JP2018160491A5 - - Google Patents
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- JP2018160491A5 JP2018160491A5 JP2017055408A JP2017055408A JP2018160491A5 JP 2018160491 A5 JP2018160491 A5 JP 2018160491A5 JP 2017055408 A JP2017055408 A JP 2017055408A JP 2017055408 A JP2017055408 A JP 2017055408A JP 2018160491 A5 JP2018160491 A5 JP 2018160491A5
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- 239000004020 conductor Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017055408A JP2018160491A (ja) | 2017-03-22 | 2017-03-22 | コイル基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017055408A JP2018160491A (ja) | 2017-03-22 | 2017-03-22 | コイル基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018160491A JP2018160491A (ja) | 2018-10-11 |
| JP2018160491A5 true JP2018160491A5 (fi) | 2019-03-22 |
Family
ID=63796771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017055408A Pending JP2018160491A (ja) | 2017-03-22 | 2017-03-22 | コイル基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2018160491A (fi) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7449660B2 (ja) | 2019-09-06 | 2024-03-14 | 株式会社村田製作所 | インダクタ部品 |
| CN118073315B (zh) * | 2021-09-17 | 2024-08-16 | 玻芯成（重庆）半导体科技有限公司 | 一种具有隔离作用的电感器及芯片 |
| CN115831915B (zh) * | 2021-09-17 | 2024-06-11 | 上海玻芯成微电子科技有限公司 | 一种隔离器及芯片 |
| CN116825753B (zh) * | 2022-03-22 | 2024-06-11 | 上海玻芯成微电子科技有限公司 | 一种电容隔离器及芯片 |
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2017
- 2017-03-22 JP JP2017055408A patent/JP2018160491A/ja active Pending