JP2018183898A - Optical device, exposure device, assembly, and image formation device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical device which can inhibit a reinforcement member from being removed from a housing in a structure in which the reinforcement member is inserted into a hollow part of a housing elongated in one direction to reinforce the housing, compared to a structure in which only an outer surface of the reinforcement member is fixed, and to provide an exposure device, an assembly, and an image formation device.SOLUTION: An optical device 40 has a housing 42, a reinforcement member 46 and a joint material 48. The housing 42 is elongated in a Z direction and opens to a Y direction, and a hollow part 56 which is elongated in the Z direction is formed between inner surfaces 57, 58 facing each other in an X direction. The reinforcement member 46 is fixed with at least a part thereof inserted into the hollow part 56 and reinforces the housing 42. The joint material 48 is disposed between at least the reinforcement member 46 and the inner surfaces 57, 58 to join the reinforcement member 46 and the housing 42 to each other.SELECTED DRAWING: Figure 6

Description

  The present invention relates to an optical apparatus, an exposure apparatus, an assembly, and an image forming apparatus.

  The exposure apparatus described in Patent Document 1 includes a holder that holds a circuit board and a rod lens array, and a transmission member that is mounted with the holder interposed therebetween and that transmits heat of a heating element of the circuit board.

JP, 2014-162065, A

  There is an optical device that includes a housing formed with a hollow portion and elongated in one direction, and a reinforcing member that is inserted into the hollow portion and reinforces the housing. In this optical device, the reinforcing member is attached to the casing by bonding the end face of the casing in the insertion direction of the reinforcing member and the outer surface of the reinforcing member that is orthogonal to the end face and is exposed to the outside of the casing with an adhesive. Fixed to.

  However, in this optical device, since only the outer surface of the reinforcing member is fixed, the reinforcing member may be detached from the housing.

  In the configuration in which the reinforcing member is inserted into the hollow portion of the casing that is long in one direction and the casing is reinforced, the reinforcing member is detached from the casing as compared with the configuration in which only the outer surface of the reinforcing member is fixed. It aims at suppressing.

  The optical device according to the first aspect is a casing that is long in one direction, and opens toward the direction intersecting with the one direction, and between the inner surface facing the direction orthogonal to the one direction and the intersecting direction. The casing in which a hollow portion that is long in one direction is formed, a reinforcing member that is fixed in a state where at least a part is inserted into the hollow portion, and reinforces the casing, and at least the reinforcing member and the And a bonding material that is interposed between the inner surface and bonds the reinforcing member and the housing.

  The reinforcing member of the optical device according to the second aspect has a pair of wall portions opposed to each other in the orthogonal direction, the bonding material is filled between the pair of wall portions, and the wall portion is orthogonal to the orthogonal member. It covers from both sides of the direction and the side opposite to the opening side in the hollow portion.

  The bonding material of the optical device according to the third aspect is arranged with an interval in the one direction.

  The bonding material of the optical device according to the fourth aspect is hardened at room temperature, and the hollow portion is a substrate whose thickness direction is the intersecting direction, and the end of the reinforcing member in the one direction The substrate having a contact portion that is located outside the portion and protrudes from the substrate surface and comes into contact with the bonding material is disposed.

  The bonding material of the optical device according to the fifth aspect is provided continuously from one end to the other end of the reinforcing member in the one direction.

  In the hollow portion of the optical device according to the sixth aspect, a substrate whose thickness direction is the intersecting direction is disposed, and the bonding material closes a gap between the housing and the substrate.

  The exposure apparatus which concerns on a 7th aspect has the optical apparatus as described in a 4th aspect or a 6th aspect, and the light irradiation means which irradiates light toward the irradiation object provided in the said board | substrate.

  An assembly according to an eighth aspect includes an exposure apparatus according to the seventh aspect, an image holding member that holds a latent image formed by light irradiation from the light irradiation unit, and a latent image of the image holding member. A developing device that develops using the developer; and a transfer device that transfers the developer image developed by the developing device to a recording medium.

  An image forming apparatus according to a ninth aspect includes the exposure apparatus according to the seventh aspect, an image holding member that holds a latent image formed by light irradiation from the light irradiation unit, and a latent image of the image holding member. A developing device that develops the toner image using a developer, a transfer device that transfers the developer image developed by the developing device to a recording medium, and a fixing device that fixes the developer image transferred to the recording medium. .

  An image forming apparatus according to a tenth aspect includes the assembly according to the eighth aspect and a fixing device that fixes the developer image transferred to the recording medium.

  According to the optical device of the first aspect, in the configuration in which the reinforcing member is inserted into the hollow portion of the casing that is long in one direction to reinforce the casing, the reinforcing member is compared with the configuration in which only the outer surface of the reinforcing member is fixed. Can be prevented from coming off the casing.

  According to the optical device of the second aspect, it is possible to suppress the bonding material from being peeled off from the reinforcing member as compared with the configuration in which the bonding material is used only between the wall portion of the reinforcing member and the inner surface of the housing. it can.

  According to the optical device of the third aspect, the amount of the bonding material to be used can be reduced as compared with the configuration in which the bonding material is disposed in the entire one direction of the reinforcing member.

  According to the optical device of the fourth aspect, the area of the joint portion between the end of the reinforcing member and the inner surface of the housing can be increased as compared with the configuration having no contact portion.

  According to the optical device of the fifth aspect, it is possible to prevent the reinforcing member from being detached from the casing, as compared with the configuration in which the bonding material is provided only in a part of the reinforcing member in one direction.

  According to the optical device of the sixth aspect, the bonding material can also be used as a sealant that seals the gap between the housing and the substrate.

  According to the exposure apparatus of the seventh aspect, it is possible to suppress the light irradiation position from deviating from the designed light irradiation position as compared with the configuration that does not include the optical apparatus according to the fourth aspect or the sixth aspect. it can.

  According to the assembly of the eighth aspect, it is possible to suppress the positional deviation of the developer on the recording medium with respect to the designed development position as compared with the configuration that does not include the exposure apparatus of the seventh aspect.

  According to the image forming apparatus of the ninth aspect, it is possible to suppress image defects compared to a configuration that does not include the exposure apparatus of the seventh aspect.

  According to the image forming apparatus of the tenth aspect, image defects can be suppressed as compared with the configuration that does not include the assembly according to the eighth aspect.

1 is an overall configuration diagram illustrating an image forming apparatus according to a first embodiment. FIG. 3 is a bottom view showing the print head according to the first embodiment. 1 is a longitudinal sectional view showing a print head according to a first embodiment. FIG. 3 is an exploded perspective view of the print head according to the first embodiment. It is explanatory drawing which shows the state which attaches a reinforcement member to the housing | casing which concerns on 1st Embodiment. (A) It is a longitudinal cross-sectional view (6A-6A line cross section of FIG. 2) of the print head which concerns on 1st Embodiment, (B) A longitudinal cross-sectional view (6B-6B of FIG. 2) of the print head which concerns on 1st Embodiment. Line cross section). (A) It is explanatory drawing which shows the state which apply | coated the bonding material to the edge part of the reinforcement member of the print head which concerns on 1st Embodiment, (B) The end of the reinforcement member of the print head which concerns on the modification of 1st Embodiment It is explanatory drawing which shows the state which apply | coated the bonding material to the part. (A) It is a longitudinal cross-sectional view of a part of the print head according to the second embodiment, and (B) is a longitudinal cross-sectional view of another part of the print head according to the second embodiment. FIG. 10 is an overall configuration diagram illustrating an image forming apparatus according to a modification.

[First embodiment]
An example of the optical apparatus, the exposure apparatus, the assembly, and the image forming apparatus according to the first embodiment will be described.

  FIG. 1 shows an image forming apparatus 10 according to the first embodiment. In the following description, the direction indicated by the arrow Y in FIG. 1 is the apparatus height direction, and the direction indicated by the arrow X is the apparatus width direction. In addition, a direction (indicated by Z) orthogonal to each of the apparatus height direction and the apparatus width direction is defined as an apparatus depth direction. Then, when the image forming apparatus 10 is viewed from the front, the apparatus height direction, the apparatus width direction, and the apparatus depth direction are described as a Y direction, an X direction, and a Z direction. Further, when it is necessary to distinguish one side and the other side in the X direction, the Y direction, and the Z direction, when the image forming apparatus 10 is viewed from the front, the upper side is the Y side, the lower side is the -Y side, and the right side is X side, left side is described as -X side, back side is described as Z side, and front side is described as -Z side.

  The image forming apparatus 10 includes a transport unit 12 including a roll pair 13 that transports the paper P, an image forming unit 20 that forms a toner image TA on the paper P transported by the transport unit 12 using the developer G, And a control unit 14 that controls the operation of each unit of the image forming apparatus 10. The paper P is an example of a recording medium. The toner image TA is an example of a developer image.

  As an example, the image forming unit 20 includes four photoreceptors 22, a charging roll 24, a print head 30, a developing device 28, one transfer device 34, and one fixing device 36. Details of the print head 30 will be described later.

  The photoreceptor 22 is an example of an image holding member, is formed in a cylindrical shape, and is rotated with the Z direction as an axial direction. The photosensitive member 22 has a structure in which a charge generation layer and a charge transport layer (not shown) are formed on the outer peripheral surface 22A of a cylindrical conductive substrate. Then, the outer peripheral surface 22A of the photoconductor 22 is charged by a discharge caused by a potential difference with the charging roll 24, and a latent image (not shown) formed by irradiation of light Bm from the print head 30 in this charged state is transferred to the outer peripheral surface. Hold on.

  The developing device 28 includes a main body 28A in which the developer G is stored, and a developing roll 28B provided on the main body 28A so as to be rotatable about the Z direction as an axial direction. The developing roll 28B includes a magnet roll provided with a plurality of magnetic poles (not shown), and a developing sleeve (not shown) rotatably provided outside the magnet roll. The developing roll 28B develops (makes visible) the latent image on the photosensitive member 22 using the developer G. As an example, the developer G includes toner and a carrier (not shown).

  The transfer device 34 includes an intermediate transfer belt 34A, a primary transfer roll 34B, a secondary transfer roll 34C, and a counter roll 34D. The transfer device 34 primarily transfers the toner image TA developed by the developing device 28 to the intermediate transfer belt 34A due to a potential difference between the photosensitive member 22 and the primary transfer roll 34B. Further, the transfer device 34 secondarily transfers the toner image TA on the intermediate transfer belt 34A onto the paper P due to a potential difference between the secondary transfer roll 34C and the opposing roll 34D.

  The fixing device 36 heats and pressurizes the toner image TA transferred onto the paper P and fixes it on the paper P. For example, the sheet P on which the toner image TA is fixed in the fixing device 36 is discharged to the discharge unit 18 provided in the image forming apparatus 10.

[Main part configuration]
Next, the print head 30 will be described.

  The print head 30 shown in FIG. 3 is an example of an exposure apparatus. The print head 30 includes an optical device 40 and a light emitting element 32 as an example of a light irradiation unit. In the present embodiment, as an example, the image is such that the longitudinal direction of the print head 30 is along the Z direction and the optical axis direction of the light Bm (see FIG. 1) emitted from the print head 30 is along the Y direction. A print head 30 is mounted in the forming apparatus 10 (see FIG. 1).

<Light emitting element>
The light emitting element 32 is provided (mounted) on a Y-side surface of a substrate 44 described later. In addition, as an example, the light emitting element 32 has a configuration in which a plurality of light emitting diodes (LEDs) are arranged in a staggered manner in the X direction with respect to the Z direction. Further, the light emitting element 32 is controlled in light emission operation and light emission stop operation by an electronic component 45 (see FIG. 5) of the substrate 44 described later. And the light emitting element 32 is comprised so that light Bm (refer FIG. 1) may be irradiated toward the outer peripheral surface 22A (refer FIG. 1) as an example of irradiation object.

<Optical device>
The optical device 40 includes a housing 42, a lens array 43 as an example of an optical member, a substrate 44, a reinforcing member 46, and a bonding material 48.

(Casing)
The housing 42 shown in FIG. 4 is formed of a resin material (liquid crystal polymer as an example). The outer shape of the housing 42 has a rectangular parallelepiped shape that is long in the Z direction as an example of one direction. The housing 42 is formed with a through hole 52 extending in the Z direction and penetrating in the Y direction as an intersecting direction with the Z direction. In other words, the through hole 52 opens in the Y direction. The X direction is an example of an orthogonal direction orthogonal to the Y direction and the Z direction.

  As shown in FIG. 6A, the through hole 52 includes a first hole portion 54 into which a lens array 43 to be described later is inserted, a second hole portion 55 connected to the inside of the first hole portion 54, and a second hole portion. It has the hollow part 56 formed in the opposite side to the 1st hole part 54 side with respect to the hole part 55, and the 2nd hole part 55 and the inside were connected. The distance between the second holes 55 in the X direction is wider than the distance between the first holes 54 in the X direction. The interval in the X direction of the hollow portion 56 is wider than the interval in the X direction of the second hole portion 55.

  The hollow portion 56 is a part of the through hole 52 of the housing 42 and is formed between the inner surface 57 and the inner surface 58 that face each other in the X direction. The hollow portion 56 is longer in the Z direction than in the X direction. A substrate 44 having a thickness direction in the Y direction is disposed in the hollow portion 56. At the boundary of the hollow portion 56 with the second hole portion 55, a step portion 59 is formed in which the Y side surface of the substrate 44 contacts from the -Y side. A plurality of positioning portions 51 (see FIG. 2) for positioning the substrate 44 are formed in the stepped portion 59. The positioning part 51 is composed of a columnar part that stands upright along the Y direction.

  The inner surface 57 and the inner surface 58 are opposed to each other in the X direction. Specifically, when viewed from the Z direction, the inner surface 57 has a longitudinal surface 57A along the Y direction, and the −Y side end on the −Y side with respect to the longitudinal surface 57A is closer to the X side than the Y side end. And a tapered surface 57B inclined so as to be positioned. When viewed from the Z direction, the inner surface 58 has a vertical surface 58A along the Y direction and a −Y side with respect to the vertical surface 58A, and the −Y side end is positioned on the −X side with respect to the Y side end. And an inclined tapered surface 58B.

  The length L1 of the distance between the vertical surface 57A and the vertical surface 58A in the X direction is slightly longer than the length L2 of the substrate 44 in the X direction. The length L3 of the interval in the X direction between the −Y side end of the tapered surface 57B and the −Y side end of the tapered surface 58B is longer than the length L1.

  As shown in FIG. 2, when the housing 42 is viewed from the −Y side, the substrate 44 is inserted into the hollow portion 56 from the −Y side. The length of the hollow portion 56 in the Z direction and the length of the substrate 44 in the Z direction are substantially the same length L4.

(Lens array)
As shown in FIG. 4, the lens array 43 is formed in a rectangular parallelepiped shape with the X direction as the short direction, the Z direction as the long direction, and the Y direction as the height direction. The lens array 43 is inserted into the first hole 54 of the housing 42 from the Y side, and is fixed to the housing 42 using a UV adhesive (ultraviolet curable adhesive) (not shown). Further, the lens array 43 is composed of a plurality of rod lenses through which light Bm (see FIG. 1) emitted from each light emitting element 32 passes. The light Bm that has passed through the lens array 43 is imaged on the outer peripheral surface 22A (see FIG. 1) of the photoreceptor 22.

(substrate)
As shown in FIG. 2, the substrate 44 is formed of a rectangular plate material in which the X direction is the short direction, the Z direction is the long direction, and the Y direction is the thickness direction. A plurality of mounting holes 44A penetrating in the Y direction are formed at both ends of the substrate 44 in the Z direction. The substrate 44 is positioned with respect to the housing 42 by inserting the positioning portion 51 formed in the housing 42 into the mounting hole 44 </ b> A.

  The light emitting element 32 is mounted on the Y side surface of the substrate 44. An electronic component 45 that controls the operation of the light emitting element 32 is mounted on the surface on the −Y side of the substrate 44. Further, a connector 49 (see FIG. 3) is mounted on the surface of the substrate 44 on the −Y side and part of the Z side from the center in the Z direction. The connector 49 is connected to the control unit 14 (see FIG. 1) of the image forming apparatus 10 via a wiring (not shown).

  The substrate 44 is placed on the stepped portion 59 of the housing 42 and fixed to the housing 42 using a UV adhesive (ultraviolet curable adhesive) 62. The UV adhesive 62 that fixes the substrate 44 to the housing 42 is applied to both ends of the substrate 44 in the X direction with a gap in the Z direction. A gap between the peripheral edge of the substrate 44 and the casing 42 (the inner surface 57 and the inner surface 58) is sealed with a sealant 64. In the present embodiment, as an example, the sealing agent 64 is made of a silicon resin-based material.

  As shown in FIG. 6B, when the lens array 43 and the substrate 44 are attached to the housing 42, the lens array 43 and the light emitting element 32 of the substrate 44 face each other in the Y direction.

(Reinforcing member)
As shown in FIG. 5, the reinforcing member 46 is formed by bending a sheet metal as an example, and extends in the Z direction. The cross-sectional shape when the reinforcing member 46 is viewed from the Z direction is an inverted U shape in which the Y side in the Y direction is opened. Specifically, the reinforcing member 46 includes a pair of wall portions 66 that face each other in the X direction and a connection wall 68 that connects the −Y side end portions of the pair of wall portions 66.

  The height of the wall portion 66 in the Y direction is such that the −Y side portion of the wall portion 66 protrudes more toward the −Y side than the −Y side end surface of the housing 42 in a state where the reinforcing member 46 is fixed to the housing 42. It is said to be high. In other words, the height of the wall portion 66 in the Y direction is a height at which at least the Y-side end portion of the wall portion 66 is inserted into the hollow portion 56 in a state where the reinforcing member 46 is fixed to the housing 42. In the present embodiment, as an example, about 1/3 of the wall portion 66 in the Y direction is inserted into the hollow portion 56. A plurality of semicircular cutouts 67 are formed at the Y side end portions of the respective wall portions 66 at intervals in the Z direction. The position of the notch 67 in the Z direction is set in accordance with the position where the substrate 44 is fixed to the housing 42 by the UV adhesive 62. The notch 67 serves as an escape portion for avoiding a portion where the sealing agent 64 is raised when the sealing agent 64 is applied on the UV adhesive 62 on the substrate 44 side.

  As shown in FIG. 6A, the length L5 in the X direction from the side surface on the X side to the side surface on the −X side in the pair of wall portions 66 is the end portion on the −Y side of the tapered surface 57B and the tapered surface 58B. Is shorter than the length L3 of the distance in the X direction from the −Y side end. Thereby, a part of a pair of wall part 66 can be inserted in the hollow part 56. A gap is formed between the wall 66 and the tapered surfaces 57B and 58B. This gap is filled with a bonding material 48 described later.

  The reinforcing member 46 shown in FIG. 6B is in a state in which the −Y side end portion (the portion having the height of about 1/3 as described above) of the wall portion 66 is inserted between the inner surface 57 and the inner surface 58. The UV adhesive 62 is used and fixed to the end surface on the −Y side of the housing 42 with an interval in the Z direction (see FIG. 2). The reinforcing member 46 prevents the casing 42 from bending in the Y direction (reinforcing the casing 42). The UV adhesive 62 is an adhesive that is cured by irradiating UV (ultraviolet rays) with a UV irradiator (not shown). The UV adhesive 62 is also applied to both outer side surfaces of the wall portion 66 in the X direction. Thus, both outer side surfaces in the X direction of the wall portion 66 are fixed to the end surface on the −Y side of the housing 42.

  The length L6 in the Z direction of the reinforcing member 46 shown in FIG. 2 is shorter than the length L4 in the Z direction of the hollow portion 56. Further, the center of the reinforcing member 46 in the Z direction is located on the −Z side with respect to the center of the hollow portion 56 in the Z direction. That is, the reinforcing member 46 is disposed (offset) at a position close to the −Z side with respect to the center of the housing 42 in the Z direction. A plate 69 serving as a weight is fixed to the surface on the −Y side of the connecting wall 68.

  On the substrate 44 shown in FIG. 3, two support members (not shown) that are arranged at intervals in the Z direction and extend in the Y direction are provided. This support member supports the connecting wall 68 of the reinforcing member 46 from the substrate 44 side (Y side). By this support member supporting the connecting wall 68, a space for filling a bonding material 48 described later is formed between the substrate 44, the pair of wall portions 66 and the connecting wall 68.

(Sealing agent)
The sealing agent 64 shown in FIG. 5 seals the gap between the casing 42 and the peripheral edge of the substrate 44. As an example, the sealing agent 64 includes a silicon resin material. The sealing agent 64 is applied from the −Y side to the substrate 44 so as to cover the gap between the housing 42 and the peripheral edge of the substrate 44 after the substrate 44 is fixed to the housing 42 with the UV adhesive 62. Applied.

(Joining material)
As an example, the bonding material 48 illustrated in FIG. 6B is formed of an insulating resin material and is cured at room temperature (25 ° C.). In this specification, the term “insulating” means that the volume resistivity at 20 ° C. is 1 × 10 ¹⁴ Ω · cm or more. For example, the tensile modulus after curing of the bonding material 48 is about 70 MPa, which is lower than the tensile modulus after curing of the UV adhesive 62. Further, as an example, the bonding material 48 joins both end portions in the Z direction of the reinforcing member 46 to the inner surface 57 and the inner surface 58. That is, in the optical device 40 of the first embodiment, the bonding material 48 is arranged with a gap in the Z direction (one direction).

  Further, the bonding material 48 is also filled between the pair of wall portions 66, and covers the wall portions 66 from both sides in the X direction and from the side opposite to the opening side (−Y side) in the hollow portion 56. In other words, in the wall portion 66, there are three surfaces: an inner surface 57A that faces the inner surface 57 or the inner surface 58 in the X direction, an end surface 66B that faces the substrate 44 in the Y direction, and an inner surface 66C that faces each other in the X direction. , In contact with the bonding material 48. The filling of the bonding material 48 between the pair of wall portions 66 is not limited to the entire space between the pair of wall portions 66 filled with the bonding material 48, and the Y side end portions of the pair of wall portions 66 This includes the presence of a space that is connected by the bonding material 48 and does not have the bonding material 48 in a part between the pair of wall portions 66.

(Contact part)
As shown in FIGS. 3 and 5, the reinforcing member 46 on the substrate 44 is in contact with the bonding material 48 at the end portion on the −Z side and the end portion on the Z side in the Z direction. A resistor 74 as an example of the contact portion is provided (mounted). The resistors 74 are disposed symmetrically with respect to the center of the reinforcing member 46 in the Z direction. Therefore, the Z-side resistor 74 will be described, and the description of the -Z-side resistor 74 will be omitted.

  As shown in FIG. 5, as an example, the resistor 74 is formed in a rectangular parallelepiped shape that is long in the X direction, and protrudes from the −Y side surface 44 </ b> B of the substrate 44 to the −Y side. As shown in FIG. 7A, when the resistor 74 is viewed from the X direction, the height h1 in the Y direction from the −Y side surface 44B of the substrate 44 to the −Y side surface 74A of the resistor 74 is shown. Is lower than the height h2 in the Y direction from the surface 44B to the surface 68A on the Y side of the connecting wall 68. Further, when the resistor 74 is viewed from the X direction, there is a gap of the length L7 in the Z direction between the −Z side side surface 74B of the resistor 74 and the Z side end surface 46A of the reinforcing member 46. ing. Thus, a space 76 is formed between the reinforcing member 46 and the resistor 74, into which the bonding material 48 before curing can flow. The length L7 is two to three times the diameter of the nozzle of a dispenser (not shown) that flows (injects) the bonding material 48 into the space 76, or the height of the space formed by the substrate 44 and the reinforcing member 46. It is preferable to set it to about 1/2 of the thickness. The diameter of the nozzle is 1.5 mm as an example. The height of the space formed by the substrate 44 and the reinforcing member 46 (height from the substrate 44 to the connecting wall 68) is, for example, 5 mm or more and 6 mm or less. That is, in this case, it is preferable that the length L7 is 3 mm or more and 4 mm or less.

<Manufacturing method>
Next, a method for manufacturing the print head 30 will be described.

  As shown in FIG. 6B, in a state where the first hole portion 54 is opened to the Y side, a part of the lens array 43 is inserted into the first hole portion 54 from the Y side, and a UV adhesive (not shown) is applied. At the same time, the lens array 43 is fixed to the casing 42 by being cured by UV irradiation. A gap between the housing 42 and the lens array 43 is filled with a sealing agent (not shown).

  Next, in the arrangement state in which the hollow portion 56 is opened to the Y side, the substrate 44 is placed on the stepped portion 59, the UV adhesive 62 is applied, and the substrate 44 is cured by UV irradiation, whereby the substrate 44 is placed. Fixed to. Thereafter, a sealant 64 is applied between the substrate 44 and the wall surface of the hollow portion 56 including the inner surface 57 and the inner surface 58. The sealant 64 is cured at room temperature. Thereby, the 2nd hole 55 is sealed.

  Next, the pair of wall portions 66 are inserted between the tapered surface 57B and the tapered surface 58B with the pair of wall portions 66 of the reinforcing member 46 facing the substrate 44 side. At this time, the position of the reinforcing member 46 in the Y direction is determined by the contact between the support member (not shown) and the connecting wall 68. In a state where the position of the reinforcing member 46 in the Y direction is determined, the UV adhesive 62 is applied so as to connect the both outer side surfaces of the wall portion 66 in the X direction and the end surface on the −Y side of the housing 42. The UV adhesive 62 is cured. Thereby, the reinforcing member 46 is fixed to the housing 42.

  Next, as shown in FIG. 7A, at the end of the reinforcing member 46 in the Z direction, the bonding material 48 is placed in the space 76 between the reinforcing member 46 and the resistor 74 on both sides by a dispenser (not shown). Poured. The bonding member 48 is cured by natural drying, so that the reinforcing member 46 and the casing 42 are bonded to each other by the bonding material 48. The print head 30 is manufactured including the above steps.

  As shown in FIG. 6A, a sealant 64 is stacked on the substrate 44 at a portion where the UV adhesive 62 (see FIG. 3) is not provided at both ends of the substrate 44 in the X direction. A bonding material 48 is stacked on the agent 64.

  As shown in FIG. 6B, the UV adhesive 62 is overlapped on the substrate 44 and sealed on the UV adhesive 62 at the portions where the UV adhesive 62 is provided at both ends in the X direction of the substrate 44. A stopper 64 is stacked, and a bonding material 48 is stacked on the sealant 64.

[Action]
Next, the operation of the first embodiment will be described.

  As shown in FIG. 6B, in the optical device 40, the reinforcing member 46 is fixed to the housing 42 by interposing the UV adhesive 62. Further, in the optical device 40, the reinforcing member 46 and the housing 42 are bonded together by interposing the bonding material 48. Specifically, the housing 42 and the reinforcing member 46 are only between the end surface on the −Y side of the housing 42 and the outer surface that is a surface of the portion exposed to the housing 42 of the reinforcing member 46. In addition, the reinforcing member 46 is joined to the inner surface 57 and the inner surface 58 at both ends in the Z direction of the reinforcing member 46. Thereby, compared with the configuration in which only the outer surface of the reinforcing member 46 is fixed, the proof stress against the shearing force acting between the reinforcing member 46 and the housing 42 is increased, so that the reinforcing member 46 may be detached from the housing 42. It is suppressed.

  Further, in the optical device 40, the bonding material 48 covers the wall portion 66 from both sides in the X direction and from the side opposite to the opening side (−Y side) in the hollow portion 56. In other words, the three surfaces of the inner surface 57 or the inner surface 58 and the outer surface 66A facing the X direction, the substrate 44 and the end surface 66B facing the Y direction, and the inner surface 66C facing each other in the X direction, In contact. Accordingly, the contact area between the reinforcing member 46 and the bonding material 48 is increased as compared with the configuration in which the bonding material 48 is used only between the wall portion 66 and the inner surface 57 and the inner surface 58. The bonding material 48 is prevented from being peeled off.

  As shown in FIG. 3, in the optical device 40, the bonding material 48 is provided at both ends of the reinforcing member 46 in the Z direction. Here, when an external force is applied to the Z direction center portion of the casing 42, the load acting on both ends of the reinforcing member 46 in the Z direction is larger than the Z direction center portion of the reinforcing member 46. It is a part. In other words, in the optical device 40, the bonding material 48 is disposed at a portion where the shearing force acting between the reinforcing member 46 and the housing 42 is increased, and the bonding material 48 reinforces this portion. Peeling 46 from the bonding material 48 is suppressed. In addition, since the bonding material 48 is disposed only at both ends in the Z direction, the amount of the bonding material 48 to be used is small compared to the configuration in which the bonding material 48 is disposed in the entire Z direction of the reinforcing member 46.

  As shown in FIG. 7A, in the optical device 40, a resistor 74 is provided on the substrate 44. In the step of applying (injecting) the bonding material 48, the uncured bonding material 48 is formed in the space 76 between the Z-direction end of the reinforcing member 46 and the end of the resistor 74 on the reinforcing member 46 side. Poured along the Y direction. Here, a force toward the inside of the reinforcing member 46 in the Z direction acts on a part of the bonding material 48 that flows along the Y direction due to contact with the end of the resistor 74 on the reinforcing member 46 side. In other words, the bonding material 48 that is poured onto the substrate 44 is blocked by the resistor 74 from flowing toward the side opposite to the reinforcing member 46 side. Due to these actions, the bonding material 48 flows toward the inside of the reinforcing member 46 in the Z direction. Therefore, the bonding material 48 is directed toward the center side of the reinforcing member 46 in the Z direction as compared with the configuration without the resistor 74. And flow easily. Further, in the optical device 40, the bonding material 48 easily flows toward the center side in the Z direction of the reinforcing member 46, so that the end portion in the Z direction of the reinforcing member 46 is compared with the configuration without the resistor 74. The area of the joint portion between the inner surface 57 and the inner surface 58 of the housing 42 increases.

  In the print head 30, the reinforcement member 46 is prevented from being detached from the housing 42 by an external force, so that bending of the substrate 44 fixed to the housing 42 is suppressed. Thereby, since the position of the light emitting element 32 mounted on the substrate 44 is suppressed from being shifted from the designed position, the light irradiation position is designed light irradiation as compared with the configuration without the optical device 40. Deviation from the position is suppressed.

  In the image forming apparatus 10 shown in FIG. 1, the light irradiation position of the light Bm by the print head 30 is suppressed from deviating from the designed light irradiation position, so that the image is compared with a configuration without the print head 30. Defects are suppressed. An image defect means that the toner image TA is formed at a position shifted from a predetermined position on the paper P, or a part of the toner image TA is shifted when a plurality of toners are overlapped. Includes a color different from a preset color.

[Second Embodiment]
Next, an example of the optical apparatus, the exposure apparatus, the assembly, and the image forming apparatus according to the second embodiment will be described. Note that the same reference numerals as those in the first embodiment are given to the same members and parts as those in the first embodiment described above, and the description thereof is omitted.

  FIG. 8A shows a print head 80 as an example of an exposure apparatus according to the second embodiment. The print head 80 is provided in place of the print head 30 (see FIG. 1) in the image forming apparatus 10 (see FIG. 1). The print head 80 includes an optical device 90 and a light emitting element 32.

<Optical device>
The optical device 90 includes a housing 42, a lens array 43, a substrate 44, a reinforcing member 46, and a bonding material 48. In the optical device 90, the bonding material 48 is provided continuously (connected) from one end (Z side end) to the other end (−Z side end) of the reinforcing member 46 in the Z direction. The bonding material 48 closes the gap between the housing 42 and the substrate 44. In the optical device 90, the bonding material 48 is injected (flowed) into the gap between the tapered surface 57B in the X direction and the tapered surface 58B and the wall portion 66, thereby reinforcing the casing 42 and the reinforcement in the entire Z direction. A bonding material 48 is interposed between the member 46 and the member 46.

  A bonding material 48 is superimposed on the substrate 44 at a portion where the UV adhesive 62 (see FIG. 8B) is not provided at both ends in the X direction of the substrate 44.

  As shown in FIG. 8B, the UV adhesive 62 is superposed on the substrate 44 at the portions where the UV adhesive 62 is provided at both ends in the X direction of the substrate 44 and bonded onto the UV adhesive 62. The material 48 is piled up.

[Action]
Next, the operation of the second embodiment will be described.

  As shown in FIGS. 8A and 8B, in the optical device 90 and the print head 80, the reinforcing member 46 is fixed to the housing 42 by the UV adhesive 62. Further, a bonding material 48 is interposed between the reinforcing member 46 and the inner surface 57 and the inner surface 58, and the reinforcing member 46 is bonded to the inner surface 57 and the inner surface 58 by the bonding material 48. As a result, as compared with the configuration in which only the outer surface of the reinforcing member 46 is fixed, the resistance to the shearing force acting between the reinforcing member 46 and the housing 42 is increased, so that the reinforcing member 46 may be detached from the housing 42. It is suppressed.

  Further, in the optical device 90 and the print head 80, the reinforcing member 46 and the inner surface 57 and the inner surface 58 are bonded by the bonding material 48 in the entire Z direction of the reinforcing member 46. Thereby, compared with the structure which provides the joining material 48 only in a part of Z direction of the reinforcement member 46, it is suppressed that the reinforcement member 46 remove | deviates from the housing | casing 42. FIG.

  Further, in the optical device 90 and the print head 80, the gap between the housing 42 and the substrate 44 is closed by the bonding material 48. That is, since the bonding material 48 is also used as a sealant that seals the gap between the housing 42 and the substrate 44, no other material is used to seal the gap between the housing 42 and the substrate 44. I'll do it. Further, the step of sealing the gap between the housing 42 and the substrate 44 with another material is omitted.

  In addition, this invention is not limited to said embodiment.

<Modification>
FIG. 9 shows an image forming apparatus 100 as a modified example. The image forming apparatus 100 is configured such that, in the image forming apparatus 10 (see FIG. 1), a portion for forming the toner image TA is detachable from the main body as a process cartridge 110 as an example of an assembly. .

  As an example, the process cartridge 110 includes a cartridge main body 112, a charging roll 24, a print head 30, a photoreceptor 22, a developing device 28, and a transfer device 34. The cartridge main body 112 can be attached to and detached from the main body of the image forming apparatus 100 in the Z direction. In addition, the print head 30, the photosensitive member 22, the developing device 28, and the transfer device 34 are accommodated in the cartridge main body 112.

  In the process cartridge 110, since the light irradiation position of the light Bm by the print head 30 is suppressed from deviating from the designed light irradiation position, the developer on the paper P is compared with the configuration without the print head 30. The positional deviation with respect to the development position on the design of G is suppressed.

  In the image forming apparatus 100, in the process cartridge 110, the positional deviation of the developer G on the paper P from the designed development position is suppressed, so that an image defect (for example, compared to a configuration without the process cartridge 110) (for example, , Color shift) is suppressed. In the image forming apparatus 100, a print head 80 and an optical device 90 (see FIG. 8A) may be provided instead of the print head 30 and the optical device 40.

<Other variations>
In the optical device 40, the bonding material 48 may not be filled between the pair of wall portions 66. Further, in the optical device 40, a through hole penetrating in the Y direction is formed in a part of the connecting wall 68 of the reinforcing member 46, and the bonding material 48 is passed through this through hole at a place other than both ends of the reinforcing member 46 in the Z direction. May be filled. In this case, the interval at which the bonding material 48 is arranged may be either an equal interval or a different interval in the Z direction. Further, in the optical device 40, only the Z-side end or the −Z-side end in the Z direction of the reinforcing member 46 may be filled with the bonding material 48.

  As shown in FIG. 7B, in the optical device 40, the resistor 74 (see FIG. 7A) is not provided (the contact portion is not provided) and bonded to the end portion in the Z direction of the reinforcing member 46. The material 48 may be filled.

  The contact portion is not limited to the resistor 74, and may be configured by other electronic components such as a capacitor, a transistor, and a coil, and other members (for example, connectors) other than the electronic components. Further, the contact portion may be made of a hardened resin material or a metal such as solder. When the contact portion is composed of an electronic component that generates heat, the heat of the electronic component is transmitted to the reinforcing member 46 via the bonding material 48 and is radiated in the reinforcing member 46. It functions as a heat dissipation member.

  In the optical device 90, the bonding material 48 may be filled after the sealing agent 64 is provided. In the optical device 40 and the optical device 90, the tapered surface 57B and the tapered surface 58B may be configured as vertical surfaces. In the optical device 40 and the optical device 90, the tapered surface 57B and the tapered surface 58B may be vertical surfaces, and the pair of wall portions 66 may be inclined with respect to the Y direction.

  The optical device is not limited to the one used as the exposure device, but may be used as a light receiving device (scanner) in combination with a light receiving element instead of the light emitting element 32.

  The reinforcing member 46 is not limited to being inserted in the hollow portion 56 in a part in the Y direction, and may be inserted in the entire Y direction.

  Further, the contact portion is not limited to an electronic component, and may be a member formed of a lump of metal or resin. Furthermore, the contact portion may be formed by applying the bonding material 48, other adhesive, sealant, or the like to the substrate 44 and curing it in advance. In addition, the shape of the contact portion is not limited to a rectangular parallelepiped shape such as the resistor 74, but may be a hemispherical shape or a polygonal shape other than a square when viewed from the X direction.

10 Image Forming Apparatus 22 Photoconductor (Example of Image Holding Member)
22A outer peripheral surface (an example of irradiation target)
28 Developing Device 30 Print Head (Example of Exposure Device)
32 Light emitting element (an example of light irradiation means)
34 Transfer device 36 Fixing device 40 Optical device 42 Housing 44 Substrate 46 Reinforcement member 48 Bonding material 56 Hollow portion 57 Inner surface 58 Inner surface 66 Wall portion 74 Resistor (an example of a contact portion)
80 print head (an example of an exposure device)
90 Optical device 100 Image forming device 110 Process cartridge (an example of an assembly)
TA toner image (example of developer image)

Claims (10)

A casing that is long in one direction, and has a hollow portion that is long in one direction between an inner surface that opens in a direction intersecting with the one direction and faces the one direction and a direction orthogonal to the intersecting direction. The housing being formed;
A reinforcing member that is fixed in a state in which at least a part is inserted into the hollow portion and reinforces the housing;
A bonding material interposed between at least the reinforcing member and the inner surface and bonding the reinforcing member and the housing;
An optical device. The reinforcing member has a pair of wall portions facing in the orthogonal direction,
2. The optical device according to claim 1, wherein the bonding material is filled between the pair of wall portions and covers the wall portions from both sides in the orthogonal direction and from the side opposite to the opening side in the hollow portion. .   The optical device according to claim 1, wherein the bonding material is disposed with a gap in the one direction. The bonding material is cured at room temperature,
The hollow portion includes a substrate having a thickness direction in the intersecting direction, the contact portion being located outside the end of the reinforcing member in the one direction and protruding from the substrate surface to contact the bonding material. The optical apparatus according to claim 3, wherein the substrate is disposed.   The optical device according to claim 1, wherein the bonding material is provided continuously from one end to the other end of the reinforcing member in the one direction. In the hollow portion, a substrate having the cross direction as a thickness direction is disposed,
The optical device according to claim 5, wherein the bonding material closes a gap between the housing and the substrate. An optical device according to claim 4 or 6,
A light irradiation means provided on the substrate for irradiating light toward an irradiation target;
An exposure apparatus. An exposure apparatus according to claim 7;
An image holding member for holding a latent image formed by light irradiation from the light irradiation means;
A developing device for developing the latent image of the image holding member using a developer;
A transfer device for transferring the developer image developed by the developing device to a recording medium;
An assembly. An exposure apparatus according to claim 7;
An image holding member for holding a latent image formed by light irradiation from the light irradiation means;
A developing device for developing the latent image of the image holding member using a developer;
A transfer device for transferring the developer image developed by the developing device to a recording medium;
A fixing device for fixing the developer image transferred to the recording medium;
An image forming apparatus. An assembly according to claim 8;
A fixing device for fixing the developer image transferred to the recording medium;
An image forming apparatus.