JP2018192555A - Polishing device and polishing method - Google Patents

Abstract

To provide a polishing device capable of reliably performing temperature control of a polishing pad in a short period of time while inhibiting a hindrance to proper supply of an abrasive, and a polishing method.SOLUTION: A polishing device includes: a polishing pad 21 for being rotatively driven; a polishing head 22 where a semiconductor wafer serving as an object to be polished is installed and which polishes the object to be polished by bringing it into contact with the polishing pad 21; a polishing agent supply part 23 for supplying the polishing pad 21 with slurry serving as a polishing agent; and a temperature adjustment plate in which a surface 31a brought into contact with the polishing pad 21 is formed in an uneven shape constituting a slurry passage, and which adjusts a temperature of the polishing pad 21 by being brought into contact with the polishing pad 21 in a state of being fixed to an outside of the polishing pad 21.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a polishing apparatus and a polishing method.

  2. Description of the Related Art In recent years, a chemical mechanical polishing (CMP) method has been used to planarize a surface in a multilayer wiring formation process of an electronic device such as a semiconductor device. In CMP, an appropriate range of temperature exists depending on the material to be polished, the polishing state, and the like. Conventionally, during polishing using a CMP polishing apparatus, a mechanism for contacting the polishing pad to cool the polishing pad, a mechanism for contacting the polishing pad and heating the polishing pad, etc. have been developed (for example, patents). Reference 1 to 3).

JP 2003-220552 A JP 2012-178450 A JP 2013-42066 A JP 9-234663 A

  In a conventional polishing apparatus, when a heating mechanism or a cooling mechanism of a polishing pad is used, the flow of slurry, which is an abrasive supplied to the surface of the polishing pad, is hindered, which hinders polishing of an object to be polished. .

  An object of the present invention is to provide a polishing apparatus and a polishing method capable of reliably controlling the temperature of a polishing pad in a short time while suppressing an obstacle to the appropriate supply of an abrasive.

  In one aspect, a polishing apparatus includes a polishing pad that is rotationally driven, a polishing target, a polishing head that contacts the polishing target with the polishing pad and polishes the polishing pad, and supplies a polishing agent to the polishing pad The contact surface between the polishing agent supply section and the polishing pad is a concavo-convex shape that constitutes the passage of the polishing agent, and is in contact with the polishing pad in a fixed state with respect to the outside of the polishing pad. And a temperature adjusting plate for adjusting the temperature of the pad.

  In one aspect, the polishing method supplies a polishing agent to a polishing pad that is rotationally driven, and contacts a surface to be polished with the polishing pad when polishing an object to be polished placed in a polishing head in contact with the polishing pad. The temperature control plate having a concavo-convex shape constituting the passage of the polishing agent is brought into contact with the surface of the polishing pad in a fixed state with respect to the outside of the polishing pad to adjust the temperature of the polishing pad.

  In one aspect, highly reliable polishing capable of reliably controlling the temperature of the polishing pad in a short time while suppressing an obstacle to proper supply of the abrasive is realized.

It is a mimetic diagram showing the whole polisher composition by a 1st embodiment. It is a schematic plan view which expands and shows the grinding | polishing chamber of a grinding | polishing apparatus. It is a schematic plan view which shows the grinding | polishing part of the grinding | polishing apparatus by 1st Embodiment. It is a schematic plan view which shows the other structural example of the grinding | polishing apparatus by 1st Embodiment. It is a schematic plan view which shows the further another structural example of the grinding | polishing apparatus by 1st Embodiment. It is a schematic diagram which shows the temperature control board of the grinding | polishing apparatus by 1st Embodiment. It is a schematic plan view which shows the arrangement | positioning aspect of the protrusion in the temperature control board of the grinding | polishing apparatus by 1st Embodiment. It is a flowchart which shows the grinding | polishing process by 1st Embodiment in order of a step. It is a schematic diagram which shows the temperature control board of the grinding | polishing apparatus by the modification 1 of 1st Embodiment. FIG. 6 is a schematic plan view showing a flow of slurry during a polishing operation in the polishing apparatus according to Modification 1 of the first embodiment. It is a schematic diagram which shows the temperature control board of the grinding | polishing apparatus by the modification 2 of 1st Embodiment. It is a schematic diagram which shows the temperature control board of the grinding | polishing apparatus by the modification 3 of 1st Embodiment. It is a schematic diagram which shows the temperature control board of the grinding | polishing apparatus by the modification 4 of 1st Embodiment. It is a partial cross section figure which shows the other example of the slit shape of the temperature control board in the modifications 1-4. It is a schematic diagram which shows the temperature control board of the grinding | polishing apparatus by the modification 5 of 1st Embodiment. FIG. 10 is a schematic plan view showing a flow of slurry during a polishing operation in a polishing apparatus according to Modification 5 of the first embodiment. It is a schematic diagram which shows the temperature control board of the grinding | polishing apparatus by the modification 6 of 1st Embodiment. It is a schematic plan view which shows the flow of the slurry in grinding | polishing operation | work in the grinding | polishing apparatus by the modification 6 of 1st Embodiment. It is a schematic diagram which shows the temperature control board of the grinding | polishing apparatus by the modification 7 of 1st Embodiment. It is a schematic diagram which shows the temperature control board of the grinding | polishing apparatus by the modification 8 of 1st Embodiment. It is a schematic diagram which shows the temperature control board of the grinding | polishing apparatus by the modification 9 of 1st Embodiment. It is a schematic plan view which shows the grinding | polishing part of the grinding | polishing apparatus by 2nd Embodiment. FIG. 9 is a schematic plan view showing a flow of slurry during a polishing operation in a polishing apparatus according to Modification 2 of the second embodiment. It is a schematic diagram which shows the arrangement | positioning state of the temperature control board of the grinding | polishing apparatus by the modification 2 of 2nd Embodiment. FIG. 10 is a schematic plan view showing a flow of slurry during a polishing operation in a polishing apparatus according to Modification 3 of the second embodiment. It is a schematic diagram which shows the arrangement | positioning state of the temperature control board of the grinding | polishing apparatus by the modification 3 of 2nd Embodiment. It is a schematic plan view which shows the grinding | polishing part of the grinding | polishing apparatus by the modification 5 of 2nd Embodiment.

  Hereinafter, embodiments of a polishing apparatus and a polishing method will be described in detail with reference to the drawings.

[First Embodiment]
First, the first embodiment will be described. In the present embodiment, the polishing apparatus adopts a mode in which the temperature adjusting plate is disposed on the polishing pad at the rear position of the slurry arm and at the front position of the polishing head with respect to the rotation direction of the polishing pad.

(Configuration of polishing equipment)
FIG. 1 is a schematic diagram showing the overall configuration of the polishing apparatus according to the first embodiment. FIG. 2 is an enlarged schematic plan view showing a polishing chamber of the polishing apparatus. FIG. 3 is a schematic plan view showing a polishing unit of the polishing apparatus according to the first embodiment.
This polishing apparatus is a CMP polishing apparatus, and includes a wafer storage unit 1, a first wafer transfer unit 2, a wafer cleaning unit 3, a second wafer transfer unit 4, and a polishing chamber 5.

The wafer storage unit 1 stores a semiconductor wafer to be polished as shown in FIG.
The first wafer transfer unit 2 takes out a semiconductor wafer 6 to be polished from the semiconductor wafers stored in the wafer storage unit 1 from the wafer storage unit 1 and sends it to the wafer cleaning unit 3. Alternatively, the polished semiconductor wafer 6 cleaned in the wafer cleaning unit 3 is stored in the wafer storage unit 1.

The wafer cleaning unit 3 cleans the semiconductor wafer 6 with a cleaning liquid.
The second wafer transfer unit 4 takes out the semiconductor wafer 6 from the wafer cleaning unit 3 and sends it to the polishing chamber 5. Alternatively, the polished semiconductor wafer 6 is taken out from the polishing chamber 5 and sent to the wafer cleaning unit 3.

As shown in FIG. 2, the polishing chamber 5 has a wafer carry-in unit 12 and, for example, three polishing units 10 on a polishing table 11. Each polishing unit 10 sequentially performs polishing with different polishing conditions, for example.
Each polishing unit 10 is provided with a rotatable platen 13 on a rotationally driven surface plate, and a polishing pad 21 described later is provided on the platen 13.
The wafer carry-in unit 12 is a place where the semiconductor wafer 6 transferred from the second wafer transfer unit 4 is on standby.

As shown in FIG. 3, each polishing unit 10 includes a polishing pad 21, a polishing head 22, a slurry arm 23, a conditioning mechanism 24, and a temperature adjustment mechanism 25. In FIG. 2, the temperature adjustment mechanism 25 is simplified and only the temperature adjustment plate is displayed.
The polishing pad 21 is driven to rotate, for example, in the direction of the arrow A1, and polishes the surface to be polished of the semiconductor wafer pressed against the surface, and has a temperature sensor 21a that measures its own temperature.
The polishing head 22 has a semiconductor wafer to be polished on the back surface, and is driven to rotate in the direction of an arrow A2, for example, and presses the semiconductor wafer against the surface of the rotating polishing pad 21 for polishing.

The slurry arm 23 supplies slurry, which is an abrasive, to the surface of the polishing pad 21 from the nozzle 23a at the tip.
The conditioning mechanism 24 includes a conditioning disk 24a, an arm 24b, and a standby unit 24c. The conditioning disk 24 a is disposed on the surface of the polishing pad 21 to adjust the surface state of the polishing pad 21 and remove slurry remaining on the surface of the polishing pad 21. The arm 24b moves the conditioning disk 24a onto the polishing pad 21 as appropriate. When not in use, the arm 24b causes the standby part 24c outside the polishing pad 21 to wait.

The temperature adjustment mechanism 25 includes a temperature adjustment plate 31, an arm 32, a liquid reservoir temperature adjustment unit 33, and a control unit 34.
The temperature adjustment plate 31 is, for example, a circular plate-shaped member made of a metal having a high specific heat, such as copper (Cu), and is taken out from the liquid reservoir temperature adjustment unit 33 by driving the arm 32 and Placed on the surface. When the temperature adjusting plate 31 is disposed on the surface of the polishing pad 21, it is fixed at a predetermined position without rotating and moving. The temperature adjustment plate 31 stands by at the liquid reservoir temperature adjustment unit 33 when not in use. In the present embodiment, the temperature adjustment plate 31 is disposed on the polishing pad 21 and in front of the polishing head 22 at a position behind the slurry arm with respect to the rotation direction of the polishing pad 21 (arrow A1).

The arm 32 is connected to the temperature adjustment plate 31, and moves the temperature adjustment plate 31 between the liquid reservoir temperature adjustment unit 33 and the surface of the polishing pad 21.
The liquid reservoir temperature adjustment unit 33 includes a liquid reservoir 33a in which a predetermined liquid, for example, water, is stored, a temperature sensor 33b that measures the temperature of water in the liquid reservoir 33a, and the temperature of water in the liquid reservoir 33a. Temperature adjusting means 33c for adjusting. The temperature adjusting means 33c has, for example, an electric heating mechanism having a heating function and a Peltier element having a cooling function.

The control unit 34 performs drive control of the arm 32 and temperature control of water in the liquid storage tank 33a.
Based on the temperature of the surface of the polishing pad 21 measured by the temperature sensor 21a, the control unit 34 drives the temperature adjusting means 33c to adjust the temperature of the water in the liquid reservoir 33a to a predetermined temperature. The controller 34 drives the arm 32, and the arm 32 is immersed in water adjusted to a predetermined temperature in the liquid storage tank 33a, and the temperature adjustment plate 31 having the predetermined temperature is taken out from the liquid storage tank 33a and moved. Then, the temperature control plate 31 is disposed on the surface of the polishing pad 21.

FIG. 4 is a schematic plan view showing another configuration example of the polishing apparatus according to the first embodiment.
In the example of FIG. 4, two identical temperature control plates 31 are used. In this case, the temperature adjustment mechanism 25 includes two temperature adjustment plates 31, an arm 32, a cooling liquid reservoir 35, a heating hot plate 36, and a controller 34.

  The cooling liquid reservoir 35 cools the water in the liquid reservoir 35a, the temperature sensor 35b for measuring the temperature of the water in the liquid reservoir 35a, and the water in the liquid reservoir 35a. Temperature adjusting means 35c such as a Peltier element. The heating hot plate 36 has an electric heating mechanism having a heating function. The control unit 34 adjusts the temperature of the water in the liquid reservoir 35a and the temperature of the heating hot plate 36 to a predetermined temperature. The arm 32 moves the cooling temperature adjustment plate 31 from the liquid reservoir 35a to the surface of the polishing pad 21 during cooling, and the heating / cooling temperature adjustment plate 31 from the heating hot plate 36 to the surface of the polishing pad 21 during heating. Move to.

FIG. 5 is a schematic plan view showing still another configuration example of the polishing apparatus according to the first embodiment.
In the example of FIG. 5, the temperature adjusting means 31d is provided on the temperature adjusting plate 31 without providing the liquid reservoir 33a.
The temperature adjusting means 31b includes, for example, an electric heating mechanism having a heating function and a Peltier element having a cooling function. When the temperature adjustment plate 31 is not used, the temperature adjustment plate 31 stands by at the standby unit 31c. Based on the temperature of the surface of the polishing pad 21 measured by the temperature sensor 21a, the control unit 34 drives the temperature adjusting means 31d to adjust the temperature of the temperature adjusting plate 31 to a predetermined temperature.

6A and 6B are schematic views showing a temperature control plate of the polishing apparatus according to the first embodiment, wherein FIG. 6A is a perspective view, FIG. 6B is a plan view of the back surface, FIG. 6C is a cross-sectional view, and FIG. It is a partial cross section figure of protrusion vicinity.
The temperature adjustment plate 31 has a plurality of protrusions 31 </ b> A formed on a contact surface (back surface) 31 a with the polishing pad 21. The protrusions 31A are circular convex portions having a curved surface, and are arranged at equal intervals on the entire contact surface 31a.

The size of the temperature control plate 31 is, for example, 150 mm ≦ D ≦ 390 mm (the radius of the polishing pad 21) when the diameter of the polishing pad 21 is, for example, 780 mm, where D is the diameter.
The size of the protrusion 31A is, for example, 0.5 mm ≦ W ≦ 3.0 mm, 0.5 mm ≦ H ≦ 3.0 mm, where W is the width, H is the height, and D is the separation distance between the adjacent protrusions 31A. 0 mm ≦ D ≦ 5.0 mm.

  In the present embodiment, at the time of temperature adjustment, the temperature adjustment plate 31 is disposed on the polishing pad 21 in the rear position of the slurry arm 23 and in front of the polishing head 22 with respect to the rotation direction of the polishing pad 21. When the temperature control plate 31 is fixed to the outside of the polishing pad 21 and the contact surface 31a contacts the surface of the polishing pad 21 (the tip of the protrusion 31A contacts the surface of the polishing pad 21), the contact surface 31a and the polishing pad An air gap is formed between the surface of 21 and adjacent protrusions 31A. Here, the “fixed state with respect to the outside of the polishing pad 21” means that the fixed state is set with respect to the outside of the polishing pad 21, for example, the stationary polishing table 11. The movement to such an extent that the temperature adjustment plate 31 that is in contact with the surface of the polishing pad 21 slightly moves with the rotation of the polishing pad 21 is an allowable range that is regarded as a “fixed state”.

  The space between the adjacent protrusions 31A communicates from one part of the periphery of the contact surface 31a to another part, and a large number of communication paths are formed in the contact surface 31a. When the temperature control plate 31 is disposed on the polishing pad 21, the temperature adjustment plate 31 is fixed to the outside of the polishing pad 21 (a state fixed when viewed from the outside of the polishing pad 21). With this configuration, when the temperature adjustment plate 31 is in contact with the surface of the polishing pad 21 during the polishing operation and temperature adjustment is performed, a passage through which the slurry flows in and out of the gap is formed in the contact surface 31a. During the polishing operation, the flow of the slurry is prevented from being obstructed by the temperature adjusting plate 31, and sufficient supply of the slurry to the polishing pad 21 is ensured to improve the uniformity of polishing. The desired temperature control is achieved.

Here, the curvature radius R of the tip portion of the protrusion 31A is
R ≧ W / 2 (1)
It is desirable that When the curvature radius R satisfies the expression (1), even when the protrusion 31A contacts the surface of the polishing pad 21 during polishing, the surface is not damaged, and the contact surface 31a does not worry about damage to the polishing pad 21. The desired passage for the slurry is secured.

FIG. 7 is a schematic plan view showing the arrangement of protrusions on the temperature control plate of the polishing apparatus according to the first embodiment.
In FIG. 7A, the protrusions 31A are arranged in a lattice pattern on the contact surface 31a. In FIG. 7B, the protrusions 31A are arranged closest to the contact surface 31a.

(Polishing method)
Hereinafter, the polishing method according to the present embodiment will be described. FIG. 8 is a flowchart showing the polishing process according to the first embodiment in order of steps.
In accordance with the surface state of the polishing pad 21, the surface of the polishing pad 21 using the conditioning disk 24a is conditioned by driving the conditioning mechanism 24 while rotating the polishing pad 21, and then the polishing process is performed. The

First, a semiconductor wafer to be polished is placed on the polishing head 22 (step S1).
The slurry arm 23 supplies the slurry to the surface of the polishing pad 21 while rotating the polishing pad 21 (step S2).
While the polishing head 22 is driven to rotate, the surface to be polished of the semiconductor wafer is pressed against the surface of the polishing pad 21 to start the polishing operation (step S3).

The controller 34 monitors the temperature of the polishing pad 21 measured by the temperature sensor 21a, and determines whether or not it is within a predetermined appropriate range corresponding to the polishing (step S4).
In step S4, when the measured temperature deviates from the appropriate range, the control unit 34 drives the temperature adjusting means 33c to adjust the temperature of water in the liquid reservoir 33a to a predetermined temperature (step S5). This predetermined temperature is a temperature required for the temperature adjustment plate 31 in order to keep the temperature of the surface of the polishing pad 21 within an appropriate range.

  The control unit 34 drives the arm 32, and the arm 32 is immersed in the water in the liquid storage tank 33a so that the temperature adjustment plate 31 having the predetermined temperature is taken out from the liquid storage tank 33a and moved. 31 is disposed on the surface of the polishing pad 21 (step S6). The temperature adjustment plate 31 is fixed to the outside of the polishing pad 21 on the surface of the polishing pad 21.

  In a state where the temperature adjustment plate 31 is disposed on the surface of the polishing pad 21 and the temperature of the polishing pad 21 and the slurry is adjusted, the slurry discharged from the nozzle 23a of the slurry arm 23 is polished as shown in FIG. It flows toward the temperature control plate 31 by the rotation of the pad 21. The direction in which the slurry flows is indicated by arrow A3. A plurality of protrusions 31A are provided on the contact surface 31a of the temperature adjusting plate 31 with the polishing pad 21, and the slurry flowing in from the contact surface 31a flows out through a passage formed by the protrusion 31A. The outflow direction of the slurry is indicated by an arrow A4. The slurry flowing out from the contact surface 31 a of the temperature control plate 31 flows toward the polishing head 22 and is supplied to the polishing head 22.

The controller 34 monitors the temperature of the polishing pad 21 measured by the temperature sensor 21a, and determines whether or not the temperature is within a predetermined temperature range corresponding to the polishing (step S7).
In step S <b> 3, when it is determined that the measured temperature is within the intended temperature range, the control unit 34 ends the temperature adjustment and drives the arm 32. The arm 32 moves the temperature adjusting plate 31 disposed on the surface of the polishing pad 21 away from the surface, and disposes it in the liquid reservoir 33a (step S8). The temperature adjustment plate 31 is set in a standby state in the liquid reservoir 33a. It is confirmed whether or not the polishing operation is completed (step S9). If the polishing operation is being performed, step S4 is executed again. When the polishing operation is finished, step S4 is also finished.

  As described above, the polishing apparatus according to the present embodiment can reliably control the temperature of the polishing pad 21 (and slurry) in a short time while suppressing the inhibition of the supply of the slurry to the polishing head 22. High-quality polishing is realized.

[Modification]
Hereinafter, various modifications of the first embodiment will be described. These modifications differ from the first embodiment in that the temperature adjustment plate is different. Since the other constituent members of the polishing apparatus are the same as those in the first embodiment, the same reference numerals as those in the first embodiment are used and detailed description thereof is omitted.

(Modification 1)
FIG. 9 is a schematic diagram illustrating a temperature control plate of a polishing apparatus according to Modification 1 of the first embodiment, where (a) is a perspective view, (b) is a plan view of the back surface, and (c) is a cross-sectional view. (D) is a partial sectional view near the slit. (B) shows a state where the back surface is seen through from above.
The temperature control plate 41 is, for example, a circular plate member made of a metal having a high specific heat, such as copper (Cu). The temperature adjusting plate 41 has a plurality of slits 41 </ b> A formed on a contact surface (back surface) 41 a with the polishing pad 21. Each slit 41A has a curvature that decreases with increasing distance from one end 41b of the periphery of the contact surface 41a, and is formed side by side with a concave curved shape toward the one end 41b. When the temperature control plate 41 is used, the concave slit 41A serves as a slurry passage. The slit 41A has, for example, a rectangular cross-section, where the width is W, the height is H, and the distance between adjacent slits 41A is D, for example, 0.5 mm ≦ W ≦ 5.0 mm, 0.5 mm ≦ H ≦ 5.0 mm, 0.5 mm ≦ D ≦ 5.0 mm.

  When the contact surface 41a of the temperature adjusting plate 41 contacts the surface of the polishing pad 21 in a fixed state, the slit 41A becomes a gap between the contact surface 41a and the surface of the polishing pad 21. With this configuration, when the temperature adjustment plate 41 comes into contact with the surface of the polishing pad 21 during the polishing operation and the temperature adjustment is performed, the slit 41A serves as a slurry inflow and outflow passage on the contact surface 41a.

  FIG. 10 is a schematic plan view showing the flow of slurry during the polishing operation in the polishing apparatus according to the first modification of the first embodiment. In FIG. 10, illustration of the temperature sensor 21a is omitted, and the temperature adjustment mechanism 25 shows only the temperature adjustment plate 41 and the arm 32.

  In the first modification, when adjusting the temperature, the temperature adjusting plate 41 is disposed on the polishing pad 21 with respect to the rotation direction of the polishing pad 21 at a position after the slurry arm 23 and at a position before the polishing head 22. The temperature adjustment plate 41 is arranged on the surface of the polishing pad 21 so as to be fixed to the outside of the polishing pad 21 so that the slit 41A has a convex curve when viewed from the center position of the polishing pad 21. The flow of the slurry with respect to the temperature control plate 41 is indicated by an arrow A5 in FIG. The slurry that has flowed into the slit 41A is guided by the flow toward the polishing head 22 and flows out as the flow is regulated by the curved shape of the slit 41A as indicated by an arrow A4. In the first modification, the flow of the slurry is positively defined by the slit 41 </ b> A so that the flow of the slurry is evenly directed to the polishing head 22, as well as preventing the flow of the slurry from being inhibited by the temperature adjustment plate 41. As a result, sufficient supply of the slurry to the polishing pad 21 is ensured to improve polishing uniformity, and desired temperature control of the polishing pad 21 and the slurry is achieved.

  As described above, in the polishing apparatus according to the first modification, the temperature control of the polishing pad 21 (and slurry) can be reliably performed in a short time while suppressing the inhibition of the proper supply of slurry. Polishing is realized.

(Modification 2)
FIG. 11 is a schematic diagram illustrating a temperature control plate of a polishing apparatus according to Modification 2 of the first embodiment, where (a) is a perspective view, (b) is a plan view of the back surface, and (c) is a cross-sectional view. (D) is a partial sectional view near the slit. (B) shows a state where the back surface is seen through from above.
The temperature control plate 42 is, for example, a circular plate member made of a metal having a high specific heat, such as copper (Cu). The temperature adjusting plate 42 has a plurality of slits 42 </ b> A formed on a contact surface (back surface) 42 a with the polishing pad 21. The slit 42A has a curvature that decreases with increasing distance from the one end 42b of the peripheral edge of the contact surface 42a. These are formed side by side. When the temperature adjusting plate 42 is used, the concave slit 42A serves as a slurry passage. The slit 42A has, for example, a rectangular cross section, where W is the width, H is the height, and D is the distance between the adjacent slits 42A, for example, 0.5 mm ≦ W ≦ 5.0 mm, 0.5 mm. ≦ H ≦ 5.0 mm, 0.5 mm ≦ D ≦ 5.0 mm.

  When the contact surface 42a of the temperature control plate 42 contacts the surface of the polishing pad 21 in a fixed state, the slit 42A becomes a gap between the contact surface 42a and the surface of the polishing pad 21. With this configuration, when the temperature adjustment plate 42 comes into contact with the surface of the polishing pad 21 during the polishing operation and the temperature adjustment is performed, the slit 42A becomes a slurry inflow and outflow passage on the contact surface 42a.

  In the second modification, at the time of temperature adjustment, the temperature adjustment plate 42 is disposed on the polishing pad 21 with respect to the rotation direction of the polishing pad 21 at a position after the slurry arm 23 and at a position before the polishing head 22. The temperature adjustment plate 42 is arranged on the surface of the polishing pad 21 so as to be fixed to the outside of the polishing pad 21 so that the slit 42A1 has a convex curve when viewed from the center position of the polishing pad 21. The flow of the slurry with respect to the temperature control plate 42 is indicated by an arrow A5 in FIG. The slurry that has flowed into the slit 42A is guided by the flow toward the polishing head 22 and flows out while being regulated by the curved and linear shapes of the slit 42A. In the second modification, the slurry flow is positively defined by the slits 42 </ b> A so that the slurry flow is uniformly directed toward the polishing head 22, as well as suppressing the slurry flow from being inhibited by the temperature adjustment plate 42. As a result, sufficient supply of the slurry to the polishing pad 21 is ensured to improve polishing uniformity, and desired temperature control of the polishing pad 21 and the slurry is achieved.

  As described above, in the polishing apparatus according to the modified example 2, the temperature control of the polishing pad 21 (and slurry) can be reliably performed in a short time while suppressing the inhibition of the proper supply of the slurry. Polishing is realized.

(Modification 3)
12A and 12B are schematic views showing a temperature control plate of a polishing apparatus according to Modification 3 of the first embodiment, wherein FIG. 12A is a perspective view, FIG. 12B is a plan view of the back surface, and FIG. 12C is a cross-sectional view. (D) is a partial sectional view near the slit. (B) shows a state where the back surface is seen through from above.
The temperature control plate 43 is a circular plate-shaped member made of a metal having a high specific heat, for example, copper (Cu). The temperature adjusting plate 43 has a plurality of slits 43 </ b> A formed on a contact surface (back surface) 43 a with the polishing pad 21. The plurality of slits 43A include a plurality of first slits 43A1, for example, one second slit 43A2 and a plurality of third slits 43A3, which are formed side by side. The first slit 43A1 is a curved slit that has a curvature that decreases with increasing distance from one end 43b of the peripheral edge of the contact surface 43a, and is concave toward the one end 43b. The second slit 43A2 is a linear slit. The third slit 43A3 is a curved slit having a curvature that increases with distance from the second slit 43A2 and is concave toward the second slit 43A2. When the temperature adjusting plate 43 is used, the concave slit 43A serves as a slurry passage.

  The slit 43A has, for example, a rectangular shape in cross section. When the width is W, the height is H, and the distance between adjacent slits 43A is D, for example, 0.5 mm ≦ W ≦ 5.0 mm, 0.5 mm ≦ H ≦ 5.0 mm, 0.5 mm ≦ D ≦ 5.0 mm.

  When the contact surface 43a of the temperature control plate 43 comes into contact with the surface of the polishing pad 21 in a fixed state, the slit 43A becomes a gap between the contact surface 43a and the surface of the polishing pad 21. With this configuration, when the temperature adjustment plate 43 comes into contact with the surface of the polishing pad 21 during the polishing operation and the temperature adjustment is performed, the slit 43A serves as a slurry inflow and outflow passage on the contact surface 43a.

  In the third modification, the temperature adjustment plate 43 is disposed on the polishing pad 21 at a position after the slurry arm 23 and at a position in front of the polishing head 22 with respect to the rotation direction of the polishing pad 21 during temperature adjustment. The temperature adjusting plate 43 is arranged on the surface of the polishing pad 21 so as to be fixed to the outside of the polishing pad 21 so that the slit 43A is parallel to the direction of the slurry flow indicated by the arrow A5 in FIG. The Here, the slit 43A1 has a convex curve when viewed from the center position of the polishing pad 21, and the slit 43A3 has a convex curve when viewed from the center position of the polishing pad 21. The slurry that has flowed into the slit 43A flows out with its flow regulated by the curved and linear shapes of the slit 43A. Here, the slurry that has passed through the slits 43A1 (, 43A2) is guided inward from the center position of the polishing head 22, in particular. The slurry that has passed through the slit 43A3 is guided particularly toward the outside of the polishing head 22. In the third modification, the slurry flow is positively regulated by the slits 43 </ b> A so that the slurry flow is prevented from being obstructed by the temperature adjusting plate 43 and is uniformly directed to the entire polishing head 22 at a wide angle. The As a result, sufficient supply of the slurry to the polishing pad 21 is ensured to improve polishing uniformity, and desired temperature control of the polishing pad 21 and the slurry is achieved.

  As described above, the polishing apparatus according to the third modification can be controlled without hindering the proper supply of slurry, and the temperature of the polishing pad 21 (and slurry) can be reliably controlled in a short time. High polishing is achieved.

(Modification 4)
FIG. 13 is a schematic diagram illustrating a temperature control plate of a polishing apparatus according to Modification 4 of the first embodiment, where (a) is a perspective view, (b) is a plan view of the back surface, and (c) is a cross-sectional view. (D) is a partial sectional view near the slit. (B) shows a state where the back surface is seen through from above.
The temperature control plate 44 is a circular plate-shaped member made of a metal having a high specific heat, for example, copper (Cu). The temperature adjusting plate 44 has a plurality of slits 44 </ b> A formed on a contact surface (back surface) 44 a with the polishing pad 21. The slits 44A are formed in a straight line extending radially from one end of the contact surface 44a. In FIG. 13, among the slits 44A, with respect to the central second slit 44A2, the left one is the first slit 44A1, and the right one is the third slit 44A3. When the temperature adjusting plate 44 is used, the concave slit 44A serves as a slurry passage.

  The slit 44A has, for example, a rectangular cross section, where the width is W, the height is H, and the distance between adjacent slits 44A is D, for example, 0.5 mm ≦ W ≦ 5.0 mm, 0.5 mm. ≦ H ≦ 5.0 mm, 0.5 mm ≦ D ≦ 5.0 mm.

  When the contact surface 44a of the temperature adjusting plate 44 comes into contact with the surface of the polishing pad 21 in a fixed state, the slit 44A becomes a gap between the contact surface 44a and the surface of the polishing pad 21. With this configuration, when the temperature adjustment plate 44 comes into contact with the surface of the polishing pad 21 during the polishing operation and the temperature adjustment is performed, the slit 44A serves as a slurry inflow and outflow passage on the contact surface 44a.

  In the fourth modification, when adjusting the temperature, the temperature adjustment plate 44 is disposed on the polishing pad 21 in the rear position of the slurry arm 23 and in front of the polishing head 22 with respect to the rotation direction of the polishing pad 21. The temperature adjusting plate 44 is fixed to the outside of the polishing pad 21 on the surface of the polishing pad 21, and the slit 44A is arranged in parallel with the direction of the slurry flow indicated by the arrow A5 in FIG. The Here, the slit 44A1 is a straight line toward the inside of the polishing pad 21 when viewed from the center position of the polishing pad 21, and the slit 44A3 is a straight line toward the outside of the polishing pad 21. The slurry flowing into the slit 44A flows out with its flow regulated by the linear shape of the slit 44A. Here, the slurry that has passed through the slits 44 </ b> A <b> 1 (44 </ b> A <b> 2) is guided inward from the center position of the polishing head 22 in particular. The slurry that has passed through the slit 44A3 is guided particularly toward the outside of the polishing head 22. In the modified example 4, the slurry flow is positively regulated by the slits 44A so that the slurry flow is evenly directed to the entire polishing head 22 at a wide angle, as well as preventing the slurry flow from being obstructed by the temperature adjusting plate 44. The As a result, sufficient supply of the slurry to the polishing pad 21 is ensured to improve polishing uniformity, and desired temperature control of the polishing pad 21 and the slurry is achieved.

  As described above, in the polishing apparatus according to the modified example 4, the reliability of the polishing pad 21 (and slurry) can be reliably controlled in a short time by controlling the supply of the slurry without hindering it. High polishing is achieved.

In the above-described modified examples 1 to 4, the slit shape of the temperature control plate is not limited to FIGS. 10D, 11D, 12D, and 13D, for example, the following modes It is also good. In the following description, Modification 1 will be described as an example, but the same applies to Modifications 2 to 4.
FIG. 14 is a partial cross-sectional view illustrating another example of the slit shape of the temperature control plate in Modifications 1 to 4, and illustrates Modification 1.

  In the example of FIG. 14A, the slit 41A of the temperature adjustment plate 41 has a rectangular cross section, and the side surface 41Aa at the front end and the side surface 41Ab at the rear end are rounded and chamfered. Since the side surface 41Aa is chamfered, the slit 41A does not damage the surface even if the convex portion of the slit 41A contacts the surface of the polishing pad 21 during polishing, and there is no concern about damage to the polishing pad 21. The desired passage for the slurry is secured. Further, since the side surface 41Ab is chamfered, the slit 41A can surely pass through the slit 41A without staying in the slit 41A.

  In the example of FIG. 14B, the slit 41A of the temperature adjustment plate 41 has a semicircular cross section. Due to the semicircular shape of the cross section of the slit 41A, the slurry surely passes through the slit 41A without staying in the slit 41A, and an expected passage of the slurry is secured.

  In the example of FIG. 14C, the slit 41A of the temperature control plate 41 has a semicircular cross section, and the tip side surface 41Ac is rounded and chamfered into a curved shape. Since the side surface 41Ac is chamfered, the slit 41A does not damage the surface even if the convex portion of the slit 41A contacts the surface of the polishing pad 21 during polishing, and there is no concern about damage to the polishing pad 21. The desired passage for the slurry is secured. Further, the slit 41A can surely pass through the slit 41A without the slurry staying in the slit 41A due to the semicircular shape of the cross section.

(Modification 5)
15A and 15B are schematic views showing a temperature control plate of a polishing apparatus according to Modification 5 of the first embodiment, wherein FIG. 15A is a perspective view, FIG. 15B is a plan view of the back surface, and FIG. 15C is a cross-sectional view. (D) is a partial sectional view near the slit.
The temperature control plate 51 is a rectangular plate made of a metal having a high specific heat, such as copper (Cu), for example, a rectangular plate member. The temperature adjustment plate 51 has a plurality of protrusions 51 </ b> A formed on a contact surface (back surface) 51 a with the polishing pad 21. The protrusions 51A are circular convex portions having a curved surface, and are arranged in a lattice shape or a close-packed shape at equal intervals over the entire contact surface 51a.

It is assumed that the polishing pad 21 has a diameter of, for example, 780 mm and the semiconductor wafer to be polished has a diameter of 300 mm. In this case, the size of the temperature control plate 51 is, for example, 300 mm ≦ L ≦ 390 mm (the radius of the polishing pad 21), 50 mm ≦ L ≦ 150 mm, where L is the length in the longitudinal direction and W is the length in the rectangular direction. (Radius of the semiconductor wafer).
The size of the protrusion 51A is, for example, 0.5 mm ≦ W ≦ 3.0 mm, 0.5 mm ≦ H ≦ 3.0 mm, where W is the width, H is the height, and D is the separation distance between the adjacent protrusions 51A. 0 mm ≦ D ≦ 5.0 mm.

  FIG. 16 is a schematic plan view showing the flow of slurry during the polishing operation in the polishing apparatus according to the fifth modification of the first embodiment. In FIG. 16, illustration of the temperature sensor 21a is omitted, and the temperature adjustment mechanism 25 shows only the temperature adjustment plate 51, the arm 32, and the rectangular liquid reservoir tank 33a.

  In the fifth modification, when adjusting the temperature, the temperature adjustment plate 51 is disposed on the polishing pad 21 with respect to the rotation direction of the polishing pad 21 at a position after the slurry arm 23 and at a position before the polishing head 22. The temperature control plate 51 is arranged so that its short direction is parallel to the direction of the slurry flow indicated by the arrow A5 in FIG. When the contact surface 51a of the temperature control plate 51 is in contact with the surface of the polishing pad 21 in a fixed state (the tip of the protrusion 51A is in contact with the surface of the polishing pad 21), the contact surface 51a and the surface of the polishing pad 21 are A gap is formed by the adjacent protrusions 51A. The gap communicates from one part of the periphery of the contact surface 51a to another part, and a large number of communication paths are formed in the contact surface 51a. With this configuration, when the temperature adjustment plate 51 is in contact with the surface of the polishing pad 21 during the polishing operation and temperature adjustment is performed, a passage through which the slurry flows in and out of the gap is formed in the contact surface 51a. The outflow direction of the slurry is indicated by an arrow A4. During the polishing operation, the flow of the slurry is not hindered by the temperature adjusting plate 51, and sufficient supply of the slurry to the polishing pad 21 is ensured to improve polishing uniformity. Temperature regulation is achieved.

Here, the curvature radius R of the tip portion of the protrusion 51A is
R ≧ W / 2 (1)
It is desirable that When the radius of curvature R satisfies the expression (1), even if the protrusion 51A contacts the surface of the polishing pad 21 during polishing, the surface is not damaged, and the contact surface 51a does not worry about damage to the polishing pad 21. The desired passage for the slurry is secured.

  As described above, in the polishing apparatus according to the modified example 5, the temperature control of the polishing pad 21 (and slurry) can be reliably performed in a short time while suppressing the inhibition of the supply of the slurry to the polishing head 22. High-quality polishing is realized.

(Modification 6)
FIG. 17 is a schematic diagram illustrating a temperature control plate of a polishing apparatus according to Modification 6 of the first embodiment, where (a) is a perspective view, (b) is a plan view of the back surface, and (c) is a cross-sectional view, (D) is a partial sectional view near the slit. (B) shows a state where the back surface is seen through from above.
The temperature control plate 52 is a rectangular plate made of a metal having a high specific heat, such as copper (Cu), for example, a rectangular plate member. The temperature adjustment plate 52 has a plurality of slits 52 </ b> A formed on a contact surface (back surface) 52 a with the polishing pad 21. Each slit 52A is formed in a curved shape that is convex upward when viewed from one end 52b, which is a portion slightly shifted downward from the center position of the short side in FIG. Each slit 52A may have a curvature that decreases with increasing distance from one end 52b, and may be formed side by side in a concave curve toward one end 52b. When the temperature adjusting plate 52 is used, the concave slit 52A serves as a slurry passage.

  The slit 52A has, for example, a rectangular cross section, where the width is W, the height is H, and the distance between adjacent slits 52A is D, for example, 0.5 mm ≦ W ≦ 5.0 mm, 0.5 mm. ≦ H ≦ 5.0 mm, 0.5 mm ≦ D ≦ 5.0 mm.

  When the contact surface 52a of the temperature control plate 52 contacts the surface of the polishing pad 21 in a fixed state, the slit 52A becomes a gap between the contact surface 52a and the surface of the polishing pad 21. With this configuration, when the temperature adjustment plate 52 comes into contact with the surface of the polishing pad 21 during the polishing operation and the temperature adjustment is performed, the slit 52A serves as a slurry inflow and outflow passage on the contact surface 52a.

  FIG. 18 is a schematic plan view showing the flow of slurry during the polishing operation in the polishing apparatus according to the sixth modification of the first embodiment. In FIG. 18, the temperature sensor 21a is not shown, and the temperature adjustment mechanism 25 shows only the temperature adjustment plate 52, the arm 32, and the rectangular liquid reservoir tank 33a.

  In the modified example 6, when adjusting the temperature, the temperature adjusting plate 52 is disposed on the polishing pad 21 in the rear position of the slurry arm 23 and in front of the polishing head 22 with respect to the rotation direction of the polishing pad 21. The temperature adjustment plate 52 is fixed to the outside of the polishing pad 21 on the surface of the polishing pad 21, and the slit 52 </ b> A is disposed so as to have a convex curve when viewed from the center position of the polishing pad 21. . The direction of the slurry flow with respect to the temperature control plate 52 is indicated by an arrow A5 in FIG. The slurry flowing into the slit 52A is guided by the flow toward the polishing head 22 with the flow regulated by the curved shape of the slit 52A. The outflow direction of the slurry is indicated by an arrow A4. In the modified example 6, the flow of the slurry is positively regulated by the slits 52 </ b> A so that the flow of the slurry is evenly directed to the polishing head 22, as well as preventing the flow of the slurry from being inhibited by the temperature adjustment plate 52. As a result, sufficient supply of the slurry to the polishing pad 21 is ensured to improve polishing uniformity, and desired temperature control of the polishing pad 21 and the slurry is achieved.

  As described above, in the polishing apparatus according to the modified example 6, the temperature control of the polishing pad 21 (and slurry) can be reliably performed in a short time while suppressing the inhibition of the proper supply of slurry. Polishing is realized.

(Modification 7)
FIG. 19 is a schematic view showing a temperature control plate of a polishing apparatus according to Modification 7 of the first embodiment, where (a) is a perspective view, (b) is a plan view of the back surface, and (c) is a cross-sectional view, (D) is a partial sectional view near the slit. (B) shows a state where the back surface is seen through from above.
The temperature control plate 53 is a rectangular, for example, rectangular plate-shaped member made of a metal having a high specific heat, such as copper (Cu). The temperature adjustment plate 53 has a plurality of slits 53 </ b> A formed on a contact surface (back surface) 53 a with the polishing pad 21. In FIG. 19B, attention is paid to one end 53b which is a portion slightly shifted downward from the center position of the short side. The slit 53A has a curvature that decreases with increasing distance from the one end 53b. The slit 53A includes a plurality of first curved slits 53A1 that are concave toward the one end 53b and, for example, one linear second slit 53A2. It is formed side by side. When the temperature adjusting plate 53 is used, the concave slit 53A serves as a slurry passage.

  The slit 53A has, for example, a rectangular shape in cross section. When the width is W, the height is H, and the distance between adjacent slits 53A is D, for example, 0.5 mm ≦ W ≦ 5.0 mm, 0.5 mm ≦ H ≦ 5.0 mm, 0.5 mm ≦ D ≦ 5.0 mm.

  When the contact surface 53a of the temperature control plate 53 comes into contact with the surface of the polishing pad 21 in a fixed state, the slit 53A becomes a gap between the contact surface 53a and the surface of the polishing pad 21. With this configuration, when the temperature adjustment plate 53 comes into contact with the surface of the polishing pad 21 during the polishing operation and the temperature adjustment is performed, the slit 53A serves as a slurry inflow and outflow passage on the contact surface 53a.

  In the modified example 7, when adjusting the temperature, the temperature adjustment plate 53 is disposed on the polishing pad 21 with respect to the rotation direction of the polishing pad 21 at a position after the slurry arm 23 and at a position before the polishing head 22. The temperature adjustment plate 53 is arranged on the surface of the polishing pad 21 so as to be fixed to the outside of the polishing pad 21 so that the slit 53A1 has a convex curve when viewed from the center position of the polishing pad 21. The direction of the slurry flow indicated by the arrow A <b> 5 is parallel to the short direction of the temperature control plate 53. The slurry that has flowed into the slit 53A is guided by the flow toward the polishing head 22 and flows out, with the flow being regulated by the curved and linear shapes of the slit 53A. In the modified example 7, the slurry flow is positively defined by the slits 53 </ b> A so that the slurry flow is uniformly directed toward the polishing head 22 as well as suppressing the slurry flow from being inhibited by the temperature adjustment plate 53. As a result, sufficient supply of the slurry to the polishing pad 21 is ensured to improve polishing uniformity, and desired temperature control of the polishing pad 21 and the slurry is achieved.

  As described above, in the polishing apparatus according to the modified example 7, the reliability can be reliably controlled in a short time by controlling the slurry supply without hindering proper supply and controlling the temperature of the polishing pad 21 (and slurry). High polishing is achieved.

(Modification 8)
FIG. 20 is a schematic diagram showing a temperature control plate of a polishing apparatus according to Modification 8 of the first embodiment, where (a) is a perspective view, (b) is a plan view of the back surface, and (c) is a cross-sectional view, (D) is a partial sectional view near the slit. (B) shows a state where the back surface is seen through from above.
The temperature adjusting plate 54 is a rectangular plate made of a metal having a high specific heat, such as copper (Cu), for example, a rectangular plate member. The temperature adjustment plate 54 has a plurality of slits 54 </ b> A formed on a contact surface (back surface) 54 a with the polishing pad 21. The plurality of slits 54A include a plurality of first slits 54A1, for example, one second slit 54A2 and a plurality of third slits 54A3, which are formed side by side. The first slit 54A1 is formed in a curved shape that has a curvature that decreases with increasing distance from the one end 54b, which is a portion slightly shifted downward from the center position of the short side in FIG. 20B, and becomes concave toward the one end 54b. ing. The second slit 54A2 is formed linearly. The third slit 54A3 has a curvature that increases with distance from the one end 54b so as to be symmetrical with the first slit 54A1 with respect to the second slit 54A2, and is formed in a curved shape that protrudes toward the one end 54b. Yes.

  The first slit 54A1 may be formed in an upwardly convex curved shape having a curvature that decreases with increasing distance from the one end 54b, which is a portion slightly shifted downward from the center position of the short side in FIG. . The third slit 54A3 may be formed in a downwardly convex curved shape having a curvature that increases with distance from the second slit 54A2. When the temperature adjusting plate 54 is used, the concave slit 54A serves as a slurry passage.

  The slit 54A has, for example, a rectangular shape in cross section. If the width is W, the height is H, and the distance between adjacent slits 54A is D, for example, 0.5 mm ≦ W ≦ 5.0 mm, 0.5 mm ≦ H ≦ 5.0 mm, 0.5 mm ≦ D ≦ 5.0 mm.

  When the contact surface 54a of the temperature adjusting plate 54 comes into contact with the surface of the polishing pad 21 in a fixed state, the slit 54A becomes a gap between the contact surface 54a and the surface of the polishing pad 21. With this configuration, when the temperature adjustment plate 54 comes into contact with the surface of the polishing pad 21 during the polishing operation and the temperature adjustment is performed, the slit 54A serves as a slurry inflow and outflow passage on the contact surface 54a.

  In the modified example 8, when adjusting the temperature, the temperature adjustment plate 54 is disposed on the polishing pad 21 in the rear position of the slurry arm 23 and in front of the polishing head 22 with respect to the rotation direction of the polishing pad 21. The temperature control plate 54 is disposed on the surface of the polishing pad 21 so as to be fixed to the outside of the polishing pad 21 so that the direction of the slurry flow indicated by the arrow A5 is parallel to the short direction of the temperature control plate 54. The Here, the slit 54A1 has a convex curve when viewed from the center position of the polishing pad 21, and the slit 54A3 has a convex curve when viewed from the center position of the polishing pad 21. The slurry that has flowed into the slit 54A flows out with its flow regulated by the curved and linear shapes of the slit 54A. Here, the slurry that has passed through the slit 54A1 (, 54A2) is guided inward from the center position of the polishing head 22, in particular. The slurry that has passed through the slit 54A3 is guided particularly toward the outside of the polishing head 22. In the modified example 8, the slurry flow is positively defined by the slit 54A so that the slurry flow is uniformly directed to the entire polishing head 22 at a wide angle, as well as suppressing the slurry flow from being obstructed by the temperature adjusting plate 54. The As a result, sufficient supply of the slurry to the polishing pad 21 is ensured to improve polishing uniformity, and desired temperature control of the polishing pad 21 and the slurry is achieved.

  As described above, in the polishing apparatus according to the modified example 8, it is possible to control without disturbing the proper supply of the slurry and to reliably perform the temperature control of the polishing pad 21 (and slurry) in a short time. High polishing is achieved.

(Modification 9)
FIG. 21 is a schematic diagram illustrating a temperature control plate of a polishing apparatus according to Modification 9 of the first embodiment, where (a) is a perspective view, (b) is a plan view of the back surface, and (c) is a cross-sectional view, (D) is a partial sectional view near the slit. (B) shows a state where the back surface is seen through from above.
The temperature control plate 55 is a rectangular plate made of a metal having a high specific heat, such as copper (Cu), for example, a rectangular plate member. The temperature adjusting plate 55 has a plurality of slits 55 </ b> A formed on a contact surface (back surface) 55 a with the polishing pad 21. The slits 55A are formed in a straight line extending radially from the long side of one end of the contact surface 55a. Of the slits 55A, the left side in FIG. 21 with respect to the center second slit 55A2 is the first slit 55A1, and the right side is the third slit 55A3. When the temperature adjusting plate 55 is used, the concave slit 55A serves as a slurry passage.

  The slit 55A has, for example, a rectangular shape in cross section. When the width is W, the height is H, and the distance between adjacent slits 55A is D, for example, 0.5 mm ≦ W ≦ 5.0 mm, 0.5 mm ≦ H ≦ 5.0 mm, 0.5 mm ≦ D ≦ 5.0 mm.

  When the contact surface 55a of the temperature adjusting plate 55 comes into contact with the surface of the polishing pad 21 in a fixed state, the slit 55A becomes a gap between the contact surface 55a and the surface of the polishing pad 21. With this configuration, when the temperature adjustment plate 55 comes into contact with the surface of the polishing pad 21 during the polishing operation and the temperature adjustment is performed, the slit 55A serves as a slurry inflow and outflow passage on the contact surface 55a.

  In the modification 9, the temperature adjusting plate 55 is disposed on the polishing pad 21 at a position after the slurry arm 23 and at a position in front of the polishing head 22 with respect to the rotation direction of the polishing pad 21 when adjusting the temperature. The temperature adjustment plate 55 is arranged on the surface of the polishing pad 21 so as to be fixed to the outside of the polishing pad 21 so that the direction of the slurry flow indicated by the arrow A5 is parallel to the short direction of the temperature adjustment plate 55. The Here, the slit 55A1 is a straight line toward the inside of the polishing pad 21 when viewed from the center position of the polishing pad 21, and the slit 55A3 is a straight line toward the outside of the polishing pad 21. The slurry flowing into the slit 55A flows out with its flow regulated by the linear shape of the slit 55A. Here, the slurry that has passed through the slit 55A1 (, 55A2) is guided inward from the center position of the polishing head 22 in particular. The slurry that has passed through the slit 55A3 is guided particularly toward the outside of the polishing head 22. In the modified example 9, the flow of the slurry is positively regulated by the slits 55A so that the flow of the slurry is evenly directed to the entire polishing head 22 at a wide angle as well as suppressing the inhibition of the flow of the slurry by the temperature adjusting plate 55. The As a result, sufficient supply of the slurry to the polishing pad 21 is ensured to improve polishing uniformity, and desired temperature control of the polishing pad 21 and the slurry is achieved.

  As described above, in the polishing apparatus according to the modified example 9, the temperature control of the polishing pad 21 (and slurry) can be reliably performed in a short time while suppressing the inhibition of the proper supply of the slurry. Polishing is realized.

  Also in the above-described modified examples 6 to 9, as in the modified examples 1 to 4, the slits of the temperature control plate are chamfered at the front side surface and the rear side surface, or are semicircular in cross section, or semicircular in cross section. The tip side surface may be chamfered.

[Second Embodiment]
Next, the second embodiment will be described. In the present embodiment, the polishing apparatus adopts a mode in which the temperature adjusting plate is disposed on the polishing pad at a position before the slurry arm and at a position behind the polishing head with respect to the rotation direction of the polishing pad. About another structure, it is the same as that of 1st Embodiment.

FIG. 22 is a schematic plan view showing a polishing unit of the polishing apparatus according to the second embodiment.
The temperature control plate 31 is a circular plate-like member, and is the same as the temperature control plate 31 shown in FIGS. 3 to 7 of the first embodiment. In the polishing unit 10, the temperature adjustment plate 31 is disposed on the polishing pad 21 in the front position of the slurry arm 23 and at the rear position of the polishing head 22 with respect to the rotation direction of the polishing pad 21 (arrow A1).

  At the time of temperature adjustment, when the contact surface 31a of the temperature adjustment plate 31 is in contact with the surface of the polishing pad 21 in a fixed state (the tip of the protrusion 31A contacts the surface of the polishing pad 21), the contact surface 31a and the surface of the polishing pad 21 A gap is formed between adjacent projections 31A. The gap communicates from one part of the periphery of the contact surface 31a to another part, and a large number of communication paths are formed in the contact surface 31a. With this configuration, when the temperature adjustment plate 31 is in contact with the surface of the polishing pad 21 during the polishing operation and temperature adjustment is performed, a passage through which the slurry flows in and out of the gap is formed in the contact surface 31a. As a result, the flow rate of the slurry after polishing is equalized to improve the uniformity of polishing, and the desired temperature adjustment of the polishing pad 21 and the slurry is achieved.

  As described above, in the polishing apparatus according to the present embodiment, the temperature control of the polishing pad 21 (and slurry) can be reliably performed in a short time while suppressing the inhibition of the proper supply of slurry. Polishing is realized.

[Modification]
Hereinafter, various modifications of the second embodiment will be described. These modifications differ from the second embodiment in that the temperature adjustment plate is different. Since the other constituent members of the polishing apparatus are the same as those in the second embodiment, the same reference numerals as those in the first embodiment are used and detailed description thereof is omitted.

(Modification 1)
In Modification 1, the temperature adjustment plate 41 is a circular plate-like member, and is the same as the temperature adjustment plate 41 shown in FIG. 9 of Modification 1 of the first embodiment. In the polishing unit 10 of FIG. 22, the temperature adjustment plate 41 is polished at a position in front of the slurry arm 23 with respect to the rotation direction (arrow A1) of the polishing pad 21 on the polishing pad 21 instead of the temperature adjustment plate 31. It is arranged at the rear position of the head 22.

  In the first modification, at the time of temperature adjustment, the temperature adjustment plate 41 is arranged so that the slit 41A has a convex curve when viewed from the center position of the polishing pad 21. The flow of the slurry is the same as the arrow A5 in FIG. 9B of the first modification of the first embodiment. The slurry that has flowed into the slit 41A is guided by the flow toward the polishing head 22 and flows out as the flow is regulated by the curved shape of the slit 41A as indicated by an arrow A4. In the first modification, the flow of the slurry is positively regulated by the slits 41 </ b> A so that the flow rate of the slurry after polishing is equal, as well as suppressing the inhibition of the slurry flow by the temperature adjustment plate 41. As a result, the flow rate of the slurry after polishing is equalized to improve the uniformity of polishing, and the desired temperature adjustment of the polishing pad 21 and the slurry is achieved.

  As described above, in the polishing apparatus according to the first modification, the temperature control of the polishing pad 21 (and slurry) can be reliably performed in a short time while suppressing the inhibition of the proper supply of slurry. Polishing is realized.

(Modification 2)
In the second modification, the temperature adjustment plate 41 is a circular plate-like member and is the same as the temperature adjustment plate 41 in the first modification. In the polishing unit 10 of FIG. 22, the temperature adjustment plate 41 is polished at a position in front of the slurry arm 23 with respect to the rotation direction (arrow A1) of the polishing pad 21 on the polishing pad 21 instead of the temperature adjustment plate 31. It is arranged at the rear position of the head 22.

  FIG. 23 is a schematic plan view showing the flow of slurry during the polishing operation in the polishing apparatus according to the second modification of the second embodiment. In FIG. 23, illustration of the temperature sensor 21a is omitted, and the temperature adjustment mechanism 25 shows only the temperature adjustment plate 41 and the arm 32.

  In the second modification, the temperature adjusting plate 41 is fixed to the outside of the polishing pad 21 on the surface of the polishing pad 21 during temperature adjustment, and the curvature decreases as the slit 41A moves away from the one end 41b of the polishing pad 21. And is arranged in a curved shape that becomes concave toward one end 41b. As shown in FIG. 24, in the temperature control plate 41 of the second modification, the slit 41A rotates somewhat counterclockwise from the state of FIG. 9B with respect to the slurry flow (arrow A5) with respect to the temperature control plate 41. It arrange | positions so that it may be in the state. In the temperature control plate 41 of the second modification, the slurry outflow portion in the slit 41 </ b> A is bent more toward the inside of the polishing pad 21 than the temperature control plate 41 of the first modification. The slurry flowing into the slit 41A is regulated in the curved shape of the slit 41A as indicated by an arrow A4, flows out of the slit 41A, flows toward the inside of the polishing pad 21 again, and is reused. In the first modification, not only the flow of the slurry is inhibited from being inhibited by the temperature adjustment plate 41 but also the slurry 41 is positively defined by the slit 41A so that the slurry is reused and is evenly directed to the polishing head 22. The Thereby, although the amount of the slurry used is reduced by reusing the slurry, the slurry can be sufficiently supplied to the polishing pad 21 to improve the uniformity of polishing, and the expected polishing pad 21 and slurry can be used. Temperature regulation is achieved.

  As described above, in the polishing apparatus according to the modified example 2, the temperature control of the polishing pad 21 (and slurry) can be reliably performed in a short time while suppressing the inhibition of the proper supply of the slurry. Polishing is realized.

(Modification 3)
In the third modification, the temperature adjustment plate 41 is a circular plate-like member and is the same as the temperature adjustment plate 41 in the first modification. In the polishing unit 10 of FIG. 22, the temperature adjustment plate 41 is polished at a position in front of the slurry arm 23 with respect to the rotation direction (arrow A1) of the polishing pad 21 on the polishing pad 21 instead of the temperature adjustment plate 31. It is arranged at the rear position of the head 22.

  FIG. 25 is a schematic plan view showing the flow of slurry during the polishing operation in the polishing apparatus according to Modification 3 of the second embodiment. In FIG. 25, illustration of the temperature sensor 21a is omitted, and the temperature adjustment mechanism 25 shows only the temperature adjustment plate 41 and the arm 32.

  In the third modification, the arrangement mode of the temperature adjustment plate 41 is different from the first modification. As shown in FIG. 26, when adjusting the temperature, the temperature adjustment plate 41 is fixed to the outside of the polishing pad 21 on the surface of the polishing pad 21, and becomes smaller as the slit 41 </ b> A moves away from the one end 41 b of the polishing pad 21. And is arranged so as to form a concave curve toward the one end 41b. The flow of the slurry with respect to the temperature control plate 41 is indicated by an arrow A5 in FIG. In the temperature adjustment plate 41 of the third modification, the outflow portion of the slurry in the slit 41 </ b> A is bent toward the outside of the polishing pad 21. The slurry flowing into the slit 41A is regulated by the curved shape of the slit 41A as indicated by an arrow A4, flows out from the slit 41A, flows toward the outside of the polishing pad 21, and is discharged. In the second modification, not only the flow of the slurry is inhibited from being inhibited by the temperature adjusting plate 41, but also the slit 41A is positive so that the slurry is discharged to the outside of the polishing pad 21 together with the polishing pad scraps and reaction products. Is stipulated. As a result, an improvement in the polishing rate and a reduction in the occurrence of scratches are achieved, and the desired temperature control of the polishing pad 21 and the slurry is achieved.

  As described above, in the polishing apparatus according to the modified example 3, the temperature control of the polishing pad 21 (and slurry) can be reliably performed in a short time while suppressing the inhibition of the proper supply of the slurry. Polishing is realized.

(Modification 4)
In Modification 4, the temperature adjustment plate 42 is a circular plate-like member, and is the same as the temperature adjustment plate 42 shown in FIG. 11 of Modification 2 of the first embodiment. In the polishing unit 10 of FIG. 22, the temperature adjustment plate 42 is polished at a position in front of the slurry arm 23 with respect to the rotation direction (arrow A1) of the polishing pad 21 on the polishing pad 21 instead of the temperature adjustment plate 31. It is arranged at the rear position of the head 22.

  In the modified example 4, when adjusting the temperature, the temperature adjustment plate 42 is fixed to the outside of the polishing pad 21 on the surface of the polishing pad 21, and the slit 42 </ b> A <b> 1 is a concave curve toward the center position of the polishing pad 21. It is arranged to be. The flow of the slurry is the same as the arrow A5 in FIG. 11B of the second modification of the first embodiment. The slurry that has flowed into the slit 42A is guided by the flow toward the polishing head 22 and flows out while being regulated by the curved and linear shapes of the slit 42A. In the second modification, the flow of the slurry is positively defined by the slits 42A so that the flow rate of the slurry after polishing is equal, as well as preventing the slurry flow from being inhibited by the temperature adjustment plate 42. As a result, the flow rate of the slurry after polishing is equalized to improve the uniformity of polishing, and the desired temperature adjustment of the polishing pad 21 and the slurry is achieved.

  As described above, in the polishing apparatus according to the modified example 4, the temperature control of the polishing pad 21 (and slurry) can be reliably performed in a short time while suppressing the inhibition of the proper supply of slurry. Polishing is realized.

  Also in the above-described modified examples 1 to 4, as in the modified examples 1 to 4 of the first embodiment, the slit of the temperature adjusting plate has a semicircular cross-section that chamfers the side surface at the front end and the side surface at the rear end. Alternatively, the side surface of the tip may be chamfered with a semicircular cross section.

(Modification 5)
FIG. 27 is a schematic plan view showing a polishing unit of a polishing apparatus according to Modification 5 of the second embodiment. In FIG. 27, the temperature sensor 21a is not shown, and the temperature adjustment mechanism 25 shows only the temperature adjustment plate 51, the arm 32, and the rectangular liquid reservoir tank 33a.

  The temperature control plate 51 is a rectangular plate member, for example, a rectangular plate member, and is the same as the temperature control plate 51 shown in FIG. 15 of the fifth modification of the first embodiment. In the polishing unit 10, the temperature adjustment plate 51 is disposed on the polishing pad 21 in the rear position of the polishing head 22 in front of the slurry arm 23 with respect to the rotation direction of the polishing pad 21 (arrow A <b> 1). The temperature control plate 51 is arranged so that its short direction is parallel to the direction of the slurry flow indicated by the arrow A5 in FIG.

  In Modification 5, when the temperature adjustment, when the contact surface 51a of the temperature adjustment plate 51 comes into contact with the surface of the polishing pad 21 in a fixed state (the tip of the protrusion 51A contacts the surface of the polishing pad 21), the contact surface 51a and the polishing surface A gap is formed between the surface of the pad 21 by the adjacent protrusions 51A. The gap communicates from one part of the periphery of the contact surface 51a to another part, and a large number of communication paths are formed in the contact surface 51a. With this configuration, when the temperature adjustment plate 51 is in contact with the surface of the polishing pad 21 during the polishing operation and temperature adjustment is performed, a passage through which the slurry flows in and out of the gap is formed in the contact surface 51a. As a result, the flow rate of the slurry after polishing is equalized to improve the uniformity of polishing, and the desired temperature adjustment of the polishing pad 21 and the slurry is achieved.

  As described above, in the polishing apparatus according to the modified example 5, the temperature control of the polishing pad 21 (and slurry) can be reliably performed in a short time while suppressing the inhibition of the proper supply of slurry. Polishing is realized.

(Modification 6)
In Modification 6, the temperature adjustment plate 52 is a rectangular plate member, for example, a rectangular plate member, and is the same as the temperature adjustment plate 52 shown in FIG. 17 of Modification 6 of the first embodiment. In the polishing unit 10 of FIG. 27, the temperature adjustment plate 52 is polished at a position in front of the slurry arm 23 with respect to the rotation direction (arrow A1) of the polishing pad 21 on the polishing pad 21 instead of the temperature adjustment plate 51. It is arranged at the rear position of the head 22.

  In the modified example 6, when adjusting the temperature, the temperature adjusting plate 52 is fixed to the outside of the polishing pad 21 on the surface of the polishing pad 21, and the slit 52 </ b> A is a concave curve toward the center position of the polishing pad 21. It arrange | positions so that it may become. The flow of the slurry is the same as the arrow A5 in FIG. 17B of Modification 6 of the first embodiment. The slurry flowing into the slit 52A is guided by the flow toward the polishing head 22 with the flow regulated by the curved shape of the slit 52A. In the modified example 6, the flow of the slurry is positively regulated by the slits 52A so that the flow rate of the slurry after polishing is made equal, as well as preventing the slurry flow from being inhibited by the temperature adjusting plate 52. As a result, the flow rate of the slurry after polishing is equalized to improve the uniformity of polishing, and the desired temperature adjustment of the polishing pad 21 and the slurry is achieved.

  As described above, in the polishing apparatus according to the modified example 6, the temperature control of the polishing pad 21 (and slurry) can be reliably performed in a short time while suppressing the inhibition of the proper supply of slurry. Polishing is realized.

(Modification 7)
In the modification example 7, the temperature adjustment plate 53 is a rectangular plate member, for example, a rectangular plate member, and is the same as the temperature adjustment plate 53 shown in FIG. 19 of the modification example 7 of the first embodiment. In the polishing unit 10 of FIG. 27, the temperature adjustment plate 53 is polished at a position in front of the slurry arm 23 with respect to the rotation direction (arrow A1) of the polishing pad 21 on the polishing pad 21 instead of the temperature adjustment plate 51. It is arranged at the rear position of the head 22.

  In the modified example 7, when adjusting the temperature, the temperature adjusting plate 53 is fixed to the outside of the polishing pad 21 on the surface of the polishing pad 21, and the slit 53 </ b> A <b> 1 is a concave curve toward the center position of the polishing pad 21. It is arranged to be. The direction of the slurry flow indicated by the arrow A <b> 5 is parallel to the short direction of the temperature control plate 53. The slurry that has flowed into the slit 53A is regulated by the curved shape of the slit 53A and guided toward the polishing head 22 to flow out. In the modified example 7, the flow of the slurry is positively regulated by the slits 53 </ b> A so that the flow rate of the slurry after polishing is made equal, as well as preventing the slurry flow from being inhibited by the temperature adjustment plate 53. As a result, the flow rate of the slurry after polishing is equalized to improve the uniformity of polishing, and the desired temperature adjustment of the polishing pad 21 and the slurry is achieved.

  As described above, in the polishing apparatus according to the modified example 7, the temperature control of the polishing pad 21 (and slurry) can be reliably performed in a short time while suppressing the inhibition of the proper supply of slurry. Polishing is realized.

  In the above-described modified examples 6 to 7 of the second embodiment, as in the modified examples 6 to 7 of the first embodiment, the side surfaces of the front end and the rear end are chamfered with respect to the slits of the temperature control plate. The side surface of the tip may be chamfered with a semicircular cross section or a semicircular cross section.

  Also in the sixth modification of the second embodiment, the temperature adjustment plate 52 may be arranged in the same manner as the second modification of the second embodiment. In this case, the slit 52 </ b> A has a concave curve toward the center position of the polishing pad 21, and is positioned so that the outflow portion of the slurry in the slit 52 </ b> A bends toward the inside of the polishing pad 21 as compared with the sixth modification. The temperature adjustment plate 52 may be disposed in the same manner as in the third modification of the second embodiment. In this case, the slit 52 </ b> A has a downwardly convex curve when viewed from the center position of the polishing pad 21, and the slurry outflow portion in the slit 52 </ b> A is positioned to bend toward the outside of the polishing pad 21.

  Also, in the modification 7 of the second embodiment, the temperature adjustment plate 53 may be arranged similarly to the modification 2 of the second embodiment. In this case, the slit 53 </ b> A <b> 1 has a concave curve toward the center position of the polishing pad 21, and the slurry outflow portion in the slit 53 </ b> A <b> 1 is more bent toward the inner side of the polishing pad 21 than the seventh modification. The temperature adjustment plate 53 may be arranged similarly to the third modification of the second embodiment. In this case, the slit 53 </ b> A <b> 1 has a downwardly convex curve when viewed from the center position of the polishing pad 21, and the slurry outflow portion in the slit 53 </ b> A <b> 1 is positioned to bend toward the outside of the polishing pad 21.

  Hereinafter, various aspects of the polishing apparatus and the polishing method will be collectively described as additional notes.

(Supplementary Note 1) A polishing pad that is rotationally driven;
An object to be polished is installed, and a polishing head that polishes the object to be polished in contact with the polishing pad;
An abrasive supply section for supplying an abrasive to the polishing pad;
A temperature at which the contact surface with the polishing pad has an uneven shape constituting the passage of the polishing agent, and the temperature of the polishing pad is adjusted by contacting the polishing pad in a fixed state with respect to the outside of the polishing pad. A polishing apparatus comprising: an adjustment plate.

  (Supplementary note 2) The polishing apparatus according to supplementary note 1, wherein the temperature adjustment plate has a plurality of protrusions formed on the contact surface.

  (Supplementary note 3) The polishing apparatus according to supplementary note 2, wherein the temperature adjusting plate has a gap formed between the adjacent protrusions on the contact surface, and the gap serves as a passage for the abrasive.

  (Supplementary Note 4) The polishing apparatus according to Supplementary Note 2 or 3, wherein the protrusion has a radius of curvature at a tip portion that is a value that is half or more of a width of the protrusion on the contact surface.

  (Supplementary note 5) The polishing apparatus according to supplementary note 1, wherein the temperature adjusting plate has a plurality of slits that serve as passages for the abrasive on the contact surface.

  (Supplementary Note 6) The plurality of slits have a curvature that decreases with increasing distance from one end of the contact surface, a plurality of first curved slits that are concave toward the one end, a second slit that is linear, and the first slit 6. The polishing apparatus according to appendix 5, wherein the polishing apparatus includes a plurality of curved third slits having a curvature that increases with increasing distance from the two slits and is convex toward the one end.

  (Supplementary note 7) The polishing apparatus according to supplementary note 5, wherein the plurality of slits are formed in a straight line extending radially from one end of the contact surface.

  (Supplementary Note 8) The temperature adjusting plate is disposed on the polishing pad at a position after the polishing agent supply unit and at a position before the polishing head with respect to the rotation direction of the polishing pad. The polishing apparatus according to any one of appendices 1 to 7.

  (Additional remark 9) The said temperature control board is arrange | positioned in the back position rather than the said polishing head in the position before the said abrasive | polishing agent supply part with respect to the rotation direction of the said polishing pad on the said polishing pad, It is characterized by the above-mentioned. The polishing apparatus according to any one of appendices 1 to 7.

  (Supplementary Note 10) The polishing apparatus according to Supplementary Note 5, wherein the plurality of slits are formed in a curved shape having a curvature that decreases with increasing distance from one end of the contact surface and becomes concave toward the one end. .

  (Supplementary note 11) The polishing apparatus according to supplementary note 10, further comprising a linear slit separate from the plurality of slits.

  (Supplementary note 12) The temperature adjusting plate is disposed on the polishing pad at a position after the polishing agent supply unit and at a position before the polishing head with respect to the rotation direction of the polishing pad. The polishing apparatus according to appendix 10 or 11, wherein

  (Supplementary note 13) The polishing apparatus according to supplementary note 12, wherein the temperature adjusting plate is disposed at a position where the slit becomes concave toward a center position of the polishing pad.

  (Additional remark 14) The said temperature control board is arrange | positioned in the back position rather than the said polishing head before the said abrasive | polishing agent supply part with respect to the rotation direction of the said polishing pad on the said polishing pad, It is characterized by the above-mentioned. The polishing apparatus according to appendix 10 or 11, wherein

  (Additional remark 15) The said temperature control board is a grinding | polishing apparatus of Additional remark 14 characterized by arrange | positioning in the position where the said slit becomes concave toward the center position of the said polishing pad.

  (Additional remark 16) The said temperature control board is a grinding | polishing apparatus of Additional remark 14 characterized by arrange | positioning in the position where the said slit becomes convex toward the center position of the said polishing pad.

  (Supplementary note 17) The polishing apparatus according to any one of supplementary notes 1 to 16, wherein the temperature adjusting plate has a circular shape or a rectangular shape.

(Supplementary Note 18) When supplying a polishing agent to a rotationally driven polishing pad and polishing an object to be polished placed on a polishing head in contact with the polishing pad,
A surface of the polishing pad is brought into contact with a surface of the polishing pad in a fixed state with respect to the outside of the polishing pad, and a temperature control plate whose contact surface with the polishing pad has an uneven shape constituting a passage of the polishing agent. A polishing method characterized by adjusting a temperature.

  (Supplementary note 19) The polishing method according to supplementary note 18, wherein the temperature adjusting plate has a plurality of protrusions formed on the contact surface.

  (Additional remark 20) The said temperature control board has the space | gap between the said processus | protrusions adjacent on the said contact surface, The said space | gap becomes a channel | path of the said abrasive | polishing agent, The grinding | polishing method of Additional remark 19 characterized by the above-mentioned.

  (Supplementary note 21) The polishing method according to supplementary note 19 or 20, wherein the protrusion has a radius of curvature at a tip portion that is a value of half or more of a width of the protrusion on the contact surface.

(Supplementary note 22) The polishing method according to supplementary note 18, wherein the temperature adjusting plate has a plurality of slits serving as a passage for the abrasive on the contact surface.
(Supplementary Note 23) The plurality of slits have a curvature that decreases with increasing distance from one end of the contact surface, a plurality of first slits that are concave toward the one end, a second slit that is linear, and the first slit 23. The polishing method according to appendix 22, characterized by comprising a plurality of curved third slits having a curvature that increases as the distance from the two slits increases and protrudes toward the one end.

  (Supplementary note 24) The polishing method according to supplementary note 22, wherein the plurality of slits are formed in a straight line extending radially from one end of the contact surface.

  (Supplementary Note 25) The temperature adjusting plate is disposed on the polishing pad at a position after the polishing agent supply unit and at a position before the polishing head with respect to the rotation direction of the polishing pad. The polishing method according to any one of appendices 18 to 24.

  (Supplementary Note 26) The temperature adjusting plate is disposed on the polishing pad at a position before the polishing agent supply unit and at a position after the polishing head with respect to a rotation direction of the polishing pad. The polishing method according to any one of appendices 18 to 24.

  (Supplementary note 27) The polishing method according to supplementary note 22, wherein the plurality of slits are formed in a curved shape having a curvature that decreases as the distance from one end of the contact surface decreases toward the one end. .

  (Supplementary note 28) The polishing method according to supplementary note 27, further comprising a linear slit separate from the plurality of slits.

  (Supplementary note 29) The temperature adjusting plate is disposed on the polishing pad at a position after the polishing agent supply unit and at a position before the polishing head with respect to a rotation direction of the polishing pad. The polishing method according to appendix 27 or 28.

  (Additional remark 30) The said temperature control board is a grinding | polishing method of Additional remark 29 characterized by arrange | positioning in the position where the said slit becomes concave toward the center position of the said polishing pad.

  (Supplementary Note 31) The temperature adjusting plate is disposed on the polishing pad in a position before the polishing head and at a position after the polishing head with respect to a rotation direction of the polishing pad. The polishing method according to appendix 27 or 28.

  (Additional remark 32) The said temperature control board is a grinding | polishing method of Additional remark 31 characterized by arrange | positioning in the position where the said slit becomes concave toward the center position of the said polishing pad.

  (Additional remark 33) The said temperature control board is a grinding | polishing method of Additional remark 31 characterized by arrange | positioning in the position where the said slit becomes convex toward the center position of the said polishing pad.

  (Appendix 34) The polishing method according to any one of appendices 18 to 33, wherein the temperature adjusting plate is circular or rectangular.

DESCRIPTION OF SYMBOLS 1 Wafer storage part 2 1st wafer conveyance part 3 Wafer cleaning part 4 2nd wafer conveyance part 5 Polishing chamber 6 Semiconductor wafer 10 Polishing part 11 Polishing stand 12 Wafer carrying-in part 13 Platen 21 Polishing pad 22 Polishing head 23 Slurry arm 23a Nozzle 24 Conditioning mechanism 25 Temperature adjusting mechanism 24a Conditioning disk 24b, 32 Arm 24c Standby part 31, 41, 42, 43, 44, 51, 52, 53, 54, 55 Temperature adjusting plate 31a, 41a, 42a, 43a, 44a, 51a, 52a, 53a, 54a, 55a Contact surface (back surface)
31c Standby part 31A, 51A Protrusion 31d, 33c, 35c Temperature adjustment means 33 Temperature adjustment part 33a, 35a Liquid reservoir 33b, 35b Temperature sensor 34 Control part 35 Cooling liquid reservoir 36 Heating hot plates 41A, 42A, 43A, 44A, 52A, 53A, 54A, 55A Slit 41Aa, 41Ab, 41Ac Side 41b, 42b, 43b, 52b, 53b One end 42A1, 43A1, 44A1, 53A1, 54A1, 55A1 First slit 42A2, 43A2, 44A2, 53A2, 54A2, 55A2 Second slit 43A3, 54A3, 55A3 Third slit

Claims (10)

A rotationally driven polishing pad;
An object to be polished is installed, and a polishing head that polishes the object to be polished in contact with the polishing pad;
An abrasive supply section for supplying an abrasive to the polishing pad;
A temperature at which the contact surface with the polishing pad has an uneven shape constituting the passage of the polishing agent, and the temperature of the polishing pad is adjusted by contacting the polishing pad in a fixed state with respect to the outside of the polishing pad. A polishing apparatus comprising: an adjustment plate.   The polishing apparatus according to claim 1, wherein the temperature adjustment plate has a plurality of protrusions formed on the contact surface.   The polishing apparatus according to claim 2, wherein the protrusion has a radius of curvature at a tip portion that is a value that is half or more of a width of the protrusion on the contact surface.   The polishing apparatus according to claim 1, wherein the temperature adjusting plate has a plurality of slits that serve as passages for the abrasive on the contact surface.   5. The polishing apparatus according to claim 4, wherein the plurality of slits are formed in a curved shape having a curvature that decreases with increasing distance from one end of the contact surface and is concave toward the one end. When supplying a polishing agent to a polishing pad that is driven to rotate and polishing an object to be polished installed in a polishing head in contact with the polishing pad,
A surface of the polishing pad is brought into contact with a surface of the polishing pad in a fixed state with respect to the outside of the polishing pad, and a temperature control plate whose contact surface with the polishing pad has an uneven shape constituting a passage of the polishing agent. A polishing method characterized by adjusting a temperature.   The polishing method according to claim 6, wherein the temperature adjusting plate has a plurality of protrusions formed on the contact surface.   The polishing method according to claim 7, wherein the protrusion has a radius of curvature of a tip portion that is a value that is half or more of a width of the protrusion on the contact surface.   The polishing method according to claim 6, wherein the temperature adjusting plate has a plurality of slits that serve as passages for the abrasive on the contact surface.   10. The polishing method according to claim 9, wherein the plurality of slits are formed in a curved shape having a curvature that decreases as the distance from one end of the contact surface decreases toward the one end.