JP2018196267A - Electric power conversion system - Google Patents

Abstract

To provide a structure which makes an attachment housing a snubber circuit less likely to be removed from semiconductor modules in an electric power conversion system including a lamination body in which multiple semiconductor modules and multiple coolers are laminated.SOLUTION: An electric power conversion system 2 includes: a lamination body in which multiple semiconductor modules 3 and multiple coolers are laminated; and an attachment 4 attached to the semiconductor modules 3. In the semiconductor module 3, a switching circuit including switching elements 35a, 35b is sealed and a positive electrode terminal 31 and a negative electrode terminal 32 of the switching circuit extend in a direction intersecting with a lamination direction of the lamination body. The attachment 4 houses a snubber circuit connected between the positive electrode terminal 31 and the negative electrode terminal 32. Notches 31a, 32a are provided at the positive electrode terminal 31 and the negative electrode terminal 32. Spring claws 42b, 43b included in the attachment 4 are engaged with the notches 31a, 32a.SELECTED DRAWING: Figure 5

Description

  The technology disclosed in this specification relates to a power conversion device including a stacked body in which a plurality of coolers and a plurality of semiconductor modules are stacked.

  In a power conversion device, a semiconductor module in which a circuit (switching circuit) including a switching element for power conversion is sealed is often used. On the other hand, in a power converter, a snubber circuit is used to reduce noise associated with the switching operation of a switching element or to reduce current / voltage oscillation called ringing. In Patent Document 1, a high potential side terminal and a low potential side terminal (terminals connected to the high potential side and terminals connected to the low potential side of the internal switching circuit) extending from the semiconductor module are connected to a snubber. A power conversion device is disclosed in which a substrate on which a circuit is mounted is screwed.

JP 2014-128066 A

  A power converter often uses a plurality of semiconductor modules. In addition, since the switching element for power conversion generates a large amount of heat, the power conversion device often includes a cooler for cooling the semiconductor module. One type of power conversion device includes a stacked body in which a plurality of semiconductor modules and a plurality of coolers are stacked so that the semiconductor modules and the coolers are alternately arranged. In such a power conversion device, the gap between adjacent semiconductor modules is narrow, and screwing the snubber circuit board to the high-potential side terminal and the low-potential side terminal of each semiconductor module is poor in assembling workability.

  The applicant of the present application has proposed a structure with good workability for assembling a snubber circuit, relating to a power conversion device of a type including a stacked body in which a plurality of semiconductor modules and a plurality of coolers are stacked (Japanese Patent Application Nos. 2006-001776 and 2016). Filed on January 7, 1980, unpublished at the time of filing this application. The power conversion device includes a stacked body in which a plurality of semiconductor modules and a plurality of coolers are stacked so that the semiconductor modules and coolers are alternately arranged, and a socket component attached to at least one semiconductor module. Yes. The semiconductor module to which the socket part is attached seals the switching circuit including the switching element, and the high potential side terminal and the low potential side terminal of the switching circuit extend in a direction intersecting the stacking direction of the stacked body. Yes. The socket component contains a snubber circuit connected between the high-potential side terminal and the low-potential side terminal inside the insulating body that can be inserted into the high-potential side terminal and the low-potential side terminal. Yes. The socket component can be inserted into the high potential side terminal and the low potential side terminal from the direction orthogonal to the stacking direction of the semiconductor modules, so it is assembled to the stacked body in which multiple semiconductor modules are stacked. Good sex.

  However, the structure in which the socket component is simply inserted into the terminal of the semiconductor module may cause the socket component to come out of the terminal in an environment with large vibrations such as a power conversion device mounted on an automobile. The present specification relates to the improvement of the power conversion device with a socket part proposed by the applicant of the present application, and provides a technique for improving the vibration resistance of a part that contains a snubber circuit and is attached to a terminal of a semiconductor module.

  The power conversion device disclosed in this specification is attached to at least one semiconductor module and a stacked body in which a plurality of semiconductor modules and a plurality of coolers are stacked so that the semiconductor modules and the coolers are alternately arranged. With attachments. The semiconductor module to which the attachment is attached encapsulates a switching circuit including a switching element inside. In the semiconductor module, the high-potential side terminal and the low-potential side terminal of the switching circuit extend in a direction crossing the stacking direction of the stacked body. The attachment is configured such that at least one of the high potential side terminal and the low potential side terminal can be inserted along the aforementioned “direction intersecting the stacking direction”. The attachment houses a snubber circuit connected between the high potential side terminal and the low potential side terminal inside the main body. At least one of the high potential side terminal and the low potential side terminal is provided with a notch, and the attachment is provided with a claw that is locked to the notch of the terminal. In this power converter, since the attachment can be inserted into the terminal along the direction intersecting the stacking direction, the attachment can be easily assembled even if the interval between adjacent terminals in the stacking direction is narrow. Furthermore, in this power converter, the attachment that houses the snubber circuit includes a claw, and the claw is locked to a notch provided in the terminal. Since the claw is locked to the notch of the terminal, the attachment is difficult to come off from the terminal even in a severe vibration environment. Note that an attachment with a built-in snubber circuit may be attached to all the stacked semiconductor modules, or an attachment may be attached to some of the semiconductor modules in the stacked body. Details and further improvements of the technology disclosed in this specification will be described in the following “DETAILED DESCRIPTION”.

It is a block diagram of the electric power system of the electric vehicle containing the power converter device of an Example. It is a top view of a power converter. It is a perspective view of a semiconductor module. It is a perspective view of an attachment. It is a perspective view of the semiconductor module which attached the attachment. It is a perspective view of the semiconductor module which attaches the attachment of a modification. It is a perspective view of the attachment of a modification. It is a perspective view of the semiconductor module which attached the attachment of the modification. It is sectional drawing of the attachment attached to the semiconductor module.

  A power converter 2 according to an embodiment will be described with reference to the drawings. The power conversion device 2 according to the embodiment is mounted on the electric vehicle 100. FIG. 1 shows a block diagram of a power system of an electric vehicle 100 including the power conversion device 2. The power conversion device 2 boosts the DC power of the battery 11 and converts it into AC, and supplies AC power to the two traveling motors 19a and 19b. The power conversion apparatus 2 includes a bidirectional voltage converter circuit 17 and two inverter circuits 18a and 18b. The bidirectional voltage converter circuit 17 includes a filter capacitor 12, a reactor 13, two switching elements 14a and 14b, two diodes 15a and 15b, a snubber capacitor 5, and a snubber resistor 6. The bidirectional voltage converter circuit 17 boosts the voltage of power supplied from the battery 11 and outputs the boosted voltage to the inverter circuits 18a and 18b, and power supplied from the inverter circuits 18a and 18b ( A step-down function is provided that steps down the voltage of the regenerative power generated by the motors 19a and 19b and outputs the voltage to the battery 11 side. Since the circuit configuration and operation of the bidirectional voltage converter circuit 17 shown in FIG. 1 are well known, detailed description thereof will be omitted.

  In the bidirectional voltage converter circuit 17, two switching elements 14a and 14b are connected in series, and a snubber capacitor 5 and a snubber resistor 6 are connected in series between a high potential side and a low potential side of the series circuit. Has been. A series circuit of the snubber capacitor 5 and the snubber resistor 6 is a snubber circuit 9. The snubber circuit 9 is provided to reduce noise accompanying switching operations of the switching elements 14a and 14b and to reduce ringing. A broken line rectangle indicated by reference numeral 3a shown in FIG. 1 means a semiconductor module described later. The semiconductor module 3a is a package in which two switching elements 14a and 14b are connected in series and diodes 15a and 15b connected in antiparallel to each of the switching elements 14a and 14b are sealed. Moreover, the broken-line rectangle which the code | symbol 4 shows in FIG. 1 means the attachment 4 mentioned later. The attachment 4 is a package with a built-in snubber circuit 9.

  The inverter circuit 18a has a circuit structure in which three sets of series connection of two switching elements are connected in parallel. AC is output from the midpoint of each series connection by appropriately controlling each switching element. Since the circuit configuration and operation of the inverter circuit 18a shown in FIG. 1 are well known, detailed description thereof will be omitted.

  A diode is connected in antiparallel to each switching element of the inverter circuit 18a. As is apparent from FIG. 1, the three series connection of the inverter circuit 18a is the same as the circuit configuration of the switching elements 14a and 14b and the diodes 15a and 15b of the bidirectional voltage converter circuit 17. In FIG. 1, a broken-line rectangle indicated by reference numeral 3 b-3 d represents a semiconductor module, and the semiconductor module 3 b-3 d has the same physical structure as the semiconductor module 3 a of the bidirectional voltage converter circuit 17.

  In the inverter circuit 18a, the same snubber circuit as the snubber circuit 9 of the bidirectional voltage converter circuit 17 is connected between the high potential side and the low potential side of the series connection of two switching elements. An attachment 4 incorporating a snubber circuit 9 is connected in parallel to each of the semiconductor modules 3b-3d of the inverter circuit 18a.

  In FIG. 1, since the configuration of the switching element, the diode, and the snubber circuit included in the inverter circuit 18a is the same as the circuit configuration of the bidirectional voltage converter circuit 17, the reference numerals for the individual electronic components are omitted in the inverter circuit 18a. ing.

  The inverter circuit 18b has the same structure as the inverter circuit 18a. In FIG. 1, the detailed circuit configuration of the inverter circuit 18b is not shown. The inverter circuit 18b includes a semiconductor module 3e-3g in which two switching elements are connected in series and diodes connected in antiparallel to each switching element, and an attachment 4 connected in parallel to each semiconductor module 3e-3g. It consists of The snubber circuit 9 of the inverter circuits 18a and 18b is also provided for reducing noise generated by each switching element and reducing ringing.

  A smoothing capacitor 16 is connected between the bidirectional voltage converter circuit 17 and the two inverter circuits 18a and 18b. The smoothing capacitor 16 is inserted in order to suppress the pulsation of the current output from the bidirectional voltage converter circuit 17.

  The hardware structure of the power conversion device 2 will be described with reference to FIG. FIG. 2 is a top view of the power conversion device 2. The power conversion device 2 includes seven semiconductor modules 3a-3g. Hereinafter, when any one of the seven semiconductor modules 3a to 3g is shown without distinction, it is referred to as a semiconductor module 3.

  The seven semiconductor modules 3 are stacked with a plurality of coolers 22, which constitute a stacked unit 10. The plurality of semiconductor modules 3 and the plurality of coolers 22 are alternately stacked one by one. The X direction of the coordinate system in the figure corresponds to the stacking direction of the semiconductor module 3 and the cooler 22. In FIG. 2, reference numeral 22 is given only to the coolers at both ends in the stacking direction, and the reference numerals are omitted for the other coolers. The laminated unit 10 is accommodated in the housing 23 of the power converter 2 and receives pressure in the laminating direction by a leaf spring 28.

  The stacking unit 10 includes two pipes 58 and 59 that penetrate the plurality of coolers 22 in the stacking direction, and these pipes 58 and 59 are connected to a refrigerant circulation device (not shown) outside the power converter 2. It is connected. The refrigerant is distributed to each cooler 22 through one pipe 58. The refrigerant absorbs heat from the adjacent semiconductor module 3 while flowing through each cooler 22, and is discharged from the power converter 2 through the other pipe 59. The adjacent cooler 22 and the semiconductor module 3 are brought into close contact with each other by the pressure of the leaf spring 28, and heat transfer from the semiconductor module 3 to the cooler 22 is promoted.

  Here, the semiconductor module 3 will be described with reference to FIG. FIG. 3 is a perspective view of the semiconductor module 3. Semiconductor chips 35 a and 35 b are sealed inside the main body 30 of the semiconductor module 3. The main body 30 is made by injection molding of resin. That is, the semiconductor chips 35 a and 35 b are sealed in the resin main body 30. Each of the semiconductor chips 35a and 35b is a reverse conducting IGBT chip in which one switching element (IGBT element) and one diode are connected in antiparallel. The semiconductor chips 35a and 35b are connected in series inside the semiconductor module 3, and constitute a circuit in a range surrounded by a broken-line rectangle indicated by reference numerals 3a to 3g in FIG. That is, the semiconductor module 3 has a switching circuit including a switching element sealed therein.

  Three power terminals extend from the main body 30 of the semiconductor module 3. The three power terminals extend in a direction (Z direction in the drawing) intersecting the stacking direction (X direction in the drawing) of the plurality of semiconductor modules 3. The three power terminals include a positive terminal 31 connected to the high potential side of the series connection (switching circuit) of the switching elements, a negative terminal 32 connected to the low potential side of the series connection, and a series connection. This is a midpoint terminal 33 that is electrically connected to the point. In FIG. 2, only the semiconductor module 3a at the right end is given a symbol for each terminal, and the symbols indicating the terminals are omitted for the other semiconductor modules 3b-3g. The positive terminal 31 is provided with a notch 31a, and the negative terminal 32 is provided with a notch 32a (see FIG. 3). The notches 31a and 32a will be described later.

  A plurality of control terminals 34 extend from the opposite side surface of the main body of the semiconductor module 3. The plurality of control terminals 34 are gate terminals that are electrically connected to the gate electrodes of the switching elements (semiconductor chips 35a and 35b), control lines that are connected to temperature sensors and current sensors inside the semiconductor chips 35a and 35b, and the like. is there. The control terminal 34 is connected to a control board (not shown). A circuit for driving the switching elements (semiconductor chips 35a and 35b) of each semiconductor module 3 is mounted on the control board.

  The three power terminals 31, 32, and 33 are each connected to other components through a bus bar. As is apparent from the block diagram of FIG. 1, the high potential side (that is, the positive terminal 31) and the low potential side (that is, the negative terminal 32) of all the semiconductor modules 3 are connected to the smoothing capacitor 16. In the capacitor unit 21 shown in FIG. 2, capacitor elements corresponding to the smoothing capacitor 16 and the filter capacitor 12 of FIG. 1 are accommodated. The positive terminals 31 of all the semiconductor modules 3 are connected to the capacitor unit 21 through the positive bus bar 51, and the negative terminals 32 are connected to the capacitor unit 21 through the negative bus bar 52. The positive electrode bus bar 51 is a large metal plate on the side close to the capacitor unit 21, and branch portions as many as the number of the semiconductor modules 3 extend toward the positive electrode terminal 31 of each semiconductor module 3. Each branch is joined to each positive terminal 31. Similarly, the negative electrode bus bar 52 is a single large metal plate on the side close to the capacitor unit 21, and branches corresponding to the number of the semiconductor modules 3 extend toward the negative electrode terminal 32. Each branch is joined to each negative terminal 32.

  The midpoint terminal 33 of the semiconductor module 3 a of the bidirectional voltage converter circuit 17 is connected to the reactor unit 29 via the intermediate bus bar 53. In the reactor unit 29, a part corresponding to the reactor 13 of FIG. The midpoint terminal 33 of the other semiconductor module 3b-3g is connected to one end of the output bus bar 25, and the other end of the output bus bar 25 is connected to the motor 19a, 19b (see FIG. 1) in the terminal block 26. A cable connection terminal 27 is formed.

  The attachment 4 described above is attached to the positive terminal 31 and the negative terminal 32 of each semiconductor module 3. In FIG. 2, the attachment 4 is painted in gray to help understanding.

  4 shows a perspective view of the attachment 4, and FIG. 5 shows a perspective view of the semiconductor module 3 to which the attachment 4 is attached. A main body 41 of the attachment 4 is made of resin, and a capacitor element 45 and a resistance element 46 are accommodated in the main body 41. The capacitor element 45 and the resistance element 46 are connected in series. The capacitor element 45 corresponds to the snubber capacitor 5 shown in FIG. The resistance element 46 corresponds to the snubber resistor 6 shown in FIG. That is, the snubber circuit 9 shown in FIG.

  On the side surface of the main body 41 of the attachment 4, metal fittings 42 and 43 having conductivity and elasticity are attached. The metal fitting 42 and the metal fitting 43 are connected to the snubber circuit inside the main body 41. The metal fitting 42 includes a clamping claw 42a and a locking claw 42b, and the metal fitting 43 includes a clamping claw 43a and a locking claw 43b. The attachment 4 moves toward the semiconductor module 3 along the extending direction of the power terminals (the positive terminal 31 and the negative terminal 32) (that is, the Z direction in the figure), so that the attachment 4 is interposed between the main body 41 and the holding claws 42a. The positive terminal 31 can be inserted, and the negative terminal 32 can be inserted between the main body 41 and the holding claws 43a. When the attachment 4 is moved to the base of the positive electrode terminal 31 and the negative electrode terminal 32, the locking claw 42 b is locked to the notch 31 a of the positive electrode terminal 31, and the locking claw 43 b is locked to the notch 32 a of the negative electrode terminal 32. The positive electrode terminal 31 is clamped by the clamping claw 42a of the main body 41 and the metal fitting 42, and the locking claw 42b is locked by the notch 31a. The negative electrode terminal 32 is clamped by the clamping claw 43a of the main body 41 and the metal fitting 43, and the locking claw 43b is locked by the notch 32a. Thus, the attachment 4 is fixed to the positive terminal 31 and the negative terminal 32. Since the locking claws 42b and 43b of the attachment 4 are locked to the notches 31a and 32a of the semiconductor module 3, the attachment 4 is difficult to come off even if the semiconductor module 3 vibrates.

  The clamping claw 42a (43a) has elasticity and is strongly pressed against the positive electrode terminal 31 (negative electrode terminal 32). The latching claws 42b (43b) also have elasticity, and when the positive electrode terminal 31 (negative electrode terminal) is inserted, the locking claws 42b (43b) bend so as to follow the surface of the positive electrode terminal 31 (negative electrode terminal 32). It returns to its original state due to elasticity at the position of the base notch 31a (32a) of the terminal 32) and is locked to the notch 31a (32a).

  The metal fittings 42 and 43 also serve to electrically connect the snubber circuit 9 between the positive terminal 31 and the negative terminal 32. In other words, when the attachment 4 is attached to the semiconductor module 3, one end of the snubber circuit 9 is electrically connected to the positive electrode terminal 31 via the metal fitting 42, and the other end of the snubber circuit 9 is electrically connected to the negative electrode terminal 32 via the metal fitting 43. To do. That is, the snubber circuit 9 is connected between the high potential side and the low potential side of the series connection of the two switching elements in the semiconductor module 3.

  As shown in FIG. 2, attachments 4 are attached to all the semiconductor modules 3. As described above, the attachment 4 can be inserted into the terminals (the positive terminal 31 and the negative terminal 32) of the semiconductor module 3 from the Z direction intersecting with the stacking direction (X direction in the drawing) of the plurality of semiconductor modules 3. ing. Therefore, the attachment work of the attachment 4 is easy even if the space between the positive electrode terminals 31 (negative electrode terminals 32) of the adjacent semiconductor modules 3 is narrow.

  On the opposite side of the main body 41 of the attachment 4, a positive bus bar 51 (see FIG. 2) is joined to the positive terminal 31 and a negative bus bar 52 (see FIG. 2) is joined to the negative terminal 32.

  A modification of the attachment will be described with reference to FIGS. FIG. 6 is a perspective view of the semiconductor module 103 to which the attachment 104 of the modified example is attached. FIG. 7 is a perspective view of a modified attachment 104. FIG. 8 is a perspective view of the semiconductor module 103 to which the attachment 4 of the modification is attached. FIG. 9 is a cross-sectional view of the attachment 104 attached to the semiconductor module 103. FIG. 9 is a cross-sectional view of the attachment 104 cut along a plane passing through a metal fitting 142 described later. In FIG. 9, the internal structure of the main body 141 is not shown.

  In this modification, the notches 31 c and 31 d are provided at two locations of the positive electrode terminal 31 of the semiconductor module 103, and the notch is not provided at the negative electrode terminal 32. Similar to the attachment 4, the capacitor element 45 and the resistance element 46 are accommodated in the main body 141 of the attachment 104, and they are connected in series inside the main body 141. A series connection of the capacitor element 45 and the resistance element 46 corresponds to the snubber circuit 9 of FIG. Another conductor 144 is exposed on the main body 141.

  Two clip-shaped metal fittings 142 and 143 are attached to the side surface of the main body 141 of the attachment 104. The metal fittings 142 and 143 have conductivity and elasticity, and are electrically connected to one end of the snubber circuit inside the main body 141. A conductor 144 is electrically connected to the other end of the snubber circuit.

  The metal fitting 142 includes a spring hook 142a and a locking claw 142b, and the metal fitting 143 includes a spring hook 143a and a locking claw 143b. The attachment 104 moves toward the semiconductor module 103 along the extending direction of the power terminals (the positive electrode terminal 31 and the negative electrode terminal 32) (that is, the Z direction in the figure), so that the attachment 104 is located between the main body 141 and the spring hooks 142a and 143a. The positive terminal 31 can be inserted into the terminal. When the attachment 104 is moved to the base of the positive electrode terminal 31, the locking claws 142 b and 143 b are locked to the notches 31 c and 31 d of the positive electrode terminal 31. The positive terminal 31 is sandwiched between the main body 141 and the spring hooks 142a and 143a of the metal fittings 142 and 143, and the locking claws 142b and 143b are locked to the notches 31c and 31d. In FIG. 9, the state in which the locking claw 142b is locked to the notch 31c while the positive electrode terminal 31 is sandwiched between the main body 141 and the spring hook 142a of the metal fitting 142 is well represented. In this way, the attachment 104 is fixed to the positive terminal 31. Since the locking claws 142b and 143b of the attachment 104 are locked to the notches 31c and 31d of the semiconductor module 103, the attachment 104 is difficult to come off even if the semiconductor module 103 vibrates.

  The spring hooks 142 a and 143 a have elasticity and are strongly pressed against the positive terminal 31. Further, the locking claws 142b and 143b also have elasticity, and bend so as to follow the surface of the positive electrode terminal 31 when the positive electrode terminal 31 is inserted. The locking claws 142b and 143b return to their original state due to elasticity at the positions of the base notches 31c and 31d of the positive electrode terminal 31, and are locked to the notches 31c and 31d.

  The metal fittings 142 and 143 and the conductor 144 also serve to electrically connect the snubber circuit 9 between the positive electrode terminal 31 and the negative electrode terminal 32. In other words, when the attachment 104 is attached to the semiconductor module 103, one end of the snubber circuit 9 is electrically connected to the positive terminal 31 through the metal fittings 142 and 143, and the other end of the snubber circuit 9 is connected to the negative terminal 32 through the conductor 144. Conducted with. That is, the snubber circuit 9 is connected between the high potential side and the low potential side of the series connection of the two switching elements in the semiconductor module 103.

  On the opposite side of the main body 141 of the attachment 104, a positive bus bar 51 (see FIG. 2) is joined to the positive terminal 31, and a negative bus bar 52 (see FIG. 2) is joined to the negative terminal 32.

  Points to be noted regarding the technology described in the embodiments will be described. The positive electrode terminal 31 of the embodiment corresponds to an example of a high potential side terminal, and the negative electrode terminal 32 corresponds to an example of a low potential side terminal. The laminated unit 10 corresponds to an example of a laminated body. The locking claws 42b, 43b, 142b, and 143b correspond to an example of the claws engaged with the notches of the terminals.

  Specific examples of the present invention have been described in detail above, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above. The technical elements described in this specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology exemplified in this specification or the drawings can achieve a plurality of objects at the same time, and has technical usefulness by achieving one of the objects.

2: Power converters 3, 3a-3g, 103: Semiconductor module 4, 104: Attachment 5: Snubber capacitor 6: Snubber resistor 9: Snubber circuit 10: Multilayer unit 11: Battery 12: Filter capacitor 13: Reactors 14a, 14b: Switching element 15a, 15b: Diode 16: Smoothing capacitor 17: Bidirectional voltage converter circuit 18a, 18b: Inverter circuit 19a, 19b: Traveling motor 21: Capacitor unit 22: Cooler 23: Housing 25: Output bus bar 26: Terminal block 27: Connection terminal 28: Leaf spring 29: Reactor unit 30: Main body 31: Positive terminals 31a, 31c, 31d, 32a: Notch 32: Negative terminal 35a: Semiconductor chip 35b: Semiconductor chip 41: Main bodies 42, 142, 43, 143 : Metal fittings 42a, 43 : Kyojitsume 42b, 43b, 142b, 143b: locking claws 45: capacitor element 46: Resistance element 51: positive electrode bus bar 52: negative electrode bus bar 100: electric vehicle 141: body 142: bracket 142a, 143a: spring hooks

Claims (1)

A stacked body in which a plurality of semiconductor modules and a plurality of coolers are stacked such that the semiconductor modules and the coolers are alternately arranged;
An attachment attached to at least one of the semiconductor modules;
With
The semiconductor module seals a switching circuit including a switching element, and a high potential side terminal and a low potential side terminal of the switching circuit extend in a direction intersecting a stacking direction of the stacked body,
The attachment is configured such that at least one of the high potential side terminal and the low potential side terminal can be inserted along the intersecting direction, and is connected between the high potential side terminal and the low potential side terminal. Contains the snubber circuit to be
A power conversion device, wherein a notch is provided in at least one of the high potential side terminal and the low potential side terminal, and the attachment includes a claw engaged with the notch.

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