to the communication unit 90 and inputs a signal indicating a measurement value to the communication unit 90. The communication unit 90 transmits quality inspection data based on a signal indicating a measurement value obtained by the measurement unit 80 to the processing device 1.

  The workpiece W is an annular part, for example, an inner ring or an outer ring of a rolling bearing. The workpiece W in the present embodiment is an outer ring of a rolling bearing whose inner surface is a ground surface. In this case, the processing device 5 is a grinding device that grinds the inner peripheral surface of the workpiece W, for example. The inspection items of the inspection apparatus 8 include the roundness, cylindricity, dimensions of each position, and the like of the workpiece W.

  The processing device 1 is a computer device called a so-called edge computer. The processing device 1 is communicably connected to the processing device 5 and the inspection device 8.

  The output device 2 is an information output device such as a display or a speaker. The output device 2 is communicably connected to the processing device 1 and receives information to be output from the processing device 1.

<Device configuration>
FIG. 2 is a schematic diagram illustrating an example of the configuration of the processing unit 50 and the sensor (first sensor) 60 of the processing apparatus 5 that is a grinding apparatus. With reference to FIG. 2, the processing unit 50 includes a cutting base 52 that holds and rotates a workpiece W, a wheel head 55 that has a grinding wheel shaft 54 on which a grinding wheel 53 is mounted, and a grinding wheel of the wheel head 55. A wheel head driving motor 56 that rotates the shaft 54 via a belt 57 and a cutting motor that moves the cutting base 52 relative to the wheel head 55 to cause the grindstone 53 to perform a cutting operation (grinding) on the workpiece W. 58. The processing unit 50 further includes an in-process gauge 59 for measuring the processing dimension of the workpiece W. The in-process gauge 59 is a second sensor that measures the processing amount of the workpiece W by the processing apparatus 5.

  Referring to FIG. 2, the sensor 60 of the processing apparatus 5 includes a current sensor 61 that measures a current (motor current) Im flowing through the wheel head driving motor 56 and a vibration sensor that measures the vibration Pu of the wheel head 55. 62 and a temperature sensor 63 that measures the temperature Te of the wheel head 55. As an example, these sensors 61 to 63 are attached to the wheel head driving motor 56 and the wheel head 55 from the outside and measure the motor current Im, the vibration Pu, and the temperature Te. The sensors 61 to 63 are communicably connected to the communication unit 70 and input a signal indicating a measurement value to the communication unit 70. The communication unit 70 transmits measurement data based on a signal indicating a measurement value from the sensors 61 to 63 to the processing device 1.

  The workpiece W moves toward the wheel head 55 in the axial direction of the workpiece W to the position where the grindstone 53 comes into contact with the inner peripheral surface of the workpiece W (traverse). The grindstone 53 in contact with the inner peripheral surface of the workpiece W rotates according to the rotation of the grindstone shaft 54, whereby the inner peripheral surface of the workpiece W is ground by the grindstone 53. After grinding, the workpiece W is moved in the direction of retreating from the wheel head 55 in the axial direction of the workpiece W by the cutting table 52.

  FIG. 3 is an enlarged schematic view around the workpiece W being processed. Referring to FIG. 3, in-process gauge 59 is provided in the vicinity of grindstone 53. For this reason, the gauge part 59a of the in-process gauge 59 contacts the inner peripheral surface of the workpiece W being processed, and measures the inner diameter. As an example, the in-process gauge 59 measures the inner diameter using the bottom surface of the track groove on the inner circumferential surface of the workpiece W as a measurement point. The measured value by the in-process gauge 59 is an actual processing amount (grinding amount).

  The in-process gauge 59 is communicably connected to the communication unit 70 and inputs a signal indicating the gauge position X to the communication unit 70 as a measurement value. The communication unit 70 transmits measurement data based on a signal indicating a measurement value by the in-process gauge 59 to the processing device 1.

  FIG. 4 is a diagram showing a temporal change of the grinding power WA (graph A) during grinding based on the current sensor 61 and the remaining grinding amount (graph B) indicated by the in-process gauge 59. The grinding power WA is the power consumption in the wheel head driving motor 56 and is obtained by multiplying the motor current Im of the wheel head driving motor 56 by the motor voltage E.

  The grinding process includes an indexing process, a semi-rapid process, a black skin process, a roughing process, a finishing process, and a spark-out (SO) process, and is performed in this order. In the indexing process, the grindstone 53 is not in contact with the workpiece W. In the semi-urgent process, the grindstone 53 comes into contact with the shoulder of the workpiece W track. In the quasi-urgent process, the grindstone 53 does not reach the entire inner peripheral surface of the workpiece W, and is in full contact during the black skin process. In the roughing process, the grindstone 53 grinds the inner peripheral surface of the workpiece W with a predetermined grinding amount with a constant power, and in the finishing process, the grinding is performed so that the surface roughness has a predetermined accuracy.

  Referring to graph A in FIG. 4, grinding power WA increases until the grindstone 53 comes into full contact in the black skin process and reaches the rough process after the grindstone 53 starts to contact the workpiece W in the semi-urgent process. Thereby, the speed of the grinding process by the cutting motor 58 is changed. In the roughing process, the grinding power WA is constant because the inner peripheral surface of the workpiece W is ground with a predetermined grinding amount with constant power. Thereafter, the grinding power WA decreases as the surface roughness of the inner peripheral surface of the workpiece W approaches a predetermined accuracy in the finishing step.

  Further, referring to graph B of FIG. 4, the bottom surface of the track groove on the inner peripheral surface of the work W until the grindstone 53 starts contacting the entire surface in the black skin process after the grindstone 53 starts contacting the work W in the semi-urgent process. Therefore, the grinding amount by the grindstone 53 is not measured. Grinding of the bottom surface of the raceway groove proceeds from the start of the entire contact of the grindstone 53 in the black skin process to the finishing process through the roughing process, so the grinding amount by the grindstone 53 increases. Thereafter, as the inner peripheral surface of the workpiece W approaches the predetermined accuracy in the finishing process, the increasing rate of the grinding amount decreases, and the grinding is completed at the end of the finishing process.

  FIG. 5 is a schematic diagram illustrating an example of the configuration of the processing apparatus 1. Referring to FIG. 5, processing device 1 receives data from processing unit 11 including a CPU (Central Processing Unit) (not shown) and a memory for storing a program executed by CPU, processing device 5 and inspection device 8. A receiving unit 12 for receiving and a transmitting unit 13 for transmitting data to the output device 2 such as a display or a speaker are included. The processing unit 11 can further communicate with the server 3 that is an external device.

<Overview of operation>
When the abrasive grain state of the grindstone 53 of the processing device 5 and the shape of the processing unit 50 such as the amount of deflection of the quill 54a change, the processing state of the workpiece W by the processing device 5, that is, the quality of the workpiece W changes. For example, as shown in FIGS. 2 and 3, the quill 54a to which the grindstone 53 is attached has a smaller diameter than the grindstone shaft 54, and the quill 54a is in a cantilever state. It is easy to bend by.

  The shape of the processing unit 50 changes according to the amount of use up to a certain amount of use, and the degree of change increases (the shape changes abruptly) when the amount of use exceeds that amount. In the case of a normal degree of change, since there is a predetermined correlation between the shape of the processing unit 50 and the quality of the workpiece W, an abnormality in the processing quality of the processing device 5 is predicted based on the shape change of the processing unit 50. Is done. On the other hand, when the usage amount of the processing device 5 increases and the shape of the processing unit 50 changes suddenly, the above correlation between the shape of the processing unit 50 and the quality of the workpiece W is not applied. Therefore, the monitoring system 100 according to the present embodiment includes measurement data on the shape of the processing unit 50 during processing of the workpiece W, and quality inspection data in the inspection device 8 of the workpiece W processed by the processing device 5. Based on the above, a sign of quality abnormality of the workpiece W is detected. Thereby, even if the usage-amount of the processing apparatus 5 increases and the shape of the process part 50 changes rapidly, the sign of abnormality of the quality of the workpiece | work W can be detected with high precision.

<Functional configuration>
In order to detect a sign of quality abnormality of the workpiece W, the processing unit 11 of the processing apparatus 1 includes a calculation unit 111, a comparison unit 112, and a determination unit 113, as shown in FIG. These are functions mainly realized by the CPU when a CPU (not shown) included in the processing unit 11 reads and executes a program stored in the memory.

  The function represented by the calculation unit 111 (hereinafter, the calculation unit 111) is a parameter used when obtaining an index value for evaluating the quality of the workpiece W being processed by the processing device 5 from the measurement data of the processing device 5. Is calculated. The parameters are, for example, the machining removal amount R and the machining removal efficiency RE. The processing removal amount R is a grinding amount by the processing device 5 per unit time, and is obtained as a change amount (processing amount) per unit time of the gauge position X of the in-process gauge 59. The machining removal efficiency RE is a ratio of the machining removal amount R to the grinding power amount (processing power amount) per unit time. Here, the grinding power amount can be obtained from, for example, grinding power WA as shown in FIG.

In order to calculate the machining removal amount R from the gauge position X of the in-process gauge 59, the calculation unit 111 stores the following calculation formula (1) in advance. Then, the machining removal rate R is calculated by substituting the gauge position X acquired from the machining apparatus 5 into the calculation formula (1).
R = Xn−X (n−1) (n = 0, 1,...) (1)

Further, in order to calculate the machining removal efficiency RE from the gauge position X of the in-process gauge 59 and the grinding power WA, the calculation unit 111 stores the following calculation formula (2) in advance. Then, the machining removal efficiency RE is calculated by substituting the gauge position X and the motor current Im acquired from the machining apparatus 5 into the calculation formula (2). Note that grinding power WA = motor current Im × motor voltage E.
RE = (Xn−X (n−1)) ÷ (Wn−W (n−1)) (2)

  The calculation unit 111 calculates an index value using at least one of the two parameters. The calculated index value is a value corresponding to the quality inspection data. In the present embodiment, the value corresponding to the quality inspection data is, for example, the value Ci ′ corresponding to the roundness Ci. By using such an index value, it is possible to easily detect the presence or absence of a sign of quality abnormality of the workpiece W in consideration of measurement data and quality inspection data of the processing unit 50.

The calculation unit 111 stores in advance the following calculation formula (3) using A and B as coefficients in order to obtain index values from the above parameters.
Ci ′ = A × R + B × RE (3)

  Note that the index value is not limited to that calculated using both of the two parameters. The index value may be a value calculated without using the machining removal efficiency RE using only the machining removal rate R as a parameter, or may be calculated without using the machining removal rate R using only the machining removal efficiency RE as a parameter. It may be a value.

  The function represented by the comparison unit 112 (hereinafter, the comparison unit 112) compares the calculated index value with the quality inspection data. Then, the comparison unit 112 uses a value indicating the degree of deviation of the index value from the quality inspection data as a comparison result. In the present embodiment, the comparison unit 112 calculates a ratio (Ci ′ / Ci) of the index value to the quality inspection data as a comparison result. As another example, the comparison result may be an absolute value of a difference between the index value and the quality inspection data.

A function represented by the determination unit 113 (hereinafter, determination unit 113) determines whether or not the apparatus state of the processing apparatus 5 is in a state of an indication of quality abnormality based on the comparison result of the comparison unit 112. Therefore, the determination unit 113 stores in advance as a threshold a range (normal range) in which there is no sign of quality abnormality in the comparison result of the comparison unit 112. The normal range is a range in which the degree of deviation of the index value from the quality inspection data can be determined as having no sign of quality abnormality. When the comparison result is a ratio of the index value to the quality inspection data, the normal range is, for example, 0.8 or more and 1.2 or less. In this case, the determination unit 113 determines that there is no sign of quality abnormality when the comparison result (Ci ′ / Ci) satisfies the determination formula (4) below, and if there is a sign of quality abnormality when the comparison result is not satisfied judge.
0.8 ≦ Ci ′ / Ci <1.2 (4)

  The normal range may be set in multiple stages for each level of indication of quality abnormality. In this case, the determination unit 113 determines the level of the quality abnormality sign as well as the presence or absence of the quality abnormality sign.

  When the determination unit 113 determines that there is a sign of quality abnormality, the processing unit 11 outputs a control signal to the transmission unit 13 and causes the output device 2 to transmit information for outputting a warning. Thereby, a warning indicating that there is a sign of quality abnormality is output from the output device 2. This warning includes display of a warning screen on a display, output of a warning sound from a speaker, and the like. Thereby, the user can grasp that there is a sign of quality abnormality.

  Note that the processing unit 11 may cause the output device 2 to output information indicating that there is no sign of quality abnormality in the determination unit 113. That is, the processing unit 11 may cause the output device 2 to output the determination result in the determination unit 113. Thereby, the user can also grasp that there is no sign of quality abnormality.

<Operation flow>
FIG. 6 is a flowchart showing an example of the operation of the processing apparatus 1. The processing apparatus 1 repeats the operation shown in the flowchart of FIG. 6 at a predetermined timing, for example, at a predetermined interval, at the start of machining the workpiece W, at a predetermined time after the start, or the like. The operation shown in the flowchart of FIG. 6 is realized by a CPU (not shown) of the processing apparatus 1 reading out and executing a program stored in the memory and exhibiting each function shown in FIG.

  With reference to FIG. 5 and FIG. 6, first, the processing apparatus 1 acquires measurement data of the shape state of the processing apparatus 5 during processing of the workpiece W and accumulates it in the server 3 (step S <b> 1). As an example, the processing apparatus 1 determines the gauge position X of the in-process gauge 59 during processing of the workpiece W, the motor current Im of the wheel head driving motor 56, the vibration Pu of the wheel head 55, the temperature Te of the wheel head 55, and the like. get.

  Further, the processing device 1 acquires quality inspection data in the inspection device 8 such as the roundness Ci of the workpiece W processed by the processing device 5 and stores it in the server 3 in association with measurement data from the processing device 5. (Step S3). The processing device 1 calculates parameters (processing removal rate R, processing removal efficiency RE) from the measurement data of the processing device 5 stored in the server, and calculates an index value using the parameters (step S5). Then, the processing device 1 compares the calculated index value with the quality inspection data stored in the server 3 in association with the measurement data used for calculating the index value (step S7). Note that the processing device 1 may calculate parameters when receiving the measurement data from the processing device 5, and store the calculated parameters in the server 3.

  When the comparison result between the index value and the quality inspection data is within a range in which the apparatus state of the processing apparatus 5 has no sign of quality abnormality (NO in step S9), the processing apparatus 1 has no sign of quality abnormality. Is determined. In this case, the processing device 1 does not output a warning. Alternatively, the processing device 1 may cause the output device 2 to output a determination result that there is no sign of quality abnormality.

  When the comparison result is out of the above range (YES in step S9), the processing device 1 determines that there is an indication of quality abnormality. In this case, the processing device 1 causes the output device 2 to output a warning (step S11).

  7 and 8 are flowcharts showing the specific processing contents of step S1 of FIG. 7 and 8, the measurement data is received every millisecond for each step shown in FIG. 4, and the machining removal amount R and the machining removal efficiency RE are calculated from the received measurement data. The interval of measurement data is not limited to every 1 millisecond, and may be every 10 milliseconds or every 100 milliseconds.

  Specifically, referring to FIG. 7, when the rough process is reached (YES in step S <b> 101), the processing apparatus 1 sets the gauge position X of the in-process gauge 59 and the grinding power WA at the start of the process to the rough process. Is stored in the server 3 as the gauge position initial value X0 and the grinding power initial value W0 (step S103).

  Next, the processing device 1 stores the gauge position Xan of the in-process gauge 59 and the grinding power Wan in the rough process in the server 3 every 1 millisecond after reaching the rough process (YES in step S105) (step S107). ).

  Preferably, the processing apparatus 1 acquires the gauge position Xan and the grinding power Wan every 1 millisecond, calculates the machining removal amount R and the machining removal efficiency RE, and stores these parameters in the server 3 (step S109). That is, the processing apparatus 1 calculates the machining removal amount R in the rough process from the received gauge position Xan and the latest gauge position Xa (n−1) stored in the server 3 every 1 millisecond ( R = Xan−Xa (n−1)), stored in the server 3. Further, the processing device 1 receives the processing removal efficiency RE in the rough process every 1 millisecond from the received gauge position Xan, the latest gauge position Xa (n-1) stored in the server 3, and the received motor current Imn. Calculated from the obtained grinding power Wa and the grinding power Wa (n-1) obtained from the latest motor current Im (n-1) stored in the server 3 (RE = (Xan-Xa (n-1) )) / (Wan-Wa (n-1))), stored in the server 3.

  Referring to FIGS. 7 and 8, processing apparatus 1 performs the processes in steps S107 to S109 every millisecond (in step S111) until the rough process is completed and the finishing process is reached (NO in step S113). YES) Repeat. Thereby, the processing apparatus 1 can acquire the measurement data in a rough process or the parameter calculated from the measurement data every 1 millisecond, and can accumulate | store it in the server 3. FIG.

  Next, referring to FIG. 8, when the roughing process is completed and the finishing process is reached (YES in step S113), processing apparatus 1 causes gauge position X and grinding power W of in-process gauge 59 at the start of the process. Are stored in the server 3 as the gauge position initial value Xs0 and the grinding power initial value Ws0 in the finishing process, respectively (step S115).

  Next, the processing apparatus 1 stores the gauge position Xsn of the in-process gauge 59 and the grinding power Wsn in the finishing process in the server 3 every 1 millisecond after reaching the finishing process (YES in step S117) (step S119). ).

  Preferably, when the processing apparatus 1 acquires the gauge position Xsn and the grinding power Wsn every 1 millisecond, as in the roughing process, the processing device 1 calculates the processing removal amount R and the processing removal efficiency RE and sends these parameters to the server 3. Store (step S121).

  The processing apparatus 1 repeats the processes of steps S119 to S121 until the finishing process is completed and the machining is completed (NO in step S125) and every millisecond (YES in step S123). Thereby, the processing apparatus 1 can acquire the measurement data in a finishing process or the parameter based on the measurement data every 1 millisecond, and can accumulate | store it in the server 3. FIG.

<Effect of the first embodiment>
In the monitoring system 100 according to the first embodiment, the measurement data representing the shape state of the machining unit 50 during machining of the workpiece W by the machining device 5 and the measurement value representing the inspection result of the workpiece W by the inspection device 8. On the basis of both the quality inspection data and the quality inspection data, a sign of a quality abnormality of the workpiece W due to a shape change of the processing unit 50 is detected. Thereby, it is possible to detect a sign of an abnormality in the product quality before an abnormality actually occurs in the product quality. Thereby, the occurrence of quality abnormality can be prevented in advance.

  Further, when a sign of quality abnormality is detected, it is specified that the cause of the quality abnormality on the processing apparatus 5 side is a part of the processing unit 50 related to the measurement data. Therefore, when the maintenance of the processing apparatus 5 is stopped and the maintenance is performed, the part to be maintained is specified, so that the operation of the processing apparatus 5 is compared with the case where the target part must be specified at the start of the maintenance. It is possible to shorten the period for stopping the operation.

  Furthermore, in the monitoring system 100 according to the first embodiment, the machining state is quantified using the change in the gauge position X of the in-process gauge 59 which is the actual machining amount in the machining apparatus 5 as measurement data. Thereby, the sign of the quality abnormality of the workpiece | work W can be detected with high precision.

<Modification 1>
In the monitoring system 100 according to the first embodiment, in the processing device 1, in order to calculate the index value using the measurement data, a parameter for calculating the index value from the measurement data of the processing unit 50 is calculated, An index value is calculated using the parameter and used for determination. This index value calculation method is an example, and the calculation method is not limited to this method. As another example of the method of calculating the index value using the measurement data, the processing device 1 may calculate the index value using the measurement data itself as a parameter.

In the monitoring system 100 according to the first modification, the processing device 1 calculates an index value using the measurement data itself of the processing unit 50 as a parameter. For this reason, the calculation unit 111 of the processing apparatus 1 according to the first modification stores in advance the following calculation formula (5) for calculating the index value. The calculation formula (5) is a formula for calculating a value Ci ′ corresponding to the roundness Ci of the workpiece W using C to E as arbitrary constants and using the motor current Im, the vibration Pu, and the temperature Te as parameters.
Ci ′ = C × Im + D × Pu + E × Te (5)

<Modification 2>
In addition, the processing apparatus 1 calculates an index value experimentally using the measurement data of the shape state of the processing apparatus 5, and uses the index value and the quality inspection data in the inspection apparatus 8 of the workpiece W. The calculation formula (3) or the formula (5) for calculating the index value may be adjusted. As an example, the processing device 1 compares the index value Ci ′ calculated by changing the coefficients A, B, and C by the amounts of change ΔA, ΔB, and ΔC stored in advance and the roundness Ci. The equation (3) is adjusted by adjusting the coefficients A, B, and C using the change amounts ΔA, ΔB, and ΔC when the index value Ci ′ is closest to the circularity Ci.

  Thereby, it is possible to improve the accuracy of detecting a sign of a quality abnormality of the workpiece W, and it is possible to predict the quality of the workpiece W with high accuracy only from the measurement data in the processing device 5.

<Modification 3>
When measuring the shape of the processing device 5, the workpiece W being processed by the processing device 5 and an index value calculated from the measurement data are used to determine a sign of a quality abnormality of the workpiece W. The workpiece W which is the target of the quality inspection data in the inspection apparatus 8 used for the inspection may be completely the same workpiece W, or is continuously processed under the same conditions, so-called the same lot. Different works belonging to a plurality of work groups may be used.

[Second Embodiment]
In the monitoring system 100 according to the second embodiment, the index value calculated by the processing device 1 is accumulated in the server 3, and a sign of quality abnormality is predicted based on the change in the index value. That is, the processing apparatus 1 repeats the calculation of the index value in step S5 and the comparison with the quality inspection data in step S7 at predetermined intervals during the processing of the workpiece W. The processing device 1 calculates and stores a value indicating the degree of deviation of the index value from the quality inspection data. And the processing apparatus 1 calculates the change degree of the said value about each of several continuous index value during the process period of the said workpiece | work W. FIG. The degree of change is, for example, change directionality and change speed. When the processing device 1 changes so that the degree of deviation of the index value from the quality inspection data becomes large during the processing period, and the rate of change is equal to or greater than a predetermined threshold value, there is a possibility of quality abnormality. Judge that there is.

  By making such a determination, the monitoring system 100 according to the second embodiment allows the monitoring system 100 according to the second embodiment to display the sign even when it is determined that there is no sign of a quality abnormality of the workpiece W at the time of the determination. It is possible to predict and warn of the possibility of abnormality. Thereby, maintenance can be performed in advance and quality abnormalities can be prevented.

[Third Embodiment]
In the first embodiment and the second embodiment, attention is paid to a change in shape due to wear or deflection as a factor of product quality abnormality caused by the processing device 5 such as a grinding machine or a lathe. ing. Therefore, the sensor 60 for measuring the factor is a sensor for measuring the shape state of the processed part 50.

  However, as another factor, a malfunction due to aging (electrical state change) of a power line connected to a motor or the like is also considered as a factor of product quality abnormality caused by the processing device 5. Such factors can also be measured by the sensor 60.

  A change in shape and electrical state of the processing unit 50 can be regarded as a disturbance of the processing unit 50. Therefore, the monitoring system 100 according to the present embodiment includes the measurement data of the disturbance of the processing unit 50 during product processing, which is at least one of the change in the shape of the processing unit 50 and the electrical state, and the inspection apparatus. 8 can be said to be a monitoring system that determines the presence or absence of a sign of product quality abnormality caused by disturbance of the processing unit 50 from the quality inspection data of No. 8.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

DESCRIPTION OF SYMBOLS 1 Processing apparatus, 2 output apparatus, 5 processing apparatus, 8 inspection apparatus, 12 receiving part, 59 in-process gauge (2nd sensor), 60 sensor (1st sensor), 50 processing part, 100 monitoring system, 111 calculation Part, 113 judgment part

Claims (4)

A first sensor that measures at least one of a geometric state and an electrical state of a processing apparatus during product processing; an inspection apparatus that inspects the quality of a product processed by the processing apparatus; A monitoring system including a sensor and a processing device capable of communicating with the inspection device,
The processor is
A receiving unit that receives measurement data from the first sensor and quality inspection data from the inspection device;
A calculation unit that calculates an index value for evaluating the quality of the product being processed using the measurement data received by the reception unit;
Based on the index value and the quality inspection data, a determination unit that determines the presence or absence of a sign of quality abnormality of the product due to at least one of a geometric state change and an electrical state change of the processing device, Having a surveillance system. A second sensor for measuring a processing amount of the product by the processing device;
The first sensor measures a machining power amount in the machining apparatus,
The index value is a value calculated using at least one of a machining amount by the machining apparatus per unit time and a ratio of the machining amount to a machining power amount per unit time as a parameter. Monitoring system.   The determination unit predicts the presence or absence of an indication of the quality abnormality based on a change in the relationship between the plurality of index values calculated from the plurality of measurement data continuously measured and the quality inspection data. The monitoring system according to claim 1 or 2. The calculation unit stores a calculation formula for calculating the index value;
The monitoring system according to claim 1, wherein the calculation formula is adjusted based on the index value and the quality inspection data.