JP2018199192A - Polishing device, abnormality detection method, and program - Google Patents

Abstract

To provide a polishing device or an abnormality detection method, which can detect a case where a substrate is not held at a desired position by a top ring.SOLUTION: A polishing device includes: a top ring 11; a pusher device; a polishing member 32; a pressure sensor P5; and a control section 17. The top ring 11 has a retainer ring 13 and an airbag 15 and holds a substrate W. The pusher device delivers the substrate toward the top ring. The polishing member polishes the substrate held by the top ring. The pressure sensor detects pressure in the airbag. The control section detects an abnormality of a delivery state of the substrate from the pusher device to the top ring on the basis of a time when pressure in the airbag rises after air is supplied to the inside of the airbag.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a polishing apparatus, an abnormality detection method, and a program.

  Conventionally, a polishing apparatus as shown in Patent Document 1 below is known. The polishing apparatus includes a top ring that holds the substrate, a polishing member that polishes the substrate held by the top ring, and a pusher device that delivers the substrate toward the top ring. In this polishing apparatus, the pusher device brings the substrate into contact with the top ring, and the top ring holds the substrate. Then, the top ring moves above the polishing member, and the top ring presses the substrate against the polishing member, whereby the substrate can be polished.

JP 2012-178608 A

  As a result of intensive studies by the inventors of this application, in this type of polishing apparatus, when the pusher device delivers the substrate toward the top ring, the substrate is not held in a desired position by the top ring. It was found that damage occurred.

  The present invention has been made in consideration of such circumstances, and an object of the present invention is to provide a polishing apparatus and an abnormality detection method capable of detecting a substrate when the substrate is not held at a desired position by a top ring. To do.

  In order to solve the above-described problem, a polishing apparatus according to a first aspect of the present invention includes a retainer ring and an airbag that raises and lowers the retainer ring, a top ring that holds a substrate, and the top ring toward the top ring. A pusher device that delivers a substrate, a polishing member that polishes the substrate held by the top ring, a pressure sensor that detects pressure in the airbag, and supply of air into the airbag is started. And a controller that detects an abnormality in the state of delivery of the substrate from the pusher device to the top ring based on the time until the pressure in the airbag rises.

  In the polishing apparatus according to the above aspect, after the pusher device delivers the substrate toward the top ring and the top ring holds the substrate, air is supplied into the airbag and the retainer ring is lowered. At this time, if the substrate is not held at a desired position by the top ring, even if air is supplied into the airbag to lower the retainer ring, the substrate contacts the retainer ring and prevents the lowering. As a result, the time from the start of the supply of air into the airbag until the pressure in the airbag rises is shortened. Therefore, the control unit detects an abnormality in the delivery state of the substrate from the pusher device to the top ring based on the time from the start of the supply of air into the airbag until the pressure in the airbag rises. Thus, it is possible to detect such an abnormality with a simple configuration.

  Further, the control unit may stop the supply of air into the airbag based on a detection result of an abnormality in the state of delivery of the substrate from the pusher device to the top ring.

  In this case, it is possible to prevent the substrate from being deformed or damaged due to the retainer ring continuing to descend while the retainer ring is in contact with the substrate.

  In order to solve the above problem, the abnormality detection method according to the second aspect of the present invention is an abnormality detection method for detecting an abnormality in the delivery state when the pusher device delivers the substrate toward the top ring. Then, based on the time from the start of the supply of air into the airbag provided in the top ring until the pressure in the airbag rises, the substrate delivery state from the pusher device to the top ring is abnormal. Is detected.

  According to the above aspect of the present invention, it is possible to provide a polishing apparatus or an abnormality detection method capable of detecting when the substrate is not held at a desired position by the top ring.

It is a schematic plan view of the substrate processing apparatus which concerns on this embodiment. It is sectional drawing of the pusher apparatus which concerns on this embodiment. It is sectional drawing of the top ring which concerns on this embodiment. It is explanatory drawing explaining operation | movement when a pusher apparatus delivers a board | substrate toward a top ring, Comprising: The case where delivery is performed normally is shown. It is explanatory drawing explaining operation | movement at the time of a pusher apparatus delivering a board | substrate toward a top ring, Comprising: The case where abnormality generate | occur | produces is shown. It is a graph which shows a mode that the pressure in an airbag rises.

  Hereinafter, a configuration of a polishing apparatus according to the present embodiment and a substrate processing apparatus including the polishing apparatus will be described with reference to FIGS. In each drawing used in the following description, the scale is appropriately changed to make each member a recognizable size. Moreover, in order to make each structure easy to understand, the illustration of parts may be partially omitted or simplified.

(Substrate processing equipment)
First, the overall configuration of the substrate processing apparatus 100 will be described. As shown in FIG. 1, the substrate processing apparatus 100 includes a substantially rectangular housing H partitioned into a load / unload unit 110, a polishing unit 120, and a cleaning unit 130. The substrate processing apparatus 100 is a chemical mechanical polishing (CMP) apparatus that performs a polishing process and a cleaning process (including a drying process) on a substrate (wafer).

  The load / unload unit 110 is a part that loads (loads) a substrate before processing into the substrate processing apparatus 100 and unloads (unloads) the processed substrate outside the substrate processing apparatus 100. The load / unload unit 110 includes a plurality of front load units 111 and a load / unload unit 112. The front load unit 111 is a part on which a substrate cassette that stocks a large number of substrates is placed. In the present embodiment, four front load portions 111 are provided. The front load unit 111 is configured to be able to mount a substrate cassette such as an open cassette, a standard manufacturing interface (SMIF) pod, or a front opening unified pod (FOUP).

  The load / unload unit 112 is a unit that takes out a substrate before processing from a substrate cassette placed on the front load unit 111 and returns the substrate after processing to the substrate cassette. The load / unload unit 112 includes two transfer robots (loaders) 113 configured to be movable along a direction in which a plurality of front load units 111 are arranged. These transfer robots 113 can access a substrate cassette mounted on each front load unit 111.

The polishing unit 120 is a part that performs a polishing process on a substrate carried into the substrate processing apparatus 100. The polishing unit 120 is provided with four polishing apparatuses 10A to 10D arranged along the longitudinal direction of the substrate processing apparatus 100, a linear transporter 126, and a linear transporter 127.
The configurations of the polishing apparatuses 10A to 10D are the same as each other, and include a polishing table 31, a top ring 11, a polishing liquid supply nozzle 33, a dresser 34, and an atomizer 35, respectively. In the following description, these polishing apparatuses 10A to 10D may be represented as the polishing apparatus 10 as a representative.

  A polishing pad (polishing member) 32 having a polishing surface is attached to the polishing table 31. The polishing table 31 is rotated by a motor (not shown). The top ring 11 presses the substrate W against the polishing pad 32 on the rotating polishing table 31. Thereby, the substrate W is polished. The polishing liquid supply nozzle 33 supplies a polishing liquid and a dressing liquid (for example, pure water) to the polishing pad 32. The dresser 34 performs dressing of the polishing surface of the polishing pad 32. The atomizer 35 injects a mixed fluid of liquid (for example, pure water) and gas (for example, nitrogen gas) or a mist-like liquid onto the polishing surface of the polishing pad 32.

The linear transporter 126 is disposed adjacent to the first polishing apparatus 10A and the second polishing apparatus 10B, and transfers the substrate between the plurality of transfer positions TP1 to TP4.
The transfer position TP1 is a position where the linear transporter 126 receives the substrate W before processing from the transfer robot 113. The transfer position TP2 is a position where the substrate W is transferred between the linear transporter 126 and the top ring 11 of the first polishing apparatus 10A.

The transfer position TP3 is a position where the substrate W is transferred between the top ring 11 and the linear transporter 126 of the second polishing unit 20B. The transport position TP4 is a position where the substrate W is transferred between the linear transporter 126 and the linear transporter 127. Similarly, the transfer positions TP5 to TP7 are positions at which the substrate W is transferred between the linear transporter 127 and the polishing apparatuses 10C and 10D.
In addition, delivery of the board | substrate from each linear transporter 126,127 to each grinding | polishing apparatus 10A-10D is performed by the pusher apparatus 20 mentioned later.

The cleaning unit 130 is a part that performs a cleaning process and a drying process on the substrate polished by the polishing unit 120. The cleaning unit 130 includes five units (first cleaning unit 131A, first transport unit 132A, second cleaning unit 131B, second transport unit 132B, and drying unit) arranged along the longitudinal direction of the substrate processing apparatus 100. 133).
The first cleaning unit 131A and the second cleaning unit 131B include cleaning tools M1 and M2 for cleaning the substrate, respectively. As the cleaning tools M1 and M2, cylindrical rolls can be used. As a material for the cleaning tools M1 and M2, porous PVA sponge, urethane foam and the like can be used.

The first cleaning unit 131A and the second cleaning unit 131B spray the chemical liquid toward the substrate, bring the outer peripheral surfaces of the cleaning tools M1 and M2 into contact with the substrate, and rotate the cleaning tools M1 and M2, thereby rotating the substrate. Wash. As the chemical solution, SC1 (ammonia / hydrogen peroxide mixed aqueous solution) or the like can be used.
The first transfer unit 132A and the second transfer unit 132B include transfer robots R1 and R2 that can move up and down, respectively. The transfer robot R1 transfers the substrate among the temporary placement table Q, the first cleaning unit 131A, and the second cleaning unit 131B. The transport robot R2 transports the substrate between the second cleaning unit 131B and the drying unit 133.

The drying unit 133 includes a drying module M3 that dries the substrates cleaned by the cleaning units 131A and 131B. The drying module M3 dries the substrate by, for example, rotagoni drying. Rotagony drying is a drying method in which a substrate is dried while supplying IPA vapor (a mixture of isopropyl alcohol and N ₂ gas) and ultrapure water to the surface of the substrate while rotating the substrate.

  In addition, the substrate processing apparatus 100 includes a control unit 140 that controls the operation of the substrate processing apparatus 100 in an integrated manner within the housing H. The control unit 140 controls the operation of the substrate processing apparatus 100 in an integrated manner by outputting control signals corresponding to detection results of various sensors provided in the substrate processing apparatus 100 to the respective units.

(Pusher device)
Next, the pusher device 20 for delivering the substrate W from the linear transporters 126 and 127 to the polishing apparatuses 10A to 10D will be described. Although not shown in FIG. 1, the pusher device 20 is disposed in the vicinity of the respective transport positions TP <b> 2 to TP <b> 7.
As shown in FIG. 2, the pusher device 20 is a device that presses the unprocessed substrate W transported by the linear transporters 126 and 127 toward the top ring 11. The pusher device 20 includes a guide stage 21, a push stage 22, a shaft 23a, an alignment mechanism 24, a top ring guide 25, an upper cylinder 26, a lower cylinder 27, an impact mitigation mechanism 28, and an optical sensor. 50.

  The guide stage 21 supports the top ring guide 25. The push stage 22 pushes up the tray 40 on which the substrate W transported by the linear transporters 126 and 127 is temporarily placed. The guide stage 21 and the push stage 22 are attached to the upper end of a shaft 23a that is installed vertically.

  A bearing case 23c is attached to the upper portion of the shaft 23a through a slide bearing 23b so as to be movable up and down, and a guide stage 21 is installed in the bearing case 23c through an alignment mechanism 24. A coil spring 23h is disposed between the bearing case 23c and the shaft 23a. The bearing case 23c is urged upward by the coil spring 23h with respect to the shaft 23a. The alignment mechanism 24 is a mechanism for aligning the position of the top ring guide 25 and can move the top ring guide 25 in the horizontal direction.

  A push rod 23d protrudes from the upper end of the shaft 23a. The push rod 23d penetrates the central portion of the guide stage 21 and protrudes upward, and the push stage 22 is installed at the upper end portion thereof. The push rod 23d is supported by the guide stage 21 so as to be movable up and down via a slide bearing 23e. On the other hand, the shaft 23a is supported by a slide bearing 23g so as to be movable up and down with respect to a bearing case 23f attached to the fixed member 23i.

  A lower end portion of the shaft 23 a is connected to the upper cylinder 26. The upper cylinder 26 moves the push stage 22 up and down via the shaft 23a. The upper cylinder 26 is provided with limit sensors 26a and 26b for confirming the position when the push stage 22 is raised and lowered. A shaft 26c is connected to the lower end portion of the upper cylinder 26, and the lower end portion of the shaft 26c is connected to a lower cylinder 27 attached to the fixed side member 23i. The lower cylinder 27 raises and lowers the guide stage 21, the top ring guide 25, and the push stage 22 integrally by raising and lowering the upper cylinder 26 via the shaft 26c. The lower cylinder 27 is provided with limit sensors 27a and 27b for confirming the position when the shaft 26c is moved up and down. In addition, a cushion member 28a is provided at the lower end portion of the bearing case 23f, and a plate-like stopper member 28b is provided at the upper end portion of the upper cylinder 26, and the impact mitigating mechanism 28 is constituted by these. The impact mitigating mechanism 28 performs the positioning in the height direction and the absorption of the impact when the top ring guide 25 rises to access the top ring 11.

  A tray 40 is placed on the push stage 22. The tray 40 is a ring-shaped flat plate member having an outer diameter dimension slightly smaller than the inner periphery of the top ring guide 25, and the substrate W can be placed on the upper surface thereof. Note that the linear transporter 126 or the linear transporter 127 shown in FIG. 2 plays the role of horizontally transporting the tray 40 on which the substrate W is placed from another place to the position of the pusher device 20 and passing it to the push stage 22. .

  The top ring guide 25 is a guide member that fits into the retainer ring 13 of the top ring 11. A guide portion 25 a that protrudes upward is formed on the outer peripheral edge of the top ring guide 25. The guide portion 25 a plays a role of determining the position of the top ring 11 with respect to the pusher device 20 by fitting with the retainer ring 13.

The optical sensor 50 includes a light projecting unit 51 installed in the top ring guide 25 and a light receiving unit 52 installed on the guide stage 21. The light projecting unit 51 emits sensor light toward the light receiving unit 52.
When the substrate W is seated on the tray 40, the outer peripheral portion of the substrate W is positioned on a straight line connecting the light projecting unit 51 and the light receiving unit 52, and the sensor light from the light projecting unit 51 is blocked. Thereby, the optical sensor 50 can detect the seating of the substrate W.

(Top ring)
Next, the configuration of the top ring 11 that holds the substrate W and presses it against the polishing pad 32 will be described. As shown in FIG. 3, the top ring 11 includes a carrier 12 that presses the substrate W against the polishing pad 32, a retainer ring 13 that directly presses the polishing pad 32, a membrane (elastic film) 14, and an airbag 15. And.

The carrier 12 is formed in a disc shape. The carrier 12 is formed of a resin such as engineering plastic (for example, PEEK). The retainer ring 13 is formed in an annular shape and is attached to the outer periphery of the carrier 12 (the outer periphery of the membrane 14).
The membrane 14 is installed on the lower surface of the top ring 11 and contacts the back surface of the substrate W. The membrane 14 is formed of a rubber material having excellent strength and durability, such as ethylene propylene rubber (EPDM), polyurethane rubber, and silicon rubber.

  The membrane 14 has a plurality of concentric partition walls 14a. By these partition walls 14a, a circular center chamber S1, an annular ripple chamber S2, and an annular outer chamber S3 are provided between the upper surface of the membrane 14 and the lower surface of the carrier 12. An annular edge chamber S4 is formed. That is, a center chamber S1 is formed at the center of the carrier 12, and a ripple chamber S2, an outer chamber S3, and an edge chamber S4 are sequentially formed concentrically from the center toward the outer peripheral direction. A through hole 14b penetrating through the membrane 14 is formed in a portion of the membrane 14 facing the ripple chamber S2. The through hole 14b is used as an adsorption hole for the membrane 14 to adsorb the substrate W.

  In the carrier 12, a flow path 12a communicating with the center chamber S1, a flow path 12b communicating with the ripple chamber S2, a flow path 12c communicating with the outer chamber S3, and a flow path 12d communicating with the edge chamber S4 are formed. Yes. The flow paths 12a to 12d are connected to the flow paths 16a to 16d through the rotary joint 16, respectively.

  The airbag 15 is formed in a bag shape by an elastic film-like member, and is disposed immediately above the retainer ring 13. A space in the airbag 15 (hereinafter referred to as a retainer ring pressurizing chamber S5) is connected to a flow path 16e via a flow path 11a and a rotary joint 16 formed in the top ring 11.

The flow paths 16a to 16e are connected to the control unit 17, respectively. The control unit 17 includes a pressure adjustment unit such as a valve and a pressure regulator, a calculation unit such as a CPU, and a memory unit such as a ROM. In addition, the memory part of the control part 17 has memorize | stored the program for performing the abnormality detection method mentioned later, and the calculating part of the control part 17 can load and run this program.
The control unit 17 operates the pressure adjusting unit to adjust the pressure of the pressure fluid supplied to the center chamber S1, the ripple chamber S2, the outer chamber S3, the edge chamber S4, and the retainer ring pressurizing chamber S5. Pressure sensors P1 to P5 are installed in the flow paths 16a to 16e, respectively. These pressure sensors P1 to P5 are coupled type pressure sensors that can measure both positive pressure and negative pressure. However, the present invention is not limited to this, and both positive pressure and negative pressure may be measured by combining a pressure sensor for positive pressure and a pressure sensor for negative pressure.

  The pressure sensor P5 can measure the pressure in the flow path 16e, that is, the pressure in the retainer ring pressurizing chamber S5 formed in the airbag 15. Similarly, the pressure sensors P1 to P4 can measure the pressures in the flow paths 16a to 16d, that is, the pressures in the chambers S1 to S4, respectively.

  In the top ring 11, the pressure of the fluid supplied to the center chamber S <b> 1, the ripple chamber S <b> 2, the outer chamber S <b> 3, the edge chamber S <b> 4 and the retainer ring pressurizing chamber S <b> 5 can be independently adjusted by the control unit 17. With such a structure, the pressing force for pressing the substrate W against the polishing pad 32 can be adjusted for each region of the substrate W, and the pressing force for the retainer ring 13 to press the polishing pad 32 can be adjusted.

  Next, a method for manufacturing a processed substrate by the substrate processing apparatus 100 configured as described above will be described.

(Processed substrate manufacturing method)
When a processed substrate is manufactured by the substrate processing apparatus 100, first, the transfer robot 113 takes out the substrate W from the front load unit 111 (see FIG. 1).
Next, the linear transporter 126 receives an unprocessed substrate W from the transfer robot 113, and transfers the substrate W to the top ring 11 of the first polishing apparatus 10A at the transfer position TP2.
Note that the substrate transfer method from the linear transporters 126 and 127 to the polishing apparatuses 10A to 10D performed at the transfer positions TP2 to TP7 is the same. Hereinafter, this delivery method will be described.

(Substrate delivery method)
4A to 4D are schematic diagrams for explaining the operation when the substrate W is normally delivered from the linear transporters 126 and 127 to the top ring 11 of the polishing apparatus 10.
At the time of delivery, first, as shown in FIG. 4A, the substrate W is held between the top ring 11 and the pusher device 20 by the linear transporter 126 or the linear transporter 127. 4A to 4D, illustration of the linear transporters 126 and 127 and the tray 40 that temporarily holds the substrate W is omitted.

  Next, as shown in FIG. 4B, the push stage 22, the top ring guide 25, and the like move toward the top ring 11. At this time, the retainer ring 13 and the guide portion 25a of the top ring guide 25 are fitted to determine the position of the top ring 11 with respect to the pusher device 20. In this state, the push stage 22 presses the substrate W toward the membrane 14 and sucks it from the through hole 14b of the membrane 14, whereby the substrate W is adsorbed to the membrane 14.

Next, as shown in FIG. 4C, the top ring 11 and the pusher device 20 are separated from each other.
Next, air is supplied into the airbag 15. Thereby, as shown in FIG.4 (d), the volume in the airbag 15 expand | swells and the retainer ring 13 falls. By lowering the retainer ring 13 in this way, the substrate W is positioned inside the retainer ring 13. For example, even if the top ring 11 moves at high speed toward the polishing table 31, the position of the substrate W is shifted. Can be suppressed. That is, the retainer ring 13 plays a role of stabilizing the holding position of the substrate W by the membrane 14.

  Thus, the top ring 11 receives the substrate W from the pusher device 20 and moves from the delivery position to above the polishing table 31 with the substrate W held on the lower surface thereof. Then, the top ring 11 is lowered to press the substrate W against the polishing pad 32 (see FIG. 3). At this time, the top ring 11 and the polishing table 31 are rotated, and the polishing liquid is supplied onto the polishing pad 32 from a polishing liquid supply nozzle (not shown) provided above the polishing table 31. By the above operation, the substrate W is brought into sliding contact with the polishing pad 32 and the surface of the substrate W is polished.

  After the polishing process as described above is repeated in each polishing apparatus 10A to 10D, the substrate W is transferred to the first cleaning unit 131A by the first transfer unit 132A provided in the cleaning unit 130. Then, the polished substrate W is cleaned by the first cleaning unit 131A. Similarly, the substrate W is cleaned by the second cleaning unit 131B. The cleaned substrate W is transported to the drying unit 133 by the second transport unit 32B and dried. The substrate dried by the drying unit 133 is returned to the substrate cassette of the front load unit 111 by the transfer robot 113. A processed substrate is manufactured by the above process.

(Abnormality detection method)
Here, an abnormality detection method for detecting when the substrate W is not normally delivered from the pusher device 20 to the top ring 11 will be described. This abnormality detection method is executed by loading the program stored in the memory unit of the control unit 17 by the calculation unit of the control unit 17.
FIGS. 5A to 5D are views for explaining the operation when the substrate W is not normally delivered from the pusher device 20 to the top ring 11.

  FIG. 5A shows a state where the substrate W is temporarily held on the linear transporter 126 or the linear transporter 127 between the pusher device 20 and the top ring 11. The case where the shift | offset | difference has arisen in the relative position of is shown. If the transfer operation is performed in this state, a part of the substrate W may be located directly below the retainer ring 13 as shown in FIGS.

  Further, when air is supplied into the airbag 15 in the state of FIG. 5C and the retainer ring 13 is going to descend, a part of the substrate W is pressed downward while the substrate W is held by the membrane 14. The Rukoto. As a result, the substrate W may be deformed or damaged, or the substrate W may fall off the membrane 14. Therefore, in the present embodiment, such an abnormality is detected based on the rise time of the pressure in the airbag 15. Hereinafter, it demonstrates in detail using FIG.

FIG. 6 shows a case where the delivery is normally performed as shown in FIGS. 4A to 4D (data A) and a case where a delivery abnormality occurs as shown in FIGS. 5A to 5D. It is a graph which shows two data of (data B). In the graph shown in FIG. 6, the horizontal axis indicates time (seconds), and the vertical axis indicates the pressure in the airbag 15. When the pressure is +, positive pressure is indicated, and when the pressure is-, negative pressure is indicated. Data A and data B have the same flow rate of air supplied into the airbag 15 (the amount of air flowing into the airbag 15 per unit time). The amount of air supplied into the airbag 15 is proportional to the passage of time after the supply of air into the airbag 15 is started.
In the data of FIG. 6, the pressure in the airbag 15 is detected by the pressure sensor P <b> 5 detecting the pressure in the flow path 16 e communicating with the airbag 15.

A time T1 shown in FIG. 6 is a time when the supply of air into the airbag 15 is started. Time T2 _A is the time when the pressure in the airbag 15 starts to rise from near zero in the data A. Time T2 _B is the time in data B when the pressure in the airbag 15 starts to rise from near zero. [Delta] T _A is the time difference between the time T1 to time T2 _A. [Delta] T _B is the time difference between the time T1 to time T2 _B.

As shown in FIG. 6, at the time before time T1, the pressure in the airbag 15 is negative. This is due to the negative pressure in the airbag 15 in order to raise the retainer ring 13 against its own weight.
In both data A and data B, the pressure increases from negative pressure toward zero from time T1 to time T1 ′. This represents a state in which supply of air into the airbag 15 is started at time T1, and the negative pressure in the airbag 15 is gradually eliminated.

The fact that the pressure is stable in the vicinity of zero for about 1.5 seconds after the time T1 ′ represents a state in which the airbag 15 is inflated as air is supplied into the airbag 15. That is, in this section, since the inner volume of the airbag 15 increases by the amount of air supplied, the pressure in the airbag 15 hardly changes.
Thereafter, the pressure increases at time T2 _A or T2 _B when the increase in the internal volume of the airbag 15 is stopped and the air is continuously supplied into the airbag 15 so that the pressure in the airbag 15 is increased. This is because of the increase.

Here, the time when the pressure rises after time T1 ′ is greatly different between data A and data B. More specifically, ΔT _B is shorter than ΔT _A by about 1 second. This is data when data B is abnormal in the delivery state. This is because the substrate W prevents the retainer ring 13 from being lowered as shown in FIG. That is, it is because the time when the airbag 15 stops inflating is earlier than when the retainer ring 13 is normally lowered (data A).

From the above, when an abnormality in the delivery state as shown in FIGS. 5A to 5D occurs, the pressure in the airbag 15 is started after the supply of air into the airbag 15 is started. Becomes shorter (hereinafter referred to as ΔT).
Therefore, in the present embodiment, the control unit 17 detects an abnormality in the delivery state of the substrate W based on ΔT. More specifically, a preset value of ΔT at normal time (hereinafter referred to as ΔT _set ) is compared with a value of ΔT actually measured (hereinafter referred to as ΔT _i ). Then, when the value of ΔT _set −ΔT _i is larger than a predetermined threshold (for example, 0.5 seconds), it is determined that an abnormality in the delivery state has occurred.

  According to the present embodiment, an abnormality in the delivery state of the substrate W can be detected from the measurement result of the pressure in the airbag 15 by the pressure sensor P5. This makes it possible to detect the abnormality with a simple configuration without using, for example, a sensor for detecting the position of the substrate W.

Further, when it is determined that an abnormality in the delivery state has occurred, the control unit 17 stops the supply of air into the airbag 15, for example. As a result, it is possible to prevent the peripheral device from being damaged due to deformation or breakage of the substrate W or broken pieces of the substrate W.
Further, when it is determined that a delivery state abnormality has occurred, the control unit 17 may stop the operation of the entire substrate processing apparatus 100. Thereby, for example, the substrate processing apparatus 100 can be prevented from unexpectedly failing due to the damaged substrate W.

  The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

  For example, in the embodiment, the control unit 17 detects an abnormality in the delivery state, but the configuration, arrangement, and the like of the control unit that detects the abnormality can be changed as appropriate. For example, the control unit 140 that controls the overall operation of the substrate processing apparatus 100 may detect an abnormality in the delivery state.

  In addition, the constituent elements in the above-described embodiments can be appropriately replaced with known constituent elements without departing from the spirit of the present invention, and the above-described embodiments and modifications may be appropriately combined.

  DESCRIPTION OF SYMBOLS 10, 10A-10D ... Polishing apparatus 11 ... Top ring 13 ... Retainer ring 15 ... Air bag 17 ... Control part 20 ... Pusher apparatus 32 ... Polishing member W ... Substrate (wafer) 100 ... Substrate processing apparatus P5 ... Pressure sensor

Claims (4)

A retainer ring and a top ring for holding the substrate, including a retainer ring and an airbag for raising and lowering the retainer ring;
A pusher device for delivering the substrate toward the top ring;
A polishing member for polishing the substrate held by the top ring;
A pressure sensor for detecting the pressure in the airbag;
A control unit that detects an abnormality in the state of delivery of the substrate from the pusher device to the top ring based on the time from when the supply of air into the airbag is started until the pressure within the airbag rises. A polishing apparatus comprising:   2. The polishing apparatus according to claim 1, wherein the control unit stops the supply of air into the airbag based on a detection result of an abnormality in a delivery state of the substrate from the pusher device to the top ring. An abnormality detection method for detecting an abnormality in a delivery state when the pusher device delivers a substrate toward the top ring,
Based on the time from the start of the supply of air into the airbag provided in the top ring until the pressure in the airbag rises, an abnormality in the delivery state of the substrate from the pusher device to the top ring is detected. An abnormal detection method.   A program for executing the abnormality detection method according to claim 3.

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