JP2018183893A - Manufacturing method of liquid discharge head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a liquid discharge head which can adjust a height of a sealing agent appropriately while securing electric reliability.SOLUTION: In a first process, a first thermosetting sealing agent sa is applied so as to cover at least a part of an electric connection part C for electrically connecting an element substrate 160 and an electric wiring member 150, and the first sealing agent sa is heated and cured. In a second process, a second thermosetting sealing agent sb is applied on the first cured sealing agent sa. In a third process, the second sealing agent sb is heated to be in a temporary cured state in which a surface is cured and an inside is fluid. In a fourth process, the second sealing agent sb in the temporary cured state is pressed by a heating tool ht to adjust a height of the second sealing agent sb, and heat the sealing agent sb and cure to an inside.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for manufacturing a liquid discharge head that discharges liquid.

A liquid discharge head used in a liquid discharge apparatus such as an ink jet recording apparatus includes an element substrate that discharges liquid, a support member that supports the element substrate, and an electrical wiring member that inputs a logic signal to the element substrate. Some are equipped with.
As a manufacturing method of the above liquid discharge head, first, an element substrate is bonded to a support member using an adhesive to form a recording element unit, and further, an electrical wiring is formed on the support member of the recording element unit using an adhesive. Join the members. Thereafter, the terminal of the element substrate and the lead portion of the electric wiring member are electrically connected. Then, the electrical connection portion is covered with a sealant, and the sealant is subjected to a thermosetting process (thermal cure) to form a protective portion that cures the sealant and protects the electrical connection portion. To do.
From the viewpoint of electrical insulation, the following conditions (1) and (2) are required for the sealant that forms the protective portion in order to ensure the electrical reliability of the electrical connection portion.
(1) Fluidity capable of flowing into the lower portion of the lead portion of the electrical connection portion (2) Shape maintenance property capable of ensuring a necessary height (coating thickness) above the electrical connection portion The above conditions (1) and (2 ) Is difficult to achieve with a single sealant, it is necessary to use a plurality of materials satisfying the conditions (1) and (2) as the sealant. That is, it is necessary to apply a sealant having a low viscosity to the lower part of the lead part and to apply a sealant having a high clay to the upper part of the lead part. A high-viscosity sealant to be applied to the upper portion of the lead portion needs to be applied in a large amount so as to be higher than a necessary height in consideration of application height variations caused by material lots and application conditions.
In general, in a liquid discharge head, it is desired to shorten the distance between the media, which is the distance between the element substrate and the recording medium, in order to increase the landing accuracy of the liquid on the recording medium. However, in the above-described liquid discharge head, since the protective portion is higher than the required height, there is a problem that when the distance between the media is shortened, clogging due to the recording medium is likely to occur. For this reason, it is desired to adjust the height of the protection portion with high accuracy so that the distance between the media is as short as possible.
Patent Document 1 discloses a technique for adjusting the height of a protective portion by applying an external force to a sealing agent covering an electrical connection portion and processing the sealing agent, and then curing the sealing agent.

JP 2008-120056 A

  However, if an external force is applied before the sealant is cured as in the technique described in Patent Document 1, a load is applied to the electrical connection portion via the sealant. For this reason, a deformation | transformation of an electrical connection part etc. arise and there exists a possibility of reducing electrical reliability. Also, if the sealant is processed before it is cured, the sealant flows to the outer periphery of the element substrate, the sealant becomes lower than necessary, the electrical connection part is exposed, and the electrical reliability is lowered. There is also a problem.

  An object of the present invention is made in view of the above problems, and provides a method for manufacturing a liquid discharge head capable of adjusting the sealant to an appropriate height while ensuring electrical reliability. That is.

  A method of manufacturing a liquid discharge head according to the present invention is a method of manufacturing a liquid discharge head including an element substrate that discharges liquid and an electric wiring member that is electrically connected to the element substrate, and has thermosetting properties. The first sealant is applied so as to cover at least a part of the electrical connection portion that electrically connects the element substrate and the electrical wiring member, and the first sealant is heated and cured. A first step of applying, a second step of applying a thermosetting second sealing agent on the cured first sealing portion, and a surface of the second sealing agent. A third step of curing and heating the inside to a temporarily-cured state having fluidity, and pressing the second sealant in the temporarily-cured state with a pressing member to increase the height of the second sealant A fourth step of adjusting and heating the second sealing agent to the inside thereof.

  According to the present invention, the first sealant covering the electrical connection portion is cured, and the height of the second sealant applied on the first sealant is cured on the surface, The inside is adjusted in a temporarily cured state having fluidity. For this reason, the first sealant can protect the electrical connection portion from an external force applied to adjust the height of the second sealant, and the surface of the second sealant Since it is hardened | cured, it can suppress that a 2nd sealing agent flows and becomes low more than necessary. Therefore, it becomes possible to adjust the sealing agent to an appropriate height while ensuring electrical reliability.

It is sectional drawing which shows the liquid discharge head of one Embodiment of this invention. FIG. 3 is a top view illustrating a liquid discharge head according to an embodiment of the present invention. It is a figure for demonstrating the manufacturing process of the liquid discharge head of one Embodiment of this invention. It is a figure for demonstrating the manufacturing process of the liquid discharge head of one Embodiment of this invention. It is a figure for demonstrating the manufacturing process of the liquid discharge head of one Embodiment of this invention.

Embodiments of the present invention will be described below with reference to the drawings. In addition, in each drawing, the same code | symbol is attached | subjected to what has the same function, and the description may be abbreviate | omitted.
(Embodiment)
FIG. 1 is a cross-sectional view showing a liquid discharge head according to an embodiment of the present invention. FIG. 2 is a plan view showing the upper surface of the liquid discharge head according to the embodiment of the present invention.
As shown in FIG. 1, the liquid discharge head 100 includes a first support member 110, a substrate 120, a discharge port forming member 130, a second support member 140, and an electric wiring member 150. The substrate 120 and the discharge port forming member 130 constitute an element substrate 160 that discharges a liquid such as ink.
The first support member 110 is a support member that supports the element substrate 160 and the electrical wiring member 150. The first support member 110 has a supply path 111 through which a liquid is supplied.
On the first support member 110, the element substrate 160 is bonded via an adhesive layer g1. The adhesive layer g1 is formed around the supply path 111 of the support member 110, and the element substrate 160 is provided in contact with the adhesive layer g1 and covering the supply path 111 of the support member 110. The element substrate 160 has a configuration in which the substrate 120 and the discharge port forming member 130 are bonded to each other via an adhesive layer (not shown), and the substrate 120 is bonded to the support member 110 via the adhesive layer g1. ing.
The substrate 120 has a supply path 121 through which liquid is supplied from the supply path 111 of the support member 110. The supply path 121 is formed on the supply path 111 and communicates with the supply path 111. Bumps B forming terminals for electrical connection with the electrical wiring member 150 are formed at the end of the first direction along the substrate 120 (in the example of the figure, the longitudinal direction X of the substrate 120). Yes. There are a plurality of bumps B, and the bumps B are juxtaposed in a second direction (in the example shown in the figure, the short direction Y of the substrate) intersecting (orthogonal) the longitudinal direction X on the substrate 120 as shown in FIG. The discharge port forming member 130 has a plurality of discharge ports n for discharging the liquid supplied to the supply path 121. In the present embodiment, the plurality of discharge ports n are arranged so as to form a plurality of discharge port arrays na along the longitudinal direction X as shown in FIG.
Further, a flow suppression portion f that is a convex portion is formed between the bump B on the element substrate 160 (substrate 120) and the discharge port forming member 130 (discharge port n). The flow suppression part f is provided along the short direction Y as shown in FIG. It is desirable that the flow suppressing portion f be formed so as to have a height equal to or higher than the surface 131 provided with the discharge port n in the element substrate 160 (discharge port forming member 130). In the present embodiment, the flow suppression part f is 0 to 0.2 mm higher than the surface 131. The flow suppressing part f is formed by, for example, a film forming technique using photolithography.
The flow suppression part f is provided so as not to contact the discharge port forming member 130. Thereby, a slit d extending toward the outer peripheral portion k of the element substrate 160 is formed along the short direction Y as shown in FIG. 2 between the discharge port forming member 130 and the flow suppressing portion f. .

In addition, a second support member 140 is bonded on the first support member 110 via an adhesive layer g2. The second support member 140 is provided at a position spaced from the end in the longitudinal direction X of the substrate 120 so as not to contact the substrate 120.
The second support member 140 supports the electric wiring member 150. Specifically, an adhesive layer g3 is formed on the second support member 140, and the electric wiring member 150 is joined to the support member 140 via the adhesive layer g3.
In this embodiment, the electrical wiring member 150 is formed of a tape member. The electrical wiring member 150 is electrically connected to the element substrate 160 and inputs a logic signal for discharging liquid to the element substrate 160.
A lead portion L for electrically connecting to the bump B provided on the substrate 120 is provided at an end portion of the electric wiring member 150 on the element substrate 160 side. The lead portion L extends from the end of the electric wiring member 150 toward the substrate 120 until it contacts the bump B.
The bump B and the lead portion L constitute an electrical connection portion C that electrically connects the element substrate 160 and the electrical wiring member 150. The electrical connection portion C is covered with a protection portion S that protects the electrical connection portion C.
The protection part C is formed of a sealant having thermosetting properties and electrical insulation properties. Specifically, the protection part C has sealing parts s1 and s2 formed of different sealing agents. The sealing part s1 is a first sealing part formed with a first sealing agent. The sealing portion s1 covers the electrical connection portion C and is filled up to the space W between the element substrate 160 and the second support member 140. The sealing portion s1 is formed so as not to overflow from the flow suppressing portion f and protrude into the slit d. The sealing part s2 is a second sealing part formed with a second sealing agent. The sealing part s1 is covered with the sealing part s2. The sealing part s2 has a raised part i raised above the flow suppressing part f.

3 and 4 are diagrams for explaining a method of manufacturing the liquid discharge head shown in FIGS. 1 and 2.
In the method for manufacturing a liquid discharge head, first, an intermediate unit 101 is prepared by removing the protective part S from the configuration of FIG. 1 as shown in FIG.
Subsequently, as shown in FIG. 3B, the electrical connection portion C is covered with the first sealant sa. Specifically, the first sealing agent sa is applied to the space W so that the space W between the element substrate 160 and the second support member 140 is filled with the first sealing agent sa. At this time, the first sealing agent sa is applied so as to cover the electrical connection portion C from the viewpoint of protecting the electrical connection portion C from external force in the step of adjusting the height of the sealing portion s2 described later. The first sealant sa may cover at least a part of the electrical connection part C, more specifically, a part of the lower surface of the lead part L of the electrical connection part C that is easily affected by an external force. It is desirable to cover the entire upper surface of the lead portion L of the portion C. The first sealing agent sa shown in FIG. 3B covers the entire upper surface of the lead portion L. The first sealant is applied so as not to overflow from the flow suppressing portion f provided on the substrate 120 to the discharge port n side and to protrude into the slit d.
The first sealant preferably has a low viscosity so that the space W is filled without any gaps. In the present embodiment, the viscosity of the first sealant is included in the range of 1 Pa · s to 5 Pa · s.
When the first sealant sa is applied, the intermediate unit 101 to which the first sealant sa is applied is put into a heating device, and the first sealant sa is thermally cured (thermal cure). ), The first sealing agent sa is cured to form the sealing portion s1.

Thereafter, the second sealing agent sb is applied to the upper portion of the electrical connection portion C through the sealing portion s1 as shown in FIG. Further, as shown in FIG. 4A, the third sealing agent sc is applied to a position away from the upper portion of the electrical connection portion C, that is, a position away from the second sealing agent sb. Specifically, the third sealing agent sc is applied to the upper part of the flow suppressing part f.
The application amount of the third sealant sc is small (small) compared to the second sealant sb, and the height of the third sealant sc is lower than that of the second sealant sb. . The third sealant sc may be the same material as the second sealant sb or a different material as long as it is a thermosetting sealant similar to the second sealant sb. From the viewpoint of simplification, the same material as the second sealing agent sb is desirable. In the present embodiment, the third sealing agent sc is the same material as the second sealing agent sb.
When the second sealant sb and the third sealant sc are applied, the intermediate unit 101 to which the second sealant sb and the third sealant sc are applied is put into a heating device. By performing the thermosetting treatment, the second sealing agent sb and the third sealing agent sc are heated to the temporarily cured state.
The temporarily cured state is a tack-free state in which the surface is cured until it loses fluidity, and the interior is not cured and has fluidity. The surfaces of the second sealing agent sb and the third sealing agent sc lose their fluidity and lose their adhesiveness.

When the second sealant sb and the third sealant sc are in a temporarily cured state, the height of the second sealant sb is adjusted using the heating tool ht as shown in FIG. While being cured, a sealing portion s2 is formed as shown in FIG. Thereby, the liquid discharge head 100 shown in FIG. 1 is formed.
The heating tool ht has a pressing surface ht1 to be heated, and adjusts the height of the second sealing agent sb by heating the pressing surface ht1 while pressing the second sealing agent sb. It is a pressing member that cures the second sealant to the inside. The heating tool ht can adjust the height of the second sealant sb according to the variation in the height of the discharge port n.
When the second sealing agent sb is pressed on the pressing surface ht1, as shown in FIG. 4B, the second sealing agent sb is crushed and while maintaining the height to the surface of the heating tool ht. Then, it spreads toward the discharge port forming member 130 side and the electric wiring member 150 side. At this time, since the third sealing agent sc applied on the flow suppressing part f formed on the substrate 120 is provided, the second sealing agent sb is discharged from the discharge port n (discharge port forming member 130). It is possible to suppress the protrusion.
At this time, since the third sealing agent sc is minute, it does not contact the pressing surface ht1. However, since the third sealing agent sc is minute, its heat capacity is small. For this reason, the third sealing agent sc is cured to the inside earlier than the second sealing agent sb by the radiant heat from the pressing surface ht1, and forms a raised portion i. By forming the raised portion i, the effect of suppressing the protrusion of the second sealing agent sb can be enhanced. Further, even if the second sealing agent sb exceeds the raised portion i, the second sealing agent sb that has exceeded the slit d provided between the discharge port forming member 130 and the flow suppressing portion f. Accordingly, it is possible to flow to the outer peripheral portion k of the element substrate 160. Accordingly, the second sealing agent sb can be prevented from protruding to the discharge port n.
From the viewpoint of ensuring electrical insulation of the electrical connection portion C, the second sealant sb needs to have a predetermined height. For this reason, as the material of the second sealing agent sb, a material having high viscosity and high thixotropy is desirable. More specifically, the material of the second sealing agent sb may include a viscosity in the range of 50 Pa · s to 70 Pa · s and a thixo ratio in the range of 1.0 to 2.5. desirable. The second sealant sb needs rigidity from the viewpoint of contact with the recording medium due to clogging of the recording medium. For this reason, it is desirable that the material of the second sealing agent sb is a material having a high filler filling rate such as silica. The filler content of the second sealant sb is desirably included in the range of 60 wt% to 80 wt%.

An external force is applied to the electrical connection portion C by pressing the second sealant sb with the heating tool ht. From the viewpoint of protecting the electrical connection portion C from this external force, it is desirable that the first sealing agent sa is applied so as to cover the entire electrical connection portion C as described above. Further, the elastic modulus of the first sealing agent sa is desirably higher than the elastic modulus of the second sealing agent sb in the temporarily cured state.
Further, the second sealing agent sb is pressed and brought into close contact with the surface of the sealing portion s1 by the pressing against the second sealing agent sb by the heating tool ht. For this reason, it can suppress that a space | gap is formed in the interface of 2nd sealing agent sb and sealing part s1. Moreover, in order to suppress generation | occurrence | production of position shift of 2 sealing agent sb, interface peeling, etc., the material of the 1st sealing agent and the 2nd sealing agent sb is the same thermosetting resin material, It is desirable that the filler content of the second sealant sb is higher than the filler content of the first sealant sa.
Further, in order to efficiently transfer heat from the heating tool ht to the second sealant sb, so that excessive heat is not applied to the electrical connection portion C, the thermal conductivity of the second sealant sb. Is preferably higher than the thermal conductivity of the first sealant sa. For this reason, it is desirable that the filler added to the second sealing agent sb is ceramics such as alumina (aluminum oxide) or carbon.
In order to harden the second sealing agent sb protruding to the discharge port n side from the raised portion i more quickly, the temperature of the portion facing the discharge port n (discharge port forming member 130) on the pressing surface ht1 is other than It is desirable that the temperature is higher than the temperature of the part. Moreover, in order to harden the 3rd sealing agent sc faster by the radiant heat from the pressing surface ht1, the emissivity of the pressing surface ht1 corresponding to the vicinity of the 3rd sealing agent sc is higher than another part. It is desirable.
The heating tool ht used in the above manufacturing method is an example, and is not limited to this example. FIG. 5 is a diagram showing another example of the heating tool ht. The heating tool ht shown in FIG. 5 (a) is provided with an inclined portion t on the pressing surface ht1. In the step of pressing the second sealant with the heating tool ht, as shown in FIG. 5B, the inclined portion t is a second seal between the electrical connection portion C and the discharge port forming member 130. It is formed in contact with the agent sb. The second sealing agent sb can be prevented from protruding to the discharge port n by the heating tool ht.

As described above, according to the present embodiment, the method for manufacturing a liquid ejection head includes the following first to fourth steps. In the first step, a first sealant sa having thermosetting properties is applied so as to cover at least a part of the electrical connection portion C that electrically connects the element substrate 160 and the electrical wiring member 150. The first sealant sa is heated and cured. In the second step, the second sealant sb having thermosetting property is applied on the cured first sealant sa. In the third step, the second sealing agent sb is heated to a temporarily cured state in which the surface is cured and the inside has fluidity. In the fourth step, the second sealant sb in the temporarily cured state is pressed with the heating tool ht to adjust the height of the second sealant sb, and the second sealant sb is heated. Cure to the inside.
Therefore, the first sealing agent sa covering the electrical connection portion C is cured, and the surface of the second sealing agent sb applied on the first sealing agent sa is cured, The inside is adjusted in a temporarily cured state having fluidity. For this reason, the electrical connection part C can be protected from the external force applied in order to adjust the height of the 2nd sealing agent sb with the 1st sealing agent sa. Furthermore, since the surface of the second sealing agent sb is cured, it is possible to suppress the second sealing agent sb from flowing and becoming lower than necessary. Therefore, it becomes possible to adjust the sealing agent to an appropriate height while ensuring electrical reliability.
In the present embodiment, the flow suppressing part f that is a convex part is provided between the electrical connection part C and the discharge port n that discharges the liquid in the element substrate 160, and the first sealing agent sa is the flow suppressing part. It is applied so as not to overflow to the side of the discharge port n from f. For this reason, it becomes possible to suppress that the 1st sealing agent sa flows to the discharge outlet n, and causes a discharge defect etc.
In the present embodiment, the third sealant sc having thermosetting property is applied to the upper part of the flow suppressing part f so as to be lower than the second sealant sb. For this reason, it is possible to suppress the second sealing agent sb from protruding to the discharge port n by the third sealing agent sc.
Further, in the present embodiment, the third sealing agent sc is cured faster by being applied in a smaller amount than the second sealing agent sb, so that the effect of suppressing the protrusion of the second sealing agent sb is high. can do. Further, since the third sealing agent sb is cured by radiant heat from the heating tool ht, the second sealing agent sb can be easily cured.
In the present embodiment, since the second sealing agent sb and the third sealing agent sc are formed of the same material, positional displacement of the second sealing agent sb, interface peeling, and the like are suppressed. It becomes possible.
In the present embodiment, a slit extending toward the outer peripheral portion k of the element substrate 160 is formed between the electrical connection portion C and the discharge port forming member 130. For this reason, since it becomes possible to guide the second sealing agent sb flowing out by pressing to the outer peripheral portion k of the element substrate 160, it is possible to suppress the second sealing agent sb from protruding to the discharge port n. It becomes possible.
In the present embodiment, since the inclined portion t of the heating tool ht is in contact with the second sealant sb between the electrical connection portion C and the discharge port forming member 130, the second sealant sb is discharged. Protruding to the exit n can be suppressed.
Moreover, in this embodiment, it is desirable that the elastic modulus of the sealing part s1 is higher than the elastic modulus of the second sealing agent sb in the temporarily cured state. The effect of protecting the electrical connection portion C from an external force applied to the electrical connection portion C can be increased.
In this embodiment, since the thermal conductivity of the second sealing agent sb is larger than the thermal conductivity of the first sealing agent sa, heat is applied from the heating tool ht to the second sealing agent sb. It is possible to prevent excessive heat from being applied to the electrical connection portion C while efficiently transmitting.

Hereinafter, a method for manufacturing a liquid discharge head will be described in more detail using an embodiment of the present invention.
[Example 1]
First, an intermediate unit 101 is prepared as shown in FIG. The flow suppression part f of the intermediate body unit 101 was formed by a film forming technique using photolithography so as to have a height of 0.2 mm from the first surface 131 of the discharge port forming member 130.
Subsequently, the first sealing agent is applied to the space W between the element substrate 160 and the second support member 140 in the intermediate unit 101. In this step, the first sealant was applied so as not to overflow from the flow suppressing portion f provided on the substrate 120 and to cover the electrical connection portion C. In this embodiment, the material of the first sealant is an epoxy resin having a viscosity of 3 Pa · s, a thixo ratio of 1.1, an elastic modulus of 1 GPa, and a filler that is not filled (filler filling rate is 0 wt%). is there.
Then, the intermediate unit 101 coated with the first sealant sa is put into a heating device, and the first sealant is cured by performing a thermosetting process on the first sealant. The sealing part s1 was formed.

Thereafter, as shown in FIG. 3C, a second sealing agent sb made of the same kind of epoxy resin as the first sealing agent is applied to the upper portion of the electrical connection portion C. In this embodiment, the material of the second sealant sb is an epoxy resin having a viscosity of 60 Pa · s, a thixo ratio of 1.4, an elastic modulus of 10 GPa, and a filler filling rate of 70 wt%.
Here, the second sealant sb is applied to the upper portion of the electrical connection portion C, and the third sealant sc made of the same material as the second sealant sb as shown in FIG. 4A. Was applied to the upper part of the flow suppression part f.
Subsequently, the intermediate unit 101 to which the second sealing agent sb and the third sealing agent sc are applied is put into a heating device and subjected to thermosetting treatment, whereby the second sealing agent sb and the third sealing agent sb are applied. The sealant sc is heated to a temporarily cured state. In the temporarily cured state, the elastic modulus of the second sealant sb is 0.5 GPa.
Then, as shown in FIG. 4B, the second sealant sb is adjusted while adjusting the height of the second sealant sb by pressing the second sealant sb from above with the heating tool ht. Is cured to form a sealing portion s2 as shown in FIG. At this time, the third sealant sc is first cured by radiant heat from the heating tool ht to form the raised portion i, thereby suppressing the second sealant sb from spreading to the discharge port n side. ing. About the temperature of the heating tool ht, the part located in the upper part of the discharge outlet n was set to 150 degreeC, and the other location was set to 100 degreeC.
As shown in FIG. 4C, the second sealing agent sb beyond the raised portion i flows into the slit d formed in the substrate 120 along the arrangement direction of the lead portions L of the electric wiring member 150. It hardens in the state. In this way, the protruding second sealing agent sb is stored in the slit d.
In the liquid discharge head manufactured in this example, the sealing agent could be adjusted to an appropriate height while ensuring electrical reliability.

[Example 2]
First, an intermediate unit 101 is prepared as shown in FIG. The flow suppression part f of the intermediate body unit 101 was formed by a film forming technique using photolithography so as to have a height of 0.2 mm from the first surface 131 of the discharge port forming member 130.
Subsequently, the first sealing agent is applied to the space W between the element substrate 160 and the second support member 140 in the intermediate unit 101. In this step, the first sealant was applied so as not to overflow from the flow suppressing portion f provided on the substrate 120 and to cover the electrical connection portion C. In this embodiment, the material of the first sealant is an epoxy resin having a viscosity of 3 Pa · s, a thixo ratio of 1.1, an elastic modulus of 3 GPa, and a filler filling rate of 15 wt%.
Then, the intermediate unit 101 coated with the first sealant sa is put into a heating device, and the first sealant is cured by performing a thermosetting process on the first sealant. The sealing part s1 was formed.

Thereafter, as shown in FIG. 3C, a second sealing agent sb made of the same kind of epoxy resin as the first sealing agent is applied to the upper portion of the electrical connection portion C. In this embodiment, the material of the second sealant sb is an epoxy resin having a viscosity of 60 Pa · s, a thixo ratio of 1.4, an elastic modulus of 10 GPa, and a filler filling rate of 70 wt%.
Here, the second sealant sb is applied to the upper portion of the electrical connection portion C, and the third sealant sc made of the same material as the second sealant sb as shown in FIG. 4A. Was applied to the upper part of the flow suppression part f.
Subsequently, the intermediate unit 101 to which the second sealing agent sb and the third sealing agent sc are applied is put into a heating device and subjected to thermosetting treatment, whereby the second sealing agent sb and the third sealing agent sb are applied. The sealant sc is heated to a temporarily cured state. In the temporarily cured state, the elastic modulus of the second sealant sb is 0.5 GPa.
And as shown in FIG.5 (b), while adjusting the height of 2nd sealing agent sb by pressing the 2nd sealing agent sb from the top with the heating tool ht which has the inclination part t, it is 1st. The sealing agent sb of 2 is cured to form the sealing part s2 as shown in FIG. In this case, the inclined portion t suppresses the second sealing agent sb from protruding to the discharge port n side. Further, the third sealant sc is first cured by radiant heat from the heating tool ht to form the raised portion i, thereby suppressing the second sealant sb from spreading to the discharge port n side. Yes. About the temperature of the heating tool ht, the part located in the upper part of the discharge outlet n was set to 150 degreeC, and the other location was set to 100 degreeC.
As shown in FIG. 4C, the second sealing agent sb beyond the raised portion i flows into the slit d formed in the substrate 120 along the arrangement direction of the lead portions L of the electric wiring member 150. It hardens in the state. In this way, the protruding second sealing agent sb is stored in the slit d.
In the liquid discharge head manufactured in this example, the sealing agent could be adjusted to an appropriate height while ensuring electrical reliability.

  In each embodiment described above, the illustrated configuration is merely an example, and the present invention is not limited to the configuration.

130 Discharge port forming member 150 Electric wiring member 160 Element substrate C Electrical connection portion d Slit f Flow suppression member (convex portion)
k Peripheral part of element substrate n Discharge port sa First sealant sb Second sealant sc Third sealant

Claims (12)

A method for manufacturing a liquid discharge head comprising an element substrate for discharging liquid and an electric wiring member electrically connected to the element substrate,
A first sealant having thermosetting property is applied so as to cover at least a part of an electrical connection portion that electrically connects the element substrate and the electrical wiring member, and the first sealant A first step of curing by heating;
A second step of applying a second sealant having thermosetting property onto the cured first sealant;
A third step of heating the second sealant to a temporarily cured state in which the surface is cured and the inside has fluidity;
The second sealing agent in the temporarily cured state is pressed with a pressing member to adjust the height of the second sealing agent, and the second sealing agent is heated and cured to the inside. And a liquid ejection head manufacturing method comprising: A convex portion is provided between the electrical connection portion and a discharge port for discharging the liquid in the element substrate,
2. The method of manufacturing a liquid ejection head according to claim 1, wherein in the first step, the first sealing agent is applied so as not to overflow the ejection port side from the convex portion. In the second step, a third sealing agent having thermosetting property is applied on the top of the convex portion so as to be lower than the second sealing agent,
In the third step, the third sealant is cured to a temporarily cured state,
The method of manufacturing a liquid ejection head according to claim 2, wherein in the fourth step, the third sealant is cured to the inside. In the second step, the third sealant is applied in a smaller amount than the second sealant,
4. The method of manufacturing a liquid ejection head according to claim 3, wherein, in the fourth step, the third sealing agent is cured faster than the second sealing agent.   5. The fourth step according to claim 3, wherein in the fourth step, the second sealing agent is pressed by the heated pressing member, and the third sealing agent is cured by radiant heat from the pressing member. Manufacturing method of the liquid discharge head.   6. The method of manufacturing a liquid ejection head according to claim 3, wherein the second sealant and the third sealant are formed of the same material. 7.   The slit which extends toward the outer peripheral part of the said element substrate is formed between the said electrical connection part and the discharge port formation member which discharges the liquid in the said element substrate. A manufacturing method of a liquid discharge head given in 2. A plurality of the electrical connection portions are juxtaposed,
The method of manufacturing a liquid ejection head according to claim 7, wherein the slit extends along a direction in which the electrical connection portions are arranged in parallel. The pressing member has an inclined portion,
9. The method according to claim 1, wherein, in the fourth step, the inclined portion is in contact with the second sealing agent between the electrical connection portion and a discharge port forming member that discharges liquid in the element substrate. A method for manufacturing a liquid discharge head according to claim 1.   10. The liquid ejection head according to claim 1, wherein an elastic modulus of the cured first sealing agent is higher than an elastic modulus of the second sealing agent in the temporarily cured state. Production method.   11. The liquid ejection head according to claim 1, wherein a filler content in the second sealant is higher than a filler content in the first sealant. 11. Method.   12. The method of manufacturing a liquid ejection head according to claim 1, wherein the thermal conductivity of the second sealant is larger than the thermal conductivity of the first sealant.

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