JP2018177840A - Light source device for curing resin - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light source device for curing a resin capable of irradiation with a light capable of curing the resin in a short time without generating tackiness on a resin surface, and having dimension optimal to a size of a body to be irradiated.SOLUTION: A light source device for curing a resin has a light source, an optical system for introducing a light emitted from the light source to an ejection part via a light path, and a light passing part inserted in an optical light passage, for passing UV-C ultraviolet including lights with wavelength band of 250 nm, visible lights excluding lights with wavelength band of 500 nm to 640 nm, and an infrared ray, and is constituted to suppress generation of adhesiveness on a resin surface. Especially the optical system has an irradiation area setting part capable of setting that a light with which a body to be irradiated is irradiated has desired irradiation area.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a resin curing light source device for curing a photocurable resin such as a resin adhesive.

  An adhesive application device and an adhesive curing device for curing the applied adhesive by irradiating ultraviolet rays are well known, and many are used in the field of manufacturing electronic parts and medical parts etc. (for example, Patent Documents 1 to 3) ).

  All of these conventional adhesive application devices and adhesive curing devices are those that cure by curing the ultraviolet (UV) curable adhesive by irradiating it with ultraviolet light. For example, the UV spot curing apparatus, which the applicant of the present invention has provided since several decades, uses a very small amount of a UV curable resin manufactured so as to absorb the wavelength centered on 365 nm most efficiently. Small area to be cured rapidly, and in order to use ultraviolet light of wavelength centered around 365 nm efficiently, cut light energy of visible light region and infrared (IR) region and make spot irradiation doing.

Unexamined-Japanese-Patent No. 05-253526 gazette Japanese Patent Application Laid-Open No. 11-128800 Unexamined-Japanese-Patent No. 2006-176653

  As described above, when UV light is irradiated by cutting unnecessary light energy to the UV curable resin, it is known that the resin surface is cured, but the curing state inside the resin is unknown, and , Slough or tackiness remains on the resin surface. For this reason, conventionally, as a post-process after the curing process by ultraviolet irradiation, the process of heating the object to a high temperature in an oven has been performed.

  However, according to this method, the heating time by the oven requires extra time and the whole processing time becomes long, and furthermore, in the case of the medical related object, it moves to the oven with the presence of tackiness on the surface of the object. Impurities were attached during the process and there was a possibility of becoming a defective product.

  Generally, in the curing process of a UV curable resin, it is the shortest wavelength band of ultraviolet light (UV-C, 200 nm to less than 280 nm) that affects curing of the resin surface layer, and it affects curing in the middle of the resin. Is UV light of a longer wavelength band (UV-B, 280 nm to less than 315 nm), and it is the UV light of longer wavelength that affects the curing of the deeper part of the resin (closest to the object) UV-A, 315 nm to 400 nm), visible light and infrared light are considered. However, when the light of all the wavelengths is simultaneously irradiated, the tackiness of the resin surface can be removed, but the energy is too strong, and many problems such as destruction (deformation), breakage and / or charring of the UV curable resin have occurred. Therefore, in the conventional curing process, in most cases, UV-B and longer wavelength light are used to cure the UV-curable resin, and then the UV-curable resin is completely cured. After that, tackiness removal remaining on the surface in a later step was carried out using a high temperature oven over time.

  As described above, there is the problem of the resistance of the object to the heat treatment, in addition to the problem that the contamination of the resin surface occurs when moving to the post process. Many electronic components and liquid crystals have low resistance to high temperature. For this reason, it is necessary to lower the temperature of the heat treatment, but this causes the treatment time to be prolonged, which is contrary to the demand for shortening the treatment process. As a result, there was no choice but to develop a completely new resin to cope with tackiness removal, or to remove the tackiness of the resin surface after UV curing with a very short time of high temperature treatment.

  The inventors of the present invention have already proposed a light source device for curing a resin that generates special spot light that can prevent or remove tackiness on the resin surface without performing such high temperature treatment.

  However, since this resin curing light source device is configured to guide spot light of a fixed diameter to the irradiated body, it is necessary to change the irradiation position of the spot light and irradiate a plurality of times to the large-area irradiated body. It took a lot of time. In addition, the spot light is irradiated to the small-area object to be irradiated to a portion not requiring light irradiation or a portion not to be irradiated with light, and not only a problem occurs but also the efficiency is very low.

  Therefore, an object of the present invention is to provide a light source device for curing a resin, which is light which can be cured in a short time without generating tackiness on the resin surface and which can emit light having an optimum size for the size of the irradiated object. It is to do.

  According to the present invention, a UV-C including a light source, an optical system for guiding light emitted from the light source to the output unit through the optical path, and an optical path of the optical system and including light in a wavelength band of 250 nm There is provided a light source device for curing a resin, which comprises an ultraviolet ray, a visible ray excluding light in a wavelength band of 500 nm to 640 nm, and a light passage portion which transmits an infrared ray, and suppresses the generation of tackiness on the resin surface. . In particular, the optical system includes an irradiation area setting unit that can be set so that the light irradiated to the irradiation object has a desired irradiation area.

  The UV curable resin is simultaneously irradiated with UV-C ultraviolet light containing light in the 250 nm wavelength band, visible light excluding light in the 500 nm to 640 nm wavelength band, and infrared light, to form a tackiness on the resin surface. It can be cured in a short time without causing it. Moreover, not only UV curable resins but also IR curable resins can be cured efficiently.

  In particular, according to the present invention, since the irradiation area setting unit capable of setting the light irradiated to the irradiation object to have a desired irradiation area is provided, the size of the irradiation object is optimized. It can emit light. For this reason, it is possible to cure the resin in a short time without generation of tackiness using light of a large irradiation area for a large-area irradiation object, and light using a small irradiation area light for a small-area irradiation object It is possible to reliably and efficiently cure only the portions that need to be irradiated, without causing tackiness. In the present invention, since the light irradiated to the irradiated object contains infrared rays, the irradiation area of the light irradiated to the irradiated object is determined by the size of the irradiated object so that the excess portion is not irradiated and heated. Correctly.

  It is preferable that the irradiation area setting unit includes an optical fiber bundle provided in an optical path closer to the irradiated object than the light passage unit, and a lens unit for adjusting the spread angle provided at the tip of the optical fiber bundle.

  An optical fiber bundle whose irradiation area setting unit is provided in an optical path closer to the irradiated object than a light passing unit, a rod lens for uniform illumination provided at the tip of the optical fiber bundle, and a tip of the rod lens It is also preferable to have a lens unit for adjusting the spread angle provided.

  The irradiation area setting unit includes a plurality of optical fiber bundles provided in an optical path closer to the irradiated body than the light passing unit, and a plurality of lens units for adjusting the spread angle respectively provided at the tip of the plurality of optical fiber bundles. It is also preferable to have

  The irradiation area setting unit includes a rod lens for uniform illumination provided in an optical path closer to the irradiated object than the light passing portion, and a lens unit for adjusting the spread angle provided at the tip of the rod lens. Is also preferred.

  In this case, it is more preferable that the lens unit of the irradiation area setting unit be installed so as to be movable along the optical axis.

  It is also preferable that the irradiation area setting unit be provided with an integrator lens for obtaining a uniform illuminance distribution, which is provided in the light path closer to the irradiated object than the light passing unit.

  A parabolic mirror or an axial cross section parabolic mirror which reflects the light emitted from an elliptical mirror or an axial cross-sectional ellipsoidal mirror or light source to collimate the light emitted from the light source. It is also preferred that

  By controlling the amount of energy of the tackiness removal wavelength or the UV curing dominant wavelength, the ratio of the relative strength between the UV curing dominant wavelength and the tackiness removal wavelength is adjusted to suppress the tackiness of the resin surface. Is also preferred. By controlling the amount of energy of the tackiness removal wavelength (ultraviolet light near 254 nm) or the energy content of the UV curing dominant wavelength, the ratio of the relative intensity between the UV curing principal wavelength (ultraviolet light near 365 nm) and the tackiness removal wavelength It can be adjusted and set. As a result, it is possible to carry out the tackiness removal of the ultraviolet curable resin under the optimum conditions.

  It is preferable that the light passage portion is configured to further pass UV-B ultraviolet light and UV-A ultraviolet light.

  It is also preferable that the light passing portion is a transmission filter or a mirror that transmits ultraviolet light in the above-mentioned wavelength band, visible light and infrared light in the above-mentioned wavelength band.

  It is also preferred that the light source comprises a metal halide lamp, a mercury-xenon lamp, a long low pressure mercury lamp, or a plurality of LED elements.

  According to the present invention, it is possible to cure in a short time without generating tackiness on the resin surface, and it is possible to efficiently cure not only the UV curable resin but also the IR curable resin. In particular, since the irradiation area setting unit capable of setting the light irradiated to the irradiation object to have a desired irradiation area is provided, it is possible to irradiate light having an optimal size for the size of the irradiation object. For this reason, it is possible to cure the resin in a short time without generation of tackiness using light of a large irradiation area for a large-area irradiation object, and light using a small irradiation area light for a small-area irradiation object It is possible to reliably and efficiently cure only the portions that need to be irradiated, without causing tackiness. In the present invention, since the light irradiated to the irradiation object contains infrared rays, the irradiation area corresponds exactly to the size of the irradiation object, and the object is irradiated so that the excess portion is not irradiated and heated. The light irradiated to the irradiator is configured to have a desired irradiation area.

  By performing the ultraviolet curing in the tackiness free wavelength band (a wavelength band capable of removing the occurrence of tackiness) in the resin curing process, it is possible to omit the process after the heat treatment for tackiness removal. In electronic circuits with a high degree of integration, the need for such heat treatment has been a major problem. In recent years, it has become an age when optical technology and electronic technology merge, such as virtual reality (virtual reality, VR) systems, augmented reality (AR) systems, mobile phone systems, etc. Heat sensitive components are often placed in the vicinity of the components that must be UV cured. Since tackiness removal by heat treatment is performed at a relatively high temperature (90 ° C. or higher), conventionally, there is a restriction that the selection of parts to be used and the design of the circuit system must be performed in consideration of heat treatment entering later steps. there were. On the other hand, as in the present invention, by combining a light source having a tackiness removal wavelength band and an optical system capable of irradiating light according to applications in various irradiation area patterns, downsizing of the electronic circuit and improvement of productivity can be achieved. It has become possible to bring about various industrial revolutions such as cost reduction and energy saving.

It is a top view which shows roughly the optical structure of the light source device for resin curing in the 1st Embodiment of this invention. It is a figure showing the wavelength light transmittance characteristic of the zone penetration filter in the light source device for resin hardening of a 1st embodiment. It is a top view which shows roughly the optical structure of the light source device for resin curing in one modification of 1st Embodiment. It is a figure showing the wavelength light transmittance characteristic of the low zone rejection filter in the modification of FIG. It is a top view which shows roughly the optical structure of the light source device for resin curing in the other modification of 1st Embodiment. It is a figure showing the wavelength light transmittance characteristic of the optical element for energy adjustment in the modification of FIG. It is a top view which shows roughly the optical structure of the light source device for resin curing in the 2nd Embodiment of this invention. It is a top view which shows roughly the optical structure of the light source device for resin curing in the 3rd Embodiment of this invention. It is a top view which shows roughly the optical structure of the light source device for resin curing in the 4th Embodiment of this invention. It is a top view which shows roughly the optical structure of the light source device for resin curing in the 5th Embodiment of this invention. It is a top view which shows roughly the optical structure of the light source device for resin curing in the 6th Embodiment of this invention. It is a perspective view which shows roughly the optical structure of the light source device for resin curing in the 7th Embodiment of this invention. It is a perspective view which shows roughly the optical structure of the light source device for resin curing in the 8th Embodiment of this invention. It is a figure showing the spectral-distribution characteristic of the light actually transmitted in 1st Example. It is a figure showing the wavelength light transmittance characteristic of the band transmission filter in a 1st comparative example. It is a figure showing the spectral distribution characteristic of the light actually transmitted in the 1st comparative example. It is a figure showing the wavelength light transmittance characteristic of the band transmission filter in a 2nd comparative example. It is a figure showing the spectral distribution characteristic of the light actually transmitted in the 2nd comparative example.

  FIG. 1 schematically shows an optical configuration of a light source device for resin curing in the first embodiment of the present invention.

  As shown in the figure, the light source device for resin curing of the present embodiment is reflected by the light source 10, the reflecting mirror 11 of a condensing type that is an elliptical mirror on which the light source 10 is mounted, and the reflecting mirror 11. A band pass filter (corresponding to the light passing portion of the present invention) 13 inserted in the light path 12 of the light to be collected, an optical fiber bundle 14 for guiding a light spot to be irradiated onto the irradiated object, and an optical fiber bundle 14 And a spread angle adjustment unit (corresponding to the irradiation area setting unit according to the present invention) 15 provided at the tip of the cover. In this embodiment, the light source 10, the reflecting mirror 11, and the band pass filter 13 are provided in the housing 16, and the optical fiber bundle 14 is attached to the mounting portion 17 provided on the front surface 16 a of the housing 16. In a modification of the present embodiment, the light source 10 and the reflecting mirror 11 are integrated into a unit.

  Although only the minimum necessary elements are shown in FIG. 1 in order to simplify the explanation, in fact, they are inserted into the optical path 12 of the light reflected and collected by the reflecting mirror 11, A light intensity adjusting mechanism for adjusting the intensity, a shutter mechanism inserted in the light path 12 on the downstream side of the light intensity adjusting mechanism, for blocking light, and for inserting other types of filters, an operation panel, And a control computer or the like may be provided.

  The light source 10 is, for example, a metal halide lamp configured to emit light of a full wavelength band including IR band light, visible light and UV band light. Instead of the metal halide lamp, a mercury-xenon lamp or a plurality of LED elements capable of emitting light in the entire wavelength band may be used as the light source 10.

  The reflector 11 has a spheroidal shape in which the light source 10 is mounted at its focal position, for example all the wavelength bands emitted from the light source 10, ie the IR band, by using a mirror of aluminum deposition It is configured to efficiently reflect and collect light of all wavelength bands (for example, a band of 200 nm to 2500 nm) including light, visible light and UV band light (UV-A, UV-B and UV-C) ing. In addition, it may replace with the reflective mirror 11 and may use the lens which condenses the light of all the wavelength bands radiated | emitted from the light source 10. FIG.

  The UV and IR band transmission filter 13 is a UV and IR band transmission filter, and in the present embodiment, it is excellent in heat resistance and long life stability, and UV-C ultraviolet light including light in a wavelength band of 250 nm and 500 nm to It consists of a transmission filter or a mirror that transmits visible light excluding light in the wavelength band of 640 nm and infrared light. An example of the wavelength light transmittance characteristic of this UV and IR band transmission filter 13 is shown in FIG. In this example, transmission of light in the range of about 500 nm or more and about 640 nm or less among visible light is blocked, and 90% or more of UV-C ultraviolet light including at least 250 nm wavelength band and visible light and infrared light of about 650 nm or more It has the characteristic of transmitting at a transmittance of That is, in the present embodiment, the ratio of the relative intensity between the tackiness removal wavelength (ultraviolet light near 254 nm) and the UV curing principal wavelength (ultraviolet light near 365 nm) is optimally adjusted. As a result, the ultraviolet curable resin It is possible to carry out the removal of tackiness under the optimal conditions. By inserting such a UV and IR band-pass filter 13 into the light path 12, it is possible to cure the resin surface in a short time without generating tackiness on the resin surface, and only the light for the UV curable resin Therefore, the IR curable resin can be cured efficiently. And since the light of a wavelength band of 500 nm-640 nm which is not required for resin hardening is intercepted, it can prevent that a to-be-irradiated body is heated unnecessarily. Although the UV and IR band transmission filter 13 of the present embodiment is configured to have a transmission characteristic of transmitting only ultraviolet (including partially visible light) and infrared (including partially visible light), Depending on the wavelength curing characteristics of the UV curable resin to be irradiated and the wavelength emitting characteristics of the light source 10, various wavelength light transmittance characteristics may be used.

  The optical fiber bundle 14 is configured by bundling a plurality of light propagation quartz fibers having a high ultraviolet band transmittance formed of a core having a diameter of several tens of microns and a clad. In practice, flexible fiber bundles having an effective diameter of 3 to 5 mm are used. Instead of the optical fiber bundle, it is possible to use a flexible optical waveguide made of an optical material that transmits the same tackiness removing wavelength band as this, or an optical waveguide in which a quartz rod or the like is jointed in an articulated manner. Thereby, it is possible to irradiate the light of the necessary wavelength band from the light source 10 for ultraviolet curing to the irradiated object with low loss.

  The spread angle adjustment unit 15 is configured of a lens unit 15a formed by combining a plurality of lenses. The lens unit 15a includes, for example, a convex lens (a biconvex lens or a plano-convex lens) such as a collimator lens for converting light emitted from the optical fiber bundle 14 into parallel light, and a convex lens (a biconvex lens or a convex lens for condensing the light emitted from the convex lens). And a plano-convex lens). By such a lens unit 15a, it is possible to adjust the spread angle of the light spot emitted from the optical fiber bundle 14 and to set it to an arbitrary irradiation area with a diameter of 3 to 6 mmφ.

  As described above in detail, according to the present embodiment, the UV and IR band-pass filter 13 is inserted into the light path 12 from the light source 10, so that UV-C ultraviolet light including light in the wavelength band of 250 nm and Since the light to be irradiated is simultaneously irradiated with light consisting of visible light and infrared light excluding light in the wavelength band of 500 nm to 640 nm, the UV-curable resin does not have tackiness on the resin surface and is short. It can be cured in time. Moreover, not only UV curable resins but also IR curable resins can be cured efficiently. In particular, since the spread angle adjustment unit 15 by the lens unit 15a is provided at the tip of the optical fiber bundle 14, it is possible to emit light having an optimum size for the size of the object to be irradiated. For this reason, it is possible to cure the resin in a short time without generation of tackiness using light of a large irradiation area for a large-area irradiation object, and light using a small irradiation area light for a small-area irradiation object It is possible to reliably and efficiently cure only the portions that need to be irradiated, without causing tackiness. That is, since the light irradiated to the irradiation object contains infrared rays, the irradiation area corresponds exactly to the size of the irradiation object, and the irradiation object so that the excess part is not irradiated and heated. Is configured to have a desired illuminated area.

  In addition, even if it irradiates only the light of a UV wavelength range with UV curing resin, and also irradiates only the light of an IR wavelength range, and after irradiating the light of a UV wavelength range (IR wavelength range), IR wavelength Even when irradiated with light of a band (UV wavelength band), the tackiness of the resin surface can not be completely removed. Therefore, conventionally, as described above, the tackiness is removed by performing both the UV curing treatment by the UV curing apparatus having a main wavelength of 365 nm and the heat treatment by the heat ray oven. According to the present embodiment, UV curing is performed by simultaneously irradiating UV-C ultraviolet light including light in the wavelength band of 250 nm, visible light excluding light in the wavelength band of 500 nm to 640 nm, and light consisting of infrared light. The mold resin can be cured without exposure to air, and UV curing and tackiness removal can be achieved simultaneously. That is, the ratio of relative intensity between the tackiness removal wavelength (ultraviolet light near 254 nm) and the UV curing principal wavelength (ultraviolet radiation near 365 nm) is optimally adjusted, and as a result, the tackiness removal of the ultraviolet curable resin is optimum. It is possible to carry out on condition.

  FIG. 3 schematically shows an optical configuration of a light source device for resin curing in a modification of the first embodiment shown in FIG.

  This modification is different from the configuration of the embodiment of FIG. 1 in that a low band rejection filter mechanism 18 is inserted in the light path 12 on the irradiated body side (downstream side) of the UV and IR band transmission filters 13. The other configuration is the same as that of the embodiment of FIG.

  The low band rejection filter mechanism 18 is configured to be insertable in part or all of the light collecting region of the optical path 12 by linearly moving the low band rejection filter by, for example, a stepping motor and a rack and pinion gear not shown. It is a thing. This low band rejection filter has a light transmission characteristic capable of attenuating a part of UV-C ultraviolet light, and at least a part of this low band rejection filter is slide inserted into the light path 12 to obtain 254 nm. It is possible to appropriately attenuate the transmitted energy of UV-C ultraviolet light in the vicinity according to the amount of insertion. However, this low band rejection filter has the property of allowing high transmittance for UV-A ultraviolet rays whose main wavelength is 365 nm, which affects UV curing.

  FIG. 4 shows the light transmittance characteristics of a fused silica glass plate and a vapor deposited low pass filter (LWPF-300), which is an example of this low band rejection filter, where a is a fused silica glass plate and b is a vapor deposited The characteristics of each of the low-pass rejection filters are shown. Fused silica glass plates are less expensive than vapor deposited low-pass filters, and also have excellent heat resistance.

  In order to effectively remove tackiness, it is effective to simultaneously irradiate ultraviolet light (UV curing principal wavelength) near 365 nm, which is the main UV curing wavelength, ultraviolet light (tackiness removal wavelength) near 254 nm, and infrared light. is there. However, since it is considered that some chemicals have different wavelength sensitivity characteristics, it is desirable that the ratio of the relative intensity between the UV curing principal wavelength and the tackiness removal wavelength can be freely adjusted. . In order to do so, it is conceivable to insert an optical element such as a reflective or transmissive band pass filter that transmits or reflects each wavelength band into the light path, but these reflective or transmissive band pass filters are expensive and the cost of the entire device Increase the

  Therefore, as in the present modification, for example, if a low band rejection filter made of a fused silica glass plate can be inserted into a part or all of the optical path 12, the tackiness removal wavelength of the light emitted according to the insertion degree It is possible to reduce the amount of energy of ultraviolet light in the vicinity of 254 nm. On the other hand, since the transmittance of the low band rejection filter in the wavelength band of the UV curing principal wavelength (ultraviolet light near 365 nm) is very high, even when the low band rejection filter is inserted in the light path, the UV curing principal wavelength (ultraviolet light near 365 nm There is almost no attenuation). That is, the energy ratio around the UV curing principal wavelength and the tackiness removing wavelength of the emitted light can be freely controlled only by the simple operation of inserting and removing the low band rejection filter into the light path 12.

  A fused silica glass plate, as shown in FIG. 4, has a light transmittance characteristic similar to that of a vapor deposited low-pass filter (LWPF-300), so it is used as it is without processing (vapor deposition). Can be configured. In addition, the cost is low and not only the cost of the entire apparatus can be reduced, but also there is no heat damage. Of course, although the cost is increased, a vapor deposition type low pass filter (LWPF-300) may be used instead of the fused silica glass plate.

  The other effects and advantages of the present embodiment are the same as those of the first embodiment of FIG.

  FIG. 5 schematically shows an optical configuration of a light source device for resin curing in another modification of the first embodiment shown in FIG.

  This modification is different from the configuration of the embodiment of FIG. 1 in that the energy adjusting optical element 19 is inserted in the light path 12 on the irradiated body side (downstream side) of the UV and IR band transmission filters 13. The other configuration is the same as that of the embodiment of FIG.

  The energy adjusting optical element 19 inserts a transmission type filter, which is a multilayer interference filter, into the light collection region of the optical path 12, and the transmission type filter is in a state where its surface is perpendicular to the optical axis (incident angle 0 ° State, or the state is inclined -20 ° from the state 131a (incident angle + 20 °) inclined by + 20 ° to the optical axis (incident angle -20 °) Is configured. That is, by rotating the axis of the transmission filter with, for example, a stepping motor (not shown), the surface of the transmission filter is controlled to be inclined at an arbitrary angle of 0 ° to ± 20 ° with respect to the optical axis. It is configured to be able to. The plane of the transmission filter may be controlled to be inclined at an arbitrary angle of 0 ° to ± 45 ° (an arbitrary angle of less than 0 ° to ± 45 °) with respect to the optical axis.

  This multilayer interference transmission filter has a light transmittance characteristic that partially attenuates only the wavelength band near 365 nm which is the UV curing principal wavelength of UV-C ultraviolet rays, and attenuates according to the incident angle It has the characteristic that the wavelength band changes. For example, when the incident angle is ± 20 ° with respect to the incident angle of 0 °, the peak at which the light transmittance decreases is moved by about 10 nm. Therefore, by inserting this transmission type filter in the light path 12 and changing the angle of the surface with respect to the optical axis, it is possible to appropriately attenuate the transmitted energy of UV-C ultraviolet light near 365 nm.

  FIG. 6 shows the light transmittance characteristic of Super UV Filter 365 (SUF-365) which is an example of this transmission type filter which is a multilayer type interference filter, and c is an incident angle of 0 ° (the filter surface is an optical axis , And d represent the characteristics of the incident angle ± 20 ° (the filter surface is ± 20 ° with respect to the optical axis), respectively. As can be seen from the figure, when the incident angle is 0 °, the light transmittance of 200 nm to 2500 nm is 95%, and the light transmittance of 380 nm is 80% (this transmittance may be determined arbitrarily). However, the ratio of the intensities near 250 nm and 365 nm does not change. When the transmission filter is rotated so that the incident angle changes in such a state that the ratio does not change, the spectral characteristics deviate by the same characteristics in the ultraviolet region, so that the transmittance of 365 nm changes and fine adjustment is performed. it can. The light transmittance of 200 nm to 2500 nm can be adjusted by changing the current of the light source, and the transmittance of 380 nm can be arbitrarily selected by changing the material characteristics (vapor deposition film characteristics) of the transmission filter. .

  In order to effectively remove tackiness, as described above, ultraviolet light (UV curing principal wavelength) near 365 nm, which is the main UV curing wavelength, ultraviolet light (tackiness removal wavelength) near 254 nm, and infrared light It is effective to irradiate at the same time. However, since it is considered that some chemicals have different wavelength sensitivity characteristics, it is desirable that the ratio of the relative intensity between the UV curing principal wavelength and the tackiness removal wavelength can be freely adjusted. In the present embodiment, by changing the angle (incident angle) of the filter surface to the optical axis in the range of 0 ° to 20 ° (arbitrary angle less than 0 ° to ± 45 °), the tackiness removal wavelength around 254 nm is obtained. The light transmittance in the vicinity of 365 nm, which is the UV curing main wavelength, is adjusted without changing the light transmittance of the light source, and the energy ratio in the vicinity of the UV curing main wavelength of emitted light and the tackiness removal wavelength is freely controlled.

  The other effects and advantages of the present embodiment are the same as those of the embodiment of FIG.

  As the low band rejection filter of the low band rejection filter mechanism in the modification of FIG. 3, a transmission filter which is a multilayer interference filter as in the modification of FIG. 5 is used, and its incident angle is changed to around 254 nm. You may comprise so that the transmitted energy of UV-C ultraviolet-ray may be attenuated.

  FIG. 7 schematically shows an optical configuration of a light source device for curing a resin according to a second embodiment of the present invention.

  As shown in the figure, the light source device for resin curing of the present embodiment is reflected by the light source 10, the reflecting mirror 11 of a condensing type that is an elliptical mirror on which the light source 10 is mounted, and the reflecting mirror 11. A band pass filter (corresponding to the light passing portion of the present invention) 13 inserted in the light path 12 of the light to be collected, an optical fiber bundle 14 for guiding a light spot to be irradiated onto the irradiated object, and an optical fiber bundle 14 And a spread angle adjustment unit (corresponding to the irradiation area setting unit of the present invention) 75 provided at the tip of the lens. In this embodiment, the light source 10, the reflecting mirror 11, and the band pass filter 13 are provided in the housing 16, and the optical fiber bundle 14 is attached to the mounting portion 17 provided on the front surface 16 a of the housing 16. In a modification of the present embodiment, the light source 10 and the reflecting mirror 11 are integrated into a unit.

  Although only the minimum necessary elements are shown in FIG. 7 to simplify the explanation, they are inserted into the optical path 12 of the light reflected and condensed by the reflecting mirror 11 to adjust the light intensity. Light intensity adjustment mechanism, shutter mechanism inserted in the light path 12 downstream of the light intensity adjustment mechanism, for blocking light, and for inserting other types of filters, operation panel, control computer, etc. May be provided.

  The configurations of the light source 10, the reflecting mirror 11, the UV and IR band transmission filters 13, and the optical fiber bundle 14 are the same as those in the first embodiment of FIG.

  In the present embodiment, the spread angle adjustment unit 75 includes a rod lens 75a for uniform illumination and a lens unit 75b provided on the downstream side in the axial direction and combining a plurality of lenses. The rod lens 75a has a function of equalizing the light emitted from the optical fiber bundle 14, and can prevent the central portion of the optical path cross section from becoming dark. The lens unit 75b is, for example, a convex lens (a biconvex lens or a planoconvex lens) such as a collimator lens that converts light emitted from the rod lens 75a into parallel light, and a convex lens (a biconvex lens or a plane) that condenses the light emitted from the convex lens. And a convex lens). By providing such a lens unit 75b, it is possible to adjust the spread angle of the light spot emitted from the optical fiber bundle 14 and to set the irradiation area to an arbitrary size of 10 mmφ or more. Since the lens 75a is used, the in-plane uniformity can be made within ± 10%.

  As described above in detail, according to the present embodiment, the UV and IR band-pass filter 13 is inserted into the light path 12 from the light source 10, so that UV-C ultraviolet light including light in the wavelength band of 250 nm and Since the light to be irradiated is simultaneously irradiated with light consisting of visible light and infrared light excluding light in the wavelength band of 500 nm to 640 nm, the UV-curable resin does not have tackiness on the resin surface and is short. It can be cured in time. Moreover, not only UV curable resins but also IR curable resins can be cured efficiently. In particular, since the spread angle adjustment unit 75 including the rod lens 75a and the lens unit 75b is provided at the tip of the optical fiber bundle 14, it is possible to irradiate light having an optimum size for the size of the object to be irradiated. For this reason, it is possible to cure the resin in a short time without generation of tackiness using light of a large irradiation area for a large-area irradiation object, and light using a small irradiation area light for a small-area irradiation object It is possible to reliably and efficiently cure only the portions that need to be irradiated, without causing tackiness. That is, since the light irradiated to the irradiation object contains infrared rays, the irradiation area corresponds exactly to the size of the irradiation object, and the irradiation object so that the excess part is not irradiated and heated. Is configured to have a desired illuminated area. Moreover, the uniformity of the irradiation light can be significantly improved.

  As a modification of this embodiment, as in the modification of FIG. 3, a low band rejection filter mechanism 18 is inserted in the optical path 12 on the downstream side of the UV and IR band transmission filters 13 to remove tackiness wavelength (ultraviolet light near 254 nm) The energy adjustment optical element 19 may be inserted in the light path 12 downstream of the UV and IR band-pass filter 13 as in the modification of FIG. The light transmittance near 365 nm may be adjusted.

  FIG. 8 schematically shows an optical configuration of a light source device for resin curing in the third embodiment of the present invention.

  As shown in the figure, the light source device for resin curing of the present embodiment is reflected by the light source 10, the reflecting mirror 11 of a condensing type that is an elliptical mirror on which the light source 10 is mounted, and the reflecting mirror 11. A band pass filter (corresponding to the light passing portion of the present invention) 13 inserted in the light path 12 of the light to be condensed, and a plurality of (four in the present embodiment) light spots irradiated to the object to be irradiated A plurality of (four in the present embodiment) spread angle adjustment units (four in the present embodiment) provided at the tip portions of the plurality of (four in the present embodiment) optical fiber bundles 84 a to 84 d and the plurality of optical fiber bundles 84 a to 84 d And 85a to 85d corresponding to the irradiation area setting unit of the present invention. In this embodiment, the light source 10, the reflecting mirror 11, and the band pass filter 13 are provided in the housing 16, and the plurality of optical fiber bundles 84a to 84d are attached to the mounting portion 87 provided on the front surface 16a of the housing 16. It is done. The number of optical fiber bundles and the spread angle adjustment unit is not limited to four, and may be any two or more. Moreover, in the modification of this embodiment, the light source 10 and the reflective mirror 11 are integrated and unitized.

  Although only the minimum necessary elements are shown in FIG. 8 to simplify the explanation, they are inserted in the optical path 12 of the light reflected and condensed by the reflecting mirror 11 to adjust the light intensity. Light intensity adjustment mechanism, shutter mechanism inserted in the light path 12 downstream of the light intensity adjustment mechanism, for blocking light, and for inserting other types of filters, operation panel, control computer, etc. May be provided.

  The configurations of the light source 10, the reflecting mirror 11, and the UV and IR band transmission filters 13 are the same as in the first embodiment of FIG.

  The plurality of optical fiber bundles 84a to 84d are configured to branch the light emitted from the optical path 12, but the configuration of each optical fiber bundle is the same as that of the first embodiment.

  In the present embodiment, each of the plurality of spread angle adjustment units 85a to 85d is configured of a lens unit formed by combining a plurality of lenses. The lens unit includes, for example, a convex lens (a biconvex lens or a planoconvex lens) such as a collimator lens that converts emitted light from each optical fiber bundle into a parallel light, and a convex lens (a biconvex lens or a convex lens that condenses the emitted light of the convex lens And a plano-convex lens). With such a lens unit, it is possible to adjust the spread angle of the light spot emitted from each optical fiber bundle and to set it to an arbitrary irradiation area with a diameter of 1 to 2 mmφ. Furthermore, emission of a diameter of 0.1 to 1 mm is also possible.

  The greatest feature of the optical system of the present embodiment is that a plurality of minute light spots can be irradiated simultaneously. Generally, in highly integrated electronic circuits, heat sensitive parts are often in the vicinity of parts that should be UV hardened. In particular, the degree of integration of electronic circuits tends to increase in recent years, and for that purpose, it is desirable that tackiness removal can be performed simultaneously with ultraviolet curing with a plurality of small light spots, and this embodiment can achieve this. It is an optical system.

  As described above in detail, according to the present embodiment, the UV and IR band-pass filter 13 is inserted into the light path 12 from the light source 10, so that UV-C ultraviolet light including light in the wavelength band of 250 nm and Since the light to be irradiated is simultaneously irradiated with light consisting of visible light and infrared light excluding light in the wavelength band of 500 nm to 640 nm, the UV-curable resin does not have tackiness on the resin surface and is short. It can be cured in time. Moreover, not only UV curable resins but also IR curable resins can be cured efficiently. In particular, since a plurality of optical fiber bundles are branched, and a plurality of spread angle adjustment units consisting of a lens unit or a rod lens and a lens unit are respectively provided at their tip portions, the size of the irradiated object A plurality of lights having optimal dimensions can be irradiated at the same time. For this reason, it is possible to cure the resin in a short time without generation of tackiness using light of a large irradiation area for a large-area irradiation object, and light using a small irradiation area light for a small-area irradiation object It is possible to reliably and efficiently cure only the portions that need to be irradiated, without causing tackiness. That is, since the light irradiated to the irradiation object contains infrared rays, the irradiation area corresponds exactly to the size of the irradiation object, and the irradiation object so that the excess part is not irradiated and heated. Is configured to have a desired illuminated area. Moreover, the uniformity of the irradiation light can be significantly improved.

  As a modification of the present embodiment, the irradiation object is irradiated by combining the light directly emitted from the plurality of optical fiber bundles without providing the spread angle adjusting unit at the tip end of the plurality of optical fiber bundles 84a to 84d. Light may have a desired illumination area. In that case, since light with a large irradiation area can be obtained, it is possible to cure the resin of a large area to be irradiated in a short time without the occurrence of tackiness.

  As a further modification of this embodiment, as in the modification of FIG. 3, a low band rejection filter mechanism 18 is inserted in the downstream optical path 12 of the UV and IR band transmission filters 13 to remove the tackiness removal wavelength (ultraviolet light near 254 nm The energy adjustment optical element 19 may be inserted in the light path 12 downstream of the UV and IR band transmission filter 13 as in the modification of FIG. The light transmittance in the vicinity of a certain 365 nm may be adjusted.

  FIG. 9 schematically shows an optical configuration of a light source device for resin curing in the fourth embodiment of the present invention.

  As shown in the figure, the light source device for resin curing of the present embodiment is reflected by the light source 10, the reflecting mirror 11 of a condensing type that is an elliptical mirror on which the light source 10 is mounted, and the reflecting mirror 11. A band pass filter (corresponding to the light passing portion of the present invention) 13 inserted in the light path 12 of the light to be condensed, and a spread angle adjusting portion (the irradiation area of the present invention And 95) corresponding to the setting unit. In this embodiment, the light source 10, the reflecting mirror 11, and the band pass filter 13 are provided in the housing 16, the optical fiber bundle is not provided, and the spread angle adjusting unit 95 is provided on the front surface 16a of the housing 16. It is directly attached to the attached attachment 97. In a modification of the present embodiment, the light source 10 and the reflecting mirror 11 are integrated into a unit.

  Although only the minimum necessary elements are shown in FIG. 9 to simplify the explanation, they are inserted into the optical path 12 of the light reflected and condensed by the reflecting mirror 11 to adjust the light intensity. Light intensity adjustment mechanism, shutter mechanism inserted in the light path 12 downstream of the light intensity adjustment mechanism, for blocking light, and for inserting other types of filters, operation panel, control computer, etc. May be provided.

  The configurations of the light source 10, the reflecting mirror 11, and the UV and IR band transmission filters 13 are the same as in the first embodiment of FIG.

  In the present embodiment, the spread angle adjusting unit 95 combines a plurality of lenses provided on the downstream side of the axial direction with a rod lens 95 a for uniform illumination fixed and disposed near the focusing point of the reflecting mirror 11. And a movable lens unit 95b. The rod lens 95a has a function of equalizing the light collected by the reflecting mirror 11, and can prevent the central portion of the cross section of the optical path from being darkened. The lens unit 95b is, for example, a convex lens (a biconvex lens or a planoconvex lens) such as a collimator lens that converts light emitted from the rod lens 95a into parallel light, and a convex lens (a biconvex lens or a plane) that collects the light emitted from the convex lens. And a convex lens). The lens unit 95 b is configured to be movable in the front-rear direction (optical axis direction) along the support shaft 97 a of the mounting portion 97. By providing such a lens unit 95b, it is possible to adjust the spread angle of the light spot collected by the reflecting mirror 11 and set it to a diameter of 3 to 6 mmφ or an arbitrary irradiation area of 10 mmφ or more. It has become. Moreover, since the rod lens 95a is used, the in-plane uniformity can be made within ± 10%.

  As described above in detail, according to the present embodiment, the UV and IR band-pass filter 13 is inserted into the light path 12 from the light source 10, so that UV-C ultraviolet light including light in the wavelength band of 250 nm and Since the light to be irradiated is simultaneously irradiated with light consisting of visible light and infrared light excluding light in the wavelength band of 500 nm to 640 nm, the UV-curable resin does not have tackiness on the resin surface and is short. It can be cured in time. Moreover, not only UV curable resins but also IR curable resins can be cured efficiently. In particular, since the spread angle adjustment unit 95 including the rod lens 95a provided in the vicinity of the light collecting part of the reflecting mirror 11 and the lens unit 95b provided at the tip and movable in the optical axis direction is provided It can emit light having an optimal size for the size of the body. For this reason, it is possible to cure the resin in a short time without generation of tackiness using light of a large irradiation area for a large-area irradiation object, and light using a small irradiation area light for a small-area irradiation object It is possible to reliably and efficiently cure only the portions that need to be irradiated, without causing tackiness. That is, since the light irradiated to the irradiation object contains infrared rays, the irradiation area corresponds exactly to the size of the irradiation object, and the irradiation object so that the excess part is not irradiated and heated. Is configured to have a desired illuminated area. Moreover, the uniformity of the irradiation light can be significantly improved. In addition, since no optical fiber is used, light attenuation is small, the light intensity of the irradiation light can be increased, and large area uniform irradiation becomes possible.

  As a modification of this embodiment, as in the modification of FIG. 3, a low band rejection filter mechanism 18 is inserted in the optical path 12 on the downstream side of the UV and IR band transmission filters 13 to remove tackiness wavelength (ultraviolet light near 254 nm) The energy adjustment optical element 19 may be inserted in the light path 12 downstream of the UV and IR band-pass filter 13 as in the modification of FIG. The light transmittance near 365 nm may be adjusted.

  FIG. 10 schematically shows an optical configuration of a light source device for resin curing in a fifth embodiment of the present invention.

  As shown in the figure, the light source device for resin curing of the present embodiment is reflected by the light source 10, the reflecting mirror 11 of a condensing type that is an elliptical mirror on which the light source 10 is mounted, and the reflecting mirror 11. A band pass filter (corresponding to the light passing portion of the present invention) 13 inserted in the light path 12 of the light to be condensed, and a spread angle adjusting portion (the irradiation area of the present invention And 105) (corresponding to the setting unit). In this embodiment, the light source 10, the reflecting mirror 11, and the band pass filter 13 are provided in the housing 16, the optical fiber bundle is not provided, and the spread angle adjusting unit 105 is provided on the front surface 16a of the housing 16. It is directly attached to the attached attachment 107. In a modification of the present embodiment, the light source 10 and the reflecting mirror 11 are integrated into a unit.

  Although only the minimum necessary elements are shown in FIG. 10 to simplify the explanation, they are inserted into the optical path 12 of the light reflected and condensed by the reflecting mirror 11 to adjust the light intensity. Light intensity adjustment mechanism, shutter mechanism inserted in the light path 12 downstream of the light intensity adjustment mechanism, for blocking light, and for inserting other types of filters, operation panel, control computer, etc. May be provided.

  The configurations of the light source 10, the reflecting mirror 11, and the UV and IR band transmission filters 13 are the same as in the first embodiment of FIG.

  In the present embodiment, the spread angle adjusting unit 105 is provided on the downstream side of an integrator lens (fly eye lens) 105 a for obtaining a uniform illuminance distribution, which is fixedly disposed in the vicinity of the focusing point of the reflecting mirror 11. A lens unit 105b is formed of a single lens or a combination of a plurality of lenses. The integrator lens 105a has a function of equalizing the light collected by the reflecting mirror 11, and is a lens array in which a plurality of lenses are arranged in a matrix. The lens unit 105b is constituted by, for example, a convex lens (a biconvex lens or a plano-convex lens) such as a collimator lens for converting light emitted from the integrator lens 105a into parallel light, or such a convex lens and an output of this convex lens You may comprise from the combination with the convex lens (biconvex lens or plano-convex lens) which condenses incident light. By providing such a lens unit 105b, it is possible to adjust the spread angle of the light spot collected by the reflecting mirror 11 and set it to a diameter of 3 to 6 mmφ or an arbitrary irradiation area of 10 mmφ or more. It has become. Moreover, since the integrator lens 105a is used, the in-plane uniformity can be made within ± 5%.

  As described above in detail, according to the present embodiment, the UV and IR band-pass filter 13 is inserted into the light path 12 from the light source 10, so that UV-C ultraviolet light including light in the wavelength band of 250 nm and Since the light to be irradiated is simultaneously irradiated with light consisting of visible light and infrared light excluding light in the wavelength band of 500 nm to 640 nm, the UV-curable resin does not have tackiness on the resin surface and is short. It can be cured in time. Moreover, not only UV curable resins but also IR curable resins can be cured efficiently. In particular, since the spread angle adjusting unit 105 including the integrator lens 105a provided in the vicinity of the light collecting part of the reflecting mirror 11 and the lens unit 105b provided at the tip and movable in the optical axis direction is provided, It can emit light having an optimal size for the size of the body. For this reason, it is possible to cure the resin in a short time without generation of tackiness using light of a large irradiation area for a large-area irradiation object, and light using a small irradiation area light for a small-area irradiation object It is possible to reliably and efficiently cure only the portions that need to be irradiated, without causing tackiness. That is, since the light irradiated to the irradiation object contains infrared rays, the irradiation area corresponds exactly to the size of the irradiation object, and the irradiation object so that the excess part is not irradiated and heated. Is configured to have a desired illuminated area. Moreover, the uniformity of the irradiation light can be significantly improved. In addition, since no optical fiber is used, light attenuation is small, the light intensity of the irradiation light can be increased, and large area uniform irradiation becomes possible.

  As a modification of this embodiment, as in the modification of FIG. 3, a low band rejection filter mechanism 18 is inserted in the optical path 12 on the downstream side of the UV and IR band transmission filters 13 to remove tackiness wavelength (ultraviolet light near 254 nm) The energy adjustment optical element 19 may be inserted in the light path 12 downstream of the UV and IR band-pass filter 13 as in the modification of FIG. The light transmittance near 365 nm may be adjusted.

  FIG. 11 schematically shows an optical configuration of a light source device for resin curing in the sixth embodiment of the present invention.

  As shown in the figure, the light source device for resin curing of the present embodiment is reflected by the light source 10, the reflecting mirror 11 of a condensing type that is an elliptical mirror on which the light source 10 is mounted, and the reflecting mirror 11. A band pass filter (corresponding to the light passing portion of the present invention) 13 inserted in the light path 12 of the light to be collected is provided. In this embodiment, no optical fiber or lens system is used, and the light from the reflecting mirror 11 is directly irradiated to the irradiated object through the band pass filter 13. Therefore, in the present embodiment, the reflecting mirror 11 corresponds to the irradiation area setting unit of the present invention. In a modification of the present embodiment, the light source 10 and the reflecting mirror 11 are integrated into a unit.

  The configurations of the light source 10, the reflecting mirror 11, and the UV and IR band transmission filters 13 are the same as in the first embodiment of FIG.

  In the present embodiment, the irradiation area setting unit is configured of the spheroid-shaped reflecting mirror 11. The light condensed by the reflecting mirror 11 is emitted, and the spread angle of the light spot is adjusted.

  As described above in detail, according to the present embodiment, the UV and IR band-pass filter 13 is inserted into the light path 12 from the light source 10, so that UV-C ultraviolet light including light in the wavelength band of 250 nm and Since the light to be irradiated is simultaneously irradiated with light consisting of visible light and infrared light excluding light in the wavelength band of 500 nm to 640 nm, the UV-curable resin does not have tackiness on the resin surface and is short. It can be cured in time. Moreover, not only UV curable resins but also IR curable resins can be cured efficiently. The light condensed by the reflecting mirror 11 can emit light having an optimum size for the size of the object to be irradiated. For this reason, it is possible to cure the resin of a large area to be irradiated in a short time without occurrence of tackiness using light of a large irradiation area. That is, since the light irradiated to the irradiation object contains infrared rays, the irradiation area corresponds exactly to the size of the irradiation object, and the irradiation object so that the excess part is not irradiated and heated. Is configured to have a desired illuminated area.

  As a modification of this embodiment, as in the modification of FIG. 3, a low band rejection filter mechanism 18 is inserted in the optical path 12 on the downstream side of the UV and IR band transmission filters 13 to remove tackiness wavelength (ultraviolet light near 254 nm) The energy adjustment optical element 19 may be inserted in the light path 12 downstream of the UV and IR band-pass filter 13 as in the modification of FIG. The light transmittance near 365 nm may be adjusted.

  FIG. 12 schematically shows the optical configuration of a light source device for resin curing in the seventh embodiment of the present invention.

  As shown in the figure, in the light source device for resin curing of the present embodiment, a light source 10, a reflecting mirror 121 which is a parabolic mirror on which the light source 10 is mounted, and parallel light reflected by the reflecting mirror 121 And a band pass filter (corresponding to the light passing portion of the present invention) 13 inserted in the light path 12 of In this embodiment, no optical fiber or lens system is used, and the light from the reflecting mirror 121 is directly irradiated to the irradiated object through the band pass filter 13. Therefore, in the present embodiment, the reflecting mirror 121 corresponds to the irradiation area setting unit of the present invention. In the modification of the present embodiment, the light source 10 and the reflecting mirror 121 are integrated into a unit.

  The configurations of the light source 10 and the UV and IR band transmission filters 13 are the same as in the first embodiment of FIG.

  In the present embodiment, the irradiation area setting unit is configured of a reflecting mirror 121 having a paraboloid shape. The reflecting mirror 121 emits light substantially parallel to the optical axis, and the spread angle is adjusted to a light spot having a diameter substantially equal to the diameter of the reflecting surface of the reflecting mirror 121.

  As described above in detail, according to the present embodiment, the UV and IR band-pass filter 13 is inserted into the light path 12 from the light source 10, so that UV-C ultraviolet light including light in the wavelength band of 250 nm and Since the light to be irradiated is simultaneously irradiated with light consisting of visible light and infrared light excluding light in the wavelength band of 500 nm to 640 nm, the UV-curable resin does not have tackiness on the resin surface and is short. It can be cured in time. Moreover, not only UV curable resins but also IR curable resins can be cured efficiently. The parallel light having a diameter corresponding to the diameter of the reflecting surface of the reflecting mirror 121 can emit light having an optimum size for the size of the object to be irradiated. For this reason, it is possible to cure the resin of a large area to be irradiated in a short time without occurrence of tackiness using light of a large irradiation area. That is, since the light irradiated to the irradiation object contains infrared rays, the irradiation area corresponds exactly to the size of the irradiation object, and the irradiation object so that the excess part is not irradiated and heated. Is configured to have a desired illuminated area.

  As a modification of this embodiment, as in the modification of FIG. 3, a low band rejection filter mechanism 18 is inserted in the optical path 12 on the downstream side of the UV and IR band transmission filters 13 to remove tackiness wavelength (ultraviolet light near 254 nm) The energy adjustment optical element 19 may be inserted in the light path 12 downstream of the UV and IR band-pass filter 13 as in the modification of FIG. The light transmittance near 365 nm may be adjusted.

  FIG. 13 schematically shows an optical configuration of a light source device for resin curing in the eighth embodiment of the present invention.

  As shown in the figure, the light source device for resin curing of the present embodiment is a reflecting mirror which is an elongated light source 130 and an axial sectional ellipsoidal mirror or axial sectional parabolic mirror on which the light source 130 is mounted. And a band pass filter (corresponding to the light passing portion of the present invention) 133 inserted in the light path 132 of the light reflected by the reflecting mirror 131. In this embodiment, no optical fiber or lens system is used, and the light from the reflecting mirror 131 is directly irradiated to the irradiated object through the band pass filter 133. Therefore, in the present embodiment, the reflecting mirror 131 corresponds to the irradiation area setting unit of the present invention. In the present specification, an axial cross-section ellipsoidal mirror means a reflecting mirror whose cross section taken along a plane perpendicular to the axis is an elliptical face, and an axial cross-section parabolic mirror has a cross section taken along a plane perpendicular to the axis It means a reflector that is a paraboloid.

  The light source 130 is a linear, for example, low-pressure mercury lamp configured to emit light of the entire wavelength band including IR band light, visible light and UV band light.

  The reflecting mirror 131 is an axial sectioned ellipsoidal mirror or an axial sectioned parabolic mirror on which the light source 130 is mounted at its focal position, for example all wavelengths emitted from the light source 130 by using a mirror of aluminum deposition Efficiently reflect and collect light of all wavelength bands (for example, bands of 200 nm to 2500 nm) including bands, ie IR band light, visible light and UV band light (UV-A, UV-B and UV-C) It is configured to In addition, it may replace with the reflective mirror 131 and may use the lens which condenses the light of all the wavelength bands radiated | emitted from the light source 10. FIG.

  The UV and IR band transmission filters 133 are UV and IR band transmission filters, and in the present embodiment, they are excellent in heat resistance and long life stability, and UV-C ultraviolet light including light in a wavelength band of 250 nm and 500 nm to It consists of a transmission filter or a mirror that transmits visible light excluding light in the wavelength band of 640 nm and infrared light. An example of the wavelength light transmittance characteristic of this UV and IR band transmission filter 133 is shown in FIG. In this example, transmission of light in the range of about 500 nm or more and about 640 nm or less among visible light is blocked, and 90% or more of UV-C ultraviolet light including at least 250 nm wavelength band and visible light and infrared light of about 650 nm or more It has the characteristic of transmitting at a transmittance of That is, in the present embodiment, the ratio of the relative intensity between the tackiness removal wavelength (ultraviolet light near 254 nm) and the UV curing principal wavelength (ultraviolet light near 365 nm) is optimally adjusted. As a result, the ultraviolet curable resin It is possible to carry out the removal of tackiness under the optimal conditions. By inserting such a UV and IR band-pass filter 133 into the light path 132, curing can be performed in a short time without generating tackiness on the resin surface, and only light for UV curable resin can be obtained. Therefore, the IR curable resin can be cured efficiently. And since the light of a wavelength band of 500 nm-640 nm which is not required for resin hardening is intercepted, it can prevent that a to-be-irradiated body is heated unnecessarily. Although the UV and IR band transmission filter 133 of this embodiment is configured to have a transmission characteristic of transmitting only ultraviolet (including partially visible light) and infrared (including partially visible light), Depending on the wavelength curing characteristics of the UV curable resin to be irradiated and the wavelength emitting characteristics of the light source 130, various wavelength light transmittance characteristics may be used.

  In the present embodiment, the irradiation area setting unit is configured of a reflecting mirror 131 having an elliptical cross section in an axial cross section or a parabola in an axial cross section. This reflecting mirror 131 condenses light along the optical axis or emits light substantially parallel to the optical axis, and the light condensed by the reflecting mirror 131 is emitted to adjust the spread angle of the light spot Alternatively, the spread angle is adjusted to a light spot having a diameter substantially equal to the diameter of the reflection surface of the reflecting mirror 131.

  As described above in detail, according to the present embodiment, the UV and IR band-pass filter 133 is inserted into the light path 132 from the light source 130, thereby providing UV-C ultraviolet light including light in the wavelength band of 250 nm. Since the light to be irradiated is simultaneously irradiated with light consisting of visible light and infrared light excluding light in the wavelength band of 500 nm to 640 nm, the UV-curable resin does not have tackiness on the resin surface and is short. It can be cured in time. Moreover, not only UV curable resins but also IR curable resins can be cured efficiently. The light having the optimum size for the size of the object to be irradiated can be irradiated by the light condensed by the reflecting mirror 131 or by the parallel light having a diameter corresponding to the diameter of the reflecting surface of the reflecting mirror 131. For this reason, it is possible to cure the resin of a large area to be irradiated in a short time without occurrence of tackiness using light of a large irradiation area. That is, since the light irradiated to the irradiation object contains infrared rays, the irradiation area corresponds exactly to the size of the irradiation object, and the irradiation object so that the excess part is not irradiated and heated. Is configured to have a desired illuminated area.

  In the first to eighth embodiments and their modifications described above, all the light emitted from the resin curing light source device is resin curing light having a tackiness removing function through the UV and IR band transmission filters. However, depending on the target to be UV-cured, the specific part may emit light through a combination of a filter for removing tackiness and a filter that transmits other wavelength bands or a mirror to irradiate the target . For example, the peripheral portion of the light spot may be configured with a tackiness free wavelength, and the central portion may be a light spot via an optical system that transmits or reflects wavelength bands of other wavelength bands.

  Hereinafter, in order to demonstrate the tackiness removing effect of the present invention, the first embodiment and the first and second comparative examples will be described.

  As a first example, light from a light source was reflected by a reflector (elliptic mirror) on which aluminum deposition was performed, and UV and IR band-pass filters were transmitted to irradiate a UV curable resin. The UV and IR band transmission filters used are transmission filters that transmit UV-C UV in the 250 nm band, UV-B UV in the 315 nm band, UV-A UV in the 365 nm band, and a band of 640 nm to 2500 nm, It has a light transmission characteristic as shown in FIG. FIG. 14 shows spectral distribution characteristics of light transmitted through the transmission filter.

  Such light was irradiated for 10 seconds, and when the surface of the UV-curable resin after irradiation was touched with a hand, the UV-curable resin was cured and the surface tackiness was completely removed. In addition, destruction, deformation, breakage and / or burn-out and the like of the UV curable resin due to too high irradiation energy did not occur at all.

  As a first comparative example, light from a light source was reflected by a reflecting mirror (elliptic mirror) on which aluminum deposition was performed, transmitted through a UV band transmission filter, and irradiated to a UV curable resin. The UV band transmission filter used is a transmission filter that transmits 200 nm to 400 nm UV-C, UV-B and UV-A ultraviolet rays including a band of 250 nm, and some visible light but does not transmit any infrared light, as shown in FIG. It has light transmission characteristics as shown in FIG. FIG. 16 shows spectral distribution characteristics of light transmitted through the transmission filter.

  Such light was irradiated for 10 seconds, and the surface of the UV-curable resin after irradiation was touched by hand, but the surface of the UV-curable resin was still tackiness and was not removed.

  As a second comparative example, the light from the light source was reflected by a reflecting mirror (elliptic mirror) on which aluminum deposition was performed, and the UV and IR band-pass filters were transmitted to irradiate the UV curable resin. The UV and IR band transmission filters used are transmission filters that transmit UV-B and UV-A ultraviolet rays as well as infrared rays in the wavelength band of 300 nm or more, and in particular, do not transmit any ultraviolet rays in the 250 nm band; It has light transmission characteristics as shown. FIG. 18 shows spectral distribution characteristics of light transmitted through the transmission filter.

  Such light was irradiated for 10 seconds, and the surface of the UV-curable resin after irradiation was touched by hand, but the surface of the UV-curable resin was still tackiness and was not removed.

  From the first embodiment and the first and second comparative examples described above, Tackiness is a method of completely removing the resin surface by irradiating the wavelength band of the first embodiment for a short time (about 10 seconds). It has been found that the tackiness can be completely removed, and furthermore, no destruction, deformation, breakage and / or burning or the like of the UV-curable resin due to too high irradiation energy occur. On the other hand, if the entire wavelength range is irradiated, the tackiness of the resin surface can be removed, but in this case, when the irradiation energy is too strong, defects such as destruction, deformation, breakage and / or charring of the UV curable resin occur. The possibility of doing is increased.

  The embodiments and examples described above are all illustrative of the present invention and not limiting, and the present invention can be practiced in various other variations and modifications. Accordingly, the scope of the present invention is to be defined only by the appended claims and their equivalents.

  The present invention is applicable to an adhesive application device and an adhesive curing device for curing a photocurable resin of a resin adhesive, or a resin curing device. Specifically, for example, (1) fixation of electronic parts and the like used in the vicinity of the slider assembly in the hard disk drive, (2) sealing of the liquid crystal periphery attached to small mobile communication means and the like, (3) small wearable display device Small-sized electronic components for electronic parts, fixing of optical parts, (4) electronic parts corresponding to the electronics of electronic parts such as auto parts, fixing of sensors etc., (5) sealing of intelligent window materials etc., (6) The present invention can be applied to preventing the adhesion of contaminants by the presence of tackiness.

10, 130 Light source 11, 121, 131 Reflector 12, 132 Optical path 13, 133 Band pass filter 14, 84a to 84d Optical fiber bundle 15, 75, 85a to 85d, 95, 105 Spreading angle adjusting unit 15a, 75b, 95b, 105b lens unit 16 housing 16a front surface 17, 87, 97, 107 mounting portion 18 low band rejection filter mechanism 19 optical element for energy adjustment 75a, 95a rod lens 105a integrator lens

Claims (12)

  A light source, an optical system for guiding the light emitted from the light source to the light emitting part through the light path, and UV-C ultraviolet light, 500 nm-inserted in the light path of the optical system and containing light in the 250 nm wavelength band A light source device for curing a resin, comprising: a light passing portion that passes visible light excluding light in a wavelength band of 640 nm and infrared light, and configured to suppress the generation of tackiness on a resin surface, wherein the optical system is What is claimed is: 1. A light source device for curing a resin, comprising: an irradiation area setting unit which can be set so that light irradiated to a body to be irradiated has a desired irradiation area.   The irradiation area setting unit includes an optical fiber bundle provided in the optical path closer to the light receiving body than the light passage unit, and a lens unit for adjusting the spread angle provided at the tip of the optical fiber bundle. The light source device for resin curing according to claim 1, characterized in that   The optical fiber bundle provided in the optical path on the side closer to the irradiated object than the light passing portion, the irradiation area setting unit, the rod lens for uniform illumination provided at the tip of the optical fiber bundle, and the rod lens The resin curing light source device according to claim 1, further comprising: a lens unit for adjusting the spread angle provided at the tip of the lens.   The irradiation area setting unit includes a plurality of optical fiber bundles provided in the optical path closer to the light receiving body than the light passing unit, and a plurality of divergence angle adjustments provided on the tip of the plurality of optical fiber bundles. The light source device for resin curing according to claim 1, comprising:   The irradiation area setting unit includes: a rod lens for uniform illumination provided in the light path closer to the light receiving body than the light passing portion; and a lens unit for adjusting the spread angle provided at the tip of the rod lens. The light source device for resin curing according to claim 1, comprising:   The resin curing light source device according to claim 5, wherein the lens unit of the irradiation area setting unit is installed so as to be movable along an optical axis.   The resin hardening according to claim 1, wherein the irradiation area setting unit includes an integrator lens for obtaining a uniform illuminance distribution provided in the light path closer to the light receiving body than the light passing unit. Light source device.   The irradiation area setting unit is an elliptical mirror or an axial cross-sectional ellipsoidal mirror that condenses light emitted from the light source, or a parabolic mirror or an axial cross-section that reflects light emitted from the light source into parallel light The light source device for resin curing according to claim 1, which is an object mirror.   By controlling the amount of energy of the tackiness removal wavelength or the UV curing dominant wavelength, the ratio of the relative strength between the UV curing dominant wavelength and the tackiness removal wavelength is adjusted to suppress the tackiness of the resin surface. The light source device for resin hardening of any one of Claim 1 to 8 characterized by these.   The resin curing light source device according to any one of claims 1 to 9, wherein the light passing portion is configured to further pass UV-B ultraviolet light and UV-A ultraviolet light.   The resin curing light source according to any one of claims 1 to 10, wherein the light passing portion is a transmission filter or a mirror that transmits ultraviolet light in the wavelength band, visible light and infrared light in the wavelength band. apparatus.   The resin curing light source according to any one of claims 1 to 11, wherein the light source includes a metal halide lamp, a mercury-xenon lamp, a long low-pressure mercury lamp, or a plurality of LED elements. apparatus.

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